HP BladeSystem c7000
Enclosure Evolution
October 2014
Speaker name / Title
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Standard Features:
• 16 HH/8 FH blade bays
• 6 Hot-plug power supply bays (N+1, N+N)
• 8 I/O interconnect bays (4 redundant fabrics)
• 10 Hot-plug fan bays with redundancy
• All c-Class G1 through Gen9 ProLiant and
Integrity server blades3,4
• All power input modules and power supplies3
• Redundant OA option
c7000 Enclosure Evolution Overview5
Initial Offering
Initial Update
RoHS Enclosure
Platinum Enclosure
4XXXXX-B21
4XXXXX-B22, -B23
5XXXXX-B21, 68661XB21
6XXXXX-B211, 7XXXXXB21
2Q- 2009
3Q-2006
1Q-2013
•4Tb/s
Midplane
3Q-2007
2018
•RoHS compliance
•7Tb/s Midplane (40% increase),
•5Tb/s Midplane (25% increase),
improved signal integrity; adds:
improved signal integrity; adds:
– 16Gb FC
– 20GbE
– 4xFDR IB (>1 port/server)
– 4xQDR IB, 4xFDR IB (1 port/server) •1Phase intelligent input module
– 6Gb SAS
•Location Discovery Services
•2400W Platinum power supply
•2650W Platinum power supply
(2Q10)2,3
(2Q13)2,3
•1Gb/s OA connectivity
•High voltage power solution (3Q14)2,3
•Limited distribution with Platinum
1. Except 68661X-B21.
enclosure
(SKUs
68661X2. Although introduced with this enclosure, this item is supported on all enclosures.
Seemidplane
back-up slides
for more
information.
B21)
3. The enclosure OA firmware must be at a level to support all components within the enclosure.
•3” display (from 2”)
– 10GbE
•2400W Gold power
– 4Gb/8Gb FC
supply (4Q08)2,3
– 4xDDR IB
– 3Gb SAS
•2250W AC, 2250W 48VDC
power2,3
•1Phase/3Phase 200-240AC,
48VDC input modules2,3
•100Mb/s OA connectivity
4.
5.
2
Server generation mixing within an enclosure is allowed subject to the support requirements of the Onboard Administrator. See back-up slides for more
information.
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
All information applies to the commercial-grade/non-NEBs c7000 enclosures.
c7000 Enclosure Midplane Enhancements
7Tb/s
Platinum Enclosure
Bandwidth
40%
5Tb/s
25%
RoHS
Adds:
Enclosure
4Tb/s
Initial Offering Initial Update




10GbE
 No midplane
8Gb FC
change
4xDDR IB (20Gb)
3Gb SAS
3Q06
3
Adds:
 16Gb FC
 4xFDR IB (56Gb), >1 port
3Q07




