Optical Interconnect Project
Definition Stage Project
Project Update and Plan
M.Immonen/ TTM Meadville & Shaoyong Xiang/ Huawei
At Asia Meeting in Shenzhen
May 18, 2011
©HDP User Group International, Inc.
Background
• To meet the ever increasing bandwidth demands in high-speed
•
•
•
•
•
•
telecom and datacom systems, we need higher data rate, higher
channel density and longer interconnect links
For copper interconnect, scaling is limited due to fundamental
obstacles (such as loss, crosstalk, reflection and parasitics) to
block it meeting the increasing bandwidth demands
On-going initiatives for 25 Gbps per lane over copper backplane –
OIF CEI 25G/28G SR/VSR and IEEE 802.3ba 100G Cu BP
Significant increase in cost/ power consumption/ design efforts/
manufacturing challenges to achieve viable 20+ Gbps operation
and beyond
AOCs are now taking over longer rack-to-rack links (> 2m)
Industry roadmaps indicate that optical backplanes for < 1 m will
be very likely applied in for high speed systems within 5~10 years
Fiber/waveguide hybrid backplane shows roadmaps < 5 years
©HDP User Group International, Inc.
2
Challenges
• Implementation Roadblocks:
• Users / OEM’s are Reluctant to adopt optical interconnectivity at the
•
•
backplane/daughter circuit board level
Risk, critical performance, and cost concerns must be resolved
Critical Risk examples include:
• Availability of key building block technologies for waveguides,
interconnections, system designs, design tools
• Cost effective relative to electronics and performance benefit
• System performance at > 20 Gbps, design versatility, packaging
• Manufacturability, production scale up
• Process compatibility with accepted practices
• Reliability, lifetime, environmental issues
©HDP User Group International, Inc.
Proprietary
3
Purpose
• Understanding on performance benefits and limitations using
•
•
•
•
optical fibers and polymer waveguides for intra-system (< 1m)
interconnects on cards and backplanes
Demonstrate backplane architecture(s) that shows cost/
performance improvements obtained by using optical links
Focus on optical fiber/WG link characteristics, connectivity, endto-end link implementations and reliability of the same
Showcasing technology options and cost competitiveness to
demonstrate optical connectivity using practical hybrid fiber and
polymer waveguide solutions that exist today
Use ”Black-box” approach, standardized components and
interfaces, be protocol-agnostic, focus on practical solutions
©HDP User Group International, Inc.
4
Goals and Approach
• SoA survey of WG materials, parallel optical xceivers and
•
connectors available for short reach optical links
Build and test two Test Vehicles
• Verification TV (TV1) with multiple waveguide components and
FO/WG connects to examine practicality and link metrics
A more complex system-level demonstration TV (TV2)
•
•
•
•
•
Compare test results to equivalent electrical links and identify
design characteristics unique to optical signaling
Assess optical backplane reliability using the TV constructions
with selected WG/FO designs, connectors and module packages
Point out gaps and issues in design, fabrication, assembly and
testing to be addressed in the industry/ follow-on projects
Provide robust technology building-blocks and best-practices for
System designers/ users/ providers
©HDP User Group International, Inc.
5
Out of Scope
• This Project will not provide:
• Build application specific prototype(s)
• Solutions based on WDM or single mode fibers/WGs
• Wavelengths of 2nd and 3rd window
• Communication architectures other than point-to-point
• Need for multi-protocol module support
• Transceivers limited to mount at the card edge
• Chip-level photonic networks and Si-pho device
©HDP User Group International, Inc.
6
Sub-teams and Tasks
System Architecture and Specifications
• Optical intra-system link architectures
• Definition and specification of test vehicles
• Definition of optical layer interfaces and signal launch
Design Architecture team
• Design practices for optical/electrical boards
Waveguide and fiber interconnects
• WG and FO materials and their data
• Optical waveguide processing and testing
Transceivers and Connectors
• Devices and connectors
• Data and link comparisons
©HDP User Group International, Inc.
