Wei Hong
Assistant Professor
Department of Aerospace Engineering
Iowa State University, Ames, IA 50011
(515) 294-8850
whong@iastate.edu
http://www.public.iastate.edu/~whong/
Education
Ph. D.
M. S.
B. S.
B. S.
Engineering Sciences
Solid Mechanics
Engineering Mechanics
Computer Science
Harvard University, Cambridge, MA
Tsinghua University, Beijing, China
Tsinghua University, Beijing, China
Tsinghua University, Beijing, China
May 2006
June 2002
June 2000
June 2000
Employment
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July 2008 – Present, Assistant Professor, Department of Aerospace Engineering, Iowa State
University
July 2008 – Present, Assistant Professor (courtesy), Department of Materials Science and
Engineering, Iowa State University
Dec 2011 – Present, Assistant Professor (courtesy), Department of Mechanical Engineering, Iowa
State University
June 2006 – June 2008, Postdoctoral Research Fellow, Harvard University.
Research Interests
Mechanics of soft and smart materials; Fracture, deformation, and mass transport; Evolving
microstructures of materials; Continuum mechanics and computational methods; Biomechanics.
Teaching
EM 274
AE 321
EM 425
EM 516
EM 564
Statics (Fall 2008, Fall 2009, Spring 2011) AE 243 Aerodynamics I (Fall 2011)
Flight Structures Analysis (Fall 2009)
EM 324 Mechanics of Materials (Spring 2012)
Introduction to Finite Element Method (Spring 2009)
Mechanics of Deformable Solids (Spring 2010)
Fracture and Fatigue (Fall 2010, Fall 2012)
Other Affiliations
Chair, Technical Committee on Soft Materials, Applied Mechanics Division, ASME (2011-)
Vice chair, Technical Committee on Soft Materials, Applied Mechanics Division, ASME (2010-2011)
Secretary, Technical Committee on Soft Materials, Applied Mechanics Division, ASME (2009-2010)
Editorial board, International Journal of Applied Mechanics (2008- )
Editorial board, International Journal of Computational Materials Science and Engineering (2011- ).
Editorial board, International Journal of Aerospace and Lightweight Structures (2011- ).
Awards and Honors
Award of Distinction in Teaching, Harvard University, 2006
Chinese Government Award for Outstanding Students Abroad, 2005
Summa cum Laude, Tsinghua University, 2000
Invited Talks
University of Iowa (Feb 2009), Zhejiang University (May 2009), Tsinghua University (May 2009), Peking
University (May 2009), Stony Brook University (Oct 2009), University of Science and Technology of China
(May 2010), Xi’an Jiaotong University (May 2010), Cornell University (Nov 2011), University of Texas at
Austin (April 2012).
Selected Publications
[1] W. Hong, and X. Wang, Modeling mechano-chromatic lamellar gels. Phys. Rev. E 85, 031801
(2012).
[2] X. Wang and W. Hong, Pseudo-elasticity of double network gels. Soft Matter, 7, 8576-8581
(2011).
[3] X. Wang and W. Hong, Theory of Ionic Polymer Conductor Network Composite. Appl. Phys. Lett.,
98, 081910 (2011).
[4] S. J. A. Koh, T. Li, J. Zhou, X. Zhao, W. Hong, J. Zhu, and Z. Suo. Mechanisms of large actuation
strain in dielectric elastomers. J. Polym. Phys. B, 49 (7), 504-515 (2011)
[5] W. Hong, Modeling viscoelastic dielectrics. J. Mech. Phys. Solids, 59, 637-650 (2011).
[6] Z. Liu, W. Hong, Z. Suo, S. Swaddiwudhipong, Y. Zhang, “Modeling and simulation of buckling of
polymeric membrane thin film gel”. Comp. Mater. Sci. 49, S60-S64 (2010).
[7] L. E. Faidley, Y. Han, K. Tucker, S. Timmons and W. Hong, “Axial strain of ferrogels under cyclic
magnetic fields”. Smart Mater. Struct. 19, 075001 (2010).