20GbE
4xQDR IB (40Gb)
4xFDR IB (56Gb), 1 port
6Gb SAS
2Q09
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
1Q13
HP BladeSystem c7000 Platinum Enclosure
Improvements over previous RoHS enclosure
Enhanced fabric capabilities
 40% increase in midplane bandwidth
 Enhanced midplane signal integrity
 2x storage bandwidth with 16Gb Fibre Channel
 Multi-lane 56Gb 4xFDR InfiniBand
Intelligent infrastructure
 2650W Platinum Hot Plug Power Supply (80Plus Platinum
certified)
 Single Phase - Intelligent Power Module
 Location Discovery Services
4
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Innovations in Intelligent Infrastructure
Platinum Power Supplies
94% efficient 80Plus certified1
Improved
efficiency reducing cost per
enclosure
5
Power Discovery
Services
Location Discovery
Services
Eliminate power configuration
errors and precisely track power
usage2
Optimize workload placement
with servers that self-identify
and inventory
Minutes
Eliminate
vs. hours to deploy power
manual error prone inventory
tracking
1. See www.80plus/org
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
2. Supported with the single phase intelligent power input module
HP 2650W Hot Plug Power Supply
Designed for enhanced configurations
• 10% increase in total enclosure wattage (versus 2400W)
• Enables higher performance server configurations with N+N
power redundancy
Available options
• 733459-B21: HP 2650W Platinum Hot Plug Power Supply
• 733460-B21: HP 6X 2650W Platinum Hot Plug Power
Supply
www.80plus.org
Requirements
• Onboard Administrator firmware v3.73 or higher
• Compatible with all enclosures
6
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
c7000 Power Supply Comparison
HP 2650W Hot Plug
Platinum Power Supply
HP 2400W Hot Plug
Platinum Power Supply
2650W
2450W
15,900W
14,700W
Power Efficiency
94%
94%
80 PLUS Platinum Certified
Yes
Yes
Input Voltage Range (Vrms)
200-240V AC
200-240V AC
50/60
50/60
All
All
733459-B21 (single)
733460-B21 (6-pack)
588603-B21 (single)
517521-B22 (6-pack)
Maximum Output
Total Enclosure Wattage
Frequency Range (Nominal) (Hz)
Enclosure Support
Ordering
7
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
HP BladeSystem c-Class Longevity
On Jan 6, 2014 HP
announced:
• There’s no end-of-life date for HP
BladeSystem c-Class set at this time
• HP remains committed to the c-Class
architecture and plans to offer it through at
least 2018
• HP plans to support the c-Class portfolio
with spares for at least 5 years after any
EOL date
8
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
c7000 Enclosure Summary
Ongoing enhancements
• Higher performance I/O fabrics
• Intelligent infrastructure
• Increased power
Investment protection
•
•
•
•
9
ProLiant and Integrity server blade support across all enclosures
Power supply and power input module support across all enclosures
Onboard Administrator firmware support across all enclosures
c-Class availability to at least 2018
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
Thank you
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
* The enclosure SKU can be found in the OA Rack Overview screen. For more information, see
the Rack View section in the OA user guide. Note: The SKU is listed as a “part number”.
Enclosure Evolution
Enclosure
SKUs*
Intro
Date
Disc
Date
Initial
Enclosure
Offering
4XXXXX-B21
Aug06
Oct07
Initial
Offering
Update
4XXXXX-B22,
4XXXXX-B23
Aug07
Sep09
RoHS
Enclosure
5XXXXX-B21,
68661X-B21
May09
Oct13
Interconnect
Downlink
Speeds





10GbE
4Gb FC
8Gb FC
4xDDR IB
3Gb SAS
Above plus:
 20GbE
 4xQDR IB
 4xFDR IB
(1 port/server)
 6Gb SAS
Updates from Previous Enclosure


Original c7000 c-Class offering.
Original midplane:
o Supports 10GbE, 4Gb and 8Gb FC, 20Gb 4xDDR IB (via full-width switch), and
3Gb SAS.
o 4Tb/s Bandwidth: 8Gb/s per lane x 16 lanes per device bay x 16 device bays x 2
directions for duplex = 8 x 16 x 16 x 2 = 4,096Gb/s = 4Tb/s.


Insight Display LCD from 2” to 3”.
2400W Gold 92% efficient power supply (Nov08).
o Midplane same as above.


RoHS compliance.
Midplane bandwidth increased by 25% and improved signal integrity, adds:
o 20GbE, 40Gb 4xQDR IB (via full-width switch), 56Gb 4xFDR IB (single port per
server via full-width switch), and 6Gb SAS support.
o 5Tb/s Bandwidth: 10Gb/s per lane x 16 lanes per device bay x 16 device bays x 2
directions for duplex = 10 x 16 x 16 x 2 = 5.120Gb/s = 5Tb/s.
2400W Platinum 94% efficient power supply (Jun10).
OA connectivity from 10/100 to 1Gb.
Updated Onboard Administrator (DDR2 memory and PowerPC processor).



