North America Environmental, Health,
and Safety (EHS) Committee
October 2014
Outline
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Leadership
Organization Chart
Meeting Information
Ballot Results
Upcoming Ballots
Subcommittee & Task Force Reports
Upcoming Meeting Schedule
Task Force and Leadership Changes
• New Task Forces
– Energetic Materials EHS Task Force
• Charter: Develop EHS guidance for the entire supply chain
to assist in timely and accurate characterization of energetic
processing materials. Propose design considerations for
equipment, delivery system, pump and abatement
manufacturers. Identify handling, use and disposal best
practices, as well as, operation, maintenance and emergency
response criteria for end users.
• TF Leaders: Steve Trammell (SEMATECH), Andy McIntyre
(EORM)
• Approved via EHS GCS in late June 2014.
Task Force and Leadership Changes
• New Task Forces (cont’d)
– S7 Revision Task Force
• Charter: The purpose of this task force is to support
the five year revision of SEMI S7. The task force will
obtain comments and suggestions from SEMI
membership on suggested changes and take the
document through the SEMI balloting process.
• TF Leader: Chris Evanston (Salus)
• Approved via EHS GCS in late June 2014.
Organization Chart
North America
Environmental, Health,
and Safety Committee
New!
Energetic Materials EHS TF
Manufacturing
Equipment Safety
Subcommittee (MESSC)
Ergonomics (S8) TF
Fire Protection (S14) TF
S2 Chemical Exposure TF
Seismic Liaison TF
Lifting Equipment TF
(Inactive)
S2 Interlock Reliability TF
Hazardous Energy Control
Isolation Devices TF
S2 Ladders & Steps TF
S1 Revision TF
S6 Revision TF
New!
S7 Revision TF
S10 TF
S22 TF
S2/Machinery Directive
Mapping TF
S2 Non-Ionizing Radiation
TF
Meeting Information
• Last Meeting:
– July 10 at SEMICON West 2014
San Francisco, California (SF Marriott Marquis Hotel)
• Next Meeting:
– November 6 at the NA Standards Fall 2014 Meetings
San Jose, California (SEMI Headquarters)
Committee Activities
1 of 4
Document Review Summary – SC West 2014 Meetings
* Cycle 3, 2014 *
Doc #
Description
TC Action
4316K
(3 LIs)
Line Item Revision to SEMI S2-0712b, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing Equipment
and SEMI S22-0712a, Safety Guideline for the Electrical
1. Failed, reballot
4683C
(2 LIs)
2. Failed, reballot
Line Item 1 - Improvements to the FECS criteria
Line Item 2 - Allowing additional flexibility to the UPS disconnect criteria
Line Item 3 - Allowing an alternate grounding methodology from IEC 6020433 and has been found to be useful with larger equipment
3. Failed, reballot
Line Item Revisions to SEMI S2-0712b, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing Equipment.
Delayed Revisions Related to Chemical Exposure
1. Failed, reballot
Line Item 1 - Added explanatory materials for valid air sampling and
measurement methods and accredited laboratories
Line Item 2 - Added suggested clarification on reporting of sampling related
to 23.5
2. Failed, reballot
Committee Activities
2 of 4
Document Review Summary – SC West 2014 Meetings
* Cycle 3, 2014 *
Doc #
Description
TC Action
5591
(4 LIs)
Line Item Revisions to SEMI S2-0712b, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing Equipment.
