Shanghai Huali Adoptes BSIMProPlusTM SPICE Modeling Platform for Huali’s
Advanced Process Technologies
San Jose, California, Jan. 31, 2012 - ProPlus Design Solutions, Inc., the leader in
SPICE Modeling products and technologies, today announced that Shanghai Huali
Microelectronics Corporation (HLMC) has adopted its BSIMProPlusTM SPICE
modeling platform and solutions to establish a complete flow, including data
measurement, model parameter extraction/optimization/validation, and model
retargeting for HLMC’s advanced technologies, 65/55nm, 45/40nm, and beyond.
Shanghai Huali Microelectronics Corporation is a dedicated semiconductor
foundry jointly invested by Shanghai Alliance Investment Co., Ltd., Shanghai Grace
Semiconductor Manufacturing Corporation, Shanghai Hua Hong NEC Electronics Co.,
Ltd., and Shanghai Hua Hong (Group) Co., Ltd. HLMC has been targeting at
advanced technologies, including both 65/55nm and 45/40nm, and will offer logic and
flash foundry services to fabless companies, IDMs, and other system companies.
Adopting the ProPlus modeling solutions enables HLMC to quickly establish
in-house SPICE modeling and validation capabilities and provide high quality SPICE
models to HLMC customers for its advanced process technologies. As a technology
and market leader, ProPlus provides the most complete SPICE modeling solution with
over 18 years of expertise in serving worldwide leading foundries, IDMs and fabless
design companies. The BSIMProPlusTM SPICE modeling solution was chosen by
HLMC for its high-efficient and powerful modeling environment, user-friendly
interface and unique modeling solutions for advanced technologies.
“It is critical for HLMC to establish a complete, reliable, unified and efficient
SPICE modeling extraction and validation flow to introduce advanced process
technologies to its customers,” said Mr. Chris Shao, Senior Director of Technology
Development Division I at HLMC. “As a 300mm wafer foundry targeting at advanced
technologies beyond 65/55 nm, HLMC must provide customers with high-quality
SPICE circuit simulation models. ProPlus has high reputation in products,
technologies and customer support, and has made firm commitments to HLMC. We
believe the collaboration with ProPlus is crucial for us to quickly set up and improve
modeling capabilities for advanced technologies, and greatly enhance our market
competitiveness.”
“We’re very happy to welcome HLMC adopting our modeling solutions," said Dr.
Zhihong Liu, the Executive Chairman of ProPlus. "BSIMProPlusTM has been the
primary choice for SPICE modeling by most leading semiconductor companies and
fabless design houses for more than 10 years. ProPlus has paid special attention to the
cooperation with HLMC, one of the key projects in China aiming at advanced process
technologies, and HLMC will benefit from ProPlus’ knowledge and experiences in
SPICE modeling, especially the unique technology advantages of advanced statistical
models, reliability models and layout proximity effects, etc. ProPlus is committed to
providing the best support for the technology development and customer services of
HLMC’s advanced process, and working closely with HLMC, contributing to the
whole industry. ProPlus devotes itself to enhance customer competitiveness, and we
look forward to sharing the joy with their success.”
About ProPlus
ProPlus Design Solutions, Inc. delivers Electronic Design Automation (EDA)
solutions with the mission to enhance the linkage between design and manufacture.
The company provides cutting-edge solutions for Design for Yield (DFY) that
consists of a device modeling technology platform BSIMProPlus™, targeted at
nanometer device fabrication, and circuit design and electrical verification platforms,
NanoDesigner™ and NanoVerifier™, targeted to meet the challenges of performance
and yield trade-off for advanced analog and digital circuit designs. The company has
R&D centers in the Silicon Valley, Beijing and Jinan, and branch offices in Tokyo,
Hsinchu, and Shanghai.
For more information, visit http://www.proplussolution.com.