Platinum
Enclosure
11
6XXXXX-B21
(except 68661XB21),
7XXXXX-B21
Feb13
~2018 Above plus:
 16Gb FC
 4xFDR IB
(>1 port/srvr)
© Copyright 2014 Hewlett-Packard Development Company, L.P.

Midplane bandwidth increased by 40% and improved signal integrity, adds:
o 16Gb FC and 56Gb 4xFDR IB (via full-width switch) support.
o 7Tb/s Bandwidth: 14Gb/s per lane x 16 lanes per device bay x 16 device bays x 2
directions for duplex = 14 x 16 x 16 x 2 = 7,168Gb/s = 7Tb/s.
 Enclosure Location Discovery Services.
The information contained herein is subject to change without notice.
 Single phase intelligent power module.
 2650W Platinum 94% efficient power supply (Jun13).
c7000 Power Module- Power Supply Interoperability
(For commercial grade/non-NEBS systems)
Power Input Module
Single Phase AC Intelligent
(677595-B21)
Single Phase AC (413379-B21)
Three Phase AC NA/JPN
(413380-B21)
Three Phase AC International
(413381-B21)
-48V DC (AH331A)
High Voltage (753623-B21)
Supported Power Supply Kits1,2
• Platinum 2650W: 733460-B21(6-pack), 733459-B21 (single)
• Platinum 2400W: 517521-B22 (6-pack), 588603-B21 (single)
• Gold 2400W: 517521-B21 (6-pack), 499243-B21 (single)
• 2250W: 412138-B21 (single)4
Supported c7000
Enclosures3
4XXXXX-B21
4XXXXX-B22
4XXXXX-B23
5XXXXX-B21
6XXXXX-B21
7XXXXX-B21
• 2250W -48VDC (AH332A)
• Universal 2650W: 753619-B21 (6-pack), 753618-B21 (single)
1. Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level
or higher efficient power supplies. The Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all
are matched.
2. The three phase power input modules (413380-B21 and 413381-B21) require a minimum of 3 power supplies.
3. The Onboard Administrator firmware must be at least the minimum version that supports all components installed within the
enclosure.
4. No longer shipping.
12
© Copyright 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice.
c7000 Power Supply Comparison
(For commercial grade/non-NEBS systems)
Power Supply
Kit1
SKU
Rated
Maximu Efficiency Hot2
Input
m output
plug
Voltage
HP
Location
Discovery
Services
Supported Power Input
Modules3
Supported
c7000
Enclosures4
200-240
VAC
Supported6
4XXXXXB21
4XXXXXB22
4XXXXXB23
5XXXXXB21
6XXXXXB21
7XXXXXB21
2650W Platinum
AC
733460-B21(6-pack)
733459-B21 (single)
2400W Platinum
AC
2400W Gold AC
2450W
2250W AC5
517521-B22 (6-pack)
588603-B21 (single)
517521-B21 (6-pack)
499243-B21 (single)
412138-B21 (single)
2250W -48VDC
AH332A
2650W Universal
40-60
VDC
753619-B21 (6-pack) 277 VAC
753618-B21 (single)
380
VDC
2650W
94%
Yes
2450W
92%
2250W
89%
2250W
90%
Single Phase AC Intelligent
(677595-B21)
Single Phase AC (413379B21)
Three Phase AC NA/JPN
(413380-B21)3
Three Phase AC
International
(413381-B21)3
-48V DC (AH331A)
2650W
94%
High Voltage (753623-B21)
Not
supported
1. Each enclosure must include only one type of power supply. Mixing is not supported, except during hot swaps to different level or higher efficient power supplies. The
Onboard Administrator will exhibit a mismatch error due to mixed power supplies until all are matched.