7
Demonstrator Architecture Proposal 1/3
WG/F Backplane – Mid-Board Access
Line Card
System
Chip
Optical Engine
line card
(O/E/O conversion)
optical waveguide
or fiber
switch card
WG/Fiber
O/E module
Switch Card
Optical
Connector
•
•
•
•
•
•
•
Electrical
connector
Waveguide/fiber links on
cards and backplane
Differential lanes for lowspeed signals, power and
control
Mid-board backplane access
with Right-Angle optical
connectors (90° optical turn)
Mid-Board Optical Engines
(Fiber-ended or fiber-less)
Coupling unit to interface
waveguides on cards
Point-to-point optical links
Optical layer design involving
multiple waveguide routing
components – straights,
bends, overcrossings
8
©HDP User Group International, Inc.
Demonstrator Architecture Proposal 2/3
WG/F Backplane – Orthogonal Case
Optical Connector/ Coupling unit
Optical Engine
•
Embedded waveguide
Similar case, but with
orthogonal midplane
structure
Optical and electrical connector
Backplane/
Midplane
Optical and electrical connector
Embedded waveguide
Optical Engine
Optical Connector/ Coupling unit
©HDP User Group International, Inc.
9
Demonstrator Architecture Proposal 3/3
WG/F Backplane – Edge Access
Optical conduit
(Extension cable)
Optical waveguide embedded backplane
•
Optical cable path
(Jumper cable)
linecard
•
•
Mid-board
optical module
Node “R”
Chassis configured to use
waveguides within the backplane,
but route line-card’s optical i/o to
the front panel
The line-card has a jumper cable to
the top of the chassis
Crossbar interconnect architecture
by optical waveguides in backplane
– Not doable with copper lanes at
high frequencies cost efficiently
Node 1
©HDP User Group International, Inc.
Node 2
Node 3
Node 4
Node 12
10
Project Test Vehicle Designs
1st TV: Verification Test Vehicle (TV1)
• Backplane with connector interfaces
• Used to verify design parameters and connectivity options for TV2
• Basic TV, basic performance and reliability testing by the team
• Currently 3 available WG technologies to build TV1
• Specification and design must fit all WG technologies
• Design to include multiple WG components fitting realistic application targets
• Connector interfaces that can be used for performance testing and for
•
•
interfacing by OEMs and others to evaluate specific applications
May want to include at least one daughter card with function on it to test the
backplane interface
Must allow application/company specific tests and interoperability testing
2nd TV: Demonstration Test Vehicle (TV2)
• Backplane with N Line Card(s) and M Switch Card(s)
• More difficult TV, Enhanced testing by the team
• Expanded specification challenging the technologies
• Connector interfaces that can be used for performance testing and for
•
interfacing by OEMs and others to evaluate specific applications
Must allow application/company specific tests and interoperability testing
11
Specification
Specification as of 2011-03-26
Parameter
System
OE module
Waveguide channel
Optical Backplane Connector
TEST VEHICLE 1 (2011-03-21)
Optical Channels per Line Card
Nx12
No. of Line Card
TBD
Optical Channels per Switch Card
None
No. of Switch Card
Date Rate per Channel
Channels per Device
Waveguide Channel Length
Waveguide core dimension
Waveguide pitch
Waveguide Loss
Launch conditions
Return Loss
Optical Waveguide Layers
Channels per Connector
Channel Pitch
Max. Insertion Loss
None
>10 Gbps
12+12 (Tx+Rx) or 4x4 (Xceiver)
Dimensions (include housing)
System
TV 2
Loss per Link
©HDP User Group International, Inc.
Max. 30 cm; Min. 50 cm
50 µm x 50 µm
250 µm
≤0.2 dB/cm
-15 dB
1
1 x 12
250 µm
2 dB
LxWxH
15 dB
12
Test Vehicle 1 Backplane
Proposal in Meeting 2011-02-09
Note : Groups 1, 2, and 3 implemented in common or separate test beds
A
Straight WGs, Surface Layer
B
Straight WGs, Inner Layer
C
Crossings
E
Connector1
Connector2
G
Tx/Rx
D
Cascading bends
Card1
Card2
E
Long waveguide spiral
F
90° -in-plane bends
Card1 1xN couplers Card2
Connector1
H
Tx/Rx
Group 2
End-to-End
Links &
Connectors
Connector2
Butt-joint, 90-turn Tx/Rx
N+N channels
2011-02-22:
TV1 will use
external launch
Passive BP
Group 1
Waveguides,
WG-Fiber
Interface
WGs + 90° Out-of-plane
Group 3
Off-chip
Interface
TBD: Reference copper line designs, connector types (FO/FO; WG/FO; WG/WG)
©HDP User Group International, Inc.
