MICROELECTRONICS
ENGINEERING
GROUP
Contact:
Assoc. Prof. Yasar Gurbuz
Faculty of Engineering & Natural Sciences
Sabanci University
Orhanli, 34956 Tuzla, Istanbul, Turkey
Tel: +90 216- 483 9533, Fax: +90 216- 483 9550
e-mail: yasar@sabanciuniv.edu
MAJOR AREAS OF RESEARCH
Microelectromechanical Systems (MEMS):
Modeling, simulation
and fabrication of silicon micromachined mechanical systems; pressure,
acceleration sensors, ultrasonic transducers, RF-MEMS; resonators, oscillators,
filters.
Integrated Circuits and VLSI Design and Technology:
RF/Analog/Digital/Mixed Signal ICs, SoC ASIC Design, Hardware realization of
dedicated DSP architectures, High Speed A/D, D/A Converters, Modeling and
Simulation of Semiconductor Devices.
Photonics and Optoelectronics: High Speed ElectroOptic
Modulators, Chip-scale Photonic ICs, Wavelength Division Multiplexing (WDM)
Fiber Optic Network Components, Quantum Dots, Quantum Cyptography,
Optical Thin Film Coating and Fiber Optic Sensors.
MICROELECTRONICS GROUP
Ayhan BOZKURT
E-mail : abozkurt@sabanciuniv.edu
Phone : +90 216 483 9537
Fax : +90 216 483 9550
Education
•PhD. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1994-2000
•MSc. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1992-1994
•BSc. in Electrical and Electronics Eng., Bilkent University, Ankara, Turkey,1987-1992
Research Interest
• Acoustic Non-destructive Evaluation (NDE)
• Modeling and Fabrication of Microelectromechanical Systems (MEMS)
• Transducer Design for Ultrasonic Imaging
• IC Design for Sensor Interfaces
• Low-level Microprocessor/DSP Programming
MICROELECTRONICS GROUP
Cem ÖZTÜRK
E-mail : cemozturk@sabanciuniv.edu
Phone : +90 216 483 9593
Fax : +90 216 483 9550
Education
•PhD, Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA, 2002
•MSc, Electrical and Computer Engineering, University of California, Santa Barbara, CA, USA, 1997
•BSc, Electrical and Electronics Engineering, Bogazici University, Istanbul, Turkey, 1995
Work Experience
•Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics Group (Sep 2003present)
•Assistant Research Engineer, Electrical and Computer Engineering Dept., University of California,
Santa Barbara, CA, USA (Mar 2002- Aug 2003)
•Research Assistant, Electrical and Computer Engineering Dept., University of California, Santa
Barbara, CA, USA (Sep 1995- Mar 2002)
Research Interests
•Photonics, Chip-scale Photonic Integrated Circuits, Optoelectronic filters and add/drop Mux/DeMux,
WDM Fiber Optic Networks and Components, Ultra-high speed electrooptic and quantum well
modulators, Semiconductor and hybrid integrated processing technologies.
MICROELECTRONICS GROUP
İlker HAMZAOĞLU
E-mail : hamzaoglu@sabanciuniv.edu
Phone : +90 216 483 9577
Fax : +90 216 483 9550
Education
•PhD, Computer Science, University of Illinois at Urbana-Champaign, IL, USA, 1999
•MSc, Computer Engineering, Bogazici University, Istanbul, Turkey, 1993
•BSc, Computer Engineering, Bogazici University, Istanbul, Turkey, 1991
Work Experience
•Faculty Member, Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics
Group (Sep 2003-present)
•Principle Staff Engineer (Dec 2002- Aug 2003), Senior Staff Engineer (Aug 1999- Dec 2002),
Multimedia Architecture Lab, Motorola Labs, Schaumburg, IL, USA
•Visiting Lecturer, Computer Science Dept., University of Illinois at Urbana-Champaign, IL, USA
(Summer 1998, Summer 1999)
•Teaching and Research Assistant, Computer Science Dept. and Electrical and Computer Engineering
Dept., University of Illinois at Urbana-Champaign, IL, USA (Jan 1994- July 1999)
Research Interests
Embedded Systems (Hw/Sw) Design, Digital SoC ASIC Design, Computer-aided Design, Verification
and Testing for Digital SoC ASICs, Embedded Microprocessor Architectures, Parallel Processing.
