Taiwan Standards Committee Liaison Report SEMI Taiwan April 2014 Venue, Location, Date SEMI Taiwan Standards Committee SEMI Taiwan I&C Committee Established in 2003 Mission: Focus on interface of manufacturing tools, factory automation computers, purpose of transferring commands and data used during the manufacturing process. Venue, Location, Date EHS Committee FPD Committee PV Committee 3DS-IC3DS-IC Committee Established in 2005 Established in 2008 Established in 2009 Established in 2011 Mission: Focus on Environmental, Health, and Safety standards fulfilling the technical needs. New TF to LED and PV, 2011 April Mission: Focus on standards for materials and equipment used in the manufacture and test methods of TFT-LCD Mission: Focus on standards for Cell Appearance and vibration Test Method in the manufacture and test methods of PV industry Mission: Focus on standards for Testing and Middle-end process in the manufacture and test methods of 3DS-IC industry FPD Metrology TC Venue, Location, Date Contents • • • • • • • Leadership Current Committee Structure Meeting Information New SNARFs & TFOFs Ballot Results Upcoming Ballots Task Force Update Venue, Location, Date Leadership of TC Co-Chair: Tzeng-Yow Lin-CMS/ITRI Co-Chair: Jia-Ming Liu-TDMDA Leadership Change of TF Leader: Fang Hui-Mei (Stepped Down) Leader: Jed Tai (E INK) New Venue, Location, Date <Month> <Year> <Region> <Committee> 5 FPD Committee Structure and Organization Chart Liaison L: YP Lan/ITRI L:DA Chang/Kingbird L:RJ Chuang/TDMDA L:Tony Chiu/CIPO TWN FPD TC C: Tzeng-Yow Lin-CMS/ITRI C: Jia-Ming Liu-TDMDA LCD Sub-Committee L:Kerson Wang-i-boson ACG TF (DISBANDED) Touch Screen Panel TF L: Garfield Pan-AUO L: Y.W. Fang-AUO L:S.P. Wang-DTC/ITRI L:S.Y. Chuo-CMS/ITRI Flexible Display TF <New> e-Paper Displays TF L: Fang Hui-Mei (Prime View, New leader) L: Bor-Jiunn Wen-CMS/ITRI L:WangWen-Tung-ITRI 3D Displays Metrology TF (DISBANDED) L: Wen-Chuan Tsai-AUO L: Bao-Jen Pong-CMS/ITRI <Month> <Year> Venue, Location, Date <Region> <Committee> L: Kuen Lee-EOL/ITRI 6 Committee Highlights : FPD Organization Chart (New) Liaison L: YP Lan/ITRI L:DA Chang/Kingbird L:RJ Chuang/TDMDA L:Tony Chiu/CIPO TWN FPD TC C: Tzeng-Yow Lin-CMS/ITRI C: Jia-Ming Liu-TDMDA LCD Sub-Committee L:Kerson Wang-i-boson Touch Screen Panel TF e-Paper Displays TF Flexible Display TF L: Y.W. Fang-AUO L: Fang Hui-Mei (Stepped Down) L:Wang Wen-Tung-ITRI L:S.Y. Chuo-CMS/ITRI L: Jed Tai (E INK) New L: Bor-Jiunn Wen-CMS/ITRI <Month> <Year> Venue, Location, Date <Region> <Committee> 7 FPD-Metrology Committee Meeting Information Committee Last Meeting Location Next Meeting Location FPD Committee Apr. 22, 2014 ITRI July 22, 2014 ITRI Venue, Location, Date <Month> <Year> <Region> <Committee> 8 New SNARFs and TFOFs None Venue, Location, Date <Month> <Year> <Region> <Committee> 9 Ballot Results Document Document Title # 5293B Test Method for Positional Accuracy of Touchscreen Panel 5533A Test Methods for Color Properties of Electronic Paper Displays Venue, Location, Date <Month> <Year> <Region> <Committee> Committee Action Failed, re-work Passed 10 Upcoming Ballots NA Venue, Location, Date <Month> <Year> <Region> <Committee> 11 FPD Metrology- TF Update • e-Paper TF : focus on reflectance measurements for Electronic Paper Displays: Terminology & Measuring methods, including Incident illumination and measurement geometry. The draft #5533A Passed for A&R. • Touch Screed TF: Re-work the draft #5293C for next Cycle, 2014 • Flexible TF: Working on the SNARF for: New Standard: Test Methods for Flexibility Properties of Flexible