13
Test Vehicle 1 Backplane
Design as of 2011-05-13
Point-to-point TV for Multimode based λ = 850 nm VCSELs
provided via externally launched test source and fiber-optic ribbons
WG
channel loss
(Ref.)
Nx12 WGs, Straight; Length L1
Nx12 WGs, Straight; Length L2
WG end face
coupling loss
Nx 12 WGs, Straight; L2
12 WGs, Straight; L1
12 WGs, Straight; L1
12 WGs, Straight; L1
12 WGs, Straight; L1
Connector
coupling loss
(multiple
connector options)
12 WGs, Straight; Length L2
Link loss with
connectors
12 WGs, Straight; Length L2
.
.
.
Crossings
Cascading bends
.
.
.
(multiple
connector options
and link lengths)
BACKPLANE
In-plane launch
BP connector with
MT Edge/Mid-board
Notes:
90-deg turn
Right angle launch
- All waveguide arrays are on board surface
- Layout is to be finalized in accordance with actual board design
- Schematic illustration, sizes not to scale, may not include all design variations
- Fiber ribbon links not shown
©HDP User Group International, Inc.
- Electrical connectors or ref. lanes not shown
Waveguides
90-deg up turn in WGs
14
Waveguide Design Features
1
50
250
12
1
1.
50
1
2.
12
12
Straight waveguide array sets (N=12
channels)
• Fixed width w=50µm
• Fixed center-to-center spacing: 250 µm
• Varying length: L1=15 cm; L2=30 cm
Nested sets of 90° bends
• Varying ROC (R=RS…RN) with fixed width
•
3.
E.g. R= 5’ … 20 mm, w= 50 µm
Varying ROC Varying waveguide widths
E.g. w= 35‘ 50‘ 70 µm
Straight section lin and lout E.g. 10 mm
•
Staggered cascaded bend
• Mode mismatch loss between segments of
different RoCs
4.
5.
Long waveguide loop
Over crossings
2
©HDP User Group International, Inc.
4
1 3
15
Optical and Board Materials
• Three waveguide suppliers (OIL, Dow, API) to build optical
layers on PCBs
• Waveguide Polymer/ GuideLink™ / Optical Interlinks
• Acrylic-based dry film, channel loss: 0.1 dB/cm (850 nm), Index
difference D: ~0.033 (2.1%); NA=0.2-0.32
• Waveguide Polymer/ LightLink™/ Dow
• Siloxane-based wet material; material loss: ~0.05 dB/cm (850
nm), Index difference D (%): 0.022 (1.5 %); NA=0.26
• Waveguide Polymer/ Proprietary/ API
• Acrylate-based dry film, channel loss: ~0.05 dB/cm (850 nm),
Index difference D (%): 1.3 % or 2.8 %; NA=0.2-0.37
• TTM to provide PCBs, materials not yet confirmed by team
• Standard Loss (Df=0.016 @ 1GHz)
• High Tg FR4 Panasonic R-1755V
• Low-Loss Hi-Speed (Df=0.005 at 1GHz)
• High Tg FR4 Panasonic R5725 (Megtron 4)
16
©HDP User Group International, Inc.
Connectivity Evaluations
• 1. Waveguide to Fiber coupling
• Fiber-to-WG; WG-to-Fiber
• Fiber: 50µm and 62.5µm; WG: 50µm
• 2. Backplane Connector (D-Card-to-BP)
• A. MTP/MT conn. with bent WGs
• B. MTP/MT conn. with right angle turn
• C. MT-terminated WG flex film for 90-° coupling
• 3. Edge Connectors/ Mid-board in-plane connectors
• A. MT or micro-MT array connector on board edge
• B. Edge connector in cut-out hole on board
• 4. I/O Mirrors on Waveguides
Interfaces are contact and/or with beam
expansion, air gap or filled
17
©HDP User Group International, Inc. Proprietary
Optical Connectors – At Members
Molex
BP/Midplane MTP
Fiber <-> Fiber
IL 0.5 dB; 250µm
No 90° turn
Optical Interlinks
MTP pluggable
WG <-> WG
IL dB; 250µm
Bent WG 90° turn
Advanced Photonics
MT with housing
Fiber <-> WG
IL 0.5-3dB; 250µm
Bent OF/WG 90° turn
Optical Interlinks
MTP pluggable
WG <-> WG
IL dB; 250 µm
Bent WG 90° turn
Optical Interlinks
MT modified
WG <-> WG (or FO)
IL dB; 250µm
Advanced Photonics
MT comp. ferrule
Fiber <-> WG
IL 0.5-3dB; 250µm
Advanced Photonics
MT for mid-board I/O
Fiber <-> WG
IL dB; 250µm
Reflex Photonics
MT ferrule
Fiber <-> WG
IL dB; 250µm
Edge
Backplane
Demonstrated or proposed by HDPug OI team members
MTP plug and receptacle on optical fiber ribbons are generally available. Here are examples of MT OF ribbon WG connectors18
only.
