Electrolyte-Gated Graphene Field-Effect Transistors: ARCHIVES Modeling and Applications ASSACHUSETTS INSTITUTE OF TECHNOLOLGY By MAR 19 2015 Charles Edward Mackin LIBRARIES Submitted to the Department of Electrical Engineering and Computer Science in partial fulfillment of the requirements for the degree of Master of Science at the MASSACHUSETTS INSTITUTE OF TECHNOLOGY February 2015 0 Massachusetts Institute of Technology 2014. All rights reserved. Signature redacted Signature of Author: Department of Electrical Engineering & Computer Science December 11, 2014 Signature redacted Certified by: Tomis Palacios Professor of Electrical Engineering and Computer Science Thesis supervisor Accepted by: Signature redacted Le~ i'e. IKolodziejski Chair, Departmental Commi tee on Graduate students 2 Graphene Electrolyte-Gated Field-Effect Transistors: Modeling and Applications By Charles Mackin Submitted to the Department of Electrical Engineering & Computer Science on August 29, 2014 in Partial Fulfillment of the Requirements for the Degree of Master of Science in Electrical Engineering and Computer Science ABSTRACT This work presents a model for electrolyte-gated graphene field-effect transistors (EGFETs) that incorporates the effects of the double layer capacitance and the quantum capacitance of graphene. The model is validated through experimental graphene EGFETs, which were fabricated and measured to provide experimental data and extract graphene EGFET parameters such as mobility, minimum carrier concentration, interface capacitance, contact resistance, and effective charged impurity concentration. The proposed graphene EGFET model accurately determines a number of properties necessary for circuit design such as currentvoltage characteristics, transconductance, output resistance, and intrinsic gain. The model can also be used to optimize the design of EGFETs. For example, simulated and experimental results show that avoiding the practice of partial channel passivation enhances the transconductance of graphene EGFETs. Graphene EGFETs are fabricated for pH sensing. The location of the Dirac point is measured for pH concentrations varying from 4 to 10. In this range, graphene EGFETs are shown to produce -50.8 mV/pH sensitivity. Graphene EGFETs are also fabricated for use in a real-time polymerase chain reaction (RTPCR) system. RTPCR is run successfully to identify DNA segments thought responsible for the metabolism of clopidogrel, a widely prescribed antiplatelet medication. The graphene EGFETs, however, failed to sense an increase in DNA concentration. Further optimization of the PCR mix is required to ensure that increased DNA concentration lowers the PCR mix pH without rendering the DNA polymerase ineffective. Lastly, graphene EGFETs fabricated for electrogenic cell sensing using the optimized parameters from the newly developed graphene EGFET current-voltage model. Hippocampal mouse neurons were cultured on top of the graphene EGFETs in attempt record action potentials. Thesis Supervisor: Tomis Palacios Title: Professor of Electrical Engineering and Computer Science 3 Contents Chapter 1- Introduction 1- Introduction to Graphene 2- Introduction Graphene Electrolyte-Gated Field-Effect Transistors (EGFETs) 3- Graphene EGFET Operation Principles 4- Relevant Principles in Electrochemistry Chapter 2 - Graphene EGFET Fabrication & Setup 1234- Graphene Synthesis Graphene Transfer Process Graphene EGFET Fabrication Measurement Setup Chapter 3 - Monolayer Graphene EGFET Characterization 1- Graphene-Electrolyte Interface Capacitance Modeling 2- Fundamental Current-Voltage Model for Graphene EGFETs 3- Current-Voltage Model for Graphene EGFETs with Heterogeneous TopGate Capacitances 4- Minimum Conduction Point 5- Fitting the Current-Voltage Model to Experimental Data 6- Passivation Scheme Comparison 7- Performance Optimization for Electrogenic Cell Sensing Chapter 4 - Graphene EGFET Applications 1- pH Sensing 2- Monitoring Real-time Polymerase Chain Reaction 3- Electrogenic Cell Sensing Chapter 5 - Summary & Conclusions 4 Chapter 1 - Introduction 1. Introduction to Graphene Graphene consists of an atomically-thin planar sheet of sp 2 -bonded carbon atoms arranged in a hexagonal lattice [1]-[5]. Graphene is one of three low-dimensional carbon allotropes depicted in Fig. 1.1. As a zero band gap and all-surface material, graphene's electrical properties are affected by its surrounding environment. This serves as the chief motivation for graphene's use in sensing applications. Graphene also possesses a combination of electrical, mechanical and chemical properties that make it promising for use in chemical and biological sensors. These properties include room temperature mobilities in excess of 50,000 cm 2 /Vs [6], high surfaceto-weight ratio of 2630 m 2 /g [7], [8], flexibility [9]-[12], high Young's modulus of 1 TPa and breaking strength of 42 N/in [13], a wide electrochemical potential window of 2.5 V in phosphate buffered saline [14], and relatively inert electrochemistry [15]-[18]. a) b) 19MW--_C) Fig. 1.1: New carbon allotropes a) spherical Buckminster fullerene b) 1D carbon nanotube c) 2D graphene [19]. Graphene may be synthesized using a number of methods. Monolayer and few layer graphene were initially isolated by repeated mechanical exfoliation of highly oriented pyrolytic graphite (HOPG) [20]. Graphene may also be grown by thermal decomposition of silicon carbide [21]. In this process, silicon carbide is annealed at high temperature-typically above 1000*C-in an inert gas. This causes silicon atoms to desorb from the silicon carbide lattice leaving behind a layer of carbon atoms at the surface, which rearrange and bond to form epitaxial graphene. Lower quality and multilayered graphene films are also commonly synthesized by reducing graphene oxide [7]. Lastly, graphene may be synthesized using chemical vapor deposition (CVD). In this process, methane is flowed over a metal foil-usually nickel or copper-at around 1000*C resulting in graphene formation on the metal surface. CVD graphene synthesis is capable of producing large sheets of graphene at relatively low cost [22]-[24]. 5 2. Introduction to Graphene Electrolyte-Gated FieldEffect Transistors (EGFETs) A number of graphene-based chemical and biological sensing devices have been developed in recent years. The vast majority of these graphene chemical and biological sensors may be categorized as optical, electrochemical, or FET-based. Optical-based graphene sensors offer analyte detection without the risk of adversely altering the analyte environment [25]. These sensors, however, often require light sources, mirrors, and filters making low-cost and miniaturization difficult. Electrochemical graphene sensors not only provide analyte detection but a wealth of information regarding analyte reaction kinetics. These sensors, however, typically require bulky and expensive potentiostats as well as a trained professional to run a number of measurements and to interpret the complex data. FET-based approaches, on the other hand, offer the ability to make cheap, stand-alone, and small (e.g. implantable) sensors with greatly simplified readout systems. Equally important, FET-based graphene sensors are promising in terms of performance. For instance, reported detection limits for FET-based graphene dopamine sensors are on par or better than their electrochemical counterparts [26]-[37]. Graphene's inertness enables a direct interface with many chemical and biological environments. This is particularly beneficial for the electrolytic environments present in a variety of biological and chemical sensing applications because graphene can exploit the electrical double layer phenomenon and resulting ultrahigh interface capacitance [38]. This large capacitance coupled with graphene's high mobility enables high-transconductance field-effect transistor (FET) sensors, which have been shown capable of less than 10pV RMS gate noise [39]-[43]. Graphene electrolyte-gated field-effect transistors (EGFETs) consist of a graphene channel between two conductive source-drain contacts, which are typically metals. Some portion of the graphene channel is exposed to the electrolytic environment; either directly or via some selectively permeable membrane. This allows changes in the electrolytic environment to alter the graphene channel's electrical properties. Some form of read out circuitry is then used to identify these changes in electrical properties. No material constraints are imposed on the substrate, which can vary from glass to silicon to polymer. Fig. 1.2 depicts the layout and measurement setup of a typical graphene EGFET. 6 VGS -- VDS - Vs Si LjSiO2 = Ti/Au/Pt E2Graphene Polyimide IZ LI SU-8 =j Electrolyte Fig. 1.2: Graphene EGFET with heterogeneous top-gate capacitance due to non-self-aligned completely passivated source and drain regions. VS, VDS, and VGs represent the voltages applied to the source, drain, and gate, respectively. 3. Graphene EGFET Operation Principles Graphene electrolyte-gated field-effect transistor (EGFET) sensors rely on one of two operation principles: Dirac point shifts or VGS modulation. In the Dirac point shift approach, a change in the electrolytic environment alters the graphene Fermi level. In other words, the graphene become more p-type or n-type. For certain applications such as electrogenic cell sensing, graphene EGFETs can be thought of as operating based on VGS modulation. For instance, when a neuron produces an action potential near the graphene surface, it alters the distribution of ions found at the graphene surface. Even though VGS is held constant, this process can be thought of as a slight modulation in the effective Vcs voltage. The change in the effective VGS then results in a detectable change in IDS current. Figs. 1.3, 1.4 depict how Dirac point shifts and VGs modulation impacts the measured current-voltage characteristic. IDS IDS AIDS{ '----1~ I' Ii Ii I AVDRAC VGS 0 Fig. 1.3: Change in electrolyte composition alters graphene doping and the location of the Dirac point. ll A-r. ~ VGS 0 Fig. 1.4: Change in ionic composition near the graphene surface due to electrogenic cell activation modulates the applied Vcs voltage. 