MICROELECTRONICS GROUP
Meriç ÖZCAN
E-mail : meric@sabanciuniv.edu
Phone : +90 216 483 9506
Fax : +90 216 483 9550
Education
•PhD, Electrical Engineering, Stanford University, Stanford, CA, USA, 1991
•MSc, Electrical Engineering, Stanford University, Stanford, CA, USA, 1986
•BSc, Electrical Engineering, Middle East Technical University, Ankara, Turkey, 1984
Work Experience
•Sabanci University, Faculty of Engineering & Natural Sciences, Microelectronics Group
(02-present)
•K2 Optronics Inc., Director of Advanced Research, Sunnyvale, CA, (00-01)
•NASA Ames Research Center, Research Scientist, Moffett Field, CA (91-00)
•Stanford University, Research Assistant, Stanford, CA (84-91)
Research Interests
•Analog and Digital Electronic Design, High Frequency Electronic Design, Optoelectronics,
Fiber Optic Communication, Quantum Electronics, Quantum Computing, Quantum
Cryptography.
MICROELECTRONICS GROUP
Yasar GÜRBÜZ
E-mail : yasar@sabanciuniv.edu
Phone : +90 216 483 9533
Fax : +90 216 483 9550
Education
•1997 Ph. D., Electrical Engineering, Vanderbilt University, Nashville, TN
•1993 MSc, Electrical Engineering, Vanderbilt University, Nashville, TN
•1990 BSc, Electronics Engineering, Erciyes University, Kayseri - Turkey
Work Experience
•2000- Faculty Member, Sabanci University, FENS
•1999-2000 Project Manager, Aselsan Inc., MGEO, Ankara
•1997-1999 Senior Research Associate, Vanderbilt University
•1991-1997 Research / Teaching Assistant, Vanderbilt University
Research Interests
•Microelectromechanical Systems (MEMS)
•Analog and RF Integrated Circuits
•Solid-State Sensors
•Microelectronics Devices
•Semiconductor Technology
Memberships:IEEE Solid-State Circuits Society, SPIE
MICROELECTRONICS GROUP
Chem/Bio
Pressure
Light
Thermal
Electrical
etc.
LAB CAPABILITIES
Idea
Design/Simulation
Mask Making
(outsourcing)
Etching (wet/dry)
Patterning
Wire Bonding
Packaging
Deposition/Sputter
Testing
(Atmospheric Pressure)
Sensors &
Transducers
Testing
(Sub-Atmospheric Environment)
MICROELECTRONICS GROUP
Vacuumed Cavity
Cleaned Silicon
Substrate
Design and Simulation Lab
Software:
Hardware:
•SUN Workstations
• Europractice
• 3x ULTRA-10 (1 GByte RAM)
• Cadence / Synopsys
• 4x ULTRA-5 (512 MByte RAM)
• HSpice, Saber
•24x HP Pentium IV PCs
MICROELECTRONICS GROUP
• MemsCap, MemCad, Ansys
Class 1000 Clean Room
MASK ALIGNER
Specs
•Exposure Optics UV:
300nm
•Automated delivery
system
•Variable Dose
•Separate View
Aligners
Capability
•1um resolution
MISC. FACILITIES
SPUTTER
•Microscope
•Ultrasonic Cleaner
•Balance
•Hot Plate Stirrer
•Small Capacity Furnace,
3 zone (1200oC)
Specs.:
•Vacuum: 10-7 Torr
•Temperature 350oC
•RF Power (600W) , DC
Power (500W)
•20 – 100kHz variable
frequency pulse
•3 Gas inputs
•Load Lock Chamber
•Computer Controlled
Deposition Capability:
•Metals
•Oxides
•Reactive coating
•oxides & nitrides
WET BENCH
•Class 100 Hood
•Hot plate
•Spinner
•Ultrasonic Cleaner
•Etch Basin
•DI Water & dry air
MICROELECTRONICS GROUP
RIE
Specs:
ICP, 1500W, 13.56MHz
•RIE, 600W
•4 Gas Lines
•0.05-0.5mbar
•End Point Detector
Etch Capabilities:
Oxide
•Nitride
•Semiconductor (Si.