Commercial
Development
©HDP User Group International, Inc.
Proprietary
Optical Connectors, cont.
• Rough alignment (± 0.3mm) using MTP or
MPX/MPX adapter and housing technology which
alignd the opposite MPX-flex guide connectors
• Most precise alignment (±2µm) obtained by the MT
pins itself aligning the opposing MT ferrules
©HDP User Group International, Inc.
19
Optical Connectors, cont.
Reflection mirror for beam 90°deflection can be on waveguide or on coupling
device.
coupling device
coupling device
micro lens
micro lens
Waveguide core
Reflection mirror
reflection mirror on waveguide
Waveguide core
Reflection mirror
reflection mirror on coupling device
©HDP User Group International, Inc.
Better
scalability
for
multilayer
application
20
SoA Survey – Parallel Optical Connectors
HDPUG Optical Interconnect Project
Rev. 1.2 2011-02-02
Parallel Optical Connector Technology Survey
Optical Engines, Parallel Optical Modules -- Commercial (l=850nm)
Reflex
Avago
Furukawa
Finisar Tyco (Zarlink)
Conjunct
AlpenIO
Photonics
Supplier
Product
Lightable,
MicroPod + Prizm
u-POEM
ZOE
FibreLyte
AIO-TXNHyperDense
LightTurn conn. (R-PACK/V-PACK)
40G
Type
Fiber-pigtailed
Parallel OM
Parallel OM
OE
Fibre-less
Fibre-less Optical
OE
pluggable MT I/O pluggable MT I/O package Optical Engine Engine + embedded
lensed MTP interface
Data rate [Gbps/ch]
10,4
12,5
10(R-PACK)
12,5
10
10,0
5(V-PACK)
No ch. per Module
96
12
4+4
12+12
4+4
4+4
Aggreg. BW [Gbps]
960
150
40G/20G
40
40
4-, 12-, 24-, 48- 12-, 24-, 48- and μ-Joint/μ-Curve
Tx and Rx per
72 MT fiber
connector
module
ferrules
Interface out
MMF ribbon MMF ribbon cable ThreadWave Fiber
Module
cable
Ribbon Cord
Power consumption
TX:80mW/ch.
per Module [mW]
Rx:110mW/ch
Power consumption
45
[mW/Gbps]
Packaging type
BGA; SMT
SMT Module
0.5-mm pitch LGA
Module
Formats
24
©HDP User Group International, Inc.
4+4
4+4
-750
600
Glass-subst.
SMD
16x16x2.83
mm
21
Testing Plan Overview (TV 1)
Fabricate Boards
As-built Testing
6x 260C
Reflow
Waveguides:
Propagation loss, bend
losses, cross-over loss,
loss post-lamination,
refractive index, RL,
Signal integrity analysis
Electrical: Input electrical
specification incl. Sparameters, Eye
Reliability test 1
Reliability test
2
Waveguide IL and RI
stability
Link parts. System test
In-situ monitoring of IL
at established read
points
Link BER, before/after
Connectors: IL, RL,
misalignment tolerance,
mate/unmate
Transceivers: Pout, Eye,
BER
TBD
Phase I tests to ensure waveguides and interfaces are practical
and they meet the specification
Link: Budget,
IL, Eye, BER
©HDP User Group International, Inc.
22
Polymer Waveguide Characterization Criteria
Issues to be Considered for TV1
©HDP User Group International, Inc.
