Altera Device
Package Information
October 2003, vers.12.0
Introduction
Data Sheet
This data sheet provides package information for Altera® devices. It
includes these sections:
■
■
■
Device & Package Cross Reference (below)
Thermal Resistance (starting on page 9)
Package Outlines (starting on page 25)
In this data sheet, packages are listed in order of ascending pin count.
Device &
Package Cross
Reference
Tables 3 through 19 show which Altera CycloneTM, StratixTM GX, Stratix,
APEXTM II, MercuryTM, ARM®-based ExcaliburTM, APEX 20KC,
APEX 20KE, APEX 20K, and ACEX® 1K, FLEX 10KA, FLEX® 10KS, FLEX
10KE, FLEX 10KV, FLEX 10K®, FLEX 6000, MAX® 9000, MAX 7000B, MAX
7000AE, MAX 7000A, and enhanced configuration devices are available in
Ball-Grid Array (BGA), FineLine Ball-Grid Array (FBGA) and Wirebond
Ultra FineLine Ball-Grid Array (UBGA) packages.
Table 1. Cyclone Devices in BGA, FineLine BGA & Wirebond UBGA Packages
Device
Package
Pins
EP1C4
Wirebond FBGA
324
Wirebond FBGA
400
EP1C6
Wirebond FBGA
256
EP1C12
Wirebond FBGA
256
EP1C20
Wirebond FBGA
324
Wirebond FBGA
324
Wirebond FBGA
400
Table 2. Stratix GX Devices in BGA, FineLine BGA & Wirebond UBGA
Packages (Part 1 of 2)
Altera Corporation
DS-PKG-12.0
Device
Package
Pins
EP1SGX10C
Thermally Enhanced FlipChip FBGA
672
EP1SGX10D
Thermally Enhanced FlipChip FBGA
672
1
Altera Device Package Information Data Sheet
Table 2. Stratix GX Devices in BGA, FineLine BGA & Wirebond UBGA
Packages (Part 2 of 2)
Device
Package
Pins
EP1SGX25
Thermally Enhanced FlipChip FBGA
672
EP1SGX25D
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip FBGA
1,020
EP1SGX25F
Thermally Enhanced FlipChip FBGA
1,020
EP1SGX40D
Thermally Enhanced FlipChip FBGA
1,020
EP1SGX40G
Thermally Enhanced FlipChip FBGA
1,020
Table 3. Stratix Devices in BGA, FineLine BGA & Wirebond UBGA Packages
Device
EP1S10
EP1S20
EP1S25
EP1S30
Package
Thermally Enhanced FlipChip FBGA
484
Wirebond BGA
672
Wirebond FBGA
672
Thermally Enhanced FlipChip FBGA
780
Thermally Enhanced FlipChip FBGA
484
Wirebond BGA
672
Wirebond FBGA
672
Thermally Enhanced FlipChip FBGA
780
Wirebond BGA
672
Wirebond FBGA
672
Thermally Enhanced FlipChip FBGA
780
Thermally Enhanced FlipChip FBGA
1,020
Thermally Enhanced FlipChip FBGA
780
Thermally Enhanced FlipChip BGA
956
Thermally Enhanced FlipChip FBGA
EP1S40
EP1S60
EP1S80
Thermally Enhanced FlipChip BGA
1,020
956
Thermally Enhanced FlipChip FBGA
1,020
Thermally Enhanced FlipChip FBGA
1,508
Thermally Enhanced FlipChip BGA
956
Thermally Enhanced FlipChip FBGA
1,020
Thermally Enhanced FlipChip FBGA
1,508
Thermally Enhanced FlipChip BGA
FineLine BGA
Thermally Enhanced FlipChip FBGA
2
Pins
956
1,020
1,508
Altera Corporation
Altera Device Package Information Data Sheet
Table 4. APEX II Devices in BGA, FineLine BGA & Wirebond UBGA Packages
Device
EP2A15
EP2A25
Package
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip BGA
724
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip BGA
724
Thermally Enhanced FlipChip FBGA
EP2A40
1,020
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip BGA
724
Thermally Enhanced FlipChip FBGA
EP2A70
Pins
Thermally Enhanced FlipChip BGA
Thermally Enhanced FlipChip FBGA
1,020
724
1,508
Table 5. Mercury Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
Package
Pins
EP1M120
Thermally Enhanced FlipChip FBGA
484
EP1M350
Thermally Enhanced FlipChip FBGA
780
Table 6. ARM-Based Excalibur Devices in BGA, FineLine BGA & Wirebond
UBGA Packages
Device
EPXA1
Altera Corporation
Package
Pins
Wirebond FBGA
484
Thermally Enhanced FlipChip FBGA
672
EPXA4
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip FBGA
1,020
EPXA10
Thermally Enhanced FlipChip FBGA
1,020
3
Altera Device Package Information Data Sheet
Table 7. APEX 20KE Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
EP20K30E
EP20K60E
EP20K100E
Package
Wirebond FBGA
144
Wirebond FBGA
324
Wirebond FBGA
144
Wirebond FBGA
324
Thermally Enhanced Wirebond BGA
356
Wirebond FBGA
144
Wirebond FBGA
324
Thermally Enhanced Wirebond BGA
356
EP20K160E
Thermally Enhanced Wirebond BGA
356
Wirebond FBGA
484
EP20K200E
Thermally Enhanced Wirebond BGA
356
Wirebond FBGA
484
EP20K300E
EP20K400E
EP20K600E
EP20K1000E
EP20K1500E
Wirebond BGA
652
Wirebond FBGA
672
Wirebond BGA
652
Wirebond FBGA
672
Thermally Enhanced Wirebond BGA
652
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced Wirebond BGA
652
Thermally Enhanced FBGA
672
Thermally Enhanced FBGA
1,020
Thermally Enhanced FlipChip BGA
652
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip FBGA
1,020
Thermally Enhanced FlipChip BGA
Thermally Enhanced FlipChip FBGA
4
Pins
652
1,020
Altera Corporation
Altera Device Package Information Data Sheet
Table 8. APEX 20KC Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
EP20K200C
EP20K400C
EP20K600C
EP20K1000C
Package
Pins
Thermally Enhanced Wirebond BGA
356
Wirebond FBGA
484
Thermally Enhanced Wirebond BGA
652
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced Wirebond BGA
652
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip FBGA
1,020
Thermally Enhanced FlipChip BGA
652
Thermally Enhanced FlipChip FBGA
672
Thermally Enhanced FlipChip FBGA
1,020
Table 9. APEX 20K Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
Package
Pins
EP20K100
Wirebond FBGA
324
Thermally Enhanced Wirebond BGA
356
EP20K200
Thermally Enhanced Wirebond BGA
356
Wirebond FBGA
484
EP20K400
Thermally Enhanced Wirebond BGA
652
Thermally Enhanced FlipChip FBGA
672
Table 10. ACEX 1K Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
Altera Corporation
Package
Pins
EP1K10
Wirebond FBGA
256
EP1K30
Wirebond FBGA
256
EP1K50
EP1K50S
Wirebond FBGA
256
EP1K50
EP1K50S
Wirebond FBGA
484
EP1K100
Wirebond FBGA
256
Wirebond FBGA
484
5
Altera Device Package Information Data Sheet
Table 11. FLEX 10KA & FLEX 10KS Devices in BGA, FineLine BGA & Wirebond
UBGA Packages
Device
Package
Pins
EPF10K10A
Wirebond FBGA
256
EPF10K30A
Wirebond FBGA
256
EPF10K30A
Thermally Enhanced Wirebond BGA
356
EPF10K30A
Wirebond FBGA
484
EPF10K50S
Wirebond FBGA
256
EPF10K50S
Thermally Enhanced Wirebond BGA
356
484
EPF10K50S
Wirebond FBGA
EPF10K100A
Thermally Enhanced Wirebond BGA
356
EPF10K100A
Wirebond FBGA
484
EPF10K100A
Thermally Enhanced Wirebond BGA
600
EPF10K200S
Thermally Enhanced Wirebond BGA
356
EPF10K200S
Wirebond FBGA
484
EPF10K200S
Thermally Enhanced Wirebond BGA
600
EPF10K200S
Wirebond FBGA
672
EPF10K250A
Thermally Enhanced Wirebond BGA
600
Table 12. FLEX 10KE Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
6
Package
Pins
EPF10K30E
Wirebond FBGA
256
EPF10K30E
Wirebond FBGA
484
EPF10K50E
Wirebond FBGA
256
EPF10K50E
Wirebond FBGA
484
EPF10K100E
Wirebond FBGA
256
EPF10K100E
Thermally Enhanced Wirebond BGA
356
EPF10K100E
Wirebond FBGA
484
EPF10K130E
Thermally Enhanced Wirebond BGA
356
EPF10K130E
Wirebond FBGA
484
EPF10K130E
Thermally Enhanced Wirebond BGA
600
EPF10K130E
Wirebond FBGA
672
EPF10K200E
Thermally Enhanced Wirebond BGA
600
EPF10K200E
Wirebond FBGA
672
Altera Corporation
Altera Device Package Information Data Sheet
Table 13. FLEX 10K & FLEX 10KV Devices in BGA, FineLine BGA & Wirebond
UBGA Packages
Device
Package
Pins
EPF10K30
Thermally Enhanced Wirebond BGA
EPF10K50
Thermally Enhanced Wirebond BGA
356
356
EPF10K50V
Thermally Enhanced Wirebond BGA
356
EPF10K50V
Wirebond FBGA
484
EPF10K130V
Thermally Enhanced Wirebond BGA
600
Table 14. FLEX 6000 Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
EPF6016
Package
Pins
Wirebond BGA
256
EPF6016A
Wirebond FBGA
100
EPF6016A
Wirebond BGA
256
EPF6024A
Wirebond BGA
256
EPF6024A
Wirebond FBGA
256
Table 15. MAX 9000 Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
Altera Corporation
Package
Pins
EPM9320
Thermally Enhanced Wirebond BGA
356
EPM9320A
Thermally Enhanced Wirebond BGA
356
EPM9560
Thermally Enhanced Wirebond BGA
356
7
Altera Device Package Information Data Sheet
Table 16. MAX 7000B Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
Package
Pins
EPM7032B
Wirebond UBGA
EPM7064B
Wirebond UBGA
49
49
EPM7064B
Wirebond FBGA
100
EPM7128B
Wirebond UBGA
49
EPM7128B
Wirebond FBGA
100
Wirebond BGA
100
EPM7128B
Wirebond UBGA
169
EPM7128B
Wirebond FBGA
256
EPM7256B
Wirebond UBGA
169
EPM7256B
Wirebond FBGA
256
EPM7512B
Wirebond UBGA
169
EPM7512B
Wirebond FBGA
256
EPM7512B
Thermally Enhanced Wirebond BGA
256
Table 17. MAX 7000AE Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
EPM7064AE
EPM7128AE
Package
Pins
Wirebond UBGA
49
Wirebond FBGA
100
Wirebond FBGA
100
Wirebond UBGA
169
Wirebond FBGA
256
EPM7256AE
Wirebond FBGA
256
EPM7256AE
Wirebond FBGA
256
EPM7512AE
Thermally Enhanced Wirebond BGA
256
Table 18. MAX 7000A Devices in BGA, FineLine BGA & Wirebond UBGA
Packages
Device
8
Package
Pins
EPM7128A
Wirebond FBGA
100
Wirebond FBGA
256
EPM7256A
Wirebond FBGA
256
Altera Corporation
Altera Device Package Information Data Sheet
Table 19. Enhanced Configuration Devices in BGA, FineLine BGA & Wirebond
UBGA Packages
Device
Package
EPC16
Thermal
Resistance
Pins
Wirebond UBGA
88
Tables 20 through 34 provide θJA (junction-to-ambient thermal resistance) and
θJC (junction-to-case thermal resistance) values for Altera Cyclone, Stratix GX,
Stratix, APEX II, Mercury, ARM-based Excalibur, APEX 20K and APEX 20KE,
ACEX 1K, FLEX® 10K and FLEX 10KE, FLEX 8000, FLEX 6000, MAX® 9000,
MAX 7000, MAX 3000A, ClassicTM, and configuration devices.
Altera is transitioning to an industry-standard copper lid for its Thermally
Enhanced BGA and Thermally Enhanced FlipChip FBGA package offerings
(as mentioned in PCN024
http://www.altera.com/literature/pcn/pcn0214.pdf). This change affects the
APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families.
Hence, two thermal resistance specifications are provided for devices affected
by this change. The older packages are identified as using the aluminum
silicon carbide (AlSiC) lid, while the newer packages are identified as using the
copper (Cu) lid.
Thermally Enhanced BGA and Thermally Enhanced FlipChip FBGA packages
offered in the newer Altera families, including Stratix and Stratix GX, were
introduced using an industry-standard Cu lid. Hence, there is single thermal
resistance specification for these devices.
