Lasers for Use in
Medical Device Manufacturing and
Microelectronics Device Manufacturing
Mark Keirstead
Market Development Manager
Coherent, Inc – Santa Clara Headquarters
Coherent - The Photonics Company
Provider off Photonics Solutions
S
 Primarily Lasers for
f Commercial
C
and Scientific Research Applications
•
Founded in 1966
•
HQ in Santa Clara, CA. Factories and Service Centers worldwide
•
Public Company: Nasdaq: COHR
•
~ $800M / year revenue
•
~ 2,500 employees worldwide
•
Sales 23% U.S. and 77% International
•
Approximately 429 Patents, 156 Pending
____________________
Note: Photonics is the Merger of Lasers, Optics and Electronics
Source: Company management as of 10/1/11
Superior Reliability & Performance
Jan 17th, 2013
P. 2
Coherent ~ Full Spectrum of Laser Technologies
Direct Diode
CO2
DPSS & OPSL Solid State
(nm)
200
300
800
900
1000
THz
10m
Diode-pumped Solid State
Excimer
CO2
Superior Reliability & Performance
Jan
April17th,
24, 2012
2013
P. 3
Extensive Pulse Width & Peak Power Portfolio
Peak Power kW
Pulsed ~500 femtosec(100kHz–600kHz) :
C ld Abl
Cold
Ablative
ti process:- Very
V
high
hi h precision
i i
Pulsed ~10picosec (100kHz–600kHz) :
Rapid, Talisker
Cold Ablative process:
process:- Silicon Dicing,
Dicing Glass
Scribing, OLED repair,
>20 kW
Pulsed 1-20nsec (100kHz – 1MHz) :
Daytona, Helios
Mostlyy Ablative process,
p
Low-k and Silicon
Dicing, Glass Scribing, Thin Film Ablation
Pulsed 30-80nsec (100kHz - 300kHz) :
DPSS (Avia, Matrix), Excimer,
Wide variety. Thermal/Ablative processes,
Scribing, Thin Film Ablation, Via Drilling and UV
Flex Cutting,
Cutting LTPS & Semi Annealing,
Annealing Marking,
Marking
Drilling and Scribing
Continuous (CW or QCW):
OPS, Direct Diode, Verdi and Paladin
Thermal processes:- Cutting, Frit
W ldi
Welding,
S
Soldering,
ld i
L
Laser D
Doping,
i
Annealing, Resist Exposure / LDI.
Precision
Superior Reliability & Performance
Time
Throughput
Jan
April17th,
24, 2012
2013
P. 4
Motivation for Shorter Wavelengths
Infrared
Green
UV
Typically at Shorter wavelengths :
• Stronger absorption in many materials
• Shallower penetration depth
• Less heat affected zone HAZ
• Reduced damage to surrounding
materials, or structures
• Smaller focal spot possible
• Longer depth of focus
• Localized removal with less power
Superior Reliability & Performance
Jan
April17th,
24, 2012
2013
P. 5
Burst Mode Technology Platform for Ultra-Fast Lasers
Oscillator
50MHz
Transient-amplifier architecture:
• large average power (100W)
• modular design
• high repetition rate (up to 2MHz)
Switch
Transient Amplifier
2MHz
Bursts of pulses with 20ns
separation
• significant increase in
ablation rate
• can lead to better
surface quality
open
switch
longer
Oscillator
50MHz
Switch
T
Transient
i t Amplifier
A lifi
2MHz
Superior Reliability & Performance
P. 6
Burst Machining of Silicon
Max. a
ablation ratte [mm³/miin]
Si
20
18
16
200µ
m
6 pulses/burst
4 pulses/burst
2 pulses/burst
1 pulse/burst
14
12
10
50µm
8
6
4
2
0
200
400
600
800
1000
Pulse Repetition Frequency [kHz]
• high rep. rate + burst: 14x removal rate
constant average power of 50W
Superior Reliability & Performance
effective ablation rate:
> 15 mm3/min
P. 7
Lasers in Medical Device Manufacturing
Superior Reliability & Performance
12/14/2010
P. 8
Wire Stripping of wires, cables & coils
• Exposing the underlying metal surface of a coated wire
for further joining steps
• Creating electrodes used for sensing or precise
vascular or lesion ablation
Where used:
