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S E L E C T I O N G U I D E

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More than 20 years ago, Bergquist set the standard for elastomeric thermal interface materials with the introduction of
Sil-Pad. Today, Bergquist is a world leader with a complete family of Sil-Pad materials to meet critical needs of a rapidly changing electronics industry.
The Sil-Pad family of elastomeric thermal interface materials encompasses dozens of products, each with its own unique construction, properties and performance.
Sil-Pad thermally conductive insulators, in their many forms, continue to be a clean and efficient alternative to mica, ceramics or grease for a wide range of electronic applications.
Sil-Pad provides:
• Excellent thermal performance
• Eliminates the mess of grease
• More durable than mica
• Efficient "total applied cost" that compares favorably with other alternatives
Features
• Thermal impedance:
0.61°C-in 2 /W (@50 psi)
• Electrically isolating
• Low mounting pressures
• Smooth and highly compliant surface
• General-purpose thermal interface material solution
Applications
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Specifications
Thickness: 0.009" (0.229mm)
Dielectric Breakdown Voltage (Vac): 5500
Thermal Conductivity: 1.6 W/m-K
Construction: Silicone/Fiberglass
Features
• Thermal impedance:
0.66°C-in 2 /W (@50 psi)
• Inherent tack on both sides
• Pad is re-positionable
• Excellent thermal performance at low pressures
• Electrically isolating
• Auto-placement
• Auto-dispensable
Applications
• Power supplies
• Automotive electronics
• Motor controls
Specifications
Thickness: 0.012" (0.305mm)
Dielectric Breakdown Voltage (Vac): 5000
Thermal Conductivity: 1.1 W/m-K
Construction: Silicone/Fiberglass
Features
• Thermal impedance:
0.53°C-in 2 /W (@50 psi)
• Exceptional thermal performance at lower application pressures
• Smooth and non-tacky on both sides
• Superior breakdown voltage and surface
“wet out” values
• Designed for applications where electrical isolation is critical
• Excellent cut-through resistance
Applications
• Power supplies
• Automotive electronics
• Motor controls
• Audio amplifiers
• Telecommunications
• Discrete devices
Specifications
Thickness: 0.009-0.016" (0.229-0.406mm)
Dielectric Breakdown Voltage (Vac): 6000
Thermal Conductivity: 1.8 W/m-K
Construction: Silicone/Fiberglass
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Sil-Pad 1500ST (soft tack) high performance thermal interface material is designed specifically for use in high-volume autodispensing and auto-placement applications.
Features
• Thermal impedance:
0.41°C-in 2 /W (@50 psi)
• Tough dielectric barrier against cut-through
• High performance film
• Designed to replace ceramic insulators
Applications
• Power supplies
• Power semiconductors
• Motor controls
• CAGE Number 55285
• U.L. File Number E59150
Specifications
Thickness: 0.006" (0.152mm)
Dielectric Breakdown Voltage (Vac): 6000
Thermal Conductivity: 1.3 W/m-K
Construction: Silicone/Film
Features
• Thermal impedance:
0.42°C-in 2 /W (@50 psi)
• Elastomeric compound coated on both sides
Applications
• Power supplies
• Automotive electronics
• Motor controls
• Power semiconductors
Specifications
Thickness: 0.010" (0.254mm)
Dielectric Breakdown Voltage (Vac): 6000
Thermal Conductivity: 2.0 W/m-K
Construction: Silicone/Fiberglass
Features
• Thermal impedance:
0.35°C-in 2 /W (@50 psi)
• Eliminates grease processing constraints
• Electrically isolating and easy to handle
• Conforms to surface textures
• Installation prior to soldering and cleaning
Applications
• Between a transistor and a heat sink
• Between two large surfaces such as an
L-bracket and the chassis of an assembly
• Between a heat sink and a chassis
• Under electrically isolated power modules or devices such as resistors or transformers
• U.L. File Number E59150
Specifications
Thickness: 0.005" (0.127mm)
Dielectric Breakdown Voltage (Vac): N/A
Thermal Conductivity: 2.0 W/m-K
Construction: Silicone/Fiberglass
THE WORLD LEADER IN THERMAL MANAGEMENT TECHNOLOGY

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Thermal Clad is a versatile substrate allowing circuit boards to be configured for shapes, bends and multiple thicknesses. In this motor control application, the dielectric has been selectively removed and the metal formed with three-dimensional features.