Table 20. Thermal Resistance of Cyclone Devices
Device
EP1C3
EP1C6
EP1C12
EP1C20
Pin Count
Package
θJC (° C/W)
θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
100
TQFP
11.0
37.5
35.4
33.4
29.8
144
TQFP
10.0
31.1
29.4
27.9
25.5
144
TQFP
9.8
29.4
28.0
26.7
24.7
240
PQFP
4.3
27.2
24.7
22.1
17.8
256
FBGA
8.8
28.7
24.5
22.3
20.5
240
PQFP
4.0
26.0
23.4
20.8
17.1
256
FBGA
6.6
24.3
20.2
18.1
16.4
324
FBGA
6.1
23.0
19.8
17.7
16.1
324
FBGA
5.0
21.0
17.7
15.6
14.1
400
FBGA
4.7
20.7
17.5
15.5
13.9
Altera Corporation
9
Altera Device Package Information Data Sheet
Table 21. Thermal Resistance of Stratix GX Devices
Device
Pin Count
EP1SGX10C
EP1SGX10D
672
EP1SGX25C
EP1SGX25D
672
EP1SGX25D
EP1SGX25F
1020
EP1SGX40D
EP1SGX40G
1020
Package
BGA
BGA
FBGA
FBGA
θJC (° C/W) θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W)
200 ft./min.
θJA (° C/W)
400 ft./min.
0.39
11.1
9.1
7.7
6.5
0.23
10.8
8.8
7.4
6.2
0.23
9.9
7.9
6.5
5.4
0.16
9.8
7.7
6.4
5.3
Table 22. Thermal Resistance of Stratix Devices
Device
EP1S10
EP1S20
EP1S25
EP1S30
EP1S40
EP1S60
EP1S80
10
Pin Count
Package
θJC (° C/W)
θJA (° C/W)
Still Air
θJA (° C/W)
100 ft./min.
θJA (° C/W) θJA (° C/W)
200 ft./min. 400 ft./min.
484
FBGA
0.38
11.9
9.8
8.4
7.2
672
BGA
3.2
16.8
13.7
11.9
10.5
672
FBGA
3.4
17.2
14
12.2
10.8
780
FBGA
0.43
10.9
8.8
7.4
6.3
484
FBGA
0.30
11.8
9.7
8.3
7.1
672
BGA
2.5
15.5
12.4
10.7
9.3
672
FBGA
2.7
16
12.8
11
9.6
780
FBGA
0.31
10.7
8.6
7.2
6.1
672
BGA
2.2
14.8
11.7
10.0
8.7
672
FBGA
2.3
15.3
12
10.4
9
780
FBGA
0.25
10.5
8.5
7.1
6.0
1020
FBGA
0.25
10.0
8.0
6.6
5.5
780
FBGA
0.2
10.4
8.4
7.0
5.9
956
BGA
0.2
9.1
7.1
5.8
4.8
1020
FBGA
0.2
9.9
7.9
6.5
5.4
780
FBGA
0.17
10.4
8.3
6.9
5.8
956
BGA
0.18
9.0
7.0
5.7
4.7
1020
FBGA
0.17
9.8
7.8
6.4
5.3
1508
FBGA
0.18
9.1
7.1
5.8
4.7
956
BGA
0.13
8.9
6.9
5.6
4.6
1020
FBGA
0.13
9.7
7.7
6.3
5.2
1508
FBGA
0.13
8.9
7.0
5.6
4.6
956
BGA
0.1
8.8
6.8
5.5
4.5
1020
FBGA
0.1
9.6
7.6
6.2
5.1
1508
FBGA
0.1
8.8
6.9
5.5
4.5
Altera Corporation
Altera Device Package Information Data Sheet
Table 23. Thermal Resistance of APEX II Devices
Device
EP2A15
Pin
Count
672
724
EP2A25
672
724
1020
EP2A40
672
724
1,020
EP2A70
724
1,508
Altera Corporation
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
FBGA
(Cu lid)
0.22
10.8
8.8
7.4
6.2
FBGA
(AlSiC lid)
0.34
11.6
9.6
8.0
6.6
BGA
(Cu lid)
0.23
9.7
7.7
6.4
5.3
BGA
(AlSiC lid)
0.35
10.0
8.2
6.6
5.4
FBGA
(Cu lid)
0.17
10.7
8.7
7.2
6.1
FBGA
(AlSiC lid)
0.26
11.5
9.6
8.0
6.6
BGA
(Cu lid)
0.17
9.6
7.6
6.2
5.2
BGA
(AlSiC lid)
0.27
10.0
8.2
6.6
5.4
FBGA
(Cu lid)
0.17
9.8
7.8
6.4
5.3
FBGA
(AlSiC lid)
0.27
10.4
8.5
6.9
5.7
FBGA
(Cu lid)
0.24
10.0
8.2
6.9
5.9
FBGA
(AlSiC lid)
0.2
10.0
8.2
6.9
5.9
BGA
(Cu lid)
0.15
9.5
7.5
6.1
5.1
FBGA
(AlSiC lid)
0.19
9.5
7.5
6.1
5.1
FBGA
(Cu lid)
0.15
9.7
7.7
6.3
5.2
FBGA
(AlSiC lid)
0.19
9.7
7.7
6.3
5.2
BGA
(Cu lid)
0.10
9.3
7.3
6.0
4.9
BGA
(AlSiC lid)
0.14
10.0
7.9
6.4
5.3
FBGA
(Cu lid)
0.10
8.8
6.8
5.5
4.5
FBGA
(AlSiC lid)
0.14
9.3
7.3
5.8
4.7
11
Altera Device Package Information Data Sheet
Table 24. Thermal Resistance of Mercury Devices
Device
EP1M120
EP1M350
Pin
Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
484
FBGA
(Cu lid)
0.58
12.2
10.1
8.7
7.5
484
FBGA
(AlSiC lid)
0.87
13.0
11.1
9.3
7.9
780
FBGA
(Cu lid)
0.22
10.5
8.5
780
FBGA
(AlSiC lid)
0.34
11.0
9.2
7.1
7.6
5.9
6.3
Table 25. Thermal Resistance of Excalibur Embedded Processor Solutions
Device
EPXA1
EPXA4
EPXA10
12
Pin
Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air 100 ft./min. 200 ft./min. 400 ft./min.
484
FBGA
4.0
20.0
18.3
15.8
13.9
672
FBGA
(Cu lid)
0.52
11.3
9.3
7.9
6.7
672
FBGA
(AlSiC lid)
0.78
12.2
10.2
8.6
7.2
672
FBGA
(Cu lid)
0.21
10.8
8.8
7.3
6.2
672
FBGA
(AlSiC lid)
0.31
11.6
9.6
7.9
6.6
1,020
FBGA
(Cu lid)
0.21
9.9
7.9
6.5
5.4
1,020
FBGA
(AlSiC lid)
0.32
10.4
8.5
6.9
5.7
1,020
FBGA
(Cu lid)
0.11
9.6
7.6
6.2
5.1
1,020
FBGA
(AlSiC lid)
0.17
10.0 11.3
8.0 8.4
6.4 6.9
5.7
Altera Corporation
Altera Device Package Information Data Sheet
Table 26. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 1 of 3)
Device
EP20K30E
EP20K60E
EP20K100
EP20K100E
EP20K160E
EP20K200
Pin
Count
Package
144
TQFP
208
144
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min.
θJA (° C/W)
400
ft./min.
8.0
29.0
28.0
26.0
25.0
PQFP
5.0
30.0
29.0
27.0
22.0
FBGA
14.0
36.0
34.0
32.0
29.0
324
FBGA
9.0
31.0
29.0
28.0
25.0
144
TQFP
7.0
28.0
26.0
25.0
24.0
144
FBGA
11.0
33.0
32.0
30.0
27.0
208
PQFP
5.0
30.0
28.0
26.0
21.0
240
PQFP
4.0
26.0
24.0
21.0
17.0
324
Fineline BGA
7.0
29.0
28.0
26.0
24.0
356
BGA
1.0
12.0
11.0
10.0
9.0
144
TQFP
7.0
26.0
25.0
24.0
23.0
208
PQFP
5.0
29.0
27.0
25.0
20.0
240
PQFP
4.0
25.0
23.0
20.0
17.0
324
FBGA
6.0
28.0
26.0
25.0
23.0
356
BGA
1.0
12.0
11.0
10.0
9.0
144
TQFP
7.0
26.0
25.0
24.0
23.0
144
FBGA
9.0
32.0
30.0
29.0
26.0
208
PQFP
5.0
29.0
27.0
25.0
20.0
240
PQFP
4.0
25.0
23.0
20.0
17.0
324
FBGA
6.0
28.0
26.0
25.0
23.0
356
BGA
1.0
12.0
11.0
10.0
9.0
144
TQFP
6.0
25.0
24.0
23.0
22.0
208
PQFP
5.0
28.0
26.0
23.0
19.0
240
PQFP
4.0
24.0
21.0
19.0
16.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FBGA
5.0
24.0
23.0
22.0
21.0
208
PQFP
4.0
25.0
23.0
20.0
17.0
240
PQFP
3.0
21.0
19.0
17.0
15.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FBGA
5.0
22.0
21.0
20.0
19.0
Altera Corporation
13
Altera Device Package Information Data Sheet
Table 26. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 2 of 3)
Device
EP20K200E
EP20K200C
EP20K300E
EP20K400
EP20K400E
EP20K400C
EP20K600E
EP20K600C
Pin
Count
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min.
208
PQFP
240
PQFP
3.0
356
BGA
2.0
484
FBGA
5.0
652
BGA
672
FBGA
208
PQFP
240
PQFP
3.0
22.0
356
BGA
2.0
12.0
484
FBGA
5.0
23.0
240
PQFP
3.0
652
BGA
1.0
4.0
25.0
θJA (° C/W)
400
ft./min.
23.0
20.0
17.0
22.0
19.0
18.0
16.0
12.0
11.0
10.0
9.0
23.0
22.0
21.0
20.0
1.0
12.0
11.0
10.0
9.0
5.0
21.0
20.0
19.0
18.0
4.0
25.0
23.0
20.0
17.0
19.0
18.0
16.0
11.0
10.0
9.0
22.0
21.0
20.0
19.0
18.0
16.0
15.0
12.0
11.0
10.0
9.0
672
FBGA
5.0
20.0
19.0
18.0
17.0
652
BGA
0.5
9.0
8.0
7.0
6.0
655
PGA
1.0
8.0
7.0
6.0
4.0
672
FBGA
0.36
11.6
9.6
7.9
6.5
672
FBGA w/ fin (1)
0.5
7.0
4.0
3.0
2.6
652
BGA
0.5
9.0
8.0
7.0
6.0
672
FBGA
(Cu lid)
0.25
10.9
8.8
7.4
6.3
FBGA
(AlSiC lid)
0.38
11.7
9.7
8.0
6.7
672
FBGA w/ fin (1)
0.5
7.0
4.0
3.0
2.6
652
BGA
0.5
9.0
8.0
7.0
6.0
672
FBGA
(Cu lid)
0.18
10.8
8.7
7.3
6.1
FBGA
(AlSiC lid)
0.28
11.6
9.6
7.9
6.5
672
1,020
1,020
14
Package
FBGA w/ fin (1)
0.5
5.0
3.0
3.0
2.0
FBGA
(Cu lid)
0.19
9.9
7.8
6.5
5.4
FBGA
(AlSiC lid)
0.29
10.4
8.4
6.8
5.6
0.5
5.0
3.0
3.0
2.0
FBGA w/ fin (1)
Altera Corporation
Altera Device Package Information Data Sheet
Table 26. Thermal Resistance of APEX 20K & APEX 20KE Devices (Part 3 of 3)
Device
Pin
Count
EP20K1000E
EP20K1000C
652
Package
BGA
(Cu lid)
BGA
(AlSiC lid)
652
FBGA w/ fin (1)
672
FBGA
(Cu lid)
FBGA
(AlSiC lid)
672
1,020
1,020
EP20K1500E
652
FBGA w/ fin (1)
0.12
8.3
7.0
5.6
4.5
0.2
9.3
7.4
6.0
4.9
0.5
4.0
3.0
3.0
2.0
0.12
10.6
8.6
7.2
6.0
0.2
11.4
9.4
7.7
6.3
0.5
6.0
4.0
3.0
2.0
0.12
9.7
7.7
6.3
5.2
FBGA
(AlSiC lid)
0.19
10.2
8.2
6.6
5.4
0.5
5.0
3.0
2.0
2.0
BGA
(Cu lid)
0.10
8.2
6.9
5.5
4.4
BGA
(AlSiC lid)
0.15
9.2
7.3
5.8
4.8
0.1
9.2
7.3
5.8
4.8
FBGA w/ fin
FBGA
652
FBGA w/ fin (1)
1,020
θJA (° C/W)
400
ft./min.
FBGA
(Cu lid)
652
1,020
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min.
0.5
4.0
3.0
2.5
2.0
FBGA
(Cu lid)
0.10
9.6
7.6
6.2
5.1
FBGA
(AlSiC lid)
0.15
10.1
8.1
6.4
5.3
0.5
5.0
3.0
2.5
2.0
FBGA w/ fin (1)
Notes to Table 26:
(1)
“fin” is an extra heat sink that customers can add to the device. Several vendors make heat sinks, and they all have
different sizes. Altera performed the thermal calculations in Table 26 using the following fin specifications: width:
0.25 mm; height: 7.0 mm; pitch: 1.5 mm; base thickness: 0.5 mm.
