8x8
North American Company Profiles
8X 8
8x8, Inc.
2445 Mission College Boulevard
Santa Clara, California 95054
Telephone: (408) 727-1885
Fax: (408) 980-0432
Web Site: www.8x8.com
Email: pr@8x8.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
8x8, Inc. • Bucks, England U.K.
Telephone: (44) (1628) 402800 • Fax: (44) (1628) 402829
Financial History ($M), Fiscal Year Ends March 31
1992
Sales
36
Net Income
5
R&D Expenditures
7
Capital Expenditures
—
Employees
114
1993
31
(1)
7
—
1994
34
(0.3)
7
—
1995
20
(6)
8
—
1996
29
(3)
8
1
1997
19
(14)
11
1
100
105
110
81
100
1998
50
4
12
1
100
Ownership: Publicly held. NASDAQ: EGHT.
Company Overview and Strategy
8x8, Inc. is a worldwide leader in the development, manufacture and deployment of an advanced Visual
Information Architecture (VIA) encompassing A/V compression/decompression silicon, software, subsystems,
and consumer appliances for video telephony, videoconferencing, and video multimedia applications.
8x8, Inc. was founded in 1987. The “8x8” refers to the company’s core technology, which is based upon Discrete
Cosine Transform (DCT) image compression and decompression. In DCT, 8-pixel by 8-pixel blocks of image data
form the fundamental processing unit.
2-1
8x8
North American Company Profiles
Management
Paul Voois
Keith Barraclough
Bryan Martin
Sandra Abbott
Chris McNiffe
Chris Peters
Michael Noonen
Samuel Wang
David Harper
Brett Byers
Chairman and Chief Executive Officer
President and Chief Operating Officer
Vice President, Engineering and Chief Technical Officer
Vice President, Finance and Chief Financial Officer
Vice President, Marketing and Sales
Vice President, Sales
Vice President, Business Development
Vice President, Process Technology
Vice President, European Operations
Vice President, General Counsel and Investor Relations
Products and Processes
8x8 has developed a Video Information Architecture (VIA) incorporating programmable integrated circuits (ICs) and
compression/decompression algorithms (codecs) for audio/video communications. The company’s video
compression semiconductors combine, on a single chip, a RISC microprocessor, digital signal processor,
specialized video processing circuitry, static RAM memory, and proprietary codec software.
The company’s family of processors include the following:
•
ViaTV Phone is an all-in-one video telephone that connects to standard TV and regular telephone lines for
cost-effective, easy-to-use consumer and small business video telephony.
•
Video Communications Processor (VCP) is a single-chip programmable video subsystem and multimedia
communications processor for ISDN/LAN/WAN videoconferencing.
•
Low Bit-Rate Video Processor (LVP) is a single-chip programmable video-phone processor for ordinary
telephone lines.
8x8 is a fabless manufacturer of video ICs and videophone systems, but has strategic alliances for core
technologies, as well as equity partners, with leading electronics manufacturers, including Siemens,
NSC/ASCII/Mitsu, Yamaha and Sony.
8x8 also provides videoconferencing components to major OEMs such as British Telecom, MCI, PictureTel,
Panasonic and Sony.
2-2
ACC Micro
North American Company Profiles
ACC MICRO
ACC Microelectronics Corporation
2500 Augustine Drive
Santa Clara, California 95054
Telephone: (408) 980-0622
Fax: (408) 980-0626
(See Auctor Corporation)
2-3
Actel
North American Company Profiles
ACTEL
Actel Corporation
955 East Arques Avenue
Sunnyvale, California 94086-4533
Telephone: (408) 739-1010
Fax: (408) 739-1540
Web Site: www.actel.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
Actel Europe Ltd. • Basingstoke, Hampshire, England
Telephone: (44) (1256) 29209
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1992
41
(0.3)
9
—
1993
56
5
11
—
1994
76
8
14
4
1995
109
(1)
21
3
1996
149
15
24
4
1997
156
17
26
0
168
211
245
320
356
380
Ownership: Publicly held. NASDAQ: ACTL.
Company Overview and Strategy
Founded in 1985, Actel Corporation designs, develops, and markets field programmable gate arrays (FGPAs) and
associated software development systems and programming hardware. Its products are used by designers of
computer and computer peripheral, telecommunications, military, aerospace, industrial control, and other
electronic systems.
2-4
Actel
North American Company Profiles
Actel is a leader in the development of antifuse-based FPGAs and believes it was the first company to achieve
volume production of such devices. The company's objective is to become the leading supplier of FPGAs by fully
exploiting the capabilities of its proprietary antifuse and circuit architectures.
In April 1995, Actel completed the acquisition of the antifuse FPGA business of Texas Instruments, which was the
only second-source supplier of Actel’s products.
Management
John C. East
Esmat Z. Hamdy
Fares Mubarak
Hank Perret
Michelle A. Begun
Douglas D. Goodyear
Carl Burrow
Robert Smith, Ph.D.
David L. Van De Hey
Gujus Worthington
Bruce Weyer
Cindy Joyce
President and Chief Executive Officer
Senior Vice President, Technology and Operations
Vice President, Engineering
Vice President, Finance and Chief Financial Officer
Vice President, Human Resources
Vice President, Worldwide Sales
Vice President, Marketing
Vice President, Software
Vice President and General Counsel
Manager, Strategic Product Planning
Director, Product Marketing
Director, North American Distribution Sales
Products and Processes
Value Series
• The ACT1 family consists of two devices, a 1,200-gate part and a 2,000-gate (6,000 PLD equivalent gates)
part, and offers system performance of up to 25MHz. This family of circuits utilizes 1.0µm or 0.9µm CMOS
technology.
• The ACT2 family consists of three devices ranging from 2,500 to 8,000 gates (20,000 PLD equivalent gates)
and offers system performance of up to 50MHz. This family of circuits utilizes 1.0µm CMOS technology.
2-5
Actel
North American Company Profiles
Accelerator Series
• The ACT3 family consists of devices ranging from 1,500 to 10,000 gates (25,000 PLD equivalent gates) and
on-chip performance of up to 250MHz (system performance up to 75MHz). This family of circuits is based on
0.8µm double-level-metal CMOS technology.
• The ACT3 PCI family consists of fully PCI-compliant devices with 4,000 to 10,000 usable gates and on-chip
performance of up to 250MHz. This family of circuits is based on 0.6µm double-level-metal CMOS technology.
Integrator Series
• The MX family is the first line of low-cost, single-chip ASIC alternatives. The 9,000 gate A42MX09, is the fastest
device in the MX family of FPGAs.
• The 1200XL family features parts ranging from 2,500 to 8,000 gates and offers system performance of up to
60MHz. This family of circuits is based on 0.65µm CMOS technology.
• The 3200DX family of FPGAs has capacities ranging from 6,500 gates to 40,000 gates and offers system
performance of up to 100MHz. These high-performance FPGAs offer fast dual-port SRAM, fast decode, and
data path circuitry based on 0.65µm double-level-metal CMOS technology.
Reprogrammable SPGAs
• Actel’s ES family of system programmable gate arrays (SPGAs) are non-antifuse PLDs designed to address the
system-on-a-chip market. The fine-grained array of logic module blocks enables gate counts from 50,000
gates up to 400,000 gates. The SRAM-based SPGAs permit the integration of complex intellectual property
(IP) cores and support in-system programmability (ISP). Actel jointly developed the SPGA technology with the
Silicon Architects Group of Synopsys.
Radiation-Hardened FPGAs
• In March 1998, Actel announced availability of its new FPGA, the 2,000 gate RH1020.
• Actel’s RadHard family of FPGAs consists of radiation-hardened versions of its 2,000-gate ACT1 device and its
8,000-gate ACT2 device. These devices were first shipped in 1996 and ramped more quickly than any other
product in the company’s history. The RadHard family is based on 0.8µm double-level-metal epitaxial bulk
CMOS technology jointly developed with Lockheed-Martin Federal Systems.
Mask Programmed Gate Arrays (MPGAs)
• Offered as an alternative to traditional gate array conversions, Actel’s MPGAs provide significant cost
reductions for high-volume applications. An Actel FPGA used for prototyping and initial production can be
replaced by a corresponding MPGA (masked version of the device).
To support its FPGA products, Actel offers software products, including its CoreHDL IP portfolio consisting of
telecommunications cores, industrial cores, a Universal Serial Bus (USB) interface, and Actel-developed CorePCI
models, as well as proprietary and third-party design automation software. In addition, Actel provides programming
and test hardware and a diagnostic option that provides special in-circuit debug and diagnostic capabilities.
2-6
North American Company Profiles
Actel
Semiconductor Fabrication Facilities
Actel's FPGAs are manufactured by Chartered Semiconductor, Lockheed-Martin Federal Systems, Matsushita,
Texas Instruments, and Winbond.
The company’s first foundry suppliers were Matsushita and TI. As part of the 1995 acquisition of TI’s FPGA
business, Actel signed a three-year manufacturing agreement (1.0µm design rules).
Also in 1995, Actel and Matsushita extended their five-year manufacturing relationship (0.8µm, 0.9µm, and 1.0µm
design rules). In addition, Matsushita is assisting Actel in developing next-generation antifuse technology.
Actel’s relationship with Chartered began in 1994 when the company purchased a minority equity interest in
Chartered. In return, Actel is guaranteed access to Chartered’s advanced 200mm wafer capacity (0.6µm design
rules).
Since being signed on in 1994, Winbond has become one of Actel’s largest fab partners, providing the company
with advanced wafer production services (0.8µm and 0.6µm design rules).
Lockheed-Martin Federal Systems is the sole source of Actel’s rad-hard FPGAs, which are being jointly developed
by the two companies (0.8µm design rules).
Key Agreements
•
In March 1998, Space Electronics Inc. announced that it had signed a memorandum of understanding with
Actel Corporation to develop and market a new line of high-reliability, radiation-tolerant Field Programmable
Gate Array (FPGA) products. The agreement calls for the two companies to combine Space Electronics’
patented RAD-PAK package shielding technology with Actel’s commercial FPGA products. The first products
are expected by the second quarter of 1998.
• In January 1998, Actel and High Reliability Components Corporation (HIREC) announced a partnership to bring
high reliability field programmable gate arrays (FPGAs) to the burgeoning Japanese satellite and space
exploration industry. This includes the latest Japanese National Space Development Agency (NASDA) launch
vehicle, the H-IIA Rocket.
• In 4Q96, Actel signed a multi-year agreement with Swiss IP provider, Inicore AG, for several
telecommunications and industrial control cores. The cores have been optimized for Actel’s ACT3, ACT3 PCI,
1200XL, and 3200DX families of FPGAs, as well as the ES family of SPGAs.
• Actel and Synopsys announced an agreement in mid-1996 to jointly develop Actel’s SPGAs, which combine
the features of FPGAs and mask programmed ASICs in a single chip. Under the agreement, Actel licensed the
cell-based array (CBA) architecture of the Silicon Architects Group of Synopsys for use in the maskprogrammed portion of the SPGAs.
2-7
Actel
North American Company Profiles
• In 2Q96, Actel signed an agreement with IP provider, Technical Data Freeway, Inc., giving Actel and its
customers access to over 90 synthesizable DSP, telecommunications, multimedia, and MCU cores.
• Actel completed an agreement with Lockheed-Martin Federal Systems Company in Manassas, Virginia, in 1H95
to jointly develop radiation-hardened FPGAs. Lockheed Martin FSC is manufacturing the devices.
2-8
Advanced Hardware Architectures
North American Company Profiles
ADVANCED HARDWARE ARCHITECTURES CORP .
Advanced Hardware Architectures Corporation
2365 Northeast Hopkins Court
Pullman, WA 99163
Telephone: (509) 334-1000
Fax: (509) 334-9000
Web Site: www.aha.com
Fabless IC Manufacturer
Founded: 1988
Employees: 50
Ownership: Privately held.
Company Overview and Strategy
Advanced Hardware Architectures Corporation (AHA) supplies standard and customized coprocessor IC designs
for many leading electronics manufacturers worldwide. AHA products offer a unique difference that gives
equipment or systems faster data rates and more capacity. Applications include data backup storage, hardcopy
and digital communications. Using patented coprocessor architectures that are highly parallel, extremely fast, and
void of the performance delays inherent in software, AHA compiles algorithms directly into full-custom VLSI chips.
AHA’s single-chip, full-custom coprocessor designs involve custom algorithms, architectures, logic, electronics
and cell designs.
Advanced Hardware was a spin-off of the University of Idaho Microelectronics Research Center, the only NASA
Engineering Research Center for VLSI design. In exchange for royalties and shares of AHA stock, the University
granted perpetual, exclusive and worldwide rights to two patented coprocessor technologies. The first is the
high-speed Reed-Solomon Error Correction patent, the initial focus of the Company. The second technology
improves the speed of today’s best computer sorting by at least a factor of ten.
AHA has over 25 sales agents across the US and Canada. In addition, the Company is represented by a number
of sales representatives and distributors in Europe, the Middle East and the Pacific Rim. Annual sales for 1997
were approximately $14M.
2-9
Advanced Hardware Architectures
North American Company Profiles
Management
John C. Overby
Gordon F. Scott
Patrick A. Owsley
Thomas M. Kovanic
Iain Mackie
John Cameron
President
Vice President, Finance and Administration
Vice President, Technology and Product Development
Vice President, Marketing and Sales
Vice President, Engineering
Director, Operations
Products and Processes
Advanced Hardware’s products are outlined below.
• Data Storage – AHA produces a wide variety of formatters and data compression solutions for data storage
applications. Typical products are Magneto Optical drives, Quarter Inch Cartridge tape and Digital Data
Storage Tape.
• Hardcopy – Hardcopy is AHA’s generic term for any transfer of electronic images to the printed page that
could benefit from AHA’s data compression technology. This area includes, but is not limited to, copiers,
printers, scanners, plotters, x-ray and medical imaging devices.
• Digital Communications – The digital communications product group has grown to encompass many
different applications in the last 10 years. These include wireless LANs, wireless digital cable, cable
modems, digital television, digital cellular telephones and other low power digital communication
applications. AHA Reed-Solomon ECC devices include the AHA4012, 1.5 Mbytes/sec, and the AHA4011,
10Mbytes/sec. AHA brings error detection and correction to digital channels from 10Kbits per second to
over 80Mbits per second.
Data Compression
2-10
•
AHA’s dictionary-based lossless data compression chips support a customized version of the Lempel-ziv
adaptive algorithm (DCLZ) originally developed by Hewlett-Packard. AHA’s single-chip devices
effectively double, or even triple, storage capacity in sequential storage media. Throughput rates in
applications as diverse as high-speed LANs and data storage can be greatly boosted. The average
compression ratio of the chips is 2:1 for typical files; however, compression ratios of 5:1 or higher are also
achievable.
•
The StarLite Family of hardcopy products include devices capable of simultaneous compression and
decompression with speeds ranging from 4Mbytes/second to 33Mbytes/second. Also included in this
family is a decompression only device which runs at of 16Mbytes/second.
•
Color Image Compression – AHA’s proprietary Color Adaptive Data Compression (CADC) algorithm is
based on DPCM algorithm, Huffman coding and adaptive quantization. The AHA3710 compression
device is an efficient implementation of this algorithm that has been modified and optimized for color
image data as well as grayscale formatted image data.
North American Company Profiles
Advanced Hardware Architectures
• Data Format Controller – The Company’s QIC tape data format controller, the AHA5140, includes unique
features such as read-while-write, frame level control and on-board system resources. The read-while-write
feature greatly reduces backup time compared to read-after write drives. In addition, the chip’s frame level
logic avoids block level control typically required of microprocessors. This chip incorporates a programmable
clock generator for system, tape write channel and data separator reference.
• Forward Error Correction – AHA’s forward Error Correction codecs offer the highest level of cost-effective
error correction performance in the industry. Some of the designs stem from research completed fro NASA
space communications. AHA has integrated all Reed-Solomon encoding/decoding and specific controller
functions into single, low-cost VLSI chips for on-the-fly error/erasure correction. AHA uses both ReedSolomon and Viterbi error correction in an effective one-two punch that can clean up the noisiest
transmission channels.
Semiconductor Fabrication Facilities
Key Agreements
• In February 1997, Advanced Hardware Architectures announced a joint venture with the Electronic Device
Group of Mitsubishi Electronics America, Inc., to co-develop a new integrated circuit for use in the set-top
boxes of cable television operations. As part of the agreement, Mitsubishi Electronics America has also
invested an undisclosed amount of money in AHA. Both companies have plans to market the new chip
worldwide.
2-11
Advanced Power Technology, Inc.
North American Company Profiles
ADVANCED POWER TECHNOLOGY , INC .
Advanced Power Technology, Inc.
405 Southwest Columbia Street
Bend, Oregon 97702
Telephone: (541) 382-8028
Fax: (541) 388-0364
Web Site: www.advancedpower.com
IC Manufacturer
Founded: 1984
Regional Offices/Representative Locations
U.S.:
Western Region
Advanced Power Technology, Inc.
Phone: (408) 847-2447 • Fax: (408) 847-2413
Northeastern Region
Advanced Power Technology, Inc.
Phone: (972) 686-5352 • Fax: (972) 686-5441
Southeastern Region
Advanced Power Technology, Inc.
Phone: (704) 693-6564 • Fax: (704) 693-7757
Europe:
European Sales Office, U.K.
Advanced Power Technology, Inc.
Phone: (44) 1635 582 358 • Fax: (44) 1635 582 458
APT Europe – Merignac, France
Phone: (33) 557 92 15 15
Ownership: Privately held.
Company Overview and Strategy
Advanced Power Technology, Inc. (APT) manufactures power MOSFETs and ultrafast rectifiers for high-power
switch mode power supplies, motor speed controls and related power applications.
2-12
Advanced Power Technology, Inc .
North American Company Profiles
In November 1993, APT acquired Power Compact, Merignac, France, a manufacturer of Application Specific
Power Modules (ASPM). This acquisition enabled APT to combine its high power silicon technology with Power
compact’s unique expertise in integrating the power, supervisory, protection and control circuitry into custom
ASPM solutions. Targeted at the motor drive, welding and other high power applications, these modules offer
end users a cost effective solution that meets their specific application needs.
Management
Patrick Sireta
John Hess
Dah Wen Tsang
Thomas A. Loder
Greg Haugen
Russell Crecraft
President and Chief Executive Officer
Vice President, Discrete Power Products
Vice President, Engineering Research and Development
Vice President, Sales and Marketing
Chief Financial Officer and Vice President, Finance and Administration
Vice President, Manufacturing Operations
Products and Processes
Advanced Power Technology products are described below.
Avalanche Energy Rated MOSFETs: APT has a broad line of avalanche energy rated MOSFETs ranging from
100V to 1,200V with RDS(ON) ranging from 0.019 ohms to 1,600 ohms. APT’s interdigitated layout has always
featured very fast switching speeds and short delay times. An improved layout for Power MOSV™ has reduced
the switching speeds even further. This product family also includes FREDFETs and is offered in a wide range of
plastic packages.
Ultra Fast Recovery Diodes (FRED): Includes devices rated from 200V though 1,200V and from 15Å to 100Å per
chip. Using APT’s proprietary heavy metal lifetime control process, the FREDs achieve ultra-fast recovery time
while maintaining soft recovery characteristics and low forward voltage.
Low Gate Charge MOSFET Family: This product line ranges from 400V to 1,000V with RDS(ON) ranging from
0.042 ohms to 1,000 ohms.
RF MOSFETs: Offered in plastic packaged “symmetric pair” lead pin-out configuration allows for easy board layout
of push-pull circuits. This product line is targeted at 1-120MHz industrial, scientific and medical applications.
Hermetic Packaged MOSFET Products: This product line includes ICs operating at voltages ranging from 200V to
1,000V with RDS(ON) from 0.022 ohms to 4,000 ohms.
IGBT: This product line is available with 600V and 1,200V ratings. Utilizing Non-Punch through (NPT) technology,
it is the only rugged line of IGBT products currently offered in today’s market.
Advanced Power Technology, Inc. also offers high quality integrated custom modules, Application Specific Power
Modules, through the Power Compact facility in Europe.
2-13
Alberta Microelectronic Corporation
North American Company Profiles
ALBERTA MICROELECTRONIC CORPORATION (AMC)
Alberta Microelectronic Corporation
11315 – 87th Ave., Suite #318
Edmonton, Alberta
Canada
T6G 2T9
Telephone: (403) 492-3914
Fax: (403) 492-1643
Web Site: www.amc.ab.ca
Email: info@amc.ab.ca
IC/Prototype Manufacturer
Founded: 1982
Employees: 65
Ownership: As of April 1998 - privately held.
Regional Offices/Representative Locations
North America:
Alberta Microelectronic Corporation • Calgary, Canada
Telephone: (403) 298-2043 • Fax: (403) 289-2047
Company Overview and Strategy
Alberta Microelectronic Corporation (AMC) started in 1982 as a University of Alberta spin-off and grew into a
foremost Canadian provider of microelectronics. With annual semiconductor-related revenues of $6 million, AMC
works as an OEM supplier to various companies utilizing microelectronic products or devices in the areas of
genetic analysis, telecommunications, and industrial automation.
AMC offers services in three main areas: Design Engineering, Microfabrication and Thin-Film Simulation Software.
Management
Chris Lumb
Graham McKinnon
Derek Hudson
Steven Slupsky
Thomas Janacek
2-14
President and Chief Executive Officer
Vice President of Microfabrication
Chief Financial Officer
Design Group Manager
Director of Marketing
North American Company Profiles
Alberta Microelectronic Corporation
Products and Processes
AMC markets its own proprietary Thin-Film Process Simulator, SIMBAD – Silicon processing without Silicon, the
first commercially available PVD process simulator.
AMC also provides electronic design services, especially in the area of embedded systems and microcontrollers.
Semiconductor Fabrication Facilities
AMC has a prototype facility, which is one of Canada’s finest laboratory environments for research and
development in microelectronics and related areas. The 8,000 sq. ft. facility houses the development and
fabrication of materials, devices, and microstructures in semiconductor related fields, which also include device
processing, thin-film deposition, testing and packaging of microelectronic devices.
AMC
11315 – 87th Ave., Suite #318
Edmonton, Alberta, Canada
T6G 2T9
Telephone: (403) 492-3914
Cleanroom size: 5,000 sq. ft.
Noteworthy News
•
In April 1998, AMC announced its privatization plans, as well as a new name – The Alberta Microelectronic
Corporation. Operating as a private company, the AMC will be governed by an independent board of directors
and will continue its close and productive relationships with the Universities of Alberta and Calgary. As part of
the re-organization, AMC is committing $5,000,000 to be spent over ten years to support research activities at
the Universities of Alberta and Calgary.
2-15
Allegro MicroSystems
North American Company Profiles
ALLEGRO MICRO S YSTEMS
Allegro MicroSystems, Inc.
115 Northeast Cutoff, Box 15036
Worcester, Massachusetts 01615-0036
Telephone: (508) 853-5000
Fax: (508) 856-7434
Web Site: www.allegromicro.com
IC Manufacturer
Financial History ($M)
Semiconductor
Sales
Capital Expenditures
Employees
1992
1993
1994
1995
1996
1997
115
13
124
10
161
14
181
13
177
13
155
47
—
—
—
—
2,000
2,400
Company Overview and Strategy
Allegro MicroSystems is the former semiconductor branch of Sprague Technologies, Inc. In 1990, Sprague
Semiconductor Group was purchased by Japan's Sanken Electric and renamed Allegro MicroSystems. Today,
Allegro is functionally and structurally an independently operating organization as a wholly owned subsidiary of
Sanken Electric.
Allegro MicroSystems specializes in the design, manufacture, and marketing of advanced mixed-signal ICs. The
company is the world leader in Hall-effect sensor ICs and a prominent supplier of power and intelligent power ICs.
Allegro's customers are OEMs primarily serving the automotive and industrial markets, but also the consumer,
telecommunications, computer mass storage, and printer markets.
2-16
Allegro MicroSystems
North American Company Profiles
Management
Allan S. Kimball
Allan S. Kimball
Dennis Fitzgerald
John Kokulis
Andy Labrecque
John MacDougall
Steven W. Miles
Fred Windover
Mary Beth Perry
President
Vice President, Sales (acting)
Vice President, Quality Systems
Vice President, Finance and Chief Financial Officer
Vice President, Operations
Vice President, Research and Development
Vice President, Product Development and Engineering
Vice President and General Counsel
Vice President, Human Resources
Products and Processes
Allegro's product offerings are outlined below by end-use market segment.
Automotive Market
Magnetic field sensors
Power driver ICs
Signal processing ICs
Radio components
EDP Printer and Communication Markets
Printer head driver
Paper transport motor driver
Battery management
Computer Mass Storage Market
Spindle motor controller/driver
Servo/voice-coil motor driver
Combination drivers
Industrial and Consumer Markets
Chip supply for hybrids
Smoke detector electronics
Switch Mode Power Supply Market
AC-DC converter (>10W to <250W)
Universal input switching (<1kW)
The semiconductor processes used by Allegro range from standard bipolar to CMOS, power DMOS (doublediffused MOS), and combinations of all of them.
2-17
Allegro MicroSystems
North American Company Profiles
Semiconductor Fabrication Facilities
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 5,000
Wafer size: 100mm and 150mm
Processes: Bipolar, BiMOS, BiCMOS, DMOS
Products: Power and intelligent power ICs,
signal processing ICs, sensors.
Feature sizes: 1.25µm-8.0µm
Allegro MicroSystems, Inc.
3900 Welsh Road
Willow Grove, Pennsylvania 19090
Cleanroom size: 15,000 square feet
Capacity (wafers/week): 3,000
Wafer size: 100mm
Processes: Bipolar, CMOS, BiMOS, BiCMOS, DMOS
Products: Power and intelligent power ICs,
ASICs (mixed-signal), sensors.
Feature sizes: 1.5µm-8.0µm
Allegro plans to expand wafer capacity at its Willow Grove facility.
2-18
Alliance Semiconductor
North American Company Profiles
ALLIANCE S EMICONDUCTOR
Alliance Semiconductor Corporation
3099 North First Street
San Jose, California 95134-2006
Telephone: (408) 383-4900
Fax: (408) 383-4999
Web Site: www.alsc.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1993
22
2
2
—
1994
55
9
4
—
1995
119
24
8
7
1996
201
11
15
95
1997
83
(17)
15
—
1998
118
(6)
15
32
35
40
74
130
150
160
Ownership: Publicly held. NASDAQ: ALSC.
Company Overview and Strategy
Founded in 1985, Alliance Semiconductor designs, develops, and markets memory products and memoryintensive logic products for high-performance applications. The company services a broad range of markets
including desktop and portable PCs, networking, telecommunications and instrumentation. Alliance has OEM
customers in North America, Europe, and Asia.
The majority of Alliance’s revenues have historically come from the high speed SRAM market. Over the past few
years, the company has made steady progress in diversifying its product lines. Alliance’s product offerings now
include DRAMs, flash memories, and 3D/2D graphics accelerator chips. In the near future, Alliance plans to
leverage its experience in both memory and logic design to produce high performance embedded memory
products to meet the needs of diverse markets.
2-19
Alliance Semiconductor
North American Company Profiles
Management
N. Damodar Reddy
C.N. Reddy
Charles Alvarez
Bill Caparelli
Sunit Saxena
Angela Kupps
Chairman, President, and Chief Executive Officer
Senior Vice President, Engineering and Operations, and Chief Operating Officer
Vice President, Finance and Administration, and Chief Financial Officer
Senior Vice President, Sales
Vice President, Operations and Product Engineering
Vice President, Human Resources
Products and Processes
SRAMs
Alliance offers a variety of synchronous and asynchronous CMOS SRAMs that address application needs in the
networking, telecom, modem, PC, and mainframe markets. Alliance is a leader in the high performance SRAM
market. Historically, SRAMs were the primary product line for the company. In 1994 and 1995, Alliance produced
a 3.3V asynchronous 256K SRAM which was considered a standard for Intel Pentium Cache applications.
Following the success of the 3.3V asynchronous SRAM product line, Alliance developed and introduced high
density 1Mb (32K x 32) and 2Mb (64K x 32) 3.3V, synchronous-burst, fully pipelined SRAMs. These new
SRAMs, with access times as low as 5ns, are being used in 166MHz and faster Pentium Cache applications. In
1993, Alliance introduced a 5V 1Mb, high performance, asynchronous SRAM, and in 1996, Alliance introduced a
4Mb asynchronous SRAM. Today, these two leading edge, high-density SRAMs are in production both in 3 and
5V configurations.
2-20
North American Company Profiles
Alliance Semiconductor
Alliance recently introduced six, new, ultra-low power Intelliwatt™ SRAM products for the digital communications
market. These SRAM products consume as little as 20 milliwatts of power when active. These devices use low
power memory cell technology and a 0.25µm process technology to all but eliminate quiescent power
consumption. Alliance offers Intelliwatt™ SRAM products in 64K x 16 and 128K x 8 configurations in 3.3V, 2.5V,
and 1.8V operating ranges.
Alliance also introduced a high-speed (150MHz) synchronous graphics RAM (SGRAM). The 3.3V, one port, 8Mb
device is suited for 2D/3D graphics applications on PCs and set-top boxes.
DRAMs
Alliance currently offers high speed 4Mb DRAMs in 1M x 4 and 256K x 16 configurations. Alliance has produced
high speed DRAM parts such a 16Mb EDO DRAM, 16Mb SDRAM, and 8Mb SGRAM in the most popular
configurations. Currently under development are 16Mb SGRAM and 64Mb SDRAM memories; these devices are
anticipated for 1998 production.
Flash Memories
As part of Alliance’s diversification strategy, Alliance is developing a broad range of flash memory products. The
flash memory product line will consist of high performance, feature-rich, single supply voltage (5V-only and 3Vonly) products ranging from 1Mb to 8Mb in both 8-bit and 16-bit wide configurations. These products will be
designed to address the PC BIOS, networking, telecommunications, instrumentation, and consumer electronics
markets. Alliance currently offers a 4Mb 512K x 8 device.
3D/2D Graphics Accelerators
In 1994, Alliance made its first foray into non-memory products with its line of ProMotion™ 2D graphics
accelerators for PCs. In 1997, Alliance gained major recognition in the graphics market when it was chosen as the
supplier for the 2D graphics chip to be used with 3Dfx’s high-end Voodoo Rush™ 3D graphics chipset. Alliance
graphics OEMs include Hercules, Jazz Multimedia, and Intergraph.
Alliance introduced a new line of high performance 3D/2D graphics accelerators. These products fully support the
new Intel Accelerated Graphics Port standard, including AGP 2X with sideband addressing. Alliance will also offer
3D/2D graphics accelerators with embedded memory for the laptop PC market.
Embedded Memory Products
Alliance Semiconductor offers a set of memory-intensive logic devices targeted at the computing,
communications, and mass storage markets. These devices are currently implemented in 0.4 micron, 0.35 micron
and 0.25 micron CMOS technologies on 8 inch wafers in world class fabs.
Alliance’s embedded products integrate logic + flash memory, logic + DRAM and logic + SRAM. Alliance will soon
offer customers the ability to integrate logic + DRAM + SRAM on a single chip.
Alliance currently manufactures most of its products using 0.35 and 0.3µm CMOS technology in state-of-the-art 8
inch fabs. In 1998, Alliance introduced new SRAM products based on 0.25 micron technology and DRAM
products based on 0.30 technology.
2-21
Alliance Semiconductor
North American Company Profiles
Semiconductor Fabrication Facilities
Alliance manufactures its IC products through a combination of joint venture and independent manufacturing
facilities. The company’s major foundries are United Microelectronics Corporation (UMC), United Semiconductor
Corporation (USC), Chartered Semiconductor Manufacturing Ltd., and Rohm Corporation.
In February 1995, Alliance agreed to purchase shares of Chartered Semiconductor Manufacturing Ltd. in
Singapore for approximately U.S. $10 million. In April 1995, the company agreed to purchase additional shares in
Chartered, bringing the total agreed investment in Chartered to approximately U.S. $51.6 million.
In July 1995, Alliance entered into an agreement with UMC and S3 Inc. to form a separate Taiwanese company,
USC, for the purpose of building and managing a semiconductor facility in Taiwan. The facility is now in full
production utilizing advanced submicron manufacturing processes. On March 20, 1998, Alliance announced an
agreement to sell 35 million shares of USC, approximately 18 percent of the almost 190 million shares owned by
Alliance. Through the agreement to sell 35 million shares of USC, Alliance will maintain an approximately 15.5
percent equity ownership position of USC, and will maintain the right to purchase up to 25 percent of the
manufacturing capacity of the facility.
In October 1995, Alliance entered into an agreement with UMC and other parties to form a separate Taiwanese
company, United Silicon Inc., for the purpose of building and managing a semiconductor manufacturing facility in
Taiwan. The facility is expected to commence production in 1998. The contributions of Alliance and other parties
shall be in the form of equity investments, representing an initial ownership interest of approximately five percent
for each U.S. $30 million. Alliance had originally committed to an investment of approximately U.S. $60 million or
ten percent ownership interest, but has recently requested that its level of participation be reduced by 50 percent.
Currently, Alliance owns approximately 3.33 percent of the outstanding shares of USI and has the right to
purchase up to approximately 4.17 percent of the manufacturing capacity of the facility.
2-22
Allied Signal Microelectronics & Technology Center
North American Company Profiles
ALLIED S IGNAL MICROELECTRONICS & TECHNOLOGY CENTER
AlliedSignal Microelectronics & Technology Center
9140 Old Annapolis Road, MD-108
Columbia, Maryland 21045
Telephone: (410) 964-4000
Fax: (410) 992-5813
Web Site: www.mtcsemi.com
IC/Prototype Manufacturer
Founded: 1981
Financial History ($M), Fiscal Year Ends December 31
Corporate
Sales
Net Income
1996
1997
13,971
1,170
14,472
1,020
Ownership: Publicly held; part of AlliedSignal Corporation (NYSE: ALD).
Company Overview and Strategy
AlliedSignal Microelectronics & Technology Center (MTC) designs and manufactures high-performance ASICs,
from full-custom digital and analog to high-density standard cell. The mission of the company is to provide
customers a competitive leverage at microwave frequencies utilizing SOI microwave CMOS technology. MTC is
dedicated to serving wireless communications markets including: Global Positioning Systems (GPS), Wireless
LAN, Personal Communications Systems (PCS), Satellite Systems Communications, and European GSM. MTC
products include ASICs for space applications, Microwave CMOS and foundry services, Mixed-Signal, and Active
Matrix Displays.
MTC, a wholly owned division of AlliedSignal Inc., evolved from two divisions of AlliedSignal Aerospace (previously
known as Bendix). The two divisions were the VLSI group, created in Ft. Lauderdale, Florida in 1978, at the
Bendix Avionics facility, and the Research and Technology Group of Columbia, Maryland. In 1984, Bendix
enhanced it’s VLSI operation by moving it to Columbia, Maryland and creating it’s own fab facility. In 1985, Bendix
merged with Allied, and by the first quarter of 1986, the fab produced its first wafers. In 1992, AlliedSignal merged
the Research and Technology Group with the Microelectronics Center. This new organization was renamed
Microelectronics and Technology Center, combining the technical expertise of both to create a world class
research, design, and fab facility.
Management
David Yaney
General Manager
2-23
Allied Signal Microelectronic & Technology Center
North American Company Profiles
Products and Processes
AlliedSignal’s microwave CMOS technology primarily serves the wireless communications market. The Company
offers microwave, mixed-signal and digital integration capability on a single chip. Components include transistors,
inductors, capacitors, and resistors. Their microwave CMOS devices feature SOI (silicon-on-insulator) technology,
low power consumption at multiple D.C. bias conditions, low voltage operation (1.5V), high speed performance
(greater than twice the speed of bulk silicon), inherent radiation hardened capabilities, and high temperature
devices (300°C). Microwave CMOS Circuit/System applications include: receivers, transmitters, synthesizers,
mixers, switches, PLLs, phase shifters, modulators, high speed A/Ds, digital receivers, and in amplifiers-LNAs and
buffer.
Semiconductor Fabrication Facilities
AlliedSignal MTC has a 0.8 micron triple-level metal CMOS wafer fabrication facility. This facility houses 20,000
square feet of cleanroom — a combination of Class 10 and Class 10,000. Also on site, is a 4,000 square foot
cleanroom used exclusively for research and development of new products.
2-24
Alpha Industries
North American Company Profiles
ALPHA INDUSTRIES , INC .
Alpha Industries, Inc.
Semiconductor Division
20 Sylvan Road
Woburn, MA 01801
Telephone: (781) 935-5150
Fax: (781) 824-4564
Web Site: www.alphaind.com
IC Manufacturer
Founded: 1959
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1997
85
(16)
10
8
1998
117
10
10
11
800
840
Ownership: Publicly held. NASDAQ: AHAA.
Company Overview and Strategy
Alpha Industries designs and manufactures gallium arsenide (GaAs) integrated circuits, silicon and GaAs discrete
semiconductors and ceramic products. Markets include cellular telephones, personal communications services
(PCS), global positioning systems, mobile radio and specialized wireless equipment.
Management
George S. Kariotis
Thomas Leonard
Paul Vincent
Jean Pierre Gillard
Chairman
President and Chief Executive Officer
Vice President and Chief Financial Officer
Vice President, Business Development
2-25
Altera
North American Company Profiles
ALTERA
Altera Corporation
101 Innovation Drive
San Jose, California 95134
Telephone: (408) 544-7000
Fax: (408) 433-3945
Web Site: www.altera.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
Altera Japan Ltd. • Shinjuku-ku, Tokyo, Japan
Telephone: (81) 3 3340-9480
Europe:
Altera U.K. Limited • Buckinghamshire, United Kingdom
Telephone: (44) 1 494 602-000
Asia-Pacific:
Altera International, Ltd. • Kwai Fong, New Territories, Hong Kong
Telephone: (852) 2487-2030
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1992
101
12
16
4
1993
140
21
17
—
1994
199
15
22
1
1995
402
87
34
1
1996
497
109
50
93
1997
631
133
54
146
477
527
667
881
918
1,086
Ownership: Publicly held. NASDAQ: ALTR.
Company Overview and Strategy
Altera Corporation, founded in 1983, is the leading supplier of high-performance, high-density CMOS
programmable logic devices (PLDs) and associated development tools. Its broad line of "off-the-shelf" userconfigurable chips, together with Altera-developed software, enable system manufacturers to create custom logic
functions in-house for a wide variety of applications. Altera believes its products and services provide its
customers with faster time-to-market than masked ASIC solutions.
Altera products are used in a variety of applications, including telephone switching systems, computer networking,
multimedia boards, broadcast video and video conferencing, and medical instrumentation.
2-26
Altera
North American Company Profiles
Management
Rodney Smith
Denis Berlan
Clive McCarthy
Jack Fitzhenry
Thomas J. Nicoletti
Nathan Sarkisian
Peter Smyth
Erik Cleage
Chairman, President, and Chief Executive Officer
Executive Vice President and Chief Operating Officer
Senior Vice President, Development Engineering
Vice President, Human Resources
Vice President, Investor Relations
Vice President, Finance
Vice President, Sales
Vice President, Marketing
Products and Processes
Altera® PLD products range from 24 to 676 pins with gate counts up to 250,000 gates and process technologies
advancing to 0.25 micron through its fabrication partners. Altera recently announced Raphael, a revolutionary new
PLD architecture with up to two million gates, more than 15 times the capacity of the largest PLDs on the market
today. The first device, which is expected to be available in 1999, will be built on a 0.25 micron process and offer
500,000 gates of programmable logic. This device will chart a clear path toward one-million-gate PLDs, built on a
0.18 micron, six-layer metal process, that is expected to be available at the end of 1999. Devices with two million
gates based on the Raphael architecture and a 0.15 micron, seven-layer metal process will follow thereafter.
2-27
Altera
2-28
North American Company Profiles
FLEX 10KE Family
• Up to 250,000 gates
• In-circuit reconfigurable
• Embedded array blocks with dual-port RAM
• Up to 676 pins
• System performance: Up to 100MHz
• 0.25 micron, CMOS SRAM technology
• 2.5V supply voltage
• MultiVolt interface supporting 5V, 3.3V,
and 2.5V
• Megafunction support
FLEX 10KA Family
• 10,000 to 250,000 gates
• In-circuit reconfigurable
• Embedded array architecture
• 100 to 600 pins
• System performance: 40 to 60MHz
• 0.35 micron CMOS SRAM technology
• 3.3V supply voltage
• MultiVolt interface supporting 5V, 3.3V,
and 2.5V
• Megafunction support
FLEX 10K Family
• 10,000 to 100,000 gates
• In-circuit reconfigurable
• Embedded array architecture
• 84 to 503 pins
• System performance: 30 to 40MHz
• 0.5 micron CMOS SRAM technology
• MultiVolt interface supporting 5V and 3.3V
• Megafunction support
FLEX 6000 Family
• 10,000 to 24,000 gates
• In-circuit reconfigurable
• 100 to 256 pins
• System performance: 40 to 60MHz
• 0.35 micron CMOS SRAM technology
• 3.3V supply voltage
• MultiVolt interface supporting 5V, 3.3V,
and 2.5V
• Megafunction support
FLEX 8000 Family
• 2,500 to 16,000 gates
• In-circuit reconfigurable
• 84 to 304 pins
• System performance: 40 to 60MHz
• 0.5 micron CMOS SRAM technology
• MultiVolt interface supporting 5V and 3.3V
• Megafunction support
MAX 9000 Family
• 6,000 to 12,000 gates
• In-system programmable
• 84 to 356 pins
• Jam programming support
• System performance: 40 to 60MHz
• 0.5 micron CMOS EEPROM technology
• MultiVolt interface supporting 5V and 3.3V
MAX 7000A Family
• Up to 20,000 gates
• In-system programmable
• 44 to 256 pins
• Jam programming support
• tPD = 5ns
• 0.35 micron CMOS EEPROM technology
• 3.3V supply voltage
• MultiVolt interface supporting 5V, 3.3V,
and 2.5V
MAX 7000S Family
• 600 to 5,000 gates
• In-system programmable
• 44 to 208 pins
• Jam programming support
• tPD = 5ns
• 0.5 micron CMOS EEPROM technology
• MultiVolt interface supporting 5V and 3.3V
Altera
North American Company Profiles
MAX 7000(E) Family
• 600 to 5,000 gates
• 44 to 208 pins
• tPD = 6ns
• 0.5 micron, CMOS EEPROM technology
• MultiVolt interface supporting 5V and 3.3V
MAX 5000 Family
• 600 to 3,750 gates
• 24 to 100 pins
• 0.65 micron CMOS EPROM technology
Classic Family
• 300 to 900 gates
• Zero standby power
• 24 to 68 pins
• 0.65 micron CMOS EPROM technology
The company also offers a series of configuration memory devices designed to configure its FLEX devices, as well
as mask-programmed logic devices (MPLDs) for high-volume applications. MPLDs are pin-, function-, and timingcompatible with Altera PLDs and are available for all families.
Altera supplies the state-of-the-art MAX+PLUS® II development software, which has been optimized for design
flexibility and compatibility with leading EDA design systems. With MAX+PLUS II, designers can quickly implement
and test changes in a design, eliminating the long lead times typically associated with gate arrays.
As PLDs reach higher density levels, design flows must be as efficient as possible. Altera addresses this by being
the industry leader in providing reusable and synthesizable megafunctions that are optimized for the Altera device
architectures, and the tools required to create these solutions. Altera MegaCore™ functions are developed, pretested and licensed by Altera; megafunctions are also offered through the Altera Megafunction Partners Program
(AMPP SM), an alliance between Altera and developers of optimized, synthesizable megafunctions.
Semiconductor Fabrication Facilities
Altera has foundry agreements with Sharp, TSMC, Cypress, and Intel.
In November 1995, Altera signed a letter of intent for joint ownership of a TSMC joint venture fab facility, located in
Camas, Washington. Under the terms, Altera will invest $140 million to take an 18 percent equity stake in, and also
gain the rights to 27 percent of the output from the new fab. Construction on the facility, called WaferTech, began
in July 1996. Potential output from the plant is expected to be 7,500 200mm wafers per week, with production
scheduled to start in 1998. Design rules will start at 0.35µm and migrate to 0.25µm.
Key Agreements
• In February 1996, Altera purchased a minority stake in I-Cube Inc., a privately held supplier of programmable
switching and interconnect devices (PSIDs).
2-29
AMCC
North American Company Profiles
APPLIED MICRO CIRCUITS (AMCC)
Applied Micro Circuits Corporation
6290 Sequence Drive
San Diego, California 92121-4358
Telephone: (619) 450-9333
Fax: (619) 450-9885
Web Site: www.amcc.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Applied Micro Circuits Corporation • Munich, Germany
Telephone: (49) (89) 92404-217 • Fax: (49) (89) 92404-140
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income (loss)
Employees
1993
38
993
1994
50
10.2
1995
47
(1.0)
1996
50
(3.6)
1997
57
6.3
1998
77
15
275
300
310
270
255
309
Ownership: Publicly held. NASDAQ: AMCC
Company Overview and Strategy
Established in 1979, Applied Micro Circuits Corporation (AMCC) designs, develops, manufactures, and markets
standard and application-specific high-speed, high-performance, high-bandwidth interface ICs for the
communications, computer, instrumentation, and military markets. The company also offers a comprehensive line
of low EMI, low skew precision clock products.
AMCC is a leader in bipolar manufacturing and bipolar ECL logic arrays, the company’s focus in recent years has
been shifting from ASICs to standard products, particularly chips for the telecommunications and networking
markets, areas where bipolar’s high frequency characteristics can be exploited.
Management
David Rickey
Joel O. Holliday
Anil Bedi
Laszlo Gal
Kenneth Clark
Thomas Tullie
2-30
President and Chief Executive Officer
Chief Financial Officer and Administration
Vice President, Marketing
Vice President, Engineering
Vice President, Operations
Vice President, Sales
North American Company Profiles
AMCC
Products and Processes
AMCC produces and sells bipolar and BiCMOS gate array and standard cell ASICs, custom bipolar IC products, and
standard bipolar and CMOS products.
The company’s portfolio of ASSPs for high-performance networking, clock/timing, and bus interface applications,
and ASICs include the following:
Telecom and Data Products
• ATM 155, 622Mbit/s Transmitters and Receivers
• Fibre Channel Crosspoint Switches
• Fibre Channel Interface Circuits
• HIPPI Serial XMUX and XDEMUX Circuits
• HIPPI Source and Destination Interface Circuits
• SONET Clock Synthesis/Recovery Devices
• SONET OC-3, OC-12 Transceivers
• 100VG AnyLAN STP/Fibre Transceivers
• Gigabit Ethernet Transceivers
PCI Local Bus Interface Products
• PCI Matchmaker Controllers
• PCI Matchmaker Controller Developer’s Kit
Precision Clock and Timing Standard Products
• 3.3/5V Low Skew Clock Drivers
• Low Skew Clock Generators/Synthesizers
ASICs
• BiCMOS Logic Arrays
• Bipolar Logic Arrays
As part of its push into communications markets, AMCC redesigned its G3.0 bipolar process, obtained through a
technology alliance with Plessey, to allow for 3.3V operation. Parts derived from the 1.0µm process can be
operated at up to 2.4GHz.
Semiconductor Fabrication Facilities
AMCC operates from a 120,000 square foot facility in San Diego, California, that includes a design center for
customer design use and training, a Class 10 cleanroom for bipolar IC production, and an assembly and test facility.
The company has established strategic foundry partners to augment its wafer supply.
2-31
AMCC
North American Company Profiles
Applied Micro Circuits Corporation
6920 Sequence Drive
San Diego, California 92121-4358
Cleanroom size: 8,500 square feet (Class 10)
Capacity (wafers/week): 600
Wafer size: 100mm
Processes: Bipolar, BiCMOS
Products: ASICs, ASSPs, custom ICs
Feature sizes: 1.0µm, 2.0µm, 3.0µm
AMCC's capacity is only about half utilized and the company expects its current manufacturing resources to reach
maximum levels in a few years.
Key Agreements
•
In April 1998, Applied Micro Circuits Corporation announced the acquisition of certain assets of Ten Mountains,
an analog design group located in Minneapolis, Minnesota, for an undisclosed amount. Ten Mountains
focuses on the design engineering of Physical Media Devices (PMDs). This acquisition enables AMCC to offer
immediate expertise in PMD design and technology.
The company will integrate Ten Mountains’ seven employees, which will bring AMCC’s staffing levels to 333
people worldwide. AMCC will immediately take over Ten Mountains’ Minneapolis facility.
•
In January 1998, AMCC announced that 3Com Corporation had selected AMCC’s SONET transceivers for use
in the company’s CoreBuilder™ 7000 high function switch and CoreBuilder 9000 enterprise switch for ATM
and Gigabit Ethernet high capacity backbone networks.
2-32
AMD
North American Company Profiles
ADVANCED MICRO DEVICES (AMD)
Advanced Micro Devices, Inc.
One AMD Place
P.O. Box 3453
Sunnyvale, California 94088-3453
Telephone: (408) 732-2400
Fax: (408) 774-7216
Web Site: www.amd.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Advanced Micro Devices (UK) Ltd. • Firmley, United Kingdom
Telephone: (44) (1276) 803100 • Fax: (44) (1276) 803102
Japan:
Advanced Micro Devices • Shinjuku-ku, Tokyo, Japan
Telephone: (81) (3) 3346-7550 • Fax: (81) (3) 3342-5685
Asia-Pacific:
Advanced Micro Devices Far East Ltd. • Kowloon, Hong Kong
Telephone: (852) 2956-0388 • Fax: (852) 2956-0588
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
1,514
234
238
224
1993
1,648
208
279
390
1994
2,155
271
295
586
1995
2,468
216
416
650
1996
1,953
(69)
401
494
1997
2,356
(21)
468
623
11,674
12,203
11,994
12,981
12,181
12,759
Ownership: Publicly held. NASDAQ: AMD.
Company Overview and Strategy
Advanced Micro Devices (AMD) was founded in 1969 and is today one of the largest U.S.-based merchant
manufacturers of integrated circuits. With a focus on the personal and networked computing and communications
markets, the company produces microprocessors and related peripherals, flash memories, programmable logic
devices, and circuits for telecommunications and networking applications.
AMD’s strategy is to be competitive only in those markets where it can be a leading factor. The company has been
a major supplier of microprocessors since 1975, it is a leading supplier of non-volatile memories, a leader in ICs for
local area networks and linecards for public communications applications, and is one of the largest suppliers of
programmable logic devices.
2-33
AMD
North American Company Profiles
In a move to significantly enhance its core competency in advanced microprocessor design, AMD acquired
NexGen, Inc. for nearly $1 billion in early 1996. The acquisition brought together the engineering resources of
NexGen and AMD’s sub-0.35µm process technology and manufacturing capability to enable AMD to offer future
generations of microprocessors in a competitive timeframe.
To address the unique requirements of the market for programmable logic devices (PLDs), AMD spun-off its PLD
operations in the second half of 1996 to form a new subsidiary business unit called Vantis Corporation (a separate
profile of Vantis is included in this publication). Vantis will continue to rely on AMD for manufacturing services and
plans to eventually become an independent company.
AMD is organized into four product groups: the Communications Group (CG), the Computation Products Group
(CPG), the Memory Group (MG), and Vantis Corporation. CG products include voice and data communications
products, embedded processors, I/O devices, and network products. CPG products include microprocessors.
Memory Group products include flash memory devices and EPROMs. Vantis products are high-speed PLDs.
Management
W.J. Sanders III
Richard Previte
Marvin Burkett
Gene Conner
S. Atiq Raza
Stanley Winvick
Stephen Zelencik
Donald M. Brettner
Richard Forte
Gary O. Heerssen
William Siegle
Terryll R. Smith
Benjamin M. Anixter
Gary Ashcraft
Kathryn Brandt
Randy Burdick
2-34
Chairman and Chief Executive Officer
President and Chief Operating Officer
Senior Vice President, Chief Financial and Administrative Officer and Treasurer
Senior Vice President, Operations
Senior Vice President and Chief Technical Officer
Senior Vice President, Human Resources
Senior Vice President and Chief Marketing Executive
Group Vice President, Manufacturing Services Division
Group Vice President, Communications and Components Group, and
President and Chief Executive Officer, Vantis
Group Vice President, Wafer Fabrication Group
Group Vice President, Technology Development Group, and Chief Scientist
Group Vice President, Sales and Marketing
Vice President, External Affairs
Vice President and GM, Communication Products Division
Vice President, Business Systems
Vice President, Information Technology Management
AMD
North American Company Profiles
Susan T. Daniel
James Doran
Tom Eby
Curt Francis
Robert R. Herb
Larry Hollatz
Mike Johnson
Robert M. Krueger
Gerald A. Lynch
Walid Maghribi
Robert McConnell
Thomas M. McCoy
Giuliano Meroni
Daryl Ostrander
Jack Saltich
Danne Smith
Tom Stites
Michael Van Buskirk
Jerry Vogel
Vice President, Human Resource Operations
Vice President, Technical Operations
Vice President, Strategic Marketing, Communications and Components Group
Vice President, Corporate Planning and Development
Vice President, Strategic Marketing, Computation Products Group
Vice President and GM, Texas Microprocessor Division
Vice President, Advanced Research and Development
Vice President and GM, Network Products Division
Vice President, Sales and Marketing, Asia/Pacific-Japan
Vice President and GM, Non-Volatile Memory Products Division
Vice President and GM, Logic Products Division
Vice President, General Counsel, and Secretary
Vice President, Sales and Marketing, Europe
Vice President, Austin Wafer Fabrication
Vice President and GM, European Microelectronics Center, Dresden
Vice President, Corporate Quality
Vice President, Communications
Vice President, Engineering, Non-Volatile Memory Products Division
Vice President and GM, California Microprocessor Division
Products and Processes
MOS MEMORY
ANALOG
DRAM
SRAM
✔
✔
✔
Flash Memory
EEPROM
Voltage Regulator/Reference
✔
✔
Other (Including Non-Volatile RAM)
General Purpose Logic
Gate Array
Field Programmable Logic
Comparator
DIGITAL BIPOLAR
✔
✔
Standard Cell
✔
Data Conversion
Other (Includes Telecom)
MOS LOGIC
✔
Interface
Consumer/Automotive
EPROM
ROM
✔
Amplifier
Bipolar Memory
General Purpose Logic
Gate Array/Standard Cell
✔
Other Special Purpose Logic
Field Programmable Logic
Other Special Purpose Logic
✔
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
MPU
OTHER
MCU
Full Custom IC
MPR
Discrete
DSP
Optoelectronic
2-35
AMD
North American Company Profiles
Microprocessor Products
AMD-K6™ MMX Microprocessors—Shipments of AMD’s sixth-generation K6 MMX microprocessor, the second
member of AMD’s K86 family of superscalar RISC MPUs, began in the second quarter of 1997. The K6 has been
designed to be competitive in performance with Intel’s single-chip version of its Pentium Pro microprocessor. The
8.8-million-transistor device is based on AMD’s 0.35µm five-layer-metal CMOSCS34 technology. The first
versions in the K6 family operate at 166MHz, 200MHz, and 233MHz. A 266MHz version is expected in 2H97. In
order to reach 300MHz, AMD plans to migrate the K6 to a 0.25µm process by the end of 1997, at the earliest.
AMD-K5™ Microprocessors—The first member of AMD’s K86 family, the K5 is a fifth-generation alternative to
Intel’s Pentium. It is based on 0.35µm CMOS technology and is offered in five speed versions, the PR75, PR100,
PR133, PR150, and PR166. The PR nomenclature suggests which specific higher-clock-rate Intel Pentium each
of the members best compete with. Unfortunately, AMD was late in getting its K5 processor to market, and thus
does not expect it to generate the levels of revenues achieved by the Am486 microprocessor over its product life.
Am5x86 Microprocessors—The 5x86 is said to offer Pentium-class performance using a fourth-generation
architecture. It is based on a 0.35µm CMOS process and runs at a quadrupled clock rate of 133MHz.
Am486 Microprocessors—AMD’s 486DX4 microprocessors offer clock-tripled performance speeds of up to
120MHz and feature “enhanced” power management capabilities.
Embedded Processor Products
For processing/control applications in communications, mobile computing, networking, mass storage, or industrial
control systems, AMD offers its E86™ Family of x86-compatible embedded processor products. The E86 family
ranges from 16-bit MCUs to 32-bit MPUs, general purpose processors to “PCs on a chip.” The E86 family includes
several versions of Am186/188 16-bit microcontrollers, Am386SX/DX and AM486DX 32-bit microprocessors,
ElanSC300/310 32-bit microcontrollers based on a 386 core, and ElanSC400/410 32-bit microcontrollers based
on a 486 core.
With the success of its E86 family, AMD is putting less emphasis on its venerable 29K™ family of embedded RISC
processors. AMD will continue to support current product designs and customers using its 29K products.
However, development of new 29K devices has been discontinued. AMD cited the high cost of supporting the
proprietary architecture as the reason for putting an end to the product line.
Communications, Network, and I/O Products
AMD’s communications and networking products include ICs for public infrastructure, including subscriber line
interface circuits (SLICs), subscriber line audio-processing circuits (SLACs™), and ISDN controllers; ICs for
networking, including FDDI chips and PCnet™ Ethernet LAN devices; ICs for data communications, including PCI
small computer systems interface (SCSI) circuits, serial communications controllers (SCCs), and TAXIchip™
devices; and ICs for wireless communications, including CT2 PhoX™ controllers for digital cordless telephones
and PCnet-Mobile devices for wireless LANs.
2-36
North American Company Profiles
AMD
Non-Volatile Memory Products
Am29Fxxx Flash Memories—5.0V-only sector-erase flash memory devices available in densities ranging from 1M
to 16M. Some devices are available in bare die form.
Am29LVxxx Flash Memories—2.7V-only sector-erase flash memory devices available in densities ranging from 2M
to 8M. Some devices are available in bare die form.
Am29LLxxx Flash Memories—AMD’s new family of “zero-power” flash chips that incorporate new power
management circuitry to lower current consumption in sleep mode to only 75nA. The first member of the 2.2Vonly sector-erase flash family is an 8M part.
Am28Fxxx Flash Memories—This is the company’s first generation family of 5.0V/12.0V bulk-erase flash memory
devices. They are available in densities ranging from 256K to 2M.
EPROM Products—AMD’s CMOS UV and OTP EPROMs are offered in densities ranging from 64K to 4M. Lowvoltage versions are available in 1M and 2M densities.
ExpressROM Products—These are standard EPROM die that are pre-programmed and then encapsulated in
plastic packaging before delivery. They are offered in densities ranging from 64K to 8M.
Programmable Logic Products
The PLD products of Vantis include a variety of CMOS and bipolar programmable array logic (PAL) devices and its
line of MACH (Macro Array CMOS High-Density) advanced complex PLDs (CPLDs). See individual profile of Vantis
Corporation.
Other IC Products
The company’s other IC products include bipolar PROMs and RAMs, FIFO memories, high-performance CMOS
and bipolar bus interface devices, transmission line drivers and receivers, and dynamic memory management
circuits.
Semiconductor Fabrication Facilities
AMD built a $1.9 billion sub-half-micron semiconductor manufacturing facility in Dresden, Germany, for the
manufacture of its K86 microprocessors. Groundbreaking took place in the fourth quarter of 1996, with
production scheduled to start by the end of 1998.
AMD and Fujitsu broke ground in late 1995 on their second joint-venture manufacturing facility in Japan, a $1.2
billion fab for the production of flash memories. Initial output is expected in early 1998.
2-37
AMD
North American Company Profiles
Advanced Micro Devices
5204 East Ben White Boulevard
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 10
Cleanroom size: 22,000 square feet (Class 100)
Capacity (wafers/week): 4,500
Wafer size: 125mm
Process: CMOS
Products: PLDs
Feature size: 0.9µm
Advanced Micro Devices
5204 East Ben White Boulevard
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 14
Cleanroom size: 22,000 square feet (Class 10)
Capacity (wafers/week): 3,500
Wafer size: 150mm
Process: CMOS
Products: Flash memories, EPROMs
Feature size: 0.8µm
Advanced Micro Devices
5204 East Ben White Boulevard
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 15
Cleanroom size: 22,000 square feet (Class 10)
Capacity (wafers/week): 3,500
Wafer size: 150mm
Process: CMOS
Products: Logic, telecom, and network ICs;
MPUs; microperipheral ICs.
Feature size: 0.7µm
Advanced Micro Devices
901 Thompson Place
Sunnyvale, California 94088
Telephone: (408) 732-2400
Fab 17 and Submicron Development Center
Cleanroom size: 42,500 square feet (Class 1)
Capacity (wafers/week): 2,000
Wafer size: 150mm
Process: CMOS
Products: R&D, MPUs, flash memories
Feature sizes: 0.35µm-0.8µm
Advanced Micro Devices
5204 East Ben White Boulevard
Austin, Texas 78741
Telephone: (512) 385-8542
Fab 25
Cleanroom size: 86,700 square feet (Class 1)
Capacity (wafers/week): 6,000
Wafer size: 200mm
Process: CMOS
Products: MPUs, logic ICs, flash memories
Feature sizes: 0.35µm, 0.5µm (0.25µm capability)
AMD Saxony Manufacturing GmbH
Dresden, Saxony, Germany
Fab 30
Cleanroom size: 90,000 square feet
Capacity (wafers/week): 6,000
Wafer size: 200mm
Process: CMOS
Products: MPUs, logic ICs, R&D
Feature size: 0.25µm (0.18µm capability)
(Expected to start production by the end of 1998).
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AMD
North American Company Profiles
Fujitsu AMD Semiconductor Ltd. (FASL)
Aizuwakamatsu, Fukushima Prefecture, Japan
FASL I
Cleanroom size: 69,900 square feet (Class 1)
Capacity (wafers/week): 5,000
Wafer size: 200mm
Process: CMOS
Products: Flash memories
Feature sizes: 0.35µm, 0.5µm
(upgrading 0.5µm lines to 0.35µm).
Fujitsu AMD Semiconductor Ltd. (FASL)
Aizuwakamatsu, Fukushima Prefecture, Japan
FASL II
Cleanroom size: 88,000 square feet
Capacity (wafers/week): 6,000
Wafer size: 200mm
Process: CMOS
Products: Flash memories
Feature sizes: 0.25µm, 0.35µm
(Expected to start production in early 1998).
AMD’s back-end manufacturing facilities are located in Penang, Malaysia; Bangkok, Thailand; and Singapore. In
1996, AMD began the construction of a new assembly and test facility in Suzhou, China.
Key Agreements
• In February 1998, AMD announced a collaboration with Alcatel Microelectronics to license and manufacture
Alcatel’s ADSL (Asymmetric Digital Subscriber Line) DMT (Discrete Multitone) technology for both “full-rate”
and forthcoming ASDL “Lite” solutions. This alliance increases the availability of Digital Subscriber Line (DSL)
products for the global telecommunications market.
• Micron, Motorola, and AMD joined together with DuPont Photomasks Inc. (DPI) in 1996 to form a technology
venture, called DPI Reticle Technology Center, to develop advanced mask technology and provide pilot line
fabrication of leading-edge reticles.
• AMD and Intel signed a new five-year cross-licensing agreement near the end of 1995 that gives the two
companies rights to use each other’s patents and certain copyrights, excluding microprocessor microcode
beyond the 486 generation.
• Fujitsu and AMD opened a large flash memory fabrication facility, called Fujitsu-AMD Semiconductor Ltd.
(FASL), in Japan in September 1994. Production of flash memory chips began in 1Q95. FASL is currently
building its second fab, also to be dedicated to flash memory production. The partnership also involves joint
development of flash devices.
• Analog Devices, Inc. licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories
(Taiwan) in early 1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for
future PC telephony and telephone-answering devices.
2-39
AMI
North American Company Profiles
AMERICAN MICROSYSTEMS (AMI)
American Microsystems, Inc.
2300 Buckskin Road
Pocatello, Idaho 83201
Telephone: (208) 233-4690
Fax: (208) 234-6795
Web Site: www.amis.com
IC Designer / Manufacturer / Foundry
Founded: 1966, Idaho
Regional Offices/Representative Locations
Japan:
AMI-Japan • Nerima-ku, Tokyo, Japan
Telephone: (81) (3) 5399-7831 • Fax: (81) (3) 5399-7834
Europe:
AMI-GmbH • Dresden, Germany
Telephone: (49) (351) 31-99-1506 • Fax: (49) (351) 31-99-1507
Financial History ($M)
Sales
1992
135
1993
150
1994
171
1995
221
1996
256
1997
300
Employees
1,685
1,657
1,265
1,265
1,439
1600
Ownership: 100% of the capital stock is owned by Japan Energy Corporation of Tokyo.
Company Overview and Strategy
American Microsystems Inc. (AMI) was a pioneer in the development of application specific ICs (ASICs). Today,
AMI’s core business is to provide its customers with the best ASIC solution by leveraging its digital and mixedsignal design capabilities and its Class 1 manufacturing facilities. AMI has a full compliment of design, production,
and packaging capabilities.
The company offers a broad range of digital and mixed-signal ASICs, ASIC translation services, wireless
application-specific standard products (ASSPs) and CMOS foundry services with extremely short design-toproduction cycles.
Customers depend on AMI for a broad variety of ASIC-related services and products: FPGA to ASIC conversions;
second sourcing of an ASIC; production of an ASIC originally produced on an obsolete process; customer design
of digital and mixed-signal ASICs; foundry services; and a very popular line of wireless standard products.
2-40
North American Company Profiles
AMI
The company is comprised of eight business units: Communications ASICs; Industrial ASICs (for medical
equipment, power management, building and process controls); Inter-market ASICs (to support all other ASIC
applications); Translation ASICs (design translation services i.e., converting programmable logic to lower cost gate
array or standard cell ASICs, and second source existing ASIC designs); Communications Standard Products
(using DSS Technology to allow low-power, high data-rate wireless communications); Timing Generator Products
(products based on clock synthesis and frequency timing generators); Foundry services; and Design Technology
(supporting day-to-day business operations and developing strategic direction for design methodologies, tool
libraries, capabilities, etc.). Each of the units has the responsibility to engineer, market and sell their respective
products and services. To support the design function of each business unit, AMI maintains a digital ASIC
Standard library that contains more than 500 cells that operate from 2.5 to 5.5 volts. The library supports gate
arrays and standard cells.
AMI sells its services and products through a worldwide network of sales representatives and operates nine
design centers around the world. AMI is a QS9000/ISO9000 qualified supplier.
2-41
AMI
North American Company Profiles
Management
Gerald "Jerry" E. Homstad
Harold Blomquist
Dan Schroeder
Brian Harris
Tom Schiers
Al Morrison
Steve Ransom
Vince Hopkin
Bob Klosterboer
Bob Smith
Grant Hulse
Chris Laytun
President and Chief Executive Officer
Senior Vice President, Business Operations
Senior Vice President, Operations
Vice President, N. American Sales
Vice President, Strategic Accounts
Vice President, Foundry
Vice President, Timing Generator Products
Director, Translation ASICs
Director, Inter-Market ASICs
Director, Design Technology
Director, New Business Development
Director, Industrial ASICs
Products and Processes
AMI offers the latest state-of-the-art 0.35µm manufacturing process, but unlike many competitors, also continues
to support earlier 1.0µm processes. AMI produces digital and mixed-signal ASICs using a 0.6µm single-poly,
double- or triple- metal CMOS process. Low-voltage, low pad-width, 0.5µm processes are up and running.
Already, AMI has begun production of a 3.3 volt, low pad pitch, high digital performance 0.5µm CMOS process.
This low-voltage submicron process has interested customers producing products with high gate counts that
require low power but also high performance. This process is also attractive to customers who are concerned
about input/output pad pitches and availability of cores. Using this process it is possible to cost effectively
develop products with 50,000 to 200,000 gates. The density is about 8,000 gates/mm for standard cell and close
to 8,000 gates/mm for gate arrays. Work is also in progress to qualify a 0.35µm process. At 0.35µm, Fab 10 is a
Class-1 facility, focused on small volume production.
AMI offers the following products and services:
•
•
•
•
•
•
•
Standard-cell and gate array digital ASICs
Mixed-signal ASIC development services
Digital and mixed-signal ASIC design software
Wireless ICs (includes mask programmable system devices)
Foundry services
Contract design and manufacturing
Custom packaging
In 1997, AMI released several wireless IC devices targeting the direct sequence spread spectrum (DSSS) IC
market. The three devices include a transceiver, receiver-only, and a transmit-only device, and are designed for
various applications including security systems and remote medical devices. This product allows the customer to
use a number of modulation techniques that support data rates as high as 4Mbits/second. With SX043 at
4Mbits/second, a 10Mbytes game file can be downloaded from the Internet in less than 30 seconds versus 30
minutes with the standard 33.6Kbits PC modem.
2-42
AMI
North American Company Profiles
Semiconductor Fabrication Facilities
AMI
Pocatello, Idaho
Fab 9
Cleanroom size: 34,000 sq. ft. (Class 10)
Capacity (wafers/week): 6,500
Wafer size: 125mm
Processes: CMOS, NMOS
Products: ASICs, ROMs, telecom and datacom ICs,
MCMs, foundry services.
Feature sizes: 0.6µm-5.0µm CMOS;
3.0µm-5.0µm NMOS.
AMI
Pocatello, Idaho 83201
Fab 10
Cleanroom size: 20K to 40K sq. ft. (Class 1)
Capacity (wafers/week): 5,000
Wafer size: 200mm
Process: CMOS
Feature sizes: 0.35µm-0.8µm
(Operations began in mid-1997).
AMI maintains a 64,000 sq. ft. facility in the Philippines that performs assembly and final testing. The AMI facility in
Pocatello includes a 27,000 sq. ft. test area.
2-43
Anadigics
North American Company Profiles
ANADIGICS
Anadigics, Inc.
35 Technology Drive
Warren, New Jersey 07059-5197
Telephone: (908) 668-5000
Fax: (908) 668-5068
Web Site: www.anadigics.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Anadigics, Inc. • Somerset, England
Telephone: (44) (1935) 822611 • Fax: (44) (1935) 826696
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
20
(2)
5
—
1993
29
2
7
2
1994
35
2
9
5
1995
51
7
12
9
1996
69
12
12
16
1997
103
15
17
52
115
200
270
320
430
577
Ownership: Publicly held. NASDAQ: ANAD.
Company Overview and Strategy
Anadigics was founded in 1985 when it initiated macrocell development. A year later, it completed construction of
its wafer fab, and in 1987, started GaAs IC production with the introduction of both MMIC and fiber optic IC
products. Today, the company is a leading designer and producer of GaAs ICs for high-volume, high-frequency
receiver applications. The company launched its initial public offering in April 1995.
The company had originally relied on defense contracts to survive. However, with lucrative military pacts becoming
more of a rarity, Anadigics looked to the commercial and consumer electronics marketplaces to sell its products.
Today, Anadigics has established itself as a leading supplier of high-volume, low-cost, high-performance analog
GaAs ICs for applications including direct broadcast satellite (DBS) systems, cable TV systems, cellular phones,
fiber optic communications, and personal communication systems (PCS).
2-44
Anadigics
North American Company Profiles
Management
Ron Rosenzweig
Charles Huang, Ph.D.
John F. Lyons
Bruce Diamond
Robert Baytuns
Sheo Khetan
Javed S. Patel
Phillip Wallace
James Gilbert
President and Chief Executive Officer
Executive Vice President, Products and Engineering
Senior Vice President and Chief Financial Officer
Senior Vice President, Operations
Vice President, Research and Technology
Vice President, Manufacturing
Vice President, Marketing and Sales
Vice President, Product Development
Vice President, Device and Process Engineering
Products and Processes
Among the company's GaAs IC products are low-noise block converters and tuners for DBS systems, upconverter
chips for use in cable TV converters, cellular PCs, telephone power amplifiers and receivers, and fiber optic
(SONET) transimpedence amplifiers. Anadigics produces all of its ICs using its GaAs MESFET process.
Semiconductor Fabrication Facilities
In 1997, the company completed the conversion of its existing fab from 3 inch to 100mm wafers. Anadigics is in
the process of constructing an additional facility for both manufacturing and administration purposes. The
166,000 square foot facility, also located in Warren, New Jersey, will house a 12,000 square-foot Class 100
cleanroom that will manufacture 100mm GaAs wafers. Production to begin in late 1998 or early 1999.
Anadigics, Inc.
35 Technology Drive
Warren, New Jersey 07059-5197
Cleanroom size: 8,000 square feet (Class 100)
Capacity (wafers/week): 500
Wafer size: 100mm
Process: GaAs MESFET
Feature size: 0.5µm
Anadigics, Inc.
141 Mt. Bethel Road
Warren, New Jersey 07059
Cleanroom size: 12,000 square feet (Class 100)
Capacity (wafers/week): 500
Wafer size: 100mm
Process: GaAs MESFET
(Production to begin in late 1998 or early 1999).
2-45
Analog Devices
North American Company Profiles
ANALOG DEVICES (ADI)
Analog Devices, Inc.
One Technology Way
P.O. Box 9106
Norwood, Massachusetts 02062-9106
Telephone: (781) 329-4700
Fax: (781) 326-8703
Web Site: www.analog.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Analog Devices, GmbH • Munich, Germany
Telephone: (49) (89) 57005-0 • Fax: (49) (89) 57005-527
Japan:
Analog Devices, K.K. • Minato-Ku, Tokyo, Japan
Telephone: (81) (3) 5402-8210 • Fax: (81) (3) 5402-1063
Asia-Pacific:
Analog Devices Hong Kong, Ltd. • Hong Kong
Telephone: (852) 2506-9336 • (852) 2506-4755
Financial History ($M), Fiscal Year Ends October 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Foundry Fab Investment
1992
567
15
88
66
—
1993
666
44
94
67
—
1994
773
74
107
91
—
1995
942
119
134
213
14
1996
1,194
172
178
234
49
1997
1,243
178
196
179
54
Employees
5,200
5,300
5,400
6,000
6,900
7,800
Ownership: Publicly held. NYSE: ADI.
Company Overview and Strategy
Analog Devices is a leading manufacturer of precision high performance integrated circuits used in analog and
digital signal processing. ADI offers leadership products in analog, mixed-signal, and digital signal processing.
2-46
North American Company Profiles
Analog Devices
The company manufactures and markets a broad line of high-performance linear, mixed-signal and digital
integrated circuits (ICs) that address a wide range of real-world signal processing applications. The company’s
principal products include system-level ICs and general purpose, standard product linear ICs. Other products
include devices manufactured using assembled product technology, such as hybrids, which combine
unpackaged IC chips and other chip-level components in a single package.
Analog Devices’ business strategy for many years has focused on developing, manufacturing and marketing
integrated circuits (ICs) used for signal processing. Their products enable their customers—which are primarily
original equipment manufacturers (OEMs)—to process real-world analog signals, such as voice, video, audio,
temperature, pressure, acceleration and many others, in both the analog and digital domains.
Analog Devices maintains a strong focus on Standard Linear ICs, or SLICs. Approximately 60 percent of their
revenues come from this product category, and the majority of that comes from data converters and amplifiers. ADI
has its focus on power management and interface ICs, the two other major SLIC product categories.
Over the past few years Analog Devices has become a major supplier of digital signal processing ICs, or DSPs.
They provide both general-purpose DPSs and system-level ICs, which integrate analog and digital signal
processing technology to provide highly integrated solutions to leading manufacturers of communications,
computer and high-end consumer products. ADI provides system-level ICs that do not require DSP for selected
applications in markets such as automatic test equipment.
2-47
Analog Devices
North American Company Profiles
Management
Ray Stata
Jerald G. Fishman
Ross Brown
David D. French
Russell K. Johnsen
Robert R. Marshall
William A. Martin
Robert McAdam
Brian P. McAloon
Joseph E. McDonough
H. Goodloe Suttler
Franklin Weigold
Chairman
President and Chief Executive Officer
Vice President, Human Resources
Vice President and General Manager, Computer Products Division
Vice President and General Manager, Communications Division
Vice President, Worldwide Manufacturing
Treasurer
Vice President and General Manager, Standard Linear Products Division
Vice President, Sales
Vice President, Finance, and Chief Financial Officer
Vice President, Marketing, Quality, and Planning
Vice President and General Manager, Transportation and
Industrial Products Division
Products and Processes
Analog continues to develop new products such as: the ADXL202, 3.0V accelerometer; the Enhanced
AD20msp425 GSM chipset; and the Pentium® II Motherboard PC Life Guard™. ADI also offers high-performance
linear, digital, and mixed-signal ICs such as data converters, amplifiers, voltage references and comparators, signal
processors and conditioners, application-specific ICs for the consumer, disk drive, telecommunications, and
automotive industries, and temperature and accelerometer sensors.
SLICs
Analog Devices principal SLIC products are high-performance amplifiers and data converters. Other SLIC
products include analog signal processing devices, voltage references, and comparators. High-speed
products introduced in 1996 included the company’s first RF and IF SLICs, which operate at up to 2GHz. The
company continues to expand its SLIC product line to include offerings in areas where it traditionally has had
limited focus, primarily interface circuits and power management ICs, and to include a much larger number of
products designed to operate from single-supply 3-volt or 5-volt power sources.
System-Level ICs
ADI’s system-level ICs include general-purpose DSPs and multi-function devices that feature high levels of
functional integration on a single chip. All of the company’s DSPs share a common architecture and code
compatibility. The company is aggressively pursuing the 32-bit floating-point DSP market with its line of
SHARC™ products. The ADSP-21061 features high performance of 120 MFLOPS, 1M of on-chip dual-port
SRAM, and 240 Mbytes/sec I/O bandwidth.
Most of the company’s other system-level ICs are mixed-signal devices (with some incorporating a DSP core)
and special-purpose linear ICs generally designed to meet the needs of a specific application. The company
also offers sensors and surface micromachined ICs.
2-48
North American Company Profiles
Analog Devices
Assembled Products
The company’s assembled products consist of hybrids, multichip modules (MCMs), and printed-board modules
(primarily I/O modules used in industrial control and factory automation equipment).
In addition to utilizing standard bipolar and CMOS process technologies, ADI employs a number of proprietary
processes specifically tailored for use in manufacturing high-performance linear and mixed-signal SLICs and
system-level ICs.
Semiconductor Fabrication Facilities
Analog Devices meets most of its need for wafers fabricated using linear and mixed-signal processes with
company-owned production facilities and uses third-party wafer fabricators for most wafers that can be produced
on industry-standard digital processes. Its two principal foundries are Taiwan Semiconductor Manufacturing
(TSMC) and Singapore’s Chartered Semiconductor Manufacturing.
During 1995 and 1996, Analog Devices expanded its relationships with TSMC and Chartered in response to the
rapid growth of its systems IC business. These transactions included an equity investment in Chartered,
advanced payments to both Chartered and TSMC in order to secure access to future wafer capacity, and most
significantly, the announcement of a joint venture agreement with TSMC and other investors to construct and
operate a fab facility in Camas, Washington. ADI agreed to invest $140 million in the joint venture, called
WaferTech, in return for an 18 percent equity ownership and up to 27 percent of the plant’s total output.
ADI converted its company-owned fabrication facility in Wilmington, Massachusetts from 100mm to 150mm wafer
production for high-speed linear devices. In addition, ADI upgraded and modernized the fab in Sunnyvale,
California, it acquired from Performance Semiconductor in 1995.
In 1996, Analog Devices established a wafer fabrication facility in Cambridge, Massachusetts, dedicated to the
development and production of the company’s surface micromachined ICs. The fab is located in a building
previously used by Polaroid Corporation as an R&D fab.
Analog Devices, Inc.
Semiconductor Division
804 Woburn Street
Wilmington, Massachusetts 01887
Cleanroom size: 34,000 square feet
Capacity (wafers/week): 2,500
Wafer sizes: 100mm, 150mm
Processes: CMOS, BiCMOS, bipolar
Products: Linear and mixed-signal ICs, DSPs, ASICs
Feature sizes: 1.0µm CMOS
1.5µm BiCMOS, bipolar
4.0µm BiCMOS, complementary bipolar
Analog Devices, Inc.
PMI Division
1500 Space Park Drive
Santa Clara, California 95052
Capacity (wafers/week): 1,750
Wafer size: 100mm
Processes: CMOS, BiCMOS, bipolar
Products: Linear and mixed-signal ICs
Feature size: 1.5µm
2-49
Analog Devices
Analog Devices, Inc.
610 East Weddell Drive
Sunnyvale, California 94089
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 3,500
Wafer size: 150mm
Processes: BiCMOS, complementary bipolar
Products: Linear ICs
(Acquired from Performance Semiconductor in 1995).
North American Company Profiles
Analog Devices Ireland, Ltd.
Bay F-1, Raheen Industrial Estate
Limerick, Ireland
Cleanroom size: 15,000 square feet
Capacity (wafers/week): 7,000
Wafer sizes: 100mm, 150mm
Processes: CMOS, BiCMOS
Products: Linear and mixed-signal ICs, ASICs
Feature sizes: 0.6µm, 1.0µm, 2.0µm
WaferTech, LLC
Camas, Washington
Capacity (wafers/week): 7,500
Wafer size: 200mm
Process: CMOS
Products: Foundry
Feature sizes: 0.25µm, 0.35µm
(Joint venture between TSMC, Analog Devices, Altera,
and ISSI. ADI owns 18 percent. Scheduled to begin
operations in late 1998).
Analog Devices has its own test and assembly facilities located in California, Massachusetts, North Carolina,
Ireland, the Philippines, and Taiwan.
Key Agreements
• In March 1998, Analog Devices announced an agreement with Pacific Microsonics to include its HDCD®
Process technology on the ADSP-21061 SHARC® 32-bit digital signal processor (DSP), to result in the
industry’s first 32-bit HDCD decoder.
• In March 1998, ADI and Aware, Inc. announced an expanded strategic partnership for asymmetric digital
subscriber line (ADSL) and DSL Lite chipset development. Under the new relationship, ADI will receive
broader access to Aware’s technology and software, which will allow ADI to directly provide complete software
and silicon support to its customers.
• In early 1997, Analog Devices licensed TEMIC Semiconductors its ADSP-21020 DSP architecture. TEMIC will
build radiation-tolerant versions of the high-performance 32-bit floating-point DSP.
•
In October of 1997, SST and Analog Devices, Inc. (ADI) announced a licensing agreement to use SST’s
SuperFlash™ technology in a variety of ADI products.
• ADI licensed its ADSP-21xx 16-bit digital signal processor core to AMD and Acer Laboratories (Taiwan) in early
1996. AMD will embed the core in communications-related ICs and Acer Labs will use it for future PC telephony
and telephone-answering devices.
2-50
North American Company Profiles
Analog Devices
• Analog Devices announced a license agreement with Hitachi in February 1996, for Hitachi’s 16-bit
microprocessor H8/300H core. ADI also has the option of licensing Hitachi’s next-generation H8S/2000 core.
The core will be used by ADI’s Wireless Communications Division.
• In early 1996, Aspec Technology licensed to Analog Devices its high-density ASIC architectures. The
agreement includes Aspec’s family of embedded array and standard cell architectures, as well as associated
design tools.
• Analog devices entered an agreement with Noise Cancellation Technologies Inc. (NCT) to provide design and
foundry services for NCT's first line of custom chipsets.
• Analog Devices is working with DSP Group to provide DSP Group's TrueSpeech voice compression
technology on ADI's digital signal processors.
• Analog Devices has an alliance with IBM in the joint design, production, and marketing of mixed-signal and RF
ICs based on IBM's silicon-germanium (SiGe) process technology.
• Analog Devices is developing surface micromachined accelerometers with Delco Electronics (now Delphi) and
Lockheed-Martin for both defense and commercial applications.
2-51
Aptos
North American Company Profiles
APTOS S EMICONDUCTOR CORPORATION
Aptos Semiconductor Corporation
2254 North First Street
San Jose, California 95131
Telephone: (408) 474-3000
Fax: (408) 474-0445
Web Site: www.aptos.com
Email: info@aptos.com
Fabless IC Manufacturer
Founded: 1993
Regional Offices/Representative Locations
Northeast/West U.S.:
Aptos – Boca Raton, Florida
Telephone: (561) 883-7969 • Fax: (561) 883-7970
Southeast/Central U.S.:
Aptos – Raleigh, North Carolina
Telephone: (919) 870-0525 • Fax: (919) 870-0472
France:
Axess Technology – Cedex, France
Telephone: (33) 1-4978-9494 • Fax: (33) 1-4978-0324
Italy:
Newtek Italia S.P.A. – Milano, Italy
Telephone: (39) 02-469-2156 • Fax: (39) 02-469-2156
Israel:
El-Gev Electronics, Ltd. – Tirat-Yehuda, Israel
Telephone: (972) 3-971-2056 • Fax: (972) 3-971-2407
Employees: 12
Ownership: Privately held.
Company Overview and Strategy
Aptos Semiconductor Corporation designs high-performance integrated circuits, targeted for the
telecommunications, networking instrumentation, and computer markets. Aptos Semiconductor addresses the
communication equipment market needs for faster equipment and increased bandwidth by combining its
expertise in high-speed circuit design, with their proprietary design software, and state-of-the-art wafer processes.
The company was founded in 1993, and introduced its first product, a 256K R\SRAM, in 1994. Since that time,
Aptos has introduced SRAMs in the following organizations: 32K x 8, 128x 8, 256K x 4, 64K x 16, 64K x 18. The
first memory module using Aptos products was introduced in early 1995. The first non-memory product, the
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Aptos
North American Company Profiles
Network Associative Processor, was announced in the third quarter of 1997. Aptos was profitable in 1995, not
profitable in 1996.
Products and Processes
Aptos has developed a broad family of high-speed SRAMs with performance specifications that are the fastest and
lowest power for their size and organization. The products come in organizations that are 4-, 8-, 16-bits wide and
are available in 256K, 1M at 5V, and 1M and 4M densities at 3.3V operating voltage. The family is available in a
wide range of packages designed to fit various equipment requirements. All SRAMs are designed using wafers
processed with line widths of 0.5 microns or smaller.
In the area of specialty memories, Aptos offers customers a broad line of synchronous and asynchronous FIFOs.
All memory products are available to be placed on modules for space-conscience customers. FIFOs are available
in x9, x18, x36 and BiFIFO configurations.
Aptos has developed a core processor technology that can search large databases in a minimum number of clock
cycles, or at extremely fast rates. This core technology is known as an Associative Processor. Specific processors
for different market applications are being developed using this core technology. The first family of products using
the Associative Network Processor is for network systems, such as switches, bridges, and routers, and is called
Network Associative Processors (NAP). The NAP circuits are programmable, reconfigurable protocols including
100Mbit Ethernet, Gigabit Ethernet, Token Ring and ATM.
Semiconductor Fabrication Facilities
Aptos has established good relationships with several pure-play wafer foundries with state-of the-art wafer
processes and wafer sizes.
One of Aptos’ key foundry partners is Taiwan Semiconductor Manufacturing
Corporation, based in Hsin-Chu, Taiwan.
2-53
Array Microsystems
North American Company Profiles
ARRAY MICROSYSTEMS
Array Microsystems, Inc.
987 University Avenue, Suite 6
Los Gatos, CA 95030
Telephone: (408) 399-1505
Fax: (408) 399-1506
Web Site: www.array.com
Email: support@array.com
Fabless IC Supplier
Employees: 41
Company Overview and Strategy
Array Microsystems, a privately-held company, was founded in 1991 to design, develop, and market highperformance digital signal processing (DSP) products with a focus on video compression technologies and
system level designs for multimedia applications. Array’s mission is to become the leading supplier of turnkey
MPEG video encoding board solutions for personal computers (PCs).
Management
Paul Smith
Surendar S. Magar, Ph.D.
Tom Kopet
E. Flint Seaton
Shannon Shen, Ph.D.
Roger Westberg
Jim Larkin
President and Chief Executive Officer
Founder and Chief Technical Officer
Vice President, Systems Technology
Vice President and Chief Financial Officer
Vice President, IC Technology
Vice President, Sales and Marketing
Vice President, Operations
Products and Processes
Array Microsystems has developed a complete line of processor and controller ICs, SRAM memory modules,
software simulators, and processor boards. The company's first product family, the a66, includes proprietary VLSI
chipsets, development tools, and array processor boards that set industry performance standards for frequency
domain processing. Array's two-chip video compression chipset, based on unique vector data flow architecture,
forms the core of the VideoFlow product family. One of the chips is called an image compression coprocessor
(ICC) and the other a motion estimation coprocessor (MEC).
Semiconductor Fabrication Facilities
Array Microsystems is a fabless IC supplier. The company's devices are produced by other companies, including
Samsung and Atmel.
2-54
North American Company Profiles
Array Microsystems
Key Agreements
• Array Microsystems has a technology development pact with Samsung that provides Array with a strong
foundry partnership. The two companies codeveloped the initial VideoFlow video compression technology.
The deal provides Array with access to Samsung's advanced 0.5µm and 0.35µm CMOS fab capacity for the
manufacture of its products. In 1993, Samsung secured a 20 percent equity ownership position in Array
Microsystems, and in mid-1995, Samsung increased its stake to 37 percent.
2-55
Aspec Technology
North American Company Profiles
ASPEC TECHNOLOGY
Aspec Technology, Inc.
830 East Arques Avenue
Sunnyvale, CA 94086
Telephone: (408) 774-2199
Fax: (408) 522-9450
Web Site: www.aspec.com
Email: info@aspec.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends November 30
Sales
Net Income
1996
15
3
1997
22
2
Employees
—
127
Ownership: Publicly held. NASDAQ: ASPC.
Company Overview and Strategy
Founded in 1991, ASPEC Technology Inc. provides designs and design implementation tools to ASIC vendors,
IC companies and system houses. Customers include: AMD, Hyundai, National Semiconductor, Samsung,
Winbond and Yamaha.
These tools are used with process technologies ranging from 0.8 micron to 0.25 micron.
Management
Dr. Conrad Dell’Oca
Mitchell Bohn
Jai Shin
Patrick Y.C. Yin
Yen C. Chang
Jim Behrens
Charles Kummeth
Edward Wan
2-56
President and Chief Executive Officer
Chief Operating Officer
Executive Vice President
Senior Vice President
Senior Vice President, Engineering
Vice President, Business Development
Vice President, Marketing
Vice President, Design Services
North American Company Profiles
Aspec Technology
Key Agreements
In April 1998, Aspec Technology acquired SIS Microelectronics, Inc. in exchange for the issuance of an aggregate
of 400,000 shares of common stock. SIS Microelectronics is an engineering design services company that has
approximately 20 employees. The acquisition will expand Aspec’s engineering design services capacity.
2-57
Atmel
North American Company Profiles
ATMEL
Atmel Corporation
2325 Orchard Parkway
San Jose, California 95131
Telephone: (408) 441-0311
Fax: (408) 436-4200
Web Site: www.atmel.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Atmel Japan K.K. • Chuo-ku, Tokyo, Japan
Telephone: (81) (3) 3523-3551 • Fax: (81) (3) 352-7581
Europe:
Atmel U.K. Ltd. • Camberley, Surrey, England
Telephone: (44) (1276) 686677 • Fax: (44) (1276) 686697
Asia-Pacific:
Atmel Asia, Ltd. • Kowloon, Hong Kong
Telephone: (852) 2721-9778 • Fax: (852) 2722-1369
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
140
14
18
14
1993
222
30
26
74
1994
375
59
43
183
1995
634
114
70
270
1996
1,070
202
110
400
1997
958
1.8
138
315
998
1,250
1,900
2,900
3,900
4,150
Ownership: Publicly held. NASDAQ: ATML.
Company Overview and Strategy
Atmel designs, manufactures, and markets a broad array of high-performance CMOS memory, logic, and analog
integrated circuits. Founded in 1984, the company serves the manufacturers of communications equipment,
computers, and computer peripherals as well as producers of instrumentation, consumer, automotive, military, and
industrial equipment. Many of Atmel's ICs are based on its proprietary non-volatile memory technology. The
company's name was derived from Advanced technology: memory and logic.
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North American Company Profiles
Atmel
Atmel is a leading supplier of EPROM, EEPROM, and flash memory components. Nevertheless, the company is
shifting its focus away from being primarily a memory company toward having a balanced portfolio of memory and
logic products. Still, the company hopes to continue expanding its share of the memory market even as logic
products take over a larger share of its production capacity.
Atmel has made several acquisitions over the past few years in support of its core product lines, non-volatile
memory and logic ICs. The company bought out FPGA supplier Concurrent Logic in 1993, acquired Seeq
Technology's EEPROM product line in early 1994, and made a minority investment in SRAM producer Paradigm
Technology in 1995, in return for certain SRAM product rights. In 1996, Atmel acquired an 8-bit RISC
microcontroller architecture and design team from Nordic VLSI in Trondheim, Norway. Also in 1996, the company
acquired DSP architecture and development from an organization called TCSI in Berkeley, California.
The company’s most substantial acquisition came in April 1995, when it purchased a majority interest (75 percent)
in the French IC manufacturer ES2. By the end of 1995, Atmel increased its ownership of the company to more
than 90 percent and renamed it Atmel-ES2. Atmel expanded Atmel-ES2’s existing fab facility and constructed a
new 0.35µm, 200mm wafer fab.
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Atmel
North American Company Profiles
Management
George Perlegos
Gust Perlegos
Tsung-Ching Wu
Bernard Pruniaux
Chih Jen
Ralph Bohannon
Kris Chellam
James Hu
B. Jeffrey Katz
Ken Kwong
Krish Panu
Steve Schumann
Mikes Sisois
Graham Turner
Tashiki Wada
Chairman, President, and Chief Executive Officer
Executive Vice President and General Manager
Executive Vice President, Technology
Chief Executive Officer, Atmel-ES2 Operations
Senior Vice President and General Manager, Asian Operations
Vice President, Manufacturing
Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Process Development
Vice President, Marketing
Vice President, North American Sales
Vice President, MCU, PLD, FPGA Operations
Vice President, Non-Volatile Products
Vice President, Planning and Information Systems
Vice President, European Operations
Vice President, Atmel Japan
Products and Processes
Atmel's products are outlined below.
NonVolatile Memory ICs
• EPROMs — Standard, high-speed, and low-voltage parts ranging in density from 256K to 8M.
• EEPROMs — Serial-interface parts ranging in density from 1K to 1Mb.
— Parallel-interface parts ranging in density from 4K to 4M.
• Flash memories — Single voltage supply (5V or 2.7V) parts ranging in density from 256K to 8M.
Programmable Logic Devices and Field Programmable Gate Arrays
• PLDs — Generic PAL-type ICs including fast, low-power, and 3V flash-based versions of the standard 22V10,
16V8, and 20V8.
— Complex PLDs with densities to 10,000 gates.
• FPGAs — SRAM-based devices with 2,000 to 40,000 usable gates and very low power. Partial or full
reconfiguration, in system, during normal operation.
ASIC Devices
• Gate arrays — High speed with up to 1.2 million routable gates.
• RFID ASICs — Analog, digital, and memory on a single-chip ASIC.
• Cell based ASICs — Mixed-technology (Digital, Analog, NVM).
Other Products
• Microcontrollers — Combine Intel's 80C51 core logic or Atmel’s proprietary AVR 8-bit RISC core logic with
1KB to 128KB of Atmel's flash memory, and 256 Bytes - 2KB of EEPROM.
• Standard logic devices — Multimedia system, controllers/chipsets.
• Flash memory cards.
• Spread spectrum cordless phone chipset.
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North American Company Profiles
Atmel
Atmel uses proprietary CMOS and BiCMOS technologies for the processing of its chips. Most products are
produced with 0.6µm and 0.5µm line widths. The company's newest Colorado Springs fab facility is capable of
producing ICs with 0.35µm feature sizes, as is the newest fab in Rousset, France.
Semiconductor Fabrication Facilities
Atmel announced plans to build its next sub-half micron CMOS wafer fab facility, to be called Fab 8, adjacent to its
existing Colorado Springs, Colorado facilities. The facility will house a 75,000 square-foot cleanroom.
Atmel Corporation
1150 East Cheyenne Mountain Boulevard
Colorado Springs, Colorado 80906
Telephone: (719) 567-3300
Fab 3
Cleanroom size: 33,900 square feet (Class 10)
Capacity (wafers/week): 7,250
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: EEPROMs, EPROMs, flash memories,
PLDs, FPGAs, ASICs, MCUs, linear ICs.
Feature sizes: 0.5µm, 0.8µm, 1.0µm
Atmel Corporation
1150 East Cheyenne Mountain Boulevard
Colorado Springs, Colorado 80906
Telephone: (719) 567-3300
Fab 5
Cleanroom size: 43,000 square feet (Class 1)
Capacity (wafers/week): 9,000
Wafer size: 150mm
Process: CMOS
Products: EEPROMs, flash memories, EPROMs, logic.
Feature size: 0.35µm
Atmel-ES2
Zone Industrielle
13106 Rousset Cedex
France
Telephone: (33) (4) 42-33-40-0
Fab 6
Cleanroom size: 15,000 square feet
Capacity (wafers/week): 2,000
Wafer size: 150mm
Process: CMOS
Products: Cell-based ASICs, MCUs
Feature sizes: 0.6µm, 0.8µm, 1.0µm
Atmel-ES2
Zone Industrielle
13106 Rousset Cedex
France
Telephone: (33) (4) 42-33-40-0
Fab 7
Cleanroom size: 60,000 square feet
Capacity (wafers/week): 7,000 (at full equipment ramp)
Wafer size: 200mm
Process: CMOS
Products: Cell-based ASICs, MCUs, flash memories
Feature sizes: 0.25µm, 0.35µm, 0.6µm
Atmel maintains a facility for IC test and qualification at its headquarters in San Jose and assembly work is
performed offshore.
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Atmel
North American Company Profiles
Key Agreements
• Atmel licensed “Oak” and “Pine” DSP core logic and development tools from DSP Group in 1996.
• Atmel-ES2 licensed from Advanced RISC Machines in mid-1995, the ARM7DMI 32-bit RISC processor core
and associated software tools. The company will develop standard Flash-based MCUs using this architecture.
• Atmel has a cross-licensing and product exchange agreement with Philips Semiconductors covering several of
each company's proprietary PLDs.
• Atmel established an agreement with Wireless Logic Inc. of Hong Kong in 1994 that calls for the
codevelopment and joint marketing of special-purpose DSP and microcontroller chipsets for the spreadspectrum wireless communications market.
• Atmel and Poloroid established an agreement in 1997 to co-develop CMOS image sensing and color
processing and image storage chipsets.
• Atmel acquired the intellectual property assets and development processes of Nordic VLSI in 1995, and has
developed the AVR 8-bit RISC MCU family in the resulting Atmel-Norway design center.
• Atmel acquired the intellectual property assets and development resources of Fincitec in 1997, and is
developing mixed technology MCU products in the resulting Atmel-Finland design center.
• Atmel acquired the intellectual property assets and development resources of Digital Resource Electronics
Acoustic Music (DREAM) in 1996, and has developed the DREAM™ family of Music Synthesizer products in
the resulting Atmel-Dream design center in France.
• Atmel acquired digital signal processing intellectual property assets and a development team, from
Telecommunications Systems, Inc. (TCS) in 1996, and is developing wireless communications chipsets in the
resulting Atmel-Berkely design center.
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Auctor Corp. / ACC Microelectronics Corp.
North American Company Profiles
AUCTOR CORPORATION / ACC MICROELECTRONICS
CORPORATION
Auctor Corporation / ACC Microelectronics Corporation
2401 Walsh Ave., 2 nd Floor
Santa Clara, California 95051
Telephone: (408) 980-0622
Fax: (408) 980-0626
Web Site: www.auctorcorp.com & www.accmicro.com
Fabless IC Supplier
Founded: 1987
Company Overview and Strategy
Auctor Corporation is a leading manufacturer of Windows-based connectivity products for computer,
communication and consumer applications. The company’s strength is in creating single chip system controller
solutions, which formally trademarked the term Single Chip Solution. Auctor Corporation gained its reputation
being the first in creating single chip system controller solutions for 16-, 32- and 64-bit x86 portable system
designs.
ACC Microelectronics is a leading manufacturer of Low Power Logic (LPL) controller chips for a variety of VLSI
circuit devices in computer system control, computer system board integration, and communication applications.
Management
Wei-Tau Chiang, Ph.D.
Mark Shieu
President and Chief Executive Officer
Vice President, Engineering
Products and Processes
The Auctor companies provide chipsets and controller chips for 386/486-based and Pentium-based computers.
Other products include buffer chips, power management chips, peripheral controllers, and mixed-signal chips.
Auctor is a leader in the production of connectivity products. Options include memory controllers, advanced
power management controllers, floppy disk controllers, parallel ports, keyboard and mouse controllers, LCD
controllers, integrated peripheral controllers, and advanced connectivity products.
The Maple Engine, a trademark of Auctor Corporation, is an ultra-integrated 486 based “system-on-a-chip” that
will provide software and hardware capabilities and versatility for multimedia electronics and embedded solutions
as well as a single chip processing engine for the sub-subnotebook and micro-notebook markets. Other products
include the ACC2089, which is a 486 Super Chip Solution with highly integrated PCI-based system design
features, and the ACC2051 (Pentium-class counterpart) are also for embedded and portable systems
applications.
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Auctor Corp. / ACC Microelectronics Corp.
North American Company Profiles
Auctor offers products for consumer and industrial applications: the “Memphis” connectivity controller, the
DataLink Processor and the ACC 3350 Ultra Fast controller/ACC 3360 Ultra Wide SCSI controller. These products
provide high performance solutions for data intensive applications such as video conferencing, on-demand
interactive entertainment by implementing multimedia connectivity with consumer devices such as set-top boxes,
VCRs, DVD, camcorders, digital cameras, HDTVs, hard disks, printers and scanners.
Semiconductor Fabrication Facilities
Auctor works with world class, quality foundry partners.
ACC Micro has second-source licensing agreements with Motorola to support delivery schedules.
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Audio DigitalImaging Inc
North American Company Profiles
AUDIO DIGITAL IMAGING INC . (ADI)
Audio DigitalImaging Inc.
511 West Golf Road
Arlington Heights, Illinois 60005
Telephone: (847) 439-1335
Fax: (847) 439-1533
Web Site: www.adi.net
Fabless IC Supplier
Founded: 1989
Ownership: Publicly held. NASDAQ: ADIKF and VSE: ADH.
Company Overview and Strategy
Audio DigitalImaging Inc., a subsidiary of ADI Technologies, Inc., specializes in the design and development of ICs
for digital video and audio compression multimedia components. ADI chip components are designed for use in
PC printed circuit boards, add-in PC boards and other multimedia products including television set-top receiver
boxes, digital TVs and DVD players.
Products and Processes
ADI has developed a unique “system-on-chip” design within a family of ASIC components, Apogee&trade. ADI’s
MPEG chip technology incorporates many system management features, such as system transport layer
management, and into all of its Apogee&trade products which eliminate the need to use multiple external chip
components or firmware. ADI expects to introduce its MPEG video and audio decode-only chips, the Apogee D-1
and D-2, in 1998.
The ADI MPEG Audio Player (AMAPLAY) is a full featured, high quality 32-bit MPEG audio player for use with
Windows 95 and NT. AMAPLAY was optimized for MPEG sound quality. AMAPLAY is representative of the audio
quality that is used in the Apogee Series of MPEG ASICs. Features full stereo playback support; decodes and
plays MPEG1, MPEG2, layer 1 and layer 2 audio files; auto re-sync on corrupt MPEG audio streams; supports fast
forward and rewind; and slide bar can be dragged forward or reverse, even while player is decoding.
Semiconductor Fabrication Facilities
ADI Inc.’s fabrication and production services are provided by IBM.
Key Agreements
• ADI and Cadence Design Systems have established a long-term business agreement that validates ADI’s
algorithmic solutions and methodologies.
