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OMICS Group Conferences make the perfect platform for global networking as it brings together renowned speakers and scientists across the globe to a most exciting and memorable scientific event filled with much enlightening interactive sessions, world class exhibitions and poster presentations Omics group has organised 500 conferences, workshops and national symposium across the major cities including SanFrancisco,Omaha,Orlado,Rayleigh,SantaClara,Chicago, Philadelphia,Unitedkingdom,Baltimore,SanAntanio,Dubai, Hyderabad,Bangaluru and Mumbai. Dilute Nitrides – growth, characterisation and mid-infrared applications A. Krier, M. de la Mare, P. Carrington, Q. Zhuang, M. Kesaria, M. Thompson Physics Department, Lancaster University, UK Optics 2014 Outline Dilute Nitrides MBE growth on InAs and GaAs Structural and transport properties PL and EL Addition of Sb Devices Summary N Motivation -1 Wavenumber ( cm ) • Gas sensors - optical absorption; • • • • • CH4, CO2, CO Industrial process control Spectroscopy Thermal imaging Bio-medical diagnostics Military - infrared countermeasures Transimission ( % ) 2000 100 50 2400 CO 5 4.5 3200 HCN CO2 NO2 0 2800 HCl HCN NO2 CH4 CO CO2 HCl 4 3.5 Wavelength ( m ) CH4 3 Principal gas absorptions in the mid-infrared For these applications we need LEDs, lasers and detectors operating at Room Temperature Dilute nitrides and the Mid-infrared Problems :- imbalance in the DOS of InAs Auger recombination (CHSH) CB Inter-valence band absorption (IVBA) Inadequate electrical confinement -small band offsets - No SI substrates Addition of N : Band anti-crossing effect - flexible wavelength tailoring without complex growth 1 1’ 2’ Eg HH 2 LH Higher effective mass than in InAs or InSb and equalises DOS Superior bond strengths and material stability Compared to CdHgTe InAsN dilute nitride alloys offer some possibilities for improvement Δ0 Band anti-crossing An empirical model Extended-localized state interaction E (k ) ECB (k ) V E (k ) V E ( k ) EN Anticrossing/repulsion between conduction-band edge and localized states 2 the band gap EN ECB (k ) ( k ) EN Edecreases 2 CB E ( k ) introduces Vat low k-value in the CB minigap(s) 2 2 2.00 GaAsN E (k) (eV) E+ 1.80 EN ECB 1.60 E1.40 -5.00 0.00 8 5.00 -1 k (10 m ) W. Shan et al., Phys. Rev. Lett. 82, 1221 (1999) Band structure CB N levels N-N pairs & clusters N related defects The band structure of III-VNs is determined by the distribution of energy levels due to N-impurities and Nclusters and their hybridization with the extended CB states VB GaAsN N-level CBE 0.2 eV InPN 0.4 eV InAsN N-pairs and clusters DE = 1 eV E.P. O’Reilly et al., SST 24 033001 (2009) E. P. O‘Reilly, A. Lindsay, and S. Fahy, J. Phys. Cond. Matt., 16, S3257 (2004) MBE Growth on InAs and on GaAs V80 Molecular Beam Epitaxy (VG) with RF Plasma Nitrogen source, As and Sb valved cracker cells (EPI) Ga, In, Al and dopants GaTe and Be Sample TG A0276 A0282 A0285 A0299 A0300 485 420 442 376 450 Flux - As Flux - N2 Plasma Power N Content 6.6x10-6 2.2x10-6 2.2x10-6 2.2x10-6 2.8x10-6 n/a 6.12x10-7 6.12x10-7 6.3x10-7 5.0x10-7 n/a 160 160 160 160 n/a 0.6 0.2 1.0 0.4 % Large parameter space for InAsN InAsN successfully grown on InAs with N < 2% and PL observed out to 4.5 µm For growth on GaAs Optimum growth at substrate temperatures between 4000C- 4400C Nitrogen plasma setting fixed at 160 W with flux of 5x10-7 mbar Growth rate of ~1µm per hour InAs control sample was grown under the same conditions X-ray diffraction 2 different