• Cardiac rhythm management devices e.g. pacemakers
• Electrophysiology ablation devices e.g. atrial fibrillation
• Embolic protection and guide catheters
• Neuromodulation devices stimulating the spinal cord or
brain
• RF ablation probes used in arthroscopy and spine
procedures
Materials:
• Platinum, silver coated copper, alloys, Nitinol
Wire coating materials (5µm-1mm
(5µm 1mm thick):
• Fluoropolymers – ETFE, PTFE, PFA
• Polyimide
• PET
• Silicone
Superior Reliability & Performance
12/14/2010
P. 9
Wire Stripping
• Self Bonding wire
• Stripped with Matrix UV @
500mm/s and 2 passes
• Wire stripping
pp g with Diamond
C-30 CO2 laser
Courtesy of: Control Microsystems
Superior Reliability & Performance
P. 10
Surface Structuring
Colchea Implants
Hip & Knee
Implants
• Functional surfaces on medical implants improve acceptance in the bone
or prevent tissue growth, depending if the implant remains in the body or is
removed later.
• Creation of spikes makes only neuronal cells grow on hearing implants
implants.
• Micro-scale surface texturing may be effective in improving
osseointegration.
• Patterns include micro-grooves,
micro grooves dimple patterns,
patterns moguls,
moguls sinusoidal
patterns, and similar 3D surfaces
Superior Reliability & Performance
6/10/2014
P. 11
Surface Structuring
•
•
•
•
•
Coronary stents – creating drug
reservoirs
Balloons – texturing helps improve
traction between the balloon and
arterial wall
Catheters – may help increase balloon
adhesion to catheter shaft
Minimally invasive surgery – may
improve the growth of connective
tissue with polymer implants
Spinal fusion– fine laser texturing of
metal components may be
advantageous versus less controllable
bead blasting or additive coatings
Balloon Surface
Screw Surface
Superior Reliability & Performance
12/14/2010
P. 12
Glass marking with Helios green
• Traditional methods: etching, deep engraving & inside
marking
• NEW: diffractive marking for medical industry without
micro cracing.
Superior Reliability & Performance
6/10/2014
P. 13
Ophthalmology Blade – Atomic EdgeTM
Pre-shape blade with ps-pulses
Edge quality comparison
Metal
Diamond
Atomic EdgeTM
Sili
Silicon
bl
blade
d h
has sharpness
h
off di
diamond
d att costt more similar
i il tto metal.
t l
Superior Reliability & Performance
P. 14
Point of care diagnostics
Kiss Cutting of medical spacers with
additional laser perforations for easy part
separation
Laser cut and kiss-cut pressure sensitive test
strips
Laser cut microfluidic channels prior to
lamination. Laser kiss-cutting and
perforating
f ti were added
dd d tto create
t th
the fi
finall
parts.
A biosensor sample and laser processed
component
p
layers
y
Superior Reliability & Performance
P. 15
Drilling of medical components
• Holes as small as 5µm in drug
eluting balloons
• Drug
D
delivery
d li
in
i arteries
t i as
alternative to stents. Advantage in
areas with high fatigue stress i.e.
below the knee.
•
Superior Reliability & Performance
Large rectangular opening in tubing for e.g.
glucose monitor sensors
12/14/2010
P. 16
Blood Sugar Sensor Structures
40mm x 10mm
300 Hz
60m/min
150 pieces per sec
Superior Reliability & Performance
P. 17
Laser Direct Patterning – 100nm Au on Polymer
Reel to Reel (continuous feed) production system
Reel-to-Reel
Single laser shot ablation  High Productivity
Feature size: 15µm
Superior Reliability & Performance
P. 18
Lasers in Microelectronics Manufacturing
Superior Reliability & Performance
12/14/2010
P. 19
Why Use Lasers ??