Thermal Clad substrates minimize thermal impedance and conduct heat more effectively and efficiently than standard printed wiring boards (PWB’s).These substrates are more mechanically robust than thick-film ceramics and direct bond copper constructions that are often used in these applications.
Additional Thermal Clad benefits:
• Increased power density
• Extend the life of dies
• Improved product thermal and mechanical performance
• Better use of surface mount technology
Thermal Clad substrates are available in panel form. Material selection should be based on thermal, dielectric and mechanical application requirements.
Circuit layer - 0.50 oz-10 oz
Dielectric layer - HT, HPL or MP
Base plate copper or aluminum
0.020-0.125" (0.5-3.2mm)
• Panels 18" x 24" (457.2 x 609.6mm),
18" x 25" (457.2 x 635mm) and
20" x 24" (508 x 609.6mm)
Ideal for use in DC/DC converter applications, IsoEdge high thermal performance technology replaces older flat-based heat sinks and insulators used in combination to meet safety agency criteria. IsoEdge’s thin powder dielectric coating provides excellent heat transfer with inherent 3-D dielectric safety while minimizing time-consuming assembly and safety approval times.
Base Layer
Copper or Aluminum
Circuit Layer
Dielectric Layer
( HPL, HT, MP )
PRODUCT FAMILY
Part
Number
(1)
Thickness
(.000"/µm)
PRODUCT PERFORMANCE
(2)
Thermal
Performance
(ºC/W)
(3)
Impedance
(ºC in 2 /W) /
(ºC cm 2 /W)
(2)
Conductivity
(W/m-K)
HPL
HT
MP
HPL-03015
HT- 04503
HT- 07006
MP- 06503
1.5/38
3/ 76
6/152
3/ 76
0.30
0.45
0.70
0.65
0.02 /0.13
0.05/0.32
0.11/0.71
0.09/0.58
7.5
4.1
4.1
2.4
DIELECTRIC PERFORMANCE
(5)
Breakdown
(kVAC)
(6)
Permittivity
(Dielectric
Constant)
(4)
Dielectric
Conductivity
(W/m-K)
5.0
8.5
11.0
8.5
6
7
7
6
3.0
2.2
2.2
1.3
(7)
Glass
Transition
(°C)
OTHER
(8)
Peel Strength
(lbs/in) /
(N/mm)
185
150
150
90
5/0.9
6/1.1
6/1.1
9/1.6
Method Description: 1-Optical 2- MET-5.4-01-40000-Test Thermal Performance of Insulated Metal Substrates (IMS)
3-Calculation from ASTM 5470 4-Extended ASTM 5470 5- ASTM D149 6-ASTM D150 7-MET-5.4-01-7800 7-ASTM D2861
Due to the size constraints and watt-density requirements in DC/DC conversion,
Thermal Clad has become the favored choice.Thermal Clad offers a variety of thermal performances, is compatible with mechanical fasteners and is highly reliable.
It can be used in almost every form-factor and fabricated in a wide variety of substrate metals, thicknesses and copper foil weights.
The use of Thermal Clad in heat-rail applications has grown significantly and is currently used in automotive, audio, motor control and power conversion applications.
Utilizing the many advantages of surface mount assembly, attachment capabilities and high thermal performance,Thermal Clad offers a cost effective solution for heat management.When using Thermal Clad as the metal base substrate, the assembly process can be fully automated, thus eliminating the high labor cost of hand assembly.T-Clad also allows for unique shape requirements as it can be custom formed.
In high-brightness LED applications, light output and long life are directly attributable to how well the LEDs are managed thermally.Thermal Clad is an excellent solution for designers. Because T-Clad is a metal based material, it can be configured for custom shapes and thicknesses thus allowing the designer to put high-brightness
LEDs in virtually any application. Mounting high-brightness LEDs on T-Clad assures the lowest possible operating temperatures and maximum brightness, color and life.
