Reliability Analysis of Flexible Electronics: Case Study of Hydrogenated Amorphous Silicon (a-Si:H) TFT Scan Driver Tsung-Ching (Jim) Huang Tim Cheng Feb. 10th 2007 Outline Introduction Motivation: Why a-Si:H TFT scan driver Reliability of a-Si:H TFT circuits Electrical degradation and self-recovery Reliability Analysis for Flexible Electronics Device degradation model Reliability simulation Conclusion 2 Why A-Si:H TFT Scan Driver • Type Samsung Gen VII display line will produce of TFT Single-Crystal Poly- Si an area of active electronics equal to ~ 10% Proc. Temp. 1000 ºC 450 ºC of total worldwide IC area per year Mobility cm2/Vs 250 cm2/Vs • 60,000 1870 mm270 X 2200 mm panel/month Cost/Area High • Scan driver is used toHigh generate scanning signal to drive TFTs High Maturity Medium A-Si:H Organic 200 ºC < 100 ºC 1 cm2/Vs 0.5 cm2/Vs Medium Low High Low Flex. Sub. Transfer Transfer Direct Direct Degrade. N/A Electrical Electrical Elec./Chem. Ref: Samsung; T.N. Jackson, Penn State Univ. 3 Reliability Concern of A-Si:H TFT • Prolonged bias-stress to a-Si:H TFTs will induce electrical degradation which causes threshold voltage (VTH) shift • Electrical degradation is attributed to biasinduced dangling bonds Drain a-Si:H (Semiconductor) Source SiNx n+ a-Si:H SiNx (Insulator) Gate Substrate • Charge trapping in the SiNx layer and point defect creation in the a-Si:H layer are the major mechanisms Ref: C.-S. Chiang et al, Jap. J. Applied Physics, 1998; AUO Taiwan 4 Outline Introduction Motivation: Why a-Si:H TFT scan driver Reliability of a-Si:H TFT circuits Electrical degradation and self-recovery Reliability Analysis for Flexible Electronics Device degradation model Reliability simulation Conclusion 5 Electrical Degradation Model VTH degradation Pulsed-bias VGS DC-bias VGS Pulsed-bias VGS + pulsed-biased VDS VTH recovery Reverse pulsed-bias VGS 6 Methodology for Reliability Simulation SPICE-level circuit simulation High accuracy Compatible with RPI TFT- model Compatible with Verilog-a behavioral model Comprehensive model parameters Input Pattern Device Characterization Input Segment Slicer Fitting Parameters Device Analyzer Analytical Model Selection Simulation time reduction Prediction & Optimization Optimizer Analyze Iterative reliability simulation Incrementally change model parameters to mimic physical degradation process High-accuracy with measured device degradation model parameters under various conditions Circuit Netlist HSPICE Simulator/Interface Transient Output Extractor Model Parameter Adjustment Degraded Netlist Generator Ready For Simulation Control Console Auto-regressive invariant moving average (ARIMA) model 7 Case Study: A-Si:H TFT Scan Driver A-Si:H TFT scan driver integrated with the LCD pixel circuits on the glass substrate Save the cost of wire bonding and packaging Eliminate the need for driver ICs Compatible with low-temperature process for plastic substrates Device degradation depends on its bias-stress Degradation profile for each TFT can be obtained by analyzing its bias-stress Reliability simulation can predict circuit lifetime based on bias-stress analysis 8 Comparison of Simulation and Measurement Results Simulation Measured Fig. 1. Before Degradation Simulation Measured Fig. 2 After Degradation (33,000s, 85 ºC) Reliability simulation tool provides a fast and yet accurate way of estimating circuit reliability with a-Si:H TFTs No physical layout information is required SPICE-compatible Device degradation model and input pattern are needed 9 Conclusion Flexible electronics are emerging Future trend in consumer electronics Potential applications includes: E-paper, flexible display RFID tags, Implantable IDtags Ubiquitous sensor arrays & rollable solar cells Reliability analysis is essential Electrical degradation is severe vs. CMOS Robust circuit design and architecture is critical Our reliability simulation tool shows: Predicting circuit reliability is possible with high accuracy within reasonable simulation time 10 Q&A Thank you for your attention !! 11