Using GaP Avalanche Photodiodes for Photon Detection Abigail Lubow EE Senior Project Fall 2001 and Spring 2002 Advisor: Professor Woodall Pictures from http://www.roithner-laser.com/UV-PD.html Background • Avalanche photodiodes (APDs) are high gain photodetectors. • Nonavalanching p-n and p-i-n photodetectors have unity gain. By contrast, APDs use the avalanching process to produce a higher gain. • This device addresses the need for solar blind UV detectors. • Potential applications: High density optical storage and detection of tryptophan flourescence (348nm). • This project is the first time GaP has been used to create an APD. Photodiodes Figure 1. • Incident photons are absorbed in the photodiode giving rise to electron-hole pairs. • Gain = 1. Impact ionization will increase the gain above 1. Impact Ionization • Definition: “a snowballing creation of carriers very similar to an avalanche of snow on a mountain side.”from Pierret’s Semiconductor Device Fundamentals • Conditions: Applied voltage (VA) is negative and VA Vbreakdown. Figure 2. Why use GaP? • It is more commonly available and less expensive than other wide bandgap materials such as SiC and GaN. • For GaP, ni 1 /cm3 and for Si, ni = 1 x 1010/cm3. GaP p-n junction will have a smaller reverse current: Dp ni 2 qniW JR q p ND e • Large bandgaps correspond to small wavelengths: Eph = 1.24/. GaP bandgap = 2.26 eV, Si bandgap = 1.12 eV Figure 3. P-I-N GaP Sample Figure 4. Figure 5. p-GaP, Be doped grading from 210^18 to 210^19 (surface) over 3000A I- GaP, 3000 A n-GaP, 210^18, 5000 A Semi-insulating super lattice buffer n-GaP substrate • Fig. 4. P-I-N structure: Electric field in graded p-layer separates electrons and holes. • Fig. 5. Electrochemical CV measurement. “+” for n type and “o” for p type. Measurements: Current vs. Voltage Figure 6. Reverse IV: GaP 80um Ring Device 1.0E-05 log current (A) 1.0E-06 dark UV White 1.0E-07 1.0E-08 1.0E-09 1.0E-10 1.0E-11 1.0E-12 1.0E-13 0 -5 -10 -15 -20 -25 voltage (V) Avalanching occurs at about -20V. Dark current is 1 × 10-¹³ A. Measurements: Quantum efficiency vs. wavelength Figure 7. QE: GaP 80um ring device 50 45 40 QE % 35 30 25 20 15 10 5 0 250 300 350 400 450 500 wavelength QE is “the ratio of the number of carriers generated to the number of photons incident upon the active region.” www.seas.gwu.edu/~ecelabs/appnotes/PDF/LED/LEDterms.pdf Surface Band Bending Figure 8. • Surface band bending due to the “Fermi level pinning.” • Electron loss due to the surface recombination. Measurements: Gain vs. Voltage Figure 9. Gain: GaP 80um ring Device 1000 UV Gain 100 gain White Gain 10 1 0 -5 -10 -15 -20 -25 voltage (V) • Gain results from the impact ionization process. • Large gains start at –20V for UV and white light. • Gains reach as high as 1000. Measurements: Photocurrent vs. Wavelength Figure 10. Photocurrent v wavelength: GaP 80um ring device 1.60E-08 1.40E-08 1.20E-08 photocurrent (A) 1.00E-08 I(10V) I(17V) I(19V) 8.00E-09 I(20V) I(20.5V) I(20.7V) 6.00E-09 4.00E-09 2.00E-09 0.00E+00 250 300 350 400 450 500 550 wavelength • Current decreases at small wavelengths due to surface pinning. • Current decreases at large wavelengths due to low absorption coefficients. Schottky Device Figure 11. Metal 0.25 m I-GaP 50 nm p-GaP doped 1*10^18cm^-3 Be 0.1 m I-GaP 1.0 m n-GaP doped 5*10^18 cm^-3 Si GaP n+ Substrate • SAM structure Schottky device improves absorption efficiency and reduces noise. • Processing Issue: Choice of metal with low light loss Summary • GaP APD has been chosen for use as a solar blind UV detector. • P-I-N device showed promising performance with high gain, low dark current, and high QE at medium wavelengths. • UV QE needed improvement. A Schottky device structure was proposed.