HPE Moonshot System
Site Planning Guide
Abstract
This guide is for an experienced service technician. Hewlett Packard Enterprise assumes you are qualified in the servicing of computer
equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability
precautions for rack installations.
Part Number: 711769-004R
November 2015
Edition: 5
© Copyright 2013, 2015 Hewlett Packard Enterprise Development LP
The information contained herein is subject to change without notice. The only warranties for Hewlett Packard Enterprise products and services
are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting
an additional warranty. Hewlett Packard Enterprise shall not be liable for technical or editorial errors or omissions contained herein.
Links to third-party websites take you outside the Hewlett Packard Enterprise website. Hewlett Packard Enterprise has no control over and is not
responsible for information outside the Hewlett Packard Enterprise website.
Contents
Introduction ............................................................................................................................................ 5
About this guide........................................................................................................................................................5
Related documentation ............................................................................................................................................5
Environmental requirements .................................................................................................................. 6
Environmental elements ...........................................................................................................................................6
Humidity level ................................................................................................................................................6
Dust and pollution ..........................................................................................................................................6
Metallic particulate contamination .................................................................................................................7
Electrostatic discharge prevention ................................................................................................................7
Acoustic noise specification...........................................................................................................................8
Recommended operating environment ....................................................................................................................8
Airflow requirements .................................................................................................................................................9
Blanking panels .............................................................................................................................................9
G3 Optimization Kit......................................................................................................................................10
Space requirements ...............................................................................................................................................10
Delivery space requirements .......................................................................................................................10
Operational space requirements .................................................................................................................10
Equipment clearance and floor loading .......................................................................................................14
Floor plan grid..............................................................................................................................................15
Chassis environmental specifications ....................................................................................................................15
Rack and accessory footprints ...............................................................................................................................16
Front door clearance ...................................................................................................................................16
Best practices for deployment in rows .........................................................................................................18
Rack placement and arrangement for proper airflow ..................................................................................18
Rack tie-down option kit ..............................................................................................................................20
Power requirements and considerations .............................................................................................. 21
Power requirements ...............................................................................................................................................21
Electrical factors .....................................................................................................................................................21
Power consumption .....................................................................................................................................21
Electrical load requirements (circuit breaker sizing) ....................................................................................22
Power quality ...............................................................................................................................................23
Power considerations ..................................................................................................................................23
Distribution hardware...................................................................................................................................24
Grounding requirements ..............................................................................................................................25
Grounding systems......................................................................................................................................25
System installation guidelines .....................................................................................................................29
Power configuration................................................................................................................................................29
Single-phase AC configuration ....................................................................................................................30
Power supply specifications ...................................................................................................................................30
Hardware specifications and requirements .......................................................................................... 31
Chassis specifications ............................................................................................................................................31
HPE Intelligent Rack Series rack specifications .....................................................................................................31
Rack requirements .................................................................................................................................................31
Rack-free environment requirements .....................................................................................................................32
Configuration scenarios ....................................................................................................................... 33
Example configurations ..........................................................................................................................................33
Estimating power and cooling ................................................................................................................................33
Estimating total weight ...........................................................................................................................................34
Preparing for installation ...................................................................................................................... 35
Warnings and cautions ...........................................................................................................................................35
Contents
3
Additional rack considerations ................................................................................................................................36
General component placement guidelines .............................................................................................................36
Rack configuration software ...................................................................................................................................37
Sample installation schedule ..................................................................................................................................37
Sample checklists...................................................................................................................................................38
Delivery survey .......................................................................................................................................................40
Conversion factors and formulas ......................................................................................................... 41
Conversion factors .................................................................................................................................................41
Formulas ................................................................................................................................................................41
Support and other resources................................................................................................................ 42
Accessing Hewlett Packard Enterprise Support .....................................................................................................42
Information to collect ...................................................................................................................................42
Accessing updates .................................................................................................................................................42
Websites.................................................................................................................................................................42
Customer Self Repair .............................................................................................................................................43
Remote support ......................................................................................................................................................51
Acronyms and abbreviations ................................................................................................................ 52
Documentation feedback ..................................................................................................................... 54
Index.................................................................................................................................................... 55
Contents
4
Introduction
About this guide
This document helps facilities and IT staff plan for the receipt and installation of HPE Moonshot System
products in a dedicated computer facility.
The document is structured as follows:
•
Environmental requirements (on page 6)
This section provides information on the environmental site requirements, including temperature,
airflow, and space requirements.
•
Power requirements and considerations (on page 21)
This section details the power requirements and electrical factors that must be considered before
installation. This section also discusses PDU installation.
•
Hardware specifications and requirements (on page 31)
This section provides system specifications for the HPE Moonshot 1500 Chassis, HPE Intelligent
Rack Family series racks, and single-phase and three-phase power sources.
•
Configuration scenarios (on page 33)
This section provides examples of maximum and typical rack configurations using Moonshot System
products, and worksheets to help determine power usage and total weight.
•
Preparing for installation (on page 35)
This section includes tools and information to help prepare for Moonshot System product delivery
and installation.
Related documentation
The HPE Moonshot Information Library (http://www.hpe.com/info/moonshot/docs) is a task-based
repository that includes installation instructions, user guides, maintenance and service guides, best
practices, useful links, and videos. Use this website to obtain the latest documentation and look up
information about the following:
•
Learning about the Moonshot System technology
•
Setting up and configuring the Moonshot System
•
Updating the components of the Moonshot System
•
Integrating the Moonshot System and understanding how it connects to the outside world
•
Using and managing the Moonshot System
Introduction
5
Environmental requirements
Environmental elements
The following environmental elements can affect Moonshot System product installation.
Humidity level
Maintaining proper humidity levels in the computer room is essential for reliable equipment performance.
Humidity levels outside the recommended range of 25% to 45%, especially if these levels are sustained,
lead to equipment damage and result in equipment malfunction through several mechanisms.
High humidity levels enable galvanic activity to occur between dissimilar metals. Galvanic activity can
cause high resistance to develop between connections and lead to equipment malfunctions and failures.
Extended periods of humidity levels greater than 60% have also been shown to adversely affect modern
printed circuit board reliability. High humidity can also adversely affect some magnetic tapes and paper
media.
High humidity levels are often the result of malfunctioning facility air conditioning systems. High humidity
can also be the result of facility expansion in excess of air conditioning system capacity.
Humidity levels below the minimum recommended value can also have undesirable effects. Low humidity
contributes to high ESD voltage potentials. ESD events can cause component damage during service
operations and equipment malfunction or damage during normal operation. Low humidity levels can
reduce the effectiveness of static dissipating materials and have also been shown to cause high speed
printer paper feed problems.
Low humidity levels are often the result of the facility heating system and occur during the cold season.
Most heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.
ASHRAE and representatives of IT equipment manufacturers recommend a range of 18°C dry bulb with a
5.5°C dew point temperature to 27°C dry bulb with a 5.5°C dew point temperature. Over this range of dry
bulb temperature with a 5.5°C dew point, the relative humidity varies from approximately 25% to 45%.
For more information on humidity levels, see the ASHRAE website (http://www.ashrae.org).
Dust and pollution
Dust and microscopic particles in the site environment adversely affect computer equipment. Airborne
abrasive particles can cause bearing failures in disk drives, tape drives, and other mechanical devices.
Dust may also blanket electronic components and printed circuit boards, causing premature failure
because of excess heat, humidity buildup, or both.
Conductive metallic particles can cause power supply and other electronic component failures. A build-up
of these metallic particles over time can cause short circuits on the densely packed circuit boards
common in modern electronics. Use every effort to ensure that the environment is as dust- and
particulate-free as possible. See "Metallic particulate contamination."
Smaller particles can pass through some filters, and over time, cause problems in mechanical parts.
Selection of the appropriate filter media and maintaining the air conditioning system at a high static air
pressure level can prevent small dust particles from entering the computer room.
Other dust, metallic, conductive, abrasive, or microscopic particles can result from the following sources:
•
Subfloor shedding
•
Raised floor shedding
Environmental requirements 6
•
Ceiling tile shedding
These particulates are not always visible to the naked eye. A good method to determine their possible
presence is to check the underside of the tiles. The tile should be shiny, galvanized, and free from rust.
To minimize dust and pollution in the computer room, observe the following guidelines:
•
Smoking—Establish a no-smoking policy. Cigarette smoke particles are eight times larger than the
clearance between disk drive read/write heads and the disk surface.
•
Printer location—Locate printers and paper products in a separate room to eliminate paper
particulate problems.
•
Eating or drinking—Establish a no-eating or drinking policy. Spilled liquids can cause short circuits
in equipment such as keyboards.
•
Floor cleaning—Use a dust-absorbent cloth mop rather than a dry mop to clean tile floors.
Special precautions are necessary if the computer room is near a source of air pollution. Some air
pollutants, especially hydrogen sulfide (H2S), are not only highly toxic and unpleasant but corrosive as
well. Hydrogen sulfide damages wiring and electronic equipment. The use of activated charcoal filters
reduces this form of air pollution.
Metallic particulate contamination
Metallic particulates can be especially harmful around electronic equipment. This type of contamination
can enter the data center environment from a variety of sources, including but not limited to raised floor
tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners, or printer component
wear. Because metallic particulates conduct electricity, they have an increased potential for creating short
circuits in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of
electronic equipment.
Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If
these whiskers are disturbed, they may break off and become airborne, possibly causing failures or
operational interruptions. For more than 50 years, the electronics industry has been aware of the relatively
rare but possible threat posed by metallic particulate contamination. During recent years, a growing
concern has developed in computer rooms where these conductive contaminants are formed on the
bottom of some raised floor tiles.
Although this problem is relatively rare, it may be an issue within your computer room. Because metallic
contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett
Packard Enterprise strongly recommends that your site be evaluated for metallic particulate
contamination before installation of electronic equipment.
Electrostatic discharge prevention
Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of
a static charge is determined by the following factors:
•
Types of materials
•
Relative humidity
•
Rate of change or separation
Follow these precautions to minimize possible ESD-induced failures in the computer room:
•
Maintain recommended humidity level and airflow rates in the computer room.
•
Install conductive flooring (conductive adhesive must be used when laying tiles).
•
Use conductive wax if waxed floors are necessary.
•
Ensure that all equipment and flooring are properly grounded and are at the same ground potential.
Environmental requirements 7
•
Use conductive tables and chairs.
•
Use a grounded wrist strap (or other grounding method) when handling circuit boards.
•
Store spare electronic modules in antistatic containers.