Compact high reliability motor drives built on Thermal Clad have set the benchmark for watt-density. Dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements. With the ability to fabricate in a wide variety of form-factors, the implementation into either compact or integrated motors drives is realized.The
availability of Thermal Clad HT makes high temperature operation possible.
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The Bergquist Company developed the
Gap Pad thermal interface material family to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application.
The extensive Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.
Gap Pad provides:
• Elimination of air gaps to reduce thermal resistance
• High conformability to reduce interfacial resistance
• Low-stress application assembly
Features
• Highly conformable, low hardness
• “Gel-like” modulus
• Designed for low-stress applications
• Puncture, shear and tear resistant
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• Between heat-generating semiconductors or magnetic components and a heat sink
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.020-0.250" (0.508-6.350mm)
Hardness, Bulk Rubber (Shore 00): 5
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.0W/m-K
(Two-Part)
Features
• Fiberglass reinforced for puncture, shear and tear resistance
• Easy release construction
• Electrically isolating
Applications
• Telecommunications
• Computers and peripherals
• Power conversion
• RDRAM
® memory modules / chip scale packages
• Area where heat needs to be transferred to a frame, chassis or other type of heat spreader
Specifications
Thickness: 0.010-0.020" (0.254-0.508mm)
Hardness, Bulk Rubber (Shore 00): 40
Dielectric Breakdown Voltage (Vac): >6000
Thermal Conductivity: 1.5W/m-K
(Two-Part)
Features
• Highly conformable, “S-Class” softness
• Natural inherent tack reduces interfacial thermal resistance
• Conforms to demanding contours and maintains structural integrity with little or no stress applied to fragile component leads
• Fiberglass reinforced for puncture, shear and tear resistance
• Excellent thermal performance at low pressures
Applications
• CD ROM / DVD ROM
• Voltage Regulator Modules (VRMs) and POLs
• Thermally-enhanced BGAs
• Memory packages / modules
• PC Board to chassis
• ASICs and DSPs
Specifications
Thickness: 0.020-0.125" (0.508-3.175mm)
Hardness, Bulk Rubber (Shore 00): 35
Dielectric Breakdown Voltage (Vac): >5000
Thermal Conductivity: 5.0W/m-K
(Two-Part)
Bergquist Gap Filling materials deliver superior thermal conductivity and are the ideal solution for liquid dispensed applications. As form-in-place elastomers, their ultra-conforming properties provide infinite-thickness coverage for uneven board topography. They are ideal for fragile and low-stress applications such as power electronics and discrete devices.
As cured, these products are dry to the touch, with no cure by-products, for a cleaner assembly. Bergquist Gap Filler offerings include a range of rheological characteristics and can be tailored to meet customer specific flow requirements.
Features
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient and accelerated cure schedules
• 100% solids - no cure by-products
• Excellent low and high temperature mechanical and chemical stability
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 1.6
Hardness (Shore 00): 30
Dielectric Strength (V/mil): 500
Thermal Conductivity: 1.0W/m-K
Features
• Optimized shear thinning*
• Stays in place, highly slump resistant
• Ultra-conforming, designed for fragile and low stress applications
• No cure by-products
Applications
• Automotive electronics
• Computers and peripherals
• Telecommunications
• Between any heat-generating semiconductor and a heat sink
Specifications
Density (g/cc): 2.7
Hardness (Shore 00): 50
Dielectric Strength ( V/mil): 400
Thermal Conductivity: 1.8W/m-K
* “Optimized Shear Thinning” - Maximizes dispensing capacity.
Features
• Two-part formulation for easy storage
• Thixotropic nature makes it easy to dispense
• Ultra-conforming, designed for fragile and low-stress applications
• Ambient or accelerated cure schedules
Applications
• Automotive electronics
• Discrete components to housing
• PCBA to housing
• Fiber optic telecommunications equipment
Specifications
Density (g/cc): 3.0
Hardness (Shore 00): 35
Dielectric Strength (V/mil): 275
Thermal Conductivity: 3.6W/m-K
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Hi-Flow phase change materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. The materials change from a solid at specific phase change temperatures and flow to assure total wet-out of the interface without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.
