MSP430 Hardware Tools
User's Guide
Literature Number: SLAU278X
May 2009 – Revised February 2016
Contents
Preface ........................................................................................................................................ 9
1
Get Started Now! ................................................................................................................ 12
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
2
Hardware FAQs ............................................................................................................ 27
Known Issues ............................................................................................................... 29
Hardware ........................................................................................................................... 30
B.1
B.2
B.3
B.4
B.5
B.6
B.7
B.8
B.9
B.10
B.11
B.12
B.13
B.14
B.15
2
Signal Connections for In-System Programming and Debugging ................................................... 21
External Power ............................................................................................................. 25
Bootloader (BSL) ........................................................................................................... 25
Frequently Asked Questions and Known Issues .................................................................... 26
A.1
A.2
B
13
15
15
15
15
15
15
16
16
16
16
17
17
18
18
19
19
19
19
Design Considerations for In-Circuit Programming ................................................................ 20
2.1
2.2
2.3
A
Kit Contents, MSP-TS430xx ..............................................................................................
Kit Contents, MSP-FET430xx ............................................................................................
Kit Contents, MSP-FET ....................................................................................................
Kit Contents, MSP-FET430UIF ...........................................................................................
Kit Contents, MSP-FET430PIF ...........................................................................................
Kit Contents, eZ430-F2013 ...............................................................................................
Kit Contents, eZ430-T2012 ...............................................................................................
Kit Contents, eZ430-RF2500 .............................................................................................
Kit Contents, eZ430-RF2500T ............................................................................................
Kit Contents, eZ430-RF2500-SEH .......................................................................................
Kit Contents, eZ430-Chronos-xxx ........................................................................................
Kit Contents, FET430F6137RF900 ......................................................................................
Kit Contents, EM430Fx1x7RF900 .......................................................................................
Hardware Installation, MSP-FET .........................................................................................
Hardware Installation, MSP-FET430UIF ................................................................................
Hardware Installation, MSP-FET430PIF ................................................................................
Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900, EM430Fx1x7RF900 .......
Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSPEXP430F5529...........
Important MSP430 Documents on the Web ............................................................................
MSP-TS430D8 ..............................................................................................................
MSP-TS430PW14 ..........................................................................................................
MSP-TS430L092 ...........................................................................................................
MSP-TS430L092 Active Cable ...........................................................................................
MSP-TS430PW20 ..........................................................................................................
MSP-TS430PW24 ..........................................................................................................
MSP-TS430RGE24A ......................................................................................................
MSP-TS430DW28..........................................................................................................
MSP-TS430PW28 ..........................................................................................................
MSP-TS430PW28A ........................................................................................................
MSP-TS430RHB32A.......................................................................................................
MSP-TS430DA38 ..........................................................................................................
MSP-TS430QFN23x0......................................................................................................
MSP-TS430RSB40.........................................................................................................
MSP-TS430RHA40A.......................................................................................................
Contents
32
35
38
41
44
48
51
54
57
60
63
66
69
72
75
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B.16
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
B.26
B.27
B.28
B.29
B.30
B.31
B.32
B.33
B.34
B.35
B.36
B.37
B.38
B.39
B.40
B.41
B.42
B.43
C
MSP-TS430DL48 ........................................................................................................... 78
MSP-TS430RGZ48B....................................................................................................... 81
MSP-TS430RGZ48C ...................................................................................................... 84
MSP-TS430PM64 .......................................................................................................... 87
MSP-TS430PM64A ........................................................................................................ 90
MSP-TS430PM64D ........................................................................................................ 93
MSP-TS430PM64F ........................................................................................................ 96
MSP-TS430RGC64B ...................................................................................................... 99
MSP-TS430RGC64C ..................................................................................................... 102
MSP-TS430RGC64USB ................................................................................................. 106
MSP-TS430PN80 ......................................................................................................... 110
MSP-TS430PN80A ....................................................................................................... 113
MSP-TS430PN80USB ................................................................................................... 116
MSP-TS430PZ100 ........................................................................................................ 120
MSP-TS430PZ100A ...................................................................................................... 123
MSP-TS430PZ100B ...................................................................................................... 126
MSP-TS430PZ100C ...................................................................................................... 129
MSP-TS430PZ100D ...................................................................................................... 132
MSP-TS430PZ5x100 ..................................................................................................... 135
MSP-TS430PZ100USB .................................................................................................. 138
MSP-TS430PZ100AUSB ................................................................................................ 142
MSP-TS430PEU128...................................................................................................... 146
EM430F5137RF900 ...................................................................................................... 149
EM430F6137RF900 ...................................................................................................... 153
EM430F6147RF900 ...................................................................................................... 157
MSP-FET .................................................................................................................. 161
B.41.1 Features ......................................................................................................... 161
B.41.2 Release Notes .................................................................................................. 161
B.41.3 Schematics ...................................................................................................... 164
B.41.4 Layout ............................................................................................................ 169
B.41.5 LED Signals ..................................................................................................... 169
B.41.6 JTAG Target Connector ....................................................................................... 170
B.41.7 Specifications ................................................................................................... 172
B.41.8 MSP-FET Revision History .................................................................................... 172
MSP-FET430UIF.......................................................................................................... 173
B.42.1 MSP-FET430UIF Revision History ........................................................................... 178
MSP-FET430PIF .......................................................................................................... 179
Hardware Installation Guide ............................................................................................... 181
C.1
Hardware Installation ..................................................................................................... 182
Revision History ........................................................................................................................ 187
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Contents
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List of Figures
2-1.
Signal Connections for 4-Wire JTAG Communication................................................................. 22
2-2.
Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices .............................................................................. 23
2-3.
Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBW-Capable
Devices That are Not Part of F2xx, G2xx, F4xx Families ............................................................. 24
B-1.
MSP-TS430D8 Target Socket Module, Schematic .................................................................... 32
B-2.
MSP-TS430D8 Target Socket Module, PCB ........................................................................... 33
B-3.
MSP-TS430PW14 Target Socket Module, Schematic ................................................................ 35
B-4.
MSP-TS430PW14 Target Socket Module, PCB ....................................................................... 36
B-5.
MSP-TS430L092 Target Socket Module, Schematic .................................................................. 38
B-6.
MSP-TS430L092 Target Socket Module, PCB ......................................................................... 39
B-7.
MSP-TS430L092 Active Cable Target Socket Module, Schematic.................................................. 41
B-8.
MSP-TS430L092 Active Cable Target Socket Module, PCB ......................................................... 42
B-9.
UART BSL Signal Select .................................................................................................. 44
B-10. MSP-TS430PW20 Target Socket Module, Schematic ................................................................ 45
B-11. MSP-TS430PW20 Target Socket Module, PCB ....................................................................... 46
B-12. MSP-TS430PW24 Target Socket Module, Schematic ................................................................ 48
B-13. MSP-TS430PW24 Target Socket Module, PCB ....................................................................... 49
B-14. MSP-TS430RGE24A Target Socket Module, Schematic ............................................................. 51
B-15. MSP-TS430RGE24A Target Socket Module, PCB .................................................................... 52
B-16. MSP-TS430DW28 Target Socket Module, Schematic ................................................................ 54
B-17. MSP-TS430DW28 Target Socket Module, PCB ....................................................................... 55
B-18. MSP-TS430PW28 Target Socket Module, Schematic ................................................................ 57
B-19. MSP-TS430PW28 Target Socket Module, PCB ....................................................................... 58
B-20. MSP-TS430PW28A Target Socket Module, Schematic
..............................................................
60
B-21. MSP-TS430PW28A Target Socket Module, PCB (Red) .............................................................. 61
B-22. MSP-TS430RHB32A Target Socket Module, Schematic ............................................................. 63
B-23. MSP-TS430RHB32A Target Socket Module, PCB .................................................................... 64
B-24. MSP-TS430DA38 Target Socket Module, Schematic ................................................................. 66
B-25. MSP-TS430DA38 Target Socket Module, PCB ........................................................................ 67
B-26. MSP-TS430QFN23x0 Target Socket Module, Schematic ............................................................ 69
B-27. MSP-TS430QFN23x0 Target Socket Module, PCB ................................................................... 70
B-28. MSP-TS430RSB40 Target Socket Module, Schematic ............................................................... 72
B-29. MSP-TS430RSB40 Target Socket Module, PCB ...................................................................... 73
B-30. MSP-TS430RHA40A Target Socket Module, Schematic ............................................................. 75
B-31. MSP-TS430RHA40A Target Socket Module, PCB .................................................................... 76
B-32. MSP-TS430DL48 Target Socket Module, Schematic ................................................................. 78
B-33. MSP-TS430DL48 Target Socket Module, PCB ........................................................................ 79
B-34. MSP-TS430RGZ48B Target Socket Module, Schematic ............................................................. 81
B-35. MSP-TS430RGZ48B Target Socket Module, PCB .................................................................... 82
B-36. MSP-TS430RGZ48C Target Socket Module, Schematic ............................................................. 84
B-37. MSP-TS430RGZ48C Target Socket Module, PCB .................................................................... 85
B-38. MSP-TS430PM64 Target Socket Module, Schematic................................................................. 87
B-39. MSP-TS430PM64 Target Socket Module, PCB ........................................................................ 88
B-40. MSP-TS430PM64A Target Socket Module, Schematic ............................................................... 90
B-41. MSP-TS430PM64A Target Socket Module, PCB ...................................................................... 91
B-42. MSP-TS430PM64D Target Socket Module, Schematic ............................................................... 93
B-43. MSP-TS430PM64D Target Socket Module, PCB ...................................................................... 94
4
List of Figures
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B-44. MSP-TS430PM64F Target Socket Module, Schematic ............................................................... 96
B-45. MSP-TS430PM64F Target Socket Module, PCB ...................................................................... 97
B-46. MSP-TS430RGC64B Target Socket Module, Schematic ............................................................. 99
..................................................................
MSP-TS430RGC64C Target Socket Module, Schematic ...........................................................
MSP-TS430RGC64C Target Socket Module, PCB ..................................................................
MSP-TS430RGC64USB Target Socket Module, Schematic........................................................
MSP-TS430RGC64USB Target Socket Module, PCB ...............................................................
MSP-TS430PN80 Target Socket Module, Schematic ...............................................................
MSP-TS430PN80 Target Socket Module, PCB ......................................................................
MSP-TS430PN80A Target Socket Module, Schematic..............................................................
MSP-TS430PN80A Target Socket Module, PCB .....................................................................
MSP-TS430PN80USB Target Socket Module, Schematic ..........................................................
MSP-TS430PN80USB Target Socket Module, PCB .................................................................
MSP-TS430PZ100 Target Socket Module, Schematic ..............................................................
MSP-TS430PZ100 Target Socket Module, PCB .....................................................................
MSP-TS430PZ100A Target Socket Module, Schematic ............................................................
MSP-TS430PZ100A Target Socket Module, PCB ...................................................................
MSP-TS430PZ100B Target Socket Module, Schematic ............................................................
MSP-TS430PZ100B Target Socket Module, PCB ...................................................................
MSP-TS430PZ100C Target Socket Module, Schematic ............................................................
MSP-TS430PZ100C Target Socket Module, PCB ...................................................................
MSP-TS430PZ100D Target Socket Module, Schematic ............................................................
MSP-TS430PZ100D Target Socket Module, PCB ...................................................................
MSP-TS430PZ5x100 Target Socket Module, Schematic ...........................................................
MSP-TS430PZ5x100 Target Socket Module, PCB ..................................................................
MSP-TS430PZ100USB Target Socket Module, Schematic .........................................................
MSP-TS430PZ100USB Target Socket Module, PCB ................................................................
MSP-TS430PZ100AUSB Target Socket Module, Schematic .......................................................
MSP-TS430PZ100AUSB Target Socket Module, PCB ..............................................................
MSP-TS430PEU128 Target Socket Module, Schematic ............................................................
MSP-TS430PEU128 Target Socket Module, PCB ...................................................................
EM430F5137RF900 Target Board, Schematic .......................................................................
EM430F5137RF900 Target board, PCB...............................................................................
EM430F6137RF900 Target Board, Schematic .......................................................................
EM430F6137RF900 Target Board, PCB ..............................................................................
EM430F6147RF900 Target Board, Schematic .......................................................................
EM430F6147RF900 Target Board, PCB ..............................................................................
MSP-FET Top View ......................................................................................................
MSP-FET Bottom View ..................................................................................................
MSP-FET USB Debugger, Schematic (1 of 5) ........................................................................
MSP-FET USB Debugger, Schematic (2 of 5) ........................................................................
MSP-FET USB Debugger, Schematic (3 of 5) ........................................................................
MSP-FET USB Debugger, Schematic (4 of 5) ........................................................................
MSP-FET USB Debugger, Schematic (5 of 5) ........................................................................
MSP-FET USB Debugger, PCB (Top) .................................................................................
MSP-FET USB Debugger, PCB (Bottom) .............................................................................
JTAG Connector Pinout ..................................................................................................
Pin States After Power-Up ...............................................................................................
B-47. MSP-TS430RGC64B Target Socket Module, PCB
100
B-48.
103
B-49.
B-50.
B-51.
B-52.
B-53.
B-54.
B-55.
B-56.
B-57.
B-58.
B-59.
B-60.
B-61.
B-62.
B-63.
B-64.
B-65.
B-66.
B-67.
B-68.
B-69.
B-70.
B-71.
B-72.
B-73.
B-74.
B-75.
B-76.
B-77.
B-78.
B-79.
B-80.
B-81.
B-82.
B-83.
B-84.
B-85.
B-86.
B-87.
B-88.
B-89.
B-90.
B-91.
B-92.
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List of Figures
104
106
107
110
111
113
114
116
117
120
121
123
124
126
127
129
130
132
133
135
136
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149
150
153
154
157
158
162
162
164
165
166
167
168
169
169
170
171
5
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B-93. MSP-FET430UIF USB Interface, Schematic (1 of 4) ................................................................ 173
B-94. MSP-FET430UIF USB Interface, Schematic (2 of 4) ................................................................ 174
B-95. MSP-FET430UIF USB Interface, Schematic (3 of 4) ................................................................ 175
B-96. MSP-FET430UIF USB Interface, Schematic (4 of 4) ................................................................ 176
B-97. MSP-FET430UIF USB Interface, PCB ................................................................................. 177
B-98. MSP-FET430PIF FET Interface Module, Schematic ................................................................. 179
B-99. MSP-FET430PIF FET Interface Module, PCB ........................................................................ 180
6
C-1.
Windows XP Hardware Wizard ......................................................................................... 182
C-2.
Windows XP Driver Location Selection Folder........................................................................ 183
C-3.
Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010
C-4.
Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430 ..................................... 185
C-5.
Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432 .................................... 186
List of Figures
...................................
184
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List of Tables
1-1.
Individual Kit Contents, MSP-TS430xx .................................................................................. 13
B-1.
MSP-TS430D8 Bill of Materials
B-2.
B-3.
B-4.
B-5.
B-6.
B-7.
B-8.
B-9.
B-10.
B-11.
B-12.
B-13.
B-14.
B-15.
B-16.
B-17.
B-18.
B-19.
B-20.
B-21.
B-22.
B-23.
B-24.
B-25.