Table 27. Thermal Resistance of ACEX 1K Devices(Part 1 of 2)
Device
EP1K10
Pin
Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
100
TQFP
11.0
37.0
35.0
33.0
144
TQFP
8.0
31.0
29.0
28.0
25.0
208
PQFP
6.0
30.0
29.0
27.0
22.0
256
FineLine BGA
12.0
37.0
35.0
33.0
30.0
Altera Corporation
29.0
15
Altera Device Package Information Data Sheet
Table 27. Thermal Resistance of ACEX 1K Devices(Part 2 of 2)
Device
EP1K30
EP1K50
EP1K100
Pin
Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
144
TQFP
8.0
28.0
27.0
26.0
24.0
208
PQFP
5.0
30.0
28.0
26.0
21.0
25.0
256
FBGA
9.0
31.0
29.0
28.0
144
TQFP
7.0
26.0
25.0
24.0
23.0
208
PQFP
5.0
29.0
28.0
25.0
20.0
256
FBGA
7.0
30.0
28.0
27.0
24.0
484
FBGA
5.0
25.0
24.0
23.0
22.0
208
PQFP
5.0
28.0
26.0
23.0
18.0
256
FBGA
6.0
28.0
26.0
25.0
23.0
484
FBGA
5.0
24.0
23.0
22.0
21.0
Table 28. Thermal Resistance of FLEX 10K Devices (Part 1 of 3)
Device
EPF10K10
EPF10K10A
EPF10K20
EPF10K30
EPF10K30A
16
Pin
Count
Package
θJC (° C/W)
84
PLCC
9.0
144
TQFP
208
PQFP
100
TQFP
10.0
144
TQFP
208
PQFP
θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
28.0
26.0
24.0
22.0
7.0
26.0
25.0
24.0
23.0
5.0
29.0
27.0
25.0
20.0
35.0
33.0
31.0
28.0
7.0
29.0
28.0
26.0
25.0
5.0
30.0
29.0
27.0
21.0
256
FineLine BGA
7.0
33.0
30.0
28.0
26.0
144
TQFP
6.0
24.0
23.0
22.0
21.0
208
RQFP
1.0
17.0
16.0
15.0
13.0
240
RQFP
1.0
14.0
12.0
11.0
10.0
208
RQFP
1.0
17.0
16.0
15.0
12.0
240
RQFP
1.0
13.0
12.0
11.0
10.0
356
BGA
1.0
12.0
11.0
10.0
9.0
144
TQFP
7.0
25.0
24.0
23.0
22.0
208
PQFP
5.0
29.0
27.0
24.0
19.0
240
PQFP
4.0
25.0
22.0
20.0
17.0
256
FineLine BGA
6.0
28.0
26.0
24.0
23.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
24.0
22.0
21.0
20.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 28. Thermal Resistance of FLEX 10K Devices (Part 2 of 3)
Device
EPF10K30E
Pin
Count
Package
θJC (° C/W)
θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
144
TQFP
9.0
28.0
27.0
26.0
24.0
208
PQFP
5.0
30.0
28.0
26.0
21.0
256
FineLine BGA
9.0
31.0
29.0
28.0
25.0
484
FineLine BGA
6.0
26.0
25.0
24.0
22.0
EPF10K40
208
RQFP
1.0
17.0
16.0
15.0
12.0
240
RQFP
1.0
13.0
12.0
11.0
10.0
EPF10K50
240
RQFP
1.0
12.0
11.0
10.0
9.0
356
BGA
1.0
12.0
11.0
10.0
9.0
403
PGA
3.0
12.0
10.0
9.0
8.0
PGA (1)
3.0
10.0
8.0
7.0
6.0
240
PQFP
4.0
25.0
22.0
20.0
17.0
240
RQFP
1.0
13.0
12.0
11.0
10.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
23.0
22.0
21.0
20.0
144
TQFP
9.0
26.0
25.0
24.0
23.0
208
PQFP
5.0
29.0
27.0
24.0
19.0
240
PQFP
4.0
25.0
22.0
20.0
17.0
256
FineLine BGA
6.0
29.0
27.0
26.0
24.0
484
FineLine BGA
5.0
25.0
24.0
23.0
21.0
144
TQFP
9.0
26.0
25.0
24.0
23.0
208
PQFP
5.0
29.0
28.0
25.0
20.0
240
PQFP
4.0
26.0
23.0
20.0
17.0
256
FineLine BGA
7.0
30.0
28.0
27.0
24.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
25.0
24.0
23.0
22.0
240
RQFP
1.0
12.0
11.0
10.0
9.0
503
PGA
1.0
8.0
7.0
6.0
4.0
503
PGA
1.0
8.0
7.0
6.0
4.0
PGA (1)
1.0
6.0
5.0
4.0
3.0
PGA (2)
–
2.0
–
–
–
EPF10K50V
EPF10K50E
EPF10K50S
EPF10K70
EPF10K100
EPF10K100A
240
RQFP
1.0
13.0
11.0
10.0
9.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
22.0
21.0
20.0
18.0
600
BGA
0.5
10.0
9.0
8.0
7.0
Altera Corporation
17
Altera Device Package Information Data Sheet
Table 28. Thermal Resistance of FLEX 10K Devices (Part 3 of 3)
θJC (° C/W)
θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
Device
Pin
Count
EPF10K100E
208
PQFP
5.0
28.0
26.0
23.0
18.0
240
PQFP
4.0
23.0
21.0
19.0
16.0
256
FineLine BGA
6.0
28.0
26.0
25.0
23.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
24.0
23.0
22.0
21.0
599
PGA
1.0
8.0
7.0
6.0
4.0
600
BGA
0.5
10.0
9.0
8.0
7.0
240
PQFP
4.0
21.0
19.0
17.0
15.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
23.0
22.0
21.0
20.0
600
BGA
0.5
10.0
9.0
8.0
7.0
EPF10K130V
EPF10K130E
EPF10K200E
EPF10K200S
EPF10K250A
Package
672
FineLine BGA
5.0
21.0
20.0
19.0
18.0
599
PGA
1.0
8.0
7.0
6.0
4.0
600
BGA
0.5
10.0
9.0
8.0
7.0
672
FineLine BGA
5.0
20.0
19.0
18.0
17.0
240
RQFP
1.0
13.0
11.0
10.0
9.0
356
BGA
1.0
12.0
11.0
10.0
9.0
484
FineLine BGA
5.0
22.0
21.0
20.0
19.0
600
BGA
0.5
10.0
9.0
8.0
7.0
672
FineLine BGA
5.0
21.0
20.0
19.0
18.0
599
PGA
1.0
8.0
7.0
6.0
4.0
600
BGA
0.5
10.0
9.0
8.0
7.0
Notes to Table 28:
(1)
(2)
18
With attached pin-fin heat sink.
With attached motor-driven fan heat sink.
Altera Corporation
Altera Device Package Information Data Sheet
Table 29. Thermal Resistance of FLEX 8000 Devices
Device
EPF8282A
EPF8452A
EPF8636A
EPF8820A
EPF81188A
EPF81500A
Pin
Count
84
Package
PLCC
θJC (° C/W)
10.0
θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
30.0
28.0
26.0
23.0
29.0
100
TQFP
11.0
36.0
34.0
32.0
84
PLCC
10.0
30.0
28.0
26.0
23.0
100
TQFP
11.0
35.0
33.0
31.0
28.0
160
PQFP
6.0
32.0
31.0
30.0
28.0
160
PGA
6.0
20.0
13.0
10.0
8.0
84
PLCC
10.0
29.0
28.0
26.0
23.0
160
PQFP
6.0
32.0
31.0
30.0
27.0
192
PGA
6.0
16.0
11.0
8.0
6.0
208
PQFP
5.0
30.0
38.0
26.0
20.0
208
RQFP
1.0
17.0
16.0
15.0
14.0
144
TQFP
9.0
26.0
25.0
24.0
23.0
160
PQFP
6.0
32.0
31.0
30.0
27.0
192
PGA
6.0
16.0
11.0
8.0
6.0
208
PQFP
5.0
29.0
27.0
25.0
20.0
208
RQFP
1.0
17.0
16.0
15.0
14.0
225
BGA
6.0
28.0
19.0
14.0
11.0
208
PQFP
5.0
28.0
26.0
24.0
19.0
232
PGA
2.0
14.0
10.0
7.0
5.0
240
PQFP
4.0
24.0
21.0
19.0
16.0
240
RQFP
1.0
14.0
12.0
11.0
10.0
240
PQFP
4.0
22.0
20.0
19.0
16.0
240
RQFP
1.0
13.0
12.0
11.0
10.0
280
PGA
2.0
14.0
10.0
7.0
5.0
304
RQFP
1.0
11.0
10.0
9.0
8.0
Altera Corporation
19
Altera Device Package Information Data Sheet
Table 30. Thermal Resistance of FLEX 6000 Devices
Device
Pin Count
Package
EPF6010A
100
144
TQFP
10.0
28.0
26.0
25.0
24.0
EPF6016
144
TQFP
10.0
28.0
26.0
25.0
24.0
208
PQFP
5.0
30.0
28.0
26.0
21.0
240
PQFP
4.0
26.0
24.0
21.0
17.0
256
BGA
6.0
28.0
22.0
20.0
19.0
100
TQFP
11.0
35.0
33.0
31.0
28.0
FineLine BGA
14.0
36.0
34.0
32.0
29.0
144
TQFP
10.0
29.0
28.0
26.0
24.0
208
PQFP
5.0
30.0
29.0
26.0
21.0
256
FineLine BGA
10.0
32.0
30.0
29.0
26.0
144
TQFP
10.0
27.0
26.0
25.0
24.0
208
PQFP
5.0
29.0
28.0
26.0
20.0
240
PQFP
4.0
26.0
23.0
21.0
17.0
256
BGA
6.0
28.0
22.0
20.0
19.0
FineLine BGA
8.0
30.0
29.0
27.0
25.0
EPF6016A
EPF6024A
TQFP
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
11.0
35.0
33.0
31.0
28.0
Table 31. Thermal Resistance of MAX 9000 Devices (Part 1 of 2)
Device
EPM9320
EPM9320A
EPM9400
EPM9480
20
Pin Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
84
PLCC
9.0
29.0
27.0
25.0
23.0
208
RQFP
1.0
17.0
16.0
15.0
13.0
280
PGA
2.0
14.0
10.0
7.0
5.0
356
BGA
2.0
14.0
12.0
11.0
10.0
84
PLCC
9.0
29.0
27.0
26.0
23.0
208
RQFP
2.0
17.0
16.0
15.0
13.0
356
BGA
1.0
12.0
11.0
10.0
9.0
84
PLCC
9.0
29.0
27.0
25.0
23.0
208
RQFP
1.0
17.0
16.0
15.0
13.0
240
RQFP
1.0
14.0
12.0
11.0
10.0
208
RQFP
1.0
17.0
16.0
15.0
12.0
240
RQFP
1.0
12.0
11.0
10.0
9.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 31. Thermal Resistance of MAX 9000 Devices (Part 2 of 2)
Device
EPM9560
EPM9560A
Pin Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air
100 ft./min. 200 ft./min. 400 ft./min.
208
RQFP
1.0
17.0
16.0
15.0
12.0
240
RQFP
1.0
12.0
11.0
10.0
9.0
280
PGA
2.0
14.0
10.0
7.0
5.0
304
RQFP
1.0
12.0
11.0
10.0
9.0
356
BGA
1.0
12.0
11.0
10.0
9.0
208
RQFP
1.0
17.0
16.0
15.0
12.0
240
RQFP
1.0
11.0
10.0
9.0
8.0
356
BGA
1.0
12.0
11.0
10.0
9.0
Table 32. Thermal Resistance of MAX 7000 Devices (Part 1 of 3)
Device
EPM7032
EPM7032B
EPM7032S
EPM7032V
Pin
Count
44
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air 100 ft./min. 200 ft./min. 400 ft./min.
PLCC
10.0
33.0
31.0
30.0
27.0
PQFP
15.0
48.0
46.0
45.0
42.0
TQFP
14.0
46.0
44.0
43.0
40.0
44
PLCC
10.0
33.0
31.0
30.0
27.0
TQFP
14.0
46.0
44.0
43.0
40.0
49
Wirebond UBGA
23.0
69.0
67.0
66.0
62.0
44
PLCC
10.0
33.0
31.0
30.0
27.0
TQFP
14.0
46.0
44.0
43.0
40.0
PLCC
9.0
31.0
30.0
28.0
25.0
TQFP
14.0
45.0
44.0
42.0
39.0
31.0
30.0
28.0
25.0
44
EPM7032AE
44
PLCC
9.0
TQFP
14.0
46.0
45.0
43.0
40.0
EPM7064S
44
PLCC
9.0
31.0
30.0
28.0
25.0
40.0
EPM7064
TQFP
14.0
46.0
44.0
43.0
84
PLCC
9.0
28.0
26.0
25.0
23.0
100
TQFP
11.0
39.0
37.0
35.0
32.0
44
PLCC
9.0
31.0
30.0
28.0
25.0
TQFP
13.0
44.0
43.0
41.0
38.0
68
PLCC
9.0
29.0
28.0
26.0
23.0
84
PLCC
9.0
28.0
26.0
25.0
22.0
100
PQFP
6.0
33.0
32.0
31.0
30.0
Altera Corporation
21
Altera Device Package Information Data Sheet
Table 32. Thermal Resistance of MAX 7000 Devices (Part 2 of 3)
Device
EPM7064AE
EPM7064B
EPM7096
EPM7128A
EPM7128B
EPM7128E
EPM7128S
EPM7128AE
Pin
Count
44
22
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air 100 ft./min. 200 ft./min. 400 ft./min.