Acoustic noise specification
The declared noise emission values for the Moonshot 1500 Chassis in accordance with ISO 9296 are
listed in the following table.
Specification
Value
Declared sound power level, LWAd Bels
Idle
Operating
—
7.27
7.27
Declared sound pressure level, LpAm
dBA
Idle
Operating
—
58.93
59.00
For detailed information on conformance to country Technical Regulations and certificates of
conformance, see the Hewlett Packard Enterprise website (http://www.hpe.com/eu/certificates).
The levels specified in the previous table are appropriate for dedicated computer room environments, not
office environments.
You must consider the acoustic noise specifications relative to operator positions within the computer
room when adding additional systems to computer rooms with existing noise sources.
You can reduce ambient noise level in a computer room using the following methods:
•
Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling
tile.
•
Sound deadening—Cover the walls with curtains or other sound deadening material.
•
Removable partitions—Use foam rubber models for the most effectiveness.
Recommended operating environment
To help ensure continued safe and reliable equipment operation, install or position the rack in a well
ventilated, climate-controlled environment.
Air inlet temperature to the rack should be between 20ºC to 25ºC (68°F to 77°F) under normal operating
conditions in the data center, per ASHRAE standard TG9 HDEC.
The following table shows product technical requirements based on customer environments.
Operating Environment (ambient)1
Environme
nt
Dry bulb temperature2
Industry
3
equivalent Recommended6
ASHRAE
(Allowable4,5)
Controlled
computer
room
Controlled
office
1
2
Dew
point
(max)7
Rate of
change
(max)
20°C to 25°C (15°C to 32°C) 40% to 55% (20% to 80%)
68°F to 77°F (59°F to 90°F)
17.0°C
62.6°F
5°C/hr
41°F/hr
20°C to 25°C (10°C to 35°C) 40% to 55% (20% to 80%)
68°F to 77°F (50°F to 95°F)
21.0°C
69.8°F
5°C/hr
41°F/hr
Relative humidity,
noncondensing
Recommended6
(Allowable5)
Environmental requirements 8
Uncontrolled
office
Home
3
3
4
Light
industrial
Portable/mobi 4
le
—
Special9
NA8 (5°C to 35°C)
NA8 (41°F to 95°F)
NA8 (5°C to 35°C)
NA8 (41°F to 95°F)
NA8 (5°C to 40°C)
NA8 (41°F to 104°F)
NA8 (5°C to 40°C)
NA8 (41°F to 104°F)
—
NA8 (8% to 85%)
NA8 (8% to 85%)
NA8 (8% to 90%)
NA8 (8% to 90%)
—
28.0°C
82.4°F
28.0°C
82.4°F
28.0°C
82.4°F
28.0°C
82.4°F
—
NA8
NA8
NA8
NA8
—
The maximum elevation for all operating environmental classes is 3050 m (10,007 ft).
Dry bulb temperature is the regular ambient temperature. Derate maximum dry bulb temperature 1ºC/300 m above
900 m (34°F/984 ft above 2,953 ft).
3 The values in each row meet or exceed the stated industry equivalent class specifications.
4 With installed media, the minimum temperature is 10ºC (50°F) and maximum relative humidity is limited to 80%.
Specific media requirements may vary.
5 Allowable: equipment design extremes as measured at the equipment inlet.
6 Recommended: target facility design and operational range.
7 Must be noncondensing environment.
8 Local product groups must make business decisions for the appropriate values.
9Product specifications are controlled by contract or other requirements.
1
2
The operating temperature inside the rack is always higher than the room temperature and is dependent
on the configuration of equipment in the rack. Check the TMRA for each piece of equipment before
installation.
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the chassis or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA
Airflow requirements
Hewlett Packard Enterprise rack-mountable products typically draw in cool air through the front and
exhaust warm air out through the rear of the rack. The front door of the rack must be ventilated adequately
to enable ambient room air to enter the rack with as little restriction as possible. Likewise, the rear door
must offer as little restriction as possible to the warm air escaping from the rack.
The free area of a door determines the amount of airflow that can pass through the doors. Rack doors
must have a minimum of 63% free area compared to the total area of the door. Some doors appear to
have sufficient free area but do not.
To prevent air recirculation from the rear of the rack, the computer room air conditioning system must
deliver sufficient airflow to the front of the rack to meet the airflow requirements of the installed equipment
in the rack. Idle, normally operating, and maximum airflow requirements for cartridge configurations can
be obtained from the Hewlett Packard Enterprise website (http://www.hpe.com/info/hpepoweradvisor).
Route cables away from fans and air inlets and outlets to ensure proper airflow. Improperly routed cables
can impede airflow, cause the cooling fans to work harder, consume more power, and reduce cooling
system efficiency.
Blanking panels
If the front of the rack is not filled completely with components, unused equipment mounting space
between the components can adversely affect cooling within the rack. Cover unused equipment mounting
space with blanking panels.
Seal air gaps in the rack and between adjacent racks to prevent recirculation of hot-air from the rear of the
rack to the front of the rack. Use cable brushes to seal cable entry and exit cutouts and cabinet fillers to
seal the space between the cabinets to provide improved cooling efficiency.
Environmental requirements 9
G3 Optimization Kit
The G3 Optimization Kit enables you to install foam rail gaskets in your HPE Intelligent Series 36U, 42U,
and 47U 600-mm (24-in) wide racks and in 42U 800-mm (31-in) wide racks to improve separation
between hot and cold aisles in the data center.
The G3 Optimization Kit supports all Intelligent Series Rack rack heights including 42U and 47U. It also
supports 800-mm wide racks.
Space requirements
When deciding where to place your rack:
•
At least 1219 mm (48 in) of clearance is needed all the way around the pallet and above the rack to
enable the removal of the packing material.
•
At least 1219 mm (48 in) of clearance is needed in front of the rack to enable the door to open
completely.
•
At least 762 mm (30 in) of clearance is needed in the rear of the rack to provide access to
components.
•
At least 380 mm (15 in) of clearance is needed around a power supply to facilitate servicing.
Delivery space requirements
There should be enough clearance to move equipment safely from the receiving area to the computer
room. Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.
Delivery plans should include the possible removal of walls or doors.
Operational space requirements
Other factors must be considered along with the basic equipment dimensions. Reduced airflow around
equipment causes overheating, which can lead to equipment failure. Therefore, the location and
orientation of air conditioning ducts, as well as airflow direction, are important. Obstructions to equipment
intake or exhaust airflow must be eliminated.
CAUTION: Do not block venting holes in the covers or side panels. Proper airflow is required
to prevent overheating of the unit.
The locations of lighting fixtures and utility outlets affect servicing operations. Plan equipment layout to
take advantage of lighting and utility outlets. Do not forget to include clearance for opening and closing
equipment doors.
Clearance at the front and rear of the racks must also be provided for proper cooling airflow through the
equipment.
If other equipment is located so that it exhausts heated air near the cooling air intakes of the racks, larger
space requirements are needed to keep ambient air intake to the racks and equipment within the specified
temperature and humidity ranges.
Space planning should also include the possible addition of equipment or other changes in space
requirements. Equipment layout plans should also include provisions for the following:
•
Channels or fixtures used for routing data cables and power cables
•
Access to air conditioning ducts, filters, lighting, and electrical power hardware
•
Power conditioning equipment
•
Cabinets for cleaning materials
Environmental requirements 10
•
Maintenance area and spare parts
Rack or cabinet space required for HPE Moonshot 1500 Chassis
The Moonshot 1500 Chassis installation requires a total of 990 mm (39 in) of rack space.
Item
Description
1
2
3
Rack column
Moonshot 1500 Chassis
Cable management tray
CAUTION: Special precautions must be taken when installing the Moonshot 1500 Chassis in
a 1075mm Intelligent Series Rack. The cable management arm or rear-mounted PDU prohibits
the rear rack door from closing.
The Moonshot 1500 Chassis can be installed in any of the 1075mm HPE Intelligent Series Racks;
however, the following exceptions must be accounted for:
•
The rack rear doors must stay open or be completely removed from the rack.
•
The PDU must use the horizontal mount, either above or below the chassis.
Environmental requirements 11
PDU location options for the Moonshot 1500 Chassis
The PDU can be installed in one of the following configurations:
•
Side mount (0U)
Environmental requirements 12
•
Horizontal mount (1U)
Environmental requirements 13
•
Vertical mount (rear)
Equipment clearance and floor loading
Hewlett Packard Enterprise recommends a clearance of 1219 mm (48 in) in front of a configured rack and
762 mm (30 in) to the rear of a configured rack. All buildings and raised computer room floors are
engineered to provide a specific floor loading.
WARNING: When configuring a solution, make sure that the floor loading specifications are
followed. Failure to do so can result in physical injury or damage to the equipment and the
facility.
Intelligent Series Rack footprint (600 mm [24 in] wide)
Environmental requirements 14
Intelligent Series Rack footprint (800 mm [31.5 in] wide)
Floor plan grid
A floor plan grid is used to plan the location of equipment in the computer room. In addition to its use for
planning, the floor plan grid should also be used when planning the locations of the following items:
•
Air conditioning vents
•
Lighting fixtures
•
Utility outlets
•
Doors
•
Access areas for power wiring and air conditioning filters
•
Equipment cable routing
Chassis environmental specifications
Specification
Value
Temperature range*
Operating
—
Non-operating
Maximum Wet bulb temperature
Operating
-30°C to 60°C (-22°F to
140°F)
—
28ºC (82.4ºF)
Non-operating
38.7ºC (101.7ºF)
Relative humidity
(non-condensing)**
Operating
Non-operating
—
10°C to 35°C (50°F to 95°F)
10% to 90%
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1000 ft) to 3048
m (10,000 ft) is applicable. No direct sunlight allowed. Upper operating limit is 3,048 m (10,000 ft) or 70 kPa/10.1 psia.
Upper non-operating limit is 9,144 m (30,000 ft).
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for
storage corresponds to a pressure minimum of 70 kPa (10.1 psia).
Environmental requirements 15
Rack and accessory footprints
When accessories such as extensions and stabilizing kits are added to a particular rack, the footprint of
the rack extends into the rack rear row and infringes upon necessary clearances.
Footprint for a 600-mm rack configuration (597.8 mm [23.54 in] wide x 1300.2 mm [51.19 in] deep):
Front door clearance
When racks are bayed together, the design of the front door limits the extent to which the rack door on the
right can open. If there is not sufficient work space, open the door on the left side or remove the door from
the rack being serviced. Slight differences exist between the opening allowances of the Intelligent Series
Racks because of the different geometries and construction of the doors.