• Material
M t i l Selective
S l ti
•
•
•
•
Wavelength can be absorbed selectively
Localized thermal effects controlled (low) thermal budget
Non-contact
Non
contact processes less expensive consumables
Light can be focused within or through transparent materials
at interfaces between materials to mark, ablate, lift-off or
weaken (used in thin film solar, stealth dicing, glass cutting,
flap cutting, laser lift off etc)
• High Precision
LLaser drilled/machined Ink‐Jet nozzle with d ill d/
hi d I k J
l ih
tiny flow channel ‐ Courtesy: LEXMARK
• UV Laser light can be tightly focused to create very small
feature sizes with resolution down to micrometers or less
• Ultra short pulses with high peak intensities can be used to
ablate material/features that cannot be cut with any blade/drill
• Feature depth control on nanometer scale
• Light scattering can be used to detect nm features or defects
• Scalability / Productivity / Lower Costs
•
•
•
•
High throughput laser processes reduce costs
Large substrates e.g. G8 glass
Fewer process steps
Eco-Friendly – No Wet Chemistry
Superior Reliability & Performance
Stealth Diced Sapphire Wafer – psec laser pulses are focused inside crystal
pulses are focused inside crystal April 24, 2012
P. 20
Smartphone – Submodules and Technologies
• Integrated Circuit Manufacturing
•
•
•
•
•
•
•
•
•
•
•
28 / 22 nm Lithography @ 193nm
Annealing / Activation
Multi-Layer PCB
RF, GPS
Laser Dicing
Logic
Glass substrate with
Memory
LightGuidePlate p-Si TFT Matrix
Advanced Packaging
MEMS
with HB-LED
RGB Color Filter
Multi-layer pcb
Camera
Polarizer
Via drilling
Light Diffusor
Back Cover
Singulation
Laser Direct Imaging
Battery
3D Integration
g
TSV, TGV
MEMS, MOEMS
.
Cover Glass
Touch-Screen
• Battery
y
• Structuring
• Welding
• Bonding
• Engraving
Polarizer Liquid Crystal
Reflector
Cell Module
Prism Sheet
LED Backlight
ac g t U
Unitt Bonded PCB
Back
.
display driver
Active Matrix LCD Display
Superior Reliability & Performance
Jan
April17th,
24, 2012
2013
Front
LCD
P. 21
Smartphone – Submodules and Technologies
• Laser
ase Crystallization
C ysta at o
• poly-Silicon, LTPS
•
•
•
•
•
Glass (FRIT) Welding
Film Cutting
Laser Direct Patterning
Thin Film Ablation
Glass cutting
• Thin, curved
• Strengthened glass
• Laser-Lift-Off
• Laser Induced Thermal Imaging
• Marking
g
• Serialization
• Design, Decoration
OLED
• Repair
• Backplane, Array, Cell, CF, OLED
Superior Reliability & Performance
Jan
April17th,
24, 2012
2013
P. 22
Packaging Trends
•
•
•
•
•
•
•
Die
e stac
stacking
g
Package stacking – package on package
Through Mold Via TMV
Wafer on wafer
Wafer-on-wafer
Through silicon vias
Glass and silicon interposers
Embedded devices / components
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 23
Device Singulation
• Low-k
L
k patterned
tt
d wafer
f scribing
ibi
 355nm 25µJ,
=355nm,
25µJ 200kHz
• Sub 28nm node wafers
• Thin wafer dicing
• For 3D stacked memory etc
• Sapphire scribing
• High brightness LEDs
Talisker-355nm picosecond pulses result
in lower HAZ for thin silicon dicing.
Avia 33W UV Q-Switched DPSS
L
Laser
D
Deployed
l
d iin 24/7 M
Manufacturing
f t i
Superior Reliability & Performance
Conventional diamond
wheel saw
Laser saw
Jan
April17th,
24, 2012
2013
P. 24
Laser Via Drilling
• HDI Multi-layer Rigid PCBs
• Flex PCBs
• IC Substrates
Buried
Laser Via
Plated Through
Via Mech.
