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MLT Microvia Drilling Advantage
 Alignment and Scale Methodologies for Minimal Annular Ring
Requirements
 Large Via Process Technology that Inhibits Target Pad
Delamination
 Lot/Panel Scale Reporting and Analysis for Drill Optimization
 Via Trax ™ Technology for Target Pad Surface Texturing
 Processes for IPC High Density Interconnect Types
 Advanced uVia Diameters Less than 25um
 100% uVia Vision Inspection (In Development)
[LARGE Vias – Page]
LARGE via laser drilling techniques and energy control are the critical elements for balancing speed
(cost), quality, and premature interconnect failure modes.
Poor energy delivery methods like trepanning can breakdown dielectric to copper adhesion that
promotes delamination.
Some laminates rely on a mechanical bond as part of the overall bonding system. Generating too much
heat during the drilling process can compromise these bonds with centralized CTE effect.
Most laser systems are not designed around large vias and the respective CO2 beam diameters are well
under 10mils. This requires trepanning at high frequencies to expose the landing pads at a reasonable
cost
The trepanning method implores the overlapping of energy in a spiral configuration to cover the area
larger than the beam diameter itself. This produces an uneven distribution of energy across the copper
surface and a propensity for ‘hot spots’.
MLT implores CO2 systems with beam diameters up to 30mils generating an even distribution of energy
for LARGE via applications.
Page looks something like this in format (see below)
Via Trax™
Delamination
Trepanning
30mil Laser Beam
MLT LARGE Via
[
Via Trax™page]
Via Trax tm technology is a laser surface preparation technique used to remove
contaminates from the target pad. The resin or carbon contaminates are
generally not visible under magnification and are invisible to CO2 laser drilling
wavelengths. Even standard, post laser desmear or permanganate processes will
not remove these surface contaminates that inhibit good
plating adhesion.
Backed by accelerated environmental testing, Via Trax has
been proven to eliminate ‘hair-line’ fractures or separation
that form between the plate line and the pad itself. Via Trax
utilizes an ultraviolet wavelength that removes 2-4um of the
copper surface including the carbon based contaminate. The
surface topography is transformed into a rough surface of
micron level peaks and valleys. The new surface acts as
‘micro-cleats’ that form an additional mechanical bond
between the plating and the copper pad.
Via Separation

Proven to eliminate plating delamination to target pad via failures.

Required process by Aerospace and Defense subcontractors.

Direct copper drilling systems not capable of this process.

Cleaner plating surface – The shorter UV wavelength removes any submicron resin from the
target pad surface.

Superior plating quality – The patterned surface provides an extra mechanical, locking bond for
plating.
Via Trax on Target Pad