Name:
Affiliation:
Date:
Confidential
/ Slide 1
<file name>
<version 00>
<author>
Problem Statement when the system generates an error
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Please copy the error log.
Description of what you were doing, when the error
occurred.
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What is the jobfile name if you were running a batch.
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Has this job worked in the past?
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Were there any modifications to the job recently?
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Is the problem repeatable or intermittent?
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What films are on the wafer and process steps prior to
failing on the stepper?
Confidential
/ Slide 2
Problem Statement for issues in the printed results
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Was the issue Imaging (SEM results) or Overlay related?
Was the issue in all die or just in one location on the wafer?
Is the problem repeatable or intermittent?
What type of substrate?
What is the Thickness of wafer?
Did you check wafers for flatness?
What resist process is used?
3612
Spr-955-.7
Have you checked back of wafers for cleanliness, residue, particles?
How many layers of lithography?
What kind of film?
What kind of pm marks?
What etch process and system did you use?
Confidential
/ Slide 3
Testing Completed and Data Collected
Testing Completed
Data
attached
Confidential
/ Slide 4
File name
Conclusions (From data available)
Confidential
/ Slide 5