PLCC
9.0
31.0
30.0
28.0
25.0
TQFP
14.0
46.0
45.0
43.0
40.0
49
Wirebond UBGA
23.0
56.0
53.0
51.0
47.0
100
TQFP
12.0
39.0
37.0
35.0
31.0
FineLine BGA
21.0
49.0
47.0
44.0
40.0
23.0
68
PLCC
9.0
29.0
27.0
26.0
84
PLCC
9.0
28.0
26.0
24.0
22.0
100
PQFP
6.0
32.0
31.0
30.0
29.0
84
PLCC
9.0
28.0
26.0
25.0
22.0
100
TQFP
11.0
37.0
35.0
33.0
30.0
FineLine BGA
18.0
44.0
42.0
39.0
35.0
144
TQFP
9.0
31.0
29.0
28.0
25.0
256
FineLine BGA
12.0
38.0
36.0
34.0
31.0
49
Wirebond UBGA
22.0
53.0
50.0
48.0
44.0
100
TQFP
11.0
38.0
36.0
34.0
31.0
FineLine BGA
19.0
46.0
44.0
41.0
37.0
144
TQFP
169
Wirebond UBGA
9.0
32.0
30.0
29.0
26.0
16.0
44.0
42.0
39.0
35.0
256
FineLine BGA
13.0
40.0
38.0
36.0
33.0
84
PLCC
10.0
29.0
28.0
26.0
23.0
100
PQFP
6.0
32.0
31.0
30.0
29.0
160
PQFP
6.0
32.0
31.0
30.0
28.0
84
PLCC
10.0
30.0
28.0
26.0
23.0
100
TQFP
12.0
38.0
36.0
34.0
30.0
PQFP
10.0
35.0
34.0
33.0
32.0
160
PQFP
7.0
33.0
32.0
31.0
30.0
84
PLCC
11.0
30.0
28.0
26.0
23.0
100
TQFP
12.0
38.0
36.0
34.0
30.0
FineLine BGA
14.0
43.0
40.0
38.0
37.0
TQFP
11.0
33.0
30.0
28.0
26.0
144
EPM7160E
Package
169
Wirebond UBGA
14.0
42.0
40.0
38.0
36.0
256
FineLine BGA
12.0
39.0
37.0
35.0
31.0
84
PLCC
10.0
29.0
28.0
26.0
23.0
100
PQFP
6.0
32.0
31.0
30.0
29.0
160
PQFP
6.0
33.0
32.0
31.0
30.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 32. Thermal Resistance of MAX 7000 Devices (Part 3 of 3)
Device
EPM7160S
Pin
Count
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air 100 ft./min. 200 ft./min. 400 ft./min.
84
PLCC
10.0
35.0
28.0
26.0
100
TQFP
12.0
37.0
35.0
33.0
30.0
160
PQFP
6.0
33.0
32.0
31.0
30.0
EPM7192S
160
PQFP
6.0
32.0
31.0
30.0
29.0
EPM7192E
160
PGA
6.0
20.0
13.0
10.0
8.0
PQFP
6.0
32.0
31.0
30.0
26.0
EPM7256A
100
TQFP
9.0
36.0
34.0
32.0
30.0
144
TQFP
8.0
32.0
27.0
25.0
24.0
208
PQFP
5.0
30.0
28.0
26.0
21.0
EPM7256B
EPM7256E
EPM7256S
EPM7256AE
EPM7512AE
EPM7512B
23.0
256
FineLine BGA
12.0
34.0
32.0
29.0
28.0
100
TQFP
12.0
37.0
35.0
33.0
30.0
144
TQFP
169
Wirebond UBGA
208
256
9.0
33.0
29.0
27.0
25.0
13.0
40.0
38.0
36.0
34.0
PQFP
5.0
31.0
29.0
27.0
22.0
FineLine BGA
9.0
34.0
32.0
30.0
28.0
192
PGA
6.0
20.0
13.0
10.0
8.0
160
PQFP
6.0
31.0
30.0
29.0
25.0
208
RQFP
1.0
17.0
16.0
15.0
13.0
208
PQFP
5.0
30.0
29.0
26.0
21.0
RQFP
1.0
18.0
17.0
16.0
15.0
100
FBGA
13.0
42.0
39.0
37.0
36.0
100
TQFP
12.0
37.0
35.0
33.0
30.0
144
TQFP
9.0
33.0
29.0
27.0
25.0
208
PQFP
5.0
31.0
29.0
27.0
22.0
256
FineLine BGA
9.0
34.0
32.0
30.0
28.0
144
TQFP
10.0
32.0
27.0
25.0
23.0
208
PQFP
5.0
30.0
28.0
25.0
21.0
256
BGA
1.2
14.0
12.0
11.0
10.0
FineLine BGA
11.0
32.0
30.0
28.0
22.0
144
TQFP
10.0
32.0
27.0
25.0
24.0
169
Wirebond UBGA
12.0
35.0
33.0
31.0
30.0
208
PQFP
5.0
30.0
28.0
25.0
21.0
256
BGA
1.2
14.0
12.0
11.0
10.0
256
FineLine BGA
11.0
32.0
30.0
28.0
27.0
Altera Corporation
23
Altera Device Package Information Data Sheet
Table 33. Thermal Resistance of MAX 3000A Devices
Device
EPM3032A
EPM3064A
Pin Count
44
44
Package
θJC (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W) θJA (° C/W)
Still Air 100 ft./min. 200 ft./min. 400 ft./min.
TQFP
14.0
46.0
45.0
43.0
PLCC
9.0
31.0
30.0
28.0
40.0
25.0
TQFP
14.0
46.0
45.0
43.0
40.0
PLCC
9.0
31.0
30.0
28.0
25.0
100
TQFP
12.0
39.0
37.0
35.0
31.0
100
TQFP
12.0
38.0
36.0
34.0
30.0
144
TQFP
11.0
33.0
30.0
28.0
26.0
EPM3256A
144
TQFP
9.0
33.0
29.0
27.0
25.0
208
PQFP
5.0
31.0
29.0
27.0
22.0
EPM3512A
208
PQFP
5.0
30.0
28.0
25.0
21.0
256
FBGA
11.0
32.0
30.0
28.0
22.0
EPM3128A
Table 34. Thermal Resistance of Classic Devices (Part 1 of 2)
Device
EP600I
EP610
EP610I
θ JA (° C/W)
PDIP
22.0
67.0
CerDIP
18.0
60.0
28
PLCC
16.0
64.0
24
CerDIP
10.0
60.0
PDIP
18.0
55.0
24
Package
SOIC
17.0
77.0
28
PLCC
13.0
74.0
24
CerDIP
18.0
60.0
PDIP
22.0
67.0
28
PLCC
16.0
64.0
EP900I
40
PDIP
23.0
49.0
44
PLCC
10.0
58.0
EP910
40
CerDIP
12.0
40.0
PDIP
23.0
49.0
44
PLCC
10.0
58.0
40
CerDIP
17.0
44.0
PDIP
29.0
51.0
EP910I
EP1800I
24
θ JC (° C/W)
Pin Count
44
PLCC
16.0
55.0
68
PLCC
13.0
44.0
Altera Corporation
Altera Device Package Information Data Sheet
Table 34. Thermal Resistance of Classic Devices (Part 2 of 2)
Device
EP1810
Package
Outlines
Altera Corporation
θ JC (° C/W)
θ JA (° C/W)
JLCC
12.0
47.0
PLCC
13.0
44.0
PGA
6.0
38.0
Pin Count
68
Package
The package outlines on the following pages are listed in order of
ascending pin count. Altera package outlines meet the requirements of
JEDEC Publication No. 95.
25
Altera Device Package Information
8-Pin Plastic Dual In-Line Package (PDIP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
–
–
0.17
A1
.015
–
–
–
.130
–
Ordering Code Reference
P
Package Acronym
PDIP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-001
b
.016
–
.020
JEDEC Option
BA
b2
.055
–
.065
Maximum Lead Coplanarity N/A
b3
.030
.039
.045
Weight
0.5 g
c
.008
.010
.014
Moisture Sensitivity Level
Printed on moisture barrier bag
D
.360
–
.380
D1
.005
–
–
E
.300
–
.325
E1
.240
–
.260
e
.100 BSC
eA
.300 BSC
eB
–
–
eC
0°
–
15°
L
.125
–
.135
N
.430
8
Package Outline
E
D
e
N
E1
A2 A
Base
Plane
Seating
Plane
A1
L
D1
Pin 1
24
b2
b3
b
eA
ec
eB
Altera Corporation
Altera Device Package Information
20-Pin Plastic J-Lead Chip Carrier (PLCC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
.165
.172
.180
A1
.090
.105
.120
.062
–
.083
Ordering Code Reference
L
Package Acronym
PLCC
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-018
A3
.042
–
.048
JEDEC Option
AA
D
.385
.390
.395
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D1
.350
.353
.356
Weight
0.8 g
D2
.141
.155
.169
Moisture Sensitivity Level
Printed on moisture barrier bag
E
.385
.390
.395
E1
.350
.353
.356
E2
.141
.155
.169
b
.013
–
.021
e
.026
–
.032
N
20
Package Outline
D
D1
A2
0.020 Min
0.045 X 45
o
A3
E
E1
D2 E 2
0.050
BSC
e
b
D2 E 2
0.010 Max
A1
A
Altera Corporation
25
Altera Device Package Information
24-Pin Ceramic Dual In-Line Package (CerDIP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
–
–
0.200
0.015
0.028
0.041
–
0.175
Ordering Code Reference
D
Package Acronym
CerDIP
A
Lead Material
Alloy 42
A1
Lead Finish
Solder dip (60/40 typical)
A2
0.140
JEDEC Outline
MS-030
b
0.015
0.018
0.021
JEDEC Option
AF
b2
0.049
0.057
0.065
E2
0.365
0.380
0.395
Maximum Lead Coplanarity N/A
Weight
4.1 g
e
Moisture Sensitivity Level
Printed on moisture barrier bag
L
0.100 BSC
0.125
–
–
θ
0°
–
15°
D
1.240
1.260
1.280
E
0.290
0.305
0.320
E1
0.280
0.295
0.310
E3
0.325
–
0.410
N
24
Package Outline
B
E1
E
1
0.005 Min
0.090 Max
E3
E
D
Base Plane
A
A1
A2
A
C
0
E2
L
Seating Plane
b2
b
26
e
NÐ2 Places
Altera Corporation
Altera Device Package Information
24-Pin Plastic Dual In-Line Package (PDIP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
0.140
–
0.170
A1
0.015
–
–
0.125
–
0.145
Ordering Code Reference
P
Package Acronym
PDIP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-001
b
0.016
–
0.020
JEDEC Option
AF
b2
0.045
0.060
0.070
Maximum Lead Coplanarity N/A
b3
0.030
0.039
0.045
Weight
1.7 g
c
0.008
0.010
0.012
Moisture Sensitivity Level
Printed on moisture barrier bag
D
0.124
–
1.255
D1
0.020
–
–
E
0.295
–
0.325
E1
0.245
–
0.270
e
eA
0.100 BSC
0.310
–
0.360
eB
–
–
0.430
L
0.125
–
0.135
N
24
Package Outline
E E1
1
D
D
E
A2
A
A1
L
eA
eB
Altera Corporation
c
b2
D1
e
b3
b
27
Altera Device Package Information
28-Pin Plastic Dual In-Line Package (PDIP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
0.140
–
0.180
A1
0.020
–
–
0.125
–
0.145
Ordering Code Reference
P
Package Acronym
PDIP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-001
b
0.015
–
0.021
JEDEC Option
AG
b2
0.045
–
0.055
Maximum Lead Coplanarity N/A
b3
0.030
0.039
0.045
Weight
1.7 g
c
0.008
0.010
0.012
Moisture Sensitivity Level
Printed on moisture barrier bag
D
1.345
–
1.370
D1
0.028
–
–
E
0.295
–
0.325
E1
0.270
–
0.295
e
0.100 BSC
eA
0.310
–
0.360
eB
–
–
0.430
L
0.125
–
0.135
N
28
Package Outline
A
b2
E1
1
D
E
A2
A
A1
L
c
eA
b2
D1
e
b3
b
eB
28
Altera Corporation
Altera Device Package Information
28-Pin Plastic J-Lead Chip Carrier (PLCC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
0.155
–
0.180
0.090
0.105
0.120
0.062
–
0.083
Ordering Code Reference
L
Package Acronym
PLCC
A
Lead Material
Copper
A1
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-018
A3
0.030
–
0.042
JEDEC Option
AB
D
0.485
0.490
0.495
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D1
0.442
–
0.458
Weight
1.1 g
D2
0.191
0.205
0.219
Moisture Sensitivity Level
Printed on moisture barrier bag
E
0.485
0.490
0.495
E1
0.442
–
0.458
E2
0.191
0.205
0.219
e
0.026
–
0.032
b
0.017
–
0.043
N
28
Package Outline
A2
A3
D
D1
0.045 X 45
o
Indicates Location
of Pin A1
D2 E 2
0.050
BSC
e
b
D2 E 2
E E1
A1
A
Altera Corporation
29
Altera Device Package Information
28-Pin Small-Outline Integrated Circuit (SOIC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
2.35
–
2.65
A1
0.10
–
0.30
0.33
–
0.51
Ordering Code Reference
S
Package Acronym
SOIC
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
B
JEDEC Outline
MS-013
C
0.23
–
0.32
JEDEC Option
AE
D
17.70
–
18.10
Maximum Lead Coplanarity N/A
E
7.40
–
7.60
Weight
0.6 g
e
Moisture Sensitivity Level
Printed on moisture barrier bag
H
1.27 BSC
10.00
–
10.65
h
.25
–
.75
L
.40
–
1.27
α
0°
–
8°
N
28
Package Outline
N
H E
Pin 1
D
h X 45
o
Seating
Plane
A
A1
e
B
8
C
L
30
Altera Corporation
Altera Device Package Information
32-Pin Plastic Thin Quad Flat Pack (TQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
1.27
A1
0.05
–
0.15
0.30
0.37
0.45
Ordering Code Reference
T
Package Acronym
TQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
b
JEDEC Outline
MS-026
D
9.00 BSC
JEDEC Option
BBA
D1
7.00 BSC
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
e
0.80 BSC
Weight
0.2 g
E
9.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
E1
7.00 BSC
θ
0°
3.5°
θ1
0°
–
–
θ2
11°
12°
13°
θ3
11°
12°
13°
L
0.45
0.60
0.75
L1
1.00 REF
R1
0.08
–
–
R2
0.08
–
0.20
S
0.20
–
–
N
Altera Corporation
7°
32
31
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
Detail A
D
Pin 1
02
E1
2
A
B
E1 E
01
H
R1
R2
B
+
E
2
Gage Plane
S
L
03
0
0.25
e
L1
A
C
A1
32
B
b
Altera Corporation
Altera Device Package Information
40-Pin Ceramic Dual In-Line Package (CerDIP)
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
Package Information
Description
Specification
Ordering Code Reference
D
Package Acronym
CerDIP
Lead Material
Alloy 42
Lead Finish
Solder dip (60/40 typical)
JEDEC Outline
MS-103
JEDEC Option
N/A
Maximum Lead Coplanarity N/A
Weight
13.2 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline
Window
0.550 ± 0.040
(13.97 ± 1.02)
