Environmentally Benign
Manufacturing
WTEC Study sponsored by NSF
Delcie R. Durham
National Science Foundation
December 2000
Manufacturing
The manufacturing enterprise requires the
integration of the appropriate scientific,
engineering, and mathematics disciplines with
design objectives within a systems framework
where the desired outcome is a viable product
or service.
Product realization, integrated product and
process development, concurrent engineering are
all aspects of the manufacturing enterprise.
Economics, energy and environmental issues
define viability.
Industrial Ecology
Seeks to analyze and control materials flows
across regional or national boundaries to reduce
resource depletion and environmental effects.
is defined to encompass diverse disciplines such
as engineering, environmental health sciences,
life-cycle analysis (LCA), economics, social
sciences, and public policy.
Is macro in nature.
Sustainable Production Model - EU
VIRTUAL
PRODUCTION
design
production
distribution
PHYSICAL
PRODUCTION
use maintenance
dismissal
recycling
© CNR-ITIA
REVERSE
PRODUCTION
MANUFUTURING - EU
VF
Virtual
Factory
Phys.
Factory
PF
..........
Producers of
final goods
Virtual
Factory
Producers
of subassemblies
Phys.
Factory
..........
Suppliers of raw materials and components
CONTEXT
© CNR-ITIA
Environmentally Benign
Manufacturing (EBM)
Environmentally benign manufacturing is involved
with the technologies, the operational practices,
the analytical methods and strategies for
sustainable production within the industrial
ecology framework. (Sheng, Durham, Wellek)
Specifically addresses the development and
implementation of benign materials processing to meet
the challenges of sustainable materials flow in a use and
reuse environment
It also addresses systems consideration of remanufacturing, reuse, and recycling in total waste-stream
management.
Life Cycle Analysis
Recycling and
Disposal
Produce Use
Product
Development
and Design
Acquisition of
raw materials,
components, and
sub-assemblies
Product
Manufacture
Product
Packaging and
Distribution
taken from Richards and Frosch, 1997
Product manufacture
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Minimize emissions
Minimize wastes (solid, fluid)
Conserve water, energy, materials
Reduce toxicity, exposure
Substitute more benign materials
Substitute more benign processes
Assure worker health and safety
Find new uses for wastestreams
Recycling and disposal
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Design for reusability
Design for remanufacturability
Design for separability
Design for disassembly
Design for recyclability
Design for diposability
State of International Environmental
Performance Standards
In the electronic equipment manufacturing,
IEC* has concerns with:
 the primitive state of LCA
 pollution prevention
environmental impact assessments
design for disassembly
IEC - International Electrotechnical Commission
Information from The Ecology of Industry, NAE,
Manufacturing, Laudise & Gradel
EBM Panel Mission
Advance understanding of EBM
Establish baseline and document best practices;
– Policy, practice,and motivation
– infrastructure and technology,
– methodologies and metrics,
– goals and assessments
– research
Identify research opportunities
Promote international cooperation
EBM Panelists
• Timothy Gutowski
(Chair)
• Cynthia Murphy
(Co-chair)
• Thomas Piwonka
• Paul Sheng
• John Sutherland
• Deborah Thurston
• David Allen
• Egon Wolff
• Diana Bauer
• Delcie Durham (NSF)
• Bert Bras
• Fred Thompson (NSF)
Focus Areas
Metal Processing
Polymer Processing
– thermoplastics and
thermosets,
– composites
Applications
– automobiles
– electronics
Potential Scope of EBM
• So where and what is EBM?
Sites Visited: Japan
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Fuji Xerox
Hitachi PERL
Horiba, Ltd.
Kubota
MITI/Mechanical Eng.
Lab.
MITI/AIST/NIMC
Nagoya University
NEC Corporation
Nippon Steel
Corporation
NIRE
• New Earth Conference
& Exhibition
• NRIM
• PVC Industrial
Association
• Sony Corporation
• Toyo Seikan Kaisha
• Toyota Motor
Corporation
• University of Tokyo
• Institute for
Industrial Science
Sites Visited: Europe
Belgium, Denmark, Netherlands, Germany,
Sweden, Switzerland
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Corus Holland
DaimlerChrysler
Denmark Tech. U.
EC Environmental
Directorate
EC Research and
Technical Development
Excello
Fraunhofer, Aachen
Fraunhofer, Berlin
Fraunhofer, Stuttgart
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ICAST
IVF
MIREC
Siemens
TU Aachen
TU Berlin
TU Delft (Ministry of
Environment, Lucent Tech.,
Phillips)
• Univ. of Stuttgart
• Volvo
Sites Visited: U. S.