Intelligent Series Racks configured with 600-mm (23.62-in) baying brackets have the following front door
clearances:
•
90º access with one door closed
Environmental requirements 16
•
120º access with both doors open
Intelligent Series Racks configured with 609.60-mm (24.00-in) baying brackets have the following front
door clearances:
•
102º access with one door closed
Environmental requirements 17
•
120º access with both doors open
Best practices for deployment in rows
Baying kits are used to physically connect adjacent racks to create a row of two or more units. Racks that
are bayed together with a baying kit are more stable and reduce the potential tipping of the rack. If racks
are secured together with baying kits, the side feet installed on each end of the row of racks are
considered optional.
If gaps are created between racks that could allow airflow from the rear of the rack, these gaps should be
sealed with an appropriate material that will not cause particulate or electro-static discharge issues.
Fixed stabilizers are anti-tip side feet (front and side) that provide stability and support when equipment is
installed, removed, or accessed within the rack. Rack rows with four or more bayed racks do not need a
stabilizer kit installed. For single racks or bays of three racks, with no component exceeding 100 kg (220
lb), a standard 600 mm stabilizer is required.
If a standard 600 mm (23.62 in) or 800 mm (31.50 in) front stabilizing foot is installed on a stand-alone
rack, the side feet, provided with the fixed stabilizer kit, should also be installed.
A heavy duty 600 mm (23.62 in) front stabilizer foot is required in any of the following situations:
•
A single rack-mountable component weighing 100 kg (220 lb) or greater is installed in a stand-alone
rack.
•
A row of three or fewer racks are bayed together.
•
Side feet, which are included in the stabilizer kits, should also be installed to stabilize the rack.
For more information about supported rack option kits, see the Intelligent Rack Family Options Installation
Guide on the Hewlett Packard Enterprise website (http://www.hpe.com/info/rackandpower).
Rack placement and arrangement for proper airflow
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This
arrangement ensures proper airflow. Using a rack without blanking panels results in improper
cooling that can lead to thermal damage.
Racks must be placed and arranged properly in the data center to provide sufficient airflow and clearance
for access to the rack.
Environmental requirements 18
In the front of the rack, a clearance of 1219 mm (48 in) is required. This requirement applies when
installing individual racks as well as when aligning rack rows so that the front doors are facing each other.
In the rear of the rack, a clearance of 762 mm (30 in) is required to provide space for servicing the rack.
If a data center has multiple rows of racks, the rows of racks can be arranged to take advantage of the
front-to-back airflow by arranging racks front-to-front and back-to-back. Additionally, conditioned air
registers can be oriented along the front aisles and the return air registers in the back aisles. This
arrangement utilizes the aisle space as air plenums and increases the efficiency of the air conditioning.
Item
Description
1
2
3
4
5
6
Building ceiling or roof
Return air plenum
Suspended ceiling
Down flow air conditioner located perpendicular to equipment
rows
Airflow grille
Building floor*
7
8
9
10
Raised floor
Front of rack
Rear of rack
Return air grille
*Elevation: Raised floor - under flow plenum distribution system with ceiling return
Third-party racks
If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and
to prevent damage to the equipment:
•
Front and rear doors: If the rack includes closing front and rear doors, a minimum of 65 percent open
area must be provided to ensure adequate airflow.
Environmental requirements 19
•
Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm
(3 in).
•
Rear door: The clearance between the rear of the enclosure and the rear rack door must be a
minimum of 177.80 mm (7.00 in) to accommodate system cabling.
•
Side: The clearance between the installed rack component and the side panels of the rack must be a
minimum of 70 mm (2.75 in).
•
Width: 483 mm (19 in)
•
Depth: Maximum clearance between front and rear RETMA rails is 876.00 mm (34.5 in). Minimum
clearance for square-hole and round-hole racks is 654.00 mm (25.75 in).
•
The rack must be able to accept the adjustable rack rails that are shipped with each chassis:
o
Minimum rail length: 654.00 mm (25.75 in)
o
Maximum rail length: 876.00 mm (34.50 in)
Rack tie-down option kit
HPE Rack Family Rack Tie-Down Option Kit enables you to secure HPE Rack Family racks to the floor.
The following figure indicates where to drill the holes to secure the rack to the floor. The distances are
measured from the holes on the tie-downs. Hewlett Packard Enterprise recommends having the building
structural engineer drill the holes. Secure the rack to the floor by inserting a bolt with a washer into each
hole.
For more information, see the Rack Family Options Installation Guide.
Environmental requirements 20
Power requirements and considerations
Power requirements
When planning power distribution requirements, observe the following:
•
The power load must be balanced between available AC supply branch circuits.
•
The AC current load attached to a branch circuit must not exceed 80 percent of that branch circuit
current rating.
•
If a UPS system is used, when the peak load reaches 90 percent of the non-redundant UPS system
capacity, no new loads can be installed until the UPS system capacity is increased.
Installation of this equipment must be performed by licensed electricians and must comply with local and
regional electrical regulations governing the installation of IT equipment. This equipment is designed to
operate in installations covered by NFPA-70 (National Electric Code) and NFPA-75 (code for Protection of
Electronic Computer/Data Processing Equipment). For electrical power ratings on options, refer to the
product rating label or the user documentation supplied with that option
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not
overload the AC supply branch circuit that provides power to the rack. Consult the electrical
authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the chassis from power fluctuations and temporary interruptions with a
regulating UPS. This device protects the hardware from damage caused by power surges and
voltage spikes and keeps the chassis in operation during a power failure.
Electrical factors
Proper design and installation of a power distribution system requires specialized skills. The person
responsible for this task must have a thorough knowledge of appropriate electrical codes and the
limitations of the power systems for computer and data processing equipment.
A well designed power distribution system exceeds the requirements of most electrical codes. A good
design, when coupled with proper installation practices, produces the most trouble-free operation.
A detailed discussion of power distribution system design and installation is beyond the scope of this
document. However, electrical factors relating to power distribution system design and installation must
be considered during the site preparation process.
IMPORTANT: Electrical practices and suggestions in this guide are based on North America
practices. For regions and areas outside North America, local electrical codes take
precedence over North American electrical codes.
Local authority has jurisdiction (LAHJ) and should make the final decision regarding adherence
to region-specific or area-specific electrical codes and guidelines.
Power consumption
Power consumption can be divided into two broad categories:
•
Marked electrical amperage, which is listed on the required safety and regulatory labels, generally
represents the maximum current draw that the marked device could achieve. Safety and regulatory
labels on computer equipment list the ratings for maximum power consumption conditions.
Power requirements and considerations 21
•
Typical consumption, which is measured under normal circumstances, should be used only in
customer calculations with UPS and air conditioning sizing where remaining capacities are needed.
When determining the necessary electrical infrastructure required, consider several factors. The first and
most important factor is the local electrical and regulatory codes. The installation must meet or exceed
these codes. The local authority has jurisdiction and makes the final decision as to whether an installation
conforms to the relevant codes.
In North America, the relevant code is National Electrical Code 2005 Article 210 and Article 645, which
states the continuous measured load must not exceed 80 percent of the rated circuit maximum, where
continuous load is defined as three hours or longer.
This method leaves some flexibility to the infrastructure designer and includes the following options for
determining power requirements:
NOTE: The following scenarios use North America circuit sizes and voltages.
•
Use the HPE Power Advisor to calculate the infrastructure required as configured and allow some
flexibility for growth. Hewlett Packard Enterprise provides power sizing tools for all its current
industry standard servers at the Hewlett Packard Enterprise website.
(http://www.hpe.com/info/hpepoweradvisor)
This tool provides a conservative estimate of power loading values at a given system utilization as
well as a theoretical maximum load that the system could achieve as configured. These tools enable
the infrastructure designer to use realistic maximum values to estimate power loading and circuit
requirements. In this scenario, however, monitoring tools such as Insight Power Manager or HPE
Monitored PDUs must be used to ensure that the continuous loads do not exceed 80 percent of the
rated circuit load.
•
Install devices in a test environment and measure the actual worst case loads running the
applications and loading that is specific to your environment, and then size the electrical
infrastructure accordingly. This method is the most accurate, but it might not be practical for many
customers. This method also requires ongoing monitoring of the installation to ensure that
infrastructure is not overloaded as applications and loads change.
•
Manage the electrical load using the HPE APM. For information about APM, see the HPE ProLiant
SL Advanced Power Manager User Guide on the Moonshot Information Library
(http://www.hpe.com/info/moonshot/docs).
•
Size air conditioning and UPS devices with typical ratings, but account for overloading that might
take place with additional infrastructure growth.
Hewlett Packard Enterprise recommends a cooling plan for the maximum rated power output of the room
and a growth plan for cooling the infrastructure.
When determining power requirements, always consider any peripheral equipment that will be installed
during initial installation or as a future upgrade. To determine the power required to support these devices,
see the applicable documentation for such devices. Hewlett Packard Enterprise recommends using
dedicated breakers for peripheral equipment.
Electrical load requirements (circuit breaker sizing)
IMPORTANT: LAHJ is the final authority regarding adherence to country-specific electrical
codes and guidelines.
Hewlett Packard Enterprise recommends derating the power distribution systems for one or both of the
following reasons:
•
To avoid nuisance tripping from load shifts or power transients, do not run circuit protection devices
continuously above 80 percent of their RMS current ratings.
Power requirements and considerations 22
•
Safety agencies derate most power connectors to 80 percent of their RMS current ratings.
Power quality
Most Hewlett Packard Enterprise products are designed to operate over a wide range of voltages and
frequencies. The products are tested and shown to comply with certain EMC Specifications. However,
damage can occur if these ranges are exceeded. Severe electrical disturbances can exceed the design
specifications of the equipment.
Factors affecting power quality
Common factors that affect power quality include the following:
•
Electrical storms
•
Utility service brownouts or sags
•
Faults in the power generation equipment
•
Large inductive loads, such as motors and welders
•
Load fluctuations occurring within the facility distribution system
•
Loose connections or other faults in the distribution system wiring
Power system protection
Hewlett Packard Enterprise products can be protected from the sources of many of these electrical
disturbances by using the following:
•
A dedicated power distribution system
•
Power conditioning equipment
•
Over- and under-voltage protection and detection circuits
•
Lightning arresters on power cables to protect equipment against electrical storms
The power distribution system is designed to provide immunity to power interruptions. However, testing
cannot conclusively rule out loss of service. Use the following guidelines to provide the best possible
performance of power distribution systems for Hewlett Packard Enterprise computer equipment:
•
Dedicated power source—Isolates the power distribution system from other circuits in the facility.