Delayed revisions related to fire protection
1. Failed, reballot
Line Item 1 - Audibility and visibility of annunciators of fire detection systems
Line Item 2 - Location of manual activation devices of fire detection systems
Line Item 3 - Audibility and visibility of annunciators of fire suppression
systems
Line Item 4 - Location of manual activation devices of fire suppression
systems
2. Passed superclean
3. Failed, reballot
4. Passed superclean
Committee Activities
3 of 4
Document Review Summary – SC West 2014 Meetings
* Cycle 4, 2014 *
Doc #
Description
TC Action
5009C
(3 LIs)
Line Item Revisions to SEMI S8-0712a, Safety Guidelines for
Ergonomics Engineering of Semiconductor Manufacturing
Equipment. Delayed Revisions on Multiple Topics
1. Failed, reballot
Line Item 1 - Ergonomic clearances clarification.These changes are intended
to better define ergonomics-related clearances for equipment design and
installation
Line Item 2 - Modifications to Appendix 1, SESC checklist, Section 6 enclosed
handle design guidelines to allow for a wider range of acceptable handle
shapes and sizes
Line Item 3 - Modifications to Appendix 1, SESC checklist, Section 7 to
expand whole body clearance criteria to include equipment operation tasks
and provide design criteria for a seated posture. Whole body clearance
recommendations are separated into two categories: walking/crawling and
working postures. Existing recommendations specific to maintenance and
service tasks are moved to a new Section 11
2. Failed, reballot
3. Failed, reballot
Committee Activities
4 of 4
Document Review Summary – SC West 2014 Meetings
* Cycle 4, 2014 *
Doc #
Description
TC Action
5718
(7 LIs)
Line Item Revisions to SEMI S10-0307E, Safety Guideline for
Risk Assessment and Risk Evaluation Process
1. Passed with
editorial changes
Line Item 1 - Addition of NOTE on product and equipment under
consideration
Line Item 2 - Change “loss” to “harm” (section 5.1.1)
Line Item 3 - Remove Note 4
Line Item 4 - Clarification of the life cycle stages to be considered
Line Item 5 - Clarification section 6.5 on risk estimation, remove the term
benchmarking. Multiple changes in the section
Line Item 6 - Change “loss” to “harm” (Table A1-1)
Line Item 7 - Add pointer to ISO 12100
2. Passed as balloted
3. Failed, reballot
4. Passed as balloted
5. Failed, reballot
6. Failed, reballot
7. Failed, reballot
Committee Activities
Ballots to be reviewed at NA Fall 2014 Meetings [1/2]
* Cycle 5, 2014 *
Doc #
Description
TF / SC
5623
Revision to SEMI S1, Safety Guideline for Equipment Safety Labels
S1 Revision TF
5760
Line Item Revisions to SEMI S7, Safety Guideline for Evaluating
Personnel and Evaluating Company Qualifications
S7 Revision TF
Committee Activities
Ballots to be reviewed at NA Fall 2014 Meetings [2/2]
* Cycle 6, 2014 *
Doc #
Description
TF / SC
4683D
Line Item Revisions to SEMI S2, Environmental, Health, and Safety
Guideline for Semiconductor Manufacturing Equipment
Delayed Revisions Related to Chemical Exposure Criteria
S2 Chemical
Exposure TF
5591A
Line Item Revisions to SEMI S2-0712b, Environmental, Health,
and Safety Guideline for Semiconductor Manufacturing
Equipment
Delayed revisions related to fire protection
Fire Protection TF
5718A
Line Item Revisions to SEMI S10-0307E, Safety Guideline for
Risk Assessment and Risk Evaluation Process
S10 TF
Committee Activities
Ballots expected to be reviewed at the NA Spring 2015 Meetings
* Cycle 8, 2014 *
Doc #
Description
TF / SC
TBA*
Reapproval of SEMI S5-0310, Safety Guideline for Sizing and
Identifying Flow Limiting Devices for Gas Cylinder Valves
NA EHS
Committee
(5-Year Review)
TBA*
Reapproval of SEMI S27-0310, Safety Guideline for the Contents of NA EHS
Environmental, Safety, and Health (ESH) Evaluation Reports
Committee
(5-Year Review)
* TBA – to be assigned
NOTE: Reapproval ballots for SEMI S5 and S27 will be submitted for voting
for the first available cycle after the NA Standards Fall 2014 meetings.
