Alan M Schoepp
Work Experience:
Lam Research Corporation, Fremont, CA

Sr. Technical Director, Corporate Technology Development
o

1998-2012 – Responsible for the hardware development of new process chambers. Managed an
engineering group that ranged from 12 to 75 people and development budgets up to $25M per
year. The successful products that were developed include the 2300 Etch chambers and Linear
Clean products that are the current company cash cows. Multiple other projects were taken
through the concept and feasibility phases to demonstrate a capability to customers without
further commercialization. Chaired the corporate electrostatic chuck development group.
1996-1998 - Principal Technologist
o
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2013 to present – Responsible for the hardware development of new process technologies.
Focusing on disruptive and emerging technologies with a 5 to 7 year horizon
Sr. Technical Director, New Product Development
o

Responsible chamber hardware design and development of the next generation 300mm high
density plasma etcher
1994-1996 – Manager, Oxide Etch R&D
o
Responsible for design and development of a production-worthy electrostatic chuck for oxide
etch applications. The project was completed in 9 months after Lam had previously spent 5 years
on the problem. The basic materials and chuck design has been incorporated into every etch
module that Lam sells.
Novellus Systems Inc., San Jose, CA

9/91-9/94
Manager, Dielectric R&D
o
Responsible for the hardware and process development for the high density plasma CVD system.
Built project team from scratch and managed through a well-staged development program. The
“SPEED” product was introduced and subsequently captured ~ 85% of the available market.
Watkins-Johnson Company, Scotts Valley, CA

9/94 – present
8/89-9/91
Head, Process Engineering, Single Wafer Products
o
Responsible for process development on the new Select Series open-architecture cluster tool
including research and development of LPCVD and reduced-pressure LTO, PSG, BPSG,
TEOS/O3and BPTEOS films.
Alan M Schoepp - Page 2
Silicon Systems Inc., Santa Cruz, CA

Sr. Equipment Engineer
o
Responsible for sustaining engineering of the epitaxial, polysilicon, and oxide CVD equipment in
the thin film section of the fab.
Focus Semiconductor Systems, Sunnyvale, CA

8/88-2/89
Process Technology Manager
o
Responsible for directing all phases of process technology including research and development,
customer demonstrations, and machine qualifications for a start-up semiconductor equipment
company.
Watkins-Johnson Company, Scotts Valley, CA

2/89-8/89
7/84-8/88
Head, CVD Production Process and Member of the Technical Staff
o
1987-88 – Designed APCVD system for deposition of tungsten-based thin films. Directed process
development efforts on WSi, W, and selective W thin films.
o
1986- Project manager for and chief designer for WJ-999 series of APCVD systems. This product
went onto capture 85% of the available BPSG market and resulted in approximately $1B in sales
over the next 10 years.
o
1984-85 – Designed and managed the build of the first R&D CVD demonstration lab. Responsible
for chamber design, customer demos and process development activities within the new lab.
Education:
Stanford University, M.S. in Mechanical Engineering
1984
Major emphases’ in high temperature gas dynamics and product design
University of Missouri-Rolla, B.S. in Mechanical Engineering
General Motors Scholarship recipient, emphases’ in heat transfer and thermodynamics
Additional Information:
25+ granted patents in semiconductor processes and equipment design; others still pending
Member of Tau Beta Pi (Engineering Honor Fraternity)
Member of Pi Tau Sigma (Mechanical Engineering Honor Fraternity)
1982