•
Online uninterruptible power supply (UPS)—Keeps input voltage to devices constant and should be
considered if outages of one-half cycle or more are common.
•
Auto-start generators–provide backup power to the UPS.
•
Missing-phase and low-voltage detectors—initiate a transfer of the UPS to generator power when a
severe power interruption occurs. For peripheral equipment, these devices are recommended but
optional.
For each situation, refer to qualified contractors or consultants.
Power considerations
Power is best managed within the rack by the use of one or more rack-mounted PDUs. Depending on the
configuration, you might have to use multiple PDUs to connect all devices inside the rack.
The total power load for a PDU must not exceed 80% of the branch circuit rating. If you do not use a PDU,
connect each piece of equipment within the rack to a dedicated branch circuit.
Power requirements and considerations 23
For additional information, see the Hewlett Packard Enterprise website
(http://www.hpe.com/info/hpepoweradvisor).
Power redundancy
High-availability information technology equipment such as the Moonshot System can be configured with
backup or redundant power sources and power supplies in either of the following configurations:
•
N+N design: N power supplies can be provided where N/2 power supplies are capable of sustaining
the associated equipment's power demand. For the Moonshot 1500 Chassis this quantity is typically
a 2+2 power supply configuration.
•
N+1 design: For the Moonshot System, the typical N+1 configuration can result in either 3 power
supplies or 4 power supplies, depending on the power draw of the system. When the N+1 design
requires four power supplies, three of the power supplies are required to handle the equipment's
power demand. If one fails, the other three remain online with enough capacity to meet the power
demand.
Be sure that the wiring and branch circuitry to each installation is suitably rated for the power demand of
the connected equipment. To provide additional redundancy, Hewlett Packard Enterprise recommends
routing the power through separate branch circuits, breaker panels, and PDUs.
Non-redundant power
For equipment supplied by a single source of power, connect all components to the same power
distribution device (PDU or UPS). The power distribution device should be suitably rated for the
connected load. If the total load exceeds the rating of the power distribution device, obtain a suitable rated
device or add a second power distribution device and divide the load equally between the devices.
Line voltage selection
All Hewlett Packard Enterprise products that are optimized for rack mounting have wide-range power
supply inputs designed to operate at a voltage range of 100-240V. Hewlett Packard Enterprise
recommends operating rack-optimized equipment with high line voltage (200 V AC to 240V AC).
Benefits of high line voltage operation include the following:
•
Power supplies run more efficiently and waste less power when operating at 200V to 240 V, thus
saving electrical power.
•
Greater capacity is available in a single rack. For the same size circuit, almost twice the power can
be delivered to a rack at high line versus low line. For example, a branch circuit that is 115 V 30A can
deliver 2760 VA (derated) to a rack, while a branch circuit that is 208 V 30A can deliver 4992VA
(de-rated) to a rack.
•
Some products require 200 V to 240 V input power to operate at their full-rated capacity.
•
The HPE 1200W High Efficiency Power Supply operates only at 200 V AC to 240V AC and provides
significantly higher efficiency than the 750 W power supply.
•
Power supplies run cooler at higher input voltages, last longer, and improve overall availability. Also,
because they run cooler, they produce less heat which helps to lower cooling costs.
•
Keeping input currents lower allows the use of smaller, more standardized power connections.
Distribution hardware
This section describes wire selection and the types of raceways (electrical conduits) used in the
distribution system.
Power requirements and considerations 24
Wire selection
Use copper conductors instead of aluminum, because aluminum’s coefficient of expansion differs
significantly from that of other metals used in power hardware. Because of this difference, aluminum
conductors can cause connector hardware to work loose, overheat, and fail.
Raceway systems (electrical conduits) (LAHJ)
Raceways (electrical conduits) form part of the protective ground path for personnel and equipment.
Raceways protect the wiring from accidental damage and also provide a heatsink for the wires.
Any of the following types may be used:
•
EMT thin-wall tubing
•
Rigid (metal) conduit
•
Liquidtight with RFI shield grounded (most commonly used under raised floors)
•
Armored cable
Building distribution
All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to
provide ground continuity). Conduit that is exposed and subject to damage should be constructed of rigid
galvanized steel.
Grounding requirements
This equipment must be grounded properly for proper operation and safety. In the United States, you
must install the equipment in accordance with NFPA 70 (National Electric Code), Article 250, as well as
any local and regional building codes.
In Canada, you must install the equipment in accordance with Canadian Standards Association, CSA
C22.1, Canadian Electrical Code.
In all other countries, you must install the equipment in accordance with any regional or national electrical
wiring codes, such as the International Electrotechnical Commission (IEC) Code 364, parts 1 through 7.
Furthermore, you must be sure that all power distribution devices used in the installation, such as branch
wiring and receptacles, are listed or certified grounding-type devices.
Because of the high ground-leakage currents associated with this equipment, Hewlett Packard Enterprise
recommends the use of a PDU that is either permanently wired to the building’s branch circuit or includes
a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those
complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips to
supply power to this equipment is not recommended.
Grounding systems
Hewlett Packard Enterprise systems are tested and certified only with grounding systems in which a
neutral return path and a protective earth are separate conductors without any inserted impedances.
Additionally, the protective earth and return neutral wires are shorted together at the XO bonding junction
on the secondary side of the newly derived power source.
Grounding and earth leakage current
For proper operation and safety, rack components must be properly grounded in accordance with any
local and regional building codes. Furthermore, be sure that all power distribution devices used in the
installation, such as branch wiring and receptacles, are Listed or Certified grounding-type devices.
Observe the following limits when connecting products to AC power distribution devices:
Power requirements and considerations 25
•
For UPS products and PDUs that have permanently attached AC power cords or are directly wired to
the building power, the total combined leakage current should not exceed 5 percent of the total input
current required for the connected products.
•
For UPS products and PDUs that have detachable AC power cords, the total combined leakage
current should not exceed 3.5 mA per PDU or UPS.
Power distribution safety grounding (LAHJ)
The power distribution safety grounding system consists of connecting various points in the power
distribution system to earth ground using green (green/yellow) wire ground conductors. When tied to
metal chassis parts that might be touched, these ground connections protect computer room personnel
against shock hazard from current leakage and fault conditions.
Power distribution systems consist of several parts. Hewlett Packard Enterprise recommends that these
parts be solidly interconnected to provide an equipotential ground to all points.
Main building electrical ground
The main electrical service entrance equipment should have an earth ground connection, as required by
applicable codes. Connections such as a grounding rod, building steel, or a conductive type cold water
service pipe provide an earth ground.
Conduit bonding
Construct all electrical distribution systems of metallic conduit that is connected together securely or
bonded to panels and electrical boxes to provide a continuous grounding system.
Power panel ground
Each power panel should be grounded to the electrical service entrance with green (green/yellow) wire
ground conductors. The green (green/yellow) wire ground conductors should be sized per applicable
codes (based on circuit overcurrent device ratings).
NOTE: The green wire ground conductor can be a black wire with green tape (LAHJ).
Computer safety ground
Ground all computer equipment with the green (green/yellow) wire included in the branch circuitry. The
green (green/yellow) wire ground conductors should be connected to the appropriate power panel and
should be sized per applicable codes (based on circuit overcurrent device ratings).
Dual power source grounding
With dual power sources, both sources must have the same ground reference. Otherwise, an electrical
potential could exist that could be hazardous to personnel and might cause performance issues for the
equipment.
Because the dual power sources often originate from two different transformers or two different UPS
devices, use the same ground reference point to ground the secondary of each transformer or UPS
device. Measure the voltage potentials from ground pin to ground pin of these sources. Voltage levels that
are measured above 3.0 V might be hazardous to personnel or cause equipment performance issues and
must be corrected before placing the equipment in service.
Power requirements and considerations 26
Cabinet performance grounding (high frequency ground)
Some safety power distribution wires are too long and too inductive to provide adequate high-frequency
return paths. Signal interconnects between system cabinets might need high-frequency ground return
paths in addition to the safety or power distribution system 50-60Hz grounding system. Hewlett Packard
Enterprise recommends the use of a properly installed SRG, also bonded to the 50-60Hz grounding
system.
WARNING: Do not use a cabinet-to-floor ground strap in place of a properly installed safety
(50-60Hz) grounding system, nor in place of a properly installed SRG. An improperly installed
grounding system can present a shock hazard to personnel.
Power panels located in close proximity to the computer equipment should also be connected to the site
grounding grid.
Raised floor high-frequency noise grounding
IMPORTANT: Regardless of the grounding connection method used, the raised floor should
be grounded as an absolute safety minimum.
If a raised floor system is used, the floor must be designed as a signal ground grid that maintains an equal
potential over a broad band of frequencies. To accomplish this, observe the following guidelines:
•
Use a raised floor system where the stringers are bolted to the pedestals.
•
Select floor components that have a corrosion-resistant plating to provide low resistance connection
points to other components and to computer cabinets.
•
Connect a 2/0 copper conductor to every other pedestal around the perimeter and to the equipment
grounding system of the building.
•
Bond all metal pipes that enter or leave the raised floor area to the 2/0 perimeter ground.
•
Bond each row and column of the floor grid to the 2/0 perimeter ground.
•
Bond any I-beams that penetrate the raised floor to the pedestals.
•
Connect the opposite corners of equipment cabinets to the pedestals with #12 stranded wire.
•
Where the cabinets are bolted together in rows, bonding two corners at opposite ends of the row is
sufficient.
•
Use bonding straps that are 70 cm (24 in) or less in length.
If a bolted-stringer raised floor system is not used, the following alternate methods can provide acceptable
results:
•
Use a grounded #6 AWG minimum copper wire grid that is clamped mechanically to floor pedestals
and bonded properly to the building or site ground.
•
Add a grounding grid made of copper strips mounted to the subfloor. The strips should be 0.8 mm
(0.032 in) thick and a minimum of 76 mm (3.0 in) wide. Connect each pedestal to four strips using
6-mm (0.25-in) bolts tightened to the manufacturer’s torque recommendation.
Power requirements and considerations 27
Raised floor SRG bonding detail
Item
1
2
3
4
5
6
7
8
9
10
11
12
13
Description
#2/0 CU bond to nearest building steel or ground connection
Bond the computer equipment rack to SRG with #4 CU AWG,
maximum length 70 cm (24 in)
Computer equipment racks
All metallic conduits, pipes (water, fire suppression, steam, air,
drain, refrigerant, and so on) and those that penetrate vertically or
horizontally into the raised floor must be bonded to the SRG with a
#4 CU AWG, maximum length 70 cm (24 in).
