Overview ECE 553: TESTING AND TESTABLE DESIGN OF DIGITAL SYSTEMS

advertisement
11/7/2002
Overview
ECE 553: TESTING AND
TESTABLE DESIGN OF
DIGITAL SYSTEMS
• Definition
• Ad-hoc methods
• Scan design
–
–
–
–
–
–
Design for Testability (DFT) - 1
Design rules
Scan register
Scan flip-flops
Scan test sequences
Overhead
Scan design system
• Summary
11/7/2002
Definition
Ad-Hoc DFT Methods
• Good design practices learned through
experience are used as guidelines:
• Design for testability (DFT) refers to those design
techniques that make test generation and test
application cost -effective.
• DFT methods for digital circuits:
– Don’t-s and Do-s
• Avoid asynchronous (unclocked) feedback.
• Avoid delay dependant logic.
• Avoid parallel drivers.
– Ad-hoc methods
– Structured methods:
•
•
•
•
• Avoid monostables and self-resetting logic.
• Avoid gated clocks.
Scan
Partial Scan
Built-in self-test (BIST)
Boundary scan
11/7/2002
2
• Avoid redundant gates.
• Avoid high fanin fanout combinations.
3
11/7/2002
4
Ad-Hoc DFT Methods
Ad-Hoc DFT Methods
• Good design practices learnt through experience
are used as guidelines:
– Don’t -s and Do-s (contd.)
• Design reviews
– Manual analysis
• Conducted by experts.
• Make flip-flops initializable.
– Programmed analysis
• Separate digital and analog circuits.
• Provide test control for difficult-to-control signals.
– Programmed enforcement
• Using design auditing tools
• Buses can be useful and make life easier.
• Limit gate fanin and fanout.
• Must use certain design practices and cell types.
• Objective: Adherence to design guidelines and
testability improvement techniques.
• Consider ATE requirements (tristates, etc.)
11/7/2002
5
11/7/2002
6
1
11/7/2002
Ad-Hoc DFT Methods
Scan Design
• Disadvantages of ad-hoc DFT methods:
– Objectives
• Experts and tools not always available.
• Simple read/write access to all or subset of storage
elements in a design.
• Direct control of storage elements to an arbitrary value
(0 or 1).
• Direct observation of the state of storage elements and
hence the internal state of the circuit.
• Test generation is often manual with no guarantee of
high fault coverage.
• Design iterations may be necessary.
Key is – Enhanced controllability and observability.
11/7/2002
7
11/7/2002
Scan Design
8
Scan Design Rules
– Circuit is designed using pre-specified design rules.
– Test structure (hardware) is added to the verified design:
• Add one (or more) test control (TC) primary input.
• Replace flip-flops by scan flip-flops and connect to form one or more shift
registers in the test mode.
• Make input/output of each scan shift register controllable/observable from
PI/PO.
– Use combinational ATPG to obtain tests for all testable faults i n
the combinational logic.
– Add shift register tests and convert ATPG tests into scan
sequences for use in manufacturing test.
11/7/2002
9
• Use only clocked D-type flip -flops for all state
variables.
• At least one PI pin must be available for test; more
pins, if available, can be used.
• All clocks must be controlled from PIs.
• Clocks must not feed data inputs of flip-flops.
11/7/2002
Scan Flip-Flop (master-slave)
Correcting a Rule Violation
Master latch
D
• All clocks must be controlled from PIs.
Comb.
logic D1
CK
Q
Logic
overhead
MUX
SD
Comb.
logic
FF
Q
CK
Comb.
logic
D2
11/7/2002
D flip-flop
CK
D1
CK
Slave latch
TC
Q
D2
10
Master open
Slave open
t
Q
FF
Comb.
logic
TC
11
11/7/2002
Normal mode, D selected
Scan mode, SD selected
t
12
2
11/7/2002
Level-Sensitive Scan-Design Latch
(LSSD)
Master latch
Adding Scan Structure
Slave latch
PI
D
Q
MCK
PO
Combinational
SFF
logic
SFF
Q
SCK
D flip-flop
SD
overhead
TCK
MCK
TCK
Scan
mode
Logic
TCK
SFF
Normal
mode
MCK
SCK
t
11/7/2002
TC or TCK
SCANIN
13
Not shown: CK or
MCK/SCK feed all
SFFs (scan Flipflops).
11/7/2002
I1
PI
I1
I2
O1
O2
SCANIN
PO
TC
Combinational
SCANIN
TC
Present
state
S2
S1
Don’t care
or random
bits
I2
S2
0000000 1 0000000
1 0000000
SCANOUT
logic
S1
14
Comb. Test Vectors
Comb. Test Vectors
PI
SCANOUT
PO
N1
N2
Next
state
O1
SCANOUT
O2
N1
N2
Sequence length = (nsff + 1) ncomb + nsff clock periods
ncomb = number of combinational vectors
nsff = number of scan flip-flops
11/7/2002
15
16
Multiple Scan Registers
Testing Scan Register
• Scan register must be tested prior to application of scan test
sequences.
• A shift sequence 00110011 . . . of length n sff +4 in scan
mode (TC=0) produces 00, 01, 11 and 10 transitions in all
flip-flops and observes the result at SCANOUT output.