Committee Activities
New SNARFs
• New SNARFs (1 of 2)
– [#5761] New Standard: EHS Guideline for Use of Energetic
Materials in Semiconductor R&D and Manufacturing Processes
• Background: Based on international device manufacturing accident
and incident experience over the last four (4) years (2011-2014)
with new energetic compounds being used to support advanced
semiconductor process, a total of 70+ incidents have been
documented, causing loss of life, significant facility damage and
production business interruption. Based on this experience, a
majority of leading semiconductor device manufacturers
(GLOBALFOUNDRIES, IBM, Intel, Samsung, SK Hynix, TI, tsmc)
along with CNSE have determined the need to for a
comprehensive international best known methods safety guideline
for safe use, handling, processing and disposal of reactive
hazardous materials which have or may exhibit energetic
properties.
Committee Activities
New SNARFs
• New SNARFs (1 of 2)
– [#5761] New Standard: EHS Guideline for Use of
Energetic Materials in Semiconductor R&D and
Manufacturing Processes
• Rationale: This SEMI Standards activity is intended to:
– Develop EHS guidance for the entire supply chain to assist in
timely and accurate characterization of energetic processing
materials.
– Propose design considerations for equipment, delivery system,
pump and abatement manufacturers.
– Identify handling, use and disposal best practices, as well as,
operation, maintenance and emergency response criteria for end
users.
Committee Activities
New SNARFs
• New SNARFs (1 of 2)
– [#5761] New Standard: EHS Guideline for Use of Energetic Materials in
Semiconductor R&D and Manufacturing Processes
• Scope: This environmental, safety and health (ESH) guideline is intended to
provide a supplemental set of ESH criteria for the procurement, storage,
handling, and use of energetic materials in existing and new semiconductor
R&D and Manufacturing processes from all phases of use: chemical supply to
abatement.
This guideline will cover the handling, shipping and disposal of waste energetic
materials and process byproducts as well as equipment and components
containing residual energetic materials and process byproducts.
It will also set minimum characterization data to be provided before an
energetic material is introduced into research and development, pilot line and
high volume semiconductor manufacturing processes as well as define ESH
design criteria for capital equipment suppliers designing chemical supply
process and post process equipment for semiconductor processes using
energetic materials.
Committee Activities
New SNARFs
• New SNARFs (1 of 2)
– [#5761] New Standard: EHS Guideline for Use of Energetic Materials in
Semiconductor R&D and Manufacturing Processes
• Scope: Energetic materials that are within the proposed scope of this
document are:
– Substances used in and generated from semiconductor R&D and Manufacturing
Processes which exhibit one or more of the following properties
» Is classified as a pyrophoric substance such as organic precursors (Diethyl Zinc,
Tertiarybutyl arsine, Tertiarybutyl phosphine, Trimethyl Aluminum, Trimethyl
Gallium and Trimethyl Indium)
» Is classified as an unstable reactive (greater than or equal to 2) and/or water
reactive material (greater than or equal to 2) by the National Fire Protection
Association Standard NFPA 704 “Standard System for the Identification of the
Hazards of Materials for Emergency Response”
– By-products anticipated having either unstable, water reactive and/or pyrophoric
properties that are generated from semiconductor R&D and Manufacturing processes.
Note: The scope of this document is intended to complement and support other industry
safety guidelines (e.g., SEMI S18). The intent is to prevent overlap with other SEMI safety
standards.
Committee Activities
New SNARFs
• New SNARFs (2 of 2)
– [#5760] Line Item Revisions to SEMI S7, Safety
Guideline for Evaluating Personnel and Evaluating
Company Qualifications
• Rationale: Revise and update SEMI S7 – in accordance
with 5 year review cycle.
Committee Activities
Subcommittee & Task Force Updates [1/12]
• MESSC (Manufacturing Equipment Safety Subcommittee)
– Discussed the issue that the generation of smoke by
SME in the fab is not adequately addressed in SEMI
S14 or Section 14 of S2
• Issue to be discussed further within the Fire Protection TF.