1
0.090 Max.
(2.29)
2.050 ± 0.020
(52.07 ± 0.51)
0.005 Min.
(0.127)
0.610 ± 0.010
(15.49 ± 0.25)
0.225 Max.
(5.75)
0.025 ± 0.010
(0.64 ± 0.25)
0.010 ± 0.002
(0.25 ± 0.05)
0.100 BSC
(2.54)
Altera Corporation
0.057 ± 0.008
(1.45 ± 0.20)
0.018 ± 0.002
(0.46 ± 0.05)
0.125 Min.
(3.18)
0˚ – 15˚
0.660 ± 0.020
(16.76 ± 0.51)
33
Altera Device Package Information
40-Pin Plastic Dual In-Line Package (PDIP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Ordering Code Reference
P
Package Acronym
PDIP
A
Lead Material
Copper
A1
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-011
JEDEC Option
AC
Nom.
Max.
0.165
–
0.190
–
0.020
–
0.145
–
0.155
b
0.015
–
0.020
B1
0.049
–
0.065
Maximum Lead Coplanarity N/A
C
0.008
–
0.012
Weight
6.0 g
D
2.030
2.050
2.070
Moisture Sensitivity Level
Printed on moisture barrier bag
D1
0.005
–
–
E
0.600
–
0.620
E1
0.485
–
0.580
e
0.100 BSC
eA
0.640
L
0.120
N
34
0.600 BSC
eB
0.660
0.680
–
0.130
40
Altera Corporation
Altera Device Package Information
Package Outline
N
E E
1
D
Location of
Pin A1
E
A2
A
A1
L
eA
e
c
eB
e
D1
B1
b
Altera Corporation
35
Altera Device Package Information
44-Pin Plastic J-Lead Chip Carrier (PLCC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
0.165
0.172
0.180
A1
0.090
0.105
0.120
0.062
–
0.083
Ordering Code Reference
L
Package Acronym
PLCC
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-018
A3
0.042
–
0.048
JEDEC Option
AC
D
0.685
0.690
0.695
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D1
0.650
0.653
0.656
Weight
2.3 g
D2
0.590
–
0.630
Moisture Sensitivity Level
Printed on moisture barrier bag
E
0.685
0.690
0.695
E1
0.650
0.653
0.656
E2
0.590
–
0.630
b
0.013
–
0.032
e
0.026
–
0.032
N
44
Package Outline
D
A2
D1
0.045 X 45 o
Location of
Pin 1
0.020 Min
A3
.015 M AÐB S D S
0.050
BSC
E E1
D2 E 2
e
b
D2 E 2
0.010 Max
A1
A
36
Altera Corporation
Altera Device Package Information
44-Pin Plastic Quad Flat Pack (PQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Q
Package Acronym
PQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
Min.
Nom.
Max.
A
–
–
2.45
A2
1.95
–
2.10
b
0.30
–
0.45
JEDEC Outline
MS-022
D
12.95
–
13.45
JEDEC Option
AB
D1
9.90
–
10.10
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
E
12.95
–
13.45
Weight
0.5 g
E1
9.90
–
10.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
0.80 BSC
c
0.11
–
0.23
L
0.65
0.80
0.95
L1
L2
1.40
1.60
1.80
R1
0.13
–
–
R2
0.13
–
0.30
S
0.20
–
–
θ
0°
–
7°
θ1
0°
–
–
N
Altera Corporation
0.25 BSC
44
37
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Location
of Pin 1
E1
2
E1 E
A
B
E
2
Detail A
S
o
o
5 - 16
A2
See Detail A
+
A
C
01
R1
R2
Seating plane
o
e
o
5 Ð 16
c
L
0
Gage Plane
L1
(n-4) X
L2
38
Altera Corporation
Altera Device Package Information
44-Pin Plastic Thin Quad Flat Pack (TQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
T
Package Acronym
TQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
Min.
Nom.
Max.
A
–
–
1.27
A1
0.05
–
–
b
0.30
0.37
0.45
JEDEC Outline
MS-026
D
11.75
–
12.25
JEDEC Option
BCB
D1
9.90
–
10.10
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
e
Weight
0.3 g
E
11.75
0.80 BSC
–
12.25
Moisture Sensitivity Level
Printed on moisture barrier bag
E1
9.90
–
10.10
7°
θ
0°
3.5°
θ1
0°
–
–
θ2
11°
12°
13°
θ3
11°
12°
13°
L
0.45
0.60
0.75
L1
0.08
–
–
R2
0.08
–
0.20
S
0.20
–
–
N
Altera Corporation
1.00 REF
R1
44
39
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Location of
Pin 1
E1
2
E1 E
A
B
E
2
Detail A
02
01
H
See Detail A
A
+
C
A1
0.25
L
03
0
e
(n-4) X
40
Gage Plane
S
Seating plane
b
R1
R2
B
L1
B
Altera Corporation
Altera Device Package Information
49-Pin Wirebond Ultra FineLine Ball-Grid Array (UBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
Ordering Code Reference
U
Package Acronym
UBGA
A
1.30
–
1.55
Lead Material
Tin-lead alloy (63/37)
A1
0.30
0.40
0.45
Lead Finish
N/A
A2
1.00
1.05
1.10
JEDEC Outline
MO-216
b
0.40
0.50
0.60
JEDEC Option
BAB-2
e
Maximum Lead Coplanarity 0.005 inches (0.12 mm)
Weight
0.1 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
0.80
D/E
7
N
49
41
Altera Device Package Information
Package Outline
A
D
B
b
G
F
E
E
D
e
C
B
A
1
Indicates
location of
Ball A1
2
3
4
5
6
7
A1 Ball
Pad Corner
A
A2
A1
C
42
Altera Corporation
Altera Device Package Information
68-Pin Small Outline Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parentheses, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-066
JEDEC Option
AC
Maximum Lead Coplanarity N/A
Weight
10.4 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
43
Altera Device Package Information
Package Outline
1.120 ± 0.020
Sq.
(27.94 ± 0.51)
1.005 ± 0.005
(25.53 ± 0.13)
0.100
BSC
(2.54)
L
K
J
H
G
F
E
D
C
B
0.070
Dia. Typ.
(1.78)
A
1
Window
0.127 ± 0.013
(3.23 ± 0.33)
2 3
4 5
6 7
8 9 10 11
Indicates location
of Pin A1
0.180 ± 0.005
(4.57 ± 0.13)
0.005
R
(0.13)
0.018 ± 0.002
(0.457 ± 0.05)
0.730
Max.
(18.54)
0.008
Ref.
(0.20)
0.050
Dia.
(1.27)
0.050 ± 0.005
(1.27 ± 0.13)
44
Altera Corporation
Altera Device Package Information
68-Pin Plastic J-Lead Chip Carrier (PLCC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Nom.
Max.
A
0.165
0.172
0.200
A1
0.090
0.105
0.130
0.013
–
0.021
Ordering Code Reference
L
Package Acronym
PLCC
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
b
JEDEC Outline
MS-018
D
0.985
0.990
0.995
JEDEC Option
AE
D1
0.950
0.954
0.958
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D2
0.441
0.455
0.469
Weight
4.6 g
E
0.985
0.990
0.995
Moisture Sensitivity Level
Printed on moisture barrier bag
E1
0.950
0.954
0.958
E2
0.441
0.455
0.469
e
0.026
–
0.032
D2/E2
0.890
–
0.930
N
Altera Corporation
68
45
Altera Device Package Information
Package Outline
D
D1
0.045 X 45
o
A2
Pin 1
0.020 Min
b
0.050
(NÐ4 Places)
E E1
D2 E 2
e
See Detail A
A1
A
Detail A
0.045 Min
0.025 Min
0.021 / 0.013
46
Altera Corporation
Altera Device Package Information
84-Pin Plastic J-Lead Chip Carrier (PLCC)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1982.
Controlling dimension is in inches.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Inches
Symbol
Min.
Ordering Code Reference
L
Package Acronym
PLCC
A
Lead Material
Copper
A1
Lead Finish
Solder plate (85/15 typical)
A2
Nom.
Max.
0.155
–
0.200
0.090
0.105
0.120
0.030
–
0.040
JEDEC Outline
MS-018
b
0.017
–
0.023
JEDEC Option
AF
D
1.185
1.190
1.195
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D1
1.142
–
1.158
Weight
6.8 g
E
1.185
1.190
1.195
Moisture Sensitivity Level
Printed on moisture barrier bag
E1
1.142
–
1.158
e
0.260
–
0.320
D2/E2
1.090
–
1.130
N
Altera Corporation
84
47
Altera Device Package Information
Package Outline
D
D1
0.048 × 45°
A2
Pin 1
b
0.050
(N - 4 places)
E E1
See Detail A
D2 E 2
e
A1
A
Detail A
0.045 Min
0.025 Min
0.021 / 0.013
48
Altera Corporation
Altera Device Package Information
88-Pin Wirebond Ultra FineLine Ball-Grid Array (UBGA)
■
■
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Millimeters
Specification
Symbol
Ordering Code Reference
U
Min.
Nom.
Max.
Package Acronym
UBGA
A
–
–
1.4
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
0.40
Lead Finish
Contact Altera Application at
www.altera.com/mysupport.
A2
0.65
–
–
b
0.40
0.45
0.50
JEDEC Outline
N/A
D
11.00
–
11.20
JEDEC Option
N/A
E
8.00
–
8.20
Maximum Lead Coplanarity 0.005 inches (0.12 mm)
Weight
Contact Altera Application at
www.altera.com/mysupport.
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
e
0.8 BSC
N
88
49
Altera Device Package Information
Package Outline
C
B
A
1.1 TYP
D
0.4 TYP
e
H
b
D
G
Indicates
Location of
Ball A1
E
F
E
0.4 TYP
D
C
B
e
A
1.2 TYP
1
2 3 4
5 6
7 8
9 10 11 12
A2 A
A1
C
50
Altera Corporation
Altera Device Package Information
100-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
1.70
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
1.10
JEDEC Outline
MS-034
D/E
JEDEC Option
AAC-1
b
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
1.6 g
Moisture Sensitivity Level
Printed on moisture barrier bag
11.00 BSC
0.50
0.60
e
1.00 BSC
M
10
0.70
†Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Altera Corporation
51
Altera Device Package Information
Package Outline
A
A1 Ball
Pad Corner
B
D
10
Indicates
location of
Ball A1
9
8
7
6
5
4
3
2
1
A
B
C
D
E
E
F
G
H
J
K
A
A2
A1
C
52
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option 1
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
These dimensions support all 100-pin PQFP devices, including EPC4, except EPC8 and
EPC16 devices. See 100-Pin Plastic Quad Flat Pack (PQFP) Option 2 for more information.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
3.40
Ordering Code Reference
Q
Package Acronym
PQFP
A
Lead Material
Copper
A1
0.25
–
0.50
Lead Finish
Solder plate (85/15 typical)
b
0.22
–
0.38
JEDEC Outline
MS-022
D
22.95
–
23.45
JEDEC Option
GC-1
D1
19.90
–
20.10
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
E
16.95
–
17.44
Weight
1.6 g
E1
13.90
–
14.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
L
Altera Corporation
0.65 BSC
0.65
–
L1
0.25 BSC
N
100
0.95
53
Altera Device Package Information
Package Outline
E
E1
E1
2
D
E
2
Pin 1
Indicates location
of Pin 1
D1
2
Detail A
0.20 MIN
D1 D
A
B
o
0 MIN
R 0.13 MIN
R 0.13/0.30
+
D
2
L
c
o
o
0 Ð7
Gage Plane
L1
1.60
o
5 Ð16
o
See Detail A
A
C
Seating plane
A1
b
e
(n-4) X
54
o
o
5 Ð16
Altera Corporation
Altera Device Package Information
100-Pin Plastic Quad Flat Pack (PQFP) Option 2
■
■
■
Controlling dimension is in millimeters.
