Results on Recent pCVD Diamond Samples Maurizio Vannoni INOA Stefano Lagomarsino INFN and University of Florence CERN RD42 meeting March 31- April 1 2008 In the following slides, I will show how the microinterferometric tecnique is relevant: -In the framework of RAPSODIA experiment (Radiation Active Pixel Silicon On DIAmond), for discriminate suitable surfaces for wafer-bonding -In the characterization of polycristalline CVD Diamond, to study the morphologic characteristic of substrate and growth sides of diamond films. (Radiation Active Pixel Silicon on DIAmond) Gr. V national INFN experiment started in 2007 RAPSODIA Program: development of a technique of wafer-bonding of silicon-on-diamond (SOD) Motivations: diamond as insulator in a silicon-on-insulator structure with superior thermal properties, diamond acting as handle wafer and possibly as rad-hard detector Two different approaches Mastering SOD technology is the aim of several research groups in US and Europe, now. (Relatively )High Pressure High Temperature Bonding Laser Enhanced Bonding •High Pressure High Temperature Bonding •Laser Enhanced Bonding For both these approaches, it is crucial to obtain a contact as intimate as possible between diamond and silicon surfaces Mechanical pressure up to 300 atm, at 950C, gives fairly good results only on a limited portion of the interfacial surface*. *G.N. Yushin et al. Wafer bonding of highly oriented diamond to silicon, Diamond & Related Materials 13 (2004) 1816–1821 plans an increment of the pressure of a least a factor 3 (about 1000 atm), but the question is - Which is the minimum pressure necessary to obtain, say, 90% of adherence within fractions of nm? RAPSODIA We found that a fourier analysis of diamond surface, permit to stand a simple relation between Scontact/Stot and the pressure P. P S contact 2 erf Stot P 2 P P Pressure P is related to the 2D-fourier transform h of the surfaces in the following way: 1 P J c J s 2 L L x y d d 2 h , 2 1/ 2 2 Constans relative Surface factor of Diamond to Silicon We performed this analysis on a batch of 3 samples purchased by Element 6 (obtained through RD42 coll.) Surface factor of Diamond 1 2 L L x y d d 2 h , 2 1/ 2 2 Pressure PSide =0.49e-3 A atm =490 =1.31 e-3 PSide B Pressure =1300 atm Polycristalline nature of the material is clearly recognizable by images, as well as the difference in cristal size between the two sides of each sample. The size of the cristals and their shape are also recognizable under the metallizations. Thus, it could be possible to match this images with those obtained with other imaging tecniques, like IBIC At the end: a couple slides to show results on 2 samples by Element-6, metallized in Bologna (IMMCNR)* with a recipe from Ohio State University. Samples label: EL0100-0100-0500 CERN 1006107-2 - Cleaning with Oxygen plasma - Ti-sputtering 50 nm - Au-sputtering 400 nm - Annealing in N2: 400°C for 15 min, temperature rise time 40 min and fall time 130 min. *Credits: Ivan Elmi, Giulio Pizzochero, Andrea Scorzoni, Institute of Microelectronics and Microsystems, IMM –CNR Bologna Italy SAMPLE: EL0100-0100-0500 CERN 1006107-2 IMM #2 CV characteristics shows constant capacitance within 0.25% in the range 1-100kHz , from -500 V to +500V. The IV characteristic shows currents below 1pA from -500 to 500V and a very symmetric but moderately nonohmic IV profile 0.6 0.4 I (pA) 0.2 0.0 -0.2 -0.4 -0.6 -600 -400 -200 0 V (V) 200 400 600 CCD pulse height spectrum EL0100-0100-0500 CERN 1006107-2 IMM #1 (PUMPED) 400 350 Pulse Height Spectrum Fit Deconvoluted Landau 300 Counts 250 200 150 100 50 0 0 5000 10000 15000 electrons 20000 25000 mean electron value EL0100-0100-0500 CERN 1006107-2 IMM-#1 unpumped pumped 8000 6000 4000 2000 0 -2000 -4000 -6000 -8000 -300-200-100 0 100 200 300 400 500 600 Bias Voltage S curve exhibits no pumping or hysteresis effects (or are they within experimental errors) CCD of about 220m at E=1V/m Results on Recent pCVD Diamond Samples Maurizio Vannoni INOA Stefano Lagomarsino INFN and University of Florence Thank you for listening! CERN RD42 meeting March 31- April 1 2008