Microelectronic Packaging Education
for the 21st Century
Objective
• Develop new courses to be developed by Faculty
to be shared globally to educate students and
industry professionals
Achieve By
• Collaboration between universities, government,
professional society and industry
Partners
• IEEE/CPMT and PRC/NSF
Microelectronic Packaging
Education for the 21st Century
Funding Level: 1997 through 2000
Total Funding
PRC/NSF
IEEE/CPMT
$240K
$120K
Microelectronic Packaging
Education for the 21st Century
Project Title
Thin Film Substrate Virtual
Laboratory
Thermal Management
Signal Integrity
PCB Interconnects
Electrical Design
PWB Virtual Laboratory
Sensors
Conductive Adhesives
Systems Cost Analysis
Lead Prof.
Gary May
Avi Bar-Cohen
Jose Schutt-Aine
University
Georgia Tech
U. of Minnesota
U. of Illinois
Indian Inst.
N.J. Rao
Science
Bruce C. Kim
Arizona State U.
Technical U. of
Z. Illyefalvi-Vitez
Budapest
Technical U. of
Gabor Harsanyi
Budapest
State University
James Morris
of New York
Peter Sandborn
U. of Maryland
Funding
Year
1&2
1&2
1
2
2&3
2
3
3
3
Thin Film Substrate Virtual Laboratory
(Gary May)
• http://www.ece.gatech.edu/research/labs/vc/packaging OR
http://cpmt.org
Description
• Course contents: clean room environment; process theory, steps and
flow chart; interconnect design and testing
• Provides: theory, lecture notes, video, graphics, familiarity with process
techniques
• Target group: undergraduate and graduate students, engineers new to the
subject area
Usage
• Site is regularly used to accompany the lecture and lab portions of the
senior level “Electronics Packaging Substrate Fabrication” course
offered at GaTech.
Status
• Complete
Signal Integrity
(Jose Schutt-Aine)
• http://natcsi.ece.uiuc.edu OR http://cpmt.org
Description
• Course contents:CAD tools on crosstalk simulation and lossy
interconnect
• Course provides: Simulation tools, taped lectures
• Target group: Graduate students and engineers working in signal
integrity
Usage
• Once the material is completed it can be used as an individual module
to teach signal integrity concepts in system level packaging courses
Status
• Some sections are incomplete
Thermal Management
(Avi Bar-Cohen, Yogendra Joshi, Sushil Bhavnani)
• http://www.me.umn.edu/courses/me5348/outline.html
Description
• Multi-institutional project - U of Minnesota, U. of Maryland and
Auburn University
• Course contents: conduction in PCBs and chip packages; convection
cooling of PCBs and electronic systems; heat sinks; passive immersion
cooling; failures and reliability; strain,stress and fatigue; thermoelectric
cooling; heat pipes.
• Course provides: lecture material, exercises, case study projects,
lectures on CD
• Target group: course is provided simultaneously at all three campuses
during the spring semester to mostly graduate students and limited UG
students.
Usage & Status
• Complete. The course material can be used as a semester long course
or modules.
Electrical Design
(Bruce Kim)
• http://cpmt.org
Description
• Course contents: interconnect modeling, embedded passives,
simultaneous switching noise, CAD tools on crosstalk simulation and
lossy interconnect
• Target group: graduate students
Status
• Most sections of the web site is under construction
PWB Virtual Laboratory
(Zsolt Illyevalfi-Vitez)
• http://www.ett.bme.hu/vlab OR http://cpmt.org
Description
• Course content: PWB technology; thin and thick film technology; laser
technology; surface mount technology, computer integrated
manufacturing technology
• Course provides: Information on the available equipment in the lab,
processes and results with animation and graphics
• Target group: graduate students
Usage
• The site is used by the graduate students of the Technical University of
Budapest
Status
• Apart from a few sites under construction most of the course is
complete
Cost-Based Design/Analysis
(Peter Sandborn, Cynthia Murphy)
• http://www.enme.umd.edu/ESCML
Description
• Course content: Lectures and on-line models for computing yields
through various process steps.
• Course provides: Web-based calculators, for student use; lectures for
use by professors and students
• Target group: graduate students
Usage
• The site is used by the graduate students of the University of Maryland
Status
• Several lectures now available; several calculators are open for others
to use
PCB Interconnects
(NJ Rao)
Status
• Under construction
Future Directions
• Finish courses that are not completed to date
• Initial product is CD-ROM, for some courses,
convert into multi-media by Sync-O-Mat software
and post on web.
• Update the completed courses periodically
• Add new courses in strategic areas
–
–
–
–
–
RF
Optoelectronics
Wafer level packaging
Integral passives
Reliability
Strategic Course Topics
Strategic Area
Funding Status
Course
Availability
Electronic packaging
yes
no
Substrate fabrication
yes
yes
Thermal management
yes
yes
Signal integrity
yes
partial
Virtual process lab
yes
yes
Electrical Design
yes
no
Sensors
yes
no
Conductive adhesives
yes
no
Systems cost analysis
yes
partial
Optoelectronics
no
no
RF & Wireless
no
no
Wafer level packaging
no
no
Integral passives
no
no
Reliability
no
no
Recommendations
Funding Year CPMT
1998-2000
PRC
$120K $240K
2001
$40K
2002
$30K $30K**
Total
$190K
* PRC committed
** PRC willing to commit if CPMT does
$20K*
$290K