IHEP High Power Input Coupler Activity Report Huang Tong-ming (黄彤明) IHEP High Power Input Coupler Group First Mini-workshop on IHEP 1.3 GHz Superconducting RF project June 10th, 2009, Beijing Outline • The construction of the high power input coupler for BEPCII 500MHz superconducting cavity; • The preliminary consideration about the input coupler for IHEP 1.3GHz superconducting RF project; • Some questions to be consulted. Part I: The Construction of the High Power Input Coupler for BEPCII 500MHz Superconducting Cavity; Design 个 • Considering the short time available for the BEPCII construction, the high power input coupler is modified based on the KEKB 508MHz coupler. • In the following, some simulation works will be listed. 1. doorknob cover; 2. doorknob; 3. DC-bias component; 4. ceramic; 5. outer conductor; 6. inner conductor; 7. water-cooling pipes; 8, window; 9. monitor ports for vacuum、Arc and electron ; 10. BEPCII 500MHz superconducting cavity. Window position Ceramic window The ceramic window is usually located at the minimum E-filed of the standing wave mode. Tristan-type window optimization Radial electric field of the ceramic window dc=2 mm dc=4 mm dc= 6 mm Electric field (V/m) 500000 400000 300000 200000 100000 The area near Choke tip 0 -10 0 10 20 30 40 Radial distance (mm) 50 60 70 Conclusion: • The E-field near the choke tip increases obviously, so the distance from the choke tip to the ceramic surface should be carefully selected. • The H-field gratitude along the ceramic radius is high, especially the H-field on the inner conductor is quite high, so the dimension of the ceramic window inner conductor is not allowed to be too small. Impedance matching optimization (b) 1.002 rw , f0 1.000 f0=500MHz rw=171mm rw=166mm Mag(S21) 0.998 0.996 rw=176mm 0.994 0.992 0.990 490 492 494 496 498 500 502 504 506 508 510 Frequency (MHz) (c) 0 0 1.000 h=94.5mm 0.999 0.998 h=90mm 0.997 0.996 0.995 0.994 0.993 0.992 h=99mm 0.991 0.990 0.989 0.988 0.987 0.986 0.985 0.984 488 490 492 494 496 498 500 502 504 506 508 510 512 f =500MHz Frequency (MHz) r_doorknob ,f0 (d) 1.000 f0=500MHz r_doorknob=20mm 0.999 0.998 Mag(S21) h ,f Mag(S21) Conclusion: • ‘rw’, ‘h’, ‘r_doorkonb’ have a great impact to the central frequency; • the parameter “h” is changed to 94.5mm to shift the central frequency to 500MHz. r_doorknob=15mm 0.997 r_doorknob=10mm 0.996 0.995 0.994 488 490 492 494 496 498 500 502 504 506 508 510 512 Frequency(MHz) Qe calculation Conclusion: The results provide theoretical instruction for coupler input port design and the positioning of the antenna penetration depth. 1.000000E+07 3.000E+06 radius_10 radius_15 2.500E+06 2.000E+06 1.000000E+06 Qext 10*logQext measured simulation 1.500E+06 1.000E+06 1.000000E+05 5.000E+05 0.000E+00 -32.7 -27.7 -22.7 -17.7 -12.7 -7.7 1.000000E+04 -33 -28 -23 -18 -13 -7.7 -2.7 2.3 -2.7 2.3 7.3 12.3 17.3 22.6 27.6 29.6 7.3 12.3 17.3 22.6 27.6 29.6 antenna penetration(mm) antenna penetration(mm) 4.500E+06 7.000E+06 4.000E+06 6.000E+06 3.500E+06 5.000E+06 Dia_SBP 220 Dia_SBP 200 2.000E+06 Qext 2.500E+06 4.000E+06 D_215.25 D_225.25 3.000E+06 1.500E+06 1.000E+06 2.000E+06 5.000E+05 1.000E+06 0.000E+00 -3 2. 7 -2 7. 7 -2 2. 7 -1 7. 7 -1 2. 7 -7 .7 -2 .7 2. 3 7. 3 12 .3 17 .3 22 .6 27 .6 29 .6 Qext 3.000E+06 antenna penetration(mm) 0.000E+00 -33 -28 -23 -18 -13 -7.7 -2.7 2.3 7.3 12.3 17.3 22.6 27.6 29.6 antenna penetration(mm) Multipacting simulation Tri-plots about the counter function, final impact energy of the window: Electron trajectory of the window : Conclusion: By simulation, a one order MP appears on the vacuum side of the window at mixed wave mode. Thermal simulation RF heat of the coupler for BEPCII SCC Calculated Dynamic losses 160 inner conductor outer conductor ceramic 140 50 100 150 200 250 300 Dynamic loss W) Window 26 52 77 103 129 155 Inner conductor 26 51 77 102 128 153 120 RF heat(W) Pin(kW) Y =0.004+0.51043 X 100 Y =0.08+0.26526 X 80 60 40 Y =0.064+0.22209 X 20 Outer conductor 11 22 33 45 56 67 0 50 100 150 200 Pin(kW) Temperature distribution Thermal Stress distribution 250 300 Fabrication The fabrication flows of the inner