• This issue is also related to the Energetic Materials EHS TF,
but from a chemical source rather than from an electrical
source.
– Reviewed and discussed Energetic Materials EHS
TFOF and proposed SNARF {See previous slides}
SME – semiconductor manufacturing equipment
Committee Activities
Subcommittee & Task Force Updates [2/12]
• S1 Revision TF
– [#5623] Revision to SEMI S1, Safety Guideline for
Equipment Safety Labels
• TF plans to submit document 5623 for Cycle 5, 2014
voting period.
Committee Activities
Subcommittee & Task Force Updates [3/12]
• S2 Chemical Exposure TF
– Ballot 4683C failed. TF plans to submit ballot 4683D for Cycle
6, 2014 voting period.
• S2 Ladders & Steps TF
– In 2011, after the 4449C ballot, the committee asked the TF to
ballot material as an RI and minimize “hard criteria” in the body
of the document.
• The TF understand that this is still the desired direction.
– TF continues to revise proposal based on responses to the
4449D ballot.
– TF plans to submit ballot 4449E for Cycle 2, 2015 voting period.
Committee Activities
Subcommittee & Task Force Updates [4/12]
• S2 to Machinery Directive Mapping TF
– [#4966] New Auxiliary Information: S2 Mapping into the
Machinery Directive (2006/42/EC) Essential Health and Safety
Requirements
• Distributed to the Global EHS Technical Committee on June 5,
2014.
• Approved for publication by NA EHS at the SEMICON West 2014
meeting.
– Passed subsequent procedural review.
• S2 Non-Ionizing Radiation TF
– [#5625] S2 Revisions related to non-ionizing radiation to
be balloted in Cycle 6, 2014.
Committee Activities
Subcommittee & Task Force Updates [5/12]
• Hazardous Energy Control Isolation Devices TF
– Previously raised LOTO concerns:
• Remote LOTO Challenges
– OSHA’s Control of Hazardous Energy does not allow the use of Remote LOTO devices
(remote LOTO = low voltage control circuit isolation) unless it meets the minor service
exemptions and the alternate LOTO methods via ANSI Z244.1. What if used not just
for minor service but for all potential LOTO.
» Human foreseeable misuse error rate versus the safety circuit failure rate??
• SEMI S2, § 17 (Hazardous Energy Isolation)
– Additional Gaps in SEMI S2 for Chemical LOTO
• SEMI S2, § 11 (Interlocks)
– Safety Interlocks: should SEMI S2 specify the need for safety interlock for pressurized
chemical/gas access doors?
– Next steps
• Edit proposed changes to SEMI S2 Section 17
• Transfer Collaboration with Other Industry Standards Organizations to the
ICRC (e.g. RIA, ANSI, others?)
LOTO – lockout/tagout
Committee Activities
Subcommittee & Task Force Updates [6/12]
• Fire Protection TF
– Doc 5591 balloted in Cycle 3
• Line items 2 and 4 passed superclean.
• Line items 1 and 3 were failed and will be reballoted.
{See previous slides for details}
– Future plans
• Start Work on Tiered Approach for Fire Risk Assessment
between S2 and S14.
– Address Negatives from Document #5590.
» S14 Re-Approval
– Address Negatives from Document #4495B
» Alignment of S14 with S10 Likelihood & Risk Tables
Committee Activities
Subcommittee & Task Force Updates [7/12]
• S6 Revision TF
– Discussions
• Realistic worst case release scenarios and release rate
calculations
– Wording/rationale to be developed in preparation of balloting
line item in Cycle 1, 2015
• Gas detector approval/listing requirement
• White Paper or related information development for
Gas Panel design
Committee Activities
Subcommittee & Task Force Updates [8/12]
• S7 TF
– TFOF approved via EHS GCS in June 2014
– S7 revision SNARF (#5760) approved at
SEMICON West 2014 meeting
{See previous slides for details}
Committee Activities
Subcommittee & Task Force Updates [9/12]
• S8 Ergonomics TF
– Ballot 5009C, all three line items failed and will be
reballoted.
