RJR Polymers, Inc.
The Complete Process
Solution
RJR Polymers, Inc.
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Specializes in the manufacture of Injection Molded Plastic
Packages, Pre-applied Adhesives, Equipment and
Processes that provide additional service to our customers
in the Electronics Industry.
Provide engineered solutions to our customers demanding
product and process applications
Allow our customers to focus on their core competencies.
Can manage your product from design through to high
volume offshore manufacturing through our licensed
partners
Market Mix
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RF/ Wireless
Imaging
Medical
Military
WAN/ LAN/ Broadband
Telecom
Automotive
MEM’s, MOEM’s, sensors, etc.
Technology Driven
Pre-applied Adhesives
Prototype Design
And Assembly
Injection Molded
Plastic Packages
RJR Technologies
Sealing Equip.
ITS
De-reelers
AITS
Products/ Core Competencies
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Plastic Air Cavity Packages
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Thermally Enhanced SOIC, Power RF, High Freq RF (UHF, SHF),
LDMOS, etc.
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Plastic backed SOIC, MEM’s, MOEMS, Sensors
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Vision, CCD,
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Other
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Epoxy coated Lids – Metal, Composites, Ceramic, Plastic and Glass
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Flip Chip - Thermal Interface Adhesives
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Heat Sink - Thermal Interface Adhesives
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Windows - Vision Packages
Materials
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Full staff of polymer chemists have formulated a
complete line of B-staged adhesives.
Our view of the entire process has allowed us to
design functional materials you require today and
the future.
The common goals of all our materials are:
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Ionic purity
Near ‘Zero” outgassing
Fuse or cure in minutes (pushing the boundaries of today’s
competitive materials)
No Mess (it’s pre-applied)!!
RJR’s pre-applied Materials
Air Cavity
Package Lids
Plastic
Composites
Glass
Ceramic
Metal
Glass Windows
For CCD, CMOS
and other
Vision Devices
Flip Chip Devices
Adhesive Options
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Thermo-Set
Thermo-Plastic
Electrically Conductive
Thermally Conductive
Thermout™
Pulls heat away from the
device through the lid
RJR’S Optical Products
• Glass
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Standard Products
• Borosilicate glass
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Schott D263, Corning 1737F, Corning D211
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Supplied in standard thicknesses of 0.54mm and 0.71mm
• Material supplied cut on tape on rings (plastic or metal)
• Typical epoxy dispense pattern:
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0.76/1.40mm wide
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0.05/0.2mm height
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0.25mm typical pullback from edge
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Standard Coatings available
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Can be supplied beveled
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Wafer Cleaning
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Glass capacity to millions of units per month
Microwave Application
Low Chloride Quick Bond
1. RJR Supplied lids pre-applied Quick Bond
2. Place Packages and lids into the ITS or AITS
3. Start the cycle
4. Time from Start to cured ~ 4 minutes
5. Material is then fully cured!
Flip Chip Application
Thermout™
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Resilient material built to maintain thermal
contact between a die and a lid or cover
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B-stage material that is pre-applied
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Can be applied to ceramic or metals
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Exhibits elastomer type behavior at elevated
temperatures to maintain thermal performance
Retains elongation and resiliency at low
temperatures
Flip Chip Application
Thermout™
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Typical Properties of Thermouttm
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Thermal conductivity 1 – 3.5 W/mK
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Shear Modulus 360,000 psi
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Tensile Elongation 3%
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Water absorption 0.2%
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Shear strength 2,000 psi
Flip Chip Application
Thermout™
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Will withstand Mil-Std thermal cycling requirements
For PBGA Applications – Materials available that will
pass MSL Level III
For CBGA (HTCC or LTCC) Applications – Materials
available that will pass MSL Level I
168 hr. Autoclave
Can be manufactured with a variety of thermally
enhanced fillers – Aln, BN, Ag
Sealing Equipment
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Our staff of Expert Engineers have designed Semiautomatic AND Fully
Automatic solutions for your Packaging sealing needs
OUR Focus:
• Increase throughput
• Functioning today and with future applications
• Increase yields
• Eliminate “Blowouts”
• Accurate lid placement
• Decrease required floor space (REAL ESTATE)
Equipment - ITS
(Isothermal Packaging System)
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Semiautomatic
Custom Design & Built
Plates
Controls:
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** Run Rates are Dependant on
Package Size and Configuration
Time
Pressure
Temperature
UPH: 600 - 700*
99% + Yield
Air Cavity
Package Technologies
Plastic Backed
For Low Energy Cavity Package
Applications like
Sensors, etc.
CCD / CMOS
(Thermo-Plastic)
For Vision and Optical
Sensor applications.