conductor and the window: OFHC window parts machining Ceramic window frame machining Stainless steel parts machining Clean Copper-copper brazing Ceramiccopper brazing Clean Clean Copper or nickel plating Window subassemblies leak check Window subassemblies leak check Steel-copper brazing Ceramic TiN coating The whole window brazing Window subassemblies leak check Antenna and window EBW Stainless steel water cooling pipes machining Clean TIG Subassemblies leak check The whole antenna EBW OFHC antenna parts machining Clean Final assembly leak check and storage Copper plating and TiN coating Copper plating A good sample (left) and a bad sample (right) of copper plating: bubbles on the bad sample due to too high current A plate shape Ti target acted as anode and the outer conductor of the window as the cathode. The desired film thickness is 8 nm. TiN coating Brazing and welding Steel- copper brazing 99.5% Al2O3ceramiccopper brazing AuCu(65%) at 1020 Ag at 962 The whole window brazing Copper- copper brazing AuCu(65%) at 1020 AuCu(20%) at 889 , AgCu(28%) at 779 Brazing and welding, cont. TIG (Tungsten-arc inert-gas welding) EBW (electron beam welding) The ceramic shield before EBW (left) and after EBW (right) Leakage checking and surface cleaning Subassemblies leak check Final assembly leak check OFHC parts after cleaning Assembly is processed in a class 100 clean room Test Results The two key components (window and inner conductor) were fabricated in China and then received high power test in KEK. Professor Takaaki Furuya has given us great help about the test. The maximum power reached is 270kW in CW. Test result (Cont.) No electron and outgasing were found at CW of 200kW after conditioning Electron current state: Keeping power test at 100kW ,150kW and 200kW Part II: The preliminary consideration about the input coupler for IHEP 1.3GHz superconducting RF project Through carefully investigating and considering our fabrication experiences, we choose the STF baseline type coupler as IHEP 1.3GHz coupler design prototype in the first research phase. TTF III @DESY ERL @Cornell 电容型 @KEK STF baseline型@KEK IHEP 1.3GHz SCC coupler Frequency 1.3 GHz Max Power Test:1MW,Pulsed (for ILC) Oper:300 kW,Pulsed Pulse length & rep.rate Test:1.5msec,5Hz (for ILC) Oper:1.5msec,5Hz Q e for ILC 2 10 6 低温系统 低电平控制系统 功率源系统 真空系统等 低温恒温器 高功率输入 耦合器 超导腔和调谐器 What have done • Preliminary RF structures have been calculated. • Coupling factor calculation has been finished decide the coupler port position Transition taper Cold part Warm part doorknob Doorknob RF Structures 85 78 39 110 R3 R 10 R 14 82.55 7.0 4 104 40 45.2 R 1.6 R 2.0 19 R 2.0 3 4 Two parameters belong to the doorknob( highlighted with yellow) have been modified to get the optimum power transmission performance. 4 R7.0 23 Warm Part RF Structures Warm window 1.0 R 22.6 R 52 10 50 104 45.2 116 R 2.0 6.6 50 28 3.0 R 1.5 30 25 50 44 6.6 R 22 Try to reduce the number of bellows from 4 to 2: only one bellow on each conductors? 10 R 1.5 R 15 R 58 1 R 3.0 303 35.2 3.0 6.0 Inner conductor 9.0 R 1.25 5.0 2.0×9 Bellow 20 R1 2.5 2.5×11 113 Outer conductor R 17.6 R 40.5 R1 R 1.25 Outer conductor Inner conductor 81 Cold Part RF Structures R 17.6 R 40.5 10 50 35.2 R2 25 35 Cold window 30 R 17.3 1 R 46 50 26 60 40 7 17.4 R 11 R 2.3 Outer conductor 40 R 1.5 6.2 50 3 20 R 1.25 1 Inner conductor In order to match with the 40mm coupler input port, a tapper was used to transit the coaxial diameter from 60mm to 40mm. E-field and H-field distribution 1MW @TW 1MW @TW Try to reduce the E-field on ceramic surface, especially air side. RF Performance Power transmission performance Maximum Mag_E on ceramic air side is 1.28e6 V/m, @ 1MW, TW, 115deg Before optimize After optimize Mesh check 1.0 1400000 1200000 Abs(Mag_E) 0.8 Mag(S21) Radial E-field distritubion on ceramic air side 0.6 0.4 0.2 1000000 800000 600000 400000 0.0 200000 1.1 1.2 1.3 1.4 1.5 Frequency (GHz) Mag(S21)=0.9979@1.3GHz 0 10 20 30 Radial distance (mm) 40 50 Qe calculation • This work discusses the positioning of the high power input coupler for IHEP 1.3GHz 9-cell SCC. It examines the method used