B-26.
B-27.
B-28.
B-29.
B-30.
B-31.
B-32.
B-33.
B-34.
B-35.
B-36.
B-37.
B-38.
B-39.
B-40.
B-41.
B-42.
B-43.
B-44.
B-45.
B-46.
.......................................................................................... 34
MSP-TS430PW14 Bill of Materials....................................................................................... 37
MSP-TS430L092 Bill of Materials ........................................................................................ 40
MSP-TS430L092 JP1 Settings ........................................................................................... 42
MSP-TS430L092 Active Cable Bill of Materials ........................................................................ 43
MSP-TS430PW20 Bill of Materials....................................................................................... 47
MSP-TS430PW24 Bill of Materials....................................................................................... 50
MSP-TS430RGE24A Bill of Materials (BOM) .......................................................................... 53
MSP-TS430DW28 Bill of Materials ...................................................................................... 56
MSP-TS430PW28 Bill of Materials ...................................................................................... 59
MSP-TS430PW28A Bill of Materials ..................................................................................... 62
MSP-TS430RHB32A Bill of Materials ................................................................................... 65
MSP-TS430DA38 Bill of Materials ....................................................................................... 68
MSP-TS430QFN23x0 Bill of Materials .................................................................................. 71
MSP-TS430RSB40 Bill of Materials ..................................................................................... 74
MSP-TS430RHA40A Bill of Materials ................................................................................... 77
MSP-TS430DL48 Bill of Materials ....................................................................................... 80
MSP-TS430RGZ48B Bill of Materials ................................................................................... 83
MSP-TS430RGZ48C Bill of Materials ................................................................................... 86
MSP-TS430PM64 Bill of Materials ....................................................................................... 89
MSP-TS430PM64A Bill of Materials ..................................................................................... 92
MSP-TS430PM64D Bill of Materials ..................................................................................... 95
MSP-TS430PM64F Bill of Materials (BOM) ............................................................................ 98
MSP-TS430RGC64B Bill of Materials.................................................................................. 101
MSP-TS430RGC64C Bill of Materials ................................................................................. 105
MSP-TS430RGC64USB Bill of Materials .............................................................................. 108
MSP-TS430PN80 Bill of Materials ...................................................................................... 112
MSP-TS430PN80A Bill of Materials .................................................................................... 115
MSP-TS430PN80USB Bill of Materials ................................................................................ 118
MSP-TS430PZ100 Bill of Materials .................................................................................... 122
MSP-TS430PZ100A Bill of Materials ................................................................................... 125
MSP-TS430PZ100B Bill of Materials ................................................................................... 128
MSP-TS430PZ100C Bill of Materials .................................................................................. 131
MSP-TS430PZ100D Bill of Materials .................................................................................. 134
MSP-TS430PZ5x100 Bill of Materials.................................................................................. 137
MSP-TS430PZ100USB Bill of Materials ............................................................................... 140
MSP-TS430PZ100AUSB Bill of Materials ............................................................................. 144
MSP-TS430PEU128 Bill of Materials .................................................................................. 148
EM430F5137RF900 Bill of Materials ................................................................................... 151
EM430F6137RF900 Bill of Materials ................................................................................... 155
EM430F6147RF900 Bill of Materials ................................................................................... 159
UART Backchannel Implementation ................................................................................... 161
UART Backchannel Activation Commands............................................................................ 162
MSP Target BSL Activation Commands ............................................................................... 163
MSP-FET LED Signals ................................................................................................... 169
JTAG Connector Pin State by Operating Mode ...................................................................... 170
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List of Tables
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B-47. Specifications .............................................................................................................. 172
B-48. MSP-FET Revision History .............................................................................................. 172
C-1.
8
USB VIDs and PIDs Used in MSP430 Tools.......................................................................... 182
List of Tables
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Preface
SLAU278X – May 2009 – Revised February 2016
Read This First
About This Manual
This manual describes the hardware of the TI MSP-FET430 Flash Emulation Tool (FET). The FET is the
program development tool for the MSP430™ ultra-low-power microcontroller. Both available interface
types, the parallel port interface and the USB interface, are described.
How to Use This Manual
Read and follow the instructions in Chapter 1. This section lists the contents of the FET, provides
instructions on installing the hardware and according software drivers. After you see how quick and easy it
is to use the development tools, TI recommends that you read all of this manual.
This manual describes the setup and operation of the FET but does not fully describe the MSP430™
microcontrollers or the development software systems. For details of these items, see the appropriate TI
documents listed in Section 1.19.
This manual applies to the following tools (and devices):
• MSP-FET430PIF (debug interface with parallel port connection, for all MSP430 flash-based devices)
• MSP-FET430UIF (debug interface with USB connection, for all MSP430 flash-based devices)
• MSP-FET (successor to MSP-FET430UIF, debug interface with USB connection, for all MSP430
devices)
• eZ430-F2013 (USB stick form factor interface with attached MSP430F2013 target, for all
MSP430F20xx, MSP430G2x01, MSP430G2x11, MSP430G2x21, and MSP430G2x31 devices)
• eZ430-T2012 (three MSP430F2012 based target boards)
• eZ430-RF2500 (USB stick form factor interface with attached MSP430F2274 and CC2500 target, for
all MSP430F20xx, MSP430F21x2, MSP430F22xx, MSP430G2x01, MSP430G2x11, MSP430G2x21,
and MSP430G2x31 devices)
• eZ430-RF2500T (one MSP430F2274 and CC2500 target board including battery pack)
• eZ430-RF2500-SEH (USB stick form factor interface with attached MSP430F2274 and CC2500 target
and solar energy harvesting module)
• eZ430-Chronos-xxx (USB stick form factor interface with CC430F6137 based development system
contained in a watch. Includes <1 GHz RF USB access point)
Stand-alone target-socket modules (without debug interface) named as MSP-TS430TSxx.
Tools named as MSP-FET430Uxx contain the USB debug interface (MSP-FET430UIF) and the respective
target socket module MSP-TS430TSxx, where 'xx' is the same for both names. The following tools contain
also the USB debug interface (MSP-FET430UIF):
•
•
FET430F5137RF900 (for CC430F513x devices in 48-pin RGZ packages) (green PCB)
FET430F6137RF900 (for CC430F612x and CC430F613x devices in 64-pin RGC packages) (green
PCB)
These tools contain the most up-to-date materials available at the time of packaging. For the latest
materials (data sheets, user's guides, software, application information, and so on), visit the TI MSP430
website at www.ti.com/msp430 or contact your local TI sales office.
SLAU278X – May 2009 – Revised February 2016
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Read This First
9
Information About Cautions and Warnings
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Information About Cautions and Warnings
This document may contain cautions and warnings.
CAUTION
This is an example of a caution statement.
A caution statement describes a situation that could potentially damage your
software or equipment.
WARNING
This is an example of a warning statement.
A warning statement describes a situation that could potentially
cause harm to you.
The information in a caution or a warning is provided for your protection. Read each caution and warning
carefully.
Related Documentation From Texas Instruments
MSP430 development tools documentation:
MSP Debuggers User's Guide (SLAU647)
Code Composer Studio for MSP430 User's Guide (SLAU157)
Code Composer Studio v5.x Core Edition (CCS Mediawiki)
IAR Embedded Workbench for MSP430(tm) User's Guide (SLAU138)
IAR Embedded Workbench KickStart installer (SLAC050)
eZ430-F2013 Development Tool User's Guide (SLAU176)
eZ430-RF2480 Demonstration Kit User's Guide (SWRU151)
eZ430-RF2500 Development Tool User's Guide (SLAU227)
eZ430-RF2500-SEH Development Tool User's Guide (SLAU273)
eZ430-Chronos Development Tool User's Guide (SLAU292)
Spectrum Analyzer (MSP-SA430-SUB1GHZ) User's Guide (SLAU371)
MSP-EXP430F5529 Experimenter Board User's Guide (SLAU330)
MSP-EXP430F5438 Experimenter Board User's Guide (SLAU263)
MSP-EXP430G2 LaunchPad Experimenter Board User's Guide (SLAU318)
MSP Gang Programmer (MSP-GANG) User's Guide (SLAU358)
MSP430 Gang Programmer (MSP-GANG430) User's Guide (SLAU101)
MSP430 device user's guides:
MSP430x1xx Family User's Guide (SLAU049)
MSP430x2xx Family User's Guide (SLAU144)
MSP430x3xx Family User's Guide (SLAU012)
MSP430x4xx Family User's Guide (SLAU056)
MSP430x5xx and MSP430x6xx Family User's Guide (SLAU208)
10
Read This First
SLAU278X – May 2009 – Revised February 2016
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If You Need Assistance
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CC430 Family User's Guide (SLAU259)
MSP430FR57xx Family User's Guide (SLAU272)
MSP430FR58xx and MSP430FR59xx Family User's Guide (SLAU367)
If You Need Assistance
Support for the MSP430 devices and the FET development tools is provided by the Texas Instruments
Product Information Center (PIC). Contact information for the PIC can be found on the TI website at
www.ti.com/support. The Texas Instruments E2E™ Community support forums for the MSP430 provide
open interaction with peer engineers, TI engineers, and other experts. Additional device-specific
information can be found on the MSP430 website.
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Read This First
11
Chapter 1
SLAU278X – May 2009 – Revised February 2016
Get Started Now!
This chapter lists the contents of the FET and provides instruction on installing the hardware.
Topic
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
12
...........................................................................................................................
Kit Contents, MSP-TS430xx .................................................................................
Kit Contents, MSP-FET430xx ..............................................................................
Kit Contents, MSP-FET .......................................................................................
Kit Contents, MSP-FET430UIF ..............................................................................
Kit Contents, MSP-FET430PIF ..............................................................................
Kit Contents, eZ430-F2013 ...................................................................................
Kit Contents, eZ430-T2012 ...................................................................................
Kit Contents, eZ430-RF2500 ................................................................................
Kit Contents, eZ430-RF2500T ...............................................................................
Kit Contents, eZ430-RF2500-SEH .........................................................................
Kit Contents, eZ430-Chronos-xxx .........................................................................
Kit Contents, FET430F6137RF900 ........................................................................
Kit Contents, EM430Fx1x7RF900 ..........................................................................
Hardware Installation, MSP-FET ...........................................................................
Hardware Installation, MSP-FET430UIF .................................................................
Hardware Installation, MSP-FET430PIF .................................................................
Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,
EM430Fx1x7RF900 .............................................................................................
Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,
MSPEXP430F5529 ..............................................................................................
Important MSP430 Documents on the Web............................................................
Get Started Now!
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15
15
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16
16
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16
17
17
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18
19
19
19
19
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Kit Contents, MSP-TS430xx
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1.1
Kit Contents, MSP-TS430xx
•
•
•
•
•
One READ ME FIRST document
One 32.768-kHz crystal from Micro Crystal (except MSP-TS430PW24)
One target socket module
A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
MSP430 device samples (see Table 1-1 for sample type)
Table 1-1. Individual Kit Contents, MSP-TS430xx
Part Number
Socket Type
Supported Devices
Included Devices
MSP-TS430D8
(green PCB)
8-pin D
(TSSOP ZIF)
MSP430G2210, MSP430G2230
1 x MSP430G2210ID and
1 x MSP430G2230ID
Two PCB 1×4-pin headers (two
male and two female)
Headers and Comment
MSP-TS430PW14
(green PCB)
14-pin PW
(TSSOP ZIF)
MSP430F20xx, MSP430G2x01,
MSP430G2x11, MSP430G2x21,
MSP430G2x31
2 x MSP430F2013IPW
Four PCB 1×7-pin headers (two
male and two female)
2 x MSP430L092IPW
Four PCB 1×7-pin headers (two
male and two female). A "MicroMaTch" 10-pin female connector is
also present on the PCB which
connects the kit with an 'Active
Cable' PCB; this 'Active Cable'
PCB is connected by 14-pin JTAG
cable with the FET430UIF
MSP-TS430L092
(green PCB)
14-pin PW
(TSSOP ZIF)
MSP-TS430L092
MSP-TS430PW20
(green PCB)
20-pin PW
(TSSOP ZIF)
MSP430FR2311IPW20,
MSP430FR2311IPW16
MSP-TS430PW24
(green PCB)
24-pin PW
(TSSOP ZIF)
MSP430AFE2xx
MSP-TS430RGE24A
(red PCB)
24-pin RGE
(QFN ZIF)
MSP430FR2433IRGE
MSP-TS430DW28
(green PCB)
28-pin DW