GaAs etc…)
•Metals
Test and Measurement Lab
• IC Probe Station
• Surface Profiler
• Logic Analysis System
• Semiconductor Parameter Analyzer
• 500 MHz Infiniium Oscilloscope
• 1 GHz Infiniium Oscilloscope
• Spectrum Analyzer
• Impedance Analyzer
• RF Signal Generator
• Sampling Oscilloscope
• Arbitrary Waveform Generator
• Pulse Generator
MICROELECTRONICS GROUP
SPONSORED RESEARCH EXAMPLES and WORKING ENVIRONMENT
•TARGET, EU-6th Frame Work Project (2004-2008) (http://www.target-net.org):
European research in the field of microwave power amplifiers for broadband wireless access
(including RF-semiconductor technology, RF-IC, RF-MEMS, RF system architectures)
• RF-MEMS for wireless appications:
•MINAEAST-NET, EU-6th Frame Work Project Project
Resonators, Filters and Oscillators
(2004-2006),
http://www.minaeast.net
involving micro and nanotechnologies.
•MEMS-Based Chemical Sensors and
Interface Electronics (Mixed-Signal IC)
(TUBITAK, 2001-2004)
•High-Voltage Front-End IC Design CMUT
(TUBITAK, 2003-2005)
Sensor Read-out
CDR
PLL
• High-Voltage Front-End IC Design CMUT
•MEMS-Based Chemical Sensors
DC-DC Conv.
Sensor Read-out
IC & MEMS Design
and simulation lab.
Class-1000 Clean Room
Test and Characterization (RF/microwave,
small/large power and optical)
IEEE 802.11a-b:
- Bit rate: 110 and 220Mb/s
- Power consumption: 100mW and 250mW
- Bandwidth ≥ 500MHz
- Number of channels: 5
-Total signal power: +20dBm
-- Adjacent channel power ratio,
(ACPR) better than 30dBc at 500MHz bandwidth
-PAE PA unit: better than 40%
-Reference PLL from 3.35GHz to 10.35GHz, step
250MHz
- MEMS based pass-band filter: 3.1-10.6GHz,
roll-off selectivity 20dB/500MHz.
Important semiconductors
MOSFET structure
Source
Group IV materials
III-V compounds
Drain
 elements: C (diamond), Si, Ge
 compound: SiC
 solid solution: SixGe1-x, x = 0 … 1




GaAs, AlAs, InP, …
low gap: InAs, InSb
wide gap: GaN, AlN
solid solutions: GaxAl1-xAs, …
Gate
Source
n+
II-VI compounds
Gate
 ZnSe, CdTe
 wide gap: ZnS, MgS
 solid solutions: ZnxMg1-xSySe1-y, …
Drain
n+ cap
Barrier
cap
L
Barrier / buffer
High Electron Mobility Transistor
Substrate
Channel layer
2DEG channel
E
B
C
B
C
HeterostructureBipolarTransistor
RF Devices
E
MOSFET structure
Source Gate
B
Gate
Source
Drain
n+
cap
L
B
Drain
n+ cap
Barrier
C
C
Barrier / buffer
High Electron Mobility Transistor
Substrate
Channel layer
2DEG channel
HeterostructureBipolarTransistor
RF ICs
PLL / VCO
Power
Amplifer
LNA
Mixer
TRx – RF System
MICROELECTRONICS GROUP
RF MEMS for TRx
Resonators
VC-Capacitors
Filters
Switches
Inductors
MICROELECTRONICS GROUP
RF Integrated Circuits and MEMS for TRx
PLL / VCO
Power Amplifer
Mixer
LNA
MICROELECTRONICS GROUP
Micro and
Nanotechnologies going
Eastern Europe through
Networking
INCO-CT-2004-510470
Project Objectives
MINAEAST-NET is intended to be a tool for achieving a better
integration of eight ACCs (Romania, Hungary, Poland, Slovenia,
Slovakia, Lithuania, Bulgaria and Turkey), in projects for FP6 on Micro
and Nano Technologies.
