INTRODUCTION TO :
DUAL BEAM FOCUSED ION BEAM
SCSAM Short Course
Amir Avishai
RESEARCH QUESTIONS
Solid Fuel Cell
TEM Liftout
Defect Analysis
Dual Beam FIBs Open
New Dimensions
MEMS Device
FIB slice showing detail of axons and myelin sheaths, Mitochondria.
Cross section of
50nm Cu Vias
OUTLINE
- Beam Optics and Signals Generated.
- Beam Energy & Current and Ion-Solid Interactions.
- FIB Applications.
- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.
- 3D Imaging.
FIB Flavors - LMIS (Ga) FIB vs Plasma (Xe) FIB
LMIS
Plasma
Laurens Kwakman - FEI
DUAL BEAM FIB OPTICS
FIB\SEM Schematic
Helios 650
Ion‐Solid Interactions
Secondary electrons
Secondary ions,
Backsputtered ions,
Neutral atoms,
Implanted ions,
•Sputtering/Milling
•FIB Imaging
•Ion Channeling
•Redeposition
•Surface amorphisation
Detector selection for Secondary Electrons Produced by the Ion Beam
Low Voltage Sample Clean up (5kV)
Notice the Shadowing
OUTLINE
- Beam Optics and Signals Generated.
- Beam Energy & Current and Ion-Solid Interactions.
- FIB Applications.
- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.
- 3D Imaging.
Ion‐Solid Incidence Angle & Sputter Yield Prenitzer et al., M&M 2003
Milling Rate for different Materials All cuts were done under the same conditions
and are presented at the same magnification.
Prenitzer et al., M&M 2003
FIB Ion Channeling Effects on Contrast and MiIling
Science, Imaging and Microscopy, FIB Milling and Channeling, Nov. 01, 2008
FIB Ion Channeling Effects on Contrast and MiIling
C.A.Volkert MAY 2007
Science, Imaging and Microscopy,
FIB Milling and Channeling, Nov. 01, 2008
FIB Surface Beam Damage As Function of Voltage
Beam current will effect
mostly milling rate and
heating
5 nm
30 keV
~ 21 nm
2 nm
2 nm
5 keV
~ 2 nm
2 keV
0.5nm -1.5nm
With Cs corrected TF20
Giannuzzi et al. M&M 2005
OUTLINE
- Beam Optics and Signals Generated.
- Beam Energy & Current and Ion-Solid Interactions.
- FIB Applications.
- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.
- 3D Imaging.
Gas Assisted Pattern options
Deposition Gases
•Platinum
•Tungsten
•Carbon
•Insulator
•Non-standard Requests, Au
Reactive Gases
•Iodine = EE
•XeF2= IEE
•Delineation Etch =DEE
•Selective Carbon Milling = SCM
Failure Analysis ‐ Device
Si
Al
P
O
Si
CN
O
Al
P
Failure Analysis ‐ Device
Si
Al
P
O
Si
P
O
C
N
Ga
Pt
Al
Cross Sections of Polymers and Bio Samples
Photosensitive Polymers
Acrylonitrile butadiene styrene (ABS)
(Selective Carbon etch - Water)
Cross Section of Critical point dried
Rods cell from a Wild Mouse Eye
3 m
Mg
Ti
Failure Analysis – Oxide & Polymer
Si
O
C
Pt
C
O
Si
Ga
in situ testing
Thermal
Measurement on
Carbon nanofiber
N. Mahanta & A. Abramson, CWRU
OUTLINE
- Beam Optics and Signals Generated.
- Beam Energy & Current and Ion-Solid Interactions.
- FIB Applications.
- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.
- 3D Imaging.
TEM liftouts
a.
c.
d.
LEAP liftouts – Carburized Steel
3D Atom Probe Tomography
Carbon Atom Map
CWRU - Danqi Wang
FIB Prototyping NanoBuilder Work Flow
GDS editor
or NanoBuilder
built-in editor
NanoBuilder
NanoArchitect (offline)
DualBeam + NanoBuilder
MILL
DEPOSIT
Design
Creation
Create (CAD) design
Load GDSII into NanoBuilder
Process
Definition
Assign Actions
to Layers
Process
Execution
Define Layer
Alignment & Multi
site setup
Create
structure
FIB Prototyping NanoBuilder
Multi-field writing with NanoBuilder
Example: array of IR plasmonic waveguides
200 nm
10 μm
• Waveguides written with sub-50 nm accuracy over 200 x 200 µm2 area.
50 μm
• Total processing time: 10 hours
Courtesy of CIC NanoGUNE - 2013
OUTLINE
- Beam Optics and Signals Generated.
- Beam Energy & Current and Ion-Solid Interactions.
- FIB Applications.
- TEM and Local Electrode Atom Probe Liftout, FIB Prototyping.
- 3D Imaging.
3D IMAGING APPROACHES
SERIAL ION ABLATION SEM
Ion beam
•
HRSEM
•
Small field of view, slow cutting,
•
Wide range of thickness
•
Any material
•
High vacuum
•
Artifacts – curtaining
•
Site Specific
VS
SERIAL BLOCK FACE SEM
Microtome
•
•
•
•
•
•
Regular FEG
Large Field of view, fast cutting
Limited thickness
Soft materials
High pressure mode and wet
mode
Artifacts – Chatter marks
3D Reconstruction of a Resin‐Bonded Interface of a Tooth
3D VOLUME ANALYSIS & MICROSTRUCTURAL PARAMETERS
Phase 1
Phase fraction
Phase 1
Phase 2
Phase 3
Naima Hilli
3D VOLUME ANALYSIS & MICROSTRUCTURAL PARAMETERS
Sample 1
Sample 2
Parameter
Phase 1 ( vol%)
Sample 1
Sample 2
20.1± 2.1
27.1± 1.2
Phase 1 particle diameter (m)
Phase 2 (vol%)
2.3± 0.8
3.0± 1.1
40.2± 1.8
36.4± 2.3
Phase 3 (vol%)
Tortuosity (Phase 1)
39.9± 1.4 2.3± 0.6
36.5± 0.8
1.7± 0.5
The pillars are constructed both parallel and perpendicular to the interfaces. The investigation of parameters like tortuosity is performed.
Phase 1
Phase 2
Phase 3
Naima Hilli
Examples of 3D SEM Imaging of Biological Tissues
Dr. Grahame Kidd, Lerner Institute Cleveland Clinic
Quantitative Analysis – Axonal Mitochondria
Mitochondrial Sizes Internodal Cerebellar Axons
1.4
1.2
Volume (um)
1
0.8
Series1
0.6
0.4
0.2
0
0
2
4
6
8
10
12
14
Length (um)
(Calc Diameter um)
Mitochondrial Diameters
0.6
0.5
0.4
0.3
Series1
0.2
0.1
0
0
2
4
6
8
10
12
Length (um)
Internodal axon samples
Axonal mitochondria tend to be thin in cross section (0.1‐0.3 um) and increase in length as they increase in volume .
Axons n= 18
diameters = 0.7 – 1.6 um
length sampled = 19‐36 um
mitos / mm = 85 – 680
mito vol : axon vol = 2.5 – 9%
Mitochondria
n= 195
length range = 0.5 – 13 um
14
Analysis of Void Defects in IC Device
500nm
Can you Find
the Cat?!
QUESTIONS