to reduce the model to enable faster solutions whilst still maintaining accurate results. In order to faster solving, the model was reduced to 4.5-cell since Qe scales with the number of cells. The field flatness in every cell should be assured before the coupling analysis. Two parameters related with Qe were studied: 1) the coupler input port position; 2) the antenna penetration depth Model of 4.5-cell and simplified coupler E-field distribution on Z-Plane H D field magnitude along the on axis curve Parameters related with Qe Qe calculation Plotted results • To obtain the optimum 2×106,we can: – Chose the distance from end cell to coupler port center D=40mm, adjust the antenna penetration near 4mm; – Chose the distance from end cell to coupler port center D=45mm, adjust the antenna penetration near 7mm; – Chose the distance from end cell to coupler port center D=50mm, adjust the antenna penetration near 10mm; beam tube = 80mm input port = 40 mm Distance from end-cell = ‘D’ The radius of antenna = 3mm Coaxial line = 50 W Qext 1.4000E+07 1.2000E+07 1.0000E+07 8.0000E+06 D=40mm D=45mm D=50mm 6.0000E+06 4.0000E+06 2.0000E+06 0.0000E+00 0 1 2 3 4 5 6 7 8 9 10 Part III: Some questions to be consulted Question 1: Have you done MP simulation? 2D or 3D simulation? Tools? Did you find MP occurs inside the coupler, especially on the bellow area during high power test? How to avoid MP? If the crest is wide enough (~2-3 mm), it may be able to support a MP buildup, or MP may jump across one MP resonance conditioned satisfied at operating power on flat wall Bellows or Steps May Lead to More Pervasive Multipacting Based on scaling, for a given bellows undulation or step, more MP resonances may be supported simultaneously, potentially increasing the conditioning area and gas load “Coupler component Test stand Activities at SLAC/ LLNL”, TTC meeting @ KEK, WG1-input coupler, 2006 Question2: What’s the fabrication difficulties? • Copper Plating on Bellows? • Vacuum sealing of bellows? • Other? Question3: About ceramic: • KEK coupler choose 95% Al2O3, why don’t you choose high purity ceramic? • Is the thermal shock tests of the ceramic necessary? Put into liquid nitrogen repeatedly: repeated times? Thermal Shock Test Question4: Does the dimension shrinking from room temperature to cryo-temperature impact the power transmission performance? Why is the central frequency a little below 1.3GHz? Does it have relationship with dimension shrinking? My guess: Right? The RF structures simulated are at room temperature and after cooling down, the central frequency will shift to 1.3GHz. Question5: Why does KEK STF coupler make a independent Vacuum in the inner conductor, since it results in DC bias impossible? Warm window Cold window Beam pipe Doorknob conversion 5K cooling Vacuum port 80K cooling Independent Vacuum? Why? Questions 6 and 7: What kind of sealing gasket of flanges used between warm and cold parts, doorknob and warm parts connecting? What kind of method used in bellow connecting? Brazing or welding? What’s the method used in bellow connecting? What’s the sealing gasket of the flange? Question8: Except copper plating, does the coaxial lines received other plating, e.g. ion plating? Plating method? Thickness? One of trial to reduce electron multipactoring amplitude, Ti ion plate with ~2-µm applied (gold color) to the inner and outer conductors for the coaxial transmission line. TTC at KEK Question 9: When does TiN been coated on ceramic vacuum side? Before whole window assembled or after? What’s method used in TiN coating? A TiN coating A or B? B TiN coating Question10:During brazing and welding, is there any metal vapor coming from? If there is, how to protect the ceramic? protection mask for ceramic and RF surface, TTF-III coupler e-beam for support and removal shielding against metal vapor ceramic with copper collars ERL mini-workshop at Beijing University, 7th – 8th November 2005 Question 11: Is it necessary to use four bellows? Why not just use two bellows (it’s similar with TTF-III coupler)? 4 bellows 2 bellows Question 12: • what’s the stainless steel type? 316L or 316LN?