2. At 50% of rated load. Platinum and Gold power supplies are 80Plus certified, see www.80plus.org. Power supplies with DC capability are not eligible for 80Plus certification,
efficiency is per HP internal testing.
3. Three phase power input modules require a minimum of 3 power supplies.
© Copyright
2014 Hewlett-Packard
Development
The information
contained
is subject
change withoutinstalled
notice. within the enclosure.
13 Onboard
4. The
Administrator
firmware
must beCompany,
at least L.P.
the minimum
version
thatherein
supports
all to
components
5. No longer shipping.
Onboard Administrator/Virtual Connect Firmware
Firmware Compatibility Matrix1,2,3
HP ProLiant Server
Blade:
BL460c (G1)
BL465c (G1)
BL480c (G1)
BL685c (G1)
BL260c G5
BL460c G5
BL465c G5
BL495c G5
BL680c G5
BL685c G5
BL280c G6
BL460c G6
BL465c G6
BL490c G6
BL495c G6
BL685c G6
BL2x220c G6
WS460c G6
BL2x220c G7
BL460c G7
BL465c G7
BL490c G7
BL685c G7
BL620c G7
BL680c G7
BL420c Gen8
BL460c Gen8
BL465c Gen8
BL660c Gen8
14
Onboard Administrator Firmware4
Minimum
Maximum
1.00
4.22
1.00
4.22
1.00
4.22
1.00
4.22
2.20
4.22
2.31
4.22
2.31
4.22
2.31
4.22
2.31
4.22
2.31
4.22
2.41
4.30
2.41
4.30
2.41
4.30
2.41
4.30
2.41
4.30
2.41
4.30
2.60
4.30
2.60
4.30
3.11
4.30
3.11
4.30
3.11
4.30
3.11
4.30
3.11
4.30
3.20
4.30
3.20
4.30
3.50
4.30
3.50
4.30
3.50
4.30
3.60
4.30
Virtual Connect Firmware5
Minimum
Maximum
1.10
4.20
1.10
4.20
1.10
4.20
1.10
4.20
1.31
4.20
2.02
4.20
2.02
4.20
1.32
4.20
1.20
4.20
2.02
4.20
2.10
4.30
2.10
4.30
2.30
4.30
2.10
4.30
2.30
4.30
2.10
4.30
2.30
4.30
2.30
4.30
3.10
4.30
3.10
4.30
3.01
4.30
3.10
4.30
3.01
4.30
3.15
4.30
3.15
4.30
3.60
4.30
3.51
4.30
3.60
4.30
3.70
4.30
HP ProLiant Server
Blade Mixing Support
All G1
All G1, BL260c G5
All G1 to all G5
4.116
4.30
4.30
4.30
1. Please review the HP Service Pack for ProLiant (SPP),
Onboard Administrator, and Virtual Connect firmware
advisories and release notes on www.hp.com/support
for important information when determining the most
appropriate firmware versions.
2. HP recommends the current firmware whenever
possible for maximum compatibility and stability.
All G1 to all G5,
All G6 except the
BL2x220c G6 and
WS460c G6
3. HP Service Pack for ProLiant (SPP) releases and
important information can be found at
www.hp.com/go/spp.
4. HP Onboard Administrator firmware and important
information can be found at www.hp.com/support/OA.
All G1 to all G6
All to all G6,
All G7 except BL620c G7
and BL680c G7
All G1 to all G7
All G1 to all G7,
BL420c Gen8,
BL460c Gen8,
BL465c Gen8
All G1 to all Gen8
©
Copyright
2014 Hewlett-Packard
Development Company,
herein is subject to change without notice.
WS460c
Gen8
3.60
4.30 L.P. The information
3.70 contained
4.30
BL460c Gen9
Notes:
All G6 to Gen9
5. HP Virtual Connect firmware and important information
can be found at www.hp.com/support/VC.
6. For additional information, please see the Customer
Notice ”ProLiant Gen9 Servers - Onboard Administrator
Firmware Version 4.11 (or Later) Support for Gen9
Server Blades and Possible Issues That May Arise”.