(SSOP ZIF)
MSP430F11x1, MSP430F11x2,
MSP430F12x, MSP430F12x2,
MSP430F21xx
Supports devices in 20- and 28-pin
DA packages
2 x MSP430F123IDW
Four PCB 1×12-pin headers (two
male and two female)
MSP-TS430PW28
(green PCB)
28-pin PW
(TSSOP ZIF)
MSP430F11x1, MSP430F11x2,
MSP430F12x, MSP430F12x2,
MSP430F21xx
2 x MSP430F2132IPW
Four PCB 1×12-pin headers (two
male and two female)
MSP-TS430PW28A
(red PCB)
28-pin PW
(TSSOP ZIF)
MSP430F20xx, MSP430G2xxx in
14-, 20-, and 28-pin PW packages,
MSP430TCH5E in PW package
2 x MSP430G2452IPW20
Four PCB 1×12-pin headers (two
male and two female)
MSP-TS430RHB32A
(red PCB)
32-pin RHB
(QFN ZIF)
MSP430i204x
2 x MSP430i2041TRHB
Eight PCB 1×8-pin headers (four
male and four female)
MSP-TS430DA38
(green PCB)
38-pin DA
(TSSOP ZIF)
MSP430F22xx, MSP430G2x44,
MSP430G2x55
2 x MSP430F2274IDA
2 x MSP430G2744IDA
2 x MSP430G2955IDA
Four PCB 1×19-pin headers (two
male and two female)
MSP-TS430QFN23x0
(green PCB)
40-pin RHA
(QFN ZIF)
MSP430F23x0
2 x MSP430F2370IRHA
Eight PCB 1×10-pin headers (four
male and four female)
MSP-TS430RSB40
(green PCB)
40-pin RSB
(QFN ZIF)
MSP430F51x1, MSP430F51x2
2 x MSP430F5172IRSB
Eight PCB 1×10-pin headers (four
male and four female)
MSP-TS430RHA40A
(red PCB)
40-pin RHA
(QFN ZIF)
MSP430FR572x, MSP430FR573x
2 x MSP430FR5739IRHA
Eight PCB 1×10-pin headers (four
male and four female)
MSP-TS430DL48
(green PCB)
48-pin DL
(TSSOP ZIF)
MSP430F42x0
2 x MSP430F4270IDL
Four PCB 2×12-pin headers (two
male and two female)
MSP-TS430RGZ48B
(blue PCB)
48-pin RGZ
(QFN ZIF)
MSP430F534x
2 x MSP430F5342IRGZ
Eight PCB 1×12-pin headers (four
male and four female)
MSP-TS430RGZ48C
(black PCB)
48-pin RGZ
(QFN ZIF)
MSP430FR58xx and
MSP430FR59xx
2 x MSP430FR5969IRGZ
Eight PCB 1×12-pin headers (four
male and four female)
64-pin PM
(QFP ZIF)
MSP430F13x, MSP430F14x,
MSP430F14x1, MSP430F15x,
MSP430F16x, MSP430F16x1,
MSP430F23x, MSP430F24x,
MSP430F24xx, MSP430F261x,
MSP430F41x, MSP430F42x,
MSP430F42xA, MSP430FE42x,
MSP430FE42xA, MSP430FE42x2,
MSP430FW42x
TS Kit:
2 x MSP430F2618IPM;
FET Kit:
2 x MSP430F417IPM and
2 x MSP430F169IPM
Eight PCB 1×16-pin headers (four
male and four female)
MSP-TS430PM64
(green PCB)
None. Free samples can
Four PCB 1×12-pin headers (two
be ordered in the TI Store. male and two female)
2 x MSP430AFE253IPW
Four PCB 1×12-pin headers (two
male and two female)
None. Free samples can
Four PCB 1×6-pin headers (two
be ordered in the TI Store. male and two female)
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Kit Contents, MSP-TS430xx
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Table 1-1. Individual Kit Contents, MSP-TS430xx (continued)
Part Number
Socket Type
MSP-TS430PM64A
(red PCB)
64-pin PM
(QFP ZIF)
Supported Devices
Included Devices
Headers and Comment
MSP430F41x2
MSP-TS430PM64D
(white PCB)
64-pin PM
(QFP ZIF)
MSP430FR413x, MSP430FR203x
MSP-TS430PM64F
(purple PCB)
64-pin PM
(QFP ZIF)
MSP430FR6972
MSP-TS430RGC64B
(blue PCB)
64-pin RGC
(QFN ZIF)
MSP430F530x
2 x MSP430F5310IRGC
Eight PCB 1×16-pin headers (four
male and four female)
MSP-TS430RGC64C
(black PCB)
64-pin RGC
(QFN ZIF)
MSP430F522x, MSP430F521x,
MSP430F523x, MSP430F524x,
MSP430F525x
2 x MSP430F5229IRGC
Eight PCB 1×16-pin headers (four
male and four female)
MSP-TS430RGC64USB
(green PCB)
64-pin RGC
(QFN ZIF)
MSP430F550x, MSP430F551x,
MSP430F552x
2 x MSP430F5510IRGC
or
2 x MSP430F5528IRGC
Eight PCB 1×16-pin headers (four
male and four female)
MSP-TS430PN80
(green PCB)
80-pin PN
(QFP ZIF)
MSP430F241x, MSP430F261x,
MSP430F43x, MSP430F43x1,
MSP430FG43x, MSP430F47x,
MSP430FG47x
2 x MSP430FG439IPN
Eight PCB 1×20-pin headers (four
male and four female)
MSP-TS430PN80A
(red PCB)
80-pin PN
(QFP ZIF)
MSP430F532x
2 x MSP430F5329IPN
Eight PCB 1×20-pin headers (four
male and four female)
MSP-TS430PN80USB
(green PCB)
80-pin PN
(QFP ZIF)
MSP430F552x, MSP430F551x
2 x MSP430F5529IPN
Eight PCB 1×20-pin headers (four
male and four female)
MSP-TS430PZ100
(green PCB)
100-pin PZ
(QFP ZIF)
MSP430F43x, MSP430F43x1,
MSP430F44x, MSP430FG461x,
MSP430F47xx
2 x MSP430FG4619IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100A
(red PCB)
100-pin PZ
(QFP ZIF)
MSP430F471xx
2 x MSP430F47197IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100B
(blue PCB)
100-pin PZ
(QFP ZIF)
MSP430F67xx
2 x MSP430F6733IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100C
(black PCB)
100-pin PZ
(QFP ZIF)
MSP430F645x, MSP430F643x,
MSP430F535x, MSP430F533x
2 x MSP430F6438IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100D
(white PCB)
100-pin PZ
(QFP ZIF)
MSP430FR698x(1),
MSP430FR688x(1)
2 x MSP430FR6989IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ5x100
(green PCB)
100-pin PZ
(QFP ZIF)
MSP430F543x, MSP430BT5190,
MSP430SL5438A
2 x MSP430F5438IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100USB
(green PCB)
100-pin PZ
(QFP ZIF)
MSP430F665x, MSP430F663x,
MSP430F563x
2 x MSP430F6638IPZ
Eight PCB 1×25-pin headers (four
male and four female)
MSP-TS430PZ100AUSB
(blue PCB)
100-pin PZ
(QFP ZIF)
MSP430FG662x, MSP430FG642x
None. Free samples can
Eight PCB 1×25-pin headers (four
be ordered in the TI Store. male and four female)
MSP-TS430PEU128
(green PCB)
128-pin PEU
(QFP ZIF)
MSP430F677x, MSP430F676x,
MSP430F674x, MSP430F677x1,
MSP430F676x1, MSP430F674x1
2 x MSP430F67791IPEU
2 x MSP430F4152IPM
Eight PCB 1×16-pin headers (four
male and four female)
2 x MSP430FR4133IPM
Eight PCB 1×16-pin headers (four
male and four female)
None. Free samples can
Eight PCB 1×16-pin headers (four
be ordered in the TI Store. male and four female)
Four PCB 1x26-pin headers (two
male and two female) and four
PCB 1x38-pin headers (two male
and two female)
See the device data sheets for device specifications. Device errata can be found in the respective device
product folder on the web provided as a PDF document. Depending on the device, errata may also be
found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
14
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Kit Contents, MSP-FET430xx
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1.2
Kit Contents, MSP-FET430xx
•
•
•
•
•
•
•
•
One READ ME FIRST document
One MSP-FET430UIF USB interface module. This is the unit that has a USB B-connector on one end
of the case, and a 2×7-pin male connector on the other end of the case.
One USB cable
One 32.768-kHz crystal from Micro Crystal, if the board has an option to use the quartz.
A 2×7-pin male JTAG connector is also present on the PCB (see different setup for L092)
One 14-Pin JTAG conductor cable
One small box containing two MSP430 device samples (See table for Sample Type)
One target socket module. To determine the devices used for each board and a summary of the board,
see Table 1-1. The name of MSP-TS430xx board can be derived from the name of the MSP-FET430xx
kit; for example, the MSP-FET430U28A kit contains the MSP-TS430PW28A board.
Refer to the device data sheets for device specifications. Device errata can be found in the respective
device product folder on the web provided as a PDF document. Depending on the device, errata may also
be found in the device bug database at www.ti.com/sc/cgi-bin/buglist.cgi.
1.3
Kit Contents, MSP-FET
•
•
•
•
1.4
READ ME FIRST document
MSP-FET interface module
USB cable
14-conductor cable
Kit Contents, MSP-FET430UIF
•
•
•
•
1.5
One
One
One
One
One
One
One
One
READ ME FIRST document
MSP-FET430UIF interface module
USB cable
14-conductor cable
Kit Contents, MSP-FET430PIF
•
•
•
•
One
One
One
One
READ ME FIRST document
MSP-FET430PIF interface module
25-conductor cable
14-conductor cable
NOTE: This part is obsolete and is not recommended to use in new design.
1.6
Kit Contents, eZ430-F2013
•
•
1.7
One QUICK START GUIDE document
One eZ430-F2013 development tool including one MSP430F2013 target board
Kit Contents, eZ430-T2012
•
Three MSP430F2012-based target boards
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Kit Contents, eZ430-RF2500
1.8
Kit Contents, eZ430-RF2500
•
•
•
•
•
1.9
www.ti.com
One
One
One
One
One
QUICK START GUIDE document
eZ430-RF2500 CD-ROM
eZ430-RF2500 development tool including one MSP430F2274 and CC2500 target board
eZ430-RF2500T target board
AAA battery pack with expansion board (batteries included)
Kit Contents, eZ430-RF2500T
•
•
One eZ430-RF2500T target board
One AAA battery pack with expansion board (batteries included)
1.10 Kit Contents, eZ430-RF2500-SEH
•
•
•
•
•
One MSP430 development tool CD containing documentation and development software
One eZ430-RF USB debugging interface
Two eZ430-RF2500T wireless target boards
One SEH-01 solar energy harvester board
One AAA battery pack with expansion board (batteries included)
1.11 Kit Contents, eZ430-Chronos-xxx
'433, '868, '915
• One QUICK START GUIDE document
• One ez430-Chronos emulator
• One screwdriver
• Two spare screws
eZ430-Chronos-433:
– One 433-MHz eZ430-Chronos watch (battery included)
– One 433-MHz eZ430-Chronos access point
eZ430-Chronos-868:
– One 868-MHz eZ430-Chronos watch (battery included)
– One 868-MHz eZ430-Chronos access point
eZ430-Chronos-915:
– One 915-MHz eZ430-Chronos watch (battery included)
– One 915-MHz eZ430-Chronos access point
16
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Kit Contents, FET430F6137RF900
www.ti.com
1.12 Kit Contents, FET430F6137RF900
•
•
•
•
•
•
•
•
•
•
•
One READ ME FIRST document
One legal notice
One MSP-FET430UIF interface module
Two EM430F6137RF900 target socket modules. This is the PCB on which is soldered a CC430F6137
device in a 64-pin RGC package. A 2×7-pin male connector is also present on the PCB.
Two CC430EM battery packs
Four AAA batteries
Two 868-MHz or 915-MHz antennas
Two 32.768-kHz crystals
18 PCB 2x4-pin headers
One USB cable
One 14-pin JTAG conductor cable
1.13 Kit Contents, EM430Fx1x7RF900
•
•
•
•
•
•
•
•
One READ ME FIRST document
One legal notice
Two target socket module
MSP-EM430F5137RF900: Two EM430F5137RF900 target socket modules. This is the PCB on which
is soldered a CC430F5137 device in a 48-pin RGZ package. A 2×7-pin male connector is also present
on the PCB
MSP-EM430F6137RF900: Two EM430F6137RF900 target socket modules. This is the PCB on which
is soldered a CC430F6137 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
MSP-EM430F6147RF900: Two EM430F6147RF900 target socket modules. This is the PCB on which
is soldered a CC430F6147 device in a 64-pin RGC package. A 2×7-pin male connector is also present
on the PCB
Two CC430EM battery packs
Four AAA batteries
Two 868- or 915-MHz antennas
Two 32.768-kHz crystals
18 PCB 2×4-pin headers
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Hardware Installation, MSP-FET
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1.14 Hardware Installation, MSP-FET
Follow these steps to install the hardware for the MSP-FET tool:
1. Install the IDE (CCS or IAR) that you plan to use before connecting MSP-FET to PC. During IDE
installation, USB drivers are installed automatically. Make sure to use the latest IDE version, otherwise
the USB drivers might not be able to recognize the MSP-FET.
2. Connect the MSP-FET to a USB port on the PC with the provided USB cable.
3. The following procedure applies to operation under Windows:
(a) After connecting to the PC, the MSP-FET should be recognized automatically, as the USB device
driver has been already installed together with the IDE.
(b) If the driver has not been installed yet, the Found New Hardware wizard starts. Follow the
instructions and point the wizard to the driver files.
(c) The default location for CCS is c:\ti\ccsv6\ccs_base\emulation\drivers\msp430\USB_CDC.
(d) The default location for IAR Embedded Workbench is <Installation Root>\Embedded Workbench
x.x\430\drivers\<Win_OS>.
4. After connecting to a PC, the MSP-FET performs a self-test. If the self-test passes successfully, the
green LED stays on. For a complete list of LED signals, please refer to the MSP-FET chapter in this
document.
5. Connect the MSP-FET to a target board, such as an MSP-TS430xxx target socket module, with the
14-conductor cable.
6. Make sure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
1.15 Hardware Installation, MSP-FET430UIF
Follow these steps to install the hardware for the MSP-FET430UIF tool:
1. Install the IDE (CCS or IAR) you plan to use before connecting USB-FET interface to PC. The IDE
installation installs drivers automatically.
2. Use the USB cable to connect the USB-FET interface module to a USB port on the PC. The USB FET
should be recognized, as the USB device driver is installed automatically. If the driver has not been
installed yet, the install wizard starts. Follow the prompts and point the wizard to the driver files.
The default location for CCS is c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, depending of firmware version of
the tool.
The default location for IAR Embedded Workbench is <Installation
Root>\Embedded Workbench x.x\430\drivers\TIUSBFET\eZ430-UART or <Installation
Root>\Embedded Workbench x.x\430\drivers\<Win_OS>, depending of firmware version of the tool.
The USB driver is installed automatically. Detailed driver installation instructions can be found in
Appendix C.
3. After connecting to a PC, the USB FET performs a self-test during which the red LED may flash for
approximately two seconds. If the self-test passes successfully, the green LED stays on.
4. Use the 14-conductor cable to connect the USB-FET interface module to a target board, such as an
MSP-TS430xxx target socket module.
5. Ensure that the MSP430 device is securely seated in the socket, and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
6. Compared to the parallel-port debug interface, the USB FET has additional features including JTAG
security fuse blow and adjustable target VCC (1.8 V to 3.6 V). Supply the module with up to 60 mA.
18
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1.16 Hardware Installation, MSP-FET430PIF
Follow these steps to install the hardware for the MSP-FET430PIF tools:
1. Use the 25-conductor cable to connect the FET interface module to the parallel port of the PC. The
necessary driver for accessing the PC parallel port is installed automatically during CCS or IAR
Embedded Workbench installation. Note that a restart is required after the CCS or IAR Embedded
Workbench installation for the driver to become active.
2. Use the 14-conductor cable to connect the parallel-port debug interface module to a target board, such
as an MSP-TS430xxx target socket module. Module schematics and PCBs are shown in Appendix B.
1.17 Hardware Installation, MSP-TS430xxx, MSP-FET430Uxx, FET430F6137RF900,
EM430Fx1x7RF900
Follow these steps to install the hardware for the MSP-FET430Uxx and MSP-TS430xxx tools:
1. Follow steps 1 and 2 of Section 1.15
2. Connect the MSP-FET430PIF or MSP-FET430UIF debug interface to the appropriate port of the PC.
Use the 14-conductor cable to connect the FET interface module to the supplied target socket module.
3. Ensure that the MSP430 device is securely seated in the socket and that its pin 1 (indicated with a
circular indentation on the top surface) aligns with the "1" mark on the PCB.
4. Ensure that the two jumpers (LED and VCC) near the 2×7-pin male connector are in place. Illustrations
of the target socket modules and their parts are found in Appendix B.
1.18 Hardware Installation, eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739,
MSPEXP430F5529
To install the eZ430-XXXX, MSP-EXP430G2, MSP-EXP430FR5739, MSP-EXP430F5529 tools, follow
steps 1 and 2 of Section 1.15
1.19 Important MSP430 Documents on the Web
The primary sources of MSP430 information are the device-specific data sheet and user's guide. The
MSP430 website (www.ti.com/msp430) contains the most recent version of these documents.
PDF documents describing the CCS tools (CCS IDE, the assembler, the C compiler, the linker, and the
librarian) are in the msp430\documentation folder. A Code Composer Studio specific Wiki page (FAQ) is
available, and the Texas Instruments E2E Community support forums for the MSP430 and Code
Composer Studio v5 provide additional help besides the product help and Welcome page.
