Fermi National Accelerator Laboratory General Information for Manufacture of Printed Circuit Boards TOF CLOCK TRANSLATOR 10 2 signal, 2 power Not less than 63 mils 7.125 x 9.000 inches SMOBC HASL 1 1 None 10 mils 6 mils Top and bottom lpi Top and bottom yes ~75 top and ~175 bottom 248 7 13 mils 130 mils None None 100 ohm differential traces on bottom layer: 16 mil width, 6 mil separation. --------------------------------TOP POWER GND BOTTOM Gerber files 5/10 days Matthew Jones – 630-840-8410 Tom Wesson – 630-840-2948 Note: All dimensions in inches unless specified Board Name Quantity Board Type (# signal layers - # power layers) Board Thickness and Tolerance Board Dimensions and shape Finish SMOBC (solder mask over bare copper) Plating HASL (hot air solder leveling) Cu Weight outer layers (ounces per square inch) Cu Weight inner layers (ounces per square inch) Number of gold contacts/side Minimum Trace width & tolerance Minimum Trace clearance & tolerance Solder Mask ( top & bottom – top only) Solder Mask Type (wet/dry/LPI) Silk Screen ( top & bottom – top only - white) Testing Required (yes/no/specify) Number of Surface mount pads TOP/BOT (only needed for testing) Number of Through Holes Number of Drill Sizes Smallest Hole Largest Hole Number of Blind Vias Number of Buried Vias Controlled Impedance (yes/no/specify) Physical Board Stackup Top layer name Inner layer Inner layer Bottom layer name Material Supplied (Film/gerber files/modem/ect) Required Delivery Special NOTES Technical Contact Personnel and phone number