ECSEL JU M Introduction
Yves Gigase
Head of Programmes
Hardware: the “Smart” in Everything
Smartphone
Smart Card
Smart Grid
Smart Cities
Smart Mobility
Smart Governance
“Smart” =
chips
….
running software,
Smartanything ! HAIRintegrated in a system,
enabling applications !
But also software
1 million lines of code Is approximately 1 meter height of A4 paper
Nanoelectronics Permeates All Aspects of Societal Life,
Drives Innovation in All Industries,
Creates Jobs and Growth
Services
7-10 jobs
20-25 €
ELECTRONICS
1 job
Nano
Electronic
Components
1€
4
Bridging the valley
ENIAC
PUSH
& ARTEMIS
PULL
Building on FP7 Success: ENIAC Pioneering KET Pilot Line Projects
14 Large Projects, Strong Participation from All Around Europe !
Eligible Costs
11
NO
4
3
3
10
45
56
13
6
6
1
29
1
3
5
• 1.8B€ eligible costs
• 338 participations
• 23 countries
97
3
14
4
5
2
4
TR
IL
13
ECSEL Ecosystem Evolving from FP7 to H2020
Along the Value Chain
European strategic necessities:
ECSEL JU
Wafer
processing
Embedded
Software
ECSL JU: an EU Policy
Equipment
Design
Automation
IP Blocks
Assembly
and Test
System
Integration
ELECTRONICS
APPLICATIONS
Materials
► ENIAC + ARTEMIS + EPoSS = ECSEL
FP7
 Without state of the art
semiconductor technology,
Europe will depend entirely on
importation (ENIAC JU)
 Without embedded software
functionality, chips are useless,
fabs are unsustainable
(ARTEMIS JU)
 Without smart integration in
systems, no economic and
societal benefits are possible
(ETP EPoSS)
H2020
7
What is ECSEL?
ECSEL = Electronic Components and Systems for
European Leadership
ECSEL JU is:
A Public-Private Partnership
keeping Europe at the Forefront
of Technology Development
9
What is ECSEL? - Principles
 Implement Horizon 2020:
• Develop favourable conditions for investing in knowledge and
innovation
• Achieve smart, sustainable and inclusive growth
 Build upon ARTEMIS/ENIAC JU experience: establish
an autonomous organization:
• Joint Undertaking
 Build upon ARTEMIS/ENIAC JU achievements: 3-way
funding
• The Union (1.17B€)
• The ECSEL Participating States (>1.17B€)
• The Private Members (~ 5B€, minus grants)
Who is ECSEL Joint Undertaking?
COUNCIL DECISION
PUBLIC PRIVATE PARTNERSHIP: INDUSTRY AND THE NATIONAL
AUTHORITIES THAT DECIDE ON THE PROGRAMME
Work Plan
MASP
GUIDELINES
PAB Decisions
Participating states
+ associated + industrial
+ EC
ECSEL JU Is Focused on
Higher Technology Readiness Levels
2014 (ACTUAL)
RIA
IA
TOTAL
National eligible costs
150.2
558.1
708.23
National contributions
39.8
104.0
143.7
H2020 eligible costs
145.2
504.6
649.8
EU contributions
48.3
106.7
155.0
European Commission, Brussels, 23.5.2013, COM(2013) 298 final
15
ECSEL Projects Arising from the Calls 2014
16
ECSEL JU
Programme Architecture
Electronic Leaders Group “KETs” report:
“… A combined market-pull-supply-drive strategy to optimise impact.”
Applications creating the
opportunities for Industry to
help address Societal
Challenges
PART A
PART B
Technologies needed by
Industry to make it happen...
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Part A – Key Applications
1. Smart mobility
– resource-efficient transport
– highly automated and autonomous
– integrated and multimodal mobility networks
2. Smart society
– Security enabling components and systems
– Smart and Connected Things (incl. Internet of Things)
– European assets protection
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Part A – Key Applications
3. Smart energy
– Sustainable energy generation and conversion
– Reducing energy consumption
– Efficient community energy management
4. Smart health
–
–
–
–
–
Prevention
Diagnosis
Treatment/Therapy
Aftercare
Improved Food Quality
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Part A – Key Applications
5. Smart production
I.
manufacturing and process automation and new
manufacturing and process technologies
enabled by advanced electronics systems.
•
Several sub-topics (see MASP)
II. manufacturing of semiconductors as a special
topic
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Part B – Essential Capabilities
1. Semiconductor Process, Equipment, and
Materials
– leadership in processing know-how for:
•
•
•
advanced and beyond CMOS (More Moore, MM),
heterogeneous (More than Moore, MtM)
and System in Package (SiP) technology
2. Design technologies
–
–
–
–
Technologies for Model-Based and Virtual Engineering
Managing complexity, safety and security
Managing diversity
Increasing yield, robustness and reliability, and generate
system openness
22
Part B – Essential Capabilities
3. Cyber-physical systems
–
–
–
Architectures, principles and models for safe and secure CPS
Autonomous, adaptive and cooperative CPS
Computing Platforms
4. Smart systems integration
–
–
–
Building blocks, controls and interfaces of smart systems
Integration methods enabling smart functionality, automation and
reliable operation in harsh and complex environments
Interfaces for the safe, secure and efficient transfer of data and
energy
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Project Topics
THINK OUTSIDE OF YOUR SILO!
• “Projects of the ECSEL programme do not
necessarily have to limit themselves to covering
only one of these key applications or essential
technology capabilities;
on the contrary, multi/cross-capability projects will
be encouraged wherever relevant.
This cross-capability work is vital in creating
initiatives of adequate critical mass and vital in
fostering innovation ...”
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What’s special about ECSEL JU projects?
• Think “Programme”, not isolated projects...
• Think BIG in terms of ECONOMIC IMPACT
• Think Pilot Lines and PLATFORMS*
• Build a new one (ambitious !)
• or ensure your RD&I project
relates to one
* “Lighthouse Projects” in the ELG KETs report
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Where do we go from here?
Europe leading in electronics systems value chains:
The Possible
- Encompassing components to software to system integration
- Securing a sustainable supply of critical technologies
- Deriving economic and societal benefits from continuous
innovation
- Providing prosperity and safety for citizens and nations
ECSEL is an essential instrument
in making this happen.
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