CDF
RunIIb Silicon Project
• Successful Lehman Review Sept.
24-26
Workshop at LBL 10/23-10/25:
• Wednesday-Thursday
 hybrids testing and burnin plans
 status of construction and
testing of modules and staves
 contributions and plans for
various groups on Run IIb
• Friday (joint with D0)
 Chip status and schedule
 Grounding issues
Brenna Flaugher Oct. 31th CDF Meeting
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CDF
Lehman Review Results
 No “Findings”
 Committee was impressed with advance state of
prototyping
 Told us to reduce the $ contingency and increase
schedule contingency.
 Additional “guidance” from Lab has been included
– we think we have a final schedule
• Total silicon project cost Now Oct 02:
 14.3M$ + 5M$ contingency = 19.3M$ (FY02$)
 was 13.6M$ + 6.6M$ = 20.2M$ at Lehman Review
• We are approved as much as possible
– Run IIb still contingent on accelerator review
– still have to get through a few external reviews of
project management issues.
Brenna Flaugher Oct. 31th CDF Meeting
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CDF
Stave: conceptual view
• 2 sensors + hybrid = 1 module
• 3 modules per side
• 1 MPC per stave
• 1 readout unit per stave
Chips
• Stave is 66 cm long
Cooling tubes
Mini PC
Mounts
Wing Cable
Hybrid
Pitch Adapter
Sensors
Mounting holes
Brenna Flaugher Oct. 31th CDF Meeting
We now have all components
in hand and have made the
first electrical stave!
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CDF
Silicon Sensors
All detectors are single sided and based on the high voltage operation layout
(CMS,ATLAS,L00)
 Prototype stereo
sensors delivered to
Tsukuba last week.
 High yield on axial
sensors and high
quality (0% bad
channels grade “A”
and 0.07% grade “B”)
 characterization of
stereo sensors in
progress
 Testing of irradiated
axial sensors is in
progress
 Production signoff
scheduled for Nov.
25th
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CDF
Prototype Stave Assembly
Brenna Flaugher Oct. 31th CDF Meeting
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CDF
Brenna Flaugher Oct. 31th CDF Meeting
1st Electrical Stave
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CDF
SVX4 chip
• 1st full prototype submission
in April ‘02
• Chip back in June ‘02
Tested at LBL and FNAL
No major problems found
Corrections for bow and
channel to channel
variation are in progress
Yield looks very good,
~85% (but low stats)
Next Submission Mid. Jan.
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CDF
Chip Schedule
on critical path
Summer submission (preproduction?) has only 10 days of slack
Brenna Flaugher Oct. 31th CDF Meeting
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CDF
Module
• Ten modules fully assembled
• Hybrids work with No problems!
• Module tests at LBL in progress,
Soon will test at FNAL (FCC)
with full DAQ
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CDF
Pre-prototype stave tests at LBL
• One module glued to bus
cable on carbon fiber
(top of stave)
• First results with
deadtimeless operation
on a stave!
• looks pretty good - many
things still to optimize,
all peaks go away with
DPS (RTPS) on
• Second module sent to
LBL and new results will
come soon
Brenna Flaugher Oct. 31th CDF Meeting
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CDF
Workshop: Friday
• Discussion with chip designers, CDF and D0 about chip schedule
• Two problems are being addressed with next submission
 Bow and channel-channel variations
• everyone seems to agree on the plan (we meet weekly)
 Simulations at LBL have reproduced the channel to channel variations
 Layout changes are in progress at LBL and FNAL: Submit mid Jan. 03
 For next submission two new versions will be submitted: Min and Max
changes. Also the current version of the chip will be included for quality
control
• Grounding Discussion
 We are starting to work out plans for grounding staves
– Connect CF in staves to ground at the mini portcard
– Connect stave ground to bulkheads and screens
– Connection to L0 ground
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CDF
Critical Path Milestones
1st prototypes: now-2/03
2nd prototype round
2/03 – 9/03
preproduction
9/03 – 3/04
Production
3/04 -3/05
Project complete
7/18/05!
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CDF
•
•
•
•
•
Conclusion (1)
We have an aggressive schedule, but already most of the prototype parts work well.
1st electrical stave is ready for testing!
Preprototype stave tests at LBL look good so far but just started.
Commitments to Run IIb
 LBL is doing tests with prototype chips, hybrids, modules and pseudostaves and is
committed to providing oversite of Hybrid production
 Davis is preparing for Hybrid burnin and testing
 Helsinki is going to send 3 people to LBL for ~9mths this spring and will continue
to provide support for hybrid assembly, testing and burnin
 Will need to send more people to LBL/Davis for full production efforts
 Uof I is developing a PC based test stand
 Uof I and Rutgers are collaborating on Stave Burnin
 Sensor testing at Purdue, UNM, Tsukuba
Discussions in progress of other groups – We need to get MOUs with all the groups
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CDF
Conclusion (2)
• Completion date is July 18th 2005 – our schedule
• Official completion date with Lab contingency is May 31, 2006
• Could gain time on July 18th date by eliminating the 2nd
prototype round of DAQ components.
• L0 is not on the critical path. We want to keep it that way.
 need to have acceptable cables to make progress on design
• We are already scheduling signoff meetings for going into
production
 sensors – Nov. 25th
 beampipe flanges – done (beampipe is already being fabricated)
• Lab and Sidet are preparing to provide large labor force for Run IIb
• This is a great time to join Run IIb – Plenty of hardware projects for
students and postdocs. Come talk to us!
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