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Aureal Semiconductor
North American Company Profiles
AUREAL S EMICONDUCTOR
Aureal Semiconductor
4245 Technology Drive
Fremont, CA 94538
Telephone: (510) 252-4400
Fax: (510) 252-4400
Web Site: www.aureal.com
Email: info@aureal.com
Fabless IC Supplier
Founded: 1995
Financial History ($000s), Fiscal Year Ends December
Sales
Net Income (loss)
R&D Expenditures
Capital Expenditures
Employees
1995
47,474
(103,833)
6,730
277
1996
3,485
(17,020)
6,231
590
1997
1,640
(17,690)
7,425
881
—
—
81
Ownership: Publicly held. AURL (OTC Bulletin Board).
Company Overview and Strategy
Aureal develops and markets advanced audio semiconductor and software solutions. Applications for Aureal’s
digital audio technology include PCs, consumer devices, and sound studios.
Aureal has progressed in setting the 3D audio standard for future PC platforms by licensing its A3D Interactive
audio technology to several leading PC audio manufacturers (including Diamond Multimedia, S3, LSI Logic, Cirrus
Logic, Rockwell International, Analog Devices and Oak Technology), and providing support to world-class game
and Internet software developers (such as Activision, LucasArts, Electronic Arts, Psygnosis, Acclaim, GT
Interactive, Terratec Electronic GmbH, Dell Computer, and Interplay).
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Aureal Semiconductor
North American Company Profiles
Aureal’s strategy to be a leading supplier of advanced audio solutions to the consumer electronics and PC markets
is supported by their continuing development. Rather than burdening the audio device with the entire
computational task related to audio, the audio accelerator is developed to be used in conjunction with the
computing power of the general-purpose host CPU. The audio accelerator only provides enough additional
computational power to significantly off-load the main CPC while providing baseline audio performance which
would completely overwhelm the main CPU if delivered through software alone. Aureal is developing devices
targeted to the consumer marketplace which provide lower system cost through integration of digital, analog and
other audio system functions. The existing VSP901 provides Surround Sound quality through a two speaker
presentation. Further products under development address Dolby Digital media, and provide integration of
various components of the audio sub-system of consumer market products.
Revenues for 1997 totaled $1.6 million resulting primarily form technology licensing transactions, with
approximately 10 percent coming from semiconductor sales. Aureal’s products are sold via local sales
representatives and distributors throughout North America, Europe and Asia.
Management
Kip Kokinakis
Scott Foster
Gary Catlin
Suryanarayana “Murty” Cheruvu
David Domeier
Michael Hunter
Sanjay Iyer
Brendan O’Flaherty
Toni Schneider
President, Chief Executive Officer and Director
Chief Technical Officer
Vice President, Engineering
Vice President, Manufacturing Operations
Vice President, Finance and Chief Financial Officer
Vice President, Sales
Vice President, PC Products
Vice President, Consumer Electronics
Vice President, Advanced Audio Products
Products and Processes
Aureal’s A3D technology is a high quality digital audio technology that enables real-time interaction where sounds
emanate from multiple sources or locations, and follow the user’s movement throughout three dimensional space,
for PC and dedicated gaming platforms. A3D Interactive technology provides surround playback, through
speakers, of pre-recorded media in the home theater and PC environments without the need for five- or sixspeaker setups. Aureal has licensed these technologies to various semiconductor and OEM customers.
Aureal’s semiconductor devices include.
• “Vortex” PCI-based AC’97 Digital Audio Accelerator (AU8820);
• A3D Dolby Pro Logic virtual surround processor (VSP901); and
• Music and effects processor (ASP301).
Semiconductor Fabrication Facilities
Aureal contracts with independent silicon foundries for production of its semiconductor products.
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Aureal Semiconductor
North American Company Profiles
Key Agreements
•
In July 1998, Aureal Semiconductor and Diamond Multimedia Systems Inc. announced a major strategic
alliance to co-develop and market next-generation PC audio solutions for the PC consumer and game markets.
•
Aureal Semiconductor has licensing agreements with Compaq Computer, Yamaha Corporation, Zoran
Corporation, LSI Logic Corporation, S3 Incorporated, ATI Technologies Inc., and Analog Devices for its A3D
Surround technology.
•
In May 1996, Aureal acquired 100 percent ownership of Crystal River Engineering, Inc., a leader in the field of
3D audio technology. This merger has enabled Aureal to offer hardware and software solutions for 3D audio
presentation. Total recorded cost of the merger was $6.4 million.
•
In August 1995, the Company announced that it was divesting its multimedia components business to
implement a business plan based on development and sale of software and semiconductor solutions providing
advanced audio for the PC and consumer electronics markets. In conjunction with the Company’s change in
business, it formally changed its name to Aureal Semiconductor Inc.
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Austin Semiconductor
North American Company Profiles
AUSTIN S EMICONDUCTOR
Austin Semiconductor, Inc.
8701 Cross Park Drive
Austin, Texas 78754
Telephone: (512) 339-1188
Fax: (512) 835-8358
Web Site: www.austinsemiconductor.com
Fabless IC Supplier
Financial History ($M)
Sales
Employees
1993
7
1994
14
1995
19
1996
21
1997
25
60
110
114
150
150
Ownership: Privately held.
Company Overview and Strategy
Austin Semiconductor, Inc. (ASI) was founded in 1988 to supply high-reliability semiconductors and microcircuit
devices to the military and aerospace industries. In 1993, ASI acquired the Micron Semiconductor Military
Products Group, and now supplies standard memory chips to those industries.
The company's business is currently divided into two distinct groups: a custom product line and a standard
product line (consisting primarily of the former Micron products). At the end of 1997, about 70 percent of ASI's
business was in memory products, with the balance in custom products.
Management
Roger C. Minard
H. Donald Ludwig
Marty Lanning
Ed Walker
Chief Executive Officer
President
Vice President, Marketing
Director, Sales
Products and Processes
ASI's standard IC products include: 64K to 16M DRAMs, 64K to 4M SRAMs, and 1M VRAMs, as well as
EEPROMs, flash memories, and SCSI interface processors. ASI also has the right to introduce military-grade
versions of Micron's new products as they are brought out.
2-69
Austin Semiconductor
North American Company Profiles
ASI's custom product capabilities include testing and packaging of a wide array of custom memory products,
including DRAMs, SRAMs, EEPROMs, and flash memories, interface devices, and analog/digital communications
products. ASI also offers devices manufactured using a silicon-on-sapphire (SOS) process.
Semiconductor Fabrication Facilities
ASI is a fabless IC supplier, but maintains a Class 100 assembly, packaging, and test facility on site. As part of its
purchase of Micron's military products group, ASI receives wafers from Micron. The firm also uses other major
manufacturers for the fabrication of its product wafers.
2-70
Benchmarq
North American Company Profiles
BENCHMARQ MICROELECTRONICS
Benchmarq Microelectronics, Inc.
17919 Waterview Parkway
Dallas, Texas 75252
Telephone: (972) 437-9195
Fax: (972) 437-0581
Web Site: www.benchmarq.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1994
23
2
—
1995
29
4
2
1996
40
7
3
1997
44
7
3
—
180
235
221
Company Overview and Strategy
Benchmarq Microelectronics, founded in 1989, has a worldwide presence in the power-sensitive and portable
electronic systems marketplace. It provides integrated IC and module solutions that address real-world problems
in managing battery-operated, low-power, and power-sensitive equipment. Benchmarq's products are adopted
by companies producing PCs, cellular phones, telecommunications equipment, and portable electronics systems.
In 1997, international sales accounted for approximately 60 percent of total sales.
Management
Derrell Coker
Al Schuele
Jim Vernon
Will Davies
David Heacock
Loren Reifsteck
Eric Smith
Gene Armstrong
David Freeman
Scott Schaefer
Chairman
President and Chief Executive Officer
Vice President, Sales
Vice President, Product and Market Development
Director, Marketing and Corporate Communications
Director, Quality Technology and Assurance
Director, Manufacturing Operations
Director, Product Development
Director, Applications Engineering
Chief Financial Officer
2-71
Benchmarq
North American Company Profiles
Products and Processes
Benchmarq's product portfolio consists of CMOS and BiCMOS mixed-signal circuits. The focus is on low-power,
battery-backed ICs and ICs for battery management. Geometries on its devices range from 0.8µm to 1.2µm.
Benchmarq’s IC product families include:
• Battery management ICs and modules that provide fast charge control, sophisticated battery conditioning, and
“gas gauge” capacity monitoring of many different types of battery-operated systems.
• Real-time clock ICs and modules, which provide highly integrated clock/calendar solutions for microcomputerbased designs. The RTCs are available with 3V or 5V operation.
• Nonvolatile SRAM (nvSRAM) ICs in densities ranging from 64K to 16M.
• Nonvolatile controller ICs and modules that provide power monitoring, write protection, and supply switching to
convert standard SRAM and a battery backup into a reliable, predictable nonvolatile memory.
Semiconductor Fabrication Facilities
The company is fabless, relying instead on domestic and overseas foundries for wafer fabrication. Burn-in and test
of ICs and value-added assembly of hybrid circuits is performed at the company's headquarters in Texas.
Key Agreements
•
In March 1998, Unitrode announced that it had signed a definitive agreement to merge with Benchmarq
Microelectronics, Inc. On April 17, 1998 – Unitrode and Benchmarq jointly announced that on April 15, 1998,
the waiting period under the Hart-Scott-Rodino Antitrust Improvements Act expired. The merger remains
subject to the approval of the shareholders of both companies and the satisfaction of other customary closing
conditions.
2-72
Bright Microelectronics
North American Company Profiles
BRIGHT MICROELECTRONICS
Bright Microelectronics, Inc.
1012 Stewart Drive
Sunnyvale, CA 94086
Telephone: (408) 738-8830
Fax: (408) 738-8666
Web Site: www.brightflash.com
Email: info@brightflash.com
Fabless IC Supplier
Company Overview and Strategy
Bright Microelectronics, Inc. (BMI) was founded in 1991 to provide high-density, non-volatile flash memory that
operates on a single low-voltage power supply. BMI serves the telecommunications, computers and consumer
electronics markets. Bright designs, produces, and markets single low voltage products ranging from 1 Megabit to
16 Megabit densities.
Products and Processes
BMI’s patented technology is based on a split-gate cell which features source-side electron injection during the
programming. A 3 micron square cell size is achieved by a contactless array architecture using a 0.6 micron
technology.
The company presently has seven U.S. patents on flash technology.
BMI features three basic types of products: AMD Compatible; Application Specific; and Chipset Solutions.
In 1993, BMI developed 0.8µm technology with Sharp. In 1994, BMI developed 0.6µm technology with Hyundai.
In 1995, BMI developed 0.6µm 3V technology with Ricoh. In 1996, BMI transferred 0.6µm technology to
Winbond. In 1997, BMI started 0.35µm product developments.
BMI has partnerships with Ricoh – Advanced Technology/3.5V Flash; Winbond – Flash Memory Manufacturing;
Hyundai – Flash Memory Manufacturing; and ISD – Multilevel Digital Storage.
2-73
Broadcom Corporation
North American Company Profiles
BROADCOM CORPORATION
Broadcom Corporation
16251 Laguna Canyon Road
Irvine, California 92618
Telephone: (714) 450-8700
Fax: (714) 450-8710
Web Site: www.broadcom.com
Email: info@broadcom.com
Fabless IC Supplier
Founded: 1991
Regional Offices/Representative Regions
North America: Broadcom Corp. • San Jose, California
Telephone: (408) 501-7825 • Fax: (408) 918-0307
Broadcom Corp. • Garwood, New Jersey
Telephone: (908) 233-8308 • Fax: (908) 233-9421
Broadcom Corp. • Duluth, Georgia
Telephone: (770) 232-0018 • Fax: (770) 232-0211
Asia:
Broadcom Corp. • Albany, Singapore
Telephone: (65) 251-0388 • Fax: (65) 356-1898
Europe:
Broadcom Corp. • Zeist, Netherlands
Telephone: 31 (30) 6930350 • Fax: (31) 30-6930056
Broadcom Corp. • South Yorkshire, United Kingdom
Telephone: (44) 1709-579770 • Fax: (44) 1709-579771
Financial History (000s), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
1,138
12
875
—
1994
3,636
237
1,746
—
1995
6,107
4
2,687
1,112
1996
21,370
3,016
5,662
3,747
—
—
—
164
Ownership: Publicly held. NASDAQ: BRCM.
2-74
1997
36,955
1,173
16,204
7,132
As of 6/98
378
North American Company Profiles
Broadcom Corporation
Company Overview and Strategy
Broadcom Corporation is a leading supplier of system-level silicon solutions for the high-speed data
communications market. The Company’s highly integrated digital and mixed-signal CMOS chips are for cable-TV,
cable modem, local area network, digital broadcast satellite, XDSL and digital radio applications.
Management
Dr. Henry T. Nicholas
Dr. Henry Samueli
William J. Ruehle
Tim M. Lindenfelser
Aurelio Fernandez
Martin Colombatto
Vahid Manian
David Dull
President, Chief Executive Officer and Founder
Chief Technical Officer and Vice President of Research and Development
Vice President and Chief Financial Officer
Vice President, Marketing
Vice President, Worldwide Sales
Vice President/General Manager, Networking Business Unit
Vice President of Manufacturing Operations
Vice President of Business Affairs and General Counsel
Products and Processes
Broadcom’s product line consists of: High-Speed Networks, Cable-TV and Cable Modem, XDSL and Direct
Broadcast Satellite. The Company uses proprietary communication building blocks to develop standard and
customer-specific products. Broadcom has developed a suite of silicon compilers that integrate with customers’
Verilog HDL and VHDL designs, using a specialized VLSI design methodology. These silicon compilers consist of
digital filters, adaptive equalizers, modulators and demodulators, numerically-controlled oscillators, frequency
synthesizers, A/D converters, D/A converters.
Broadcom Corporation’s QAMLink® product line consists of 64/256 QAM downstream demodulators and
modulators, QPSK 16-QAM upstream burst demodulators and modulators and 16/64-QAM, ADSL/VDSL
transceivers. These digital transmission devices are used in digital set-top boxes, cable data modems and twistedpair XDSL modems.
The Company’s high-speed networking product lines are 10/100Base-T transceiver and repeater devices for FastEthernet applications. These high-speed LAN devices are in line cards, hubs, switches, test equipment and
routers. Broadcom also develops custom chips for digital broadcast satellite and digital radio equipment.
Broadcom’s products are detailed below.
High-Speed Networks
The products in this category include single-chip Fast-PHY transceivers; a Quad-PHY transceiver; a Fast-Ethernet
Transceiver that incorporates four entire transceivers into a monolithic CMOS chip; 13-port Fast-Ethernet
Repeater Controller; and a five port Integrated 100BASE-TX Repeater that integrates four 100BASE-TX
transceivers, an MII port, and a five port repeater controller into a single monolithic CMOS chip.
2-75
Broadcom Corporation
North American Company Profiles
Cable-TV and Cable Modem
The cable-TV and cable modem product lines consist of a QAMLink demodulator; two types of QAMLink Upstream
Burst Modulators and a QAMLink Upstream Burst Demodulator; two types of QAMLink Media Access Controllers
with 56-bit DES encryption and decryption; a QAMLink Universal Modulator with an FEC encoder and an
integrated D/A converter; a Universal QAM Modulator; and three types of QAMLink receivers.
XDSL Product
This product (BCM6010) is a QAMLink ADSL/VDSL Transceiver that incorporates a rate adaptive QAM transmitter
and receiver with FEC. Integrated features include a 4-256 QAM demodulator, 10-bit A/D and D/A converters,
Nyquist filters, acquisition and tracking loops, Reed-Solomon FEC encoder and decoder, a digital adaptive
decision feedback equalizer, and ATM Utopia Level 1 and 2 standard interfaces.
Direct Broadcast Satellite Product
The BCM4200 is a DVB/DSS® Satellite Receiver for digital satellite set-top boxes. It supports variable data rates
up to 90Mbps and is compliant with DVB and DSS standards. The features in this device include dual 6-bit A/D
converters, a phase/frequency recovery block, variable rate digital filters, square-root Nyquist matched filters,
acquisition and tracking loops, and a DVB/DSS compliant concatenated Viterbi/Reed-Solomon FEC decoder with
deinterleaver. This product provides support for DIRECTV® licensees.
Semiconductor Fabrication Facilities
The company is fabless and relies on two outside foundries, Taiwan Semiconductor Manufacturing Corporation
(TSMC) in Taiwan and Chartered Semiconductor Manufacturing in Singapore.
Substantially all of Broadcom’s products are assembled and tested by one of two third-party subcontractors,
ASAT, Ltd. in Hong Kong and ST Assembly Test Services in Singapore.
Key Agreements
•
In August 1998, MIPS Technologies, Inc. announced a strategic alliance with Broadcom Corporation.
Broadcom will incorporate MIPS Processor Architecture into its Broadband Communications semiconductors.
•
In May 1998, Broadcom announced a cooperation with Sony Corporation to develop a range of integrated
circuit products designed for use in consumer electronics products.
•
In March 1998, Broadcom and General Instruments (GI) entered into a strategic partnership for NextGeneration Digital Set-Top Terminal Silicon. GI will purchase ICs for its products from Broadcom.
2-76
Burr-Brown
North American Company Profiles
BURR -BROWN
Burr-Brown Corporation
P.O. Box 11400
Tucson, Arizona 85734-1400
Telephone: (520) 746-1111
Fax: (520) 889-1510
Web Site: www.burr-brown.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Burr-Brown Japan Ltd. • Atsugi-shi, Kanagawa, Japan
Telephone: (81) (4) 6248-4695
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
163
1
18
5
1993
169
3
20
7
1994
194
6
22
12
1995
269
29
26
18
1996
220
30
28
32
1997
252
33
34
26
Employees
1,566
1,547
1,825
1,900
1,400
1,300
Ownership: Publicly held. NASDAQ: BBRC.
Company Overview and Strategy
Founded in 1956, Burr-Brown Corporation is primarily engaged in the design, manufacture, and marketing of a
broad line of proprietary standard high-performance analog and mixed-signal ICs used in the processing of
electronic signals. The company’s products are used in applications such as electronic and medical
instrumentation, process and industrial control, communications, manufacturing automation, automatic test
equipment, consumer audio, computer peripherals, and multimedia.
Burr-Brown is expanding from its traditional focus on older IC processing technologies — primarily linear bipolar —
and adding new technologies such as CMOS, BiCMOS, BCDMOS and CBCMOS technologies. The company
has also been strategically shifting some of its production to outside foundries, a trend that is expected to
continue in order to access sub-micron CMOS technology.
2-77
Burr-Brown
North American Company Profiles
In early 1996, Burr-Brown sold its interest in Power Convertibles Corporation (PCC). PCC, formerly a majorityowned affiliate of Burr-Brown, manufactures DC-to-DC converters and battery chargers used in cellular telephone
applications. The divestiture of PCC is part of Burr-Brown’s strategic plan to build a stronger focus on its analog
and mixed-signal IC business. New product development will focus on developing standard linear ICs (SLICs) as
well as application specific standard products (ASSPs).
In 1995, Burr-Brown set new directions for its foreign operations. Burr-Brown’s Japanese development subsidiary
is now concentrating primarily on the digital audio and video and other consumer markets, while the company’s
Livingston Scotland operation has been re-directed from subcontract manufacturing to in-house product R&D.
Management
Thomas R. Brown, Jr.
Syrus P. Madavi
Scott Blouin
Michael Paugh
Michael M. Pawlik
Paul Prazak
Robert E. Reynolds
Bryan Rooney
R. Mark Stitt
Rod Lawton
Toshiyuki Yamasaki
2-78
Chairman
President and Chief Executive Officer
Vice President and Chief Financial Officer
Vice President, Quality
Vice President, Marketing
Vice President, Data Conversion Division
Vice President, Operations
Vice President, Worldwide Sales
Vice President, Linear Division
General Manager, Scotland Division
President, Japan Operations
North American Company Profiles
Burr-Brown
Products and Processes
Burr-Brown's product portfolio includes operational, instrumentation, power, and isolation amplifiers,
optoelectronic ICs, digital audio devices, digital-to-analog and analog-to-digital converters, data communications
products, LAN products, microterminals, design and development software, and board-level microcomputer
subsystems. The company’s products are manufactured using processes that include bipolar, complementary
bipolar, CMOS, and BiCMOS.
The following describes the various processes that Burr-Brown utilizes in the manufacture of its ICs.
40 Volt Bipolar Process:
This is a high-voltage (40V) bipolar process (±15V or 36V power supplies) used to make high-voltage
operational and instrumentation amplifiers. High precision in these products is made possible by the capability
of ion implanted JFETs and trimmable resistors. Other typical products made from this process are universal
active filters, isolation amplifiers, and high-voltage power amplifiers.
20 Volt Bipolar Process:
This is a lower voltage (20V) bipolar process especially suited for data acquisition and PCM components.
These are faster circuits utilizing smaller devices with lower RC. Trimmable resistors allow high precision
products.
Dielectrically Isolated Bipolar Process:
This is a dielectrically isolated high-voltage bipolar (40V) process used for low noise, high precision, and low
drift. Very high-performance amplifiers are built using this process where the noise and drift characteristics are
important, especially in the medical equipment markets that it serves.
Complementary Bipolar Dielectrically Isolated Process:
This is a dielectrically isolated process with complementary NPN and PNP bipolar transistors. It is used to
manufacture high-voltage operational amplifiers, voltage-to-frequency converters, and sample/hold circuits.
CMOS Double-Level Metal Poly-Poly Process:
This is a 3.0µm double-level metal CMOS process that also makes use of parasitic bipolar devices. This is a ±5V
process with compatible thin-film resistors and very high quality poly-poly capacitors. It produces high density,
high precision (16-bit and 18-bit) single and dual analog-to-digital and digital-to-analog converters.
BiCMOS Process:
This double-poly, double-metal 3.0µm process is optimized for analog circuitry including critical thin-film resistor
capability. The process is primarily used for data conversion products.
Processes not available internally are sourced from various foundries, including Lucent Technologies, Mitel
Semiconductor, Oki, Hualon Microelectronics, and Taiwan Semiconductor Manufacturing Co. (TSMC). Such
processes include 2.0µm, 1.2µm, and 0.6µm BiCMOS and CMOS processes, and a very high-frequency bipolar
process for products such as video amplifiers.
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Burr-Brown
North American Company Profiles
Semiconductor Fabrication Facilities
Burr-Brown Corporation
6730 South Tucson Boulevard
Tucson, Arizona 85706
Cleanroom size: 30,000 square feet
Capacity (wafer/week): 4,200
Wafer size: 100mm (Planning conversion to 150mm wafers)
Processes: CMOS, Bipolar, BiCMOS
Products: Digital and linear ICs, monolithic and hybrid assembly
Feature sizes: 1.0µm-3.0µm
Burr-Brown has IC assembly facilities in Tucson and Scotland. The company also incorporated plastic multichip
module (MCM) assembly capability in its Tucson facility in 1995.
Key Agreements
• Burr-Brown is jointly developing with Oki, 20-bit BiCMOS A/D and D/A converter chips for business digital audio
equipment.
2-80
C-Cube Microsystems
North American Company Profiles
C-C UBE MICROSYSTEMS
C-Cube Microsystems Inc.
1778 McCarthy Boulevard
Milpitas, California 95035
Telephone: (408) 490-8000
Fax: (408) 490-8590
Web Site: www.c-cube.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
C-Cube Japan • Yokohama, Kanagawa, Japan
Telephone: (81) (45) 474-7571 • Fax: (81) (45) 474-7570
Europe:
C-Cube Microsystems • Crawley, West Sussex, United Kingdom
Telephone: (44) (1293) 651100 • Fax: (44) (1293) 651119
Asia-Pacific:
C-Cube Microsystems International Inc. • Wanchai, Hong Kong
Telephone: (852) 2511-6683 • Fax: (852) 2511-6939
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
14
(5)
7
1993
24
(1)
7
1994
45
5
10
1995
124
25
14
1996
320
(73)
44
1997
337
44
64
—
112
140
254
669
750
Ownership: Publicly held. NASDAQ: CUBE.
Company Overview and Strategy
Founded in 1988, C-Cube Microsystems is a provider of highly integrated, standards-based, programmable digital
video compression and decompression products and systems. The company's innovative encoder, decoder, and
codec products bring full motion video and still image capabilities to a broad range of end-user products in the
consumer electronics, computer, and communications markets. Such products include DVD-PCS, digital set-top
receivers, DVD consumer players, video CD players, and non-linear editing applications, interactive digital cable
TV systems, and direct broadcast satellite (DBS) systems.
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C-Cube Microsystems
North American Company Profiles
In 1995, C-Cube acquired Media Computer Technologies (MCT), a supplier of PC-based digital video processing
and video-windowing technology. As a subsidiary of C-Cube, MCT is responsible for developing ASICs,
reference designs, and application software, and contributing to development projects of C-Cube’s PC
customers. In 1996, C-Cube acquired DiviCom Inc., a digital video networking company that designs, integrates,
and markets complete systems for the delivery of broadcast video networks. DiviCom will operate as a wholly
owned subsidiary of C-Cube.
Management
Alexandre A. Balanski, Ph.D.
Mark K. Allen
Alex Daly
John Hagedorn
Richard Foreman
Didier Le Gall, Ph.D.
Senjeev Renjen, Ph.D.
Nolan Daines
Tom Lookabough
President and Chief Executive Officer
Senior Vice President, Operations
Senior Vice President, Sales and Corporate Marketing
Vice President, Finance and Administration, and Chief Financial Officer
Vice President and Chief Information Officer
Vice President, Research and Development, and Chief Technology Officer
Vice President, Decoder Engineering
Chief Executive Officer, DiviCom Inc.
President, DiviCom Inc.
Products and Processes
C-Cube's single-chip and chipset products include: MPEG 1 video and audio/video encoders and decoders for
consumer electronics applications; and MPEG 2 video encoders and decoders for broadcast and consumer
applications and MPEG-2 codecs; and MPEG 2 transport demultiplexers for communications applications. In
February 1997, C-Cube introduced the ZiVA family of single-chip DVD products, which include decoders,
encoders, and system-level solutions for consumer and multimedia OEMs. C-Cube’s unique set-top silicon,
application software and production ready designs, offer the market a feature-rich set-top system solution.
C-Cube’s IC products are currently manufactured using two- or three-layer metal CMOS process technology with
0.5µm, 0.35µm, and 0.25µm feature sizes.
The company also markets a line of design example boards and demonstration systems products.
2-82
North American Company Profiles
C-Cube Microsystems
Semiconductor Fabrication Facilities
C-Cube does not manufacture its own ICs; it uses independent foundries. The company’s principal IC foundry is
TSMC in Taiwan. Other foundry partners include Matsushita and Yamaha. Assembly, test, and packaging of its
devices is also subcontracted to third parties.
In 2Q96, C-Cube signed an agreement with foundry partner TSMC. As part of the agreement, C-Cube agreed to
make advanced payments to secure wafer production capacity through 2001.
Key Agreements
•
In February 1998, C-Cube announced a cooperative engineering effort with Intel Corporation. The CCube/Intel solution will allow audio/video data to be directly decoded by C-Cube’s ZiVA DVD chip and passed
to the Intel processor for scaling and display.
•
In December 1997, C-Cube announced strategic alliances with two innovative providers of “Internet-over-TV”
services. Through these alliances, C-Cube is integrating WEB browsing solutions from Worldgate and
MoreCom with its AViA chipset, offering advanced graphics and Internet support for set-top devices. This will
allow service providers to offer Internet access over television, in addition to digital video services.
•
In April 1997, C-Cube and Adaptec announced that they are joining forces to provide a Fire Wire based
solution and tools that will allow video professionals and consumers to move between multiple digital video
formats, including MPEG-2 and DVC.
•
In March 1997, C-Cube and Quadrant International (QI) entered into a development partnership. Through this
partnership, QI’s DVD technology will be ported to C-Cube’s ZiVA DVD decoder family.
2-83
California Micro Devices
North American Company Profiles
CALIFORNIA MICRO DEVICES (CMD)
California Micro Devices Corporation
215 Topaz Street
Milpitas, California 95035-5430
Telephone: (408) 263-3214
Fax: (408) 263-7846
Web Site: www.camd.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends March 31 effective 1995, previously June 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
33
2
4
—
1994
30
(15)
3
2
1995
24
(24)
3
1
1996
40
5
3
4
1997
33
1
4
6
1998
33
(3)
4
1
247
273
229
297
260
256
Ownership: Publicly held. NASDAQ: CAMD.
Company Overview and Strategy
Founded in 1980, California Micro Devices (CMD) is a designer, manufacturer, and marketer of integrated thin-film,
silicon-based termination and filtering passive components and active electronic circuitry. These products are
targeted primarily at applications in the computer, networking, and communications industries. CMD exited the
military market in 1996.
2-84
California Micro Devices
North American Company Profiles
In 1996, CMD introduced its new line of thin-film P/Active™ devices, which combine the company’s thin-film
technology with active semiconductor components and techniques to create enhanced passive networks called
applications specific passive network (ASPN™) products. With these products, CMD is striving to become an
expert in the matters of high-performance termination systems for PCs, workstations, and networking equipment,
as well as in the filtering and complementary functions necessary in both computers and mobile communications.
Foreign sales, primarily in Asia, Europe, and Canada accounted for approximately 36 percent of net product sales
in fiscal 1997.
Management
Wade Meyercord
Jeffrey C. Kalb
Nick Bacile
Robert Filiault
John Jorgensen
Arieh Schifrin
John E. Trewin
Scott Hover-Smoot
Frank Ellis
Chairman
President and Chief Executive Officer
Vice President, Marketing
Vice President, Worldwide Sales
Vice President, Engineering
Vice President, Operations
Vice President and Chief Financial Officer
General Counsel
Manager, Product Marketing
Products and Processes
CMD's thin-film products use silicon-based thin-film materials and process technology to combine multiple passive
elements in a single package. They fall into two categories: the traditional IPEC™ family, consisting of custom and
general purpose devices; and the new P/Active ASPN components, which use semiconductor techniques and
devices to enhance the performance and functionality of its traditional thin-film passive technologies. Its first
P/Active devices include termination devices for the Intel Pentium and Pentium Pro and Motorola Power PC
processor buses, bias networks for Linear Technology’s and Harris’ PC voltage regulators, special diode clamping
circuits for second-generation PCI, memory, and other computer buses, and filter circuits for parallel ports in PCs.
CMD also offers a variety of precision and non-precision thin-film resistors and capacitors as well as combinations of
those elements with and without semiconductor devices. The company has particular strength in the area of
resistor-capacitor filters.
The company's semiconductor products include analog and mixed-signal integrated circuits, such as data
communications and interface devices and telecommunication dual tone multi-frequency (DTMF) receiver and
transceiver products. These products are used in personal computers, answering machines, portable
telephones, and switching systems. They are manufactured in 1.25µm through 3.0µm BiCMOS and CMOS
processing technologies.
CMD also offers the use of its Tempe fabrication facility as a foundry and test service.
2-85
California Micro Devices
North American Company Profiles
Semiconductor Fabrication Facilities
CMD plans to convert certain of its fabrication facilities from 125mm to 150mm wafers during the next couple of
years.
California Micro Devices, Microcircuits Division
2000 West 14th Street
Tempe, Arizona 85281
Telephone: (602) 921-6000
Cleanroom size: 16,000 square feet (Class 1)
Capacity (wafers/week): 1,000
Wafer size: 125mm
Processes: CMOS (SM/DP, DM/SP, DM/DP);
BiCMOS (SM/DP, DM/DP)
Products: Linear and mixed-signal ICs, thin-film
devices, foundry services.
Feature sizes: 1.25µm-3.0µm CMOS;
1.25µm, 1.5µm BiCMOS.
California Micro Devices
215 Topaz Street
Milpitas, California 95035-5430
Telephone: (408) 263-3214
Cleanroom size: 10,000 square feet
Capacity (wafers/week): 750
Wafer sizes: 125mm, 4.5 in. square
Products: Thin-film discretes
The company uses subcontractors in Asia, primarily Thailand and the Philippines, for the assembly and packaging
of most of its products. Most of its product testing is done in-house, but its assembly partners are increasingly
being used for testing purposes.
Key Agreements
• In February 1998, CMD announced a partnership with Flip Chip Technologies and Avex Electronics Inc. to
develop flip chip packaging and assembly of CMD’s patented integrated passive components (IPCs).
• In January 1998, CMD and Sipex Corporation announced that they had expanded their foundry relationship
(which started in late 1995) to include a broader range of Sipex products.
• California Micro Devices has a comprehensive strategic alliance with Hitachi Metals, Ltd. (HML), a subsidiary of
Hitachi, Ltd., that involves joint product development, manufacturing, marketing, and worldwide distribution.
HML owns 980,000 shares of CMD stock, about 10 percent.
2-86
Calogic
North American Company Profiles
CALOGIC
Calogic Corporation
237 Whitney Place
Fremont, California 94539
Telephone: (510) 656-2900
Fax: (510) 651-3025
Web Site: www.calogic.com
IC Manufacturer
Employees: 200
Company Overview and Strategy
Calogic is a privately held company, founded in 1983. The company offers a line of standard and full custom
semiconductor products made using several technologies including CMOS/DMOS and bipolar. Its product line is
specifically designed for high-performance applications. The company strives to form relationships with its
customers by offering technical expertise from design to processing to final test.
Management
Manny Del Arroz
Charlie Bevivino
Brenda Hill
President
Director, Sales
Director, Marketing
Products and Processes
Calogic offers bipolar standard products (e.g., switches, multiplexers, and op amps) and CMOS, DMOS, and JFET
full custom ICs. Calogic acquired a small signal discrete line from Harris and now offers one of the broadest small
signal FET product lines in the industry. In addition, Calogic offers its production facilities as a foundry service.
CRT Related Products:
CRT driver amplifiers (30MHz to 185MHz)
Pre-amplifiers
Buffers
Level shifters
Instrumentation Products:
Op amps
References
Analog switches
Full Custom and Semicustom Capabilities:
Design, layout, manufacturing, and test
Video Products:
Widebank buffers and amplifiers
2-87
Calogic
North American Company Profiles
Power Management :
Low drop out regulators
Adjustable shunt regulators
MOSFET drivers
DC to DC converters
Discretes :
High-speed lateral DMOS FET switch and switch arrays (switching speeds under 1ns)
Vertical MOS FET switches
JFETs
MOSFETs
Diodes
Calogic’s process technologies include a dielectrically isolated (DI) complementary bipolar process, a high
frequency (1GHz), low-noise bipolar process, a medium-voltage, medium-frequency, bipolar process for supply
voltages up to ±20 volts, CMOS, BiCMOS, JFET, lateral and vertical DMOS.
Semiconductor Fabrication Facilities
Calogic Corporation
237 Whitney Place
Fremont, California 94539
Cleanroom size: 10,000 square feet
Capacity (wafers/week): 900
Wafer size: 100mm
Processes: CMOS, DMOS, bipolar
Products: ASICs (gate arrays, full custom ICs); peripheral, linear, and logic ICs; discretes.
Feature sizes: 1.5µm-5.0µm
2-88
Catalyst
North American Company Profiles
CATALYST S EMICONDUCTOR
Catalyst Semiconductor, Inc.
1250 Borregas Avenue
Sunnyvale, California 94089
Telephone: (408) 542-1000
Fax: (408) 542-1200
Web Site: www.catsemi.com
Email: westussales@catsemi.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
Nippon Catalyst K.K. • Tokyo, Japan
Telephone: (81) (3) 5340-3781 • Fax: (81) (3) 5340-3780
Europe:
Catalyst Semiconductor, Inc. • Oxford, England
Telephone: (44) (1865) 481-411 • Fax: (44) (1865) 481-511
Asia-Pacific:
Catalyst Semiconductor, Inc. • Taipei, Taiwan
Telephone: (886) (2) 345-6192 • Fax: (886) (2) 729-9388
Financial History ($M), Fiscal Year Ends April 30
Sales
Net Income
R&D Expenditures
Employees
1992
1993
1994
1995
1996*
1997
Preliminary
1998
29
(7)
7
33
(2)
5
54
(22)
7
49
2
7
60
4
9
47
(4)
6
35
(19)
—
100
90
60
65
82
71
35
*In February 1996, fiscal year changed from ending March 31 to April 30.
Ownership: Publicly held. NASDAQ: CATS.
Note: Effective August 6,1998, the Company’s shares are traded on the OTC bulletin board.
Company Overview and Strategy
Catalyst Semiconductor, established in 1985, designs, develops, and markets a broad range of nonvolatile
memory IC products that have applications in the computer, consumer electronics, wireless communications,
network, automotive, industrial, and instrumentation markets.
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Catalyst
North American Company Profiles
The company's strategy is to become a leading supplier of flash memory devices while maintaining its position as a
leading supplier of EEPROM products. The company’s development efforts are focused on improving its
fabrication processes and the development of advanced products.
For the nine months ended January 31, 1998, approximately 51 percent of the company’s revenues were from
sales of its Flash memory devices, and approximately 70 percent of its revenues were derived from shipments to
international customers versus 60 percent in Fiscal 1997.
Management
Hide Tanigami
Radu Vanco
Chris Carstens
Heber Clement
Sorin Georgescu
Daryl Stemm
Gelu Voica
Marc Cremer
Bassam Khoury
Fred Leung
Steve Donaldson
Chairman
President, and Chief Executive Officer
Vice President, Quality and Reliability
Vice President, Operations
Vice President, Technology
Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Product Engineering
Vice President, Sales
Vice President, Marketing
Director, Strategic Marketing
National Sales Manager
Products and Processes
Catalyst's family of nonvolatile devices includes flash memories (512K, 1M, 2M, 4M, and 8M), serial EEPROMs (1K
to 64K), parallel EEPROMs (16K to 256K), and NVRAMs (i.e., shadow RAMs and devices that combine EEPROM
with SRAM). Catalyst also offers a line of BiCMOS data converters and other specialized products such as its
application-specific electrically erasable devices (ASEEDs™), and its mixed-signal products used in freight billing
systems and contactless security control.
In January 1998, Catalyst shipped its first product built at its UMC foundry — a 2 Meg Flash memory (the 28F020),
fabricated with the company’s advanced 0.5 micron technology.
Most of the company's products are designed and manufactured using a 0.8µm CMOS EEPROM process or a
0.5µm flash memory process.
2-90
North American Company Profiles
Catalyst
Catalyst if ISO 9001 certified.
Semiconductor Fabrication Facilities
Through the establishment of long-term licensing agreements, Catalyst principally uses Oki and UMC for the
fabrication and testing of its devices. Catalyst also has agreements with Seiko-Epson, Chartered Semiconductor
and Newport Wafer-Fab Ltd.
Key Agreements
• In April 1998, Catalyst Semiconductor announced that in two separate agreements reached with Oki
Electronics Industry Co. Ltd. and Trio-Tech International PTE Ltd., the company will receive additional credit to
purchase wafers. Catalyst currently has over $9 million in backlog, a significant portion of which is delinquent to
the customer’s requested delivery date.
• In January 1998, Catalyst Semiconductor and JACO Electronics, Inc. of Hauppauge, New York, signed a
Distribution Agreement. The agreement allows JACO to distribute Catalyst’s Serial EEPROMs, Parallel
EEPROMs, Mixed-Signal Products and Flash Memory devices.
• In 1996, Catalyst announced an agreement with United Microelectronics Corp. (UMC). As part of the
agreement, UMC will take a 10 percent equity stake in Catalyst and will provide significant wafer foundry
capacity. Also, UMC and Catalyst will jointly develop 0.5µm and 0.35µm process technologies, geared for flash
memory products.
• In November 1995, Catalyst signed a cross-licensing agreement with Intel. The agreement provides Catalyst
with the right to utilize all of Intel’s flash memory patents.
• Catalyst signed on Wales, U.K.-based Newport Wafer-Fab Ltd. in May 1995 for the manufacture of its
EEPROMs and for process technology development.
• Catalyst formed an alliance with Zilog that calls for the joint development of 20M and 40M 2.5-inch solid-state
disk drives merging Catalyst's flash memory devices with Zilog's compression and controller technology. The
two companies are also developing other devices combining flash and microcontroller technology.
Noteworthy News
•
On August 4, 1998, Catalyst announced that, effective at the market close of business August 5, 1998, its
Common Stock would be delisted from The Nasdaq National Market due to a failure to satisfy the continuing
listing requirements of maintaining a closing bid price of at least $1.00 per share. Effective August 6, the
Company’s shares will be traded on the OTC Bulletin board.
•
In March 1998, Catalyst announced restructuring and new leadership changes to allow the company to return
to profitability. (Management changes are reflected in this profile).
2-91
Catalyst
North American Company Profiles
In April 1998, Catalyst announced a recovery plan to improve its operating results. In conjunction with steps
taken earlier in the year, Catalyst will reduce cash expenditures for manufacturing overhead and operating
expenses. The plan includes an additional 20 percent reduction in force in the Sunnyvale operation and
leveraging existing lower cost operations in the Far East and Eastern Europe.
2-92
Celeritek
North American Company Profiles
CELERITEK
Celeritek, Inc.
3236 Scott Blvd.
Santa Clara, CA 95054
Telephone: (408) 986-5060
Fax: (408) 986-5095
Web Site: www.celeritek.com
Email: bhoppin@celeritek.com
IC Manufacturer
Financial History ($000s), Fiscal Year Ends March 31
1993
2,411
28,340
30,751
1994
6,274
29,755
36,029
1995
10,854
21,813
32,667
1996
28,021
9,703
37,724
1997
27,632
17,714
45,346
1998
32,663
23,653
56,317
Net income
1,836
1,925
284
2,276
3,656
3,991
Employees
—
—
—
—
370
422
Commercial
Defense
Total net sales
Ownership: Publicly held. NASDAQ: CLTK.
Company Overview and Strategy
Founded in December 1994, Celeritek designs, develops, manufactures and markets high frequency radio
products that provide core transmit and receive functions for wireless communications systems. Celeritek’s
products are utilized primarily in four markets: (1) microwave radios; (2) cellular telephone systems and personal
communications services ("PCS"); (3) satellite-based communications; and (4) defense electronics. For fiscal
1997, approximately 61 percent of Celeritek’s total net sales were derived from the commercial wireless
communications markets. At fiscal year end 1997, Celeritek had two customers, P-Com and Westinghouse, who
accounted for approximately 20 percent and 11 percent of total net sales, respectively.
Celeritek’s gallium arsenide radio-frequency integrated circuits (GaAs RF ICs) and high frequency radio transceiver
subsystems and components operate in the high radio frequency (RF) range of 800MHz to 1GHz and in the
microwave frequency range of 1GHz to 40GHz. Celeritek’s wireless subsystem division's products include
subsystems and components for point-to-point radios, very small aperture terminals (VSAT) and for cellular and
PCS base stations. Celeritek’s semiconductor division's products include GaAs RF ICs for PCS, wireless local loop
and cellular subscriber equipment and base station applications. Celeritek’s defense electronics products are for
applications such as missile guidance, electronic countermeasures and communications satellites.
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Celeritek
North American Company Profiles
Celeritek’s strategy is to identify and expand penetration into high-growth wireless, target leading OEMs in those
markets with a broad range of solutions and, on a “teaming” basis, provide its customers the application-specific
products they require by leveraging its expertise in integrated circuit and system design, as well as high frequency
signal processing technology and GaAs process technologies.
Celeritek has 15 U.S. distributors across 15 states.
countries.
They also have 17 international distributors across 14
Management
Tamer Husseini
Margaret E. Smith
Robert D. Jones
Perry Denning
William W. Hoppin
Gary J. Policky
Richard G. Finney
Chairman of the Board, President and CEO
Vice President, Finance and CFO
Senior Vice President, Marketing and Sales
Vice President and General Manager, Semiconductor Division
Vice President, Sales
Vice President, Engineering and Chief Technical Officer
Vice President, Manufacturing
Products and Processes
Celeritek's GaAs products are produced using implanted MESFET as well as epitaxial and PHEMT structures. By
having a variety of options, the Company selects the best fit for a given product function based on achieving
maximum, cost-effective performance. In addition, Celeritek continues to explore new and emerging GaAs-based
technologies as they become available.
Celeritek offers a line of GaAs semiconductor products to OEM customers for use in the commercial wireless
communications markets, in addition to those semiconductor products that it incorporates into its own assemblies.
The GaAs semiconductor products produced by the company are transceiver components such as amplifiers,
switches and converters. Some of these products are combined to function as complete transceivers. Celeritek's
current revenues from semiconductor products are derived principally from the sale of discreet GaAs FETs and
GaAs ICs for use in wireless communications applications such as cellular, PCS and wireless local loop base
stations and subscriber units.
Celeritek manufactures twelve 900MHz MMIC products (amplifiers and power GaAs FETs), thirteen 1.8GHz Power
GaAs FETs, eleven 2.4GHz MMIC products, three 2.4GHz Power GaAs FETs, and a single high dynamic range,
low-noise GaAs FET.
Celeritek's products are optimized for a number of transmit frequency applications including cellular (800MHz1.0GHz), satellite (1.6-1.7GHz), PCS (1.8-2.0GHz), and WLAN/Wireless local loop (2.2-2.7GHz). Modulation
formats as varied as GSM, TDMA, CDMA, DCS, PHS and others are all supported. Power GaAs RF ICs and discrete
power FETs form the backbone of Celeritek's diverse product offerings.
In fiscal 1997, Celeritek introduced a new product family of gallium arsenide radio-frequency integrated circuits
(GaAs RF ICs), called the Triniti DX(TM) for use in PCS and cellular phones. These were designed into handsets
and base stations at customers including Lucent, Motorola, and Ericsson.
2-94
North American Company Profiles
Celeritek
In February 1998, Celeritek announced two new, low cost, "true" 3.0 Volt power amplifiers. The products support
dual band handset requirements including linearity demands of CDMA and TDMA systems over the entire
discharge cycle of a lithium ion battery, allowing users to have longer talk time. The CMM0530 delivers 28.5dBm
of CDMA output power with 27dB of gain cross the 824-928MHz band with 40 percent digital efficiency and
exceeding 60 percent analog efficiency while meeting both TDMA and CDMA spectral mask requirements for IS136 and J-STD-18. Similarly, the CMM1530 delivers 28.5dBm of CDMA output power with 30dB of gain across
the 1850-1910MHz band with 35 percent digital efficiency, meeting both IS-136 and IS-95 spectral mask
requirements. Both products are fabricated using PHEMT technology in Celeritek's GaAs foundry. Manufactured
for high volume, these parts are packaged in an 8-pin plastic package, offering high thermal characteristics with an
associated smaller footprint.
Celeritek’s proprietary wafer fabrication process produces line-width geometries as small as 0.25 micron that permit
the production of high performance, highly integrated devices. Celeritek has accumulated a sizable base of
technology associated with the specification of this special starting material and uses its knowledge of GaAs
surface preparation techniques to design the surface of its GaAs products to optimize its customers' specific price
and performance objectives. Celeritek’s GaAs process has seven major steps for both its FET and IC products. Its
GaAs manufacturing process is accomplished with commercially available fabrication equipment including contact
photolithography equipment.
Since its inception in 1984, Celeritek has accumulated a substantial base of knowledge in the development of
system architectures and integrated circuits for RF and microwave signal processing. This has been developed
into an extensive library of signal processing functions that it integrates into higher level systems.
Semiconductor Fabrication Facilities
Celeritek’s 57,000 square foot headquarters houses its main manufacturing plant. In April, 1997, the Company
leased an additional 25,000 square foot building in Santa Clara, California to house its wireless subsystems
manufacturing operation.
Celeritek’s facilities are approved for MIL-Q9858A quality production.
The
manufacturing facility includes cleanrooms, with Class 10 performance.
Noteworthy News
• Beginning in the second quarter of fiscal 1999, in order to reduce operating expenses, Celeritek will lay off
approximately 40 employees, or ten percent, and reduce work weeks through the end of calendar 1998.
2-95
Cherry Semiconductor
North American Company Profiles
CHERRY S EMICONDUCTOR
Cherry Semiconductor Corporation
2000 South County Trail
East Greenwich, Rhode Island 02818-0031
Telephone: (401) 886-3500
Fax: (401) 885-5786
Web Site: www.cherry-semi.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends February 28
Corporate
Sales
Net Income
Semiconductor
Sales
Net Income
Capital Expenditures
Employees
1992
1993
1994
1995
1996
1997
229
5
266
10
275
11
339
15
425
11
440
16
36
3
1
45
5
4
56
7
7
75
11
17
99
5
20
103
5
14
415
450
500
550
975
975
Company Overview and Strategy
Formed in 1972 as Micro Components Corporation, Cherry Semiconductor originally manufactured linear bipolar
ICs with a focus on the photography market. In 1977, MCC was acquired by The Cherry Corporation and renamed
Cherry Semiconductor Corporation (CSC). The market orientation of CSC began to include more automotive
business as the photo market began to sag. In 1985, the company committed to two major market focuses:
automotive and computer. Within these two markets, CSC focused further on four application areas: dedicated
automotive, power supply control, motor control, and memory management (high-performance disk drive circuits).
In 3Q95, CSC was organized into three business groups: automotive OEM, automotive electronics, and
computer and industrial. The company’s global customer base includes automotive equipment manufacturers and
suppliers, power systems suppliers and resellers, computer OEMs, and telecommunications systems
manufacturers.
2-96
Cherry Semiconductor
North American Company Profiles
Management
Alfred S. Budnick
Andrew F. Durette
Walter E. McMann
Dennis Gaetano
President, Cherry Semiconductor
Executive Vice President
Vice President, Finance and Administration
Director, Worldwide Sales and Marketing
Products and Processes
Cherry Semiconductor designs and builds standard linear and mixed-signal ICs and semicustom and full-custom
ICs (ASICs). The company’s automotive ICs are most often custom designs, while its standard ICs are usually
targeted at the computer market.
Cherry Semiconductor developed its high-performance PowerSense™ BiCMOS process for automotive circuits.
It is a mixed-signal process that allows analog power functions and compact digital logic to be combined on a single
chip. It uses 15 masks and has five critical alignments. In addition, CSC has developed a 16-volt BiCMOS process
for disk drive applications and a 2.5MHz bipolar process for computer applications. The firm’s bipolar processes
feature vertical and lateral PNP transistors, up-down isolation, and low leakage diodes.
Cherry developed an Al-Ni bumping capability in 1972 which was changed to Ti-W in 1986. Cherry currently
supplies 1,200 bumped wafers/month.
Semiconductor Fabrication Facilities
Cherry Semiconductor Corporation
2000 South County Trail
East Greenwich, Rhode Island 02818
Cleanroom size: 24,000 square feet
Capacity (wafer/week): 3,500
Wafer sizes: 100mm, 150mm
Processes: Bipolar, BiCMOS
Products: Linear and mixed-signal ICs and ASICs
Feature size: 1.4µm
2-97
Cherry Semiconductor
North American Company Profiles
Key Agreements
• In 1997, Cherry Semiconductor made an equity investment in Switch Power, Inc. Cherry Semiconductor will
help Switch Power to co-develop new product definitions.
• Cherry Semiconductor works with Motorola to develop ASICs for the automotive industry. The two companies
struck their first agreement in the late 1980's.
2-98
Chip Express
North American Company Profiles
CHIP EXPRESS
Chip Express Corporation
2323 Owen Street
Santa Clara, California 95054
Telephone: (408) 988-2445
Fax: (408) 988-2449
Email: moreinfo@chipx.com
Web Site: www.chipexpress.com
IC Prototypes / Fabless IC Supplier
Founded: 1989, Delaware
Regional Offices/Representative Locations
Europe/Middle East:
Chip Express Ltd. • Haifa, Israel
Telephone: (972) (4) 855-0011 • Fax: (972) (4) 855-1122
Financial History ($M)
Sales
Employees
1994
10
1995
18
1996
28
1997
28
80
110
140
140
Ownership:Privately held; funded by Elron Electronic Industries (Israel), Morgan Stanley Venture Partners (U.S.)
and Toyo INK/Intex (Japan).
Company Overview and Strategy
Chip Express started its operations in 1990 when it was spun-out from Elron Electronics Industries Ltd. (an Israeli
high technology holding company). The company has developed a series of unique capabilities that allow
customization of gate arrays outside of conventional fabs, enabling significant flexibility, fast time to market and
production-cost reduction. Chip Express provides a complete “Time-to-Market Solution™” that offers flexible
ASIC production solution with a seamless migration path for transferring a logic design from netlist to fast-turn
prototypes and then to volume production.
The company produces laser programmable gate arrays (LPGAs), gate arrays fabricated using programmable laser
cutting equipment, a patented technology. Traditional gate array and standard cell vendors are focusing more on
servicing designs that lead directly to high volume production, leaving customers who require lower volume and/or
lower density and fast turnaround, without any low risk, low cost solution. Chip Express introduces a technology
that revives the gate array value and avoids the traditional gate array deficiencies, such as no low volume
alternatives, longer lead times for gate array design turns, and higher NRE.
2-99
Chip Express
North American Company Profiles
Management
Zvi Or-Bach
Howard Brodsky
Paul Indaco
Uzi Yoeli
Meir Janai
President and Chief Executive Officer
Chief Financial Officer
Vice President, Sales
Vice President, Research and Development (Israel)
Chief Scientist (Israel)
Products and Processes
Chip Express offers CMOS gate array prototype and production capability densities that range from 4K to 200K
gates. In 2Q96, the company introduced the new CX2000 gate array family, which features a 0.6µm triple metal
device with up to 160K usable gates plus configurable embedded memory of up to 128K bits. In 1Q97, the
company introduced the next generation CX2001 product family with PLL capability. In addition, in 2Q97, the
company developed 0.5µm device capabilities.
The company is currently developing a triple metal 0.35µm technology, the CX3000 LPGA, with foundry partners.
Chip Express proprietary techniques are used to selectively remove specific metallization points to
personalize/customize standard gate arrays. These techniques are optimized for use on a single die (laser
programming), a single wafer (OneMask process) or a wafer lot (TwoMask process).
At the prototyping phase, no masks are required and only a few dies need to be customized. For ASIC
prototyping, the QuICk System disconnects the predefined links of multi-layer metal in a single operation with
20,000 per second. A real time computer and image processing system use the Cut-List to control the automatic
laser cutting process. The QuICk System personalizes one die at a time, in less than two hours. Therefore, the
NRE is reduced tremendously and the turnaround time is as short as one day. For the initial production phase,
Chip Express utilizes a simple dedicated fab-line to process a single wafer at a time, requiring only a single mask
and one etch process step for ASIC customization. The turnaround time for low volume production (quantities up
to a few thousand devices) can be as short as one week. The company offers a seamless migration to high volume
production, where the generic wafers could be processed up to metal 2, requiring only two masks for the
customization.
Cores (Mega Cells) – Chip Express is partnering with cores suppliers to provide system designers with predesigned, tested modules (i.e., PCI, microcontrollers, Ethernet controllers). The OPEN CORE program offers
easy access for core providers to verify their cores on silicon and enables a quick and smooth transition from logic
design through fully-verified ASIC prototypes to volume production.
2-100
North American Company Profiles
Chip Express
Semiconductor Fabrication Facilities
Chip Express has a 37,000 square foot facility that provides gate array prototyping and low volume production
services. The prototype is customized in a self-contained Class 100 laminar air flow cell. The OneMask, low
volume production operation is performed in a Class 10 cleanroom environment, processing a single wafer at a
time, in a single etch step using only a single mask for personalization.
The LPGA fabrication is provided by Tower Semiconductor and Yamaha. Additional foundry partners include
Sony, Seiko-Epson, and Chartered Semiconductor Manufacturing.
2-101
Chips and Technologies
North American Company Profiles
CHIPS AND TECHNOLOGIES
Chips and Technologies, Inc.
2950 Zanker Road
San Jose, California 95134
Telephone: (408) 434-0600
Fax: (408) 894-2082
Web Site: www.chips.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends June 30
Sales
Net Income
R&D Expenditures
Employees
1992
141
(64)
46
1993
98
(49)
23
1994
73
3
12
1995
105
9
13
1996
151
26
20
400
220
180
185
209
1997
168
36
24
260
Ownership: Publicly held. NASDAQ: CHPS.
Company Overview and Strategy
Chips and Technologies, a wholly owned subsidiary of Intel Corporation, develops semiconductor and software
solutions for leading manufacturers of personal computers. The company has a product portfolio that includes
display controllers, graphics accelerators, video devices, communications ICs, and system logic chipsets. These
products are built into a wide range of systems from compact portables to high-performance desktop computers.
Chips’ product strategy has taken several turns since it was founded in 1984. The company initially placed its
primary focus on system logic chipsets and built up this particular business to represent 87 percent of total
revenues in fiscal 1989. Chips’ annual sales in 1990 grew over 100 percent from that in 1988. However, the
company’s logic chipset business took a turn for the worst and the company reported a net loss in 1991, the first
since its inception.
In an effort to move the company out of the red, Chips sold off several product lines in 1993 and implemented a
plan to reorganize the company’s strategy. With its new objectives — to provide highly-integrated silicon and
software solutions to the PC industry by creating unique, high-quality products — the company slowly turned
around.
Today, Chips and Technologies maintains a leading position as a supplier of graphics and video controllers to
portable computer manufacturers. The Company’s strategy is to leverage its core expertise and market leadership
to rapidly bring advanced display controller technologies to portable computers. During 1997, Chips extended its
HiQVideo family of video display controllers.
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Chips and Technologies
North American Company Profiles
Management
James F. Stafford
Morris E. Jones, Jr.
Keith Angelo
Lee J. Barker
Timothy R. Christofferson
Richard E. Christopher
Lawrence A. Roffelsen
Jeffery Anne Tatum
President and Chief Executive Officer
Senior Vice President and Chief Technical Officer
Vice President, Marketing
Vice President, Operations
Vice President, Finance, and Chief Financial Officer
Vice President, Sales
Vice President, Engineering
Vice President, General Counsel
Products and Processes
Chips' product line includes CRT and flat-panel graphics controller ICs, graphical user interface (GUI) accelerators,
PC video circuits, I/O and peripheral controllers, and system logic chipsets. The company's LCD controllers have
been well received by makers of industry-leading products in the laptop, notebook, and sub-notebook industries.
In 1996, Chips’ introduced a line of LCD flat panel/CRT controllers and accelerators, called the HiQVideo™ family,
which are based on a new 64-bit display graphics engine architecture and feature multiple window display,
zoomed video, and full-motion video acceleration and scalability.
In 1997, Chips began preliminary sampling of flat panel multimedia accelerators with integrated memory and logic,
designed with foundry partner Samsung Semiconductor. The two companies announced in mid-1996 a plan to
jointly develop integrated memory products as part of a plan by Chips to introduce a new generation of low-power,
high-bandwidth, and high-performance products that are software-compatible with its HiQVideo product family.
Following is a sampling of Chips and Technologies’ HiQVideo series.
•
•
•
•
•
•
69000 HiQVideo - Accelerator with integrated memory
65555 HiQVPro - Multimedia Accelerator
65554 HiQV64 - Multimedia Accelerator
65550 HiQV32 - Multimedia Accelerator
65548 - High Performance Flat Panel/CRT Accelerator
65545 - High Performance Flat Panel/CRT Accelerator
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Chips and Technologies
North American Company Profiles
The majority of Chips’ products are built using 0.5µm and 0.35µm triple-layer-metal CMOS processes.
company plans to utilize 0.35µm and 0.25µm process geometries for most of its future products.
The
Semiconductor Fabrication Facilities
Chips and Technologies uses subcontractors for the fabrication and assembly of its semiconductor components.
Currently its foundry partners include Chartered Semiconductor, IBM, NEC, Samsung, LG Semicom, and TSMC.
Key Agreements
•
In January 1998, Intel Corporation acquired the outstanding shares of Chips and Technologies, Inc. for
approximately $430M. Chips and Technologies became a wholly owned subsidiary of Intel Corporation, part of
Intel’s Graphics Component Division.
•
Chips and Technologies signed a production agreement with Chartered Semiconductor. Chips agreed to pay
Chartered $20 million for guaranteed production capacity support of 200mm wafers through 2000.
•
In fiscal 1996, Chips and Technologies established a long-term foundry agreement with TSMC. The
agreement called for Chips to make deposits totaling $23.5 million to TSMC in exchange for a guaranteed wafer
supply through 2000.
2-104
Chrontel
North American Company Profiles
CHRONTEL
Chrontel, Inc.
2210 O’Toole Ave.
San Jose, CA 95131
Telephone: (408) 383-9328
Fax: (408) 383-9338
Web Site: www.chrontel.com
Email: sales@chrontel.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Singapore:
Wearnes Technology Pte. Ltd. • Singapore
Telephone: (65) 2580641 • Fax: (65) 2592270
Wearnes is a holding company for several high-tech companies including Advanced Logic Research (ALR), the
computer/server company. Wearnes is represented on Chrontel’s board by Wong Chun Win.
Financial History
Sales for Chrontel in 1996 were in the $10 million to $25 million range. Chrontel had 85 employees at the
beginning of 1998, all located at the San Jose headquarters.
Company Overview and Strategy
Founded in 1986, Chrontel is a privately-held operating unit of Singapore’s Wearnes Technology Pte. Ltd.
Chrontel uses a “partnership-based business model” and a fabless strategy, relying on Taiwan Semiconductor
Manufacturing Company (TSMC) and United Microelectronics Corporation (UMC) for fabrication of its multimedia
products. Chrontel’s core competencies are in mixed-signal IC design; video signal processing; innovative
product features; and the use of full custom layout for precise product tuning.
Based on these core competencies, Chrontel develops what it calls “visually oriented multimedia solutions.”
Chrontel targets the convergence (TVs/PCs/communications) segment of the consumer multimedia market which
it assesses as “poised for significant growth.” Target applications include PC-TVs, DVD players, set-top boxes,
video CDs, Internet web browsers and video conferencing.
Chrontel currently produces a variety of clock chip products, video encoder products, and video DACs and
multiplexers, and has a video camera IC now under development. Chrontel entered the video encoder market as a
brand new player in 1996, Chrontel claims to be the world's leading maker of these devices, shipping more than
one million encoders per month. Chrontel expects to maintain its leadership position by offering an expanded
range of encoders and by continuing its aggressive video encoder marketing program.
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Chrontel
North American Company Profiles
Chrontel offers its products through a worldwide network of distributors and manufacturers' sales representatives,
including 17 U.S. manufacturer sales representatives across 20 states and another 17 international distributors
located in Canada, Mexico, England, Wales, Austria, Germany, Israel, Italy, Hong Kong, Japan, Korea, Singapore
and Taiwan. Sager Electronics is Chrontel’s U.S. distributor, with offices in 19 states.
Management
David Soo, Ph.D.
Gene McCown
Lawrence Tse
Gary Salter
Demonder Chan
Ted Friedland
Kenneth Lowe
Founder, President and Chief Executive Officer
Vice President, Finance and Chief Financial Officer
Vice President, Engineering
Vice President, Advanced Technology
Vice President, Systems and Software Engineering
Vice President, Sales
Vice President, Marketing
Products and Processes
Chrontel’s name is based on its initial sole product line of clock chips. Chrontel has since expanded its product
portfolio, but continues to offer an innovate and broad range of clock synthesizer products including graphics
clock generators and video encoders, true-color ChronDAC clock generators, motherboard clocks, Rambuscompatible clocks, dual programmable clock generators and general purpose device clocks.
Chrontel claims to be the world's leading supplier of PC-TV encoder solutions, shipping over one million units per
month into PC, video CD and web browser applications. Its CH7002 is positioned as the industry’s first standalone, scalable PC-to-TV encoder chip, and is fully Microsoft PC ‘97 compliant. The chip incorporates proprietary
TrueScale rendering technology to optimize images to NTSC or PAL TV standards. It is also fully programmable
through an I2C input port. The CH7003, which began shipping in August 1997, uses a digital input interface.
MPEG-to-TV encoders are another major product area for Chrontel. The company claims that its flagship
CH7201B chip has captured more than 75 percent of the video CD market, which though largely limited to the
PRC market, is supposedly expanding rapidly in India and South America. Chrontel is in the early stages of
developing a DVD-targeted product which will be Macrovision compliant and will be implemented using a 0.5
micron die.
Chrontel manufactures digital color key video mixers, analog color key devices and video DACs. It introduced an
8-bit version of its video mixer in Q1 1997, and plans to integrate DACs and muxes with video encoders in the
future.
Chrontel is developing a video camera IC featuring an active CMOS sensor designed for multiple applications
including video conferencing, security and entertainment. Target capabilities for the chip include SIF resolution of
353x228, CCIR 601 digital output and up to 30fps speed.
Chrontel’s overall product direction is to offer more integration and cost reductions with a systematic targeting of
multimedia market requirements.
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North American Company Profiles
Chrontel
Key Agreements
•
Chrontel has partnerships with 2D/3D graphics chipmakers such as Cirrus Logic and S3. In the MPEG camp,
Chrontel has teamed up with several MPEG chip manufacturers including C-Cube Microsystems and ESS
Technology.
•
Chrontel and its IC partner, Cirrus Logic, jointly developed a fully PC '97 compliant integrated multimedia
reference design which enables PC users to view high-quality 2D, 3D and video images on a standard TV. The
reference card is based on Chrontel's CH7002 VGA-to-NTSC/PAL encoder and Cirrus' Laguna 3D-AGP
graphics controller. Being incorporated by OEMs, the card will allow such large-format applications as 3D
games, web browsing, video playback and video conferencing.
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Cirrus Logic
North American Company Profiles
CIRRUS LOGIC
Cirrus Logic, Inc.
3100 West Warren Avenue
Fremont, California 94538-6423
Telephone: (510) 623-8300
Fax: (510) 226-2240
Web Site: www.cirrus.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Cirrus Logic K.K. • Tokyo, Japan
Telephone: (81) (3) 3340-9111
North America: Cirrus Logic, Inc. • Austin, Texas
Telephone: (512) 445-7222
Europe:
Cirrus Logic, Inc. • United Kingdom
Telephone: (44) (1727) 872424
Asia-Pacific:
Cirrus Logic, Inc. • Taiwan
Telephone: (886) (2) 2718-4526
Financial History ($M), Fiscal Year Ends March 28
Sales
Net Income
R&D Expenditures
1993
355
21
73
1994
557
45
127
1995
889
61
166
1996
1,147
(36)
239
1997
917
(46)
231
1998
954
36
180
Employees
1,353
1,854
2,331
3,500
2,600
1,636
Ownership: Publicly held. NASDAQ: CRUS.
Company Overview and Strategy
Cirrus Logic Inc. is a premier supplier of system-level integrated circuits that demand high-performance mixedsignal processing. The company combines its systems, mixed-signal and silicon expertise to create innovative
solutions for high-volume applications in data storage, networking and multimedia for both computing and
consumer electronics markets, as well as ultra-precision data acquisition applications in industrial automation and
instrumentation markets.
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North American Company Profiles
Cirrus Logic
Founded in 1984, Cirrus Logic completed its initial public offering in 1989. The company grew rapidly in the
ensuing seven years and reached a billion dollar annual revenue run rate, faster than any other Silicon Valley
semiconductor manufacturer. This remarkable growth was highlighted in September 1997, when Deloitte &
Touche LLP and Joint Venture: Silicon Valley Network announced the winners of the “Silicon Valley Fast 50.” At
this annual tribute, special recognition was given to the fourteen companies that placed in the “Fast 50” for three
consecutive years. With 569 percent revenue growth over the 1992-1996 period, Cirrus Logic ranked tenth in
this distinctive group.
Cirrus Logic has amassed a rich portfolio of intellectual property over its years in business. The company currently
holds more than 750 patents (issued or pending), a number of which have set new industry standards.
Approximately 40 percent of these patents involve mixed-signal technology.
Focusing on high-performance, mixed-signal chip solutions that leverage its innovative analog circuit design
techniques and algorithmic software expertise, Cirrus Logic targets emerging and existing high-growth markets
that are undergoing high rates of technological change. The company enables high-growth markets by
anticipating transitions and developing unique system-level chip solutions ahead of those translations. Following
this strategy, Cirrus Logic continues to add high value to major brands worldwide.
Within the continental United States, Cirrus Logic operates from its headquarters in Fremont, California and a major
site in Austin, Texas, as well as from its design centers in Greenville, South Carolina; Raleigh, North Carolina;
Broomfield, Colorado and other locations. Internationally, the company operates from offices in Europe, Japan
and Pacific Asia. The company’s products are sold under its own name as well as the Crystal™ product brand,
which is well established in industrial automation and consumer/professional audio markets.
Cirrus Logic is a partner in two wafer fabs: MICRUS with IBM in East Fishkill, New York, and Cirent Semiconductor
with Lucent Technologies in Orlando, Florida. These joint ventures reinforce the company’s manufacturing
strategy of balancing joint-venture ownership with its strong foundry relationships. With this strategy, Cirrus Logic
expects to realize cost efficiencies that come from balancing direct owned capacity with foundries—plus the early
and direct access to world-class process technologies.
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Cirrus Logic
North American Company Profiles
Cirrus Logic has invested substantially in R&D and in the acquisition of key technologies to develop its “systems in
silicon” expertise. Past acquisitions include Pixel Semiconductor (1991), Crystal Semiconductor Corporation
(1991), Acumos Inc. (1992), Pacific Communication Sciences, Inc. (1993), PicoPower Technology, Inc. (1994),
the 3D graphics chip technology of Austek Microsystems (1994), and the graphics and disk interface IC
businesses of Appian Technology (1994). The intellectual property gain from these acquisitions, combined with
Cirrus Logic’s on-going research and development, have enabled the company to broaden and deepen its
technology in the areas of mixed-signal design, digital audio, graphics acceleration, modulation/demodulation
algorithms, and digital wireless communications.
As part of the company’s streamlining efforts in fiscal 1996, certain acquisitions were divested, including
PicoPower Technology (sold to National Semiconductor in May 1996), PCSI’s Wireless Infrastructure Equipment
Group (sold to ADC Telecommunications in December 1996), and PCSI’s Wireless Semiconductor Group (sold to
Rockwell Semiconductor Systems in January 1997).
With approximately 2,600 employees worldwide, Cirrus Logic operates with a division infrastructure designed to
drive high product development synergy within key markets and high customer satisfaction. The company’s four
market-focused divisions are profiled under “Products and Processes.”
Management
Michael L. Hackworth
Thomas F. Kelly
George N. Alexy
Edward C. Ross
Hank Josefczyk
Ronald K. Shelton
Steven Dines
Michael D. Shealy
Eric C. Broockman
Halappa Ravindra
Satish K. Gupta
Robert F. Donohue
Patrick V. Boudreau
Thomas P. Rigoli
Chairman and Chief Executive Officer
Office of the President, Chief Operating Officer
Office of the President, Chief Products and Marketing Officer
President, Technology and Manufacturing Group
Senior Vice President, Sales
Vice President, Finance and Chief Financial Officer
Vice President and General Manager, Mass Storage Products Division
Vice President and General Manager, Communications Products Division
Vice President and General Manager, Crystal Semiconductor Products Division
Vice President, Research and Development
Vice President, Corporate Marketing and Business Development
Vice President and Chief Legal Officer
Vice President, Human Resources
Vice President, Corporate Communications
Products and Processes
Cirrus Logic’s broad portfolio of products emanate from four market-focused divisions:
•
Mass Storage Products Division addresses the increasing demand for higher-storage capacity and faster
information access with high-performance mixed-signal chip solutions for both magnetic and optical moving
media. A long-time market leader in the magnetic drive segment, Cirrus Logic has more recently begun strong
penetration into the optical segment. Using advanced mixed-signal processing to integrate drive electronics,
Cirrus Logic has led the industry with innovations such as PRML (Partial Response Maximum Likelihood) readchannel chips, which enable disk drive makers such as Seagate and Western Digital to pack more data on a
magnetic platter. Cirrus Logic is also bringing similar innovations to the optical market working with customers
such as Sony.
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North American Company Profiles
Cirrus Logic
•
Communications Products Division serves three key communications markets. In the wide area and
local area networking (WAN and LAN) infrastructure equipment market, the division provides: advanced T1/E1
chip solutions to a large base of WAN customers; an expanding breadth of LAN products including 10BASE-T
and 100BASE-TX/FX Ethernet chips to key customers such as Bay Networks; and a solid portfolio of highly
integrated, multiprotocol engines to industry leaders such as Cisco Systems. In the intelligent “network-aware”
appliance market, the company focuses on emerging WEB-centric TV and telephony markets as well as the
new high-end cellular phone and PDA segments that demand high integration. The company also offers CardBus (PC Card) chips that enable portable PC “bridge applications” not only to desktop PCs but also to network
infrastructure and industrial equipment.
•
PC Products Division offers advanced multimedia chip solutions for personal computing and home
entertainment markets. Leveraging its powerful PC product platforms (CrystalClear™ Audio; Languna3D™
Graphics/Video; and FastPath™ Telephony), Cirrus Logic is focused on delivering system-on-a-chip solutions
that speed the development and time-to-market of affordable multimedia PCs and PC-based entertainment
appliances. Cirrus Logic’s platforms enable customers to provide CD-quality audio, cutting-edge 3D
graphics/video, and high-speed Internet access, plus the opportunity to achieve high-level system integration.
Customers include major PC manufacturers such as Compaq, Dell, Hewlett-Packard and IBM.
•
Crystal Semiconductor Products Division focuses its advanced mixed-signal chip solutions on
consumer electronics, industrial automation and instrumentation markets. The patented delta-sigma
technology pioneered by this division is today an industry standard technique for analog-to-digital (A/D)
conversion, and key to achieving ultra-precision data acquisition. Moreover, the high-performance mixedsignal design techniques that originate in this division are applied to chip solutions across Cirrus Logic’s
product line. Products sold under the Crystal brand serve consumer/professional audio customers such as
Harmon International, Philips, and Blaupunkt as well as industrial/instrumentation customers such as Rockwell
Automation and Schlumberger.
Semiconductor Fabrication Facilities
Cirrus Logic currently manufactures most of its IC products using 0.35µm and 0.6µm triple-layer-metal CMOS
process technologies. The company balances joint venture fab ownership (see Key Agreements) with the use of
foundries.
In late 1995, Cirrus Logic announced a program to expand its manufacturing infrastructure, targeting 0.35µm and
0.25µm process capabilities. The program called for the company to invest approximately $2 billion over a fiveyear period. In early 1997, the amount was reduced by half.
This program resulted in the expansion of MiCRUS and the formation of Cirent Semiconductor, a new joint venture
with Lucent Technologies, that operates within an existing Lucent wafer manufacturing facility in Orlando, Florida.
Cirent is 40 percent owned by Cirrus Logic and 60 percent by Lucent Technologies. The two firms share the
production output of the new 200mm wafer facility, which initially focused on 0.35µm, and is now migrating to
0.25µm processing.
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Cirrus Logic
North American Company Profiles
With both of its joint manufacturing ventures in production, Cirrus Logic has reduced its dependence on
foundries. Whereas, the company used a dozen foundries before the joint ventures, the company now depends
on less than half that number to meet its production needs. Cirrus Logic continues to nurture its foundry
relationships, which include long-standing relationships with TSMC and UMC.
MiCRUS
(Joint venture with IBM)
1580 Route 52
Hopewell Junction, New York 12533
Telephone: (914) 892-2121
Wafer size: 200mm
Process: CMOS
Feature sizes: 0.25µm-0.6µm
Cirent Semiconductor
(Joint venture with Lucent)
9333 South John Young Parkway
Orlando, Florida 32819
Telephone: (407) 345-6000
Wafer size: 200mm
Process: CMOS
Feature sizes: 0.25µm, 0.5µm
Key Agreements
• IBM and Cirrus Logic formed a joint manufacturing venture called MiCRUS in 1994. IBM and Cirrus Logic own
52 percent and 48 percent of MiCRUS, respectively. Volume production of logic chips for Cirrus and memory
ICs for IBM began in mid-1995. The agreement does not include product and/or technology exchange. In
1996, Cirrus Logic entered into a similar joint venture agreement with Lucent Technologies to form Cirent
Semiconductor in Orlando, Florida. Cirrus Logic has access to the production outputs of up to 55 percent and
25 percent of the MiCRUS and Cirent fabs, respectively.
• Cirrus Logic is a long-time licensee of Advanced RISC Machines (ARM) Ltd., and as such licensed to embed
ARM processors into its chip solutions.
•
Chrontel and its IC partner, Cirrus Logic, jointly developed a fully PC '97 compliant integrated multimedia
reference design which enables PC users to view high-quality 2D, 3D and video images on a standard TV. The
reference card is based on Chrontel's CH7002 VGA-to-NTSC/PAL encoder and Cirrus' Laguna 3D-AGP
graphics controller. Being incorporated by OEMs, the card will allow such large-format applications as 3D
games, web browsing, video playback and video conferencing.
• In 1996, Cirrus Logic entered into a licensing agreement with U.S. Robotics that gave the company rights to
use U.S. Robotics’ x2 protocol for high-speed (56Kbps) access. Cirrus Logic’s software configurable line of
FastPath modem chipsets is currently being upgraded to the new International Telecommunications Union
(ITU) worldwide standard.
• Cirrus Logic licensed the Rambus high-performance DRAM interface architecture in early 1995.
pioneered the use of the Rambus in 3D graphics accelerators.
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Cirrus
North American Company Profiles
Compensated Devices, Incorporated
COMPENSATED DEVICES , INCORPORATED (CDI)
Compensated Devices, Incorporated
22 Corey Street
Melrose, MA 02176
Telephone: (781) 665-1071
Fax: (781) 665-7379
Web Site: www.cdi-diodes.com
Email: salescdi@aol.com
Discrete Semiconductor Manufacturer
Founded: 1974
Financial History ($M)
Sales
Employees
1998
10
100
Ownership: Privately held.
Management
Thomas Kachel
Don Smith
Charles Smith
Elizabeth Parker
Thomas Briand
Peter Haxton
Lorraine Goodhue
President
Vice President, Engineering
Vice President, Marketing (Scottsdale, AZ 602-990-7326)
Manager, Product
Manager, National Sales
Manager, Quality Assurance
Manager, Human Resources
Products and Processes
CDI manufactures Current Regulator Diodes, Schottky Diodes and Rectifiers, Temperature-Compensated Voltage
Reference Diodes, and Zener Voltage Regulator Diodes. Products are available for the commercial market and for
the military market (JAN, JANHC, JANKC, JANTX, JANTXV, JANS).
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C.P. Clare Corporation
North American Company Profiles
C.P. CLARE CORPORATION
C.P. Clare Corporation
78 Cherry Hill Drive
Beverly, Massachusetts 01915-1048
Telephone: (978) 524-6700
Fax: (978) 524-4700
Web Site: www.cpclare.com
IC Manufacturer
Financial History ($), Fiscal Year Ends March 29
Sales
R&D Expenditures
Net Income
1993
75,699
2,148
689
1994
75,970
2,489
715
1995
95,992
3,532
3,079
1996
127,928
4,447
7,734
1997
128,161
6,543
(6,911)
1998
156,271
8,869
8,312
Capital Equipment
—
—
6,477
9,135
15,047
—
Employees
—
—
—
—
1,474
—
Ownership: Publicly held. NASDAQ: CPCL.
Semiconductor relays accounted for 47 percent and 37 percent of the Company's net sales in fiscal 1997 and
1996, respectively.
Company Overview and Strategy
Founded in 1937, C.P. Clare was acquired by General Instrument (GI) in 1967 only to be divested by GI to Theta-J
Corporation in 1989. In January 1997, the company consolidated its headquarters into a newly constructed facility
in Beverly, Mass.
C.P. Clare is a leading provider of small signal semiconductor and electromagnetic switches and relays. Its primary
markets are telecommunications and data communications. However, it also sells to a wide range of other markets
including consumer electronics, appliances, computer peripheral, gaming equipment, automotive, aerospace,
automatic test equipment, industrial control and instrumentation. The communications industry represents the
company’s largest market due to the ubiquity of switch and relay technology, and the need for integrated
solutions, in that market.
The company is organized around four strategic business units: Semiconductor, Reed Relay, Surge Arrestor and
Advanced Magnetic Products (AMP).
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North American Company Profiles
C.P. Clare Corporation
C.P. Clare’s corporate development strategy is to capitalize on semiconductor opportunities, focus on the
communications industry as a market, increase and enhance new product development, reduce complexity and
costs of operations, and increase inter-unit portfolio synergies to better leverage its corporate brand and customer
franchises. The company therefore has a two-prong segmentation strategy: provide customized solutions and
leverage resources by selling complementary products across all product lines, in both existing and new markets.
C.P. Clare has 21 distributors worldwide, including 11 in the U.S., as well as 12 sales “representatives”
organizations, three of which are not also distributors. With branch units and 700 total personnel worldwide, such
as U.S.-based Allied Electronics’ Isando, South Africa unit, Allied Electronics Components (Pty.) Ltd.
Management
Corporate
Arthur R. Buckland
Michael J. Ferrantino
William D. Reed
Thomas B. Sager
Robert M. Palladino
Richard E. Morgan
Harsh Koppula
Mike Ferrantino
Bill Miller
JoAnn McDonald
Rose Ferrara
Pat Swiencicki
Donna Boland
Lori M. Henderson
President and Chief Executive Officer
Chief Operating Officer
Executive Vice President, Sales and Marketing
Vice President and Chief Financial Officer
Vice President and Corporate Treasurer
Vice President, Human Resources
Vice President and General Manger, Advanced Magnetic Prods.
Vice President and General Manager Components Products
Vice President, Manufacturing
Major Accounts Manager
Distribution Manager
Distributor Sales Manager
Director of Corporate Customer Service
Corporate Counsel and Clerk
Products and Processes
C.P. Clare’s core competencies are analog semiconductor processes and design, optical isolation, wafer
technology and multi-chip packaging, package molding, coil winding, ceramic-to-metal sealing and materials
processing.
C.P. Clare Semiconductor is a leading small signal relay manufacturer. The company believes it pioneered the
application of semiconductor technology into relay products. Its working assumption is that semiconductor relays
represent the fastest growing segment of the small signal relay market. The unit offers over 270 relay
configurations.
Recent products include the (7/96) Cybergate 2000, the (8/96) dual linear optocoupler LOC210P, LOC211P
models and the LIA100 Series, the (10/96) Cybergate 2001 and the (1/97) LOC110/111 and LOC112 enhanced
optocoupler series.
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C.P. Clare Corporation
North American Company Profiles
The Circuits Division’s latest product is its telephone line interface, the Cybergate Series Data Access
Arrangement (DAA) Module. Cybergate application targets include Home Medical Devices, Utility Meters,
Voicemail Systems and Telephony, PBX Systems and Set-Top Boxes. A turnkey device, the Cybergate is V.34
compatible (28.8Kbps) and is available in a 2-4 wire hybrid version, and domestic and international versions. The
Cybergate 2000 DAA series was introduced in order to penetrate the analog modem market where multiple
discrete components can be displaced by the small package size Cybergate.
C.P. Clare Reed Relay manufactures a broad range of dry and wetted reed switches and relays. These products
operate electromagnetically and their largest market is the telecommunications industry. In August 1996, the unit
introduced an instrument grade single in-line relay, the SIL4 Reed Relay, and the MVS Series Reed Relay, 1 Form
A Reed Switch. The unit’s DYAD product was the first commercially available switch to have surface mount
capabilities. The unit’s wetted reed high performance switch uses a liquid mercury film which is applied or wetted
to the electrical contacts. These products are used primarily in telecommunications applications (CO equipment;
telephone switching gear and test systems; PBXs), as well as in process control applications and precision
measuring and water meter applications.
In fiscal 1997, the Reed Relay unit also developed a standard telecommunications transformer designed to
replace isolation transformers used in large volumes in communications applications. Fulfilling the complementary
products strategy, Reed Relay also began offering a modem isolation transformer in the semiconductor DAA
product in fiscal 1997.
The C.P. Clare Surge unit manufactures a line of surge arrestors used primarily for circuit protection in
telecommunications, data transmission lines and cable TV systems. These products are often used in conjunction
with semiconductor and reed relays.
C.P. Clare AMP provides application-specific engineering, design and manufacturing subcontracting services for
magnetic components. Its products are used in applications such as transformers and lighting ballasts. AMP
introduced its Modem Isolation Transformer (MIT) line in July 1996.
Semiconductor Fabrication Facilities
All of C.P. Clare’s manufacturing facilities are ISO-9001 certified. Manufacturing and assembly facilities total about
354,400 square feet of floor space. The St. Louis facility is 20,000 square feet, the Guadalajara, Mexico facility is
194,000 square feet, and the Chitu, Taiwan facility is 25,000 square feet.
Aside from its headquarters consolidation, which houses its 5 inch wafer fabrication facility (32,400 square feet),
the company is also consolidating and automating its facilities. Additionally, in mid-1997 the company anticipated
adding capacity to the headquarters fabrication facility. During fiscal 1997, it expanded manufacturing operations
in Mexico.
Most fabricated chips are shipped for assembly to a subcontractor in the Philippines, although some are sent to
the company's Guadalajara, Mexico facility.
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North American Company Profiles
C.P. Clare Corporation
The company manufactures dry reed switches in St. Louis, Missouri and assembles relays in Chitu, Taiwan and
Guadalajara, Mexico. Wetted reed switches and some wetted reed relays are purchased from TMC (Tongeren,
Belgium). Magnetic components are designed and assembled in Guadalajara, Mexico.
Advanced Magnetic Products (AMP)
AMP Plant - Mexico
Calz. Gonzalez Gallo 1269
Col. Atlas
Guadalajara, Jal. Mexico 44870
Telephone: (52) (36) 191720
Fax: (52) (36) 191730
Sensors Division
Sensors Manufacturing
48 Progress Parkway
Maryland Heights, MO 63043
Telephone: (314) 434-0311
Fax: (314) 434-1521
C.P. Clare Mexicana, S.A. de C.V.
Blvd. Gral. Marcelino
Garcia Barragan 1610
Guadalajara, Mexico 44870
Telephone: (52) (36) 501031
Fax: (52) (36) 190361
C.P. Clare Taiwan, Corporation
91, Tung Hsin Street
Chi Tu, Keelung, Taiwan 20607
R.O.C.
Telephone: (886) (2) 4566126/9
Fax: (886) (2) 4566130/4568570
Key Agreements
•
In February 1997, C.P. Clare’s Surge Arrestor Products Group acquired Wickmann GmbH’s gas discharge tube
(GDT) surge protection product line. Under a reciprocal supply agreement, C.P. Clare moved the technology
and assets to its factory in Guadalajara, Mexico from which it will supply Wickmann. Additionally, C.P. Clare now
sells these products to its customers worldwide through its existing sales and distribution channels to
complement its line of surge arrestors. The acquisition was positioned as an investment designed to leverage
brand and distribution channel franchises, and to enhance penetration of the international telecommunications
market. It was also intended to complement the company’s 11/96 partnership with Harris Semiconductor to
resell their surge protection product line.
•
In January 1997, C.P. Clare completed the sale of its Tongeren Manufacturing Company (TMC) to Gunther
GmbH. The companies entered into a long term supply contract in which Gunther Belgium will supply its
mercury switches and relays exclusively to C.P. Clare, (which will continue to offer these products worldwide
through its existing sales channels). TMC was renamed Gunther Belgium. The sale was aimed at exiting a high
labor cost region and a mature product with serious environmental liabilities.
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Cypress Semiconductor
North American Company Profiles
CYPRESS S EMICONDUCTOR
Cypress Semiconductor Corporation
3901 North First Street
San Jose, California 95134-1599
Telephone: (408) 943-2600
Fax: (408) 943-2796
Web Site: www.cypress.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Cypress Semiconductor Japan K.K. • Shinjuku-ku, Tokyo, Japan
Telephone: (81) (3) 5296-0781 • Fax: (81) (3) 5269-0788
Europe:
Cypress Semiconductor International • Waterloo, Belgium
Telephone: (32) (2) 357-02-20 • Fax: (32) (2) 357-02-30
Asia-Pacific:
Cypress Semiconductor Singapore • Singapore
Telephone: (65) 735-0338 • Fax: (65) 735-0228
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
272
(21)
65
32
1993
305
8
50
56
1994
406
50
53
112
1995
596
102
72
195
1996
528
53
84
195
1997
544
18
94
138
Employees
1,529
1,262
1,423
1,859
2,171
2,770
Ownership: Publicly held. NASDAQ: CY.
Company Overview and Strategy
Founded in 1983, Cypress Semiconductor is a designer, developer, and manufacturer of high-performance digital
integrated circuits for a variety of markets including networking, military, computers, telecommunications, and
instrumentation. Cypress’ product offerings include SRAMs, EPROMs, specialty memories, programmable logic
devices (PLDs), data communications products, timing devices, and USB microcontrollers.
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North American Company Profiles
Cypress Semiconductor
Suffering its first revenue decline in 1992, Cypress initiated a restructuring program. From the company's
beginning, it had been known for its niche-market strategy of acquiring and managing smaller autonomous
businesses. That approach, however, has been modified to take advantage of Cypress' lowered manufacturing
costs, allowing the company to compete effectively in high-volume markets such as the PC market. Cypress has
also turned to a more market-driven focus.
Restructuring activities included the selling of its SPARC processor subsidiary, Ross Technology, to Fujitsu and
the realignment of its subsidiaries — Aspen Semiconductor and Multichip Technology — under the company's
four business units: the Memory Products Division (MPD), the Programmable Products Division (PPD), the Data
Communications Division (DCD), and the Computation Products Division (CPD). Cypress also made a few
strategic acquisitions, including Seattle-based IC Designs, Inc., a supplier of clock-frequency synthesis chips for
the PC market, and the high-speed FCT logic product line from Performance Semiconductor.
During 1997, Cypress’ sales grew to $544 million. Cypress entered 1998 with a reinforced strategy to continue
developing new products and processes utilizing its proprietary technologies to address the needs of its target
markets as well as enter new markets in order to reduce its dependence on specific markets.
In 1997, Cypress introduced a record number of new products. Cypress debuted a 4Mbit SRAM, low-power
devices for mobile applications, the NoBL (TM) SRAMs for networking applications, and the company’s first 0.35
micron device, a 64K x 16 SRAM targeted to work with DSPs.
Cypress also has introduced new products for other applications including DUB and SMPTE video, ATM, PC
clocking solutions, the world’s largest First-In First-Out (FIFO) memory, new universal serial bus (USB)
microcontrollers, high-speed logic products, and 3.3V compatible CPLDs.
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Cypress Semiconductor
North American Company Profiles
Management
Pierre Lamond
T.J. Rodgers
Antonio Alvarez
Dan Barrett
Lou Chetaud
Bernard Glasauer
Emmanuel Hernandez
Jeff Kaszubinski
Paul Keswick
Jim Kupec
Jeff Linden
Lothar Maier
J. Daniel McCranie
Christopher Norris
Rich Parker
John Ramacciotti
R. Michael Starnes
Joyce Sziebert
John Torode
Edward Rodriguez
William Verde
Michael Villott
Christopher Seams
David Fleischer
Thomas Knueppel
Jagdish Belani
Anthony Cantu
Gerald Cummings
Neil Weiss
Chairman
President and Chief Executive Officer
Vice President, Memory Products Division and Research and Development
Vice President, European Sales and Marketing
Vice President, Worldwide Assembly and Test Manufacturing
Vice President, Product Engineering
Vice President, Finance and Administration and Chief Financial Officer
Vice President, Manufacturing Operations
Vice President, New Products Development
Vice President, Business Development
Vice President and Corporate Controller
Vice President, Worldwide Manufacturing
Vice President, Marketing and Sales
Vice President, Programmable Logic Division
Vice President, North American Distribution
Vice President, Procurement
Vice President, Process Technology
Vice President, Human Resources
Vice President and Chief Technical Officer
Vice President, Data Communications Division
Vice President, Strategic Accounts
Vice President, North American Sales
Vice President, Worldwide Wafer Manufacturing
Vice President, Asia Pacific
Vice President and Corporate Controller
Vice President, Packaging Technology
Vice President, Quality
Vice President, Central Manufacturing Operations
Tax and Treasury
Products and Processes
Highlights of Cypress Semiconductor's product portfolio are given below. Its integrated circuits are fabricated
using proprietary 0.5µm, 0.65µm, and 0.8µm CMOS and BiCMOS technologies.
SRAMs
• 4K to 4M CMOS SRAMs
• 64K and 256K BiCMOS SRAMs
• 64-bit x 18 Cache tag RAMs
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Specialty Memories and Memory Modules
• Industry-standard FIFOs
• Bidirectional FIFOs
• Clocked FIFOs
• Asynchronous FIFOs
• Dual-port RAMs
• Memory accelerator MCMs
North American Company Profiles
Cypress Semiconductor
UltraLogic PLDs/Tools
• Flash370 CPLDs (44-288 pins)
• Development tools
Industry-Standard PLDs
• 20-pin CMOS/BiCMOS PLDs
• 16V8 GAL-compatible PLDs
• 22V10 flash/BiCMOS PLDs
• MAX CPLDs (28-84 pins)
PROMs/EPROMs
• 4K to 512K CMOS PROMs
• 4K-1M CMOS EPROMs
Data Communications
• HOTLink point-to-point communications
• Fibre Channel, and ATM/
SONET transceivers/receivers
Timing Technology Products
• Motherboard frequency synthesizers
• Low-power system logic devices
• Graphics frequency synthesizers
• Programmable products
• Custom oscillators
• Pentium clock synthesizers/drivers
Logic and Bus Products
• FCT logic chips
• VMEbus controllers
• Programmable skew clock buffers
• Low-skew clock buffers
Semiconductor Fabrication Facilities
Several strategic activities took place at Cypress during the late-1997 to early-1998 timeframe. Cypress
consolidated its manufacturing to two main fabs. Fab II in Round Rock, Texas now does all of Cypress’ non-SRAM
based manufacturing, including data communications, programmable logic, and USB microcontrollers. Fab IV in
Bloomington, MN — the company’s 8-inch, 0.35 micron facility — will produce all of Cypress’ SRAM-based
products. Cypress’ Fab III, also in Bloomington, has been closed for renovation and will come back on-line as a
0.25 micron facility when that capacity is needed. Cypress spent $85 million in 1Q98 for this restructuring, which
will significantly reduce costs.
Cypress Semiconductor Inc.
3901 North First Street
San Jose, California 95134
Telephone: (408) 943-2653
Fab I
Cleanroom size: 12,000 square feet
Capacity (wafers/week): 1,000
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: R&D
Feature sizes: 0.35µm-0.8µm
Cypress Semiconductor (Texas) Inc.
17 Cypress Drive
Round Rock, Texas 78664
Telephone: (512) 244-7789
Fab II (17 percent owned by Altera)
Cleanroom size: 25,000 square feet
Capacity (wafers/week): 2,700
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: SRAMs, PLDs, FPGAs, EPROMs,
datacom ICs.
Feature sizes: 0.5µm-1.2µm
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Cypress Semiconductor
Cypress Semiconductor (Minnesota) Inc.
2401 East 86th Street
Bloomington, Minnesota 55425
Telephone: (612) 851-5100
Fab III
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 2,400
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: SRAMs, PLDs, FPGAs, logic chips,
datacom ICs.
Feature sizes: 0.5µm-1.2µm
North American Company Profiles
Cypress Semiconductor (Minnesota) Inc.
2401 East 86th Street
Bloomington, Minnesota 55425
Telephone: (612) 851-5100
Fab IV
Cleanroom size: 30,000 square feet
Capacity (wafers/week): 3,000
Wafer size: 200mm
Processes: CMOS, BiCMOS
Products: SRAMs, specialty memories
Feature size: 0.5µm
Cypress Semiconductor
Round Rock, Texas
Fab V
Cleanroom size: 35,000 square feet
Capacity (wafers/week): 5,000 (when fully equipped)
Wafer size: 200mm
Processes: CMOS, BiCMOS
Products: SRAMs, EPROMs, Logic ICs
Feature sizes: 0.25µm-0.5µm
(Production tentatively scheduled for 1998).
Key Agreements
• In March 1997, QuickLogic and Cypress terminated the Existing Agreement, and replaced it with a new
arrangement whereby the company’s FPGA products will no longer be second sourced by Cypress. In
exchange for the termination of the Existing Agreement and the reversion of the rights to the intellectual
property developed thereunder to the company, the company paid $4.5 million in cash and agreed to issue
2,603,817 shares of common stock to Cypress, resulting in a charge of approximately $23 million in the first
quarter of 1997. The 2,603,817 shares of common stock to be issued to Cypress are issuable upon the
consummation of an initial public offering by the company or by April 1, 1998, whichever is first. In addition, the
company granted Cypress certain contractual rights as to the shares of the company’s stock held by Cypress,
including the right to sell shares in this offering.
• QuickLogic and Cypress also entered into a new foundry agreement effective through the year 2001. This
agreement guarantees weekly wafer starts at established prices and yields for the company’s pASIC 1 and
pASIC 2 product families, which are fabricated using a 0.65µm three-layer metal CMOS process on 6-inch
wafers. These products will continue to be manufactured at Cypress’ Round Rock, Texas facility, and will
continue to utilize QuickLogic’s proprietary ViaLink amorphous silicon antifuse technology.
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Cyrix
North American Company Profiles
CYRIX
(A National Semiconductor Company)
Cyrix Corporation
2703 North Central Expressway
Richardson, Texas 75080-2010
Telephone: (972) 968-8388
Fax: (972) 699-9857
Web Site: www.cyrix.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures**
Employees
1992
73
8
8
7
1993
125
20
16
15
1994
246
38
25
24
1995
228
16
29
80
1996
184
(26)
32
13
150
220
309
400
391
1997*
—
—
—
—
—
*As of November 1997, Cyrix is a wholly owned subsidiary of National Semiconductor — financial information no
longer disclosed separately.
**As part of the agreement made with IBM in early 1994, Cyrix purchases substantially all of the equipment
required by IBM to manufacture Cyrix products.
Company Overview and Strategy
In November 1997, Cyrix became a wholly owned subsidiary of National Semiconductor.
Founded in 1988, Cyrix Corporation designs, develops, and markets high-performance x86 software-compatible
microprocessors for the desktop and mobile computer markets. The company seeks to serve the needs of the PC
marketplace as an alternative source for x86 microprocessors of original design with competitive
price/performance characteristics.
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Cyrix
North American Company Profiles
Fiscal 1996 was a difficult year for Cyrix financially. The transition from the old 486 product line to the 6x86™
processor did not occur as quickly as expected. The 6x86 was recognized with numerous awards for its
exceptional processing power, but it did not gain broad market acceptance until late in the year. Significant
demand for the 6x86 was experienced in 4Q96.
*As of November 1997, Cyrix is a wholly owned subsidiary of National Semiconductor. Sales no longer disclosed
separately.
Cyrix has strategic alliances with IBM Microelectronics, National Semiconductor, and TSMC for the production of its
high-performance microprocessors. These agreements support the company's current strategy to focus its
resources on product design, market development, and customer support.
Products and Processes
Cyrix’s first products were math coprocessors. The company delivered its first x86 microprocessors in 1992. It
then moved quickly to develop a full line of 486 processors with advanced power management, clock-doubling
capabilities, integrated math coprocessors, and write-back cache. In 1995, Cyrix introduced its fifth-generation
5x86 and sixth-generation 6x86 high-performance processors (the 486 products are no longer in production).
Cyrix’s 6x86 (formerly called the M1) is based on a superscalar, superpipelined architecture and a RISC core. The
6x86 was offered (no longer available) at several performance levels ranging from PR133+ to PR200+. The PR+
nomenclature suggests which specific higher-clock-rate Intel Pentium each of the members best compete with.
Cyrix launched its M2 processor (6x86MX) in May 1997. Building on the 6x86 core, the six-million-transistor M2
features Cyrix’s fully compatible MMX technology, a quadrupled (64KByte) internal Cache, enhanced memory
management, and other architectural and performance innovations. In March 1998, Cyrix announced the
6x86MX™ PR266 processor, which delivers performance comparable to systems based on a 266MHz Pentium® II
processor, at approximately half the price. The 6x86MX™ processor also provides Winstone® 98 performance on
par with similarly configured Pentium II processor systems running at 266MHz. Meanwhile, the development of
the seventh-generation processor, called the M3 is under way.
Cyrix began shipping its first MediaGX processors in early 1997. Due to the number of functions integrated onchip, the MediaGX eliminates the need for L2 Cache, memory controller, graphics controller, graphics memory,
and audio card. Cyrix’s MediaGX processors are offered at speeds of 166MHz, 180MHz, 200MHz, and 233MHz.
The MPU interfaces with the Cyrix-designed Cx5510 core logic chipset that provides a PCI-ISA bridge.
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North American Company Profiles
Cyrix
In March 1998, Cyrix announced the 233MHz MMX-enhanced MediaGX™ processor. The company currently
uses 0.35µm five-layer-metal CMOS technology for its 6x86 products. The initial MediaGX processor is being
produced with IBM’s 0.44µm three-layer-metal CMOS process, with a 0.4µm process scheduled for
implementation by the end of 1997. The 6x86MX is being produced with IBM’s 0.33µm five-layer-metal CMOS
process.
Semiconductor Fabrication Facilities
Cyrix's agreement with IBM Microelectronics was established in April 1994 and is good through the end of 1999.
As part of the agreement, Cyrix made a capital equipment investment of about $88 million in an IBM fab in 1995.
Cyrix expanded its partnership with IBM in May 1996 to increase the quantity of wafers supplied by IBM through
the end of 1997.
Key Agreements
• In November 1997, Cyrix became a wholly owned subsidiary of National Semiconductor.
• In 1Q96, Cyrix announced an agreement with Cadence Design Systems. Under the agreement, Cadence will
provide a broad range of technologies and services to Cyrix, and work together in designing Cyrix’s seventhgeneration x86 microprocessor, called the M3.
• Cyrix and IBM announced a five year agreement in early 1994 under which IBM is manufacturing Cyrix's x86compatible microprocessors. The agreement calls for the two companies to equally share the output of the
Cyrix-designed chips.
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Dallas Semiconductor
North American Company Profiles
DALLAS S EMICONDUCTOR
Dallas Semiconductor Corporation
4401 South Beltwood Parkway
Dallas, Texas 75244-3292
Telephone: (972) 371-4000
Fax: (972) 371-3715
Web Site: www.dalsemi.com
IC Manufacturer
Founded: 1984
Regional Headquarters/Representative Locations
Europe:
Dallas Semiconductor • Birmingham, England
Telephone: (44) (121) 782-2959 • Fax: (44) (121) 782-2156
Asia-Pacific:
Dallas Semiconductor Taiwan • Taipei, Taiwan
Telephone: (886) (2) 698-3940 • Fax: (886) (2) 698-3941
Financial History ($M), Fiscal Year Ends last Sunday in December
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
120
18
16
16
1993
157
26
19
21
1994
181
30
23
45
1995
233
37
29
49
1996
288
38
35
60
1997
368
65
46
59
696
748
850
1,000
1,300
1,800
Company Overview and Strategy
Dallas Semiconductor (NYSE: DS) designs, manufactures, and markets high performance CMOS ICs and
semiconductor-based systems that provide innovative and cost-effective solutions to electronic design problems
in a wide range of markets. The company's continuous new product development strategy serves as a means to
increase future revenues and avoid dependence upon a single industry, market, or customer. Its products are
sold to OEMs in the personal computer and workstation, scientific and medical equipment, industrial control,
automatic information, telecommunications, and other markets.
Positive 1997 financial results have further validated their strategy of using proprietary circuit architectures and
technologies to create non-commodity products for a broad customer base.
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Dallas Semiconductor
North American Company Profiles
Management
Charles Vincent Prothro
Chao C. Mai, Ph.D.