All power panels, control and alarm panels must be bonded to the
SRG with a #4 CU AWC.
HVAC equipment
HVAC equipment must be bonded to the SRG with #4 CU AVG,
maximum length 70 cm (24 in).
#2/0 CU bond to nearest building ground connection
Bond every 1.22 m (4.00 ft) along the perimeter with a #2/0 bare
CU conductor.
Perimeter bonding point
Access floor pedestal (typical)
Power distribution units or power panels must be bonded to the
SRG with a #4 CU AWG maximum length 70 cm (24 in).
SRG (metal stringers of raised floor system)
Equipment grounding implementation details
Connect all Hewlett Packard Enterprise equipment cabinets to the site ground grid as follows:
1.
Attach one end of each ground strap to the applicable cabinet ground lug.
2.
Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point
(nonraised floor).
3.
Check that the braid contact on each end of the ground strap consists of a terminal and connection
hardware (a 6-mm [0.25-in] bolt, nuts, and washers).
4.
Check that the braid contact connection points are free of paint or other insulating material and
treated with a contact enhancement compound (similar to Burndy Penetrox).
Power requirements and considerations 28
System installation guidelines
In domestic installations, install the proper receptacles before the Hewlett Packard Enterprise equipment
arrives. For installation procedures, see the appropriate installation guide.
Wiring connections
Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical
connection depends on the restraining force applied. Connections that are too tight can compress or
deform the hardware and cause it to weaken. This deformation usually leads to high impedance,
preventing circuit breakers from tripping when needed or contributing to a buildup of high frequency noise.
CAUTION: Connections that are too loose or too tight can have a high impedance that
causes serious problems, such as erratic equipment operation. A high impedance connection
overheats and sometimes causes fire or high temperatures that can destroy hard-to-replace
components such as distribution panels or system bus bars.
Wiring connections must be properly torqued. Many equipment manufacturers specify the proper
connection torque values for their hardware.
Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration
is present, lock washers must be used on all connections to prevent connection hardware from working
loose.
Data communications cables
Power transformers create high-energy fields in the form of EMI. Heavy foot traffic can create ESD that
can damage electronic components. Route data communications cables away from these areas. To
reduce the effects of external fields, use shielded data communications cables that meet approved
industry standards.
Power configuration
The Moonshot 1500 Chassis can be powered from single-phase AC power sources. Power supply
options are available at the time of purchase through either the Build-to-Order or Configure-to-Order
processes.
Existing units can be converted from one power source to another when necessary. For more information
on converting an enclosure power source, see the Hewlett Packard Enterprise website
(http://www.hpe.com/info/hpepoweradvisor).
Power requirements and considerations 29
Single-phase AC configuration
The Moonshot 1500 Chassis has four power supplies, five fans, and a single APM interface located on the
Moonshot 1500 CM module.
Item
Description
1
2
3
4
5
6
7
8
9
10
11
Fan bay 1
Fan bay 2
Fan bay 3
Fan bay 4
Fan bay 5
APM port
Moonshot 1500 CM module
Power supply bay 4
Power supply bay 3
Power supply bay 2
Power supply bay 1
To cable the chassis using a single-phase AC configuration:
1.
Connect the AC power cables to the power supply connections on the rear of the chassis.
2.
Connect the AC power cables to the AC power source or to an installed PDU.
Power supply specifications
For the latest power supply specifications, see the Moonshot 1500 Chassis QuickSpecs in the Hewlett
Packard Enterprise website (http://www.hpe.com/info/Quickspecs-Moonshot-1500Chassis).
Power requirements and considerations 30
Hardware specifications and requirements
Chassis specifications
Specification
Value
Height
Depth
Width
Weight, fully loaded
18.96 cm (7.46 in)
84.91 cm (33.43 in)
44.33 cm (17.45 in)
81.65 kg (180.00 lb)
Weight, empty
43.09 kg (95.00 lb)
HPE Intelligent Rack Series rack specifications
For more information about product features, specifications, options, configurations, and compatibility,
see the product QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).
Rack
Heigh Width
t
Depth
Dynamic
load (gross)
Static load
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
HPE 642 1200mm Pallet Intelligent 42U
Rack
HPE 642 1200mm Shock Intelligent 42U
Rack
HPE 647 1200mm Pallet Intelligent 47U
Rack
597.80 mm
(23.54 in)
597.80 mm
(23.54 in)
597.80 mm
(23.54 in)
1300.20 mm
(51.19 in)
1300.20 mm
(51.19 in)
1300.20 mm
(51.19 in)
—
HPE 647 1200mm Shock Intelligent 47U
Rack
HPE 842 1200mm Pallet Intelligent 42U
Rack
HPE 842 1200mm Shock Intelligent 42U
Rack
597.80 mm
(23.54 in)
797.80 mm
(31.40 in)
797.80 mm
(31.40 in)
1300.20 mm
(51.19 in)
1300.10 mm
(51.19 in)
1300.10 mm
(51.19 in)
1,360.78 kg
(3,000.00 lb)
—
1,360.78 kg
(3,000.00 lb)
—
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
Rack requirements
The chassis is compatible with the following Intelligent Series Racks:
•
642 1200mm Pallet Intelligent Rack
•
642 1200mm Shock Intelligent Rack
•
647 1200mm Pallet Intelligent Rack
•
647 1200mm Shock Intelligent Rack
•
842 1200mm Pallet Intelligent Rack
•
842 1200mm Shock Intelligent Rack
•
Telco racks
If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and
to prevent damage to the equipment:
Hardware specifications and requirements 31
•
Front and rear doors: If the rack includes closing front and rear doors, a minimum of 65 percent open
area must be provided to ensure adequate airflow.
•
Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm
(3 in).
•
Rear door: The clearance between the rear of the enclosure and the rear rack door must be a
minimum of 177.80 mm (7.00 in) to accommodate system cabling.
•
Side: The clearance between the installed rack component and the side panels of the rack must be a
minimum of 70 mm (2.75 in).
•
Width: 483 mm (19 in)
•
Depth: Maximum clearance between front and rear RETMA rails is 876.00 mm (34.5 in). Minimum
clearance for square-hole and round-hole racks is 654.00 mm (25.75 in).
•
The rack must be able to accept the adjustable rack rails that are shipped with each chassis:
o
Minimum rail length: 654.00 mm (25.75 in)
o
Maximum rail length: 876.00 mm (34.50 in)
Rack-free environment requirements
The Moonshot 1500 Chassis (referred to as the chassis) can be used in a rack-free environment. The
following conditions must be met when performing a rack-free installation:
•
A fully-populated chassis can weigh up to 81.65 kg (180.00 lb). The object supporting the chassis
must be able to withstand this weight.
•
The chassis should be supported by a sturdy, flat surface.
WARNING: To reduce the risk of personal injury or damage to the equipment in a rack-free
environment:
• Never stack the chassis on top of another chassis.
• Never place equipment on top of the chassis.
• Never place the chassis on a surface that cannot support up to 81.65 kg (180.00 lb).
Hardware specifications and requirements 32
Configuration scenarios
Example configurations
Configuration examples can be calculated using the HPE Power Advisor Tool
(http://www.hpe.com/info/hpepoweradvisor). This tool is designed for facilities planning purposes only.
Values obtained from the tool are based on worst case loads. Whenever possible, Hewlett Packard
Enterprise recommends using actual measurements in configuration planning. Measurements must be
made with the intended configuration, application loading, and ambient environment.
Actual power usage will vary, depending on application loading, ambient temperature, and other factors.
Estimating power and cooling
Power consumed by the Moonshot System is converted to heat, which is expressed in Btu/h. You can
calculate the heat load for a system by using the following equation: Heat Load = Power (W) x 3.413
BTU/h.
In the preceding equation, 1 W equals 3.413 BTU/h. The installation of the Moonshot System into a
computer room containing existing systems might have a significant impact on cooling requirements.
Hewlett Packard Enterprise Data Center Services provides consultation to assist you in developing an
efficient high-density cooling strategy by using dynamic modeling.
For more information, contact your Hewlett Packard Enterprise sales representative.
A complete discussion of cooling requirements is beyond the scope of this guide. For more information,
see the Technology Brief TC050901TB, Optimizing facility operation in high density data center
environments, 2nd edition, available on the Hewlett Packard Enterprise website
(http://www.hpe.com/portal/site/hpesc).
The budget allowed for cartridges should include at least 1.8kW of actual power usage per chassis at
maximum configuration. When planning upgrades to older data centers to add the Moonshot System,
plan to upgrade the electrical and mechanical infrastructure to properly support the added electrical and
cooling requirements. New data center planning for the Moonshot 1500 Chassis must specify a minimum
of 355 W/sf or 17 kW/cabinet power densities.
To estimate computer room cooling requirements, first calculate the amount of energy used by the
solution. Hewlett Packard Enterprise provides online power-consumption calculators that enable you to
configure a virtual rack and determine its power consumption. For more information, see the Hewlett
Packard Enterprise website (http://www.hpe.com/info/hpepoweradvisor).
For other models, obtain the power consumption data from the component specifications.
The QuickSpecs contain the specifications for all Hewlett Packard Enterprise products. For more
information, see the Hewlett Packard Enterprise website (http://www.hpe.com/info/qs).
Use a worksheet similar to the following to calculate power consumption and heat load.
Component
Quantity
Watts
BTUs
Total
Moonshot 1500 Chassis (configured)
Other rack options
Option A
Option B
Configuration scenarios
33
Component
Quantity
Watts
BTUs
Total
Total power
Estimating total weight
You might need to determine the total weight of custom configurations if any of the following
considerations apply:
•
Variations in flooring support when moving the solution during installation
•
Trucking equipment limits
•
Raised floor installation (calculating load limits and reinforcement)
•
Secondary or tertiary floor installation
Determine the weight and floor load requirements for the purpose of site planning:
•
Capacity planning: Assume that the rack will eventually be laden to its 907.18 kg (2,000 lb) capacity.
•
To obtain an approximation for planning, you can use the worksheet supplied in the following table
for each rack in the configuration.
You must add the weight of any components that are not included in the list of rack options, for example,
additional drives in the cartridge. To obtain the weight of any individual component, see the product
QuickSpecs on the Hewlett Packard Enterprise website (http://www.hpe.com/info/productbulletin).