Mech
Drilled
Blind Laser
Via
Dielectric
Copper Planes
PCB Core
Staggered Laser
Via
Buried
Mech. Via
Stacked Laser
Via (filled)
Multi-Layer Printed Circuit Board showing Via Structures
1000s of Coherent CO2 and UV lasers installed
in high volume manufacturing worldwide
Coherent Avia UV DPSS Laser
Designed Specifically for Via Drilling
Superior Reliability & Performance
Coherent Diamond E-400 Series Laser
Designed Specifically for Via Drilling
Jan
April17th,
24, 2012
2013
P. 25
Glass and Silicon Interposers
Superior Reliability & Performance
Jan
April17th,
24, 2012
2013
P. 26
Picosecond Micromachining – Holes in glass
200µm
 Glass drilling
 355nm
 10µJ
 High quality
edges
 Depth >200µm
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 27
Drilling Glass Wafers with UV-Bursts
Entrance side: 26 µm diameter
500 µ
µm thick 30–10 µ
µm diam.
percussion 20 holes/second
Exit side: ~ 10 µm
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 28
Many Laser Applications in Display Manufacturing
• Cutting,
Cutting Scribing
• Glass, sapphire, substrates, metal
•
•
•
•
Film cutting, polarizer
L
Laser
C
Crystallization
t lli ti ffor LTPS
Glass Welding and Frit Sealing
Thin Film Patterning
• Selective Ablation of SiNx, SiO2, Moly, ITO, TCO`s, metals
• Touch Sensor Patterning
• Laser Induced Thermal Transfer
• RGB OLED Patterning
• Laser Lift-Off of Flexible Displays
• Laser Repair
• LCD, OLED, Color Filter
• Selective ablation on array- (open) / deposition (close) / removal /
bl k i off sub-pixel
blackening
b i l on CF
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 29
Display Technology - Thinner Stronger Glass
• Thinner Glass
[mm]
• Image quality
• Lightweight
2
PDP
1
LCD
• Stronger- Durable
0.5
• Strengthened
g
g
glass –
mobile
GORILLA, DRAGONTAIL .. 0.1
• Cover Glass
• One-Glass Solution
T
Touchsensor
h
o Laser cutting is advantageous for thin glass
• Bezel free
• Stylish Design
• Rounded corner
• Notches, holes
• Curved glass
o
Debris Free and Minimal Cracks
o
Maintains glass strength
o
Can follow curves and contours
o
Advanced laser processes enable the cutting
of fully strengthened glass
o
N
New
processes minimize
i i i post processing
i
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 30
Filament Cutting
“Brute Force” Cutting
ps-laser based filaments
Debris
Stress
Field
Microcracks
perforate material
Superior Reliability & Performance
April 24, 2012
P. 31
Filament Cutting
• Early experiments in the Kaiserslautern
apps lab in 2008 led to experimental
demonstration of filaments in glass
• Peter Herman, University of Toronto
improves technique to show cutting
• Abbas Hosseini refines technique to cut
strengthened glass in 2010
• Papers in the Sowiet Union demonstrated
glass cutting with filaments in 1994
Superior Reliability & Performance
April 24, 2012
P. 32
Laser Cutting of Display Glass
CO2 Heat then quench crack propagation Technique
•
•
•
•
Full body cut with CO2 – crack propagation
Scribe and Break with DPSS nsec or ps-Laser
Full ablative cutting - ps-Laser, green, UV
Filament Cutting - Single pass with psec laser
• Filaments extend through glass
• After breaking glass has laser-ground surface
• No MICROCRACKS surface mark or debris
• Excellent bend strength
• High speed achievable
• Contoured or curved cuts possible
single pass
filament defect curtain
Gorilla XG, 700 µm, cut at 500 mm/sec
Filament Cutting Technique using Green psec Laser
Superior Reliability & Performance
Jan 17th, 2013
P. 33
Cutting „Home Position“ Button Holes
Superior Reliability & Performance
•
Down to 5mm diameter
•
Glass pops out
April 24, 2012
P. 34
Excimer Laser Annealing for Advanced Displays
Laser-based
Laser
based crystallization is the only industrially proven method
to form highly-uniform LTPS films for displays
20+ years commercial experience in LTPS
All
ll TOP manufacturers
f
off LTPS Displays
i l
use ELA!