layer peaks obtained - 2 dominant N compositions Plastic relaxation -Vertical and horizontal lattice deformations obtained -Gives relaxed lattice const. and plastic deformation R Layers with N< 1.2% are pseudomorphic Bragg maps narrow in qII N > 1.2% more diffuse scattering from misfit dislocations & defects Onset of plastic relaxation at N~ 1.4% asymmetrical (224) reflections measured for all samples N=0.83% - tail indicates vertical N composition gradient N=0.34% - thickness fringes – good interface quality Growth rate decreases with increasing N SIMS and TEM analysis Sample : A0299 InAsN 1% N 1.0E+07 Intensity (cs-1) 1.0E+06 1.0E+05 Ga As InAs/GaAs In 200 nm 1.0E+04 1.0E+03 N 1.0E+02 1.0E+01 InAsN(1%) /GaAs 1.0E+00 0.00 0.50 1.00 1.50 2.00 200 nm Depth (microns) N is uniform No evidence of unintentional impurities (C, O etc.) as-grown InAsN is of high purity Analysis of secondary ion peaks from CsAsN+ enables accurate N determination -comparison with XRD data – N content is ~5% larger than determined from XRD Significant incorporation of non-substitutional N Higher dislocation density in InAsN – but obtain increase in PL Localisation, non-uniform PL emission from regions around dislocations? Raman spectroscopy Weak InAs modes at 405 and 425 cm−1 and 2nd order InAs optical modes at 435, 450, 460 and 480cm−1 N related features Additional N related features at 402, 415, 428 and 443 cm−1 (previously observed by Wagner et al. N ~ 1.2 %) 2nd order InAs modes NAS As -N N-N difference spectrum of highest N – lowest N content 443 cm−1 feature - also detected in FTIR NAs LVM from substitutional 14NAs 402 cm−1 and 415 cm−1 peaks from non-substitutional N-N or As-N split interstitials, (N antisites or interstitial N) rather than N-In-N complexes and As -N produce deviations from Vegard’s law (Calculations predict N-N split interstitial at 419 cm−1 but also predict that the As-N split interstitial lies well above the LVM in GaAsN) Ibanez et al, JAP (2010) Electrical properties InAsN on GaAs 1 10 T = 293 K 5 3 -1 Ga(AsN) 2 impurity scattering -2 10 0.0 0.4 0.8 1.2 1.6 N (%) 2 -1 -1 Mobility (m V s ) 77K InAsN 1 0.1 GaAsN 0.01 0.0 0.1 0.2 0.3 0.4 N-content (%) 0.5 0.6 A. Patanè et al Appl. Phys Lett. 93, 25106 (2008) -3 0.5 x (%) 16 10 1.0 1000 nm n-type InAs(N) 10 T (K) 10 0.0 1 0.4% 0.6% 1.0% 1 T = 293K 2 0.2% 10 nH (cm ) 2 -1 -1 (m V s ) x=0% 4 -1 -1 Phonon scattering 0 10 H (m V s ) In(AsN) 17 10 100 0 Semi-insulating GaAs substrate N reduces electron mobility µ is limited by electron scattering by N-atoms, -pairs and clusters Model for GaAsN predicts a strong reduction of the mobility and electron mean free path due to the N-levels Weak dependence of µ on N-content compared to GaAsN due to the proximity of the N-related states to the CBE Impurity scattering dominant at high N Residual carrier conc. increases for N >0.4% N incorporation introduces native donor states Electron Cyclotron Mass The cyclotron mass increases with increasing x Comparing the N-induced change of the mass in InAsN and GaAsN 0.030 (me) me*/m0 0.035 GaAsN LCINS, O’Reilly 0.025 11.4 m 66.0 m 0.0 0.5 1.0 15.0 m 103.0 m 1.5 2.0 N (%) CR/PR GaAsN CR InAsN The electron mass and its dependence on the excitation energy are weakly affected by the nitrogen O. Drachenko et al. APL 98, 162109 (2011) InAsN - Cyclotron Resonance 0.5 EF= 10 meV 18 2.0% 0.4 EF -3 n (cm ) 10 1.0% (eV) 80 meV 40 meV 20 meV N = 0% 0.3 17 10 -4x10 6 0 -1 k (cm ) 4x10 6 Pinning of the Fermi level 16 10 0.0 0.5 1.0 N (%) 1.5 2.0 The increase of electron density with increasing