PDF documents describing the IAR tools (Workbench C-SPY, the assembler, the C compiler, the linker,
and the librarian) are in the common\doc and 430\doc folders. Supplements to the documents (that is, the
latest information) are available in HTML format in the same directories. A IAR specific Wiki Page is also
available.
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Chapter 2
SLAU278X – May 2009 – Revised February 2016
Design Considerations for In-Circuit Programming
This chapter presents signal requirements for in-circuit programming of the MSP430.
Topic
2.1
2.2
2.3
20
...........................................................................................................................
Page
Signal Connections for In-System Programming and Debugging ............................. 21
External Power................................................................................................... 25
Bootloader (BSL)................................................................................................ 25
Design Considerations for In-Circuit Programming
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Signal Connections for In-System Programming and Debugging
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2.1
Signal Connections for In-System Programming and Debugging
MSP-FET430PIF, MSP-FET430UIF, MSP-GANG, MSP-GANG430, MSP-PRGS430
With the proper connections, the debugger and an FET hardware JTAG interface (such as the MSPFET430PIF and MSP-FET430UIF) can be used to program and debug code on the target board. In
addition, the connections also support the MSP-GANG430 or MSP-PRGS430 production programmers,
thus providing an easy way to program prototype boards, if desired.
Figure 2-1 shows the connections between the 14-pin FET interface module connector and the target
device required to support in-system programming and debugging for 4-wire JTAG communication.
Figure 2-2 shows the connections for 2-wire JTAG mode (Spy-Bi-Wire). The 4-wire JTAG mode is
supported on most MSP430 devices, except devices with low pin counts (for example, MSP430G2230).
The 2-wire JTAG mode is available on selected devices only. See the Code Composer Studio for MSP430
User's Guide (SLAU157) or IAR Embedded Workbench Version 3+ for MSP430 User's Guide (SLAU138)
for information on which interface method can be used on which device.
The connections for the FET interface module and the MSP-GANG, MSP-GANG430, or MSP-PRGS430
are identical. Both the FET interface module and MSP-GANG430 can supply VCC to the target board
(through pin 2). In addition, the FET interface module, MSP-GANG, and MSP-GANG430 have a VCCsense feature that, if used, requires an alternate connection (pin 4 instead of pin 2). The VCC-sense feature
senses the local VCC present on the target board (that is, a battery or other local power supply) and
adjusts the output signals accordingly. If the target board is to be powered by a local VCC, then the
connection to pin 4 on the JTAG should be made, and not the connection to pin 2. This uses the VCCsense feature and prevents any contention that might occur if the local on-board VCC were connected to
the VCC supplied from the FET interface module, MSP-GANG or the MSP-GANG430. If the VCC-sense
feature is not necessary (that is, if the target board is to be powered from the FET interface module, MSPGANG, or MSP-GANG430), the VCC connection is made to pin 2 on the JTAG header, and no connection
is made to pin 4. Figure 2-1 and Figure 2-2 show a jumper block that supports both scenarios of supplying
VCC to the target board. If this flexibility is not required, the desired VCC connections may be hard-wired to
eliminate the jumper block. Pins 2 and 4 must not be connected at the same time.
The connection to the JTAG connector RST pin of Figure 2-1 is required when programming or debugging
a device that supports 2-wire JTAG communication, even when using 4-wire JTAG communication mode
on these devices. However, this connection is optional on devices that do not support 2-wire JTAG
communication. The MSP430 development tools and device programmers perform a target reset by
issuing a JTAG command to gain control over the device. However, if this is unsuccessful, the RST signal
of the JTAG connector may be used by the development tool or device programmer as an additional way
to assert a device reset.
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Signal Connections for In-System Programming and Debugging
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VCC
Important to connect
MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
R1
47 kW
(see Note B)
C2
10 µF
C3
0.1 µF
JTAG
VCC TOOL
VCC TARGET
TEST/VPP
RST/NMI
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
TDO/TDI
TDI/VPP
TDI/VPP
TMS
TMS
TCK
TCK
GND
RST (see Note D)
TEST/VPP (see Note C)
C1
10 nF/2.2 nF
(see Notes B and E)
VSS/AVSS/DVSS
A
If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B
The configuration of R1 and C1 for the RST/NMI pin depends on the device family. See the respective MSP430 family
user's guide for the recommended configuration.
C
The TEST pin is available only on MSP430 family members with multiplexed JTAG pins. See the device-specific data
sheet to determine if this pin is available.
D
The connection to the JTAG connector RST pin is required when programming or debugging a device that supports
2-wire JTAG communication, even when using 4-wire JTAG communication mode on these devices. However, this
connection is optional on devices that do not support 2-wire JTAG communication.
E
When using a device that supports 2-wire JTAG communication in 4-wire JTAG mode, the upper limit for C1 should
not exceed 2.2 nF. This applies to both TI FET interface modules (LPT and USB FET).
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-1. Signal Connections for 4-Wire JTAG Communication
22
Design Considerations for In-Circuit Programming
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Signal Connections for In-System Programming and Debugging
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VCC
Important to connect
MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
R1
47 kΩ
C2
10 µF
C3
0.1 µF
JTAG
VCC TOOL
VCC TARGET
TEST/VPP
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
RST/NMI/SBWTDIO
TCK
GND
R2
330Ω
TEST/SBWTCK
C1
2.2 nF
(See Note B)
VSS/AVSS/DVSS
A
If a local target power supply is used, make connection J1. If power from the debug or programming adapter is used,
make connection J2.
B
The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
C
R2 protects the JTAG debug interface TCK signal from the JTAG security fuse blow voltage that is supplied by the
TEST/VPP pin during the fuse blow process. If fuse blow functionality is not needed, R2 is not required (populate 0 Ω)
and do not connect TEST/VPP to TEST/SBWTCK.
Figure 2-2. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by MSP430F2xx,
MSP430G2xx, and MSP430F4xx Devices
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Signal Connections for In-System Programming and Debugging
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VCC
Important to connect
MSP430Fxxx
J1 (see Note A)
VCC/AVCC/DVCC
J2 (see Note A)
R1
47 kΩ
C2
10 µF
C3
0.1 µF
JTAG
VCC TOOL
VCC TARGET
2
1
4
3
6
5
8
7
10
9
12
11
14
13
TDO/TDI
RST/NMI/SBWTDIO
TCK
GND
TEST/SBWTCK
C1
2.2 nF
(See Note B)
VSS/AVSS/DVSS
A
Make connection J1 if a local target power supply is used, or make connection J2 if the target is powered from the
debug or programming adapter.
B
The device RST/NMI/SBWTDIO pin is used in 2-wire mode for bidirectional communication with the device during
JTAG access, and any capacitance that is attached to this signal may affect the ability to establish a connection with
the device. The upper limit for C1 is 2.2 nF when using current TI tools.
Some EVMs use a value of 1.1 nF to enable high-speed SBW communication.
Figure 2-3. Signal Connections for 2-Wire JTAG Communication (Spy-Bi-Wire) Used by All MSP430 SBWCapable Devices That are Not Part of F2xx, G2xx, F4xx Families
NOTE: On some Spy-Bi-Wire capable MSP430 devices, TEST/SBWTCK is very sensitive to rising
signal edges that can cause the test logic to enter a state where an entry sequence (either
2‑wire or 4-wire) is not recognized correctly and JTAG access stays disabled. Unintentional
edges on SBWTCK can occur when the JTAG connector is connected to the target device.
24
Design Considerations for In-Circuit Programming
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External Power
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2.2
External Power
The MSP-FET430UIF can supply targets with up to 60 mA through pin 2 of the 14-pin connector. Note
that the target should not consume more than 60 mA, even as a peak current, as it may violate the USB
specification. For example, if the target board has a capacitor on VCC more than 10 µF, it may cause
inrush current during capacitor charging that may exceed 60 mA. In this case, the current should be
limited by the design of the target board, or an external power supply should be used.
The VCC for the target can be selected between 1.8 V and 3.6 V in steps of 0.1 V. Alternatively, the target
can be supplied externally. In this case, the external voltage should be connected to pin 4 of the 14-pin
connector. The MSP-FET430UIF then adjusts the level of the JTAG signals to external VCC automatically.
Only pin 2 (MSP-FET430UIF supplies target) or pin 4 (target is externally supplied) must be connected;
not both at the same time.
When a target socket module is powered from an external supply, the external supply powers the device
on the target socket module and any user circuitry connected to the target socket module, and the FET
interface module continues to be powered from the PC through the parallel port. If the externally supplied
voltage differs from that of the FET interface module, the target socket module must be modified so that
the externally supplied voltage is routed to the FET interface module (so that it may adjust its output
voltage levels accordingly). See the target socket module schematics in Appendix B.
The PC parallel port can source a limited amount of current. Because of the ultra-low-power requirement
of the MSP430, a stand-alone FET does not exceed the available current. However, if additional circuitry
is added to the tool, this current limit could be exceeded. In this case, external power can be supplied to
the tool through connections provided on the target socket modules. See the schematics and pictorials of
the target socket modules in Appendix B to locate the external power connectors. Note that the MSPFET430PIF is not recommended for new design.
2.3
Bootloader (BSL)
The JTAG pins provide access to the memory of the MSP430 and CC430 devices. On some devices,
these pins are shared with the device port pins, and this sharing of pins can complicate a design (or
sharing may not be possible). As an alternative to using the JTAG pins, most MSP430Fxxx devices
contain a program (a "bootloader", formerly knows as the "bootstrap loader") that permits the flash
memory to be erased and programmed using a reduced set of signals. The MSP430 Programming With
the Bootloader (BSL) User's Guide (SLAU319) describes this interface. See the MSP430 website for the
application reports and a list of MSP430 BSL tool developers.
TI suggests that MSP430Fxxx customers design their circuits with the BSL in mind (that is, TI suggests
providing access to these signals by, for example, a header).
See FAQ Hardware #10 for a second alternative to sharing the JTAG and port pins.
SLAU278X – May 2009 – Revised February 2016
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25
Appendix A
SLAU278X – May 2009 – Revised February 2016
Frequently Asked Questions and Known Issues
This appendix presents solutions to frequently asked questions regarding the MSP-FET430 hardware.
Topic
A.1
A.2
26
...........................................................................................................................
Page
Hardware FAQs .................................................................................................. 27
Known Issues .................................................................................................... 29
Frequently Asked Questions and Known Issues
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Hardware FAQs
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A.1
Hardware FAQs
1. MSP430F22xx Target Socket Module (MSP-TS430DA38) – Important Information
Due to the large capacitive coupling introduced by the device socket between the adjacent signals
XIN/P2.6 (socket pin 6) and RST/SBWTDIO (socket pin 7), in-system debugging can disturb the
LFXT1 low-frequency crystal oscillator operation (ACLK). This behavior applies only to the Spy-Bi-Wire
(2-wire) JTAG configuration and only to the period while a debug session is active.
Workarounds:
• Use the 4-wire JTAG mode debug configuration instead of the Spy-Bi-Wire (2-wire) JTAG
configuration. This can be achieved by placing jumpers JP4 through JP9 accordingly.
• Use the debugger option "Run Free" that can be selected from the Advanced Run drop-down
menu (at top of Debug View). This prevents the debugger from accessing the MSP430 device
while the application is running. Note that, in this mode, a manual halt is required to see if a
breakpoint was hit. See the IDE documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
2. With current interface hardware and software, there is a weakness when adapting target boards
that are powered externally. This leads to an accidental fuse check in the MSP430 device. This is
valid for PIF and UIF but is seen most often on the UIF. A solution is being developed.
Workarounds:
• Connect the RST/NMI pin to the JTAG header (pin 11). LPT and USB tools are able to pull the
RST line, which also resets the device internal fuse logic.
• Use the debugger option "Release JTAG On Go" that can be selected from the IDE drop-down
menu. This prevents the debugger from accessing the MCU while the application is running. Note
that in this mode, a manual halt is required to see if a breakpoint was hit. See the IDE
documentation for more information on this feature.
• Use an external clock source to drive XIN directly.
3. The 14-conductor cable that connects the FET interface module and the target socket module must
not exceed 8 inches (20 centimeters) in length.
4. The signal assignment on the 14-conductor cable is identical for the parallel port interface and the
USB FET.
5. To use the on-chip ADC voltage references, the capacitor must be installed on the target socket
module. See the schematic of the target socket module to populate the capacitor according to the data
sheet of the device.
6. To use the charge pump on the devices with LCD+ Module, the capacitor must be installed on
the target socket module. See the schematic of the target socket module to populate the capacitor
according to the data sheet of the device.
7. Crystals or resonators Q1 and Q2 (if applicable) are not provided on the target socket module.
For MSP430 devices that contain user-selectable loading capacitors, see the device and crystal data
sheets for the value of capacitance.
8. Crystals or resonators have no effect upon the operation of the tool and the CCS debugger or
C-SPY (as any required clocking and timing is derived from the internal DCO and FLL).
9. On devices with multiplexed port or JTAG pins, to use these pin in their port capability:
For CCS: "Run Free" (in Run pulldown menu at top of Debug View) must be selected.
For C-SPY: "Release JTAG On Go" must be selected.
10. As an alternative to sharing the JTAG and port pins (on low pin count devices), consider using
an MSP430 device that is a "superset" of the smaller device. A very powerful feature of the
MSP430 is that the family members are code and architecturally compatible, so code developed on
one device (for example, one without shared JTAG and port pins) ports effortlessly to another
(assuming an equivalent set of peripherals).
SLAU278X – May 2009 – Revised February 2016
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27
Hardware FAQs
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11. Information memory may not be blank (erased to 0xFF) when the device is delivered from TI.
Customers should erase the information memory before its first use. Main memory of packaged
devices is blank when the device is delivered from TI.
12. The device current is higher then expected. The device current measurement may not be accurate
with the debugger connected to the device. For accurate measurement, disconnect the debugger.
Additionally some unused pins of the device should be terminated. See the Connection of Unused Pins
table in the device's family user's guide.
13. The following ZIF sockets are used in the FET tools and target socket modules:
• 8-pin device (D package): Yamaichi IC369-0082
• 14-pin device (PW package): Enplas OTS-14-065-01
• 14-pin package for 'L092 (PW package): Yamaichi IC189-0142-146
• 24-pin package (PW package): Enplas OTS-24(28)-0.65-02
• 28-pin device (DW package): Wells-CTI 652 D028
• 28-pin device (PW package): Enplas OTS-28-0.65-01
• 38-pin device (DA package): Yamaichi IC189-0382-037
• 40-pin device (RHA package): Enplas QFN-40B-0.5-01
• 40-pin device (RSB package): Enplas QFN-40B-0.4
• 48-pin device (RGZ package): Yamaichi QFN11T048-008 A101121-001
• 48-pin device (DL package): Yamaichi IC51-0482-1163
• 64-pin device (PM package): Yamaichi IC51-0644-807
• 64-pin device (RGC package): Yamaichi QFN11T064-006
• 80-pin device (PN package): Yamaichi IC201-0804-014
• 100-pin device (PZ package): Yamaichi IC201-1004-008
• 128-pin device (PEU package): Yamaichi IC500-1284-009P
Enplas: www.enplas.com
Wells-CTI: www.wellscti.com
Yamaichi: www.yamaichi.us
28
Frequently Asked Questions and Known Issues
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Known Issues
www.ti.com
A.2
Known Issues
MSP-FET430UIF
Current detection algorithm of the UIF firmware
Problem Description
If high current is detected, the ICC monitor algorithm stays in a loop of frequently
switching on and off the target power supply. This power switching puts some MSP430
devices such as the MSP430F5438 in a state that requires a power cycle to return the
device to JTAG control.
