GLOBALFOUNDRIES Completes
Acquisition of IBM Microelectronics
July 1, 2015
The GLOBALFOUNDRIES Story
Creating an Industry Leader
•
•
•
•
AMD spins out fab operations
Mubadala (ATIC) acquires majority stake
GLOBALFOUNDRIES created
Construction begins on New York fab
Acquires Chartered
Semiconductor
2009
2010
Largest privately held
semiconductor company
2011
• New York fab delivers initial
silicon first time right
• 100% ownership by Mubadala
• Dresden fab ships 250,000th
32nm HKMG wafer
• Sanjay Jha joins as CEO
• Collaborates with Samsung
on global 14nm manufacturing
Launches 14nm
FinFET Technology
Acquires IBM Microelectronics business
2012
2014
2013
Over $15B invested
in CAPEX to date
2015
~8X capacity increase
since 2009
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Business Strategy
Operational
Excellence
Differentiated
Offerings
Strategic
Partnerships
Cost & Capital Efficiency
GLOBALFOUNDRIES
has a long-term
commitment to investing
in R&D for technology
leadership.
• Manufacturing excellence and execution continue to be a
main pillar of our strategy. We will continue to strengthen
our execution across our end-to-end portfolio.
• Acquired substantial IP with more than 16,000 patents &
applications, industry-leading technology know how and
design tools, making GF the holder of one of the largest
semiconductor patent portfolios in the world.
• GLOBALFOUNDRIES will increase the investment in both
RF and ASIC, and will leverage the scale and capacity
that comes with the acquisition.
• Target segments for these technologies include the growth
markets of Internet of Things (IOT), mobility, automotive
and advanced processors.
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Foundry Growth Outpacing Semiconductors
Electronic Systems
Semiconductor Market
Foundry Market
($B)
($B)
($B)
7%
11%
1%
6%
4%
1,702
54.4
357
1,584
354
5%
1,488
49.1
46.9
340
2014
2015
2016
2014
2015
2016
2014
2015
2016
Sources:
EIectronic Systems: IC Insights
Semiconductor & Foundry markets: Gartner
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2014 Semiconductor Ranking Including Foundries
HQ
2014 Sales
($M)
Company
1 Intel
U.S.
51,368
11 Renesas
Japan
7,372
2 Samsung
South Korea
37,259
12 Mediatek + MSTAR
Taiwan
7,032
3 TSMC
Taiwan
24,976
13 Infineon
GLOBALFOUNDRIES
U.S.
Europe
6,000*
5,988
4 Qualcomm
U.S.
19,100
14 Avago + LSI
Singapore
5,674
5 Micron + Elpida
U.S.
16,814
15 NXP
Europe
5,625
6 SK Hynix
South Korea
15,838
16 AMD
U.S.
5,512
7 TI
U.S.
12,179
17 Sony
Japan
5,192
8 Toshiba
Japan
11,216
18 Freescale
U.S.
4,548
9 Broadcom
U.S.
8,360
19 GLOBALFOUNDRIES
U.S.
4,350
10 ST
Europe
7,374
20 UMC
Taiwan
4,350
Company
Source: IC Insights The McClean Report 2015
HQ
2014 Sales
($M)
*Based upon analysts’ estimates
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World-Class Leadership Team
Dr. Sanjay Jha
CEO
Ibrahim Ajam i
EVP and Chief Strategy
Officer
KC Ang
SVP and GM,
Singapore Operations
Gregg Bartlett
SVP, CMOS Platforms
Business Unit
John Bucher
SVP, Strategy
Mike Cadigan
Product Management
Group
Dr. Thom as Caulfield
SVP and GM, FAB 8
Terry Daly
SVP, Program
Management
John Docherty
SVP, Global Operations
Jam es Doyle
Fab 9 and Fab 10
Operations
Chuck Fox
SVP, Worldw ide Sales
Dr. John Goldsberry
Chief Accounting Officer
and Acting CFO
Brian Harrison
SVP, Integration and
Factory Management
Ana Hunter
SVP, U.S. Major
Accounts
Alexie Lee
Chief of Staff,
Office of the CEO
Lou Lupin
SVP and Chief Legal
Officer
Rick Mahoney
SVP, Design
Enablement
Dr. Gary Patton
CTO and Worldw ide
R&D
Len Stephens
SVP, Chief Human
Resources Officer
Dr. Rutger Wijburg
SVP, FAB 1
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Global Manufacturing Capacity: ~7M Wafers/Yr*
East Fishkill,
New York
Malta,
New York
Burlington,
Vermont
Dresden,
Germany
Singapore
45nm–28nm
180nm–40nm
TECHNOLOGY
90nm–22nm
28nm, ≤ 14nm
350nm–90nm
CAPACITY IN WAFERS/MONTH
14,000 (300mm)
Up to 60,000 (300mm)
40,000 (200mm)
60,000 (300mm)
68,000 (300mm)
93,000 (200mm)
*200mm Equivalents