N indicates a pinning of the Fermi level and implies a substantial density of native donor states O. Drachenko et al. APL 98, 162109 (2011) Photoluminescence InAsN on InAs Incorporation of small amounts of N into III-V’s causes conduction band anti-crossing leading to reduction in band gap Good agreement with band anti-crossing model (60 meV per 1%N) Long low energy tail appears - localisation CMN = 2.5 eV at 4 K caused by uneven nitrogen distribution- composition fluctuations or point defects 0.355 Band Gap Energy (eV) 0.350 0.345 0.340 0.335 0.330 -4 2 Eg=0.353-[1.1x10 T /(T+100)] 0.325 0 50 100 150 200 Temperature (K) 250 300 6.5 Photoluminescence Lineshape 6.0 5.5 4K 20K 40K 60K 80K 100K 120K 150K 180K 210K 240K 270K 300K 5.0 4.5 Intensity 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.26 0.28 0.30 0.32 0.34 0.36 0.38 0.40 Photon Energy (eV) PL is Gaussian at low T As T increases becomes asymmetric with high energy tail extends well above Eg Conduction Band Lineshape - 2 effects Localization at low T Free carrier emission at high T J. Appl. Phys. 108, 103504 (2010) Valence Band InAsN on GaAs 0.6%N 10 Good agreement with band anti-crossing model Inclusion of nitrogen improves the peak intensity InAsN > InAs on GaAs Photoreflectance shows Δ0 is constant with increasing N Activation energy increases with increasing N content – CHSH Auger detuning 4K PL 0.4%N 8 Intensity (a.u.) PL obtained from InAsN on GaAs across the mid-IR spectral range with addition of small quantities (~ 1%) of nitrogen 1%N 0.2%N 6 improved PL InAs/GaAs 4 CO2 2 0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 Wavelength (m) 0 D0 0.40 Energy (eV) Normalised PL Intensity (a.u.) 10 0.35 E0 InAsN/InAs InAsN/GaAs InAsN/InAs E0 0.30 InAs/InAs InAs/GaAs InAsN(0.6%)/GaAs InAsN(1%)/GaAs -1 10 -2 10 InAsN/InAs Do 0 BAC model 0.0 0.5 1.0 1.5 2.0 Nitrogen content (%) 2.5 3.0 50 100 150 200 Temperature (K) 250 300 4.6 Adding Sb - MBE growth of InAsSbN InAs Adding N to InAs Conduction band Adding Sb to InAs Eg Valence band Increasing N Increasing Sb Tensile strain Compressive strain N is hard to incorporate Use Sb to reduce lattice mismatch increase N incorporation improve quality Sb acts as surfactant to maintain 2D growth and reduces point defects - improves PL Red-shift of emission wavelength – need less N to reach longer wavelengths Sb reduces N surface diffusion length - increases N incorporation ~ 2.5x Reduction of Sb segregation induced by N increases Sb incorporation ~1.5x Photoreflectance Δso > E0 Auger suppression Advantage of InAsNSb over InAsN In-plane strain for layers grown on InAs can be tuned from tensile to compressive - Tailor polarization in QW to be either TE or TM Sb increases confinement in valence band - dominant polarisation is TE (e1-hh1) 0.8 0.8 Spin orbit splitting In InNAs & InAsNSb E0 E0+DSO DSO 0.5 E0+DSO DSO Fit Fits for InNAs 0.4 0.4 0.3 0.5 0.3 (c) InNAs 0.0 0.5 1.0 1.5 2.0 Nitrogen concentration (%) InNAs Kudrawiec et al. APL 99, 011904 (2011) Incorporation of Sb increases Δso and decreases E0 N does not change Δso DSO 0.6 2.6% Sb 4.1% Sb 7.0% Sb 7.3% Sb Ref.