A side issue is that if the UIF firmware has entered this switch on and switch off loop, it
is not possible to turn off the power supply to the target by calling MSP430_VCC(0). A
power cycle is required to remove the device from this state.
Solution
IAR KickStart and Code Composer Essentials that have the MSP430.dll version
2.04.00.003 and higher do not show this problem. Update the software development tool
to this version or higher to update the MSP-FET430UIF firmware.
MSP-FET430PIF
Some PCs do not supply 5 V through the parallel port
Problem Description
Device identification problems with modern PCs, because the parallel port often does not
deliver 5 V as was common with earlier hardware.
1. When connected to a laptop, the test signal is clamped to 2.5 V.
2. When the external VCC becomes less than 3 V, up to 10 mA is flowing in the adapter
through pin 4 (sense).
Solution
Measure the voltage level of the parallel port. If it is too low, provide external 5 V to the
VCC pads of the interface. The jumper on a the target socket must be switched to
external power.
SLAU278X – May 2009 – Revised February 2016
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29
Appendix B
SLAU278X – May 2009 – Revised February 2016
Hardware
This appendix contains information relating to the FET hardware, including schematics, PCB pictorials,
and bills of materials (BOMs). All other tools, such as the eZ430 series, are described in separate productspecific user's guides.
30
Hardware
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Appendix B
www.ti.com
Topic
...........................................................................................................................
B.1
B.2
B.3
B.4
B.5
B.6
B.7
B.8
B.9
B.10
B.11
B.12
B.13
B.14
B.15
B.16
B.17
B.18
B.19
B.20
B.21
B.22
B.23
B.24
B.25
B.26
B.27
B.28
B.29
B.30
B.31
B.32
B.33
B.34
B.35
B.36
B.37
B.38
B.39
B.40
B.41
B.42
B.43
Page
MSP-TS430D8 .................................................................................................... 32
MSP-TS430PW14 ................................................................................................ 35
MSP-TS430L092 ................................................................................................. 38
MSP-TS430L092 Active Cable .............................................................................. 41
MSP-TS430PW20 ................................................................................................ 44
MSP-TS430PW24 ................................................................................................ 48
MSP-TS430RGE24A ............................................................................................ 51
MSP-TS430DW28................................................................................................ 54
MSP-TS430PW28 ................................................................................................ 57
MSP-TS430PW28A ............................................................................................. 60
MSP-TS430RHB32A ............................................................................................ 63
MSP-TS430DA38 ................................................................................................ 66
MSP-TS430QFN23x0 ........................................................................................... 69
MSP-TS430RSB40 .............................................................................................. 72
MSP-TS430RHA40A ............................................................................................ 75
MSP-TS430DL48 ................................................................................................ 78
MSP-TS430RGZ48B ............................................................................................ 81
MSP-TS430RGZ48C ............................................................................................ 84
MSP-TS430PM64 ................................................................................................ 87
MSP-TS430PM64A .............................................................................................. 90
MSP-TS430PM64D .............................................................................................. 93
MSP-TS430PM64F .............................................................................................. 96
MSP-TS430RGC64B ............................................................................................ 99
MSP-TS430RGC64C .......................................................................................... 102
MSP-TS430RGC64USB ...................................................................................... 106
MSP-TS430PN80 ............................................................................................... 110
MSP-TS430PN80A ............................................................................................ 113
MSP-TS430PN80USB ........................................................................................ 116
MSP-TS430PZ100 ............................................................................................. 120
MSP-TS430PZ100A ........................................................................................... 123
MSP-TS430PZ100B ........................................................................................... 126
MSP-TS430PZ100C ........................................................................................... 129
MSP-TS430PZ100D ........................................................................................... 132
MSP-TS430PZ5x100 .......................................................................................... 135
MSP-TS430PZ100USB ....................................................................................... 138
MSP-TS430PZ100AUSB ..................................................................................... 142
MSP-TS430PEU128 ........................................................................................... 146
EM430F5137RF900 ........................................................................................... 149
EM430F6137RF900 ........................................................................................... 153
EM430F6147RF900 ........................................................................................... 157
MSP-FET ......................................................................................................... 161
MSP-FET430UIF ............................................................................................... 173
MSP-FET430PIF ................................................................................................ 179
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Hardware
31
Vcc
J5
3
2
1
14
12
10
8
6
4
2
SBW
2
1
C7
13
11
9
7
5
3
1
GND
330R
R3
C5
100nF
SBWTCK
J4
R2
330R
1
2
3
4
TST/SBWTCK
FE4L
J1
VCC430
P1.2
P1.5
P1.6
U1
RST/SBWTDIO
R5
47K
MSP-TS430D8
DVCC
P1.2/TA1/A2
P1.5/TA0/A5/SCLK
P1.6/TA1/A6/SDO/SCL
DNP
GND
C8
2.2nF
1
2
3
4
Socket: YA MAICHI
Type: IC369-0082
DVSS
TST/SBWTCK
RST/SBWTDIO
P1.7/A7/SDI/SDA
8
7
6
5
GND
GND
TST/SBWTCK
RST/SBWTDIO
P1.7
J2
FE4H
8
7
6
5
VCC
J3
Ext_PWR
REV:
1.0
GND
1
2
3
Sheet: /11
Copyright © 2009–2016, Texas Instruments Incorporated
RST/SBWTDIO
TST/SBWTCK
to measure supply current
J6
10uF/10V
D1
green
2
1
ext
int
+
GND
MSP-TS430D8
MSP-TS430D8 Ta rget Socket Board
TITLE:
Document Number:
Date: 28.07.201
1 11:03:35
SLAU278X – May 2009 – Revised February 2016
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32
MSP-TS430D8
B.1
www.ti.com
MSP-TS430D8
Figure B-1. MSP-TS430D8 Target Socket Module, Schematic
MSP-TS430D8
www.ti.com
Jumper J5
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
14-pin connector for debugging
in Spy-Bi-Wire mode only
(4-Wire JTAG not available)
D1
LED connected to P1.2
Connector J3
External power connector
Jumper J5 to “ext”
Jumper J4
Open to disconnect LED
Jumper J6
Open to measure current
Orient Pin 1 of MSP430 device
Figure B-2. MSP-TS430D8 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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Hardware
33
MSP-TS430D8
www.ti.com
Table B-1. MSP-TS430D8 Bill of Materials
Position
No. per
Board
Ref Des
Description
Digi-Key Part No.
Comment
1
J4, J6
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
2
J5
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
3
SBW
1
10-pin connector, male, TH
HRP10H-ND
4
J3
1
3-pin header, male, TH
SAM1035-03-ND
5
C8
1
2.2nF, CSMD0805
Buerklin 53 D 292
6
C7
1
10uF, 10V, 1210ELKO
478-3875-1-ND
7
R5
1
47K, 0805
541-47000ATR-ND
8
C5
1
100nF, CSMD0805
311-1245-2-ND
9
R2, R3
2
330R, 0805
541-330ATR-ND
10
J1, J2
2
4-pin header, TH
SAM1029-04-ND
DNP: headers enclosed with kit.
Keep vias free of solder.
10,1
J1, J2
1
4-pin socket, TH
SAM1029-04-ND
DNP: receptacles enclosed with kit.
11
U1
1
SO8 Socket: Type IC369-0082
12
D1
1
red, LED 0603
13
MSP430
2
MSP430G2210, MSP430G2230
14
PCB
1
50,0mmx44,5mm
34
Hardware
Manuf.: Yamaichi
DNP: enclosed with kit. Is supplied
by TI
MSP-TS430D8 Rev.
1.0
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MSP-TS430PW14
B.2
MSP-TS430PW14
www.ti.com
Vcc
J5
3
2
1
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
GND
RST/NMI
SBWTCK
TMS
TDI
TDO/SBWTDIO
J7
3
2
1
TEST/SBWTCK
JTAG ->
SBW ->
XIN
XOUT
to measure supply current
J6
Q1
DNP
J4
R2
330R
1
2
3
4
5
6
7
TEST/SBWTCK
J1
J8
3
2
1
C8
2.2nF
1
2
3
4
5
6
7
J9
3
2
1
P1.7/TDO
3
2
1
J10
GND
XIN
XOUT
TEST/SBWTCK
RST/SBWTDIO
P1.7/TDO
P1.6/TDI
Socket: ENPLAS
Type: OTS-14-065
14
13
12
11
10
9
8
P1.6/TDI
14
13
12
11
10
9
8
J2
3
2
1
J11
VCC
P1.5/TMS
3
2
1
J12
2-wire "SpyBiWire": Set jumpers J7 to J12 to position 2-1
4-wire JTAG: Set jumpers J7 to J12 to position 2-3
JTAG-Mode selection:
RST/SBWTDIO
R5
47K
DNP
GND
VCC430
P1.0
P1.1
P1.2
P1.3
P1.4/TCK
P1.5/TMS
C3
100nF
DNP
GND
MSP-TS430PW14
Ext_PWR
J3
GND
P1.4/TCK
REV:
2.0
Sheet: 1/1
MSP-TS430PW14 Target Socket Board
TITLE:
Document Number:
Date: 7/16/2007 8:22:36 AM
Copyright © 2009–2016, Texas Instruments Incorporated
1
2
3
35
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SLAU278X – May 2009 – Revised February 2016
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ext
int
2
1
12pF C2
DNP
330R
R3
12pF C1
DNP
D1
green
2
1
C5
C7
100nF
10uF/10V
GND
+
Figure B-3. MSP-TS430PW14 Target Socket Module, Schematic
MSP-TS430PW14
www.ti.com
Connector JTAG
For JTAG Tool
Jumper J5
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J3
External power connector
Jumper J5 to "ext"
D1
LED connected to P1.0
Jumpers J7 to J12
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
Jumper J4
Open to disconnect LED
Orient Pin 1 of MSP430 device
Jumper J6
Open to measure current
Figure B-4. MSP-TS430PW14 Target Socket Module, PCB
36
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MSP-TS430PW14
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Table B-2. MSP-TS430PW14 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C3, C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
6
J1, J2
0
Description
Digi-Key Part No.
Comment
DNP
DNP: C3
DNP
475-1056-2-ND
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder
7-pin header, TH
SAM1029-07-ND
: Header
SAM1213-07-ND
: Receptacle
7
J3, J5, J7,
J8, J9, J10,
J11, J12
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers J5, J7, J8,
J9, J10, J11, J12; Pos 1-2
8
J4, J6
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
Place on: J5, J7-J12; Pos 1-2
9
10
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R2, R3
2
330 Ω, SMD0805
541-330ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-14-0.65-01
Manuf.: Enplas
17
PCB
1
56 x 53 mm
2 layers
Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
18
Adhesive
plastic feet
4
For example, 3M
Approximately 6mm width,
Bumpons Part No. SJ2mm height
5302
19
MSP430
2
MSP430F2013IPW
SLAU278X – May 2009 – Revised February 2016
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DNP: keep vias free of solder
Hardware
37
MSP-TS430L092
B.3
www.ti.com
MSP-TS430L092
Figure B-5. MSP-TS430L092 Target Socket Module, Schematic
38
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MSP-TS430L092
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Settings of the MSP-TS430L092 Target Socket
Figure B-6 shows the PCB layout of the MSP-TS430L092 target socket. The following pinning is
recommended:
• JP1 is write enable for the EPROM. If this is not set, the EPROM can only be read.
• JP2 and JP3 connect device supply with boost converter. They can be opened to measure device
current consumption. For default operation, they should be closed.
Connector J3
External power connector
Jumper JP1
Write enable for EPROM
Jumper JP3
Open to measure current
Orient pin 1 of
MSP430 device
Figure B-6. MSP-TS430L092 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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39
MSP-TS430L092
www.ti.com
Table B-3. MSP-TS430L092 Bill of Materials
Pos.
Ref Des No.
No. Per
Board
1
C1, C2
2
330nF, SMD0603
2
C5
1
100n, SMD0603
3
C6
1
10u, SMD0805
4
C10
1
100n, SMD0603
5
EEPROM1
1
M95512 SO08 (SO8)
7
40
J1, J2
2
Description
Digi-Key Part No.
ST Micro M95160R
Comment
Digikey: 497-8688-1-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
7-pin header, TH
SAM1213-07-ND
: Header
SAM1035-07-ND
: Receptacle
8
J3
1
3-pin header, male, TH
SAM1035-03-ND
9
J4, J5
2
FE4L, FE4H
4 pol. Stiftreihe
11
J13
1
MICRO_STECKV_10
12
JP1, JP2,JP3
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
15
L1
1
33uH, SMD0806
LQH2MCN330K02L
Farnell: 151-5557
16
LED1, LED4
2
LEDCHIPLED_0603
17
Q2
1
BC817-16LT1SMD
18
R0, R6, R7
3
2K7, SMD0603
19
R1
1
1k, SMD0603
20
R2
1
47k, SMD0603
21
R4,R5, R8,
R10, RC, RD
6
10k, SMD0603
22
RA
1
3.9k, SMD0603
23
RB
1
6.8k, SMD0603
24
U1
1
14 Pin Socket - IC189-0142146
Manuf. Yamaichi
22
MSP430
2
MSP430L092PWR
DNP: Enclosed with kit. Is
supplied by TI.
Hardware
DNP; Keep vias free of solder.
Reichelt: MicroMaTchConnector: MM FL 10G
Farnell: 1686065
BC817-16LT1SMD
SOT23-BEC
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MSP-TS430L092 Active Cable
www.ti.com
B.4
MSP-TS430L092 Active Cable
Figure B-7. MSP-TS430L092 Active Cable Target Socket Module, Schematic
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MSP-TS430L092 Active Cable
www.ti.com
Figure B-8 shows the PCB layout for the Active Cable. The following pinning is possible:
• JP1 has two jumpers (Jumper 1 and Jumper 2) that can be set as shown in Table B-4.
Table B-4. MSP-TS430L092 JP1 Settings
•
Jumper 1
Jumper 2
Description
Off
Off
The active cable has no power and does not function.
Off
On
The active cable receives power from target socket. For this option, the
target socket must have its own power supply.
On
Off
The active cable receives power from the JTAG connector.
On
On
The JTAG connector powers the active cable and the target socket. For
this option, the target socket must not have its own power source, as this
would cause a not defined state.
JP2 is for reset. For the standard MSP-TS430L092, this jumper must be set. It sets the reset pin to
high and can also control it. Without this jumper on the MSP-TS430L092, reset is set to zero.