More than 200 LTPS systems installed by Coherent
A Billi
Billion off Brillant
B ill t Di
Displays
l
each
h Year!
Y !
Galaxy S5
5“ FHD
443ppi, AMOLED
LG G3
5 5“ QHD LCD
5.5“ QHD LCD
534ppi, IPS LCD
Superior Reliability & Performance
iPhone 5
4.0“ Retina
326 i IPS LCD
326ppi IPS‐LCD
April 24, 2012
P. 35
Mobile Displays – Low Temp Poly Silicon
High
g resolution
eso ut o displays
d sp ays with
t b
brilliant
a t co
color,
o , lower
o e po
power
e co
consumption
su pt o
and integrated touch-panel are enabled by LTPS
AM-LCD
AM-OLED
Flexible Display
Active Matrix comprises of Thin Film Transistors (TFT)
• Low Temperature Poly-Silicon
Poly Silicon (LTPS) provides
high electron mobility enabling…
• small TFT  leaving a large aperture pixel
• stable TFT  driving current of emissive AMOLED
• CMOS driver integration to provide highest ppi
a-Si 
p-Si
• To provide
• Brilliant highest resolution displays
• Low power consumption
• Sleek form factor
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 36
Transforming a-Si into poly-Si – Excimer Laser Anneal
Hi h
i
L
VY
High Power Excimer Laser –
VYPER
(1.2 kW, 2 Joule/pulse – 600Hz – 308nm)
UV Optical System highly uniform thin line beam
Top‐hat, <1% uniformity, rms
(e.g. 750mm length x 0.4mm width)
(e g 750mm length x 0 4mm width)
Excimer Laser Annealing (ELA)
Highly uniform p-Si grains
a-Si is re-crystallized to poly-Si by a highly uniform line beam of pulsed UV Excimer laser irradiation
Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 37
Expansion of ELA into Large Scale LTPS Production
Line beam system
E
di llarge scale
l production
d ti
• Expanding
 20,000,000 sqm by Y2015
• Large glass, G5.5  G8
• High
Hi h power  Productivity
P d ti it
Annealing
Chamber
Excimer laser
System Layout G5.5 VYPER Laser with Line Beam 750mm Gen5 5 substrate with 7“ displays Source: Samsung
Gen5.5‐substrate with 7“ displays Source: Samsung Smartphones: AMLCD, AMOLED, Flex‐OLED Superior Reliability & Performance
April
2012
Jan 24,
17th,
2013
P. 38
Power and Stability Roadmap
3000
15
1.5
Laser Power and Stability
1.25
2000
1
1500
0.75
1000
0.5
500
0.25
0
energy sta
ability / rms
laser pow
wer / Watt
2500
0
2004
power
2006
2008
energy stability
2010
2012
Poly. (power)
2014
Poly. (energy stability)
• UV Laser Power up to 2.4 kW shipped; up to 3.6 kW demonstrated
• Excellent energy stability of is a key advantage of our excimer
Superior Reliability & Performance
April 24, 2012
P. 39
Laser Lift-Off Process with Temporary Glass Carrier
Flexible
Display
prototype:
YOUM by
Samsung
LLO of flexible AMOLED, 85µm
Source: Philips
AMOLED + Electrophoretic
freestanding flexible display
Laser
l
laser
lift
lift-off
ff
• Facilitates transition from rigid to flexible mass production
• Same processing equipment as for glass based display production
Superior Reliability & Performance
April 24, 2012
P. 40
Ablation process control
•
Excimer ablation allows us to control many things…
Side-wall Angle Control (WPR5100):

Higher fluence: Steeper wall-angle
wall angle

Lower fluence: Shallow wall-angle

Wall angles to < 85º
~65º
Depth Control - by No. of Pulses:

Each pulse removes a certain amount of material
 Etch-rate = material removed/pulse

With a known etch-rate – the number of pulses to
reach a desired depth can be predicted and controlled
~81º
Selective Excimer Stop Layers:
 Metal pads >1µm thick are a Stop Layer
4
Superior Reliability & Performance
April 24, 2012
P. 41
Seed metal removal - excimer
 A means to laser remove or pattern metal
seed layers < 600nm thick over organic
materials.