[31]: E0 4.8% Sb This work: E0 Energy (eV) Energy (eV) 0.6 E0+DSO 0.7 0.7 Both Sb and N reduce E0 (d) In(N)AsSb 0.0 0.5 1.0 1.5 2.0 Nitrogen concentration (%) InNAsSb ~ 5 meV per 1% of Sb ~ 60 meV per 1% N InAsSbN Photoluminescence Strong PL at room temperature - good optical quality Asymmetric shape Narrow energy gap – free carrier emission is important Especially > 100 K High energy tail extends well above Eg Latwoska et al, Appl. Phys. Lett 102, 122109 (2013) Gaussian at low T PL peak lower than Eg determined from PR Characteristic S-shape but with weak carrier localisation - Stokes shift <10 meV smaller than for InAsN Composition fluctuations or point defects reduced due to surfactant effect of Sb InAsN QW lasers on InP InAsN ridge lasers operating up to 2.6 µm have been demonstrated – grown by gas source MBE limited by N incorporation and critical thickness 4 QW InAsN/InGaAs on InP (5μs pulse width, 500 Hz repetition rate) Max. operating temperature 260 K with T0 = 110 K Decreasing growth temp incorporates more N ….but reduces QW quality D. K. Shih, H, H. Lin, and Y. H. Lin, IEE Proc. Optoelectronics 150, 253 (2003) InAsN MQW grown by MOVPE MQW containing 18% N on GaAs (UNM) -longest wavelength PL obtained from dilute N growth temperature 500 0C Osinski , Optoelectronics Review 11(4) 321-6 (2003) InAsSbN / InAs MQWs 100 nm InAs Capping Layer 10x InAsNSb /InAs QW (12x24 nm) 200 nm InAs Buffer Layer Growth of the MQWs calibrated using the same growth method of previously grown InAsNSb bulk layers InAs substrate 200 nm InAs Buffer layer grown at 480°C 10x InAsSbN/InAs QW grown at 420°C • Growth rate of 0.5µm per hour -6 • Nitrogen plasma setting fixed at 160 W with flux of 6×10 mbar 100 nm InAs Capping Layer grown at 480°C As flux kept at minimum for growth of InAs layers ∆EV = 102meV InAs hh1 = 9meV hh2 = 36meV InAs0.92Sb0.08 InAs InAsSbN/InAs MQW 4K photoluminescence 7 5 4 3 2 Peak Wavelength tot=3.62m e - hh1 4K 0.009 =3.68m 0.008 e1-hh1 e - lh1 =3.48m 2.6 2.8 3.0 3.2 3.4 4K N =1%, Sb 6% 4.38 m Bulk 0.007 e1-lh1 3.6 3.8 4.0 4.2 4.4 4.6 Wavelength (m) Intensity (a.u.) Relative Intensity (a.u.) 6 1.8W 1.6W 1.2W 1W 0.8W 0.6W 0.5W 0.4W 0.2W 0.1W 0.06W 0.03W 0.006 3.62 m MQW 0.005 0.004 0.003 0.002 0.001 1 0.000 0 -1 3.0 -0.001 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 3.2 3.4 3.6 3.8 4.0 Wavelength (m) No blue-shift with excitation power - Type I QW 3.48 µm 3.62 µm (expt.) 4.2 4.4 Wavelength (m) Band alignment determined by modification of InAsSb - Type II alignment with conduction and valence band offsets of 39 & 82 meV ADDITION OF N : • Reduction in overall strain band gap Reduction of • Conduction band further reduced by BAC model Reduction of 63 meV 50 InAsSbN MQW LED 25mA 50mA 75mA 100mA 150mA 200mA 300 K EL 40 EL Intensity (a.u.) p-i-n diode containing 10x InAsSbN QW in active region N =1%, Sb 6% p InAs InAsNSb MQW n InAs 30 C-H absorption 20 InAs (100) substrate 10 p+-InAs n+-InAs 0 2500 3000 3500 Wavelength (nm) Longest wavelength dilute nitride light emitting device to date 0.07 12 4 K EL Intensity (a.u.) 0.05 10 Outout Power (W) 30mA 50mA 75mA 100mA 150mA 4K 0.06 8 6 4 0.04 0.03 0.02 InAsSbN e-hh1 InAsSb e-hh1 InAsSb e-hh2 0.01 2 0.00 2.5 0 50 100 150 200 Current (mA) 250 300 3.0 3.5 4.0 4.5 Wavelength (m) LED output power : 6 µW at 100 mA drive current and internal RT efficiency ~ 1% 4000 4500 InAsSbN MQW p-i-n photodetector 0.1 4K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K Current (A) 0.01 1E-3 1E-4 1E-5 EL emission (a.u) -0.5 1.5 2.0 2.5 3.0 3.5 4.0 0.5 1.0 1.5 10 9 8 7 6 2 0.1 1.0 0.0 Voltage (V) R0A (cm ) 1 1E-6 R0A ~1/n 5 4 2 (R 1/n R 0AA)~1/n 3 2 0 4.5 Wavelength (m) 3 4 5 6 7 8 9 10 11 12 13 -1 1000/T (K ) A0363 4.00E+017 3.50E+017 3.00E+017 2.50E+017 17 -2 NA = 8.3x10 cm -3 2.00E+017 -2 Cut-off λ ~ 4 μm Ideality factor = 1.6 R0A T<120 K generation-recombination dominates T>220K diffusion limited recombination is dominant Capacitance at 0V =2.54 nF Built in potential = 0.19 V Carrier