7 4. Relevant Principles in Electrochemistry Understanding graphene electrolyte-gate field-effect transistor operation requires an introduction to a couple fundamental principles of electrochemistry: electric double layer formation and electrochemical potential windows. An electric double layer is formed whenever an electrode is interfaced with an electrolyte of a different electrochemical potential. This causes either the cations or anions of the electrolyte to preferentially migrate to the surface of the electrode. In equilibrium, the ionic charge is screened by an equal and opposite amount of charge within the electrode so that net charge neutrality is maintained. The charge separation occurs primarily over a few nanometers. As a result, electric double layer capacitances are quite large and typically range from a few pF/cm 2 to tens of pF/cm 2 . Several models have been developed to describe the electric double layer phenomenon. The most common are the Helmholtz model, Gouy-Chapman model, and the Gouy-Chapman-Stern model. Helmholtz, who credited with discovery the electric double layers, assumed all ions were specifically adsorbed onto the electrode surface and therefore modeled the electric double layer using a simple parallel plate capacitor. The Gouy-Chapman model is a diffuse electric double layer model, which takes into account the fact that the ions are subject to diffusive and electrostatic forces within the electrolyte. Lastly, the Gouy-Chapman-Stern model combines the previous two models to allow for layer of specifically adsorbed ions as well as a diffusive region. Fig. 1.5 depicts the three different electric double layer models. diffuse layer diffuse layer a O solvent % 0 (a) Helmholtz modcl Stern layer (b) Gouy-Chapman model moIlcuIl anion (c) Gouy -Chapman-Stern modcl Fig. 1.5: The three most common models used to describe electric double layers a) Helmholtz model b) Gouy-Chapman model c) Gouy-Chapman-Stern model [44]. The drawback with these models is that they model ions as point charges. In actuality, ions occupy a certain amount of volume and have a limited packing 8 density. In general, this means the Helmholtz, Gouy-Chapman, and Gouy-ChapmanStern models only accurately model electric double layers at low ionic concentrations and low potentials. More accurate models such as the modified Poisson-Boltzmann (MPB) account for steric effects and are described by the following equations [45]. 21p _zqN c0 2 sinh(q z 0 ) 1+2sinh~qkBT) 1+2vinh where ip is the potential, c, represents the ion species bulk concentration, z is the corresponding ion valency, NA is Avogadro's number, kB is the Boltzmann constant, E is the permittivity, q is the elementary charge, and T is temperature. Steric effects are included via the denominator term in the summation and are governed by the packing parameter v. The packing parameter represents the maximum density to which ions may accumulate at the graphene-electrolyte interface and is given by the following equation. v = 2a 3cO where a is the effective diameter of the ion species and c, again represents the bulk ion species concentration. Solutions to the modified Poisson-Boltzmann equation play an important role in building intuition on how a number of factors might influence the grapheneelectrolyte interface (Figs. 1.6 - 1.9). The effects of bulk electrolyte composition, permittivity, and effective ion sizes have been determined for the potential, ion concentration, total electrical double layer charge, and capacitance. Analytic solutions to the modified Poisson-Boltzmann equation become difficult or impossible for many scenarios applicable to graphene EGFETs. Because of this, solutions to the modified Poisson-Boltzmann equation are obtained numerically from a custom built simulation. 9 Ion Concentration v. Distance from Interface (MPB) (z = 1, CO = 0.15 M, P0 = 25 mV, ion size = 1 nm) Total Charge per Area v. Applied Voltage (P0) (z = 1, er = 78.3, ion size = 1 nm) 45, -er 0.35 -er = 78.3 (z = +1) -- er=78.3(z=-1) er = 100 (z =+1) er =100 (z =-1) -er = 120 (z =+1) er = 120 (z =-1) 0.3 0.25 0.2 - = 30 (z = +1) er = 30 (z = -1) ---- er = 50 (z = +1) - -er = 50 (z = -1) 0.4 -CO =0.01 M(PB) CO = 0.01 M (MPB) CO = 0.05 M (PB) -CO = 0.05 M(MPB) _-_ CO = 0.10 M (PB) -- CO = 0.10 M (MPB) CO = 0.15 M (PB) C = 0.15 M(MPB) --CO = 0.30 M (PB) L--C0 = 0.30 M (MPB) 0.6 0.8 1 -10 105 > 0.15 < 10 0.1 .- 0 0.2 0. 8 0.4 0.6 Distance(m) 108 1 x 108 E"f -- Et. -Eff. -Eff. E 150 '-Eff. 0.2 0.4 P0 (V) Fig. 1.7: Electric double layer charge density as a function of electrode potential for various electrolyte concentrations. Solid lines represent are MPB solutions that include steric effects. Dashed lines are Poisson-Boltzmann solutions, which neglect steric effects. Fig. 1.6: Cation and anion concentrations as a function of distance from the electrode surface for varying electrolyte permittivity. 200 0 -Concentration =10 mM 10 Ion Size = 5 A Ion Size = 1 nm Ion Size = 2 nm Ion Size =3 nm Ion Size = 4 nm -Concentration -Concentration 50 mM = 100 mM = Concentration = 150 mM - Concentration = 200 sM E S60 L 100- .0 40 c- C- 50 co 20- 0~ - -1.5 - -05 0 Potential (V) 05 1 15 Fig. 1.8: Electric double layer capacitance versus applied potential for various effective ion sizes. The simulated data includes steric effects and is for 100 mM symmetric aqueous electrolyte with relative permittivity 78.3. 2 - :2-15 -1 -0.5 0 Potential (V) 05 1 1.5 Fig. 1.9: Electric double layer capacitance versus applied potential for various ion concentrations. The simulated data includes steric effects and is for an aqueous symmetric electrolyte with a 1 nm effective ion size and relative permittivity of 78.3. Electrochemical potential windows are another important concept to understanding graphene EGFET operation. The basic layout for a graphene EGFET is re-illustrated in Fig. 1.10 for convenience. Note that the graphene is directly interfaced with the electrolyte. Both the graphene and electrolyte are conductive so the pertinent question becomes: what prevents current from flowing from the gate through electrolyte and into the graphene channel towards the source terminal? 2 10 vGS Si II SiO2 l Polyimide K Graphene LI TI/Au/Pt n SU-8 =l Electrolyte Fig. 1.10: Graphene EGFET with heterogeneous top-gate capacitance due to non-self-aligned completely passivated source and drain regions. Vs, VDS, and VGs represent the voltages applied to the source, drain, and gate, respectively. In order for a DC current to flow at the graphene electrolyte interface, there must be a sustained reduction or oxidation of one of the chemical species. In the case of aqueous NaCl electrolyte, either Na+ must be reduced, Cl- must be oxidized, or water molecules must be split in order to create oxygen and hydrogen gases. These processes all require some activation barrier to be overcome. Fortunately, these activation barriers are quite high for many graphene-electrolyte reactions including aqueous NaCl and phosphate buffered saline (PBS) [14]. The current density due to the oxidation and reduction of chemical species at an electrode is described by the Butler-Volmer equation (Eq. 1.1). j = jo[eaanFi/RT - e-acnFl/RT1 (1.1) Where j is the current density, jo is the exchange current density, aa is the anodic charge transfer coefficient, a, is the cathodic charge transfer coefficient, n is the number of electrons involved in the reaction, R is the universal gas constant, T is the The graphene-electrolyte absolute temperature, and -q is the overpotential. interface possesses a low exchange current density. This results in a large potential range where negligible DC current exists across the graphene-electrolyte interface. Fig. 1.11 depicts the wide electrochemical potential window of graphene in 1M aqueous NaCl. I1 1.5 1 -- 0.50-0.5-1-- 5 -0.5 0 0.5 1 1.5 Voltage (V) Fig. 1.11: Graphene electrode current versus potential in 1M aqueous NaCl using an Ag/AgCl reference electrode and 1 mm diameter platinum button counter electrode. The grapheneelectrolyte interface has dimensions W/L = 40 pm/20um. The graphene channel may be biased anywhere from -1 to +1 volts without bringing on any oxidation or reduction currents. Thus, the gate leakage current can be kept at negligible levels without requiring graphene passivation by some oxide material. This wide electrochemical potential window enables graphene EGFETs to be directly interfaced with electrolytic environments and take full advantage of the high electric double layer capacitance. 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Chemical Vapor Deposition Graphene Synthesis Chemical vapor deposition (CVD) graphene synthesis has been demonstrated by flowing methane over a number of transition metals including cobalt, ruthenium, nickel, and copper [1]-[4]. In this process, the metal substrate serves as a catalyst for methane decomposition as given by the following chemical reaction (Eq. 2.1). CH 4 -+ C + 2H 2 (2.1) The transition metal substrate also provides nucleation sites for graphene growth [5]. Copper, however, has become dominant substrate for CVD graphene synthesis because the graphene growth process self-terminates after the formation of monolayer graphene. This phenomenon is attributed to the low carbon solubility in copper, which prevents additional layers of graphene from forming via the out diffusion of carbon from the copper substrate. The CVD graphene used for this work was grown by first loading copper foils inside a quartz tube furnace and heating the copper substrate to 1000'C for thirty minutes in a mixture of argon and hydrogen gas. This step removes the oxide from the copper surface and helps reduce the number of surface impurities. A mixture of methane and hydrogen gas is then flown over the copper substrate at 1000*C for forty minutes during the graphene synthesis stage (Fig. 2.1). Finally, the copper substrate is cooled to room temperature while flowing a mixture of hydrogen and methane. The resulting graphene film is depicted in Fig. 2.2. ~H2 CH 4 Bl 1Boundary layer 6 H* + C*+.3 CH Surface Fig. 2.1: CVD graphene synthesis depicting formation from methane decomposition and carbon nucleation at the copper substrate [5]. Fig. 2.3: Optical microscope image of a large-area intact and clean CVD graphene on a Si/SiO 2 wafer substrate. 17 2. Graphene Transfer Process A well-developed graphene transfer process is essential for well-functioning EGFETs with reasonably consistent electrical properties. Poor graphene transfer processes may result in discontinuous graphene, large amounts of wrinkling, and a great deal of unwanted photoresist residue at the graphene-electrolyte interface. The following illustration provides an overview of the most essential graphene transfer processes [3]. A more detailed description of the transfer process is given thereafter. Graphene Cu Foil Wax Paper PET PMMA - Target Substrate 1. Graphene Growth on Cu Foil 2. Transfer Graphene/Cu Foil to Wax Paper & PET 3. Spin Coat PIMMA 4. Cut Off Wax Paper and PET 5. Back Etch Graphene 6. Dissolve Cu Substrate 7. Transfer Graphene/PMMA to Target Substrate 8. Remove PMMA Graphene is first grown on both sides of a copper foil using the previously described method of chemical vapor deposition. The graphene/copper foil is then placed on top of a slightly larger piece of wax paper. The graphene/copper foil and wax paper and then taped down around the edges to a slightly larger piece of polyethylene 18 terephthalate (PET). PMMA A9 is then diluted with anisole in a 1:1 ratio and spin coated on top of the entire structure at 2500 rpm for 60 seconds. This results in structures such as those depicted in Fig. 2.4. PET Wax Paper Graphene/Cu Foil Fig. 2.4: Graphene/copper foils on top of wax paper and PET. The entire structure has been spin coated with PMMA. The graphene/copper foil with coated in PMMA is then released by cutting just inside the edges of the tape. The graphene/copper foil then has exposed graphene on one side and PMMA-covered graphene on the other side. The exposed graphene is then removed using reactive ion etching for 30 seconds in 02 and He plasma. The copper foil/graphene/PMMA structure is then floated on top of copper etchant (Transene CE-100) in a Petri dish. After 30 minutes, the copper foil is completely etched away leaving only the graphene/PMMA film floating on the surface of the copper etchant. The graphene/PMMA film is then scooped out using a silicon wafer piece or glass slide and transferred into a new Petri dish containing deionized (DI) water. This dilutes any copper etchant solution that may have remained on the graphene/PMMA film. The graphene/PMMA film