Displays, but team members still have different opinions on this SNARF. So, will re-work. • ACG TF: Disbanded on Jan. 21, 2014 • 3D Display Metrology TF: Disbanded on Jan. 21, 2014 <Month> <Year> Venue, Location, Date <Region> <Committee> 12 PV TC Contents • • • • • • • Leadership Current Committee Structure Meeting Information New SNARFs & TFOFs Ballot Results Upcoming Ballots Task Force Update Leadership PV Committee Co-chair: B.N.Chuang-CMS/ITRI Co-chair: J.S. Chen-TeraSolar Co-chair: Ray Sung-UL TWN Leadership Change of TF TF: PV Wafer Measurement Method Leader: Dr. Samuine Chen (ITRI/CMS ,New leader) <Month> <Year> <Region> <Committee> 15 PV Committee Structure and Organization PV Committee Chart C:B.N.Chuang-CMS/ITRI C:J.S. Chen-TeraSolar C:Ray Sung-UL TWN PV Package Performance TF L: C.C.Lin-PV Guider Organic PV and Dye Sensitized Solar Cell TF (OPV & DSSC) L: Bor –Tsuen Wang/National Pingtung Unviersity L: Der-Ray Huang/NDHU L: T.C. Wu – CMS/ITRI L: T.C. Wu-CMS/ITRI L: Ivan Chou/Delsolar L: K.T.Lee-King Design Building Integrated Photovoltaic (BIPV) Task Force TF L: C.C.Lin-PV Guider PV Wafer Measurement Method TF L: Der-Ray Huang/NDHU L: Dr. Samuine Chen/ITRI-CMS L: T.C. Wu-CMS/ITRI L: Ivan Chou/Delsolar L: K.T.Lee/King Design L: Kuang Han Ke/Gran System Venue, Location, Date PV Committee Meeting Information Committee Last Meeting Location Next Meeting Location PV Committee April 25 ITRI July 25 ITRI Venue, Location, Date New SNARFs & TFOFs • New PV Reliability Test Method Task Force Venue, Location, Date Ballot Results • None Venue, Location, Date Upcoming Ballot • None Venue, Location, Date PV –TF Update • Package TF: SEMI Draft #5431:New Standards : Test Method for Performance Criteria of Photovoltaic (PV) Wafer, Cell, and Module Package in process. Doc 5431 draft may apply for approval to vote in 2014Q4 in order to simulate and consider the handling, process and transportation for pallet cartons of packaged cells indoors and outdoors, this draft will refer the guidelines of ISTA and SEMI Standards firstly, based on the specific scenario. Revised PV 38-0912 to add criteria. • BIPV TF: SEMI Draft # 5560 : New Standard : Classification of Building Integrated Photovoltaic (BIPV) in progress. Currently working on the category and terminology. • Wafer Measurement Method TF: SNARF for wafer crack detection method or carrier lifetime measurement method. Venue, Location, Date PV –TF Update • DSSC&OPV TF: Documents in work are Doc# 5597Voltage (I-V) Performance Measurement of Dye Sensitized Solar Cell (DSSC), Doc 5599-Spectrum Response (SR) Measurement of Dye, ensitized Solar Cell (DSSC), Doc 5598Durability Test Method of Dye Sensitized Solar Cell (DSSC) No Title Update (Old) New Title Status #5597 (old) Current-Voltage (I-V) Performance Measurement of and Dye-Sensitized Solar Cell (DSSC)) (new) Current-Voltage (I-V) Performance Measurement of Organic Photovoltaic (OPV) and Dye-Sensitized Solar Cell (DSSC)) Passed # 5599 (old) Spectrum Response (SR) Measurement of Dye Sensitized Solar Cell (DSSC) (new) Spectrum Response (SR) Measurement of Organic Photovoltaic (OPV) and Dye Sensitized Solar Cell (DSSC) Passed Venue, Location, Date 3DS IC TC Venue, Location, Date Leadership • Committee Co-chairs – TK Ku (ITRI) – Wendy Chen (KYEC) – YS Lai (ASE) NAVenue, 3DS-ICLocation, Committee Report - August 2011 Date Contents • • • • • • • Leadership Current Committee Structure Meeting Information New SNARFs & TFOFs Ballot Results Upcoming Ballots Task Force Update Venue, Location, Date Organization Chart Taiwan 3DS-IC Committee Chairs: • TK KU(ITRI) • Wendy Chen(KYEC) • YS Lai(ASE) Middle-end Process Task Force Leaders: Leaders: TT Miau (ITRI) Jerry Yang (SEMATECH) Roger Huang (ASE) CC Chen (CMPUG TW) Ming-Chin Tsai (KYEC) Erh Ho Chen (ITRI) NAVenue, 3DS-ICLocation, Committee Report - August 2011 Date Testing Task Force Committee Meeting Information Committee Last Meeting Location Next Meeting Location 3DS IC Committee Nov. 22, 2013 SEMI TBC, 2014 SEMI <Month> <Year> <Region> <Committee> 27 SNARFs (Standards New Activity Report Form) Middle end Process TF NA Testing TF Doc. 5485 New Standard: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products SEMI 3DS-IC Standards Venue, Location, Date Activities - August 2012 3DS IC Testing TF Update – [5485] New Standards: Guide for Incoming/Outgoing Quality Control and Testing Flow for 3DS-IC Products • Summary: – 1. Removed one extra AOI typed in 5.1.9 – 2. Removed 6.2.3 X-ray inspection. à for cost consideration – 3. Revised 8.4 SCoS testing flow à added options for CoC and CoW into the flow. NAVenue, 3DS-ICLocation, Committee Report - August 2011 Date Published Standards [1/2] • SEMI 3D6-0913, New Standard: Guide for CMP and Micro-bump Processes for Frontside Through Silicon Via (TSV) Integration – This Guide provides: • A generic middle-end process flow to define acceptable TSV and CMP quality criteria as well as to develop methodology and measuring procedures for micro-bump. • A criteria and common baselines of the middle-end process for related upstream and downstream manufacturers in fabricating 3DS-IC products. SEMI 3DS-IC Standards Venue, Location, Date Activities Published Standards [2/2] • SEMI 3D7-0913, New Standard: Guide for Alignment Mark for 3DS-IC Process – Photo alignment mark configuration is the key to ensure consistent and precise alignment of layers, chips and wafers. – This Guide provides: • the alignment mark strategy for chip to chip, chip to wafer, and wafer to wafer stacking. • addresses the universal alignment mark where the outcome will be a feasible photo alignment standard. Originated by Taiwan 3DS-IC Middle End Process TF SEMI 3DS-IC Standards Venue, Location, Date Activities EHS TC <Month> <Year> <Region> <Committee> 32 Contents • • • • • • • Leadership Current Committee Structure Meeting Information New SNARFs & TFOFs Ballot Results Upcoming Ballots Task Force Update Leadership of TC Co-Chair: Shuh-Woei Yu-SAHTECH Co-Chair: Fang-Ming Hsu-TSMC <Month> <Year> <Region> <Committee> 34 EHS Committee Structure and Organization Chart TWN EHS TC FPD Safety Sub-Committee C: Shuh-Woei Yu-SAHTECH C: Fang-Ming Hsu-TSMC L:C.C. Huang -SAHTECH IC Equipment Safety TF L: Collin Shen-Mxic Equipment Safety TF L: C.C. Huang-SAHTECH Gas & Chemical Safety TF L: Benny Chen-AUO L: Benny Chen-AUO L:Juo Cho-AUO L: Heng Li Sue-SAHTECH L: Alice Lin-CMO L: Moony Lee-UMC Seismic TF L:K.C. Tsai -NCREE L: J.S. Hwang-NCREE Environmental Sustainability TF L: Tony. C.H. Lu-ITRI L: C.Y Hung-TSMC L: D.W. Sun-TSMC Accreditation Committee PV Safety TF LE Safety TF L: Eddie Wu -Nexpw L: Eric Lin-Epistar Under Process EHS Committee Meeting Information Committee EHS Committee: NA 3DS-IC Committee Report - Last Meeting Location April 1, 2014 SEMI Next Meeting Location September, 2014 (TBD) SEMI New SNARF & TFOFs • None <Month> <Year> <Region> <Committee> 37 Ballot Result • None <Month> <Year> <Region> <Committee> 38 Upcoming Ballot • None <Month> <Year> <Region> <Committee> 39 TF Update • Overall TF Update by Dr. C. C. Huang/SAHTECH. Dr. Huang updated the current industry issues in Taiwan such as Occupational Safety and