•MINAEAST-NET will be established as the premier source of
information about resources and results in MNT from ACCs and
about the strong points of the ACC organisations.
•Organisations and companies from MS (and world-wide) that are looking
for partners in MNT for any kind of projects, should address their needs to
MINAEAST-NET and MINAEAST-NET will definitely find the best
partner suited for them.
Acad. Dan Dascalu,
Project coordinator
Email: dascalu@imt.ro
www.imt.ro
•For all MNT interested organisations from ACC, MINAEAST-NET will
be the main source of MNT specific project and partnership
information: MNT related information about EC calls, international
networking activities, partnership search from abroad.
Turkey
contact point:
•MINAEAST-NET will support interaction between ACC and MS
organisations to initiate FP6 proposals through organising meetings,
workshops and support travel cost.
Yasar Gurbuz,
Sabanci University
www.sabanciuniv.edu
Email: yasar@sabanciuniv.edu
•MINAEAST-NET will also be the little helper with any questions
concerning proposal set-up and regulations for ACC organisations all
that especially for MNT.
Micromachined Chemical Gas Sensor and
Signal ReadOut Integrated Circuitry
Material characterisation
Electrical characterisation
Micromachined Gas Sensor
Sensor Read-out IC
Back-side etched
Sensors
Close-up view
Sensors
MEMS for Ultrasonic Imaging
Capacitive Micromachined
Ultrasonic Transducer (CMUT)
Annular Array used in
IVUS Imaging
Ultrasound Generation
Echo Detection
MICROELECTRONICS GROUP
MEMS for Ultrasonic Imaging
High-Voltage Front-End IC Design CMUT
MICROELECTRONICS GROUP
Pending Projects
• Micro and NanoTechnologies for
Automotive Applications - EU 6th FrameWork
• Sensors / MEMS and IC / VLSI Systems
• Protein microchip design; cardiovascular
risk assessment platform – DPT / TÜBİTAK
MICROELECTRONICS GROUP
Ultra Wide Band (UWB) Wall Penetrating Radar
• Ultra wideband technology has its origins in the development of time domain
(impulse response) techniques for the characterization of linear, time invariant
microwave structures.
• A short pulse in time has a large bandwidth in frequency domain hence it is
called ultra wide band waveform.
• UWB radar also uses radiated and reflected electromagnetic waves to detect,
locate and identify targets.
• The advantage of using UWB waveforms for radar include better spatial
resolution, detectable materials penetration, easier target information recovery
from reflected signals and lower probability of interference than with the
narrowband signals.
• Here we are developing a hand held behind the wall moving object/persons
detector for intelligence and surveillance. Same system can also be used for
people detection under the ruins after an earthquake for example….