is transferred twice more to Petri dishes containing DI water. This further dilutes any copper etchant contamination and helps ensure that the graphene surface is clean. Next, the graphene/PMMA film is transferred to HCl/DI H 20 (1:2) mixture for 30 minutes. This process helps to remove metal ion contaminants and reduce the level of graphene doping. The graphene is then transferred three times to Petri dishes containing DI water to further clean the graphene surface. Finally, the graphene/PMMA film is transferred to the target substrate. Once on the target substrate, the graphene/PMMA film is gently blow-dried using a nitrogen gun. The nitrogen gas is aimed at the center of the graphene/PMMA film causing any water trapped between the graphene and the substrate to be pushed out towards the edges. This also helps to reduce wrinkles in the graphene/PMMA film. The graphene/PMMA film is blow-dried until the film is as smooth as possible and the majority of the water is removed from underneath the film. 19 The target substrate with the graphene/PMMA film is then baked at 80*C for 5 minutes and 130*C for 30 minutes. This allows the PMMA to reflow, which allows for better adhesion between the graphene and the target substrate. This process also aids in evaporating any remaining water. The target substrate with the graphene/PMMA film is then immersed in acetone for two hours to remove the PMMA film. Any remaining PMMA residue is then further removed by annealing the sample at 350*C for three hours in 400 sccm of argon and 700 sccm of hydrogen. The following optical microscope images depict both failed and successful graphene transfers for Van der Pauw structures. The graphene area is approximately 100 ptm x 100 ptm. The fabrication of such large-area graphene structures without tears, excessive wrinkles, and other defects requires consistent implementation of a welldeveloped transfer process. For a detailed description of the entire graphene EGFET fabrication process, see the subsequent section. SU-8 Si02 Fig. 2.5: Optical microscope image of poor graphene transfer for a Van der Pauw structure. SU-8 S'02 Fig. 2.6: Optical microscope image of a successful graphene transfer for a Van der Pauw structure. 3. Graphene EGFET Fabrication Graphene EGFETs were fabricated using a clean 4" silicon wafer coated with Spm of spin-on polyimide (HD-8820). The polyimide film was annealed at 375*C in 700 sccm argon to prevent outgassing in subsequent high-temperature annealing steps. Source and drain Ti/Au/Pt (10nm/100nm/20nm) contacts were patterned using optical lift-off photolithography. Monolayer graphene was then grown on copper foils using chemical vapor deposition (CVD) and transferred over the entire substrate using polymethyl methacrylate (PMMA) [6]. PMMA was removed by immersion in acetone and devices were rinsed with isopropanol. PMMA residue was further reduced by annealing at 350 0 C in 400 sccm argon and 700 sccm hydrogen for three hours. The graphene channel regions were defined using 20 MMA/OCG825 photoresist stacks and helium and oxygen plasma, 16 sccm and 8 sccm, respectively. The graphene channel dimensions are W/L = 40 pim / 30 pim. The MMA/0CG825 photoresist stacks were removed using acetone and isopropanol. The samples were annealed once more at 350*C in 400 sccm argon and 700 sccm hydrogen for three hours to further remove MMA residue. The entire wafer was passivated with 2.4 im of SU-8 2002 and windows were photo defined to provide electrolyte access to the graphene EGFET channel regions. The SU-8 was hard-baked at 150*C for five minutes to remove cracks and pinholes. Similar devices were fabricated on 300 nm SiO 2 to facilitate better wire bonding, which was required for the interface capacitance measurement [7]. Polyimide SU-8 Fig. 2.7: Optical microscope image of a graphene EGFET on a polyimide substrate with SU-8 passivation extending into the graphene channel region. 20 pm Fig. 2.8: Optical microscope image of a graphene EGFET with recessed SU-8 passivation leaving portions of the source drain contact metal exposed to the electrolyte. Similar graphene EGFETs were fabricated on SiO 2 with W/L = 10 pim / 5 Im. Hardbaking SU-8 photoresist was found to effectively remove cracks. The following optical microscope images show SU-8 before and after hardbaking. Fig. 2.9: Optical microscope image of a graphene EGFET on SiO 2 substrate with recessed SU-8 passivation. The SU-8 has cracks near the corners before hardbaking. Fig. 2.10: Optical microscope image of a graphene EGFET on SiO 2 substrate with recessed SU-8 passivation. Hardbaking removes cracks in the SU-8 near the corners. 21 Raman spectroscopy data of was acquired from every graphene EGFET device on a single die. The Raman data is offset in the y-direction to prevent the data from overlapping and allow for easy comparison. The G peak mean and standard deviation are 1596.8 cm-1 and 2.8 cm-1, respectively. The 2D peak mean and standard deviation are 2693.4 cm-1 and 4.5 cm-1, respectively. These values are in agreement with previously reported G and 2D peak values [6], [8]. The consistency of the Raman spectroscopy data indicates that consistency in the graphene quality across the sample. 600 A , 500 -CU C') T 400 300 C k, AA1V 200 O&A 1 00 A 100 1400 1600 1800 2000 2200 2400 Shift (cm-1) 2600 2800 3000 Fig. 2.11: Raman spectroscopy data from eleven graphene EGFET channel regions all from the same die. Raman spectroscopy data was acquired using a 532 nm laser. 4. Measurement Setup Graphene EGFETs possess three terminals: source, drain, and gate. The source terminal is typically ground. The drain terminal is biased at a positive voltage to create positive current flow through the graphene channel, IDS. The gate voltage is applied to the electrolyte and is used to modulate the current in the graphene channel, IDS. Because the graphene EGFET is a symmetric device, the source and drain terminals can be switched and the measured current-voltage characteristics will remain the same. The following illustration shows a graphene EGFET and the location of each terminal in the measurement setup. 22 VGS Si SiO2 = Polyimide = Ti/Au/Pt EMGraphene = SU-8 = Electrolyte Fig. 2.12: Graphene EGFET with heterogeneous top-gate capacitance due to non-self-aligned and completely passivated source and drain regions. Vs, VDS, and VGS represent the voltages applied to the source, drain, and gate, respectively. Graphene EGFET current-voltage characteristics may be measured directly from the die (without packaging) by using a standard DC probe station. The only special setup requirement is that the die be large enough for an electrolyte droplet to cover the graphene gate region without providing a conductive path between the source and drain terminals. The DC probe station tips connecting to the source and drain are kept out of the electrolyte to ensure that the measured IDS current stems solely from conduction through the graphene EGFET channel region. The probes of the DC probe station are typically made of tungsten. The probe inserted into the electrolyte for the gate terminal is substituted for a platinum wire, which is known to be inert and serve well as an electrode material. Most potentiostat measurements either apply a voltage and measure a resulting current or apply a current and measure the resulting voltage. Ideally, such measurements only require two terminals. Potentiostats, however, possess three terminals: a working electrode, reference electrode, and counter electrode. This is because in a two terminal setup, supplying current through an electrode can also alter its potential and lead to erroneous results. Therefore, potentiostats make use of a reference electrode, which passes virtually no current and maintains a very stable reference potential. The counter electrode then supplies whatever current is necessary in order for the working electrode to have the desired potential with respect to the reference electrode. Many types of reference electrodes exist, but the most common for aqueous-based electrochemical experiments are the Ag/AgCl and saturated calomel reference electrodes. Because saturated calomel reference electrodes contain mercury, Ag/AgCl have become the most popular. Reference electrodes are designed to act as ideal non-polarizable electrodes. This means that the interface potential between the reference electrode and the electrolyte is very stable (Fig. 2.13). This is in stark contrast to graphene, which has a large electrochemical potential window and is closer to an ideal polarizable electrode. Recall, that graphene was biased from -1 to +1 volts in 1M aqueous NaCl while producing minimal DC current (Fig. 2.14). 23 Graphene accommodates this changing potential by storing charge like a capacitor in the electric double layer. V V Fig. 2.13: Electrode current versus electrode potential for an almost ideal non-polarizable electrode. Fig. 2.14: Electrode current versus electrode potential for an almost ideal polarizable electrode. Graphene EGFET characterization also required measurement of the grapheneelectrolyte interface capacitance. This capacitance was measured using a Gamry Reference 600 potentiostat in conjunction with the Mott-Schottky experiment within the electrochemical impedance spectroscopy software suite. In the MottSchottky experiment setup, the source and drain terminals are connected together. The source and drain terminals are then connected to the potentiostat such that the graphene channel becomes the working electrode. A platinum wire is used as the counter electrode and an Ag/AgCI electrode is used as the reference electrode. The Ag/AgCl reference electrode, however, is too large to fit into an electrolyte droplet pipetted on the 8 mm x 8 mm die. Therefore, the graphene EGFETs were packaged by wire-bonding the die to a chip carrier, passivating the wire bonds with medicalgrade epoxy, and mounting a glass cylinder around the devices with epoxy. Fig. 2.15: Graphene EGFETs packaged in a chip carrier with glass cylinder on top for electrolyte storage. Fig. 2.16: Bird's eye view of graphene EGFETs packaged in a chip carrier with glass cylinder on top for electrolyte storage. 24 The Mott-Schottky experiment determines the graphene-electrolyte interface capacitance by applying a small sinusoidal voltage signal (typically 10 mV) to the gate and recording the resulting sinusoidal current from the gate to source/drain terminals. Magnitude and phase relationship between the voltage and current signals determine the complex impedance of the interface. Z = V sin(wt) 1 sin(wt+O) (2.2) This procedure is repeated for frequencies ranging from 1 Hz to 1 MHz. Now that the graphene-electrolyte interface impedance is known as a function of frequency, it can be represented as either as either a Bode plot or a Nyquist plot. The majority of electrolyte-electrode interfaces can be modeled using the Randles circuit. By fitting the experimental data to the Randles circuit model, the interface capacitance is extracted [9]. Note that the interface capacitance is due to the electric double layer capacitance, CEDL. RCT Img(Z) Rs Re(Z) CEDL Zw Fig. 2.17: Randles circuit model for the grapheneelectrolyte interface. Rs RS+RCT Fig. 2.18: Typical Nyquist plot of the electrodeelectrolyte interface impedance. References [1] H. Ago, Y. Ito, N. Mizuta, K. Yoshida, B. Hu, C. M. Orofeo, M. Tsuji, K. Ikeda, and S. Mizuno, "Epitaxial Chemical Vapor Deposition Growth of Single-Layer Graphene over Cobalt Film Crystallized on Sapphire," ACS Nano, vol. 4, no. 12, pp. 7407-14, Dec. 2010. [2] P. W. Sutter, J.