This information applies to EPC8 andEPC16 devices only. See 100-Pin Plastic Quad Flat
Pack (PQFP) Option 1 for more information.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
1.75
1.95
2.15
A1
0.10
0.15
0.20
b
0.20
0.30
0.40
N/A
D
23.90
24.30
24.70
N/A
20.20
Ordering Code Reference
Q
Package Acronym
PQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
JEDEC Outline
JEDEC Option
D1
19.80
20.00
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
E
17.90
18.30
18.70
Weight
1.6 g
E1
13.80
14.00
14.20
Moisture Sensitivity Level
Printed on moisture barrier bag
e
0.65 BSC
N
Altera Corporation
100
L
0.8
1.2
1.6
L1
—
0.1
—
55
Altera Device Package Information
Package Outline
E
E1
E1
2
D
E
2
Pin 1
D1
2
Detail A
D1 D
_ 0.2
1.95 +
_ 0.2
0.9 +
Base Plane
_ 0.1
0.1 +
D
2
L1
L
o
5 - 16
o
o
0 ~10
o
See Detail A
A
Seating plane
A1
b
e
(n-4) X
56
o
5 - 16
o
Altera Corporation
Altera Device Package Information
100-Pin Plastic Thin Quad Flat Pack (TQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
1.27
A1
0.05
–
0.15
0.17
0.22
0.27
Ordering Code Reference
T
Package Acronym
TQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
b
JEDEC Outline
MS-026
D
15.80
–
16.20
JEDEC Option
BDE
D1
13.50
–
14.50
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
15.80
–
16.20
Weight
0.5 g
E1
13.50
–
14.50
Moisture Sensitivity Level
Printed on moisture barrier bag
θ
0°
3.5°
7°
θ1
0°
–
–
θ2
11°
12°
13°
θ3
11°
12°
13°
C
0.09
–
0.20
L
0.45
0.60
0.75
L1
Altera Corporation
1.00 REF
R1
0.08
–
–
R2
0.08
–
0.20
S
0.20
–
–
e
0.50 BSC
N
100
57
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Detail A
02
Pin 1
E1
2
E1 E
01
H
R1
R2
B
+
A
B
Gage Plane
S
E
2
0.25
L
03
0
L1
B
4X
A
C
A1
e
58
b
Altera Corporation
Altera Device Package Information
144-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
1.70
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
1.10
JEDEC Outline
MO-192
D/E
JEDEC Option
AAD-1, depopulated
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
b
13.00 BSC
0.50
0.60
M
12
Weight
1.7 g
e
1.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
N
144
0.70
†Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Altera Corporation
59
Altera Device Package Information
Package Outline
A1 Ball
Pad Corner
A
B
D
12
Indicates
location of
Ball A1
10
11
9
8
7
6
5
4
3
2
1
A
B
C
D
E
F
E
G
H
J
K
L
M
e
b
A
A2
A1
C
60
Altera Corporation
Altera Device Package Information
144-Pin Plastic Thin Quad Flat Pack (TQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
1.60
A1
0.05
–
0.15
0.17
0.22
0.27
Ordering Code Reference
T
Package Acronym
TQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
b
JEDEC Outline
MS-026
D
22.00 BSC
JEDEC Option
BFB
D1
20.00 BSC
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
e
0.50 BSC
Weight
1.3 g
E
22.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
E1
20.00 BSC
θ
0°
3.5°
θ1
0°
–
–
θ2
11°
12°
13°
θ3
11°
12°
13°
L
0.45
0.60
0.75
L1
1.00 REF
R1
0.08
–
–
R2
0.08
–
0.20
S
0.20
–
–
N
Altera Corporation
7°
144
61
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Pin 1
E1
2
Detail A
02
E1 E
B
A
01
H
E
2
R1
R2
B
+
Gage Plane
S
L
03
0
L1
A
B
C
A1
62
0.25
e
(n-4) X
b
Altera Corporation
Altera Device Package Information
160-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-067
JEDEC Option
AG
Maximum Lead Coplanarity N/A
Weight
19.9 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
63
Altera Device Package Information
Package Outline
1.560 ± 0.020
Sq.
(39.624 ± 0.51)
1.400 ± 0.012
(35.56 ± 3.05)
1.250 ± 0.012
Sq.
(31.75 ± 0.30)
0.100
BSC
(2.54)
0.070
Dia. Typ.
(1.79)
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
Indicates location
of Pin A1
2 3 4
5 6 7
8 9 10 11 12 13 14 15
Orientation
Index
0.140 ± 0.020
(3.56 ± 0.51)
0.090 ± 0.010
(2.286 ± 0.25)
0.180
(4.572)
0.018 ± 0.002
Dia.
(0.457 ± 0.05)
0.050
Dia.
(1.27)
0.050
(1.27)
64
0.008
Ref.
(0.203)
Altera Corporation
Altera Device Package Information
160-Pin Plastic Quad Flat Pack (PQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.07
A1
0.25
–
0.50
3.17
–
3.67
Ordering Code Reference
Q
Package Acronym
PQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-022
b
0.22
–
0.38
JEDEC Option
DD-1
D
30.95
–
31.45
Maximum Lead Coplanarity 0.004 inches (0.10 mm)
D1
27.90
–
28.10
Weight
5.4 g
D2
Moisture Sensitivity Level
Printed on moisture barrier bag
25.35 REF
E
30.95
E1
27.90
E2
Altera Corporation
31.45
–
28.10
25.35 REF
e
L
–
0.65 BSC
0.508
–
L1
0.25 BSC
N
160
0.762
65
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Pin 1
Detail A
E1
2
0.635 MIN
0o MIN
E1 E
E2
+
B
A
E
2
c
R 0.13 MIN
R 0.13/0.30
L
0o Ð7o
Gage plane
L1
4X
o
o
5 Ð 16
See Detail A
A2
A
A1
C
b
66
e
(n-4) X
Seating
plane
o
o
5 Ð 16
Altera Corporation
Altera Device Package Information
169-Pin Wirebond Ultra FineLine Ball-Grid Array (UBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
The EPM7512B uses a thicker version of this package. Package thickness of this EPM7512B
device is 1.6 mm typical and total package thickness is 2.2 mm maximum.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
U
Min.
Nom.
Max.
Package Acronym
UBGA
A†
1.30
–
1.55
Lead Material
Tin-lead alloy (63/37)
A1
0.30
0.40
0.45
Lead Finish
Contact Altera Application at
www.altera.com/mysupport.
A2
0.65
0.70
0.75
b
0.40
0.50
0.60
JEDEC Outline
MO-216
JEDEC Option
BAF-1
Maximum Lead Coplanarity 0.005 inches (0.12 mm)
e
0.80
D/E
11
N
169
Weight
2.2 g
†Altera's thickness specification for A is
Moisture Sensitivity Level
Printed on moisture barrier bag
2.2 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Altera Corporation
67
Altera Device Package Information
Package Outline
A
D
B
N
M
b
L
K
J
E
H
e
G
F
E
D
C
B
A
1
Indicates
Location of
Ball A1
2
3
4
5
6
7
8
9 10 11 12 13
A1 Ball
Pad Corner
A
A1
A2
C
68
Altera Corporation
Altera Device Package Information
192-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-067
JEDEC Option
AJ
Maximum Lead Coplanarity N/A
Weight
21.0 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
69
Altera Device Package Information
Package Outline
1.760 ± 0.018
(45.15 ± 0.46)
1.600 ± 0.015
(41.03 ± 0.38)
0.100
BSC
(2.54)
0.070
Dia. Typ.
(1.79)
0.142 ± 0.015
(3.64 ± 0.38)
0.085 ± 0.004
(2.18 ± 0.10)
0.180 ± 0.010
(4.62 ± 0.25)
U
0.005
R
(0.128)
T
R
P
0.018 ± 0.002
Dia.
(0.457 ± 0.05)
N
M
L
K
J
H
G
F
E
D
0.050
Dia.
(1.28)
C
B
A
1
2 3 4
Indicates location
of Pin A1
5 6 7
8 9 10 11 12 13 14 15 16 17
1.450 ± 0.010
(3.68 ± 0.25)
0.050 ± 0.005
(1.28 ± 0.13)
0.008
Ref.
(0.203)
Indicates location
of Pin A1
70
Altera Corporation
Altera Device Package Information
208-Pin Plastic Quad Flat Pack (PQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.10
A1
0.25
–
0.50
3.20
3.40
3.60
Ordering Code Reference
Q
Package Acronym
PQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-029
D
JEDEC Option
FA-1
D1
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
Weight
5.7 g
E1
Moisture Sensitivity Level
Printed on moisture barrier bag
–
28.10
30.35 BSC
27.90
e
–
28.10
0.50 BSC
b
0.17
–
0.27
R2
0.08
–
0.25
R1
0.08
–
–
θ
0°
3.5°
8°
θ1
0°
–
–
θ2
5°
–
16°
θ3
5°
–
16°
L
0.46
–
0.66
L1
0.40
–
–
S
0.20
–
–
N
Altera Corporation
30.35 BSC
27.90
208
71
Altera Device Package Information
Package Outline
D
D1
D1
2
1.52 X 45
D
2
D
o
Pin 1
Indicates
Location
of Pin 1
E1
2
E1 E
A
B
E
2
A2
See Detail A
A
C
(NÐ4)X
e
A1
b
Detail A
02
L1
01
H
R1
R2
B
+
Gage Plane
S
0.25
L
03
0
B
72
Altera Corporation
Altera Device Package Information
208-Pin Power Quad Flat Pack (RQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.10
A1
0.25
–
0.50
3.20
3.40
3.60
Ordering Code Reference
R
Package Acronym
RQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-029
D
30.35
–
30.85
JEDEC Option
FA-1
D1
27.90
–
28.10
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
30.35
–
30.85
Weight
10.8 g
E1
27.90
–
28.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
0.50 BSC
b
0.17
–
0.27
R2
0.08
–
0.25
R1
0.08
–
–
θ
0°
3.5°
8°
θ1
0°
–
–
θ2
5°
–
16°
θ3
5°
–
16°
L
0.46
–
0.66
L1
S
N
Altera Corporation
0.635
0.20
–
–
208
73
Altera Device Package Information
Package Outline
D
D1
D1
2
1.52 X 45
D
2
o
D
Pin 1
Indicates
Location
of Pin 1
E1
2
o
E1 E
o
A
B
o
E
2
Metal Heat Sink
A
A1
C
A2
e
b
Detail A
02
L1
01
H
0.25
B
B
0
Gage
Plane
S
03
L
74
Altera Corporation
Altera Device Package Information
232-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-067
JEDEC Option
AJ
Maximum Lead Coplanarity N/A
Weight
25.5 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
75
Altera Device Package Information
Package Outline
1.760 ± 0.018
Sq.
(44.70 ± 0.46)
1.450 ± 0.012
Sq.
(36.83 ± 0.30)
0.090 ± 0.009
(2.286 ± 0.228)
0.142 ± 0.008
(3.61 ± 0.20)
0.018 ± 0.002
(0.457 ± 0.050)
Indicates location
of Pin A1
0.050 ± 0.005
(4 Places)
(1.27 ± 0.127)
0.010
× 45°
(0.25)
0.050 ± 0.005
(1.27 ± 0.127)
0.020
× 45°
(0.51)
(4 Places)
0.008
Ref.
(0.20)
0.180 ± 0.010
(4.572 ± 0.254)
1.600 ± 0.010
Sq.
(40.64 ± 0.254)
0.070
0.100
Dia. Typ.