Features
• Thermal impedance:
0.05°C-in 2 /W (@25 psi)
• Used where electrical isolation is not required
• Low volatility - less than 1%
• Easy to handle in the manufacturing environment
Applications
• Spring or clip mount applications where thermal grease is used
• Microprocessors mounted on a heat sink
• Power semiconductors
• Power conversion modules
Specifications
Thickness: 0.005", 0.010" (0.127mm, 0.254mm)
Reinforcement Carrier: None
Continuous Use Temp: 125°C
Thermal Conductivity: 3.0 W/m-K
Features
• Thermal impedance:
0.10°C-in 2 /W (@25 psi)
• Can be manually or automatically applied to the surfaces of a roomtemperature heat sink
• Foil reinforced, adhesive-coated
• Soft, thermally conductive 55°C phase change compound
Applications
• Computers and peripherals
• Power conversion
• High performance computer processors
• Power semiconductors
• Power modules
Specifications
Thickness: 0.004" (0.102mm)
Reinforcement Carrier: Aluminum
Continuous Use Temp: 120°C
Thermal Conductivity: 1.0 W/m-K
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Features
• Thermal impedance:
0.20°C-in 2 /W (@25 psi)
• Field-proven polyimide film
• Excellent dielectric performance
• Excellent cut-through resistance
Applications
• Spring / clip-mounted
• Discrete power semiconductors and modules
Specifications
Thickness: 0.0045-0.0055" (0.114-0.140mm)
Reinforcement Carrier: Polyimide
Continuous Use Temp: 150°C
Thermal Conductivity: 1.5W/m-K
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The above application photo depicts TO-251 components fully bonded to a heat sink utilizing Bond-Ply LMS 500P lamination.
Bergquist Liquid Adhesives provide mechanical attachment of the component to the heat sink with thermal transfer properties without the need for added fasteners. The thixotropic characteristics make these materials an ideal fit automated or manual dispensing.
Features
• High bond strength to a variety of surfaces
• Double-sided, pressure-sensitive adhesive tape
• High performance, thermally conductive acrylic adhesive
• Can be used instead of heat-cure adhesive, screw mounting or clip mounting
Applications
• Mount heat sink onto BGA graphic processor or drive processor
• Mount heat spreader onto power converter PCB or onto motor control PCB
Specifications
Thickness: 0.005/0.008/0.011"
(0.127/0.203/0.279mm)
Reinforcement Carrier: Fiberglass
Dielectric Breakdown Voltage (Vac):
3000/6000/8500
Thermal Conductivity: 0.8W/m-K
Features
• Designed to replace mechanical fasteners or screws
• For applications that require electrical isolation
• Double-sided pressure sensitive adhesive tape
Applications
• Heat sink onto BGA processor
• Heat sink onto drive processor
• Heat spreader onto power converter PCB
• Heat spreader onto motor control PCB
Specifications
Thickness: 0.008" (0.203mm)
Reinforcement Carrier: Film
Dielectric Breakdown Voltage (Vac): 6000
Thermal Conductivity: 0.4W/m-K
Features
• Eliminates the need for mechanical fasteners
• One-part formulation for easy dispensing
• Mechanical and chemical stability
• Maintains structural bond in severeenvironment applications
• Heat cure
Applications
• PCBA to housing
• Discrete component to heat spreader
Specifications
Density (g/cc): 2.8
Hardness (Shore A): 80
Dielectric Strength (V/mil): 250
Thermal Conductivity: 1.8W/m-K
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Corporate Headquarters and Sales Office:
18930 West 78th Street
Chanhassen, MN 55317
Toll Free: (800) 347-4572 • Main: (952) 835-2322 • Fax: (952) 835-0430 • www.bergquistcompany.com
Thermal Products • Membrane Switches • Touch Screens