-I. Flege, and E. a Sutter, "Epitaxial Graphene on Ruthenium," Nat. Mater., vol. 7, no. 5, pp. 406-11, May 2008. [3] A. Reina, X. Jia, J. Ho, D. Nezich, H. Son, V. Bulovic, M. S. Dresselhaus, and J. Kong, "Large Area, Few-Layer Graphene Films on Arbitrary Substrates by Chemical Vapor Deposition," Nano Lett., vol. 9, no. 1, pp. 30-35, 2009. [4] X. Li, W. Cai, J. An, S. Kim, J. Nah, D. Yang, R. Piner, A. Velamakanni, I. Jung, E. Tutuc, S. K. Banerjee, L. Colombo, and R. S. Ruoff, "Large-Area Synthesis of 25 High-Quality and Uniform Graphene Films on Copper Foils," Science, vol. 324, no. 5932, pp. 1312-4, Jun. 2009. [5] S. Bhaviripudi, X. Jia, M. S. Dresselhaus, and J. Kong, "Role of Kinetic Factors in Chemical Vapor Deposition Synthesis of Uniform Large Area Graphene using Copper Catalyst," Nano Lett., vol. 10, no. 10, pp. 4128-33, Oct. 2010. [6] J. W. [7] E. F. Transistors, C. Mackin, L. H. Hess, A. Hsu, Y. Song, J. Kong, J. A. Garrido, and T. Palacios, "A Current-Voltage Model for Graphene Electrolyte-Gated Field-Effect Transistors," IEEE Trans. Electron Devices, vol. 61, no. 12, pp. 3971-3977, 2014. [8] Y. Zhu, S. Murali, W. Cai, X. Li, J. W. Suk, J. R. Potts, and R. S. Ruoff, "Graphene and Graphene Oxide: Synthesis, Properties, and Applications," Adv Mater., vol. 22, no. 35, pp. 3906-24, Sep. 2010. [9] A. J. Bard, L. R. Faulkner, E. Swain, and C. Robey, ElectrochemicalMethods: FundamentalsandApplications. 2001. Suk, A. Kitt, C. W. Magnuson, Y. Hao, S. Ahmed, J. An, A. K. Swan, B. B. Goldberg, and R. S. Ruoff, "Transfer of CVD-Grown Monolayer Graphene onto Arbitrary Substrates," ACS Nano, vol. 5, no. 9, pp. 6916-24, Sep. 2011. 26 Chapter 3 - Monolayer Graphene EGFET Characterization 1. Graphene-Electrolyte Modeling Interface Capacitance Immersion of graphene in an electrolyte results in the accumulation of ions at the graphene surface due to differences in electrochemical potentials. This phenomenon is termed an electric double layer. The capacitance of the electric double layer is large enough that accurately modeling the graphene-electrolyte interface capacitance requires inclusion of the graphene quantum capacitance. Quantum capacitance is proportional to the density of states and can serve as the limiting capacitive component for two-dimensional materials such as graphene. The graphene quantum capacitance is given by the Eqs. 3.1, 3.2 [1]. (InGI+ In*1)1/2 CQ= nG = (qVc2 (3.1) (3.2) where h is the reduce Planck constant, VF is the Fermi velocity, nG is the carrier concentration induced by the gate voltage, n* is the effective charged impurity concentration, and Ve is the electric potential of the graphene channel. Experimental data shows that the graphene-electrolyte interface capacitance, CTOP,EXP, may be modeled using a parallel plate capacitor, CEDL,EFF, in series with the graphene quantum capacitance, CQ. As a hydrophobic material, graphene repels aqueous electrolytes resulting in what may be modeled as an angstrom-scale gap between the electrolyte and graphene surface. This forms a parallel plate capacitor, which reduces the complex voltage-dependence capacitance typical of electric double layers. This effect was previously measured and modeled and is reproduced for this work [2]-[4]. Experimental data also includes a parallel capacitive component due to device leads, Co. The interface capacitance is measured at 100 Hz with an Ag/AgCl reference electrode using a Gamry Reference 600 potentiostat. The measurement was taken in 1M aqueous NaCl. The measured data is fit to the capacitive model using the Levenberg-Marquardt algorithm from the MATLAB optimization toolbox (Fig. 3.2). The data confirms the applicability of the interface capacitance model in the current-voltage graphene EGFET model. 27 10k C C0 - IU 4- CU C 0 CQ - Q CEDLEFF -- 2-2 TOPSIM CoPx TOP,EXPEDL,EFF C -1.5 -1 0.5 0 -0.5 1 1.5 2 VG - VIRAC (V) Fig. 3.1: Capacitive components comprising the overall graphene-electrolyte interface capacitance. Fig. 3.2: Simulated versus experimental top-gate capacitance for a graphene SGFET on Si02. The device has W/L = 40Vm/40im where the center 20im is unpassivated. CEDL,EFF = 8.8RF/cm 2, n* = 1.0x1011 . /cm 2 , Co = 11.3 pF/cm2 2- Fundamental Current-Voltage Graphene EGFETs Model for A number of models have been developed to study and predict the behavior of metal-oxide-gated graphene FETs [5]-[10]. Little work, however, has been reported for graphene electrolyte-gated FET models [11]. Electrolyte-gated graphene FET models represent an increase in complexity over metal-oxide-gated graphene FETs because the top-gate capacitance cannot be considered constant. The top-gate capacitance of graphene EGFETs, which is comprised of the electrical double layer capacitance and graphene quantum capacitance, varies as a function of ionic species, ionic concentration, and also spatially along the graphene channel [1], [12]. The current at any given position along the channel is determined by the product of the carrier concentration and the carrier drift velocity, which is scaled appropriately by the elementary charge and channel width. This principle combined with current continuity enables calculation of the graphene EGFET current and the corresponding channel potential profile. Fig. 3.3 depicts a typical layout for a graphene EGFET. Substrate Passivation Graphene S/D Contact Fig. 3.3: Graphene SGFET structure with mostly passivated source and drain regions. 28 The channel current is given by the following equation. IDS = (3.3) q W n Vdrift where q is the elementary charge, W is the channel width, n is the carrier concentration, and Vdrift is the carrier drift velocity. The drift velocity may be rewritten. vdrift = (3.4) dV where y is the carrier mobility, and V is the channel potential which is a function of position. This model assumes carrier mobility is equal for holes and electrons and independent of the carrier concentration. The carrier concentration is a function of potential and is given by the following equation. n(V) ~ no + [CTop(V)[VGS,TOP - V - Vo]/q] 2 (3.5) where no is the minimum carrier concentration [13], [14], CTOP is the top-gate capacitance, VGS,TOP is the applied top gate voltage, and V is the potential along the channel. V, represents the potential at the Dirac point. VO = VGOS,TOP + COCP(VvS,BACK - VGS,BACK) (3.6) are the locations of the Dirac point as experimentally determined from top gating and back gating, respectively. CBACK is the back-gate capacitance. The majority of graphene EGFETs - including the ones examined in this work - are fabricated on thick insulating substrates to provide structural support and ensure the measured source-drain current stems solely from the graphene channel. As a result, the back gate capacitance is far less the than top gate capacitance, which is typically several pF/cm 2 . The equation for threshold voltage can then be simplified to the following. VGOS,TOP and VGOS,BACK VO = VGOS,TOP (3.7) Including the effects of saturation velocity and contact resistance produces the following equation describing the channel current. Contact resistances are assumed symmetric. It is also important to note that chemical and biological sensors employing graphene EGFETs are typically be biased at low voltages to avoid the undesirable reduction of chemical species in the solution. Because of this, carrier drift velocity is typically well below the saturation velocity. Saturation velocity is included nonetheless for completeness. 29 W VDS-IDSRC qp I 2 ri~~ *o+[CTOP(V)LVGS,TOP-V-V]/q) dV (3.8) - IDS DSDSRC 1+I Lv sa c) Because the top-gate capacitance is a function of potential, this equation cannot readily be integrated. As a result, a numerical equation describing the channel potential profile is employed where h represents the step width. h-IDS [1I(VDQS-2QDSRC)j] I (LVsat 0O-x <L + V(x + h) = V(x) q iW n+[CTOP (VGS,TOP--V(x)-Vo )VGS,TOP -V(x)-VO]/q)2 (3.9) The graphene EGFET channel current problem may be reformulated as a root finding problem and solved using the bisection method. This is a robust method with guaranteed convergence provided that the initial bounds span the solution and that the solution is unique. The following pseudocode describes the bisection method and its adaptation to the EGFET current and channel potential problem. Bisection Method Pseudocode Graphene EGFET Problem Pseudocode XLOW < XROOT < XHIGH 'DS,LOW < 'DS < 'DS,HIGH XMID = 0.5 IDSMID (XLOW + XHIGH) while(f(XMID) > Error Tolerance) if(f (XLOW) *f(XMID) < 0) = 0.5 (IDS,LOW + while(VDS,ERROR (DS,MID) (XMID) -f (XHIGH) IDS,HIGH <0 0.5 (XLOW + XHIGH) (DS,MID) 'DS,LOW IDSMID = <0) 'DSMID if(VDS,ERROR(IDS,MID) 'VDS,ERROR(LDS,HIGH) XLOW = XMID XMID = > Error Tolerance) if(VDSERROR (lDS,LOW) -VDS,ERROR XHIGH = XMID Wf IDS,HIGH) = <0) 'DS,MID 0-5 (IDS,LOW + IDS,HIGH) is initialized to zero. IDS,HIGH is initialized to the maximum possible channel current value. IDS,MID is then calculated and employed as the initial guess for IDS. Based on the IDS guess, the channel potential profile may be calculated. The first and last points of the profile are used to calculate VDS. If the calculated VDS is greater than the VDS input parameter, the IDS guess was too large and must be revised to a smaller value. Similarly, if the VDS value is smaller than the VDS input parameter, then the IDS guess was too small and must be revised to a larger value. IDS,LOW Application of the bisection method algorithm causes the simulation to converge towards the unique solution where channel current IDS and channel potential profile V(x) are in agreement. The solution obtained possesses some VDS and IDS error less 30 than the user-specified maximum tolerable errors. The IDS error tolerance exit condition is omitted from the pseudocode for simplicity and ease of illustration. 3- Current-Voltage Model for Graphene EGFETs with Heterogeneous Top-gate Capacitance The ability to model heterogeneous top-gate capacitances is important for cases where source/drain region passivation extends into the channel region. This common practice is used to ensure complete passivation of the source/drain regions and minimize leakage current (Fig. 3.4). The importance of modeling heterogeneous top-gate capacitances is not limited to the study of passivation schemes. This model also applies to the study of electrogenic cells, which due to their uncontrolled positioning may cover only a portion of the graphene channel. These cells act to modulate the top-gate capacitance over a limited region of the channel. From a modeling standpoint, this is equivalent to applying a thick layer of passivation in the regions unmodulated by the electrogenic cell. VGS Vs VDS IIDS RC I R, 0 Si SiO2 = Polyimide x1 L R RG(X) x2 : RC L Ti/Au/Pt L JGraphene =J SU-8 =l Electrolyte Fig. 3.4: Graphene EGFET with heterogeneous top-gate capacitance due to non-self-aligned completely passivated source and drain regions. Splitting the channel into regions corresponding to the different top-gate capacitances yields the following piecewise numerical channel potential equation: 31 h-IDS j1 V(x) + P(VDS-21DSRC~j 0 < X< X 12 IILvsat,p qppW no p+[CTOP,PASS(V)[VGS,TOP -V(x)-Vo]/q 2 h-IDS 14 R(VDS-21DSRC~j V(x + h) = V(x) + 'I+I vDsa ) x1 x x 2 qpwjno+[CTOP(V)[VGS,TOP-V(x)-Vo]/q) h-IDS 1+I V(x) + (VDS-21DSRC Lvsat,p 0 S,TO P - V(x) - VO]/q) q p~ np[TP,P AS S(V) [VG X2 < X< L (3.10) where ptp is the graphene mobility in the passivated regions, no,p is the minimum carrier concentration in the passivated regions, and CTop,PAss(V) is the top-gate capacitance in the passivated regions. Alternatively, one can realize that the passivated graphene regions may be modeled as an additional series resistance described by the following equation. R1 (3.11) - qlpp jn,p+[CTOP,PASS(V)[VGS,TOP-V(x)-Vo]/q 2 W For the typical case where the passivation regions possess a very small capacitance of nF/cm 2 , the equation for the passivation series resistance can be simplified to a constant. Rp ~ q I pp no,p (3.12) W This produces the following revised form of the graphene EGFET channel current equation. It now becomes evident that introducing passivation into the graphene channel regions acts to increase the overall series resistance. 