Michael L. Bolan
Alan P. Hale
F.A. Scherpenberg
Chairman, President and Chief Executive Officer
Senior Vice President
Vice President, Marketing and Product Development
Vice President, Finance
Vice President, Computer Products
Products and Processes
Dallas Semiconductor's product groups include:
• Timekeeping circuits
Commercial
Computing
• Microcontrollers (8-bit)
Secure MCUs
High-speed MCUs
• Non-volatile RAMs (16K to 4M)
Integrated battery backup
Intelligent sockets
• Automatic Information
Cryptographic iButton™
iButton™
• Telecommunications ICs
T1 and E1 circuits
SCSI terminators
• System extension circuits
CPU supervisors
Digital potentiometers
Thermal and battery management
• Silicon timed circuits
In 1996, Dallas’ Automatic Information product division introduced a device called the Cryptographic iButton. The
device is said to provide safer transfer of sensitive information such as credit card numbers or electronic transfer of
funds. The device consists of a processor, an arithmetic accelerator, a true time clock, a random number
generator, and 8K of SRAM.
For 1998, Dallas Semiconductor remains committed to new product development and manufacturing cost
reductions, including a more aggressive policy of shrinking the size of their chips.
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Dallas Semiconductor
Semiconductor Fabrication Facilities
Dallas Semiconductor
4401 South Beltwood Parkway
Dallas, Texas 75244-3292
Cleanroom size: 17,000 square feet (Class 1)
Capacity (wafers/week): 2,500
Wafer size: 150mm (2 lines)
Process: CMOS
Feature sizes: 0.35µm-0.6µm
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North American Company Profiles
Digital Semiconductor
North American Company Profiles
DIGITAL S EMICONDUCTOR *
Digital Equipment Corporation
Digital Semiconductor
77 Reed Road
Hudson, Massachusetts 01749
Telephone: (508) 568-6868
Web Site: www.digital.com/semiconductor
Captive IC Manufacturer
* In October 1997, Intel and Digital Equipment Corporation announced that they have agreed to establish a broadbased business relationship. Under the agreement, Intel will purchase Digital’s semiconductor operations,
including facilities in Hudson, Massachusetts, as well as development operations in Jerusalem, Israel and Austin,
Texas, for approximately $700M. The agreement is subject to U.S. government review.
Financial History ($M), Fiscal Year Ends June 30
Corporate
Sales
Net Income
Semiconductor*
Sales
Internal Sales
External Sales
Employees
1992
1993
1994
1995
1996
13,931
(2,796)
14,371
(251)
13,451
(2,156)
13,813
122
14,563
(112)
230
230
—
240
235
5
270
245
25
305
255
50
375
290
85
—
—
—
—
2,500
*Calendar year
Company Overview and Strategy
Digital Equipment Corporation (DEC) is one of the world's largest manufacturers of computers and computerrelated products. The company provides network computer systems, systems integrator, computer peripheral
equipment, software, and associated computer accessory equipment to customers in more than 100 countries.
2-129
Digital Semiconductor
North American Company Profiles
DEC began developing semiconductor products in 1975 for use in its electronic systems. In 1993, Digital
expanded its semiconductor charter to become a merchant vendor. As part of its push into the merchant market,
DEC spun out its semiconductor operation in mid-1994 to become an autonomous business unit, called Digital
Semiconductor. For the past several years, Digital Semiconductor has worked to establish itself as an
independent semiconductor vendor, but its largest customer always has been Digital Equipment, which bases its
workstations and servers on its proprietary high-performance RISC microprocessor, called Alpha. Still, the
company desires to expand its merchant focus.
Digital Semiconductor designs, manufactures, and markets a broad portfolio of semiconductor products including
its Alpha processor and PCI-based networking, bridge, and graphics/multimedia devices.
Management
Robert B. Palmer
Charles F. Christ
R.E. Caldwell
William N. Johnson
President and Chief Executive Officer
Vice President and General Manager, Components Division
Vice President, Digital Semiconductor
Vice President, Marketing, Digital Semiconductor
Products and Processes
Digital Semiconductor’s IC products include its Alpha 64-bit RISC microprocessors with speeds as fast as 533MHz;
the high-performance, low-power StrongARM 32-bit RISC microprocessor; PCI-compliant system and peripheral
logic chipsets; PCI-PCI bridge devices; Ethernet and Fast Ethernet LAN controller ICs; and graphics and
multimedia coprocessors.
Digital’s Alpha 21164 microprocessor is available in speed grades ranging from 366Hz to 533Hz. It is designed for
use in high-performance computing systems like network servers and workstations. A 600MHz version of the
21164 entered the sampling stage in early 1997. Also in early 1997, Digital announced its first Alpha chip
designed for use in a desktop PC. The 21164PC die is 34 percent smaller than its big brother 21164 and requires
86 fewer pins. The result is a high-performance 533MHz RISC microprocessor for systems that sell for as little as
$2,500.
Digital's IC products are built using primarily CMOS and bipolar technologies, with all advanced process
development centered on CMOS technology. Its leading-edge 0.35µm, four-level interconnect, CMOS-6
process technology is being used to manufacture the latest versions of the Alpha 21164.
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North American Company Profiles
Digital Semiconductor
Semiconductor Fabrication Facilities
In 1995, Digital Semiconductor sold to Motorola its South Queensferry, Scotland, fabrication facility.
Digital Semiconductor
75 Reed Road
Hudson, Massachusetts 01749
Telephone: (508) 568-4000
Fab 6
Cleanroom size: 64,000 square feet
Capacity (wafers/week): 5,000
Wafer size: 200mm
Process: CMOS
Products: MPUs, MPRs, ASICs, logic ICs, custom ICs
Feature sizes: 0.35µm, 0.5µm (eventually, 0.18µm)
Key Agreements
• Samsung Electronics became a licensee of the Alpha architecture in 1996 and is manufacturing and selling
Alpha microprocessors to its customers as an independent alternate source of Alpha technology.
• Mitsubishi agreed to be both a second source for Digital's Alpha MPUs and a development partner. The
Japanese company began producing Alphas for Digital at its Saijo facility in late 1994. Subsequently,
Mitsubishi began designing and fabricating its own versions of the RISC architecture for use in its own systems
and for sale to its own customers.
• In 1995, Advanced RISC Machines Ltd. began jointly developing with Digital and Apple Computer a family of
high-performance microprocessors compatible with the ARM RISC line. The 32-bit processor, called
StrongARM, is being produced by Digital using its 0.35µm CMOS-6 process. Volume shipments began in the
first half of 1996 and are targeted at applications in digital imaging, multimedia, set-top boxes, handheld
computers, and communications products, as well as Apple's Newton line.
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Diodes Inc.
North American Company Profiles
DIODES INCORPORATED
Diodes Inc.
3050 East Hillcrest Drive
Westlake Village, California 91362
Telephone: (805) 446-4800
Fax: (805) 446-4800
Web Site: www.diodes.com
Fabless IC Manufacturer
Founded: 1959
Financial History ($M)
Sales
Net Income
1996
56
3
1997
66
5
Ownership: Publicly held. ASE: DIO.
Company Overview and Strategy
Diodes Incorporated provides high-quality discrete semiconductor devices and customer support to leading
manufacturers in the automotive, electronics, computing and telecommunications industries. Diodes’ products
include small signal transistors and MOSFETs, transient voltage suppressors, zeners, Schottkys, diodes,
rectifiers, and bridges.
Despite pricing pressures is Asia, higher revenues and an improvement in gross margins was experienced in 1997
– gross margins grew to 27.9 percent in 1997, from 26.5 percent in the prior year. The record results reflect the
growing contribution of Kai Hong, a joint venture manufacturing facility in China. Twenty-four percent of Diodes’
1997 revenues were attributed to Asian business, compared to 14 percent the prior year.
First announced in June 1995, Kai Hong, in which the Company has invested approximately $5M, owns and
operates a facility in mainland China for the manufacture of high-quality SOT 23 products. In 1997, Diodes
recently increased their equity position in Kai Hong to 95 percent from 70 percent, and is currently implementing a
planned $12M capital equipment expansion program at Kai Hong.
In 1990, Diodes formed a technology alliance with Lite-On Group which specializes in power semiconductors.
Lite-On Group now owns 40 percent of Diodes, Inc. stock. In 1997, Lite-On Group and Vishay Intertechnology
created a joint venture, of which Diodes is now a part.
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Diodes Inc.
North American Company Profiles
Management
Michael A. Rosenberg
Joseph Liu
President
Chief Financial Officer
Products and Processes
Diodes offers the following discrete products.
•
•
•
•
•
•
Schottky diodes and rectifiers;
Switching diodes;
Zeners and transient voltage suppressors;
Standard, fast, and ultra-fast and super fast recovery rectifiers;
Bridge rectifiers; and
Small-signal transistors and MOSFETs.
Semiconductor Fabrication Facilities
Diodes Inc. has agreements with foundry facilities in Taiwan and Shanghai.
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Dionics
North American Company Profiles
DIONICS
Dionics Inc.
65 Rushmore Street
Westbury, New York 11590-4839
Telephone: (516) 997-7474
Fax: (516) 997-7479
IC Manufacturer
Employees: 25
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
1996
1.5
56
35
1997
1.8
146
40
Company Overview and Strategy
Established in 1969, Dionics is a developer, manufacturer, and marketer of innovative high-quality integrated
circuits and discrete products. It targets these devices at areas of the industrial and military markets where high
voltage, high frequency, and unusual structures are required.
Using a dielectric isolation process, Dionics has evolved from a supplier of discrete components to a manufacturer
of hybrid circuits and photovoltaic ICs, solid-state relays (SSRs), and MOSFET-drivers. The products were initially
targeted for use in digital watches, but have since made their way to markets that require high reliability that is
inherent to the dielectric isolation process.
Management
Bernard L. Kravitz
President
Products and Processes
Photovoltaic ICs, SSRs, and MOSFET-drivers.
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North American Company Profiles
Dionics
Semiconductor Fabrication Facilities
Dionics Inc.
65 Rushmore Street
Westbury, New York 11590-4839
Cleanroom size: 3,000 square feet
Capacity (wafers/week): 400
Wafer size: 100mm
Process: Dielectric isolation bipolar
Products: Photovoltaic ICs, SSRs, and MOSFET-drivers
Feature sizes: 2.0µm-5.0µm
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DSP Group
North American Company Profiles
DSP GROUP
DSP Group, Inc.
3120 Scott Boulevard
Santa Clara, California 95054
Telephone: (408) 986-4300
Fax: (408) 986-4442
Email: ir@dspg.com
Web Site: www.dspg.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
DSP Group Japan • Tokyo, Japan
Telephone: (81) (3) 3449-7851
Europe:
DSP Group Europe • Massy, France
Telephone: (33) (6) 0768-6754
Israel:
DSP Group Israel • Herzelia, Israel
Telephone: (972) 9 952-9696
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
9
(6)
4
1993
12
(0.4)
2
1994
29
4
4
1995
50
7
8
1996
53
6
8.5
1997
62
11
8.4
—
—
106
115
100
105
Ownership: Publicly held. NASDAQ: DSPG.
Company Overview and Strategy
DSP Group Inc. is a leader in the development and marketing of high-performance, cost-effective, Digital Signal
Processing (DSP) cores and integrated solutions for the consumer telephony and computer telephony markets.
By combining three key technologies — digital signal processing, speech processing algorithms and telephony
algorithms — the company is delivering a wide range of enabling application-specific ICs to these markets. DSPG’s
core designs and software are licensed by industry leaders such as NEC, LSI Logic, Samsung, Fujitsu, Siemens,
VLSI Technology, GEC Plessey, ROHM, TSMC and more.
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DSP Group
North American Company Profiles
DSP Group began business in 1987 with the purchase of a small design house that was involved in paramilitary
DSP-related design for applications such as noise cancellation and eavesdropping. The company began
developing its own DSPs and established a design center in 1990. In 1992, the company launched DSP
Semiconductors as a subsidiary to directly focus on the licensing of its technology. Since then, DSP
Semiconductors has been folded back into DSP Group and now operates as the Semiconductor Division.
The company’s strategy is to use its digital speech processing knowledge, and DSP core architecture to be a
leading supplier of DSP-based solutions for the emerging markets such as digital speech products.
Management
Igal Kohavi
Eli Ayalon
Avi Basher
Martin Skowron
Gideon Wertheizer
Chairman
President and Chief Executive Officer
Vice President, Finance, and Chief Financial Officer
Senior Vice President, Operations
Corporate Vice President, Marketing
Products and Processes
DSP Group has developed a family of low-power consumption, low-cost DSP core architectures that are suitable
for consumer, mobile computer, and communications products. The company’s products are manufactured using
0.35µm and 0.6µm CMOS technologies.
SmartCores™ Products
• The company’s SmartCores™ products are a family of standard DSP macrocells for use in standard cell ASIC
libraries. The SmartCores™ are designed for speech/audio processing, telecommunications, digital cellular
and embedded control applications. The first three members of the family are the PineDSPCore®, the
OakDSPCore®, and the TeakDSPCore™ all of which are 16-bit general-purpose, low-power, low-voltage, and
high-speed DSP core architectures. The PineDSPCore® is based on 0.8µm or 0.6µm double-level-metal
CMOS technology (scaleable to 0.5µm and below). The OakDSPCore® is based on 0.6µm double-level-metal
CMOS technology (scaleable to 0.35µm and below). The TeakDSPCore™ is a “Soft Core” design and is
portable to any technology.
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DSP Group
North American Company Profiles
TrueSpeech® Software
• TrueSpeech® is a proprietary software-based digital speech compression technology. It is designed for a wide
range of applications, including video conferencing, computer telephony, the Internet, and personal
recorders.
CT Products
• DSP Group’s CT products are coprocessors that implement real-time TrueSpeech® compression and
decompression functions. They are available for Windows 95 messaging, DSVD (digital simultaneous voice
and data) modem, video conferencing, and multimedia visual telephony applications.
TAD Related Products
• The company’s D6000 family of products are for digital telephone answering device (TAD) and voice recorders.
They implement all functions of TrueSpeech® compression and decompression, voice prompts, voice
recognition, telephone line signal processing, and memory management.
Current licensees of the company’s DSP Core architectures include Adaptec, Asahi Kasei Microsystems, AtmelES2, DSP Communications, GEC Plessey Semiconductors, Hyundai/Symbios, ITDK Semiconductors, Integrated
Circuit Systems, LSI Logic, NEC, Rohm, Samsung, Siemens, TI/Silicon Systems, TEMIC, TSMC, VLSI
Technology, and Fujitsu among others.
Licensees of DSP Group’s TrueSpeech® technology include Atmel, Cirrus Logic, Creative Labs, Intel, LSI Logic,
Lucent Technologies, Microsoft, Siemens, Sierra Semiconductor, U.S. Robotics, and VLSI Technology.
Semiconductor Fabrication Facilities
As a fabless supplier, DSPG depends on foundries for the manufacturing of its devices. The company has
established foundry relationships with several companies, including TSMC and Samsung.
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Edal Industries
North American Company Profiles
EDAL INDUSTRIES , INC .
Edal Industries, Inc.
51 Commerce Street
East Haven, Connecticut 06512
Telephone: (203) 467-2591
Fax: (203) 469-5928
Web Site: www.eemonline.com/edal
Email: www.mjlweb.com/edalind
IC Manufacturer
Founded: 1958
Financial History ($M)
Sales
Employees
1996
5.6
1997
6.6
65
75
Ownership: Privately held.
Company Overview and Strategy
Edal Industries, Inc., is a manufacturer of discrete components: diodes rectifiers, varistors and metal oxide
varistors.
Management
Robert Cowles
President
Products and Processes
Edal manufactures a complete line of silicon rectifiers — from 1 amp diodes to 6 amp diodes; high voltage diodes
to 50,000 volts; high voltage rectifier assemblies to 220,000 volts; and bridge rectifiers. They also make a
complete line of power rectifiers which include D04, D05, D08 and D09 up to 300 amps. Edal offers a complete
line of JEDEC devices and can supply units which are screened and tested to MIL-S19500. Special assemblies
such as single and three phase bridge assemblies, in current ranges from 25-100 amps, are also available.
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Edal Industries
North American Company Profiles
Product families are as follows.
•
•
•
•
•
•
Rectifiers — silicon rectifiers, fast recovery rectifiers, rectifier assemblies, power rectifiers, selenium rectifiers,
and copper oxide rectifiers;
Power diodes;
Copper oxide varistors;
Modulators;
Phase comparators; and
Selenium diodes.
2-140
EDI
North American Company Profiles
ELECTRONIC DESIGNS , INC. (EDI)
Electronic Designs, Inc.
One Research Drive
Westborough, Massachusetts 01581
Telephone: (508) 366-5151
Fax: (508) 836-4850
Web Site: www.electronic-designs.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Employees
1995*
40
(3)
3
85
1996
59
4
3
1997
42
3
2.1
125
130
*Pro forma data. Electronic Designs, Inc. was acquired by Crystallume in October 1995, and the entire company
was renamed Electronic Designs, Inc. in March 1996.
Company Overview and Strategy
Electronic Designs, Inc. (NASDAQ: EDIX) is a supplier and an industry leader in the design, manufacture and
marketing of high performance memory products and Active Matrix Liquid Crystal Displays (AMLCDs) for Original
Equipment Manufacturers (OEMs) in the global commercial, industrial and military markets, particularly
telecommunications, datacommunications and avionics.
EDI’s primary product lines are high density, high performance memory devices (Asynchronous SRAM,
Synchronous SRAM, DSP Memory Solutions, PC CARDS, Flash, and DRAM) for the performance driven
telecommunications and datacommunications markets, and ruggedized applications worldwide. New commercial
memory modules offered by EDI are geared to support the latest microprocessor devices used in advanced
communications systems.
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EDI
North American Company Profiles
EDI’s memory products are used in many segments of the electronic equipment industry, including computer
systems and peripherals, telecommunications, medical equipment, and military systems. The company
emphasizes a time-to-market advantage for its high-speed SRAM modules. Other memory products incorporate
SRAM, DRAM, flash, and EEPROM technologies. The company recently announced the release of a line of
PCMCIA memory cards. Memory product development is currently focused on the design and prototyping of new
module and monolithic products based on 4M SRAM, as well as on new MCM-L, flash memory, and high-density
DRAM designs.
EDI’s offering of AMLCDs includes various sizes of ruggedized panels for use in display heads, monitors, and
computer systems. The company is developing technology for a PC system incorporating its displays, in addition
to electronic circuit boards for “smart” displays.
Management
Don McGuinness
Frank Edwards
Ken Buckley
Daniel R. Doyle
Frank Muscolino
Chairman, President, and Chief Executive Officer
Senior Vice President, Finance, and Chief Financial Officer
Vice President, Marketing and Sales
Vice President, Display Products
Vice President and General Manager, Display Products
Products and Processes
EDI's products include the following:
• High-speed monolithic 1M and 4M CMOS SRAMs (industrial or military).
• High-density CMOS SRAM modules (1M to 32M) with speeds of 8ns-70ns (commercial, industrial, or military).
• JEDEC pinout super high-density DRAM modules (64MB to 288MB; commercial or industrial).
• JEDEC pinout flash SIMM modules (4M to 64MB; commercial or industrial).
• Active-matrix LCDs for avionics and other specialty applications.
Semiconductor Fabrication Facilities
EDI handles assembly, test, and QCI at its headquarters in Westborough. For the production of its memory
products in wafer, die, and component form, the company has partnerships with major semiconductor
manufacturers in the U.S. and the Far East, including Micron, Mitsubishi, Samsung, and Sharp.
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North American Company Profiles
EDI
Key Agreements
• In February 1998, EDI and SanDisk Corporation announced the formation of a strategic partnership to
introduce embedded solid state data storage modules. EDI will incorporate SanDisk’s ATA/IDE Flash Chipset
technology in their new embedded Flash Module product family.
• In May 1997, EDI announced its intention to divest its Crystallume Diamond Products Division. This divestiture
was completed in October 1997. As a result of the Acquisition and subsequent divestiture of the Crystallume
Diamond Products Division, EDI’s current focus is the design, manufacture and sale of semiconductor memory
and flat panel display products to specialty niche markets within these commodity markets.
• EDI formed an agreement with Atmel in 1994 calling for EDI to design, manufacture, and market high-density
memory modules using Atmel's flash memory devices.
2-143
EG&G Optoelectronics
North American Company Profiles
EG&G O PTOELECTRONICS
EG&G, Inc.
Optoelectronics Group
2175 Mission College Boulevard
Santa Clara, California 95054
Telephone: (408) 565-0700
Fax: (408) 565-0777
Web Site: www.egginc.com/optogrp
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
EG&G Reticon • Munich, Germany
Telephone: (49) (89) 92692-666 • Fax: (49) (89) 911-008
Financial History ($M), Fiscal Year Ends December 31
Corporate
Sales
Net Income
Optoelectronics
Sales
1992
1993
1994
1995
1996
1997
1,320
88
1,319
59
1,333
(6)
1,420
68
1,427
60
1,460
34*
210
201
213
259
270
261
*Included an asset impairment of $28.2 million, $23.5 million after tax.
Company Overview and Strategy
EG&G Optoelectronics is one of three product groups within EG&G, Inc., a $1.4 billion company involved in
diversified technology markets. The EG&G Optoelectronics business segment consists of eight autonomous
divisions, including EG&G Amorphous Silicon, EG&G Canada Ltd., EG&G Electro-Optics, EG&G Heimann
Optoelectronics, EG&G IC Sensors, EG&G Judson, EG&G Reticon, and EG&G Vactec. These businesses
specialize in photonic products that are sensitive in the x-ray and ultraviolet to far infrared region of the light
spectrum.
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EG&G Optoelectronics
North American Company Profiles
The divisions involved in the production of integrated circuit-related devices are EG&G Reticon and EG&G IC
Sensors. Reticon was founded in 1971, and became a subsidiary of EG&G in 1976. From its start, Reticon has
been a leader in image sensing. It was among the first semiconductor companies to specialize in solid-state
imaging components and vision system products. IC Sensors was formed originally as a spin-off from Foxboro/ICT
in 1982, and was acquired by EG&G in 1994. IC Sensors specializes in the manufacturing of silicon
micromachined pressure sensors, accelerometers, valves, and custom microstructures for applications in
automotive airbags, scientific instruments, and medical pressure sensitive devices.
Management
Reiner Quad
Chris Raanes
General Manager, EG&G IC Sensors
General Manager, EG&G Reticon
Products and Processes
EG&G Reticon Products
• EG&G Reticon manufactures solid-state linear and area cameras, both analog and digital, image sensor arrays,
CCDs and pinned photodiode arrays including CMOS, PMOS and CCD process, and machine vision systems.
EG&G IC Sensors Products
• Microelectromechanical system (MEMS) devices, such as pressure sensors, accelerometers, and custom
microstructures for a broad range of applications, including medical, industrial, automotive, consumer, and
aerospace.
Semiconductor Fabrication Facilities
EG&G Reticon
345 Potrero Avenue
Sunnyvale, California 94086
Telephone: (408) 738-6979
Fax: (408) 738-3832
Capacity (wafers/week): 625
Wafer size: 100mm
Processes: CMOS, PMOS, CCD,
pinned photodiode arrays
Products: Linear ICs and image sensing devices
Feature size: 2.0µm
EG&G IC Sensors
1701 McCarthy Boulevard
Milpitas, California 95035
Telephone: (800) 767-1888
Fax: (408) 432-7322
Cleanroom size: 10,000 square feet
Wafer size: 100mm
Process: Bipolar
Products: MEMS devices and sensors
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Elantec Semiconductor
North American Company Profiles
ELANTEC S EMICONDUCTOR
Elantec Semiconductor, Inc.
675 Trade Zone Blvd.
Milpitas, California 95035
Telephone: (408) 945-1323
Fax: (408) 945-9305
Web Site: www.elantec.com
IC Manufacturer
Founded: 1983, California; 1995 reincorporated in Delaware
Regional Offices/Representative Locations
Eastern US:
Elantec Semiconductor, Inc. • Hingham, MA
Telephone: (781) 741-5977 • Fax: (781) 741-5976
Europe:
Elantec Semiconductor, Inc. • Wokingham, United Kingdom
Telephone: (44) (1189) 776080
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
15
0.3
—
—
1993
18
1
4
1
1994
23
1
4
1
1995
27
3
5
2
1996
37
4
6
2
1997
35
0.6
5
1.5
110
120
125
155
162
163
Ownership: Publicly held. NASDAQ: ELNT.
Company Overview and Strategy
Elantec Semiconductor, Inc. designs, manufactures, and markets high-performance analog integrated circuits for
the video/multimedia, data processing, instrumentation, and communications markets (i.e., amplifiers, drivers,
faders). The company serves these markets with standard products and application-specific standard products
(ASSPs), using primarily high-speed complementary bipolar and advanced CMOS technologies.
The company offers more than 150 high performance analog products, such as amplifiers, drivers, faders,
transceivers and multiplexers, most of which are available in multiple packaging configurations. Their products are
sold either directly, with the assistance of independent sales representatives, or indirectly through independent
distributors to over 2,500 electronic systems manufacturers worldwide.
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Elantec Semiconductor
North American Company Profiles
Management
David O'Brien, Ph.D.
Richard E. Corbin
Ralph S. Granchelli, Jr.
Ephraim Kwok
Barry L. Siegel
President and Chief Executive Officer
Vice President, Technology
Vice President, Marketing
Vice President, Finance, and Chief Financial Officer
Vice President, Engineering and Quality
Products and Processes
Elantec's analog and mixed-signal ICs for commercial markets include the following:
•
•
•
•
•
•
Op amps
Video circuits
Analog buffers
Fully integrated DC/DC converters
Comparators and ATE pin drivers
IGBT drivers
•
•
•
•
•
•
H-sync Genlock-computer video circuits
DC restore subsystems
Fader circuits
MOSFET drivers
PWM controllers
Laser diode drivers
The company’s process technologies include dielectric isolation and junction isolation complementary bipolar,
junction isolation bipolar, and CMOS technologies.
In 1996, the company introduced its first product for the optical disk storage market – a high performance laser
driver to power the read/write function of the laser diode. Long term this market has great potential as consumers
transition to DVD (digital video disk) for their primary video entertainment system.
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Elantec Semiconductor
North American Company Profiles
Semiconductor Fabrication Facilities
Elantec Semiconductor, Inc.
1996 Tarob Court
Milpitas, California 95035
Cleanroom size: 4,000 square feet
Capacity (wafers/week): 300
Wafer size: 100mm
Processes: Complementary bipolar, complementary bipolar dielectric isolation (DI), JI bipolar, CMOS.
Products: Analog ICs
Feature sizes: 5.0µm (bipolar); 1.2µm, 2.0µm (CMOS)
During the first quarter of 1998, Elantec initiated the expansion of its wafer fabrication facility to provide additional
bipolar wafer capacity. Completion is scheduled for mid-1998.
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Electronic Technology Corporation
North American Company Profiles
ELECTRONIC TECHNOLOGY CORPORATION
Electronic Technology Corporation
402 Campus Drive
Huxley, IA 50124
Telephone: (515) 597-7000
Fax: (515) 597-7001
Web Site: www.etechcorp.com
Fabless IC Supplier
Company Overview and Strategy
Electronic Technology Corporation (ETC) was founded in 1983, initially as a design center for linear and digital
gate array manufacturers. The company has since developed its own mixed-signal CMOS designs and
technology.
The company now supplies mixed-signal ASICs to the industry. Customers include: Hewlett-Packard, Eaton
Automotive Controls, and ITT Aerospace. The company has its own CAD, testing and quality assurance
capabilities at the above location.
ETC is ISO9001 and QS9000 certified.
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ENSONIQ Corporation
North American Company Profiles
ENSONIQ CORPORATION
ENSONIQ Corporation
155 Great Valley Parkway
Malvern, Pennsylvania 19355
Telephone: (610) 647-3930
Fax: (610) 647-8908
Web Site: www.ENSONIQ.com
Email: johnsp@ENSONIQ.com
Fabless IC Manufacturer
Founded: 1982
Regional Offices/Representative Locations
Europe:
Thame Components Ltd., Oxfordshire, England, U.K.
Telephone: (44) 1 8 44 261188 • Fax: (44) 1 8 44 261681
Korea:
PoleTech Systems Co., Ltd., Seoul, Korea
Telephone: (82) (2) 431-4359 • Fax: (82) (2) 431-4358
Taiwan:
World Peace Industrial Co., Taipei, Taiwan, ROC
Telephone: (886) 2 788-5200 • Fax: (886) 2 788-3255
Financial History ($M)
1997
Corporate
Sales
Net Income
Semiconductor
Sales
Employees
1.3
143
< 100
200
Ownership: Publicly held under Creative Technology Ltd. NASDAQ: CREAF.
Company Overview and Strategy
ENSONIQ is a key innovator in the design and development of PCI audio microchip technology and has strong
brand recognition association with its line of electronic musical instruments. The Company is the leading supplier
of sound ICs, owning over 75 percent of the sampling keyboard market and recognized as one of the leading
suppliers of samplers and synthesizers to professional, semi-professional and home musicians.
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ENSONIQ Corporation
North American Company Profiles
ENSONIQ products are sold through a select group of musical instrument retailers in the United States,
international distributors and a direct sales office in Japan.
In 1992, after years of successfully integrating ENSONIQ chip technology into products of companies such as
Apple Computer, Baldwin Piano & Organ, and Taito Corporation, ENSONIQ established its Multimedia Division.
The company’s expertise in audio technology has won a wide range of design and production contracts from PC,
video arcade game, karaoke, and other markets (such as Disney Imagineering, which uses ENSONIQ technology
for programming audio in its theme park rides). In 1994, the company entered the rapidly growing market for
personal computer multimedia sound cards, using its music and sound expertise to lead the evolution of PC audio
from inferior FM (frequency modulation) synthesis to the more realistic sounding wavetable synthesis.
In December of 1997, ENSONIQ was acquired by Creative Technology Ltd., based in Singapore, for
approximately $75M. Creative Technology Ltd. develops, manufactures and markets a wide array of advanced
multimedia solutions for the PC, entertainment, education, music and productivity tools markets. Creative’s
products are marketed through both the OEM and retail channels under a variety of trademarks, including the
“Blaster” family name. Sound Blaster® has become the multimedia industry’s de facto audio standard.
Each of ENSONIQ’s products contains one or more custom integrated circuits. These chips are specifically
designed for wavetable synthesis, sampling and digital effects, incorporating in hardware the sound generation
and processing algorithms.
Management
Albert Scharpentier
Joel Friel
John Spataro
David Looft
Chairman of the Board and Chief Executive Officer
Vice President, Engineering
Director of Marketing – Multimedia Department
Worldwide Retail Sales Manager
Products and Processes
ENSONIQ’s key products include the following.
•
PCI Bus – Digital Audio and Music Controllers — The PCI bus, ES1370, provides high speed access to system
memory and resources for 2- and 4-Mbyte wavetable data and effects processing. It is compatible with the
multimedia enhancement of Intel’s MMX architecture, and also supports drivers for Windows 3.1x, Windows 95
and Windows NT 3.5/4.0. The AudioPCI chipset, which includes the AK4531 codec, provides a low power
solution for the motherboard. Power-down mode is supported under software control.
•
The Signal Processor, ES5510 – “ESP,” is a custom digital signal processor chip with over 75,000 transistors,
used in the Company’s musical instruments and some multimedia products. It is a high-speed microprocessor
with an instruction set that is optimized for manipulating audio data, with typical sample rates between 10kHz
and 50kHz. The ESP chip is capable of creating a wide range of digital effects including reverb, delay, echo,
equalization, and distortion, and is capable of generating multiple effects simultaneously. The ESP is a VLSI
device designed in a 1.0 micron, double-metal, CMOS process.
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ENSONIQ Corporation
North American Company Profiles
•
Sound ROM Library – ENSONIQ’s sound library contains sounds ranging from basic General MIDI to special
purpose effects, world instruments, and large memory sounds that satisfy even the most demanding fidelity
requirements.
•
The ES 5506 OTT chip is a sample playback synthesizer designed to playback digital recordings. It creates one
or more complete musical instruments through onboard signal processing. OTT is capable of altering pitch and
timbre of a digital recording and operating with 32 channels. OTT is a VLSI device designed in a 1.5 micron,
double-metal CMOS process, and contains approximately 80,000 transistors.
Key Agreements
•
In September 1997, Berkley Integrated Audio Software, Inc. (BIAS), a leading manufacturer of digital audio
editing software, announced a software bundling agreement with ENSONIQ, creators of the new Professional
Audio Recording Integration System (PARIS), a fully integrated 24-bit digital audio workstation. According to
the agreement, ENSONIQ’s PARIS will now include the Peak LE digital audio editing software for Macintosh.
2-152
ESS Technology
North American Company Profiles
ESS T ECHNOLOGY
ESS Technology, Inc.
48401 Fremont Boulevard
Fremont, California 94538
Telephone: (510) 492-1088
Fax: (510) 492-1098
Web Site: www.esstech.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Asia-Pacific:
ESS Technology, Inc. • Taipei, Taiwan
Telephone: (886) (2) 346-5300 • Fax: (886) (2) 346-1698
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
24
5
4
1993
15
0.2
3
1994
33
8
4
1995
106
30
9
1996
227
22
20
1997
250
(10.9)
29
—
—
—
145
253
500
Ownership: Publicly held. NASDAQ: ESST.
Company Overview and Strategy
ESS Technology, founded in 1984, designs, develops, and markets highly integrated mixed-signal
semiconductor and software solutions for multimedia applications in the PC and consumer markets. Current
development is focused on new PC audio and multimedia products for the PC and consumer markets that provide
video and fax/modem/voice capabilities.
Management
Fred S.L. Chan
Robert L. Blair
Nicholas A. Aretakis
John H. Barnet
Hoover J. Chen
Johnston Chen
Jan Fandrianto
Hadi Ibrahim
Robert S. Plachno
Roger K. Shum
Chi-Shin Wang
Chairman and Chief Executive Officer
Executive Vice President, Operations
Vice President, PC Products Group
Vice President and Chief Financial Officer
Vice President, Engineering
Vice President, Consumer Products Group
Vice President, Video Group Engineering
Vice President, Engineering, Multimedia Technology Design (Austin, Texas)
Vice President, Research and Development
Vice President, Manufacturing
Vice President and Chief Technical Officer
2-153
ESS Technology
North American Company Profiles
Products and Processes
ESS Technology has three principal product lines: the AudioDrive™ family, which targets the PC digital audio
market; the VideoDrive™ family, which targets MPEG-1 and MPEG-2 decompression-based consumer products,
such as DVD, video compact disk players, and set-top boxes; and the TeleDrive™ family, which focuses on
integrated audio-fax/modem applications, including full duplex speakerphone, digital simultaneous voice and
data, and videoconferencing.
The company’s chips are manufactured using mixed-signal 0.35µm, 0.5µm and 0.6µm CMOS process
technologies.
Semiconductor Fabrication Facilities
ESS has contracts with several independent foundries for the manufacture of its products. The majority of its
devices are currently manufactured by Taiwan Semiconductor Manufacturing Company (TSMC), its primary
supplier since 1989. The company also uses UMC, Sharp Corporation, and IC Works.
In December 1995, ESS announced a wafer supply program to commit approximately $62 million, and an option to
commit another $31 million, over a three year period for expanding manufacturing capacity and developing
advanced technology. The company expanded its relationship with TSMC by entering into a long term agreement
for an increased amount of wafer capacity. ESS agreed to pay approximately $32 million to TSMC in exchange for
wafer supply through 1999. ESS also obtained an option to further expand this agreement for additional capacity.
ESS also entered into a joint venture agreement with United Microelectronics Corporation (UMC) of Taiwan. ESS
agreed to invest $30 million for a five percent equity ownership in UMC’s new 200mm wafer joint manufacturing
facility, United Integrated Circuits Corporation (UICC). The wafer fab, located in Taiwan, is expected to begin
production in 1Q99.
2-154
Exar
North American Company Profiles
EXAR
Exar Corporation
48720 Kato Road
Fremont, California 94538
Telephone: (510) 668-7000
Fax: (510) 668-7017
Web Site: www.exar.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
Exar Japan Corporation • Kawasaki-shi, Kanagawa, Japan
Telephone: (81) (44) 922-9411 • Fax: (81) (44) 922-9368
Europe:
Exar, Ltd. • Crowborough, East Sussex, United Kingdom
Telephone: (44) (1892) 665718 • Fax: (44) (1892) 664354
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Employees
1993
146
14
11
1994
162
16
11
1995
159
(11)
14
1996
126
14
16
1997
92
(9)
14
1998
102
7.5
16
500
525
468
447
365
350
Company Overview and Strategy
Exar Corporation (NASDAQ: EXAR) designs, develops and markets innovative, systems-oriented analog and
mixed-signal products for video, imaging, communications and silicon sensing. The company was formed in 1971
and is located in Fremont, California, with operations in the United States, Europe, Taipei and Japan.
Exar’s competence is in the area of high-performance analog and mixed-signal design. This is becoming more
important as digital devices increasingly interface with an analog world. Exar enjoys strong customer relationships
in its established markets, supplying both components and subsystem solutions.
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Exar
North American Company Profiles
The company’s areas of concentration are:
Communications: The Communications Division supports multiple segments of transmission and networking
markets. The firm offers T1/E1 and T3/E3 line interface devices; an extended line of Universal Asynchronous
Transmitters Receivers (UARTs) with 1, 2 and 4 channels, and V .35 transceivers which are used in the routers that
form the backbone of the Internet. A family of crystal clock oscillators and clock multipliers allow voltage control, or
multiply the input clock frequencies to a higher transmission rate, as Internet speeds increase. Customers include
world leaders in the fields of voice and data communications.
Video and Imaging: Exar also offers an extensive product line for video and image signal conditioning and
digitizing, leveraging the company’s strong capability in high-performance analog-to-digital conversion enabling
technology. The company’s video focus is on devices and subsystems for low power analog-to-digital and digitalanalog functions in digital video and digital still cameras. Exar’s document imaging offerings are used in scanners,
whether handheld or flatbed, and in multifunction products that combine scan, print and fax operations.
Customers include consumer electronic vendors.
Silicon Sensors: Exar is a market pioneer of this emerging technology which allows users to integrate an
analog function, such as pressure or motion, to electronic signal processing in a way that is fast, reliable and
accurate. Sensor products are used in the automotive industry, for example, in engine control, emission control
and antilock braking systems. They are also used in medical instruments, disposable blood pressure devices, and
respirators and ventilators.
Management
Donald L. Ciffone
Ronald W. Guire
Roubik Gregorian
Jim Knutti
John Sramek
Suhas "Sid" Bagwe
Thomas W. Jones
Stephen W. Michael
Linda Prosser
Michael Class
2-156
President and Chief Executive Officer
Executive Vice President and Chief Financial Officer
Vice President, Chief Technical Officer,
and General Manager, Communications Division
Vice President and General Manager, Silicon Microstructures Division
Vice President and General Manager, Video and Imaging Division
Vice President, Strategic Development
Vice President, Quality
Vice President, Manufacturing
Vice President, Marketing Communications
Vice President, North American Sales
North American Company Profiles
Exar
Products and Processes
Exar’s IC products can be divided into five major market groups: communications, data communications, video and
imaging, silicon microstructures, and other products.
•
For the communications market, the company offers T1/E1 and T3/E3.
•
For the data communications market, Exar supplies UARTs/DUARTs/QUARTs, clock oscillators/clock
multipliers, line drivers/receivers, frequency timing generators and Super I/O devices.
— In 1998, Exar introduced the industry’s first UARTs with on-chip transmit and receive FIFO counters —
XR16C580 (single) and XR16C854 (quad).
•
For video and imaging applications, Exar supplies A/D and D/A converters, CCD analog signal processors and
conditioners.
— Processors include: the XRD9829, a single-channel, 10-bit integrated linear processor. It operates at
6MSPS, and integrates AFE and AD functions on one chip. The XRD9812 and the XRD9822 are 12-bit
processors that operate at 8MSPS. These processors combine AFE and AD functions onto a single chip for
high-performance scanners and copiers.
•
Subsidiary Silicon Microstructures currently offers high-precision pressure sensors for applications such as
engine control and tire pressure in automobiles, inter uterine pressure in medical instruments, and HVAC and
pressure transducers in industrial equipment. Silicon Microstructures also supplies accelerometers for
automotive applications.
•
Other products include general purpose analog-to-digital and digital-to-analog converters for a wide variety of
applications, including pace makers, handheld digital voltmeters, and high-speed digital communications.
Exar is ISO 9001 and QS9000 certified.
Key Agreements/Announcements
•
In March 1998, Exar announced that Connectix Corporation chose Exar’s XRD4460 analog image signal
processor for the Connectix QuickCam VC(r).
•
In February 1998, Exar announced that Eastman Kodak chose its new XRD6418 analog-to-digital device for
the film scanner in Kodak’s digital Advanced Photo System.
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Extel Semiconductor
North American Company Profiles
EXTEL S EMICONDUCTOR , INC .
Extel Semiconductor, Inc.
250 Mines Road
Livermore, California 94550
Telephone: (510) 443-6300
Fax: (510) 443-6310
IC Manufacturer
Financial History ($M), Fiscal Year Ends December 31
Sales
Employees
1997
$5-10 (est.)
30
Kanematsu provided full funding in Q4 1996. Terms were not available. The management team was assembled
by the end of Q1 1997.
Company Overview and Strategy
Extel Semiconductor, Inc. was formed June 13, 1996, as a joint venture of Kanematsu Corporation (Kanematsu
Semiconductor Corporation) and Seaway Semiconductor Inc. (Livermore, CA), and Impala Semiconductor
Manufacturing Corporation of the United States. Kanematsu also owns Powerchip Semiconductor Corp., a
manufacturer of DRAMs. Kanematsu USA, Sunnyvale, positions Extel as a “strategic business partner.” Extel
operates as a privately-held company and is quite reticent about operations and financials.
Extel claims its formation was based upon a realization of the need for a “pure foundry” service in Silicon Valley.
Extel began shipping for revenue October 1997.
Extel uses ZeusTec Sales (Santa Clara) as their sole manufacturer’s representative.
Management
Dr. Mano Malwah
Dom Consorte
Marcello Martinez
Susanne Scullen
Dan Brors
2-158
Chief Executive Officer and Chief Technology Officer
Director, Sales and Marketing
Applications Manager
Fab Manager
Director (President, Seaway Semiconductor)
North American Company Profiles
Extel Semiconductor
Products and Processes
Extel Semiconductor is a CMOS and BiCMOS sub-micron foundry. Extel is currently running a 0.6 micron, double
poly, double metal process for the majority of output. Single and double poly CMOS with 2-3 metal layers from
C300A-C035A is available or anticipated by Q4 1998. Double poly, two metal BiCMOS will be available in Q3
1998 and double poly, three metal BiCMOS is planned for Q1 1998. Current capacity is 2,000 six inch wafer outs
per month, with 6,000 per month anticipated for “late” 1998 and 17,500 per month by “late” 1999. The foundry
was initially producing geometries of 0.8µm on 150mm wafers.
Extel is offering additional capacity at attractive prices in order to penetrate the market.
Extel claims that it has customer designs in the prototype stage and that it is planning a ramp starting “mid year.”
Extel’s current focus is to provide analog and mixed-signal foundry services for Silicon Valley fabless
semiconductor companies, with expansion on the West Coast planned in “the near future.” Services include
design assistance and customer support.
Semiconductor Fabrication Facilities
Seaway Semiconductor Inc. had purchased Intel's Fab 3 facility in Livermore, (vacated four to five years prior),
some time in late winter 1996. It then converted it into two foundry fabs, initially with one as a Class 100 cleanroom
capable of 20,000 wafers/month and the other a smaller Class 1 cleanroom with a capacity of 15,000
wafers/month. The Class 1 facility appears to have been assigned to the Extel joint venture, though the Class 100
facility may have been upgraded to its current capability of “better than Class 10.”
Extel currently is claiming an approximate 14,000 square feet for its cleanroom and greater than 85,000 total
square feet for the facility overall.
2-159
Fairchild Semiconductor
North American Company Profiles
FAIRCHILD S EMICONDUCTOR
Fairchild Semiconductor Corporation
333 Western Avenue
South Portland, Maine 04106
Telephone: (207) 775-8100
Fax: (207) 761-6027
Web Site: www.fairchildsemi.com
IC Manufacturer
Employees: 7,000
Ownership: Privately held.
Company Overview and Strategy
Fairchild Semiconductor was relaunched in March 1997, when the combined logic, memory, and discrete
businesses of National Semiconductor were purchased by private investors. Fairchild Semiconductor originally
emerged in the late 1950’s when the late Sherman Mills Fairchild sponsored a small group of scientists — among
them Robert Noyce and Gordon Moore — in the development of a new process for the manufacturing of
transistors. The team reached their goal in 1959 with the introduction of the Planar process. A facility was
established in 1962 in South Portland, Maine, for the manufacture, test, and assembly of transistors.
Beginning in 1978, Fairchild became a major force in the development and production of logic circuits. Its first
innovation was the FAST® (Fairchild Advanced Schottky Technology) family of advanced Schottky TTL logic
circuits. Next came the invention of the FACT™ (Fairchild Advanced CMOS Technology) family of logic circuits in
1985. Still today, Fairchild is the leading supplier of FAST and FACT, as well as LCX, logic products.
In 1987, National Semiconductor purchased Fairchild from Schlumberger Ltd., a French conglomerate that had
acquired the company in 1979. National dropped the Fairchild name, but resurrected it in mid-1996 when its logic,
memory, and discrete businesses were combined to form the Fairchild Semiconductor Division. The division was
sold in March 1997. National retains a 16 percent stake in Fairchild.
Together with its advanced logic IC products, Fairchild’s high-performance non-volatile memory and discrete
semiconductor technologies form the foundation of the new company’s product portfolio. The fiscal 1997 (ended
May 31) revenues from these products were approximately $590 million.
Fairchild is investing in research and development to enhance its portfolio in the fast-growth areas of CMOS, lowvoltage logic, power and small-signal discretes, and non-volatile standard and application-specific memories.
Applications for Fairchild’s products include automotive entertainment systems, communications products,
desktop and portable computers, security, consumer products, and satellites and aerospace systems.
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Fairchild Semiconductor
North American Company Profiles
Management
Kirk Pond
Joseph Martin
Daniel Boxer
Wayne Carlson
Jerry Baker
Chairman, President, and Chief Executive Officer
Executive Vice President and Chief Financial Officer
Executive Vice President, General Counsel, and Chief Administrative Officer
Executive Vice President and General Manager, Logic Group
Executive Vice President and General Manager, Non-Volatile Memory and
Discrete Power and Signal Technologies Group
Senior Vice President, Worldwide Sales and Marketing
Darrell Mayeux
Products and Processes
MOS MEMORY
✔
✔
✔
✔
ANALOG
DRAM
Amplifier
SRAM
Interface
Flash Memory
Consumer/Automotive
EPROM
Voltage Regulator/Reference
ROM
Data Conversion
EEPROM
Comparator
Other (Including Non-Volatile RAM)
Other (Includes Telecom)
MOS LOGIC
✔
General Purpose Logic
Gate Array
✔
DIGITAL BIPOLAR
Bipolar Memory
✔
General Purpose Logic
Standard Cell
Gate Array/Standard Cell
Field Programmable Logic
Field Programmable Logic
Other Special Purpose Logic
✔
Other Special Purpose Logic
MPU/MCU/MPR
MOS MICROCOMPONENT
MPU
OTHER
MCU
MPR
DSP
Full Custom IC
✔
Discrete
Optoelectronic
Logic Products
Fairchild offers 17 families of standard logic devices utilizing CMOS, bipolar, and BiCMOS process technologies.
The company claims to be the world’s third-largest supplier of standard logic ICs.
Its logic products include FAST® high-speed, low-power bipolar devices; FACT™ high-performance advanced
CMOS devices; FACT QS™ low-noise, high-performance advanced CMOS devices; LVQ low-voltage CMOS
devices, LCX/LVX high-performance, low-voltage CMOS devices with over-voltage protection; and VHC HCreplacement, low-noise, high-speed CMOS devices.
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Fairchild Semiconductor
North American Company Profiles
Memory Products
Fairchild’s memory products include several varieties of non-volatile memory ICs. It is among the world’s leading
suppliers of serial EEPROMs and EPROMs. Its EEPROM product group includes several families of standard
devices as well as application-specific devices such as a Plug-and-Play controller for ISA cards, a serial presence
detect (SPD) device for the memory module market, and the HiSEC™ family of products for remote keyless entry
applications. The company’s EPROM products include 5V devices with densities ranging from 16K to 4M and lowvoltage 1M parts.
Through an alliance formed originally by National and Toshiba in 1992, Fairchild also offers flash memory devices
compatible with Toshiba’s NAND and NOR architectures.
Discrete Products
Fairchild’s principal discrete products are DMOS power MOSFETs. Its other discrete products are small-signal
components such as small-signal transistors, JFETs, and diodes.
Semiconductor Fabrication Facilities
Fairchild Semiconductor Corp.
333 Western Avenue
South Portland, Maine 04106
Telephone: (207) 775-8100
Fax: (207) 761-6027
Cleanroom size: 51,000 square feet
Capacity (wafers/week): 12,350
Wafer sizes: 100mm, 125mm, 150mm
Processes: CMOS, bipolar, BiCMOS
Products: Logic ICs, discretes
Feature sizes: 0.8µm-2.5µm
Fairchild Semiconductor Corp.
3333 West 9000 South
West Jordan, Utah 84088
Telephone: (801) 562-7000
Fax: (801) 562-7500
Cleanroom size: 86,000 square feet
Capacity (wafers/week): 8,000
Wafer size: 150mm
Processes: CMOS, DMOS
Products: EPROMs, EEPROMs, logic ICs, discretes
Feature size: 0.8µm
Some of Fairchild’s IC products continue to be produced at fabs owned by National Semiconductor and vice versa.
Fairchild’s semiconductor assembly and test plants are located in Penang, Malaysia, and Cebu in the Philippines.
Key Agreements
•
In January 1998, Fairchild Semiconductor and Chartered Semiconductor Manufacturing agreed that Chartered
will manufacture EEPROM products based on Fairchild’s advanced EEPROM process. Fairchild has
completed the transfer of its EEPROM technology to Chartered, and Chartered has already returned test runs
of silicon to Fairchild, with high yields.
• In December 1997, Fairchild completed its acquisition of Raytheon Electronics Semiconductor, a division of the
Raytheon Company, for approximately $120 million in cash.
• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth as
possible. The two companies also share and swap fab capacity.
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North American Company Profiles
Fairchild Semiconductor
• Motorola, Toshiba, and Fairchild Semiconductor announced in early 1997 they would jointly develop nextgeneration high-speed CMOS logic ICs. The three companies will work to develop 2.5V and 3.3V devices with
a propagation delay time of 2ns.
• Fairchild has a long-term partnership with Toshiba for the development, licensing, design, and manufacture of
NAND and NOR flash memories. The agreement was signed by Toshiba and National Semiconductor in 1992.
•
Tower has an agreement with Fairchild Semiconductor to supply advanced EPROM processes for the
commodity and ASSP markets. In January 1998, the parties extended their agreement to include a new family
of products. The first project under way is the development of a next-generation Flash technology.
2-163
General Semiconductor
North American Company Profiles
G ENERAL S EMICONDUCTOR
General Semiconductor, Inc.
10 Melville Park Road
Melville, NY 11747
Telephone: (516) 847-3000
Fax: (516) 847-3236
Web Site: www.gensemi.com
Discrete Semiconductor Manufacturer
Financial History ($), Fiscal Year Ends December 31
Sales
R&D Expenditures
Net Income
Capital Expenditures
Employees
1993
267,773
3,152
90,583
—
1994
315,688
3,454
246,535
—
1995
414,269
5,068
123,782
34,912
1996
361,891
5,838
(1,864)
60,299
1997
380,038
5,998
5,933
29,208
—
—
—
—
5,000
Ownership: Publicly held. NYSE: SEM.
The Asian-Pacific region accounted for approximately 40 percent of General Semiconductor’s sales in 1997.
Company Overview and Strategy
General Semiconductor was formed from the 1960 merger of General Transistor and General Instruments. The
Semiconductor Components Division of General Instruments was then formed in Hicksville, NY, with its name later
changing to Discrete Semiconductor Division and then Power Semiconductor Division. In July 1997, General
Semiconductor was spun-off from General Instruments into a publicly-traded firm.
General Semiconductor is a leading worldwide designer, manufacturer and seller of discrete semiconductors. The
company sells these components into the consumer electronics, computer, telecommunications, lighting ballasts,
home appliance, automotive and industrial markets.
Management
Ronald A. Ostertag
Andrew M. Caggia
Vincent M. Guercio
W. John Nelson
Stephen B. Paige
Linda S. Perry
John P. Phillips
Robert J. Gange
2-164
Chairman, President and Chief Executive Officer
Senior Vice President and Chief Financial Officer
Senior Vice President, Worldwide Sales and Marketing
Senior Vice President, Asia Pacific Operations
Senior Vice President, General and Secretary
Senior Vice President, Human Resources
Senior Vice President, European Operations
Vice President and Controller
North American Company Profiles
General Semiconductor
Products and Processes
General Semiconductor manufactures low-to-medium-power rectifiers, and transient voltage suppressor (TVS)
components in axial, bridge and surface mount packages. With the acquisition of discrete small signal products
manufacturer ITT Industries, Inc. in October 1997, the company now also sells small signal diodes, transistors and
zener diodes. Leaded and surface mount packaging are offered.
General Semiconductor offers standard, Schottky (metal-silicon junctions and majority carrier conduction), and fast
efficient rectifiers (reverse recovery times as low as 25 nanoseconds up to 1,000 volts). Its selection of rectifier
package types is one of the largest in the world and includes plastic encapsulated, glass passivated, Superectifier
and surface mount packaging. The company has developed proprietary sputtered metallization process and ionimplanted guard ring technology for its Schottky product line.
General Semiconductor’s bridge rectifier is comprised of four separate rectifier components configured into a
"bridge" arrangement in a single package. The company manufactures over 100 bridge rectifier products for
various power and case style requirements across multiple applications.
The company’s TVS devices include a wide variety of semiconductor surge protection products. General
Semiconductor anticipates a significant increase in demand for TVS devices in applications incorporating
increasingly sensitive and smaller ICs. The small signal diode portfolio is marketed for a wide range of applications
including telecommunications equipment, personal computer motherboards, automotive systems, power
supplies and consumer electronics. The company’s zener product lines provide a wide variety of specialized
functions for complex electronic circuits. Zener applications include voltage regulators, voltage reference and
voltage suppressors.
General Semiconductor's small signal transistors, sold into nearly all end markets, round out its portfolio of
electronic building blocks available to its customers.
From the market/application segmentation perspective, General Semiconductor’s automotive electronics portfolio
includes the SUPERECTIFIER™ and PAR™ TVS. Transient Voltage Suppressors (TVS) fabricated with General
Semiconductor’s patented proprietary PAR™ (Passivated Anisotropic Rectifier) process have very high stability
(absorbs high energy; low reverse leakage) and power handling capability across the temperature range of
automotive and other applications. The company’s surface mount load dump TVS series (SM5A27 through
SM8A27) and avalanche alternator rectifier series (AS30 through AS40) are two new products incorporating PAR
technology.
General Semiconductor’s strategy is to increase its share of the discrete semiconductor market by focusing on
value-added investment and manufacturing, (high-volume, highly automated operations; very low-defect output),
product breadth expansion (through internal research and development efforts, strategic partnerships and
strategic acquisitions), capitalizing on its global sales and distribution franchise, and maintaining and expanding
customer relationships.
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General Semiconductor
North American Company Profiles
Semiconductor Manufacturing Facilities
General Semiconductor’s facilities are ISO9001 and QS9000 approved.
At year end 1997, the company’s Taiwanese facilities accounted for about 50 percent of its total production
output.
General Semiconductor’s 112,000 square foot Macroom, County Cork, Ireland facility employs over 750 people
(projected to reach over 1,000 by the end of 1998). The Macroom plant is ISO9001 and QS9000 qualified. The
plant produces Transient Voltage Suppressor (TVS) devices in a variety of leaded, surface mount and array
packages. Surface mount rectifiers and low current bridge diodes are also produced here. The facility was
expanded in 1997 to increase the company’s penetration of the European market.
The 360,000 square foot Taipei, Taiwan facility, opened in the late 1960s, employs 2,300 people. The location
houses the Standard Rectifier Products Group’s wafer fab, a Schottky wafer fab, Superectifier, Bridge, and
Surface Mount manufacturing and testing areas. Service and support sections utilize nearly 20 percent of the total
square footage. At 14 million devices per day, the facility produces Superectifiers, Bridge Rectifiers, Fast Efficient
Rectifiers, Schottky Diodes, Transient Voltage Suppressors, Clamper/Damper Products, Surface Mount
Products, and Power Rectifiers. The facility has previously won many quality awards including Delco Electronics’
"Quality Wins" PPAP, Ford’s Q1 and AT&T "Quality Leader ‘Gold’ Supplier” award.
In October 1997, General Semiconductor opened a $29 million, 120,000 square-foot semiconductor factory on a
540,000 square-foot site in China’s Tianjin Economic and Technological Development Area. Plant employment
was approximately 750 at year end 1997. Scheduled to begin in 1998, and reach completion by the year 2000, a
second phase of development will add 65,000 to 120,000 square feet to the facility and an increase employment
by 500 to 1,000. The company cited the facility’s proximity to several of its largest customers and fastest growing
markets as key drivers in opening the facility. The Tianjin facility is producing General Semiconductor’s
SUPERECTIFIER diodes, GBL, KBPM, WOG, GBU, GBPC, DFM bridge rectifiers, and small signal transistors
General Semiconductor's Westbury, New York plant, opened in 1956 as Semi-Metals, is a 13,000 square foot
facility, currently employing a staff of 50. Facility equipment includes Gemini Epitaxial Reactors, used to produce
silicon epitaxial wafers at a rate of 1,800 wafers per day, meeting the entire company’s epitaxial wafer
requirements. Co-located with this facility is the company’s applied material sciences research and development
laboratory.
Key Agreements
•
Implementing its corporate strategy of increasing market share, on October 1, 1997, General Semiconductor
acquired the small signal transistor business from ITT Industries, Inc. for $8.0 million. The unit had trailing 12month revenues of approximately $60.0 million. The company’s target market segments now make up 44
percent, versus the prior 20 percent, of the $13 billion total available market for discrete semiconductors.
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Genesis Microchip
North American Company Profiles
G ENESIS MICROCHIP
Genesis Microchip Inc.
200 Town Centre Boulevard
Suite 400
Markham, Ontario
Canada L3R 8G5
Telephone: (905) 470-2742
Fax: (905) 470-9022
Web Site: www.genesis-video.com
Fabless IC Supplier
Employees: 85
Ownership: Publicly held. NASDAQ: GNSSF.
Regional Headquarters/Representative Locations
North America:
Genesis Microchip Corporation • Mountain View, California
Telephone: (650) 428-4277 • Fax: (650) 428-4288
Company Overview and Strategy
Founded in 1987, Genesis Microchip is a technology leader in digital video/image manipulation. The company
designs, develops, and markets leading-edge ICs targeted at both existing and emerging applications demanding
high-quality video/image processing. Genesis sets the standard in video/image resizing.
Management
Paul M. Russo
Peter Dakin
Eric Erdman
Hamid Farzaneh
Lance Greggain
Stephen Solari
Scott Baker
Perry Chappell
Shyam Nagrani
Jay Giblon
David Green
Graham Loveridge
Peter Mandl
President and Chief Executive Officer
Vice President, Manufacturing Operations
Vice President, Finance and Administration
Vice President, Worldwide Sales
Vice President, Product Development Operations
Vice President, Marketing and Business Development
Director, Product Development Operations
Director, Sales
Director, Sales
Manager, Information Systems
Manager, Sales
Manager, Customer and Product Support
Manager, Video DSP Technology
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Genesis Microchip
North American Company Profiles
Products and Processes
Genesis' products include the Genesis Scaling™ series of video/image resizing ICs (gmz1, gm865x1, gm833x2,
gm833x3, gm833x3F), the gm2242B half-band filter, and the gmVLD family of video line doublers plus supporting
evaluation boards and software. The patented algorithms and architectures provide improvement in
computational efficiency over traditional finite impulse response (FIR) filter structures. All of Genesis' design
efforts currently employ 0.8µm (and below) CMOS technology. Several products are described below.
•
gmz1 — A highly integrated IC designed to solve de-interlacing, zoom scaling, display synchronization and
overly control.
•
gmFC1 — A frame rate conversion chip that tracks video frame location to avoid “picture tear.”
•
gm865x1 — This is the first of the Genesis Scaling chip series. The gm865x1 IC is a single-channel device
that provides high-quality video/image processing technology for medical imaging, broadcast equipment,
and projection systems.
•
gm833x2 — This is the second of the Genesis Scaling chip series and first in the mid-range family of
GenScale chips. The gm833x2 is a dual-channel device for use in workstations, projection systems, and
multimedia applications.
•
gm833x3 — This is a triple-channel version in the 833 class designed for use in projection systems,
videographic workstations, and scan conversion equipment.
•
gm833x3F (fast) “Bullet” — This is a 68MHz version of an RGB scaler, featuring low power and an advanced
0.35µm, 3.3V CMOS process.
•
gm2242B Half-Band Filter — This is a decimating/interpolating digital filter for use in applications requiring
pre- or post-filtering of digital video signals. The gm2242B supports NTSC, PAL, SECAM, and square pixel
video standards.
•
gmVLD8/gmVLD10 Video Line Doublers — This is a single-chip de-interlacing device for use in equipment
such as large screen televisions, video walls, projection systems, video-in-a-window workstations, and home
theater screens.
Genesis is ISO 9001 certified.
Key Agreements
•
In April 1998, Genesis and Micronas Intermetall announced they are using each other’s chips to produce a
unique set of video processing reference designs.
•
In March 1998, Genesis and Philips Semiconductors announced that its Z1MP and Z1FCMP reference
designs for LCD applications will use Philips’ TDA 8752 triple high-speed analog-to-digital converter (ADC)
chip.
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Gennum
North American Company Profiles
G ENNUM
Gennum Corporation
P.O. Box 489, Station A
Burlington, Ontario
Canada L7R 3Y3
Telephone: (905) 632-2996
Fax: (905) 632-2055
Email: corporate@gennum.com
Web Site: www.gennum.com
IC Manufacturer
Founded: 1973, Canada
Regional Offices/Representative Locations
Japan:
Gennum Japan K.K. • Miyamae Village, C-101, Tokyo, Japan
Telephone: (81) (3) 3334-7700 • Fax: (81) (3) 3247-8839
Financial History ($M), Fiscal Year Ends November 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
26
4
7
3
1993
27
4
7
2
1994
33
5
8
3
1995
42
7
9
4
1996
53
10
10
5
1997
62
12
12
4
233
240
247
255
300
334
Ownership: Publicly held. Toronto Stock Exchange.
Company Overview and Strategy
Gennum Corporation is a Canadian high technology company that designs, manufactures, and markets electronic
components, primarily silicon integrated circuits for specialized applications. Gennum’s manufacturing capability
ranges from wafer fabrication through to device packaging, assembly and test. The company’s products include
low-voltage audio electronic amplifiers and analog signal processing circuits supplied to the world hearing
instrument industry; video signal distribution and processing components sold to the professional video and
broadcast television markets; and user specific ICs for a wide variety of specific applications where information is
being conditioned, transmitted, or interpreted. In the packaging area, Gennum has developed a line of proprietary
ultra-miniature device package configurations, including tape automated bonding (TAB).
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Gennum
North American Company Profiles
The company markets and distributes its products worldwide through a direct sales organization as well as through
a network of independent manufacturer’s representatives and regional distributors. The company also operates a
brand office in Tokyo to service the Japanese market. Gennum is registered to the ISO 9001 (1994) quality
standard.
Management
H. Patrick Thode
H. Douglas Barber, Ph.D.
Ian L. McWalter, Ph.D.
Michael R. Fielding
David L. Lynch
C. Timothy Zahavich
Chairman
President and Chief Executive Officer
Executive Vice President, and Chief Operating Officer
Vice President, Marketing and Sales
Vice President, Research and Development
Vice President, Finance and Administration, and Chief Financial Officer
Products and Processes
Gennum concentrates on the design and fabrication of linear and mixed-signal devices utilizing bipolar and CMOS
technologies and the associated packaging of these products. Products include:
• Low voltage (i.e., 1.0V) audio electronic amplifiers and analog signal processing circuitry to the world hearing
instrument industry.
• High speed serial digital interface chips for the broadcast video market with operation to 400Mbits.
• High performance analog signal processing and switching devices for the video communications industry.
• High performance digital signal processing ICs for standard conversion and filtering applications.
Semiconductor Fabrication Facilities
Gennum Corporation
3435 Landmark Road
Burlington, Ontario L7M 1T4
Two Plants –
Total cleanroom size: 75,350 square feet
Capacity (wafers/week): 350
Wafer size: 100mm
Process: Bipolar
Products: Linear ICs, ASICs, thick-film hybrid circuits
Feature sizes: 1.5µm-4µm
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Germanium Power Devices Corporation
North American Company Profiles
G ERMANIUM POWER DEVICES CORPORATION (GPD)
Germanium Power Devices Corporation
300 Brickstone Square,
York Street, Box 3065 SVS
Andover, Massachusetts 01810-3065
Telephone: (978) 475-5982
Fax: (978) 470-1512
Web Site: www.gpd-ir.com
IC Manufacturer
Founded: 1973
Employees: 25
Ownership: Privately held.
Company Overview and Strategy
Germanium Power Devices has been a manufacturer of power transistors and diodes since its founding. In
addition, GPD has manufactured infrared photodetectors for military, commercial, and telecommunications
applications. The company offers Germanium, Germanium Avalanche, and InGaAs photodetectors. GPD is also
involved in custom designs.
Products and Processes
Germanium Power Devices manufacturers a broad range of Germanium p-n, p-I-n, APD and InGaAs p-I-n highspeed and large area photodetectors. Many of the standard detectors can be supplied with integrated amplifiers.
The following are products of GPD:
•
•
•
•
•
•
•
•
•
•
•
Germanium Photodetectors
Germanium Avalanche Photodiodes
Germanium Rectifiers
High Speed InGaAs Photodiodes
Large Area InGaAs Photodiodes
Germanium Transistors
Germanium Small Signal Transistors
Germanium NPN Transistors
Germanium PNP Mesa Transistors
Germanium PNP Small Signal Transistors
Germanium Power Transistors
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GHz Technology
North American Company Profiles
GHZ TECHNOLOGY , INC .
GHz Technology, Incorporated
3000 Oakmead Village Drive
Santa Clara, California 95051-0808
Telephone: (408) 986-8031
Fax: (408) 986-8120
Web Site: www.ghz.com
IC Manufacturer
Founded: 1977
Company Overview and Strategy
GHz Technology is a worldwide supplier of Silicon RF and Microwave Power Transistors for use in application
specific products. Product families support high power amplifier applications including: airborne avionics (DME,
IFF) to broadcast (FM, UHF-TV), cellular, defense and microwave communications and RADAR systems. The
majority of GHz’s customer base represent companies who have been using these transistors for more than 20
years. GHz products are sold via sales representatives and distributors throughout North America.
Management
Frank W. Schneider
Roger W. Thorton
Mike Mallinger
Lyle T. Leverich
Jeffery B. Hume
David Diamond
President and Chief Executive Officer
Chairman and Executive Vice President, Operations
Vice President, Marketing and Sales
Vice President, Engineering
Director of Product Engineering
Director of Sales
Products and Processes
GHz products include RF and microwave power transistors for use in application specific products. Their products
are optimized for custom applications, focused on providing the highest level performance for the lowest total cost
of ownership.
All GHz products incorporate the design and process technologies which will provide a transistor with the best
achievable performance and reliability. These include: gold topside metal used for the high mean time-to-failure;
silicon nitride passivation to protect against surface contamination; diffused ballast resistors to increase tolerance
to load mismatch; gold thermosonic wirebonding for consistent product performance and high reliability; hermeticsolder seal to ensure protection from the outside environment, even under the most severe operating conditions.
2-172
North American Company Profiles
GHz Technology
Semiconductor Fabrication Facilities
The company’s facility, which is 20,000 square feet, includes 4,000 square feet of Class 1,000 cleanroom. Also
on site are test and assembly areas that are fully compliant with U.S. Space Applications requirements.
Key Agreements
• The founders of GHz Technology purchased the right to the Acrian Inc. Power Transistor product line – which
included the predecessor Varian (CTC). The acquisition included the rights to tooling, process documentation
and product specifications. In addition to the tooling, GHz purchased a full complement of Acrian Inc. wafer
fabrication, assembly and test equipment. The Company also purchased material which was available from
Acrian as “work in process,” thereby, allowing it to be begin to make immediate shipments to selected
customers.
2-173
GMT Microelectronics Corporation (GMT)
North American Company Profiles
GMT MICROELECTRONICS CORPORATION (GMT)
GMT Microelectronics Corporation (GMT)
Valley Forge Corporate Center
950 Rittenhouse Road
Norristown, Pennsylvania 19403
Telephone: (610) 666-7950
Fax: (610) 666-2500
Web Site: www.gmtme.com
IC Manufacturer
Employees
1997
1998
160
145
GMT is funded and approximately 80 percent owned by a syndicate of venture capitalists consisting of Pecks
Management Partners, Unterberg Harris, Liebman Capital and TL Ventures. Additionally, Kopin Corp. and
Unitrode, (the current CEO’s former employer), each own a 4.5 percent share of the company, and employees
own the remaining 11 percent.
GMT provides Kopin Corp., (Taunton, MA; NASDAQ: KOPN), with output for its very high resolution (active matrix)
LCD display products. Early stage funding was $4.5 million, exclusive of TL Ventures and the other corporate
investments. $4.3 million of this was for the purchase of assets from CMG (see below).
New product sales, versus foundry service contracts to external clients, currently account for about 25 percent of
total sales. The goal is to move revenue mix to 75 percent internal products within five years, as well as to achieve
a 55 percent gross margin, 25 percent pretax net and 6-8 percent market share. GMT also plans to go public,
though no timeframe has been set.
Company Overview and Strategy
GMT Microelectronics is an independent, privately held company that produces analog and mixed-signal
integrated circuits. The company is also a silicon wafer foundry service. GMT was formed by former CMG
management and their backing by the above investment group’s January 1995 buy out of the captive
semiconductor assets of the Commodore Semiconductor Group (CMG), a unit of Commodore International Ltd.’s
Commodore Business Machines.
Although production ramp was initiated in May 1995, difficulties in launching the operation necessitated a turn
around program. This was executed by the current CEO, hired in October 1996.
2-174
North American Company Profiles
GMT Microelectronics Corporation (GMT)
GMT’s processing expertise includes the manufacture of digital, analog, mixed-signal, and power management
products using various CMOS, NMOS, and BiCMOS process technologies as advanced as one-micron in feature
sizes, with double metal and double poly layers. Strategically, GMT’s goal is to balance customer mix across the
foundry services, semiconductor merchant and OEM markets.
GMT has begun to offer its own brand of analog, mixed-signal power management ICs. GMT is targeting OEMs of
communications, computer, industrial, and consumer products.
Management
Dennis A. Peasenell
Thomas W. Aiken
James H. Oerth
Alan R. Sabanosh
Anthony R. Wilson
Sergio Mendes
Barry Signoretti
Ben Rappaport
Evonna Phillips
Chairman, President and Chief Executive Officer
Senior Vice President and Chief Financial Officer
Senior Vice President and Chief Technology Officer
Vice President, Manufacturing
Vice President, Facilities and Services
Vice President, Sales and Marketing
Director, Marketing (San Jose Office)
Director, Product Development
Director, Customer Relations
Products and Processes
In April 1998, GMT introduced a new high voltage (40V) bipolar CMOS DMOS process for mixed-signal
technologies. The process is targeted for telecommunications, battery power, motor control and smart power
applications. The 40V DMOS device has a Vt of 1.8V and an Rds-on of 0.32 ohm-mm2. The 40V VNPN has an ft
of 2.5GHz, beta = 95, Va = 150 and a Vce-sat of 0.42V. The 40V VPNP has an f{\s\do2(t)} of 200MHz, beta = 90,
Va = 85 and a Vce-sat of 0.32V. Other available active devices include 15V NMOS and PMOS and 20V PMOS
transistors and 7V zener diodes.
The new BCD40 process offers 3.0 micron feature size with 1.5 micron line widths. One or two metal layers are
available along with one or two layers of polysilicon. The polysilicon layers can be used for poly capacitors.
In April 1998, GMT announced availability of a pulse width modulation controller IC for DC-DC converter
applications requiring high speed performance in an MSOP package. The GMT38HC4x family of current mode
PWM controllers are industry standard UC384x and MIC38HC/C4x device compatible. Shoot-through current is
4mA and current sense delay time is typically 50ns. GMT cites its BCDMOS process as enabling such capabilities.
The products are available in 8- and 14-pin DIP, 8- and 14-pin SOIC and 8-pin MSOP packages.
2-175
GMT Microelectronics Corporation (GMT)
North American Company Profiles
Semiconductor Fabrication Facilities
GMT operates its 150,000 square foot, ISO-9002 certified wafer fab on a twenty-four hour, five shifts per week
schedule. The fab has a capacity of 7,000 125mm wafer outs per month, with capability to expand to 10,000
wafers out per month within three months. Situated on 14 acres, the facility contains space for the future
completion of a second wafer fab with equal or more capacity than the current facility. When equipped, it will be
housed in an existing structure designed and built for more advanced manufacturing technologies.
Key Agreements
•
In December 1994, GMT signed an agreement with the Environmental Protection Agency to resolve claims
resultant from the Commodore Semi-Conductor Superfund site where the foundry is now located. In
consideration for a limited covenant not to sue and also contribution protection, GMT made a $675,000
payment to the EPA, deposited $375,000 in escrow and will make annual payments up to $65,000 for any
future “response” actions the EPA takes relating to prior violations.
2-176
Gray Chip
North American Company Profiles
G RAY CHIP
GrayChip
2185 Park Boulevard
Palo Alto, CA 94306
Telephone: (650) 323-2955
Fax: (650) 323-0206
Web Site: www.graychip.com
Email: sales@graychip.com
Fabless IC Manufacturer
Founded: 1989
Company Overview and Strategy
GrayChip develops high speed CMOS signal processing chips tailored for the telecommunication markets. They
specialize in the design of function-specific DSP chips. The Company’s products include all-digital downconverters, up-converters, digital filters, and chipsets for high-speed QAM modems. Annual revenues for 1997
were under $10M, up from 1996 revenues of less than $5M.
Management
Joseph H. Gray
Lars Jorgensen
Brad Evans
President
Vice President, Technology
Director of Marketing
Products and Processes
GrayChip custom designs chip solutions tailored for specific requirements. Examples of their customer-specific
DSP’s are as follows.
•
•
•
•
•
Digital filter ICs;
Wideband digital tuner ICs;
Receiver ICs — Quad digital receiver ICs, single chip digital receivers, dual channel receivers;
Transmitter ICs — Quad digital transmitter ICs, FFT ICs (30MHz radix-8);
Demodulator ICs — 50 M-baud equalizer/demod chipset, supergroup demodulator chip, and quad group
demodulator; and
• Multiplexer ICs — PCM Demultiplexer ICs, FDM transmux ICs, 500MHz mutiplexer.
2-177
Harris Semiconductor
North American Company Profiles
HARRIS S EMICONDUCTOR
Harris Semiconductor
2401 Palm Bay Road Northeast
Palm Bay, Florida 32905
Telephone: (407) 724-7000
Fax: (407) 729-5691
Web Site: www.semi.harris.com
IC Manufacturer
Founded: 1962 (Radiator Inc.)
Renamed Harris Semiconductor in 1967 as result of merger.
Regional Offices/Representative Locations
Europe:
Harris Semiconductor • Brussels, Belgium
Telephone: (32) (2) 724-2111 • Fax: (32) (2) 724-2205
Asia-Pacific:
Harris Semiconductor China Ltd. • Shanghai, China
Telephone: (86) (21) 6247-7923 • Fax: (86) (21) 6247-7926
Financial History ($M), Fiscal Year Ends June 30
Corporate
Sales
Net Income
Semiconductor
Sales
Net Income
Capital Expenditures
Employees
1992
1993
1994
1995
1996
1997
3,004
75
3,099
111
3,336
112
3,444
155
3,621
178
3,972
208
585
(20)
22
591
17
27
635
31
44
659
42
80
708
52
140
670
58
176
—
—
8,000
8,100
8,100
8,100
Company Overview and Strategy
Harris Corporation (NASDAQ: HRS) is a global communications company with core capabilities in wireless
communications, digital television systems, microelectronics, information processing, defense communications
and office systems. Their business is comprised of four major businesses – Communications, Semiconductor,
Lanier Worldwide, and Electronic Systems. Harris is an ISO 9000 certified company.
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North American Company Profiles
Harris Semiconductor
Harris Semiconductor originated as the Microelectronics Division of Radiation, Inc. in 1962. It became Harris
Semiconductor in 1967 through the merger of Harris and Radiation. Then in 1988, Harris Semiconductor nearly
tripled in size through the acquisition of the General Electric Solid State semiconductor business.
Harris’ Semiconductor business is focused on five major markets: Communications, Telecommunications,
Automotive, Video/Multimedia, and Power Control. During the past five years, company investments have been
concentrated in wireless communications, multimedia, and power control.
Broad Product categories include: discrete MOS power transistors (MOSFETs, IGBTs, MCTs) power protection
devices for surge protection; intelligent power ICs with mixed-signal content; data converters and associated data
acquisition signal conditioning ICs; amplifier ICs; digital processing ICs; telecom line card ICs; CMOS logic and
microprocessors; and radiation-hardened ICs and transistors for spacecraft and satellites. Also offered are analog,
digital, power and mixed-signal ICs and discrete power semiconductors specifically for the communications,
automotive, power control, multimedia, aerospace and military markets.
Product breakthroughs in two key areas – wireless communications and multimedia – are critical areas of focus. In
wireless communications, for example, Harris introduced the PRISM family of chipset solutions that provide
wireless access to company local area networks and from there to the Information Superhighway. Another PRISM
solution allows wireless voice or data telephone service in what are called “local loops” – an important solution for
countries without wired telephone infrastructures. In multimedia systems, Harris has developed an advanced
chipset and complete system solution for high-quality video conferencing for desktop PCs. The highly integrated
Harris solution will allow such systems to retail for about $500, making easy to use, high-quality video conferencing
an affordable upgrade for any PC.
The power semiconductor market is another strategic growth area. Power semiconductors and ICs are used to
control, condition, or monitor the power in virtually any electric powered device – from watches, cameras, mobile
phones, stereos, and TVs or computers, to washing machines, air conditioners, cars, and space stations. The
company doubled its production capacity with the start-up of a new high-capacity eight inch fabrication facility in
fiscal 1997. Along with this sizable expansion, the company launched an innovative manufacturing process that
helps their power products out perform the competition. Harris expects to develop more than 200 new power
devices in fiscal 1998 and will be in position to expand production as the market grows.
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Harris Semiconductor
North American Company Profiles
Management
Harris Corporation
Phillip W. Farmer
Bryan R. Roub
Chairman, President and Chief Executive Officer
Senior Vice President and Chief Financial Officer
Harris Semiconductor Sector
John C. Garrett
F. Scott Moody
W. Russell Morcom
Dyer Matlock
Carleton Smith
Bill McLean
Edward Verbeek
President
Vice President, Military and Aerospace Products Division
Vice President and GM, Semiconductor Products Division
Vice President, Engineering
Vice President (Asia), Sales
Vice President and GM, Worldwide Sales and Marketing
Vice President (Europe), Sales
Products and Processes
Harris offers a broad range of standard, semi-custom, and custom ICs and discrete semiconductors, including
intelligent power devices, data acquisition and signal processing circuits, digital microprocessor, peripheral, and
logic ICs, as well as radiation-hardened circuits for spacecraft and satellite applications. Harris also offers advanced
chipsets and complete system solutions for desktop PC-based video conferencing. Products listed by market are
as follows:
Communications – wireless LAN (local area network) systems; cellular base stations; satellite communications
systems; set-top boxes.
• PRISM Wireless Radio data communications chipset; RF-optimized operational amplifiers, digital
down converters, high speed data converters, digital filters.
Telecommunications – PBX, central office, wireless local loop, fiber-in-the-loop equipment
• Single, dual SLICs (subscriber line interface circuits). Also, CODEC/Filter products.
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Harris Semiconductor
North American Company Profiles
Automotive – Antilock braking systems, engine and emission controls, engine knock sensing, air-bag systems,
entertainment systems
• J1850 Multiplexing chipset; engine knock sensor; devices for power management, control. Power
protection circuits.
Video/Multimedia – video and imaging processing systems; video teleconferencing; multimedia.
• Video buffers, op amps, crosspoint switches, routers, digital video mixers, and digital filters; videooptimized A/D and D/A converters and sample and hold amplifiers.
Power Control – Motor controllers, disc drives, power supplies, distributed power systems, power switching.
• Power MOSFETs, IGBTs, power processing products, MOV (metal oxide varistors), intelligent power
products.
General Electronics Markets – Test equipment, industrial controls, consumer electronics, medical imaging,
computer peripherals, hand-held portable equipment; military and aerospace electronics.
• Op amps, sample-and-hold amplifiers; Analog switches, multiplexers; A/D and D/A converters;
Microprocessors, microcontrollers; Logic devices; DSP ICs; Power MOS; Power processing products;
MOVs; Intelligent power products; radiation-hardened ICs and discretes, semicustom ICs for military
and aerospace applications.
✔
✔
MOS MEMORY
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
Other (Including Non-Volatile RAM)
✔
MOS LOGIC
General Purpose Logic
Gate Array
Standard Cell
Field Programmable Logic
Other Special Purpose Logic
✔
✔
✔
✔
MOS MICROCOMPONENT
MPU
MCU
MPR
DSP
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
✔
ANALOG
Amplifier
Interface
Consumer/Automotive
Voltage Regulator/Reference
Data Conversion
Comparator
Other (Includes Telecom)
DIGITAL BIPOLAR
Bipolar Memory
General Purpose Logic
Gate Array/Standard Cell
Field Programmable Logic
Other Special Purpose Logic
MPU/MCU/MPR
OTHER
Full Custom IC
Discrete
Optoelectronic
2-181
Harris Semiconductor
North American Company Profiles
Process technologies used by Harris Semiconductor include: CMOS, BiCMOS, power BiMOS, high-frequency
bipolar/power MOS, high-voltage bipolar/power MOS, complementary bipolar dielectric isolation (bonded wafer),
CMOS/SOI (silicon-on-insulator), CMOS/SOS (silicon-on-sapphire), and radiation hardening.
Semiconductor Fabrication Facilities
Harris supplements its internal semiconductor production capabilities with foundry agreements with external
semiconductor manufacturers. For example, the company uses foundries for the fabrication of triple-layer-metal
CMOS devices like signal processing ICs.
Harris Semiconductor (Ohio), Inc.
1700 Fostoria Road
Findlay, Ohio 45840
Telephone: (419) 423-0321
Cleanroom size: 57,500 square feet
Capacity (wafers/week): 15,000
Wafer sizes: 100mm, 125mm
Processes: CMOS, bipolar, BiCMOS
Products: Custom digital, linear, logic, and
mixed-signal ICs.
Feature sizes: 1.2µm, 1.5µm, 2.0µm
Harris Semiconductor (Florida), Inc.
P.O. Box 883
Palm Bay, Florida 32905
Telephone: (407) 724-7000
Cleanroom size: 53,000 square feet
Capacity (wafers/week): 7,000
Wafer sizes: 3 in., 100mm, 125mm
Processes: CMOS, PMOS, bipolar
Products: MPUs, SRAMs, linear and digital ICs,
discretes.
Feature sizes: 0.8µm, 1.0µm, 2.0µm, 4.0µm
Harris Semiconductor (Pennsylvania), Inc.
Crestwood Industrial Park
125 Crestwood Road
Mountaintop, Pennsylvania 18707-2189
Telephone: (717) 474-6761
Cleanroom size: 74,000 square feet
Capacity (wafers/week): 4,000
Wafer sizes: 100mm, 125mm, 150mm
Processes: MOS, bipolar, BiCMOS
Products: Discretes, hybrids, ASICs
Feature sizes: 1.0µm, 2.0µm, 5.0µm
Harris Semiconductor (Pennsylvania), Inc.
Mountaintop, Pennsylvania
Cleanroom size: 25,000
Capacity (wafers/week): 5,000
Wafer size: 200mm
Process: MOS
Products: Discretes, smart power ICs
Feature size: 1.0µm
In early 1996, Harris began building a new IC assembly and test facility in Suzhou, China. The company expects
construction to be completed by summer of 1998. The new facility will assemble and test digital logic,
microperipheral, and analog and mixed-signal devices. Harris has existing semiconductor assembly factories in
Kuala Lumpur, Malaysia, Dundalk, Ireland, and Palm Bay, Florida.
In 1997, Harris completed construction and check-out of a new fabrication facility in Mountaintop, Pennsylvania,
This is noted to be the first facility in the world to produce discrete power devices on an eight-inch wafer.
2-182
North American Company Profiles
Harris Semiconductor
Key Agreements
•
February 1998, Solectek Corporation, an industry leader in wireless LAN/WAN connectivity products,
announced a collaboration with Harris Semiconductor to develop a high-speed, long range wireless bridge
product, the Solectek MP1100E. The Solectek MP1100E will provide high speed building-to-building
wireless bridging with IP and IPX routing features using Harris’ PRISM™ 2.5GHz direct sequence spread
spectrum (DSSS) radio technology.
•
In January 1998, Harris Semiconductor and Netwave Technologies, Inc. have agreed to collaborate to bring
high performance wireless technology to the market this year. The joint venture leverages Harris’ expertise in
the semiconductor arena and Netwave’s networking and software experience. The partnership will yield
advanced 2Mbps and 11Mbps wireless LAN products based on state-of-the-art radio chipsets from Harris.
•
August 1997, Harris Semiconductor partnered with Chrysler to develop a multiplexing system for cars. In
parallel, Harris, Chrysler and the Society of Automotive Engineers helped define a new standard for in-vehicle
data transmission. This new standard, known as SAE J1850, defined minimum data communication
requirements so that the resulting network is cost effective for simple applications yet flexible enough to use in
complex applications. This will allow complex communications wiring in an auto to be replaced by a single
central communications wire that loops through the car and to which all the electronic components are joined
by small nodes.
2-183
Holt Integrated Circuits
North American Company Profiles
HOLT INTEGRATED CIRCUITS
Holt Integrated Circuits
23351 Madero
Mission Viejo, California 92691-2730
Telephone: (949) 859-8800
Fax: (949) 859-9643
Web Site: www.holtic.com
IC Manufacturer
Founded: 1976
Employees: 25
Ownership: Privately held.
Company Overview and Strategy
Holt Integrated Circuits, with 1997 total sales of $5.1 million, is a major supplier of CMOS display drivers and
avionics databus and monolithic ICs to the avionics and military markets. As one of the early suppliers of cell based
custom and semi-custom CMOS, Holt Integrated Circuits provided low voltage, mixed signal ASICs worldwide.
Applications included heart pacemakers, data and voice communications, industrial instrumentation, consumer
applications and avionics products. Holt gradually changed its focus to become a major supplier of standard
products for the display driver and avionics markets.
The HI-8010 series of Dichroic LCD Display Drivers was Holt’s first standard product entry into the avionics market
in 1984. Along with the newer HI-8020, HI-8040 and HI-8045 drivers, they are now widely used in a variety of
military and commercial avionics displays as well as ground based applications.
The initial Holt ARINC 429 standard products were introduced in 1990, in response to requests from several
avionic’s manufacturers for an alternate, cost effective source of monolithic devices for this protocol. The product
line has further expanded with additional devices. New products are under development for both this and other
avionics protocols.
Management
William Holt
Richard Kemmerle
Gerald Donaldson
2-184
Chairman, President, and Chief Executive Officer
Vice President, Operations
Director, Marketing and Sales
Holt Integrated Circuits
North American Company Profiles
Products and Processes
MOS MEMORY
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
Other (Including Non-Volatile RAM)
MOS LOGIC
General Purpose Logic
Gate Array
✔
Standard Cell
Field Programmable Logic
✔
Other Special Purpose Logic
MOS MICROCOMPONENT
MPU
✔
MCU
MPR
DSP
✔
✔
ANALOG
Amplifier
Interface
Consumer/Automotive
Voltage Regulator/Reference
Data Conversion
Comparator
Other (Includes Telecom)
DIGITAL BIPOLAR
Bipolar Memory
General Purpose Logic
Gate Array/Standard Cell
Field Programmable Logic
Other Special Purpose Logic
MPU/MCU/MPR
OTHER
Full Custom IC
Discrete
Optoelectronic
Standard Products
Holt offers a family of high voltage (up to 35V) CMOS display drivers and a family of avionics databus devices for
use in both commercial and military aircraft applications.
The high voltage display driver products are available with 30, 32, 34, 38, 80 and 85 segments in a variety of plastic
and ceramic, leaded and surface mount packages for both industrial and military applications.
The avionics databus products provide monolithic solutions for ARINC 429 protocol application. The products
encompass transmitter/receivers for use with 8- and 16-bit microprocessors/microcomputer; differential line
receivers to convert the ARINC 429 levels to CMOS/TTL levels; and differential line drivers that convert
CMOS/TTL logic levels to ARINC 429 bus levels. All are available in a variety of plastic and ceramic, leaded and
surface mount packages suitable for industrial and military applications.
Semiconductor Fabrication Facilities
Holt’s products are manufactured using a combination of qualified wafer and assembly services in conjunction with
Holt’s in-house design, test and screening capabilities.
2-185
Honeywell
North American Company Profiles
HONEYWELL SSEC
Honeywell, Incorporated
Solid State Electronics Center (SSEC)
12001 Highway 55
Plymouth, Minnesota 55441
Telephone: (612) 954-2301
Fax: (612) 954-2504
Web Site: www.ssec.honeywell.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends December 31
Corporate
Sales
Net Income
Semiconductor
IC Sales
Employees
1992
1993
1994
1995
1996
1997
6,223
247
5,963
322
6,057
279
6,731
334
7,312
403
8,000
471
53
45
45
58
60
55
—
—
500
523
550
645
Company Overview and Strategy
Founded in 1885, Honeywell (NASDAQ: HON) is an international company that provides control components,
products, systems, and services for the home and building, industrial, space and aviation, and defense and marine
markets.
2-186
Honeywell
North American Company Profiles
Honeywell established its Solid State Electronics Center (SSEC) in 1965 to support the high technology
demands in the markets served by the parent company. This growing reliance on microelectronics led SSEC to
become a niche market manufacturer of specialized ICs and solid-state sensors.
The SSEC's mission is to develop and produce niche semiconductor technologies and products which are
focused in the market areas of sensors, radiation-hardened space components, and specialized ICs for its parent's
needs and select external markets. SSEC is the world’s leading supplier of SOI CMOS ICs for space and industrial
applications. Approximately 50 percent of the SSEC's IC production is sold to external customers.
Management
Michael R. Bonsignore
D. Larry Moore
Larry C. Welliver
Brian Urke
Lou Del Monte
Bryan Johnson
Pravin Parekh
Jay Schrankher
Karen Dale
Rod Clark
Chief Executive Officer
President and Chief Operating Officer
Vice President, SSEC
Director, Aerospace Electronics
Director, Business Management, SSEC
Director, Human Resources and Facilities, SSEC
Director, Operations, SSEC
Director, Quality and Information Systems, SSEC
Director, Material Management, SSEC
Manager, ASIC Products, SSEC
Products and Processes
Honeywell SSEC's key business areas are outlined below.
Space components (for commercial, military space, and tactical and strategic missile applications).
• SRAMs
• ROMs (SOI and bulk)
• Gate arrays (SOI and bulk) with ultra low power options
• Bus interface products (1773 and 1553)
Sensors (for industrial control, automotive, medical, and aircraft applications).
• Precision pressure
• High-accuracy magnetic
High-temperature products (for oil service industry, industrial control, and gas turbine control applications). All
SOI devices.
• Op amps
• Switches
• A/D converters and controllers
2-187
Honeywell
North American Company Profiles
About 90 percent of Honeywell's ICs are manufactured using CMOS or radiation-intensive CMOS (RICMOS™)
processes and 10 percent using an advanced bipolar process.
Semiconductor Fabrication Facilities
Honeywell, Incorporated
Solid State Electronics Center
12001 Highway 55
Plymouth, Minnesota 55441
Wafer size: 150mm
Processes: CMOS, bipolar
Products: Rad-hard memories, ASICs, analog ICs, digital ICs, sensors, foundry services
Feature sizes: 0.3µm, 0.4µm, 0.5µm, 0.7µm, 0.8µm, 1.2µm
2-188
HP
North American Company Profiles
HEWLETT -PACKARD (HP)
Hewlett-Packard Company
3000 Hanover Street
Palo Alto, California 94304-1112
Telephone: (650) 857-1501
Fax: (650) 857-5518
Web Site: www.hp.com
Captive IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Hewlett-Packard Company • Geneva, Switzerland
Telephone: (41) (21) 780-8111
Asia-Pacific:
Hewlett-Packard Company • Causeway Bay, Hong Kong
Telephone: (852) 2599-7777
Financial History ($M), Fiscal Year Ends October 31
Corporate
Sales
Net Income
Employees
Semiconductor*
Sales
IC Sales
Internal Sales
External Sales
Discrete Sales**
1992
1993
1994
1995
1996
1997
16,410
549
20,317
1,177
24,991
1,599
31,519
2,433
38,420
2,586
42,895
3,119
—
—
—
—
—
121,900
745
400
350
50
345
880
475
410
65
405
1,085
585
540
45
500
1,250
655
615
40
595
1,420
740
705
35
680
1,585
826
787
39
759
*Calendar year
**Includes internal and external sales
Ownership: Publicly held. NYSE: HWP.
Company Overview and Strategy
Hewlett-Packard (HP) is one of the world's leading designers and manufacturers of electronic, medical, analytical,
and computing instruments and systems. HP divides its business into five product categories: computer
products, electronic test and measurement instruments and systems, medical electronic equipment, analytical
instruments, and electronic components.
2-189
HP
North American Company Profiles
Hewlett-Packard’s Components Group (CG) is structured into four main businesses:
• Optoelectronics Division: Broad range of visible LEDs, Displays, and Motion Sensing and Control products.
• Communications Semiconductor Solutions Division: Fiber Optic Transmit and Receive products, Infrared
communication link products, RF/Microwave semiconductor devices, High Isolation Optocoupler
components, and High Speed I/O integrated circuits and modules.
• Wireless Infrastructure Division: RF/Microwave/Millimeter-wave subsystems and components for wireless
communications infrastructure equipment.
• Integrated Circuit Business Division: Application Specific Integrated Circuits, MPUs.
HP CG serves the following market areas: Communications Equipment (mobile, infrastructure, wired/wireless),
Computer/Office Equipment, Transportation, Consumer Electronics, and Industrial Electronic Equipment. Also
under the wings of Hewlett-Packard is HP Labs, which is one of the world's leading electronic research centers.
Management
Lewis E. Platt
Byron Anderson
Bill Sullivan
Alan Marty
Dick Chang
Neal Carney
Lance Mills
2-190
Chairman, President, and Chief Executive Officer
Vice President and General Manager, Microwave and Communications Group
Vice President and General Manager, Components Group
General Manager, Integrated Circuits Business Division
General Manager, Communications Semiconductor Solutions Division
Manager, Marketing, IC Business Division
Manager, Research and Development, IC Business Division
North American Company Profiles
HP
Products and Processes
HP's semiconductor products range from analog and high-speed digital ICs to RF, microwave, and optoelectronic
semiconductors. The company also offers motion control devices, solid-state relays, and millimeter-wave
components. In addition, HP manufactures RISC MPUs that are designed using what it calls Precision
Architecture-RISC (PA-RISC).
In 1998, HP introduced three new Intel-based models to its family of home PCs. The new line features the
following models.
• HP Pavilion 8290 PC — powered by a Pentium II 400MHz processor with 100MHz system bus, 64MB
SDRAM, a 12.0GB hard drive and a DVD drive.
• HP Pavilion 8250 PC — powered by the new 266MHz Intel Celeron processor and comes with 48MB
SDRAM and a 6.0GB hard drive.
• HP Pavilion 3265 PC — offers a 233MHz Pentium processor with MMX technology, 32MB SDRAM and a
56Kbps modem.
In early 1997, HP introduced the latest product from its PA-8000 RISC microprocessor family of 64-bit MPUs for
high-end systems—the 12-million transistor PA-8500. Claiming to be HP’s most powerful microprocessor, the PA8500 incorporates 1.5MB of memory on chip and was designed on a 0.25µm process. Target applications for the
device include Internet access, database access and management, computer-aided design and manufacturing
(CAD/CAM), and communications.
HP uses sophisticated semiconductor technologies based on silicon, GaAs, and InP materials.
Semiconductor Fabrication Facilities
In April 1997, Hewlett-Packard announced the development of a new joint venture foundry company with foundry
company, Chartered Semiconductor, and the Economic Development Board (EDB) of Singapore. This is the
second fab facility investment HP has made in Singapore.
The new venture, called Chartered Silicon Partners, will be located adjacent to Chartered’s exiting facilities in the
Woodlands Industrial Park in Singapore. Construction of a 200mm wafer manufacturing facility is expected to
begin in September 1997 with production beginning in mid-1999. HP will receive a specified amount of wafers
(0.35µm and 0.25µm ASICs) from the venture in exchange for its investment, while the remaining capacity will be
offered as part of Chartered’s usual foundry services. Chartered will hold the majority interest of the venture while
HP and the EDB will hold minority positions.
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HP
North American Company Profiles
Hewlett-Packard
350 West Trimble Road
San Jose, California 95131-1008
Telephone: (408) 435-7400
Capacity (wafers/week): 1,100
Wafer sizes: 3 in., 100mm
Processes: Bipolar, GaAs
Products: ASICs, optoelectronics, discretes
Feature sizes: 0.5µm-5.0µm
Hewlett-Packard
39201 Cherry Street
Newark, California 95131
Telephone: (408) 435-6765
Cleanroom size: 13,000 square feet
Capacity (wafers/week): 1,250
Wafer size: 100mm
Process: Bipolar
Products: Analog ICs, RFICs
Hewlett-Packard
3404 East Harmony Road
Fort Collins, Colorado 80525
Telephone: (303) 229-3800
Capacity (wafers/week): 1,250
Wafer sizes: 100mm, 150mm
Processes: CMOS, bipolar
Products: RFICs, microwave ICs, MPUs, ASICs
Feature sizes: 0.35µm-1.0µm
Hewlett-Packard
1050 Northeast Circle Boulevard
Corvalis, Oregon 97330
Capacity (wafers/week): 5,600
Wafer sizes: 100mm, 150mm
Process: CMOS
Products: ASICs, MPUs, MPRs, DSPs
Feature sizes: 0.5µm-1.0µm
Hewlett-Packard
Santa Rosa, California
Capacity (wafers/week): 1,000
Wafer size: 2 in.
Process: Bipolar
Products: Discretes
Hewlett-Packard
Santa Clara, California
Cleanroom size: 17,000 square feet
Capacity (wafers/week): 225
Wafer size: 3 in.
Process: GaAs
Products: ICs and discretes
TECH Semiconductor Singapore Pte. Ltd.
P.O. Box 2093, SE 9040
990 Bendemeer Road
Singapore 1233
Telephone: (65) 298-1122
Cleanroom size: 40,000 square feet
Capacity (wafers/week): 6,250
Wafer size: 200mm
Process: CMOS
Products: DRAMs
Feature sizes: 0.35µm, 0.5µm
(Joint venture with Texas Instruments, the Economic Development
Board of Singapore, and Canon.)
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North American Company Profiles
HP
Key Agreements
• Intel and HP have worked for more than three years on the next-generation microprocessor architecture
technology. On October 14, 1997, the two companies revealed the first details of their jointly defined Explicity
Parallel Instruction Computing (EPIC) technology and IA-64 (Intel Architecture 64-bit). IA-64, based on EPIC
technology, will enable breakthrough performance, compatibility and scalability addressing next-generation,
64-bit high-end workstation and server market requirements. HP’s future systems will be built with IA-64-based
processors that will take full advantage of EPIC technology.
• Early in 1997, HP and Cisco Systems Inc. agreed to a broad technology-development, Internet solutions and
customer-support alliance. This agreement expanded an ongoing relationship to more fully integrate
computing, networking and network management, and to offer end-to-end support and security for Internetready networked computing solutions.
• HP announced a joint strategy with Microsoft to increase the productivity of their enterprise customers’
computing technology while reducing costs. Together, they’re developing an initiative to help customers
achieve cost-effective enterprise environments.
• AT&T Microelectronics (now Lucent Technologies) and Hewlett-Packard signed an agreement in early 1995 to
develop and dual-source fiber-optic transceivers for SONET/SDH and ATM applications.
• To promote and coordinate the use of its PA-RISC architecture, Hewlett-Packard formed PRO, the Precision
RISC Organization. Some of the founding members are Convex Computer, Hitachi, Oki, Hughes Aircraft, and
Mitsubishi. Other members include Sequoia Systems and Winbond Electronics.
• Although not a PRO member, Samsung has the right to manufacture PA-RISC ICs to sell on the merchant
market and use in its own workstations.
• HP formed an alliance with Analog Devices for the joint development of advanced mixed-signal processes
based on HP's submicron CMOS and BiCMOS technologies.
• Hewlett-Packard and Intel announced a wide ranging joint research and development alliance in 1994 under
which the partners are seeking to design a superior next-generation 64-bit microprocessor by 1999, a year later
than originally planned. The processor will be binary-compatible with both Intel x86 code and HP PA-RISC
code.
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Hughes Electronics
North American Company Profiles
HUGHES ELECTRONICS *
Hughes Electronics Corporation
Delco Electronics Corporation
One Corporate Center
Kokomo, Indiana 46904-9005
Telephone: (317) 451-5700
Fax: (317) 451-5426
Web Site: www.delco.com
Hughes Aircraft Company
Microelectronics Division
500 Superior Avenue
Newport Beach, California 92663
Telephone: (714) 759-2411
Fax: (714) 759-2986
Web Site: www.hughes.com
Captive IC Manufacturer
*In January 1997, Hughes Electronics Corporation and Raytheon entered into a definitive agreement to bring
about the merger of the defense operations (Hughes Aircraft Company, which includes the Microelectronics
Division) and Raytheon. As part of the agreement, Delco Electronics will be transferred from Hughes Electronics
to GM’s Delphi Automotive Systems. On October 20, 1997 — GM announced that it was moving forward with
restructuring transactions that include the spin-off of Hughes Defense and its merger with Raytheon, and the
transfer of Delco Electronics from Hughes Electronics to GM.
Financial History ($M), Fiscal Year Ends December 31
Corporate
Sales
Net Income
*Semiconductor
Sales
Delco Electronics
Internal Sales
External Sales
Hughes Aircraft
Internal Sales
External Sales
1992
1993
1994
1995
1996
12,297
(922)
13,518
922
14,099
1,049
14,772
1,108
15,918
1,151
341
205
195
10
136
81
55
350
220
205
15
130
72
58
360
235
215
20
125
64
61
340
240
215
25
100
45
55
330
250
215
35
80
30
50
*Delco Electronics returned to GM’s Delphi Automotive Systems, and Hughes Aircraft was sold to Raytheon who
in turn sold its Semiconductor Division to Fairchild.
Company Overview and Strategy
Hughes Electronics Corporation (HE), known as GM Hughes Electronics Corporation prior to March 1995, is a
subsidiary of General Motors Corporation.
HE's principal operating organizations are Delco Electronics
Corporation and Hughes Aircraft Company. Its other business units are Hughes Telecommunications and Space
Company, DirecTV, Inc., and Hughes Network Systems, Inc.