Thermally Enhanced
Metal Backed
Eutectic & Non-eutectic
applications with
high thermal transfer
Eutectic Die Attach
in a Plastic Air Cavity Package !
This technology represents a
breakthrough in polymer based air
cavity electronic packaging. This
new low cost injection molded
packaging process allows the user
to combine the thermal advantages
gained by using a eutectic die
attach material between die and
backplane, with a moisture resistant
plastic sidewall specifically designed
to manage the higher power and
frequency output values previously
found only in ceramic packaging
systems/ technology.
Features:
• Eutectic Die attach
• Moisture resistant
• Low CTE
• CTE matched package
• Low Dielectric
• Low Parasitics
• High Power
• High Frequency
• Low Cost !
Package Applications:
• RF/ Microwave
• WLAN/ LAN
• Short Range Wireless
• MEMS/ MOEMS
• LDMOS
• CCD/ CMOS
RJR’s Injection Molded Packages
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Package Buildup
• Essentially 3 layers
• Thermal Base (Cu, WCu, CuMoCu, AlSiC, etc)
• Sidewall with leads
• Lids with epoxy (pre-applied)
• RJR formulated epoxy as interstitial layers
• Plastic alloy formulated to match the CTE of Copper or
Copper alloys (WCu, CuMo, etc.)
• Leads are coated with moisture resistant polymer, then
injection molded
• The 3 layers are fused together using RJR ITS equipment
RJR’s Injection Molded Packages
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Thermal Package Performance
• Moisture Resistant
• Eutectic Die attachable
• Thermal Dissipation >10 watts
• Handle Frequency > 2.5 GHz Have parts in service
at 5.8 GHz
• Pass JEDEC Level I Moisture Pre-Conditioning
• Pass Mil-Std 883 Section 1010 Condition C temp
cycle
• Anticipated improvement in electrical performance
compared to ceramic
RJR Air Cavity
Package Technologies
Benefits of RJR Packages vs Competition
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Equal or superior performance compared to ceramic
packages.
Fast turnaround time (two weeks) for prototype assembly.
Lower tooling costs.
Substantially less expensive !!
All Packages Available in Leadframe Format
Benefits of Thermally Enhanced Plastic Packages:
 Improved heat dissipation = lower die operating Temp. =
longer life!
 Less Expensive !!!
Thermally-Enhanced Package
Build process procedure (eutectic die attach)
Process Steps
RJR Polymers
1) Package Base
2) Leadframe with moisture barrier applied
3) Injection mold sidewall over leadframe
4) Nickel and Gold plate leadframe
5) Epoxy coat molded sidewall
Customer location –or- RJR Location
6) Perform Die attach to base leadframe
7) Using RJR’s ITS system – attach assembled base
leadframe to coated injection molded sidewall
8) Wire Bond device to package
9) Using RJR’s ITS system – seal package
lid to molded sidewall
10) Trim, Form and singulate
Thermally-Enhanced Package
Exploded View
Package lid with pre-applied adhesive
Lid Material: Plastic, Ceramic, Metal, Glass, etc.
Injection molded sidewall
Shown with moisture resistant seal encapsulating
the leads and pre-applied adhesive on bottom
surface
Wire Bonds
Device
Solder Preform or Epoxy, etc.
Package Base
Base Material: Cu, Cu/Mo, Cu/Mo/Cu, WCu, etc.
Completed Package
RJR’S Optical Packaging
• Packaging
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28, 32, 40, 48 and 52 lead count packages standard tooled
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Packages are capable of JEDEC level 1 for moisture preconditioning
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From design to prototypes in 6 weeks.
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Customers experience Low Cost/ Low barriers to entry for
product mechanical testing/ sampling
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RJR’s offers product solutions for drop in replacements as
well as new/ custom packaging.
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RJR solution includes the use of RJR assembly technology
RJR Polymers RF Power Products
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LDMOS, MMIC, FET, pHEMT, Wide Bandgap
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Power levels to +150 watt
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Frequency Management to +5.8 GHz
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Eutectic Die attachable (like all RJR Packages)
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Enabling Technology
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Internally matched elements transform impedence to
manageable levels
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Flat sealing surface – reduces gross leak failure
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Leadframe processing/ assembly
Low cost – approx. 60% of ceramic equivalents
RJR Air Cavity Package
Costs/ Deliverables
Benefits of R-Pak vs Competition
• Rapid turnaround time (~6 weeks) for prototype/ custom
packages
• Fast turnaround time (two weeks) for prototype assembly.
• Substantially lower tooling costs.
• Substantially less expensive packages !! Typically half the cost
of ceramic.
• Low barriers to entry
• Low Cost tooling
• Low cost packages
• Budget friendly
RJR’s Injection Molded Package
Program Rewards
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Equal or superior performance compared to
ceramic packages.