Component
Quantity
Weight (kg)
Weight (lb)
Total
Rack
Moonshot 1500 Chassis weight
including all components
Other rack options and requirements
Option A
Option B
Option C
Total weight
Configuration scenarios
34
Preparing for installation
Warnings and cautions
WARNING: To reduce the risk of personal injury or damage to equipment, heed all warnings
and cautions throughout the installation instructions.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The rack is bolted to the floor using the concrete anchor kit.
• The leveling feet extend to the floor.
• The full weight of the rack rests on the leveling feet.
• The racks are coupled together in multiple rack installations.
• Only one component is extended at a time. If more than one component is extended, a rack
might become unstable.
WARNING: The chassis is very heavy. To reduce the risk of personal injury or damage to the
equipment:
• Observe local occupational health and safety requirements and guidelines for manual
material handling.
• Remove all installed components from the chassis before installing or moving the chassis.
• Use caution and get help to lift and stabilize the chassis during installation or removal,
especially when the chassis is not fastened to the rack.
WARNING: To reduce the risk of personal injury or damage to the equipment, you must
adequately support the chassis during installation and removal.
WARNING: Always use at least two people to lift the chassis into the rack. If the chassis is
being loaded into the rack above chest level, a third person must assist with aligning the
chassis with the rails while the other two people support the weight of the chassis.
WARNING: Be sure to install chassis starting from the bottom of the rack and work your way
up the rack.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
internal system components to cool before touching them.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Never reach inside the chassis while the system is powered up.
• Perform service on system components only as instructed in the user documentation.
CAUTION: Always be sure that equipment is properly grounded and that you follow proper
grounding procedures before beginning any installation procedure. Improper grounding can
result in ESD damage to electronic components. For more information, refer to "Electrostatic
discharge ("Electrostatic discharge prevention" on page 7)."
CAUTION: When performing non-hot-plug operations, you must power down the chassis
and/or the system. However, it may be necessary to leave the chassis powered up when
performing other operations, such as hot-plug installations or troubleshooting.
Preparing for installation
35
Additional rack considerations
Consider the following additional specifications and components with regard to your specific rack
configuration:
•
Power—If a UPS is installed, do not exceed its output rating. Be sure to review the installation
instructions provided with each component for important cautions and warnings.
•
PDUs—Install PDUs before installing other components.
•
Height—The height of the rack and of rack-mountable components is measured in U increments,
where U = 4.5 cm (1.75 in). When you are configuring your rack installation, remember that the total
U measurement of the components you want to install cannot exceed the stated U height of the rack.
•
Keyboard—The rack keyboard requires installation of a 1U keyboard drawer rack option kit.
•
Monitor—The monitor requires installation of a monitor/utility shelf rack option kit unless you are
using a rack-mountable flat-panel monitor.
•
Console switch—If a console switch is configured, use the CPU-to-console switch cable included
with the product. The standard distance between the console switch and the keyboard, monitor, and
mouse can vary by the following lengths:
o
0.91 m (3.00 ft)
o
2.13 m (7.00 ft)
o
3.65 m (12.00 ft)
o
6.09 m (20.00 ft)
o
12.19 m (40.00 ft)
NOTE: National electrical regulations governing the installation of building wiring require that
an appropriate cable, meeting fire-safety standards, must be used any time cabling is routed:
• Through an overhead drop-ceiling
• Under raised flooring
• From room to room
• From floor to floor
Be sure that the cable jacket or sleeving is made of material that does not burn easily and does
not exude toxic fumes when exposed to heat. Be sure that the cable you have selected is
appropriate for your installation site. If you require a U.S. plenum-rated (CL2P) cable, contact
your local Hewlett Packard Enterprise authorized reseller to obtain any of the following options:
• 149363-B21-20-foot plenum cable
• 149364-B21-40-foot plenum cable
•
Rack baying option kits—The number of baying kits needed to join a series of racks is one less than
the number of racks in the suite. Each baying kit supplies parts to bay two cabinets on 600 mm (24
in) center line spacing.
•
Side panels—Only one set of side panels is required for each row of bayed racks.
•
Stabilizer kit—A stabilizer kit is either required or recommended, depending on your rack
configuration.
For more information about supported rack option kits, see the Intelligent Rack Family Options Installation
Guide on the Hewlett Packard Enterprise website (http://www.hpe.com/info/rackandpower).
General component placement guidelines
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately
stabilize the rack before extending a component outside the rack. Extend only one component
at a time. A rack may become unstable if more than one component is extended.
Preparing for installation
36
WARNING: To reduce the risk of personal injury or damage to the equipment, always load
the heaviest item first from the bottom of the rack up. This makes the rack bottom-heavy and
helps prevent the rack from becoming unstable.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling feet are extended to the floor.
• The full weight of the rack rests on the leveling feet.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the chassis or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA
IMPORTANT: Hewlett Packard Enterprise strongly recommends that you configure the rack
using the eCo-Enterprise Configurator, which provides factory default racking. The latest
version of this software is available on the Hewlett Packard Enterprise website
(http://www.hpe.com/support/hpesc).
When loading your components, observe the general guidelines:
•
For detailed instructions on installing specific component or third-party hardware, see the user
documentation that shipped with that component.
•
Before installing components into the rack, see "Electrostatic discharge prevention (on page 7)."
•
Use the configuration prepared by the eCo Enterprise Configurator as a guideline for installation
components.
•
Load the heavier components first from the bottom of the rack.
•
Be sure to balance the weight load among bayed racks. For example, if you have several UPS units
and several chassis, do not load all of the UPS units into one rack. Instead, distribute them evenly in
the bottom positions of each rack.
•
Allow a minimum clearance of 76 cm (30 in) between the wall and the rear of the rack to provide
adequate access for installation and service.
Rack configuration software
To help you plan your rack configuration more efficiently, Hewlett Packard Enterprise provides
eCo-Enterprise Configurator, a powerful web-based service that enables you to build, store, and export
end-to-end rack configurations. Hewlett Packard Enterprise strongly recommends that you configure the
rack using the eCo-Enterprise Configurator, which provides factory default racking. The latest version of
the software is available on the Hewlett Packard Enterprise website (http://www.hpe.com/support/hpesc).
Sample installation schedule
The following schedule lists the sequence of events for a typical system installation. For situations that
prevent following this type of schedule, consider using a milestone schedule.
•
60 days before installation
o
Floor plan design completed and sent to Hewlett Packard Enterprise (if required to be Hewlett
Packard Enterprise task)
Preparing for installation
37
•
•
30 days before installation
o
Primary power and air conditioning installation completed
o
Telephone and data cables installed
o
Fire protection equipment installed
o
Major facility changes completed
o
Special delivery requirements defined
o
Site inspection survey completed
o
Delivery survey completed
o
A signed copy of the site inspection and delivery survey sent to Hewlett Packard Enterprise
o
Site inspection and predelivery coordination meeting arranged with an Hewlett Packard
Enterprise representative to review the inspection checklist and arrange an installation schedule
7 days before installation
o
Final check made with Hewlett Packard Enterprise site preparation specialist to resolve any last
minute problems
Sample checklists
Customer and Hewlett Packard Enterprise information checklist:
Customer information
Name:
Street address:
State or province:
Zip or postal code:
Primary customer contact:
Secondary customer contact:
Traffic coordinator:
Hewlett Packard Enterprise information
Sales representative:
Survey representative:
Order number:
Phone:
City or town:
Country:
Phone:
Phone:
Phone:
Phone:
Date:
Scheduled delivery date:
Sample site inspection checklist:
Yes
No.
No
Comment or date
Computer room
1.
Is there a completed floor plan?
2.
3.
Is there adequate space for maintenance needs? Minimum
recommended clearances, front and rear: 914 mm (36 in).
Is access to the site or computer room restricted?
4.
Is the computer room structurally complete?
5.
Is a raised floor installed and in good condition?
6.
Is the raised floor adequate for equipment loading?
7.
Are there channels or cutouts for cable routing?
8.
Is there a remote console telephone line available with an
RJ-11 jack?
Preparing for installation
38
9.
Is a telephone line available?
10.
Are customer supplied peripheral cables and LAN cables
available and of the proper type?
Are floor tiles in good condition and properly braced?
11.
12.
Is the floor tile underside shiny or painted? If painted,
determine the need for particulate test.
Power and lighting
13.
Are lighting levels adequate for maintenance?
14.
18.
Are AC outlets available for servicing needs? (for example,
vacuuming)
Does the input voltage correspond to equipment
specifications?
Is a dual power source used? If so, identify type and
evaluate grounding.
Does the input frequency correspond to equipment
specifications?
Are lighting arrestors installed inside the building?
19.
Is power conditioning equipment installed?
20.
Is there a dedicated branch circuit for equipment?
21.
Is the dedicated branch circuit less than 72 m (250 ft)?
22.
Are the input circuit breakers adequate for equipment
loads?
Safety
23.
Is there an emergency power shut-off switch?
24.
Is a telephone available for emergency purposes?
25.
Is a fire protection system installed in the computer room?
26.
Is antistatic flooring installed?
27.
Do any equipment servicing hazards exist (loose ground
wires, poor lighting, or others)?
Cooling
28.
Can cooling be maintained between 20ºC and 55ºC (up to
5000 ft)? Derate 1º C/1000 ft above 5000 ft and up to 10,000
ft.
Can temperature changes be held to 10ºC/h with tape
media? Can temperature changes be held to 20ºC/h without
tape media?
Can humidity levels be maintained at 40% to 60% at 35ºC
noncondensing?
Are air conditioning filters installed and clean?
15.
16.
17.
29.
30.
31.
Storage
32.
Are cabinets available for tape and disc media?
33.
Is shelving available for documentation?
Training
34.
35.
Are personnel enrolled in the System Administrator's
Course?
Is on-site training required?
Preparing for installation
39
Delivery survey
Special instructions or recommendations should be entered on the special instructions or
recommendations form. The following list gives examples of special instructions or issues:
•
Packaging restrictions at the facility, such as size and weight limitations
•
Special delivery procedures
•
Special equipment required for installation, such as tracking or hoists
•
What time the facility is available for installation (after the equipment is unloaded)
•
Special security requirements applicable to the facility, such as security clearance
Dock delivery
Yes or No
Is the dock large enough for a semitrailer?
North, south, east, or west
Location of the dock:
Street name if different than company
address:
Street delivery
North, south, east, or west
Location of the access door:
Street name if different than company
address:
Height of access door:
Width of access door:
Special permits (list type and agency obtained
from):
Elevator
Capacity (kg or lb):
Depth:
Height:
Width:
Stairs
Number of flights:
Width:
Preparing for installation
40
Conversion factors and formulas
Conversion factors
The conversion factors provided here are intended to help in data calculation for systems that do not
conform to the specific configurations listed in this guide. Listed below are the conversion factors used in
this document, as well as additional conversion factors that can be helpful in determining those factors
required for site planning.