23
Functional Tests (Level 1)
• Functional tests for waveguides (Level 1)
• Waveguide material loss, IL low-mode fill SMF input, straight channels
• Waveguide channel loss, IL high-mode fill, MMF input, straight channels
• Waveguide bending loss, 1) in-plane imaged guides (nested 90-deg
curves and staggered cascaded bends); 2) out-of-plane, flex guides
Waveguide crossover loss
Waveguide channel loss, post-lamination, IL high-mode fill, straight ch.
Dimensional accuracy; dimensions and pitch
Coupling loss MMF-to/from-Waveguides – volunteer needed
Waveguide NA and Index contrast --- Fiber Analyzer – volunteer needed
Waveguide Dispersion
•
•
•
•
•
•
•
Functional tests for waveguides (Level 2) (proposed, confirmed later)
• CTE, Dn/dT
• Waveguide routing configurations and losses: splitters, high-density
•
•
cross-talk (leakage)
Functions: Splitters, combiners, star couplers/ mixer
NA control (modification, tapers), mode scrambling
©HDP User Group International, Inc.
24
Functional Tests (Level 1), cont.
• Waveguide links with connectors
• Reflective Back Reflection Return Loss --- OTDR
• Signal integrity analysis (eye diagram, jitter, extinction ratio)–
Optical signal analyzer with optical port
• Connectors
• Dimensions (Alignment structure and coupling interface on
•
•
•
•
connector and on PCB)
Insertion loss (connector)
Coupling loss (connector assembly on board)
Misalignment tolerance (coupling sensitivity x, y, z)
Durability, mate/unmate, 200 cycles
©HDP User Group International, Inc.
25
Testing Plan with Resources (2011-05-13)
Version
2011-03-26
Includes all tests and related criteria proposed for the project per 11-02-16
Level 1 tests are to be done with TV1. YES indicates agreement, test owner to be confirmed. Following volunteers are confirmed
LEVEL TV1
TV2 TEST
VOLUNTEER
(2011-05-13)
Test Condition
OPTICAL WAVEGUIDES
1
YES
Waveguide Optical Loss (Material Loss)
1
YES
Waveguide Optical Loss (Channel Loss)
1
YES
Waveguide Bend Loss
(In-plane, imaged guides)
1
YES
1
YES
1
YES
Coupling Loss (Waveguide to/from Fiber)
1
YES
Waveguide NA and Index Contrast
1
YES
Waveguide Cross-over Loss
1
YES
Reflective Back Reflection Return Loss
1/2
Y/N
Waveguide Cross-talk, leakage
(High density/ cross-talk)
YES
Waveguide Bend Loss
(Out-of-plane, film bending)
Waveguide Dimension
(Dimensions and Spacing)
Waveguide Optical Loss
(Inner layer WGs, post lamination)
Waveguide Dispersion,
Bandwidth Distance Product
Low mode fill. Design feature: Straight waveguides. Insertion
loss method (primary); Cut back (secondary). Lengths L1 and
OIL, Fujitsu
L2. λ= 850 nm. Low mode fill by SM fiber input
Mode fill 60-80%. Design feature: Straight waveguides. Insertion
loss method (primary); Cut back (secondary). Lengths L1 and
Xyratex, OIL, Fujitsu
L2. λ= 850 nm. MM fiber input
Design features: 1. Nested 90-deg curves (fixed width, varying
width), 2. Cascading staggered WGs. IL vs. ROC. Min. bending Xyratex, OIL, Fujitsu
radius 5 mm (From 20 mm to 5 mm).
IL vs. ROC. Min bending radius 5 mm.
Macroscope
Xyratex, OIL, Fujitsu
TTM
Coupling loss of MM-SI WG to/from MM-GI 50/125 and 62.5/125
Volunteer
OF. Both directions. Variables: Waveguide size, NA
Far field radiation pattern / Fiber Analyzer
Volunteer
IL per Cross. Varying angles 30º to 90º
APi, Fujitsu
OTDR. Connectorized waveguides
Cisco
Crosstalk vs waveguide pitch (250 μm, 125 μm, 62.5 μm and
31.25 μm)
APi
IL for Lenght L1. 850nm
Xyratex, OIL, Fujitsu
©HDP User Group International, Inc.