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North American Company Profiles
Hughes Electronics
Delco Electronics (DE) is a world leader in the development, manufacture, and marketing of vehicle and driver
systems for the global automotive market, and Hughes Aircraft, acquired by GM in 1985, is a world leader in
aerospace, defense electronics, and information systems.
Delco Electronics, alone, is the third largest captive IC manufacturer. Its fabrication facilities produce about 40
percent of its semiconductor needs. The company produces advanced ICs that perform a variety of functions,
such as deciphering radio frequency signals for audio systems, controlling the release of an airbag, suspension
system control, and fuel, electrical, and ignition management. Some of its new technologies include night vision
systems, collision avoidance systems, navigation systems, keyless start systems, tire pressure warning systems,
and reconfigurable LCD head-up displays.
Hughes Aircraft continues to restructure its business to adapt to severe cuts in U.S. defense spending. The
company intends to maintain its leadership in key defense markets, while at the same time, explore new
marketplaces and exploit new technologies. Some commercial ventures the company is involved in include:
digital cellular communications systems, advanced acoustic technologies, light projection systems, digital signal
compression, character recognition, and airport integration systems.
In January 1997, GM and Hughes Electronics announced a series of strategic transactions designed to
strengthen the position of GM in two key areas — telecommunications and space, and automotive electronics. GM
has a definitive agreement with Raytheon to spin off Hughes Aircraft from Hughes Electronics and then merge the
operation into Raytheon. Separately, Delco Electronics will be transferred from Hughes Electronics to GM’s Delphi
Automotive Systems. Both of these transactions are expected to take place in 3Q97.
Management
Michael T. Smith
Charles H. Noski
Michael J. Burns
John C. Weaver
Chairman and Chief Executive Officer, Hughes Electronics Corporation
President, Hughes Electronics
Executive Vice President, Hughes Electronics Corporation;
General Manager, Delco Electronics Corporation
Senior Vice President, Hughes Electronics Corporation;
President, Hughes Aircraft Company
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Hughes Electronics
North American Company Profiles
Products and Processes
IC Delco, DE's automotive semiconductor unit, designs and manufactures custom analog and digital ICs for
specific automotive applications such as anti-lock brake systems, engine controllers, suspension control systems,
communications, and instrumentation. IC Delco also produces silicon-based electronic sensors.
Among the semiconductor devices Hughes Aircraft designs and manufactures are ASICs, memory devices,
microcomponents, rad-hard circuits, monolithic microwave integrated circuits (MMICs), and millimeter-wave devices
using a variety of process technologies including CMOS, BiCMOS, GaAs, and InP.
Semiconductor Fabrication Facilities
Delco Electronics Corporation
IC Delco Business Unit
700 East Firmin Street
Kokomo, Indiana 46902-2340
Cleanroom size: 125,000 square feet (3 fabs)
Capacity (wafers/week): 12,000
Wafer sizes: 100mm, 125mm
Processes: NMOS, CMOS, BiCMOS, bipolar
Products: MPUs, MCUs, ASICs, logic and
linear ICs, discretes.
Feature sizes: 1.0µm-2.0µm
Hughes Aircraft Company
Microelectronics Division
500 Superior Avenue
Newport Beach, California 92663-3627
Telephone: (714) 759-2411
Capacity (wafers/week): 1,600
Wafer sizes: 100mm
Processes: CMOS, BiCMOS, SOS, CryoCMOS
Products: ASICs, memories, MCUs, LCD drivers,
linear ICs, rad-hard ICs, foundry services.
Feature sizes: 1.25µm-5.0µm
Hughes Aircraft Company
Hughes Communications Products
3100 Lomita Boulevard
Torrance, California 90509
Telephone: (310) 517-6880
Fax: (310) 517-6883
Capacity (wafers/week): 250
Wafer size: 3 in.
Processes: GaAs, InP
Products: MMICs, MM-wave devices, discretes
Feature sizes: 0.25µm-0.5µm
Hughes Microelectronics Europa, Ltd.
Fullerton Road
Queensway Industrial Estate
Glenrothes, Fife, Scotland KY7-5PY
Telephone: (44) (1592) 754-311
Fax: (44) (1592) 610-186
Capacity (wafers/week): 1,600
Wafer size: 100mm
Processes: CMOS, MOS
Products: ASICs, memories, custom ICs
Feature size: 3.0µm
Key Agreements
•
In December 1997, Fairchild completed its acquisition of Raytheon Electronics Semiconductor, a division of
the Raytheon Company.
•
Delco Electronics and Texas Instruments jointly developed a new methodology, called Prism, that is claimed to
cut the high cost and long lead time of taking complex mixed-technology designs from concept to silicon.
Prism is being used by DE to produce configurable 16-bit microcontrollers for GM cars.
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Hutson Industries
North American Company Profiles
HUTSON INDUSTRIES
Hutson Industries
P.O. Box 90
1000 Hutson Circle
Frisco, Texas 75034
Telephone: (972) 335-8600
Web Site: www.hutsonind.com
Email: info@hutsonind.com
Discrete Semiconductor Manufacturer
Ownership: Privately held.
Company Overview and Strategy
Hutson Industries was formed in 1965, and specializes in the design and manufacturing of semiconductor
switching devices for the industrial market. Today, Hutson is one of the largest manufacturers of thyristors.
Products and Processes
The basic product line includes:
•
•
•
•
•
DIACS
SCRs
SIDACS
TRIACS
Chips and Wafers
The company offers most of its product line in chip or wafer form for the hybrid market or special assemblies.
2-197
IBM Microelectronics
North American Company Profiles
IBM MICROELECTRONICS
IBM Microelectronics
1580 Route 52, Building 504
Hopewell Junction, New York 12533
Telephone: (914) 894-2121
Fax: (914) 894-6891
Web Site: www.chips.ibm.com
IC Manufacturer
Founded: 1924
(See Top Ten)
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IC Works
North American Company Profiles
IC WORKS
IC Works, Inc.
3725 North First Street
San Jose, California 95134-1700
Telephone: (408) 922-0202
Fax: (408) 922-0833
Web Site: www.icworks.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends March 31
Sales
Employees
1994
21
1995
26
1996
41
1997
47
1998
55
125
150
200
250
120
Ownership: Privately held.
Company Overview and Strategy
IC Works was established in June 1992, when it acquired the San Jose fabrication facility, process technology,
and engineering and manufacturing staff of Samsung Semiconductor, the U.S. business of Korea’s Samsung.
As an independent company, IC Works designs, manufactures, and markets mixed-signal products using its
design and in-house facility, and provides quick-turn, submicron foundry services to selected mixed-signal
semiconductor companies.
IC Works operates three complementary mixed-signal businesses — clock products, wireless communications
products, and submicron foundry services.
Management
Ilbok Lee, Ph.D.
Dan Feier
Barry Small
Barr Leff
Chen Wang
President and Chief Executive Officer
Vice President and Chief Financial Officer
Vice President, Fab Operations
Vice President, Marketing
Vice President, Engineering
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IC Works
North American Company Profiles
Products and Processes
IC Works' products and services include high-performance clock generator ICs, and wireless communication
circuits. New products for the computer and data communications markets are being developed.
Clock Products
IC Works offers a wide range of high performance phase-locked-loop (PLL)-based clock ICs for system
manufacturers in a variety of markets. The main applications within the clock market include PC motherboards,
communications, mass storage, multimedia, and workstations. Products include clock buffers and single and
dual PLL clocks.
Wireless Communications
Utilizing its PLL and BiCMOS process technologies, IC Works is developing RF solutions for the wireless
marketplace, focusing on data communications. This product strategy includes development of component
level functional block products and ASSPs.
As part of the buyout, Samsung licensed IC Works to use its scaleable submicron CMOS and BiCMOS process
technologies. Currently, the majority of IC Works’ production wafer output is processed to 0.7µm design rules with
a migration to 0.6µm under way. Future plans include development of finer geometry processes down to 0.35µm.
Key Agreements
•
In 1996, IC Works and Motorola announced a second-source agreement for the development and manufacture
of CMOS and BiCMOS-based mixed-signal timing circuits. Motorola will contribute high-performance timing
solutions targeted at workstations, servers, and network applications, while IC Works will provide “clock”
solutions targeting personal computers and peripheral applications.
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ICS
North American Company Profiles
INTEGRATED CIRCUIT S YSTEMS (ICS)
Integrated Circuit Systems, Inc.
2435 Boulevard of the Generals
P.O. Box 968
Valley Forge, Pennsylvania 19482-0968
Telephone: (610) 630-5300
Fax: (610) 630-5399
Web Site: www.icst.com
Fabless IC Supplier
Financial History ($M)
Sales
Net Income
R&D Expenditures
Employees
Year ended June 3 0
1993
1994
1995
78
94
98
11
12
5
9
10
11
314
336
219
Year E n d e d
June 2 9
June 2 8
1996
1997
91
104
4
(8)
12
14
206
Year-to-Date
Six Months
1998
82
11
—
250
—
Special Charges
1997 – Reflects special charges relating to the acquisition of MicroClock, Inc. ($11.2) and the write-off of the
investment in Voyetra ($7.0).
1996 – Reflects special charges of $3.3 million relating to the Turtle Beach operations.
1995 – Reflects special charges of $7.4 million associated with severance and other exits costs associated with
redirection of the company’s multimedia strategy.
Company Overview and Strategy
Integrated Circuit Systems, Inc. (ICS), with headquarters in Valley Forge, Pennsylvania, a major design center in
Silicon Valley, California, and a product test center in Singapore, is a fabless semiconductor company specializing
in high performance mixed-signal integrated circuits for frequency synthesizers, data communications, imaging,
and ASIC products. ICS was founded in 1976, launched an IPO in 1991, and trades on the NASDAQ stock
exchange under the stock symbol ICST.
ICS’ primary focus is to combine its innovation, market position, and competency in mixed-signal and phase
locked-loop technology to capitalize on the trend convergence of computer, communications, and consumer
applications, especially in the LAN/WAN communications marketplace.
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ICS
North American Company Profiles
Management
Henry Boreen
Hock Tan
Christopher Bland
Edward Christiansen
Martin Goldberg
Paul Lessard
Barry Olson
Gregory Richmond
K. Venkateswaran, Ph.D.
Chairman of the Board
Senior Vice President, Chief Operating Officer and Chief Financial Officer
Vice President, Consumer Products Group
Vice President, Operations
Vice President, Sales
Vice President, Systems Technology
Vice President, Multimedia FTG
Vice President, Computer Products Group
Vice President, Data Communications Group
Products and Processes
Mixed-Signal Technology
ICS markets high performance, mixed-signal CMOS integrated circuits. Mixed-signal technology combines analog
and digital circuitry on a single integrated circuit. ICS continues to push the envelope of mixed-signal design
towards the computer, consumer, and communications markets.
Frequency Timing Generators
ICS is a worldwide leader in Personal Computer frequency timing generators. Every computer system has at least
one frequency timing generator (FTG) to synchronize timing between the microprocessor and peripherals with the
exchange of data. Frequency timing applications include personal computers, peripherals, such as hard disk
drives, printers, scanners, modems and digital cameras, consumer products, such as TV set-top boxes, satellite
receivers, cordless phones, and professional products, such as workstations and multimedia. ICS’ FTGs are
available for all popular microprocessor families, as well as compatible processors and core logic sets.
Data Communications
ICS’ data communications products include high-performance transceiver chips designed for applications in
network systems. These devices work in Local Area Networks (LAN) and Wide Area Networks (WAN), including
SONET/SDH fiber optic systems and 100/10M Fast Ethernet TX/FX systems. ICS is a market leader in single chip
CMOS PHYceivers™ for Fast Ethernet, and is also a founding member of the Gigabit Ethernet Alliance with plans
to support the Gigabit Ethernet market.
Core Technology and Custom ICs
ICS’ mixed-signal chips integrate analog functions with digital logic, allowing development of cost effective, stateof-the-art designs. Applications technology includes major industry groups, such as telecommunications,
military/aerospace, consumer and computers. ICS’ design strengths include data acquisition, switched capacitor
filters, phase-lock loops (PLL) with patented voltage controlled oscillators (VSO), voltage controlled crystal
oscillators (VCXO), and gigahertz CMOS.
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North American Company Profiles
ICS
Key Agreements
• ICS has entered into agreements with foundries such as Chartered Semiconductor, UMC, TSMC, and AMI to
supply wafers manufactured to its specifications and designs. Some of these agreements provide for
investment from ICS to ensure availability of capacity.
• During fiscal year 1996, ICS established an agreement with Chartered Semiconductor to secure a minimum
wafer supply from Chartered covering a five year period.
• ICS acquired a 51 percent interest in ARK Logic, Inc. in 3Q95. ICS plans to combine its audio design specialty
with ARK’s video graphics expertise to develop a chip that handles 3D graphics, VGA control, and audio and
video processing. ICS may purchase the remaining 49 percent of ARK Logic.
• In October 1992, ICS entered into an alliance with American Microsystems Inc. under which ICS secured wafer
processing capacity through the year 2000.
• ICS licensed DSP Group’s Pine digital signal processing and TrueSpeech voice compression technologies for
use in its next-generation audio components.
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ICT
North American Company Profiles
ICT
ICT Inc.
2123 Ringwood Avenue
San Jose, California 95131
Telephone: (408) 434-0678
Fax: (408) 432-0815
Web Site: www.ictpld.com
Fabless IC Supplier
Company Overview and Strategy
ICT Inc., founded in November 1991, designs, manufactures, and markets programmable logic devices (PLDs) for
a variety of applications such as PCs, telecommunications, industrial, medical, and consumer electronics. The
company was originally established in 1983 by International CMOS Technology.
ICT is organized into two divisions: the Programmable Logic Division (PLD) and the Personal Computer Products
Division (PCPD). The PLD designs, develops, and markets user-programmable integrated circuits specializing in
programmable logic devices (PLDs). The PCPD designs and markets PC core logic chipsets and peripheral
controller products.
Management
David Sears, Ph.D.
Edward D. Barnett
Volker Cathrein
Chairman
President and Chief Operating Officer
Chief Financial Officer and Secretary of Finance
Products and Processes
ICT's programmable logic product line consists of two families of CMOS PLDs — PEEL (Programmable Electrically
Erasable Logic) Devices and PEEL Arrays — in addition to supporting development tools. PEEL Devices are
simple PLDs designed as replacements for standard 20-pin and 24-pin PAL/GAL devices with speed grades
ranging from 5ns to 25ns. PEEL Arrays are complex PLDs (CPLDs) that combine a non-segmented PLA with
FPGA-like logic cells with wide single-level delays as fast as 9ns/15ns (internal/external). PEEL Arrays are used for
combinatorial logic, with clocking frequencies running up to 80MHz for sequential functions.
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ICT
North American Company Profiles
PEEL Devices
PEEL 16V8
PEEL 18CV8
PEEL 18LV8Z
PEEL 20V8
PEEL 22CV8
PEEL 22V10
PEEL 22CV10A
PEEL 22CV10AZ
PEEL 22LV8Z
PEEL 22LV10AZ
PEEL Arrays
PA7024
PA7128
PA7140
ICT's PLDs are designed and manufactured using proprietary 0.8µm CMOS EEPROM technology.
The company's PC product line consists of Pentium and 486 portable and desktop core logic chipsets,
programmable peripheral interface ICs, and peripheral controller ICs.
Semiconductor Fabrication Facilities
ICT is a fabless IC supplier therefore, utilizes external fabrication and assembly facilities. ICT wafers are currently
fabricated by two companies: Chartered Semiconductor Manufacturing of Singapore and Rohm Co. of Japan.
Assembly and test work is handled by multiple vendors in the Philippines, Thailand, and Taiwan.
Key Agreements
• ICT has a license agreement with AMD involving PLD products.
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IDT
North American Company Profiles
INTEGRATED DEVICE TECHNOLOGY (IDT)
Integrated Device Technology, Inc.
2975 Stender Way
Santa Clara, California 95054
Telephone: (800) 345-7015
Fax: (408) 492-8674
Web Site: www.idt.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Integrated Device Technology–Nippon–K.K. • Chiyoda-ku, Tokyo, Japan
Telephone: (81) (3) 3221-9821 • Fax: (81) (3) 3221-9824
Europe:
Integrated Device Technology, Ltd. • Leatherhead, Surrey, United Kingdom
Telephone: (44) (1372) 363339 • Fax: (44) (1372) 378851
Asia-Pacific:
Integrated Device Technology, Asia, Ltd. • Tsimshatsui, Hong Kong
Telephone: (852) 2736-0122 • Fax: (852) 2375-2677
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1993
236
5
54
28
1994
330
40
64
38
1995
422
78
78
95
1996
680
120
133
287
1997
537
(42)
151
201
1998
587
8
121
—
Employees
2,414
2,615
2,965
3,875
4,600
5,000
Ownership: Publicly held. NASDAQ: IDTI.
Company Overview and Strategy
Integrated Device Technology, Inc. (IDT), enables a digitally connected world by providing innovative
semiconductor solutions to leading-edge system designers in communications and computing. IDT’s broad
product mix consists of communications memories, networking devices, both RISC and x86 microprocessors,
high-speed SRAMs and high-performance logic. The company’s technologies and products take aim at markets
expected to exceed a total of $20 billion in 1998.
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IDT
North American Company Profiles
Headquartered in Santa Clara, California, the company employs approximately 5,000 people worldwide and has
manufacturing facilities in California, Oregon, the Philippines and Malaysia.
Management
D. John Carey
Leonard Perham
Alan Krock
Ray Farnham
Jerry Taylor
Glenn Henry
Stuart Bardach
Charles Clark
William Cortelyou
Dave Côté
Stefan Braken-Guelke
Robin Hodge
Jimmy Lee
Daniel Lewis
Chuen-Der Lien
John Mick
Bob Phillips
Robert Proebsting
Chairman
President and Chief Executive Officer
Chief Financial Officer
Executive Vice President
Executive Vice President, Worldwide Manufacturing and Memory Products
Senior Vice President
Vice President, Quality
Vice President, Subsystems Products/SRAM Products
Vice President, Wafer Operations
Vice President, Marketing
Vice President, Logic Products
Vice President, Assembly and Test
Vice President, FIFO Products
Vice President, Worldwide Sales
Vice President, Technology Development
Vice President, Systems Technology Group
Vice President, Worldwide Manufacturing
Vice President, Advanced Design Concepts
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IDT
Christopher Schott
Thomas Wroblewski
John Payne
Nick Kucharewski
Jack Menache
William Cowing
Gary Dean
Rick Picard
Joel Dedrick
North American Company Profiles
Vice President, Specialty Memory Products
Vice President, Human Resources
Vice President, Far Eastern Operations
Vice President, Microprocessor Products
Vice President, General Counsel and Secretary
Vice President, European Sales
Vice President, Materials
Vice President, Special Programs
Vice President, Graphics and System Solutions
Products and Processes
IDT produces communications products, SRAMs, logic products and both RISC and x86 microprocessors. These
products are designed and manufactured using proprietary advanced submicron CMOS and BiCMOS process
technologies, including the company's 0.5µm process and its next-generation 0.35µm process. IDT's product
groups are outlined below.
SRAMs
• Fast CMOS asynchronous and synchronous SRAMs with 16K to 4M densities and access times as fast as 8ns.
• Fast CMOS ZBT™ synchronous SRAMs that optimize system performance in applications that frequently turn
the data bus around between reads and writes. Available in 1M density and 4M density devices that will support
clock speeds up to 133MHz.
• High-speed industry-standard and custom CMOS SRAM modules.
Communications Memory Products
• High-speed CMOS multi-port SRAMs in densities from 8K to 1M with both synchronous and asynchronous
interfaces.
• High-density CMOS first-in, first-out memories (FIFOs) in synchronous unidirectional or bidirectional and
asynchronous unidirectional or bidirectional versions, covering depths from 1K to 256K and widths from 4 to 36
bits.
• Low-cost Asynchronous Transfer Mode (ATM) 25 to 155Mbps segmentation and reassembly (SAR) controllers
and physical layer (PHY) transceivers for use in emerging XDSL, NIC and DSLAM markets.
• SWITCHSTAR™ network switching chipset enables low-cost switch designs.
Logic Products
• Leading supplier of high-performance, low-power logic.
• More than 242 logic, interface and clock management components.
• ALVC and LVC families of high-performance logic.
RISC and x86 Microprocessors
• IDT is leading innovator of 32- and 64-bit RISController™ microprocessors.
• IDT WinChip™ products for sub-$1,000 desktop computers.
• Full range of development tools.
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IDT
North American Company Profiles
Semiconductor Fabrication Facilities
Integrated Device Technology
1566 Moffett Street
Salinas, California 93905
Fab 2
Cleanroom size: 24,000 square feet (Class 3)
Capacity (wafers/week): 2,150
Wafer size: 150mm
Process: CMOS
Products: SRAMs, FIFOs, MPUs, logic
Feature sizes: 0.5µm-0.8µm
Integrated Device Technology
2670 Seeley Road
San Jose, California 95134
Telephone: (408) 944-0114
Fab 3
Cleanroom size: 24,000 square feet (Class 1)
Capacity (wafers/week): 1,700
Wafer size: 150mm
Processes: CMOS
Products: SRAMs, FIFOs, MPUs, logic ICs, R&D
Feature sizes: 0.25µm-0.5µm
Integrated Device Technology
Hillsboro, Oregon
Fab 4
Cleanroom size: 48,000 square feet (Class 1)
Capacity (wafers/week): 1,875 (3,700 when fully outfitted)
Wafer size: 200mm
Processes: CMOS, MPUs
Feature sizes: 0.25µm, 0.35µm, 0.5µm
(Began operations in 1Q96).
Key Agreements
• IDT is in a cooperative agreement with Micron and Motorola to manufacture and market SRAM products based
on Zero Bus Turnaround™ (ZBT) architecture.
• IDT announced an alternate source agreement with Texas Instruments to manufacture ALVC and LVC logic
products.
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IMI
North American Company Profiles
INTERNATIONAL MICROCIRCUITS (IMI)
International Microcircuits Inc.
525 Los Coches Street
Milpitas, California 95035-5423
Telephone: (408) 263-6300
Fax: (408) 263-6571
Web Site: www.imicorp.com
IC Manufacturer
Ownership: Privately held (profitable from operations since inception).
Employees
80
Company Overview and Strategy
IMI focuses on Application Specific Standard Products (ASSPs) targeting the computer, computer peripheral and
communications markets with mixed analog/digital integrated circuits. Current IMI products focus on System
Clocks and Spectrum Spread products.
IMI was founded by Frank Deverse in the early 1970s. In December 1997, a leveraged buyout of Mr. Deverse by
IMI management, T.A. Associates, a large and nationally well respected venture capital firm, took place.
There are four elements to the company’s strategic positioning: focus, diversification, fast time to market and
competitive pricing. As a company, IMI focuses on not only specific markets but on the leaders within those
markets.
While having segmented the markets, IMI primarily targets the industry leaders within those segments. Becoming
the OEM supplier to the industry leaders is IMI’s goal.
IMI also plans to diversify into other applications.
IMI’s products are sold worldwide through direct sales and independent sales representatives. Exports accounted
for over 70 percent of the company’s revenues in FY97.
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IMI
North American Company Profiles
Management
Ilhan Refioglu
Orhan Tozun
Ed Walsh
George Gray
Rick Reifer
Judith Signorino
President and Chief Financial Officer
Vice President, Engineering
Vice President, Manufacturing
Vice President, Marketing
Vice President, Sales
Director, Finance
Products and Processes
IMI addresses the consumer market in computer and communication applications. IMI addresses its focus market
segments with mixed signal integrated circuits. In the computer market, IMI supplies system clocks, based on
traditional and spectrum spread technologies.
With unique technology and a broad line of low EMI system clock circuits, the company is well positioned to take
advantage of the market’s growing need for reduced EMI. IMI expects its family low EMI integrated solutions to
continue to gain wide acceptance in the market.
IMI’s customer list includes: IBM, Hewlett Packard, Compaq, Dell, Siemens, NEC, Fujitsu, DEC, Apple, MicroStar,
ACER, Goldstar, and Daewoo.
IMI is ISO 9001 certified.
Semiconductor Fabrication Facilities
IMI’s wafer production is done by the company’s foundry partner, IBM, using primarily the Burlington, MA and
Essones, France facilities. IMI uses 0.8 micron (5 inch wafers) and 0.35 micron (8 inch wafers) process
technologies.
All assembly is contracted to the Far East and is dual sourced. All wafer sort and final test functions are conducted
at IMI’s headquarters.
International Microcircuits Inc.
525 Los Coches Street
Milpitas, California 95035-5423
Cleanroom size: 2,000 square feet (Class 10)
Wafer size: 150mm
Process: CMOS
Products: ASSPs
Feature sizes: 0.35µm, 0.8µm
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IMP
North American Company Profiles
IMP
IMP, Inc.
2830 North First Street
San Jose, California 95134-2071
Telephone: (408) 432-9100
Fax: (408) 434-0335
Web Site: www.impweb.com
Email: info@impinc.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
56
(2)
10
2
1994
48
0.4
9
5
1995
60
1
9
5
1996
77
5
10
7
1997
65
(12)
10
2
1998
40
(4)
8
1
324
340
400
425
226
228
Ownership: Publicly held. NASDAQ: IMPX.
Company Overview and Strategy
IMP, Inc. designs, manufactures and markets standard-setting analog integrated circuits and specialty analog wafer
foundry processes for data communications and power management applications in computer, communications
and control systems. IMP products are sold through a worldwide network of representatives and distributors.
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IMP
North American Company Profiles
To address the need for wafer capacity by small fabless startup companies, IMP announced the establishment of
its Silicon Venture Partners (SVP) program in May 1995. Under the SVP program, IMP provides access to wafer
fabrication capabilities to fabless semiconductor startups. This includes absorbing some of the expenses of
developing and producing a new IC in exchange for product, marketing, and/or technology rights, a share of
future profits, or other compensation.
Company Facilities
IMP headquarters and ISO 9001 certified wafer fabrication and test facility are located in San Jose, California.
Product development centers are in Pleasanton, California, and Lee, New Hampshire. The company employs 226
people.
Analog Integrated Circuit Products
Key areas of focus are Data Communications and Power Management.
Data Communications includes memory bus terminators and second generation Small Computer Serial Interface
(SCSI) termination functions that lower system cost.
Power Management includes devices to generate, distribute, protect and manage thermal and power
consumption characteristics of desktop and portable computers, mobile communication devices and battery
powered electronic systems. Examples include Electroluminescent (EL) lamp drivers, low dropout (LDO)
regulators, microprocessor supervisors and high-frequency switching converters.
The company also supplies read-channels, preamplifiers, programmable filters, write drivers and other complex
mixed-signal ICs for tape back-up and other mass-storage peripherals.
Wafer Fabrication and Manufacturing Services
High-volume, analog and mixed-signal wafer foundry services on low-power, high-voltage, CMOS, BiCMOS, and
EEPROM processes, including turnkey packaging and test capabilities. Fabrication services include database
production using IMP standard processes, and porting of customer-owned technology.
Management
David Laws
Phil Ferguson
George Rassam
Jerry DaBell
Barry Wiley
Moiz Khambaty, Ph.D.
Tarsaim Batra
Ron Laugesen
Chairman of the Board
President and Chief Executive Officer
Chief Financial Officer
Sr. Vice President, Design Engineering
Vice President, Sales and Application Engineering
Vice President, Technology
Vice President, Manufacturing
Vice President, Product Engineering
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IMP
North American Company Profiles
Products and Processes
Analog Integrated Circuit Products
Data Communications – Internal system data communications devices, including memory bus terminators
and state-of-the-art Small Computer Serial Interface (SCSI) termination functions, both single-ended and
multi-mode, that lower system cost.
Power Management – Devices to generate, distribute, protect and manage thermal and power consumption
characteristics of desktop and portable computers, mobile communication devices and battery powered
electronic systems. Examples include Electroluminescent (EL) lamp drivers, low dropout (LDO) regulators,
microprocessor supervisors and high-frequency switching converters.
Analog Wafer Foundry Services
IMP’s Wafer Foundry Services provide wafer fabrication services on value-added analog, mixed-signal and
high-voltage processes. Both fast-turn prototype and high-volume production demands are supported.
The product line also manages selective ASIC design programs in association with the customer and thirdparty design resources. To date, more than 1,000 designs have been manufactured for many customers
including AT&T, Adaptec, Daimler-Benz, International Rectifier, Level One Communications, Rockwell
Semiconductor, Siemens and Tektronix.
IMP offers manufacturing capability on a broad range of CMOS technologies in its ISO 9001 registered,
18,000 square foot wafer fabrication facility, with 8,000 square feet under Class 10 laminar-flow, cleanroom
conditions. Processes available today include BiCMOS, CMOS and EEPROM technologies.
IMP manufactures products using N-well and P-well, single and double layer poly CMOS analog processes.
Analog capabilities range from 5 micron high-voltage, down to high-speed 0.8 micron processes. These
include double-poly technology to ensure maximum capacitor stability in analog circuits. Vertical and lateral
bipolar transistors are available to minimize noise in analog inputs and support high-drive outputs.
Processes created for battery-operated circuits provide low-voltage operation, down to 1.5V.
BiCMOS technology options provide solutions for users requiring the speed and drive of bipolar devices
and the low power/high density of CMOS. High-voltage manufacturing experience includes 30V BiCMOS
processes for audio and power management applications, 100V for display and lamp drivers, and custom
power programs from 300V to 600V. Electrically Erasable CMOS modules permit the incorporation of
unique user-configurable features into analog and mixed-signal designs.
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North American Company Profiles
IMP
Semiconductor Fabrication Facilities
IMP, Inc.
2830 North First Street
San Jose, California 95134
Cleanroom size: 8,000 square feet (Class 10)
Capacity (wafers/week): 3,500
Wafer size: 125mm
Processes: CMOS, BiCMOS, EECMOS, High-Voltage CMOS
Products: Foundry Services (wafer, test, packaging)
Data Communications: SCSI terminators, PCM Switches
Power Management: µP Supervisors, Electroluminescent (EL) lamp drivers,
SMPS controllers and Low Dropout (LDO) regulators.
Feature sizes: 0.8µm, 1.0µm, 1.2µm, 2.0µm, 3.0µm, 5.0µm
Key Agreements
• In June 1998, IMP announced the signing of a Joint Technology development agreement with Honeywell’s
Micro Switch Division. The long-term program will develop new analog and mixed signal IC wafer manufacturing
technology based on an existing IMP BiCMOS process. With completion of the technology development
phase, IMP will provide wafer manufacturing services to Honeywell on proprietary analog integrated circuits for
sale in the North American and International Markets.
• In September 1997, IMP introduced the IMP5000 family, the first product line resulting from a strategic
partnership with Linfinity Microelectronics that was announced in July 1997. Based on a new secondgeneration, Small Computer Systems Interface (SCSI) termination architecture, the IMP5000 BiCMOS devices
deliver higher bandwidth and lower system cost than the first generation linear terminators currently available.
With this announcement, IMP is entering the fast growing market for devices serving data communications
applications for local computer to peripheral interconnections based on the industry-standard SCSI
specifications.
Under the agreement, IMP developed a BiCMOS process optimized for high volume production of advanced
SCSI terminator devices. Linfinity developed the UltaMAX™ adaptive, non-linear termination architecture that
provides improved performance and eliminates many expensive and board area consuming capacitors required
by first generation devices from Unitrode and Dallas Semiconductor.
• In July 1997, IMP announced a broad technology strategic alliance with Linifinity Microelectronics Inc., of
Garden Grove, CA, a subsidiary of SymmetriCom, Inc. As part of this alliance, Linfinity, which designs and
manufacturers a wide variety of next-generation portable power, desktop power and data communications
analog and mixed-signal IC solutions, will gain the use of IMP’s advanced process technology, manufacturing
capacity and design resources.
IMP has licensed SCSI terminator technology from Linfinity.
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IMP
North American Company Profiles
• IMP has a design and process technology transfer agreement with South African Microelectronic Systems
(SAMES). SAMES purchased the rights to IMP’s 1.2-micron and 2.0-micron mixed-signal process
technologies and has been qualified as a second source for IMP’s high-volume manufacturing process.
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Infinite Technology
North American Company Profiles
INFINITE TECHNOLOGY
Infinite Technology Corporation
2425 North Central Expressway, Suite 323
Richardson, Texas 75080
Telephone: (972) 437-7800
Fax: (972) 437-7810
Web Site: www.infinite-tech.com
Fabless IC Supplier
Employees: 30
Ownership: Privately held.
Company Overview and Strategy
Established in 1991, Infinite Technology Corporation (ITC) is involved in the research, design, development, and
marketing of high-performance reconfigurable function and application specific semiconductor products and
technology. It also provides design support and design services.
ITC has developed a field-programmable, in-system reconfigurable architecture that efficiently addresses the
need for high performance arithmetic datapath functionality required to accelerate data stream algorithms for image
processing in video editing, digital still cameras, broadcast video, pattern recognition, medical instrumentation,
and virtual reality. Other applications for the company’s products include robotics, communications, satellites, data
storage, and military equipment.
Management
Tim Smith
Lavelle Gibson
Art Berger
Glen Haas, Jr.
Robert L. (Les) Veal
George Landers
Chairman and Chief Executive Officer
President and Chief Operating Officer
Chief Financial Officer
Vice President, Engineering
Vice President, Marketing and Sales
Vice President, RAD Technology
Products and Processes
ITC’s products and services include: reconfigurable arithmetic datapath (RAD™) IC products, which are essentially
reconfigurable coprocessors; technology license agreements for programmable logic, reconfigurable arithmetic
datapath, and digital signal processing architectures; ASIC design services, including custom macrocell
development; and software development services.
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Infinite Technology
North American Company Profiles
ITC’s RAD5A4 device features four 100MHz 16-bit MacroSequencer processors, a built-in dual PLA, and five data
buses. The RAD5A4 offers concurrent parallel processing performance (up to 3.2 billion operations per second)
when integrated into system solution as a coprocessor.
The company’s ASIC design services provide custom development of ICs and design cell libraries specializing in
digital, analog, and mixed-signal devices, as well as memories. Design libraries include a range of custom I/Os
(including SCSI, ultra SCSI AGP and PCI), dense RAMs, PLLs, oscillators, and high-speed multipliers.
The company also offers its RADcore(™) technology to implement high-performance hard datapath core for
complex system-level ASICs. The RADcore datapath generator core requires no synthesis, is software
configurable, and can be integrated with popular microprocessor cores. The RADcore coprocessor core can also
be used to design custom DSP ICs.
ITC has a broad semiconductor process experience base and recently has implemented circuit designs ranging in
CMOS process feature sizes from 0.6µm down to 0.18µm.
Infinite Technology also functions as the U.S. distributor for Nippon Precision Circuits and has a close relationship
with the Japanese company involving technology and design.
Semiconductor Fabrication Facilities
ITC’s RAD devices are manufactured by TSMC through Nippon Precision Circuits.
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Integraphics Systems
North American Company Profiles
INTEGRAPHICS S YSTEMS , INC . (IGS)
Integraphics Systems, Inc. (IGS)
4001 Burton Drive
Santa Clara, CA 95054
Telephone: (408) 982-8588
Fax: (408) 982-8591
Web Site: www.webpr.com/igs.htm
Email: igs@datamax.net
Fabless IC Supplier
Regional Sales Office
Taiwan:
IGS Taiwan • Taipei, Taiwan
Telephone: (886) (2) 738-3040 • Fax: (886) (2) 378-1833
Financial History
IGS is an independent, privately-held U.S. company with 1996 estimated sales in the $2.5 million to $5 million
range.
Company Overview and Strategy
Integraphics Systems, Inc. (IGS) was founded in 1993, by J.C. Kuo and Yee Wong. IGS’ first product, the IGA
1680, was a 128/64-bit GUI accelerator developed using the company’s expertise in mixed-signal multimedia
video and graphics technology.
IGS’ strategy is to be a major supplier of Multimedia Accelerator chips for both the desktop and notebook 2D and
3D markets. IGS plans to later become a leader in the emerging PC Appliance and Media Processor markets. IGS’
customers include systems builders and providers of board-level products used in multimedia applications.
IGS sells through distributors in the PRC, Hong Kong, Korea and Singapore, as well as Premier Technical Sales
(Santa Clara, CA) for U.S. markets. IGS plans to expand in Europe and the ROW.
Products and Processes
IGS’ 168X series products include graphics and video accelerators, and the recently announced Cyber2000
extends the IGS’s multimedia capabilities to include an integral TV encoder for enhanced PC-based
videoconferencing solutions. The current production IGA1682 is a 128/64-bit video graphics accelerator chip
designed to support a variety of display screen resolutions, including 1280 x 1024 pixel screens with 24/32-bit
color images, and to handle mixed color depths of graphics and video.
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Integraphics Systems
North American Company Profiles
IGS claims that Cyber2000 is the first accelerator chip incorporating a TV encoder; it’s volume priced at under $10
and is targeted at OEMs. The Cyber2000’s TrueTV proprietary technology enables viewing of output on a TV
screen from both desktop PCs and networked computers.
IGS is a fabless supplier using “volume production/volume pricing” fab facilities in Asia.
Management
Kenny Liu
J.C. Kuo
Yee Wong
Mike Raghavan
President and Chief Executive Officer
Vice President, Engineering
Vice President, Operations
Senior Marketing Director
Key Agreements
•
IGS has an alliance with an unnamed major consumer electronics company to jointly develop a series of
multimedia accelerator chips for the notebook market. They are also working together to develop media
processor products for the PC market. IGS is also pursuing other alliances for “mainstreaming digital and analog
videoconferencing solutions on the PC.”
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Integrated Silicon Solution
North American Company Profiles
INTEGRATED S ILICON S OLUTION (ISSI)
Integrated Silicon Solution Inc.
2231 Lawson Lane
Santa Clara, California 95054
Telephone: (408) 588-0800
Fax: (408) 588-0806
Web Site: www.issiusa.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
ISSI Europe • Planegg, Germany
Telephone: (49) (89) 899-30193 • Fax: (49) (89) 899-0399
Taiwan:
ISSI Taiwan • Hsinchu, Taiwan – Engineering Design and Sales
Telephone: (886) (2) 397-9070 • Fax: (886) (2) 394-4024
China:
ISSI China • Suzhou City, Jiangsu
Telephone: 86 727 250384 • Fax: 86 727 250536
Hong Kong:
ISSI Hong Kong, Ltd.
Telephone: 85 22 319 2212 • Fax: 85 22 319 2004
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Employees
1992
29
1993
53
1994
61
1995
123
1996
132
1997
108
1
3
6
6
5
9
30
15
1
21
(8)
26
—
190
228
311
385
450
Ownership: Publicly held. NASDAQ: ISSI.
Company Overview and Strategy
Integrated Silicon Solution, Inc. (ISSI) designs and markets high-performance SRAM and non-volatile memory ICs.
The company’s initial development efforts were focused on high-performance SRAMs for Cache memory
applications and introduced its first SRAM products in 1990. ISSI has since expanded its product offerings to
include high-speed EPROMs, serial EEPROMs, and flash memory devices. Its markets also include networking
applications, telecommunications, office automation, instrumentation, and consumer markets.
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Integrated Silicon Solution
North American Company Profiles
To date, SRAM sales have accounted for substantially all of ISSI’s product sales. In an effort to reduce its
dependency on the memory market, ISSI entered the microcontroller market in early 1997 with the introduction of
a microcontroller family.
Management
Jimmy S.M. Lee
Gary L. Fischer
Kong-Yeu Han
Robert G. Cushman
Thomas Doczy
Robert Shen
Paul Song
John Unger
Chung Wang
Bruce Campbell
Lou Yang
Ronald Lam
James Wang
Donald Trask
Chairman, President, and Chief Executive Officer
Executive Vice President, Finance and Administration,
and Chief Financial Officer
Executive Vice President and General Manager, ISSI-Taiwan
Vice President, Corporate Marketing
Vice President, Memory Division
Vice President and General Manager, ISSI China
Vice President, Design Engineering
Vice President, Quality and Reliability
Vice President, Technology Development
Vice President and General Manager, Embedded Specialty Products
Vice President, Business Development
Vice President, GEM Microcontroller and Voice Products
Vice President, SRAM and Embedded Memory Design
Vice President, Sales
Products and Processes
ISSI designs and markets a family of high-performance SRAMs, as well as several families of non-volatile memory
products, such as high-speed, high-density EPROMs, serial EEPROMs, and flash memories. In early 1997, ISSI
introduced the first products in a new family of microcontrollers with integrated non-volatile memory. ISSI’s
advanced design and process capability now produce standard devices operating in excess of 100MHz, and
synchronous 3.3V products with clock access times exceeding 200MHz. 0.3 micron processes are currently in
production. A 0.25 micron memory technology is scheduled for introduction the first half of 1998. Development
work on 0.18 micron processes are also in the works.
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North American Company Profiles
Integrated Silicon Solution
SRAM Products
• 5V SRAMs in 64K, 256K, 512K, and 1M density levels with access speeds as low as 10ns.
• 3.3V SRAMs in 256K, 512K, and 1M density levels with access speeds as low as 12ns.
• 3.3V 1M and 2M synchronous SRAMs with access speeds as low as 4ns for Pentium and PowerPC Cache
applications.
Trail Blazer
• ISSI’s Trailblazer is a 64K x 16 asynchronous CMOS SRAM with “Virtual Dual Port” architecture. Trailblazer
provides high speeds needed by advanced DSPs and controllers. It is a versatile, cost effective, DSP system
building block ideal for networking and telecommunications applications.
EPROM Products
• 5V EPROMs in 256K, 512K, and 1M density levels with access speeds of 30ns to 90ns.
• 3.3V EPROMs in 512K and 1M density levels with 90ns access times.
• 2.4V voice EPROMs with embedded speech algorithm technology.
EEPROM Products
• 3.3V and 5V serial EEPROMs in 1K, 2K, and 4K density levels.
Flash Memory Products
• 1M Intel-compatible bulk-erase flash memories with access time of only 45ns. The company introduced a 2M
bulk-erase and 1M, 2M, and 4M boot block flash chips in 1996. Concentrating in the 1Mbit through 4Mbit
product area, ISSI’s Flash product line is expanding to include high-speed devices with both 12V and 5V
programming voltages.
Microcontroller Products
• The company offers variations on the industry-standard 8051 and 8031 8-bit MCUs with embedded ROM.
Other Products
• ISSI entered the voice-chip market in 1996 with the introduction of a one-time programmable (OTP) voice-chip.
The device features ADPCM compression and pop noise reduction. These devices, now supplemented with
mask-programmable alternatives, store digitized sounds, and playback the recorded sound. An analog output
signal can directly drive a speaker or buzzer. ISSI has also developed programming and editing tools for the
voice-chip that provide users with complete turnkey record and playback capabilities.
• ISSI offers 2-4Mbit DRAMs with access speeds from 35 to 60ns.
ISSI develops its advanced CMOS process technology in collaboration with its Asian manufacturing partners.
Through these alliances, ISSI has jointly developed and taken into production six generations of CMOS memory
technology with 1.2µm, 1.0µm, 0.8µm, 0.6µm, 0.5µm, and 0.35µm feature sizes. The company currently has
several development programs with Taiwan Semiconductor Manufacturing Company (TSMC), including a program
based on a 0.35µm design for advanced SRAM applications and a 0.5µm design for a high-speed flash memory
product. ISSI is currently in the process of developing 0.3µm and 0.25µm SRAM processes.
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Integrated Silicon Solution
North American Company Profiles
The company also has collaborative programs with Chartered Semiconductor Manufacturing (CSM) in Singapore
for 0.5µm SRAM process technology and with Belling Semiconductor in China for EEPROM design and process
technology.
ISSI is undertaking efforts to diversify into other product areas such as NVM products, specialty DRAMs and
embedded memories. If the market for SRAM products should decline and the company has not successfully
diversified, such decline would have a material adverse affect on the company’s financial performance.
Semiconductor Fabrication Facilities
ISSI’s principal manufacturing partner is TSMC, with whom it also jointly develops process technology. Since
1993, ISSI has also used Chartered as a foundry for some SRAM and flash products.
In addition to securing capacity with independent foundries, ISSI has invested in several joint venture
agreements, further guaranteeing capacity. In June 1996, ISSI entered into a joint venture with TSMC, along with
Altera, Analog Devices, and other investors, to create a wafer fabrication facility, called WaferTech LLC, to be
located in Camas, Washington which will be a leading edge fab focusing on 0.3 and 0.25 micron process
technology. ISSI also has a similar agreement with United Microelectronics Corporation (UMC), located in Taiwan,
for additional supply of wafers (see Key Agreements below).
ISSI has agreed to certain minimum wafer purchase commitments with its foundry partners in exchange for wafer
capacity commitments. The company also agreed to make certain annual payments to TSMC for capacity
increases. Additional required payments to TSMC totaling approximately $26.4M over the next four years
represent annual increases in capacity which must be purchased by the company. ISSI also has minimum
purchase obligations for its joint ventures with UMC and WaferTech LLC.
Key Agreements
• In November of 1997, ISSI announced that it had entered into an agreement to acquire Nexcom Technology,
Inc., a Flash development company in Sunnyvale, CA. Nexcom, a seven year old private company, has
developed several important patents in EEPROM/Flash memory cell and design technology and has a total of
thirteen patents issued as of 1997. Their development has focused on low power, low voltage, high-speed,
high-density Flash memory for both stand-alone and embedded memory applications using innovative process
and design techniques.
• In July 1996, ISSI signed a manufacturing and joint venture agreement with TSMC, along with other investors.
The agreement calls for ISSI to receive a minimum wafer capacity from TSMC in return for a four percent equity
stake in the new venture. Construction of WaferTech LLC began in June 1996, with production expected to
start in 2H98 (see separate profile of TSMC).
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North American Company Profiles
Integrated Silicon Solution
• In early 1996, ISSI announced an agreement with Intel. ISSI licensed flash-related patents from Intel and will
pay royalty fees to Intel for the revenues generated from certain flash-based products.
• In fiscal 1995, ISSI and UMC signed a manufacturing and joint venture agreement. Under terms of the
agreement, ISSI agreed to invest $30 million for an equity stake in a joint manufacturing venture (UICC) that will
provide ISSI with an additional supply of wafers beginning in 2H97.
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Integrated Technology Express
North American Company Profiles
INTEGRATED TECHNOLOGY EXPRESS , INC .
Integrated Technology Express, Inc.
2710 Walsh Ave.
Santa Clara, California 95051
Telephone: (408) 980-8168
Fax: (408) 980-9232
Web Site: www.iteusa.com
Fabless IC Supplier
Founded: 1995
Regional Offices/Representative Regions
Asia:
Integrated Technology Express, Inc. (Subsidiary) • Hsin-Chu City, Taiwan
Telephone: (03) 579-8658 • Fax: (03) 579-4803
Integrated Technology Express, Inc. • Taipei, Taiwan
Telephone: (02) 707-9589 • Fax: (02) 703-8389
Financial History ($M)
Sales
Employees
1995
1.3
1996
19
1997
39
1998
60
—
—
180
145
Company Overview and Strategy
Integrated Technology Express, Inc. (ITE) is dedicated to the design, development, engineering and marketing of
advanced computer and communications IC products. ITE serves customers worldwide, including several major
PC manufacturers.
In 1996, the Company shipped 16.8 million pieces of Super I/O (input/output) controllers around the world,
representing approximately 25 percent of the world’s Super I/O consumption.
2-226
Integrated Technology Express
North American Company Profiles
Management
Daniel Chen
Young Liu
Vincent Hu
Victor Lee
Steven Huang
Chairman, President and Chief Executive Officer
Senior Vice President
Vice President, Research & Development Operation
Vice President, Sales and Marketing, USA
Vice President, Marketing & System Integrator Operation
Products and Processes
ITE’s products are centered around three divisions - Peripheral, Portable, and Mixed-Signal Products. The
Peripheral product division designs and markets peripheral I/O controllers and USB (Universal Serial Bus)
controllers for personal computers. The portable products group designs and markets PC core logic chipsets for
notebooks and HPCs (Hand-held PCs) and chipsets for RISC based CPU platforms. The Mixed-Signal product
division develops a series of Internet communications and analog interface ICs.
ITE’s product designs include the following.
•
•
•
•
•
•
•
•
•
•
•
•
The First Windows CE Intelligent Peripheral Controller (IPC);
Peripheral I/P circuits, including Super I/O, PCI I/O and FIR (fast infrared);
Universal Serial Bus and Firewire (IEEE 1394) technologies;
PC core logic;
Power Management Units for portable and hand-held PCs;
Complete docking and peripheral solutions (Card Bus, PCMCIA) for mobile applications;
Ethernet and fax modem;
Embedded DRAM;
LCD controller;
Sigma-Delta Codec (encoder, decoder);
ADSL (Asymmetric Digital Subscriber Line); and
DSP (Digital Signal Processing).
Key Agreements
•
In 1996, Integrated Technology Inc. acquired the Computer Products Division of United Microelectronics
Corporation and established its Taiwan subsidiary. This alliance provided access to PC core technologies, and
markets.
2-227
Integrated Telecom Technology
North American Company Profiles
INTEGRATED TELECOM TECHNOLOGY
(Acquired by PMC-Sierra, Inc.)
Integrated Telecom Technology, Inc.
18310 Montgomery Village Avenue, Suite 300
Gaithersburg, Maryland 20879
Telephone: (301) 990-9890
Fax: (301) 990-9893
Web Site: www.igt.com
Fabless IC Supplier
Company Overview and Strategy
Integrated Telecom Technology, Inc. (IgT) provides high performance, system-level integrated circuits for
asynchronous transfer mode (ATM) and local area network (LAN) switching technologies.
The company was founded in 1991 with a focus on high-speed telecom and datacom integrated circuits.
Integrated Telecom is a fabless semiconductor company that has developed partnerships with subcontractors and
foundry services. Presently LSI Logic Corporation and SMOS provide foundry services at 0.8 micron, 0.65
micron, and 0.5 micron.
IgT is ISO 9001 certified.
Noteworthy News
•
On May 20,1998, PMC-Sierra, Inc. announced the completion of the acquisition of Integrated Telecom
Technology, Inc.
2-228
Intel
North American Company Profiles
INTEL
Intel Corporation
Robert Noyce Building
2200 Mission College Boulevard
P.O. Box 58119
Santa Clara, California 95052-8119
Telephone: (408) 765-8080
Fax: (408) 765-1821
Web Site: www.intel.com
IC Manufacturer
(See Top Ten)
2-229
InterFET Corporation
North American Company Profiles
INTER FET CORPORATION
InterFET Corporation
1000 N. Shilo Road
Garland, TX 75046-9013
Telephone: (972) 487-1287
Fax: (972) 276-3375
Web Site: www.interfet.com
Email: interfet@interfet.com
Discrete Semiconductor and IC Manufacturer
Ownership: Privately held.
Company Overview and Strategy
InterFET is a 15 year old company which manufactures discrete Junction Field Effect Transistors, and custom
integrated circuits. The company headquarters and manufacturing facilities are located at the above address.
InterFET’s offices and plant are approximately 30,000 square feet. The wafer fabrication area includes 2,000
square feet of cleanroom space. Hermitic assembly occupies approximately 8,000 square feet. The wafer probe
and final testing is performed on-site. Subcontract manufacturing for plastic encapsulated devices is performed in
Malaysia.
2-230
International Rectifier
North American Company Profiles
INTERNATIONAL RECTIFIER (IR)
International Rectifier Corporation
233 Kansas Street
El Segundo, California 90245
Telephone: (310) 322-3331
Fax: (310) 322-3332
Web Site: www.irf.com
Email: sales-gb@irf.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
International Rectifier Far East Co., Ltd. • Toshima-ku, Tokyo, Japan
Telephone: (81) (3) 3983-0641 • Fax: (81) (3) 3983-0642
Europe:
International Rectifier Company (Great Britain) Ltd. • Oxted, Surrey, United Kingdom
Telephone: (44) (1883) 732020 • Fax: (44) (1883) 733410
Financial History ($M), Fiscal Year Ends June 30
1992
Sales
265
IC Sales*
15
Net Income
9
R&D Expenditures
9
Capital Expenditures
35
1993
282
17
(3)
14
17
1994
329
22
16
16
25
1995
429
29
39
20
107
1996
577
40
66
27
112
1997
486
48
(43)
35
99
1998
552
—
16.5
39
90
Employees
2,700
3,100
3,310
3,915
3,500
3,240
3,000
*Calendar year
Ownership: Publicly held. NYSE: IRF.
Company Overview and Strategy
International Rectifier (IR) was founded in 1947, and is today a major worldwide manufacturer of power
semiconductors with applications in the automotive, consumer electronics, computer and communications,
industrial lighting, and government/space markets.
2-231
International Rectifier
North American Company Profiles
The company's growth products recently have been HEXFET® power MOSFETs, insulated gate bipolar transistors
(IGBTs), control ICs, and high-performance diodes. In control ICs, new development efforts concentrate on
devices tailored to specific applications. New control ICs are tuned to specific power levels, features, and circuit
topologies in motor control, lighting, and power supply applications. IR’s focus is in the area of “solution” products
that combine multiple components and technologies to benefit the customers’ overall circuit size, cost, and
performance.
Management
Eric Lidow
Alexander Lidow
Derek B. Lidow
Robert J. Mueller
Michael P. McGee
Chairman and Co-Founder
Co-Chief Executive Officer
Co-Chief Executive Officer
Executive Vice President, Worldwide Sales and External Affairs
Chief Financial Officer
Products and Processes
IR manufactures power semiconductors, including HEXFET power MOSFETs, IGBTs, high-voltage control ICs,
diodes, rectifiers, thyristors, and standard and custom power modules.
IR’s high-voltage control ICs combine power MOSFETs with analog and digital control circuitry on a single chip.
The company has instituted several development initiatives aimed at creating integrated chipsets for common
power conversion applications including power supplies, motor controls, lighting ballasts, solenoid drivers,
welding equipment, telecom switches, computer peripherals, instrumentation and test equipment, and compact
fluorescent light bulbs.
In late 1995, IR introduced its next-generation manufacturing technology, a four-step mask, low-voltage process
called Gen5. By the end of fiscal 1996, IR had over 200 Gen5 HEXFET devices in volume production.
In 1997, IR introduced a 1,200 volt integrated circuit, which is intended to bring major design and cost benefits to
the industrial electronics marketplace. IR leveraged this 1,200 volt IC in their second generation of motor control
solutions, called PowIRTrain™ products. Their Generation4 IGBTs are a broad-line family of transistors for mediumto high-power applications.
2-232
North American Company Profiles
International Rectifier
Semiconductor Fabrication Facilities
International Rectifier
(HEXFET America)
41915 Business Park Drive
Temecula, California 92590
Telephone: (714) 676-7500
Cleanroom size: 45,000 square feet
Capacity (wafers/week): 13,100
Wafer sizes: 125mm, 150mm
Processes: CMOS, BCDMOS
Products: Discretes, power ICs
Feature sizes: 1.0µm-5.0µm
International Rectifier
233 Kansas Street
El Segundo, California 90245
Telephone: (310) 322-3331
Capacity (wafers/week): 3,250
Wafer size: 100mm
Processes: CMOS, BCDMOS
Products: Discretes, power ICs
Feature size: 5.0µm
International Rectifier Corporation Italiana, S.P.A.
Via Privata Liguria 49
10071 Borgoro, Turin, Italy
Telephone: (39) (11) 470-14-84
Capacity (wafers/week): 6,250
Wafer size: 100mm
Products: Discretes
Discrete Components and Packaging Sites
Rectificadores Internacionales S.A. de C.V.
9234 Prolongación Ave.
Los Cabos
Parque Industrial Pacifico
Tijuana B.B. Mexico
Size: 150,000 square feet
No. of employees: 1,850
Certifications: ISO-9001, QS9000 certified
Manufacture: Discrete components and packaging
International Rectifier Company
(Great Britain) Ltd.
Hurst Green Oxted
Surrey RH89BB, England
Size: 70,000 square feet
No. of employees: 425
Certifications: ISO-9001 certified
Manufacture: Discrete components and packaging
Key Agreements
• In September 1998, International Rectifier announced the building of an assembly plant in Wales to meet
demand for its proprietary motion and power control modules.
The plant, located on 20 acres in an industrial park near Sulansea Wales, will be designed to generate
approximately $300 Million of annual revenue at full capacity.
The plant is expected to employ 500 people at full capacity. Ground-breaking is scheduled for the fourth
quarter of 1998, and IR expects to occupy the plant by mid-summer 1999.
• International Rectifier signed a cross-licensing and alternate-source agreement with Motorola covering power
ICs and power discretes.
2-233
ISD
North American Company Profiles
INFORMATION S TORAGE DEVICES (ISD)
Information Storage Devices, Inc.
2045 Hamilton Avenue
San Jose, California 95125
Telephone: (408) 369-2400
Fax: (408) 369-2422
Web Site: www.isd.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
5
(3)
1
1993
23
—
2
1994
39
4
3
1995
55
6
7
1996
41
(9)
12
1997
48
(13.5)
11
—
—
70
122
134
180
Ownership: Publicly held. NYSE: ISDI.
Company Overview and Strategy
Information Storage Devices, Inc. (ISD) designs, develops, and markets integrated circuits for voice recording and
playback using the company’s proprietary ChipCorder® storage technology. The company’s ChipCorder®
products are targeted at the consumer, communications, and industrial market segments.
In 1991, ISD introduced its first commercially available products — non-volatile chips that store analog signals in
analog form. From its inception in December 1987, ISD's charter has been to develop such devices for storage of
voice, music, and other forms of analog information on a single chip.
In early 1997, ISD purchased National’s CompactSPEECH™ processor product line. The purchase enables ISD to
add long duration record and playback chips to its ChipCorder® product line. The CompactSpeech™ product line
includes a family of RISC-based speech processors that feature advanced DSP technology designed for voice
applications in the communications market.
ISD's storage technology is adaptable to a variety of small form factor applications, such as hand-held products,
alarms, answering machines, cellular phones, greeting cards, and implantable medical devices. The firm's original
chips were capable of storing up to 20 seconds of information. However, ISD’s newest devices are able to store
up to eight minutes of information. The company has received twenty-six patents with several others pending.
ISD became a public company in February 1995.
2-234
ISD
North American Company Profiles
Management
David L. Angel
Eric J. Ochiltree
Karin Bootsma
James Brennan
Michael Geilhufe
Paul Ross Hayden
Carl R. Palmer
Felix J. Rosengarten
Al Woodhull
Chairman and Chief Executive Officer
President and Chief Operating Officer
Vice President, Marketing
Vice President, Technology and Advanced Development
Vice President, Business Development
Vice President, Sales
Vice President, Engineering
Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Manufacturing
Products and Processes
ISD's ChipCorder® products are solid-state memory devices based on flash technology that store analog signals
in a multilevel format. The company currently offers nine product families incorporating its ChipCorder®
technology. All of the company’s ChipCorder® products feature an on-chip oscillator, microphone preamplifier,
automatic gain control, anti-aliasing filter, smoothing filter, and speaker amplifier. The devices are being built using
0.8µm CMOS technology.
The CompactSPEECH™ product line offers a family of advanced digital speech processors for
telecommunications and consumer voice applications, including answering machines, cordless phones, feature
phones, and digital voice recorders. Featuring advanced digital signal processing (DSP) technology, high quality
speech compression algorithms and flash memory management technology, CompactSPEECH™ speech
processors offer customers a long duration voice recording and playback and an array of digital features like multicountry caller ID and full-duplex speakerphone capabilities. The powerful synergy between CompactSPEECH™
digital speech processing technology and ISD’s multi-level storage technology is expected to lead to an
integration of these two technologies, enabling ISD to deliver the best of both worlds — unique, flash message
management, nonvolatile memory, and other innovative features at attractive price/performance points.
Semiconductor Fabrication Facilities
ISD currently has foundry agreements with Rohm, Samsung, Tower, and Winbond.
2-235
IXYS
North American Company Profiles
IXYS
IXYS Corporation
3540 Bassett Street
Santa Clara, California 95054
Telephone: (408) 435-1900
Fax: (408) 435-0670
Web Site: www.ixys.com
Fabless IC Supplier
Ownership: Privately held.
Company Overview and Strategy
IXYS Corporation designs, develops, and markets a broad spectrum of power semiconductors, integrated circuits,
and modules for the global power market. IXYS products are incorporated into various industrial, commercial, and
military systems.
Founded in 1983, IXYS has been an innovator in power MOS semiconductor products and technologies since its
inception. However, it has differentiated itself by focusing on the higher voltage and higher power end of the
MOSFET and IGBT spectrum. The company's strategy is to provide cost-effective systems solutions for its target
markets. To that end, it provides several lines of low-cost chipsets for various applications.
In April 1989, IXYS acquired the Asea Brown Boveri (ABB) power semiconductor operation in Lampertheim,
Germany. Now called IXYS Semiconductor GmbH, the firm is recognized for pioneering direct copper bonding-toceramic packaging technology and provides IXYS with a strong foothold in the European market.
Management
Nathan Zommer, Ph.D.
Peter Ingram
Arnold Agbayani
Rich Fassler
President and Chief Executive Officer
Managing Director, IXYS Semiconductor GmbH
Vice President, Finance
Vice President, Sales and Marketing
Products and Processes
The IGBT discrete and IGBT module product lines are the company's flagship products. They are targeted at the
AC motor drive market first and at electric vehicles for the long-term market.
2-236
North American Company Profiles
IXYS
IXYS's key product lines include:
Modules
• IGBT modules
• High current thyristor and rectifier modules
• Rectifier bridges
• Custom (customer-specific) power modules
Discretes
• Ultra-fast and short circuit-rated IGBTs
• MegaMOSFET™ devices
• HiPer FET™ power MOSFETs
• High-voltage BiMOSFET™ devices
•Ultra-fast recovery epitaxial diodes (FREDs)
• High-current rectifiers and switching current regulators
• High-power thyristors and rectifiers
• Schottky rectifiers
Smart Power ICs
• High-voltage current regulators
• Half-bridge (high side/low side) smart power ICs
• Pulse width modulation controllers
Direct Copper Bond (DCB) Ceramic Substrates
For the design of its products, IXYS uses a proprietary HDMOS (high performance DMOS) technology, which is
compatible with standard bulk CMOS.
Semiconductor Fabrication Facilities
The company’s semiconductor products are fabricated at their Germany facility and in external wafer fabrication
facilities through technology and foundry relationships with a number of semiconductor companies throughout
the world.
2-237
Lansdale Semiconductor
North American Company Profiles
LANSDALE S EMICONDUCTOR
Lansdale Semiconductor, Inc.
2502 West Huntington Drive
Tempe, Arizona 85282
Telephone: (602) 438-0123
Fax: (602) 438-0138
Web Site: http://lansdale.com/~lansdale
IC Manufacturer
Employees: 50
Ownership: Privately held.
Company Overview and Strategy
Founded in 1964, Lansdale Semiconductor is a semiconductor lifecycle extender dedicated to manufacturing
past and present technologies as long as the market requires them. The privately-held company is a strategic
resource for critical military programs, telecommunications systems, and semiconductor OEMs wishing to offer
their products longer than the normal lifecycle dictates.
The company purchases lines as they are discontinued by large semiconductor companies such as Intel,
Signetics, Harris, National, and Motorola. It actively seeks new product licenses from semiconductor
manufacturers as part of its niche strategy and supports OEM semiconductor companies by manufacturing wafers
on a foundry basis to extend their product lifecycles.
Military weapons systems typically operate for approximately 25 years while the commercial lifecycle of a
semiconductor chip is about seven years. Lansdale manufactures and supports these products on a continuing
basis making it possible to extend the lifecycles of the system and its products.
Management
R. Dale Lillard
Owner and President
Products and Processes
Lansdale's current product lines (about 2,600 parts) include NMOS 8-bit MPUs and bipolar general purpose logic,
MPU, SRAM, PROM, and linear ICs, as well as bipolar full custom devices.
2-238
North American Company Profiles
Original Manufacturer
AMD
Raytheon
Signetics
Motorola
Harris
National
Intel
Lansdale Semiconductor
Product Line
Digital Bipolar ICs
DTL 200 Series ICs
DTL, TTL ICs, 54LS, 82S, 54S, 54H, LSI, 8X
SUHL ICs, 5400 TTL, 3000 TTL, 900 DTE, RTL, Linear
0512 Bipolar PROMs, 7600 Bipolar PROMs/Diode Matrices
PMOS ICs
8080A and peripherals, 828x Peripherals
Semiconductor Fabrication Facilities
Lansdale Semiconductor, Inc.
2502 West Huntington Drive
Tempe, Arizona 85282
Cleanroom size: 10,000 square feet (Class 100)
Capacity (wafers/week): 2,000
Wafer sizes: 100mm, 3 in.
Processes: Bipolar, LS, Linear, TTL
Products: Foundry service, bipolar ICs
Feature size: 3µm, two-layer metal
2-239
Lattice Semiconductor
North American Company Profiles
LATTICE S EMICONDUCTOR
Lattice Semiconductor Corporation
5555 Northeast Moore Court
Hillsboro, Oregon 97124-6421
Telephone: (503) 681-0118
Fax: (503) 681-0347
Web Site: www.latticesemi.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
Lattice Semiconductor K.K. • Taito-Ku, Tokyo, Japan
Telephone: (81) (3) 5820-3533 • Fax: (81) (3) 5820-3531
Europe:
Lattice Semiconductor Ltd. • Waybridge, Surrey, United Kingdom
Telephone: (44) (1932) 831180 • Fax: (44) (1932) 831181
Asia-Pacific:
Lattice Semiconductor Asia, Ltd. • Kowloon, Hong Kong
Telephone: (852) 2319-2929 • Fax: (852) 2319-2750
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Employees
1993
103
17
17
1994
126
22
21
1995
144
27
23
1996
198
42
27
1997
204
45
28
1998
246
57
32
352
394
438
450
500
570
Ownership: Publicly held. NASDAQ: LSCC.
Company Overview and Strategy
Lattice Semiconductor, founded in 1983, is a leader in the design, development, and marketing of high-density
and low-density programmable logic devices (PLDs) and related software development systems. Its proprietary
Generic Array Logic (GAL ®), pLSI ®, and ispLSI® devices are sold worldwide, primarily to OEMs in the fields of
communications, industrial control, and military systems. In 1992, the company pioneered the development of a
family of in-system programmable products called Lattice ISP. Lattice ISP products give customers the ability to
program a PLD without removing it from the circuit board, subsequently increasing the PLD’s flexibility. ISP
products have emerged as the de facto standard in the high density PLD market, and Lattice holds the number
one market position for ISP PLDs. Its product line encompasses more than 30 ISP logic devices and a broad
range of design software tools to support them.
2-240
Lattice Semiconductor
North American Company Profiles
Lattice's strategy is to offer a full line of high-performance in-system programmable devices based on innovative
architectures. The company supports its products with sophisticated logic development tools providing high
functionality at low cost that can be easily adopted and fully integrated with common third-party CAE development
systems.
International sales represented 49 percent of the company’s total sales in fiscal 1997.
Management
Cyrus Y. Tsui
Steven A. Laub
Steven A. Skaggs
Jonathan K. Yu
Martin R. Baker
Randy D. Baker
Albert L. Chan
Stephen M. Donovan
Paul T. Kollar
Rodney F. Sloss
Kenneth K. Yu
Chairman, President, and Chief Executive Officer
Senior Vice President and Chief Operating Officer
Senior Vice President, Chief Financial Officer, and Secretary
Corporate Vice President, Business Development
Vice President and General Counsel
Vice President, Manufacturing
Vice President, California Product Development
Vice President, International Sales
Vice President, Sales
Vice President, Finance
Vice President and Managing Director, Lattice Asia
Products and Processes
Lattice entered the high-density complex PLD (CPLD) market in 1992 and currently offers four families of ispLSI®
products. The ispLSI ® 1000E family incorporates familiar GAL-like logic building blocks and offers performance up
to 125MHz (7.5ns) and densities of 2,000 to 8,000 gates. The ispLSI® 2000 family provides speeds of up to
180MHz (5.0ns) and 3.3V and 5V operating voltages and densities from 1,000 to 6,000 gates. The ispLSI® 3000
family offers densities of 7,000 to 20,000 gates, while retaining performance up to 125MHz (7.5ns). The ispLSI®
6000 family extends the company’s CPLD density range to 25,000 gates and enables integration of complete
logic subsystems. The family utilizes an innovative cell-based architecture that combines a general-purpose highdensity CPLD with memory and other function specific circuit blocks.
Lattice offers one of the industry’s highest performance and broadest lines of low density CMOS PLDs. The
company sells the industry standard GAL16V8, GAL20V8, GAL22V10, GAL20RA10, and GAL20XV10
architectures in a variety of speed grades (as fast as 3.5ns), with 5V or 3.3V signal compatibility. Lattice also offers
several proprietary architectures, the GAL26CV12, GAL18V10, GAL16VP8, GAL20VP8, and GAL6001/2, each
of which is optimized for specific applications. In 1994, the company extended its GAL line by introducing the
ispGAL22V10, bringing the advantages of in-system programmability to the low density market. In January 1998,
it introduced the industry’s only 3.3V ISP GAL, the ispGAL22LV10.
In April 1997, Lattice unveiled its ispGDX™ product family designed primarily for routing applications. According to
the company there is no control logic on the chips, allowing them to operate faster than conventional PLDs. The
family includes four devices with 64, 80, 120, and 160 programmable I/Os, with input-to-output delays of 5ns,
clock-to-output delays of 5ns, and operating frequencies of 111MHz.
2-241
Lattice Semiconductor
North American Company Profiles
Lattice also offers its ispGDS™ (Generic Digital Switch) family of in-system programmable switching matrices
targeted at mechanical dip switch replacement and connectivity applications.
The company's products are based on a proprietary EECMOS process technology, called UltraMOS®. The current
mainstream processes, UltraMOS V (0.65µm) and UltraMOS VI (0.5µm) are advanced double-metal CMOS
technologies.
Semiconductor Fabrication Facilities
Most Lattice Semiconductor products are produced by Seiko-Epson in Japan. In 1994, Lattice advanced to
Seiko-Epson $42 million for the expansion of Seiko’s submicron wafer fab in Sakata, Japan. The investment will
provide Lattice with additional submicron manufacturing capacity through 1997. The foundry relationship
between Lattice and Seiko-Epson was further strengthened in early 1997. As part of their latest agreement,
Lattice agreed to invest up to $150 million in Seiko-Epson’s Sakata, Japan, wafer fab facility in exchange for a
production line dedicated to Lattice.
Lattice added Taiwan’s United Microelectronics Corporation (UMC) as a foundry partner in 1995. In October 1995,
Lattice said it would invest $60 million over a two and a half year period for a 10 percent equity stake in one of
UMC’s joint-venture fabs that will come on-line in mid-1997. Production is now expected to begin 1Q99.
Additionally, UMC agreed to provide Lattice with interim wafer capacity from one of its existing fabs.
In December 1996, Lattice secured additional future capacity by signing a foundry and technology development
agreement with Taiwan-based Holtek Microelectronics (see Key Agreements below).
Key Agreements
•
Lattice signed a foundry and technology agreement with Holtek Microelectronics in December 1996. Under
the agreement, Lattice will make an equity investment in Holtek’s 200mm wafer facility that is currently under
construction in Taiwan. In return, Holtek will provide Lattice with foundry capacity from the facility. Additionally,
Holtek plans to develop non-volatile memory products for Lattice.
•
Lattice entered into a joint venture with UMC and other US-based fabless IC companies. Lattice will invest $60
million to gain a 10 percent equity stake in a new joint-venture wafer fab UMC is building in Taiwan. The joint
venture fab, called United Integrated Circuits Corporation (UICC), is expected to begin production in 1Q99.
•
In 1994, Lattice signed a production agreement with Seiko-Epson. As part of the agreement, Lattice advanced
Seiko $42 million to finance additional submicron wafer capacity at its fab in Sakata, Japan. In 1995, Lattice
invested an additional $2 million for the development of submicron process technology. In early 1997, Lattice
signed an agreement to advance up to $150 million to Seiko-Epson, in return for a dedicated production line in
Seiko-Epson’s Sakata wafer fab.
•
Lattice has a cross-licensing agreement with AMD under which patents for AMD's PALs have been exchanged
for Lattice's GAL patents.
2-242
Level One Communications
North American Company Profiles
LEVEL O NE COMMUNICATIONS
Level One Communications Inc.
9750 Goethe Road
Sacramento, California 95827
Telephone: (916) 855-5000
Fax: (916) 854-1101
Web Site: www.level1.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
14
2
3
1993
26
4
6
1994
47
8
10
1995
78
10
17
1996
112
13
22
1997
156.3
19
30
70
139
221
300
408
550
Company Overview and Strategy
Level One Communications, Inc., (NASDAQ: LEVL) founded in 1985, is a leading supplier of “Silicon Connectivity
Solutions.” The company provides mixed-signal integrated circuit solutions for high-speed digital signal telecom
and networking applications. The company name “Level One” refers to the company’s initial focus on the physical
layer, “layer one,” of the seven layer network model developed by the International Standards Organization (ISO).
The company specializes in the development of ASSPs and custom derivatives, such as transceivers, repeaters,
and related devices used in two key areas of the telecommunications and data communications industry: interface
solutions for digital transmission systems; and local and wide area networking (LAN/WAN) solutions, including
Ethernet LAN, datacom, and digital modems. Most of Level One’s ICs feature complex functions incorporated on
a single silicon chip for applications formerly requiring multiple chips.
In June 1995, the company acquired San Francisco Telecom, which operates as a wholly owned subsidiary and
develops products for the SONET/SDH, wireless, and cable modem communications markets. In 4Q96, Level
One acquired Silicon Design Experts Inc. (SDE) to accelerate its development of Gigabit Ethernet and xDSL
products.
2-243
Level One Communications
North American Company Profiles
Management
Robert D. Pepper, Ph.D.
Mike Wodopian
John Kehoe
Daniel S. Koellen
Manuel Yuen
Chairman, President, and Chief Executive Officer
Vice President, Business Development
Vice President, Finance and Chief Financial Officer
Vice President, Quality and Reliability Assurance
Vice President, Operations
Products and Processes
Level One’s semiconductor products include T1/E1 transceivers, receivers, repeaters, and clock adapters; digital
subscriber line (DSL) chipsets; PDM multiplexers; and Ethernet transceivers and repeaters.
Semiconductor Fabrication Facilities
Level One utilizes several foundries in the U.S., Europe, and the Far East for the fabrication of its ICs, but does all
its chip testing in-house.
Key Agreements
•
In 1995, Level One entered into a technology agreement with Maker Communications Inc. for the
development of asynchronous transfer mode (ATM) products.
2-244
LightSpeed Semiconductor
North American Company Profiles
LIGHT S PEED S EMICONDUCTOR
LightSpeed Semiconductor Corporation
1151 Sonora Court
Sunnyvale, California 94086
Telephone: (408) 616-3200
Fabless IC Supplier
Founded: 1995
Regional Offices/Representative Locations
North America:
Breakthru Communications • San Jose, California
Telephone: (408) 777-9364
Employees: 25
Ownership: Privately held – Mohr Davidow Ventures, U.S. Venture Partners, Mayfield Fund, InveStar Capital.
Company Overview and Strategy
LightSpeed Semiconductor Corporation was founded in 1995, to provide ASIC solutions that take a design from
concept to full production. LightSpeed provides a new ASIC design solution using a Module Based Array
architecture that targets the needs of the mainstream (1,000 to 100,000 devices per year) ASIC market.
LightSpeed caters to ASIC customers.
Management
Jack Peckham
Bob Osann
David P. Lautzenheiser
Dr. Shafy Eltoukhy
Dr. Don MacMillen
Alan Swahn
President and Chief Executive Officer
Chairman and Founder
Vice President of Marketing
Vice President of Technology Development
Vice President of Software Engineering
Vice President of Sales and Business Development
Products and Processes
Primary products include LightSpeed’s COMIC (Cycle Optimized Sea of Modules IC) devices manufactured on a
0.35µm process, ranging in size from 190,000 to more than 450,00 usable gates. LightSpeed’s unique Top
Metal technology enables low NREs and cuts production lead-time by eight weeks or more as compared with
the conventional ASIC cycle time. LightSpeed devices can integrate user logic as well as a variety of memory
requirements into a single device.
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LightSpeed Semiconductor
North American Company Profiles
Semiconductor Fabrication Facilities
LightSpeed is a fabless company. LightSpeed is partnered with Taiwan Semiconductor Manufacturing Company
Ltd. (TSMC) to ensure a high-quality, uninterrupted supply of semiconductor devices for their customers.
2-246
Linear Systems
North American Company Profiles
LINEAR S YSTEMS
Linear Integrated Systems, Inc.
4042 Clipper Court
Fremont, California 94538
Telephone: (510) 490-9160
Fax: (510) 353-0261
(Have Fab Capability)
Employees: 15
Ownership: Privately held.
Company Overview and Strategy
Linear Integrated Systems (LIS), a.k.a. Linear Systems, was formed in 1987 with the goal of establishing a market
niche by taking advantage of refractory-metal interconnect technology. While in the past, most firms have stayed
away from refractory metals and instead prefer to use CVD and silicon-gate technologies, many firms are now
recognizing a need for metal gates as gate dimensions shrink to below .35 micron.
Linear Systems specializes in developing integrated circuits for applications in systems where obsolete devices or
processes are no longer available or require upgrading. Existing IC products include operational amplifiers,
voltage references, and multiplexers. Besides proprietary products, Linear Systems also supplies a broad range
of second source and obsolete devices manufactured to customer's requirements.
In addition to semiconductor design and custom manufacturing services, state-of-the-art precision thin-film
services are also offered.
Management
John H. Hall
Don Howland
Paul Norton
President
Manager, Eastern U.S. Marketing
Manager, Western U.S. Marketing
Products and Processes
Linear Systems’ proprietary product line includes bipolar linear ICs (e.g., amplifiers, voltage references,
multiplexers) and discretes, as well as full custom bipolar, CMOS, and BiCMOS ICs.
Using CMOS, bipolar, and dielectric isolation processes, Linear Systems offers a family of second-source products
including multiplexers, monolithic dual N-channel JFETs, monolithic dual PNPs and NPNs, switches, and
amplifiers.
2-247
Linear Technology
North American Company Profiles
LINEAR TECHNOLOGY
Linear Technology Corporation
1630 McCarthy Boulevard
Milpitas, California 95035-7487
Telephone: (408) 432-1900
Fax: (408) 434-0507
Web Site: www.linear-tech.com
IC Manufacturer
Founded: 1981
Regional Offices/Representative Locations
Japan:
Linear Technology K.K. • Shinjuku-ku, Tokyo, Japan
Telephone: (81) (3) 3267-7891 • Fax: (81) (3) 3267-8570
Europe:
Linear Technology SARL • Chantenay Malabry, France
Telephone: (33) (1) 41-07-95-55 • Fax: (33) (1) 46-31-46-13
Asia-Pacific:
Linear Technology Pte., Ltd. • Singapore
Telephone: (65) 753-2692 • Fax: (65) 754-4133
Financial History ($M), Fiscal Year Ends June 30
1992
Sales
119
Net Income
25
R&D Expenditures
12
Capital Expenditures
10
Employees
800
1993
151
36
10
8
1994
201
57
9
16
1995
265
85
9
22
1996
378
134
31
70
1997
379
134
35
22
1998
485
181
46
24
870
1,000
1,350
1,650
1,790
2,155
Ownership: Publicly held. NASDAQ: LLTC.
Company Overview and Strategy
Linear Technology Corporation (LTC) designs, manufactures, and markets a broad line of high-performance
standard linear integrated circuits. Its devices monitor, condition, amplify, or transform continuous analog signals
associated with such physical properties as temperature, pressure, weight, position, light, sound, or speed.
Product categories include power management/regulators, interface and multi-protocol devices, data converters,
filters, and amplifiers.
2-248
Linear Technology
North American Company Profiles
The Company targets its product and marketing efforts toward the high-performance segments of the linear circuit
market. Applications for its products include telecommunications; notebook and desktop computers;
video/multimedia; computer peripherals; cellular telephones; industrial, automotive and process controls; network
and factory automation products; and satellites. Products are sold directly or through distributors to original
equipment manufacturers.
Management
Robert H. Swanson, Jr.
Paul Chantalat
Paul Coghlan
Timothy D. Cox
Clive B. Davies, Ph.D.
Robert C. Dobkin
Sean T. Hurley
Louis Di Nardo
Hans J. Zapf
President and Chief Executive Officer
Vice President, Quality, Reliability
Vice President, Finance, and Chief Financial Officer
Vice President, North American Sales
Vice President and Chief Operating Officer
Vice President, Engineering
Vice President, Operations
Vice President, Marketing
Vice President, International Sales
Products and Processes
Linear Technology products include operational, instrumentation and audio amplifiers; voltage regulators, power
management devices, DC-DC converters and voltage references; comparators; monolithic filters; communications
interface circuits; one-chip data acquisition sub-systems; pulse width modulators and sample-and-hold devices.
The company markets approximately 5,200 finished part types, of which more than 90 percent are proprietary.
Linear Technology uses a variety of process technologies in the design and fabrication of its chips, including
standard bipolar, CMOS, BiCMOS, and complementary bipolar, as well as thin-film and laser trimming technologies.
2-249
Linear Technology
North American Company Profiles
Semiconductor Fabrication Facilities
Linear Technology Corporation
1630 McCarthy Boulevard
Milpitas, California 95035-7487
Fabs 1 and 2
Cleanroom size: 170,000 square feet
Capacity (wafers/week): 4,500
Wafer size: 100mm
Processes: CMOS, BiCMOS, bipolar
Products: Linear ICs
Feature sizes: 2.0µm-3.0µm
Linear Technology Corporation
Camas, Washington
Fab 3
Capacity (wafers/week): 2,500
Wafer size: 150mm
Processes: CMOS, bipolar
Products: Linear ICs
Feature sizes: ≤2.0µm
(Began production in early 1997).
LTC maintains a plastic assembly facility in Penang, Malaysia, and a test facility in Singapore.
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Linfinity Microelectronics
North American Company Profiles
LINFINITY MICROELECTRONICS
Linfinity Microelectronics Inc.
11861 Western Avenue
Garden Grove, California 92841
Telephone: (714) 898-8121
Fax: (714) 898-2781
Web Site: www.linfinity.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends June 30
1992
1993
1994
1995
1996
1997
Corporate
Sales
Net Income
69
2
88
6
98
7
103
10
106
7
144
13
Semiconductor
Sales
Capital Expenditures
27
1
31
2
39
2
40
5
38
5
55
4
Company Overview and Strategy
Linfinity Microelectronics Inc. (LMI) is a wholly owned subsidiary of Symmetricom, Inc. (formerly Silicon General,
Inc.). It was founded in 1968 as Silicon General Semiconductors and adopted its current name in 1993. LMI
designs, manufactures, and markets linear bipolar, CMOS, and BiCMOS integrated circuits for industrial,
commercial, automotive, and military applications. Linfinity's special area of expertise is in power management with
an emphasis on mixed-signal technology. Sales from power supply products, represented over 50 percent of
total sales in fiscal 1997.
The company is expanding the value-added products and services it currently provides for power supply systems,
while adding product lines to serve new areas such as signal conditioning and motion control systems. The
company currently offers about 400 standard products.
Management
James Peterson
Ralph Brandi
Shufan Chan
Mark Granahan
James Hartman
President (acting)
Vice President, Sales
Vice President, Development
Vice President, Marketing
Vice President, Manufacturing
2-251
Linfinity Microelectronics
North American Company Profiles
Products and Processes
Linfinity's products generally address four main markets: power supply systems, motion control, analog signal
conditioning, and data communications.
Power Supply
Linfinity is a leading supplier of a wide variety of power management products, including pulse width
modulators (PWMs), voltage regulators, supervisory circuits, and power factor conversion chips. Typical
applications for these products include desktop and portable computers, portable communications
equipment, video monitors, automotive entertainment, HVAC products, satellites, and lighting. The new
product focus in this area includes controllers, linear regulators, DC-DC converters, FET drivers, and voltage
supervisors.
Motion Control
Linfinity makes two kinds of motion control integrated circuits: one that controls the spin motor in computer
disk drives and another that controls the position of the read-write head. The new product focus in this area
includes sensorless spindle controllers, voice coil controllers, and brushless DC motor controllers.
Analog Signal Conditioning
Linfinity's signal conditioning circuits include operational amplifiers, comparators, and voltage references.
Typical applications include instrumentation, industrial controls, telecommunications, and audio equipment.
Data Communications
A relatively new product area for Linfinity, the company’s data communications ICs include small computer
systems interface products and high speed, parallel communications buses, which permit high data transfer
rates between computers and various peripheral devices.
Linfinity uses a wide range of process technologies that address linear and mixed-signal product requirements.
Bipolar
Two main process flows are available in this technology. Option A provides a rugged, high-voltage (60V),
high-power process for applications such as off-line power supplies and motor drivers. Option B provides a
high-performance, low-voltage (20V) process for applications in high-speed, low-noise signal conditioning
equipment.
CMOS
Exhibiting all the characteristics of a good analog CMOS process it provides 18V MOS transistors coupled with
high density 3.0µm feature sizes for optimal packing density. Limited logic capability is available at this feature
size.
BiCMOS
The BiCMOS process combines the Option B bipolar and CMOS processes into a single flow. The process is
idealized for mixed-signal applications requiring excellent analog performance in conjunction with logic
capability. A double-level metal option is available for optimum packing density. Applications include power
supply controllers and high-performance disk drive motor controllers.
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North American Company Profiles
Linfinity Microelectronics
Semiconductor Fabrication Facilities
Linfinity Microelectronics Inc.
11861 Western Avenue
Garden Grove, California 92841
Capacity (wafers/week): 1,700
Wafer size: 100mm
Processes: Bipolar, CMOS, BiCMOS
Products: Linear ICs, ASICs
Feature size: 3.0µm
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Logic Devices
North American Company Profiles
LOGIC DEVICES
Logic Devices Incorporated
1320 Orleans Drive
Sunnyvale, California 94089
Telephone: (408) 542-5400
Fax: (408) 542-0080
Web Site: www.logicdevices.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
Logic Devices Incorporated • Warminster, Wiltshire, United Kingdom
Telephone: (44) (1985) 218699
Northeast U.S.:
Logic Devices Inc. • 80 Orville Dr., Bohemia, New York 11716
Telephone: (516) 244-1450
Southeast U.S.: Logic Devices Inc. • 9700 Koger Blvd., Suite 204, St. Petersburg, Florida 33702
Telephone: (813) 579-9992
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
12
0.1
1
1993
13
0.3
1
1994
13
1
1
1995
17
1
1
1996
13
1
1
1997
13
(399)
1
61
49
44
49
58
58
Company Overview and Strategy
Logic Devices Incorporated (NASDAQ: LOGC) was founded in 1983. It develops and markets high-performance
digital integrated circuits for applications requiring high operating speeds and low operating power. Such
applications include computers, workstations, video image processing, medical instrumentation,
telecommunications, and military signal processing.
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Logic Devices
North American Company Profiles
Logic Devices was founded as a supplier of building-block DSPs, but later entered the growing 1989 SRAM
market. It was driven from the SRAM market in 1992 due to cost and quality problems with its then supplier of
SRAM wafers. Sales of the company’s SRAM products rebounded in 1994 and 1995, but then suffered price
erosion. SRAM products fell from representing 45 percent of the company’s sales in 1995 to 15 percent in 1997.
While the company plans to remain a player in fast SRAMs and other niche SRAM markets, it has also placed a
greater emphasis on DSP devices, which grew to represent 85 percent of sales in 1997, up from 55 percent in
1995.
In April 1995, Logic Devices acquired Star Semiconductor, which developed the SPROC programmable digital
signal processor architecture. The SPROC architecture enables multiple processors to efficiently share data via a
common memory array, resulting in high processing throughput.
Research efforts continue to focus on DSP circuits to address broadcast, studio, and audio and video image
processing applications, and new products utilizing the company’s SRAM technology.
Management
Howard L. Farkas
William J. Volz
Mary C. deRegt
William L. Jackson
Scott Andrews
Tim Flaherty
Dave Hoffmaster
Chairman
President
Chief Financial Officer
Senior Vice President
Chief Technical Officer
Director of Marketing
National Sales Manager
Products and Processes
High-speed, low-power CMOS SRAMs and DSP circuits are Logic Devices' principal product lines. Its DSPs
primarily target video editing, broadcast special effects, and studio production applications, where lossless
manipulation of very high bandwidth data is required. The company also offers specialty memories, register
products, and high-performance CMOS SCSI controllers.
Fast SRAM
256K family
1M family
Fast Logic
Pipeline registers
Register files
Specialty Memory
Cache-tag memories
Programmable DSP
Star Spruce
FIFO
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Logic Devices
Computational
Multipliers
Multiplier-accumulators
FIR filters
Arithmetic logic units
Digital correlators
Barrel shifters
North American Company Profiles
Interface
SCSI bus controllers
Video Image Processing Components
Coordinate transformers
Template matcher
2D video filters
Line buffers
Video mixers
Image rotation and work generators
Color space converters
The company's chips are produced using 0.35µm, 0.5µm, and 0.8µm CMOS technologies.
Semiconductor Fabrication Facilities
Logic Devices utilizes TSMC for its wafer foundry requirements.
2-256
LSI Computer Systems
North American Company Profiles
LSI COMPUTER S YSTEMS
LSI Computer Systems, Inc.
1235 Walt Whitman Road
Melville, New York 11747-3086
Telephone: (516) 271-0400
Fax: (516) 271-0405
Email: alsicis@aol.com
Web site: www.lsicsi.com
Fabless IC Supplier
Founded: 1969, New York
Financial History ($M)
Sales
Employees
1997 (projected)
8
35
Ownership: 100% of capital stock is owned by the officers equally.
Company Overview and Strategy
LSI Computer Systems, Inc. (LSI/CSI) designs full custom and standard ICs for products in applications ranging
from consumer and industrial to military and aerospace. They are recognized as one of the leading suppliers of
lighting control ICs and full custom ICs, and were the first company to develop and market ICs for brushless DC
motors. LSI/CSI is an ISO 9002 registered company.
Management
Al Musto
Attila Tetik
Alvin Kaplan
Chief Executive Officer
President
Secretary-Treasurer
Products and Processes
LSI Computer Systems supplies both standard and full custom ICs. Its standard ICs include programmable digital
delay timers, CMOS dividers, incremental encoder interface chips, counters, melody generators, lighting control
ICs, AC and brushless DC motor controllers, Dynamic Scattering LCD drivers, telephone remote isolation devices,
programmable digital lock circuits, and PIR detection circuits.
The use of several external mask and wafer foundries that offer a broad range of process technologies makes the
Extra-Custom service, analog and digital design services, flexible in meeting the needs of a variety of applications
and provides automatic second-sourcing of product. LSI Computer Systems custom designs every detail of each
Extra-Custom IC in order to deliver the desired performance and reliability at the lowest possible price.
2-257
LSI Logic
North American Company Profiles
LSI LOGIC
LSI Logic Corporation
1551 McCarthy Boulevard
Milpitas, California 95035
Telephone: (408) 433-8000
Fax: (408) 433-8989
Web Site: www.lsilogic.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
LSI Logic K.K. • Minato-ku, Tokyo, Japan
Telephone: (81) (3) 5463-7811 • Fax: (81) (3) 5463-7825
Europe:
LSI Logic Europe, Ltd. • Bracknell, Berkshire, United Kingdom
Telephone: (44) (1344) 426544 • Fax: (44) (1344) 481039
Asia-Pacific:
LSI Logic Corporation Hong Kong, Ltd. • Hong Kong, R.O.C.
Telephone: (852) 2-405-8600 • Fax: (852) 2-412-7820
Canada:
LSI Logic Corporation of Canada, Inc. • Etobicoke, Ontario, Canada
Telephone: (416) 620-7400 • Fax: (416) 620-5005
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
617
(110)
79
143
1993
719
54
79
88
1994
902
109
99
166
1995
1,268
238
124
233
1996
1,239
147
184
362
1997
1,290
159
226
531
Employees
3,400
3,370
3,750
3,750
3,910
4,443
Company Overview and Strategy
LSI Logic (NYSE: LSI) is a leading designer and manufacturer of high-performance ASICs and related products
and services. Founded in 1981, the company uses advanced process technology and design methodology to
design and develop highly complex ASICs and other integrated circuits. Customers of LSI Logic are primarily
original equipment manufacturers (OEMs) in the electronic data processing, consumer electronics,
telecommunications, and certain office automation industries. Within these industries, the company emphasizes
digital video, digital broadcasting, networking and wireless communications, desktop and personal computing,
and office automation applications.
2-258
North American Company Profiles
LSI Logic
As process technology becomes more sophisticated, allowing greater density and increased functionality, the
"system-on-a-chip" is becoming the foundation of LSI Logic's business. In fact, the company has trade marked
the term “The System-on-a-Chip Company™.” Its product libraries, including its CoreWare® libraries, combined
with its deep submicron process technologies provide the company with the ability to combine microprocessor
"engines," logic blocks (including industry standard functions, protocols, and interfaces), and memory with a
customer’s proprietary logic on a single chip.
LSI Logic’s CoreWare® technology is at the center of its shift toward more consumer and communications
products. In 1997, CoreWare® products accounted for 40 percent of the company’s revenues, versus 30
percent in 1996. New industry-standard cores added to the CoreWare® library include those for the GSM wireless
market, Internet and Intranet applications, satellite set-top boxes, networking, and DVD products. In 1H97, the
company entered the cable modem market with the introduction of its Cablestream™ QAM Receiver core.
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LSI Logic
North American Company Profiles
Management
Wilfred J. Corrigan*
Elias J. Antoun*
John P. Daane*
W. Richard Marz*
R. Douglas Norby*
Joseph M. Zelayeta*
Maniam B. Alagaratnam
John J. D’Errico
Simon P. Dolan
Bruce L. Entin
Donald J. Esses
Amnon Fisher
Jeffrey L. Hilbert
James W. Hively
Charles E. Laughlin
Theodore Leno
Bryon Look
R. Gregory Miller
Pierre Nadeau
Willsie H. Nelson
David E. Sanders*
Richard D. Schinella
Chiaki Terada
Frank Tornaghi
Lewis C. Wallbridge
Mary E. Albanese
Norm L. Armour
Hugh H. Durdan
Thomas Daniel
Dan King
Marlon R. Murzello
King F. Pang
Ranko L. Scepanovic
Giuseppe Staffarom
Lam H. Traong
Dean J. Westman
*Executive Officers
2-260
Chairman and Chief Executive Officer
Executive Vice President, Consumer Products
Executive Vice President, Communications, Computer and ASIC Products
Executive Vice President, Geographic Markets
Executive Vice President and Chief Financial Officer
Executive Vice President, Worldwide Operations
Vice President, Package Development
Vice President and General Manager, Pan Asia
Vice President, Consumer Products Marketing
Vice President, Worldwide Customer Marketing, Geographic Markets
Vice President, U.S. Manufacturing
Vice President, Consumer Technology Engineering
Vice President, Methodology and Customer Engineering
Vice President, Memory and Mixed Signal Engineering
Vice President and General Manager, LSI Logic Japan Semiconductor, Inc.
Vice President, Assembly and Test Operations
Vice President, Corporate Development and Strategic Planning
Vice President, Corporate Controller
Vice President and General Manager, LSI Logic Europe Ltd.
Vice President, Worldwide Logistics
Vice President, General Counsel, and Secretary
Vice President, Wafer Process R&D and Santa Clara Operations
Vice President, Industrial Engineering
Vice President, North America Sales
Vice President, Human Resources
President, Mint Technology
Vice President and General Manager, Gresham Operations
Vice President and General Manager, Computer Products Division
Vice President, ASIC Technology
Vice President, Quality and Reliability
Vice President, MIPS Engineering
Vice President, Digital Video Engineering
Vice President, Advanced Development Labs
Vice President and General Manager, Communications Products Division
Vice President, Information Technology and Chief Information Officer
Vice President, Operations, Consumer Division
North American Company Profiles
LSI Logic
Products and Processes
LSI Logic's broad product line includes high-performance gate array, cell-based, and embedded array ASICs with
up to 26 million gates. The company's CoreWare® library contains cells and cores based on industry-standard
functions, interfaces, and protocols. Example cores from the CoreWare® library include Ethernet controllers, the
ATMizer™ II segmentation and reassembly engine, and the GigaBlaze G10™ SeriaLink 1.25-gigabit/second
transceiver for communications applications; PCI and USB bus interfaces and Fibre Channel protocol circuits for
computer applications; MPEG-2 and DVD decoders for digital video applications; and a GSM baseband processor
for GSM mobile phones. In addition, cores such as these may be combined with LSI Logic’s MiniRISC™ family of
MIPS-based RISC microprocessor cores, including the TinyRISC™ 16-/32-bit compressed-code MPU, and
special-purpose memory circuits to realize system-level applications on a single chip.
In addition, LSI Logic offers a family of application specific standard products (ASSPs), high-speed digital signal
and image processing devices that handle many common digital signal processing functions. Some of the ASSPs
designed by LSI Logic are included in the company’s CoreWare® library. The company also sells stand-alone
SPARC- and MIPS-based RISC microprocessors.
The company has developed and uses advanced CMOS technologies to manufacture its IC products. Its G10™
0.35µm 3-volt CMOS process, introduced in 1995, allows for up to 49 million transistors (or up to five million usable
gates) on a single chip. In early 1997, LSI Logic formally announced its next-generation G11™ process
technology featuring a 0.25µm gate length, providing up to 64 million transistors (or up to 8.1 million usable gates)
and allowing greater density and increased functionality on a single chip. Devices in the G11™ ASIC family will
operate on 1.8V, 2.5V, or 3.3V, and consume one-fourth of the power of the G10™ devices.
The G12™, introduced in March 1998, is the newest system-on-a-chip technology capable of combining all of the
system functions needed to create new classes of communications, computer, and consumer products on one
silicon chip. The 0.18 micron drawn G12™ technology offers 26,000,000 usable logic gates on a 20- by 20millimeter silicon chip. Prototype designs using the G12™ technology will begin in the 4Q98. Production will start
2Q99.
In a significant step to increase yields and allow for greater chip customization, LSI Logic during 1996 installed
chemical mechanical polishing (CMP) equipment in its Japanese fabrication facilities. In addition, the company
started using flip-chip interconnect package technology for its most complex chips.
Semiconductor Fabrication Facilities
Most of LSI Logic's wafers are manufactured by its Japanese subsidiary, LSI Logic Japan Semiconductor, Inc.
(JSI), which prior to January 1995, was jointly owned by LSI Logic (55 percent) and Kawasaki Steel Corporation (45
percent). LSI Logic is now the sole owner of JSI, as a result of the purchase of Kawasaki Steel's interest.
LSI Logic also obtains wafers from Chartered Semiconductor in Singapore. In 1995, LSI Logic made a $20 million
equity investment in Chartered, in exchange for guaranteed wafer capacity for products based on 0.6µm
technology and smaller for a period of 10 years.
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LSI Logic
North American Company Profiles
In 1996, the company closed its aging fab in Milpitas, California, and delayed the launch of its new 200mm wafer
fab under construction in Gresham, Oregon. The Gresham facility is now scheduled to begin production in the
later half of 1998.
LSI Logic Corporation
3115 Alfred Street
Santa Clara, California 95054
Telephone: (408) 433-6666
Capacity (wafers/week): 250
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: R&D, ASICs
Feature sizes: 0.25µm-0.5µm
LSI Logic Corporation
Gresham, Oregon
Capacity (wafers/week): 4,000
Wafer size: 200mm
Process: CMOS
Products: ASICs, ASSPs
Feature sizes: 0.25µm, 0.35µm
LSI Logic Japan Semiconductor, Inc.
(formerly known as Nihon Semiconductor)
10 Kitahara, Tsukuba-shi
Ibaraki-ken 300-32, Japan
Telephone: (81) (298) 64-7229
Fax: (81) (298) 64-33362
Fabs I and II
Cleanroom size: 50,000 square feet
Capacity (wafers/week): 10,000
Wafer size: 150mm, 200mm
Processes: CMOS
Products: ASICs, MPUs, MPRs
Feature sizes: 0.35µm-1.0µm
Key Agreements
• In March 1998, LSI Logic announced that it will supply Sony Corporation with a single-chip DVD decoding
engine for Sony’s recently announced second-generation DVD video players.
• In November 1997, LSI Logic announced a technology alliance with Compaq Computer Corporation to provide
custom and standard ASICs for the Compaq Netelligent 5526 Manageable Ethernet Switch.
• In July 1997, LSI Logic and Qualcomm Incorporated signed a license agreement that enables LSI Logic to
develop, manufacture and sell cdmaOne (IS-95) ASICs to Qualcomm’s subscriber equipment licensees for
digital cellular, personal communications services and wireless local loop applications around the world.
• In July 1997, LSI Logic announced the acquisition of Mint Technology Inc., an engineering services company
providing expertise in the areas of system architecture and system level design verification.
• In June 1997, LSI Logic and Micron Technology, Inc. announced an embedded DRAM technology alliance.
The companies will develop and produce digital logic integrated circuits which will have the capability of
embedding from 64 to 128Meg of conventional 1T DRAM on a single chip.
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North American Company Profiles
LSI Logic
• In May 1997, LSI Logic announced a technology alliance (initiated in 1996) with Minolta Co., Ltd., for the
specification, validation and application of DCAM digital camera system-on-a-chip products.
• In February 1997, LSI Logic and Motorola’s Information Systems Group (ISG) announced a licensing agreement
in which Motorola’s V.34 software modems will be embedded into LSI’s leading custom semiconductors.
• In early 1997, LSI Logic licensed the ARM 32-bit RISC microprocessor core of Advanced RISC Machines.
• In 3Q96, LSI Logic and MIPS Technologies, Inc. extended and expanded the scope of the architecture license
that allows LSI Logic to produce MIPS-based RISC microprocessors and microprocessor cores. The new
license will expire in the year 2004.
• The company formed a five-year alliance with Argonaut Software to develop a family of 3D graphics
accelerators. Incorporating LSI Logic’s system-on-a-chip, the companies will develop upgradable 3D graphics
cores for LSI’s ASIC library.
• LSI Logic entered into an agreement with InterDigital Communications Corporation that calls for LSI Logic to
develop and produce custom chips for InterDigital to use in Personal Communications Services (PCS)
handsets and Wireless Local Loop equipment. The cores that LSI Logic will use in the design are based on the
company’s G10™ 0.35µm process technology.
• LSI Logic established a joint development agreement with Sanyo Electric to design the core of an HDTV
system.
• LSI Logic signed an agreement with Philips to collaborate on developing video compression ICs for HDTV
applications.
2-263
Lucent Technologies
North American Company Profiles
LUCENT TECHNOLOGIES
Lucent Technologies Inc.
Microelectronics Group
555 Union Boulevard
Allentown, Pennsylvania 18103
Telephone: (800) 372-2447
Web Site: www.lucent.com/micro
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Lucent Technologies, Microelectronics Group • Shinagawa-ku, Tokyo, Japan
Telephone: (81) (3) 5421-1600 • Fax: (81) (3) 5421-1700
Europe:
Lucent Technologies, Microelectronics Group • Bracknell, Berkshire, United Kingdom
Telephone: (44) (1344) 865900 • Fax: (44) (1344) 865990
Asia-Pacific:
Lucent Technologies, Microelectronics Group • Singapore
Telephone: (65) 778-8833 • Fax: (65) 777-7495
Financial History ($M), Fiscal Year Ends September 30
Sales (Lucent Technologies)
Net Income
1993
17,734*
(3,778)
1994
19,765*
482
1995
20,258*
(867)
1,186
143
1,463
170
20,000
18,500
Semiconductor**
Sales
Capital Expenditures
Employees (Microelectronics)
1 9 9 6 (FY)
23,286
(793)
1 9 9 7 (FY )
26,360
541
1,979
259
2,312
498
2,755
550
18,000
18,000
17,000 ***
* Data for fiscal year ended December 31. In 1996, the fiscal year was changed to start in October.