BSC
(1.778)
(2.54)
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
1
0.070
Index
(1.778)
2 3 4
5 6 7
8
9 10 11 12 13 14 15 16 17
Indicates location
of Pin A1
76
Altera Corporation
Altera Device Package Information
240-Pin Plastic Quad Flat Pack (PQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.10
A1
0.25
–
0.50
3.20
3.40
3.60
Ordering Code Reference
Q
Package Acronym
PQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-029
D
34.35
–
34.85
JEDEC Option
GA
D1
31.90
–
32.10
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
34.35
–
34.85
Weight
7.0 g
E1
31.90
–
32.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
b
0.17
–
0.27
R2
0.08
–
0.25
R1
0.08
–
–
θ
0°
3.5°
8°
θ1
0°
–
–
θ2
5°
–
16°
θ3
5°
–
16°
L
0.46
–
0.66
L1
0.40
–
–
S
0.20
–
–
N
Altera Corporation
0.50 BSC
240
77
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Pin 1
E1
2
E1 E
A
B
E
2
A2
A
C
A1
(NÐ4)X
e
b
Detail A
02
L1
01
H
R1
R2
B
+
Gage Plane
S
0.25
L
03
0
B
78
Altera Corporation
Altera Device Package Information
240-Pin Power Quad Flat Pack (RQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.10
A1
0.25
–
0.50
3.30
–
3.60
Ordering Code Reference
R
Package Acronym
RQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-029
D
34.35
–
34.85
JEDEC Option
GA
D1
31.90
–
32.10
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
34.35
–
34.85
Weight
15.1 g
E1
31.90
–
32.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
b
0.17
–
0.27
R2
0.08
–
0.25
R1
0.08
–
–
θ
0°
3.5°
8°
θ1
0°
–
–
θ2
5°
–
16°
θ3
5°
–
16°
L
0.46
–
0.66
L1
0.40
–
–
S
0.20
–
–
N
Altera Corporation
0.50 BSC
240
79
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Pin 1
E1
2
E1 E
A
B
E
2
Metal
Heat Sink
A2
See Detail A
A
C
A1
e
Detail A
b
02
L1
01
H
R1
R2
B
+
Gage Plane
S
0.25
L
03
0
B
80
Altera Corporation
Altera Device Package Information
256-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
–
–
2.50
JEDEC Outline
MS-034
A3
JEDEC Option
AAF-1
D/E
17.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
b
Weight
1.9 g
e
0.50
1.00 BSC
0.60
Moisture Sensitivity Level
Printed on moisture barrier bag
M
16
0.70
†Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Altera Corporation
Copyright© 2002 Altera Corporation
81
79
Altera Device Package Information
Package Outline
D
A
B
16 15 14 13 12 11 10
9
8
7
6 5
4
3
2
1
Pin A1
A
B
Indicates
location of
Pin A1
C
D
E
F
G
H
E
J
K
L
M
N
P
R
T
A2
A1
e
A
b
C
Seating Plane
82
80
Altera Corporation
Copyright© 2002 Altera Corporation
Altera Device Package Information
256-Pin Thermally Enhanced Wirebond Ball-Grid Array (BGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
1.70
0.35
–
–
–
1.10
0.75
0.90
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
b
0.60
JEDEC Outline
MO-192
JEDEC Option
BAL-2, depopulated
D/E
27.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
e
1.27 BSC
Weight
4.3 g
M
20
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
83
Altera Device Package Information
Package Outline
D
20
8
2
18 16 14 12 10
6
4
7
3
19 17 15 13 11
9
5
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
Indicates Location
of Pin A1
E
b
A
A1 Ball
Pad Corner
e
A2
Metal Heat Sink
A1
Seating Plane
84
Altera Corporation
Altera Device Package Information
256-Pin Wirebond Ball-Grid Array (BGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Sixteen dummy copper pads are visible on the middle of the bottom of some devices. These
pads are not connected to the device die.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
B
Package Acronym
BGA
Min.
Nom.
Max.
A†
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
b
0.60
0.75
0.90
JEDEC Outline
MS-034
JEDEC Option
BAL-2, depopulated
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
2.1 g
Moisture Sensitivity Level
Printed on moisture barrier bag
D/E
27.00 BSC
e
1.27 BSC
M
20
†Altera’s thickness specification for A is
2.7 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Altera Corporation
85
Altera Device Package Information
Package Outline
A
A1 Ball
Pad Corner
D
A1 Ball
Pad Corner
B
20
18
19
16
17
14
15
12
13
10
11
8
9
6
7
4
5
2
3
1
A
B
Indicates
location of
Pin A1
C
D
E
F
G
H
J
K
E
L
M
N
P
R
T
U
45˚ Chamfer
(all 4 corners)
V
W
Y
b
e
A
A1
A3
C
86
A2
Seating Plane
Altera Corporation
Altera Device Package Information
280-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-067
JEDEC Option
AL
Maximum Lead Coplanarity N/A
Weight
29.5 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
87
Altera Device Package Information
Package Outline
1.960 ± 0.018
Sq.
(49.78 ± 0.457)
1.650 ± 0.012
Sq.
(41.91 ± 0.30)
0.088 ± 0.007
(2.24 ± 0.178)
0.135 ± 0.010
(3.43 ± 0.254)
Indicates location
of Pin A1
0.018 ± 0.002
(0.457 ± 0.050)
0.050 ± 0.005
(4 Places)
(1.27 ± 0.127)
1.800 ± 0.010
Sq.
(45.72 ± 0.254)
0.070
0.100
Dia. Typ.
Typ.
(1.778)
(2.54)
0.020
× 45°
(0.5)
(4 Places) W
0.010
× 45°
(0.25)
0.050 ± 0.005
(1.27 ± 0.127)
0.008 Ref.
(0.20)
0.180 ± 0.010
(4.572 ± 0.254)
V
U
T
R
P
N
M
L
K
Indicates location
of Pin A1
J
H
G
F
E
D
C
B
A
1
88
2 3 4
5 6 7
8
9 10 11 12 13 14 15 16 17 18 19
Altera Corporation
Altera Device Package Information
304-Pin Power Quad Flat Pack (RQFP)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
N is the number of leads.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
A
–
–
4.50
A1
0.25
–
0.50
3.70
–
3.90
Ordering Code Reference
R
Package Acronym
RQFP
Lead Material
Copper
Lead Finish
Solder plate (85/15 typical)
A2
JEDEC Outline
MS-029
D
42.35
–
42.85
JEDEC Option
JA
D1
39.90
–
40.10
Maximum Lead Coplanarity 0.003 inches (0.08 mm)
E
42.35
–
42.85
Weight
26.3 g
E1
39.90
–
40.10
Moisture Sensitivity Level
Printed on moisture barrier bag
e
b
0.17
–
0.27
R2
0.08
–
0.25
R1
0.08
–
–
θ
0°
3.5°
8°
θ1
0°
–
–
θ2
5°
–
16°
θ3
5°
–
16°
C
0.09
–
0.20
0.60
L
0.40
–
L1
0.40
–
–
S
0.20
–
–
N
Altera Corporation
0.50 BSC
304
89
Altera Device Package Information
Package Outline
D
D1
D1
2
D
2
D
Pin 1
E1
2
E1 E
A
B
E
2
Metal
Heat Sink
(NÐ4)X
e
See Detail A
A2
A
D
C
A1
ccc C
Seating
Plane
b
Detail A
02
L1
01
H
R1
R2
B
+
Gage Plane
S
0.25
L
03
0
B
90
Altera Corporation
Altera Device Package Information
324-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A†
1.20
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
D/E
JEDEC Option
AAG-1
b
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
1.9 g
Moisture Sensitivity Level
Printed on moisture barrier bag
19.00 BSC
0.50
0.60
e
1.00 BSC
M
18
0.70
†Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
Package Outline
D
A
B
A1 Ball Pad Corner
18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
Indicates Location
of Ball A1
E
e
b
A2
A1
Altera Corporation
C
A
Seating Plane
91
Altera Device Package Information
356-Pin Thermally Enhanced Wirebond Ball-Grid Array (BGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
1.70
0.35
–
–
–
1.10
0.75
0.90
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
b
0.60
JEDEC Outline
MO-192
JEDEC Option
BAR-2, depopulated
D/E
35.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
e
1.27 BSC
Weight
7.0 g
M
26
Moisture Sensitivity Level
Printed on moisture barrier bag
Package Outline
D
A
Indicates
location
of pin A1
B
26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9
8
7 6
5 4
3
2 1
A
B
C
D
E
F
G
Indicates
location
of pin A1
H
J
K
L
M
N
E
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b
e
A
A2
Metal Heat Sink
A1
Seating Plane
92
Altera Corporation
Altera Device Package Information
400-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAJ-1
D/E
21.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
b‡
Weight
2.2 g
e
1.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
20
0.50
0.60
0.70
†Altera's
thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
‡
Ball size, parameter "b", can go up to a
maximum of 0.74. Contact Altera
Applications for more information.
Altera Corporation
93
Altera Device Package Information
Package Outline
A
D
B
A1 Ball Pad Corn
20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1
Indicates Location
of Ball A1
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
e
b
A3 A2
A
A1
Seating Plane
94
Altera Corporation
Altera Device Package Information
403-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-128
JEDEC Option
AL
Maximum Lead Coplanarity N/A
Weight
47.7 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
95
Altera Device Package Information
Package Outline
1.960 ± 0.019 Sq.
(49.78 ± 0.48)
0.040 ± 0.004
(1.01 ± 0.10)
0.050 ± 0.005
(1.27 ± 0.127)
0.008 Typ.
(0.20)
0.050 Dia. Typ.
(1.27)
Indicates location
of Pin A1
0.018 ± 0.002
Dia.
(0.46 ± 0.05)
0.090 ± 0.009
(2.29 ± 0.229)
0.180 ± 0.010
(4.572 ± 0.254)
1.800
(45.72)
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
0.100
BSC
(2.54)
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
Indicates location
of Pin A1 (not a pin)
96
Sq.
0.050
BSC
(1.27)
Standoff
(4 Places)
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36
0.020 Rad. Typ.
(0.51)
(4 Places)
Altera Corporation
Altera Device Package Information
484-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAJ-1
D/E
23.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
b‡
Weight
2.2 g
e
1.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
22
0.50
0.60
0.70
†Altera's
thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
‡
Ball size, parameter "b", can go up to a
maximum of 0.74. Contact Altera
Applications for more information.
Altera Corporation
97
Altera Device Package Information
Package Outline
D
A
Pin A1
22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4
3 2
1
A
B
C
b
D
E
F
Indicates
location of
Pin A1
G
H
J
K
E
e
L
M
N
P
R
T
U
V
W
Y
AA
AB
A
A3
A2
A1
Seating Plane
98
Altera Corporation
Altera Device Package Information
484-Pin Thermally Enhanced FlipChip FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Some devices have a chamfered corner at the A-1 ball location.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAJ-1
D/E
23.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
b
Weight
3.6 g
e
1.00 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
22
Weight
5.72 g†
†
0.50
0.60
0.70
This value refers to the devices mentioned in PCN 0214.
Altera Corporation
99
Altera Device Package Information
Package Outline
D
A
B
Pin A1
22 21 20 19 18 17 16 15 14 13 12 11 10 9
Indicates
location of
Pin A1
8
7
6
5
4
3
2
1
A
C (2.00)
B
C
D
E
F
G
H
J
K
E
L
M
N
P
R
T
U
V
W
Y
AA
AB
b
A A2
e
A3
Heat Sink
A1
Seating Plane
100
Altera Corporation
Altera Device Package Information
503-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
M0-128
JEDEC Option
AN
Maximum Lead Coplanarity N/A
Weight
59.0 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
101
Altera Device Package Information
Package Outline
2.260 ± 0.015
Sq.
(57.40 ± 0.381)
0.180 ± 0.010
(4.572 ± 0.254)
1.600 ± 0.012
Sq.
(40.64 ± 0.304)
1.500 ± 0.010
Sq.
(38.10 ± 0.254)
0.145
Max.
(3.68)
0.050
Dia. Typ.
(1.27)
Indicates location
of Pin A1
0.018 ± 0.002
Dia.
(0.46 ± 0.051)
0.038 (0.966)
0.048 (1.22)
0.050 ± 0.005
(1.27 ± 0.127)
2.100
Sq.
(53.34)
1.095 ± 0.011
(27.81 ± 0.279)
BC
BB
BA
AY
AW
AV
AU
AT
AR
AP
AN
AM
AL
AK
AJ
AH
AG
AF
AE
AD
AC
AB
AA
Y
W
V
U
T
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Indicates location
of Pin A1 (not a pin)
102
0.100
(2.54)
0.008 ± 0.005
(0.20 ± 0.127)
BSC
0.050
(1.27)
BSC
1.334 ± 0.014
(33.88 ± 3.56)
Standoff
(4 Places)
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
0.020
Rad. Typ.
(0.51)
(4 Places)
Altera Corporation
Altera Device Package Information
599-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-128
JEDEC Option
AP
Maximum Lead Coplanarity N/A
Weight
69.0 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
103
Altera Device Package Information
Package Outline
2.46 ± 0.015
Sq.
(62.484 ± 0.381)
1.6 ± 0.012
Sq.
(40.64 ± 0.3048)
1.5 ± 0.01
(38.1 ± 0.254)
0.18 ± 0.01
(4.572 ± 0.254)
Sq.
0.145
Max.
(3.683)
0.05
Dia. Typ.
(1.27)
Indicates
location of A1
(not a pin)
0.018 ± 0.002
Dia.
(0.4572 ± 0.0508)
0.04
BSC
(1.016)
2.30
Sq.
(58.42)
1.015 ± 0.01
(25.781 ± 0.254)
BG
BE
BC
BA
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
R
N
L
J
G
E
C
A
BF
BD
BB
AY
AV
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
0.05 ± 0.005
(1.27 ± 0.127)
0.1
(2.54)
BSC
0.05
(1.27)
0.008 ± 0.005
(0.2032 ± 0.127)
BSC
1.45 ± 0.015
(36.83 ± 0.381)
Standoff
(4 Places)
2
1
4
3
6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46
5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43 45 47
Indicates quadrant
containing location A1
104
Altera Corporation
Altera Device Package Information
600-Pin Thermally Enhanced Wirebond Ball-Grid Array (BGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
1.70
0.35
–
–
–
1.10
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
JEDEC Outline
MO-192
JEDEC Option
BAW-1, depopulated
b
0.60
0.75
0.90
D/E
44.90
45.00
45.10
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
e
1.27 BSC
Weight
12.0 g
M
35
Moisture Sensitivity Level
Printed on moisture barrier bag
Altera Corporation
105
Altera Device Package Information
Package Outline
A
D
A1 Ball
Pad Corner
B
35
34 32 30 28 26 24 22 20 18 16 14 12 10
8
33 31 29 27 25
23 21 19 17 15 13
11 9
6
7
Indicates
location of
Pin A1
4
5
2
3
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
E
b
A
A2
e
Metal Heat Sink
A1
C
Seating Plane
106
Altera Corporation
Altera Device Package Information
652-Pin Wirebond Ball-Grid Array (BGA)
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Package Information
Figure Reference
Description
Millimeters
Specification
Symbol
Ordering Code Reference
B
Package Acronym
BGA
Min.