1+ V(x + h) = V(x) + h-IDS VDS-2IDS(RC+Rp)1 Lvsat 1 x, x 5 x2 (3.13) qpwjnf+[cTOP(V)[VGS,TOP-V(x)-Vo]/q 4- Minimum Conduction Point The location of the minimum conduction point, also known as the Dirac point, is a key parameter in the current-voltage characteristic. It marks the transition from negative to positive transconductance and approximates VGS,TOP, which provides a 32 measure of graphene doping. With this in mind, it is important to develop an understanding of what value of VGS produces the minimum value of IDS. This particular value of VGS is defined as VDIRAC. To analytically arrive at an equation for VDIRAC and gain an understanding of the parameters that determine the location of VDIRAC, a simplified EGFET equation is employed where series resistance and velocity saturation are neglected. IDS-- q -'0 WfVS n01+ [CTOP(V)[VGS,Top - V - Vo]/q] 2 dV (3.14) The following derivation of VDIRAC stems from the realization that the integral is minimized when the minimum of n(V) falls precisely in the center of the integration bounds. In other words, IDS is minimized when min(n(V)) = n(VDs/ 2 ). n(V) 0 Vos/2 VDS Fig. 3.5: IDS integral geometry to illustrate IDS minimization when the n(V) minimum occurs at the center of the integration bounds. The minimum of n(V) occurs when V = VGS,ToP - V0 . For the simplest case where VDS is very small and Vo = 0, if V = VGS,TOP the graphene potential is equivalent to the applied potential VGS,TOP. Thus no voltage bias is applied to the graphene and the total carrier concentration is equal to the minimum graphene carrier concentration. Alternatively, the location of the n(V) minimum can be obtained by setting the derivative of n(V) with respect to V equal to zero. dn _ CTOP(VDIRAC-v-Vo)/q d jno+[CToP(VDIRAC-V-Vo)/q] VDIRAC - V - Vo = 0 = 0 (3.15) (3.16) Recall that IDS is minimized when the minimum of n(V) is located in the center of the integration bounds. Thus V = VDs/2. VDIRAC = Vo + 2 (3.17) 33 The slope between the VDIRAC and VDS should be roughly equal to . In addition, VO may be extrapolated by tracing the minimum conduction point to VDS = 0 V. 5- Fitting the Model to Experimental Data The graphene EGFET model is fit to experimental data obtained from a device with dimensions W/L = 40pim/30pm and recessed passivation. The device was measured using Pt wire pseudo-reference electrode. An aqueous electrolyte consisting of 100 mM NaCl was selected because of its symmetry and similarity to physiological osmolarity. The data is fit using bounded simulated annealing from MATLAB's optimization toolbox as shown in Figs. 3.6-3.9. The extracted device parameters and sensitivity analysis are provided in Tables I and II, respectively. The data is acquired by sweeping VGS from -0.2 to 1.2 V and VDS from 10 mV to 300 mV. The experimental and simulation step size is 10 mV for both VGs and VDS. The VGS step rate was 500 ms per 10 mV. In addition, a ten second hold time was allotted when resetting VGS from 1.2 V to -0.2 V and incrementing VDS by 10 mV. Further increasing the hold time and decreasing the sweep rate had little effect on the measured IV curves meaning sufficient time was given for the ions to redistribute and for the electric double layer to reach steady state. The mean percent error for the entire data set is 2%. Transconductance, output impedance, and intrinsic gain may be computed from the current-voltage characteristic using finite differences (Figs. 3.10-3.15). TABLE Parameters VGS,ToP no I: SIMULATED ANNEALING EXTRACTED PARAMETERS Extracted Reported 560 mV N/A 2.4x10 12 /cm 2 2x1011 - 4x10 12 /cm 2 /cm 11.5kn m 2.1xlO1 2 [5], [14] [15] [1], [2], [16] 300 cm /V.s > 3 pF/cm 2 451 cm /Vs 9.6 [iF/cm 2 CEDLEFF n* Rc 2 2 2 p References 2x10 1 1 - 4x10 12 /cm 2 [5], [14] -- -- TABLE 1I: SENSITIVITY ANALYSIS Extracted Values Parameters 560 mV 2.4x101 /cm 2 451 cm 2/Vs 9.6 iF/cm 2 VGS,TOP no CEDLEFF 2.1x1012 /cm 2 n* R 1 11.5 kQ pm Mean Errorfor Mean Error for 1.O*Parameter 0.9*Parameter 1.22pA 1.22pA 1.22ptA 1.224A 1.22pA 1.22piA (2.06%) (2.06%) (2.06%) (2.06%) (2.06%) (2.06%) 10.1 pA 1.48pA 5.58pA 2.84pA 1.26ptA 5.03pA (12.3%) (2.23%) (6.11%) (3.27%) (2.12%) (4.96%) Mean Errorfor 1.1*Parameter 9.84pA 1.53 jA 5.45pA 2.76 pA 1.21 pA 4.30ptA (13.6%) (3.00%) (6.78%) (3.3 1%) (2.07%) (4.14%) 34 1300 300 200 200 0 0 --- VGS exp = mV ---VGS sim = mV -VGS = 200 mV VGS Sim = 200 mV --VS 240m VGS sxm = 400 mV VG x mV exp 00 -VG VG i 00 MV-00 x= mV - --VGS sim = 1400 mV-- VGS =8100 mV 00 0 exp 100 0 0.2 0.4 0.6 0.8 VGS (V) 0 1 2 . -0.2 03 0.25 0.2 0.15 VDS (V) 0.1 0.05 Fig. 3.7: Experimental (solid) and simulated (dashed) current versus VDs data. VGs varies from 0 mV to 1000 mV in increments of 200 mV. Fig. 3.6: Experimental (solid) and simulated (dashed) current versus VGs data. VDS varies from 50 mV to 300 mV in increments of 50 mV. 350 0.3 300 0.25 250 3 50 mal 3 50 2' 50 0.2 S0.1E 1' 50 150 0.1 100 0 0.2 0.6 0.4 VGS (V) 0.8 1 -0.2 1.2 g5 0 0.2 0 1.2 1 0.8 0.6 0.4 VGS (V) Fig. 3.9: Simulated data for current as a function VDs and VGs. Fig. 3.8: Experimental data for current as a function of VDs and VGS. 0. 00 0.05 50 -0.2 10 5 0. I5 E -5 0. J;. 02 0. 0 AW15 0 0 1 -5 -10 -0.2 0 0.2 0.4 0.6 VGS (V) 0.8 1 of 10 0.251 0.2 0.1 0 2 200 00j 0 i -10 -0.2 1.2 0.2 0 1 0.8 0.6 0.4 VGS (V) 1.2 Fig. 3.10: Experimental transconductance data as a Fig. 3.11: Simulated transconductance as a function function of VDs and of VDs and VGS- VGS- 0.3 250 0. 0.2 150cc 100 50 0 0.2 0.4 0.6 VGS (V) 0.8 1 1.2 Fig. 3.12: Experimental output impedance data as a function of VDs and VGS. 150 > E -0.2 200 0.25411U 200 0 00 m m U)0.15 100 0.1 0.05 -0.2 E 50 5 A 0 0.2 0.6 0.4 VGS (V) 0.8 1 1.2 Fig. 3.13: Simulated output impedance as a function Of VDS and VGS. 35 0.3 0.25 2.5 0.2 1.5 0. 0.25 2 C)0.15 0.5 0 0.05 -0.5 -0.2 0 0.2 0.4 0.6 VGS (V) 0.8 1 1.5 0.2 > 0.1 2 1.2 Fig. 3.14: Experimental intrinsic gain data as a function of VDs and VGS. u)2 0.15 -0.5 00.1. 0 0.05 -0.2 -0.5 0 0.2 0.4 0.6 VGS (V) 0.8 1 1.2 Fig. 3.15: Simulated intrinsic gain as a function of VDS and VGs. 6- Passivation Scheme Comparison The graphene EGFET model (Eq. 3.13) shows that increasing the degree of channel passivation increases the total series resistance. Large series resistance translates into diminished transconductance and decreased sensitivity. Optimal graphene EGFET designs should therefore eliminate the need for passivation in the channel region. Recessed channel passivation, however, directly exposes source and drain contacts to the electrolyte, which may result in large leakage currents. Excessive leakage current may be avoided by minimizing the exposed area and using a sourcedrain metal such as platinum, which possesses wide electrochemical potential window in aqueous NaCl electrolytes (Figs. 3.16, 3.17). Platinum's high chemical stability and biocompatibility also make it well suited for chemical and biological sensing applications. Devices with and without partial channel passivation were fabricated on the same die and compared (Figs. 3.18 - 3.21). The electrolyte is 100 mM aqueous NaCl and the graphene EGFET channel dimensions are W/L = 40pum/30ptm. Graphene EGFETs with recessed channel passivation were found to produce roughly four times higher transconductance (Figs. 3.22 - 3.25). Experimental data shows devices with recessed passivation also may be biased over a wider range of VGS values while still producing near-optimal transconductance. Output impedance data is provided in Figs. 3.26, 3.27. Devices with recessed channel passivation also produce higher intrinsic gain (Figs. 3.28, 3.29). This stems from the reduced series resistance of devices with recessed passivation. The effect of series resistance on intrinsic gain is examined in detail in the subsequent section. As expected, gate leakage current increases in devices with recessed channel passivation, but remains negligible in comparison to the channel current. Lastly, the dependence of VDIRC on VDS described by Eq. 3.17 is verified (Figs. 3.30, 3.31). 36 0.3 0. 2 20 3 15 0.2 2 0.1 0.1w 0.05 0 0.2 0.4 0.6 VGS (V) U.0 40 0.6 0.4 VGS (V) 1.2 1 0.8 Fig. 3.17: Gate leakage current as a function of and VDS for a device with recessed passivation. 120 60 0.2 0 -0.2 1.2 I Fig. 3.16: Gate leakage current as a function of VGS and VDS for a device with partial channel passivation. 80 5 0 -0.2 100 10C U0.15 ) 0.15 -VDS -VDS 300- VGS = 50 mV = 100 mV -VDS = 150 mV VDS =200 mV 250 -VDS = 50 mV = 100 mV -VDS = 150 mV -VDS -VDS=200mV -VDS = 250 mV VDS = 300 mV 0 -VDS = 250 mV _VDS =300 mV 200 150 100 50 20 0 -0.2 0.2 1 0.8 0.6 0.4 VGS (V) 1.2 0.2 0.6 0.4 VGS (V) 1.2 1 0.8 Fig. 3.19: Current-voltage data for a device with recessed passivation. Fig. 3.18: Current-voltage data for a device with partial channel passivation. 0.: 120 0.2! 0 -0.2 100 0.3 350 0.25 300 250 0.2 200< 80 =L 0.15 60 l0. 15 0.1 40 0.1 0.05 20 0.05 -0.2 0 0.2 0.4 0.6 VGS (V) 0.8 Fig. 3.20: Channel current as a function of VGS and VDS for a device with partial channel passivation. 100 50 0.2 0 -0.2 1.2 1 150 0.6 0.4 VGS (V) 0.8 1 1.2 Fig. 3.21: Channel current as a function of VGs and for a device with recessed passivation. VDS 100 400 50 : 200- ca = 50 mV = 100 mV = 150 mV = 200 mV -VDS = 250 mV m 8 50 -VDS -VDS -- VDS - VDS E --100L -0.2 C E - -2 0 -VDS =510m V D S =50 m V -VDS =100 mV =1250 mV -VDS =2300 mV 0- -00-VDS VDS =300 mV l 0 0.2 0.6 0.4 VGS (V) 0.8 1 1.2 Fig. 3.22: Transconductance versus VGs for a device with partial channel passivation. -602 0 0.2 0.4 0.6 VGS (V) 0.8 1 1.2 Fig. 3.23: Transconductance versus VGS for a device with recessed passivation. 37 0.3i I 2 10 0.25 : 5 0.2: 0. 0 0. 11 0.051 -0.2 0 0.2 0.4 0.6 VGS (V) E 0 0.1 C C/) -1 0. -5 -2 0.0 -10 0 VGS (V) Fig. 3.24: Transconductance as a function of VGS and VDS for a device with partial channel passivation. Fig. 3.25: Transconductance as a function of and VDS VGS for a device with recessed passivation. 0. 140 250 0. 0.2,' 130 200 120 E a 110 0.1 100 100 0.0 -0.2 150 90 0 0.2 0.4 0.6 VGS (V) 0.8 1 50 -0.2 1.2 Fig. 3.26: Output impedance as a function of VGS and VDS for a device with partial channel passivation. 0 0.2 1.2 1 0.8 0.4 0.6 VGS (V) Fig. 3.27: Output impedance as a function of and VDS for a device with recessed passivation. VGS 2.5 0.2 0. 0. 2 1.5 (I) > 0: ' 0.1 0.5 -0.1 0 -0.2 |1 2 -0.5 -0.2 VGS (V) Fig. 3.28: Intrinsic gain as a function of VGS and VDS for a device with partial channel passivation. -VDIRAC 0.2 1.2 1 0.8 0.6 0.4 VGS (V) Fig. 3.29: Intrinsic gain as a function of VGS and VDS for a device with recessed passivation. 