** Calendar year.
*** Includes Power Systems – (now part of Network Products, see Lucent Overview) 12,000 without power.
FY - Fiscal Year.
Ownership: Publicly held. NYSE: LU.
2-264
North American Company Profiles
Lucent Technologies
Company Overview and Strategy
Lucent Technologies’ Microelectronics Group designs and manufactures advanced integrated circuits and
optoelectronic components. Its product line is built upon strengths in digital signal processing, networked
computing, and communications technologies. The company's products are used in applications such as
personal computers/multimedia systems, local-area networks (LANs), cellular base stations, TV set-top boxes,
telephones, and answering machines. It is a leader in digital signal processors (DSPs), cell-based ASICs, video
conferencing ICs, and optoelectronics.
Last October, Lucent announced a reorganization that created a series of smaller businesses to better focus on
the industry’s fastest growth opportunities. The corporation’s reorganization enables it to focus more clearly on
high growth areas such as wireless, semiconductors, data networking, and optical networking. As a result, Lucent
is made up of Bell Laboratories, the research and development arm, and eleven business groups:
Microelectronics Group, Business Communications Systems, Data Networking Systems, Global Service Provider
Business, Wireless Networks, Switching and Access Systems, Optical Networking, Network Products,
Communications Software, New Ventures Group, and the Intellectual Property Division. Lucent’s power systems
manufacturing operation, which was formerly a part of the Microelectronics Group, is now part of the Network
Products Group.
Lucent’s semiconductor roots stretch back to the late 1940’s, when Bell Labs, invented the transistor. Bell Labs
was given the Nobel Prize for its invention in 1956. The Microelectronics Group was strictly an internal supplier for
thirty years. While Lucent’s semiconductor unit is a large internal supplier, two-thirds of the Microelectronics
Group’s 1997 production volume was sold to other customers.
Lucent Technologies’ Microelectronics Group products can be divided into two areas: integrated circuits for use in
communications and computing products and systems; and optoelectronic products for the telecommunications,
cable television, and network computing markets.
Much of Lucent’s recent growth in sales of microelectronic products has been due to higher sales in DSPs and
ASICs to OEMs, particularly in the Asia-Pacific region. International revenues represented approximately half of
the Microelectronics Group’s sales in fiscal 1997.
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Lucent Technologies
North American Company Profiles
Management
Lucent Technologies
Richard A. McGinn
Ben Verwaayen
Dan Stanzione
John T. Dickson
William T. O’Shea
Carleton S. Fiorina
James K. Brewington
Robert C. Holder
William R. Spivey
Gerald J. Butters
Thomas M. Uhlman
J. Carl Hsu
Chairman and Chief Executive Officer
Executive Vice President and Chief Operating Officer
Executive Vice President, Chief Operating Officer and President, Bell Labs
President, Microelectronics Group
President, Business Communication Systems and Data Networking Systems
President, Global Service Provider Business
President, Wireless Networks Group
President, Switching and Access Systems Group
President, Network Products Group
President, Optical Networking Group
President, New Ventures Group
Acting President, Communications Software Group
Lucent Technologies Microelectronics Group
John T. Dickson
President
Homa Firouztash
Vice President, Worldwide Sales
Kenneth Dorushka
Vice President, Lucent Technologies Sales
Richard Hegberg
Vice President, North American OEM Sales
John Hughes
Managing Director and Sales Vice President, Europe, Africa and the Middle East
James Mackin
Managing Director and Sales Vice President, Japan and Asia-Pacific
John V. Pilitisis
Vice President, Optoelectronics
Daniel Dileo
Vice President, Wireless and Messaging Integrated Circuits
Mark Stibitz
Vice President, Integrated Systems Integrated Circuits
Ahmed Nawaz
Vice President, Network Communications Integrated Circuits
Peter T. Panousis
Vice President, Silicon Manufacturing and Development and
Cirent Semiconductor President
2-266
Lucent Technologies
North American Company Profiles
Products and Processes
Lucent utilizes CMOS, BiCMOS, and bipolar processes in the manufacture of its integrated circuits. The following
are Lucent’s primary semiconductor products: 16-bit and 32-bit DSPs (including modem DSPs), ASICs (digital and
mixed-signal standard cells and FPGAs), MPEG-2 digital TV devices, and communications ICs (e.g., network
interface ICs, transceivers, and line card ICs).
Recent new product unveilings have included the new ORCA™ 3 series of FPGAs that will carry the ORCA™
family into 0.25µm processes, the first single-chip receiver for the North American digital television standard (DTV),
and a chip based on Lucent’s new DSP16000 core architecture that consumes up to five times less power and
requires up to five times less memory than the most advanced DSPs on the market. Lucent’s Digital Subscriber
Line Technology, called Wildwire, can download data at 1.5 megabits per second, which is about 30 times faster
than today’s analog modems.
Lucent’s most recent product is its latest addition to its family of new NetLight™ transceivers. NetLight
transceivers are used in gigabit Ethernet, ATM, SONET and fibre channel applications providing bandwidth of 155
and 622 megabits per second (Mb/s) up to 1.2 and 2.5 gigabits per second (Gb/s).
The company also provides bipolar foundry services to outside companies. The Bipolar Foundry utilizes two
industry leading advanced complementary bipolar process technologies, called CBIC-U2 and CBIC-V2.
MOS MEMORY
DRAM
SRAM
ANALOG
✔
✔
Interface
Flash Memory
Consumer/Automotive
EPROM
Voltage Regulator/Reference
ROM
EEPROM
Other (Including Non-Volatile RAM)
Data Conversion
✔
✔
MOS LOGIC
Gate Array
Comparator
Other (Includes Telecom)
DIGITAL BIPOLAR
General Purpose Logic
✔
✔
✔
Amplifier
Bipolar Memory
✔
General Purpose Logic
Standard Cell
Gate Array/Standard Cell
Field Programmable Logic
Field Programmable Logic
Other Special Purpose Logic
Other Special Purpose Logic
MPU/MCU/MPR
MOS MICROCOMPONENT
MPU
MCU
OTHER
✔
MPR
✔
DSP
Full Custom IC
Discrete
✔
Optoelectronic
2-267
Lucent Technologies
North American Company Profiles
Semiconductor Fabrication Facilities
Lucent Technologies Inc.
Allentown
555 Union Boulevard
Allentown, Pennsylvania 18103
Telephone: (610) 712-6011
Cleanroom size: 80,000 square feet
Capacity (wafers/week): 15,000
Wafer sizes: 125mm
Processes: NMOS, CMOS, bipolar
Products: Linear and logic ICs, DSPs, ASICs,
FPGAs.
Feature sizes: 0.9µm, 0.6µm, 0.55µm, 0.35µm,
0.3µm.
Lucent Technologies Inc.
Reading
P.O. Box 13396
Reading, Pennsylvania 19612
Telephone: (610) 939-7011
Cleanroom size: 70,000 square feet
Capacity (wafers/week): 5,000
Wafer sizes: 100mm (2 in. for optoelectronics)
Processes: Bipolar, HVCMOS, BCDMOS
Products: Linear ICs, optoelectronics,
foundry services.
Feature sizes: 1.5µm-3.5µm
Lucent Technologies Inc.
Orlando Plant
9333 South John Young Parkway
Orlando, Florida 32819
Telephone: (407) 345-6000
Cleanroom size: 35,000 square feet
Capacity (wafers/week): 8,250
Wafer size: 150mm
Process: CMOS, BiCMOS
Products: ASICs, FPGAs, DSPs, R&D
Feature sizes: 0.9µm, 0.6µm, 0.5µm, 0.35µm,
0.3µm, 0.25µm.
Lucent Technologies Microelectronica S.A.
Poligono Industrial de Tres Cantos
S/N (Zona Oeste), 28770 Colmenar Viejo
Madrid, Spain
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 5,000
Wafer size: 150mm
Process: CMOS
Products: ASICs, FPGAs, communications ICs, DSPs
Feature sizes: 1.25µm, 0.9µm, 0.5µm, 0.45µm,
0.35µm, 0.3µm.
Lucent Technologies Inc.
Optoelectronics Center
9901 Hamilton Boulevard
Breiningsville, Pennsylvania 18031-9359
Telephone: (610) 391-2000
Cleanroom size: 10,000 square feet
Wafer size: 2 in.
Process: LPMDCVD
Products: Optoelectronics
Feature sizes: 0.1µm-5.0µm
Cirent Semiconductor
9333 South John Young Parkway
Orlando, Florida 32819
Telephone: (407) 345-6000
Capacity (wafers/week): 2,500
Wafer size: 200mm
Process: CMOS
Products: ASICs, MPRs
Feature sizes: 0.35µm-0.18µm
(Joint venture with Cirrus Logic,
see Key Agreements).
2-268
North American Company Profiles
Lucent Technologies
Key Agreements
• In April 1998, The Microelectronics Group of Lucent Technologies announced a minority equity investment of
up to $10 million in Chip Express for rapid customization of semiconductor devices.
As part of the agreement, the companies will develop next-generation technology for a class of integrated
circuits known as laser-programmable system chip (LPSCs) — devices that help chip designers speed the
development of new application-specific integrated circuits (ASICs) for use in computers, communications
equipment, and business and consumer electronics products.
• In April 1997, Lucent announced it had licensed Advanced RISC Machines’ high-performance, low-power RISC
microprocessor core technology (ARM7TDMI) for integration with Lucent’s ASIC library.
• Lucent and Mitsubishi established an alliance in mid-1996 to jointly develop a set of ICs that together will
perform all of the functions needed for next-generation HDTV sets for the U.S. market. The first samples of the
chipset are expected to become available in early 1998.
• The output of the Cirent Semiconductor is split 75 percent for Lucent and 25 percent for Cirrus Logic.
• Lucent signed an agreement with Hewlett-Packard in 1995 to develop and dual-source fiber-optic transceivers
for SONET/SDH and ATM applications.
• Lucent (then AT&T Microelectronics) struck an agreement with Standard MicroSystems Corp. (SMC) in 1994
under which SMC agreed to buy equipment for installation in Lucent's fab in Spain in return for a guaranteed
portion of the fab output for a period of five years.
• Lucent is working with IBM, Lockheed-Martin Federal Systems, and Motorola to establish a manufacturing
infrastructure for x-ray lithography.
• Lucent has been collaborating with NEC on the development of advanced CMOS process technologies since
1991. The team completed development of a 0.25µm process flow in early 1997 and are currently working on a
successor 0.18µm program, which is targeted for completion in 1999.
• Lucent has several agreements with TriQuint Semiconductor involving the development, manufacture, and
marketing of GaAs ICs for high-performance wireless and telecommunications systems. As part of the deal,
Lucent discontinued its production of GaAs wafers and now relies on TriQuint for the manufacture of its GaAs
wafers. The two companies are developing an epitaxial process based on Lucent's GaAs intellectual property.
• Lucent is teamed with Sandia National Laboratories to develop new lithography patterning technologies for the
production of high-density ICs with geometries below 0.2µm.
2-269
Lucent Technologies
North American Company Profiles
• Mitsubishi Electric America and Lucent Technologies jointly developed the industry’s first end-to-end, receiverto-display digital television (DTV) chipset that meets the North American Advanced Television Standards
Committee (ATSC) digital television standard for both high-definition television (HDTV) and standard-definition
television (SDTV) applications. The chipset enables digital televisions, set-top boxes, personal computers and
other digital appliances to receive digital video and CD-quality audio signals from terrestrial broadcast stations.
• Lucent Technologies joined the “Universal Asymmetric Digital Subscriber Line Working Group” (UAWG), an
organization of leading telecommunications and computer companies working to accelerate widespread use of
Digital Subscriber Line (DSL) modem technology. The UAWG plans to propose an industry standard for a
simplified version of Asymmetrical Digital Subscriber Line (ADSL) technology that will deliver to consumers
high-speed modem communications over standard phone lines. Lucent will contribute to the development of
this standard by offering the engineering expertise of its research and development arm, Bell Labs, which
pioneered DSL technology and holds several of the earliest and most fundamental patents related to it.
• Lucent Technologies and Chartered Semiconductor Manufacturing signed an agreement to form a $1-billionplus joint venture in Singapore to manufacture wafers for a variety of integrated circuits using process
technology developed by Bell Labs and Chartered. The new company, called Silicon Manufacturing Partners,
is 51 percent owned by Lucent and 49 percent owned by Chartered. Both companies will share the facility’s
production output, which is scheduled to begin in the fourth quarter of 1998.
2-270
Maxim Integrated Products
North American Company Profiles
MAXIM INTEGRATED PRODUCTS
Maxim Integrated Products, Inc.
120 San Gabriel Drive
Sunnyvale, California 94086
Telephone: (408) 737-7600
Fax: (408) 737-7194
Web Site: www.maxim-ic.com
IC Manufacturer
Founded: 1983
Regional Offices/Representative Locations
Japan:
Maxim Japan Co., Ltd. • Tokyo, Japan
Telephone: (81) (3) 3232-6141
Europe:
Maxim Integrated Products (UK), Ltd. • United Kingdom
Telephone: (44) (1734) 303388
Asia-Pacific:
Maxim Integrated Products Inc. • Hong Kong
Telephone: (852) 2376-3000
Financial History ($M), Fiscal Year Ends June 30
1992
Sales
87
Net Income
14
R&D Expenditures
13
Capital Expenditures
4
Employees
554
1993
110
17
16
13
1994
154
24
13
22
1995
250
39
42
36
1996
422
123
48
75
1997
434
137
51
44
1998
560
178
72
109
638
1,016
1,552
1,987
2,444
3,000
Ownership: Publicly held. NASDAQ: MXIM.
Company Overview and Strategy
Maxim Integrated Products is a leading designer, developer, and manufacturer of linear and mixed-signal
integrated circuits. Maxim's products are the interface between the real, analog world and the world of digital
processing. They detect, measure, amplify, and convert real world signals, such as temperature, pressure, or
sound, into the digital signals necessary for computer processing. Its circuits are used in a wide variety of
microprocessor-based equipment, including PCs and peripherals, test equipment, handheld products, wireless
communicators, and video displays. The company also provides a range of high-frequency design processes and
capabilities that can be used in custom design.
2-271
Maxim Integrated Products
North American Company Profiles
Maxim’s main objective is to actively develop and market both proprietary and industry standard analog integrated
circuits that meet the increasing quality standards demanded by customers.
In mid-1994, Maxim acquired substantially all of the assets of the Tektronix's Integrated Circuits Operation in
Beaverton, Oregon, for about $22 million. The acquisition provided Maxim with additional wafer production
capacity and leading-edge high-frequency bipolar technologies that have broadened the firm's presence in the
wireless and optic communications markets, as well as in high-speed data acquisition, RF signal processing, and
video products.
Management
Jack F. Gifford
Frederick G. Beck
Ziya G. Boyacigiller
Michael J. Byrd
Stephen R. Combs, Ph.D.
Tunc Doluca
Kenneth J. Huening
William N. Levin
Robert F. Scheer
Richard E. Slater
Vijay Ullal
Richard C. Hood
Nasrollah Navid, Ph.D.
Pirooz Parvarandeh
Chairman, President and Chief Executive Officer
Vice President, Marketing and Sales
Vice President
Vice President and Chief Financial Officer
Vice President, Operations
Vice President, Research and Development
Vice President
Vice President
Vice President, Wafer Operations
Vice President and Chief Accounting Officer
Vice President
Vice President
Vice President
Vice President
Products and Processes
Maxim Integrated Products offers a broad range of linear and mixed-signal ICs, including data converters, interface
circuits, microprocessor supervisory circuits, operational amplifiers, power control circuits, timers and counters,
display circuits, multiplexers and switches, battery chargers, voltage detectors, filters, comparators, and voltage
reference circuits.
2-272
North American Company Profiles
Maxim Integrated Products
Semiconductor Fabrication Facilities
During fiscal year 1996, Maxim converted over half of its wafer fabrication capacity from 100mm to 150mm wafers.
To supplement its own IC production capacity, Maxim has foundry agreements with independent foundry
companies.
Maxim Integrated Products
430 West Maude Avenue
Sunnyvale, California 94086
Telephone: (408) 746-2650
Cleanroom size: 15,000 square feet (Class 10)
Capacity (wafers/week): 3,000
Wafer sizes: 100mm, 150mm
Processes: CMOS, BiCMOS, bipolar
Products: Linear and mixed-signal ICs
Feature sizes: 1.2µm-3.0µm
Maxim Integrated Products
14320 Southwest Jenkins
Beaverton, Oregon 97005
Telephone: (503) 641-3737
Cleanroom size: 60,000 square feet
Capacity (wafers/week): 2,000
Wafer size: 100mm
Process: Bipolar
Products: Mixed-signal ICs
Feature sizes: 0.8µm-2.0µm
(Purchased from Tektronix in mid-1994).
2-273
Micrel Semiconductor
North American Company Profiles
MICREL S EMICONDUCTOR
Micrel Semiconductor, Inc.
1849 Fortune Drive
San Jose, California 95131
Telephone: (408) 944-0800
Fax: (408) 944-0970
Web Site: www.micrel.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
18
1
2
1993
19
1
3
1994
36
3
4
1995
53
7
6
1996
66
9
9
1997
104
16
14
150
160
180
345
400
545
Ownership: Publicly held. NASDAQ: MCRL.
Company Overview and Strategy
Micrel Semiconductor, founded in 1978, designs, develops, and manufactures a range of high-performance
analog ICs targeting the communications, computer, and industrial markets. In 1982, Micrel acquired an IC
fabrication facility in Sunnyvale, California from Siemens Components and began acting as a silicon foundry. This
led to the company's development of semicustom and standard linear smart power ICs. In early 1993, Micrel
moved its headquarters and manufacturing operations from Sunnyvale to San Jose. The new fab, formerly owned
by Seeq Technology, tripled Micrel's fab capacity.
The company’s products are divided into three key areas: standard ICs, custom ICs, and foundry services. In
1996, the majority of the company’s revenues were from sales of standard products. The company’s standard
products have grown from representing 14 percent of total revenues in 1992 to 76 percent in 1997. Micrel
currently offers over 800 standard products.
2-274
Micrel Semiconductor
North American Company Profiles
In addition to standard products, the company manufactures custom analog and mixed-signal circuits and provides
wafer foundry services for customers who produce electronic systems for communications, consumer, and military
applications.
Micrel is focusing its efforts on the design and marketing of its high-performance analog power ICs to become a
strong force in portable computing, desktop computing, communications, and automotive and aviation
electronics. Future plans include a continued transition toward standard products, while maintaining its presence
in the custom IC and foundry business.
Management
Raymond D. Zinn
Robert Whelton
George T. Anderl
Robert J. Barker
John D. Husher
Warren H. Muller
Larry R. Sample
President and Chief Executive Officer
Executive Vice President, Operations
Vice President, Sales and Marketing
Vice President, Finance, and Chief Financial Officer
Vice President, Fabrication Division
Vice President, Test Operations
Vice President, Design
Products and Processes
Micrel supplies both standard and custom products. The company's key standard product lines include highcurrent low-side power MOSFET drivers, high-side power MOSFET drivers, low dropout (LDO) linear regulators,
high-efficiency switching regulators, PCMCIA power control matrices, power latched drivers, display drivers, Pchannel MOSFETs, and open drain power switches. Micrel also continues to offer the use of its fabrication
facilities as a foundry source.
Micrel uses and offers a full range of processes: CMOS, DMOS, bipolar, BiCMOS, and BCDMOS. The company’s
fab is capable of handling metal-gate, silicon-gate, double-metal and double-poly architectures with feature sizes
down to 1.0µm.
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Micrel Semiconductor
Semiconductor Fabrication Facilities
Micrel Semiconductor, Inc.
1849 Fortune Drive
San Jose, California 95131
Cleanroom size: 24,000 square feet (Class 10)
Capacity (wafers/week): 5,000
Wafer size: 100mm (moving to 150mm)
Processes: CMOS, bipolar, DMOS, BiCMOS/DMOS, BCD
Products: Linear ICs, custom ICs, foundry services
Feature sizes: 1.0µm-2.0µm
2-276
North American Company Profiles
Micro Linear
North American Company Profiles
MICRO LINEAR
Micro Linear Corporation
2092 Concourse Drive
San Jose, California 95131
Telephone: (408) 433-5200
Fax: (408) 432-0295
Web Site: www.microlinear.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditure
Employees
1992
37
3
7
1993
34
—
8
1994
42
3
9
1995
57
11
10
1996
54
7
11
1997
66
7
12
210
210
225
251
251
252
Company Overview and Strategy
Micro Linear Corporation (NASDAQ: MLIN) headquartered in San Jose, California, was founded in 1983 as an
analog ASIC semiconductor manufacturer. Since then, the company’s expansion has been in standard products
for mass storage, networking, and power management.
Micro Linear is now a major supplier to the communications, computer, and industrial markets with a product
portfolio of over 225 standard products. The company is an ISO 9002 certified supplier of analog and mixed-signal
integrated circuits.
Micro Linear designs, develops, and markets high performance analog and mixed-signal integrated circuits for a
broad range of applications. The company has targeted high growth market segments that can benefit from its
highly integrated system level solutions. Using the relationships that have been developed with key customers,
the company focuses on applications issues and develops highly integrated products that solve system level
design problems. Additionally, the company has recently opened a design center in Cambridge, England to focus
on radio frequency products.
International sales represented approximately 53 percent of total revenues in 1997.
2-277
Micro Linear
North American Company Profiles
Management
Arthur B. Stabenow
Carlos A. Laber
Chris A. Ladas
Ray A. Reed
J. Philip Russell
John K. Stahl
Paul E. Standish
Chairman, President, and Chief Executive Officer
Vice President, Engineering
Vice President, Operations
Vice President, Business Development
Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Sales
Vice President, Marketing
Products and Processes
Micro Linear continues to expand its range of standard products with its unique tile array design methodology.
This advanced, proprietary tile array approach allows custom designs and standard products that can be quickly
modified.
The product mix consists of the following categories:
•
•
•
•
•
Network Products
Telecommunications
Mass Storage
Motor Control
Switch Mode Power Supply
•
•
•
•
•
Battery Management
Lamp Ballast
Data Acquisition
Bus Products
Video Products
Micro Linear develops and manufactures products utilizing the following process technologies:
•
•
•
•
2-278
12 Volt Bipolar
3µm CMOS
0.8µm BiCMOS
15 Volt BiCMOS
• 40 Volt Bipolar
• 1.2µm CMOS
• 1.5µm BiCMOS
North American Company Profiles
Micro Linear
Semiconductor Fabrication Facilities
Micro Linear owns and occupies 100,000 square feet of combined manufacturing and office space in San Jose,
California. These facilities house marketing, sales, and administration, as well as a state-of-the-art high-speed
analog test floor, design engineering and CAD facilities, and a “backend” wafer metallization line for bipolar
products. Micro Linear utilizes wafer foundries and contract assemblers for the production of its ICs.
2-279
Micro Networks
North American Company Profiles
MICRO NETWORKS
Micro Networks Corporation
Microelectronics Business Unit
324 Clark Street
Worcester, Massachusetts 01606
Telephone: (508) 852-5400
Fax: (508) 853-8296
Web Site: www.mnc.com/company.html
Fabless IC Supplier
Ownership: Privately held.
Company Overview and Strategy
Micro Networks Corporation (MNC) designs and manufactures custom and semi-custom data acquisition products,
clock oscillators, application specific ICs (ASICs), and custom hybrid microcircuits for worldwide high reliability
aerospace/defense, industrial, and commercial applications.
MNC was established in 1969 as a hybrid producer and quickly became a dominant player in data conversion
products. A second product line, frequency control products, was added in 1991. Micro Networks also designs
and manufactures custom microelectronics products including thick- and thin-film substrates, hybrids, and
multichip modules. Typical applications for its custom microelectronics products are avionics, imaging, portable
satellite terminals, military electronics equipment and submarine communications receivers.
In September 1996, MNC acquired the assets of GTE Microelectronics from GTE Corporation, one of the world's
largest suppliers of communications systems, equipment, and services for commercial and government/defense
applications. GTE Microelectronics was an organization within the Communications Systems Division of GTE
Government Systems, one of GTE Corporation's two operating groups. With the assets of GTE Micro, MNC
expanded its monolithic capabilities and its custom microelectronics product line to include capabilities in ASIC
design, manufacture, and test. With regard to ASICs, MNC specializes in the conversion of ASIC designs and the
manufacture of secure ASIC products.
Approximately 60 percent of MNC’s sales, which were about $15 million for 1997, are from military-related
products. Commercial-related products make up the remaining 40 percent.
Management
Debbie Cremin
John Condon
2-280
Vice President, Microelectronics Business Unit
Corporate Vice President
North American Company Profiles
Micro Networks
Products and Processes
Micro Networks’ custom microelectronics products include ASICs, FPGAs, multichip modules, and hybrid circuits.
The company specializes in rapid prototyping, small production runs, custom packaging, and conversion of
hybrids to ASICs.
The company’s ASIC offerings include a variety of standard cell and gate array technologies down to submicron
CMOS, BiCMOS, and bipolar for digital, analog, and mixed-signal circuits.
Micro Networks also provides custom test services for test development and production of analog, digital, and
mixed-signal circuits including temperature testing, characteristics, and qualification.
Semiconductor Fabrication Facilities
For the production of its ICs, MNC works with a number of wafer foundries including National Semiconductor,
Symbios Logic, and Mitel Semiconductor.
Key Agreements
•
As part of the acquisition of GTE Microelectronics in September 1996, MNC established an alliance with GTE
Government Systems that calls for MNC to supply GTE Government Systems with custom ASICs, which were
previously supplied by GTE Micro.
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Micro-Rel
North American Company Profiles
MICRO -REL
Micro-Rel
2343 West Tenth Place
Tempe, Arizona 85281
Telephone: (602) 929-5576
Fax: (602) 968-9691
IC Supplier
Founded: 1973
Employees: 1,000
Company Overview and Strategy
Micro-Rel is a world class producer of analog, digital and mixed-signal devices. The company also provides custom
ASICs. Micro-Rel manufactures electronic circuits for pacemakers, defibrillators and other Medtronic medical
devices implanted in the body. Micro-Rel is a subsidiary of Medtronic Incorporated. 1997 annual sales revenues
were $250 Million.
Products and Processes
Micro-Rel designs, produces and tests integrated circuits in 1.5µm, 3.0µm, 5.0µm CMOS and BiCMOS
technology. A 0.8 micron analog/digital CMOS process is also available and the company is currently working on
0.6 micron CMOS.
Semiconductor Fabrication Facilities
Micro-Rel
2343 West Tenth Place
Tempe, Arizona 85281
Telephone: (602) 929-5576
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 1,500
Wafer size: 150mm
Processes: Bipolar, CMOS, BiCMOS
Products: ASICs
Feature sizes: 0.8µm, 1.5µm, 3.0µm, 5.0µm
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Microchip Technology
North American Company Profiles
MICROCHIP TECHNOLOGY
Microchip Technology Inc.
2355 West Chandler Boulevard
Chandler, Arizona 85224-6199
Telephone: (602) 786-7200
Fax: (602) 899-9210
Web Site: www.microchip.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Microchip Technology International Inc. • Yokohama, Kanagawa, Japan
Telephone: (81) (45) 471-6166 • Fax: (81) (45) 471-6122
Europe:
Arizona Microchip Technology Ltd. • Wokingham, Berkshire, England
Telephone: (44) (118) 921-5845 • Fax: (44) (118) 921-5835
Asia-Pacific:
Microchip Technology, Inc. • Kwai Fong, Hong Kong
Telephone: (852) 2401-1200 • Fax: (852) 2401-3431
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1993
89
4
9
3
1994
139
19
14
35
1995
208
36
21
71
1996
286
52
27
115
1997
334
51
32
77
1998
397
64
38
145
Employees
1,070
1,260
1,430
1,665
1,900
1,950
Company Overview and Strategy
Microchip Technology (NASDAQ: MCHP), was organized in 1989 by a group of venture capital investors to
acquire General Instrument Corporation's Microelectronics division, which was established in 1960. Since the
acquisition, Microchip Technology has shifted its focus from commodity memory and logic products to embedded
control system products.
The company is now a leading manufacturer of highly integrated, field-programmable RISC microcontrollers,
complementary ASSPs, and related specialty memory products for high-volume embedded control applications.
Microchip sells its products to a broad and diverse customer base in the consumer, automotive, communications,
office automation, and industrial markets.
2-283
Microchip Technology
North American Company Profiles
Microchip's embedded control products (microcontrollers, serial and parallel EEPROMs, and high-speed and lowpower EPROMs) represented 93 percent of total product sales in fiscal 1996 compared to only eight percent of
total product sales in fiscal 1990. The remaining 7 percent in fiscal 1996 was represented by the company’s
commodity memory and logic products.
In 1995, Microchip acquired the “KeeLoq” hopping code and secure smart card technology and patents
developed by Nanoteq of South Africa. The $10 million acquisition also provided Microchip with worldwide
marketing rights to the technology. New products have been, and continue to be, developed that combine the
KeeLoq and smart card technology with Microchip’s 8-bit MCUs and serial EEPROMs for enhanced security
applications in wireless/remote controlled systems.
Management
Steve Sanghi
Timothy B. Billington
Frederick J. Bruwer
C. Philip Chapman
Steve Drehobl
Harold R. Fischer
Lanny Flessas
Michael J. Jones
Adrian Kuzdas
David S. Lambert
Robert A. Lanford
Mitchell R. Little
Robert J. Lloyd
Sumit K. Mitra
John F. Oatley
Gordon W. Parnell
George P. Rigg
Richard J. Simoncic
Howard C. Teeter
Ernest M. Villicaña
William Yang
Paolo Spadini
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Chairman, President, and Chief Executive Officer
Vice President, Manufacturing Operations
Vice President, Secure Data Products
Vice President, Chief Financial Officer, and Secretary
Vice President, ASIC Products Division
Vice President, Far East Sales
Vice President, Worldwide Distribution Sales
Vice President, Human Resources and Information Systems
Vice President, Advanced Microcontroller and Technology Products
Vice President, Process Development and Manufacturing Engineering
Vice President, Worldwide Sales
Vice President, Standard Microcontroller and ASSP Division
Vice President, Facilities Management
Vice President, Systems and Applications
Vice President, Manufacturing Operations-Pacific Rim
Vice President, Controller, and Treasurer
Vice President, Advanced Microcontroller and Technology Division
Vice President, Memory and Specialty Products Division
Vice President, Europe Sales
Vice President, Advanced Microcontroller and Technology Division Marketing
Vice President, Finance-Pacific Rim
Vice President, Technology Development
North American Company Profiles
Microchip Technology
Products and Processes
During the 1970's and 1980's, a high-volume ROM and EPROM business was then-General Instrument's primary
revenue generator. Since then, however, Microchip has placed designs derived from microcontrollers at the
forefront of its strategy, and has limited nonvolatile offerings to specialty areas such as serial EEPROMs. Although
commodity EPROM shipments will continue to decrease as a percentage of total sales, the company intends to
manage EPROM production levels to maintain optimal manufacturing capacity utilization.
Microchip's integrated circuit products are outlined below.
technology with lithography dimensions down to 0.7µm.
These products are based on CMOS process
Microcontroller Products
• PICmicro™ 8-bit microcontrollers that combine a high-performance RISC processor with one-timeprogrammable (OTP) EPROM technology or reprogrammable EEPROM or flash memory technology. Current
PICmicro™ microcontroller product families include advanced features such as sophisticated timers, embedded
A/D converters, extended instruction/data memory, inter-processor communication (I2C/Microwire/SPI™ bus
ports and USARTs), and ROM, RAM, EPROM, EEPROM, and flash memories. Some of Microchip’s MCUs
operate from power supplies as low as 2.0V.
• In 1996, Microchip unveiled the industry’s first 8-pin MCU family of devices—the PIC12CXXX. The PIC12CXXX
packs the 8-bit high-speed RISC architecture of the PICmicro™ families into the smallest footprint
microcontroller. The MCU also integrates a 10-bit A/D converter without increasing the pin count.
QuickASIC™ Products
• In 1996, Microchip acquired quick-turn ASIC specialist ASIC Technical Solutions, Inc. Microchip is developing
the technology to allow the combination of the company’s PICmicro™ MCU core with configurable gate arrays,
thereby providing a wider range of flexibility, power ranges, and custom functionality.
EEPROM Products
• Serial CMOS EEPROMs with densities ranging from 1K to 64K and featuring data transfer rates up to 1MHz and
a 10 million erase/write cycle endurance. The company’s serial EEPROMs are offered with a wide operating
voltage range (1.8V to 6.0V). Microchip also developed the world’s first 64K smart serial EEPROM. The
company offers the world’s smallest serial EEPROM––in a SOT-23 package.
• Parallel CMOS EEPROMs available in 4K, 16K, and 64K densities with 10,000 to 100,000 erase/write cycles
(typ).
EPROM Products
• Standard CMOS EPROMs with densities ranging from 64K to 512K.
• Low-voltage (as low as 3.0V) CMOS EPROMs with densities ranging from 64K to 512K.
• High-speed 256K CMOS EPROMs with access times as fast as 55ns.
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Microchip Technology
North American Company Profiles
Secure Data Products
• KeeLoq® family of secure data products. The encoder and decoder devices, which feature Microchip’s
patented KeeLoq code hopping technology, are suitable for remote keyless entry, logical/physical access
control systems, alarm and immobilizer systems, garage door openers, and home security systems.
Semiconductor Fabrication Facilities
Microchip installed a 200mm wafer pilot line in its Fab 2 facility in 1997, and will completely convert the fab over to
200mm wafers over time. Construction of the company’s Fab 3, 200mm wafer fab is expected to begin in 19992000.
Microchip Technology Inc.
2355 West Chandler Boulevard
Chandler, Arizona 85224
Fab 1
Cleanroom size: 24,000 square feet (Class 10)
Wafer sizes: 125mm, 150mm
Process: CMOS
Products: MCUs, EEPROMs, EPROMs, ASSPs
Feature sizes: 0.7µm-1.5µm
Microchip Technology Inc.
1200 South 52nd Street
Tempe, Arizona 85281
Fab 2
Cleanroom size: 60,000 square feet (Class 10)
Wafer size: 150mm, 200mm
Process: CMOS
Products: MCUs, EEPROMs, ASSPs, ASICs
Feature sizes: 0.7µm-0.9µm
Microchip’s IC products are assembled and tested primarily at a subsidiary in Kaohsiung, Taiwan, at the company’s
new test facility near Bangkok, Thailand and by a third-party contractor in Bangkok, Thailand. Other third-party
assembly and test suppliers used by Microchip are located in the Philippines and other Asian countries.
2-286
Micron Technology
North American Company Profiles
MICRON TECHNOLOGY
Micron Technology, Inc.
8000 South Federal Way
P.O. Box 6
Boise, Idaho 83707-0006
Telephone: (208) 368-4000
Fax: (208) 368-4435
Web Site: www.micron.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Micron Technology Japan, K.K. • Minato-ku, Tokyo, Japan
Telephone: (81) (3) 3436-5666 • Fax: (81) (3) 3436-1444
Europe:
Micron Europe, Ltd. • Crowthorne, Berkshire, United Kingdom
Telephone: (44) (1344) 750750 • Fax: (44) (1344) 750710
Asia-Pacific:
Micron Semiconductor Asia Pacific Pte. Ltd. • Singapore
Telephone: (65) 841-4066 • Fax: (65) 841-4166
Financial History ($M), Fiscal Year Ends August 31
Sales
IC Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
506
455
7
48
102
1993
828
737
104
57
163
1994
1,629
1,368
401
83
377
1995
2,953
2,287
844
129
961
1996
3,654
2,210
594
192
1,699
1997
3,516
1,738
332
209
558
Employees
4,300
4,900
5,400
8,080
9,900
12,200
Ownership: Publicly held. NASDAQ: MU.
Company Overview and Strategy
Micron Technology, Inc. (MTI) was founded in 1978 as a semiconductor design consulting firm. In 1981, the
company opened its first fabrication facility, and in late 1982, entered the memory market with a 64K DRAM, which
had a significantly smaller die size than competing products.
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Micron Technology
North American Company Profiles
Today, Micron is a leading developer and manufacturer of DRAMs, very fast SRAMs, flash memories, and other
semiconductor memory components, as well as personal computer systems, Remote Intelligent Communication
RIC) chips and systems, flat panel displays, and complex printed circuit board assemblies (90 percent being sold).
Its memory products continue to feature some of the smallest die sizes in the industry.
MTI is comprised of several operating subsidiaries and divisions. Among them are Micron Semiconductor
Products, Inc., which is responsible for the sales and support of MTI’s semiconductor products; Micron
Electronics, Inc., which develops, manufactures, markets, and supports PC systems, workstations, and custommanufactured printed circuit boards; Micron Display Technology, which develops and manufactures small-area
field emission displays (FEDs); Micron Communications, Inc., which develops and manufactures a line of
MicroStamp™ remote intelligent communications (RIC) products; and Micron Quantum Devices, which designs,
develops, and markets flash memory IC products and systems.
MTI’s customers are primarily computer and computer peripheral manufacturers. Other customers represent the
consumer electronics, CAD/CAM, telecommunications, office automation, data processing, and graphics display
industries.
Management
Steven R. Appleton
Donald D. Baldwin
Michael W. Sadler
Kipp A. Bedard
Eugene H. Cloud
Robert M. Donnelly
D. Mark Durcan
Jay L. Hawkins
Roderic W. Lewis
Nancy M. Self
Steven L. Stout
W. G. Stover, Jr.
John W. Aiton
David A. Cathey, Jr.
Trung T. Doan
James E. Mahoney
2-288
Chairman, President, and Chief Executive Officer
Vice President, Sales and Marketing
Vice President, Sales
Vice President, Corporate Affairs
Vice President, Marketing
Vice President, Memory Products
Vice President, Process Research and Development
Vice President, Operations
Vice President, Legal Affairs, General Counsel, and Corporate Secretary
Vice President, Administration
Vice President, Facilities
Vice President, Finance and Chief Financial Officer
Vice President, Wafer Fabrication
Vice President and General Manager, Display Division
Vice President, Process Development
Vice President, Information Systems
North American Company Profiles
Micron Technology
Products and Processes
Micron's semiconductor product strategy is focused on the design, development, and manufacture of memory
products, primarily DRAMs, for standard and custom memory applications. In recent years, the company has been
applying its core semiconductor technology in other areas, such as RIC products and flat panel displays, in order to
diversify its business.
Standard and Specialty DRAMs
• 4M, 16M, and 64M standard DRAMs — fast page, extended data-out (EDO).
• 16M and 64M synchronous DRAMs (SDRAMs) — offered in speed grades of 12ns/83MHz, 10ns/100MHz,
8ns/125MHz.
• 4M EDO DRAMs for graphics applications — x16 configuration and access times as low as 40ns.
• 8M synchronous graphics RAMs (SGRAMs) — x32 configuration, with speed grades of 15ns/66MHz,
12ns/83MHz, and 10ns/100MHz.
• DRAMs are also offered in bare-die form or module form.
Synchronous SRAMs
• 1M, 2M, and 4M flow-through or pipelined burst SRAMs — the flow-through devices support bus frequencies
up to 67MHz and the pipelined devices up to 125MHz.
• 2M and 4M zero bus turnaround (ZBT) SRAMS — Support 66-167MHz cycle times.
Flash Memories
• 2M, 4M, and 8M NOR-type boot block flash memories using Intel-licensed SmartVoltage technology.
• 8M and 16M NOR-type sector erase flash memories using Intel-licensed SmartVoltage technology.
• Micron introduced a line of solid-state flash memory cards in 2H96.
Communications ICs
• The MicroStamp Engine™ is a single-chip device that integrates an 8-bit microcontroller, 256 bytes of SRAM,
and a microwave radio to produce a stamp size remote intelligent communications (RIC) product. The
MicroStamp unit can be encoded with information and attached to almost any object. The stored data can then
be retrieved or modified remotely at distances of 10-20 feet.
Micron’s semiconductor products are based on CMOS process technology, with the majority of chip designs at the
0.30µm and 0.25µm geometry levels. The company’s research and development efforts are focused on shrink
versions of its 16M DRAMs, 64M synchronous DRAMs, and a move from 0.3µm to 0.25µm and 0.18µm process
technologies. Other development efforts are devoted to 128M, 256M, and 1G DRAMs, and the design of new
flash memory and RIC products.
Semiconductor Fabrication Facilities
In 1996, Micron completed the conversion of its 150mm wafer lines (Fabs I/II and III) to 200mm wafers.
Furthermore, in mid-1995, the company began construction of a new $2.5 billion 200mm wafer fab complex in
Lehi, Utah. However, Micron announced in early 1996 that it would complete only the shell of the fab, and hold off
on outfitting and equipping the facility until market conditions warrant. Recently, a back end test facility in Lehi has
resumed and will be on line by mid-1998. When completed, the new plant will be capable of processing 10,000
wafers per week, utilizing 0.18µm technology.
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Micron Technology
Micron Technology, Inc.
8000 South Federal Way
Boise, Idaho 83707-0006
Fab I/II
Cleanroom size: 32,400 square feet
Capacity (wafers/week): 6,500
Wafer size: 200mm
Process: CMOS
Products: DRAMs, SRAMs, RFID ICs
Feature sizes: 0.35µm-0.25µm
North American Company Profiles
Micron Technology, Inc.
8000 South Federal Way
Boise, Idaho 83707-0006
Fab III
Cleanroom size: 32,000 square feet
Capacity (wafers/week): 7,000
Wafer size: 200mm
Process: CMOS
Products: DRAMs, SRAMs, flash memories
Feature sizes: 0.35µm, 0.25µm
Micron Technology, Inc.
8000 South Federal Way
Boise, Idaho 83707-0006
Fab IV
Capacity (wafers/week): 700
Wafer size: 200mm
Process: CMOS
Products: Memory R&D
Feature sizes: 0.25µm, 0.18µm
Micron’s ICs are tested and assembled at its own facilities located at the site of its headquarters and fabs in Boise,
Idaho.
Key Agreements
• Micron, Motorola, and AMD joined together with DuPont Photomasks Inc. (DPI) in 1996 to form a technology
venture called DPI Reticle Technology Center, to develop advanced mask technology and provide pilot line
fabrication of leading-edge reticles.
• Micron signed a cross-licensing agreement with Intel in 1995 covering flash memory ICs, making Micron a true
alternate source for Intel’s flash devices.
• Micron announced in 1992 a memorandum of understanding with NEC on the mutual OEM sales of each
other's semiconductor memory products.
• Micron has made a number of agreements to license its known-good die (KGD) technology. Licensees include
Honeywell SSEC, Chip Supply, nChip, and Cybex Technologies.
• Micron and LSI announced an embedded memory and logic cooperation agreement.
2-290
Microsemi Corporation
North American Company Profiles
MICROSEMI CORPORATION
Microsemi Corporation
2830 South Fairview Street
Santa Ana, California 92704
Telephone: (714) 979-8220
Fax: (714) 424-1704
Web Site: www.microsemi.com
IC Manufacturer
Financial History ($), Fiscal Year Ends September 28
Sales
R&D Expenditures
Net Income
Capital Expenditures
Employees
1995
133,881
755
6,053
1996
157,435
1,020
8,100
1997
163,234
1,161
11,051
3,765
5,933
6,052
—
—
2,503
Ownership: Publicly held. NASDAQ: MSCC.
Company Overview and Strategy
Microsemi Corporation was incorporated in 1960. It changed its name from Microsemiconductor Corporation in
February 1983. In 1986, Microsemi purchased the assets of the Allen Bradley PTC transistor business in order to
broaden its product line. In 1987, the company acquired Coors Components and renamed it Microsemi Colorado.
Also in 1987, Microsemi acquired Salem Scientific in Massachusetts, now known as Sertech Labs. Microsemi
acquired General Microcircuits in North Carolina the next year to serve as local source for assembly, screening, and
testing of surface mount assemblies for customers on the East Coast. In order to increase foreign sales,
Microsemi acquired Watertown, Massachusetts Unitrode Semiconductor Division in 1992.
Microsemi Corporation is a multinational supplier of high-reliability discrete semiconductors, surface mounted
assemblies and hi-rel screening and testing services. The company’s power conditioning semiconductor
products and custom assemblies are used in a wide array of applications in space, defense, medical and other
markets. Applications have ranged from telecommunication satellites to heart pacemakers, x-ray and other medical
equipment, automotive, computer and automation products and communications equipment. Customers include
Hughes, ITT, Bosch Telecom, Motorola, Lockheed-Martin, Loral, Lucent Technologies and Boeing.
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Microsemi Corporation
North American Company Profiles
Management
Philip Frey, Jr.
David R. Sonksen
Harold R. McKeighan
Lane Jorgensen
Andy T.S. Yuen
James M. Thomas
Eduardo R. Fernandez
Chairman, President and Chief Executive Officer
Vice President, Finance, Treasurer, Chief Financial Officer and Secretary
Vice President and General Manager, Microsemi-Scottsdale
Vice President and General Manager, Microsemi-Santa Ana
Vice President, International Operations
Vice President, Human Resources
Vice President, Marketing and Sales
Products and Processes
Microsemi’s major high reliability product lines are silicon rectifiers, zener diodes, low leakage and high voltage
diodes, temperature compensated zener diodes, transistors and a family of subminiature high power transient
suppressor diodes. Commercial products include automatic surge protectors, transient suppressor diodes used
for telephone applications and computer switching diodes used in computer systems.
New products include Microsemi Santa Ana’s revolutionary ThinKey™ technology (patent efforts commenced)
uses a pressed and metallized ceramic frame, solid metal pads and seal rings, and direct high temperature solder
bond. This ultra-compact packaging technology allows miniaturization of existing designs. The ThinKey™ tips the
scales at 1.0 grams maximum. Equally impressive is a thermal resistance of less than 0.5°C/W. The ThinKey1
package will hold a 100A Schottky die from 20-100V.
Semiconductor Fabrication Facilities
Microsemi’s domestic semiconductor plants manufacture and process all products and assemblies starting from
purchased silicon wafers and piece parts. The principal domestic semiconductor manufacturing operations are
located in Santa Ana, California; Broomfield, Colorado; Scottsdale, Arizona and Watertown, Massachusetts. Each
plant operates its own wafer processing, assembly, testing and high reliability testing and screening departments.
The Scottsdale, Arizona plant was opened in 1982. It is a 137,000 square foot facility that is MIL-certified to MIL-S19500 (JANS). In-house capabilities include a full wafer fab, assembly and screening, including hi-rel.
The Microsemic Corporation Santa Ana, CA facility is 100,000 square foot and houses a new wafer processing
building and expanded hi-rel manufacturing and test area. It is MIL-certified to MIL-S-19500 (JANS). Process
capabilities include voidless, hermetically sealed, clear glass, thermally matched and metallurgically bonded
construction.
Microsemi Colorado, acquired in 1987, supplies high-power Schottky diodes and rectifiers primarily to the
commercial markets. It is a 115,000 square foot facility that is MIL-I-45208, MIL-S-19500 (JANS) and IS09001
certified. It has a Class 100 wafer fab.
Microsemi Chatsworth, established in 1991, provides low cost commercial parts.
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North American Company Profiles
Microsemi Corporation
The Microsemi RF Products facility, Montgomeryville, Pennsylvania, is MIL-certified to MIL-S-19500.
The Microsemi PPC, Inc. facility is located in Riviera Beach, Florida.
Microsemi Watertown is a 164,600 square foot facility MIL-certified to MIL-S-19500. Located nearby is Microsemi’s
Sertech Labs.
Microsemi’s Bombay, India facility assembles a commercial zener diode line for the purpose of competing in the
lower-cost commercial and consumer markets. This plant also performs subcontract coil manufacturing.
Microsemi’s Hong Kong subsidiary, Microsemi (H.K.) Ltd., produces diode products for major commercial
customers. The Hong Kong subsidiary utilizes diode chips manufactured in Microsemi’s U.S. plants and
assembles, tests and finishes the products. The plant is approved for assembly of certain military specified diodes.
Microsemi’s Ennis, Ireland operation manufactures diodes, rectifiers, zeners, thyristors and transistors and
supports the other Microsemi operations. This plant is Defense Electronics Supply Center (DESC) approved by
the U.S. government to screen high reliability product to Military Specification Standard MIL-S-19500 and is also
European Space Agency qualified.
Microsemi Micro Electra is located in Tijuana, Mexico.
Key Agreements
•
In October 1996, Microsemi RF Products, Inc. (RF), formerly known as Micro Acquisition Corporation, a wholly
owned subsidiary of Microsemi, purchased certain assets and the right to manufacture a selected group of
products of the high-reliability portion of SGS-Thomson's Radio Frequency Semiconductor business in
Montgomeryville, Pennsylvania (RF Products).
•
In September 1997, Microsemi PPC, Inc. (PPC), formerly known as Micro PPC Acquisition Corp., a wholly
owned subsidiary of Microsemi, purchased all of the assets and assumed certain liabilities of three affiliated
companies: PPC Products Corporation, Technett Seals Inc., and Semiconductors, Inc. (collectively referred to
as PPC Products). PPC Products is a supplier of power transistors, fixed and adjustable linear regulators and
power rectifiers and is located in Riviera Beach, Florida. The aggregate purchase price for RF Products and
PPC Products included $5,201,000 in cash and a $3,070,000 in notes payable.
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Microwave Monolithics
North American Company Profiles
MICROWAVE MONOLITHICS , INC . (MMINC .)
Microwave Monolithics, Inc. (MMInc.)
465 E. Easy Street
Simi Valley, CA 93065
Telephone: (805) 584-6642
Fax: (805) 584-9594
Web Site: micro-mono.com
Email: MMInc@Micro-Mono.com
IC Manufacturer
Ownership: Privately held.
Company Overview and Strategy
Microwave Monolithics, Incorporated was founded in 1982, to supply Gallium Arsenide custom microwave
components and integrated circuits. MMInc supplies components to the government and OEM community.
The company operates an in-house GaAs foundry to develop the technology and to supply the chips for the final
products.
2-294
Microwave Technology
North American Company Profiles
MICROWAVE TECHNOLOGY
Microwave Technology
4268 Solar Way
Fremont, CA 94538
Don Apte, New Business Development
Telephone: (510) 651-6700
Fax: (510) 651-2208
IC Manufacturer
Company Overview and Strategy
Microwave Technology is a vertically integrated supplier of GaAs and silicon components. The primary market is
defense electronics and commercial systems such as microwave links. Other markets include power modules for
wireless applications.
2-295
Mitel Semiconductor
North American Company Profiles
MITEL S EMICONDUCTOR
Mitel Semiconductor
360 Legget Drive
P.O. Box 13089
Kanata, Ontario
Canada K2K 1X3
Telephone: (613) 592-2122
Fax: (613) 592-6909
Web Site: www.semicon.mitel.com
Designer and Manufacturer of Microelectronic Components
Regional Headquarters/Representative Locations
North America:
Mitel Semiconductor • Fayetteville, Georgia
Telephone: (770) 486-0194 • Fax: (770) 631-8213
Financial History ($M, Canadian)
Sales*
R&D Expenditures
Employees
1992
45
8
1993
69
6
1994
80
7
1995
110
9
1996
197
17
1997
260
20
529
552
564
633
1,061
1,157
*External sales only. Mitel Semiconductor also supplies ICs and hybrids to its parent Mitel Corporation.
Ownership: Publicly held. NASDAQ: MLT.
Company Overview and Strategy
Mitel Semiconductor is a designer, manufacturer and supplier of integrated circuits, optoelectronic and analog line
components. These products are used in telecommunications, data communications, video, aerospace,
industrial, instrumentation, and medical applications. Mitel shares the knowledge they apply to their design and
manufacturing activities through a special Custom Wafer Fabrication service, Global Design Support team and
Customer Care Center.
In March 1996, Mitel Semiconductor acquired Swedish semiconductor manufacturer ABB Hafo.
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Mitel Semiconductor
North American Company Profiles
In February 1998, Mitel Semiconductor acquired Plessey Semiconductors. Headquartered in Swindon, UK,
Plessey provides cost effective IC solutions for the communications, consumer and computer markets through
five business units: ASICs, communications, media, PC systems and power/automotive. This acquisition gives
Mitel Semiconductor immediate access to leading edge technologies, design expertise, complementary product
lines and three wafer fabrication facilities.
Management
John Millard
Francois Cordeau
President and Chief Executive Officer, Mitel Corporation
Vice President and General Manager, Semiconductor Division
Products and Processes
Mitel Semiconductor's product line of microelectronic devices include communications integrated circuits, analog
line components, silicon foundry services, ASICs and optoelectronic devices.
Semiconductor Fabrication Facilities
Mitel Semiconductor is in the process of upgrading its Bromont fabrication facility to 150mm wafers. Additional
100mm capacity is also being added to the Järfälla facility in Sweden.
Mitel Semiconductor
18 Airport Boulevard
Bromont, Quebec, Canada J2L 1S7
Telephone: (514) 534-2321
Fax: (514) 534-2168
Cleanroom size: 25,000 square feet
Capacity (wafers/week): 2,400
Wafer size: 150mm, 100mm
Processes: CMOS, double poly/triple metal,
CD, metal gate.
Feature sizes: 0.8µm, 1.2µm, 1.5µm, 2.0µm,
3.0µm, 4.0µm, 5.0µm, 9.0µm.
Mitel Semiconductor AB
Bruttovägen 1, P.O. Box 520
S-175 26 Järfälla, Sweden
Telephone: (46) (8) 580 24500
Fax: (46) (8) 580 20110
Cleanroom size: 13,000 square feet
Capacity (wafers/week): 1,000
Wafer size: 100mm
Processes: CMOS, DMOS, SOS
Feature sizes: 1.25µm, 1.5µm, 2.0µm, 3.0µm
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Mitel Semiconductor
North American Company Profiles
MITEL S EMICONDUCTOR
[F ORMERLY GEC P LESSEY S EMICONDUCTORS (GPS)]
GEC Plessey Semiconductors
Cheney Manor, Swindon
Wilshire SN2 2QW
United Kingdom
Telephone: (44) (1793) 518000
Fax: (44) (1793) 518411
Web Site: www.gpsemi.com
IC Manufacturer
Regional Headquarters/Representative Locations
North America: GEC Plessey Semiconductors • Scotts Valley, California
Telephone: (408) 438-2900 • Fax: (408) 438-7023
Japan:
GEC Plessey Semiconductors • Chiyoda-ku, Tokyo, Japan
Telephone: (81) (3) 5276-5501 • Fax: (81) (3) 5276-5510
Asia-Pacific:
GEC Plessey Semiconductors • Taipei, Taiwan
Telephone: (886) (2) 5461260 • Fax: (886) (2) 7190260
Financial History ($M)
Sales
IC Sales
Discrete Sales
R&D Expenditures
Capital Expenditures
1992
383
352
31
—
44
1993
311
290
21
—
44
1994
337
312
25
50
64
1995
377
342
35
60
155
1996
340
305
35
60
60
Employees
3,500
3,300
3,300
3,000
2,700
Company Overview and Strategy
GEC Plessey Semiconductors (GPS) was originally established as Plessey Semiconductors in 1966. The
company became a wholly owned subsidiary of The General Electric Company plc. of England and merged with
Marconi in 1990.
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Mitel Semiconductor
North American Company Profiles
GPS designs, produces, and markets ASICs and ASSPs aimed at three high growth market segments —
communications, computing, and consumer electronics. Applications within these markets include personal radio
communications (including wireless LANs and global positioning), computer peripherals, networks, and
televisions. Its technological strengths lie in a high market penetration of RF front ends, tuning, and frequency
synthesis for both radio and TV. This is backed by expertise in high speed, high complexity digital signal
processing and RISC processing, and broad-based experience and capability in semicustom products. The
company is a leading supplier of the ARM RISC processor and of CMOS ASIC devices.
The company can be viewed as two operating divisions: Integrated Circuits and Power Semiconductors. As well
as marketing conventional high power discretes, the Power division has launched a new range of high power
IGBTs.
Product development within GPS’ core market areas are focused on mobile telecommunications, multimedia, and
networks.
Management
GEC Plessey Semiconductors
Tom Urwin
John Brothers
Alan Capper
Chris Moynihan
Ian Cooper
Barry Dennington
Tony Gallagher
Ray Gleason
Phil Pollok
Ernie Pusey
John Read
Managing Director
Director, Technology
Director, Lincoln Business Unit
Director, Personnel
Director, Legal
Director, ASIC System Business Unit
Director, Finance
Director, Media Business Unit
Director, Communications Business Unit
Director, Sales and Marketing
Director, PC Systems Business Unit
GEC Plessey Semiconductors Inc. (U.S.)
T.B.A.
President and General Manager
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Mitel Semiconductor
North American Company Profiles
Products and Processes
GEC Plessey Semiconductors offers a broad range of standard and semicustom ICs in linear, mixed-signal, and
digital CMOS, bipolar, and silicon-on-sapphire (SOS) technologies. In addition to these technologies, GPS has
extensive hybrid and microwave capabilities, plus power semiconductor products.
The company’s semicustom ICs include CMOS gate arrays, embedded arrays, and standard cells; bipolar standard
cells; and gate arrays and standard cells based on SOS technology for radiation-hardened applications.
GPS’ standard semiconductor products include personal communications circuits, satellite/cable/television ICs,
video/image processors, fiber optic link/LAN devices, global positioning products, radio circuits, digital signal
processing ICs, data converters (ADCs and DACs), automotive/industrial/medical components, content
addressable memories (CAMs), linear and logarithmic amplifiers, ARM 32-bit RISC processors and
microcontrollers, and radiation-hardened (SOS) devices such as MPUs, peripherals, memories, bus products, and
standard logic chips. GPS also markets high power discretes and IGBTs.
✔
MOS MEMORY
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
Other (Including Non-Volatile RAM)
✔
MOS LOGIC
General Purpose Logic
Gate Array
Standard Cell
Field Programmable Logic
Other Special Purpose Logic
✔
✔
✔
✔
MOS MICROCOMPONENT
MPU
MCU
MPR
DSP
✔
✔
✔
✔
✔
✔
✔
✔
ANALOG
Amplifier
Interface
Consumer/Automotive
Voltage Regulator/Reference
Data Conversion
Comparator
Other (Includes Telecom)
✔
DIGITAL BIPOLAR
Bipolar Memory
General Purpose Logic
Gate Array/Standard Cell
Field Programmable Logic
Other Special Purpose Logic
MPU/MCU/MPR
✔
✔
OTHER
Full Custom IC
Discrete
Optoelectronic
By the year 2000, the company expects to have 60 percent of its revenue come from the sales of CMOS
products. Meanwhile, bipolar revenues are expected to decrease as a percent of total revenues to about 30
percent by the year 2000. Power discretes and high power IGBTs will make up about 10 percent.
2-300
Mitel Semiconductor
North American Company Profiles
In 1997, GPS began prototyping its first 0.35µm CMOS ICs. A 1.8V, 0.18µm CMOS process is expected to be
employed by the end of the decade. For bipolar, the company has 0.5µm, 5V and 2.7V, triple-metal-layer
processes in production. In addition, the company is developing a silicon germanium (SiGe) process.
Semiconductor Fabrication Facilities
The company has secured foundry partners to supplement its own wafer manufacturing capacity. The company’s
policy is to draw 30-35 percent of its manufacturing capacity from foundries, in addition to retaining its own inhouse manufacturing sources. To help move its production process capability to 0.25µm feature sizes, the
company is considering further wafer fab partnerships.
GEC Plessey Semiconductors
Cheney Manor
Swindon, Wilshire SN2 2QW
United Kingdom
Telephone: (44) (1793) 518000
Cleanroom size: 21,500 square feet
Capacity (wafers/week): 2,000
Wafer sizes: 100mm, 150mm
Process: Bipolar
Products: ASICs, linear ICs
Feature sizes: 0.35µm, 0.5µm, 0.8µm
GEC Plessey Semiconductors
Tamerton Road
Roborough
Plymouth Devon PC6 7BQ
United Kingdom
Telephone: (44) (1752) 693000
Cleanroom size: 28,800 square feet
Capacity (wafers/week): 1,500
Wafer sizes: 150mm, 200mm
Process: CMOS
Products: ASICs, MPUs, DSPs
Feature sizes: 0.35µm, 0.6µm, 0.8µm
GEC Plessey Semiconductors
Lansdowne Road
Chadderton, Oldham OL9 9TY
United Kingdom
Telephone: (44) (161) 624-0515
Cleanroom size: 21,500 square feet
Wafer size: 100mm
Process: Bipolar
Products: ASICs, linear and mixed-signal ICs
Feature size: 0.8µm
GEC Plessey Semiconductors
Lincoln, United Kingdom
Telephone: (44) (1522) 500500
Cleanroom size: 47,100 square feet
Capacity (wafers/week): 3,250
Wafer size: 100mm
Processes: CMOS, SOS/rad-hard
Products: ASICs, SOS, power devices
Feature size: 1.0µm
Key Agreements
•
GPS is involved with the European cooperatives Esprit, Alvey, RACE, and JESSI.
•
GPS is a licensed design product partner and manufacturer of the ARM RISC microprocessor.
•
GPS licensed the PineDSPCore and related development tools from DSP Group Inc. in 1994. GPS is using
the 16-bit, fixed-point DSP core in ASICs and ASSPs for multimedia PC and cellular phone applications.
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MMC Networks
North American Company Profiles
MMC NETWORKS
MMC Networks, Inc.
1134 E. Arques Avenue
Sunnyvale, CA 94086
Telephone: (408) 731-1600
Fax: (408) 731-1660
Web Site: www.mmcnet.com
Fabless IC Supplier
Financial History ($), Fiscal Year Ends December 31
Sales
R&D Expenditures
Net Income (loss)
Capital Equipment Expenses
1995
577
1,802
(2,576)
—
1996
10,515
3,312
702
—
1997
21,930
8,318
1,196
3,200
—
—
88
Employees
Ownership: Publicly held. NASDAQ: MMCN.
Revenues for the first quarter of 1998 were $9.6 million, up 181 percent from $3.4 million in revenues reported in
the first quarter of 1997, and up 26 percent from the $7.6 million reported in the fourth quarter of 1997. Net
income for the first quarter of 1998 was $1.2 million versus net income of $186,000 for the first quarter of 1997,
and net income of $639,000 for the fourth quarter of 1997. The company also stated it was on schedule to begin
volume shipments of the AnyFlow product family in the second half of 1998.
Company Overview and Strategy
Incorporated in September 1992, MMC Networks is a developer and fabless supplier of high-performance, openarchitecture, software-programmable processors optimized for networking applications.
MMC’s products include the PS1000 and ATMS2000 families of network processors. These processors provide
the core functionality of high-performance Fast Ethernet and Asynchronous Transfer Mode (ATM) networking
equipment, respectively. The company believes that network equipment vendors are able to reduce design and
development costs and accelerate product development cycles for high-performance routers and switches by
using its products. All of the company's products are based on its proprietary ViX architecture, which enables
network equipment vendors to easily and cost-effectively implement high-performance, value-added features in
their switch and router products.
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North American Company Profiles
MMC Networks
MMC expanded its product portfolio in 1997 by introducing Per-Flow Queuing technology in May, allowing service
providers to provide priority services for intranet and Internet users on a per-user basis. In September, MMC
introduced the AnyFlow 5000 product family of network processors, which allows network equipment vendors to
offer ATM-class Quality of Service on TCP/IP networks for individual user flow.
Key elements of MMC’s strategy include targeting high-growth markets, facilitating customer success, extending
its technology leadership and leveraging its fabless semiconductor model.
Customers include major networking and communications companies such as Cisco Systems, D-Link, Fujitsu,
Hitachi, N-Base, NEC, Olicom, SNT, Sumitomo, and Toshiba. MMC’s customers employ the Company's network
processors to develop and market multi-gigabit, wire-speed switches and routers with advanced features such as
layer 3 switching, internetworking of LANs and WANs, security, class of service, quality of service and network
management.
MMC has direct sales offices in Chelmsford, MA and Tokyo, Japan, as well as nine manufacturer representatives in
the U.S., four in Canada, and one each in the UK, Israel, Japan, and Taiwan.
Management
Prabhat K. Dubey
Amos Wilnai
Uday Bellary
Sena C. Reddy
Alexander Joffe
John A. Teegen
Brent R. Bilger
President and Chief Executive Officer
Chairman of the Board and Executive Vice President, Bus Development
Vice President, Finance, Chief Financial Officer and Assistant Secretary
Executive Vice President, Operations
Vice President, Engineering
Vice President, Sales
Vice President, Marketing
Products and Processes
MMC Networks’ products are based on several of its proprietary technologies, of which the ViX architecture is the
foundation. Other core technologies include its Per Flow Queuing (PFQ) technology, Direct Replication Engine
technology, Virtual SAR technology and Programmable BitStream Processor technology.
The ViX architecture is a switch fabric architecture that uses a patented point-to-point connection matrix that
permits the use of a wide, centralized, shared-memory structure, while separating control information from user
data. The ViX architecture's use of "point-to-point connections" is designed to enable network equipment
vendors to easily scale the number of ports in their switches and routers, unlike shared-bus architectures that run
into clock frequency, bus capacitance and pin count limitations. The use of a "wide, centralized shared-memory
structure" enables network equipment vendors to scale the bandwidth and amount of buffer memory, unlike
crossbar architectures which become increasingly expensive as bandwidth and buffer requirements increase. The
"separation of control information from user data" enables network equipment vendors to more easily implement
high-performance processing, queuing, replication and switching functions for networking applications, unlike
shared-bus and crossbar architectures, which may require complex processors to coordinate multiple functions
across multiple ports and the replication of user data within their buffers. In addition, the ViX architecture is
designed as an open architecture, providing external access to the appropriate timing and control signals, which
enables network equipment vendors to more easily implement differentiated features and functionality.
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MMC Networks
North American Company Profiles
MMC’s proprietary Per Flow Queuing (PFQ) technology extends the ViX architecture to support class of service
and quality of service for network switches. PFQ is designed to alleviate the limitations of FIFO queuing by
assigning each piece of data to its own unique queue and then scheduling the sending of the data according to
software-programmable algorithms developed by the network equipment vendor, thus allowing the switch or
router to implement class of service or quality of service functionality. Switches and routers incorporating PFQ
technology can be designed to support up to 500,000 queues, providing enough queues for large-scale
networks.
MMC’s Direct Replication Engine Technology is designed to provide wire-speed multicast and broadcast capability
by leveraging the separation of control information from user data enabled by the ViX architecture. This capability
allows the switch or router to store a single copy of the data to be transmitted and replicate it to multiple ports in a
single instruction cycle.
MMC’s Virtual SAR technology provides the ability to convert frames to cells, and vice versa, in internetworking of
ATM with Ethernet, frame relay and other packet-based protocols, thus eliminating the need for expensive
external SAR chips. Conventional switches and routers use more expensive segmentation and reassembly
("SAR") chips to convert frames to cells and vice versa.
MMC Networks' Programmable BitStream Processor technology performs the processing of packet and cell
headers including such functions as real-time parsing, matching and table look-up, as well as bit stream
manipulations such as adding, deleting, substituting, appending and pre-pending. This functionality enables
network equipment vendors to build high-performance switches and routers with additional services that address
network security, class of service and quality of service and improve management throughout the network.
In addition to MMC Networks’ ViX architecture patent, MMC has received notice that two additional patents will
issue. Further, MMC has filed 24 other patent applications, 13 in the U.S. and 11 outside the United States,
relating to other aspects of systems employing the ViX architecture. None of the Company's patent applications
relate to specific products of the Company, such as the ATMS2000 and PS1000 lines of network processors.
MMC’s PS1000 network processor family implements the core functionality of a high-performance Fast Ethernet
switch, provides extensions for layer 3 routing and is optimized for power workgroup, wiring closet and LAN
backbone applications. The PS1000 family enables network equipment vendors to build low-cost, highlyintegrated solutions supporting scalable port densities from eight to 128 10-Mbps Ethernet ports and up to 32
100-Mbps Fast Ethernet ports with the option of one or two ATM uplinks.
The PS1000 family includes the PS1001 PSP, a packet switch processor which provides the central core of the
switching operation; the PS1002 FEIU, a Fast Ethernet interface unit comprised of four 10/100-Mbps full-duplex
Fast Ethernet MAC ports; the PS1003 EIU Ethernet interface unit comprised of six 10-Mbps MAC ports and two
10/100-Mbps MAC ports; the PS1004 AIU ATM interface unit that provides an ATM uplink for Ethernet switches;
the PS1005 ARL Address resolution logic device that provides full frame forwarding and filtering logic; the
PS1007 NCB Network component interconnect ("NCI") bus to CPU bridge; and the PS1008 NPB NCI bus to PCI
bus bridge.
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North American Company Profiles
MMC Networks
MMC’s ATMS2000 network processor family provides the core functionality of a high-performance ATM switch,
the capabilities for layer 3 routing and is optimized for feature-rich building or campus backbones, power
workgroups and WAN access. The ATMS2000 family is targeted for 2.5- or 5-Gbps switches and routers with port
densities of up to 32 OC-3 ports or eight OC-12 ports. The ATMS2000 family includes the ATMS2001 Memory
access buffer; the ATMS2002 Port interface; the ATMS2003 Switch controller which manages data queues and
provides an SWC1 interface to the CPU; the ATMS2004 Switch controller which manages the reading and writing
of data to SWC2 various external data structures and performs pipeline control; the ATMS2101 Optional feature
chipset that monitors and polices cell traffic, Xchecker providing statistics, usage parameter control and/or packet
discard; the ATMS2110 Optional feature chipset that offloads cell reception and Xport transmission from the CPU;
and the ATMS2200 Co-processor that implements PFQ-based Xstream.
MMC Networks' AnyFlow 5000 network processor family implements the company's new Virtual SAR and
Programmable BitStream Processor technologies. The AnyFlow 5000 family employs a modular design which
enables a wide range of networking equipment, including both Ethernet and ATM switches and routers. The
AnyFlow 5000 network processors are designed to provide Layer 3 switching and routing with quality of service
and packet/cell internetworking at a bandwidth of 20Gbps and with throughput of up to 20 million packets-persecond. AnyFlow network processors scale up to 128 Fast Ethernet or ATM OC-3 ports, 16 Gigabit Ethernet
ports or 32 ATM OC-12 ports. Samples of the AnyFlow 5000 products have been available since the fourth
quarter of 1997.
MMC Networks’ fabrication suppliers use mainstream CMOS processes for the manufacturing of its products
instead of depending on leading edge processes in order to help reduce technical risks and production capacity
constraints. MMC’s main products currently are fabricated in 0.35, 0.5 and 0.8 micron CMOS. MMC has
commenced migration of some unspecified products to smaller geometries in order to remain competitive in those
product lines.
Semiconductor Fabrication Facilities
MMC Networks is a fabless IC supplier. Fabrication is outsourced to Motorola in the U.S., Oki Semiconductor and
NEC in Japan, and TSMC in Taiwan.
In 1995 and 1996, MMC Networks subcontracted its semiconductor manufacturing to Oki Semiconductor and
NEC in Japan and Motorola, Inc. in the United States. In 1997, MMC added Taiwan Semiconductor Manufacturing
Corporation (TSMC) to its fab partners. In 1998, MMC expects a growing percentage of its production will be
contracted to TSMC and potentially other new suppliers as new products reach volume production. Only one of
MMC's products is currently manufactured by more than one supplier.
Because MMC has experienced only limited ability to react to fluctuations in product demand, the company plans
to assume more of the product manufacturing responsibilities.
This will include contracting for wafer
manufacturing and subcontracting for assembly and test rather than purchasing finished product. To this end,
MMC has begun investing in design tools, libraries and personnel with the expectation of assuming greater
manufacturing responsibilities by mid-1998.
MMC also began sourcing unknown products from Hitachi Computer Products (America), Inc. in April 1997.
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MMC Networks
North American Company Profiles
Key Agreements
•
In 1997, MMC licensed Packet Engines Inc.’s (Spokane, WA) Gigabit Ethernet Media Access Control (MAC)
chip technology. The technology serves as both a complement and a hedge to MMC’s 3 layer switching-based
products.
•
In June 1996, MMC joined the Gigabit Ethernet Alliance, a multi-vendor effort aimed at providing customers
with open, cost-effective and interoperable Gigabit Ethernet solutions. The Alliance supports the CSMA/CD
(Carrier Sense Multiple Access with Collision Detection) protocol of the original Ethernet standard.
•
In February 1995, MMC joined the Flow Control Consortium, now called the Quantum Flow Control (QFC)
Alliance, an organization formed to complete a flow control protocol that can comprehensively meet the
requirements of ATM Available Bit Rate Service.
•
In December 1994, MMC signed a Development, License and Purchase Agreement with Cisco Systems, Inc.
This covered codevelopment of ViX technology and usage licenses for various MMC processors to be
incorporated into Cisco products.
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Mosaic Semiconductor
North American Company Profiles
MOSAIC S EMICONDUCTOR
Mosaic Semiconductor, Inc.
7420 Carroll Road, Suite 300
San Diego, California 92121-9727
Telephone: (619) 271-4565
Fax: (619) 271-6058
Web Site: www.syntaq.com
Fabless IC Supplier
Employees: 25
Ownership: Privately held. Division of Syntaq. Inc.
Company Overview and Strategy
Founded in 1988, Mosaic Semiconductor is a supplier of high density memory components and systems for
military, aerospace, industrial, and medical markets. Mosaic's customers are mainly in the U.S. and Canada.
European customers are serviced by the England-based operation, HMP.
Management
David Armstrong
Anthony Swaddle
Jaime Conde
President and Chief Executive Officer
Executive Vice President and General Manager
Manager, North American Sales
Products and Processes
Mosaic’s memory products include EPROM, EEPROM, FLASH and SRAM in 8-, 16-, and 32-bit widths, and are
available in both ceramic and hi-rel plastic packages. Screening levels available range from commercial to MIL-STD883B screen.
Semiconductor Fabrication Facilities
Mosaic's ICs are currently manufactured by various North American and off-shore semiconductor manufacturers.
The company maintains an assembly, test, and package design facility in San Diego.
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MOSAID Technologies
North American Company Profiles
MOSAID TECHNOLOGIES
MOSAID Technologies Incorporated
P.O. Box 13579
Kanata, Ontario
Canada K2K 1X6
Telephone: (613) 836-3134
Fax: (613) 831-0796
Web Site: www.mosaid.com
Email: communications@mosaid.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends April 30
Sales
Net Income
R&D Expenditures
Employees
1992
7
(1)
2
1993
10
2
2
1994
15
3
3
1995
24
4
5
1996
38
8
7
1997
40
4
10
1998
41
5
14
61
58
74
93
132
167
190
Company Overview and Strategy
MOSAID Technologies was founded in 1975, to provide MOS memory design and consulting services. Today,
MOSAID is the leading independent memory chip design house and the leading supplier of engineering memory
test systems. The company operates from two separate but synergistic divisions: the Semiconductor Division,
which designs advanced memory chips for both standard and application-specific memory (ASM) requirements,
and the Systems Division, which designs, manufactures, markets and services memory test systems focused
primarily on engineering test requirements.
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North American Company Profiles
MOSAID Technologies
Management
Richard C. Foss, Ph.D.
George J.J. Cwynar
Richard D. Broadway
Robert C. Albrow
G. Glen Evans
Dan Mathers
Chairman
President and Chief Executive Officer
Senior Vice President, Finance and Administration, and Chief Financial Officer
Vice President, Strategic and Technical Development
Vice President and General Manager, Systems Division
Vice President and General Manager, Semiconductor Division
Products and Processes
MOSAID has experience in nine generations of DRAM designs, from 4K to 256M. Some recent memory chip
designs include: a 125MHz, DDR, 256M SDRAM, a 143MHz, four-bank, 64M SDRAM supporting x4, x8, and x16
configurations, a high-performance 16M synchronous DRAM that supports data transfer rates of up to 200Mbps, a
low-voltage 16M DRAM upgrading the capabilities of portable computers, a low-voltage wide-word 4M DRAM, and
a low-power SRAM. MOSAID has extended this expertise to provide optimized, merged memory and logic
solutions for accelerating bandwidth limited applications in markets including telecommunication, data
communication and security.
Macrocell designs intended for use as blocks within ASICs include high-speed pipelined SRAMs and DACs for
RAMDAC function, high-performance embedded DRAM, and HDRAM™ (high-density DRAM) — MOSAID’s
proprietary DRAM technology for single poly logic processes. A yield enhancement vehicle closely integrated
with MOSAID’s engineering testers is also available.
Mosaid is ISO 9001 registered.
Key Agreements
• MOSAID has been selected to design the next generation SLDRAM on behalf of the SLDRAM consortium
using an advanced 0.25 micron DRAM process jointly developed by Siemens, IBM and Toshiba.
• MOSAID announced in February 1997, that its HDRAM embedded memory technology would be ported to
TSMC’s 0.35µm logic process.
• MOSAID signed a distribution agreement with Synopsys Inc. in February 1997, for the integration of the
company’s HDRAM technology into Synopsys’ cell-based array technology.
• MOSAID announced a cooperative development agreement with Oki Electric Company in July 1996, for the
development of an advanced 16M SDRAM and a 64M Outer Data Inner Control SDRAM.
• In 1994, MOSAID teamed up with Symbionics Ltd., Standard Microsystems Corp., and three venture capital
firms to form the joint venture company Accelerix, which has developed a single-chip graphics accelerator using
an advanced Blend IC merged DRAM/logic process from TSMC.
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Motorola
North American Company Profiles
MOTOROLA
Motorola, Inc.
Semiconductor Products Sector (SPS)
3102 North 56th Street
Phoenix, Arizona 85018
Telephone: (602) 244-6900
Fax: (602) 952-4067
Web Site: www.motorola.com/sps
IC Manufacturer
Founded: 1928
(See Top Ten)
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MUSIC Semiconductors, Inc.
North American Company Profiles
MUSIC SEMICONDUCTORS , INC .
MUSIC Semiconductors, Inc.
254B Mountain Ave.
Hackettstown, New Jersey 07840
Telephone: (908) 979-1010
Fax: (908) 979-1035
Web Site: www.music.com
Email: info@music.com
Fabless IC Manufacturer
Founded: 1986
Regional Offices/Representative Locations
Far East:
Far East Headquarters - Special Export Processing Zone 1, Philippines
Telephone: (63) 92 549-1480 • Fax: (63) 92 549-1024
Europe:
Europe Headquarters - Netherlands
Telephone: (31) (45) 546-2177 • Fax: (31) (45) 546-3663
Japan
MUSIC Semiconductors/Microtek – Tokyo, Japan
Telephone: (81) (3) 5300-5525 • Fax: (81) (3) 5300-5520
Employees: 100
Ownership: Privately held.
Company Overview and Strategy
MUSIC Semiconductors, Inc. designs, manufactures, and markets advanced semiconductor devices that
accelerate crucial functions within network switching and routing systems. MUSIC’s existing products are specialty
ASSPs (application specific standard products) — address and header processor circuits based on MUSIC’s
proprietary patented content-addressable memory (CAM) technology.
1997 annual sales are estimated to be in the $10 to $25M range.
Management
Stephen Stas
President
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MUSIC Semiconductors, Inc.
North American Company Profiles
Products and Processes
MUSIC’s CAM technology targets the fundamental function of message routing within global networks. The CAM
product family makes address and header processing more efficient at every network intersection, within every
router, bridge, hub, switch, and file server. Details on this product family are described below.
LANCAM 1st Family – consists of high density content-addressable memories (CAMs) in a variety of depths. Like
the other LANCAM series, the LANCAM 1 st is ideal for time critical applications requiring intensive list processing.
Applications include list processing where space and cost are important (i.e., high-performance desktop and
workgroup bridges and switches, and remote access servers).
List-XL – The MU9C364oL List-XL is a 256 word by 64-bit CAM, ideal for time critical applications requiring
intensive list processing where space and cost are important. Applications include cost sensitive, highperformance desktop and workgroup bridges and switches; and remote access servers.
LANCAM A/L Family – consists of CAMs designed for address filtering applications in Local Area Network bridges
and routers. The architecture of the LANCAMs allow a network station list of any length to be searched in a single
memory transaction. The devices are also well suited for other high-speed data search applications such as virtual
memories, optical and magnetic disk Caches, database accelerators, data compressors and image processors.
ATMCAMs – are CAMs with a 32-bit wide data interface. The device is designed for use in ATM switches and
routers to provide very high throughput VPI/VCI translation via lookup tables held in external RAM, VPI/VCI fields
from the ATM cell header are compared against a list of current connections stored in the CAM array.
WidePort LANCAM Family – consists of CAMs featuring 32-bit wide interface. This interface doubles the available
I/O bandwidth in many applications while maintaining the same powerful architecture and instruction set of the
LANCAMs. Applications include high-performance desktop, workgroup, edge and backbone switches and
routers; up to 16 port, 100Mb Ethernet switches; remote access server; real-time compression/decompression
engines.
LANCAM MP Family – consists of CAMs 128-bits wide, featuring 32-bit wide interfaces. The interface doubles the
available I/O bandwidth in many applications while maintaining the same powerful architecture and instruction set
of the LANCAMs. Applications include 64-bit Ipv6 bridges, switches and routers.
MUAA CAM Family – consists of 80-bit wide CAMs available in depths of 2K-, 4K-, and 8K-bit words. The MUAA
CAM can perform normal CAM functions such as search, insert, and delete on single entries and can age multiple
entries simultaneously. In addition, there is a learn instruction, particularly useful in networking applications.
Applications include Ethernet edge and backbone switches and routers.
ASSPs – MUSIC ASSPs include Source Routing Transparent Interface for use in Token Ring LAN bridges and
routers or use in FDDI LAN bridges and routers. Ethernet interface ASSPs are also available, which speed up
bridging operations using Ethernet controller chips with serial NRZ data outputs.
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North American Company Profiles
MUSIC Semiconductors, Inc.
Semiconductor Fabrication Facilities
MUSIC relies on semiconductor foundries with sub-micron capabilities in Taiwan and Japan. The company utilizes
assembly contractors in Taiwan and the Philippines, under the supervision of its own test and quality assurance
departments.
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MX-COM, Inc.
North American Company Profiles
MX-COM, INC .
MX-COM, Inc./Semiconductor Division
4800 Bethania Station Rd.
Winston-Salem, North Carolina 27105
Telephone: (336) 744-5050
Fax: (336) 744-5054
Web Site: www.mxcom.com
Fabless IC Supplier
Parent Company/Divisions
CML Microsystems Plc. Group
Witham, Essex CM8 3TD
United Kingdom
Telephone: (44) 1376-513833
Fax: (44) 1376-518247
Web Site: www.cmlmicro.com
Consumer Microcircuits Limited (CML) • United Kingdom
Telephone: (44) 1376 513833 • Fax: (44) 1376 518247
CML Microcircuits (Singapore) Pte. Ltd. • Singapore
Telephone: (65) 7450426 • Fax: (65) 7452917
Integrated Micro Systems Limited (IMS) • England
Telephone: (44) 1634-714285 • Fax: (44) 1634-715298
Microsense Systems Limited • England
Telephone: (44) 1489-589022 • Fax: (44) 1489-575616
Radio Data Technology • England
Telephone: (44) 1376-501255 • Fax: (44) 1376-501312
Company Overview and Strategy
The CML Microsystems Plc Group of companies consists of six trading subsidiaries in three technological
divisions, Semiconductor Products, Road Traffic Control Equipment and Data-Over-Radio Equipment. The major
Group companies in these divisions are: Consumer Microcircuits Limited, CML Microcircuits (Singapore) Pte Ltd.,
Integrated Micro Systems Limited, Microsense Systems Limited, MX-COM, Inc., and Radio Data Technology. All
business units are fabless suppliers.
Founded in 1972, Consumer Microcircuits Limited has distributors in 38 countries on six continents.
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North American Company Profiles
MX-COM, Inc.
CML Microcircuits (Singapore) Pte. Ltd. (CMLMS) was established in January 1995 to enhance the Group’s
presence in the Asia Pacific region. Main activities involve sales, distribution, customer service, technical support
and market development. The unit currently distributes and promotes Consumer Microcircuits Limited’s and MXCOM, Inc.’s products in China, Hong Kong, Taiwan, Singapore, Malaysia, Indonesia, Thailand and other areas in
South East Asia.
Operating since 1980, MX-COM, Inc. is a subsidiary of CML Microsystems Plc. The company is a fabless designer
and assembler of integrated circuits, modules, and systems for industrial, commercial and consumer
communication applications. The company emphasizes “strong customer participation to meet market needs.”
Microsense Systems , founded in 1981, manufactures microprocessor-based systems for intelligent highway-type
applications and public transport passenger information display applications. As such, it will not be profiled.
Radio Data Technology: manufactures wireless/radio modems, real-time video and audio transmission finished
products and data transmission finished products. As such, it will not be profiled.
Management
Integrated Micro Systems Ltd. (IMS)
Graham Davies
Technical Director
Products and Processes
Consumer Microcircuits Limited’s IC products fall into seven application lines (products): general purpose (7),
mobile radio (16), wireline telecommunications (20), radio/wireless modems (11), military communications (2),
voice security/privacy (2), and cordless telephones (1).
Specific products include: Signal-to-Noise Enhancer, QTC Tone Processor, QTC Selective Call Tone Decoders,
Voiceband Inverter, Digitally Controlled Amp Array, HSC Tone Decoder for Pagers, Digitally Controlled Quad Amp
Arrays, Frequency Sensitive Switch, Cordless Telephone Scrambler, C-NET (Netz-C) Audio Processor, Private
Squelch Circuit, Unifil Universal Analogue Processor, Band III FSK and FFSK Modems, GMSK Modems, Calling
Line Identifiers, Subscriber Private Metering (SPM) Detector, Universal Call Progress Decoder, 'Eurocom' Delta
Codec, a variety of other codecs and packet data modems, and TETRA Baseband Processors.
One of its newest products is the CMX602A, a low power CMOS IC for BT’s Calling Line Identification Service
(CLIP), Bellcore’s Calling Identity Delivery system (CID), the Cable Communications Association’s Caller Display
Services (CDS), and similar evolving services. It also meets the requirements of emerging Caller Identity with Call
Waiting services (CIDCW). The 16-pin SOIC and DIL packaged device includes a ‘zero-power’ ring or line polarity
reversal detector, a dual-tone (2,130Hz plus 2,750Hz) Tone Alert Signal detector and a 1200-baud FSK
V23/Bell202 compatible asynchronous data demodulator with a data retiming circuit which removes the need for a
UART in the associated microcontroller.
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MX-COM, Inc.
North American Company Profiles
Another new product is the FX829, a low voltage (3.0 to 5.5 Volts; 2.7mA at 3.3V with graduated powersave)
CMOS IC designed to provide baseband audio and system signal-processing functions for PAMR or PMR trunked
radio applications. The D2 - SOIC and D5 -SSOP IC meets ETS 300 086, MPT1327, PAA1382 and I-ETS 300
230 specifications. It operates in half-duplex mode under serial-bus control of the host microcontroller. Included
is a dual-rate 1,200/2,400bps FFSK modem, with a software-flexible choice of synchronization codewords, data
run-length and CRC checking. The two-point modulation output has software programmable level-adjustment.
The audio processing stages include PAMR/PMR transmit and receive filtering. The open design also
modification for emerging standards and proprietary approaches.
CML’s FX629 is a low-power, 5 volt CMOS LSI circuit designed as a continuously variable slope delta codec for use
in military communications applications including delta multiplexers, switches and phones. The device is available
in a 22-pin cerdip DIL package and meets MIL-STD-188-113. On-chip encoder input and decoder output filters
are featured.
CML Group’s Integrated Micro Systems (IMS) unit is a fabless ASIC supplier providing solutions encompassing all
aspects of standard cell custom and full custom ASIC design and manufacture. Founded in 1981, IMS was
acquired by CML Microsystems Plc. in 1994.
IMS’s devices are fabricated in CMOS, BiCMOS and Bipolar processes. The company has particular expertise in:
RF (Radio front ends, LNA, PA, NMT900, GSM, PCN, Frequency Synthesis to 1.8GHz); Optical (Laser and LED
drivers and Optical Receivers @ 50Mbs, 155Mbs, 622Mbs, 1.2Gbs, 2.4Gbs); Analogue/Mixed-Signal (ADC,
DAC, Sigma-Delta converters VCO and VCXO, Filters [CT, SC, digital], PLLs, Op Amps, Comparators); Embedded
Memory (SRAM, DRAM, CAM, FIFO, ROM, EPROM, EEPROM). IMS also provides design, consultancy and
turnkey services.
IMS’s CMOS experience includes 1.2µm-0.35µm, 2-3 metals, 2.4-40 volt products, with a custom library from
which to choose. BiCMOS expertise ranges from 1.5µm-0.8µm, 2 - 3 metals, 2.7-40 volts and up to 17GHz fT.
Bipolar expertise ranges from 2.0µm-0.8µm, 1-2 metals, 5-12 volts and at 7GHz fT. Though less often, IMS has
worked with 0.6µm GaAs in 1 and 2 metal, 5V, 12GHz applications. IMS has also completed limited SOS
applications.
MX-COM, Inc.’s products include the MX102 autocorrelator for pagers, MX109 CVSD voice codec, MX589 GMSK
filter/modem for Cellular Digital Packet Data (CDPD) cellular telephones, MX602 Caller ID on Call Waiting telecom
processor, MX818 baseband signal processor, MX839 digitally controlled analog I/O processor (with four-input
intelligent 8/10 bit A/D monitoring subsystem and three 8/10 bit DACs), MX919A wireless modem data pump, and
MX980 digital radio 36kbps p /4 DQPSK baseband processor for portable radios and base stations.
MX-COM predominantly uses 1.2µm CMOS technology in combinations of mixed-signal, embedded DSP, and
analog design architectures.
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North American Company Profiles
MX-COM, Inc.
Semiconductor Fabrication Facilities
Consumer Microcircuits Limited’s facilities are BS ISO-9001 certified.
The IMS unit is a fabless supplier. It works with AMS/Thesys, Newport Wafer-Fab, UMC, TSMC, SGS-Thomson
and Vitesse typically, but also with other fabs, where appropriate.
MX-COM occupies a 28,000 square foot purpose-built facility in Winston-Salem, NC, USA, where all functions,
except wafer fabrication, are performed. MX-COM’s facilities were ISO-9002 certified in January 1995. Outside
foundries are used for wafer fabrication.
MX-COM independently tests foundry processes for reliability performance in addition to reliability testing which is
performed by the foundry. Electrical test, at wafer level and finished assembly, is performed at the Winston-Salem
facility using proprietary, NIST-traceable hardware and software calibration standards.
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National Semiconductor
North American Company Profiles
NATIONAL S EMICONDUCTOR
National Semiconductor Corporation
2900 Semiconductor Drive
P.O. Box 58090
Santa Clara, California 95052-8090
Telephone: (408) 721-5000
Fax: (408) 739-9803
Web Site: www.national.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
National Semiconductor Ltd. • Tokyo, Japan
Telephone: (81) (43) 299-2308 • Fax: (81) (43) 299-2408
Europe:
National Semiconductor GmbH • Fürstenfeldbruck, Germany
Telephone: (49) (180) 532-7832 • Fax: (49) (180) 530-8586
Asia-Pacific:
National Semiconductor HK Ltd. • Kowloon, Hong Kong
Telephone: (852) 2737-1600 • Fax: (852) 2736-9960
Financial History ($M), Fiscal Year Ends May 31
1992
Sales
1,718
Net Income
(120)
R&D Expenditures
208
Capital Expenditures
189
Employees
27,200
1993
2,014
130
229
235
1994
2,295
264
256
271
1995
2,374
264
283
479
1996
2,623
185
361
628
23,400
22,300
22,400
20,300
1997
2,507
32
445
593
13,400
1998
2,537
(98.6)
482
622
12,000
Ownership: Publicly held. NYSE: NSM.
Company Overview and Strategy
National Semiconductor was established in Danbury, Connecticut, as a manufacturer of transistors in 1959. In
1967, the company moved to Santa Clara, California, where it began producing proprietary ICs.
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North American Company Profiles
National Semiconductor
National has since remained a leading supplier of analog and mixed-signal semiconductor products. The company
focuses on four strategic markets: communications, personal systems, industrial, and consumer. System
applications within these four markets include computers and computer peripherals, cellular phones, fax
machines, local and wide area networks, telecommunications equipment, automotive electronics, industrial
controls, and military and aerospace products. National is also a leader in power management solutions.
At the beginning of fiscal 1997, National reorganized into four operating divisions: the Analog Division, the
Communications and Consumer Division, the Personal Systems Division, and the Fairchild Semiconductor
Division. In March 1997, as part of its effort to focus on systems solutions, National divested itself of its Fairchild
Semiconductor business, which consisted of National’s family logic, non-volatile memory, and discrete
semiconductor product lines. The high-volume, manufacturing intensive business model of Fairchild differs
significantly from National’s business of providing highly integrated system chip solutions for specific applications.
Management
Brian Halla
Kamal Aggarwal
Patrick J. Brockett
Donald Macleod
Michael Bereziuk
John M. Clark III
Douglas M. McBurnie
Gobi Padmanabhan
Edgar R. Parker
Robert M. Penn
Richard L. Sanquini
Roland Anderson
Michael D. Burger
Gordon C. Chilton
David S. Dahmen
Rich Freeman
Tatsuo Ishihara
Keith M. Kolerus
Mark Levi
Robert B. Mahoney
Prem Nath
Richard A. Wilson
President and Chief Executive Officer
Executive Vice President, Central Technology and Manufacturing
Executive Vice President, International Sales and Marketing
Executive Vice President, Finance, and Chief Financial Officer
Senior Vice President and GM, Personal Systems Division
Senior Vice President, General Counsel, and Secretary
Senior Vice President and GM, Communications and Consumer Division
Senior Vice President, Process Technology
Senior Vice President, Quality and Reliability
Senior Vice President and GM, Analog Division
Senior Vice President, Strategic Business and Technology
Vice President, European Division
Vice President and GM, Southeast Asia Division
Vice President, Asia Pacific Operations
Vice President and Treasurer
Vice President, Worldwide Wafer Fab Operations
Vice President, Japan Division
Vice President, Americas Division
Vice President, Corporate Marketing and Communications
Vice President and Controller
Vice President and President, Mediamatics Inc.
Vice President, Human Resources
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National Semiconductor
North American Company Profiles
Products and Processes
MOS MEMORY
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
Other (Including Non-Volatile RAM)
ANALOG
✔
✔
✔
✔
✔
✔
✔
MOS LOGIC
✔
✔
✔
Amplifier
Interface
Consumer/Automotive
Voltage Regulator/Reference
Data Conversion
Comparator
Other (Includes Telecom)
DIGITAL BIPOLAR
General Purpose Logic
Bipolar Memory
Gate Array
General Purpose Logic
Standard Cell
Gate Array/Standard Cell
Field Programmable Logic
Field Programmable Logic
Other Special Purpose Logic
Other Special Purpose Logic
MPU/MCU/MPR
MOS MICROCOMPONENT
✔
✔
✔
MPU
MCU
OTHER
✔
Full Custom IC
MPR
Discrete
DSP
Optoelectronic
Analog Products
Analog products and technology has been one of National’s core competencies since its inception. The company
continues to be a leader in the analog IC industry. Its analog products include operational amplifiers and buffers,
power management circuits, data acquisition circuits, voltage regulators and references, motor control ICs, audio
ICs, custom linear ASICs (CLASICs), and other general and special purpose linear devices.
Comlinear Corporation, acquired by National in 1995, operates as a separate business unit within the Analog
Division. Fort Collins, Colorado-based Comlinear is a supplier of high-frequency amplifiers, current-feedback
devices, analog-to-digital converters, and other analog signal processing circuits.
Communications Products
National is one of the world’s leading suppliers of LAN Ethernet and Fast Ethernet controller chipsets. The
company also offers FDDI circuits.
For telecommunications applications, National offers ATM, ISDN, and SONET/SDH families of networking devices,
as well as single-chip Digital European Cordless Telephone (DECT) radio transceivers. In 1996, National’s
Comlinear business unit released a new family of serial digital video chipsets for transmitting high-speed video
signals through cable networks.
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North American Company Profiles
National Semiconductor
For wireless communications applications, National offers its line of PLLatinum™ RF chips. In 1996, National
introduced its Fast IR product family of wireless data communications chips using fast infrared technology.
Personal Systems Products
National’s personal systems products consist of peripheral function devices that work in tandem with the host
microprocessor in desktop and notebook computers. The recent merger with Cyrix adds high-performance
microprocessors to the personal systems portfolio. Their peripheral products include Super I/O™ products that
consolidate many dependent functions on the motherboard, high-performance disk drive ICs, bus interface
circuits (including USB types), data transmission chips, display drivers, clocks and clock support circuits, DRAM
management ICs, and UARTs. National added low-power system logic ICs to its product portfolio in 1996 when it
acquired PicoPower Technology from Cirrus Logic.
Consumer Products
National’s IC products for consumer applications include audio control circuits, audio noise reduction devices, and
audio amplifiers. The company’s Boomer™ series of single-chip CMOS audio amplifiers is used in wireless
telephones and multimedia computers, as well as CD players, video players, and VCRs.
In March 1997, National acquired Mediamatics Inc., an MPEG audio/video decoder firm, for approximately $100
million. Mediamatics is operating as a wholly owned subsidiary based in Fremont, California. The two companies
are working to incorporate National’s tuner, demodulator, A/D and D/A conversion, and other technologies with
Mediamatics’ software and hardware MPEG audio/video and Dolby AC-3 audio products to create new products, or
cores, for the consumer electronics market.
Also in early 1997, National sold to ISD its CompactSpeech line of RISC-based speech processors for voice
applications in products such as answering machines and cordless phones.
Embedded Technologies Products
This product line includes 4-bit, 8-bit (COP8 Family), and 16-bit microcontrollers and 16-bit and 32-bit
microprocessors (including its NS486 embedded processor). National is also a licensee of the Advanced RISC
Machines ARM 32-bit processor core.
Military and Aerospace Products
National is the second largest supplier of military/aerospace-related semiconductors. It is driving advances in
avionics, telecommunications, cryptography, navigation systems, and displays.
National Semiconductor's primary process technology, M2CMOS, is built around a core double-level-metal CMOS
process. To this core, modules are added to provide a third level of metallization for analog, EEPROM, and
BiCMOS applications. Optimized for analog and mixed-signal applications, the M2CMOS process is used by the
majority of the communications and computing group product lines. A wide range of design rules (down to
0.55µm) are supported by the M 2CMOS process. Plans are to further shrink the process to 0.35µm.
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National Semiconductor
North American Company Profiles
In addition to its family of M2CMOS processes, National also utilizes a high-performance core VLSI bipolar process
named ASPECT, which stands for Advanced Poly Emitter-Coupled Technology. ASPECT and its BiCMOS
module, ABiC, are used for high-performance gate arrays, customer-owned designs, and wireless
communications. ASPECT has been scaled from 2.0µm to 0.8µm and will be replaced with BiCMOS at 0.5µm and
beyond. The current versions of ASPECT and ABiC offer up to four-layers of metallization in addition to a level
zero local interconnect.
A variety of analog processes are used to produce a broad line of linear products. Notable process technologies
are VIP, a high speed complementary bipolar process for operational amplifiers, LB, a medium voltage automotive
market oriented process, LMDMOS, a high power mixed-signal process, and LFAST and LCMOS, which are used
for CLASICs.
Semiconductor Fabrication Facilities
National installed a 200mm wafer line at its fab in Maine for the fabrication of ICs with 0.35µm geometries. The new
$830 million facility includes 40,000 square feet of Class 1 cleanroom. Commercial production started in the first
calendar quarter of 1998.
National Semiconductor Corp.
2900 Semiconductor Drive
Santa Clara, California 95012
Telephone: (408) 721-5000
Cleanroom size: 20,000 square feet
Wafer size: 100mm
Process: Bipolar
Products: Linear ICs, ASICs, R&D
Feature sizes: 0.55µm-0.8µm
National Semiconductor Corp.
2900 Semiconductor Drive
Santa Clara, California 95012
Telephone: (408) 721-5000
Cleanroom size: 20,000 square feet
Wafer size: 200mm
Processes: CMOS, BiCMOS
Products: R&D
Feature sizes: 0.35µm, 0.5µm
National Semiconductor Corp.
1111 West Bardin Road
Arlington, Texas 76017
Telephone: (817) 468-6300
Fab 1
Cleanroom size: 33,000 square feet
Capacity (wafers/week): 4,500
Wafer size: 150mm
Process: CMOS
Products: Logic, microcomponents, ASICs
Feature size: 1.0µm
National Semiconductor Corp.
1111 West Bardin Road
Arlington, Texas 76017
Telephone: (817) 468-6300
Fab 2
Cleanroom size: 72,000 square feet
Capacity (wafers/week): 9,850
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: Logic, linear, mixed-signal, ASICs
Feature sizes: 0.35µm-0.65µm
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North American Company Profiles
National Semiconductor Corp.
5 Foden Road
South Portland, Maine 04106
Telephone: (207) 541-8100
Cleanroom size: 40,000 square feet (Class 1)
Wafer size: 200mm
Processes: CMOS, BiCMOS
Products: Linear, mixed-signal, microcomponents
Feature size: 0.25µm
National Semiconductor
National Semiconductor (UK) Ltd.
Earnhill Road, Larkfield Industrial Estate
Greenock PA16 OEQ, Scotland, UK
Telephone: (44) (1475) 633733
Cleanroom size: 40,300 square feet
Capacity (wafers/week): 10,000
Wafer size: 100mm
Process: Bipolar
Products: Logic, linear ICs
Feature sizes: 1.2µm-5.0µm
National Semiconductor (UK) Ltd.
Earnhill Road, Larkfield Industrial Estate
Greenock PA16 OEQ, Scotland, UK
Telephone: (44) (1475) 633733
Cleanroom size: 30,100 square feet
Capacity (wafers/week): 7,500
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: Logic, linear ICs, microcomponents, ASICs
Feature sizes: 0.8µm-1.2µm
Some of National’s IC products continue to be produced at the fabs now owned by Fairchild Semiconductor and
vice versa.
National’s semiconductor assembly and test plants are located in Toa Payoh, Singapore, and Malacca, Malaysia.
Key Agreements
•
In October 1998, National Semiconductor announced plans to consolidate its wafer manufacturing operations
in Greenlock, Scotland. National is currently seeking investors to spin out the remaining operations there as an
independent foundry operation.
The Greenlock facility near Glasgow currently has two manufacturing lines designated as Fab 1, which
processes 4-inch diameter wafers, and Fab 3, which processes 6-inch wafers. National will close Fab 1 and
consolidate all manufacturing at this site into Fab 3. Consolidation will reduce total employment there from
1,000 to 400, starting in March 1999. The full transition to Fab 3 is expected to take another 12 months after
that to reach completion.
•
In September 1998, National Semiconductor reached an agreement with IBM Corporation for termination of the
existing wafer manufacturing and marketing agreement between National’s Cyrix subsidiary and IBM.
Under terms of the agreement IBM will cease the sale of Cyrix-designed processors before the end of calendar
1998, and National’s Cyrix subsidiary will be relieved of its wafer purchase obligation to IBM. In addition, Cyrix
will transfer certain assets to IBM. As a result of the termination and transfers, National will take a one-time
charge of approximately $50 to $55 million in its second quarter of fiscal 1999, which ends November 29,1998.