concentration = 8.3x1017 cm-3 2 C (F ) Photoresponse (a.u.) 10 1.50E+017 1.00E+017 5.00E+016 2 2 1/C =2(Vbi-V)/A qNA Slope = NA Vbi=0.19V x-intercept = Vbi 0.00E+000 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 Voltage (V) 0.15 0.20 0.25 0.30 0.35 New prospects Recent results on rapid thermal annealing (RTA) show a large x20 increase in PL intensity of InAsN -no increase in residual carrier concentration H irradiation also increases PL intensity In InAsN GaAsN +H results in passivation of N which restores the bandgap (reversibly) Can create GaAsN quantum dots hydrogen GaAsN GaAs Change to GaInAsN - single photon sources Micro – LED arrays Summary The successful MBE growth of InAsN directly onto InAs and GaAs substrates has been obtained with N up to ~ 2% Behaviour of N in InAs different to N in GaAs Mobility is reduced but shows weak dependence on N content Fermi level pinning and native donor states PL was obtained which covers the mid-infrared (2-5 μm) spectral range in good agreement with the BAC model Localisation and free carrier effects are important in interpretation of PL spectra N reduces band gap but has little effect on T sensitivity Photoreflectance shows N has no effect on Δo Auger CHSH de-tuning is possible Addition of Sb increases N incorporation –structural and optical properties - improved and bright PL obtained from Type I InAsSbN/InAs MQWs First long wavelength dilute N LED operating at 300 K good prospects for device applications if electron concentration can be controlled Acknowledgements A. Patane Nottingham University Transport measurements R. Beanland & A. Sanchez University of Warwick TEM J. Ibanez University of Madrid Raman spectroscopy R. Kudrawiec M. Latkowska Institute of Physics, Wroclaw Photoreflectance O. Drachenko M. Helm Helmholtz-Zentrum Dresden-Rossendorf Cyclotron resonance M. Schmidbauer Leibniz-Institute, Berlin X-ray diffraction Financial support from EPSRC (EP/G000190/01) and also for providing a studentship for M. de la Mare Comparison with InAsSb 0.012 Intensity (a.u.) 0.010 4K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K InAsSbN MQW LED N =1%, Sb 6% 0.008 0.006 0.004 0.002 2400 2600 2800 3000 3200 3400 3600 3800 4000 InAsSbN e-hh1 InAsSb e-hh1 InAsSb e-hh2 4200 Wavelength (nm) Comparison of the temperature dependence of the EL with that of type II InAsSb/InAs reveals more intense emission at low temperature Improved temperature quenching up to T~200 K where thermally activated carrier leakage becomes important and further increase in the QW band offsets is needed Increasing the nitrogen content above 0.5% reduces the band gap sufficiently such that the energy gap Eo becomes less than Δso effectively detuning the CHSH Auger recombination mechanism PL analysis temperature dependence 8 4K 20K 40K 60K 80K 100K 120K 140K 160K 190K 220K 250K 280K 300K A0299 7 Intensity (a.u.) 6 5 4 3 2 CO2 1 0 -1 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 Wavelength (m) 1.0 300K Intensity (a.u.) 0.8 0.6 CO2 0.4 0.2 0.0 2.6 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Wavelength (m) InAsN(1%) exhibits very weak temperature quenching ~ 8x PL emission obtained up to room temperature without annealing Peak wavelength near 4 µm – appropriate for CO2 detection 4.2 4.4 4.6 Comparing III-N-Vs InAsN Energy Eg-G = 0.35 eV EL=1.08 eV EX=1.37 eV X-valley G-valley GaAsN Energy X-valley N <100> G-valley L-valley Eg-G = 1.42 eV EL~0.3 eV EX~0.3 eV L-valley N <111> <100> <111> Wave vector The energy of the N-level (EN~ 1eV) is larger than the threshold energy for