0.75 0.75 0 0 -VDMR AC = 0.53771*'VDS + = 0.50968*VDS + 0.57733 0.54632 0.7- 0.7- 0.65 C-) 0.655 S0.6- 0.5 5- 0. 5 ' 00.05 0.1 0.1 0.2 VDS (V) - -0 25 - 0.6 0.3 0.35 Fig. 3.30: Dirac point as a function of VDS for a device with partial channel passivation. 0 00 .5 02 VDS (V) 02 Fig. 3.31: Dirac point as a function of device with recessed passivation. 0.35 VDS for a 38 7- Performance Optimization for Electrogenic Cell Sensing EGFET performance trends are investigated using the parameters extracted for our polyimide substrate process. Electrogenic cell sensing and more specifically neuronal action potential sensing is chosen as a specific application for device optimization. This sets the maximum channel width to 10 im, which is roughly the diameter of a mouse hippocampal neuron. Channel widths greater than the neuron diameter result in only partial channel modulation and sub-optimal sensitivity. Channel current is then computed as a function of VGS and VDS while varying the channel length by several orders of magnitude. Given a maximum VDS of 1 V and VGS range from -0.2 to 1.2 V, the graphene EGFETs are shown capable of intrinsic gains of 9 V/V. 10' 10 8 10 10 10 10, 101 10010 4 10 / 2 10 100 10 2 ) 10 103 1 103 1 0 14J 01 10 Fig. 3.32: Simulated maximum intrinsic gain and current consumption versus channel length. 10' 0 100 10 L (pm) 102 103 Fig. 3.33: Simulated transconductance output impedance versus channel length. 10 and The gain versus channel length plot depicts an important trait: graphene EGFET intrinsic gain is virtually independent of channel length. This behavior is apparent for larger channel lengths, where the effect of contact resistance is negligible. Intrinsic gain only begins to roll off at lower channel lengths because of decreasing transconductance due to contact resistance. This reduction in transconductance occurs because at short channel lengths, the contact resistance flattens out the current-voltage characteristic. With this understanding, the intrinsic gain curve can be shifted left to produce constant intrinsic gain across an even larger range of channel lengths by reducing contact resistance. An alternative to maximizing the intrinsic gain is to focus on optimizing EGFETs with matching graphene performance and transconductance for the two-stage model signal the small 3.34 depicts Fig. transresistance amplifiers. amplifier circuit. The voltage gain for the circuit is given by Eq. 3.18. 39 R+ I + gmv, Vg ro Ri i' Ki - RL V + +in Output Stage Fig. 3.34: Graphene EGFET small signal model with transresistance output amplifier stage. G = rV)(K=K _( ( gmr+R Vin (3.18) R) RL+Ro where G, is the overall voltage gain, vin is the small signal gate voltage, vout is the small signal output voltage, g. is the graphene EGFET transconductance, ro is the graphene EGFET output impedance, Rin is the input impedance of the second stage, K is the gain of the second stage, R0 is the output impedance of the second stage, and RL is the load impedance. Given a fixed process technology, the most straightforward way to increase transconductance in graphene EGFETs is to increase the W/L ratio. For certain applications such as electrogenic cell sensing, the maximum width is dictated by cell diameter. The only means to optimize transconductance then becomes channel length reduction. As seen previously, this works to a limited extent. As the channel length becomes infinitesimal, the entirety of the drain-source voltage drops across the contact resistances leaving no current to be modulated by the graphene region. Figs. 3.35, 3.36 depict the transconductance behavior as a function of channel length along with the corresponding current consumption. 50 10 3 40 103 30 - 0 102 102 0 10 10 10 10 0 -0.2 20 10 100 -50 100 0 0.2 0.4 0.6 0.8 VGS (V) 1 1.2 1.4 -5 Fig. 3.35: Simulated transconductance as a function of channel length for VDS = 100 mV. 010 -0.2 0 0.2 0.4 0.6 0.8 VGS (V) 1 1.2 1.4 Fig. 3.36: Simulated current versus channel length for VDS = 100 mV. For the flexible polyimide substrate process and a set channel width of 10 Im, the optimal channel length is around 5 km. This unintuitive and rather modest W/L ratio demonstrates the utility of graphene EGFET models in sensor design. Fig. 3.35 also reveals that slightly longer than optimal channel lengths provide transconductance performance over a broader VGS range. Substantially shorter channel lengths, on the other hand, only serve to restrict the range of acceptable VGS biases and increase power consumption. 40 Sensor designs focusing on high transconductance sensors coupled with transresistance amplifiers also require the input impedance of the second stage to be much less than the output impedance of the first stage. Using the developed model, the graphene EGFET output impedance can be readily determined enabling appropriate design of the second stage amplifier. 8 0.8 50.66 > 0.4 4 0.2 -0.2 0 0.2 0.4 0.6 0.8 VGS (V) 1 1.2 1.4 1 1.6 2 Fig. 3.37: Output impedance as a function of VGS and VDS for a graphene SGFET with W/L = 10 ptm/5 gm. References [1] J. Xia, [2] L. H. Hess, M. V. Hauf, M. Seifert, F. Speck, T. Seyller, M. Stutzmann, I. D. Sharp, and J. A. Garrido, "High-Transconductance Graphene Solution-Gated Field Effect Transistors," Appl. Phys. Lett., vol. 99, no. 3, p. 033503, 2011. [3] N. Schwierz, D. Horinek, and R. R. Netz, "Reversed Anionic Hofmeister Series: The Interplay of Surface Charge and Surface Polarity," LangmuirACSJ. surfaces colloids, vol. 26, no. 10, pp. 7370-9, May 2010. [4] S. Birner, "Modeling of Semiconductor Nanostructures and Semiconductor Electrolyte Interfaces," 2011. [5] 1. Meric, M. Y. Han, A. F. Young, B. Ozyilmaz, P. Kim, and K. L. Shepard, "Current Saturation in Zero-Bandgap, Top-Gated Graphene Field-Effect Transistors," Nat. Nanotechnol., vol. 3, no. 11, pp. 654-9, Nov. 2008. [6] 1. J. Umoh, S. Member, T. J. Kazmierski, S. Member, and B. M. Al-hashimi, "A Dual-Gate Graphene FET Model for Circuit Simulation - SPICE Implementation," IEEE TranactionsNanotechnol., vol. 12, no. 3, pp. 427-435, 2013. - F. Chen, J. Li, and N. Tao, "Measurement of the Quantum Capacitance of Graphene," Nat. Nanotechnol., vol. 4, no. 8, pp. 505-9, Aug. 2009. 41 [7] M. Magallo, C. Maneux, H. Happy, T. Zimmer, and S. Member, "Scalable Electrical Compact Modeling for Graphene FET Transistors," IEEE Tranactions Nanotechnol., vol. 12, no. 4, pp. 539-546, 2013. [8] V. Ryzhii, M. Ryzhii, A. Satou, T. Otsuji, and N. Kirova, "Device Model for Graphene Bilayer Field-Effect Transistor," J. Appl. Phys., vol. 105, no. 10, p. 104510, 2009. [9] H. Wang, S. Member, A. Hsu, J. Kong, D. A. Antoniadis, and T. Palacios, "Compact Virtual-Source Current-Voltage Model for Top- and Back-Gated Graphene Field-Effect Transistors," IEEE Trans. Electron Devices, vol. 58, no. 5, pp. 1523-1533, 2011. [10] D. Jimenez, "Explicit Drain Current, Charge and Capacitance Model of Graphene Field-Effect Transistors," IEEE Trans. Electron Devices, vol. 58, no. 12, pp. 4377-4383, 2011. [11] E. F. Transistors, C. Mackin, L. H. Hess, A. Hsu, Y. Song, J. Kong, J. A. Garrido, and T. Palacios, "A Current-Voltage Model for Graphene Electrolyte-Gated Field-Effect Transistors," IEEE Trans. Electron Devices, vol. 61, no. 12, pp. 3971-3977, 2014. [12] M. Kilic, M. Bazant, and A. Ajdari, "Steric Effects in the Dynamics of Electrolytes at Large Applied Voltages. I. Double-layer Charging," Phys. Rev. E, vol. 75, no. 2, p. 021502, Feb. 2007. [13] J. Martin, N. Akerman, G. Ulbricht, T. Lohmann, J. H. Smet, K. von Klitzing, and A. Yacoby, "Observation of Electron-Hole Puddles in Graphene using a Scanning Single-Electron Transistor," Nat. Phys., vol. 4, no. 2, pp. 144-148, Nov. 2007. [14] S. Adam, E. H. Hwang, V. M. Galitski, and S. Das Sarma, "A Self-Consistent Theory for Graphene Transport," Proc. Natl. A cad. Sci. U. S. A., vol. 104, no. 47, pp. 18392-7, Nov. 2007. [15] B. Mailly-Giacchetti, A. Hsu, H. Wang, V. Vinciguerra, F. Pappalardo, L. Occhipinti, E. Guidetti, S. Coffa, J. Kong, and T. Palacios, "pH Sensing Properties of Graphene Solution-Gated Field-Effect Transistors,"J. Appl. Phys., vol. 114, no. 8, p. 084505, 2013. [16] H. Ji, X. Zhao, Z. Qiao, J. Jung, Y. Zhu, Y. Lu, L. L. Zhang, A. H. MacDonald, and R. S. Ruoff, "Capacitance of Carbon-Based Electrical Double-Layer Capacitors," Nat. Commun., vol. 5, p. 3317, Jan. 2014. = C Ot xax] 42 Chapter 4 - Graphene EGFET Applications 1. pH Sensing A number papers exist describing pH sensitivity of graphene field-effect transistors (FETs). pH sensitivity for graphene FETs is typically measured by the shift in Dirac point per unit change of pH. The reported pH sensitivities range anywhere from 18 mV/pH to above 99 mV/pH [1]-[5]. The shift in Dirac point versus pH can be understood through the Nernst-Planck equation [6]. This equation is essentially a drift-diffusion equation for electrolytes. The Nernst-Planck equation states that total ion flux is due to diffusion, drift from electric fields, and convection. The convection term is zero for many pH sensing applications and is omitted. Oc= Ji = -Di a- p.cjzjF 7 (4.1) where ci is the ion concentration,J is the ion flux, Di is the ion diffusivity, Yj is the ion mobility, zi is the ion charge number, F is the Faraday constant, and V) is the electric potential. The Einstein relation describes the relationship between ion diffusivity and mobility. (4.2) = RT where R is the gas constant, T is the temperature. equation to be rewritten as the following. This allows the Nernst-Planck [RT Lc-' + cizi F = -pi (4.3) This Nernst-Planck equation can then be further rewritten from the perspective of charged species moving along potential gradients. Ji oc Vpi (4.4) where p traditionally represents what is termed the electrochemical potential. -pac RT= T In (c1 ) + zLF L (4.5) The electrochemical potential must have the following form in order to satisfy the original Nernst-Planck equation. 43 p t== j (4.6) In (ci) + where pf is a constant potential term. Whenever an electrode such as graphene is brought into contact with an electrolyte an interface potential develops. This occurs because the electrode possesses a different electrochemical potential from that of the electrolyte. The electrochemical potentials are given by the following equations. ISeiectrode flelctrde =Ipiectrode + -In Peectode zF fleiectrolyte = Itelectrolyte + (Celectrode) (4.7) In (celectrolyte) (4.8) The yo parameter is a constant that is independent of ionic concentrations. Electrochemical potentials may be converted to electric potentials by dividing by Faraday's constant and the appropriate charge number. (4.9) zF zF To determine the magnitude of the interface potential drop, subtract the two potentials. electrode-~electroyte - Aelectrode~Ielectrolyte +RT zF zF In Celectrode \Celectrolyte) (4.10) The first term, which is independent of ion concentration, may be combined to yield the Eq. 4.11. The concentration of a solid electrode is equal to unity. 