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National Semiconductor
North American Company Profiles
•
In April 1998, National Semiconductor signed a definitive agreement to acquire ComCore Semiconductor, a
privately held company that designs and manufactures integrated circuits for computer networking and
broadband communications. The acquisition will add advanced design and technology capabilities to
National’s existing analog, mixed-signal and digital expertise.
•
In February 1998, VIA hosted a seminar for Cyrix’s (a National Semiconductor company) announcement of its
next generation MediaGX microprocessor, the MXi. VIA appears to be supplying Cyrix with key technology for
the MXi which is due in the Q4 1998 and is targeted at the sub-$1000 PC market. VIA has worked with Cyrix for
a number of years to support their line of processors along with those of other Intel competitors.
• On November 17, 1997, National acquired Cyrix Corporation.
• National and Fairchild remain closely linked through a long-term agreement to make the transition as smooth as
possible. The two companies also share and swap fab capacity.
• In early 1996, National joined up with the Belgian research firm IMEC to develop process technology for the
0.25µm and 0.18µm generations.
• National signed a three-year agreement in mid-1995 with Tower Semiconductor Ltd. under which Tower was to
increase its wafer production commitment to National. Tower’s fab in Israel was originally owned by National,
which retains a 3.5 percent interest in the foundry.
• In November 1994, National formed a long-term alliance with Synaptics Inc. to jointly develop computer controls
based on human senses (sight, touch, and sound).
• National formed an alliance with 8x8 Inc. in 1993. The partners are developing embedded processor, video,
and data compression technologies.
• National entered a resale and joint-development agreement with NEC for Ethernet ICs in 1993.
• National entered a cooperative relationship with Matsushita, including joint development and manufacturing
(1992).
• National signed a 10-year semiconductor patent cross-licensing agreement with Hitachi in 1991.
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NeoMagic
North American Company Profiles
NEO MAGIC CORPORATION
NeoMagic Corporation
3260 Jay Street
Santa Clara, CA 95054
Telephone: (408) 988-7020
Fax: (408) 988-7032
Web Site: www.neomagic.com
Fabless IC Manufacturer
Founded: 1993
Financial History ($M) – Fiscal year ends January 31
Sales
R&D Expense
Net Income (loss)
1997
41
9
(1)
1998
125
16
21
Ownership: Publicly held. NASDAQ: NMGC. The Company’s Initial Public Offering of common stock occurred on
March 14, 1997.
Company Overview and Strategy
NeoMagic develops high-performance, low voltage silicon technology that integrates large DRAM memory and
complex logic subsystems into a single chip. Major applications include notebook mobile computers where power
requirements are critical. The Company focuses on bringing desktop performance to mobile computers through
unique semiconductor technology. NeoMagic’s MAGICWARE™ was the first high-performance, low voltage
silicon designs that integrated large DRAM memory and complex logic subsystems onto a single chip. Prior to
MAGICWARE’s introduction, notebook PCs could not achieve desktop performance levels without sacrificing
battery life and portability.
In addition to being the first company to integrate complex logic subsystems with memory (MAGICWARE),
NeoMagic is reportedly the first company to introduce a single-chip graphics subsystem, offer the highest
bandwidth solution for mobile graphics, and offer the lowest mobile graphics power consumption IC on the market.
NeoMagic products are sold via Sales Representatives and Distributors throughout North America, Europe, Asia
and ROW.
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NeoMagic
North American Company Profiles
Management
Kamran Elahian
Prakash Agarwal
Clement Leung
Deep Puar
Ron Jankov
Niall Bartlett
Abe Korgav
Merle McClendon
Ken Murray
Chairman of the Board
President and Chief Executive Officer
Vice President, Engineering
Vice President, Technology
Vice President, Sales
Vice President, Marketing
Vice President, Manufacturing
Vice President, Finance and Chief Executive Officer
Vice President, Human Resources
Products and Processes
NeoMagic products include Accelerated Notebook Graphics Controllers, and Mobile Video Accelerators.
During the fourth quarter of 1997, NeoMagic announced its new MagicGraph128ZV+, which expanded the
multimedia accelerator product line into entry-level and ultra-portable notebooks including the recently released
Presario 1220 notebooks from Compaq Computer Corporation.
NeoMagic also offers drivers for Linux/Unitx/X-Windows, and Direct X (X2 and X3), available through computer
OEMs.
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NVIDIA Corporation
North American Company Profiles
NVIDIA CORPORATION
NVIDIA CORPORATION
1226 Tiros Way
Sunnyvale, CA 94086
Telephone: (408) 617-4000
Fax: (408) 617-4100
Web Site: www.nvidia.com and www.riva128.com
Email: info@nvidia.com
Fabless IC Supplier
Financial History ($K)
Privately held, NVIDIA received pre-IPO funding from venture capitalists Sequoia Capital, Sutter Hill Ventures,
Itochu Corporation, JAFCO Ventures, and Worldview Technology Partners. Venture capitalists as a group held
50.6 percent of the stock of NVIDIA as of February 28, 1998.
Sales
R&D Expenditures
Net Income (loss)
Employees
1993
—
204
(484)
1994
—
361
(1,361)
1995
1,182
2,426
(6,377)
1996
3,912
1,218
(3,077)
1997
29,071
6,632
(2,691)
—
—
—
75
92
Company Overview and Strategy
Founded in 1993, NVIDIA is a fabless designer of 3D multimedia accelerator chips for PC graphics and computer
animation. The company targets the “performance mainstream computer market,” including business,
entertainment and personal application segments. With a founding vision of 3D becoming the next wave in
computing, (a la Intel’s Visual Computing Initiative), NVIDIA's objective is to be the world leader in consumer 3D
technology. The company’s products support emerging applications such as DVD, Intercast and videoconferencing.
NVIDIA focuses on creating a 3D architecture that optimizes 2D graphics, and simultaneously delivers 3D
interactive capabilities. By integrating 2D and 3D into one chip, NVIDIA increases performance and makes 3D more
accessible to mass markets, as well as standardizing the platform for developers.
NVIDIA was honored by the Fabless Semiconductor Association in November 1997 as The Most Respected
Private Fabless Company. Similarly, the company’s customers have won over 40 industry awards based on
NVIDIA’s RIVA 128 graphics processor. The processor is designed into products of five of the top ten PC OEMs
in the U.S. (Compaq, Dell, Gateway 2000, Micron and Packard-Bell NEC), and into leading add-in board
manufacturers such as Diamond and STB. NVIDIA shipped over one million units during the last four months of
1997.
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NVIDIA Corporation
North American Company Profiles
Management
Jen-Hsun Huang
Geoff Ribar
Curtis Priem
Chris Malachowsky
Rick Whitacre
Dan Vivoli
Lew Paceley
Jeff Fisher
David Kirk, Ph.D.
Lee Moncton
Gopal Solanki
Michael Hara
Founder, President and Chief Executive Officer
Chief Financial Officer
Founder and Vice President, Software Engineering
Founder and Vice President, Hardware Engineering
Vice President, Corporate Engineering and Operations
Vice President, Product Marketing
Vice President, Corporate Marketing
Vice President, Sales
Chief Scientist
Director, Product Engineering and QA
Director, Engineering
Director, Marketing
Products and Processes
NVIDIA is a leading developer and manufacturer of 3D multimedia accelerator chips that enable standard PCs to
create 2D and 3D graphics and computer animation. Their first multimedia accelerator was introduced in 1995.
In 1997, NVIDIA focused on delivering state-of-the-art 3D accelerator products with higher price-performance
ratios than competing solutions, including multi-chip or multi-board 2D/3D graphics subsystems. The company’s
expertise is in advanced algorithms, software design, systems architecture, and VLSI.
The RIVA 128 delivers realistic 3D graphics (high levels of detail, smooth shading and high frame rates) using a
100 megahertz, 128-bit graphics and memory interface. The RIVA 128 is architected to take advantage of
mainstream industry standards such as Microsoft's Direct3D API. Rather than relying on traditional simulation and
validation technology, NVIDIA brought the RIVA 128 to market using emulation. Emulation allowed concurrent
chip design verification, software testing and system integration prior to tape out and fabrication.
After having just announced the RIVA 128ZX on February 23, (for Q2 shipments), NVIDIA’s second generation of
the RIVA 3D processor family, the RIVA TNT, was announced March 23, 1998, with shipping promised for Q3.
TNT boasts an impressive 250 million pixels-per-second fill rate. TNT’s proprietary Twin Texel processing engine
integrates a dual-pixel 32-bit color pipeline, 24-bit Z-buffer, 8-bit stencil buffer and per-pixel precision to deliver the
first single-chip 128-bit 3D processor that can process two pixels per clock cycle, thereby enabling true singlepass multi-texturing. TNT utilizes over 7 million transistors (double the RIVA 128), comparable to the Pentium II’s
complexity. It is optimized for Microsoft's PC '98 specification and Direct3D, including DirectX 6.0 initiatives, and
supports OpenGL ICD and AGP 2X. Additionally, the processor incorporates a 250MHz RAMDAC and can expand
up to 16Mb of frame buffer memory, thereby reaching up to 1600x1200x32bpp at 85MHz.
Substantially all of NVIDIA's products currently are manufactured by SGS-Thomson (ST) in Crolles, France. ST is
using advanced 0.35u 5LM technology for the RIVA 128. The company temporarily (December 1997)
experienced low manufacturing yields at ST, but has achieved a very strong and responsive relationship with ST
overall. In addition to the NVIDIA’s use of ST for fabrication, the company licenses technology on a non-exclusive
basis from ST (see Key Agreements).
2-328
North American Company Profiles
NVIDIA Corporation
NVIDIA recently established a relationship with TSMC as a second semiconductor manufacturer.
Key Agreements
•
NVIDIA is a partner in Intel’s Visual Computing Initiative.
•
NVIDIA has granted ST a worldwide license to sell the RIVA 128 and RIVA 128ZX graphics processors. Royalty
revenue from sales of the RIVA 128 graphics processor by ST represented six percent of the Company's total
revenue in 1997. Under the ST Agreement, ST also has a worldwide license to incorporate the technology
underlying the RIVA 128 and RIVA 128ZX graphics processors (including the source code and architecture).
2-329
Oak Technology
North American Company Profiles
O AK TECHNOLOGY
Oak Technology Inc.
139 Kifer Court
Sunnyvale, California 94086
Telephone: (408) 737-0888
Fax: (408) 737-3838
Web Site: www.oaktech.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
Oak Technology, K.K. • Musashino City, Tokyo, Japan
Telephone: (81) (422) 56-3761
Asia-Pacific:
Oak Technology, Taiwan • Taipei, Taiwan, R.O.C.
Telephone: (886) (2) 784-9123
North America: Pixel Magic, Inc., Andover, Massachusetts, U.S.A.
Telephone: (978) 470-8830
Financial History ($M), Fiscal Year Ends June 30
1992
Sales
43
Net Income
(3)
R&D Expenditures
—
Capital Expenditures
—
Employees
1993
30
(5)
5
—
1994
46
4
6
—
1995
111
21
15
—
1996
248
37
31
13
1997
167
24
35
7
1998
157
6
50
12
—
—
225
370
450
511
—
Ownership: Publicly held. NASDAQ: OAKT.
Company Overview and Strategy
Oak technology designs high-performance semiconductors (and related software solutions) for the optical
storage, consumer electronics and digital office equipment markets, targeting applications ranging form business
productivity to home entertainment and office automation.
Founded in 1987, with headquarters in Sunnyvale, California, Oak Technology currently has over 500 employees
in its offices worldwide, including its subsidiaries in Massachusetts (Pixel Magic™, Inc.), Japan (Oak Technology,
K.K.) and Taiwan (Oak Technology, Taiwan); a software design center in Boca Raton, Florida; and a mixed signal
design center in Austin Texas. Acquired by Oak in 1995, Pixel Magic is an industry leader in digital imaging
solutions for the digital office equipment market.
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Oak Technology
North American Company Profiles
Oak plans to continue designing and developing new CD-ROM controllers, while moving aggressively into new
markets to diversify its business. Oak plans to continue development of optical storage technology to address the
CD-R (Recordable), CD-RW (ReWritable), and DVD-ROM markets. Oak’s other product developments include
MPEG video decoders, such as the company’s MPEG-2/Dolby Digital decoder for DVD players.
Virtually all of Oak’s revenues in 1997 were from international sales, principally in Japan, Singapore, and Taiwan.
Management
David D. Tsang
Richard Black
Paul H.F. Vroomen
Ron Wilderink
Kenji Fujimoto
Abel Lo
Richard Simone
Chairman of the Board of Directors and Chief Executive Officer
President and Member of the Board of Directors
President, Consumer Products Group
Vice President, Finance, Chief Financial Officer and Secretary
Vice President, Oak Technology; General Manager, Oak Technology, K.K.
Vice President, Oak Technology; General Manager, Oak Technology, Taiwan
Vice President, Technology and Operations
Products and Processes
Oak offers multimedia semiconductors (and supporting software) solutions for the PC, consumer electronics and
digital office equipment market. Product offerings include storage controllers (for CD-ROM, CD-R/RW and DVDROM drives), VideoCD and DVD system solutions, and imaging compression processors for digital office
equipment.
Recent product announcements include the OTI-9150 UDMA-based controller supporting 40x+ speeds, the OTI9800 DVD-ROM controller, the TroikaCSS™ DVD decoder, and the OTI-612 AC’97 audio/telephony codec.
Semiconductor Fabrication Facilities
Oak Technology is a fabless IC supplier. The company contracts with independent foundries to manufacture all of
its products. In June and November 1995, the company entered into agreements with TSMC and Chartered to
obtain certain additional wafer capacity through the year 2001.
Key Agreements
•
In August 1998, Oak Technology announced the acquisition of Xerographic Laser Images Corporation (XLI
Corporation). XLI will operate as a division of Pixel Magic, a wholly owned subsidiary of Oak, and a leading
provider of advanced, programmable silicon and reference board designs for OEMs in the digital office
equipment (DOE) market.
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Oak Technology
•
North American Company Profiles
In July 1998, Oak Technology announced its acquisition of ViewPoint Technology, Inc., a Santa Clara, Calif.based privately held company that focuses on developing solutions for the growing CD-RW drive market.
The acquisition enables Oak to obtain key intellectual property critical for its future CD-RW product roadmap.
ViewPoint recently developed a controller that supports high encoding speeds for next generation CD-RW
drives.
•
In April 1998, Oak Technology acquired certain key assets from ODEUM Microsystems Inc., a subsidiary of
Hyundai Electronics America. The acquisition includes intellectual property related to ODEUM integrated
circuits and a core group of hardware and software engineers. The former ODEUM group has become the
Cable/Satellite Business Unit of Oak’s Consumer Group.
The two ODEUM products currently in volume production are the OTI-8211 (formerly ODM8211 SAVi), an
integrated MPEG-2 audio/video decoder and transport demultiplexer, and the OTI-8511 (formerly ODM8511
CWest), a DVB-S compliant QPSK demodulator.
2-332
Omnirel Corporation
North American Company Profiles
O MNIREL CORPORATION
Omnirel Corporation
205 Crawford Street
Leominster, Massachusetts 01453
Telephone: (978) 534-5776
Fax: (978) 537-4246
Web Site: www.omnirel.com
IC Manufacturer
Founded: 1985
Regional Offices/Representative Regions
North America:
Mid-America Sales Office • Barrington, Illinois
Telephone: (847) 381-3537 • Fax: (847) 381-3578
Northeast Sales Office • Winchester, Massachusetts
Telephone: (781) 721-6335 • Fax: (781) 721-6347
Southwest Sales Office • Granada Hills, California
Telephone: (818) 368-9772 • Fax: (818) 368-9272
Southeast Sales Office • Palm Harbor, Florida
Telephone: (813) 781-6940 • Fax: (813) 781-6576
Financial History ($M), Fiscal Year End June 30
Corporate
Revenue
Net Income
1995
1996
1997
22.6
2.5
26.0
4.4
21.3
1.6
Ownership: Publicly held. NASDAQ: ZING (Parent company – Zing Technologies, Inc.).
Company Overview and Strategy
Omnirel Corporation manufactures multi-chip power semiconductors, power modules, and semiconductor
components. Omnirel, a subsidiary of Zing Technologies, Inc., focuses on applications that require small-circuit
electrical components. Target markets include defense, aerospace, medical device, and commercial
transportation industries.
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Omnirel Corporation
North American Company Profiles
Management
John Catrambone
President and Chief Executive Officer
Products and Processes
Ominrel’s offers the following products.
•
•
•
•
•
•
•
Power MOSFETs — 1A, 50V to 190A, 100V;
IGBTs — 5A, 500V to 25A, 1,000V;
Voltage Regulators;
Rectifiers and Schottky Diodes;
Op Amps;
Functional Power Modules; and
Surface Mount Devices.
Semiconductor Fabrication Facilities
Omnirel Corporation has a Class 10,000 cleanroom facility located in Leominster, Massachusetts.
Key Agreements
•
In July 1996, Omnirel Corporation and Motorola Semiconductor Products Sector announced an agreement to
work on a new series of MIL qualified GaAs rectifier devices together. Under the agreement, Motorola will
supply GaAs Schottky wafers to Omnirel who will assemble, test, qualify and market a full line of hermetic TO257 and surface mount GaAs products.
•
Omnirel Corporation and Motorola Commercial Plus Technologies Operation signed a sales agreement in May
1995. Under the agreement, Omnirel acquired Motorola CPTO Biopolar Power Discrete Transistor business,
which transfers manufacturing and test equipment and finished goods inventory to Omnirel.
2-334
Optek Technology, Inc.
North American Company Profiles
O PTEK TECHNOLOGY, INC .
Optek Technology, Inc.
1215 West Crosby Road
Carrollton, Texas 75006
Telephone: (972) 323-2284
Fax: (972) 323-7009
Web Site: www.optekinc.com
IC Manufacturer
Financial History ($M)
Sales
1995
1996
1997
$62.5
$67.4
$75.5
Ownership: Publicly held. NASDAQ: OPTT.
Company Overview and Strategy
Optek Technology, Inc. is a leading manufacturer of optoelectronic sensors, magnetic sensors, and fiber-optic
transmitters and receivers. Optek produces virtually everything from its own chips to the plastic housings. The
Company provides components worldwide for manufacturers of office equipment and computers, automobiles,
industrial equipment, aerospace and defense applications, medical equipment and telecommunications
equipment.
The majority of Optek’s growth and profitability is from the custom applications. Optek is committed to research
and development both in the expansion of present uses and in the creative application of new sensor technology.
Management
Thomas R. Files
William J. Collinsworth
Robert J. Kosobuki
Richard G. Dahlberg
Thomas S. Garrett
President and Chief Executive Officer
Vice President, Finance, and Chief Financial Officer
Vice President, Sales and Marketing
Vice President, Engineering
Vice President, Operations
2-335
Optek Technology, Inc.
North American Company Profiles
Products and Processes
Optek Technology, Inc. manufactures sensor products which are based on either optoelectronic or magnetic field
sensing technologies.
Optoelectronic Products
Optek specializes in customized optoelectronic solutions for its customers’ applications. Optek is vertically
integrated and manufactures:
•
•
•
•
Light emitting diode (LED) chip and light sensing semiconductor chips.
Discrete components incorporating LED or sensor chips in either plastic or metal package housings.
Assemblies, which combine the light emitting and light sensing discrete components in a single package.
Fiber optic LEDs and sensors.
Magnetic Sensor Products
Hall-Effect (magnetic field sensing) devices, which sense physical events by reacting to changes in magnetic
fields and is unaffected by the cleanliness of the environment.
Semiconductor Fabrication Facilities
Optek has fabrication facilities in Carrollton, Texas and Juarez, Mexico.
2-336
Orbit Semiconductor
North American Company Profiles
O RBIT S EMICONDUCTOR
Orbit Semiconductor, Inc.
169 Java Drive
Sunnyvale, California 94089
Telephone: (408) 744-1800
Fax: (408) 747-1263
Web Site: www.orbitsemi.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Orbit Europe • Surrey, England
Telephone: (44) (1932) 346288 • Fax: (44) (1932) 347110
Asia-Pacific:
DII Group • Singapore
Telephone: (65) 298-0866 • Fax: (65) 298-3689
Financial History ($M), Fiscal Year Ends December 31
1992
1993
1994
1995
1996
1997
Corporate (DII Group)
Sales
Net Income
—
—
—
—
258
9
397
23
459
10
780
35
Semiconductor
Sales
25
34
50
62
64
120
154
184
278
400
Employees (Orbit)
*55 (est.)
400
*Orbit operates as a wholly-owned subsidiary of DII Group, semiconductor sales no longer segregated.
Company Overview and Strategy
Orbit Semiconductor specializes in semiconductor design, manufacturing, and engineering support services that
allow system designers to manage application-specific integrated circuit (ASIC) development, production,
scheduling, and inventory control. In August 1996, Orbit Semiconductor was acquired by DII Group, Inc., who
serves as a global network of companies that provide design, manufacturing, product development, and support
services to the electronics industry. Orbit operates as a wholly-owned subsidiary of DII Group.
Orbit's customers include companies that design various electronic systems and products for application in the
medical, communications, consumer, aerospace and military, computers and peripherals, and other industries.
2-337
Orbit Semiconductor
North American Company Profiles
*Orbit operates as a wholly-owned subsidiary of DII Group, no longer segregated.
In October 1992, Orbit introduced its Encore! program that converts FPGAs and other IC designs into Orbit digital
gate arrays for more cost-effective solutions or accelerated delivery. Orbit also offers a mixed-signal (analog/digital)
design service that provides rapid development of custom mixed-signal ASICs. A shared wafer-processing
program, Foresight, is provided for cost-effective prototyping of mixed-signal ASICs. In addition, Orbit offers
contract manufacturing programs including hi-rel manufacturing, a low-cost prototyping service, and charge
coupled device (CCD) fabrication.
Management
DII Group
Ronald R. Budacz
Carl R. Vertuca, Jr.
C.Y. Cheong
Chairman and Chief Executive Officer
Executive Vice President, Finance, Administration and Corporate Dev.
Vice President and Managing Director, Asia-Pacific
Orbit Semiconductor
Ronald R. Snyder
Richard Kash
Duncan Robertson
George W. Lewicki
Betty Y. Newkirk
Fernando A. Bettencourt
Uzi Breier
President and Chief Operating Officer (Acting)
Executive Vice President, Mixed-Signal Design
Vice President, Finance
Vice President, Engineering
Vice President, Foundry Business Unit and Customer Service
Vice President, Fab Operations
Vice President, Sales and Marketing
Products and Processes
Orbit's manufacturing services include several IC fabrication programs. The most popular program, Encore!, is a
service that converts netlists for gate arrays or FPGAs into Orbit gate arrays with 270 to 37,000 usable gates. The
resulting circuits are functionally equivalent, but lower in price. Another program, Foresight, supports multiproject, multi-technology runs and reduces NRE charges. Subscribers of Foresight's processes see lower costs
because they share space on masks and wafers.
2-338
North American Company Profiles
Orbit Semiconductor
Both Encore! and Foresight users have access to all of Orbit's processes. They include: 1.0µm and 1.2µm N-well
and P-well CMOS processes with various options such as a second poly layer for capacitors and gates, NPN
bipolar transistors with high or low collector resistances, classical EEPROM, imaging buried channel CCDs with an
oxide nitride gate insulator to maintain low leakage on large arrays, and conventional N-channel and P-channel
transistors to allow on-chip digital logic.
Orbit offers additional programs based on its independent manufacturing capabilities. Its low-volume
manufacturing programs include a "High Reliability Manufacturing Program" in support of medical companies and
military contractors and a low-cost prototyping service, typically used by fabless semiconductor companies.
Semiconductor Fabrication Facilities
In late 1996, Orbit purchased Paradigm’s 0.6µm, 150mm wafer production facility for $20 million.
Orbit also maintains a relationship with Chartered Semiconductor to supplement its wafer production capabilities.
Orbit Semiconductor, Inc.
71 Vista Montana
San Jose, California 95134
Cleanroom size: 18,000 square feet
Capacity (wafer/week): 1,250
Wafer size: 150mm
Process: CMOS
Products: ASICs, foundry services
Feature sizes: 0.6µm, 0.8µm (0.5µm in future)
(Purchased from Paradigm in 1996).
Key Agreements
•
On January 30, 1998, Orbit announced an agreement with Sunnyvale-based Virtual IP Group, a leading
provider of intellectual property for embedded solutions. This agreement enables Orbit to create an impressive
portfolio of synthesizable popular cores, while also enhancing its design and technical support capabilities.
2-339
Oxford Micro Devices, Inc.
North American Company Profiles
O XFORD MICRO DEVICES , INC .
Oxford Micro Devices, Inc.
The Starpin Complex,
273 Canal Street, Suite 600
Shelton, Connecticut 06484
Telephone: (203) 881-0891
Fax: (203) 888-1146
Web Site: www.oxfordmicrodevices.com
Email: sales@oxfordmicrodevices.com
Fabless IC Supplier
Founded: 1987, Delaware.
Ownership: Privately held.
Company Overview and Strategy
Oxford Micro Devices, Inc. designs, markets and sells video digital signal processor chips for use in video
compression, scanners, video production, medical imaging, safety, electronic commerce, transportation, access
control, machine vision, and education. The Company, formerly Oxford Computer, Inc., specializes in video digital
processor chips that are specifically designed to communicate, capture, process and display images in real time.
Oxford is currently developing board and miniature system level products and has plans to license these designs.
Oxford Micro Devices’ medical research activities include fabrication of the first life-size images of cytology
specimens to improve the screening for cervical cancer. The Company is also developing prototypes for ultra high
density and high capacity disk drives. Oxford Micro Devices was the first to design and fabricate the first Artificial
Pap Smear, using its patented Ultra High Resolution Printing Process.
Annual sales for 1997 were under $1 million.
Management
Steven G. Morton
Maureen White
Bruce Froehlich
Peter Holden, Ph.D.
President, Chief Executive Officer and Co-Founder
Personnel Director and Co-Founder
Vice President, Sales
Director of Partnering and Licensing
Products and Processes
Oxford Micro Devices developed a new way of processing images through their leading product — the A236
Video Digital Signal Processor Chip, an image processing system on a single chip that is user-programmable. This
system-on-chip architecture includes an analog video input, non-volatile memory and high-speed memory.
2-340
North American Company Profiles
Oxford Micro Devices, Inc.
The Company was the first to develop a single-chip, Single-Instruction Multiple-Data (SIMD) processor chip, the
A236 Parallel Video Digital Signal Processor Chip, and developed a simple Symbolic Parallel Programming
Method to program the processor.
Other Oxford Micro Devices’ products include miniature fingerprint capture and verification systems, and video
conferencing network computers.
Semiconductor Fabrication Facilities
Oxford Micro Devices, Inc. has a foundry relationship with Samsung Electronics, Korea, to produce its A236 Video
Digital Signal Processor Chip.
Key Agreements
•
Oxford Micro Devices, Inc. has teamed with Thomson-CSF of France to build and market products combining
Thomson-CSF’s fingerprint sensor with Oxford Micro Devices’ A236 SIMD Processor Chip.
2-341
Pacific Monolithics
North American Company Profiles
PACIFIC MONOLITHICS
Pacific Monolithics, Inc.
1308 Moffett Park Drive
Sunnyvale, CA 94089
Telephone: (408) 745-2700
Fax: (408) 734-2656
Web Site: www.pacmono.com
Email: info@pacmono.com
IC Manufacturer
Employees: 180
Ownership: Privately held.
Company Overview and Strategy
Pacific Monolithics, founded in 1984, designs and manufactures surface mount Gallium Arsenide (GaAs) MESFET
Radio Frequency integrated circuits. The primary application is the emerging wireless and communications
markets.
International sales comprise more than half of the current total.
Management
Richard Gold
Allen Podell
James Clark
John Wachsman
Dean Johnson
Michael Morganstern
Andrew Hartland
President
Chief Technical Officer
Vice President, Sales
Vice President, Marketing
Vice President, Business Development
Vice President, Engineering
Director, Finance
Products and Processes
Pacific Monolithics (PM) also offers a complete line of low cost, plastic packaged RF integrated circuits for cellular,
PCS, and ISM frequency bands. PM provides power amplifiers, switches, attenuators, converters and oscillators
covering the frequency spectrum from 800 to 2,500MHz. PM’s power amplifiers are used in a range of telephony
applications, from cellular to PCS. In wireless data, PM’s 10Mbps wireless LAN technology has been licensed by
3COM, a major network equipment manufacturer.
2-342
Paradigm Technology
North American Company Profiles
PARADIGM TECHNOLOGY
Paradigm Technology, Inc.
694 Tasman Drive
Milpitas, California 95035
Telephone: (408) 954-0500
Fax: (408) 954-8913
Web Site: www.prdm.com
Fabless IC Supplier
Founded: 1987
Regional Sales Offices:
United States:
Northwest • Milpitas, California
Telephone: (408) 954-0500 • Fax: (408) 954-0664
Southwest • Irvine, California
Telephone: (714) 727-0452 • Fax: (714) 727-0484
South Central & Southeast • The Colony, Texas
Telephone: (972) 625-6151 • Fax: (972) 625-0901
North Central • Barrington, Illinois
Telephone: (847) 382-1624 • Fax: (847) 382-1685
Northeast • Walpole, Massachusetts
Telephone: (508) 668-2508 • Fax: (508) 668-1563
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992*
15
(9)
1
1993*
25
(18)
2
1994*
32
(4)
1
140
190
205
1995
52
5
5
1996
36
(36)
6
1997
12,449
(8.9)
3.4
244
85
22
* Data for fiscal year ended March 31. In 1994, the company changed its fiscal year ending date to the end of
December. For the period April 1 to December 31, 1994, Paradigm’s sales totaled $26 million and net income
was $11 million.
Ownership: Publicly held. NASDAQ: PRDM.
2-343
Paradigm Technology
North American Company Profiles
Company Overview and Strategy
Paradigm Technology designs, develops and markets high-speed, Fast SRAM semiconductor devices to meet
the needs of advanced telecommunications, networking, workstations, high-performance computers, advanced
modems and complex military/aerospace applications. The company focuses on high-performance, sub-10ns
SRAMs where its technology and product design leadership can best be utilized. In 1996, these products
accounted for approximately 36 percent of the company’s sales.
When established in 1987, Paradigm Technology initially focused on the development of high-speed 256K and
1M SRAMs. In 1989, the company opened a wafer fabrication facility in San Jose, California. Costs associated
with operating the fab and developing its technology, coupled with a less than optimal sales mix, drove the
company to bankruptcy in 1994. The majority of Paradigm’s high-performance SRAM products were being sold
into lower margin commodity markets. As part of the restructuring in 1994, Paradigm’s new management team
adopted a strategy of focusing on emerging markets for higher performance asynchronous and synchronous
SRAMs and specialty products. With the help of investments from Singapore-based AMCA Limited and National
Semiconductor, the company emerged with record sales in the quarter ended September 1994. Unfortunately,
the weakness in the SRAM market that began in late 1995 has had an adverse effect on Paradigm’s revenues.
In 2Q96, Paradigm made a move to expand its product line beyond SRAMs by acquiring startup NewLogic
Corporation, a developer of logic designs with large memory arrays. However, in early 1997, the NewLogic
operation was closed down so that Paradigm could focus on its core SRAM products and markets. In November
1996, Paradigm adopted a fabless supplier strategy by selling its fab to Orbit Semiconductor, thereby gaining
greater flexibility and lowering its fixed costs. Orbit purchased Paradigm’s fab, which was newly converted from
125mm to 150mm wafers, for $20 million.
Approximately 25 percent of Paradigm’s sales in 1996 were attributable to sales outside the U.S., primarily in Asia
and Europe. Paradigm is an ISO 9001 certified supplier.
Management
Michael Gulett
James H. Boswell
David G. Campbell
Richard Morley
Sureel Rajpal
Douglas McArthur
President and Chief Executive Officer
Vice President, Sales, Europe
Vice President, Finance and Chief Financial Officer
Vice President, Operations
Vice President, Sales, U.S.
Director, Advance Product Development
Products and Processes
Paradigm Technology’s products include high-performance 256K, 1M, and 4M asynchronous SRAMs, 100MHz
FIFO buffer-memory chips, high-speed processor-specific synchronous burst SRAMs, pipelined burst SRAMs,
and high-speed Cache RAM modules. Paradigm’s most recent product announcements include the PDM31532,
a 3.3 – 9ns access time 64K x 16 asynchronous design SRAM for cellular phone, high-speed
telecommunications, network and portable applications; and the PDM4M4120S15M, a 1M x 32-bit, 72 – position
SIMM module for digital signal processing, robotics, and instrumentation applications.
2-344
North American Company Profiles
Paradigm Technology
The proprietary technology of Paradigm involves a 0.6µm dual-well CMOS process consisting of two polysilicon
layers and two metal layers, with three of the four layers fully configurable. The company has also developed a
0.35µm process.
Semiconductor Fabrication Facilities
In November 1996, Paradigm sold its wafer manufacturing facility to Orbit Semiconductor and therefore, now
operates as a fabless IC supplier. Paradigm has established foundry agreements with Orbit and Atmel in the U.S.,
NKK Corporation in Japan, and UMC in Taiwan.
Key Agreements
• In November 1996, Paradigm sold its wafer fab facility to Orbit Semiconductor for $20 million. After the
purchasing agreement was complete, the two companies entered into an agreement that calls for Paradigm to
receive a supply of wafers from Orbit over a specified time period.
• Paradigm and Atmel signed a five-year manufacturing, product, and technology agreement in May 1995.
Terms of the agreement include guaranteed wafer supply from Atmel to Paradigm for a five year period.
Moreover, Paradigm transferred its 0.6µm SRAM process to Atmel, and the two companies are jointly
developing 0.5µm and 0.4µm technologies. Atmel also purchased a significant equity interest in Paradigm.
• Paradigm has an extensive relationship with Japan's NKK Corporation. NKK holds a 10 percent stake in
Paradigm as well as a technology and product license for 256K and 1M SRAMs and FIFOs. The two companies
worked together to co-develop the latest 4M technology. Paradigm also has access to NKK's state-of-the-art
200mm wafer fabrication facility in Japan.
• Paradigm has a strategic alliance with National Semiconductor that provides National exclusive marketing and
sales rights to Paradigm’s products for military and aerospace applications. National also made an equity
investment in Paradigm.
2-345
Peregrine Semiconductor
North American Company Profiles
PEREGRINE S EMICONDUCTOR
Peregrine Semiconductor Corporation
6175 Nancy Ridge Drive
San Diego, California 92121
Telephone: (619) 455-0660
Fax: (619) 455-0770
Web Site: www.peregrine-semi.com
Fabless IC Supplier
Employees: 40
Ownership: Privately held.
Company Overview and Strategy
Founded in 1990, Peregrine Semiconductor develops and markets high-performance commercial integrated
circuits based on its patented UTSi® (ultra thin silicon) process. Initially, Peregrine focused on developing the
UTSi® process and today, through joint research and product development, uses this proprietary technology to
develop high-performance products targeted at specific applications such as wireless and satellite
communications.
Management
Ronald E. Reedy, Ph.D.
James S. Cable
Bill Peavey
David R. Staab
Milt Miller
Jon Siann
Chairman, President, and Chief Executive Officer
Vice President, Technology and Operations
Vice President and Chief Financial Officer
Vice President, Engineering and Design
Director, Sales
Director, Marketing
Products and Processes
Peregrine Semiconductor’s ultimate product vision is the Microcommunicator family of products. In a step-by-step
process to reach that goal, the company is currently focusing its product offerings in two areas — wireless
(including paging, cellular and PCs) and commercial satellite communications.
1-2GHz RF Wireless Device Market
Introduced in September of 1997, the PE3282A is a 1.1GHz/510MHz Dual Fractional-N PLL IC designed for
frequency synthesis, offering a unique combination of linearity, isolation and low power consumption and
industry-leading phase noise performance.
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North American Company Profiles
Peregrine Semiconductor
Introduced in February of 1998, the PE3292 is a 1.2GHz/550MHz dual fractional-N PLL IC featuring FlexiPower™
technology. A feature of the UTSi process, FlexiPower gives the PE3292 the ability to operate with variable
supply voltages down to one volt, minimizing total power consumption to as little as 2.6mW (1.2mA) single, and
3.9mW (1.9mA) dual.
Commercial Satellite Industry
Peregrine provides S-level screening of its commercial products, as well as developing semi-custom ASIC
solutions that meet the needs of satellite manufacturers for low-power, highly-complex, inherently radiation-hard
products.
Peregrine is currently in the second phase of its product rollout plan, integrating the discrete components in RF
systems, including mixers, LNAs, amplifiers and modulators. 1998 will see the introduction of a number of
products that embody the outstanding capabilities of UTSi, including FlexiPower™ low-power technology, and
both high integration and high linearity.
Semiconductor Fabrication Facilities
The company's devices are currently produced by Asahi Kasei Microsystems in Japan.
Key Agreements
• In January 1996, Peregrine signed a six-year fab agreement with Asahi Kasei Microsystems Co. (AKM) of
Japan. AKM will provide wafer fabrication to Peregrine in exchange for process technologies. The two
companies are also negotiating a joint development agreement for future products.
• In February 1998, Peregrine announced they will provide wireless semiconductor process technology to
Motorola’s semiconductor business in the start of a collaborative relationship between the two companies.
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Performance Motion Devices
North American Company Profiles
PERFORMANCE MOTION DEVICES
Performance Motion Devices
12 Waltham Street
Lexington, MA 02173
Telephone: (781) 674-9860
Fax: (781) 674-9861
Web Site: www.pmdcorp.com
Email: info@pmdcorp.com
Fabless IC Supplier
Company Overview and Strategy
Performance Motion Devices (PMD) designs advanced motion control integrated circuits. The primary application
is the control of servo and stepper motors in robotic and automated equipment. Other applications include:
semiconductor equipment; medical equipment; general automation; camera pointing; and office equipment.
The company offers complete user design support with a developer’s kit and other tools and support data
including a chipset selector guide.
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Performance Semiconductor Corporation
North American Company Profiles
PERFORMANCE S EMICONDUCTOR CORPORATION
Performance Semiconductor Corporation
630 East Weddell Dr.
Sunnyvale, CA 94089-1751
Telephone: (408) 734-8200
Fax: (408) 734-0962
Web Site: www.performance-semi.com
Email: info@performance-semi.com
Fabless IC Supplier
Financial History
Performance Semiconductor is an independent, privately-held company formed in 1984. 1996 sales were in the
$10 million to $25 million range. The company has five U.S. distributors with 11 offices in six states (AZ, CA, FL,
NJ, NY, TX).
Company Overview and Strategy
Performance is a fabless manufacturer of high performance ICs including memory and microprocessors.
Products and Processes
Performance Semiconductor manufactures the following product lines.
RISC based microprocessors and processors which execute MIL-STD-1750A instruction Set, as well as RISC
processors based on the R3000 family’s MIPS architecture.
Performance Semiconductor’s P1750A Processor product line includes devices built in CMOS for Avionics,
Missile Guidance and Airborne applications. The P1750A family also includes devices built on Silicon-on-Sapphire
(SOS) technology which are tolerant to Single Event Upsets (SEU) and Total Dose Radiation tolerance of greater
than 100K Total Dose. The SOS devices are designed for Launch Vehicles and long term Satellite applications. A
Memory Management Unit and Processor Interface Chip are also offered for general and space applications, and
both are offered combined with their Enhanced Processor for MIL-STD-1750A ISA to form a Multichip Module.
High speed and low power SRAMs with densities from 1K to 1 Meg and speeds as fast as 8ns. SRAMs are sold to
commercial, industrial and military markets.
The company uses CMOS technologies with capabilities including MIL-STD-883 Class B and Class C flows.
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Pericom Semiconductor
North American Company Profiles
PERICOM S EMICONDUCTOR
Pericom Semiconductor Corporation
2380 Bering Drive
San Jose, California 95131
Telephone: (408) 435-0800
Fax: (408) 321-0933
Web Site: www.pericom.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
Pericom • Bridgeport, Corset, United Kingdom
Telephone: (44) (1308) 458986
Asia-Pacific:
Pericom Technology (Shanghai) Co., Ltd. • Shanghai, China
Telephone: (86) (21) 6485-0576 • Fax: (86) (21) 6485-2181
Financial History ($M), Fiscal Year Ends June 30
1992
Sales
0.5
Net Income
—
R&D Expenditures
—
Capital Expenditures —
Employees
26
1993
6
—
—
—
1994
19
3
2
—
1995
23
2
3
—
1996
41
5
4
1
1997
33
2
4
2
1998
49
5
5
3
40
50
100
122
137
172
Ownership: Publicly held as of November. NASDAQ: PSEM.
Company Overview and Strategy
Pericom Semiconductor, founded in 1990, designs and markets ultra fast digital and mixed-signal CMOS and
BiCMOS ICs that provide solutions to bottlenecks in high-performance computing and communications systems.
The company's first products were high-performance Cache SRAMs. However, its current product line includes
CMOS 5V and 3V logic clock generators and drivers, networking ICs, and application-specific switching devices.
Pericom's 3V, 5V, and 3V/5V products are applicable in computing, data communications, and networking
systems.
Founded originally as Pioneer Semiconductor, the company changed its name to Pericom Semiconductor in
1993 to avoid becoming confused with a number of other technology companies with "Pioneer" in their names.
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Pericom Semiconductor
North American Company Profiles
Management
Alex Hui
John Chi-Hung Hui, Ph.D.
Patrick Brennan
Dan Wark
Glen Wiley
Tat C. Choi, Ph.D.
Mark Downing
President, Chief Executive Officer, Co-Founder
Vice President, Technology, Co-Founder
Chief Financial Officer
Vice President, Operations
Vice President, Sales
Vice President, Design Engineering
Director, Marketing
Products and Processes
Employing proprietary 0.8µm and 0.6µm CMOS and BiCMOS technologies, Pericom provides advanced logic,
clock, and mixed-signal products.
•
•
•
•
•
•
•
High-speed FCT bus interface logic chips with propagation delays as low as 3.2ns.
High-speed clock distribution series, including PLL implementation for high clock rates.
Fast switching, low impedance bus switches and true analog switches.
Wide architecture 16-bit FCT logic families.
Low voltage 3.3V, high-performance 8- and 16-bit FCT, LPT, LCX, and ALVCH logic families.
Frequency synthesizer ICs that provide several PLL generated output frequencies for PCs, modems, and laser
printers.
Networking products for Token Ring, 100VG, and Fast Ethernet.
Semiconductor Fabrication Facilities
Pericom has foundry relationships with Chartered Semiconductor, LG Semiconductor, and TSMC.
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PLX
North American Company Profiles
PLX TECHNOLOGY INC .
PLX Technology Inc.
390 Protrero Avenue
Sunnyvale, California 94086
Telephone: (408) 774-9060
Fax: (408) 774-2169
Web Site: www.plxtech.com
Email: info@plxtech.com
Fabless IC Manufacturer
Founded: 1986
Ownership: Privately held.
Company Overview and Strategy
PLX Technology, Inc., a leading supplier of high performance interface chips since 1986, is the world leader in PCI
to local bus bridge chips for the communications, networking, and industrial embedded markets. Over 500 OEM
customers use PLC PCI chips in a wide variety of PCI applications including standard PC and workstation PCI addin-boards, embedded PCI communication systems, such as routers and switches, and industry standard industrial
PCI implementations such as Compact PCL, PMC, and Small PCI.
Focused on providing complete solutions for PCI implementations, PLX provides design assistance to customers
in the form of Reference Design Kits and Software Development Kits. These kits, which include reference
boards, API libraries, software debug tools and sample device drivers with source, allow customers to quickly bring
new designs to production.
Management
Michael Salamen
Mark Easley
Scott Gibson
Bill Hart
Mike Hopwood
President
Vice President, Marketing
Chief Financial Officer
Vice President, Operations
Vice President, Sales
Products and Processes
PLX’s product families are outlined below.
I2O™ Compatible PCI Bus Master I/O Accelerator Chip – The PLX PCI 9080 provides a compact, high performance
PCI bus master interface with a programmable local bus. Integrating the latest in I/O technology, the PCI 9080
contains an Intelligent I/O messaging unit in hardware that allows high performance and compatible software
implementations of the I2O bus protocol specification.
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North American Company Profiles
PLX
PCI 9050 Family – Low cost connectivity for PCI slave designs is provided by the PLX PCI 9050 family. It is
specifically targeted at easing the transition of existing ISA designs to the more feature rich and performance
oriented PCI bus. The 9050 provides direct slave PCI functions by interfacing the adapter’s I/O circuitry (control,
address, and data lines) to a host computer’s microprocessor/memory architecture via the 32-bit PCI bus, which
typically runs at 33MHz.
PCI 9060 Family – The PCI 9060 family was the first full featured PCI Interface Chip on the market and was
recognized as the industry standard for PCI interface devices. Still widely used by many of the industries’ major
PCI adapter suppliers and embedded designers, the PCI 9060 family, including the 3A, ES, and SD contain all the
necessary features for the designs of an intelligent PCI adapter or embedded system. Depending on
requirements, one or two independent DMA controllers are provided, along with a highly configurable local bus
supporting 8, 16, or 32-bit requirements, both multiplexed and non-multiplexed.
Low-skew clock distribution ICs – The PLX EQuality clock distribution family of chips, EQ 6600, generate nearzero propagation delay high fidelity clock outputs referenced to an input oscillator or crystal. These products are
used in mid- to high-end server and workstation designs based on Pentium and PowerPC processors as well as
designs requiring tight tolerance and high fan-out clocking. The EQ 6600 all-digital implementation allows equal
low-skew clock output performance between any clock outputs across one or more EQuality clock chips. EQuality
clock chips permit any variable frequency reference clock input to be distributed. In addition, the chip’s digital
algorithm and design, as compared with analog designs, provide higher noise tolerance, and lower power.
Key Agreements
• In November 1997, PLX Technology, Inc., and Sebring Systems agreed to work together to achieve seamless
migration of PCI bus applications to the higher-performance, higher-functionality domain afforded by the
Sebring Ring Connection chip, the SRC3266. The companies plan to cooperate on design and test strategies
to assure compatibility between Sebring’s technology and PLX’s industry-standard PCI technology, and help
customers quickly achieve scaleable PCI designs. The resulting level of performance and functionality is likely
to appeal to the makers of network servers, switches, routers, and data stream aggregators, in addition to
embedded systems.
• In September 1997, PLX and Performance Technologies, Inc., announced an alliance whereby PLX’s
Peripheral Component Interface (PCI) technology is designed along with a PowerPC® Power QUICC
communications processor from Motorola Corporation, into high-bandwidth communications systems from
Performance Technologies. The first product from this alliance, the PCI370PQ, is a PCI 2.1 compliant add-in
card for network servers and personal computers that blends two key components – the PLX PCI 9080 I/O
Accelerator chip and Motorola’s MPC860MH® Power QUICC processor – into a single, robust Integrated
Services Digital Network (ISDN) communications controller.
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PMC-Sierra
North American Company Profiles
PMC-SIERRA, INC .
PMC-Sierra, Inc.
105-8555 Baxter Place
Burnaby, British Columbia
Canada V5A 4V7
Telephone: (604) 415-6000
Fax: (604) 415-6200
Website: www.pmc-sierra.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
United States: PMC-Sierra • Natick, Massachusetts
Telephone: (508) 650-3431 • Fax: (508) 650-3434
PMC-Sierra • Raleigh, North Carolina
Telephone: (919) 828-8341 • Fax: (919) 828-8902
PMC-Sierra • San Jose, California
Telephone: (408) 261-7221 • Fax: (408) 261-7231
PMC-Sierra • Plano, Texas
Telephone: (972) 423-4135 • Fax: (972) 424-1041
Canada:
PMC-Sierra • Kanata, Ontario, Canada
Telephone: (613) 599-7270 • Fax: (613) 599-8067
Europe:
PMC-Sierra • Warrington, Cheshire, United Kingdom
Telephone: (44) (1925) 651122 • Fax: (44) (1925) 650033
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
92
12
13
1993
83
(13)
15
1994
105
(9)
16
1995
189
1
23
1996
188
(51)
28
1997
127
34
23
322
295
335
480
500
297
Ownership: Publicly held. NASDAQ: PMCS.
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PMC-Sierra
North American Company Profiles
Company Overview and Strategy
PMC-Sierra is focused on developing products that provide its customers with advanced communications
semiconductor system solutions for the global information network. The company participates in the high growth
communications market segments of wide area network infrastructure, local area networking and remote Internet
access. PMC-Sierra provides advanced semiconductor solutions for high speed transmission and networking
systems that provide the underlying networking pipelines for the global information infrastructure. The company is
a leader in the area of Asynchronous Transfer Mode (ATM) communications, as well as an experienced developer
of other high speed communications and LAN subsystem components for frame relay and remote Internet access
applications over SONET/SDH, T1/E1, and T3/E3 transmissions lines. PMC-Sierra’s Ethernet Products Division is
focused on developing high integration, low cost solutions for the competitive Ethernet marketplace. The
company was founded in 1984 as Sierra Semiconductor and first offered its stock to the public in 1991. PMCSierra was established in 1992, and became a wholly-owned subsidiary in 1994. In 1997, the company changed
its name to PMC-Sierra to reflect the corporate focus on internetworking semiconductor solutions. PMC-Sierra
has developed an excellent reputation for its technical abilities in high speed physical layer design.
Management
Bob Bailey
Greg Aasen
Kevin Huscroft
Steve Perna
Haresh Patel
Chris DeMonico
John Sullivan
Colin Harris
Marcel Villeneuve
Geraldine Jones
Ken Mitchell
President and Chief Executive Officer
Chief Operating Officer
Vice President, Research and Development and Chief Technical Officer
Vice President, Marketing and Business Development
Vice President, Sales
Vice President, Ethernet Switching and General Manager, Portland
Chief Financial Officer
Vice President, Integrated Circuit Technology
Director, Production Control
Director, Administration and Human Resources
Controller
Products and Processes
PMC-Sierra is a leading provider of high speed internetworking component solutions emphasizing ATM,
SONET/SDH, T1/E1 and Ethernet applications. The company’s quality system is registered with the Quality
Management Institute to the ISO 9001 standard. As co-founder of the SATURN Development Group, PMC-Sierra
works with over 30 other member companies to define and develop interoperable, standard compliant solutions
for high speed networking applications.
Semiconductor Fabrication Facilities
PMC-Sierra is a fabless semiconductor company. Its wafers are manufactured by Chartered Semiconductor and
Taiwan Semiconductor Manufacturing Co. (TSMC).
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Power Integrations
North American Company Profiles
POWER INTEGRATIONS
Power Integrations Inc.
477 North Mathilda Avenue
Sunnyvale, California 94086
Telephone: (408) 523-9200
Fax: (408) 523-9300
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1996
24
(1.3)
3.6
1997
46
4.8
5.2
90
130
Regional Headquarters/Representative Locations
Japan:
Power Integrations, Inc. • Kohoku-ku, Yokohama-shi, Japan
Telephone: (81) (45) 471-1021 • Fax: (81) (45) 471-3717
Europe:
Power Integrations Europe Ltd. • Windsor, Bershire, United Kingdom
Telephone: (44) (1753) 622-208 • Fax: (44) (1753) 622-209
Korea:
Power Integrations International Holdings, Inc. • Seoul, Korea
Telephone: (82) (2) 568-7520 • Fax: (82) (2) 568-7474
Taiwan:
Power Integrations International Holdings, Inc. • Taipei 105, Taiwan
Telephone: (866) (2) 727-1221 • Fax: (866) (2) 727-1223
Company Overview and Strategy
Power Integrations, founded in 1988, is a public company (NASDAQ: POWI) focused on the power conversion
market. The company designs, develops, and markets integrated circuits that combine low-voltage analog and
digital control capability with high-voltage power output devices in monolithic form. Their three primary markets
are: cell phone chargers, PC stand-by power supplies, and TV set-top boxes.
The company's technology is used to build innovative high-voltage products for the power supply, battery
charging, telecommunications, motor control, and lighting markets.
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Power Integrations
North American Company Profiles
Management
Howard Earhart
Balu Balakrishnan
Vladimir Rumennik, Ph.D.
Dan Selleck
Robert Staples
Ed Pausa
Clifford Walker
Shyam Dujari
President and Chief Executive Officer
Vice President, Engineering and New Product Development
Vice President, Technology
Vice President, Sales
Vice President, Finance and Administration
Vice President, Operations
Vice President, Corporate Development
Director, Marketing
Products and Processes
Power Integrations utilizes a standard CMOS process and adds one implant to generate high voltage MOSFETs
integrated into power supply and interface products. The process is capable of combining 1,200V N-channel
MOSFETs, 700V P-channel MOSFETs, and 400V L-IGBTs with 5-15V CMOS and bipolar logic devices.
TOPSwitch®-II is the newest family of products for power conversion applications. In addition to integration
benefits of the high voltage process technology, this family also has patented circuit and system design
innovations.
The company's power supply IC product line is targeted at the needs of portable and small form-factor products
such as portable computers, camcorders, cellular telephones, PBX line cards, and feature phones. The highvoltage outputs of Power Integrations' power supply circuits provide universal input voltage (85-256 VAC)
capability. The high-frequency switching capability and low system component count enables low-cost, small
form-factor power supply/chargers to be realized. The power supply ICs cover universal input voltage applications
from 1 watt to 90 watts (1 watt to 50 watts from 100 VAC). A one-watt buck converter for non-isolated ISDN
applications is also available.
Its interface IC products are designed for use in energy-efficient, variable-speed electric motors for appliances
such as room air conditioners. The high-voltage capability of these products provides cost-effective level shifting
capability and control for those 110/220 VAC applications. The latest product is the INT 100 half-bridge MOSFET
driver, providing 800-volt level shifting and control for electric motors in the 50W to 3kW power range.
Semiconductor Fabrication Facilities
Foundry relationships with Panasonic Semiconductor Group of Matsushita and Oki Electric have been established
for wafer fabrication utilizing Power Integrations' proprietary process.
Key Agreements
• Power Integrations granted Matsushita access to its technology and products for internal consumption
worldwide, and for non-exclusive distribution of the products in Japan and other selected geographical areas in
return for providing foundry support.
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PowerTech
North American Company Profiles
POWER TECH
PowerTech, Inc.
0-02 Fair Lawn Avenue
Fair Lawn, NJ 07410
Telephone: (201) 791-5050
Fax: (201) 791-6805
Web Site: www.power-tech.com
Email: info@power-tech.com
Discrete Semiconductor Manufacturer
Ownership: Privately held.
Financial History ($M)
Sales
1997
2.5-5 (est.)
Company Overview and Strategy
PowerTech, formed in 1969, is a manufacturer of silicon power transistors.
military/aerospace level products and industrial devices.
The primary market is for
The current/voltage ranges of the products are:
Current:
Voltage:
10 to 2400 amps
60 to 600 volts
The company also performs custom packaging of its and other manufacturers’ chips to meet special requirements.
Management
Alex Polner
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President and Chief Executive Officer
PPC Products Corporation
North American Company Profiles
PPC P RODUCTS CORPORATION
PPC Products Corporation
7516 Central Industrial Drive
Riviera Beach, FL 33404
Telephone: (561) 848-9606
Fax: (561) 848-1607
Web Site: www.flinet.com/~ppc/
Email: ppc@flinet.com
Discrete Semiconductor Manufacturer
PPC is a GSA-rated Small Business.
Company Overview and Strategy
PPC is a discrete semiconductor manufacturer. PPC products are distributed via 105 sales offices consisting
mainly of Avnet’s Allied Electronics sales offices throughout the U.S. and in Ontario, Canada. Other distributors
are Semi-Dice, Inc. (South Easton, MA), with sales offices in California and New York, as well as Universal
Semiconductor, Inc. in Fort Lauderdale, FL and Bohemia, NY.
Products and Processes
PPC manufactures NPN and PNP Silicon Planar Power Transistors and Fast Switching Silicon Rectifiers. The
company is a qualified source for JAN S Power Transistors and JAN, JANTX, and JANTXV devices. PPC claims to
be the leader in the production of Space Level Power Discretes, manufacturing 41 MIL-S-19500 qualified JAN S
products.
Planar Bi-Polar Transistors are available in voltages ranging to 1,000 volts and currents ranging from 100µA to 300
Amps. Planar Silicon Rectifiers are produced in voltages to 1,000 volts and currents ranging to 30 Amps with
switching times as fast as 35 nanoseconds. PPC’s Power Darlington Transistors are available in monolithic and
multi-chip configurations with and without thick-film resistors. Special assemblies available from PPC include eight
MOSFET products, Schottky and IGBT. Products are quality tested to MIL-1-45208A, MIL-Q-9858A and MIL-C45662A standards.
Key Agreements
•
In September 1997, Microsemi PPC, Inc. (PPC), formerly known as Micro PPC Acquisition Corporation, a
wholly owned subsidiary of Microsemi, purchased all of the assets an assumed certain liabilities of three
affiliated companies: PPC Products Corporation, Technett Seals Inc., and Semiconductors, Inc. (collectively
referred to as PPC Products).
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ProTek Devices
North American Company Profiles
PRO TEK DEVICES
ProTek Devices
29 S. Fair Lane
Tempe, AZ 85282
Telephone: (602) 431-8101
Fax: (602) 431-2288
Web Site: www.protek-tvs.com
Email: sales@protek-tvs.com
Discrete Semiconductor Manufacturer
Employees: 48
Company Overview and Strategy
ProTek is a manufacturer of transient voltage suppression products. In 1992, ProTek Devices acquired the
General Semiconductor operation from the Square-D Company and has continued the basic product line.
Products range from board level surface mount arrays to megawatt systems. Major customers are in the industrial,
computer, telecommunications, and aerospace industries.
The specialized device products are fabricated in-house at the above address. Other products are outsourced to
three foundries.
Management
Rakesh Kansal
Richard Von Barandy
Fred Matteson
Jerry Gross
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President
Vice President, Sales and Marketing
Manager, Operations
Manager, Modular Operations
QLogic
North American Company Profiles
QLOGIC
QLogic Corporation
3545 Harbor Boulevard
Costa Mesa, California 92626
Telephone: (714) 438-2200
Fax: (714) 668-5008
Web Site: www.qlc.com
Email: j-huffman@qlc.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
52
6
9
—
1994
45
(5)
9
—
1995
58
2
8
—
1996
54
1
7
1
1997
70
6
10
4
1998
81
13
16
4
—
130
161
145
190
225
Ownership: Publicly held. NASDAQ: QLGC.
Company Overview and Strategy
QLogic Corporation is a leading designer and supplier of semiconductor and board-level I/O (input/output)
products. The company’s products provide a high performance connection between computer systems and their
attached data storage peripherals, such as hard disk and tape drives, CD-ROM drives and RAID subsystems.
QLogic provides I/O technology solutions by designing and marketing single chip controller and adapter board
products for both sides of the computer/peripheral device interlink or “bus.” Historically, the company has
targeted the high performance sector of the I/O market, focusing primarily on the small computer system interface
(SCSI) standard. The company is utilizing its I/O expertise to develop products for emerging I/O standards such as
Fibre Channel. Now experiencing initial industry acceptance, Fibre Channel is a higher performance solution that
maintains signal integrity while allowing for increased connectivity among computer systems and data storage
peripherals.
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QLogic
North American Company Profiles
Management
Gary E. Liebl
Chairman
H.K. Desai
President and Chief Executive Officer
Thomas R. Anderson
Vice President and Chief Financial Officer
Mark Edwards
Vice President, Sales and Corporate Marketing
Larry Fortmuller
Vice President and GM, Computer Systems Group
David Tovey
Vice President and GM, Peripheral Products Group
Products and Processes
QLogic’s semiconductor product families include:
•
The FAS (Fast Architecture SCSI) Family of fast and wide SCSI controller ICs for host and peripheral
applications.
•
The TEC (Triple Embedded Disk Controller) Family of SCSI, Fibre Channel and ATA HDD controllers.
•
The ISP (Intelligent SCSI Processor) Family of SCSI and Fibre Channel host adapter ICs for 32-bit and 64-bit
interfaces.
Semiconductor Fabrication Facilities
The company utilizes outside vendors for the manufacturing of its semiconductor and circuit board products.
Key Agreements
•
In August 1998, QLogic Corporation acquired the net assets of Silicon Design Resources, Incorporated
(SDR), for a cash price of $2 million, plus up to an additional $8 million based upon achievement of certain
performance criteria over the next four fiscal years. SDR, founded in 1995, designs and markets enclosure
management controller chips for the mass storage subsystem and server markets. SDR, which recorded
revenues of $686,700 in the quarter ended June, 1998, will be operated as a wholly-owned subsidiary of
QLogic Corporation, with its headquarters in Austin, Texas.
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QT Optoelectronics
North American Company Profiles
QT OPTOELECTRONICS
QT Optoelectronics
610 North Mary Ave.
Sunnyvale, California 94086
Telephone: (408) 720-1440
Fax: (408) 720-0848
Web Site: www.qtopto.com
IC Manufacturer
Founded: 1990
Regional Offices/Representative Regions
U.S.:
QT Optoelectronics • Dallas, Texas
Telephone: (972) 447-1300 • Fax: (972) 447-1300
Asia:
QT Optoelectronics Asia/Pacific • Selangor Darul Eshan, Malaysia
Telephone: (603) 735-2417 • Fax: (603) 735-2417
Europe:
QT Optoelectronics France S.A. • Charenton-Le-Pont Cedex
Telephone: (33) 01-45-18-78-78 • Fax: (33) 01-43-75-77-57
Employees: 1,500
Ownership: Privately-held. Parent company is Recovery Partners, Inc.
Company Overview and Strategy
QT Optoelectronics is a worldwide manufacturer of optoelectronic products, including LED lamps, LED displays,
optocouplers, infrared components and custom optoelectronic components for the OEM marketplace.
QT’s optocouplers are used in modems as ring detectors and on-off hook switches, in power supplies for
feedback isolation, on circuit boards for logic-to-logic voltage isolation, and for input/output isolation on industrial
process control equipment. The LED Lamps and Displays products are used in a wide range of consumer and
industrial applications, including automotive lighting, information display, gaming equipment, status indication, and
backlighting. QT’s infrared components, which include emitters, sensors and hybrid assemblies, are used for
motion control and sensing, plus a variety of applications in consumer electronic products and new opportunities
wireless communication devices.
In 1969, QT was originally an operating unit of Monsanto, a pioneer in LED technology and later became a division
of General Instrument. Since then, optoelectronics technology and business was acquired from various
semiconductor companies (i.e., Fairchild Semiconductor, General Electric, Harris Semiconductor, and Philips
Semiconductor).
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QT Optoelectronics
North American Company Profiles
QT’s 1997 annual sales were approximately $100M.
Management
Ralph Simon
Robert M. Taber Jr.
President
Vice President, Sales
Products and Processes
QT Optoelectronics produces over 750 different components in three product lines. Product details are as
follows.
Optocouplers
QT developed the OPTIOPLANAR structure for optocouplers. These devices are available in 4-, 6-, and 8-pin
configurations.
4-Pin Optocouplers —
Phototransistor Output with GaAs Input
Hermetic Phototransistor Output with GaAs Input
Photodarlington Output with GaAs Input
Phototransistor Output with GaAs AC Input
6-Pin Optocouplers —
Phototransistor Output with GaAs Input
Phototransistor Output with AgGaAs Input
Phototransistor Output with GaAs Input
High Voltage Phototransistor Output with GaAs Input with integral base-emitter resistor
Phototransistor Output with GaAs AC Input
10Mbit/s High-Speed Logic-to-Logic (Optologic®) AlGaAs Input
Photo SCR Output with GaAs Input
Bilateral Analog FET Output with GaAs Input
Schmitt Trigger Output with GaAs Input
Schmitt Trigger Output with AlGaAs Input
Non-Zero Crossing TRIAC Output with GaAs
8-Pin Optocouplers —
High Gain Split Photodarlington Output with GaAsP Output
1 Mbit/s High-Speed Transistor Output with GaAsP Input
Dual Channel Phototransistor Output with GaAs Input
Dual Channel 1Mbit/s High-Speed Transistor Output with GaAsP Input
Dual Channel Split Darlington Output with GaAsP Input
Dual Channel 10Mbit/s High-Speed Logic Gate Output with GaAsP Input
10Mbits High-Speed Logic Gate Output with GaAsP Output
Logic Output with GaAs AC input
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North American Company Profiles
QT Optoelectronics
LED Lamps and Displays
Low Current Lamps
Resistor LED Lamps
Surface Mount LED Lamps
PCB Mount LED Indicators
Light Bars and Bargraph/Panel Indicators
Displays – 10-pin, 14-pin, and 18-pin.
Dot Matrix Displays
Infrared Components
Plastic Infrared Light Emitting Diodes
Plastic Silicon Infrared Photosensors
Hermetic Infrared Light Emitting Diodes
Hermetic Silicon Infrared Photosensors
Subminiature Emitters and Photosensors
Plastic Silicon Pin Photodiodes
Optologic Photosensors
Optologic Optical Interrupter Switches
Phototransistor Optical Interrupter Switches
Photodarlington Optical Interrupter Switches
Reflective Object Sensors
Matched Emitter/Photosensor Pairs
In addition, QT Optoelectronics’ Visible Product Group offers design and manufacturing of LED based assemblies
for customer’s application specific requirements.
Semiconductor Fabrication Facilities
QT Optoelectronics has a wafer fab facility located in Singapore, and their primary engineering and manufacturing
operations are located near Kuala Lumpur, Malaysia.
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Quality Semiconductor
North American Company Profiles
Q UALITY S EMICONDUCTOR
Quality Semiconductor, Inc.
851 Martin Avenue
Santa Clara, California 95050-2903
Telephone: (408) 450-8000
Fax: (408) 496-0773
Web Site: www.qualitysemi.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Quality Semiconductor, Inc. • Hampshire, United Kingdom
Telephone: (44) (1420) 563333 • Fax: (44) (1420) 561142
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
18
(5)
—
—
1993
28
3
—
—
1994
37
3
5
1
1995
46
5
6
2
1996
45
(1)
7
7
1997
63
.2
9.3
10
100
160
160
160
197
206
Ownership: Publicly held. NASDAQ: QUAL.
Company Overview and Strategy
Established in 1989, Quality Semiconductor, Inc. (QSI) is a provider of high-performance logic devices and
networking and logic-intensive memory semiconductor products. Quality's strategy is to go after existing areas
with higher performance parts, then create new niches that can be developed. The company targets systems
manufacturers principally in the networking, personal computer and workstation, and communications industries,
but also sells devices for military and high-reliability applications.
In early 1996, Quality Semiconductor purchased AWA MicroElectronics, Pty. Ltd. (now Quality Semiconductor
Australia) from AWA Limited, acquiring AWA’s fab facility, foundry business, and design center in Australia. During
1996, QSI upgraded the facility from 1.5µm to 0.8µm process technologies. The new subsidiary continues to
provide foundry services to AWA and its existing foundry customers. AWA Limited retains some ownership in the
new subsidiary and is jointly developing new products and technologies with Quality Semiconductor.
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Quality Semiconductor
North American Company Profiles
Management
Quality Semiconductor Inc.
Chun P. Chiu
R. Paul Gupta
David Sear
Edward J. Bradley, Jr.
Albert R. Enamait
Gilbert C. Jones
David T. Zimmer
Chairman and Chief Technical Officer
President and Chief Executive Officer
Executive Vice President, Chief Operating Officer
Vice President, Manufacturing
Vice President, Sales and Marketing
Vice President, Marketing Operations
Vice President, Human Resources
Quality Semiconductor Australia
Andy Brawley
Manager, Operations; Director, Fab and Administration
Clive Potter
Director, Engineering and Design
Steve Liu
Vice President, Wafer Fab
Products and Processes
Quality Semiconductor produces high-performance 5V and 3.3V CMOS FCT logic devices, high-speed digital
logic switches, clock management circuits, fast FIFOs, analog devices, JTAG devices, and advanced networking
products. Sales of interface logic devices account for a significant majority of the company’s net product
revenues.
Networking Products — QSI offers advanced CMOS Fast Ethernet transceivers for access equipment and LAN
applications, as well as a 4:1 ATM multiplexer/demultiplexer with on-chip FIFO buffering for ATM switch fabric
and transmission applications.
Specialty Memory Products — QSI’s memory products consist of a family of Content-Addressable Memory (CAM)
products.
Logic Products — QSI offers a variety of standard 5V FCT logic devices in 8-, 16-, and 32-bit configurations, as well
as a new line of 3.3V LCX logic devices for mixed-voltage applications.
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Quality Semiconductor
North American Company Profiles
Clock Management Devices — These products include high-performance 3.3V and 5V devices with low skew, low
jitter, and low EMI-noise characteristics, and a new family of advanced programmable skew PLL clock devices
(TurboClock™).
QuickSwitch® Products — The QuickSwitch product line was invented to meet the requirement for zero
propagation delay multiplexing and switching functions in high-performance computing and networking
systems.
QuickScan™ Products — These are derived from QSI’s QuickSwitch product line and add JTAG boundary scan
capabilities.
Analog Switch Devices — This is a new family of devices designed for advanced high-performance video, audio,
and networking applications.
All of QSI’s products are manufactured using advanced CMOS process technologies with geometries ranging
from 0.8µm to 1.5µm. A 0.6µm CMOS process is under development.
Semiconductor Fabrication Facilities
In addition to using its newly acquired fabrication facility in Australia, QSI has foundry partners from which it
receives fabricated wafers. Its current foundry partners include Seiko Instruments, Ricoh, Yamaha, and TSMC. In
1997, approximately 50 percent of QSI’s wafers were manufactured by Seiko and Ricoh.
Quality Semiconductor Australia, Pty, Ltd. (QSA)
8 Australia Avenue
Homebush, NSW, 2140
Australia
Telephone: (61) (2) 763-4105
Fax: (61) (2) 746-1501
Cleanroom size: 5,000 square-feet
Capacity (wafers/week): 1,250
Wafer size: 150mm
Processes: CMOS, BiCMOS
Products: Logic and memory ICs, ASICs, foundry services
Feature sizes: 0.8µm, 1.0µm, 1.2µm, 1.5µm (0.6µm in development)
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QuickLogic
North American Company Profiles
Q UICKLOGIC
QuickLogic Corporation
1277 Orleans Drive
Sunnyvale, California 94089-1138
Telephone: (408) 990-4000
Fax: (408) 990-4040
Web Site: www.quicklogic.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
QuickLogic Corporation • London, England
Telephone: (44) (181) 563-7624 • Fax: (44) (181) 563-0489
Financial History ($M)
Sales
Employees
1994
7
1995
15
1996
30
1997
39
40
90
115
140
Ownership: Privately held.
Company Overview and Strategy
QuickLogic was founded in 1988 by the inventors of the programmable array logic (PAL) device. Today, the
privately-held company designs and sells high density CMOS field programmable gate arrays (FPGAs) featuring
high speeds and low power consumption, along with high productivity design software.
QuickLogic’s FPGAs compete with conventional high density programmable local devices and gate arrays in
applications such as graphics processing, high-speed memory control, video and image processing, DSP support
logic, and data acquisition.
Currently, international sales represent about 40 percent of QuickLogic’s total sales, and the company is working
to increase that number.
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QuickLogic
North American Company Profiles
Management
Irwin B. Federman
E. Thomas Hart
John Birkner
Andrew Chan
H.T. Chua
Michael Burger
Reginal Simpson
Ronald Zimmerman
Scott Ward
Chuck Tralka
Michael Samvelian
Chairman
President and Chief Executive Officer
Vice President, CAE
Vice President, Product Development
Vice President, Technology Development
Vice President, Worldwide Sales
Vice President, Operations
Vice President, Human Relations
Vice President, Engineering
Director, Product Marketing
Director, Marketing
Products and Processes
QuickLogic's programmable ASIC (pASIC) devices are implemented in a submicron CMOS process and deliver
high speeds and low power consumption. All of the company's existing devices are offered in both 5V and 3.3V
power supply versions. They are based on QuickLogic's proprietary metal layer, amorphous silicon ViaLink®
antifuse programming element technology that offers high speeds and high densities (up to 20,000 usable
gates). QuickLogic also supplies a comprehensive set of CAE development tools, operating on PCs and popular
workstation platforms. An open architecture approach allows popular third-party tools to interface to the
company's development environment.
pASIC 1 FPGA Family — Consists of four parts in densities ranging from 1,000 usable gates to 8,000 usable gates
(96 to 768 logic cells) and I/O pin counts ranging from 64 pins to 180 pins. The pASIC 1 devices are based on
high-speed, low-power, two-layer-metal 0.65µm CMOS process technology.
pASIC 2 FPGA Family — Consists of seven parts in densities ranging from 3,000 usable gates to 20,000 usable
gates (192 to 1,440 logic cells) and I/O pin counts ranging from 120 pins to 336 pins. The pASIC 2 devices are
based on high-speed, low-power, three-layer-metal 0.65µm CMOS process technology.
pASIC 3 FPGA Family — consists of five high-performance devices in densities ranging from 12,000 usable gates
with a maximum speed capability of 275MHz. The devices are based on an ultra high speed, low-power, four-layermetal 0.25µm CMOS process.
Semiconductor Fabrication Facilities
QuickLogic does not fabricate its own ICs, it has a manufacturing and technology agreement with Cypress
Semiconductor. However, QuickLogic does perform all FPGA product testing for both companies. To
supplement the capacity it receives from Cypress, QuickLogic established a foundry agreement with TSMC in
1996.
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North American Company Profiles
QuickLogic
Key Agreements
• In July 1997, the company entered into a manufacturing agreement with TSMC enabling the co-development
of a 0.35µm four-layer metal CMOS process for 8-inch wafers using the company’s ViaLink antifuse technology.
The agreement is effective for three years and is renewable annually as a rolling three-year agreement. The
agreement guaranteed certain capacity availability and requires that a minimum percentage of the total number
of wafers required by the company in any one year are purchased from TSMC (excluding wafers purchased
from Cypress and certain other wafer requirements), and requires “take or pay” volume commitments.
• In March 1997, QuickLogic and Cypress terminated the Existing Agreement, and replaced it with a new
arrangement whereby the company’s FPGA products will no longer be second sourced by Cypress. In
exchange for the termination of the Existing Agreement and the reversion of the rights to the intellectual
property developed thereunder to the company, the company paid $4.5 million in cash and agreed to issue
2,603,817 shares of common stock to Cypress, resulting in a charge of approximately $23 million in the first
quarter of 1997. The 2,603,817 shares of common stock to be issued to Cypress are issuable upon the
consummation of an initial public offering by the company or by April 1, 1998, whichever is first. In addition, the
company granted Cypress certain contractual rights as to the shares of the company’s stock held by Cypress,
including the right to sell shares in this offering.
• QuickLogic and Cypress also entered into a new foundry agreement effective through the year 2001. This
agreement guarantees weekly wafer starts at established prices and yields for the company’s pASIC 1 and
pASIC 2 product families, which are fabricated using a 0.65µm three-layer metal CMOS process on 6-inch
wafers. These products will continue to be manufactured at Cypress’ Round Rock, Texas facility, and will
continue to utilize QuickLogic’s proprietary ViaLink amorphous silicon antifuse technology.
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Ramtron
North American Company Profiles
RAMTRON
Ramtron International Corporation
1850 Ramtron Drive
Colorado Springs, Colorado 80921
Telephone: (719) 481-7000
Fax: (719) 481-9170
Web Site: www.ramtron.com
www.edram.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Ramtron K.K. • Yokohama, Japan
Telephone: (81) (45) 473-9372 • Fax: (81) (45) 473-9373
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
1
(23)
15
3
1993
7
(27)
19
3
1994
20
(20)
16
2
1995
29
(2)
11
1
1996
31
(6)
13
1
1997
20.5
(9)
11
1
129
140
121
88
105
130
Ownership: Publicly held. NASDAQ: RMTR.
Company Overview and Strategy
Ramtron was established in 1984 to produce non-volatile memory products by combining the unique
characteristics of ferroelectric materials with conventional integrated circuitry. The company was the first to
manufacture ferroelectric memory devices. It holds 89 U.S. and international patents covering its proprietary
technologies and products and more than 90 are pending.
Ramtron's principal business focus is directed toward the development of the commercial manufacture of
ferroelectric RAMs (FRAMs). The company sites benefits of FRAMs as having fast write times, high write
endurance, non-volatile retention, small form factors, and minimal power consumption. Applications for FRAM
devices include consumer electronics, business machines, communications equipment, test instruments,
industrial controls, and medical equipment.
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North American Company Profiles
Ramtron
Besides ferroelectric RAMs, Ramtron is also involved in the development and sale of very high speed DRAMs the
company calls enhanced-DRAMs (EDRAMs), that are based on standard volatile DRAM technology. In 1995,
Ramtron spun-off its EDRAM business into a wholly owned subsidiary called Enhanced Memory Systems, Inc.
(EMS) which has the sole responsibility of developing EDRAMs.
EDRAMs have been demonstrated to provide SRAM performance with DRAM density in a product that
approaches DRAM pricing. A large portion of the company’s EDRAM business is targeted at replacement of fast
(≤15ns) SRAMs in high-performance systems. As such, EDRAMs applications include a wide variety of the
highest performing systems such as personal computer motherboards, accelerator boards, multiprocessor
systems, disk controllers, embedded computer modules, digital signal processing systems, and video graphic
systems.
Ramtron's business strategy is to manufacture its own products, to license its products on a contract basis to other
companies, and to license its proprietary technologies to a limited number of IC manufacturers in exchange for
royalties and access to advanced manufacturing capabilities. The company has forged alliances with IBM
Microelectronics, Fujitsu, Hitachi, Rohm, Toshiba, Nippon Steel Semiconductor, Samsung, SGS-Thomson, and
Asahi Chemical.
Management
L. David Sikes
Greg B. Jones
Richard L. Mohr
Elliot M. Philofsky, Ph.D.
Donald G. Carrigan
Craig Rhodine
Chairman and Chief Executive Officer
President and Chief Operating Officer
Executive Vice President and Chief Financial Officer
Senior Vice President and Chief Technical Officer
Vice President, Sales and Marketing
Vice President and General Manager, Enhanced Memory Systems, Inc.
Products and Processes
Ramtron first demonstrated a working 256bit FRAM prototype in 1987, and in 1993, began commercial sales of 4K
FRAMs. Commercial 16K and prototype 64K devices were introduced in 1994. Ramtron is pursuing the
development, through its strategic alliance partners, of new high-density (1M and above) FRAM products.
Ramtron's FRAM products are pin compatible with many serial and parallel EEPROMs on the market.
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Ramtron
North American Company Profiles
The nonvolatile storage element in Ramtron's FRAMs is a capacitor constructed from two metal electrodes with a
thin-film ferroelectric material between the transistor and metallization layers of an industry standard CMOS
manufacturing process.
In addition to nonvolatile memories, Ramtron has identified other products in which ferroelectric technology may
be integrated, including microcontrollers, programmable logic devices (PLDs), and radio frequency identification
devices (RFIDs). Ramtron's joint venture affiliate, Racom Systems, Inc., is engaged in the development of
ferroelectric RFID chips and systems.
Enhanced Memory Systems' enhanced-DRAM (EDRAM) products were developed in cooperation with United
Memories Inc. (UMI) and Nippon Steel Semiconductor (then NMB Semiconductor). Colorado Springs-based UMI
was formed by Ramtron and NMB in 1990 (see Key Agreements). IBM is currently the primary manufacturer of
EDRAMs. The company is pursuing additional foundry arrangements.
During 1996, EMS began development of a 133MHz, 16M enhanced synchronous DRAM (ESDRAM) based on
the company’s EDRAM technology. Sample shipments of the device are expected to begin in mid-1998. In early
1997, EMS introduced the Enhanced 10ns family of EDRAMs that features upgraded performance speeds up to
10ns. The 10ns family is manufactured by IBM using 0.6µm process technology.
Semiconductor Fabrication Facilities
Ramtron International Corporation
1850 Ramtron Drive
Colorado Springs, Colorado 80921
Cleanroom size: 11,500 square feet
Capacity (wafers/week): 1,625
Wafer size: 150mm
Processes: Ferroelectric CMOS and standard CMOS
Products: Specialty memory ICs
Feature size: 1.0µm
Ramtron's wafers are also manufactured by Rohm, Nippon Steel Semiconductor, IBM Microelectronics, and Hitachi
(see Key Agreements).
Key Agreements
• In December 1997, Ramtron established a relationship with Asahi Chemical. The companies are currently
working to develop a prototype FRAM-based RF/ID chip.
• In February 1997, Ramtron established a relationship with SGS-Thomson that will cover FRAM production. The
agreement calls for SGS-Thomson to provide CMOS wafers to Ramtron, who will return the wafers to ST as
finished 64K FRAMs. The two companies may extend this relationship in the future to include joint foundry or
technology licensing agreements.
• Ramtron signed a non-exclusive licensing agreement with Samsung. Under the agreement, Ramtron licensed
its FRAM technology to Samsung in exchange for certain licensing and royalty considerations.
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North American Company Profiles
Ramtron
• Ramtron signed a manufacturing agreement with IBM Microelectronics in May 1995 for EDRAM production.
Under the agreement, IBM is serving as a foundry for the production of Enhanced Memory Systems' EDRAMs,
and IBM has a non-exclusive license to sell the devices. The first products manufactured by IBM became
available in October 1996. IBM will also build the company’s 16Mbit ESDRAM.
• Ramtron added Fujitsu to the list of companies with which it maintains joint design and licensing deals for
ferroelectric memories. The two firms are developing a 1M FRAM device, and in June 1996, Fujitsu completed
a feasibility study for 16M FRAMs. In August 1996, the agreement was amended allowing Fujitsu to use FRAM
technology in the development and manufacture of embedded memory FRAM products.
• In late 1994, Ramtron signed a cross-licensing deal with ferroelectric memory competitor, Symetrix, also located
in Colorado Springs. Both companies are jointly developing a 3-volt 16K FRAM based on Symetrix's Y-1
ferroelectric material technology. In addition, Ramtron's ferroelectric technology is now licensable by Symetrix
to its strategic partners, which include Motorola and Matsushita, and Ramtron may license Symetrix's
technology to its partners. The deal also called for Ramtron to purchase half of Symetrix for about $6 million.
• Ramtron and Rohm signed a joint manufacturing, development, and marketing deal in 1993 giving Rohm
access to Ramtron's line of FRAM products. Under the agreement, Rohm is supplying Ramtron with wafers and
is selling completed devices in Japan under both logos. In addition, joint development of new ferroelectricbased circuits, including microcontrollers and custom products will take place. Volume production of FRAM
memories by Rohm is expected to begin in the first quarter of 1998.
• A joint program to integrate Ramtron's ferroelectric technology with Hitachi's DRAM manufacturing process was
established in 1992. In early 1994, Hitachi indicated it was satisfied with its pilot program of testing and
packaging midrange density FRAMs. As a result, Hitachi is working with Ramtron to design and develop 256K,
1M, and 4M FRAMs. Volume production of the 256K FRAM is expected to begin during 1998. Ramtron also
agreed to license all its non-standard and standard FRAM products to Hitachi. Ramtron will rely on Hitachi as a
foundry for the devices since its own fab is not capable of the feature sizes required for the larger memories.
• Toshiba agreed to jointly develop and second-source Ramtron’s FRAMs in densities of 256K and above.
• In 1988, Ramtron and NMB Semiconductor (now Nippon Steel Semiconductor) entered into a product
development and license agreement for conventional 1M and 4M DRAMs. Then, in 1990, the two companies
established United Memories, Inc. (UMI) to design and develop advanced memory devices (not involving
Ramtron's ferroelectric technology) for both companies. In 1995, Ramtron sold all its remaining interest in UMI
to Nippon Steel.
“FRAM” is a registered trademark of Ramtron International Corporation.
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Raytheon
North American Company Profiles
RAYTHEON
Raytheon Company
141 Spring Street
Lexington, Massachusetts 02173
Telephone: (781) 862-6600
Fax: (781) 860-2520
Web Site: www.raytheon.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends December 31
1992
1993
1994
1995
1996
1997
Corporate
Sales
Net Income
9,122
635
9,334
693
10,098
597
11,804
793
12,331
761
13,673
526*
Employees
—
—
—
—
—
119,200
105
105
110
110
115
95
—
—
—
—
1,700
725
Semiconductor
Sales
Employees
*Including restructuring and special charges.
Ownership: Publicly held. NYSE: RTNA/RTNB.
Company Overview and Strategy
Founded in 1922, as the American Appliance Company, the company adopted the Raytheon name in 1925. Early
expertise was in the field of radio tubes and missile guidance. In 1964, Raytheon launched a diversification
program to broaden its business base by adding commercial operations.
Today, Raytheon is focused on three core business segments: defense and commercial electronics, business
aviation and special mission aircraft, and engineering and construction.
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Raytheon
North American Company Profiles
In electronics, Raytheon’s principal business is the design, manufacture, and servicing of advanced electronic
devices, equipment, and systems for governmental and commercial markets. The company has greatly enhanced
its defense electronics business through the acquisition of the Defense Systems and Electronic business of
Texas Instruments and a subsequent merger with the Hughes Aircraft business of Hughes Electronics. Both of
the transactions were completed in 1997. Raytheon estimates that combined 1997 revenues would be on the
order of $20.5 billion, more than $15 billion of which will be in defense and commercial electronics.
Raytheon’s commercial electronics business consists of Raytheon Marine Company, a supplier of marine-related
electronics and systems; Raytheon Microelectronics, which produces GaAs ICs and T/R Modules for military radar,
wireless communications, and satellite applications; and Seiscor Technologies, Inc., a supplier of telephone
transmission equipment. In 1997, Raytheon sold its Semiconductor unit to Fairchild Semiconductor Corporation
and its Switchcraft unit to a company formed by Cortec Group and Switchcraft management.
Management
Raytheon Company
Dennis J. Picard
Peter R. D’Angelo
Chairman and Chief Executive Officer
Executive Vice President and Chief Financial Officer
Microelectronics
Philip W. Cheney
James V. DiLorenzo
Dennis Moraros
James Oakes
Jack Schuss
John Langley
Vice President and Group Executive, Raytheon Electronics
General Manager, Raytheon Microelectronics
Controller
Manager, MMIC Products
Manager, T/R Modules and Wireless Systems
Manager, Wireless Solutions – Raylink™
Products and Processes
GaAs IC
Raytheon Microelectronics manufactures a wide range of RF, microwave, and millimeter-wave GaAs ICs including
cellular/PCS circuits, digital broadcast satellite (DBS) devices, Wireless Local Area Network (WLAN) components
and wideband circuits. Raytheon Microelectronics also offers custom MMIC solutions and integrated T/R Modules
for ground and space-based applications. To date, Raytheon Microelectronics is producing over 500,000 GaAs
MMICs per week from a variety of GaAs processes. These processes include 0.5µm MESFET, 0.5µm E/D
MESFET, 0.5µm D/MMIC, 0.125 and 0.5µm PHEMT. Additionally, an HBT process is in transition from its 3-inch
wafer R&D line into their 4-inch wafer production line.
T/R Modules
In 1992, Raytheon Microelectronics began developing MMICs and T/R Modules for the U.S. Army’s Ground Based
Radar (GBR) program — to date, over 68,000 units were built for this system. Since then Raytheon
Microelectronics has designed and produced over 35,000 T/R modules for the antennas of the IRIDIUM® and
Globalstar™ communications systems.
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Raytheon
North American Company Profiles
Raylink™
In 1997, Raytheon Microelectronics launched its own Wireless Local Area Network PC Card based on devices
made in its fab and sold previously to other PC Card Manufacturers.
Semiconductor Fabrication Facilities
Raytheon Microelectronics
362 Lowell Street
Andover, Massachusetts 01810
Telephone: (978) 470-9000
Cleanroom size: 20,000 square feet
Capacity (wafers/week): 1,000,000
Wafer size: 100mm
Processes: GaAs
Products: MMICs, Discretes, and T/R Modules
Feature sizes: 0.125µm, 0.25µm, and 0.25µm
Raytheon Semiconductor
Hartwell Road
Bedford, Massachusetts 01730
Telephone: (781) 274-5000
Cleanroom size: 12,000 square feet
Capacity (wafers/week): 1,000
Wafer size: 100mm
Processes: NMOS, CMOS, bipolar
Products: Logic and custom ICs
Feature sizes: 0.5µm-1.0µm
Key Agreements
•
In October 1997, Raytheon Company announced that the Department of Justice had approved the merger of
Hughes Electronics’ defense operations and Raytheon.
Raytheon announced in January 1997 that it had entered into a definitive agreement with General Motors’
Hughes Electronics Corporation to bring about the merger of the Hughes defense operations (Hughes
Aircraft) and Raytheon. The merger, once completed will create a combined company of more than 120,000
employees, with approximately $20 billion in sales, on a 1996 pro-forma basis, of which over $13 billion was in
defense electronics.
•
Raytheon has recently agreed to supply high volumes of cellular/PCS upconverters and power amplifiers to
several large mobile phone manufacturers.
•
The Andover, MA facility recently announced a “2X” wafer fabrication plan to double its 4-inch GaAs capacity
from 500,000 to 1,000,000 ICs per week and is finalizing plans for a new 6-inch GaAs wafer fab to be
completed in late 1999 and operational in the year 2000.
2-378
Real 3D
North American Company Profiles
REAL 3D
Real 3D
12506 Lake Underhill Road
Orlando, Florida 32825
Telephone: (407) 306-7302
Fax: (407) 306-3358
Web Site: www.real3d.com
Email: real3d@real3d.com
IC Manufacturer
Founded: 1996
Employees: 180
Ownership: Jointly owned by Lockheed Martin (80 percent) and Intel (20 percent).
Company Overview and Strategy
Real 3D is a leading provider of advanced computer graphics technology, focused on providing graphics
technology solutions to the portable, desktop, workstation, arcade and high-end professional markets. The
Company designs and manufactures custom 3D graphics chips and boards, arcade graphics chips and boards for
Sega, high-end image generation systems, and other 3D solutions.
The Company was formed in January 1996, by Lockheed Martin, with a mission of bringing proven 3D graphics
technology to the commercial marketplace. In December 1997, Intel purchased a 20 percent minority stake in Real
3D with Lockheed Martin maintaining majority ownership. Real 3D technology foundation comes from more than
30 years experience developing advanced 3D combat simulators and astronaut training systems.
Real 3D has an ongoing technology assistance and license agreement in place with Sega Enterprises Ltd. for the
development of arcade graphics chips and boards. Real 3D has been working with Sega since 1992, and their ICs
have been part of more than 200,000 arcade games chipped by Sega.
Management
Gerald W. Stanley
Joe Mazzarella
Stephen Teicher
Ralph Nichols
President
Vice President, Sales and Marketing
Vice President, Engineering
Vice President, Products
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Real 3D
North American Company Profiles
Products and Processes
Real 3D’s product line includes graphics boards, high-end image generators, and a 3D laser scanning system
called RealScan 3D™. The company also selectively licenses its 3D graphics technology on a royalty-bearing
basis to strategic technology partners. Real 3D offers a broad range of products, including:
•
•
•
•
Arcade graphics chips / boards for Sega
Graphics chips and boards
PRO-1000 Professional Series image generators
RealScan3D
Key Agreements
•
In August 1997, Real 3D and MetaCreations announced an agreement for Real 3D to become a licensee of
MetaCreations’ Real Time Geometry technology for the manufacture and distribution of a real-time, threedimensional scanning device called RealScan 3D™. The scanning hardware and software technology,
originally developed by MetaCreations’ Real Time Geometry labs, significantly reduces the cost while speeding
up the process of capturing texture mapped models of complex objects such as the human face.
•
In April 1997, Real 3D and Sense8® Corporation announced an agreement to provide WorldToolKit support
for Real 3D’s PRO-1000 series of graphics engines. WorldToolKit, the industry’s most widely used visual
simulation/virtual reality software toolkit, will significantly expand the capability for PRO-1000 users to quickly
and efficiently build custom real-time applications. Sense8 Corporation is the world’s leading provider of
commercially viable real-time interactive 3D/virtual reality solutions.
•
In March 1997, Real 3D and MetaTools, Inc., announced an agreement to develop and license MetaTools’ Real
Time Geometry technology into a broad range of Real 3D’s products. Joint development team initiatives will
begin immediately with co-located engineering teams working in MetaTools’ Real Time Geometry lab facility in
Princeton, NJ, and Real 3D’s Orlando, Florida, development labs. Initial funding for the joint development
effort will be provided by Real 3D. MetalTools, is a company that designs develops, publishes, markets and
supports software products for the creation, editing and manipulation of computer graphic images, digital art
and Internet/on-line content for both professionals and consumer applications.
•
In February 1998, Real 3D and Synopsys, Inc., announced an agreement to collaborate together on the
development of ASIC design verification tools scheduled for release by Synopsys. As part of the agreement,
Real 3D may participate in Alpha/Beta testing of the new tools, providing Synopsys with extensive PowerUser
feedback on key features and product performance.
•
In May 1996, Real 3D and Intel announced they had formed a technology agreement under which the two
companies would co-develop a 2D/3D/video graphics chip using Intel’s Accelerated Graphics Port interface
specification. The new chip and AGP interface, which Real 3D also helped design, brings a new level of
graphics performance to the PC platform. The new chip, called the Intel740 debuted in February 1998.
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North American Company Profiles
•
Real 3D
Real 3D is co-developing with Chips & Technologies, Inc. a 2D/3D/video graphics chip for portable PCs. Chips
and Technologies now a division of Intel, is the world’s leading supplier of graphics controllers and accelerators
to the portable computer marketplace. The new chip will bring a new level of graphics performance to the
portable PC platform. The new chip is set to debut in 1998.
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Rendition, Inc.
North American Company Profiles
RENDITION , INC .
Rendition, Inc.
999 East Arques Avenue
Sunnyvale, California 94086
Telephone: (408) 822-0100
Fax: (408) 822-0199
Web Site: www.rendition.com
Fabless IC Supplier
Founded: 1993
Regional Offices/Representative Locations
Europe:
TOPAS Electronic GmbH • Hannover, Germany
Telephone: (49) (0) 5-11-9-68-64-20 • Fax: (40) (0) 171-4-10-90-33
Asia:
Macnica, Inc. • Yokohama City, Japan
Telephone: 81 (45) 939-6130 • Fax: 81 (45) 939-6131
MAXCOM • Seoul, Korea
Telephone: (02) 843-6233 • Fax: (02) 843-6336
MaxMega Electronics Pte., Ltd. • Singapore
Telephone: (65) 7691118 • Fax: (65) 7692221
Ultima Electronics Corp. • Taipei, Taiwan, R.O.C.
Telephone: (02) 843-6233 • Fax: (02) 843-6336
Ownership: Privately held.
Company Overview and Strategy
Rendition Inc. is a leading developer of integrated 2D/3D graphics accelerators for the personal computer market.
The company’s products enable PC-based entertainment and multimedia users to enjoy the next generation of
3D graphics.
Management
Mike Boich
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President and Chief Executive Officer
North American Company Profiles
Rendition, Inc.
Products and Processes
Verite V1000 is a single chip with 2D/3D graphics engine, GUI accelerator, digital video accelerator and VGA
engine. This product has an embedded RISC core with a hard-wired pixel pipeline with a 64-bit EDO DRAM
memory interface. The Verite™ is used in the personal computer market for add-in graphics cards and OEM
motherboard implementation.
The Rendition Verite V2200, based on the Verite architecture of V1000, integrates a color palette, three DACs,
dual PLLs, and a hardware cursor on-chip. It is fabricated in a 0.35 micron 3-metal CMOS process. Verite V2200s
RISC processor has a number of new graphics instructions to convert floating point to arbitrary radix integer in a
single clock cycle that improves direct 3D performance. Two new features is the triangle engine that is used for
rendering triangles asynchronously to the setup and pixel rendering process and fill engine for fast 2D memory
products.
The Verite V2100 function is identical to the V2200, but it runs at a slower speed internally, and supports only a
4Mb configuration. The V2100 supports the same 3D features, and is 100 percent software compatible with the
V2200.
2-383
RF Micro Devices
North American Company Profiles
RF MICRO DEVICES (RFMD)
RF Micro Devices, Inc. (RFMD)
7625 Thorndike Rd.
Greensboro, NC 27409-9421
Telephone: (336) 664-1233
Fax: (336) 664-0454
Web Site: www.rfmd.com
Email: info@rfmd.com
IC Manufacturer
Financial History ($K), Fiscal Year Ends March 31
Sales
Product sales
Engineering revenue
Total revenues
Net Income (loss)
R&D Expenditures
Employees
1993
1994
1995
1996
1997
1998
—
256
256
(1,912)
1,216
574
412
986
(2,846)
1,553
1,254
434
1,688
(4,122)
2,836
8,212
1,303
9,515
(5,188)
4,245
27,852
950
28,802
1,652
6,178
44,095
1,255
45,350
(523)
8,761
—
—
—
67
97
230
Ownership: Publicly held. NASDAQ: RFMD.
Based on shipment sales, RFMD has become a leading commercial supplier of GaAs HBT RF integrated circuits.
RFMD currently derives a majority of its revenues from the sale of custom-designed products. However, the
Company's strategy is to maintain a balanced product mix between standard and custom-designed products so as
to reduce the Company's reliance on individual customers and product orders. TRW owns approximately 30
percent of RFMD’s stock.
RFMD has made a substantial turnaround so far in fiscal 1998. Revenues rose 66 percent over fiscal 1997 to
$32.7M for the nine months ended 12/27/97, and net income rose 293 percent to $3.1M. Results were
attributed to increased shipments of RFMD's small signal devices used in CDMA handsets and GaAs HBT power
amplifiers for cellular and PCS handsets.
Company Overview and Strategy
RF Micro Devices was founded in 1990, to develop IC solutions for the wireless communications industry. The
company is a spin-off from electronics leader and signal processing pioneer, Analog Devices, Inc.
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RF Micro Devices
North American Company Profiles
RFMD currently designs, develops and markets proprietary radio frequency integrated circuits (RFICs) for wireless
communications applications such as cellular and PCS, cordless telephony, wireless LANs, wireless local loop,
industrial radios, wireless security and remote meter reading. The company offers a broad array of products,
including amplifiers, mixers and modulators/demodulators, that represent a substantial majority of the RFICs
required in wireless subscriber equipment.
RFMD’s GaAs HBT power amplifiers and small signal devices have been designed into advanced subscriber
equipment manufactured by leading OEMs such as QUALCOMM, Nokia, Hyundai, Samsung, Motorola and LG.
RFMD’s objective is to be the leading worldwide supplier of RFICs for a broad range of both standard and customdesigned RFICs for commercial wireless applications. RFMD’s strategy consists of the following key elements:
focus on wireless markets; offer a wide range of RF products in order to position itself as a "one-stop" solution for
its customers' RFIC needs; leverage its GaAs HBT capabilities; expand production capacity; and maintain a
balanced product mix. However, RFMD shifted its strategy in late 1997, to a diversified technology base away from
just GaAs, as evidenced by the IBM agreement in March 1998, noted below under Key Agreements. RFMD
expects GaAs sales to be equaled by silicon sales in the future. The shift in strategy was moreover a break from
RFMD’s technology-driven approach to a market-driven approach.
Management
William J. Pratt
David A. Norbury
Powell T. Seymour
Jerry D. Neal
William A. Priddy, Jr.
Arthur E. Geissberger
Chairman of the Board and Chief Technical Officer
President, Chief Executive Officer and Director
Vice President, Operations and Secretary
Vice President, Sales and Marketing
Vice President, Finance and Treasurer
Vice President, Wafer Fabrication Operations
Products and Processes
RFMD’s products include digital quadrature modulators, quadrature demodulators, power amplifiers, LNA/mixers,
and attenuators.
Following is a sampling of RFMD’s products.
Product category: Power amplifiers
No. of products: 11
Fabrication technology: Silicon, GaAs MESFET, GaAs HBT
End user devices: Cellular and PCS handsets, cordless phones, industrial radios, CATV line amplifiers.
Product category: Quadrature modulators/demodulators
No. of products: 15
Fabrication technology: Silicon, GaAs MESFET, GaAs HBT
End user devices: Cellular and PCS handsets, cellular and PCS base stations, cordless phones,
wireless LAN cards.
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RF Micro Devices
North American Company Profiles
Product category: Low noise amplifiers/mixers
No. of products: 10
Fabrication technology: Silicon, GaAs MESFET, GaAs HBT
End user devices: Cellular and PCS handsets, cordless phones, wireless security systems.
Product category: IF components
No. of products: 10
Fabrication technology: Silicon
End user devices: Cellular and PCS handsets, cordless phones, industrial radios.
Product category: Gain blocks
No. of Products: 10
Fabrication technology: Silicon, GaAs MESFET, GaAs HBT
End user devices: Cellular and PCS handsets, cordless phones, instruments.
Product category: Transceivers
No. of products: 4
Fabrication technology: Silicon
End user devices: Wireless meter reading, cordless phones.
Product category: Attenuators
No. of products: 3
Fabrication technology: GaAs MESFET
End user devices: Cellular and PCS handsets, cellular and PCS base stations, instruments.
RFMD offers products fabricated under three distinct process technologies: GaAs heterojunction bipolar transistor
(HBT), GaAs MESFET and silicon bipolar transistor. (See deal with IBM under Key Agreements below for further
details on RFMD’s silicon processes). The Company believes that for certain applications, GaAs HBT devices offer
advantages in terms of linearity, efficiency, reduced system complexity and size. RFMD offers SOICs in 14-, 16-,
and 20-pin configurations, with other packaging options available. The company offers comprehensive
simulation, including PSPICE, HSPICE, Touchstone and Harmonica proprietary modeling. IC layout and design
rules checking (DRC) are accomplished using ICED. A proprietary layout versus schematic (LVS) provides
parametric feedback and 100 percent circuit checking. RFMD also uses auxiliary programs to include filter design,
matching section, microstrip design, and thermal analysis.
RF Micro Devices integrated circuits can operate from a single "digital" type power supply and provide digital
interfaces for digitally controlled functions.
The RF mixed-signal approach allows RFMD to design ICs that integrate with DSP technology to enable a wide
range of wireless products that had previously been impractical because of performance, size, or cost limitations.
2-386
North American Company Profiles
RF Micro Devices
RF Micro Devices serves multiple market segments for radio frequency wireless product application. These
markets range from cellular telephony (both analog and digital) to wireless security devices including:
• Cellular (digital American and European)
• Personal Communication Services (PCS)
– Portable Phones (shirt pocket phones)
• Digital Cordless Telephony (900MHz)
– Residential
– Wireless Private Automatic Branch Exchange (WPABX)
• Wireless Local Area Networks (WLAN)
• Wireless Security Systems
• Wireless Computing
Other applications served by RF Micro Devices include private mobile radio (PMR), VSAT, wireless data terminals,
wireless locks, global positioning system (GPS), and wide area networks (WAN).
RFMD experienced a major set-back in its development of a Code Division Multiple Access (CDMA) chipset for
QUALCOMM, its largest customer prior to May 1997, after low manufacturing, assembly and test yields resulted in
high material scrap. RFMD’s inability to meet requested delivery times and quantity requirements, made
QUALCOMM decide to internally produce its components and to look to other sources to replace all products
purchased from RFMD.
RFMD offers GaAs MESFET and silicon components through a delivery strategy called Optimum Technology
Matching (OTM) to complement its GaAs HBT products. OTM allows RFMD to offer RFIC solutions, on a
component by component basis, that best fulfill each OEM's performance, cost and time-to-market requirements.
Semiconductor Fabrication Facilities
To meet demand for the RFMD's GaAs HBT products, TRW is expanding its GaAs manufacturing facility and RFMD
is constructing an approximately 50,000 square foot facility to fabricate four-inch GaAs HBT wafers. RFMD
believes that operating its own GaAs HBT wafer fabrication facility will improve its ability to respond to customer
demand for GaAs HBT products and will provide it with greater opportunities to enhance product and process
quality and reliability. RFMD expects the full transfer of process know-how and production setup from TRW will
take about two years.