•
•
Refrigeration
o
1 watt = 0.86 kcal/h
o
1 watt = 3.412 BTU/h
o
1 watt = 2.843 x 10-4 tons
o
1 ton = 200 BTU/min
o
1 ton = 12,000 BTU/h
o
1 ton = 3517.2 W
Equivalents
o
1 centimeter = 0.3937 in
o
1 meter = 3.28 ft
o
1 meter = 1.09 yards
o
1 inch = 2.54 cm
o
1 foot = 0.305 m
o
1 CFM = 1.7 m3/h
Formulas
The following formulas can be helpful in determining conversion factors required for site planning:
•
kVA = voltage x Current (amps)
•
Watts = VA x PF
•
BTU = Watts x 3.41
Conversion factors and formulas
41
Support and other resources
Accessing Hewlett Packard Enterprise Support
•
For live assistance, go to the Contact Hewlett Packard Enterprise Worldwide website
(http://www.hpe.com/assistance).
•
To access documentation and support services, go to the Hewlett Packard Enterprise Support
Center website (http://www.hpe.com/support/hpesc).
Information to collect
Be sure to have the following information available before you call Hewlett Packard Enterprise:
•
Technical support registration number (if applicable)
•
Product name
•
Chassis serial number
•
Product identification number
•
Applicable error messages
•
Operating system type and revision level
To obtain product information, log in to iLO CM firmware and use the Show Chassis Info command.
For more information, see the HPE Moonshot iLO Chassis Management CLI User Guide in the HPE
Moonshot Information Library (http://www.hpe.com/info/moonshot/docs).
Accessing updates
•
Some software products provide a mechanism for accessing software updates through the product
interface. Review your product documentation to identify the recommended software update
method.
•
To download product updates, go to either of the following:
•
o
Hewlett Packard Enterprise Support Center Get connected with updates page
(http://www.hpe.com/support/e-updates)
o
Software Depot website (http://www.hpe.com/support/softwaredepot)
To view and update your entitlements, and to link your contracts and warranties with your profile, go
to the Hewlett Packard Enterprise Support Center More Information on Access to Support
Materials page (http://www.hpe.com/support/AccessToSupportMaterials).
IMPORTANT: Access to some updates might require product entitlement when accessed
through the Hewlett Packard Enterprise Support Center. You must have an HP Passport set up
with relevant entitlements.
Websites
•
Hewlett Packard Enterprise Information Library (http://www.hpe.com/info/enterprise/docs)
•
Hewlett Packard Enterprise Support Center (http://www.hpe.com/support/hpesc)
Support and other resources 42
•
Contact Hewlett Packard Enterprise Worldwide (http://www.hpe.com/assistance)
•
Subscription Service/Support Alerts (http://www.hpe.com/support/e-updates)
•
Software Depot (http://www.hpe.com/support/softwaredepot)
•
Customer Self Repair (http://www.hpe.com/support/selfrepair)
•
Insight Remote Support (http://www.hpe.com/info/insightremotesupport/docs)
•
Serviceguard Solutions for HP-UX (http://www.hpe.com/info/hpux-serviceguard-docs)
•
Single Point of Connectivity Knowledge (SPOCK) Storage compatibility matrix
(http://www.hpe.com/storage/spock)
•
Storage white papers and analyst reports (http://www.hpe.com/storage/whitepapers)
Customer Self Repair
Hewlett Packard Enterprise products are designed with many Customer Self Repair (CSR) parts to
minimize repair time and allow for greater flexibility in performing defective parts replacement. If during
the diagnosis period Hewlett Packard Enterprise (or Hewlett Packard Enterprise service providers or
service partners) identifies that the repair can be accomplished by the use of a CSR part, Hewlett Packard
Enterprise will ship that part directly to you for replacement. There are two categories of CSR parts:
•
Mandatory—Parts for which customer self repair is mandatory. If you request Hewlett Packard
Enterprise to replace these parts, you will be charged for the travel and labor costs of this service.
•
Optional—Parts for which customer self repair is optional. These parts are also designed for
customer self repair. If, however, you require that Hewlett Packard Enterprise replace them for you,
there may or may not be additional charges, depending on the type of warranty service designated
for your product.
NOTE: Some Hewlett Packard Enterprise parts are not designed for customer self repair. In order to
satisfy the customer warranty, Hewlett Packard Enterprise requires that an authorized service provider
replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.
Based on availability and where geography permits, CSR parts will be shipped for next business day
delivery. Same day or four-hour delivery may be offered at an additional charge where geography
permits. If assistance is required, you can call the Hewlett Packard Enterprise Support Center and a
technician will help you over the telephone. Hewlett Packard Enterprise specifies in the materials shipped
with a replacement CSR part whether a defective part must be returned to Hewlett Packard Enterprise. In
cases where it is required to return the defective part to Hewlett Packard Enterprise, you must ship the
defective part back to Hewlett Packard Enterprise within a defined period of time, normally five (5)
business days. The defective part must be returned with the associated documentation in the provided
shipping material. Failure to return the defective part may result in Hewlett Packard Enterprise billing you
for the replacement. With a customer self repair, Hewlett Packard Enterprise will pay all shipping and part
return costs and determine the courier/carrier to be used.
For more information about the Hewlett Packard Enterprise CSR program, contact your local service
provider. For the North American program, go to the Hewlett Packard Enterprise CSR website
(http://www.hpe.com/support/selfrepair).
Réparation par le client (CSR)
Les produits Hewlett Packard Enterprise comportent de nombreuses pièces CSR (Customer Self Repair
= réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces
défectueuses. Si pendant la période de diagnostic, Hewlett Packard Enterprise (ou ses partenaires ou
mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, Hewlett
Packard Enterprise vous l'envoie directement. Il existe deux catégories de pièces CSR :
Support and other resources 43
•
Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à
Hewlett Packard Enterprise de remplacer ces pièces, les coûts de déplacement et main d'œuvre du
service vous seront facturés.
•
Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont
également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous
demandez à Hewlett Packard Enterprise de remplacer ces pièces, l'intervention peut ou non vous
être facturée, selon le type de garantie applicable à votre produit.
REMARQUE: Certaines pièces Hewlett Packard Enterprise ne sont pas conçues pour permettre au
client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, Hewlett Packard
Enterprise exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont
identifiées par la mention "Non" dans le Catalogue illustré.
Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre
situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le
jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour toute assistance, appelez le Centre
d’assistance Hewlett Packard Enterprise pour qu’un technicien vous aide au téléphone. Dans les
documents envoyés avec la pièce de rechange CSR, Hewlett Packard Enterprise précise s'il est
nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué,
généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans
l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, Hewlett Packard Enterprise se réserve
le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, Hewlett Packard
Enterprise supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou
le transporteur à utiliser.
Pour plus d'informations sur le programme CSR de Hewlett Packard Enterprise, contactez votre
Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le
site Web Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair).
Riparazione da parte del cliente
Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti
difettose, i prodotti Hewlett Packard Enterprise sono realizzati con numerosi componenti che possono
essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica Hewlett
Packard Enterprise (o un centro di servizi o di assistenza Hewlett Packard Enterprise) identifica il guasto
come riparabile mediante un ricambio CSR, Hewlett Packard Enterprise lo spedirà direttamente al cliente
per la sostituzione. Vi sono due categorie di parti CSR:
•
Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida
la riparazione ad Hewlett Packard Enterprise, deve sostenere le spese di spedizione e di
manodopera per il servizio.
•
Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di
componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad Hewlett
Packard Enterprise, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia
previsto per il prodotto.
NOTA: alcuni componenti Hewlett Packard Enterprise non sono progettati per la riparazione da parte
del cliente. Per rispettare la garanzia, Hewlett Packard Enterprise richiede che queste parti siano
sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo
illustrato dei componenti.
In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il
giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un
supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di
un addetto del centro di supporto tecnico Hewlett Packard Enterprise. Nel materiale fornito con una parte
di ricambio CSR, Hewlett Packard Enterprise specifica se il cliente deve restituire dei component. Qualora
sia richiesta la resa ad Hewlett Packard Enterprise del componente difettoso, lo si deve spedire ad
Hewlett Packard Enterprise entro un determinato periodo di tempo, generalmente cinque (5) giorni
lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di
Support and other resources 44
spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio
da parte di Hewlett Packard Enterprise. Nel caso di riparazione da parte del cliente, Hewlett Packard
Enterprise sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.
Per ulteriori informazioni sul programma CSR di Hewlett Packard Enterprise, contattare il centro di
assistenza di zona. Per il programma in Nord America fare riferimento al sito Web
(http://www.hpe.com/support/selfrepair).
Customer Self Repair
Hewlett Packard Enterprise Produkte enthalten viele CSR-Teile (Customer Self Repair), um
Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen.
Wenn Hewlett Packard Enterprise (oder ein Hewlett Packard Enterprise Servicepartner) bei der Diagnose
feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen Hewlett
Packard Enterprise dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien
unterteilt:
•
Zwingend—Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie
den Austausch dieser Teile von Hewlett Packard Enterprise vornehmen lassen, werden Ihnen die
Anfahrt- und Arbeitskosten für diesen Service berechnet.
•
Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für
Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von Hewlett Packard
Enterprise vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt
vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.
HINWEIS: Einige Hewlett Packard Enterprise Teile sind nicht für Customer Self Repair ausgelegt. Um
den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem Hewlett Packard Enterprise
Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“
gekennzeichnet.
CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag
geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden
gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das Hewlett Packard Enterprise
Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien von
Hewlett Packard Enterprise, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob
das defekte Teil an Hewlett Packard Enterprise zurückgeschickt werden muss. Wenn es erforderlich ist,
das defekte Teil an Hewlett Packard Enterprise zurückzuschicken, müssen Sie dies innerhalb eines
vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss
mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang
enthalten ist. Wenn Sie das defekte Teil nicht zurückschicken, kann Hewlett Packard Enterprise Ihnen
das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt Hewlett Packard Enterprise
für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.
Weitere Informationen über das Hewlett Packard Enterprise Customer Self Repair Programm erhalten
Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie
auf der Hewlett Packard Enterprise Website unter (http://www.hpe.com/support/selfrepair).