4'electrode-+electrotyte 4electrode-+electrolyte = = V) + - (4.11) In i'o + 2.3 ZFT log(1\Celectrolyte/ (4.12) Thus it becomes evident that the interface potential is a function of ion concentration. This equation applies to any solid-electrolyte interface. pH is defined as pH = -log (cH+), where CH+ is the concentration of hydronium. The electrode-electrolyte interface potential equation may then be rewritten as Eq. 3.13. For monovalent ions at room temperature, the potential slope is ideally around 58.8 mV/dec. 4'electrode-+electrolyte = 4'6 + 2.3 RT pH (4.13) It is important to note, however, that the location of the Dirac point is determined not only by the potential drop at the graphene-electrolyte interface but also by the 44 potential drop present at the gate electrode-electrolyte interface. The gate electrode-electrolyte interface potential may also be a function of pH. This is shown in Fig. 4.1 where a Pt pseudoreference electrode is measured with respect to an Ag/AgCl reference electrode. Ag/AgCl reference electrodes are known to produce a relatively constant interface potential drop with changing pH. Therefore, the change in the overall potential is largely due to the potential drop at the Pt interface. 4 --- ----0 -- 5 6 7 8 9 10 -50 s -lo-10 __ -150 --- -250 - -200 ----300 2 _ -350 -400 _ I-450 -500 pp H Fig. 4.1: Platinum electrode potential with respect to Ag/AgCl reference electrode for varying pH. A pH meter from Hanna Instruments was calibrated using a 3-point calibration and buffer solutions with pH 4, 7, and 10. The buffer solutions were then mixed to produce a range of pH solutions varying from 4 to 10 in unit increments of pH. Each buffer solution was deposited on top of a graphene EGFET and the IDS current was measured as a function of VGS and VDS repeatedly until the current-voltage characteristic stabilized. This was achieved using a Pt wire as a pseudoreference electrode. The graphene EGFET was then rinsed for thirty seconds using deionized water and the measurement was repeated using a different pH solution. The Dirac points for various VDS voltages were then extracted from the current-voltage data as a function of pH. The entire experiment was repeated twice: once going from pH 4 to pH 10 and a second time going from pH 10 to pH 4. The data from these experiments is given in Figs. 4.1, 4.2. The slopes for the two experiments were -46.7 mV/pH and -54.8 mV/pH. The data is considerably less linear in the second plot suggesting that the Dirac point should have been given more time to stabilize. 600 -VDS = 20mV -VDS = 40mV -VDS = 60mV EVDS = 8OmV VDS= 1OOmV 500 0 400 -VDS -VDS -VDS -VDS VDS 500 = 20mV = 40mV = 60mV = 80mV 100mV 40 0: '~300- 204 600 5 6 7 8 9 10 pH Fig. 4.2: Graphene EGFET Dirac point location versus pH. The slope is roughly 46.7mV/pH. 2004 5 6 7 pH 8 9 10 Fig. 4.3: Graphene EGFET Dirac point location versus pH. The slope is roughly 55.8 mV/pH. 45 2. Monitoring Real-Time Polymerase Chain Reactions One potential application for graphene EGFETs is monitoring the replication of deoxyribonucleic acid (DNA) in real-time polymerase chain reactions (RTPCR). PCR is commonly employed for DNA sequencing and for the detection of foodborne pathogens such as Escherichia coli [7], [8]. RTPCR is differentiated from simple PCR in that it allows the concentration of DNA to be monitored in real-time by optically monitoring molecules that fluoresce when attached to DNA. Performing RTPCR requires a thermocycler and several reagents: template DNA, DNA polymerase, deoxyribonucleotide triphosphates (dNTPs), primers, buffer solution, and probes. The template DNA is the double-stranded DNA being replicated. The PCR process begins with an initial denaturation step, which splits all double-stranded template DNA into single-stranded DNA by breaking the hydrogen bonds holding the two strands together. This denaturation step occurs at around 100*C. The mixture of PCR reagents is then cooled to approximately 60*C. This allows the primers to fuse to their complementary segments on the single-stranded DNA. Only once the primers are fused, can the DNA polymerase incorporate complementary nucleotides using the dNTPs to rebuild each single-stranded DNA into double-stranded DNA. Ideally, each temperature cycle doubles the concentration of DNA present within the PCR mix. RTPCR also requires a buffer solution because the DNA polymerase is only active within a limited pH range. The probes used in the following experiments are fluorescent molecules consisting of a fluorophore and a quencher. This probe binds to the DNA along with the primer molecule previously discussed. However, when the DNA polymerase passes over the probe during the extension phase, it detaches the quencher segment of the probe from the fluorophore. The quencher then diffuses away into the PCR mix. With the quencher molecule far away, the fluorophore may now fluoresce when excited by a suitable light source. This fluorescence can be detected optically and is directly proportional to the DNA concentration in real time [9]. Because PCR doubles the amount of DNA (and fluorescence) with each temperature cycle, the fluorescence increases exponentially. Eventually, however, a one of the reagents will limit the reaction and the fluorescence will saturate. This produces s-shaped curves such as the one depicted in Fig. 4.4. 46 Vic LL FAM Cycles FAM 1 FAM 40 VIC 1 VIC 40 Fig. 4.4: RTPCR experiment using FAM and VIC fluorophores for the detection of a DNA sequence associated with the inability to process clopidogrel, a common antiplatelet medication. Insets below show the increase in fluorescence for the actual PCR mix droplet over the course of the experiment. Graphene EGFETs with W/L = 100 ptm / 20 prm were fabricated on the topside of a RTPCR chip along for use in a custom thermocycler system. The RTPCR chip includes both a temperature sensor and resistive heating element (Fig. 4.5). Each graphene EGFET is surrounded by a polycarbonate well capable of storing approximately 30 pL of solution. A silicone adhesive was used to attach the polycarbonate wells to the RTPCR chip. Each well was filled with approximately 20 ptL of mineral oil to prevent evaporation of the PCR mix during the denaturation phase. A 5 iL volume of PCR mix was then micropipetted underneath the mineral oil. The RTPCR chip was then placed inside of carrier designed for the RTPCR system. Thin insulated wires were glued to large metal source drain terminals using conductive silver paste. The wires were fed outside of the thermocycler system so that a voltage VDS could be applied to the graphene EGFETs and the resulting current measured over the course of the RTPCR experiment. The bottom side of the RTPCR chip contains a resistive heating network as well as a temperature sensor. 47 Thermocycler PCR Chip Graphene FET .Graphene Ac fluSensor Resistive Heating Fig. 4.5: Graphene EGFETs fabricated on the topside of a RTPCR chip. Thin insulated wires are adhered to large source-drain pads using silver paste. The RTPCR chip may then be inserted into the thermocycler using the grey button (left), which opens the system. The lid contains all of the optical excitation and detection systems. At present, RTPCR systems rely on optical systems along with fluorescent chemistries to detect DNA replication. The use of graphene EGFETs to detect DNA replication could reduce both the size and complexity of the PCR system by eliminating the need for optical detection systems as well as fluorescent chemistries. A graphene EGFET approach relies on fine-tuning the PCR buffer mix and correlating pH changes to changing DNA concentrations [10]. This is possible because DNA chain extension is accompanied by proton release (Fig. 4.6) and because graphene has been shown to exhibit pH sensitivity. B4 B3 8I B3 82 B2 08B1 + H P_0 OH B4 --- 0P4 1 OH U =U 0- P =0 dNTP DNA primer to be extended + O-P-O Extended DNA chain OH H+ proton + 4 P2 7 pyrophosphate Fig. 4.6: DNA extension chemistry illustrating the incorporation of nucleotide bases and subsequent proton release. Deoxyribonucleotide triphosphates are abbreviated as dNTP. The graphene EGFET channel current was recorded for an RTPCR experiment using just mineral oil as a control run. This run determined to what extend the graphene channel conductivity would be modulated by changes in temperature only (Fig. 4.7). The sharp changes in the graphene EGFET current represent the denaturation phase of each cycle. Therefore, the graphene EGFET covered with mineral oil produced higher currents at lower temperatures. The overall baseline current remained relatively stable. Once the PCR mix was added underneath the mineral oil, the graphene EGFET channel current dropped markedly. The denaturation phase now results in an increase in channel current. The reverse in behavior of the channel current combine with the dramatic drop in the baseline current, suggests that the Dirac point was shifted by the introduction of the PCR mix. Unfortunately, the baseline current of the EGFET with PCR mix did not change with the increased concentration of DNA. This led to the conclusion that RTPCR did not release enough protons to affect the pH of the PCR mix. The PCR chemistry will requires further 48 optimization to allow the pH to change enough to shift the Dirac point but not enough to render the DNA polymerase ineffective. 2001 150 -Mineral Oil -PCR Mix E 100 Readout -Optimized 50j_"jhUILL j 0 I1 .iiW -L - 5 10 I-- 15 20 25 30 35 40 45 Time (minutes) Fig. 4.7: Graphene FET sensor readouts over the course of an RTPCR experiment for mineral oil baseline (blue), PCR mix with excessive buffer concentration (green), hypothesized readout for optimized buffer concentration (magenta). Subsequently, the Dirac point voltage was measured as a function of temperature to verify that the spikes in current in Fig. 4.7 result from changing temperatures during the PCR cycle. Changing temperatures are known to affect rate constants in chemical reactions via the Arrhenius equation. Because the PCR is a complex chemical process consisting of many reactions with different activation barriers, it makes sense that changing temperature may affect the graphene doping and therefore the location of the Dirac point. The location of the graphene EGFET Dirac point as a function of temperature is depicted in Fig. 4.8. -100r -120 E -140 5 -160 -VDS = 20 mV T-180 -200 -VDS =80 mV VDS=00 -22 h 100mV 100 90 80 70 60 50 Temperature 0C Fig. 4.8: Graphene EGFET Dirac point temperature dependence. A tungsten probe was used as a pseudoreference electrode. The average slope is approximately -0.73 mV/C. 30 40 49 3. Action Potential Sensing Action potentials are electrical signals transmitted in both the central and peripheral nervous systems. Neurons are the cells at the core of the nervous system and consist of four components: the soma, axon, synapse, and dendrite. The soma is the cell body and the axon is responsible for transmitting the action potential from the soma to the synapse. At the synapse the electrical signal is transmitted chemically to the other side of the synaptic cleft via neurotransmitters. The dendrite is then responsible for the continued propagation of the post-synaptic action potential. Action potentials may be described by four phases: a resting potential, depolarization, repolarization, and a refractory period in which hyperpolarization occurs. The neuron membrane must be depolarized beyond a certain threshold for an action potential to evolve. A changing membrane potential for an action potential is illustrated in Fig. 4.9. Action potential +40 CC -55 initiations SResting StimulusRefractory period -70 0 1 3 2 Time (ms) Fig. 4.9: Membrane potential depiction of an action potential. 