[8] X. Wang and W. Hong, “Surface interactions between two like-charged polyelectrolyte gels”.
Phys. Rev. E, 81, 041803 (2010).
[9] R. Marcombe, S. Cai, W. Hong, X. Zhao, Y. Lapusta, Z. Suo, “A theory of constrained swelling of a
pH-sensitive hydrogel”. Soft Matter 6, 784-793 (2010).
[10] X. Tan, J. Frederick, C. Ma, E. Aulbach, M. Marsilius, W. Hong, T. Granzow, W. Jo, and J. Rödel,
“Electric-field-induced antiferroelectric to ferroelectric phase transition in mechanically confined
Pb0.99Nb0.02[(Zr0.57Sn0.43)0.94Ti0.06]0.98O3”. Phys. Rev. B 31, 014103 (2010).
[11] W. Hong, X. Zhao, and Z. Suo, Large deformation and electrochemistry of polyelectrolyte gels. J.
Mech. Phys. Solids 58, 558-577 (2010).
[12] W. Hong, X. Zhao, and Z. Suo, “Formation of creases on the surfaces of elastomers and gels”.
Appl. Phys. Lett. 95, 111901 (2009).
[13] W. Hong, Z. Liu, and Z. Suo, “Inhomogeneous swelling of a gel in equilibrium with a solvent and
mechanical load”. Int. J. Solids Struct. 46, 3282-3289 (2009).
[14] W. Hong, X. Zhao, Z. Suo, “Dryinginduced bifurcation in a hydrogelactuated nanostructure”, J.
Appl. Phys., 104, 084905 (2008)..
[15] W. Hong, X. Zhao, J. Zhou, and Z. Suo, “A theory of coupled diffusion and large deformation in
polymeric gels”, J. Mech. Phy. Solids, 56, 17791793 (2008).
[16] J. Zhou, W. Hong, X. Zhao, Z. Zhang, and Z. Suo, “Propagation of instability in dielectric
elastomers”, Int. J. Solids Struct. 45, 37393750 (2008).
[17] X. Zhao, W. Hong and Z. Suo, “Electromechanical coexistent states and hysteresis in dielectric
elastomers”, Phy. Rev. B 76,134113 (2007).
[18] W. Hong, Z. Suo and Z.Y. Zhang, “Dynamics of terraces on a silicon surface due to combined
action of strain and electric current”. J. Mech. Phy. Solids 56, 267278 (2008).
[19] M. Yoon, H. N. Lee, W. Hong, H. M. Christen, Z.Y. Zhang, Z. Suo, “Dynamics of step bunching in
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heteroepitaxial growth on vicinal substrates”, Phys. Rev. Lett. 99, 055503 (2007).
W. Hong, Z.Y. Zhang, and Z. Suo, “Interplay between elastic interactions and kinetic processes in
stepped Si (001) homoepitaxy”. Phy. Rev. B 74, 235318 (2006).
W. Hong, H. N. Lee, M. Yoon, H. M. Christen, D. H. Lowndes, Z. Suo, and Z.Y. Zhang, "Persistent
stepflow growth of strained films on vicinal substrates". Phy. Rev. Lett. 95, 095501 (2005).
Z.Y. Huang, W. Hong, Z. Suo, "Nonlinear analyses of wrinkles in films on soft elastic substrates". J.
Mech. Phy. Solids 53, 21012118 (2005).
Z.Y. Huang, W. Hong, Z. Suo, "Evolution of wrinkles in hard films on soft substrates". Phy. Rev. E
70, 030601(R), (2004).
Z. Suo, W. Hong. "Programmable motion and assembly of molecules on solid surfaces." Proc.
Natl. Acad. Sci. USA 101, 78747879 (2004).
W. Yang, W. Hong, “Numerical simulation for deformation of nano-grained metals”, Acta
Mechanica Sinica, 18, 506-515 (2002).