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Applied Materials
Caterpillar
CERP
Chaparral
Steel/Cement
DaimlerChrysler
DRI
DuPont
Federal Mogul
Ford
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GM
IBM
Interface
Johnson Controls
MBA Polymers
Metrics Workshop
Micro Metallics
NCMS
R & D Activities
Preliminary Assessment
Activity
Relevant Basic Research (>5 years
out)
Polymers
Electronics
Metals
Automotive/Transportation
Systems
Applied R&D ( 5 years out)
Polymers
Electronics
Metals
Automotive/ Transportation
Systems
Japan
US
Europe
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Industrial Activities
Relative Competitiveness
Activity
ISO 14000 Certification
Water Conservation
Engergy conservation/CO2 emissions
Decreased releases to air and water
Post Industrial solid waste
reduction/recycling
Post-consumer recycling
Material and Energy inventories
Alternative material development
Supply chain involvement
EBM as a business strategy
Life-cycle activities
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Japan
US
Europe
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Government Activities
Relative Competitiveness
Activity
Japan
US
Take-back legislation
Landfill bans
Material bans
LCA tool and database development
Recycling infrastructure
Economic incentives
Regulate by medium
Cooperative /joint efforts
with industry
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Financial and legal liability
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Europe
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Preliminary Findings of
WTEC Study
Future needs:
products designed for re-use
better reprocessing technologies
introduce EBM as part of being “lean” rather than
new
integration of financial and environmental
systems
re-use / life prediction modeling
accounting system for the “value” of EBM in
processing / design selection
Design for Environment Focus Areas
Materials of concern
– Reduction
– Elimination/substitution
Design for disassembly and reuse
– Assembly technology and materials
– Reduction in number of materials used
– Reduction in use of coatings and other
inseparable materials configurations
Volume reduction
– Manufacturing
– Products (EOL disposition)
Japanese LCA Working Groups
Inventory Committee
– Collect process emission data across industries for CO2,
CH4, HFC, PFC, N2O, SF6, NOx, SOx, particulate, BOD,
COD, phosphorus, nitrogen, suspended solids.
– Develop methodology for attributing emissions for recycling
and disposal.
Database Committee
– Construct internet-accessible database with procedures for
maintenance and data updating.
Assessment Committee
– Develop damage functions for category endpoints.
– Develop a weighting methodology appropriate for Japan.
Reuse
US:
Reuse is pursued primarily when it makes business
sense.
Most reuse is done by third party
remanufacturers.
Automobile parts, manufacturing equipment are
well established remanufacturing infrastructures.
Electronic industry does not have a reuse mindset
(yet).
Reuse Cont’d
Japan:
“Inverse Manufacturing” seems to be well known
phrase in many companies.
Electronic companies are thinking about using
“inverse manufacturing” and service industry paradigm
(rather than being product sales oriented) to their
advantage.
Still, “classical” remanufacture and reuse problems
persist
• set-up of reverse logistics network is challenging
• need for better reprocessing technologies
• products not designed for reuse - designers need reeducation
• radical new concepts still in laboratory stage
• Profitability can still be a problem
Silicon Valley Encourages Chemical
Reduction
The Silicon Valley Manufacturing Group has created a pilot
program for area manufacturers to reduce the amount of
chemicals they are using in their factories. The group will
demonstrate a business model that uses third party
"chemical management services" (CMS) firms to help
manufacturers cut costs and optimize the use of chemicals.
One semiconductor company using a chemical service
provider cut its chemical use by 50 percent, adds Chemical
Strategies Partnership, a non-profit organization that
promotes third-party chemical services. "When managers
appreciate the hidden costs of chemical use - inventory,
liability, waste, tracking, disposal -- they see how CMS can
benefit them."