RFMD faces particular risks since TRW fabricates three-inch MBE wafer starting material and three-inch GaAs HBT
wafers at its facility, while RFMD plans to fabricate four-inch wafers at its facility. Hence, in addition to replicating
TRW's complex proprietary manufacturing processes, RFMD must be able to adapt such processes from threeinch wafers to four-inch wafers, which involves a number of technical hurdles including the development of new
back-side wafer thinning processes for the larger wafers. RFMD has not yet developed these processes.
Nevertheless, RFMD plans to be operating its new facility at commercial levels (i.e., capable of producing
approximately 2,500 wafers per year) in the second half of 1998.
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RF Micro Devices
North American Company Profiles
Key Agreements
•
In June 1998, RF Micro Devices, Inc. opened its Gallium Arsenide Heterojunction Bipolar Transistor (GaAs
HBT) fabrication facility. The opening completes the transfer of TRW’s proprietary GaAs HBT process,
exclusively licensed to RFMD for commercial wireless applications below 10 GHz. The TRW and RFMD
processes are the same with the exception of the wafer size, with TRW’s being three-inch and RFMD’s being
four-inch. Commercial production has already begun, with the new fab having produced more than one million
RFMD components.
TRW and RFMD have recently agreed to a long-term commitment wherein TRW will continue to supply RFMD
fully processed three-inch GaAs HBT wafers and four-inch Molecular Beam Epitaxial (MBE) starting material
wafers to augment RFMD’s internal capability.
•
TRW is currently manufacturing all of RFMD's GaAs HBT products using TRW's proprietary technologies and
has granted RFMD a license to use its GaAs HBT process to design products for commercial wireless
applications. TRW is required to deliver certain minimum quantities of GaAs HBT wafers to RFMD until
December 31, 2000. Although TRW allocated a substantial portion of its commercial GaAs HBT wafer
production, RFMD nevertheless has experienced significant difficulty obtaining sufficient production capacity
to meet demand for some its GaAs HBT products. Although RFMD plans to begin fabricating its own GaAs HBT
wafers in commercial quantities in the second half of 1998, using technologies licensed from TRW, they expect
to remain dependent upon TRW to satisfy GaAs HBT production requirements in the future.
•
RFMD has a joint agreement with TRW and Nokia Mobile Phones Ltd. to cooperate to develop and supply
Nokia with RFICs that are manufactured using TRW's GaAs HBT processes. The arrangement contemplates
that RFMD and Nokia will negotiate separate agreements to address the development and supply of each
product. RFMD has also agreed to provide Nokia with access to certain RFIC technologies and to their GaAs
HBT foundry and Nokia has agreed to provide RFMD with rights to bid for and supply Nokia's requirements for
certain RFICs
•
In March 1998, RFMD signed a multi-year Master Purchase Agreement with IBM’s Microelectronics Division that
provides for RFMD's expanded development, manufacture and sale of custom RF ICs using IBM's advanced
Blue Logic silicon process technology. RFMD has developed more than 40 RFICs using IBM's silicon
technology. These products cover three major application groups: CDMA telephones (both 800MHz and PCS
applications), transceivers for ISM bands up to 2.5GHz, and general purpose amplifiers. Most of these
components operate on 3.0 volts making them compatible with the latest wireless applications. RFMD's silicon
chips are typically very small, ranging from 0.5-1.5 square millimeters. The small size of the chip processed on
IBM's 8 inch silicon process results in maximum cost efficiency.
•
In August 1998, RF Micro Devices expanded their multi-year Master Purchase Agreement with IBM (outlined
above). The expansion enables RFMD to develop and manufacture for sale both custom and standard RFICs
using IBM’S advanced BI CMOS 5S process.
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Rochester Electronics
North American Company Profiles
ROCHESTER ELECTRONICS
Rochester Electronics Inc.
10 Malcolm Hoyt Drive
Newburyport, Massachusetts 01950
Telephone: (508) 462-9332
Fax: (508) 462-9512
Email: sales@roelec.com
Web Site: www.rocelec.com
Fabless IC Supplier/Distributor
Founded: 1981
Ownership: Privately held.
Regional Offices/Representative Locations
Europe:
Rochester Electronics, Ltd. • Luton, Bedfordshire, England
Telephone: (44) (1582) 488680 • Fax: (44) (1582) 488681
Company Overview and Strategy
Rochester Electronics is a source manufacturer and distributor of discontinued semiconductors. As of 1997,
Rochester’s list of authorizations include AMD, Allegro, Altera, Analog Devices, Harris Semiconductor, Intel,
International Rectifier, Microchip, National Semiconductor, SMC, Texas Instruments, and Xilinx. The Company
offers entire discontinued lines, both commercial and military, from manufacturers that reduce support for old parts
to rationalize scarce manufacturing and service resources.
Management
Curt Gerrish
President
Products and Processes
Rochester’s production device list includes over 4,000 part types which are manufactured from the original
suppliers’ die and tooling. Its product lines include SRAMs, DRAMs, VRAMs, PROMs, logic chips, and linear
devices. The company also stocks unfinished wafers and original mask sets.
Semiconductor Fabrication Facilities
Rochester uses more than 30 foundries to manufacture its product lines. In 1997, the company completed the
construction of a 3,600 square foot test and burn-in facility in Newburyport, Massachusetts.
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Rockwell Semiconductor Systems
North American Company Profiles
ROCKWELL S EMICONDUCTOR S YSTEMS
Rockwell Semiconductor Systems
Rockwell International Corporation
4311 Jamboree Road
P.O. Box C
Newport Beach, California 92658-8902
Telephone: (714) 221-4600
Fax: (714) 221-6128
Web Site: www.rss.rockwell.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Rockwell International Japan Co., Ltd., Semiconductor Systems • Shibuya-ku, Tokyo, Japan
Telephone: (81) (3) 5371-1520 • Fax: (81) (3) 5371-1501
Europe:
Rockwell Semiconductor Systems SARL • Valbonne, Sophia Antipolis Cedex, France
Telephone: (33) (4) 93-00-33-35 • Fax: (33) (4) 93-00-33-03
Asia-Pacific:
Rockwell International Hong Kong, Ltd., Semiconductor Systems • Wanchai, Hong Kong
Telephone: (852) 2827-0181 • Fax: (852) 2827-6488
Fiscal Year Ends September 30
Financial History ($B), [except for Net Income/Capital Expenditures ($M)].
Corporate*
Sales
Net Income
Semiconductor Systems
Sales
Capital Expenditures
Employees
(Semiconductor Systems)
1992
1993
1994
1995
1996
1997
5,856
483
3,657
240
4,193
285
5,937
368
7,228
451
7,762
644
431
—
530
—
691
151
875
175
1,593
414
1,579
350
—
—
1,695
4,000
4,500
6,000
*Restated to reflect continuing operations. Rockwell sold its Graphics Systems and Aerospace and Defense
Businesses in 1996. Rockwell also spun-off their automotive business in 1997.
Ownership: Publicly held. NYSE: ROK.
2-390
North American Company Profiles
Rockwell Semiconductor Systems
Company Overview and Strategy
Rockwell International Corporation was incorporated in 1928 and is engaged in the research, development, and
manufacture of diversified products, including industrial automation equipment and systems, avionics products
and systems and related communications technologies primarily for commercial and military aircraft and defense
electronics systems, system-level semiconductor chipsets for personal communication electronics markets, and
automotive components and systems.
Management
Rockwell International Corporation
Dwight Decker
President
Moiz Beguwala
Vice President and General Manager, Personal Computing Division
Anthony C. D’Augustine
Vice President and General Manager, Digital Infotainment Division
Raouf Halim
Vice President and General Manager, Network Access Division
Ian Olsen
Vice President and General Manager, Personal Imaging Division
Vijay Parikh
Vice President and General Manager, Wireless Communications Division
John Algeo
Vice President, Operations
Lewis Brewster
Vice President, Worldwide Sales
Tony Kalas
Vice President, Finance
James Spoto
Vice President, Platform Technologies
Bill Tipton
Vice President, Human Resources
Krish Dharma
Executive Director, Supply Chain Management
Ashwin Rangan
Executive Director, Business Process Re-Engineering
and Information Technology
Jeffrey Cox
Director, Communications Programs
Rockwell Semiconductor Systems
Don Davis
Chairman and Chief Executive Officer
Don Beall
Chairman of the Executive Committee
Mike Barnes
Senior Vice President, Finance and Planning and Chief Financial Officer
Bill Calise
Senior Vice President, General Counsel and Secretary
Bill Fletcher
Senior Vice President, Technology and Business Development
Earl Washington
Senior Vice President, Corporate Marketing and Communications
Denny Popovec
Vice President and Treasurer
Mike Bless
Vice President, Corporate Development and Planning
Lee Shull
Vice President, Investor Relations
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Rockwell Semiconductor Systems
North American Company Profiles
Products and Processes
Rockwell Semiconductor Systems focuses on system-level semiconductor solutions primarily in the development
and application of mixed-signal computing technologies. Rockwell built its first modem in 1995.
Today, Rockwell is a leading worldwide manufacturer of advanced voice, fax and data communications technology,
and purportedly has the world’s largest installed base of data modems at more than 200 million. Rockwell’s share
of this market has represented an important beachhead for the company during its rapid and continuing expansion
into a number of key personal communications electronics markets.
Personal Computing Division Products
Focus: The PC platform, including products for desktops, notebooks and PDAs.
Through its Personal Computing Division, Rockwell serves the PC market. Modem and speakerphone are seen
as key functions of the evolving multimedia PC. Modem functionality continues to converge with video
capture/display functionality as modem applications expand into telephony, LAN connectivity, conferencing and
audio. Over the last 40 years, Rockwell has shipped more than 200 million modems worldwide.
Rockwell opened the final chapter in its roll-out of 56Kbps modem technology with the International
Telecommunications Union’s (ITU’s) February 1998 release of a final set of specifications, V.90, that are expected
to be ratified as a worldwide standard later in the year.
An overwhelming majority of the key components contained in the ITU’s V.90 specifications use technologies that
were either invented by Rockwell or supported by the company and other backers of Rockwell’s K56flex modem
technology. This has simplified Rockwell’s transition to the new specifications, allowing Rockwell to immediately
begin shipping to its customers a family of chipsets that include both V.90 and the company’s popular K56flex
technology.
Network Access Division Products
Focus: Central site modems, hubs/routers/switches, analog/digital access multiplexors.
Rockwell formed its Network Access Division in April 1997, to focus on tying together all of the company’s other
strategic product platforms. Network access systems are used to connect cellphones, facsimile machines, PCs
and networks to the Public Switched Telephone Network (PSTN), to the Internet, to Intranets and other highspeed corporate networks, to cellular networks, and to cable networks.
Rockwell’s acquisition of Brooktree Corporation in 1996 immediately established a broad family of high-speed
digital data communications products spanning the company’s existing central site modems and Brooktree’s High
Bit Rate Digital Subscriber Line (HDSL) and other T1/E1 products, and packet-switched products for
Asynchronous Transfer Mode (ATM) and Switched Multi-Megabit Data Services (SMDS).
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North American Company Profiles
Rockwell Semiconductor Systems
Personal Imaging Division Products
Focus: Products for facsimiles, printers, multifunction devices and digital imaging systems.
Personal imaging systems represent one of the fastest growing market segments in the personal communications
electronics arena. These systems include fax modems and fax machines, which perhaps rank only behind the
telephone as the world’s most popular communication device. Rockwell’s low-power chipsets for fax modems
frequently are chosen by Japanese and other Pacific Rim manufacturers of fax machines.
Rockwell formed the Personal Imaging Division in October 1997. The division is chartered with strengthening
Rockwell’s position in the fax modem chipset marketplace and using it as a springboard for adding new products
that integrate Rockwell technology into high-performance multifunctional peripheral solutions for the home and
office.
Wireless Communications Division Products
Focus: Complete chipset and component solutions for 900MHz digital spread spectrum cordless telephones,
Global Positioning System (GPS) receivers, and PCS and cellular handsets.
Rockwell’s Wireless Communications Division focuses on a market for wireless communications devices that is
experiencing unprecedented growth. At the beginning of 1997, there were more than 140 million subscribers to
wireless systems throughout the world, increasing by 3.5 million per month. There is a growing demand for
wireless consumer products that include cordless phones, cellular/PCS handsets and other wireless
communications devices, including GPS receivers.
Rockwell’s goal is to provide complete antenna-to-microphone chipsets for a wide variety of standards and user
applications. The Wireless Communications Division currently offers a broad range of full-system semiconductor
solutions. They start with a complete product line delivering advanced features for 900Mhz-digital spread
spectrum cordless telephones, a complete system solution for GSM, and continue with a PHS chipset which
maintains the best-in-class talk and standby times. Rockwell also offers GPS receiver chipsets and modules, and
high efficiency power amplifier products for digital cellular and PCS applications. Future offerings will include radio
modules and complete chipset solutions for a wide variety of digital cellular and PCS applications, such as the
Digital European Cordless Telephones (DECT), and CDMA standards.
Digital Infotainment Division Products
Focus: Digital set-top boxes/games, digital VCR/DVD-HDTV peripherals; Internet terminals.
Rockwell formed its Digital Infotainment Division in April 1997. Digital Infotainment, or the delivery of digital video
from a storage device or via satellite or cable transmission, represents a major platform opportunity for Rockwell.
The market for digital interactive information and entertainment products, digital TV receiver products and other
digital media products is expected to grow rapidly during the balance of this decade and beyond. These products
will require a variety of silicon-based functions: MPEG-related circuitry, POTS or xDSL modem technology,
broadband wireless and cable demodulation products, tuners and other MCU and video/graphics processing
technology, and DVD channel and servo components. This silicon content — excluding RAM and x86 processors
— is expected to reach upwards of $50 per system.
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Rockwell Semiconductor Systems
North American Company Profiles
Rockwell established its first toehold in the digital infotainment market with a family of video encoder and decoder
products and core multimedia processing technology that the company acquired along with Brooktree
Corporation in September 1996.
The acquisition of ComStream’s Hi Media Division expanded Rockwell’s product portfolio to include broadband
wireless and cable demodulation products and tuners. The Hi Media division has a pioneering record in
broadband satellite and cable transmission technologies, and at the time of the acquisition had shipped more than
three million demodulation ICs to leading set-top box manufacturers.
Semiconductor Fabrication Facilities
Between 1994 and 1996, Rockwell invested more than $400 million in its Newport Beach fabrication facility to
more than double monthly wafer starts. The expansion added approximately 40,000 square feet of cleanroom
space and increased capacity to 25,000 eight-inch 0.5 micron wafers per month. The facility handles eight-inch
wafers (200mm) using 0.5 micron process technology, and process flow goes from polished silicon wafers
through wafer probe test in Newport Beach, to Mexicali package assembly and test of multi-die packages.
On February 8, 1996, Rockwell began work in Colorado Springs, Colorado, on the first phase of a $1.3 billion
project to expand a wafer fabrication facility that the company purchased from United Technologies
Microelectronics. This facility will ultimately comprise two silicon wafer fabrication modules as part of a planned
450,000 square foot MegaFab capable of handling 30,000 wafers per month using 0.25 micron process
technology. The exterior shell is expected to be completed in 1998. Rockwell has delayed the schedule for
launching full-volume production here until late 1999.
Rockwell uses a combination of internal manufacturing resources and external foundry resources depending on
cost and availability factors. In early 1994, Rockwell executed an agreement to acquire additional 200mm wafer
capacity through a minority equity investment in Chartered Semiconductor Manufacturing, Pte. Ltd. of Singapore.
Under the agreement, Rockwell is guaranteed capacity in Chartered’s new $1.3 billion Fab 2 facility in Singapore.
The new plant began operations in late 1995.
In early 1996, Rockwell and SubMicron Technology announced a long-term technology transfer and wafer supply
agreement. Rockwell has transferred its 0.5 micron and 0.35 micron CMOS wafer processes and SubMicron has
guaranteed wafer capacity at its new $1.3 billion, 200mm facility near Bangkok, Thailand.
Rockwell Semiconductor Systems
Digital Communications Division
4311 Jamboree Road
Newport Beach, California 92660
Fab 4
Cleanroom size: 15,000 square feet
Capacity (wafers/week): 3,750
Wafer size: 125mm
Process: CMOS
Products: MPRs, MPUs, DSPs, ASICs,
memory ICs, linear ICs.
Feature sizes: 0.8µm-2.0µm
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Rockwell Semiconductor Systems
Digital Communications Division
4311 Jamboree Road
Newport Beach, California 92660
Fabs 5 and 6
Cleanroom size: 40,000 square feet
Capacity (wafers/week): 6,250
Wafer size: 200mm
Process: CMOS
Products: MPRs, DSPs,
Feature sizes: 0.35µm-0.65µm
North American Company Profiles
Rockwell Semiconductor Systems
1575 Garden of the Gods Road
Colorado Springs, Colorado 80907-3486
Fab 7
Cleanroom size: 25,000 square feet
Capacity (wafers/month): 750
Wafer size: 125mm
Process: CMOS
Products: Linear ICs, ASICs, MPRs, MPUs
Feature sizes: 0.8µm, 1.0µm
(Purchased from UTMC in 1995).
Rockwell Semiconductor Systems
Rockwell Semiconductor Systems
1575 Garden of the Gods Road
Colorado Springs, Colorado 80907-3486
Fab 8
Cleanroom size: 65,000 square feet (Class 1)
Capacity (wafers/month): 3,750
Wafer size: 200mm
Process: CMOS
Products: MPRs, MPUs, DSPs, ASICs
Feature size: 0.35µm (future: 0.25µm and 0.18µm)
(Operations to start in late 1999).
Rockwell Semiconductor Systems
Microelectronic Technology Center
2427 West Hillcrest Drive
Newbury Park, California 91320
Telephone: (805) 375-1256
Capacity (wafers/week): 400
Wafer size: 100mm
Processes: HBT, MESFET GaAs
Products: ASICs, receivers, power amps,
high-speed digital circuits.
Feature sizes: 0.5µm-2.0µm
Key Agreements
• In March 1998, Rockwell and PairGain Technologies, Inc. announced an agreement whereby Rockwell will
license PairGain’s DMT ADSL (Discrete Multi-Tone Asymmetric Digital Subscriber Line) Falcon chip, the
industry’s first 8Mbps single-chip DMT ADSL processor. The companies will also jointly develop a family of
ADSL and G.lite devices.
Terms of the agreement call for Rockwell to compensate PairGain via licensing and royalty fees for exclusive
rights to its DMT ADSL technology over a two year period. The agreement also calls for an intellectual property
exchange between the two companies and a close collaboration on the development of future, highly
integrated ADSL and G.lite devices.
• In early 1997, Rockwell licensed the ARM810 and the ARM7TDMI “Thumb” 32-bit RISC microprocessor core
technologies of Advanced RISC Machines Ltd., as well as a core to be developed in the future. Rockwell will
integrate the cores into a variety of communications products.
• In 4Q96, Rockwell and Lucent Technologies jointly announced plans to make the two companies’ 56Kbps
modem products interoperable.
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Rockwell Semiconductor Systems
North American Company Profiles
• In July 1995, Rockwell signed a five-year foundry agreement with IMP, Inc. for the wafer fabrication of CMOS
mixed-signal ICs.
• Rockwell is teamed with McCaw Cellular Communications to develop and provide a Cellular Digital Packet Data
(CDPD) chipset that enables portable PCs to send digital data over cellular phone networks.
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Ross Technology
North American Company Profiles
ROSS TECHNOLOGY
Ross Technology
5316 Highway 290 West
Austin, Texas 78735
Telephone: (512) 349-3108
Fax: (512) 349-3101
Web Site: www.ross.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
Ross Europe • La Hulpe, Belgium
Telephone: (32) (2) 652-1014 • Fax: (32) (2) 652-1062
Financial History ($M), Fiscal Year Ends March 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1995
39
(11)
13
—
1996
101
18
16
13
1997
83
(87)
25
7
1998
42
(38)
6
6
75
175
235
236
Ownership: Publicly held. NASDAQ: RTEC.
Company Overview and Strategy
Ross Technology is a majority owned subsidiary of Fujitsu Ltd., which acquired the firm from Cypress
Semiconductor in mid-1993 for about $22 million. In November 1995, Ross completed its initial public offering,
reducing Fujitsu’s share to 60 percent. A minority position in Ross is also held by Sun Microsystems (five percent).
Originally established in 1988, Ross is involved in the design, development, and marketing of advanced RISC
microprocessors based on the SPARC architecture pioneered by Sun Microsystems. Besides SPARC
microprocessors, Ross also offers a complete line of high-end motherboards and systems. Ross Technology is a
supplier of SPARC™ microprocessors and SPARC system products to both the OEM and end-user markets. Its
stated objective is to drive SPARC, the industry’s highest-volume reduced instruction set computing architecture,
to increased performance leadership and market share.
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Ross Technology
North American Company Profiles
Management
Jack W. Simpson, Sr.
Fred T. May
Frank A Baffi
Carter Godwin
Francis A. “Kit” Webster
President and Chief Executive Officer
Chairman
Vice President, Sales and Marketing
Chief Accounting Officer and Controller
Chief Financial Officer
Products and Processes
Ross Technology's current family of RISC microprocessors include the 32-bit Colorado™ 2, 3, and 4
hyperSPARC™ lines. The superscaler, superpipelined hyperSPARC processors are based on a 0.4µm triplelevel-metal CMOS process and deliver performance of up to 200MHz. The company continues to develop its
next-generation Viper microprocessor technology.
To support its hyperSPARC microprocessors, Ross also offers core logic chipsets.
A full line of system building blocks, including hyperSPARC™ microprocessors and SPARC Version 8-compliant
motherboards and ASIC chipsets, for OEM system suppliers and for end-user upgrades. The upgrade products
significantly increase performance while maintaining compatibility and preserving previous end-user investments
in hardware and software.
The new Quad 200 MHz hyperSPARC multiprocessing microprocessor upgrades from Ross fulfill the need for
improved performance and multiprocessing by end-users, are compatible with both SunOS® and the Solaris®
operating systems, and maintain full Sun/SPARC compatibility.
Semiconductor Fabrication Facilities
The company's devices are manufactured by Fujitsu.
Noteworthy News
•
In June 1998, Ross Technology announced the orderly shutdown of its operations and served notice on its
employees.
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S-MOS Systems
North American Company Profiles
S-MOS S YSTEMS
S-MOS Systems, Inc.
150 River Oaks Parkway
San Jose, California 95134
Telephone: (408) 922-0200
Fax: (408) 922-0238
Web Site: www.smos.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Central America:
S-MOS Systems, Inc. • Chicago, Illinois
Telephone: (847) 517-7667 • Fax: (847) 517-7601
Northeast America:
S-MOS Systems Inc. • Wakefield, Massachusetts
Telephone: (617) 246-3600 • Fax: (617) 246-5443
Southeast America:
S-MOS Systems, Inc. • Raleigh, North Carolina
Telephone: (919) 781-7667 • Fax: (919) 781-6778
Financial History ($M)
Sales
Employees
1992
152
1993
137
1994
135
1995
190
1996
210
1997
152
210
210
220
210
215
*117
*R&D Group split off.
Ownership: Privately held.
Company Overview and Strategy
S-MOS Systems Inc., established in 1983, designs, develops, and markets a full line of very-low-power and lowvoltage (2V) advanced CMOS integrated circuits for a variety of market applications including desktop, notebook,
and palmtop computers, handheld instrumentation, data and telecommunications, and mobile and portable
communications devices. The company is divided into five key business units: Semiconductor Manufacturing,
Graphics and other ASSP, MCUs, ASICs, and Card Products. The company provides silicon foundry services
through its Japanese affiliate, Seiko-Epson Corporation.
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S-MOS Systems
North American Company Profiles
Management
Tadakatsu Hayashi
Eiichi Suda
Kai P. Yiu
Ian R. Mackintosh
Takami Takeuchi
Dan Beck
Chairman, President, and Chief Executive Officer
Vice President, Product Creation
Vice President, Advanced Systems Division
Executive Director, ASIC Business Unit
Executive Director, Finance
Director, Marketing Communications
Products and Processes
Standard Products Business Unit
Memories — SRAMs, mask ROMs, EEPROMs.
Controllers — VGA-LCD controllers, 3D graphics accelerators.
Drivers — LCD drivers.
Microcontrollers — low-power 4-bit and 8-bit microcontrollers.
ASIC Business Unit
Gate Arrays
— SLA40000 Series: 0.45µm CMOS process with two or three layers of metal, 13K to
288K raw gates, and 128 to 400 available I/Os.
— SLA30000 Series: 0.6µm CMOS process with two or three layers of metal, 18K to
216K raw gates, and 128 to 376 available I/Os.
— SLA20000 Series: 0.65µm CMOS process with two and three layers of metal, 12K to
200K raw gates, and 64 to 368 available I/Os.
— SLA9000F Series: 0.6µm CMOS process, 3K to 44K raw gates, and 80 to 256 I/Os.
— SLA9000 Series: 1.0µm CMOS process with two layers of metal, 4K to
36K raw gates, and 82 to 240 available I/Os.
— SLA100X Series: 2.0µm CMOS process with two layers of metal, 1K to
8K raw gates, and 78 to 178 available I/Os.
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North American Company Profiles
S-MOS Systems
Standard Cells
— SSC5000 Series: 0.8µm CMOS process, 7K to 107K raw gates, and 112 to 432
available I/Os.
— SCC2500 Series: 1.6µm CMOS process, 300 to 16K raw gates, and 44 to 256 I/Os.
— SCC2000 Series: 2.0µm CMOS process, 250 to 11K raw gates, and 40 to 192 I/Os.
Embedded Arrays
— SSL20000-1: RAM-DAC embedded array for PC video and graphics applications.
— SSL20000-2: LAN/Ethernet embedded array for LAN controller applications.
— SSL20000-3: RAM/ROM embedded array for pager, cellular phone, and PDA applications.
Card Products Business Unit
Subsystem design and assembly.
CARD-586 – the newest and smallest PC motherboard with AMD’s 5x86 133MHz CPU. The CARD-586 is
33 percent faster than the CARD-486D4, 100MHz version introduced in 1996.
Contract Manufacturing Services
Foundry, test, and packaging services through Japanese affiliate Seiko-Epson.
Semiconductor Fabrication Facilities
Design, engineering, and marketing of S-MOS' products are handled at its San Jose headquarters. Manufacturing
is done at Seiko-Epson's fabrication facility in Fujimi, Nagano Prefecture, Japan.
2-401
S3
North American Company Profiles
S3
S3 Incorporated
2801 Mission College Boulevard
Santa Clara, California 95052-8058
Telephone: (408) 588-8000
Fax: (408) 980-5444
Web Site: www.s3.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Japan:
S3 Japan K.K. • Tokyo, Japan
Telephone: (81) (3) 3345-7630 • Fax: (81) (3) 3345-7390
Asia-Pacific:
S3 Taiwan • Taipei, Taiwan
Telephone: (886) (2) 757-6768 • Fax: (886) (2) 757-6880
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1992
31
4
5
—
1993
113
19
12
—
1994
140
6
18
—
1995
316
35
42
36
1996
439
42
63
93
1997
436
9
96
104
68
141
230
444
678
570
Ownership: Publicly held. NASDAQ: SIII.
Company Overview and Strategy
S3® Incorporated, founded in 1989, pioneered graphics acceleration in 1991 when it introduced the world’s first
single-chip graphics accelerator, significantly improving the performance of the personal computer (PC).
Since then, S3 has delivered several generations of firsts — from the first 32-bit and 64-bit graphics accelerator
families to the first integrated 2D, 3D and video accelerator to the first full-featured audio accelerator designed for
the mainstream PC market. Consistently meeting the needs of the rapidly evolving PC market, S3 combines highperformance hardware acceleration with optimized software drivers and content development programs to deliver
complete multimedia solutions. S3 also partitions its solutions to work with existing PC hardware to further
maximize cost.
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S3
North American Company Profiles
Management
Walter Amaral
Rick Bergman
John Brothers
Paul Franklin
Cecilia Hayes
Terry Holdt
Daniel Karr
Anoop Khurana
Michael Nell
Werner Stahel
Senior Vice President and Chief Financial Officer
Vice President and General Manager, Mobile Products
Vice President, Architecture and Software
Senior Vice President, Operations
Vice President, Human Resources
Chief Executive Officer, President and Chairman of the Board
Vice President, Worldwide Sales
Vice President, Engineering and Desktop Products
Vice President, Marketing and Desktop Products
Vice President, Central Engineering
Products and Processes
S3 offers a variety of 64-bit and 128-bit graphics and multimedia accelerator ICs, as well as supporting software
drivers. In 1996 and 1997, the company significantly expanded its product offerings from 2D graphics
acceleration to audio processing, 3D acceleration, and mobile multimedia acceleration. S3’s IC products are listed
below.
Desktop
The latest addition to its ViRGE® family of 2D, 3D and video accelerators, S3’s ViRGE/GX2 Home PC/TV
accelerator is a fully integrated multimedia acceleration solution providing support for TV-out, DuoView™ dualdisplay capability, Accelerated Graphics Port (AGP) and high-quality Digital Video Disc (DVD).
S3’s Trio3D accelerator delivers the industry’s highest 2D graphics performance, advanced video
conferencing/video training capabilities and “business-ready” 3D graphics. Tailored to the needs of the corporate
and SOHO PC markets, the Trio3D delivers OEMs with a cost-effective hardware/software compatible upgrade
path for both ViRGE and Trio-based products.
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S3
North American Company Profiles
Mobile
Combining the same level of 2D, 3D and video capabilities found in S3’s desktop accelerators with advanced
power management and flat panel display support, S3’s second-generation mobile product — the ViRGE/MX
accelerator — enables the development of a new generation of productivity, entertainment and Internet
applications for the mobile PC market. Providing industry-first technologies such as fully integrated TV-out,
DuoView dual display capability and AGP support, the ViRGE/MX accelerator exceeds the performance and
functionality levels of core features available for the mobile PC platform.
S3’s third generation mobile accelerator — the ViRGE/MXi — is the industry’s first 3D graphics accelerator with
Integrated DRAM for mainstream notebook PCs. With two megabytes of S3-designed DRAM (known as
S3RAM™), the ViRGE/MXi provides leading 2D/3D performance, improved power management and industry-first
technologies such as integrated Macrovision copy protection for DVD and DuoView dual display technology.
Audio
S3’s SonicVibes audio accelerator is the industry’s first, full-featured PCI-based audio solution for the mainstream
PC market. Integrating the capabilities of a sound card into a single chip, S3’s SonicVibes audio accelerator
delivers affordable sound quality previously found only in expensive, high-end studio systems.
Semiconductor Fabrication Facilities
The majority of S3's silicon products are currently manufactured by TSMC and UMC. In 1995, S3 entered into a
partnership with UMC and Alliance Semiconductor to establish a new jointly owned wafer foundry company in
Taiwan called United Semiconductor Corporation (USC). S3 enjoys 16 percent ownership in USC, which began
processing 200mm wafers in 3Q96. S3 has the right to purchase up to about 31 percent of the USC fab’s output.
See UMC’s profile for data on USC’s fab facility.
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Scenix Semiconductor
North American Company Profiles
S CENIX S EMICONDUCTOR
Scenix Semiconductor, Inc.
3140 De La Cruz Blvd., Suite 200
Santa Clara, California 95054
Telephone: (408) 327-8888
Fax: (408) 327-8880
Web Site: www.scenix.com
Email: sales@scenix.com
Fabless IC Supplier
Company Overview and Strategy
Founded in January 1996, by Steve Leung, Scenix Semiconductor, Inc. designs and markets high-performance
microcontrollers (MCUs) for embedded system applications. In November 1997, it received $3.85 million as the
initial part of its first round of venture capital funding; that round was completed in early 1998, with the receipt of
another $3.85 million.
The company announced the SX Series of microcontrollers in August 1997, and shipped its first production units
in December 1997. The MCUs are produced by world-class manufacturing partners, under contract to Scenix.
The SX is positioned as “the world's fastest and most flexible 8-bit MCU platform.” Designed for high-volume digital
electronic systems, including consumer, automotive and industrial products, the SX Series combines high
performance with features enabling affordable system costs.
Scenix has a domestic direct sales operation which is supplemented by a full-service distributor for North America,
EBV Electronics (San Diego HQ), as well as a Manufacturers Representative channel composed of 14 domestic
firms with a total of 23 offices across 18 states. Scenix uses Parallax, Inc. (Rocklin, CA) for distribution into
Germany and the U.K., Comfile Technology (Seoul) for Korea, Sumisho Electronic Devices (Tokyo) for Japan, and
Ciponic Technology Co., Inc. for Hong Kong.
Management
Steve Leung
Stephan Thaler
President and Chief Executive Officer
Vice President, Marketing
Products and Processes
The company's flagship product is the SX Series microcontroller family. Running at up to 50MHz and able to
execute most program instructions in a single clock cycle, the SX Series delivers up to 50 MIPS. The company
claims this is 10 to 50 times greater performance than typical 8-bit MCUs. The fast processing speed and jitter-free
interrupts, combined with on-chip programmable Flash memory (EEPROM), enable users to create ‘virtual
peripherals’ running on the SX.
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Scenix Semiconductor
North American Company Profiles
The SX Series MCUs incorporate on-chip CPU, 2K X 12-bits of EEPROM, 136 bytes of SRAM, and commonly
used oscillators, timers, power-on and brown-out resets, and multi-input wakeups.
The SX architecture includes 33 instructions designed to be object-code compatible with the PIC16C5X® series
of MCUs. The SX is optimized for performance, C-compiler support, and full UL1998 compliance.
2-406
Seeq Technology
North American Company Profiles
S EEQ TECHNOLOGY
Seeq Technology, Inc.
47200 Bayside Parkway
Fremont, California 94538
Telephone: (510) 226-7400
Fax: (510) 657-2837
Web Site: www.seeq.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Employees
1992
37
(11)
5
1993
33
(4)
3
1994
21
(8)
3
1995
23
1
3
1996
31
3
3
1997
31.4
4.7
3.5
190
161
67
67
74
70
Ownership: Publicly held. NASDAQ: SEEQ.
Company Overview and Strategy
Seeq Technology was established in 1981 to develop, produce, and market EEPROMs. Over the years the
company has undergone a series of transitions that has created a company that is today much different than it was
founded to be. Seeq began developing Ethernet products in 1982 and adopted a strategy to have its products
manufactured by outside foundries in 1989. As a result of the foundry alliances that were established, the company
shut down its wafer fab facility in 1992 and thus became a fabless IC supplier. In early 1994, the company
abandoned the market it had itself created by selling its EEPROM business to competitor Atmel Corporation for $10
million. Additionally, the company's Ethernet adapter board product line was discontinued in early 1994.
Seeq now focuses exclusively on local area network (LAN) communication devices and subsystems. These
products are targeted at system manufacturers in the personal computer, workstation, printer, networking, hub,
switch, router, NIC, and telecommunications markets. Fast Ethernet devices accounted for 66 percent of total
revenues in 1997, up from 31 percent in 1996.
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Seeq Technology
North American Company Profiles
Management
Alan V. Gregory
Philip J. Salsbury, Ph.D.
Stephen Dreyer
Gary Fish
Robert C. Frostholm
James Middleton
Kent Andres
Chairman
President and Chief Executive Officer
Director, Engineering
Vice President, Finance, Chief Financial Officer
Vice President, Sales and Marketing
Director, Operations
Director, Quality and Reliability
Products and Processes
Seeq supplies Ethernet data communication controllers, encoder/decoders, coaxial and unshielded twisted pair
cable CMOS transceivers, and networking modules. The company also sells media signaling ICs for the highspeed ATM (Asynchronous Transfer Mode) LAN market. Its products are designed using proprietary digital and
mixed-signal CMOS processes, including submicron technologies (0.8µm, 0.6µm and 0.35µm).
Semiconductor Fabrication Facilities
Seeq has established several agreements with wafer-based and ASIC-based foundry suppliers. Its volume wafer
processing partners are AMI, Samsung and TSMC. Ricoh and Samsung are used for turn-key manufacturing
using either a standard cell or a gate array approach.
Key Agreements
•
Hualon Microelectronics holds a 10 percent stake in Seeq Technology and is providing foundry services for the
supplier. The two companies also agreed to jointly develop and market network ICs.
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Semicoa Semiconductor
North American Company Profiles
S EMICOA S EMICONDUCTOR
Semicoa Semiconductor
333 McCormick avenue
Costa Mesa, CA 92626
Telephone: (714) 979-1900
Fax: (714) 557-4541
Discrete Semiconductor Manufacturer
Ownership: Privately held.
Financial History ($M)
Sales
1997
5-10 (est.)
Company Overview and Strategy
Semicoa, formed in 1968, manufactures small signal transistors, small signal RF transistors, power transistors and
photodiodes for the hi-rel military and space markets.
The company also manufactures a broad line of commercial transistors for the industrial markets. Many of these
devices were acquired by the purchase of transistor product lines form General Semiconductor Industries and
Harris Semiconductor. Typically, the products are packaged in hermetically sealed metal cans or ceramic
packages.
The company has automated manufacturing equipment, including wafer fabrication, pre-assembly, assembly,
screening and final testing. All transistors are also available as chips for hybrid circuits.
Semicoa is ISO9001 certified.
Semicoa’s headquarters in Costa Mesa, houses all wafer fabrication, assembly, test, screening and support
operations.
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Semtech
North American Company Profiles
S EMTECH
Semtech Corporation
652 Mitchell Road
Newbury Park, California 91320
Telephone: (805) 498-2111
Fax: (805) 498-3804
Web Site: www.semtech.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends January 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
20
0.4
1
—
1994
21
1
1
—
1995
36
2
2
1
1996
62
7
3
4
1997
74
8
5
4
1998
103
15
9
—
—
340
372
500
505
560
Ownership: Publicly held. NASDAQ: SMTC.
Company Overview and Strategy
Semtech Corporation, founded in 1960, is a leading manufacturer of high quality analog and mixed signal
products, dedicated to providing customers with cost effective, innovative solutions for power management,
interface and protection.
In October 1997, Semtech acquired Edge Semiconductor located in San Diego, California. This acquisition
positioned Semtech as a leading manufacturer of proprietary and commercial IC products for the automated test
equipment market.
Semtech continues to focus on supplying high quality analog and mixed signal integrated circuits to end-market
applications that include test and measurement, communications, computers and computer peripherals, video
and industrial equipment.
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Semtech
North American Company Profiles
Management
John D. Poe
Raymond E. Bregar
David I. Anderson
David G. Franz, Jr.
Jean Claude Zambelli
Wylie Plummer
President and Chief Executive Officer
Executive Vice President, Corporate Operations
Vice President, IC Design and Development
Vice President, Finance, and Chief Financial Officer
Vice President, Sales and Marketing
Vice President, ATE Division
Products and Processes
Semtech offers a wide range of analog and mixed signal integrated circuits, transient voltage suppression devices
and ATE components and custom analog circuits designed for solving today’s complex power management,
protection and interface issues.
Semiconductor Fabrication Facilities
Semtech Corpus Cristi
121 International Boulevard
Corpus Christi, Texas 78406
Telephone: (512) 289-0403
Wafer size: 4 inch
Process: Bipolar
Products: IC design
Feature size: 3.0µm
Semtech Santa Clara
1111 Comstock Street
Santa Clara, California 95054
Telephone: (408) 727-6562
Capacity (wafers/week): 2,000
Wafer sizes: 4 inch, 5 inch
Processes: CMOS, bipolar
Products: ASICs, linear ICs, discretes, foundry
Feature sizes: 3.0µm, 4.0µm, 5.0µm
Semtech Corporation
652 Mitchell Road
Newbury Park, California 91320
Telephone: (805) 498-2111
Products: Discretes
Semtech - ATE Division (formerly Edge Semiconductor)
10021 Willow Creek Road
San Diego, California 92151
Telephone: (619) 695-2633
2-411
Sensory
North American Company Profiles
S ENSORY
Sensory, Inc.
521 East Weddell Drive
Sunnyvale, California 94089
Telephone: (408) 744-9000
Fax: (408) 744-1299
Web Site: www.sensoryinc.com
Fabless IC Supplier
Employees: 35
Ownership: Privately held.
Company Overview and Strategy
Sensory develops and markets technologies that enhance communications with products. Sensory offers the
Interactive Speech™ product line — a complete offering of integrated circuits and software-only solutions for
speech recognition in consumer electronics and telephony handsets. Sensory’s low-cost ICs include the RSCSeries general-purpose microcontrollers featuring a comprehensive suite of speech input and output
technologies. Sensory’s software speech recognition technology runs on a range of microcontrollers and DSPs.
Management
Todd Mozer
Mark Frankel
Mike Kaskowitz
Keith Kitami
President and Chief Executive Officer
Vice President, Sales
Vice President, Engineering
Vice President, Operations and Services
Products and Processes
Sensory is dedicated to providing the highest accuracy speech recognition solutions at the lowest system cost.
Sensory employs a large R&D team working on neural networks, dynamic time warping, time domain speech
compression, plus advanced software and IC designs. Sensory’s software speech recognition lowers system
costs by substantially reducing processing and memory requirements. Sensory’s IC-based solutions further lower
costs by integrating multiple technologies and features on a single chip. RAM, ROM, automatic gain control
(AGC), output amplifier, and A/D and D/A converters are all integrated on-chip, reducing the need for external
circuitry.
2-412
North American Company Profiles
Sensory
The Interactive Speech™ line of products includes both IC and software based speech recognition solutions.
Sensory’s Interactive Speech products offer a full range of speech technologies featuring speaker-independent
and speaker-dependent discrete word speech recognition, speech and music synthesis, voice record, DTMF
generation and speaker verification. Sensory’s Interactive Speech ICs include the RSC series, general purpose
microcontrollers with speech I/O, plus a line of easy-to-implement chips which can be pin-configured or controlled
by an external host microcontroller. Sensory’s software technologies run on a variety of microcontrollers and
DSPs. Sensory’s software technologies include Car Command™ for automotive applications and other noise
environments.
2-413
Sigma Designs, Inc.
North American Company Profiles
S IGMA DESIGNS , INC .
Sigma Designs, Inc.
46501 Landing Parkway
Fremont, California 94538
Telephone: (510) 770-0100
Fax: (510) 770-2640
Web Site: www.sigmadesigns.com
Email: sales@sdesigns.com
IC Manufacturer
Founded: 1982
Financial History ($000s), Fiscal Year End January 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
27,058
(7,166)
—
—
1994
34,989
(29,546)
—
—
1995
43,700
(8,773)
—
—
1996
26,374
(14,708)
4,499
38
1997
41,214
1,529
4,688
113
1998
36,982
(5,648)
4,948
92
195
151
138
60
86
71
Ownership: Publicly held. NASDAQ: SIGM.
Company Overview and Strategy
Sigma Designs, Inc. makes multimedia chipsets and playback cards for use in PCs. The Company uses Moving
Picture Experts Group (MPEG) technology for its REALmagic product line and markets its products to OEMs,
VARs (Value Added Resellers), and retail customers throughout the world.
2-414
North American Company Profiles
Sigma Designs, Inc.
Management
Thinh Q. Tran
Silvio Perich
Dan Chen
Jacques Martinella
Prem Talreja
Kit Tsui
James Pio
Chairman of the Board, President, and Chief Executive Officer
Senior Vice President, Worldwide Sales
Senior Vice President, Technology
Vice President, Engineering
Vice President, Marketing
Director, Finance, Chief Financial Officer, and Secretary
Director, Operations
Products and Processes
Sigma Designs offers chipsets for high performance 2D and 3D graphics acceleration for PC manufacturers and
add-on card makers. The Company also offers complete MPEG-1 and MPEG-2 playback solutions for both
desktop and notebook computers.
REALmagic add-on cards were the first low cost MPEG multimedia playback controllers for the PC to target the
home and corporate PC markets. Product details are as follows.
REALmagic Chipsets
• REALmagic PRO chipset features REAL Overlay technology and is capable of supporting video playback at
up to 1600 x 1200 resolution in 24-bit colors.
• REALmagic PC-MPEG chipset incorporates all the features of the REALmagic PRO chipset, plus Sigma’s own
Integrated MPEG video and audio recorder.
• REALmagic Explorer chipset provides the new Zoomed Video (ZV) Port technology for notebook computers.
This technology gives notebook computers the ability to display full-screen, full-motion video by allowing direct
access to the video memory of the graphics controller via the PCMCIA slot.
• REALmagic 64/GX is a 2D graphics accelerator chip and incorporates advanced video filtering.
REALmagic Board Products
• REALmagic Maxima is a MPEG playback card designed for multimedia capable home PCs. Its REAL Overlay
technology makes it compatible with virtually all VGA graphics cards available.
• REALmagic Ultra has all the features of REALmagic Maxima, plus Windows PCM sound (WAV files) playback
capability and TV signal output for corporate computer-based training applications, kiosks, and multimedia
presentations.
Key Agreements
•
In mid-1997, Sigma Designs Inc., and the Haitai I & C, subsidiary of the Haitai Group of Companies, signed a
distribution and joint product development agreement. Haitai distributed the REALmagic DVD/MPEG-2
multimedia kit using the Sigma Designs DVD/MPEG-2 playback card to over 400 franchised stores in Korea.
•
On May 3, 1996, Sigma Designs Inc. acquired Active Design Corporation, a multimedia developer, in a pooling
of interests.
2-415
Signal Processing Technologies
North American Company Profiles
S IGNAL PROCESSING TECHNOLOGIES (SPT)
Signal Processing Technologies, Inc.
4755 Forge Road
Colorado Springs, Colorado 80907
Telephone: (719) 528-2300
Fax: (719) 528-2370
Web Site: www.spt.com
Fabless IC Supplier
Employees: 100
Company Overview and Strategy
Signal Processing Technologies (SPT) is a supplier of high-performance data conversion and signal conditioning
integrated circuits. It was formed in 1983 as a business unit of Honeywell's semiconductor group. SPT was then
acquired in 1989 by a group of private investors and an employee team and was established as a separate
corporation. In June 1990, the company became a wholly-owned subsidiary of Japan's Toko, Inc., a worldwide
supplier of electronic components and integrated circuits.
Management
Ben Takada
Richard Mintle
Alfi Moscovici
Mike Ruebenson
President
Director, Sales and Marketing
Director, Engineering
Director, Finance and Administration
Products and Processes
SPT offers a portfolio of products that includes high-speed comparators and A/D and D/A converters. The
company's primary focus is on developing proprietary, high-performance signal conditioning and data conversion
products. It has received funding from its parent to develop new analog products designed for a variety of
commercial, industrial, and military applications.
Semiconductor Fabrication Facilities
Toko acts as the foundry for SPT. In late 1992, SPT purchased a former Digital Equipment Corp. R&D facility,
which more than doubled the company's engineering and test area. The facility includes a 10,000 square-foot
space that SPT may convert into a Class 10 or Class 1 fab in the future.
2-416
Silicon Composers
North American Company Profiles
S ILICON COMPOSERS
Silicon Composers, Inc.
470 San Antonio Rd., Suite F
Palo Alto, California 94306
Telephone: (650) 843-1135
Web Site: www.silcomp.com
Email: info@silcomp.com
IC Manufacturer
Company Overview and Strategy
Silicon Composers is an ASIC and printed circuit board designer and manufacturer, as well as a software developer
(operating systems, device drivers, algorithms). Additionally, the company offers manufacturing services to
companies whose hardware has already been designed in-house. Silicon Composers was founded in 1985. Its
first product was the Delta Board. The company serves the independent manufacturer and OEM markets.
Products and Processes
Silicon Composers’ SC32 is a 32-bit high-speed, general purpose microprocessor optimized for subroutine calls
and returns, single-cycle instruction execution and multitasking. The dual-stack architecture of the SC32 is similar
to the that found in the Forth language. (The company claims its SC/Forth language, a Forth-83 Standard-based
version, is the world's fastest 32-bit Forth language). Instruction fetches occur in parallel with the previous
instruction's execution resulting in one clock cycle instructions, providing speeds in the 60 MIPS range at 10MHz.
The SC32 was developed at Johns Hopkins University.
The company claims the “SC32 combines the speed of DSP hardware with the ease of programming a generalpurpose microprocessor in a high-level language to significantly reduce development time.” The SC32 is used for
dedicated applications, general computing environments, embedded systems control, multi-tasking systems, data
acquisition, image and numerical processing and applications requiring large, non-segmented program, data or
memory-mapped I/O capability. Key features include: one clock cycle instruction execution; two clock cycle data
memory access; and two 32-bit, 16-deep stacks on chip with the first four registers of each stack (user registers,
program counter, zero register and processor status word register) accessible from the instruction set.
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Silicon Composers
North American Company Profiles
Silicon Composers’ ASIC design and fabrication services use advanced standard cell design environments. An
extensive variety of functional cores is also maintained. The company has particular expertise in the following
areas:
•
•
•
•
•
•
•
•
•
•
•
High performance mixed digital and analog system design;
Embedded real-time control applications;
Automotive;
Image processing;
Disk Drives;
Scanners
Printers;
Peripherals;
Scientific-aerospace (including Mil-Spec);
PALs, GALs; and
Gate arrays.
Since its founding, Silicon Composers has built over 100 types of PCBs. Boards produced have been between
two and eight layers and have included mixed-signal digital and analog, and mixed through-hole and surface
mount.
2-418
Siliconix
North American Company Profiles
S ILICONIX
Siliconix Incorporated
(Member of TEMIC Semiconductors)
2201 Laurelwood Road
Santa Clara, California 95056-0951
Telephone: (408) 988-8000
Fax: (408) 970-3950
Web Site: www.siliconix.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends December 31
Sales
IC Sales
Discrete Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
155
43
112
5
8
13
1993
171
36
135
7
13
18
1994
197
34
163
11
16
25
1995
250
64
186
24
19
28
1996
269
65
204
26
21
40
1997
322
81
241
33
18
—
Employees
1,202
1,211
1,172
1,269
1,228
1,320
Company Overview and Strategy
Founded in 1962, Siliconix designs, manufactures, and markets ICs and discrete components for switching, motor
control, and power management in computers, automotive, instrumentation, and telecommunications
applications. AEG Capital Corporation became a majority shareholder of the company in December 1990,
increasing its ownership from 38 percent to 80 percent of the company's outstanding stock. In July 1992,
Siliconix was joined with Telefunken Semiconductors, Matra MHS, and Dialog Semiconductor to form the
semiconductor division of TEMIC, the microelectronics group of Daimler-Benz AG, a German automotive,
electronics, and aerospace conglomerate.
In 1996, Siliconix restructured its business to better reach its target markets. Power MOS, Power IC, and Signal
Processing product units were created with profit and loss responsibilities for their respective product lines. The
Power MOS and Signal Processing units report jointly to Siliconix and the Discrete Components Division of TEMIC
Semiconductors. The Power IC unit reports jointly to Siliconix and the Integrated Circuits Division of TEMIC
Semiconductors.
2-419
Siliconix
North American Company Profiles
Management
Richard J. Kulle
King Owyang
Jürgen F. Biehn
G. Thomas Simmons
President and Chief Executive Officer
Executive Vice President, Technology and Silicon Operations
Senior Vice President and Chief Financial Officer
Vice President, Strategic Marketing and Business Development
Products and Processes
Siliconix's power transistors and integrated circuits are mainly used for power management and motion control in
communications, computers, and automotive systems. The company's analog switches, analog multiplexers, and
low-power transistors are used to sense, switch, and route signals in video, multimedia, instrumentation, and test
equipment in consumer and industrial applications.
In 1997, sales of power MOSFETs, the company’s fastest growing product group, and power ICs accounted for
about 75 percent of total sales.
2-420
North American Company Profiles
Siliconix
Siliconix provides products and technologies that directly answer the market's demand for smaller, more efficient,
and more cost-effective components. The company's Little Foot® discrete power transistors are the industry's
most compact solution for motion control in hard disk drives and for load management in portable computers.
These miniaturized products can be mounted directly on the printed circuit board, and are the first such power
devices small enough to fit in a PCMCIA card. The company's Little Foot® line has been designed into telecom
systems, automotive air bag triggers, and numerous other applications where space-savings and efficiency are at a
premium. In early 1997, Siliconix announced a family of specialized power MOSFETs as part of its Little Foot®
product line. The devices are designed to work with most low-voltage pulse width modulation (PWM) controllers.
Each of the new devices is designed to handle a different power level, and thus each targets a different
application.
Siliconix's power integrated circuits include a family of high-frequency switchmode regulator and controller ICs
designed for use with Lite Foot or Little Foot® discretes and offering the optimal level of integration for DC-to-DC
conversion in battery-operated equipment, including laptop and notebook computers. For data storage
customers the company offers highly integrated chips for voice coil and spindle motor control. Other IC products
include power interface devices for computers equipped with dual battery packs or PCMCIA slots, power ICs for
bus control in automobiles, and analog switches and multiplexers for use in signal switching and routing in
electronic instruments and industrial equipment.
Siliconix utilizes CMOS, DMOS, BiCMOS, and BiC/DMOS (BCDMOS) technologies in the manufacture of its IC
and discrete products. The company's power ICs are manufactured using its proprietary self-isolated BCDMOS
technologies, which include the BCD15 process for producing power ICs operating from 2.5V to 15V and the
BCD60 process for producing power ICs operating up to 60V.
Semiconductor Fabrication Facilities
Siliconix Incorporated
2201 Laurelwood Road
Santa Clara, California 95056
Fab 2
Capacity (wafers/week): 2,000
Wafer size: 100mm
Processes: CMOS, DMOS, BiCMOS, BCDMOS
Products: Linear and power ICs, discretes
Feature size: 3.0µm
Siliconix Incorporated
2201 Laurelwood Road
Santa Clara, California 95056
Fab 3
Capacity (wafers/week): 1,500
Wafer size: 150mm
Processes: CMOS, DMOS, BiCMOS, BCDMOS
Products: Power ICs and discretes
Feature sizes: 0.8µm-1.5µm
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Siliconix
North American Company Profiles
Siliconix/TEMIC
Itzehoe, Germany
Cleanroom size: 44,000 square feet (Class 1)
Wafer sizes: 150mm, 200mm
Processes: PowerMOS, BiCMOS
Products: Discretes
Siliconix also uses a foundry in Taiwan for the production of some of its cost-sensitive analog switch and low-power
discrete product lines.
High-volume assembly and product testing is handled at the company's facilities in Kaohsiung, Taiwan, a joint
venture in Shanghai, China, called Simconix, and at subcontractors in the Philippines, India, Taiwan, and China. A
limited amount of assembly and product test is performed in Santa Clara.
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Simtek
North American Company Profiles
S IMTEK
Simtek Corporation
1465 Kelly Johnson Boulevard
Colorado Springs, Colorado 80920
Telephone: (719) 531-9444
Fax: (719) 531-9481
Web Site: www.simtek.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
0.5
(6)
3
1993
3
(6)
2
1994
1
(4)
2
1995
2
(3)
1
1996
5
0.1
1
1997
7
0.8
2
25
32
25
17
17
22
Ownership: Publicly held. NASDAQ: SRAM.
Company Overview and Strategy
Simtek Corporation has designed, developed, and marketed non-volatile semiconductor memory products since
it commenced business operations in 1987. Its concentration has been on the design and development of fast
nvSRAMs (non-volatile SRAMs) and associated products and technologies.
Simtek's products are aimed at avionics subsystems, portable computers and instruments, medical
instrumentation, navigation aids, robotics, telecommunications systems, and other high performance applications.
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Simtek
North American Company Profiles
Management
Richard L. Petritz
Douglas Mitchell
Christian Herdt
Sheldon A. Taylor
Chairman
President and Chief Executive Officer
Vice President, Engineering
Director
Products and Processes
Simtek's nvSRAM product family includes 4K, 16K, 64K, and 256K devices with access speeds ranging from
25ns to 45ns. The nvSRAMs utilize a unique patented memory cell technology called Novcel, which integrates
fast SRAM and EEPROM elements in each cell. In late 1993, Simtek introduced its AutoStore™ nvSRAMs, which
automatically detect power loss and transfer data from SRAM into EEPROM.
Simtek uses an advanced implementation of silicon-nitride-oxide-semiconductor (SNOS) technology in the
design of its products. The company's Novcel technology is compatible with basic CMOS technology, allowing
nvSRAM memory cells to be incorporated with other system level semiconductor products.
Simtek’s products are based on 1.2µm and 0.8µm process technologies. In 1997, products based on 1.2µm
process technology represented 45 percent of sales, while products based on 0.8µm process technology made
up the remaining 55 percent.
Semiconductor Fabrication Facilities
Simtek has foundry agreements with Chartered Semiconductor Manufacturing (CSM) of Singapore and Zentrum
Mikroelektronik Dresden of Germany for the manufacture of its wafers.
Key Agreements
• Simtek signed an agreement with Zentrum Mikroelektronik Dresden (ZMD) in mid-1994 to install its 1.2µm
process in ZMD's fab in Germany and to jointly develop 0.8µm process technology. The agreement was later
modified to bypass the installation of 1.2µm technology and instead install 0.8µm technology. ZMD also
received a license to sell Simtek's 64K and 256K nvSRAMs built in the 0.8µm process.
In 1995, the two companies expanded their relationship to include the joint development of additional
nvSRAMs using the 0.8µm process. ZMD agreed to finance the development in exchange for shares in
Simtek. In the second quarter of 1996, ZMD began supplying Simtek with 64K finished units based on 0.8µm
process technology. ZMD is the largest shareholder of Simtek, owning 30 percent.
• Simtek entered into a manufacturing and development agreement with Chartered Semiconductor
Manufacturing (CSM) in 1992 for 64K through 1M nvSRAMs. CSM will provide Simtek with wafers at least
through 3Q98.
• Simtek established an agreement in 1989 with GEC Plessey Semiconductors under which GEC Plessey has
the right to incorporate Simtek's non-volatile memory technology into its ASICs. In 1990, the agreement was
extended to grant GEC Plessey a worldwide license to manufacture and market Simtek's nvSRAM devices.
2-424
Single Chip Systems
North American Company Profiles
S INGLE CHIP S YSTEMS
Single Chip Systems Corporation
10905 Technology Place
San Diego, California 92127
Telephone: (619) 485-9196
Fax: (619) 485-0561
www.scs-corp.com
Fabless IC Supplier
Ownership: Privately held.
Company Overview and Strategy
SCS Corporation (Single Chip Systems) is a venture capital funded company that was founded in technology.
Specifically, SCS develops and produces held programmable IC products for the radio frequency identification
(RF/ID) market. The company also assembles its ICs into electronic ID tags. SCS announced product in May 1997,
and is now the largest volume producer of RF/ID tags.
Management
Jacob S. Jacobsson
Bruce B. Roesner, Ph.D.
Gregory A. Bohdan
President and Chief Executive Officer
Chairman and Chief Technology Officer
Chief Financial Officer
Products and Processes
The company's first product is i2 system, an electronic ID tag and scanner system that offers a significant increase in
performance and decrease in price compared to existing systems.
I2 and the I2 logo are trademarks of SCS Corporation.
Semiconductor Fabrication Facilities
SCS's ICs are manufactured at independent foundries.
2-425
Sipex
North American Company Profiles
S IPEX
Sipex Corporation
22 Linnell Circle
Billerica, Massachusetts 01821
Telephone: (508) 667-8700
Fax: (508) 667-8310
Web Site: www.sipex.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Nippon Sipex Corporation • Chiyoda-ku, Tokyo, Japan
Telephone: (81) (3) 3254-5822 • Fax: (81) (3) 3254-5824
Europe:
Sipex SARL • Rungis Cedex, France
Telephone: (33) (1) 4687-8336 • Fax: (33) (1) 4560-0784
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
29
(4)
2
—
1993
28
(4)
2
1
1994
23
(5)
3
1
1995
30
(2)
4
1
1996
37
4
5
2
1997
51
13
5
6.5
—
—
—
220
247
277
Company Overview and Strategy
Sipex Corporation (NASDAQ: SIPX) is a leading designer and manufacturer of high-performance, high valuedadded analog integrated circuits. The company is focused on three market areas: data communications and
telecommunications; battery powered/portable products; and industrial controls/instrumentation. Sipex serves
these market sectors with three primary product lines: interface circuits, low power application-specific analog
circuits, and data converter products. The company pioneered the design, development, and manufacture of
electroluminescent lamp (EL) driver circuits.
2-426
Sipex
North American Company Profiles
Sipex was established in 1965 under the name Hybrid Systems Inc. and until the late 1980’s focused on the
design and manufacture of data conversion products utilizing hybrid technology, primarily for the military market.
The company merged with DataLinear Corporation in 1986 and then with Dielectric Semiconductor Inc. in 1987, at
which time the company name was changed to Sipex Corporation. Then in 1988, the company acquired Barvon
BiCMOS Technology, Inc., a designer and manufacturer of custom and standard monolithic products for
commercial markets. The development of new standard hybrid products was discontinued in 1989, and while the
company continues to support the military markets with existing hybrid products, its focus today is on commercial
products.
International sales accounted for approximately 38 percent of the company’s net sales in 1997.
Management
James E. Donegan
Frank R. DiPietro
Raymond W.B. Chow
Sanford Cohen
Tim Dhuyvetter
Chairman, President, and Chief Executive Officer
Executive Vice President and Chief Financial Officer
Senior Vice President
Senior Vice President, Technology
Senior Vice President
Products and Processes
Sipex offers both standard and custom products. The standard products include interface (line drivers/receivers),
electroluminescent lamp driver circuits, data conversion products, and other linear products, while the custom
products include full-custom monolithic ICs and custom multichip products. The company also provides
dielectrically isolated silicon substrates to a broad spectrum of semiconductor manufacturers.
For interface products, Sipex offers a full line of products, including low-power single interface products
supporting RS-232 and RS-485 standards and programmable multi-mode serial interface transceivers allowing
single chips to communicate in up to eight different standards. These products are fabricated in a high-voltage
BiCMOS process technology and specialize in low-power 5V-only operation.
The low-power application-specific products utilize a proprietary dielectrically isolated (DI) BiCMOS process
technology that allows both very low voltages (1V) and very high voltages (100V) to be used simultaneously on
the same IC. The company’s EL driver circuits are based on this specialized process.
For data converter products, Sipex specializes in high-accuracy 12-bit A/D and D/A converters.
2-427
Sipex
North American Company Profiles
The broad base of semiconductor processes and technologies used by Sipex enable it to design products
optimized for each application. Sipex focuses on leveraging its specialized dielectrically isolated BiCMOS
technology, which the company believes is particularly well suited to the low-power, low-voltage requirements of
battery powered/portable products.
The company utilizes its own fabrication facility for producing 3.0µm to 5.0µm dielectrically isolated complementary
bipolar and BiCMOS linear devices, and has strategic foundry relationships for producing 0.8µm to 4.0µm
BiCMOS and CMOS linear devices.
Semiconductor Fabrication Facilities
As already mentioned, the company’s own wafer fabrication facility produces products utilizing the company’s DI
complementary bipolar and BiCMOS processes. The company’s BiCMOS and CMOS products are manufactured
using fully processed wafers supplied primarily by UMC, Orbit Semiconductor, and Calogic Corporation.
Sipex Corporation
491 Fairview Way
Milpitas, California 95035
Telephone: (408) 945-9080
Fax: (408) 946-6191
Capacity (wafers/week): 500
Wafer size: 100mm
Processes: Bipolar, BiCMOS
Products: Linear ICs
Feature sizes: 3.0µm-5.0µm
2-428
Solitron Devices, Inc.
North American Company Profiles
S OLITRON DEVICES , INC .
Solitron Devices, Inc.
3301 Electronics Way
West Palm Beach, Florida 33407
Telephone: (561) 868-4311
Fax: (561) 863-5946
Web Site: www.solitrondevices.com
Email: sales@solitrondevices.com
IC Manufacturer
Founded: 1959
Financial History ($000s), Fiscal Year Ends February
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1996
1997
1998
$6.7
—
0
—
$7.2
139
0
121
$7.9
194
0
114
—
105
116
Ownership: Publicly held. NASDAQ: SODI.
Company Overview and Strategy
Solitron Devices, Inc. designs and manufactures more than 1500 standard semiconductor types including
Darlingtons, IGBTs, JETs, MOSFETs, Rectifiers, Voltage Rectifiers, Voltage Regulators, and Rad-Hard
components for various satellite and space exploration programs.
Solitron Devices, Inc. is well known for producing custom and standard power solid-state components for the
aerospace, defense, industrial, medical, and commercial industries worldwide.
Solitron pioneered the combining of small signal circuitry with power semiconductors to create hybrid circuits for
high-end industrial and military/aerospace applications. Solitron was one of the first companies to integrate
MOSFETs and IGBTs into power hybrid circuits, and has the capability to incorporate Rad-Hard, Single Event Gate
Rupture (SEGR) resistant MOSFETs into its products. In 1968, Solitron Devices, Inc. developed the first quad
power transistor module packaged in a copper package with ceramic eyelets, which were used to drive the wheels
of the Lunar Rover vehicle on the moon.
2-429
Solitron Devices, Inc.
North American Company Profiles
Management
Shevach Saraf
Tom Ruth
Dave Harrison
Chairman, President, and Chief Executive Officer
Vice President, Finance, and Chief Financial Officer
Vice President, Sales and Marketing
Products and Processes
MOS MEMORY
DRAM
SRAM
Flash Memory
EPROM
ROM
EEPROM
Other (Including Non-Volatile RAM)
✔
✔
✔
✔
✔
✔
MOS LOGIC
General Purpose Logic
Gate Array
Standard Cell
Field Programmable Logic
Other Special Purpose Logic
MOS MICROCOMPONENT
MPU
MCU
MPR
DSP
ANALOG
Amplifier
Interface
Consumer/Automotive
Voltage Regulator/Reference
Data Conversion
Comparator
Other (Includes Telecom)
DIGITAL BIPOLAR
Bipolar Memory
General Purpose Logic
Gate Array/Standard Cell
Field Programmable Logic
Other Special Purpose Logic
MPU/MCU/MPR
✔
OTHER
Full Custom IC
Discrete
Optoelectronic
Semiconductor Devices
• More than 1,500 standard transistor and rectifier part types.
• Planar transistors with currents ranging form 1 to 200A and voltage ranging from 40 to 1600V.
• Rad-Hard Semiconductors and Hybrids.
Power Transistors
• Power MOSFETs, N- and P- Channel.
• IGBTs.
• Power Bipolar, NPN and PNP including Darlingtons.
2-430
North American Company Profiles
Solitron Devices, Inc.
Semiconductor Fabrication Facilities
Solitron Devices, Inc.
3301 Electronics Way
West Palm Beach, Florida 33407
Telephone: (561) 868-4311
Fax: (561) 863-5946
Cleanroom size: 30,000 square feet
Processes: Bipolar, MOS
2-431
Space Electronics
North American Company Profiles
S PACE ELECTRONICS (SEI)
Space Electronics, Inc.
4031 Sorrento Valley Boulevard
San Diego, California 92121
Telephone: (619) 452-4167
Fax: (619) 452-5499
Web Site: www.spaceelectronics.com
Fabless IC Supplier
Financial History ($M)
Sales
Employees
1995
4
1996
10
1997
11.2
—
—
75
Ownership: Private-employee owned.
Company Overview and Strategy
Space Electronics, Inc. (SEI) was established in 1992 as a spin-off of Science Applications International
Corporation (SAIC) Microelectronics Technology Center. The focus of Space Electronics is to address the niche
market of spacecraft microcircuits. The company’s proprietary Rad-Pak™, Rad-Coat™, and LPT™ technologies
enable off-the-shelf commercial microelectronic components to survive the typical radiation levels encountered in
space.
Space Electronics Inc. has grown to an internationally recognized supplier of microelectronics for space
applications. They sell to every major space contractor including NASA, Lockheed Martin, Orbital Sciences,
Space Systems Loral, Boeing, TRW and Hughes. Their foreign customers include Mitsubishi, SAAB/Ericsson
Space and the European Space Agency. Their microcircuits are currently in orbit aboard many spacecrafts
including Mars Surveyor, Iridium, Globalstar, and Cassini.
In 1996, they purchased from Megatek Corp. their 2D graphics product line, inventory and capital assets. This
business unit is called Megatek Graphics™ and is currently manufacturing PMC, VME and SBus graphics
accelerator boards for the industrial and military markets.
SEI’s third business unit is Hi-Rel Components and Services which encompasses high reliability components,
upscreening services, and analytical services.
2-432
Space Electronics
North American Company Profiles
Management
Robert Czajkowski
David J. Strobel
Paul Blevins
Chief Executive Officer
President
Chief Financial Officer
Products and Processes
Key space IC product lines include memory chips (EEPROMs, SRAMs, DRAMs, FIFOs), Analog ICs (DACs, Op
Amps, ADCs, voltage regulators), Logic (PLDs, CPUs, FPGAs, I/O-fiber channel, MCMs and hybrids and power
MOSFETs). Megatek Graphics’ line manufactures PMC, VME and SBus graphics accelerator boards.
Key Agreements
•
In March 1998, Space Electronics Inc. announced that it had signed a memorandum of understanding with
Actel Corporation to develop and market a new line of high-reliability, radiation-tolerant Field Programmable
Gate Array (FPGA) products. The agreement calls for the two companies to combine Space Electronics’
patented RAD-PAK package shielding technology with Actel’s commercial FPGA products. The first products
are expected by the second quarter of 1998.
2-433
SST
North American Company Profiles
S ILICON S TORAGE TECHNOLOGY (SST)
Silicon Storage Technology, Inc.
1171 Sonora Court
Sunnyvale, California 94086
Telephone: (408) 735-9110
Fax: (408) 735-9036
Web Site: www.ssti.com
Fabless IC Supplier
Founded: 1989
Regional Offices/Representative Locations
Europe:
Silicon Storage Technology Europe • Staines Middlesex, U.K.
Telephone: (44) (17) 8 449 0455 • Fax: (44) (17) 8 449 0512
Japan:
Silicon Storage Technology Asia • Yokohama, Japan
Telephone: (81) (45) 471-1851 • Fax: (81) (45) 471-3285
U.S. Central:
Silicon Storage Technology • Clearwater, FL
Telephone: (813) 771-8819 • Fax: (813) 771-8719
U.S. East:
Silicon Storage Technology • Ipswich, MA
Telephone: (978) 356-3845 • Fax: (978) 356-6286
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
1*
1
1
—
1993
4*
0.2
2
—
*Primarily license revenues.
Ownership: Publicly held since 1995. NASDAQ: SSTI.
2-434
1994
4
(5)
3
1995
40
6
4
1996
93
12
7
1997
75
(7)
9
—
—
130
180
North American Company Profiles
SST
Company Overview and Strategy
Silicon Storage Technology (SST) designs, manufactures and markets flash memory components for the
computer, communications, and consumer markets. The company currently offers medium density devices
ranging from 512K to 4M, for a range of applications in the computer, communications, multimedia, and video
game markets.
Product development at SST is focused on developing new memory products featuring higher densities, such as
16M and 32M flash memories, for use in digital cameras, memory cards, and digital cellular phones. For the
company’s higher density products, the company is also developing advanced process technologies. SST’s
near-term strategy is to focus on the flash memory market as it continues to replace traditional nonvolatile
memories. SST’s longer term plans are to expand into the mass storage and flash embedded controller markets.
Management
Bing Yeh
Jeffrey L. Garon
Isao Nojima
Yaw Wen Hu
David Sweetman
Joel J. Camarda
Derek Best
Mike Briner
President and Chief Executive Officer
Vice President, Finance and Administration and Chief Financial Officer
Vice President, Memory Design and Product Engineering
Vice President, Technology Development and Wafer Manufacturing
Vice President, Quality and Customer Support
Vice President, Operations
Vice President, Sales and Marketing
Vice President, Design Engineering
Products and Processes
Page Mode Flash Memories —
512K Page Mode Flash Memory — 2.7V-, 3V-, and 5V-only
1M Page Mode Flash Memory — 2.7V-, 3V-, and 5V-only
2M Page Mode Flash Memory — 2.7V-, 3V-, and 5V-only
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SST
North American Company Profiles
Page Erase, Byte Program Flash Memories
4M SuperFlash Flash Memory — 2.7V-, 3V-, and 5V-only
4M PCMCIA Interface Flash Memory — 3V- and 5V-only
1M Many-Times-Programmable (MTP) Flash — 5.0V or 2.7V (2.7-3.6V)
The company’s products are designed and manufactured using the company proprietary SuperFlash™ CMOS
technology.
Semiconductor Fabrication Facilities
SST is a fabless company, therefore, it uses independent foundry companies for the manufacturing of its devices.
The company’s primary foundry partners are Sanyo and Winbond, but SST also has foundry and licensing
agreements with TSMC and Seiko-Epson. Winbond’s foundry agreement expires in 2008.
Key Agreements
•
In October of 1997, SST and Analog Devices, Inc. (ADI) announced a licensing agreement to use SST’s
SuperFlash™ technology in a variety of ADI products.
•
In July of 1997, SST and Information Storage Devices (ISD), Inc. announced a licensing agreement to use
SST’s SuperFlash™ technology in ISD’s new long duration record and playback voice circuits.
•
In March of 1997, SST and Taiwan Semiconductor Manufacturing Corporation (TSMC) announced a licensing
agreement to pursue embedded flash applications. The agreement covers 0.35 and 0.5 micron processes.
•
In March of 1997, SST and Sanyo Electric Co. Ltd., announced plans to jointly develop 0.35 micron
SuperFlash™ process in Sanyo’s first 8” wafer fab in Niigata, Japan. First production shipments are expected in
the second half of 1998. This foundry agreement provides wafer production capacity to SST through 2009.
•
In February of 1997, SST and Seiko-Epson announced a licensing and supply agreement with Seiko-Epson
Corp. for flash memory products.
•
In February 1997, SST signed an agreement with foundry partner TSMC for the production of its 2M products.
As part of the agreement, SST licensed its SuperFlash™ technology to TSMC in exchange for manufactured
wafers.
•
In 1996, SST licensed its SuperFlash™ technology to Seiko-Epson and established a foundry agreement for
production capacity.
•
SST licensed Rockwell the right to use its technology to produce and market 0.8µm embedded modem chips.
The company has similar agreements with ISD and Analog Devices.
2-436
Standard Microsystems
North American Company Profiles
S TANDARD MICROSYSTEMS (SMSC)
Standard Microsystems Corporation
80 Arkay Drive
Hauppauge, New York 11788
Telephone: (516) 435-6000
Fax: (516) 273-5550
Web Site: www.smsc.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Toyo Microsystems Corporation (SMSC Subsidiary) • Tokyo, Japan
Telephone: (81) (3) 5721-2271 • Fax: (81) (3) 5721-2270
Europe:
Standard Microsystems GmbH • Munich, Germany
Telephone: (49) (89) 92861170 • Fax: (49) (89) 92861190
Asia-Pacific:
Standard Microsystems Corporation • Taipei, Taiwan
Telephone: (886) (2) 578-7118 • Fax: (886) (2) 579-1737
Financial History ($M), Fiscal Year Ends February 28
(Includes former System Products Division, now discontinued).
1993
1994
1995
1996
1997
1998*
Corporate
Sales
Net Income
251
16
323
20
379
24
342
12
354
(21)
155
(19)
Semiconductor
Sales
25
57
117
139
179
—
Employees
—
—
—
—
430
400
*Reflects System Products Division as a discontinued operation.
Ownership: Publicly held. NASDAQ: SMSC.
2-437
Standard Microsystems
North American Company Profiles
Company Overview and Strategy
Standard Microsystems Corporation is a worldwide supplier of MOS/VLSI integrated circuits for the personal
computer industry. SMSC has a leading position in input/output (I/O) circuits for PCs with over 80 million units
shipped and, additionally, supplies circuits for local area networks and embedded control systems. The company
also operates a wafer foundry that specializes in MicroElectroMechanical Systems (MEMS) devices. SMSC is a
leading supplier of MEMS, with more than 20 million devices delivered to date.
Standard Microsystems is based in Hauppauge, New York and maintains offices worldwide, including locations in
North America, Asia, Europe, and Japan. SMSC operates engineering design centers in San Jose, CA;
Westborough, MA; Hauppauge, NY; and Austin TX.
Since its establishment in 1971, Standard Microsystems Corporation has had a long history of product and
technology innovation. Some industry firsts include the UART, digital data separator, floppy disk controller with
on-board digital data separator, CRT controller, and single-chip local area network (LAN) solutions.
In the early seventies, SMSC developed a patented semiconductor manufacturing technology, COPLAMOS®,
that provided a better way to isolate active devices on a silicon substrate. This process was essential to the
development of advanced metal-oxide-silicon (MOS) integrated circuits. Through the years, the company has
strengthened its patent portfolio with additional patents in semiconductor, communications and computer
technologies.
SMSC has leveraged its patented technology by incorporating it into the company’s own products and by
licensing it to over two dozen companies, including other semiconductor manufacturers, such as Texas
Instruments Incorporated, Intel Corporation, NEC Corporation, IBM Corporation, Hitachi, Ltd., and AT&T
Corporation.
Management
Paul Richman
Eric M. Nowling
Arthur Sidorsky
George W. Houseweart
John E. Burgess
Douglas L. Finke
Lawrence H. Goldstein
R. Hollingsworth
Peter Ju
Di Ma
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Chairman and Chief Executive Officer
Chief Financial Officer
President
Senior Vice President, Law and Intellectual Property
Vice President, Sales
Vice President and GM, Wafer Foundry Business Unit
Vice President, Engineering
Vice President, Marketing
Vice President, Personal Computer Systems Logic Business Unit
Vice President, Operations
North American Company Profiles
Standard Microsystems
Products and Processes
SMSC's IC product and service offerings include the following.
• Personal computer I/O devices that perform many of the basic input/output functions required in every PC,
including floppy disk control, IDE hard disk interface, parallel port control, and serial port control. Included is a
family of Super and Ultra I/O devices that integrate all of the above functions on a single IC. The Super and Ultra
I/O family includes other new features, such as power management and Fast IR communications.
• Highly integrated Fast Ethernet and single-chip Ethernet products such as an IC that incorporates an
encoder/decoder, 10Base-T transceiver, AT bus interface, and memory management unit (MMU) on a single
chip.
• ARCNET LAN devices for use in PCs and in industrial networking environments.
• Foundry services for customers desiring wafer fabrication capacity for 1.6µm geometries and above or for
specialized semiconductor processing requirements that require unique thin-film expertise. In early 1997,
SMSC announced plans to fully convert its fab to a foundry for the production of micro-electro-mechanical
systems (MEMS), which are tiny systems such as sensors, motors, and valves used in a variety of applications.
SMSC has been producing MEMS for several years.
SMSC is certified as an ISO 9002 supplier.
Semiconductor Fabrication Facilities
SMSC utilizes a mix of internal and external wafer fabrication sources to manufacture its products. Its more mature
products are produced at its fab in New York, while newer products, utilizing 0.6µm and 0.5µm and smaller
technologies are produced by external wafer foundries in Europe and Asia
In 1995, SMSC made a $16 million investment in Lucent Technologies’ Madrid fab and a $20 million investment in
Chartered Semiconductor to enhance its external wafer supply (see Key Agreements).
Standard Microsystems Corporation
35 Marcus Boulevard
Hauppauge, New York 11788
Capacity (wafers/week): 2,500
Wafer size: 100mm
Processes: MEMS, 2µm CMOS, 3µm CMOS and NMOS
Products: Foundry services
Feature sizes: 1.6µm-3.0µm
(This fab is being fully converted to
a dedicated MEMS foundry).
2-439
Standard Microsystems
North American Company Profiles
Key Agreements
• As of October 7, 1997, SMSC sold 80.1 percent of their former Systems Products Division to Accton
Technology Corporation. SMSC’s continuing operations will now almost entirely consist of its Component
Products Division.
• SMSC and Intel agreed to work together to integrate new semiconductor I/O chips into selected Intel PC
motherboard designs through the end of 1997. SMSC will provide Intel with the I/O devices, which have been
specifically designed to work with Intel’s newer microprocessors and core logic chipsets. Intel holds a 10
percent equity interest in SMSC.
• In 1995, SMSC made a $20 million investment in Singapore-based foundry Chartered Semiconductor
Manufacturing (CSM) in return for guaranteed capacity from CSM's new 200mm wafer fab that came on-line in
2H95.
• SMSC struck a foundry deal with Lucent Technologies in 1994 under which SMSC agreed to boost the
capacity of Lucent's fab facility in Madrid, Spain, in return for a guaranteed portion of the fab output over a fiveyear period. The new equipment has the capability to produce devices with 0.9µm to 0.45µm feature sizes.
SMSC received its first wafers in 1996.
2-440
Stanford Telecommunications
North American Company Profiles
S TANFORD TELECOMMUNICATIONS, INC . (STI)
Stanford Telecommunications, Inc. (STI)
1221 Crossman Ave.
Sunnyvale, CA 94089
Telephone: (408) 745-0818
Fax: (408) 745-7756
Web Site: www.stelhq.com and www.stel.com
Financial History ($), Fiscal Year Ends March 31
Revenues
R&D Expenditures
Net income
Property/Capital
Equipment Expenses
1993
92,821
—
1,159
1994
98,055
—
3,536
1995
114,384
7,723
131
1996
145,100
8,429
6,173
1997
167,002
11,868
8,011
1998
153,260
13,647
5,216
—
—
6,210
4,482
5,501
—
—
—
—
—
967
1,000
Employees
Ownership: Publicly held. NASDAQ: STII.
Revenues for the Company's contract manufacturing business amounted to approximately 20 percent of total
revenues for fiscal 1996 and 1997, an increase from approximately 10 percent of revenues for fiscal 1995.
Company Overview and Strategy
Founded in 1973, Stanford Telecom (STI) designs, assembles, and markets advanced digital communications
products and systems to establish or enhance communications via satellites, terrestrial wireless and cable. STI
also provides communication systems networking solutions and Global Positioning System (GPS) navigation
products. STI’s expertise encompasses all the technologies required for these systems, including radio
frequency (RF), digital, Application Specific Integrated Circuits (ASIC), software, and system design. STI maintains
a low cost, high volume commercial assembly capability and offers cost effective engineering services.
STI’s principal base business areas and products include:
•
•
•
•
•
•
•
•
Advanced Communications for Government Agencies;
Transportable Milstar Terminal;
Tri-band Terminals;
Communication Satellite Performance Monitoring;
Air Traffic Control Systems Modernization;
Satellite Based Air Traffic Control System;
Commercial Telecommunications Chip and Board Level Products;
Commercial Electronic Contract Manufacturing.
2-441
Stanford Telecommunications
North American Company Profiles
After reviewing STI overall, this profile will focus on STI’s Commercial Telecommunications Chip and Board Level
Products business below in the Products and Processes section.
STI has over 60 patents granted or applied for in communications technologies such as Code Division Multiple
Access (CDMA) and Orthogonal CDMA (OCDMA), Asynchronous Transfer Mode (ATM) network management,
Time Division Multiple Access (TDMA), high speed adaptive equalizers, and error correction decoders, as well as
ASIC semiconductor chips to implement these technologies.
STI initiated efforts in 1994 to expand its business by exploiting its technology base and intellectual property in
pursuit of high-growth potential commercial products. STI anticipated those market opportunities should begin to
yield revenue and earnings for the company in the later part of fiscal year 1998. These markets include satellite
personal communications, via STI’s key role in TRW’s $2.8 billion Odyssey satellite communication system.
Odyssey is an intermediate circular orbit constellation for global personal mobile communication which uses STI’s
patented OCDMA technology. STI expects this large program to begin during the first half of fiscal year 1998. STI
also has a development role for a future satellite system to provide Ka-band worldwide high-speed data service.
STI is developing subscriber and head-end equipment to support worldwide demand for Local Multipoint
Distribution System (LMDS) and Multichannel Multipoint Distribution System (MMDS). STI expects to participate in
a significant number of field and market trials during fiscal year 1998.
As a result of 1994 strategic investments, STI has developed and is currently selling in high quantities, modulation
and demodulation chip and board products to support two-way communications over cable networks for
telephony and high-speed Internet access. STI feels the development investments have progressed well and it
anticipates business volume to increase during the second half of fiscal year 1998.
Management
Dr. James J. Spilker, Jr.
Dr. Val P. Peline
Gary S. Wolf
Jerome F. Klajbor
George Hendry
Ernest L. Dickens, Jr.
Bronic C. Knarr
Hatch Graham
Chuck Frank
Leonard Schuchman
Dr. John E. Ohlson
Wayne Fuller
Bruce Currivan
Brian Davis
2-442
Founder, Chairman and Principal Scientist
President and Chief Executive Officer
Executive Vice President
Vice President and Chief Financial Officer
Vice President, Wireless Broadband Products Operation
Vice President, Satcom Ground Systems Operation
Vice President, Manufacturing and Quality Assurance
Vice President, ASIC and Custom Products Division
Vice President, Telecom Component Products Group
(a unit of ASIC and Custom Products Division)
Director, Comms. and Nav Systems Operation
Director, Satellite Personal Comms. Operation
Director of Network Management Products
Systems Energy Manager, ASIC and Custom Products Division
Energy Manager, Digital Frequency Synthesizers
North American Company Profiles
Stanford Telecommunications
Products and Processes
STI’s Commercial Telecommunications Chip and Board Level Products business is composed largely of two
Sunnyvale headquarters units, the ASIC & Custom Products Division and the Manufacturing and Quality
Assurance Group. These units design, assemble and market a wide range of Application Specific Integrated
Circuits (ASIC) and board level assemblies for a variety of commercial telecommunication applications. These
products provide the digital signal processing required to transmit and receive information. The units offer
products for PSK (Phase Shift Key) modulation and demodulation, digital down conversion, the reception and
transmission of spread spectrum information, forward error correction, adaptive equalization and direct digital
frequency synthesis.
Key market areas addressed by the Chip and Board Level Products units include cable/Internet communications,
VSAT receiver assemblies, and a catalog of ASIC and digital communications-related board level products. The
ASIC and Custom Products Division is organized into the Telecom Component Products Group and the Catalog
Products Group.
STI was among initial vendors offering modulation and demodulation devices cable applications. Its cable/Internet
products include the STEL-1109, a single-chip complete BPSK/QPSK (QAM/Bi-Phase Shift Key/Quadra-Phase
Shift Key) modulator ASIC, (including DAC and Reed-Solomon encoder/scrambler), specifically designed for the
transmission of data from the subscriber to the headend and the STEL-9257. The chip is compliant with all
802.14, MCNS and Davic standards and is fabricated in 0.35 micron, 3-V CMOS technology. A Burst Demodulator
board level assembly is also offered, providing demodulation of burst QPSK signals in the upstream environment.
The STEL-1108 PQFP-only predecessor introduced in February 1996 was an 80-pin single-chip using SMT
packaging and 3.3V CMOS technology. An example of another ASIC is 22,000-gate adaptive equalizer.
STI’s VSAT digital demodulator receiver assemblies used for rural telephony, background music services and
business data transmissions. The STEL-9236 product family and the recently introduced STEL-9258 Variable Bit
Rate product can provide signal timing recovery, demodulation, down conversion, carrier tracking and forward
error correction functions. Since product introduction, STI has received orders for approximately 17,000 VSAT
receiver assemblies.
STI’s catalog of ASIC and board level products are designed for various digital communications functions including
ASICs for spread spectrum wireless data links, a family of ASICs for forward error correction in communication links,
and a series of numerically controlled oscillators and direct digital synthesizers for precise signal generation and
control.
In fiscal 1993, STI launched its Commercial Electronic Contract Manufacturing business unit, the Manufacturing
and Quality Assurance Group. In addition to producing its own products, the unit offers its contract manufacturing
services to commercial customers, principally producers of electronics and medical products, on either an
inventory consignment or turnkey basis. STI’s Sunnyvale, California manufacturing facilities received ISO-9001
certification during fiscal 1996. During fiscal 1997, approximately 16 percent of the unit’s activities were
associated with STI’s own products.
2-443
Stanford Telecommunications
North American Company Profiles
Semiconductor Fabrication Facilities
The production of STI’s ASICs are fabricated by several suppliers including Zilog, American Microsystems Inc.,
Lucent Technologies, and LSI. Some of the products are fabricated on a sole-source basis.
Key Agreements
•
Zilog licensed STI’s DSSS baseband chip technology, but details of the agreement are unavailable.
•
In July 1997, the Radiocommunications unit of Alcatel Alsthom’s (France) Alcatel Radio, Space and Defense
Division, (a Telecom sector Division), agreed to jointly develop and market the Alcatel 9900 WW product family,
a system which applies wideband technologies to radio access solutions, to operators of multi-service networks
in densely-populated locations. The point-to-multipoint radio technology will be used in small and mediumsized enterprises networks and in mobile networks providing a more economical transmission means than
point-to-point connections in densely-populated areas. The system incorporates a central station and up to
several hundred terminal stations: these in turn are connected to one or more networks — usually a voice
network and a broadband data network. In order to meet the ANSI standard in the U.S., as well as the ETSI
standard for the rest of the world, development is being carried out in Alcatel facilities in both Europe and the
U.S. Information on STI chip/technology content was unavailable.
•
In November 1996, STI signed an OEM agreement to use Gensym Corporation’s (Cambridge; NASDAQ:
GNSM), flagship G2 software and other Gensym products to develop and deploy NetCoach, STI’s network
management product for heterogeneous Asynchronous Transfer Mode (ATM) networks. STI used G2 to build
the NetCoach inference engine and expert management capabilities. The new agreement enables STI to
integrate the intelligent fault and performance management capabilities of Gensym's new Fault Expert to
address quality of service and large message traffic volumes issues inherent in ATM networks.
2-444
Suni Imaging Microsystems
North American Company Profiles
S UNI IMAGING MICROSYSTEMS
Suni Imaging Microsystems, Inc.
185 E. Dana St.
Mountain View, CA 94041
Telephone: (650) 237-1060
Fax: (650) 968-6721
Fabless IC Supplier
Ownership: Privately held.
Company Overview and Strategy
Suni Imaging Microsystems, founded in 1995, develops low cost digital imaging designs which utilize both CCD
and CMOS technologies. The company has a proprietary CMOS-CCD process. Typical applications are for high
speed CD-ROMs and DVD pickups.
Management
Mr. Paul Suni
President and Chief Executive Officer
2-445
Supertex
North American Company Profiles
S UPERTEX
Supertex, Inc.
1235 Bordeaux Drive
Sunnyvale, California 94089
Telephone: (408) 744-0100
Fax: (408) 745-4800
Web Site: www.supertex.com
IC Manufacturer
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
24
2
4
1
1994
26
3
4
1
1995
32
5
4
2
1996
43
7
6
5
1997
49
9
5
7
240
235
265
274
318
1998
53
9
6
—
—
Ownership: Publicly held. NASDAQ: SUPX.
Company Overview and Strategy
Established in 1976, Supertex is a niche-oriented company that designs, develops, manufactures, and markets
high voltage semiconductor products utilizing advanced DMOS and HVCMOS process technologies. Supertex
merged CMOS and DMOS processes creating its proprietary HVCMOS® technology. The company originally
conducted business as a foundry. However, starting in fiscal 1990, and through fiscal 1992, the company's
foundry business was phased out as sales of proprietary products steadily increased.
Supertex's proprietary products are sold to electronic equipment manufacturers in the computer,
telecommunications, instrumentation, defense, medical, and consumer products industries. More specifically,
Supertex's products are targeted at applications in ultrasound imaging and medical electronics, flat panel displays,
LCD backlighting, non-impact printers and plotters, telecommunications, and high-reliability military and
commercial aerospace systems.
2-446
Supertex
North American Company Profiles
Management
Henry C. Pao, Ph.D.
Richard E. Siegel
Benedict C.K. Choy
Bill Numann
Dennis Kramer
President and Chief Executive Officer
Executive Vice President
Senior Vice President, Technology Development and IC Products
Vice President, DMOS Products
Vice President, Materials
Products and Processes
Supertex has developed advanced technologies using CMOS and DMOS (Double-diffused MOS) processes. It
pioneered the merging of CMOS and DMOS processes into its proprietary HVCMOS® (high-voltage CMOS)
technology. This process allows for the combination of the high speed and low power logic circuit of CMOS and
the high voltage output drive of DMOS on the same chip, thus creating the high voltage IC, or HVIC. Supertex
intends to maintain a leadership position in the HVIC segment of the semiconductor industry.
•
The DMOS product line includes depletion-mode and low-threshold enhancement-mode transistors and
arrays.
•
There are three distinct categories of HVIC products available, digital products, analog products, and BiCMOS
mixed-signal products.
•
The digital product family includes driver/interface ICs for flat panel displays and non-impact printers and
plotters.
•
The analog product family includes high voltage analog switches and multiplexers, which are used in the
medical ultrasound imaging industry.
•
The BiCMOS product family consists of DC/DC converters and power supply and backlighting inverter ICs.
2-447
Supertex
North American Company Profiles
Semiconductor Fabrication Facilities
Supertex, Inc.
1235 Bordeaux Drive
Sunnyvale, California 94088-3607
Cleanroom size: 13,000 square feet
Capacity (wafers/week): 1,700
Wafer size: 100mm
Processes: CMOS, DMOS, HVCMOS, BiCMOS
Products: High-voltage ICs, discretes
Feature size: 1.0µm and 3.0µm
Key Agreements
• Supertex made an agreement with Texas Instruments in 1991 that provided TI the rights to use Supertex's
HVCMOS process technologies in return for license fees and royalties, as well as access to TI's foundry and
assembly services.
• Supertex has received funding from the U.S. Government's ARPA agency to research and develop dielectricisolation (DI) technology. The goal of the project is to further raise the voltage and operating speed of ICs.
2-448
Symbios, Inc.
North American Company Profiles
S YMBIOS, INC .
Symbios, Inc.
2001 Danfield Court
Fort Collins, Colorado 80525-2998
Telephone: (970) 226-9550
Fax: (970) 226-9660
Web Site: www.symbios.com
IC Manufacturer
Regional Headquarters/Representative Locations
World Sales Headquarters:
Symbios, Inc.
Telephone: (408) 452-0303 • Fax: (408) 453-0309
Europe:
Symbios, Inc. • Munich, Germany
Telephone: (49) (89) 547470-0 • Fax: (49) (89) 547470-20
Asia-Pacific:
Symbios, Inc. • Singapore
Telephone: (65) 337-6323 • Fax: (65) 337-6313
Financial History ($M)
Sales
Employees
1992
228
1993
274
1994
354
1995
520
1996
600
1997
620
—
1,950
2,010
2,200
2,300
2,200
Company Overview and Strategy
Symbios, Inc. was established in February 1995, when Hyundai completed the purchase of the NCR
Microelectronic Products Division from AT&T Global Information Solutions Co., a wholly owned subsidiary of AT&T
Corporation. Originally established in 1972, NCR Microelectronic Products Division was acquired as part of NCR
Corporation in 1991 by AT&T Corporation (NCR Corporation was later named AT&T Global Information Solutions).
Hyundai renamed the company Symbios Logic. Symbios being a derivative from the word symbiosis, meaning a
mutually beneficial relationship.
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Symbios, Inc.
North American Company Profiles
Symbios, Inc., now a wholly owned, independently operated subsidiary of Hyundai Electronics America,
manufactures semicustom ICs including cell-based ASICs and a family of application-specific standard products
(ASSPs). Its cell library includes extensive analog functions for cell-based mixed-signal ASICs and complex
standard function macrocells (cores) for embedded SCSI, Ethernet, disk drive electronics, and serial
communications. Symbios is a leader in bus interface technology, offering high-performance application-specific
SCSI (including an extensive family of PCI-SCSI I/O controllers), Ethernet cores, 1,394 devices and host adapters,
USB host adapters, fibre channel devices, host adapters and RAID systems and controllers.
Several firsts claimed by the company include the first SCSI protocol chip, the first OEM RAID chipset, and the first
Fibre Channel RAID controller board. The company believes it holds 33 percent of the worldwide SCSI chip
market, and 10 percent of the worldwide market for disk and tape drive electronics. It is one of the three top
suppliers of OEM RAID products.
Management
Charles F. Christ
Jeff Dumas
Dan Ellsworth
Tom Lagatta
Al Lofthus
Tim McCarthy
Darrell Jones
Lynn Turner
Tom Georgens
President and Chief Executive Officer
Vice President, General Counsel, and Secretary
Vice President, Technology
Vice President, Marketing and Business Development
Vice President, Strategic Initiatives
Vice President, Symbios Semiconductor Division
Vice President, Manufacturing
Chief Financial Officer
Vice President, Storage Solutions Division
Products and Processes
Symbios is comprised of four business units: Client/Server, OEM RAID, MetaStor™, and ASIC and Peripheral
Solutions. Listed below are the major products of each business group.
Client/Server Products
• Client and server I/O products including SCSI devices.
• Communications products including LAN communications devices.
• SCSI host adapter boards.
OEM RAID
• RAID storage systems and controller boards.
MetaStor™
• Scalable enterprise level server and network-attached storage systems for the end-user market.
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North American Company Profiles
Symbios, Inc.
ASIC and Peripheral Solutions
• ASIC products include CMOS cell-based ASICs, both digital and mixed-signal, and complex core-related
products as well as disk, tape, and CD-ROM drive electronic products, including data controllers, servo
subsystems, and peripheral interfaces. In November 1996, Symbios unveiled its 0.35µm, five-layer-metal,
one-million-gate, cell-based ASIC family. The company’s cell and core libraries support a wide range of ASIC
applications, including set-top boxes, cellular phones, PCs, workstations, telecommunications, LAN and
wireless communications, and electronic data processing. Submicron mixed-signal CMOS ASICs account for
more than one-third of Symbios’ cell-based ASIC sales.
Semiconductor Fabrication Facilities
The plant in Fort Collins, Colorado will be phased out by the end of 1997.
Symbios Logic Inc.
1635 Aeroplaza Drive
Colorado Springs, Colorado 80916
Telephone: (719) 596-5795
Cleanroom size: 24,500 square feet
Capacity (wafers/week): 5,000
Wafer size: 200mm
Process: CMOS
Products: ASICs, ASSPs, logic ICs
Feature sizes: 0.35µm-2.0µm
Symbios has a manufacturing and library development agreement with Hyundai.
Key Agreements
• In February 1998, Adaptec, Inc. announced that it had signed an agreement to acquire Symbios, in a cash
transaction valued at $775 million, including assumed liabilities. Completion of the transaction is subject to
regulatory approval under the Hart-Scott-Rodino Act.
• Symbios Inc. formed an alliance with Hyundai Electronics Industries (HEI) to develop a new deep sub-micron
0.35µm five-layer metal CMOS technology. The program was successfully completed in early 1997. The
partnership will be extended to the 0.25µm level.
• Symbios also has a manufacturing agreement with HEI.
• In 1995, Symbios licensed Advanced RISC Machines Ltd.’s “Thumb” 32-bit RISC processor core for use in I/O
channel controllers and other intelligent peripheral products.
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Synergy Semiconductor
North American Company Profiles
S YNERGY S EMICONDUCTOR
Synergy Semiconductor Corporation
3450 Central Expressway
Santa Clara, California 95051
Telephone: (408) 980-9191
Fax: (408) 567-7878
Web Site: www.synergysemi.com
IC Manufacturer
Financial History ($M)
Sales
Employees
1993
14
1994
19
1995
26
1996
30
1997
38
—
110
175
180
211
Ownership: Privately held.
Company Overview and Strategy
Founded in 1987, Synergy Semiconductor Corporation designs, develops, manufactures, and markets highperformance digital and mixed-signal integrated circuits using bipolar and BiCMOS processes. Synergy’s
products include precision time-clock generators for computers and workstations, and communications circuits for
local and wide area networks. Synergy’s products employ proprietary design and process technology, resulting in
high-performance ICs. The company’s products are designed by an internal design team, and built in the
company’s in-house wafer fabrication facility.
Management
Thomas D. Mino
T. Olin Nichols
George W. Brown
Tom Lauer
Larry J. Pollock
Luke Smith
E. Marshall Wilder
Thomas S. Wong
Mike Economy
Dona Flamme
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President and Chief Executive Officer
Chief Financial Officer
Vice President, German Operations
Vice President, Sales
Vice President, Technology
Vice President, Operations
Vice President, Quality and Administration
Vice President, Engineering
Director, Marketing, Clocking, Logic and RAM Products
Director, Marketing, Communications Products
Synergy Semiconductor
North American Company Profiles
Products and Processes
Synergy supplies high-speed ICs to a range of systems vendors of public network equipment, such as
multiplexers and digital access cross-connect systems (DACS); LAN and WAN private network equipment, such as
adapter cards and hubs; high-performance workstations and superservers; and automatic test equipment (ATE).
Synergy’s products encompass three families: the ECLinPS and Super300K family of ultra-high-speed ECL logic
products, the ClockWorks family of clock generation and distribution devices, and the SuperCOM family of optical
fiber transceivers, copper wire transceivers, and clock recovery devices. Synergy recently introduced a family of
network and communication products for Fast Ethernet, FDDI, ATM, SONET, and SDH applications utilizing its
proprietary bipolar ASSET™ (All Spacer Separated Element Transistor) technology.
Semiconductor Fabrication Facilities
Synergy Semiconductor
3250 Scott Boulevard
Santa Clara, California 95054
Telephone: (408) 980-9191
Cleanroom size: 10,000 square feet
Capacity (wafers/week): 500
Wafer size: 100mm
Processes: Bipolar, BiCMOS
Products: Transceivers, SRAMs, logic products,
clock control circuits, FIFOs, translators.
Feature sizes: 1.2µm, 1.5µm (bipolar);
1.0µm (BiCMOS);
submicron in development.
Silicium Microelectronic Integration (SMI)
(Formerly System Microelectronic Innovation)
Wildbahn, Markendorf
O-15203 Frankfurt (Oder), Germany
Telephone: (49) 335-46-2200
Capacity (wafers/week): 2,400 (10,500 max.)
Wafer size: 100mm
Processes: Bipolar, BiCMOS
Products: Logic, memory, and linear ICs, ASICs
Feature sizes: ≥1.2µm
(Joint venture between Synergy and the German
government. Synergy holds a 49 percent stake).
Wafer probing and packaged product test capabilities are performed in-house.
Key Agreements
•
In April 1995, Synergy entered into a technology license agreement with Linear Technology Corporation.
Under the agreement, Synergy gave LTC the right to use its bipolar ASSET technology to develop noncompetitive products.
•
In March of 1993, Synergy entered into an agreement with the German government to form System
Microelectronic Innovation (SMI). This is a joint venture which is currently 49 percent owned by Synergy and 51
percent owned by the German government. As part of this agreement, Synergy transferred its ASSET
technology to SMI, enabling it to produce Synergy's family of ECL SRAMs, logic ICs, clock control circuits,
translators, and semicustom products and market them throughout Europe.
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Synergy Semiconductor
•
North American Company Profiles
Synergy entered into a comprehensive strategic alliance with Toshiba Corporation in November 1990. The
alliance covers foundry, joint R&D and manufacturing, technology licensing, and an equity investment in
Synergy by Toshiba. Under terms of the manufacturing agreement, Toshiba is providing Synergy with the use
of a high-volume (150mm, submicron) IC fabrication line, which is running Synergy's high-performance ASSET
and BiCMOS technologies. This fab allows Synergy to produce its current SRAM and logic products, as well as
future products.
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TelCom Semiconductor
North American Company Profiles
TELCOM S EMICONDUCTOR
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
P.O. Box 7267
Mountain View, California 94039-7267
Telephone: (650) 968-9252
Fax: (650) 967-1590
Web Site: www.telcom-semi.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
TelCom Semiconductor GmbH • Martinsried, Germany
Telephone: (49) (89) 89-56-500 • Fax: (49) (89) 89-56-5002
Asia-Pacific:
TelCom Semiconductor H.K. Ltd. • Kowloon, Hong Kong
Telephone: (852) 2350-7380 • Fax: (852) 2354-9957
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1994
25
1
1
2
1995
39
4
3
10
1996
38
(1)
4
4
1997
55.4
(1.7)
5.4
8
263
327
302
296
Ownership: Publicly held. NASDAQ: TLCM.