• S10 TF
– Action plan
• First solve several small issues by using line item ballots
– Ballot 5718 submitted for Cycle 4 and reviewed at SEMICON
West 2014 meeting. {See previous slides for details}
• Major discussion on use of risk ranking tables
Committee Activities
Subcommittee & Task Force Updates [10/12]
• S22 Revision TF
– [#4316K] S2/S22 revisions balloted for Cycle 4,
failed at SEMICON West 2014 meeting. To be
reballoted as 4316L in Cycle 6, 2014.
Committee Activities
Subcommittee & Task Force Updates [11/12]
• S23 Revision TF
1. Working on ballot to improve description of ‘efficiency improvement’
– total energy might not reduce but efficiency can improve.
2. Learned later that there was a concern over contrast of title and
purpose statements about “Conservation” and the idea of “efficiency”
in point 1, above.
3. Plan to work with Japan TF members to resolve the concern, perhaps
reword SNARF proposal to include, in essence, replacing
‘conservation’ with ‘increased efficiency’.
4. Also heard of interest in adding an ECF for liquid nitrogen. Will add
to TF proposal queue.
5. Also heard that some Taiwan “LCD” (?) related companies find their
ECFs are quite different. Offered to gather more information and
introduce it to TF.
6. There is a recommendation / idea that it might be helpful to structure
the TF as a Global TF.
Committee Activities
Subcommittee & Task Force Updates [12/12]
• NA Seismic Liaison TF
– NA TF discussions at SEMICON West 2014 meeting:
• What “level” does/should S2 require?
– Level 1 – Failing, but no failing that could result in medium or higher risk to personal or
the environment
– Level 2 – No failing, but yielding is OK
– Level 3 – No failing or yielding, but perhaps recalibration, etc. (possible slip outs of
adjustment)
– Level 4 – Immediately operable after quake (after restoration of utilities)
• Table of values or a single value? 2 – table 9-single (single >> as now – an
HPM and non-HPM value)
• Now to pick the level and get consensus on what to provide for “what if
different”
• Perhaps attempt to remove possible ambiguity of ‘survival criteria’
• Add table of flex/rigid and perhaps region Ss to RI.
• Triple check Ss for Taiwan. – Another report of 3.4 for Taichung not being
correct.
NA EHS Meeting Schedule
NA Standards Fall 2014 Meetings [DRAFT]
•
Monday, November 3
–
–
–
–
–
–
–
•
Tuesday, November 4
–
–
–
–
–
–
•
Fire Protection TF (9:00 AM to 10:30 AM)
S10 TF (10:30 AM to 12:00 Noon)
Energetic Materials EHS TF (1:00 PM to 2:00 PM)
S1 Revision TF (2:00 PM to 3:30 PM)
S8 Ergonomics TF (3:30 PM to 5:00 PM)
S23 Revision Japan TF (5:00 PM to 6:00 PM)
Wednesday, November 5
–
–
–
–
–
•
S22 (Electrical Safety) TF (9:00 AM to 10:30 AM)
S7 Revision TF (10:30 PM to 12:00 Noon)
EHS Process Meeting / Lunch Break (12:00 Noon to 1:00 PM)
S2 Non-Ionizing Radiation TF (1:00 PM to 2:00 PM)
S2 Chemical Exposure TF (2:00 PM to 3:30 PM)
S6 Revision TF (3:30 PM to 5:00 PM)
NA Seismic Liaison TF (5:00 PM to 6:00 PM)
[ICRC (8:00 AM to 12:00 Noon)]
EHS Leadership Meeting / Lunch Break (12:00 Noon to 1:00 PM)
Hazardous Energy Control Isolation Devices TF (1:00 PM to 2:00 PM)
Manufacturing Equipment Safety Subcommittee [MESSC] (2:00 PM to 4:00 PM)
S2 Ladders & Steps TF (4:00 PM to 5:30 PM)
Thursday, November 6
–
EHS Committee (9:00 AM to 6:00 PM)
SEMI Headquarters
3081 Zanker Road
San Jose, CA 95134
Thank You!