SOURCE: Manufacturing News Daily, October 20, 2000
Electronics - Overview
• Electronics industry tends to be proactive
(worldwide)
– Life-cycle Assessment (LCA)
– Design for Environment (DFE)
– End-of-Life Management (ELM)
• Industry culture of minimization, costreduction, and increased efficiency are all
compatible with EBM
Electronics - Overview cont’d
• Used to inserting and integrating new designs,
technologies, and equipment
– Average product life span of 18 to 24 months
– Complete capital equipment turn-over every 5 years
• Expert at managing and analyzing large
amounts of data (legacy of quality movement)
Component and PWB Manufacture
Wafer fabrication
– Reduction in water use
– PFC (perfluoro compound) emissions
IC Packaging and assembly
– Pb solder
– Flame retardants
– Material waste (especially thermosets)
PWBs
– Water reduction
– Plating solutions
– Flame retardants
Materials and Environmental
Concerns - Integrated
Circuits
Wafer fabrication
Chip packaging
Product materials: Si, SiO2, Al, ± Cu
EBM Issues: Water, energy, gas
emissions (especially PFCs - perfluoro
compunds)
Product materials: Polymers,
Ceramics, Ni/Au alloys, Cu, Au
EBM Issues: Energy, metal-bearing
liquid waste, flame retardants,
material waste
Wafer Fabrication
Large, highly capital intensive manufacturers
Equipment driven
Small feature size (sub-micron) requires extremely
clean processes
Deposition of very thin layers is done using gaseous
processes
Key concerns are qualification of new materials,
reduction in PFC emissions, reduction in energy and
water usage (SIA Roadmap)
NSF Engineering Center, SEMATECH
Materials and Environmental
Concerns - Printed Wiring Boards
PWB fabrication
Product materials: Ceramic, epoxyglass, or other polymers; Cu, Pd, Pb,
Au
EBM Issues: Water, energy, flame
retardants, Pb finishes, plating
solutions
Product materials: Pb/Sn
EBM Issues: Energy, Pb
PWB (board-level) assembly
PWB Fabrication
Many manufacturers of varying size, both
independent and captive; moderately capital intensive
Material and process driven
Relatively small features (3 to 4 mils) require clean
environment
Plating baths use large amounts of water and complex
chemistries (organic and inorganic compounds)
Lamination of multiple layers is very energy intensive
Several PWB projects under EPA’s DfE Program and
DARPA’s Environmentally Conscious Manufacturing
Program
PWB (Board-level) Assembly
Capital intensive
Use of Pb solder dominates environmental
concerns
Soldering processes can be very energy
intensive and are higher for Pb-free solders
Trim waste (epoxy-glass ± copper) can be 50%
of the total material budget
Materials and Environmental
Concerns - Computer System
CRT
Product materials: Glass, Pb,
phosphors, steel, Al, Cu
EBM Issues: Energy, Pb
Batteries
Product materials: NiCd
EBM Issues: Cd, life/efficiency
Product materials: Al or glass, Ni,
Storage Media
Mg
EBM Issues: recyclability
Product materials: Al or glass, Ni,
Final Assembly
Mg
EBM Issues: recyclability
Displays
Large units are manufactured overseas
Glass formation is energy intensive
Biggest concern is end of life, due to Pb
content in glass
Flat panel displays (FPDs) are replacing cathode
ray tubes (CRTs) and may introduce new issues
Study is currently underway under EPA’s DfE
program
Final Assembly
Materials and design are biggest issues
Take-back legislation in Europe is helping
define needed infrastructure for recycling
Desire to increase recycled content in housings
- typically formed using thermal plastics such
as ABS, PC, or PC/ABS
Non-brominated flame retardants for ABS a
challenge
End of Life Management
Interest being driven by
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Take back legislation in Europe
Material bans in Europe (Pb, halogenated FRs)
Landfill bans and labeling laws in US (e.g., CRTs, Hg)
Leasing agreements (increased producer responsibility)
Reuse
– Limited to systems less than 36 - 60 months old
– Component harvesting economic only in tight markets
Three primary materials commodities / issues
– Plastics / separation, contamination, high cost-to-value ratio
– Glass / Pb and FPDs
– Metals / decreasing volume, especially precious metals
Japan Findings
Highly responsive to activities in Europe
– Elimination of halogenated flame retardants
– Pb-free solders
ISO 14000 certification is a focus
New recycling law to require 50% recycling of
computers starting April, 2000
Using alternative PWB technologies (microvias)
that are inherently less water, energy, and
material intensive processes while providing
better performance
Sites visited: Hitachi , Sony
Europe Findings
Take-back legislation and WEEE (Waste Electrical
and Electronic Equipment) Directive
– Recycling
– Material alternatives (Pb and non-brominated FRs)
Dutch have a well-developed infrastructure for
collecting and recycling computers
– Glass and metals are re-introduced into the material stream
– Plastic is incinerated
“Green” products offered in parallel with
conventional, but with a price differential
Sites visited: MIREC, Siemens
United States Findings
Responding to activities in Europe
– Take-back
– Pb-free solder
– Non-brominated flame retardants
Emphasis on metrics and supply chain management
Recycling activities in partnership with OEMs (HP,
IBM) or sponsored by government agencies (DoC,
DoE, and DoD
Focus on recycling rather than incineration of plastic
Sites visited: IBM, Applied Materials, DuPont
(electronic materials), MBA polymers, Micro Metallics
US Activities
Professional associations and consortiums
– IEEE - ISEE - esp. LCA, DFE, EOL
– IPC - PWBs
– EIA (focused on industry-wide DFE and on
unified responses to policy and legislation - esp.