26
Testing Plan with Resources (2011-05-13)
LEVEL
TV1
TV2 TEST
Test Condition
VOLUNTEER
(2011-05-13)
ELECTRICAL MEASUREMENTS
YES
X
X
X
X
X
X
X
X
X
X
X
YES
X
X
X
X
X
X
X
X
Electrical Specifications and Tests
Cisco, Huawei, Celestica
Differential Output S-parameter SDD22/SDD11
Common Mode output S-parameter SCC22/SCC11
Differential Impedance
Differential Insertion loss SDD12/SDD21
Reflected Diff. to Common Mode Conversion SCD11
Rise/Fall time (20%/80%)
Total Jitter BER 10^-12 or better
Data Dependent Jitter
Eye diagram (mask testing)
Difference Voltage Modulation Amplitude
Difference Wafvorm Distorsion Penalty
Optical Specifications and Tests
Cisco, Huawei, Celestica
Rise/Fall time (20%/80%)
Total Jitter BER 10^-12 or better
Data Dependent Jitter
Eye diagram (mask testing)
Optical Modulation Amplitude
Total Jitter BER 10^-12 or better
Data Dependent Jitter
Extinction ratio (var)
©HDP User Group International, Inc.
27
Reliability Tests -- TBD
• Proposed tests for waveguide PCBs
•
•
•
•
Solder reflow simulation, 6x260C
HTS, 85°C(or max.storage T), 2000h
LTS, -40°C(or min. storage T), 2000h
Thermal Shock (alternative to HTS/LTS), -40°C/+70°C, 15mins
dwell x mins transfer, air-to-air, 100 cycles
ATC, 0-100°C
HAST, 130°C, 0.23 MPa, 85%RH, 96h
DHHH (Damp Heat High Humidity), 85°C/85%RH, 2000h
Output: IL and refractive index at 850nm: before, in intervals
•
•
•
•
• Some concerns on reliability testing with TV1
• Which tests are necessary phase 1 tests conducted with TV1
• # of units (OPCBs and OPCBA’s) need to be tested
• Does the test provide representative information on performance
(failures) we are interested in,..
©HDP User Group International, Inc.
28
Thermal Aging Study
Arrenhenius Plot Data & Extrapolation at 838nm
B.Booth 2011-03-23
Waveguide Transmission Loss Testing
Optical Tests——WG Transmission loss
In-coupling fiber
Multimode, 50/125um
Out-coupling fiber
Multimode, diameter > WG
l  850nm
Optical detector
Optical Source
L2
L1
Backplane configuration
 Flat end to flat end
Measurement method
 IL: Insertion Loss
 TL: Cut-back
Pout
Pin
TL  (IL1  IL2 ) /(L1  L2) (dB/cm)
IL  10 Log
©HDP User Group International, Inc.
Proprietary
30
Link Testing
Optical Tests——Transmission loss of link
Signal
generator
Fiber
patch cord
Detector
/Oscilloscope
Optical Tx
Fiber
patch cord
Optical
backplane
connector
TP1
TP2
Optical backplane
1.
Test optical power P1 (dBm) at TP1;
2.
Test optical power P2 (dBm) at TP2;
©HDP User Group International, Inc.
Transmission Loss (dB) =P1-P2
Proprietary
3.
31
Link Evaluations
LINK 1: TX – OF – Conn 1 – Waveguide – Conn 2 – OF – RX
MTP male to 12 FC/APC,
bare, 2m
TX +
Fiber
patch
cord
RX +
Fiber
patch
cord
TP1
TP3
Waveguide Channel
MTP male
connector to 12
individual FC/APC
connectors, bare
ribbon to 900um
buffered, 0.45m
breakout, 2m total
length
SX: We can use MPO
to 12 FC/PC
connector fan-out
cable and standard
MPO/MTP patchcord
for link test.
http://www.optequip.
com/products/fiber_ri
MTP BP
(design example)
BACKPLANE
TP2
MT Edge
MT Mid
board
WG Ref.
(Unconnectorized)
Waveguide to
Fiber coupling
evaluations
©HDP User Group International, Inc.