For more information or participate in
any NA EHS activities, please contact
Paul Trio at SEMI (ptrio@semi.org)
Back-up
Committee Activities
New SNARFs
•
New SNARFs
–
[#TBA] New Standard: EHS Guideline for Use of Energetic Materials in Semiconductor R&D and
Manufacturing Processes
•
Scope: The proposed outline of this Energetics ESH Guideline is as follows:
–
–
–
–
–
–
–
–
–
Purpose
Scope
Limitations
References
Terminology
Safety Philosophy
General Provisions
Best Known Method Guidelines
» Integrated Hazard Analysis
» Material Supplier Requirements Characterization
» End User - Facility Receiving, Inspection, Storage, Transport and Emergency Response Requirements
» Bulk (External) Delivery System(s) - Remote – Supplier
» Bulk (Remote) Delivery System(s) – End User
» Equipment Supplier Design Considerations – On Tool Ampoule Delivery
» Equipment Supplier Design Considerations – Process Chamber
» Equipment Supplier Design Considerations – Post Process Chamber through Vacuum Pump/Abatement
System
» End User Design Considerations – Post Process Chamber through Vacuum Pump/Abatement System
Appendices
* TBA – to be assigned
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
4316J
Line Item Revision to SEMI S2-0712a, Environmental, Health, and
Safety Guideline for Semiconductor Manufacturing Equipment, and
SEMI S22-0712, Safety Guideline for the Electrical Design of
Semiconductor Manufacturing Equipment. Delayed Revision
Related to Programmable Safety Circuits
1: Failed, to be
reballoted
(1 LI)
Line Item 1 – Fail-to-safe Equipment Control Systems Revision
APPROVED ballots forwarded for Procedural Review
FAILED ballots returned to task force unless noted
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
5009B
Line Item Revisions to SEMI S8-0712, Safety Guidelines for
Ergonomics Engineering of Semiconductor Manufacturing
Equipment. Delayed Revisions on Multiple Topics
1: Passed w/ EC
(7 LIs)
Line Item 1 – Changes to Terminology for Critical Controls and Displays
Line Item 2 – Ergonomic Clearances Clarification
Line Item 3 – Changes to Appendix 1: “Actual/Conforms?” Column
Modifications
Line Item 4 – Changes to Appendix 1, ¶ 6.4.1: Ball Handle Minimum Diameter
Line Item 5 – Changes to Appendix 1, § 7: New Whole Body Clearance Criteria
and Movement of Select Criteria to a New Maintenance and Service Section
Line Item 6 – Changes to Appendix 1, § 9: Hand Control Location Applications
Line Item 7 – Changes to Appendix 1, ¶ 9.1: Hand Control Location Pictogram
Addition
2: Failed, to reballot
3: Passed as balloted
4: Passed as balloted
5: Failed, to reballot
6: Passed superclean
7: Passed superclean
Committee Activities
Document Review Summary – NA Fall 2013 Meetings
* Cycle 6, 2013 *
Doc #
Description
TC Action
5649
Delayed Line Item Revisions to SEMI S22, Safety Guideline for
the Electrical Design of Semiconductor Manufacturing
Equipment
1: Failed, to reballot
(9 LIs)
Line Item 1 – Termination of the Supply Conductors
Line Item 2 – Modification to Main Disconnecting Means Guarding
Line Item 3 – Modification to Uninterruptible Power Supply Interruption
Line Item 4 – Modification to Local Lighting Overcurrent Protection Criteria
Line Item 5 – Modification to Electrical Motor Criteria
Line Item 6 – Addition of Motor Overload Test Method
Line Item 7 – Grounding Criteria
Line Item 8 – Modification to Phase Marking
Line Item 9 – Modification to Cord and Plug Disconnect Criteria
2: Failed, to reballot
3: Failed, to reballot
4: Passed as balloted
5: Failed, to reballot
6: Passed as balloted
7: Failed, to reballot
8: Passed as balloted
9: Passed w/ EC