Dry etch approach
Quickly pattern or blanket remove
Selective material removal
Precise and veryy accurate patterning
g to ~4µm
Extremely fast patterning – single pulse
ablation (1/300 second)
 Precious metal can be reclaimed
2µm L/S
Ablated 50nm Au on PET
4
Superior Reliability & Performance
Ablated 30nm Palladium
on PET
P. 42
Video courtesy SUSS Microtec
Superior Reliability & Performance
12/14/2010
P. 43
Polymer ablation - excimer
 A means ablate precise patterns in polymers







Direct etch versus more costly, multi-step
approaches (photo/wet)
Throughput not feature complexity dependent
Etch uniform 3D structures
Ablate up to a 50 x 50mm field areas
Precise/Accurate patterning – mask based
Abl t with
Ablate
ith minimal
i i l HAZ
Selective material removal

Ablation of thousands of 9µm vias and high rates of speed.
(Repeated matrix of vias over a GEN 3.5 substrate)


Precisely stop on specific layers (eg: > 1µm thick
Cu, Al, etc…)
Vias as small as ~1-2µm
Nozzles, medical aerosol, flex circuits
• What is required for
Excimer ablation?
• Material must
absorb in the UV
range (248nm or
308nm))
1µm vias in 25µm thick PI
4
5µm Via in ~5µm thick
15µm thick WPR5100
dielectric
Via inside RDL structure
Superior Reliability & Performance
P. 44
ELP300 Excimer Stepper – Technical Characteristics
 SUSS MicroTec‘s ELP300 Gen2
Laser System is based on a
platform first introduced in 1987 and
i th
is
the llatest
t t HVM system
t
ffor 200 /
300 mm wafer processing.


4
Superior Reliability & Performance
System is focused on applications
for both WLCSP, FOWLP & 3D IC.
Standard system spec’s are as
shown.
P. 45
ELP600* Excimer Stepper – Technical Characteristics
*Next Generation ELP600 planned for
2015. Prior generation systems shown in
pictures to the right
4
Superior Reliability & Performance
April 24, 2012
P. 46
Coherent Applications Center – a world of expertise
•Macro to Micro
•Demonstrate Feasibility
•Help customers converge quickly on the best laser choice
•Services that can save our customers $thousands in resources
Above: CFRP cleaning with UV lasers
Left: Cladding demonstrations
Superior Reliability & Performance
April 24, 2012
P. 47
Coherent Applications Center – a world of expertise
8 Laboratory Locations Worldwide
Germany - Excimer
Santa Clara – Most Coherent Products including CO2
CO2, Solid State
State,
kW-class Fiber Lasers, 8000W direct diode, Ultra-Fast (ps/fs)
20 Engineers on staff with a broad range of expertise
Flexible Workstations, Marking Tools, Cutting Tools, Vision Systems
Multi-axis
M
l i i lilinear motion
i
Robotic beam delivery (cladding, hardening)
High Speed Galvo Scanners (IR to UV)
Optical examination
Flexible beam delivery for optimized processing
Superior Reliability & Performance
April 24, 2012
6/10/2014P. 48
What Next?
• Market Drivers
• PROCESS SPEED . . . . Scaling power / Pulse Energy
• PROCESS COST . . . . Reduction in CapEx and OpEx
• Laser Enablers
• ENVIRONMENT . . . . Continue challenging chemical
based processes
• BROADEN APPLICATION SPACE . . .
Example – laser annealing/recrystallization
Superior Reliability & Performance
April 24, 2012
P. 49
Thank you Dr
Dr. Gupta and
distinguished audience
Superior Reliability & Performance
6/10/2014
P. 50