Proprietary
32
Link Evaluations
LINK 2 : LINK 1 + CARD (with WGs)
LINK 3 : LINK 1 + 2 CARDs (with WGs)
LINK
CARD (Side A or A+B)
WG channel length = 10 to 15 cm
Dk/Df = x.x / 0.00x
WG width/thickness : 50 / 50 µm
Trace width/thickness = 6 mil / 17.5 µm
BACKPLANE
WG channel length = 15 cm to 35 cm
Dk/Df = x.x / 0.00x
C2
WG width/thickness : 50 / 50 µm
Trace width/thickness = 6 mil / 17.5 µm
Optical pitch: 250 µm
CARD
C1
TP1
WG Length
on Card (A/B)
WG Length
on BP
Total WG
Length
Total Optical
Link Length
Short Link
12” WG + FO
4” (10 cm)
4” (10 cm)
12” (30
cm)
x meters
Long Link
20” WG + FO
5” (12.5 cm)
10” (25 cm)
20” (50
cm)
x meters
TP3
TP2
TP4
Waveguide Channel
C3
BACKPLANE
©HDP User Group International, Inc.
Proprietary
33
Sourcing Plan
Resource
VOLUNTEER (2011-05-13)
DESIGN AND MFG SERVICES
--- TV1 Backplane and Card design
--- TV1 Optical Waveguide Layer design
--- Fabricate Backplane and Cards
--- Fabricate Optical Waveguide Layer
--- Assembly
MATERIALS AND COMPONENTS
--- Optical Backplane connectors
--- Optical Edge connectors
--- High-speed electrical connectors
--- Optical Engines
TESTING (Detailed in separate table)
--- Optical Insertion Loss (Straight, bends, crossings)
--- Electrical Measurements (Electrical specs, optical specs)
--- Connectors (Coupling loss, coupling sensitivity, durability)
--- Reliability (testing plan TBD)
Source
NGC
TTM
OIL, APi, Dow
Source
OIL, APi?, Molex?, FCI?
OIL, APi?, Molex?, FCI?
TBD
TV2 only
OIL, Xyratex, APi, Fujitsu
Cisco, Huawei, Celestica
Source
TTM, APi, Fujitsu
©HDP User Group International, Inc. Proprietary
34
Proposed Schedule
Who Complete
Planned
Completion
Status
S.Xiang, M.Immonen
B.Booth, R.Pitwon
05/10
02/11
Completed
Completed
Specification for TV1 and TV2
S.Xiang
System architecture, optical layer interfaces and signal
B.Achir, S.Xiang,
launch TV1 and TV2
C.Noddings, M.Marino
WG mtrls and OE components to be tested in TV1
Team
Testing plan for TV1 and TV2
S.Xiang, B.Achir
O/E PCB Design Methodology
D.Smith
Sourcing Plan
Team
Project to Implementation Phase
M.Immonen
Phase I - Verification TV (TV1)
Design TV1
Start board fabrication
Board fabrication complete
Optical and electrical testing 1 complete
Connectors received
Board assembly complete
Optical, electrical testing 2 complete
Start reliability testing
Reliability testing complete
Failure analysis complete
Phase I report complete
02/11
03/11
Completed
Completed
03/11
03/11
04/11
05/11
06/11
Completed
Active
Completed
Active
Active
Project Task
Plan Project
SoA Surveys - Polymer WGs/FO; Xceivers and Conn's
©HDP User Group International, Inc.
06/11
07/11
09/11
11/11
12/11
01/12
03/12
04/12
35
Interested Participants
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
Adamant
Advanced Photonics
Albemarle
Alcatel-Lucent
Atotech
Boeing
Celestica
Cisco
Conpart
Dow
Ericsson
Flextronics
FCI
Fujitsu AT
Hitachi
–
–
–
–
–
–
–
–
–
–
–
–
–
Huawei
IBM
Isola Group
Iteq
ITRI
Intel
Juniper
TTM Meadville
MMM
Mayo Clinic
MolexN
National Semicon.
Northrop Grumman
– Nokia Siemens
–
–
–
–
–
–
–
–
–
–
–
–
Network
Optical Interlinks
Oracle
Park Electro
Promex
Purdue
Reflex Photonics
Rogers Corp
Sanmina
Uta
Vario-Optics
Wistron
Xyratex
New team members since 02’11
©HDP User Group International, Inc.
36
Contacts
• Jack Fisher (HDP User Group)
– Project Facilitator
– fish5er@hdpug.org
• Marika Immonen (TTM Meadville, Finland)
– Project Leader
– Marika.Immonen@meadvillegroup.com
• Shaoyang Xiang (Huawei Technologies, China)
– Project Leader
– xiangshaoyong@huawei.com
• Marshall Andrews (HDP User Group)
– Executive Director
– Marsh57@hdpug.org
©HDP User Group International, Inc.
Proprietary
37