Fermi National Accelerator Laboratory
General Information for Manufacture of Printed Circuit Boards
TOF CLOCK TRANSLATOR
10
2 signal, 2 power
Not less than 63 mils
7.125 x 9.000 inches
SMOBC
HASL
1
1
None
10 mils
6 mils
Top and bottom
lpi
Top and bottom
yes
~75 top and ~175 bottom
248
7
13 mils
130 mils
None
None
100 ohm differential traces on
bottom layer: 16 mil width, 6
mil separation.
--------------------------------TOP
POWER
GND
BOTTOM
Gerber files
5/10 days
Matthew Jones – 630-840-8410
Tom Wesson – 630-840-2948
Note: All dimensions in inches unless specified
Board Name
Quantity
Board Type (# signal layers - # power layers)
Board Thickness and Tolerance
Board Dimensions and shape
Finish
SMOBC (solder mask over bare copper)
Plating HASL
(hot air solder leveling)
Cu Weight outer layers (ounces per square inch)
Cu Weight inner layers (ounces per square inch)
Number of gold contacts/side
Minimum Trace width & tolerance
Minimum Trace clearance & tolerance
Solder Mask ( top & bottom – top only)
Solder Mask Type (wet/dry/LPI)
Silk Screen ( top & bottom – top only - white)
Testing Required (yes/no/specify)
Number of Surface mount pads TOP/BOT (only needed for testing)
Number of Through Holes
Number of Drill Sizes
Smallest Hole
Largest Hole
Number of Blind Vias
Number of Buried Vias
Controlled Impedance (yes/no/specify)
Physical Board Stackup
Top layer name
Inner layer
Inner layer
Bottom layer name
Material Supplied (Film/gerber files/modem/ect)
Required Delivery
Special NOTES
Technical Contact Personnel and phone number