MICROELECTRONICS GROUP
Ultra Wide Band (UWB) Wall Penetrating Radar
Block Diagram of the system currently under development:
Transmitter
Code
Generator
Pulse
Generator
I
Programmable
Time Delay
Adjustable
Delay
Clock
Oscillator
Pulse
Generator
II
Pulse length <1ns
Energy concentrated in 2-6GHz band
Average Power < 10uW
Receiver
Correlator
Baseband
Signal
Processing
S/H
MICROELECTRONICS GROUP
Integrator
Multiplier
Hybrid Tunable Wavelength Division
Multiplexed (WDM) Filter
Cladding
Core
Polymer
Cladding
1500
0
-2
1505
1510
1515
TE
-4
-6
-8
-10
-12
-14
-16
Vr = 5 V
No bias
-18
1520
Fiber to fiber insertion loss (dB)
GaAs Epi
Fiber to fiber insertion loss (dB)
(MOST Research Center funded by DARPA @ UCSB)
1500
0
1505
1510
1520
-2
-4
-6
-8
-10
-12
No
Bias
Vf=2.1 V
If=20 mA
-14
-16
Vf=1.5 V
If=14 mA
-18
Wavelength (nm)
1515
TE
W avelength (nm)
Gold
•Low loss and low cost due to fiber matched
Polymer waveguide, fast tuning through GaAs
electrooptic effect (nanosec.s)
p-contact
PMGI
BCB
GaAs
p-GaAs
GaAs
n-GaAs
PDBCB
n-contact
PMGI
BCB
•Fast thermoelectric control (microsec.s)
GaAs transfer substrate
MICROELECTRONICS GROUP
•Arbitrary filter spectra and multiwavelength
operatiom easily achiavable.
Gold
InP-and GaAs-based Optical
Microresonator Devices
(CSWDM Research Center funded by DARPA @ UCSB)
GaAs Microdisc
Active WG Structure
1.9 m
2265 A
0.1 m p-InGaAs
0.8 m p-InP
1 m p-InP
500 A nid InP
500 A p-InP
500 A nid InP
250 A 1.226Q
1015 A QW
BCB
PMGI
Passive WG Structure
0.1 m p-InGaAs
0.8 m p-InP
1 m p-InP
PDBCB
BCB
1.9 m
500 A nid InP
100 A nid InP
3500 A 1.4Q
1.8 m n-InP
Common WG Core
1
Transmission
0.95
m=124
1
0.9
m=122
0.95
0.85
0.9
0.8
0.85
m=123
0.8
0.75
MICROELECTRONICS GROUP
0.75
1535.5
0.7
1500
1536
1536.5
1510
1537
1537.5
1520
1538
1538.5
1530
Wavelength (nm)
1540
1550
1560
Digital SoC ASIC
Examples
Personal Digital Assistants (Application Processors and Hardware
Accelerators)
Digital Cameras/Camcorders (Image/Video Processing/Compression
Systems)
Cellular Phones (Baseband Processors, Application Processors and
Hardware Accelerators)
Entertainment Devices (Game Station (Graphics Processors), MP3
Player (Audio Processors), Set-Top Box (Video Processing,
Security))
Storage Devices (Hard Disk Controllers, RAID Controllers)
Biometric Devices (Image Processing, Cryptography)
Networking Devices (Switches, Routers)
Automobiles (Engine Control, Lane Departure Warning Systems)
MICROELECTRONICS GROUP
H.264 / MPEG4 Part 10
Video Compression Standard
• The latest video compression standard
• Performs 50% better than the next best standard
• Standardized by both ISO and ITU
• Targets a broad range of applications, e.g. wireless
video, digital TV, video-on-demand, DVD
The improved quality of H.264 requires intense
computational power making it a very exciting
challenge for real-time implementation !
MICROELECTRONICS GROUP
H.264 / MPEG4 Part 10 Encoder
Current Frame
(Fn)
Reference
Frame(s)(F'n-1)
Reconstructed
Frame (F'n)
Transform
Quant
Inverse
Transform
Inverse
Quant
CAVLC
Motion
Estimation
Mode
Decision
Intra
Prediction
Deblocking
Filter
• Designed and Implemented Modules
• Forward Transform and Quant, Inverse Transform and Quant, CAVLC
• Module Implementations in Progress
• Motion Estimation, Intra Prediction, Deblocking Filter, Mode Decision
MICROELECTRONICS GROUP
Arm Processor and Xilinx FPGA
based Prototype Platform
Xilinx FPGA Board
Xilinx Virtex II FPGA
Arm Processor
Motherboard
MICROELECTRONICS GROUP