JP2
Connector JTAG
For JTAG Tool
JP1
Figure B-8. MSP-TS430L092 Active Cable Target Socket Module, PCB
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MSP-TS430L092 Active Cable
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Table B-5. MSP-TS430L092 Active Cable Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C3, C5,
C6
4
100nF, SMD0603
2
C2, C4
2
1uF, SMD0805
3
R1, R10
2
10K, SMD0603
4
R2
1
4K7, SMD0603
5
R5, R6, R7,
R9
4
100, SMD0603
6
R8
1
680k, SMD0603
7
R11, R15
2
1K, SMD0603
8
R12
0
SMD0603
DNP
9
R13
0
SMD0603
DNP
10
R14
1
0, SMD0603
11
IC1
1
SN74AUC1G04DBVR
12
IC2, IC3, IC4
3
SN74AUC2G125DCTR
Description
Digi-Key Part No.
Comment
Manu: TI
Manu: TI
13
J2
1
MICRO_STECKV_10
Reichelt: MicroMaTchConnector: MM FL 10G
14
JP1
1
2x2 Header
JP2Q
Put jumper on Position 1 and
2. Do not mix direction.
15
JP2
1
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
16
JTAG
1
14-pin connector, male, TH
HRP14H-ND
17
Q1
1
BC817-25LT1SMD, SOT23BEC
Digi-Key: BC81725LT1GOSCT-ND
18
U1, U2
2
TLVH431IDBVR
SOT23-5
SLAU278X – May 2009 – Revised February 2016
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Manu: TI
Hardware
43
MSP-TS430PW20
B.5
www.ti.com
MSP-TS430PW20
The MSP-TS430PW20 microcontroller development board supports the MSP430FR23x and
MSP430FR21x FRAM devices in both 20-pin and 16-pin TSSOP (TI package code PW) packages. No
microcontroller devices are included in the MSP-TS430PW20 kit, but can be ordered from the TI Store.
The MSP-TS430PW20 microcontroller development board has two jumpers on header J11 that direct the
UART BSL signals, depending on which device is being used (see Figure B-9).
Figure B-9. UART BSL Signal Select
•
•
44
GROUP2: Jumpers on 3-5 and 4-6 for MSP430FR231x PW16
GROUP1: Jumpers on 1-3 and 2-4 for all other compatible devices, including MSP430FR231x PW20
Hardware
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MSP-TS430PW20
www.ti.com
Vcc
A
3
2
1
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
JTAG
13
11
9
7
5
3
1
B
TP3
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
C
TEST/SBWTCK
JP4
3
2
1
47k
R4
D
DNP
EVQ11
GND
JP5
3
2 PIN15
1
JP6
E
JP7
3
2 P1.5/TMS
1
JP8
F
G
2
1
I2C
UART
2
1
H
P1.3
TEST/SBWTCK
9
7
5
BSL
10
8
6
4
2
I
GND
J2
DNP
Ext_PWR
RST/SBWTDIO
If external supply voltage:
remove R3 and add R2 (0 Ohm)
3
RXD
1
TXD/SOMI/SDA1
P1.3
GND
2 PIN16
4 RXD
6 PIN15
PW16
JP11
PW20
DVCC
PIN15 1
TDX 3
PIN14 5
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
P1.2
GND
100nF
C11
TXD/SOMI/SDA
J4
TDX
20
19
18
17
16
15
14
13
12
11
SAM1029-10-ND/11-20
P1.2
P1.3
P1.4/TCK
P1.5/TMS
PIN16
PIN15
PIN14
3
2 P1.4/TCK
1
IPW20
Socket: Enplas OTS-20S-0.65-007
3
2 PIN16
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
RST/SBWTDIO
U1
C7
DVCC
20
P1.2/UCB0SIMO/UCB0SDA/TB0TRG/OA0-/A2/VEREFP1.1/UCB0CLK/ACLK/C1/A1
P1.0/UCB0STE/SMCLK/C0/A0/VEREF+ P1.3/UCB0SOMI/UCB0SCL/OA0O/A319
P1.4/UCA0STE/TCK/OA0+/A4 18
TEST/SBWTCK
P1.5//UCA0CLK/TMS/TRI0O/A5 17
RST/NMI/SBWTDIO
16
P1.6/UCA0RXD/UCA0SOMI/TB0.1/TDI/TCLK/TRI0-/A6
DVCC
15
P1.7/UCA0TXD/UCA0SIMO/TB2.0/TD0/TRI0+/A7/VREF+
DVSS
P2.0/TB1.1/CO 14
P2.7/TB0CLK/XIN
P2.1/TB1.2 13
P2.6/MCLK/XOUT
IPW16
P2.2/UCB0STE/TB1CLK 12
P2.5/UCB0SOMI/UCB0SCL
P2.3/UCB0CLK/TB1TRG 11
P2.4/UCB0SIMO/UCB0SDA
100nF
C6
MSP430FR231XIPW20
12p
C8
GND
H
I
Title: MSP-TS430PW20
Target Socket Board for MSP430FR231x devices
File: MSP-TS430PW20
Rev.: 1.1
Date: 11/27/2015 12:49:07 PM
Page 1/1
G
A3
6
5
4
3
2
1
Copyright © 2009–2016, Texas Instruments Incorporated
3
2
1
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ext
JP3
3
2
1
1
P1.1
2
P1.0
3
TEST/SBWTCK
4
RST/SBWTDIO
5
DVCC
6
DVSS
7
XIN
XOUT 8
9
10
DNP
DNP
F
1
2
6
5
int
JTAG ->
GND
TEST/SBWTCK1
SBW ->
1
2
3
4
5
6
7
8
9
10
SAM1029-10-ND/1-10
J3
XOUT
XIN
DNP
DNP
QUARZ5
Q2
C9
12p
DNP
E
R2
0R
R3
0R
J1
DVCC
P1.3
P1.0
P1.1
P1.2
D
JP18
1
2
1
2
JP17
2
1
JP1
DVSS
R14DNP
R1 330R
JP9
JP2
JP10
C
1uF/10V
0R R13
D1
green
R5 330R
DNP
D2
yellow DNP
R6 330R
DNP
D3
red DNP
GND
DVCC
B
XTLGND
DNP
SW2
4
3
2
1
A
R9
0R
R8
0R
2
1
2
1
2
1
TP1TP2
Figure B-10. MSP-TS430PW20 Target Socket Module, Schematic
MSP-TS430PW20
www.ti.com
Connector JTAG
For JTAG Tool
Connector BSL
For Bootloader Tool
10
14
1
2
1
2
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J2
External power connector
Jumper J1 to "ext"
Jumper JP1
Open to measure current
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
JP11
Orient Pin 1 of MSP430 device
Jumpers JP9, JP2, JP10
Open to disconnect LEDs
D1 to D3
LEDs connected to P1.0 to P1.2
SW1
Close to reset
Figure B-11. MSP-TS430PW20 Target Socket Module, PCB
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MSP-TS430PW20
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Table B-6. MSP-TS430PW20 Bill of Materials
Pos.
Ref Des
No. Per
Board
1
PCB
1
90.0 x 92.5 mm
"MSP-TS430PW20" Rev. 1.1
2 layers, green solder mask
2
JP1, JP9,
JP13, JP14,
JP15
5
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one pin only
4
JP2, JP10
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4, JP5,
JP6, JP7, JP8
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
7
JP16
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
8
J2
1
3-pin header, male, TH
SAM1035-03-ND
9
JP11
1
2x3pin header, male, TH
SAM1034-03-ND
PW20: Place jumpers on pins
1-3 and 2-4
PW16: Place jumpers on pins
3-5 and 4-6
10
R2, R8, R9
3
0R, 0805
541-0.0ATR-ND
DNP
11
R3, R13
2
0R, 0805
541-0.0ATR-ND
12
C5
1
1.1nF, CSMD0805
490-1623-2-ND
13
C7
1
1uF/10V, CSMD0805
490-1702-2-ND
14
R7, R15
1
10k, 0805
541-10KATR-ND
15
R4
1
47k, 0805
541-47KATR-ND
16
C6, C11
2
100nF, CSMD0805
490-1666-1-ND
17
C8, C9
2
12p, DNP, CSMD0805
BC1257TR-ND
18
R1
1
330R, 0805
541-330ATR-ND
19
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
20
R14
1
47k, 0805
541-47KATR-ND
DNP
21
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder
22
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of solder
23
J3, J4
2
10-pin header, TH
SAM1029-10-ND
DNP: headers are enclosed
with kit.
Keep vias free of solder.
24
J3, J4
2
10-pin receptacle, TH
SAM1213-10-ND
DNP: Receptacles are
enclosed with kit.
Keep vias free of solder.
25
TP1, TP2, TP3
3
Test point
26
BSL
1
10-pin connector, male, TH
HRP10H-ND
27
JTAG
1
14-pin connector, male, TH
HRP14H-ND
28
IC1
1
Socket: OTS-20S-0.65-007
Manuf. Enplas
29
IC1
1
MSP430FR2311IPW20
DNP: Free samples can be
ordered in the TI Store
30
Q2
1
4MHz Crystal
31
Q2
1
MSV3V-T1R (32.768KHz /
20ppm / 12.5pF)
32
D1
1
green LED, HSMG-C170
DIODE0805
33
D3
1
red LED, DIODE0805
DNP
34
D2
1
yellow LED, DIODE0805
DNP
35
Rubber stand
off
4
Description
Digi-Key Part No.
Comment
DNP
DNP, keep pads free of solder
4MHz Buerklin: 78D134
DNP: Crystal is enclosed with
kit
DNP: Crystal is enclosed with
kit
516-1434-1-ND
Buerklin: 20H1724
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Avago, Farnell 5790852
apply to corners at bottom side
Hardware
47
MSP-TS430PW24
B.6
www.ti.com
MSP-TS430PW24
Figure B-12. MSP-TS430PW24 Target Socket Module, Schematic
48
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MSP-TS430PW24
www.ti.com
Connector JTAG
For JTAG Tool
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Figure B-13. MSP-TS430PW24 Target Socket Module, PCB
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MSP-TS430PW24
www.ti.com
Table B-7. MSP-TS430PW24 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3, C7
2
10uF, 10V, SMD0805
4
C4, C6, C8
3
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
12-pin header, TH
SAM1029-07-ND
SAM1213-07-ND
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder. (Header and Receptacle)
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9
Place on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 and 8
JTAG
1
14-pin connector, male,
TH
HRP14H-ND
11
Q1
0
Crystal
12
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
13
R5, R6, R8,
R9,
2
0 Ohm, SMD0805
541-000ATR-ND
14
R4
1
47k Ohm, SMD0805
541-47000ATR-ND
U1
1
Socket: OTS 24(28)-06502-00
Manuf.: Enplas
16
PCB
1
68.5 x 61 mm
2 layers
17
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
18
MSP430
2
MSP430AFE2xx
9
10
15
50
Hardware
Description
Digi-Key Part No.
Comment
DNP
DNP: keep vias free of solder
DNP R5, R6
DNP: enclosed with kit, supplied by TI
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RGE24A
B.7
MSP-TS430RGE24A
www.ti.com
Vcc
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
JTAG
13
11
9
7
5
3
1
B
TP3
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
C
D
DNP
EVQ11
JP5
3
2 P1.7/TDO
1
JP6
E
3
2 P1.6/TDI
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
JP7
3
2 P1.5/TMS
1
JP8
F
3
2 P1.4/TCK
1
J5
G
2
1
I2C
2
1
H
SPICLK/SCL1
TEST/SBWTCK
9
7
5
BSL
10
8
6
4
2
I
GND
J2
DNP
Ext_PWR
RST/SBWTDIO
If external supply voltage:
remove R3 and add R2 (0 Ohm)
3
P1.5/TMS
1
TXD/SOMI/SDA1
P1.3
P1.5
GND
DVCC
UART
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
P1.2
TXD/SOMI/SDA
P1.4/TCK
C11
100nF
GND
H
I
Title: MSP-TS430RGE24A
Target Socket Board for MSP430FR2433 device
File: MSP-TS430RGE24A
Rev.: 1.0
Date: 4/28/2015 3:52:36 PM
Page 1/1
G
A3
6
5
4
3
2
1
Copyright © 2009–2016, Texas Instruments Incorporated
3
2
1
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A
3
2
1
JP4
47k
R4
DVSS
18
17
16
15
14
13
SAM1029-06-ND13-18
R2
0R
R3
0R
RST/SBWTDIO
GND
DNP
DNP
XIN
XOUT
18
17
16
15
14
13
F
1
2
ext
int
JP3
3
2
1
IC1
E
Socket:
ENPLAS QFN-24B-0.5-0.1c
DVSS
RST/NMI/SBWTDIO
P2.6/UCA1TXD/UCA1SIMO
TEST/SBWTCK
P1.4/UCA0TXD/UCA0SIMO/TA1.2/TCK/A4 P2.5/UCA1RXD/UCA1SOMI
P2.4/UCA1CLK
P1.5/UCA0RXD/UCA0SOMI/TA1.1/TMS/A5
P3.1/UCA1STE
P1.6/UCA0CLK/TA1CLK/TDI/TCLK/A6
P2.3
P1.7/UCA0STE/SMCLK/TDO/A7
MSP430FR2433IRGE
D
JP18
1
2
1
2
JP17
TEST/SBWTCK
C6
DNP
C9
DNP
Q2
QUARZ5
C8
1
2
3
4
5
6
J6
JTAG ->
3
2
1
DVCC
C7
100nF
GND
DNP
SAM1029-06-ND1-6
1
RST/SBWTDIO
2
TEST/SBWTCK
3
P1.4/TCK
4
P1.5/TMS
5
P1.6/TDI
6
P1.7/TDO
J3
0R
R8
0R
R9
GND
TEST/SBWTCK1
SBW ->
P1.3
P1.0
SPICLK/SCL1
P1.1
P1.2
C
XTLGND
J1
DVCC
DVSS
R14DNP
R1 330R
JP9
JP2
JP10
B
1uF/10V
2
1
JP1
0R R13
D1
green
R5 330R
DNP
D2
yellow DNP
R6 330R
DNP
D3
red DNP
GND
DVCC
6
5
4
3
2
1
A
SAM1029-06-ND19-24
J4
DNP
SW2
24
23
22
21
20
19
DVCC
DVSS
XIN
XOUT
24
23
22
21
20
19
DVCC
DVSS
P2.1/XIN
P2.0/XOUT
P3.2
P2.7
P1.0/UCB0STE/TA0CLK/A0
P1.1/UCB0CLK/TA0.1/A1
P1.2/UCB0SIMO/UCB0SDA/TA0.2/A2
P1.3/UCB0SOMI/UCB0SCL/MCLK/A3
P2.2/ACLK
P3.0
7
8
9
10
11
12
SAM1029-06-ND7-12
7 P1.0
8 P1.1
9 P1.2
10 SPICLK/SCL1
11
12
2
1
2
1
2
1
TP1TP2
Figure B-14. MSP-TS430RGE24A Target Socket Module, Schematic
MSP-TS430RGE24A
www.ti.com
Connector BSL
For bootloader tool
Connector JTAG
For JTAG tool
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J2
External power connector
Jumper J1 to “ext”
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Orient Pin 1 of MSP430 device
Figure B-15. MSP-TS430RGE24A Target Socket Module, PCB
52
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MSP-TS430RGE24A
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Table B-8. MSP-TS430RGE24A Bill of Materials (BOM)
Position
Ref Des
No. per
Board
1
PCB
1
90.0 x 92.5 mm
"MSP-TS430RGE24A" Rev.