Moisture Resistant
Eutectic, epoxy, RTV, etc. Die attachable
Thermal Dissipation >10 watts
Handle Frequency >= 5.8 GHz
Can Pass JEDEC Level I Pre-Conditioning
Pass Mil-Std 883 Section 1010 Condition C temp
cycle
RJR Plastic Alloy – HTP-1000
R-Pak Plastic Body Compound
This custom thermoplastic compound is used in RJR R-Pak plastic body package technology. The following properties are
typical for the bulk material molded into standard test configurations defined by the applicable test method. These property
values are intended for general engineering purposes and are not intended for establishing product specifications.
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Physical:
 Density:
1.67 gm/cc
ASTM D792
 Water Absorption
0.02%
ASTM D570
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Mechanical @ 23C:
 Tensile Strength
21,000 PSI
ASTM D638
 Tensile Modulus
2.5 X 106 PSI
ASTM D638
 Elongation @ Break
1.2%
ASTM D638
 Flexural Strength
31,000 PSI
ASTM D790
 Flexural Modulus
2.4 X 106 PSI
ASTM D790
 IZOD Impact Strength Notched
1.6 ftlb/in
ASTM D256
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Thermal:
 Melting Point
280C (536F)
ASTM D3418
 DTUL @ 1.8 Mpa (264 PSI)
270C (518F)
ASTM D648
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Electrical:
 Volume Resistivity
1012 ohm-cm
ASTM D257
 Surface Resistivity
1017 ohm
IEC 93
 Dielectric Strength
766 V/mil
ASTM D149
 Dielectric Constant
3.8 @ 1 kHz
ASTM D150
3.7 @ 100 kHz
3.7 @ 10 MHz
 Dissipation Factor
0.007 @ 100 kHz
ASTM D150
0.003 @ 10 MHz
ASTM D150
 Arc Resistance
165 Sec.
ASTM D495
 Comparative Tracking Index 175 volts
ASTM D3638
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Chemical Resistance:
 Not affected by: Water, Acetone, MEK, Methyl celusolve, Hexanes, (Sulfuric Acid, Nitric Acid, and HCl) as used
in electroplating baths.
RJR Polymers Quality System
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Roadmap to ISO Certification - Scheduled for Q3 2003
Supplier to Global OEM’s
• Motorola
• Ericsson/ Infineon Microelectronics
• Agere Systems
• Philips Semiconductors
• Etc.
ASQC Plan (Incoming and Outgoing)
Provide QA on all components of product manufacture
• Raw materials for epoxy, plastics
• Lids
• Packaging products
Lot to Lot traceability back to Raw Material Components
RJR Summary
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RJR has the technology background
Integrated manufacturer
Provide Solutions
Manage the manufacturing cycle in-house
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Design
Product Development
Materials
Injection Molding
Coating products with epoxies
Light/ Prototype assembly
Offshore Partners
Equipment manufacturer – ITS, AITS
Innovative thinking
The Total Electronic Package Solution
South Korea
Ken Park
Far East Representative
201-104 Byuk-San BLDG
Jookjeon-ri, Su-ji-Up Yong-in Si
Kyunggi-Do, Korea
Mobile: 011-82-11-839-7929
Fax 031-683-8182
E-mail:kpark@rjrkorea.co.kr
Europe
Renaud de Langlade
European Representative
Managing Director
NovaPack Technologies
Parc d’Activities de Pissaloup
4 rue Edouard Branly
78190 Trappes
France
Ph 33 1 64 48 76 67
Fax 33 1 30 68 10 86
Mobile: 33 6 20 42 91 63
E-mail: rdl@novapacktech.com
Eastern USA
Scott Mellen
Eastern Regional Sales Manager/
Sales Engineer
Ph (315) 676-4134
Fax (315) 676-5319
Mobile: (315)415-9401
E-mail: smellen@rjrpolymers.com
Western USA
David Pasfield
Western Regional Sales Manager/
Sales Engineer
Ph (707) 782-9257
Fax (707) 782-9268
Mobile: (707) 484-9669
e-mail: dpasfield@rjrpolymers.com
Midwestern USA
Dave DeWire
Director Sales and Marketing
Ph (303) 543-2223
Fax (303) 543-7123
Mobile: (303) 921-2222
E-mail: ddewire@rjrpolymers.com
Taiwan/Pacific Rim Region
Michael Leong
Pacific Rim Regional Sales Manager/
Sales Engineer
8-15-06, Jalan Gangsa
Greenlane Heights
Penang 11600
Malaysia
Ph 011-604-655-2468
Fax 011-604-658-2468
Mobile: 011-6012-486-5468
E-mail:mleong@maxis.net.my
RJR Polymers Inc.
Contact Information