Nom.
Max.
A†
–
–
3.50
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
BAW-1
b
0.60
0.75
0.90
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
D/E
45.00 BSC
Weight
9.6 g
e
1.27
Moisture Sensitivity Level
Printed on moisture barrier bag
M
35
†Altera's thickness specification for A is
3.2 mm maximum. The Max item for A in
this table reflects the JEDEC specification.
Altera Corporation
107
Altera Device Package Information
Package Outline
D
o
5.00 45 (4X)
35
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
Stiffener
E
Pin A1
A2
Pin A1
34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4
2
33 31 29 27 25 23 21 19 17 15 13 11
9
7
5
3
1
b
e
A3 A
Stiffener
A1
108
Altera Corporation
Altera Device Package Information
652-Pin Thermally Enhanced Wirebond Ball-Grid Array (BGA)
■
■
All dimensions and tolerances conform to AMSE Y14.5M – 1994.
Controlling dimension is in millimeters.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
B
Min.
Nom.
Max.
Package Acronym
BGA
A
–
–
1.70
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
1.10
JEDEC Outline
MO-192
D
–
45.00
–
JEDEC Option
BAW-1
E
–
45.00
–
b
0.60
0.75
0.90
–
1.27
–
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
14.9 g
e
Moisture Sensitivity Level
Printed on moisture barrier bag
M
35
Package Outline
A
D
35
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
E
b
A
A1
Pin A1
34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4
2
33 31 29 27 25 23 21 19 17 15 13 11
9
7
5
3
1
Indicates
location of
Pin A1
A2
e
Metal Heat Sink
C
Altera Corporation
109
Altera Device Package Information
652-Pin Thermally Enhanced FlipChip Ball-Grid Array (BGA) (Option 1)
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
3.50
0.35
–
–
–
3.00
–
–
2.50
0.60
0.75
0.90
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
JEDEC Outline
MS-034
A3
JEDEC Option
BAW-1
b
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
9.6 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Weight
(1)
110
18.73 g
1
D/E
45.00 BSC
D1/E1
33.00 BSC
e
1.27 BSC
M
35
Note: This value refers to devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
D
D1
Pin A1
35
E1
34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4
2
33 31 29 27 25 23 21 19 17 15 13 11
9
7
5
3
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
E
A A2 A3
b
e
Heat Sink
A1
Altera Corporation
111
Altera Device Package Information
652-Pin Thermally Enhanced FlipChip Ball-Grid Array (BGA) (Option 2)
■
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
This package has a different heat sink material than the Option 1 package, as it has been
discussed in PCN 0214. For more detailed information about this heat sink material, refer to
PCN 0214.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
3.50
0.35
–
–
–
3.00
–
–
2.50
0.60
0.75
0.90
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
JEDEC Outline
MS-034
A3
JEDEC Option
BAW-1
b
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
18.7 g1
Moisture Sensitivity Level
Printed on moisture barrier bag
(1)
112
This value refers to the devices mentioned in PCN 0214.
D/E
45.00 BSC
D1/E1
45.00 BSC
e
1.27 BSC
M
35
Altera Corporation
Altera Device Package Information
Package Outline
D/D1
Pin A1
35
34 32 30 28 26 24 22 20 18 16 14 12 10 8
6
4
2
33 31 29 27 25 23 21 19 17 15 13 11
9
7
5
3
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
Pin A1
E/E1
A A2 A3
A1
Altera Corporation
b
e
Heat Sink
113
Altera Device Package Information
655-Pin Ceramic Pin-Grid Array (PGA)
■
■
■
All dimensions and tolerances conform to ASME Y14.5M – 1994.
Controlling dimension is in inches. Millimeter measurements, shown in parenthesis, are for
reference only.
An industry-standard lead glass called T-187 (lead oxide glass) is used to seal PGA
packages. This material is manufactured by the Sumitomo Corporation.
Package Information
Description
Specification
Ordering Code Reference
G
Package Acronym
PGA
Lead Material
Alloy 42
Lead Finish
Gold over nickel plate
JEDEC Outline
MO-128
JEDEC Option
AP
Maximum Lead Coplanarity N/A
Weight
74.9 g
Moisture Sensitivity Level
Printed on moisture barrier bag
114
Altera Corporation
Altera Device Package Information
Package Outline
(Top View)
(Side View)
2.460 ± .015 Sq.
(62.48 ± 0.38)
.180 ± .005
0.20 ± 0.13
1.600 ± .012
Sq.
(40.54 ± 0.31)
.050 ± .005
0.27 ± 0.13
.008 ± .005
0.20 ± 0.13
1.500 ± .010
Sq.
(38.1 ± 0.25)
.005 Dia.
(1.27)
0.0 ± 0.002 Dia.
0.46 ± 0.05
Indicates location of A1 (not a pin)
.040 BSC
(3.68)
.145 Max.
(3.68)
(Bottom View)
0.10 BSC
(2.54)
B
D
F
H
K
M
P
T
V
Y
AB
AD
AF
Indicates quadrant
containing location A1
.050 BSC
(1.27)
A
C
E
G
J
L
N
R
U
W
AA
AC
AE
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
AY
BA
BB
BC
BD
BE
BF
BG
46 44 42 40 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2
47 45 43 41 39 37 35 33 31 29 27 25 23 21 19 17 15 13 11 9 7 5 3 1
2.30 Sq.
(58.42)
Altera Corporation
115
Altera Device Package Information
672-Pin Wirebond FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Some devices have a chamfered corner at the A-1 ball location.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
D/E
JEDEC Option
AAL-1
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
3.0 g
Moisture Sensitivity Level
Printed on moisture barrier bag
b
27.00 BSC
0.50
0.60
e
1.00 BSC
M
26
0.70
†Altera's thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
116
Altera Corporation
Altera Device Package Information
Package Outline
Represents
A1 Ball Pad
Corner
D
25
26
Indicates
location of
Ball A1
E
23
24
21
22
19
20
17
18
16
15 13 11
9
7
5
3
1
14 12 10
8
6
4
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
b
A2
A
A1
C
Seating Plane
Altera Corporation
117
Altera Device Package Information
672-Pin Thermally Enhanced FlipChip FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.30
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAL-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
4.9 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Weight
(1)
118
7.66 g
e
1.00 BSC
D/E
27.00 BSC
M
26
1
Note: This value refers to the devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
Represents
A1 Ball Pad
Corner
D
7
5
3
1
25 23 21 19 17 15 13 11 9
26 24 22 20 18 16 14 12 10
8
6
4
2
C (2.00)
C (1.00)
E
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
e
b
A A2 A1
A3
Heat Sink
// 0.35 Z
C
Seating Plane
Altera Corporation
119
Altera Device Package Information
672-Pin Wirebond Ball-Grid Array (BGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
B
Nom.
Max.
3.50
Package Acronym
BGA
A†
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
b
0.60
0.75
0.90
JEDEC Outline
MS-034
JEDEC Option
BAR-2, depopulated
D/E
35.00 BSC
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
e
1.27 BSC
Weight
5.2 g
M
26
Moisture Sensitivity Level
Printed on moisture barrier bag
†Altera’s thickness specification for A is
2.6 mm maximum. The Max item for A in the
table reflects the JEDEC specification.
120
Altera Corporation
Altera Device Package Information
Package Outline
Represents
A1 Ball Pad
Corner
25
D
26
Indicates
location of
Ball A1
E
45˚ Chamfer
(all 4 corners)
23
24
21
22
19
20
17
18
15
16
13
14
11
12
9
10
7
8
5
6
3
4
1
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
b
e
o
30 Typical
A
A2
A1
Seating Plane
Altera Corporation
121
Altera Device Package Information
724-Pin Thermally Enhanced FlipChip Ball-Grid Array (BGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
The orientation of the package shown is by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
3.50
0.35
–
–
0.25
–
3.00
A3
–
–
2.50
b
0.60
0.75
0.90
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
JEDEC Outline
MS-034
JEDEC Option
BAR-1
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
D/E
35.00 BSC
Weight
5.4 g
e
1.27 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
27
Weight
12.43 g1
(1)
122
Note: This value refers to the devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
Represents
A1 Ball Pad
Corner
D
27
C 2.00
-Y-
Indicates
location of
Ball A1
E
25 23 21 19 17 15 13 11 9
7
5
3
1
26 24 22 20 18 16 14 12 10
8
6
4
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
-Xe
b
A A2 A1
A3
Heat Sink
// 0.35 Z
C
Seating Plane
Altera Corporation
123
Altera Device Package Information
780-Pin Thermally Enhanced FlipChip FineLine Ball-Grid Array (FBGA)
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAM-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
5.8 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Weight
(1)
124
8.9 g
e
1.00 BSC
D/E
29.00 BSC
M
28
1
Note: This value refers to the devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
Represents
A1 Ball Pad
Corner
D
27
28
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
C (2.00)
C (1.00)
25 23 21 19 17 15 13 11 9
7
5
3
1
26 24 22 20 18 16 14 12 10
8
6
4
2
Indicates
location of
Ball A1
E
e
b
A A2 A1
A3
Heat Sink
// 0.35 Z
C
Seating Plane
Altera Corporation
125
Altera Device Package Information
956-Pin Thermally Enhanced FlipChip Ball Grid Array (BGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Figure Reference
Description
Specification
Millimeters
Symbol
Min.
Nom.
Max.
–
–
3.5
0.35
–
–
Ordering Code Reference
B
Package Acronym
BGA
A
Lead Material
Tin-lead alloy (63/37)
A1
Lead Finish
N/A
A2
0.25
–
–
JEDEC Outline
MS-034
A3
–
–
2.5
JEDEC Option
BAU-1
b
0.60
0.75
0.90
Maximum Lead Co-planarity 0.008 inches (0.20 mm)
D/E
40.00 BSC
Weight
8.7 g
e
1.27 BSC
Moisture Sensitivity Level
Printed on moisture barrier bag
M
31
Weight
15.30 g1
(1)
126
Note: This value refers to the devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
D
Indicates Location
of Ball A1
Y
E
X
31
30
29
28 27 26 25 24 23 22
21
20
19 18 17
16
15
14
13
12 11 10 9
8
7
6
5 4 3 2 1
Representing A1 Ball
Pad Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
e
b
A
A3 A2
e
Heat Sink
A1
Seating Plane
Altera Corporation
127
Altera Device Package Information
1020-Pin Thermally Enhanced FlipChip FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAP-1, depopulated
b
0.50
0.60
0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
7.7 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Weight
11.54 g1
(1)
128
e
1.00 BSC
D/E
33.00 BSC
M
32
This value refers to devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
D
32 313029 28 27 26 2524 23 22 21 20 19 18 17 16 1514 13 1211 10 9 8 7 6 5 4 3 2 1
C (2.00)
C (1.00)
E
A1 Ball
Pad Corner
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
e
b
A
A3 A2
Heat Sink
A1
Altera Corporation
129
Altera Device Package Information
1508-Pin Thermally Enhanced FlipChip FineLine Ball-Grid Array (FBGA)
■
■
■
■
All dimensions and tolerances conform to ANSI Y14.5M – 1994.
Controlling dimension is in millimeters.
Orientation of the package is shown by a chamfer and/or a pin 1 mark.
M is the maximum solder ball matrix size.
Package Information
Package Outline Figure Reference
Description
Specification
Millimeters
Symbol
Ordering Code Reference
Min.
F
Nom.
Max.
3.50
Package Acronym
FBGA
A
–
–
Lead Material
Tin-lead alloy (63/37)
A1
0.35
–
–
Lead Finish
N/A
A2
0.25
–
3.00
JEDEC Outline
MS-034
A3
–
–
2.50
JEDEC Option
AAU-1
b
0.50
0.60
0.70
Maximum Lead Coplanarity 0.008 inches (0.20 mm)
Weight
9.3 g
Moisture Sensitivity Level
Printed on moisture barrier bag
Weight
15.30 g1
(1)
130
e
1.00 BSC
D/E
40.00 BSC
M
39
This value refers to devices mentioned in PCN 0214.
Altera Corporation
Altera Device Package Information
Package Outline
D
C (2.00)
C (1.00)
E
A1 Ball
Pad Corner
39 383736 35 34 33 32 3130 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 1110 9 8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
AK
AL
AM
AN
AP
AR
AT
AU
AV
AW
e
b
A
A3 A2
Heat Sink
A1
Altera Corporation
131
101 Innovation Drive
San Jose, CA 95134
(408) 544-7000
http://www.altera.com
Applications Hotline:
(800) 800-EPLD
Literature Services:
lit_req@altera.com
Copyright © 2002 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the
stylized Altera logo, specific device designations, and all other words and logos that are identified as
trademarks and/or service marks are, unless noted otherwise, the trademarks and service marks of Altera
Corporation in the U.S. and other countries. All other product or service names are the property of their
respective holders. Altera products are protected under numerous U.S. and foreign patents and pending
applications, mask work rights, and copyrights. Altera warrants performance of its
semiconductor products to current specifications in accordance with Altera’s standard
warranty, but reserves the right to make changes to any products and services at any time
without notice. Altera assumes no responsibility or liability arising out of the application
or use of any information, product, or service described herein except as expressly agreed
to in writing by Altera Corporation. Altera customers are advised to obtain the latest
version of device specifications before relying on any published information and before
placing orders for products or services.