1.0
2 layers, red solder mask
2
JP1, JP9,
JP13, JP14,
JP15
5
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on one pin only
4
JP2, JP10
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of
solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R8, R9
3
0R, 0805
541-0.0ATR-ND
Description
Digi-Key Part No.
Comment
DNP
9
R3, R13
2
0R, 0805
541-0.0ATR-ND
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C7
1
1uF/10V, CSMD0805
490-1702-2-ND
12
R7, R15
1
10k, 0805
541-10KATR-ND
13
R4
1
47k, 0805
541-47KATR-ND
14
C6, C11
2
100nF, CSMD0805
490-1666-1-ND
15
R1
1
330R, 0805
541-330ATR-ND
16
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
17
R14
1
47k, 0805
541-47KATR-ND
DNP
18
C8, C9
2
DNP, CSMD0805
19
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of
solder. Lacon: 1251459
20
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Keep vias free of
solder, Lacon: 1251459
21
J3, J4, J5, J6
4
6-pin header, TH
SAM1029-06-ND
DNP: headers enclosed in
kit.
Keep vias free of solder.
22
J3, J4, J5, J6
4
6-pin receptacle, TH
SAM1213-06-ND
DNP: receptacles enclosed in
kit.
Keep vias free of solder.
23
TP1, TP2,
TP3
3
Test point
24
BSL
1
10-pin connector, male, TH
HRP10H-ND
25
JTAG
1
14-pin connector, male, TH
HRP14H-ND
26
IC1
1
Socket:QFN-24B-0.5-0.1c
Manuf. Enplas
27
IC1
1
MSP430FR2433IRGER
DNP: Free samples can be
ordered in the TI Store
28
Q2
1
DNP: MS3V-TR1
(32,768kHz/ 20ppm/12,5pF)
depends on application
DNP: Micro Crystal, enclosed
in kit. Keep vias free of solder
29
D1
1
green LED, HSMG-C170
DIODE0805
516-1434-1-ND
Avago, Farnell 5790852
30
D3
1
red (DNP), DIODE0805
DNP
31
D2
1
yellow (DNP), DIODE0805
DNP
32
Rubber stand
off
4
DNP
DNP, keep pads free of
solder
Buerklin: 20H1724
SLAU278X – May 2009 – Revised February 2016
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Apply to corners at bottom
side
Hardware
53
If external supply voltage:
-
R9
GND
C2
R8
0R
R2
0R
2
Q1
560R
R3
R1
-
12pF
C1
12pF
LED3
D1
14
12
10
8
6
4
2
JTAG
ML14
13
11
9
7
5
3
1
J5
JP1Q
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
C8
TDO
TDI
TMS
TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
10nF
RST/NMI
C5
C7
100nF
10uF/10V
J4
JP1Q
SMD-Footprint
F123
TST/VPP 1
VCC430 2
3
P2.5
4
GND
5
XOUT
6
XIN
RST/NMI 7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
R5
50K
TST/VPP
VCC
TCK
TMS
TDI
TDO
U1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
SOCK28DW
1
2
3
4
5
6
7
8
9
10
11
12
13
14
TDO
TDI
TMS
TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
Socket: Yamaichi
Type: IC189-0282-042
TST/VPP
VCC430
P2.5
GND
XOUT
XIN
RST/NMI
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
RST/NMI
1
2
3
4
5
6
7
8
9
10
11
12
13
14
FE14L
J1
J2
FE14H
28
27
26
25
24
23
22
21
20
19
18
17
16
15
R7
0R
R6
0R
TITLE:
J3
Ext_PWR
MSP-TS430DW28
Document Number:
R10 -
R11 0R
Sheet: 1/1
REV:
2.0
If external supply voltage:
remove R11 and add R10 (0 Ohm)
10
8
6
4 RST/NMI
2
ML10
not assembled
9
7
5
3
1
BOOTST
GND
1
2
3
MSP-TS430DW28 Target Socket DW28
GND
Date: 11/14/2006 1:26:04 PM
Copyright © 2009–2016, Texas Instruments Incorporated
remove R8 and add R9 (0 Ohm)
R1, C1, C2
not assembled
GND
2
1
+
QUARZ3
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
U2
TST
VCC
P2.5
VSS
XOUT
XIN
RST
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
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MSP-TS430DW28
B.8
www.ti.com
MSP-TS430DW28
Figure B-16. MSP-TS430DW28 Target Socket Module, Schematic
MSP-TS430DW28
www.ti.com
D1
LED connected to P1.0
Jumper J4
Open to disconnect LED
Connector J3
External power connector
Remove R8 and jumper R9
Jumper J5
Open to measure current
Connector JTAG
For JTAG Tool
Orient Pin 1 of
MSP430 device
Connector BOOTST
For Bootloader Tool
Figure B-17. MSP-TS430DW28 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430DW28
www.ti.com
Table B-9. MSP-TS430DW28 Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
100nF, SMD0805
3
C7
1
10uF, 10V Tantal Elko B
4
C8
1
10nF
SMD0805
5
D1
1
LED3 T1 3mm yellow
RS: 228-4991
6
Q1
0
QUARZ, Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
7
J1, J2
2
Description
Digi-Key Part No.
Comment
DNP: C1, C2, Cover holes while
soldering
DNP: Cover holes while soldering
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.
14-pin header, TH male
: Header
: Receptacle
7.1
2
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder.
14-pin header, TH female
: Header
: Receptacle
56
8
J3
1
3-Pin Connector, male
9
J4, J5
2
2-Pin Connector, male
10
BOOTST
0
ML10, 10-Pin Conn., m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn., m
RS: 482-121
12
R1, R2, R6,
R7, R8,R9,
R10, R11
4
0R, SMD0805
13
R3
1
560R, SMD0805
14
R5
1
47K, SMD0805
15
U1
1
SOP28DW socket
16
U2
0
TSSOP
Hardware
With jumper
DNP, Cover holes while soldering
DNP: R1, R2, R9, R10
Yamaichi: IC189-0282042
DNP
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PW28
B.9
MSP-TS430PW28
www.ti.com
Vcc
int
ext
3
2
1
VCC430
C2
12pF
DNP
C4
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
VCC
P1.0
GND
JTAG ->
SBW ->
XOUT/P2.7
R6
0R
DNP
TEST/SBWTCK
100nF
R5
0R
XIN/P2.6
DNP
Q1
R1 330R
JP3
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
3
2
1
R7
330R
JP5
TEST/SBWTCK1
VCC430 2
3
P2.5
4
GND
XOUT/P2.75
XIN/P2.6 6
RST/SBWTDIO7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
TEST/SBWTCK
3
2
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
U1
R4
47k
TST
VCC
P2.5
VSS
XOUT
XIN
RST
P2.0
P2.1
P2.2
P3.0
P3.1
P3.2
P3.3
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
14
13
12
11
10
9
8
7
6
5
4
3
2
1
J2
JP6
P2.2
GND
J5
-
DNP
R3 0R
R2
DNP
Ext_PWR
3
2 P1.4/TCK
1
JP9
10
8
6
4
2
DNP
GND
If external supply voltage:
remove R11 and add R10 (0 Ohm)
9
7
5
3
1
BOOTST
3
2 P1.5/TMS
1
JP8
RST/SBWTDIO
P1.1
TEST/SBWTCK
3
2 P1.6/TDI
1
JP7
3
2 P1.7/TDO
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
RST/SBWTDIO
C5
GND
P1.7/TDO
P1.6/TDI
P1.5/TMS
P1.4/TCK
P1.3
P1.2
P1.1
P1.0
P2.4
P2.3
P3.7
P3.6
P3.5
P3.4
DNP
2.2nF
28
27
26
25
24
23
22
21
20
19
18
17
16
15
MSP430F12xx
JP4
J1
Socket: Enplas
OTS-28-0.65-01
MSP-TS430PW28:
Target Socket Board for MSP430's in PW28 package
3.1
Copyright © 2009–2016, Texas Instruments Incorporated
3
2
1
57
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JP1
2
1
JP2
C3
10uF/10V
GND
2
1
DNP
XTLGND
C1
12pF
D1
green
GND
2
1
+
Figure B-18. MSP-TS430PW28 Target Socket Module, Schematic
MSP-TS430PW28
www.ti.com
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to “ext”
Jumper JP2
Open to measure current
Jumper JP4 to JP9:
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P5.1
Figure B-19. MSP-TS430PW28 Target Socket Module, PCB
58
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MSP-TS430PW28
www.ti.com
Table B-10. MSP-TS430PW28 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF, 10V Tantal Elko B
3
C4
1
100nF, SMD0805
4
C5
0
2.2nF, SMD0805
5
D1
1
LED green SMD0603
6
Q1
0
QUARZ, Crystal
7
J1, J2
Description
2
(1)
Digi-Key Part No.
Comment
DNP: C1, C2 , Cover holes
while soldering
DNP
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
DNP: Cover holes and
neighboring holes while
soldering
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
14-pin header, TH male
: Header
: Receptacle
7.1
2
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
14-pin header, TH female
: Header
: Receptacle
(1)
8
J5, IP1
1
3-Pin Connector , male
8a
JP1, JP4,
JP5, JP6,
JP7, JP8,
JP9
7
3-Pin Connector , male
Jumper on Pos 1-2
9
JP2, JP3
2
2-Pin Connector , male
with Jumper
10
BOOTST
0
ML10, 10-Pin Conn. , m
RS: 482-115
11
JTAG
1
ML14, 14-Pin Conn. , m
RS: 482-121
12
R1, R7
2
330R, SMD0805
12
R2, R3, R5,
R6
0
0R, SMD0805
14
R4
1
47K, SMD0805
15
U1
1
SOP28PW socket
DNP: Cover holes while
soldering
DNP
Enplas: OTS-28-0.65-01
PCB 66 x 79 mm, two layers; Rubber stand off, four pieces
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MSP-TS430PW28A
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B.10 MSP-TS430PW28A
JTAG Mode selection:
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers J4 to J9 to position 2-1
Figure B-20. MSP-TS430PW28A Target Socket Module, Schematic
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-21. MSP-TS430PW28A Target Socket Module, PCB (Red)
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be
populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is
supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
SLAU278X – May 2009 – Revised February 2016
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Table B-11. MSP-TS430PW28A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C5
1
2.2nF, SMD0805
3
C3
1
10uF, 10V, SMD0805
4
C4, C6,
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2
0
14-pin header, TH
7
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9 Place
on 1-2 on JP1
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
see Pos 7 an 8
14-pin connector, male,
TH
HRP14H-ND
9
10
JTAG
1
11
BOOTST
0
Digi-Key Part No.
Comment
DNP
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder: (Header and Receptacle)
DNP Keep vias free of solder
Q1
0
Crystal
Micro Crystal MS3V
32.768kHz, C(Load) =
12.5pF
13
R1, R7
2
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3,R5,
R6,
0
0 Ohm, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: OTS-28-0.65-01
Manuf.: Enplas
17
PCB
1
63.5 x 64.8 mm
2 layers
18
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
19
MSP430
2
MSP430G2553IPW28
12
62
Description
Hardware
DNP: keep vias free of solder
DNP R2, R3,R5, R6
DNP: enclosed with kit, supplied by TI
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RHB32A
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B.11 MSP-TS430RHB32A
ext
Vcc
DVCC
14
12
10
8
6
4
2
JP2
JTAG
P1.4
13
11
9
7
5
3
1
GND
DVCC
RST/NMI
TCK
TMS
TDI
TDO
C8
DNP
2.2nF
R5
47K
RST
VCC
C14
1 JP4
2
3
9
10
11
12
13
14
15
16
1
2
3
4
5
6
7
8
TDO 1
RST 2
RST/NMI 3
JP9
RST
TEST/SBWTCK
VREF
AVSS
ROSC
GND
DVCC
VCORE
A2.0+
A2.0A3.0+
A3.0-
A0.0+
A0.0A1.0+
A1.0-
J1
SAM1029-08-ND1-8
TCK
TEST/SBWTCK
R6
R8
R9
R10
R11
R12
R13
R14
R2
100nF
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
DNP 10k
20k/0.1%
R4
SAM1029-08-ND9-16
J2
U1
1 JP8
2
3
M
TMS
1 JP7
2
3
I
TDI
1 JP6
2
3
A0.0+
P2.7/TA0.2
A0.0P2.6/TA0.1
A1.0+
P2.5/TA0.0
A1.0P2.4/TA1.0
P2.3/VMONIN
A2.0+
P2.2/TA1.2
A2.0P2.1/TA1.1
A3.0+
P2.0/TA1.0/CLKIN
A3.0P1.7/UCB0SDA/UCB0SIMO/TA1CLK
VREF
P1.6/UCB0SCL/UCB0SOMI/TA0.2
AVSS
P1.5/UCB0CLK/TA0.1
ROSC
P1.4/UCB0STE/TA0.0
DVSS
P1.3/UCA0TXD/UCA0SIMO/TA0CLK/TDO/TDI
VCC
VCORE P1.2/UCA0RXD/UCA0SOMI/ACLK/TDI/TCLK
P1.1/UCA0CLK/SMCLK/TMS
RST/NMI/SBWTDIO
TEST/SBWTCK
P1.0/UCA0STE/MCLK/TCK
C
TCK
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
MSP430I2040TRHBQFN11T032-003
Socket:
Yamaichi
QFN11T032-003
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
O
TDO
JP5
1
2
3
<- SBW
<- JTAG
24
23
22
21
20
19
18
17
32
31
30
29
28
27
26
25
J4
SAM1029-08-ND25-32
P2.7
P2.6
P2.5
P2.4
P2.3
P2.2
P2.1
P2.0
P1.7
P1.6
P1.5
P1.4
O
I
M
C
SAM1029-08-ND17-2417-24
J3
MSP430: Target-Socket MSP-TS430RHB32A
for MSP430i2040
GND
1
2
3
PWR3
1.0
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3
2
1
JP3
100nF
C13 GND
AVSS
R3
330R
AVSS
int
1 JP1
2
10uF
C12
D1
1
2
GND
GND
GND
0R
C9
470nF
GND
GND
0R
R1
J5
Figure B-22. MSP-TS430RHB32A Target Socket Module, Schematic
MSP-TS430RHB32A
www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
J5
1
1
1
1
2
2
2
2
2
2
Rev.: 1.0
RoHS
R2
C14
R5
C8
Jumper JP2
Open to disconnect LED
MSP-TS430RHB32A
3
3
JP8
JP4
JP5
JP6
JP7
3
3
JP9
3
3
9
J2
16
D1
LED connected to P1.4
P1.4
D1
R3
JP2
1
C13
C12
R4 C9
VCC
JP3
JP1
1
SBW
JTAG
Curr. Meas.
JTAG
Jumper JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
1
2
GND
GND
Vcc
ext
int
3 2 1
14
Jumper JP1
Open to measure current
Connector J5
External power connector
Jumper JP3 to “ext”
R1
8
17
R14
R13
R12
R11
R10
R9
R8
R6
5
20
1
24
J1
1
J3
U1
25
30
32
Orient Pin 1 of MSP430 device
J4
Figure B-23. MSP-TS430RHB32A Target Socket Module, PCB
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Table B-12. MSP-TS430RHB32A Bill of Materials
Pos.