• Total scan test length:
• Scan flip-flops can be distributed among any
number of shift registers, each having a separate
scanin and scanout pin.
• Test sequence length is determined by the longest
scan shift register.
•
Just one test control (TC) pin is essential.
PI/SCANIN
Combinational
logic
(( n sff + 1) n comb + n sff ) + (n sff + 4) clock periods.
(n comb + 2) n sff + n comb + 4 clock periods .
• Example: 2,000 scan flip-flops, 500 comb. vectors, total
scan test length ~ 106 clocks.
• Multiple scan registers reduce test length.
11/7/2002
11/7/2002
SFF
SFF
M
U
X
PO/
SCANOUT
SFF
TC
17
CK
11/7/2002
18
3
11/7/2002
Hierarchical Scan
Scan Overhead
• Scan flip-flops are chained within subnetworks
before chaining subnetworks.
• Advantages:
• IO pins: One pin necessary.
• Area overhead:
– Gate overhead = [4 n sff/(n g +10n ff)] x 100%,
where n g = comb. gates; n ff = flip -flops;
• Automatic scan insertion in netlist
• Circuit hierarchy preserved – helps in debugging and design
changes
• Example – ng = 100k gates, nff = 2k flip-flops, overhead = 6.7%.
– More accurate estimate must consider scan wiring and layout
area.
• Disadvantage: Non-optimum chip layout.
Scanin
• Performance overhead:
SFF1
11/7/2002
19
Optimum Scan Layout
SCANIN
Flipflop
cell
Y
Y’
TC
Routing
channels
Interconnects
SCAN
OUT
Active areas: XY and X’Y’
11/7/2002
SFF2
Hierarchical netlist
21
0.0
0.87
Optimum layout
11.90%
0.91
11/7/2002
SFF2
Scanout
Flat layout
Area overhead
X’Y’--XY
= -------------- x 100%
XY
1--β
= [ (1+α s)( 1+ -------) – 1] x 100%
T
1--β
= ( αs + ------- ) x 100%
T
y = track dimension, wire
width+separation
C = total comb. cell width
S = total non-scan FF cell
width
s = fractional FF cell area
= S/(C+S)
α = SFF cell width fractional
increase
r = number of cell rows
or routing channels
β = routing fraction in active
area
T = cell height in track
dimension y
11/7/2002
22
Original
1.00
16.93%
SFF4
20
Number of combinational gates
Number of non-scan flip-flops (10 gates each)
Number of scan flip- flops (14 gates each)
Gate overhead
Number of faults
PI/PO for ATPG
Fault coverage
Fault efficiency
CPU time on SUN Ultra II, 200MHz processor
Number of ATPG vectors
Scan sequence length
Scan implementation
Area overhead
Normalized clock rate
______________________________________________________________________
None
SFF3
ATPG Example: S5378
2,000-gate CMOS chip
Fractional area under flip-flop cells, s = 0.478
Scan flip-flop (SFF) cell width increase, α = 0.25
Routing area fraction, β = 0.471
Cell height in routing tracks, T = 10
Calculated overhead = 17.24%
Actual measured data:
Hierarchical
SFF1
11/7/2002
Example: Scan Layout
•
•
•
•
•
•
•
SFF3
Linear dimensions of active area:
X = (C + S) / r
X’ = (C + S + α S) / r
Y’ = Y + ry = Y + Y(1--β) / T
SFF
cell
IO
pad
Scanout
Scan Area Overhead
X’
X
SFF4
Scanin
– Multiplexer delay added in combinational path; approx. two
gate-delays.
– Flip-flop output loading due to one additional fanout; approx.
5-6%.
23
11/7/2002
2,781
179
0
0.0%
4,603
35/49
70.0%
70.9%
5,533 s
414
414
Full-scan
2,781
0
179
15.66%
4,603
214/228
99.1%
100.0%
5s
585
105,662
24
4
11/7/2002
Automated Scan Design
Timing and Power
Behavior, RTL, and logic
Design and verification
Rule
violations
Scan design
rule audits
Gate-level
netlist
Combinational
ATPG
Scan hardware
insertion
Combinational
vectors
Scan sequence
and test program
generation
Test program
Scan
netlist
Scan chain order
Design and test
data for
manufacturing
Chip layout: Scanchain optimization,
timing verification
Mask data
11/7/2002
25
• Small delays in scan path and clock skew can
cause race condition.
• Large delays in scan path require slower scan
clock.
• Dynamic multiplexers: Skew between TC and TC
signals can cause momentary shorting of D and
SD inputs.
• Random signal activity in combinational circuit
during scan can cause excessive power
dissipation.
11/7/2002
26
Summary
• Scan is the most popular DFT technique:
• Rule-based design
• Automated DFT hardware insertion
• Combinational ATPG
• Advantages:
• Design automation
• High fault coverage; helpful in diagnosis
• Hierarchical – scan-testable modules are easily combined into large
scan-testable systems
• Moderate area (~10%) and speed (~5%) overhead
• Disadvantages:
• Large test data volume and long test time
• Basically a slow speed (DC) test
11/7/2002
27
5
Download