Review: FE Exam • Text: “Materials Science and Engineering: An Introduction,” 6th ed., William D. Callister, Jr., Wiley, 2003. Review: FE Exam – Part 1 – atomic structure & bonding • What holds materials together? – Part 2 – Imperfections in solids • How are they packed? – Part 3 – mechanical properties • How do they deform? Review: Chapter 1 – Introduction • Types of Materials – Metals – Polymers – Ceramics Review: Chapt 2-Atomic Structure • Atomic Number, Atomic Weight, etc. • Periodic table – Electron Structure - valence electrons – unfilled shells • Bonding – ionic – covalent – metallic – van der Waals Review: Chapt 3 – Crystal Structures • Unit Cell – Metals • BCC • FCC • HCP • Atomic packing factor • Coordination number • Crystallographic directions [uvw] families of directions <uvw> • Linear density of atoms (ld) = atoms/unit length Review: Chapt 3 – Crystal Structures (cont.) • Miller indices of planes (hkl) families of planes {hkl} • Planar density (pd) = # of atoms/ unit area (pd) = S.A. atoms/S.A. unit cell • X-Ray Diffraction – Bragg’s law dhk n 2 sin Review: Chapter 4 • Imperfections – Point defects • • • • Interstitial Vacancy Substitution Solid solutions – Line defects • Edge dislocation - Burgers vector perpendicular to dislocation line • Screw dislocation - Burgers vector parallel to dislocation line – Planar defects • Twin • Stacking fault • Grain Boundary Review: Chapter 4 (cont.) • Microscopy – Optical – Electron Microscopy – Sample Prep – polishing & etching Review: Chapter 5 • Diffusion – Vacancy diffusion – Interstitial diffusion – Fick’s First Law Second Law – Temp effect – Slab- non-steady state dC J D dx C 2C D 2 t x Q D D0 exp d RT C x C0 x 1 erf C s C0 2 Dt Review: Chapter 19 • Thermal Properties – Heat Capacity • C = dQ/dT Cp > Cv – phonons – thermal expansion coefficient • l/l = l T – thermal conduction of heat • q = -k (dT/dx) – k = heat transfer coefficient Review: Chapter 6 Mechanical Properties • Stress vs. strain • Hooke’s law s F A0 0 e 0 sEe TS sy sF E Review: Chapter 6 • Poisson’s Ratio • Toughness • Resilience • Hardness ey ex ez ez Review – Chapter 7 Dislocations and Strengthening Mechanisms • Deformation by motion of dislocations – Slip plane – plane of easiest deformation – Slip direction – direction of easiest slippage – Slip system – direction and plane • Applied stress must be resolved along slip direction – = s cos cos • Twinning • Mechanism of strengthening – Grain size reduction – Solid-solution hardening • impurities reduce mobility of dislocations – Strain hardening %CW = 100 x (A0-Af)/A0 • Recovery, recrystallization, & grain growth Review – Chapter 8 Fracture – failure – Ductile fracture • Large deformations – cone & cup – small necked regions – Brittle fracture • Almost no deformation other than failure – transgranular – within grain – intergranular- between grains Review, Chapter 8 (cont.) • Griffith Crack - Stress concentration sm K t s0 – Critical stress 2E s sc a 1 2 • Fatigue – cyclic stress • Creep Review- Chapter 9 Phase Diagrams • Isomorphous system – 1. How many & which phases – 2. Use tie line to read compositions – 3. Use lever rule to get weight fractions Review- Chapter 9 • binary eutectic system – 1. How many & which phases – 2. Use tie line to read compositions – 3. Use lever rule to get weight fractions Review- Chapter 9 (cont.) • Eutectic • Eutectoid • Peritectic L S1 cool heat cool heat S1+L • Hypoeutectoid • Hypereutectoid S1+S2 S2+S3 cool heat S2 Review - Chapter 10 Rate of Phase Transformation • Nucleation process Review - Chapter 10 (cont) • Phase transformations vs. temperature and time – Pearlite – Martensite – Bainite – Spheroidite Chapter 11 • Heat Treatments Review – Chapter 11 Fabrication of Metals • Forming – Forging – Rolling – Extrusion – Drawing • Casting • Powder metallurgy • Welding • Machining • Alloy Nomenclature • Cast Irons – addition of Si catalyzes graphite formation • Refractories Review – Chapter 12 Ceramics • Crystal structures – oxygen larger – generally in FCC lattice – cations go in lattice sites based on • • • • size stoichiometry charge balance bond hybridization – no good slip planes – brittle failure • Silicates – built up of SiO44– layered – countercations to neutralize charge Chapter 12 – Ceramics • Carbon forms – diamond – graphite – fullerenes – amorphous • Lattice imperfections – Frenkel defect – cation displaced into interstitial site – Schottky defect – missing cation/anion pair • Phase diagrams • Mechanical properties Chapter 13 – Ceramics (cont) • Glasses – amorphous sodium or borosilicates – Forming • pressing • drawing • blowing • Clay products - forming – Hydroplastic forming – Slip casting – Refractories – Powder pressing • Cements • Advanced ceramics Chapter 14 – Polymers • Types of polymers – Commodity plastics • • • • • PE = Polyethylene PS = Polystyrene PP = Polypropylene PVC = Poly(vinyl chloride) PET = Poly(ethylene terephthalate) – Specialty or Engineering Plastics • • • • Teflon (PTFE) = Poly(tetrafluoroethylene) PC = Polycarbonate (Lexan) Polysulfones Polyesters and Polyamides (Nylon) Chapter 14 – Polymers • Molecular Weight – Actually a molecular weight distribution – Mn = Number-averaged molecular weight – Mw = Weight-averaged molecular weight – Polydispersity = Mw/Mn • A measure of the width of the distribution • Chain Shapes – linear – branched – crosslinked – network Chapter 14 & 15 – Polymers • Isomerism – Isotactic – Syndiotactic – Atactic – Cis vs. Trans – Copolymers • Random • Alternating • Block • Crystallinity – Spherulites Chapter 16 – Composites • Combine materials with objective of getting a more desirable combination of properties • Dispersed phase • Matrix • Particle reinforced – large particle – dispersion strengthened • Rule of mixtures – Upper limit Ec(u) = EmVm + EpVp EmEp E c – Lower limit VmEp VpEm Chapter 16 – Composites • Reinforced concrete • Prestressed concrete • Fiber reinforced – Short vs. long fibers – Critical length sfd c – allignment 2c Chapter 18 – Electrical Properties Definitions • R = resistance = Ohms • = RA/l = resistivity = ohm meter • s = 1/ = conductivity • C = Q/V = capacitance • er = e/eo = dielectric constant Chapter 18 – Electrical Properties • Energy Bands – valance vs. conduction – Conductor – no band gap – Insulator – wide gap – Semiconductor – narrow gap • Intrinsic – pure or compound – Electron vs. hole (which carries charge) • Extrinsic (doped) – n-type – donor levels – extra electrons – p-type – acceptor levels – extra holes • Microelectronics – pn junction – rectifier diode – npn transistor Chapter 20 – Superconductivity • Tc = temperature below which superconducting = critical temperature Jc = critical current density if J > Jc not superconducting Hc = critical magnetic field if H > Hc not superconducting • Meissner Effect - Superconductors expel magnetic fields Chapter 21 – Optical Properties • Electromagnetic radiation hc E h c (velocity of light in vacuum) n refractive index v (velocity of light in medium) • Angle of refraction at interface n sin n sin Chapter 21 – Optical Properties • Light interaction with solids 2 n 1 – Reflection R reflectivi ty n 2 – Absorption I – Scattering ln t – Transmission I0 • Semiconductors – absorb light with energy greater than band gap • Luminescence – emission of light by a material – phosphorescence = If very stable (long-lived = >10-8 s) – fluorescence = If less stable (<10-8 s) • LASERS – coherent light • Fiber optics Questions??? • Contact Prof. David Rethwisch to discuss questions. – office 4139 SC – Phone 335-1413 – email david-rethwisch@uiowa.edu