impact ionization (~ Eg-G). The energy of the N-level (EN~ 0.2eV) is smaller than the threshold energy for impact ionization (~ Eg-G). InAsN - Cyclotron Resonance Magneto-transmission in pulsed magnetic field B up to 60T and monochromatic excitation by QCL Minimum at the resonance field Bc gives me* = eBC/(2c) x=0% me * 0.025me Transmission (arb. units) e ~ 0.20 ps 0.4% 0.6% CR quenches in GaAsN (0.1%) due to low μ NN= = 0% 0% 1 1.1 % me * 0.027me e ~ 0.15 ps me * 0.029me e ~ 0.1 ps Transmission T =100 K u= 2.9THz InAs1-xNx m* eB / 2 e c 1.9% Nx = 1.1% = 1.1% 11.4m 1.0% me * 0.060me e 0.1ps 0 2 4 6 B (T) 8 = 11.4 µm = 66.0m 15.0m 0 0 0 20 T = 4.2K 40 20 B(T) 40 10 Patanè et al. PRB 80 115207 (2009) Area of the CR minimum gives electron density n 60 Photoreflectance Spectroscopy PR spectra can be fitted using InAsN on InAs where C and θ are amplitude and phase m=2.5 for b-b Avalanche photodiodes InAsN Energy Eg-G = 0.35 eV EL=1.08 eV EX=1.37 eV X-valley G-valley GaAsN Energy X-valley N <100> G-valley L-valley Eg-G = 1.42 eV EL~0.3 eV EX~0.3 eV L-valley N <111> <100> <111> Wave vector The energy of the N-level (EN~ 1eV) is larger than the threshold energy for impact ionization (~ Eg-G). The energy of the N-level (EN~ 0.2eV) is smaller than the threshold energy for impact ionization (~ Eg-G). InAsN: Impact Ionization 0.1 x=0.6% x =0.6% L=2m 5 m 10m x =0% I (A) 0.06 0.0 0.00 0 2 Rapid increase of current at large electric fields (>1kV/cm) due to impact ionization (IO). 4 x=0% I L=2m 5 m 0.05 2m T=77K -0.1 W = 5m L = 10m -4 10m 0.00 0 -2 0 V (V) 2 2 4 4 At x~1%, electric fields for impact ionisation are larger than those measured in InAs, although the threshold energy is smaller The reduction of the band gap energy by the N-atoms combined with impact ionization is of interest for IR-Avalanche Photodiodes Makarovsky et al., APL 96, 052115 (2010) Dilute nitrides D. Sentosa, X. Tang,a, and S.J. Chua, Eur. Phys. J. Appl. Phys. 40, 247–251 (2007) InAs N introduces tensile strain (on InAs or GaAs) disorder and strong bowing Harris, J. S. Semiconductor Science and Technology 17, 880 (2002) InN N InAsN Photoreflectance Solid lines are fits to Where, x is the N content N does not change Δso Photoluminescence curve fitting Fit using Includes localized and band-band transitions A = scaling factor Ecr = energy of crossover between equations K = smoothing parameter σ relates to slope of DOS Set K = kBT/σ and Ecr = Eg + kBT/σ n= 0.5 to 2 for momentum conserving non-conserving transitions Black arrows – Eg determined from PL fitting Red arrows – PL peak Best fit when n=1 Note the difference which increases with T Latwoska et al, Appl. Phys. Lett 102, 122109 (2013) Temperature dependence Eg obtained from PL spectral fitting deviates from PL peak value especially at T> 80K Free carrier emission must be taken into account Bose-Einstein formula fitting gives: e-phonon coupling constant, αB ~ 20 meV and average phonon temperature, θB ~ 140 K N incorporation significantly reduces Eg in InNAsSb but has almost no effect on temperature dependence Temperature dependence of bandgap Comparison of change in energy gap with T InNAsSb 65 meV whereas 1% N in GaAs reduces T dependence of Eg by 40% InAs 66 meV InSb 62 meV BAC model gives good agreement T dependence of Eg in InNAsSb is not sensitive to N due to large separation between EN and EM (~ 1 eV) Let Us Meet Again We welcome all to our future group conferences of Omics group international Please visit: www.omicsgroup.com www.Conferenceseries.com http://optics.conferenceseries.com/