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Company Highlights
REVENUE
MORE THAN
~6B*
2nd
Largest
Foundry
25,000
250
18,000
Patents &
Applications
Customers
Employees
FAB CAPACITY
FAB LOCATIONS
Burlington
Dresden
East Fishkill
Malta
Singapore
300mm
200mm
Trusted
Foundry
200K
133K
Wafers/Mo Wafers/Mo
*Based upon analysts’ estimates
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Key Markets Driving Growth
CONSUMER, WIRELESS,
MOBILE COMPUTING
• Cellular/WIFI
Connectivity
• Smartphones
• Tablets
• Portable
WIRED & WIRELESS
INFRASTRUCTURE
• Basestations
• Routers/Switches
• Digital TV
• Set-top Boxes
HIGH PERFORMANCE
COMPUTING
•
•
•
•
Microprocessors
Networking
Servers/Storage
Supercomputers
Graphics
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Key Expansion Markets
INTERNET OF
THINGS
(IoT)
Smart Cards
AEROSPACE
AND DEFENSE
AUTOMOTIVE
Infotainment
Powertrain
Control
Building
Management
INDUSTRIAL
Household
Appliances
Safety
Systems
Wearables
Body Control
Consumer
Medical
Factory
Automation
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Business Unit Structure
CMOS Platforms BU
Broad technology portfolio
across Leading-Edge &
Mainstream nodes.
RF BU
ASIC BU
Accelerating RF leadership
and manufacturing scale.
Differentiated RF portfolio
solutions such as RFSOI,
RFCMOS, and SiGe.
Richest portfolio of best-inclass IP for Wired, Wireless
infrastructure applications
in the Foundry Industry.
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CMOS Platforms Business Unit
Broad and differentiated product offerings across Leading-Edge and
Mainstream process nodes
• Leading-edge portfolio from 28nm to 10nm and below including
• 28nm HKMG/Poly-Si: Industry leader, over 1 million wafers shipped
• 14nm FinFET: Ideal for the most demanding high-volume, high-performance and
power-efficient SoC designs.
• Driving rapid migration to RF and eNVM on leading-edge platforms
• Mainstream portfolio spanning process nodes from 180nm to 40nm
• Modular platforms enables cost competitive technologies
• Analog Mixed Signal, Power, HV Power
• Display Drivers, eNVM, MEMs
• Manufacturing on 200mm and 300mm wafers
Partnered with leaders in EDA software tools, design intellectual property
(IP), design services, mask services, and assembly solutions to delivery
platform solutions
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RF Business Unit
Unmatched RF Technology Portfolio
• Technology leadership in high performance RF SOI, Silicon Germanium
(SiGe), RF CMOS, and RF MEMs spanning over 10 technology nodes
• Recognized industry provider for RF radios for cellular and mobility,
high performance RF for industrial and infrastructure
• Best-of-Breed product design kits and a substantial patent portfolio
Manufacturing Scale and Flexibility
• Foundry scale for high performance high-volume consumer products
• Manufacturing and technology development centers-of-excellence
Collaborative
• Deep industry traction through an established technical collaboration
model over many RF technology generations
• Flexible technology and manufacturing engagement models
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ASIC Business Unit
Proven path to high volume ASIC production
• Leadership in high speed Serdes and embedded memory in high volume production
across 6 process node generations
• Engineering intimacy established through ASIC design centers in close proximity to
customers
• High Volume production on wire bond, flip chip and advanced packaging solutions
• Advanced Process Node roadmap spanning from 14nm and beyond
Most flexible engagement model in the Foundry Industry
• Customer engagements possible through the value chain e.g. IP licensing, Design
Engineering, packaging and test
Richest portfolio of IP for Wired, Wireless infrastructure applications provided
by a Foundry
• Multiple Serdes solutions supporting wide protocol set tuned for Backplane, Short
reach and Very Short Reach applications
• Multiple memory compiler/TCAM solutions
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