4 versus state 5 time The occurrence of action potentials was initially explained and modeled by the pioneering work of Hodgkin-Huxley [11]. The essence of the Hodgkin-Huxley model can be explained by examining two ionic species: sodium and potassium. Each of these ions species possesses its own ion channels, which allow the ions to diffuse through the cell membrane. Because the extracellular and intracellular ion concentrations are not equal, the ions diffuse along concentration gradients, which in turn create an electric field across the cell membrane. At equilibrium, the force exerted by the ions due to the electric field is equal and opposite to the force exerted on the ions due to diffusion. The potentials due to each sodium and potassium ions are defined as ENa and EK, respectively. The potentials ENa and EK may be calculated II 50 using the extracellular and intracellular ion concentrations in conjunction with the Nernst equation. The model of the cell membrane as originally described by Hodgkin-Huxley is depicted in Fig. 4.10. Outside E ~~ EKRN E~. + + CM+ Inside Fig. 4.10: Hodgkin-Huxley model of a neuron cell membrane. RNa, RK, and RL represent the conductivities of the sodium, potassium, and leakage ion channels, respectively. RNa and RK exhibit voltage-dependent conductivities. ENa, EK, and EL represent the Nernst potentials due to sodium, potassium, and leakage ions. CM is the membrane capacitance [11]. Extracellular sodium concentration is greater than the intracellular sodium concentration. On the other hand, the intracellular potassium concentration is Because membrane greater than the extracellular potassium concentration. potentials are defined as the extracellular potential with respect to the intracellular potential, the sodium ions attempt to establish a negative membrane potential, ENa, whereas the potassium ions attempt to establish a positive membrane potential, EK. These two ionic species compete to define the overall membrane potential. At the resting potential, however, conductivity of the sodium ion channels is much higher than the conductivity of the potassium ion channels. Therefore the overall membrane potential is ENa, which is approximately -70 mV as determined by the sodium ion concentrations (Fig. 4.9). If the neuron receives some stimulus and becomes depolarized beyond a certain threshold, the conductivities of the potassium ion channels will temporarily become greater than conductivities of the sodium ion channels. Therefore, the membrane potential will climb to a positive value as defined by the potassium ion concentrations, EK. Eventually, the conductivities of the sodium ion channels will again become greater than the conductivities of the potassium ion channels. When this occurs, the cell membrane repolarizes with a slight over shoot and eventually 51 recovers to the resting potential, ENa. For in-depth description of voltage dependent ion channel conductivities, the reader is referred to the Hodgkin-Huxley model [11]. If a neuron is in close proximity to the gate region of a graphene EGFET and produces an action potential, the resulting change in ion concentrations alter the composition of the electric double layer at the graphene surface. This, in turn, changes the carrier concentration in the graphene channel, which results in a modulated channel current IDS. In this way, the generation of an action potential can be detected by monitoring the current of a graphene EGFET under constant bias conditions. This experimental setup is depicted in Fig. 4.11. GS reference electrode neuron Drain Fig. 4.11: Experimental gold contact Source setup for graphene EGFET as an electrogenic cell sensor. Graphene EGFET devices were disinfected by autoclaving and subsequent immersion in ethanol. Mouse hippocampal neurons were then extracted and cultured on top of graphene EGFETs. A high K+ Tyrode's solution was used to chemically stimulate neurons and generate action potentials. The current process results in a cell culture with healthy neurons as indicated by dendrite formation in Figs. 4.12, 4.13. The process, however, produced low-density cell culture with no neurons located over the graphene EGFET channel regions. Current efforts aim to increase the cell culture density so as to increase the likelihood that neurons are positioned on top of graphene EGFET channel regions. 52 Fig. 4.12: Optical microscope image of hippocampal mice neurons cultured on top of graphene EGFET device. Fig. 4.13: Optical microscope image of hippocampal mice neurons cultured on top of a second graphene EGFET device. References [1] J.-U. Park, S. Nam, M.-S. Lee, and C. M. Lieber, "Synthesis of Monolithic Graphene-Graphite Integrated Electronics," Nat. Mater., vol. 11, no. 2, pp. 1205, Feb. 2012. [2] P. K. Ang, W. Chen, A. T. S. Wee, and K. P. Loh, "Solution-Gated Epitaxial Graphene as pH Sensor,"J. Am. Chem. Soc., vol. 130, no. 44, pp. 14392-3, Nov. 2008. [3] B. Mailly-Giacchetti, A. Hsu, H. Wang, V. Vinciguerra, F. Pappalardo, L. Occhipinti, E. Guidetti, S. Coffa, J. Kong, and T. Palacios, "pH Sensing Properties of Graphene Solution-Gated Field-Effect Transistors,"J. AppL. Phys., vol. 114, no. 8, p. 084505, 2013. [4] Y. Ohno, K. Maehashi, Y. Yamashiro, and K. Matsumoto, "Electrolyte-gated graphene field-effect transistors for detecting pH and protein adsorption," Nano Lett., vol. 9, no. 9, pp. 3318-3322, 2009. [5] J. Ristein, W. Zhang, F. Speck, M. Ostler, L. Ley, and T. Seyller, "Characteristics of Solution Gated Field Effect Transistors on the Basis of Epitaxial Graphene on Silicon Carbide,"J. Phys. D. AppL. Phys., vol. 43, no. 34, p. 345303, Sep. 2010. [6] R. Brumleve, Timothy, Buck, "Numerical Solution of the Nernst-Planck and Poisson Equation System with Applications to Membrane Electrochemistry and Solid State Physics,"J. Electroanal. Chem., vol. 90, pp. 1-31, 1978. [7] J. M. Rothberg, W. Hinz, T. M. Rearick, J. Schultz, W. Mileski, M. Davey, J. H. Leamon, K. Johnson, M. J. Milgrew, M. Edwards, J. Hoon, J. F. Simons, D. Marran, J. W. Myers, J. F. Davidson, A. Branting, J. R. Nobile, B. P. Puc, D. Light, T. a Clark, M. Huber, J. T. Branciforte, 1. B. Stoner, S. E. Cawley, M. Lyons, Y. Fu, N. Homer, 53 M. Sedova, X. Miao, B. Reed, J. Sabina, E. Feierstein, M. Schorn, M. Alanjary, E. Dimalanta, D. Dressman, R. Kasinskas, T. Sokolsky, J. a Fidanza, E. Namsaraev, K. J. McKernan, A. Williams, G. T. Roth, and J. Bustillo, "An Integrated Semiconductor Device Enabling Non-Optical Genome Sequencing," Nature, vol. 475, no. 7356, pp. 348-52, Jul. 2011. [8] D. R. Pollard, W. M. Johnson, H. Lior, S. D. Tyler, and K. R. Rozee, "Rapid and Specific Detection of Verotoxin Genes in Escherichia coli by the Polymerase Chain Reaction," J. Clin. Microbiol., vol. 28, no. 3, pp. 540-545, 1990. [9] C. a Heid, J. Stevens, K. J. Livak, and P. M. Williams, "Real Time Quantitative PCR," Genome Res., vol. 6, no. 10, pp. 986-994, Oct. 1996. [10] C. Toumazou, L. M. Shepherd, S. C. Reed, G. I. Chen, A. Patel, D. M. Garner, C. A. Wang, C. Ou, K. Amin-desai, P. Athanasiou, H. Bai, I. M. Q. Brizido, B. Caldwell, D. Coomber-alford, P. Georgiou, K. S. Jordan, J. C. Joyce, M. La Mura, D. Morley, S. Sathyavruthan, S. Temelso, R. E. Thomas, and L. Zhang, "Simultaneous DNA Amplification and Detection using a pH-sensing Semiconductor System," Nat. Methods, vol. 10, no. 7, pp. 641-646, 2013. [11] A. F. Hodgkin, A. L., Huxley, "A Quantitative Description of Membrane Current and its Application to Conduction and Excitation in Nerve,"J. PhysioL, vol. 117, no. 4, pp. 500-544,1952. 54 Chapter 5 - Summary & Conclusions This thesis provides an introduction to graphene and the theory behind graphenebased electrolyte-gated field-effect transistors (EGFETs). The thesis then moves on to provide a detailed description of the graphene EGFET fabrication process and measurement setups. A current-voltage model for graphene EGFETs is then developed to better understand and optimize graphene EGFET performance. This was accomplished by combining models for metal-insulator-gated graphene FETs with models for the graphene-electrolyte interface. The developed graphene EGFET model was shown capable of producing as little 2% error in the current-voltage characteristic. The model can be used to compute other device characteristics required for circuit design such as transconductance, output impedance, and intrinsic gain. The model allows for heterogeneous top-gate capacitances, which enable the study of different passivation schemes and cases where the graphene channel is only partially modulated (e.g. partial coverage by an electrogenic cell). The model shows partial channel passivation acts to increase the overall series resistance. This was experimentally verified and graphene EGFETs with partial channel passivation were compared to those with recessed passivation. Fitting the model to experimental data represents a convenient method to estimate device parameters such as minimum carrier concentration, mobility, contact resistance, effective double layer capacitance, and charged impurity concentration. The alternative requires fabricating specialized devices and a number of different measurements (e.g. Hall, TLM, Mott-Schottky). In addition, graphene EGFETs were shown capable of substantial intrinsic gains making them suitable for use in amplifier circuits. Alternatively, graphene EGFET sensors may be optimized for transconductance performance and coupled with transresistance amplifiers. A basis for determining an optimal channel length given certain design constraints is established. Graphene EGFETs were shown also capable of substantial intrinsic gains making them suitable for use in amplifier circuits. The intrinsic gain of graphene EGFETs is shown to be virtually independent of channel length provided the effect of contact resistance remains negligible. Alternatively, graphene EGFET sensors may be optimized for transconductance performance and coupled with transresistance amplifiers. A basis for determining an optimal channel length given certain design constraints is established. The developed graphene EGFET model may now be employed for application-specific sensor optimization and as a tool to inform the design of large-scale graphene sensors systems. Lastly, this work describes several potential applications for graphene EGFETs ranging from pH sensors to real-time polymerase chain reaction (RTPCR) sensors to 55 electrogenic cell sensors. Fabricated graphene EGFETs are shown to produce pH sensitivity of -50.8 mV/pH. Graphene EGFETs are also fabricated for use in a RTPCR system. RTPCR is run successfully to identify DNA segments thought responsible for the metabolism of clopidogrel, a popular antiplatelet medication. The graphene EGFETs, however, failed to sense an increase in DNA concentration. Further optimization of the PCR buffer concentration is required to ensure that increased DNA concentration lowers the PCR mix pH without rendering the DNA polymerase ineffective. Graphene EGFETs were fabricated for electrogenic cell sensing using the optimized parameters from the newly developed graphene EGFET current-voltage model. Hippocampal mouse neurons were successfully cultured on top of the graphene EGFETs. At present, however, the graphene EGFETs are unable to sense action potentials due to the low density of the cell cultures. Current efforts aim to increase the density of neurons and improve adhesion between neurons and the graphene EGFET channel region. Chemical and optogenetic methods of neural stimulation are under current investigation.