Reparaciones del propio cliente
Los productos de Hewlett Packard Enterprise incluyen muchos componentes que el propio usuario puede
reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor
flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de
diagnóstico, Hewlett Packard Enterprise (o los proveedores o socios de servicio de Hewlett Packard
Enterprise) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR,
Hewlett Packard Enterprise le enviará dicho componente directamente para que realice su sustitución.
Los componentes CSR se clasifican en dos categorías:
Support and other resources 45
•
Obligatorio—componentes cuya reparación por parte del usuario es obligatoria. Si solicita a
Hewlett Packard Enterprise que realice la sustitución de estos componentes, tendrá que hacerse
cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.
•
Opcional—componentes cuya reparación por parte del usuario es opcional. Estos componentes
también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa
que Hewlett Packard Enterprise realice su sustitución, puede o no conllevar costes adicionales,
dependiendo del tipo de servicio de garantía correspondiente al producto.
NOTA: Algunos componentes de Hewlett Packard Enterprise no están diseñados para que puedan ser
reparados por el usuario. Para que el usuario haga valer su garantía, Hewlett Packard Enterprise pone
como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes.
Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.
Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a
su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en
el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al
Centro de asistencia técnica de Hewlett Packard Enterprise y recibirá ayuda telefónica por parte de un
técnico. Con el envío de materiales para la sustitución de componentes CSR, Hewlett Packard Enterprise
especificará si los componentes defectuosos deberán devolverse a Hewlett Packard Enterprise. En
aquellos casos en los que sea necesario devolver algún componente a Hewlett Packard Enterprise,
deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los
componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje
de envío. Si no enviara el componente defectuoso requerido, Hewlett Packard Enterprise podrá cobrarle
por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, Hewlett Packard
Enterprise se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la
empresa de transporte que se utilice para dicho servicio.
Para obtener más información acerca del programa de Reparaciones del propio cliente de Hewlett
Packard Enterprise, póngase en contacto con su proveedor de servicios local. Si está interesado en el
programa para Norteamérica, visite la página web de Hewlett Packard Enterprise CSR
(http://www.hpe.com/support/selfrepair).
Customer Self Repair
Veel onderdelen in Hewlett Packard Enterprise producten zijn door de klant zelf te repareren, waardoor
de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte
onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als
Hewlett Packard Enterprise (of een Hewlett Packard Enterprise Service Partner) bij de diagnose vaststelt
dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt Hewlett Packard Enterprise
dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee
categorieën CSR-onderdelen:
•
Verplicht—Onderdelen waarvoor reparatie door de klant verplicht is. Als u Hewlett Packard
Enterprise verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en
arbeidsloon in rekening gebracht.
•
Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn
ontworpen voor reparatie door de klant. Als u echter Hewlett Packard Enterprise verzoekt deze
onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht,
afhankelijk van het type garantieservice voor het product.
OPMERKING: Sommige Hewlett Packard Enterprise onderdelen zijn niet ontwikkeld voor reparatie door
de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service
Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus
aangemerkt met "Nee".
Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de
eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden
aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie is gewenst, belt u het Hewlett
Packard Enterprise Support Center om via de telefoon ondersteuning van een technicus te ontvangen.
Support and other resources 46
Hewlett Packard Enterprise vermeldt in de documentatie bij het vervangende CSR-onderdeel of het
defecte onderdeel aan Hewlett Packard Enterprise moet worden geretourneerd. Als het defecte
onderdeel aan Hewlett Packard Enterprise moet worden teruggezonden, moet u het defecte onderdeel
binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan Hewlett Packard Enterprise.
Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het
meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan Hewlett Packard
Enterprise u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant
betaalt Hewlett Packard Enterprise alle verzendkosten voor het vervangende en geretourneerde
onderdeel en kiest Hewlett Packard Enterprise zelf welke koerier/transportonderneming hiervoor wordt
gebruikt.
Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair
programma van Hewlett Packard Enterprise. Informatie over Service Partners vindt u op de Hewlett
Packard Enterprise website (http://www.hpe.com/support/selfrepair).
Reparo feito pelo cliente
Os produtos da Hewlett Packard Enterprise são projetados com muitas peças para reparo feito pelo
cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de
peças com defeito. Se, durante o período de diagnóstico, a Hewlett Packard Enterprise (ou
fornecedores/parceiros da Hewlett Packard Enterprise) concluir que o reparo pode ser efetuado pelo uso
de uma peça CSR, a Hewlett Packard Enterprise enviará a peça diretamente ao cliente. Há duas
categorias de peças CSR:
•
Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a Hewlett Packard
Enterprise substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do
serviço.
•
Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas
para o reparo feito pelo cliente. No entanto, se desejar que a Hewlett Packard Enterprise as
substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de
garantia destinado ao produto.
OBSERVAÇÃO: Algumas peças da Hewlett Packard Enterprise não são projetadas para o reparo feito
pelo cliente. A fim de cumprir a garantia do cliente, a Hewlett Packard Enterprise exige que um técnico
autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de
peças ilustrado.
Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o
pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode
ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte
técnico da Hewlett Packard Enterprise para que um técnico o ajude por telefone. A Hewlett Packard
Enterprise especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve
ser devolvida à Hewlett Packard Enterprise. Nos casos em que isso for necessário, é preciso enviar a
peça com defeito à Hewlett Packard Enterprise, você deverá enviar a peça com defeito de volta para a
Hewlett Packard Enterprise dentro do período de tempo definido, normalmente em 5 (cinco) dias úteis. A
peça com defeito deve ser enviada com a documentação correspondente no material de transporte
fornecido. Caso não o faça, a Hewlett Packard Enterprise poderá cobrar a reposição. Para as peças de
reparo feito pelo cliente, a Hewlett Packard Enterprise paga todas as despesas de transporte e de
devolução da peça e determina a transportadora/serviço postal a ser utilizado.
Para obter mais informações sobre o programa de reparo feito pelo cliente da Hewlett Packard
Enterprise, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite
o site da Hewlett Packard Enterprise (http://www.hpe.com/support/selfrepair).
Support and other resources 47
Support and other resources 48
Support and other resources 49
Support and other resources 50
Remote support
Remote support is available with supported devices as part of your warranty or contractual support
agreement. It provides intelligent event diagnosis, and automatic, secure submission of hardware event
notifications to Hewlett Packard Enterprise, which will initiate a fast and accurate resolution based on your
product’s service level. Hewlett Packard Enterprise strongly recommends that you register your device for
remote support.
For more information and device support details, go to the Insight Remote Support website
(http://www.hpe.com/info/insightremotesupport/docs).
Support and other resources 51
Acronyms and abbreviations
ASHRAE
American Society of Heating, Refrigerating and Air-Conditioning Engineers
AWG
American wire gauge
BTU
British Thermal Units
CM
chassis manager
EMI
electromagnetic interference
EMT
electrical metallic tubing
ESD
electrostatic discharge
HPE APM
HPE Advanced Power Manager
ISO
International Organization for Standardization
kVA
kilovolt-ampere
LAHJ
local authority has jurisdiction
PDU
power distribution unit
PF
power factor
Acronyms and abbreviations 52
RETMA
Radio Electronics Television Manufacturers Association (rack spacing)
RMS
root-mean-square
SRG
signal reference grid
TMRA
recommended ambient operating temperature
UPS
uninterruptible power system
Acronyms and abbreviations 53
Documentation feedback
Hewlett Packard Enterprise is committed to providing documentation that meets your needs. To help us
improve the documentation, send any errors, suggestions, or comments to Documentation Feedback
(mailto:docsfeedback@hpe.com). When submitting your feedback, include the document title, part
number, edition, and publication date located on the front cover of the document. For online help content,
include the product name, product version, help edition, and publication date located on the legal notices
page.
Documentation feedback 54
Index
A
about this guide 5
acoustic noise specification 8
additional rack considerations 36
airflow requirements 9
authorized reseller 42
B
environmental requirements 6, 15
equipment clearance 14
equipment grounding details 28
estimating power and cooling 33
estimating total weight 34
examples 33
F
before you contact Hewlett Packard Enterprise 42
blanking panels 9
building distribution 25
factors affecting power quality 23
floor loading 14
floor plan grid 15
formulas 41
front door clearance 16
C
G
cabinet performance grounding 27
cables 29
cautions 35
chassis environmental specifications 15
chassis specifications 15, 31
circuit breaker sizing 22
computer safety ground 26
conduit bonding 26
configuration scenarios 33
contact information 42
contacting Hewlett Packard Enterprise 42
conversion factors 41
G3 Optimization Kit 10
grounding requirements 25
grounding systems 25
guidelines 36
D
data communication cables 29
delivery considerations 10, 40
delivery survey 40
deployment methods 18
distribution hardware 24
documentation 5, 53
documentation feedback 53
downloading files 42
dual power source grounding 26
dust and pollution control 6
E
earth leakage current 25
electrical conduits 25
electrical factors 21
electrical load requirements 22
electrical requirements 21, 22
electrostatic discharge 7
enclosure specifications 31
environmental elements 6
H
hardware specifications and requirements 31
Hewlett Packard Enterprise Technical Support 42
Hewlett Packard Enterprise, contacting 42
high frequency grounding 27
HPE Power Advisor 21
HPE Rack Tie-Down Option Kit 20
humidity 6
I
information library 5
installation guidelines 29, 36
installation schedule 37
installation, rack-free 32
introduction 5
L
line voltage 24
M
main building electrcial ground 26
metallic particular contamination 7
N
non-redundant power 24
Index 55
O
W
operating environment, recommended 8
operational space requirements 10, 11
warnings 14, 27, 32, 35
wire selection 25
wiring connections 29
P
PDU (power distribution unit) 12
PDU installation 12
pollution 6
power calculator 21, 23
power configurations 29
power considerations 23
power consumption 21, 23
power distribution safety grounding 26
power panel ground 26
power quality 23
power redundancy 24
power requirements 21
power supply specifications 30
power system protection 23
R
raceway systems 25
rack configuration software 37
rack footprints 16
rack installation 18
rack options 32
rack placement, additional considerations 18, 19
rack requirements 31
rack tie-down option kit 20
rack-free environment requirements 32
rack-free installation 32
raised floor grounding 27
recommneded operating environment 8
related documents 5
requirements, airflow 9
requirements, rack-free environment 32
resources 42
S
safety considerations 35
single-phase AC configuration 30
site planning considerations 38
space requirements 10
space requirements, delivery 10
space requirements, operational 10, 11
specifications 15, 31
support 42
support and other resources 42
T
technical support 42
telephone numbers 42
third-party racks 19
Index 56