WEEE)
– MCC (Environmental programs - roadmap, PWBs,
software)
– SIA / SEMATECH (roadmap, ESH as a major
thrust area)
US Activities Cont’d
Government programs
– NSF - EBM center (ICs), current EBM panel
– DARPA - ECM program - focus on PWBs
including bio-laminate, fully-additive circuitry,
permanent resists
– EPA DfE - PWB z-axis metallization, computer
displays
– DoE, DoD, DoC, EPA - Electronics recycling
Challenges - Pb-free Solder
Pb-free solders require higher temperatures
– Need capacitors and resistors that can withstand
increased temperatures
– Need substrates that withstand increased
temperatures
– More energy intensive and lower yield (higher waste)
Much more complex alloys
– More difficult to maintain uniform composition
– May be more difficult to recycle or disassemble to allow
recycling of boards
Challenges - Pb-free Solder
Unclear that Pb-free solders are actually more
environmentally friendly
– material extraction, increased processing difficulties,
ease of recycling
Best solution may be completely new attachment
technologies (e.g., adhesive flip-chip)
Challenges - Flame Retardants
Elimination of brominated flame retardants is due
to concern with dioxin formation upon incineration
– Unclear whether this actually occurs
– May occur only in older, lower temperature units
Alternatives for thermoplastics exist (including
choice of plastic)
– Non-organic fillers may affect mechanical properties
– Unclear that alternatives are more environmentally benign
Currently no known alternatives for thermosets;
may be solved by alternative PWB technologies
EXAMPLE : DESIGN FOR ENVIRONMENT
FOR CMP PROCESS
• Process environmental
targets
• Need for treatment
equipment
Specifications
Equipment
supplier
Organization
Motivating
factors
Process
integrit
y
Regulatory
pressure
• Treatment System
configuration and
requirements
Semiconductor
manufacturer
Resource
scarcity
OEM
Cost
effectiveness
Interface issues
A. Communication Issues
1. Results are transferred, not analysis.
2. Boundaries of analyses are different for different players
4. Interactions between different groups across players (eg: EHS in
Manufacturer to Process groups in equipment supplier, Process groups in
Manufacturer to EHS groups in supplier, developmental groups in OEM)
B. Difference in drivers
1. Ideal solution for Semiconductor Manufacturer is different from Equipment
Supplier and OEM
C. System integration issues
1. Influence of environmental solutions on systems is not well understood.
Environmental, cost and performance parameters are intertwined.
Source: Applied Materials
EXAMPLE
Technological
advantage
SUCCESSFUL DEPLOYMENT OF ECM PROGRAMS REQUIRE
CROSS-CUTTING INNOVATIONS THAT ADDRESS SEVERAL DIMENSIONS
CONCEPTUAL
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Point-of-use pollution
prevention processes
Use of novel materials
with environmentally
benign characteristics
Reduction of energy use
in processes and
products
Product design-forenvironment
Design of products and
materials for ease of
recyclability
New metrics for
environmental
performance
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Technology
Regulations and
incentives
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Regulations on airborne,
wastewater and solid
discharges
International standards
(e.g., ISO 14000)
Eco-labeling incentives
Industry agreements and
roadmaps
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Economic drivers
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Marketing incentives
Total life-cycle cost for
product stewardship
Waste disposal and
abatement cost reduction
Revenue streams from
demanufacturing
Reduction in liability and
risk management cost
The Challenge to Move from “Compliance” to
Benign Products and Benign Processes
 Life cycle analysis tools in existence provide few
alternatives
Original manufacturing lacks in-process analytical
capability that permits early intervention and
correction
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Lack of process technology to produce components
with minimal waste
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ebmchallenge.ppt
3/24/00
Five Steps to Achieve Zero Emissions
 Product design wherein all raw materials are used
in the finished product
 Industrial “clusters” that use the waste from one
facility as the raw material for its products
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ebm5steps.ppt
3/20/00
Higher efficiencies in energy generation and
consumption
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Incentives that promote the use and consumption
of benign technologies and products
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Change in lifestyle and consumption that are less
wasteful