Health Act’s impact on high-tech equipment safety: Equipment and Mechanical appliances impact Explosion-proof electrical impact • Fire Act impact on high-tech plant Fire protection system in MO chemical room should be followed (or should follow) by water reaction and flammable liquid requirements. It is still difficulty on Cleanroom fire protection. • SEMI Japan Energy-Saving Cooperation Propose technical manual to explain assumption and derivation of S23 convection factors Proposed tank N2 conversion factor Agree on Japan’s suggestion to have the common view on the ECF ranking of N2 and CDA. It affects the equipment energy saving design. The Committee is going to work on this issue first. Will continue collecting related information of technical manual. <Month> <Year> <Region> <Committee> 40 TF Update • SEMI High-Tech Facility Committee Fire Protection task force is proposing the following issues. Cleanroom exhaust system - multi-zone desmoke effectiveness validation Cleanroom exhaust system - Subfab desmoke control effectiveness validation Sprinkler system-subfab action verified Local water mist protection verified Very early smoke detection system location under wafer slab evaluation verified Establish visualization safety expert system for HPM location <Month> <Year> <Region> <Committee> 41 TF Update • Action Item: Dr. C. C. Huang/SAHTECH to work with Dr. Tsai/NCREE for Seismic Topics and feedback to SEMI NA and SEMI Japan. Co-chairs recommended to form a working group to study the impact of Occupational Safety and Health Act on high-tech equipment safety. Assigned Dr. C. C. Huang as working group leader, invited Dr. Po-Wen Wu/UMC, Eric Lin/Epistar, Jean Yang/Innlux, Yee-Long Yi/AMAT, Representative/Siemens as team members to work on the said Act. Warmly invite Siemens to join this group to share EU regulations on risk management of process equipment. <Month> <Year> <Region> <Committee> 42 SEMICON Taiwan 2014 Sustainable Manufacturing Forum September 03, 2014 SEMICON Taiwan 2014 Sustainable Manufacturing Forum Date Sept. 3, 2014 Time 09:30 – 16:30 Place TWTC Nangang Exhibition Hall, Taipei, Room 402 Theme Sustainability of Advanced Technology Dr. S. W.Yu, Chairman, SAHTECH General Chairs Mr. F. M. Hsu, Director, Corporate ESH Division,TSMC Sponsors TBD Attendees Target 150 attendees. (from IC/ FPD/ PV/ LED industry users and equipment and materials suppliers) Total 8 topics Topics interested by User: Integrated Chemical ESH Management Procurement, process, recycle, waste abatement and disposal… Segment EHS Resource Conservation – Energy, Water and Chemicals E NH4-N Wastewater Treatment Effectiveness and System Safety E Advanced Exhaust Air Abatement Systems E Sustainable Compliance: USA, Europe, Asia,… E Effective Tool Salvage after Major Fire S EPI Process H2 Gas Reclamation – Mechanism and Best Practice E Health Promotion Best Practices H Topic or Speaker/Company Candidates 2014 Sustainable Manufacturing Forum Agenda Time: Morning Description Time : Afternoon Description 09:15 -09:30 Registration 13:30 -14:00 Speech 09:30 -09:40 Remarks 14:00 -14:30 Speech 09:40 -10:40 Keynote 14:30 -15:00 Speech 10:40 -11:10 Speech 15:00-15:30 Speech 11:10-11:40 Speech 11:40 -12:10 Speech 15:30-16:30 Panel Discussion 12:10 -13:30 Lunch Break 16:30 Adjourn Regional Staff Contact Information Name Cher Wu E-mail cwu@semi.org Phone +886-3-560-1777 Fax +886-3-560-1555 Office Address 11F-2, No. 1, Taiyuan 1st Street, Zhubei, City, Hsinchu, County 30265, Taiwan Other Committees I&C / EHS / FPD / PV /3DS IC Committee In charge Venue, Location, Date