Committee Activities
New TFOF
• S10 Task Force
– Charter:
• To update the SEMI S10 (Safety Guideline for Risk Assessment and
Risk Evaluation Process) based on negatives received in the S10
reapproval ballot (Draft Document #5599)
– Scope:
•
•
•
•
Look at better definitions in the severity table
Discuss the likelihood table and how to define frequency
General update
Update Appendices/Related Information to latest standards
Published for 0813
* REVISED *
Document #
Description
S23-0813
Guide for Conservation of Energy, Utilities and Materials Used by
Semiconductor Manufacturing Equipment
- Addition of text explaining the meaning and limits of the exhaust energy
conversion factor
- Editorial change in the sleep mode definitions, and the addition of a
criterion related to load port availability during sleep mode
Published for 0213
* REVISED *
Document #
Description
S25-0213
Safety Guideline for Hydrogen Peroxide Storage & Handling Systems
- Revisions related to responses received from failed reapproval ballot
Published for 0113
* REVISED *
Document #
Description
S13-0113
Environmental, Health and Safety Guideline for Documents Provided
to the Equipment User for Use With Manufacturing Equipment
- Revisions related to responses received from failed reapproval ballot
S17-0113
Safety Guideline for Unmanned Transport Vehicle (UTV) Systems
- Revisions to:
o §11 (Design for Injury Prevention in UTV System Hazard Zone)
o §13 (Emergency Operation)
o §16 (Interface to Automated Material Handler of Semiconductor or FPD
Manufacturing Equipment)
o APPENDIX 1 (SEISMIC PROTECTION)
Published for 0912
* REVISED *
Document #
Description
S2-0712a
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Addition of Delayed Revision 1: Section 3.3 (Limitation) Revision
Published for 0812
* REAPPROVED *
Document #
Description
S16-0307
Guide for Semiconductor Manufacturing Equipment Design for Reduction of
Environmental Impact at End of Life
- 5-Year Review, Reapproval
(Reapproved 0812)
Published for 0712
* NEW *
Document #
Description
S29-0712
Guide for Fluorinated Greenhouse Gas (F-GHG) Emission Characterization
and Reduction
Published for 0712
* REVISED *
Document #
Description
S2-0712
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Delayed Revisions 1-10 effective July 2012
S8-0712
Safety Guidelines for Ergonomics Engineering of Semiconductor
Manufacturing Equipment
- Revisions related to handle criteria, laterally offset display, display
recommendations, work surface thickness, neutral & awkward postures, as
well as addition of pictograms
S22-0712
Safety Guideline for the Electrical Design of Semiconductor
Manufacturing Equipment
- Delayed Revisions 1-12 effective July 2012
Published for 0612
* REAPPROVED *
Document #
Description
S21-1106E
Safety Guideline for Worker Protection
(Reapproved 0612)
- 5-Year Review, Reapproval
Published for 0312
* REVISED *
Document #
Description
S18-0312
Environmental, Health, and Safety Guideline for Silane Flammable
Silicon Compounds
- Includes title change from “Environmental, Health and Safety Guideline for
Silane Family Gases Handling”
S22-1110c
Safety Guideline for the Electrical Design of Semiconductor
Manufacturing Equipment
- Delayed revisions related to clarifications of the creepage/clearance
material and ampacity tables
Published for 0212
* REVISED *
Document #
Description
S2-0310e
Environmental, Health, and Safety Guideline for Semiconductor
Manufacturing Equipment
- Delayed revisions related to general safety precaution concerning the
removal of burrs and sharp edges
- Delayed revisions related to non-ionizing radiation