MOSIS OVERVIEW
MSE99
July 19, 1999
César A. Piña
http://www.mosis.org
USC INFORMATION SCIENCES INSTITUTE
THREE PHASES:
http://www.mosis.org
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Phase I: 1981-1985
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DARPA Direct Funded Era: 100% DARPA Funded
Phase II: 1985-1994
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Multi-Agency Direct Funding
DARPA: ~80%
• Subsidized All Undesrsubscribed Runs
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NSA, NSF: ~15%
• Purchased Needed Projects Only
Commercial Customers: ~5%
• Helped to defray Government Costs by using excess area.
Phase III: 1994-1999
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Self-Sustaining Operations
Commercial Customers are Primary Source of Income: ~90%
DARPA: ~5%; NSA/NSF: ~5%
USC INFORMATION SCIENCES INSTITUTE
TECHNOLOGIES
http://www.mosis.org
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Supertex SCNA20:
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2-metal, 2-poly, NPN, n-well
5V
Analog/Digital
Integrated CMOS MEMs
Orbit Fab purchased by Supertex
AMI ABN:
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4-metal, 1-poly, silicided, n-well
3.3V
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0.35µ
polycided, n-well
3-metal, 2-poly, 3.3/5V
4 metal, 1-poly 3.3V
Analog/Digital
TSMC :
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0.35µ
TSMC :
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3 metal, 2 poly, non-silicided, nwell
5V
Analog/Digital
HP GMOS10QA:
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0.50µ
3-metal, 1-poly,
linear cap, silicide block, n-well
3.3V
AMI C5N: 0.50µ
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1.20µ
2-metal, 2-poly, NPN, n-well
5V
Analog/Digital
Integrated CMOS MEMs
HP AMOS14TB:
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2.00µ
0.25µ
5-metal, 1-poly, silicided, n-well
3.3/5v I/O, 2.5/3.3v Core
20x20mm Die From a
0.35µ Multiproject Run
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Future TECHNOLOGIES
http://www.mosis.org
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HP/CSP/CSM C07:
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5-metal, 1 poly, silicided, n-well,
1.8/3.3v I/O, 1.8v Core, 4Q99
5v I/O, 1.8v Core, 1Q00
TSMC 0.18µ:
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0.18µ
6-metal
2.5/3.3v I/O, 1.5/1./8v Core
2Q00
Peregrine SOI-SOS:
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0.25µ
0.50µ
3 metal layers, various options
3Q99
QUAL RUN IN PROGRESS
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TSMC 0.15µ:
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6-metal, 1 poly, silicided, Cu
1.5/3.3v I/O, 1.5v Core
4Q01
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0.13µ
6-metal, 1 poly, silicided, Cu
1.8/2.5v I/O, 1.0/1.2v Core
2Q02
HP/CSP/CSM C/G04:
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0.15µ
TSMC 0.13µ:
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2.5/3.3v I/O, 1.2-1.5v Core
4Q01
HP/CSP/CSM C/G04:
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0.15µ
6-metal, 1 poly, silicided, Cu
1.8/3.3v I/O, 1.2-1.3v Core
4Q02
0.13µ
21st Century MOSIS
• CMOS will continue to be the dominant technology for the
foreseeable future
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Only known circuit configuration that draws 0 power when not switching
• CMOS feature sizes will continue to decrease
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0.25 and 0.18  will probably be the “workhorse” logic
technologies for the next 5 years - because of COST
• 0.35  - 1998 - I line lithography (365nm) OK
• 0.25  - 1999 -248nm excimer lasers-fused silica ok
“Leading Edge”
• 0.18  - 2001- 193nm laser-close to short  limit for refractive
optics
• 0.15  - 2003 - Scaling of 0.18m
• 0.13  - 2005 - Lots of engineering problems but doable
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PHOTOLITHOGRAPHY:
CONTROLS THE COST
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Full wafer lithography (FWL) is lowest cost
• Large payload: >5000sqmm
• 2um is lowest practical limit
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1X Stepper Lithography is next
• Medium payload: ~ 900 sqmm
• 1.2um is lowest practical limit
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5X Stepper Lithography is next
• Small Payload: 290 - 400 sqmm max.
• Technology of choice for 1.2um and below
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1um defect on mask is 0.2um on wafer
• 0.5 um - 1.6um mask tech. straightforward
• Below 0.5um masks become VERY expensive
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BUT - (Fortunately) THE RETICLE SIZE IS INCREASING AS
THE FEATURE SIZE DECREASES!
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MOSIS EDUCATIONAL PROGRAM
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What is the MOSIS Educational Program?
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The MOSIS Educational Program provides free
fabrication of integrated circuits designed by students
in organized classes at accredited U.S. educational
institutions.
Who is eligible for funding?
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Funding is available to accredited U.S. universities who
agree to the following terms:
• Designs must be sent to MOSIS in CIF or GDSII format via
the Internet.
• A report must be sent to MOSIS for each fabricated circuit.
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Further Details can be found at:

http://www.mosis.org
USC INFORMATION SCIENCES INSTITUTE
MOSIS EDUCATIONAL PROGRAM
Funding Sources
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AMI has donated 4 wafer runs/yr (1.2/1.5 )
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HP has donated 2 wafer runs/yr (0.5 )
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IBM has donated 2-3 wafer runs (0.35 )
MOSIS contributes:
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All administrative costs
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The Educational share of the 2
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0.35  fabrication for a selected number of projects from
advanced classes in the regularly scheduled runs. (The 0.25 
runs will also become available in the near future)
 wafer costs
NSF funding decreasing, BUT some funding remains and
will help transition the program to a self-sustaining mode.
Various industrial firms and professional societies have
made cash contributions
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