Company Overview and Strategy
TelCom Semiconductor, Inc. is a worldwide manufacturer of linear and mixed-signal products dedicated to solving
problems over a broad spectrum of customer applications. TelCom’s product line includes data acquisition, power
management, interface, and thermal sensing devices. The company is headquartered in Mountain View,
California, where it owns and operates a dedicated wafer manufacturing facility, producing proprietary products.
Testing is performed at their Hong Kong facility, and products are sold through a network of worldwide sales
offices, sales representatives, and distributors.
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TelCom Semiconductor
North American Company Profiles
Management
Philip M. Drayer
Edward D. Mitchell
R. Michael O'Malley
Naresh Barta
Dan Riordan
Don Herman
Allan I. Resnick
President and Chief Executive Officer
Vice President, Engineering and Chief Technical Officer
Vice President, Chief Operating Officer, and Chief Financial Officer
Vice President, Strategic Marketing
Vice President, Business Development and Worldwide Sales
Vice President, Human Resources
Vice President, Assembly and Test Operations
Products and Processes
TelCom's main products are divided into three areas of focus.
• Mixed-signal ICs: includes A/D converters, V/F and F/V converters, and voltage references.
• Power management ICs: includes MOSFET power drivers, PWM controllers, DC/DC converters, switching
regulators, CMOS voltage detectors, microprocessor supervisor circuits, and charge pumps.
• Smart sensors: includes solid-state thermal management and fan controllers.
Semiconductor Fabrication Facilities
TelCom Semiconductor, Inc.
1300 Terra Bella Avenue
Mountain View, California 94043
Cleanroom size: 9,000 square feet
Capacity (wafers/week): 1,000
Wafer size: 125mm
Processes: Silicon- and metal-gate CMOS, BiCMOS,
CMOS/DMOS, DMOS, bipolar.
Feature size: 3.0µm
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Teltone Corporation
North American Company Profiles
TELTONE CORPORATION
Teltone Corporation
22121 - 20th Avenue SE
Bothell, Washington 98021
Telephone: (425) 487-1515
Fax: (425) 487-2288
Web Site: www.teltone.com
Email: info@teltone
Fabless IC Supplier
Financial History (000s), Fiscal Year Ends June 30
Sales
Engineering and
Development Expenses
Net (Loss) Income
Capital Equipment
Expenses
Employees
1993
9,679
1994
7,600
1995
9,176
1996
9,471
1997
10,053
1998
9,049
—
932
—
907
—
405
819
377
962
(42)
1,147
(155)
—
—
—
62
130
—
—
—
—
—
62
58
Ownership: Publicly held. OTC BB: TTNC.
Fiscal 1997’s sales increase was driven in part by an 11 percent increase in the sale of integrated circuits, following
1996’s decline over 1995. However, margins on ICs declined for a second consecutive year.
Sales in the first half of fiscal 1998 ending 31 December, 1997, were $4.362 million, down 13 percent from the
same period in fiscal 1996. The decrease was attributed partly to a 27 percent decrease in IC sales during the
period compared to fiscal 1997.
Teltone noted that the most significant change in 1H fiscal 1998 versus 1H fiscal 1997 was an increase in
engineering and development expenses by 87 percent to $748,000 for the period, reflecting increased
development and design work on the OfficeLink 2000 product and on newer lower cost IC chip families planned to
be introduced later in fiscal 1998.
Company Overview and Strategy
Founded in July 1968, Teltone sells specialized telecommunications software, equipment and components.
Teltone's customers include business end-users, original equipment manufacturers (OEMs), telephone call
centers, and utilities.
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Teltone Corporation
North American Company Profiles
Teltone's component business is fabless, but has been able to compete successfully in the marketplace because
of the value added by the company's proprietary products, customer service and applications support for its
component products. The most significant competition for Teltone's components comes from integrated circuit
manufacturers, some of them Teltone's suppliers, that also sell to Teltone's customer base.
Teltone’s IC products are distributed by nine U.S. companies (with 83 total sales offices), two companies in
Canada and 44 companies in more than 38 other countries.
Management
Richard W. Soshea
Richard G. Johnson
Ray Ma
Jeffrey B. deCillia
Mark Blazek
Peter C. Spratt
Don Andresen
Jay Zeman
President and Chief Executive Officer
Vice President, Operations
Vice President, Engineering
Vice President, Finance and Chief Financial Officer
Vice President, Sales and Marketing
Secretary and General Counsel
Manager, Quality
Manager, OEM Market Group
Products and Processes
Teltone’s IC product lines include MF Trunk Signaling ICs (for PBX systems, test equipment, trunk adapters,
paging terminals, and traffic recorders); Call Progress Tone Receivers and Transmitters (for automatic dialers,
dialing modems, traffic measurement equipment, callback security systems, test equipment, service
evaluation and billing systems, central office, wireless, and PBX switches, test equipment); DTMF Receivers (for
applications in telephone switching, PBX and intercom systems, answering and recording devices, radio
communication switching, remote control, monitoring and alarm devices, and data entry systems); DTMF
Transceivers w/Call Progress Detection Industry-standard DTMF transceivers plus call progress (Motorola and Intel
microprocessor-compatible); DC Signaling Components (line sensing relays and other products for central office
products, PBX and key systems, and rotary dial monitoring devices). Most of Teltone’s IC products are available in
regionalized versions as necessitated by telephony regulatory requirements (i.e., CCITT R2 MF compliant version
for single channel multifrequency trunk receivers outside of North America).
Teltone’s custom microcircuitry components are normally purchased from single sources but, because the
company owns the tooling for these components, other electronics manufacturers could take over if an existing
vendor ceased production. Teltone believes its expertise and value-adding processes involving digital signal
processing make its ICs more competitive on a price-performance basis.
Teltone achieved ISO 9001 certification February 4, 1997.
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North American Company Profiles
Teltone Corporation
Key Agreements
•
In April 1996, Teltone announced that after expiring in March 1996, it had revitalized a 13 year strategic
relationship with Silicon Systems Inc. (SSi) of Tustin, CA. The agreement consisted of three parts:
– A long-term supply agreement whereby SSi agreed to continue to act as foundry for a number of DTMF (M957) and Call Progress lines (M-981, M-982, M-984) that Teltone sells to telecom OEMs;
– A second-sourcing agreement whereby SSi agrees to second-source Teltone Call Progress products (M980); and
– A joint development agreement by which SSi and Teltone will develop new products for telecom OEMs that
Teltone will define and market and SSi will design and manufacture.
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Texas Instruments
North American Company Profiles
TEXAS INSTRUMENTS (TI)
Texas Instruments Incorporated
Semiconductor Group
P.O. Box 655303
Dallas, Texas 75265
Telephone: (214) 995-2011
Fax: (214) 997-5250
Web Site: www.ti.com/sc
IC Manufacturer
Founded: 1930
(See Top Ten)
2-460
TLSI
North American Company Profiles
TLSI
TLSI, Incorporated
815 Broadhollow Road
Farmingdale, New York 11735
Telephone: (516) 755-7005
Fax: (516) 755-7626
Web Site: www.tlsi.com
Fabless IC Supplier
Company Overview and Strategy
TLSI designs and markets analog, digital, and mixed-signal ICs for the automotive, telecommunications, industrial
process control, security, home appliance, and military/aerospace markets. TLSI was formed as a division of
Telephonics Corporation in 1977, to provide Telephonics with ICs needed for its military and commercial airline
communication systems. Today, TLSI remains a wholly owned subsidiary of Telephonics and provides ICs to the
general marketplace.
Management
Mort Pullman
R. Hartig
Jerry Powder
President
Vice President, Business Management
Director, Sales and Marketing
Products and Processes
TLSI offers a wide range of solutions in the area of full custom MOS, cell-based, and gate array configurations.
Broken down into categories, these alternatives include the following.
Full Custom:
Includes transistor-level designs.
Standard Cell Library:
Characterized functions with auto place-and-route using standard height and variable width cells.
Standard Cell Library with Custom Interconnect:
Characterized functions with Calma operator place-and-route using standard height and variable width cells.
Minimum Area Cell Libraries with Custom Interconnect:
Custom interconnect with minimum sized cells to reduce die area and development time/cost for highervolume requirements where a full custom configuration may not be required.
Analog and Digital Functions Combined on the Same Chip:
Maximizes system integration and minimizes printed circuit board area.
When TLSI designs its chips, it selects any of the following process technologies that best fits the customer’s
specific application: 0.6µm to 3µm CMOS, EEPROM, 1.5µm BiCMOS, or bipolar.
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TranSwitch
North American Company Profiles
TRAN S WITCH
TranSwitch Corporation
3 Enterprise Drive
Shelton, Connecticut 06484
Telephone: (203) 929-8810
Fax: (203) 926-9453
Web Site: www.transwitch.com
Fabless IC Supplier
Financial History ($000s), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1995
17.5
(1.8)
1
7
1996
19.7
(10.1)
2
9
1997
27.1
(1.9)
3
9
—
—
115
Employees:
Ownership: Publicly held. NASDAQ: TXCC.
Company Overview and Strategy
TranSwitch Corporation designs, develops, and markets highly integrated digital and mixed-signal semiconductor
products for broadband telecommunications and data communications applications.
The company’s product line includes very large scale integration (VLSI) devices that serve three markets:
worldwide public telephone networks, Internet, and wide area networks (WAN).
Management
Santanu Das, Ph.D.
Michael F. Stauff
Moshe Mazin
Watson Coverdale
Mike McCoy
Frank Middleton
Robert G. Pico
Kandaswamy Thangamuthu
Daniel C. Upp
Jitender K. Vij
William Bartholomay
2-462
President and Chief Executive Officer
Senior Vice President, Chief Financial Officer
Vice President, Engineering
Vice President, Sales
Vice President, Controller
Vice President, Strategic Sales
Vice President, Business Development
Vice President, Operations
Vice President, Technology Development
Vice President, Systems Engineering
Vice President, Product Definition
North American Company Profiles
TranSwitch
Products and Processes
TranSwitch’s IC devices include asynchronous (PDH), synchronous (SONET/SDH), and asynchronous transfer
mode (ATM) communications circuits.
The asynchronous products include line interface,
multiplexer/demultiplexer, framer, and data communications devices. The synchronous product line includes line
termination, overhead processor, mapper, and multiplexer/demultiplexer devices. The ATM products include
physical layer, ATM layer, and ATM adaptation layer devices that implement a variety of public and private switching
and multiplexing products.
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Trident Microsystems
North American Company Profiles
TRIDENT MICROSYSTEMS
Trident Microsystems, Inc.
189 North Bernardo Avenue
Mountain View, California 94043-5203
Telephone: (650) 691-9211
Fax: (650) 691-9260
Web Site: www.tridentmicro.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Asia-Pacific:
Trident Microsystems (Far East) Ltd. • Kowloon, Hong Kong
Telephone: (852) 2756-9666
Trident Microsystems (Far East) Ltd. • Taipei, Taiwan
Telephone: (886) 2550-6616
Financial History ($M), Fiscal Year Ends June 30
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1993
78
10
7
—
1994
69
1
10
—
1995
107
8
13
—
1996
168
17
11
14
1997
178
15
12
26
130
150
268
308
385
Ownership: Publicly held. NASDAQ: TRID.
Company Overview and Strategy
Founded in 1987, Trident Microsystems designs, develops, and markets very large scale integrated circuit
graphical user interface (GUI) accelerators, graphics controllers, and multimedia video processors targeting the
mainstream PC desktop, notebook, and multimedia markets.
Trident’s initial product offerings began with SVGA controllers in 1989 and moved toward mixed-signal controllers
in 1993. The year 1994 marked a year of transition for Trident that included its entrance into the GUI accelerator
market. Although its revenues declined in 1994, the transition to the GUI accelerator market proved successful in
the following years. Another shift in Trident’s market strategy occurred during this time period. In 1994, 95
percent of Trident’s sales came from non-OEMs. In a strategic move, Trident began targeting the OEM market and
currently derives about 30 percent of its sales from OEMs such as IBM, Hewlett-Packard, NEC, and Philips.
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North American Company Profiles
Trident Microsystems
Trident’s product line includes a complete line of 32-bit and 64-bit integrated circuits, video accelerators, and
multimedia video processing chips that provide cost-effective easy-to-use graphics solutions based on advanced
technology. Trident was among the first to deliver chips for the new Unified Memory Architecture (UMA), which
reduces system memory costs by efficiently using existing PC memory for the graphics frame buffer. Additionally,
several of Trident’s GUI and video acceleration products include the company’s proprietary TrueVideo algorithm,
the first technology to deliver horizontal/vertical interpolation and diagonal edge recovery for clearer, sharper fullmotion images.
Future product development will focus on products in the high-end of the graphics market as well as the PC
notebook market. In early 1997, Trident began sampling its first 3D notebook device.
Management
Frank C. Lin
Jung-Herng Chang
Peter Jen
W. Steven Rowe
Amir Mashkoori
Gerry Liu
Richard Silverman
Richard F. Haas
Chairman, President, and Chief Executive Officer
Senior Vice President, Graphics Engineering
Senior Vice President, Asia Operations
Vice President, Human Resources, Finance and Accounting, and Acting Chief
Financial Officer
Senior Vice President, Operations and Business Development
Senior Vice President, Product Marketing
Vice President, Advanced Graphics Product Planning
Director, Marketing Communications
Products and Processes
Trident designs its products using 1.0µm, 0.8µm, and 0.6µm CMOS process technologies. The company's
product line includes: 3D and MPEG ICs, advanced mixed-signal GUI accelerators, high-performance SVGA
controllers, multimedia video processing devices, and LCD/CRT controllers.
In 1Q97, Trident introduced two 3D graphics controllers dubbed the 3DImage™ 975™ and 3DImage™ 975DVD™.
Both devices are designed for 3D applications and feature 3D and 2D graphics acceleration, TV output
technology, VGA imaging, and high-quality video. The 3DImage 975DVD also provides DVD playback functions
for use with MMX-enabled Pentium 166MHz and higher MPUs.
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Trident Microsystems
North American Company Profiles
Semiconductor Fabrication Facilities
Trident uses a fabless manufacturing strategy where it meets its manufacturing needs by using foundries. Prior to
1996, Trident received the majority of its wafer capacity from TSMC. In 1996, in an effort to decrease its
dependence upon one foundry supplier, Trident secured additional capacity through foundry agreements with
UMC and Winbond in Taiwan, and Samsung in Korea. In its agreement with UMC, Trident has purchased an equity
interest in UICC, a UMC joint venture fab facility located in Taiwan. The facility was expected to begin production in
mid-1997.
Key Agreements
• In May 1996, Trident and Samsung announced a long-term partnership. Samsung will provide manufacturing
capacity to Trident in exchange for mixed-signal ASIC designs. In late 1996, the two companies announced
the joint development of a next-generation notebook multimedia accelerator that will feature Samsung’s
embedded SDRAM.
• In August 1995, Trident entered into a joint venture agreement with UMC. Under the agreement, Trident
agreed to invest $60 million for a 10 percent equity interest in a new 200mm fab facility, called United Integrated
Circuits Corporation (UICC). The 200mm wafer fab began production in mid-1997.
• In June 1995, Trident expanded its relationship with TSMC by signing a five-year foundry agreement. Under
the agreement, Trident will purchase a certain number of wafers each year from TSMC through 1999.
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TriQuint Semiconductor
North American Company Profiles
TRI Q UINT S EMICONDUCTOR
TriQuint Semiconductor, Inc.
2300 NE Brookwood Parkway
Hillsboro, Oregon 97124
Telephone: (503) 615-9000
Fax: (503) 615-8900
Web Site: www.triquint.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
TriQuint GmbH • Eiselfing, Germany
Telephone: (49) (80) 719-3504 • Fax: (49) (80) 719-3505
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
29
1
7
1
1993
33
1
9
1
1994
30
(10)
10
1
1995
46
3
9
1
1996
60
6
11
4
190
195
222
285
361
1997
71
7
12
6 (est.)
694
Company Overview and Strategy
TriQuint Semiconductor (NASDAQ: TQNT) designs, develops, manufactures, and markets a broad range of highperformance analog and mixed-signal gallium-arsenide (GaAs) ICs for the wireless communications,
telecommunications, and computing markets. TriQuint's mission is to commercialize GaAs ICs for communications
and computing. The company’s continued focus is on achieving new designs and introducing new products in all
three market areas.
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TriQuint Semiconductor
North American Company Profiles
TriQuint's origin can be traced back to 1978, when researchers at Tektronix Laboratories began investigating
GaAs IC technology. Established as a majority-owned subsidiary in 1985, TriQuint Semiconductor was charged
with developing application-specific integrated circuits (ASICs) for high-performance microwave, linear, and digital
systems.
TriQuint became independent from Tektronix in 1991 when it completed a successful merger with GigaBit Logic
and Gazelle Microcircuits to form a new privately-held TriQuint. In 1993, TriQuint became a public company.
Management
Steven J. Sharp
Edward C.V. Winn
Bruce R. Fournier
Donald Mohn
David Pye
Ron Ruebusch
President and Chief Executive Officer
Executive Vice President, Finance and Administration,
Chief Financial Officer, and Secretary
Vice President, Sales
Vice President and General Manager, Telecommunications and Computing
Vice President, Manufacturing Operations
Vice President and General Manager, Wireless Communications
Products and Processes
TriQuint Semiconductor's standard and customer-specific products are structured into three end-market groups:
wireless communications, telecommunications, and computing.
Wireless Communications — Standard products for this market are used as building blocks for multipurpose
applications in radio frequency (RF) and microwave systems. These systems include personal communications
networks, cellular telephones, satellite communications and navigation equipment, and wireless computer
networks. In 1996, TriQuint continued to add devices to its relatively new family of high-power RF amplifier ICs for
the voice and data wireless communications market.
Telecommunications — Most the company's telecommunications ICs are customer-specific, but its does offer
some standard products, such as SONET and SDH multiplexers/demultiplexers and transceivers, ATM framers,
and high-performance crosspoint switches.
Computing — Standard products for this market are concentrated on solving system timing and data
communications performance bottlenecks in high-performance PCs, workstations, servers, and storage systems.
The company utilizes its proprietary GaAs technology for the production of its ICs. Its GaAs process features
0.5µm to 0.7µm geometries, 4.0µm metal pitch, and a cutoff frequency of up to 21GHz.
TriQuint’s services include GaAs IC design, wafer fabrication, test engineering, package engineering, assembly,
and testing.
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North American Company Profiles
TriQuint Semiconductor
Semiconductor Fabrication Facilities
TriQuint Semiconductor, Inc.
2300 NE Brookwood Parkway
Hillsboro, Oregon 97124
Cleanroom size: 16,000 square feet (Class 10)
Capacity (wafers/week): 1,000
Wafer size: 100mm
Process: GaAs
Products: ASICs, standard components, foundry services
Feature sizes: 0.5µm-0.7µm
In early 1997, TriQuint moved into its new GaAs semiconductor manufacturing facility and office complex in
Hillsboro, Oregon. The 165,000 square-foot site houses all of the company’s manufacturing, engineering,
marketing, and administrative functions that were located in Beaverton, Oregon, with 45,000 square-feet used for
the manufacturing facility.
Key Agreements
• In January 1998, TriQuint purchased Texas Instruments MMIC operations from Raytheon. This operation
specializes in high performance GaAs technologies such as HBTs, PHEMTs, and HFETs for applications above
5GHz.
• In April 1996, TriQuint and Philips announced a wafer sourcing agreement. Under the pact, Philips will develop
GaAs ICs for TriQuint to produce according to Philips’ specifications. Assembly and test will be done by Philips
at a facility in Limeil, France.
• In August 1993, TriQuint and AT&T Microelectronics (now Lucent Technologies) announced a set of
agreements involving the development, manufacture, and marketing of GaAs ICs for high-performance wireless
and telecommunications systems. As part of the deal, Lucent discontinued its production of GaAs wafers and
is instead relying on TriQuint for the manufacture of its GaAs wafers. Lucent also became a minority stockholder
in TriQuint. Lucent increased its stake in TriQuint to 8.2 percent in early 1995.
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TRW
North American Company Profiles
TRW – GAAS TELECOM PRODUCTS
TRW – GaAs Telecom Products Division
One Space Park
Redondo Beach, CA 90278
Telephone: (310) 812-5749
Fax: (310) 812-7011
Web Site: www.trw.com/mmic
IC Manufacturer
Founded: 1991
Financial History ($M)
Corporate
Sales
Net Income
Employees
Ownership
1994
1995
1996
1997
8,491
333
9,568
446
9,857
480
10,800
499
64,175
66,518
65,218
71,480
Publicly held. TSE (Taiwan Stock Exchange) and TSM (New York Stock Exchange).
Company Overview and Strategy
TRW’s GaAs Telecom Products (GTP) Division is a leading supplier of commercial GaAs products, focused on high
volume telecommunications market segments such as Point-to-Point, Point-to-Multipoint, Digital Radio, and Ka
Band VSAT. This division, established in the early 90’s, has been chartered to bring GaAs products from Internal
government-based applications to the rapidly-expanding worldwide commercial telecommuncations market.
TRW’s mother company, founded in 1901, is based in Cleveland, Ohio. The corporation is a manufacturing and
service company focused on supplying advanced technology products and services to the automotive, space,
defense and information systems markets. The GaAs Telecom Products Division is part of TRW’s Space &
Electronics Group, based in Redondo Beach.
TRW’s GaAs products are sold through distributors throughout the U.S. and Canada.
distribution is planned for fourth quarter 1998.
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Asia-Pacific sales
TRW
North American Company Profiles
Management
GaAs Telecom Products:
Robert Van Buskirk
Rober Pinato
Tom Joseph, Ph.D.
Michael Justis
Jim Nadeau
Manny Quijije
Brad Evans
Executive Director
Marketing and Sales Manager
Foundry and Production Services Manager
Finance and Business Manager
MMW Module Products Manager
MMIC Product Development Manager
Director of Marketing
Products and Processes
TRW’s MMICs and modules product strategy is focused on the design, development and manufacture of GaAs
products for standard and custom commercial telecommunication applications. As such, these products typically
are inserted into a broad array of cellular, PCS, microwave and millimeter wave wireless and high rate fiber optic
wired electronics systems. Product details are as follows.
TRW’s family of GaAs MMIC products to cover frequencies from 18-77GHz. Products include low noise amplifiers,
medium power amplifiers, and high power amplifiers. Future products include multipliers, VCOs and mixers in both
HEMT and HBT technologies
The Module Product Family consists of MMIC-based modules and innovative packaging techniques that are costeffective products in high-capacity wireless telecommunication systems. These modules create seamless
designs between MMICs and modules to ensure reliability and compatibility. MilliWave, a subsidiary of TRW, is
responsible for volume production of these products.
Foundry Product Services – Foundry services are offered for prototyping and volume manufacturing of HBT and
HEMT technologies. The TRW facility has PHEMT capabilities using 0.2 micron and 0.15 micron processes for
prototyping and production. GaAs HBT capabilities are also available using 2 micron technology for prototyping.
Indium Phosphide products are currently in development and are scheduled for introduction during the fourth
quarter 1998. 1 micron HBT and 0.1 micron HEMT technologies are also in development.
Semiconductor Fabrication Facilities
TRW GTP has a fully functional three inch GaAs wafer fabrication facility on-site as well as access to other facilities
as consumer demand warrants.
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TRW
North American Company Profiles
TRW - GTP
One Space Park
Redondo Beach, California
Cleanroom size: 4,850 square feet - Class 10
Cleanroom size: 9,890 square feet - Class 1,000
Cleanroom size: 7,470 square feet - Class 10,000
Capacity (wafers/week): 360
Wafer size: 80mm
Process: HBT, HEMT
Products: GaAs / Foundry services
Feature sizes: 2µm, 0.2µm, 0.15µm
Key Agreements
•
In 1997, TRW and Multilink Technology Corporation formed an alliance to develop and manufacture on/off
ramp electronics for high rate data and telcom fiber optic transmission systems. Products developed from this
teaming arrangement include Clock-data recovery, Trans-impediance amplifiers, and laser drivers.
•
In 1997, TRW acquired MilliWave Technologies Corporation, a manufacturer of multi-chip RF modules for high
capacity wireless communication systems. MilliWave products include point-to-point and point-to-multipoint
communication links to 77GHz for transmitters, receivers, and transceivers. This new subsidiary is now called
TRW MilliWave Inc.
•
In 1996, TRW established a strategic alliance with RF Micro Devices to develop and market cellular and PCS
chipsets using TRW HBT technology. The purpose of the agreement is to provide chipsets with a large
selection of CDMA MMICs at the lowest cost and highest performance of any available process. The devices
are manufactured at RF Micro Devices new four inch facility which has a throughput capability of 25K wafers per
year.
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Tundra Semiconductor
North American Company Profiles
TUNDRA S EMICONDUCTOR
Tundra Semiconductor Corporation
603 March Road
Ontario, Canada K2K 2M5
Telephone: (613) 592-0714
Fax: (613) 592-1320
Web Site: www.tundra.com
Fabless IC Supplier
Employees: 84
Company Overview and Strategy
Located in Canada, Tundra Semiconductor is a privately-held company that designs, develops, and markets PCI
and VME bus-bridging components for embedded datacommunications and telecommunications applications.
Tundra was established originally as Newbridge Microsystems; a division of Newbridge Networks Corporation, a
leader in local and wide area networking and communications equipment, but became an independent company
in December 1995.
Tundra’s product strategy is to focus on the niche market of bus-bridging ICs, which control the flow of data
between different bus architectures used in computer systems. Tundra develops these products in conjunction
with leading microprocessor and digital signal processor companies. It uses a lead customer model for further
product definition. The company also designs and markets a broad line of industry standard encryption
components for data security in communications networks. To address the office equipment, consumer
electronics, and automotive markets, Tundra offers a line of Intel-compatible 8-bit microperipheral (MPR) devices.
Management
Adam Chowenaniec
Jim Roche
Michael Krause
Norm Paquette
Ed Hacker
David Lisk
Richard O’Connor
President and Chief Executive Officer
Executive Vice President and General Manager
Vice President, Research and Development
Vice President, Finance
Vice President, Sales
Vice President, Operations
Vice President, Marketing and Business Development
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Tundra Semiconductor
North American Company Profiles
Products and Processes
Tundra offers a family of embedded PCI bus bridges, the leading family of VMEbus bridges, DES-based
encryption components, and standard 8-bit microperipheral ICs.
PCI Bus Bridges
Qspan™ — PCI interface for Motorola embedded processors (e.g., 68K, PowerPC).
VMEbus Bridges
Universe II™ — VME-to-PCI bus bridge.
SCV64™ — High-performance VME64-to-local bus bridge.
Trooper™ II — Slave only VMEbus-to-local bus bridge.
Data Security Products
Wide array of encryption chips based on the Data Encryption Standard (DES). These products are designed for a
broad range of networking and communications systems such as cable modems, ATMs, fax machines, and
satellite base solutions.
8000 Microperipheral Series
Six industry standard 8-bit MPRs that support the Intel x86 microprocessor family.
Key Agreements
•
Tundra has strategic technology partnerships with Motorola, Texas Instruments, and Cadence Design
Systems.
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Unitrode
North American Company Profiles
UNITRODE
Unitrode Corporation
7 Continental Boulevard
Merrimack, New Hampshire 03054-0399
Telephone: (603) 424-2410
Fax: (603) 424-3460
Web Site: www.unitrode.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Unitrode (U.K.) Limited • London, England
Telephone: (44) (181) 3181431 • Fax: (44) (181) 3182548
Asia-Pacific:
Unitrode Electronics Asia Ltd. • Kowloon, Hong Kong
Telephone: (852) 2722-1101 • Fax: (852) 2369-7596
Financial History ($M), Fiscal Year Ends January 31*
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1993
50
6
4
—
1994
65
9
6
—
1995
87
12
9
16
1996
116
18
15
12
1997
134
21
18
18
1998
178
30
17
46
300
425
514
620
562
665
*Results excluding disposed operations.
Ownership: Publicly held. NASDAQ: UTR.
Company Overview and Strategy
Unitrode Corporation was founded in 1960 as a manufacturer of electronic components and subsystems. By
1994, the company had divested all its non-strategic businesses and focused on its linear/analog and mixedsignal IC business, which was established in 1981. The company's ICs are used in a variety of applications for
power management and as interface devices. For the most part, the chips are used to control switching power
supplies and small electronic motors, or as high-speed interface and communication circuits between various
pieces of electronic equipment.
Unitrode's customers are primarily in the EDP/computer and telecommunications markets, but also in the industrial
control and instrumentation, defense/aerospace, automotive, and consumer markets. The company plans to
focus its new product development efforts on the communications and industrial markets.
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Unitrode
North American Company Profiles
In fiscal 1998, about 65 percent of the company's integrated circuit sales were to international customers.
Management
Robert L. Gable
Robert J. Richardson
Cosmo S. Trapani
Allan R. Campbell
S. Kelley MacDonald
Patrick Moquin
Frederick J. Myers
Chairman of the Board
President and Chief Executive Officer
Executive Vice President and Chief Financial Officer
Senior Vice President and General Counsel
Vice President, Corporate Communications
Vice President, Human Resources
Vice President, International Sales
Products and Processes
Unitrode's product offering is comprised of analog ICs for power supply control, motor control, lighting, power
driving, power quality, and power factoring, as well as for high-speed and high-power interface applications. Most
of the products are based upon proprietary designs utilizing enhanced bipolar, BiCMOS, and BCDMOS
semiconductor technologies and are considered application-specific standard products (ASSPs).
Semiconductor Fabrication Facilities
In mid-1997, the company expected to complete the first phase of construction of a new 150mm BiCMOS wafer
facility. The facility is expected to begin production in fiscal year 1999.
Unitrode Corporation
7 Continental Boulevard
Merrimack, New Hampshire 03054
Capacity (wafers/week): 2,000
Wafer size: 100mm, 150mm
Processes: Bipolar, BiCMOS, BCDMOS
Feature sizes: 1.0µm-5.0µm
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North American Company Profiles
Unitrode
Unitrode has agreements with four foundries to supply additional wafers, as required. In January 1995, the
company signed an agreement with GMT Microelectronics Corporation (former Commodore Semiconductor fab in
Norristown, Pennsylvania) for additional wafer capacity. Under the agreement, Unitrode made a $2 million equity
investment in GMT, in return for up to 30 percent of GMT's capacity. In February 1996, the company made an
additional $1.5 million investment in GMT which entitles the company to favorable pricing on certain products.
During fiscal year 1998, Unitrode received about 50 percent of its output from outside foundries.
Key Agreements
• In March 1998, Unitrode announced that it had signed a definitive agreement to merge with Benchmarq
Microelectronics, Inc., a $45 million, Dallas-based manufacturer of battery management ICs and certain nonvolatile products. On April 17, 1998 - Unitrode and Benchmarq jointly announced that on April 15, 1998, the
waiting period under the Hart-Scott-Rodino Antitrust Improvements Act expired. The merger remains subject
to the approval of the shareholders of both companies and the satisfaction of other customary closing
conditions.
• Unitrode entered into an alliance with Irvine Sensors. Under the agreement, Unitrode became a licensee and
exclusive second-source for Irvine Sensors’ wireless infrared communication ICs.
• Unitrode entered into an agreement with GMT Microelectronics Corporation in early 1995 to supply wafers to
Unitrode. As part of the agreement, Unitrode invested $2 million in GMT. The company made an additional
investment of $1.5 million in GMT which entitles the company to favorable pricing on certain products.
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Universal Semiconductor
North American Company Profiles
UNIVERSAL S EMICONDUCTOR
Universal Semiconductor, Inc.
1925 Zanker Road
San Jose, California 95112
Telephone: (408) 436-1906
Fax: (408) 436-1125
Web Site: www.unisemi.com
IC Manufacturer
Employees: 30
Ownership: Privately held.
Company Overview and Strategy
Universal Semiconductor was established in 1978 to serve as a CMOS foundry offering design and manufacturing
of customers' custom/semicustom devices, gate arrays (digital and mixed-signal), dielectrically isolated (DI) highvoltage ICs, linear arrays, DMOS FETs, and thin-film RC/RCD networks.
Management
Vic Hejmadi
Tony Telesca
President and Chief Executive Officer
Director, Marketing and Sales
Products and Processes
Universal Semiconductor uses CMOS processing for all devices and offers gate arrays with up to 2,400 gates,
mixed-signal arrays (18V breakdown), and 300V and 500V dielectrically isolated high-voltage ICs, as well as
radiation-hardened devices and bipolar process.
Semiconductor Fabrication Facilities
Universal Semiconductor, Inc.
1925 Zanker Road
San Jose, California 95112
Cleanroom size: 10,000 square feet
Capacity (wafers/week): 2,500
Wafer size: 100mm
Process: CMOS
Products: ASICs, linear devices, discretes,
foundry services, linear bipolar.
Feature sizes: 1.5µm, 2.0µm, 3.0µm, 4.0µm, 5.0µm
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UTMC Microelectronic Systems
North American Company Profiles
UTMC MICROELECTRONIC S YSTEMS
UTMC Microelectronic Systems
4350 Centennial Boulevard
Colorado Springs, Colorado 80907
Telephone: (719) 594-8000
Fax: (719) 594-8032
Web Site: www.utmc.com
Fabless IC Supplier
Financial History ($M)
Sales
Employees
1992
20
1993
27
1994
30
1995
30
1996
38
350
300
300
180
170
1997
76*
350
*Includes CCA revenue of $35M.
Company Overview and Strategy
UTMC Microelectronic Systems is a business unit of Hamilton Standard, part of the United Technologies family of
companies.
Established in 1980, UTMC is dedicated to aerospace and defense. It was originally established to assist other
UTC divisions with the integration of custom and semicustom microelectronics into their systems. In 1985, UTMC
began supplying semicustom Standard VLSI circuits to external companies in the aerospace and defense
industries. Today, the majority of UTMC’s business is with external companies. The company also engages in
government- and customer-funded R&D.
Up to about mid-1995, UTMC manufactured its IC products in its own fab in Colorado Springs. However, the
company took on a fabless strategy with the sale of its fab to Rockwell Semiconductor.
In 1996, UTMC underwent another strategic change. UTMC combined its IC business with the former Commercial
Aircraft Electronics (CAE) division of Hamilton Standard, moved into a former Hamilton Standard facility, and
changed its name to UTMC Microelectronic Systems. The newly acquired 104,000 square-foot facility houses the
company’s research and development, engineering, IC assembly, test, sales and marketing, as well as the newly
acquired circuit card assembly operation (CCA). The circuit card operation is a high-mix, low-volume operation
focusing on high reliability for the aerospace market.
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UTMC Microelectronic Systems
North American Company Profiles
Management
Charles "Nick" H. Ide
Mike Dansby
Chuck Gregory
Dwight Deem
James Hudspeth
President
Chief Financial Officer
Director, Business Development and Engineering
Director, Marketing and Sales
Director, Circuit Card Assembly Operations
Products and Processes
UTMC offers semicustom and military-standard products. Its semicustom products include CMOS gate arrays with
densities from 3,400 to 600,000 usable gates, and CMOS cell-based ASICs. The process used for the gate arrays
and standard cells is a Jan-qualified low-temperature double- or triple-metal rad-hard process with 0.5µm, 0.6µm,
and 0.8µm.
The company also offers a large selection of radiation-hardened monolithic, MIL-STD-1553 products. These
include bus interface and control devices, bipolar bus transceivers, 16-bit RISC MPUs and 8-bit MCUs in both radhard and non-rad-hard versions, PROMs, dual-port RAMs, SRAMs and PLD and MSI logic devices.
Radiation-hardened products accounted for about 50 percent of UTMC’s IC sales in 1997.
From its newly acquired circuit card assembly and test division, UTMC offers circuit board assembly and test
services for low volume production runs of complex board requirements. Typical applications are commercial and
military aircraft and environmental controls.
Semiconductor Fabrication Facilities
UTMC sold its fabrication facility to Rockwell Semiconductor in mid-1995. As part of the agreement, Rockwell
supplied UTMC with wafers through 1997, as it made its transition to a fabless operation. In March 1996, UTMC
announced a foundry agreement with Lockheed-Martin Federal Systems to obtain production capacity for
strategic rad-hard products from Lockheed-Martin’s fab in Manassas, Virginia. American Microsystems
Incorporated (AMI) was added in 1997 to support new Commercial RadHard™ and standard products with 0.6µm
and 0.5µm geometries (see Key Agreements).
Key Agreements
•
UTMC established a five-year foundry supply agreement with American Microsystems Incorporated (AMI) in July
1997. This agreement makes AMI the main source for Commercial RadHard™ foundry for commercial space
(100K RAD) CMOS devices.
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Vadem
North American Company Profiles
VADEM
Vadem
1960 Zanker Road
San Jose, California 95112
Telephone: (408) 467-2100
Fax: (408) 467-2199
Web Site: www.vadem.com
Fabless IC Manufacturer
Founded: 1983
Regional Offices/Representative Locations
North America:
TSMC, USA • San Jose, California
Telephone: (408) 437-8762 • Fax: (408) 441-7713
Europe:
TSMC, Europe • Amsterdam, The Netherlands
Telephone: (31) (20) 305-9900 • Fax: (31) (20) 305-9911
Employees: 85
Ownership: Publicly held. TSE (Taiwan Stock Exchange) and TSM (New York Stock Exchange).
Company Overview and Strategy
Vadem develops and markets semiconductors, boards and system level products for the portable information
appliance markets. The Company specializes in products and services where portability (long battery life, light
weight, and small form factor and connectivity (wired or wireless messaging) are critical to market acceptance (i.e.,
internet capable appliances and turnkey portable systems).
Since its founding in 1983, Vadem has designed and developed technology to advance mobile computing. The
Company began as an engineering consulting company specializing in intelligent portable devices. Vadem has
played a central part of every major turning point in this new industry, designing the world’s first production laptop
and developing a broad line of integrated circuits optimized for mobile computing.
Vadem’s annual sales are in the $10M to $25M range. The Company’s products are primarily sold via sales
representatives and distributors throughout North America.
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Vadem
North American Company Profiles
Management
John Zhao
Henry Fung
Leslie Horton
Ahmet Alpdemir
Michael Yam
Jim Stair
Dan Epel
Chief Executive Officer and President
Chief Technology Officer
Vice President, Finance and Chief Financial Officer
Vice President, ForCE
Vice President, Marketing and Sales
Vice President, Engineering
Vice President, Business Development
Products and Processes
Vadem provides embedded products for mobile and internet capable information appliances, and turnkey
portable systems. In addition, Vadem is leveraging its expertise in Windows CE to offer a broad suite of products
and services related to Microsoft’s embedded operating system.
The majority of Vadem’s revenues are derived from the sales of its single-chip products to the embedded market.
Vadem’s single-chip products comprise two product families: x86 compatible embedded processors and PCMCIA
controllers.
The embedded controller product line consists of two platforms – the VG330 and the VG230. These highly
integrated single-chip GUI platforms combine high functionality with minimal power consumption for cost-sensitive
mobile applications.
The VG330, running at 3.3V, integrates NEC’s 8086-compatible V30MX CPU core with core logic, memory
management, a memory controller, extensive power management, a PCMCIA 2.1/ExCA/JEIDEA 4.2 controller, 34
GPIO line, a VGA LCD controller and serial port with HP IR compatibility, an AT-style bus controller and a serial
keyboard interface or scanned keyboard matrix. For lower-cost mainstream hand-held applications Vadem’s
VG230 combines a 16MHz Intel 8x86-compatible processor with highly integrated peripherals. It incorporates an
LCD controller, a keyboard scanner, and a PCMCIA controller in addition to a CPU and core logic.
Vadem also supplies a broad family of PCMCIA host adapters that are compatible with Intel’s “B” step register set
and software. Designed to offer OEMs a simple upgrade path for meeting evolving system requirements in mixedvoltage and plug-and-play systems, these products help users cope with evolving standards with minimal
difficulties. Typical applications are desktop docking systems for portables, conventional desktop, information
appliances sub-notebook computers, and portable peripherals.
2-482
North American Company Profiles
Vadem
Key Agreements
•
In November 1996, Vadem entered into a strategic partnership with NEC’s semiconductor group. Vadem will
design and market NEC’s RISC microprocessors with particular emphasis on Windows CE portable applications.
Vadem’s systems expertise and knowledge of the handheld market will help establish NEC RISC CPUs as the
engines of choice for Windows CE applications.
•
Vadem is one of only four authorized Microsoft Windows CE global distributors. It is also a certified Windows
CE Developer and integrator. With this strategic relationship, Vadem will develop new targeted Windows CE
application platforms. As a Windows CE distributor, Vadem will be exposed to a variety of applications and will
focus on major growth markets.
2-483
Vantis
North American Company Profiles
VANTIS
Vantis Corporation
995 Stewart Drive
P.O. Box 3755
Sunnyvale, California 94088
Telephone: (408) 616-8000
Fax: (408) 774-7216
Web Site: www.vantis.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Europe:
Advanced Micro Devices (UK) Ltd. • Firmley, England, United Kingdom
Telephone: (44) (1276) 803100 • Fax: (44) (1276) 803102
Japan:
Advanced Micro Devices • Shinjuku-ku, Tokyo, Japan
Telephone: (81) (3) 3346-7570 • Fax: (81) (3) 3342-7606
Asia-Pacific:
Advanced Micro Devices Far East Ltd. • Kowloon, Hong Kong
Telephone: (852) 2956-5322 • Fax: (852) 2956-0588
Financial History ($M), Fiscal Year Ends December 31
Sales
Employees
1994
187
1995
256
1996
248
1997
243
—
—
300
300
Company Overview and Strategy
Vantis Corporation was spun-off from AMD in 1997 to form a wholly-owned programmable logic subsidiary of AMD.
The company’s roots in programmable logic devices (PLDs) date back to 1978 when Monolithic Memories, Inc.
announced the development of the PAL® device. MMI merged with AMD in 1987. Today, Vantis is the dominant
supplier of simple PLDs and the world’s third largest supplier of all PLDs.
There are six basic areas addressed by Vantis’ PLDs: high-speed PAL devices, universal PAL devices, industrystandard PAL devices, low-power PAL devices, asynchronous PAL devices, and high-density PLDs. Vantis is
now a full range supplier with the latest announcement of its entrance into the FPGA market with its new VFI family
of FPGAs.
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Vantis
North American Company Profiles
Vantis’ roadmap calls for CPLDs with up to 1,000 macrocells by 1998, and CPLDs with high-density macrocells and
integrated cores by 1999. The company will utilize AMD’s core library including its digital signal processing, PCI,
and microprocessor cores. Vantis’ FPGA products will move into the 250,000-gate range by the year 2000. Also
by 2000, Vantis wants to become an independent, publicly held company.
Management
Richard Previte
Richard H. Forte
Frank Barone
Om Agrawal
Al F. Frugaletti
Andy Robin
Andy Pease
Chairman
President and Chief Executive Officer
Vice President and Chief Operating Officer
Vice President and Chief Technical Officer
Vice President, Worldwide Distribution
Vice President, Marketing
Vice President, North American Sales
Products and Processes
For high-performance applications in the networking, telecommunications, computing, and industrial markets,
Vantis offers its MACH families of high-density EECMOS PLDs. There are five MACH families, each addressing a
specific market need and all include features such as guaranteed fixed timing, PCI compliancy, power
management, and 3.3V options. The MACH 5, MACH Superset, and MACH Performance Plus CPLDs come with
JTAG in-system programming (ISP) support for no additional cost.
•
MACH 1 and 2 Families — These families (including the MACH Performance Plus CPLD products) consist
primarily of synchronous devices for synchronous subsystem applications like memory controllers and
peripheral controllers and an asynchronous device for applications having asynchronous inputs and for
collecting random glue logic. Characteristics include 900 to 3,600 PLD gates, 44 to 84 pins, and 32 to 128
macrocells.
•
MACH 3 and 4 Families — These MACH Superset CPLDs provide approximately three times the density (up to
10,000 PLD gates), two times the number of macrocells (up to 256), and two times the amount of I/O (up to 208
pins) of the original MACH 1 and 2 families.
•
MACH 5 Family — This CPLD product family has speeds as fast as 7.5ns at 512 macrocells. The MACH 5
devices feature a new hierarchical switch-matrix architecture that allows shorter design times. While a 0.35µm
(effective gate length) CMOS process is currently used to manufacture the MACH 5 PLDs, a 0.25µm six-layermetal process is under development and expected to be implemented by 2000.
•
FPGAs — The VF1 family of FPGAs, introduced in January of 1998, is Vantis’ newest programmable logic
family. First family members include the 25,000 gate devices available in production quantities in 2Q98. Based
on a variable grain architecture, the VF1 devices provide 250MHz pipeline performance providing an increase
in system speed by 50 to 100 percent over competing solutions. VF1 will span up to 250,000 gates by mid1998.
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Vantis
North American Company Profiles
Vantis also offers one of the industry’s widest variety of PAL devices.
•
•
•
•
•
High-Speed PALs — Electronically erasable (EE) CMOS and bipolar PALs with delay times as low as 5ns and
4.5ns, respectively.
Universal PALs — EECMOS PALs with user-programmable output logic macrocells.
Industry-Standard PALs — Bipolar TTL PALs in a variety of speed and power grades.
Low-Power PALs — Zero-power CMOS PALs for portable or battery-operated systems (stand-by current of
less than 15µA) and quarter-power CMOS PALs that can cut system power consumption 50 percent by
replacing equivalent CMOS PALs.
Asynchronous PALs — CMOS PALs that are optimized for asynchronous and bus interface applications.
Semiconductor Fabrication Facilities
All of the company’s products are manufactured in AMD’s wafer fabrication facilities in Austin, Texas, on processes
dedicated to programmable logic. AMD’s Fab 25, where much of Vantis’ devices are manufactured, is a 200mm
fab with 0.35µm line geometries.
2-486
Vitesse Semiconductor
North American Company Profiles
VITESSE S EMICONDUCTOR
Vitesse Semiconductor Corporation
741 Calle Plano
Camarillo, California 93012
Telephone: (805) 388-3700
Fax: (805) 987-5896
Web Site: www.vitesse.com
IC Manufacturer
Regional Headquarters/Representative Locations
Europe:
Vitesse Semiconductor Corp. • Lagerlechfeld, F.R. Germany
Telephone: (49) 8232-78-626 • Fax: (49) 8232-78-627
North America: Vitesse Semiconductor Corp. • Santa Clara, California
Telephone: (408) 696-0414 • Fax: (408) 696-0270
Other representative locations in Western, Northwestern, South Central, Northeast, Southwestern, Eastern, and
North Central regions.
Financial History ($M), Fiscal Year Ends September 30
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
37
1
9
3
1993
26
(19)
10
6
1994
36
(4)
9
2
1995
43
2
9
3
1996
66
13
11
11
1997
105
33
17
31
300
238
201
235
320
467
Company Overview and Strategy
Vitesse Semiconductor (NASDAQ: VTSS), founded in 1984, is a leader in the design, development,
manufacturing, and marketing of digital gallium arsenide (GaAs) ICs suitable for commercial, industrial, and military
customers. The company's custom, semicustom, and standard products are used in a wide variety of industries
including telecommunications, data communications, computers, defense and aerospace systems, automatic test
equipment (ATE), and instrumentation.
Vitesse's mission is to be the dominant supplier of the highest performance IC solutions for communications and
ATE applications. As the communications market shifts from wire to optical channels, and computers undergo a
shift from large proprietary central processors to open distributed processors, Vitesse is positioning itself to
provide leading high-performance digital, analog, and mixed-signal IC solutions.
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Vitesse Semiconductor
North American Company Profiles
Management
James A. Cole
Louis R. Tomasetta
Ian Burrows
Robert Cutter
Ira Deyhimy
Chris F. Gardner
Eugene F. Hovanec
James Mikkelson
Michael Millhollan
Robert Nunn
Neil Rappaport
Ram Venkataraman
Jeanne Johnson
Chairman
President and Chief Executive Officer
Vice President, Fab Operations
Vice President and General Manager, Colorado Springs
Vice President, Product Development
Vice President and General Manager, ATE Products
Vice President, Finance and Chief Financial Officer
Vice President, Technology Development and Chief Technical Officer
Vice President and General Manager, Standard Products
Vice President and General Manager, ASIC Products
Vice President, Sales
Vice President, Quality
Vice President, Human Resources
Products and Processes
Vitesse's products are fabricated using its proprietary H-GaAs™ (high integration gallium arsenide) process
technology. The current generation is the five-level metal, 0.5µm H-GaAs IV process, capable of integration levels
of over one million transistors. ASIC design and simulation is supported on industry standard tools from Mentor,
Cadence, Viewlogic, Synopsys, and Teradyne.
Vitesse's standard products include telecommunications and data communications ICs. Its communications
products address the high-speed data transmission marketplace. Most are designed to be compatible with the
SONET (synchronous optical network), ATM, and Fibre Channel standards. The operating frequency of these
devices is from 155MHz to 10GHz and they are aimed at providing physical layer solutions for copper or fiber optics
communication lines.
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North American Company Profiles
Vitesse Semiconductor
Vitesse's gate array product line consists of five families: GLX, FX, Viper, SCFX, and Fury™. Aimed at the communication, ATE/instrumental, and computer markets, GLX arrays are suited to switching networks, serial links, highspeed data bus transfers, DSP functions, and critical timing blocks. GLX utilizes a sea-of-gates architecture and can
be powered from either a single or dual power supply, depending on I/O requirements. These gate arrays can
accommodate virtually any digital application requiring up to 175,000 gates. The FX series provides solutions in
super minicomputers, high-end workstations, telecommunications systems, and high-performance
ATE/instrumentation. The Viper family provides solutions in computer peripherals, medical instrumentation, and
communications. The SCFX family is targeted at telecommunications and data communications applications, offering
maximum operating frequencies beyond 3GHz. The Fury series addresses the conventional silicon ECL user.
In early 1997, Vitesse introduced its first family of GaAs standard cell arrays targeting telecommunications and
high-speed switching applications. Dubbed the SLX line, the family consists of five devices with gate densities
ranging from 10K to 220K gates while operating from a single 3.3V power supply. The SLX family is based on a
0.4µm four-layer metal HGaAs-IV process and utilizes a standard cell architecture.
Semiconductor Fabrication Facilities
In late 1996, Vitesse began construction of what it claims will be the first 150mm GaAs VLSI fabrication facility in the
industry. The 100,000 square-foot facility will support manufacturing and test, as well as a design center for
research and development. Initial production is expected to begin in mid-1998.
Vitesse Semiconductor
741 Calle Plano
Camarillo, California 93012
Cleanroom size: 5,500 square feet (Class 10)
6,500 square feet (Class 100)
Capacity (wafers/week): 1,700
Wafer size: 100mm
Process: H-GaAs E/D MESFET
Products: Gate arrays, telecom and datacom
devices, microperipherals, foundry services.
Feature sizes: 0.4µm, 0.5µm
Vitesse Semiconductor
4323 ArrowsWest Drive
Colorado Springs, Colorado 80907
Cleanroom size: 10,000 square feet (Class 1)
Wafer size: 150mm
Process: H-GaAs E/D MESFET
Products: Gate arrays, telecom and datacom
devices, microperipherals, foundry services.
2-489
Vivid Semiconductor
North American Company Profiles
VIVID S EMICONDUCTOR
Vivid Semiconductor, Inc.
7400 West Detroit Street
Suite 100
Chandler, Arizona 85226
Telephone: (602) 961-3200
Fax: (602) 961-1135
Web Site: www.vividsemi.com
Fabless IC Supplier
Founded: 1993
Employees: 70
Ownership: Privately held.
Regional Headquarters/Representative Locations
Asia-Pacific:
Vivid Semiconductor Korea Inc. • Seoul, Korea
Telephone: (82) (2) 522-3175 • Fax: (82) (2) 552-3177
Vivid Semiconductor KK • Tokyo 105 Japan
Telephone: (03) 3432-1581
Company Overview and Strategy
Vivid Semiconductor was formed in 1993 to design and market mixed-signal and analog integrated circuits for
applications requiring high voltage operation at a low cost. Currently, the company is focused on providing drive
electronics to manufacturers of flat panel displays (FPDs).
Using patented extended voltage-range CMOS technology, Vivid has developed technology that allows
designers to build enhanced performance flat panel displays with 24-bit color and full-motion video. The key to
this technology is that it can be fabricated on standard CMOS processes. Vivid’s process technology can be
applied not only to FPDs but also to a broad range of other markets, from automotive to telecommunications,
where extended voltage-range CMOS can make a difference in product capability, power consumption, cost, and
reliability.
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Vivid Semiconductor
North American Company Profiles
Management
Alex Erhart
Dan Clarke
Gerry Harder
Tim Vatuone
James Hanshew
Ed Fullman
President and Chief Executive Officer
Vice President, Marketing and Sales
Vice President, Research and Development
Vice President and Chief Financial Officer
Vice President, Operations
Director, Marketing
Products and Processes
Vivid Semiconductor offers three families of direct drive flat panel display column drivers — CRT replacement
products, low power notebook TFT display products, and MLS/AA STN display products. Vivid’s direct drive LCD
column drivers are available for a wide range of panel resolutions from VGA to UXGA.
Vivid’s column drivers are based on its patented "Dual Range" design architecture, which allows high-voltage
devices to be achieved on standard, low-voltage CMOS processes. For example, 10V operation on a 0.8µm
process and 7V operation on a 0.5µm process can be easily achieved, and higher voltages are possible.
Semiconductor Fabrication Facilities
Unlike leading edge microprocessors and memories, Vivid’s silicon requirements can be fabricated in plants that
are three process generations old. Vivid’s wafer processing, packaging, and testing functions are contracted to
well-established manufacturers.
2-491
VLSI Technology
North American Company Profiles
VLSI TECHNOLOGY
VLSI Technology, Inc.
1109 McKay Drive
San Jose, California 95131
Telephone: (408) 434-3100
Fax: (408) 263-2511
Web Site: www.vlsi.com
IC Manufacturer
Founded: 1979
Regional Offices/Representative Locations
Japan:
VLSI Technology, Inc. • Tokyo, Japan
Telephone: (81) (3) 5454-3800 • Fax: (81) (3) 5454-3801
Europe:
VLSI Technology, Inc. • Palaiseau Cedex, France
Telephone: (33) (1) 69-19-71-00 • Fax: Fax: (33) (1) 69-19-71-01
Asia-Pacific:
VLSI Technology, Inc. • Taipei, Taiwan
Telephone: (886) (2) 719-5466 • Fax: (886) (2) 718-3204
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
429
(32)
50
1993
516
16
65
1994
587
32
79
1995
720
46
90
1996
717
(50)
105
1997*
713
67
98
40
72
94
204
245
137
2,379
2,659
2,728
2,986
2,948
2,600
Ownership: Publicly held. NASDAQ: VLSI.
*Excludes revenues of COMPASS Design Automation which was sold to Avant! Corp., September 1997.
2-492
North American Company Profiles
VLSI Technology
Company Overview and Strategy
VLSI Technology, Inc. designs and manufactures System-Level Silicon integrated circuits based on its FSB ,
functional systems blocks library. Targeting its offerings toward the wireless communications, networking,
consumer digital entertainment and computing markets, the company offers its customers advanced system-level
integration capabilities. VLSI Technology is a leader in the design, manufacture, and sale of complex highperformance ASICs and ASSPs.
Founded in 1979, the company has been a pioneer in the cell-based ASIC business. VLSI targets high-growth
markets namely communications, computing and consumer digital entertainment markets. It has built expertise in
these areas and can use its library of proprietary cells and FSB library to assist customers in designing products
and bringing them to market rapidly.
VLSI’s integrated circuit business is organized in three main groups — Computing Products, Communications
Products, and Consumer Digital Entertainment Products.
The Computing Product group offers devices for the computer market, including high-end computing applications
such as graphics workstations and high-end storage systems. Sales from this product group declined from
representing 46 percent of total revenues in 1995 to fifteen percent in 1996 due to Intel’s strengthened
dominance in the core logic business and a decrease in sales for Apple Computer architecture systems. The
Computing Products group is shifting its focus away from standard core logic chipsets and toward custom
products for high-end applications.
The Communications Products group offers devices for wireless and network communications applications.
Within the communications area, the company continues to develop technologies supporting GSM, PHS, and
DECT standards. VLSI is also developing products targeting CDMA digital cellular applications. In 1Q96, VLSI
created a European subsidiary called Creative Systems Solutions. Based in Munich, Germany, Creative Systems
Solutions will focus on the wireless data communications marketplace.
The Consumer Digital Entertainment Products group supplies devices for secure communications and home
entertainment applications such as interactive television, satellite and cable technology, and electronic video
game systems. Data encryption is one key area of focus due to increased security concerns as products become
more advanced.
2-493
VLSI Technology
North American Company Profiles
Future product development will include a focus on the wireless, networking, set-top box, and advanced
computing markets.
Management
Alfred J. Stein
Richard M. Beyer
Thierry Laurent
Douglas M. McBurnie
Balakrishnan S. Iyer
Ted Malanczuk
John Hodgson
Sunil Mehta
Nobuo Sugawara
Chairman and Chief Executive Officer
President and Chief Operating Officer
Senior Vice President and GM, Communications Product Group
Senior Vice President, Computer and Consumer Products Group
Senior Vice President, Finance and Chief Financial Officer
Senior Vice President, Operations
Senior Vice President, Sales
Vice President and Treasurer
President, VLSI Technology KK, Japanese Subsidiary
Products and Processes
Using advanced design capabilities, a vast cell library of predefined cells, and advanced manufacturing processes,
VLSI Technology offers highly customized, highly integrated standard cell, embedded array (FlexArray), and gate
array ASICs and ASSPs for applications such as computers, wireless communications equipment, electronic
games, and digital set-top boxes.
The VLSI Cell Library provides an extensive and growing variety of pre-designed and characterized cells,
macrocells, and large functional system blocks. The company’s specialized system blocks include: UART, parallel
port, SCC, SCSI, PCMCIA, PCI, SSA, Fibre Channel, and graphics functions for computing applications; T1/E1,
SONET/SDH, and ATM functions for network communications applications; GSM/DCS, DECT, CT2, PHS, CDPD,
and Ruby II functions for wireless communications applications; and digital demodulation, forward error correction
(FEC), MPEG-2 video and MPEG audio, microcontroller, and transport for digital entertainment applications.
VLSI’s cell library also includes general-purpose system blocks such as 32-bit ARM RISC processor cores, data
encryption devices, and programmable DSP cores.
In a second attempt to penetrate the data security market, VLSI has developed the GhostRider security chip for
PCI-based computers, modems, web-browsers, and set-top boxes. The device is designed to protect the
electronic transfer of intellectual property by integrating an on-chip RISC processor with encryption/decryption
engine-functional system blocks.
In April 1997, VLSI introduced a gigabit MAC controller device, the VNS67500. The device is available as a
standard product, operating at 3.3V, or may be embedded in a submicron CMOS ASIC. The device is designed
for high-speed networking applications.
Two new processes were announced in April 1997, for mixed signal devices – VSC9 SRAM, and VSC10 SRAM,
0.25 micron and 0.20 micron processes, respectively. A five layer metal interconnect process is planned for
introduction in 1998.
2-494
North American Company Profiles
VLSI Technology
Semiconductor Fabrication Facilities
VLSI has a three level manufacturing strategy – one level of support comes from their partner, Wafer Technology
Malaysia (WTM) located in San Jose, where R&D prototyping for advance technologies takes place. The second
level is from their production fab in San Antonio, where the 0.25 and 0.20 micron processes are utilized. Finally,
the third tier of support will be coming from their new fab, joint ventured with WTM, located in Penang, planned for
completion by the year 2000.
In previous years, VLSI Technology enhanced its manufacturing capacity through wafer manufacturing
relationships, primarily with Chartered Semiconductor. However, by the end of 1996, VLSI shifted substantially all
its wafer manufacturing to its own facilities.
During 1996, VLSI completed the majority of its expansion plans of its San Antonio fab, including the conversion
to 0.6µm and smaller processes. In late 1996, VLSI announced plans to close its San Jose facility, citing its
technology limitations as a contributing factor in the decision.
VLSI Technology, Inc.
1109 McKay Drive
San Jose, California 95131
Telephone: (408) 434-3000
Fab 1
Cleanroom size: 47,000 square feet
Capacity (wafers/week): 3,400
Wafer size: 150mm
Process: CMOS
Products: ASICs, ASSPs
Feature sizes: 0.6µm, 0.8µm, 1.0µm
VLSI Technology, Inc.
9641 Westover Hills Boulevard
San Antonio, Texas 78251
Telephone: (210) 522-7000
Fab 2
Cleanroom size: 50,000 square feet (Class 1)
Capacity (wafers/week): 7,400
Wafer size: 150mm
Process: CMOS
Products: ASICs, ASSPs
Feature sizes: 0.35µm, 0.5µm, 0.6µm
VLSI subcontracts all of its IC packaging and approximately half of its final test needs. Its in-house final test
functions are performed at its factories in California and Tempe, Arizona.
Key Agreements
•
In October 1997, VLSI signed an agreement to invest in a new state-of-the-art, deep submicron
semiconductor manufacturing plant with Wafer Technology (Malaysia) Sendiran Berhad (WTM), a consortium
of Malaysian and foreign investors organized under the sponsorship of Malaysian government agencies. In
addition, as part of the agreement, WTM will take ownership, manage and upgrade VLSI’s current San Jose
fabrication facility, operating as a semiconductor process development and prototyping line. This will provide
WTM with an immediate base of operations in the Silicon Valley. The fab will employ about 65 staff.
2-495
VLSI Technology
North American Company Profiles
•
In October 1997, VLSI and The Athena Group, Inc., announced a strategic partnership to develop advanced
digital signal processing (DSP) technologies under terms of an award announced by the U.S. Department of
Commerce National Institute of Standards and Technology (NIST) Advanced Technology Program (ATP). For
the project, The Athena Group will work with VLSI to develop integrated circuit elements and support software
implementing advanced DSP techniques that could result in cost/performance gains up to ten times over
those of current generation DSP chips.
•
In July 1997, VLSI announced the signing of a definitive agreement to sell its COMPASS Design Automation
subsidiary to Avant! Corporation. COMPASS provides electronic design automation (EDA) tools and libraries
for deep submicron application-specific integrated circuits (ASICs) and application-specific standard products
(ASSPs). Under the agreement, Avant! purchased all of the outstanding equity in COMPASS for a
combination of cash and common stock totaling approximately $44 million.
The agreement allows VLSI to put its full focus on expanding their semiconductor business, targeted at
communications, consumer digital entertainment and advanced computer workstations. The acquisition was
completed in September of 1997.
•
In November 1996, VLSI signed a memorandum of understanding with the Government of Malaysia. The
memo covers the construction of a 200mm wafer fabrication facility in Malaysia. To date, the company has not
announced any decision or timeframe for the facility.
•
In 1996, VLSI entered into an agreement with Digital Semiconductor that covers the design and manufacture
of system logic devices. The devices are for use in future Alpha-based systems.
•
VLSI and Hitachi renewed and expanded their 1988 standard cell and process technology exchange
agreement. The new pact added gate array technology, and the two companies will develop compatible gate
array families. In July 1996, Hitachi licensed its SuperH-3 RISC MPU core to VLSI, who plans to offer it as a
CPU core in ASICs and ASSPs for applications such as handheld computing devices, navigation systems,
digital entertainment, and multimedia peripherals.
2-496
Voltage Multipliers, Inc.
North American Company Profiles
VOLTAGE MULTIPLIERS, INC . (VMI)
Voltage Multipliers, Inc.
8711 West Roosevelt Avenue
Visalia, California 43291
Telephone: (209) 651-1402
Fax: (209) 651-0740
Web Site: www.voltagemultipliers.com
IC Manufacturer
Founded: 1980
Employees: 145
Ownership: Privately held.
Company Overview and Strategy
Voltage Multipliers Inc. was incorporated in December 1980 to design, manufacture and market high voltage
semiconductor products. VMI has also developed some of the world’s fastest switching rectifiers for both high and
low voltage applications.
VMI currently sells to more than 1,000 customers in a variety of industries. The majority of the customers are
manufacturers of high voltage power supplies or users of high voltage power supplies in their products. With more
than 50 years of combined experience in High Voltage electronics, approximately 20 percent of VMI’s business is
for military use and the balance is for industrial, medical, aircraft or other high reliability applications.
Management
Dennis J. Kemp
John Yakura
Kenneth Haag
President and Chief Executive Officer
Vice President, Director of Research and Development
Vice President of Marketing
Products and Processes
Discrete Diodes
Diodes are available in a wide variety of voltage ranges and are available in axial-leaded, SMD TAB, and some types
as glass-passivated chips.
Transient Voltage Suppressers
TVS are currently in development as catalog items and are available in limited voltage ranges. Current emphasis is
on higher voltage TVS.
2-497
Voltage Multipliers, Inc.
North American Company Profiles
High Voltage Power Supplies
These products consist of VMI diodes along with other components (transformers, resistors, capacitors, etc.)
assembled in a variety of configurations to provide power conversion from low voltage DC or AC to high voltage
DC. These devices are custom designed and are high quality, high reliability devices.
2-498
VSIS, Inc.
North American Company Profiles
VSIS, INC .
VSIS, Inc.
1050 East Arques Ave.
Sunnyvale, CA 94086
Telephone: (408) 730-5900
Fax: (408) 732-8037
Web Site: www.vsisinc.com
Fabless IC Supplier
Company Overview and Strategy
VSIS, Inc., founded in 1996, (as a semiconductor systems design spin-off of Mitsubishi Electric) is a design
company which was formed to address the emerging systems-level applications requirements of North American
customers. The company handles leading-edge “system-on-a-chip” designs, using Mitsubishi fabrication
facilities.
Products and Processes
Current products:
•
•
•
•
Advanced 3D graphics;
Java solutions in silicon;
System-on-a-chip (SOC); and
Network computing.
Mitsubishi Electronics America provided 100 percent of the venture capital funding for the company. VSIS is an
autonomous entrepreneurial company.
Management
Dr. Osamu Tomisawa
Stephen Hester
Kenji Baba
Joe Eschbach
President and Chief Executive Officer
Executive Vice President
Vice President, Engineering
Assistant Vice President, New Computing Markets
2-499
VTC
North American Company Profiles
VTC
VTC Inc.
2800 East Old Shakopee Road
Bloomington, Minnesota 55425-1350
Telephone: (612) 853-5100
Fax: (612) 853-3355
Web Site: www.vtc.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
VTC Japan • Tokyo, Japan
Telephone: (81) (3) 3389-6016
Europe:
VTC Deutschland • Germany
Telephone: (49) (8071) 95304
Financial History ($M)
Sales
Employees
1992
50
1993
75
1994
108
1995
166
1996
178
300
375
480
540
600
Company Overview and Strategy
VTC was founded in 1984 to design and manufacture VHSIC products for government markets. Within the first
year, VTC acquired Control Data Corporation's microcircuits division (a captive chip manufacturing operation for
CDC's disk drive business that had operated since 1969). VTC was privately held, but Control Data was a major
investor.
Control Data purchased all of VTC in 1987, making it a wholly-owned subsidiary. In 1988, the two original founders
left CDC and the company was put up for sale. In October 1990, CDC sold the bipolar portion to a management
buyout led by VTC's current CEO, Larry Jodsaas. Before the end of the year, CDC also sold the CMOS fab to
Cypress.
Today, VTC's strategy is to offer quality, high-performance ICs to the data storage (disk and optical drive) industry.
The company's revenues come from bipolar read/write preamplifiers and channel electronics found in disk drives
worldwide.
2-500
VTC
North American Company Profiles
Management
Larry Jodsaas
Cliff Boler
John Doyle
Dan Griffith
Greg Peterson
Robert Rousseau
Ed Schnable
President and Chief Executive Officer
Vice President, Engineering
Vice President, Quality
Vice President, Sales and Marketing
Vice President and Chief Financial Officer
Vice President, Human Resources
Vice President, Manufacturing
Products and Processes
VTC offers a broad line of read/write preamplifier standard products and channel ASICs for use in rigid disk drives.
Processes used by the company are complementary bipolar (CBP), ECL, and BiCMOS (called PolarMOS).
Semiconductor Fabrication Facilities
VTC Inc.
2800 East Old Shakopee Road
Bloomington, Minnesota 55425-1350
Cleanroom size: 32,000 square feet
Capacity (wafers/week): 5,000
Wafer size: 150mm
Processes: Bipolar, complementary bipolar, BiCMOS
Products: Standard and ASIC read/write preamplifiers, servo preamplifiers, and channel electronics
Feature sizes: 1.2µm, 2.0µm, 3.0µm
2-501
Western Design Center
North American Company Profiles
WESTERN DESIGN CENTER
Western Design Center, Inc. (THE)
2166 East Brown Road
Mesa, Arizona 85213
Telephone: (602) 962-4545
Fax: (602) 835-6442
Web Site: www.wdesignc.com
Fabless IC Supplier
Financial History ($M), Fiscal Year Ends December 31
Sales
Employees
1997
1-2.5 (est.)
7
Company Overview and Strategy
A privately-held company founded in 1978, Western Design Center (WDC) designs, assembles and sells
microprocessor Intellectual Property (IP) to the electronics industry worldwide. WDC licenses its IP portfolio
(65C02 microprocessor and microcontroller cores and a modules library) to end-user companies and foundries,
provides design services, and assembles ASIC and ASSP cores for low-volume-production applications. WDC is
the original source and remains the IP owner of the patented CMOS 65C02 8-bit and 65C816 16-bit
microprocessors. In mid-1994, WDC introduced the Mensch Computer, a developer and educational system for
data capture, communications and control applications.
The founder, William D. Mensch, Jr., was one of the inventors of the Motorola 6800 microprocessors and he
helped invent and develop the 6502 chip used in Apple, Commodore, Atari and other computers.
WDC customers include Franklin Electronic Publishers, ITT Semiconductors, Sanyo and General Instruments.
WDC also resells third party software development tools from six vendors and hardware development tools from
another eleven vendors. Most vendors are U.S., but a few are from the UK. Additionally, WDC has a network of
Field Representatives; three in the U.S. and one each in Israel and Taiwan.
Management
William D. Mensch, Jr.
Mike Grennan
Nick Dazio
Michael Thompson
2-502
Founder, Chairman, President
Chief Financial Officer
Vice President, Business Development
QA/QC Manager
North American Company Profiles
Western Design Center
Products and Processes
WDC offers five microprocessors. The W65C02S is a single-chip, 8-bit microcontroller ASIC which runs up to
20MHz, has a single-phase clock and is available in 40 DIP, 44 PLCC and 44 QFP packages. Applications for this
0.8µm chip include video games, set-top converters, pagers, and medical equipment.
WDC’s W65C816S is a fully static CMOS 16-bit microprocessor with backward software compatibility to its
predecessor series. Addressing is extended to a full 16Mb and the chip is software-switchable to 8-bit emulation
mode or native 16-bit mode. The 0.8µm chip also features abort and interrupt capability.
WDC’s W65C134S 8-bit microcontroller is a fully static 8-bit system-on-a-chip fabricated in 0.8µm CMOS for
microcomputer and low power (2.8V @ 3mA/MHz and 5.5V @ 6mA/MHz) applications including hi-rel. The chip is
also available as a monitor ROM ASSP. It is packaged in either 68 PLCC or 80 QFP and has 56 I/O ports. Low
power modes are WAI, STP, and fast oscillating start and stop. WDC also offers the W65C265S 16-bit version
specifically designed for low power hi-rel applications. It is also 0.8µm and features 64 I/O ports and is packaged in
84 PLCC or 100 QFP.
WDC’s 265C22S Versatile Interface Adapter (VIA) is a program-controlled 8-bit serial bi-directional peripheral I/O
device used with the 265C series microprocessors. The device is fabricated in a 1.2µm process using proprietary
“foundry-independent design rules.” Key features include NMOS 6522 device compatibility, two 16-bit
programmable interval timers/counters and an enhanced handshake feature. Several control registers also
provide application flexibility.
WDC offers four developer boards for embedded systems development, WDC chip-based system development
and system or chip development using WDC’s IP. The W65C02S is an 8-bit MPU with a Versatile Interface Adapter
(VIA) peripheral chip and a memory map decoder PLD. The board also features an ASIC header, ten I/O lines, a
low-power detector, easy crystal changing, a 32K SRAM, a 32K EPROM, and access to all control lines. The glue
chip is an AMD MACH211. The W65C816S MPU is a 16-bit version with twenty I/O lines and its bank address and
data buses extracted and placed on the header for easier use. It uses AMD’s MACH210 glue chip.
WDC’s W65C265S is an 8-bit MCU with four serial ports, full networking capability, a monitor program, twenty I/O
lines, the VIA peripheral chips, and Flash and battery-backed SRAM PCMCIA cards. The W65C134SPCB
developer board is a 0.8µm, 4MHz, 8-bit MCU. It has one serial port, full networking capability, a monitor program,
twenty I/O lines, 32K SRAM, 32K EPROM, and includes the VIA peripheral chip.
WDC made a wise, bold move in its 1994 launch of the Mensch Computer; a move the company positions as a
“peripheralization” and “embedded system use” of its W265C265S developer board. Base peripherals include
the keyboard and display and options include a modem, printer, and game controller. This product is targeted as a
“trainer” for college engineering laboratories. The Mensch Computer enables students to learn assembly
language and C programming and learn about libraries and all the system and peripheral hardware. WDC notes the
ASIC header allows teaching of HDL FPGA applications and soft cores. WDC has a University Relations program
from which the product appears to have its genesis and is sure to benefit from student interactions which include
fellowships at WDC.
2-503
Western Design Center
North American Company Profiles
WDC licenses two 8-bit and two 16-bit chip level cores, the VIA core, a static RAM module and a mask ROM
module.
WDC states its IP has been licensed into the full spectrum of applications including commercial, industrial, hi-rel,
medical, MIL-SPEC and rad-hard. WDC IP has been used in 0.6µm through 1.5µm processing geometries.
WDC’s licensing approach is to charge a low-cost, one-time initial fee with low quarterly maintenance fees.
2-504
WSI
North American Company Profiles
WSI
WSI, Inc.
47280 Kato Road
Fremont, California 94538
Telephone: (510) 656-5400
Fax: (510) 657-5916
Web site: www.wsipsd.com
Fabless IC Supplier
Founded: 1983
Financial History ($M)
Sales
Employees
1992
28
1993
27
1994
28
1995
38
1996
44
1997
43
137
125
125
125
100
146
Ownership: Privately held.
Company Overview and Strategy
WSI, Inc. (formerly WaferScale Integration, Inc.) was founded in 1983, as a supplier of high-performance
programmable ICs. It serves embedded system designers who need to achieve higher system performance,
reduce system size and power consumption, shorten product development cycles to achieve faster market entry,
and reduce manufacturing costs. It offers field-programmable microcontroller peripherals as well as highperformance non-volatile EPROM products.
Management
Michael Callahan
Yoram Cedar
Howard Gopen
Robert Hoard
Reza Kazerounian
Carl Mills
David Raun
Chairman, President, and Chief Executive Officer
Vice President, New Business Development
Vice President, Operations
Vice President, Worldwide Sales
Vice President, Research and Development
Vice President, Finance
Vice President, PSD and Memory Products
2-505
WSI
North American Company Profiles
Products and Processes
WSI supplies several families of programmable microcontroller peripherals as well as a broad line of high
performance non-volatile PROM and EPROM devices. These products are based on the company's patented
self-aligned split-gate CMOS EPROM technology. WSI's fast Flash, EEPROM, and EPROMs are available in
densities ranging from 16K to 1M. The programmable peripherals integrate EPROM, SRAM, PLD, and userconfigurable logic.
Semiconductor Fabrication Facilities
WSI does not have its own fabrication facility. It has foundry agreements with Sharp, National Semiconductor, AMI,
SGS-Thomson, and Tower Semiconductor.
Key Agreements
• In December 1997, WSI announced an agreement to jointly develop Flash memory versions of its PSD
peripherals for MCUs using SGS-Thomson’s FLASH+™ technology. Under the agreement, ST will provide WSI
with full access to its NVM design rules and wafer fab capacity to meet projected demand for Flash PSDs. WSI is
licensing ST for manufacturing and marketing Flash PSDs as well as use of WSI’s advanced NVM technologies.
ST also acquired a fifteen percent equity stake in WSI as part of the transaction.
• In January 1997, WSI signed a long-term technology exchange and foundry agreement with Tower
Semiconductor. Under the agreement, the two companies will jointly develop manufacturing process
technologies such as WSI’s AMG EPROM architecture using Tower’s 0.6µm technology. The agreement also
guarantees WSI access to Tower’s wafer capacity.
• National took a 10 percent stake in WSI as part of a five-year foundry and technology exchange agreement.
• WSI formed an alliance with American Microsystems to jointly develop mask-programmable versions of WSI's
line of microcontroller peripherals. AMI is manufacturing the parts and the companies are marketing them
separately.
2-506
White Microelectronics
North American Company Profiles
WHITE MICROELECTRONICS / BOWMAR INSTRUMENT CORP .
White Microelectronics
3601 East University Drive
Phoenix, Arizona 85034-7217
Telephone: (602) 437-1520
Fax: (602) 437-9120
Web Site: www.whitecmicro.com
IC Manufacturer
Founded: 1980
Regional Offices/Representative Locations
North America: White Microelectronics • Huntington Beach, CA
Phone: (562) 592-2793 • Fax: (562) 592-3046
White Microelectronics • Nutley, NJ 07110
Phone: (973) 284-1228 • Fax: (973) 284-0843
Europe:
White Microelectronics • Northumberland, England
Telephone: (44) (0) 1661-853777 • Fax: (44) (0) 1661-854111
Financial History ($K), Fiscal Year Ends September 27
Corporate
Sales
Net Income
Microelectronics Division
Net Income
1997
1996
1997
18,067
522
18,840
1,290
22,189
3,903
1,344
1,272
4,110
Ownership: Publicly held. AMEX: BOM
Company Overview and Strategy
White Microelectronics, a division of Bowmar Instrument Corporation, designs and manufactures custom and
standard multichip modules and microcircuits for commercial, industrial and military applications worldwide. The
Company is a world leader in the production of memory products. White’s products include a wide range of SRAM,
Flash, EEPROM, and SRAM memory products. High-density memories are available in PLCC, SIMM, ZIP and BGA
for commercial applications. There is also a diverse selection of processor-based products for military
environments.
2-507
White Microelectronics
North American Company Profiles
The Board of Directors of Bowmar Instrument Corporation has realigned the Company to be a pure
microelectronics company to position it for the greatest possibility of long-term success. The Company’s
Technologies division based in Fort Wayne, Indiana. The Company’s non-semiconductor division, the
Technologies division, designs and manufactures a variety of electromechanical components, electromechanical
display devices and keyboard assemblies for military and commercial applications. As an added measure to reduce
overhead expense, the Company's corporate headquarter’s facility in Phoenix, Arizona, was closed in January
1998. Bowmar corporate functions will now operate out of the new microelectronics facility, a modern 53,000
square foot facility, located in Phoenix.
Bowmar’s Microelectronics division has continued to grow and the division’s sales for fiscal 1997 were almost 18%
over sales for fiscal 1996. The percentage of sales in gross margin increased from 37.6% (1996) to 38.5% (1997).
Pre-tax income at this division in 1997 was $2,608,000, an increase of over $400,00 from 1996.
Management
Hamid Shokrogozar
Dan Tarantine
President and Chief Executive Officer
Vice President, Sales and Marketing
Products and Processes
White Microelectronics has four divisions of product lines: commercial memory products, Plastic Plus memory
products, Atlas peripheral-processor, and memory and microprocessor products. Product details are as follows:
Commercial Memory Products
• SRAM, Flash, and DRAM PLCCs, SIMMs (Single In-line Memory Modules), ZIPs, and BGAs.
• White Microelectronics is the first to introduce on the market the 16Mbyte SRAM SIMM.
• Flash SIMMs from 2Mbytes to 64Mbytes.
• SRAM SIMMs in 16, 32, 36, 36, and 64Mbit.
• 4Mbit SRAM MCMs with 3.3V, and 16Mbit SRAM MCMs with 3.3V.
• 16Mbit SRAM.
• High-density DRAM Mega DIMMs (Dual In-Line Memory Modules).
Plastic Plus  Memory Products
• SRAM, Flash, and DRAM memory products in a variety of monolithic plastic packages.
Memory and Microprocessor Products
• 8Mbyte and 16Mbyte Flash.
• 3.3V SRAM.
• Military-grade monolithic processors.
• 4Mbit monolithic SRAM.
• 8Mbyte Multichip Flash Modules and 16Mbyte Multichip Flash Modules.
• 256Kx16CMOS EEPROM Module.
• Military Grade 128Kx8CMOS monolithic EEPROM.
• SRAM, Flash, EEPROM, and Mixed memory in ceramic, hermetic monolithic and multichip module packages.
• Monolithic processors and processor MCMs.
• 16Mbit monolithic DRAM.
• 5V Flash 16Mbit monolithic, 5V Flash 32Mbit module, and 5V Flash 64Mbit module.
2-508
North American Company Profiles
White Microelectronics
Memory and Processors (continued)
• Military version of 603e Microprocessor: 32-bit of the PowerPC RISC architecture.
• SRAM/EEPROM Mixed Modules.
• SRAM/Flash Mixed Modules.
• Modular X multi-chip module (MCM) incorporate peripheral functions and memory with the processor core.
• SRAM/EEPROM Mixed Modules.
Atlas Peripheral Processors
• Contains the functions of 16 individual components in one chip: a processor interface and memory decorder,
five UARTs, a watchdog timer, an interrupt controller, 32 programmable I/Os, both reset and configuration logic,
and four 48-bit timers.
2-509
Xicor
North American Company Profiles
XICOR
Xicor, Inc.
1511 Buckeye Drive
Milpitas, California 95035-7493
Telephone: (408) 432-8888
Fax: (408) 432-0640
Web Site: www.xicor.com
IC Manufacturer
Founded: 1978
Regional Headquarters/Representative Locations
Japan:
Xicor Japan K.K. • Shinjuku-ku, Tokyo, Japan
Telephone: (81) (3) 3225-2004 • Fax: (81) (3) 3225-2319
Europe:
Xicor Ltd. • Witney, Oxford, United Kingdom
Telephone: (44) (1993) 700544 • Fax: (44) (1993) 700533
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
Employees
1992
93
(30)
22
6
1993
104
(6)
13
2
1994
104
2
14
5
1995
114
10
15
9
1996
124
14
15
25
1997
122
(3)
18
—
840
800
691
641
680
730
Company Overview and Strategy
Xicor, Inc. (NASDAQ: XICO), founded in 1978, designs and manufactures a broad line of non-volatile in-thesystem programmable semiconductor ICs.
In-the-system programmability enables telecommunications,
consumer, computer, industrial, automotive, and military products to adapt to changing software and operating
environments, and to be personalized by the user. Many of Xicor’s products consume little power and operate
well from a battery powered source, making them well suited for hand-held and portable applications.
2-510
Xicor
North American Company Profiles
Xicor emphasizes the development of proprietary products that incorporate its programmable technology,
enabling customers to rapidly bring to market products with improved features, efficiency and maintainability. In
1995, Xicor introduced its first SerialFlash™ memory product family, which operates from low voltage power
sources. Xicor is a leading supplier of EEPROM memory products and EEPOT® digitally controlled
potentiometers.
Management
Raphael Klein
Joseph Drori
Bruce Gray
Geraldine N. Hench
Klaus G. Hendig
Timothy D. Kanemoto
Dennis E. Krueger
Madga M. Madriz
Michael Levis
William H. Owen III
Chairman, President, and Chief Executive Officer
Vice President, Products Design, Engineering, Quality, and Reliability
Vice President, Wafer Operations
Vice President and Corporate Controller
Vice President, Finance and Administration
Vice President, Product Operations
Vice President, North America Sales
Vice President, Human Resources
Vice President, Marketing
Vice President, Technology Development and Intellectual Properties
2-511
Xicor
North American Company Profiles
Products and Processes
Xicor offers serial EEPROMs in 128-bit to 128K densities, parallel EEPROMs in 16K to 1M densities, Serial Flash
memories in 8K to 128K densities, Secure SerialFlash devices for data security applications, NOVRAMs
(nonvolatile SRAMs), NOVRAMs with Autostore™ power-loss data protection, EEPOT® digitally controlled
potentiometers, EEPROMs that interface directly with microcontrollers or microprocessor bus-based systems, and
memory subsystems.
Xicor is also a licensee of the Pine 16-bit fixed-point DSP core and related development tools from DSP Group.
The firm is developing products that integrate the Pine DSP core with its EEPROM technology.
Xicor is ISO 9001 and QS 9000 quality standard certified.
Semiconductor Fabrication Facilities
Xicor, Inc.
1511 Buckeye Drive
Milpitas, California 95035-7493
Capacity (wafers/week): 2,000
Wafer size: 150mm
Processes: CMOS
Products: EEPROM-based ICs
Feature sizes: 0.6µm-1.0µm
Key Agreements
•
In early 1997, Yamaha teamed up with Xicor in the EEPROM business. The partnership calls for Yamaha to
produce Xicor’s EEPROMs and supply them to cellular phone makers under the Xicor name beginning in May
1998. The two companies also agreed to jointly develop process technology.
2-512
Xilinx
North American Company Profiles
XILINX
Xilinx, Inc.
2100 Logic Drive
San Jose, California 95124-3400
Telephone: (408) 559-7778
Fax: (408) 559-7114
Web Site: www.xilinx.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
In February 1998, Xilinx broke ground for a new $31 million, 180,000 square foot corporate headquarters in San
Jose. The new building will accommodate about 600 new employees and is scheduled for completion this fall.
Japan:
Xilinx K.K. • Tokyo, Japan
Telephone: (81) (3) 3297-9191
Europe:
Xilinx Ltd. • Surrey, United Kingdom
Telephone: (44) (1932) 349401
Asia-Pacific:
Xilinx Asia-Pacific Ltd. • Kwai Fong, Hong Kong
Telephone: (852) 2424-5200
Financial History ($M), Fiscal Year Ends March 31
Sales
Net Income
R&D Expenditures
Foundry Fab Investment
Employees
1993
178
27
24
—
1994
256
41
34
—
1995
355
59
45
—
1996
561
102
65
34
1997
568
110
71
35
1998
614
127
80
91
544
689
868
1,201
1,500
1,393
Company Overview and Strategy
Founded in 1984, Xilinx (NASDAQ: XLNX) is the leading innovator of complete programmable logic solutions.
Xilinx develops, manufactures and markets a broad line of advanced integrated circuits, including field
programmable gate arrays (FPGAs) and complex programmable logic devices (CPLDs). Xilinx is currently the
world’s largest supplier of FPGAs.
2-513
Xilinx
North American Company Profiles
The company also offers software design tools, predefined system-level functions delivered as cores, and
masked programmed HardWire™ devices that are functionally equivalent and pin compatible with programmed
FPGAs. Markets for Xilinx products include data processing, telecommunications, networking, industrial control,
instrumentation, consumer, military and aerospace.
In February 1997, Xilinx unveiled its five year product roadmap that called for an aggressive adoption of the most
advanced semiconductor manufacturing processes. By mid-1997, Xilinx began shipping the industry’s first family
0.35 micron 3.3 volt FPGAs — the 10-member XC4000XL family — offering densities ranging from 5,000 to
180,000 system gates. Later the same year, Xilinx began sampling the XC40125XV, first 0.25 micron 2.5 volt
FPGA with 250,000 system gates of logic. The XC4000XV family consists of four devices offering up to 500,000
system gates of logic.
Also in 1997, Xilinx announced the architecture of its new Virtex series of FPGAs, which will offer up to 1 million
gates of system logic and begin sampling in the second half of 1998. Virtex, with a 2.5 volt supply of voltage,
features the SelectI/O that can simultaneously support low-voltage standards such as LVTTL, LVCMOS, GTL+,
and SSTL3. Virtex also offers a hierarchy of RAM — on chip distributed and block memory and high speed access
to off-chip RAM. Virtex will begin sampling in 2H98.
In January 1998, Xilinx introduced the Spartan Series of FPGAs. These devices are targeted as gate array
replacements for low-cost designs under 40,000 system gates which require on-chip RAM and can benefit from
pre-defined software cores.
Management
Bernard V. Vonderschmitt
Willem P. Roelandts
R. Scott Brown
Gordon M. Steel
Richard W. Sevcik
William S. Carter
Charles A. Fox
Steve Haynes
Robert C. Hinckley
2-514
Chairman
President and Chief Executive Officer
Senior Vice President, Worldwide Sales
Senior Vice President, Finance, and Chief Financial Officer
Senior Vice President, Software
Vice President and Chief Technical Officer
Vice President and GM, HardWire Business Unit
Vice President, North American Sales
Vice President, Strategic Plans and Programs, and Secretary
Xilinx
North American Company Profiles
Randy Ong
Dennis L. Segers
Sandra L. Sully
Christine C. Taylor
Roland Triffaux
Sandeep Vij
Evert A. Wolsheimer
Roman Iwanczuk
Scott Lewis
Vice President, Operations
Vice President, FPGA Product Development
Vice President and Chief Information Officer
Vice President, Human Resources
Vice President, European Sales and Marketing
Vice President, Marketing
Vice President and GM, CPLD Business Unit
Director, Cores Solutions Group
Director, CPLD Marketing
Products and Processes
Xilinx’s product line consists of FPGAs, HardWire Array products, EPROMs for external storage of FPGA
configuration programs, CPLDs, design and implementation software tools and cores. Its FPGA products are
manufactured using CMOS technology, with the most advanced chips utilizing 0.35µm and 0.25µm processes.
FPGA Products
XC2000 family — Being discontinued.
XC3000 family — General-purpose architecture with usable gate densities ranging from 1,500 to 7,500 gates.
The older XC3000-70 and XC3000A products are being discontinued.
XC4000 family — The company’s most successful FPGA architecture. The family consists of 15 SRAM-based
members ranging in density from 3,000 to 500,000 logic gates. The older XC4000A and
XC4000H sub-families are being discontinued. At the high end, Xilinx offers the XC4000EX,
XC4000XL sub-families and XC4000XV. Introduced in early 1997, the XC4000XL series
features high-performance 3.3V operation through the use of a 0.35µm CMOS process. The
XC4000XV, offering up to 500,000 logic gates, began sampling in late 1997.
XC5200 family — With a process-optimized architecture, the XC5200 parts are the first FPGAs specifically
developed as a cost effective, high volume production alternative to gate arrays.
Spartan family — Low-cost FPGAs featuring on-chip RAM and support for a wide variety of cores. Versions
operating at 5 volts began shipping in volume in January 1998; 3.3 versions go into production
in 3Q98.
HardWire Array Products
The company’s HardWire process converts a Xilinx FPGA into a HardWire mask-programmed array offering quick
time-to-market and a reduction in cost. For every Xilinx FPGA family, there is a corresponding HardWire family. In
1997, Xilinx expanded its HardWire product offerings with the addition of a PCI+ conversion device featuring full
PCI compliance and up to 10,000 gates of customer specific logic.
CPLD Products
XC9500 family — Volume production of these flash memory-based CPLDs began in January 1997. The XC9500
devices features in-system programmability with more than 10,000 program/erase cycles, 36 to
288 macrocells with 800 to 12,800 usable gates, and pin-to-pin delays as low as 5ns. Xilinx
expects to migrate the family from a 5V 0.6µm process to a 3.3V 0.5µm process in 3Q98.
2-515
Xilinx
North American Company Profiles
New Software
In 1997, Xilinx introduced new versions of its two lines of design and implementation software. Alliance Series
integrated with leading third-party front end EDA tools from vendors such as Cadence, Exemplar, Mentor
Graphics, Model Technology, Synopsys and Synplicity. Foundation Series is a family of a fully integrated, readyto-use Windows NT and Window 95 PC tools with built-in synthesis support that support FPGAs and CPLDs.
Available at low price points and targeted at entry-level users, Foundation Series products leverage industry
standard hardware description languages.
Xilinx also offers more than 75 different predefined cores to implement system-level functions — DSP algorithms,
bus interfaces, processors and peripheral interfaces — directly in Xilinx devices. These cores, available from Xilinx
and third-party partners, allow designers to cut design time and reduce risk while having access to the best
performing and lowest cost components available. In March 1998, Xilinx announced the CORE Generator, an
easy to use tool that delivers parameter-based cores and features an interface third-party system level DSP design
tool.
Semiconductor Fabrication Facilities
Xilinx does not fabricate its own ICs, but has foundry agreements with Seiko Epson, Yamaha, and UMC.
Key Agreements
• In June 1997, Xilinx and Synopsys established an exclusive partnership enabling Xilinx to incorporate
Synopsys’ FPGA Express technology into the Xilinx Foundation Series.
2-516
Zilog
North American Company Profiles
ZILOG
Zilog, Inc.
210 East Hacienda Avenue
Campbell, California 95008-6600
Telephone: (408) 370-8000
Fax: (408) 370-8056
Web Site: www.zilog.com
IC Manufacturer
Regional Headquarters/Representative Locations
Japan:
Zilog, Inc. • Tokyo, Japan
Telephone: (81) (3) 5272-0230
Europe:
Zilog, Inc. • Maidenhead, United Kingdom
Telephone: (44) (1628) 392-00
Asia-Pacific:
Zilog, Inc. • Taipei, Taiwan
Telephone: (886) (2) 741-3125
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Capital Expenditures
1992
146
16
16
27
1993
203
27
21
40
1994
223
35
23
69
1995
265
43
25
79
1996
298
30
31
117
1997
261
12
30
38
Employees
1,400
1,500
1,500
1,575
1,650
1,650
Company Overview and Strategy
Zilog was founded in 1974 and became a wholly owned subsidiary of Exxon by 1981. In 1985, the company
rechartered its course to focus on application-specific market segments. In 1989, Zilog's management,
employees, and a venture capitalist purchased the company from Exxon. Zilog became a public company in
February 1991. In 1998, the company was purchased by Texas Pacific Group and taken private.
Zilog is a leader in the development, design, and manufacture of application specific standard products (ASSPs)
for the consumer electronics, data communications, and computer peripheral markets. The company utilizes its
Superintegration™ design methodology to combine cores and cells from its extensive library of microprocessors
and controllers, DSPs, and memory and logic circuits.
2-517
Zilog
North American Company Profiles
Zilog maintains its strategy of addressing the needs of specific applications by utilizing its proprietary core and cell
designs, which are optimized for particular applications, to design and develop new products within its target
markets. During 1997, Zilog introduced 36 new products.
Management
Curtis J. Crawford
Michael J. Bradshaw
Thomas C. Carson
Richard L. Moore
Sally M. Baumwell
Robert E. Collins
James J. Magill
Richard R. Pickard
Alan Secor
President and Chief Executive Officer
Senior Vice President, Worldwide Operations
Senior Vice President, Worldwide Sales
Senior Vice President, Technology
Vice President, Human Resources
Vice President and Chief Financial Officer
Vice President and General Manager, Data Communications
Vice President, General Counsel
Vice President, Consumer/Peripherals
Products and Processes
Zilog's core library includes 8-bit microcontrollers, 8-bit, 16-bit, and 32-bit microprocessors, 16-bit digital signal
processors, serial communications controllers, and peripheral circuits. These cores are available as stand-alone
devices or may be combined in Superintegration products. The company’s cell library consists of logic and
memory circuits that are generally combined in Superintegration products.
The Superintegration library and diverse product portfolio of over 700 items serve three distinct markets: data
communications, consumer electronics, and computer peripheral products.
• For data communications applications, Zilog offers ASSPs based on its Z80 microprocessor family and
serial communications controllers. These ASSPs are optimized for Ethernet routers, bridges, data
switches, modems, terminals, printers, workstations, local area networks, and wide area networks. The
company holds a leadership position in general purpose, multiprotocol controllers for the LAN and WAN
markets.
2-518
Zilog
North American Company Profiles
• Based on the Z8® 8-bit microcontroller, Zilog offers a family of controllers for use in consumer electronics
products such as cellular phones, audiovisual equipment, automobiles, telephone answering machines,
household appliances, battery chargers, garage door openers, security systems, set-top boxes, interactive
TVs, and infrared remote controls.
• Zilog is an innovator in the addition of intelligence to computer peripheral chips using its line of Z80® 8-bit,
Z180 ® 16-bit, and Z380 ® 32-bit microprocessors, and peripheral circuits. Adding intelligence to computer
peripherals frees the central processor from micro-management tasks and upgrades the performance of
the system. Common peripherals are printers, keyboards, monitors, pointing devices, hard disk and floppy
disk controllers, modems, and PCMCIA bus interface products.
Semiconductor Fabrication Facilities
Zilog, Inc.
2601 11th Avenue, North Extension
Nampa, Idaho 83651
Telephone: (208) 466-4551
Fax: (208) 467-9765
Modules I and II
Cleanroom size: 77,000 square feet (Class 10)
Capacity (wafers/week): 7,000
Wafer sizes: 100mm, 125mm
Processes: NMOS, CMOS, BiCMOS
Products: ASSPs, MCUs, MPUs, DSPs
Feature sizes: 0.6µm, 0.8µm, 1.0µm, 1.2µm
Zilog, Inc.
1401 North King Road
Nampa, Idaho 83651
Module III
Cleanroom size: 30,000 square-feet (Class 1)
Capacity (wafers/week): 2,500
Wafer size: 200mm
Process: CMOS
Products: ASSPs, MCUs, MPUs, DSPs
Feature sizes: 0.35µm 0.6µm, 0.8µm
2-519
Zoran
North American Company Profiles
ZORAN
Zoran Corporation
3112 Scott Boulevard
Santa Clara, California 95054
Telephone: (408) 919-4111
Fax: (408) 919-4122
Web Site: www.zoran.com
Fabless IC Supplier
Regional Headquarters/Representative Locations
Israel:
Zoran Microelectronics Ltd. • Haifa, Israel
Telephone: (972) (4) 854-5777 • Fax: (972) (4) 855-1550
Canada:
Zoran Toronto Lab • Toronto, Ontario, Canada
Telephone: (416) 690-3356 • Fax : (416) 690-3363
Japan:
Zoran Japan • Tokyo, Japan
Telephone: (81) (03) 5352-0971 • Fax: (81) (03) 5352-0972
Financial History ($M), Fiscal Year Ends December 31
Sales
Net Income
R&D Expenditures
Employees
1992
7
(3)
5
1993
5
(8)
5
1994
8
(5)
4
1995
23
1
6
1996
44
2
9
1997
45
4.2
14
—
—
—
75
135
150
Company Overview and Strategy
Zoran Corporation (NASDAQ: ZRAN), first incorporated in 1981, and reincorporated in 1986, develops and
markets integrated circuits and software for digital video and audio compression and decompression applications.
The company’s ICs are used in a wide variety of products, such as professional and consumer video editing
systems, PC-based and stand-alone video CD systems, DVD players, digital audio systems, filmless digital
cameras, and printers/scanners.
Prior to 1991, Zoran derived the substantial majority of its revenues from digital filter processors (DFPs) and vector
signal processors (VSPs), which are DSP-based ICs used for image enhancement and processing, principally in
military, industrial, and medical applications. In 1989, the company repositioned its business to utilize its expertise
in DSP technology to develop and market video and audio compression circuits. In mid-1994, Zoran discontinued
DFP and VSP product lines.
2-520
Zoran
North American Company Profiles
Zoran has a strong core expertise in DSP technology, including digital filtering and frequency domain processing.
Its strategy centers on building partnerships with innovative marketing and manufacturing companies and
targeting high-volume, high-performance applications, such as multimedia computing and consumer video and
audio systems.
In October 1996, Zoran entered the software compression market through its acquisition of CompCore
Multimedia, Inc., a leading provider of digital audio and video MPEG-1 and MPEG-2 decoding technologies and
products. The acquisition has broadened Zoran’s product offering to include MPEG cores and software
compression products particularly for the PC-based DVD market.
Management
Uzia Galill
Levy Gerzberg, Ph.D.
Paul Goldberg
Isaac Shenberg
Alexander Sinar
Aharon Aharon
Sorin Cismas
Chairman
President and Chief Executive Officer, and
acting Chief Financial Officer
Vice President, Business Solutions
Vice President, Sales and Marketing
Vice President, Operations
Vice President, Engineering
Chief Scientist
Products and Processes
Zoran’s IC products include JPEG codecs, MPEG video decoders, Dolby AC-3 and MPEG audio decoders, and
PCI multimedia controllers. The company is the leading supplier of JPEG ICs and support devices for the
consumer and PC markets.
Additionally, Zoran is the leading supplier of Dolby Digital (AC-3) devices. Its third-generation Dolby AC-3/MPEG-2
digital audio processor was introduced in late 1996. The ZR38600 processor uses only 75 percent of the
processor’s power for audio decoding, leaving the remaining 25 percent available for product differentiation. The
device is targeted at home theater, DVD, and consumer multimedia applications. In 1998, Zoran announced the
industry’s first virtual 3-D Audio Reference design using their ZR38600 digital audio processor.
Most of Zoran’s devices are fabricated using 0.6µm and 0.8µm CMOS technologies.
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Semiconductor Fabrication Facilities
For the fabrication of its wafers, Zoran has foundry agreements with Fujifilm Microdevices, Motorola, TSMC, and
Tower Semiconductor.
Key Agreements
• In February 1998, Zoran Corporation announced licensing agreements with ten industry-leading graphic
accelerator companies to deliver high-performance DVD software decoding for the multimedia PC. The ten
companies have licensed the motion compensation VLSI core from Zoran and are in the process of integrating
it into their future graphics accelerator products. In addition, Zoran is collaborating with several VGA chip
manufacturers to adapt SoftDVD to the VGA companies’ independently-developed motion compensation
designs. (Some participants of the agreement are: IX Micro, NVIDIA, Silicon Motion, ATI Technologies, Fujitsu,
Rendition, and S3).
• In February 1998, Zoran Corporation announced a new daughter card reference design. The new
Vaddis4VMI™ daughter card reference design adds Plug-in DVD capabilities to Intel’s new Intel740 graphics
chip.
• In January 1998, Zoran Corporation and Altec Lansing Technologies, Inc. announced a strategic alliance
combining their resources to develop audio products incorporating the Zoran ZR38600 Digital Audio Signal
Processor. Altec Lansing will apply this technology in the development of a new family of products featuring
affordable Dolby® Digital AC3 surround sound audio reproduction systems.
• In December 1997, Zoran announced that its Vaddis, DVD decoder IC was shipping to Sharp Corporation for its
new line of compact DVD players.
• In November 1997, Zoran announced an alliance with Iomega Corporation to deliver revolutionary, low-cost,
portable digital photography solutions.
• IBM Corporation chose Zoran’s Soft DVD Navigator to be included in their “Extreme Performance” ThinkPad
770 notebook computers.
• In late 1996, Zoran announced an agreement with Toshiba which stated that Toshiba would use Zoran’s Dolby
digital two-channel AC-3/MPEG audio processor in a DVD chipset.
• In 1995, Zoran signed a four-year agreement with Tower Semiconductor under which Tower will supply
specified quantities of wafers to Zoran.
• Siemens and Zoran announced in 1995 they would collaborate on the development and marketing of
multimedia ICs for PC and consumer electronics applications.
• Dolby Laboratories formed a long-term joint technology partnership with Zoran in August 1992. The
partnership involves the development of low-cost ICs for multi-channel digital audio for motion-picture
soundtracks and consumer media.
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• Zoran has the marketing rights to JPEG chips produced by the company’s Japanese partner, Fujifilm.
• Zoran and Intel Corporation announced, in October 1997, a licensing agreement which includes software
which Intel has optimized for MMX technology.
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