No. per
Board
Ref Des
Description
Digi-Key Part No.
Comment
1
PCB
1
76.9 x 67.6 mm
MSP-TS430RHB32A Rev. 1
2 layers, red solder mask
2
D1
1
green LED, DIODE0805
P516TR-ND
3
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
4
JP3, JP4,
JP5, JP6,
JP7, JP8,
JP9
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
(SBW)
5
R1, R4
2
0R, 0805
541-0.0ATR-ND
6
C8
1
2.2nF, CSMD0805
490-1628-2-ND
DNP
7
R6, R8, R9,
R10, R11,
R12, R13,
R14
8
10k, 0805
311-10KARTR-ND
DNP
8
C12
1
10uF, CSMD0805
445-1371-2-ND
9
R2
1
20k/0.1%, 0805
P20KDACT-ND
10
R5
1
47K, 0805
311-47KARTR-ND
11
C13, C14
2
100nF, CSMD0805
311-1245-2-ND
12
R3
1
330R, 0805
541-330ATR-ND
13
C9
1
470nF, CSMD0805
445-1357-2-ND
14
J1, J2, J3, J4
1
8-pin header, TH
SAM1029-08-ND
DNP: headers and
receptacles, enclosed with
kit.
Keep vias free of solder.
15
J1, J2, J3, J4
1
8-pin receptable, TH
SAM1213-08-ND
DNP: headers and
receptacles, enclosed with
kit.
Keep vias free of solder.
16
JTAG
1
14-pin connector, male, TH
HRP14H-ND
17
U1
1
Socket QFN11T032-003
Manuf.: Yamaichi
18
U1
1
MSP430i2041TRHB
DNP: enclosed with kit.
Is supplied by TI
19
J5
1
3-pin header, male, TH
20
Rubber stand 4
off
SAM1035-03-ND
Buerklin: 20H1724
SLAU278X – May 2009 – Revised February 2016
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apply to corners at bottom
side
Hardware
65
Vcc
int
ext
3
2
1
14
12
10
8
6
4
2
JTAG
VCC430
C2
12pF
DNP
13
11
9
7
5
3
1
C5
100nF
GND
RST/NMI
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
VCC
3
2
1
JP4
J1
TEST/SBWTCK
JTAG ->
SBW ->
P1.0
P2.7/XOUT
Q1 DNP
P2.6/XIN
R3 560R
R1
330R
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
P1.7/TDO 38
P1.6/TDI 37
P1.5/TMS 36
P1.4/TCK 35
34
P1.3
33
P1.2
32
P1.1
31
P1.0
30
P2.4
29
P2.3
28
P3.7
27
P3.6
26
P3.5
25
P3.4
24
P4.7
23
P4.6
22
P4.5
21
P4.4
20
P4.3
JP6
3
2 P1.7/TDO
1
3
2
1
JP8
3
2
1
J2
P2.2
3
2
1
JP9
DNP
GND
J3
DNP
R11 0R
R10 -
DNP
Ext_PWR
P1.4/TCK
10
8
6
4
2
BOOTST
9
7
5
3
1
REV:
1.3
GND
If external supply voltage:
remove R11 and add R10 (0 Ohm)
P1.5/TMS
RST/SBWTDIO
P1.1
TEST/SBWTCK
JP7
P1.6/TDI
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire":Set jumpers JP4 to JP9 to position 2-1
DNP GND
R5
47k C8
10nF
U1
TEST/SBWTCK P1.7/TDO
DVCC
P1.6/TDI
P2.5
P1.5/TMS
DVSS
P1.4/TCK
P2.7
P1.3
P2.6
P1.2
RST/SBWDAT
P1.1
P2.0
P1.0
P2.1
P2.4
P2.2
P2.3
P3.0
P3.7
P3.1
P3.6
P3.2
P3.5
P3.3
P3.4
AVSS
P4.7
AVCC
P4.6
P4.0 Socket:
P4.5
P4.1 Yamaichi
P4.4
P4.2 IC189-0382-037P4.3
MSP430F2274IDA
RST/SBWTDIO
TEST/SBWTCK1
2
VCC430
3
P2.5
4
GND
5
P2.7/XOUT
6
P2.6/XIN
RST/SBWTDIO7
8
P2.0
9
P2.1
10
P2.2
11
P3.0
12
P3.1
13
P3.2
14
P3.3
15
GND
16
VCC430
17
P4.0
18
P4.1
19
P4.2
JP5
3
TEST/SBWTCK 2
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
3
2
1
Sheet: 1/1
Copyright © 2009–2016, Texas Instruments Incorporated
JP1
2
1
JP2
C7
10uF/10V
GND
C1
12pF
DNP
D1
yellow
JP3
2
1
+
GND
MSP-TS430DA38:
MSP-TS430DA38
Target Socket Board for MSP430F2247IDA
TITLE:
Document Number:
Date: 6/18/2008 11:04:56 AM
SLAU278X – May 2009 – Revised February 2016
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www.ti.com
MSP-TS430DA38
B.12 MSP-TS430DA38
Figure B-24. MSP-TS430DA38 Target Socket Module, Schematic
MSP-TS430DA38
www.ti.com
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient pin 1 of MSP430 device
Jumper JP2
Open to measure current
Connector J3
External power connector
Jumper JP1 to "ext"
Figure B-25. MSP-TS430DA38 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430DA38
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Table B-13. MSP-TS430DA38 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
0
2.2nF, SMD0805
5
D1
1
green LED, SMD0603
6
J1, J2
Digi-Key Part No.
Comment
DNP
DNP
475-1056-2-ND
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
19-pin header, TH
SAM1029-19-ND
: Header
SAM1213-19-ND
: Receptacle
7
"J3, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9"
8
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on headers
JP1, JP4,JP5, JP6, JP7, JP8,
JP9; Pos 1-2
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: JP1 - JP9; Pos 1-2
9
68
0
Description
9
Jumper
15-38-1024-ND
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R1, R3
2
330 Ω, SMD0805
541-330ATR-ND
14
R10, R11
0
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC189-0382--037
17
PCB
1
67 x 66 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2274IDA
Hardware
DNP: Keep vias free of
solder
DNP: Keep vias free of
solder
DNP
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430QFN23x0
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B.13 MSP-TS430QFN23x0
Figure B-26. MSP-TS430QFN23x0 Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430QFN23x0
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-27. MSP-TS430QFN23x0 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be
populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is
supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
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Table B-14. MSP-TS430QFN23x0 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C3
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C4
1
100nF, SMD0805
478-3351-2-ND
4
C5
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
6
J1, J2, J3, J4
Description
0
Digi-Key Part No.
Comment
DNP
DNP: headers and
receptacles enclosed with
kit.Keep vias free of solder.
10-pin header, TH
SAM1034-10-ND
: Header
SAM1212-10-ND
: Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header JP1;
Pos 1-2.
8
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
HRP14H-ND
9
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R1
1
330 Ω, SMD0805
541-330ATR-ND
14
R2, R3
0
0 Ω, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: QFN-40B-0.5-01
Manuf.: Enplas
17
PCB
1
79 x 66 mm
2 layers
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F2370IRHA
DNP: Keep vias free of
solder
for example, 3M Bumpons
Part No. SJ-5302
SLAU278X – May 2009 – Revised February 2016
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DNP: Keep vias free of
solder
DNP
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
Hardware
71
MSP-TS430RSB40
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B.14 MSP-TS430RSB40
Figure B-28. MSP-TS430RSB40 Target Socket Module, Schematic
72
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MSP-TS430RSB40
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP3
Open to disconnect LED
D1
LED connected to P1.0
Figure B-29. MSP-TS430RSB40 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R2 or R3 need to be
populated. If the board is supplied internally, R3 (0 Ω) must be assembled. If the board is
supplied externally, R2 (0 Ω) must be assembled, and R3 must be removed.
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RSB40
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Table B-15. MSP-TS430RSB40 Bill of Materials
Pos.
Ref Des
No. Per
Board
Description
1
C1, C2
0
12pF, SMD0805
2
C3, C7, C10,
C12
3
10uF, 10V, SMD 0805
445-1371-1-ND
DNP C12
3
C4, C6, C8,
C11
3
100nF, SMD0805
311-1245-2-ND
DNP C11
4
C5
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
7
J1, J2, J3, J4
4
Digi-Key Part No.
Comment
DNP: C1, C2
P516TR-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
10-pin header, TH
: Header
: Receptacle
7.1
4
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
10-pin header, TH
: Header
: Receptacle
8
JP1, JP4,JP5,
JP6, JP7, JP8,
JP9, J5, JP10
9
3-pin header, male, TH
SAM1035-03-ND
Jumper: 1-2 on JP1, JP10; 2-3
on JP4-JP9
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
10
JTAG
1
14-pin connector, male, TH
HRP14H-ND
11
BOOTST
0
10-pin connector, male, TH
Enplas
12
U1
1
13
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) = 12.5pF
DNP: Q1. Keep vias free of
solder
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
15
74
DNP. Keep vias free of solder
QFN-40B-0.4_
ENPLAS_SOCKET
16
R1,R7
2
330R SMD0805
17
R2, R3, R5,
R6, R8, R9,
R10
3
0R SMD0805
18
R4
1
47k SMD0805
19
MSP430
2
MSP430F5132
20
Rubber stand
off
4
Hardware
DNP R2, R3, R5, R6
DNP: enclosed with kit. Is
supplied by TI
select appropriate; for example,
apply to corners at bottom side
Buerklin: 20H1724
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RHA40A
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B.15 MSP-TS430RHA40A
Figure B-30. MSP-TS430RHA40A Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RHA40A
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper JP2
Open to measure current
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
D1
LED connected to P1.0
Jumper JP3
Open to disconnect LED
Orient Pin 1 of MSP430 device
Figure B-31. MSP-TS430RHA40A Target Socket Module, PCB
76
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Table B-16. MSP-TS430RHA40A Bill of Materials
Position
Ref Des
No. per
Board
Description
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
2
C5
0
2.2nF, SMD0805
DNP C12
3
C3, C7
2
10uF, 10V, SMD0805 5
4
C4, C6
2
100nF, SMD0805
5
C9
1
470nF, SMD0805
6
D1
1
green LED, SMD0805
7
J1, J2, J3,
J4
Digi-Key Part No.
Comment
DNP C11
478-3351-2-ND
P516TR-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
4
10-pin header, TH
: Header
: Receptacle
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
7.1
4
10-pin header, TH
: Header
: Receptacle
8
J5, JP1,
JP4, JP5,
JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
Place jumper on 1-2 of JP4-JP9; Place
on 1-2 on JP1
9
JP2, JP3
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
9
Jumper
15-38-1024-ND
HRP14H-ND
10
see Pos 8 an 9
11
JTAG
1
14-pin connector, male,
TH
12
BOOTST
0
10-pin connector, male,
TH
DNP. Keep vias free of solder
13
U1
1
Socket: QFN-40B-0.5-01
Manuf.: Enplas
14
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
15
R1,R7
2
330R SMD0805
541-330ATR-ND
16
R2, R3, R5,
R6, R8, R9,
2
0 Ohm, SMD0805
541-000ATR-ND
17
R4
1
47k SMD0805
18
PCB
1
79 x 66 mm
19
Rubber
stand off
4
20
MSP430
2
DNP: Q1. Keep vias free of solder
DNP:R2, R3, R5, R6
2 layers
select appropriate; for
example, Buerklin:
20H1724
MSP430N5736IRHA
SLAU278X – May 2009 – Revised February 2016
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apply to corners at bottom side
DNP: enclosed with kit. Is supplied by TI
Hardware
77
ext
int
3
2
1
JP1
C7
10uF/10V
12pF
C2
560R
R3
12pF
C1
2
1
+
2
14
12
10
8
6
4
2
13
11
9
7
5
3
1
C8
10nF
TCK
TMS
TDI
TDO
GND
1
3
5
7
9
11
13
15
17
19
21
23
2
4
6
8
10
12
14
16
18
20
22
24
R5
47K
R4
0R
J1
RST/NMI
R12
0R
VCC
C3
100nF
C4
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28 P1.0
27
26
25
IC51-1387.KS-15186
P5.4
P5.3
P5.2
COM0
P2.0
P2.1
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
S5
P5.7
P5.6
P5.5
P5.0
P5.1
LCDCAP
LCDREF
P1.0
P1.1
P1.2
P1.3
1
3
5
7
9
11
13
15
17
19
21
23
10uF/10V
J3
J2
GND
2
4
6
8
10
12
14
16
18
20
22
24
Ext_PWR
BSL_TX
0R
R7 0R
R6
MSP-TS430DL48
ML10
10
8
6
4
2
BOOTST
9
7
5
3
1
BSL_RX
Vcc
ext
int
JP2
RST/NMI
TCK
REV:
1.3
Sheet: 1/1
Copyright © 2009–2016, Texas Instruments Incorporated
JTAG
ML14
J5
JP1Q
P1.0
XOUT
C5
100nF
Q1
XIN
1
JP1Q
J4
TDO/TDI
TDI/TCLK
TMS
TCK
RST/NMI
DVCC
DVSS
XIN
XOUT
AVSS
AVCC
VREF+
P6.0
P6.1
P6.2
P6.3
P6.4
P6.5
P6.6
P6.7
P1.7
P1.6
P1.5
P1.4
GND
GND
1
2
3
MSP-TS430DL48 Target Socket DL48
TITLE:
Document Number:
1
2
3
GND
D1
LED3
QUARZ3
Vcc
Q1, C1, C2
not assembled
GND
TDO 1
2
TDI
TMS 3
TCK 4
RST/NMI 5
6
GND 7
8
XIN
XOUT 9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
U1
+
Date: 11/14/2006 1:24:44 PM
SLAU278X – May 2009 – Revised February 2016
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www.ti.com
MSP-TS430DL48
B.16 MSP-TS430DL48
Figure B-32. MSP-TS430DL48 Target Socket Module, Schematic
MSP-TS430DL48
www.ti.com
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP2
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper J5
Open to measure current
Connector J3
External power connector
Jumper JP2 to "ext"
D1
LED connected to P1.0
Jumper J4
Open to disconnect LED
Orient pin 1 of MSP430 device
Figure B-33. MSP-TS430DL48 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430DL48
www.ti.com
Table B-17. MSP-TS430DL48 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C4, C7
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C3, C5
2
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
6
J1, J2
Digi-Key Part No.
Comment
DNP
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
24-pin header, TH
SAM1034-12-ND
: Header
SAM1212-12-ND
: Receptacle
7
J3, JP1, JP2
2
3-pin header, male, TH
SAM1035-03-ND
Place jumper on header JP1;
Pos 1-2. DNP: JP2
8
J4, J5
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
Jumper
15-38-1024-ND
Place on: JP1, J4, J5
HRP14H-ND
9
80
0
Description
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
12
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R4, R6, R7,
R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC51-1387 KS-15186
17
PCB
1
58 x 66 mm
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430F4270IDL
Hardware
DNP: Keep vias free of
solder
DNP: Keep vias free of
solder
DNP: R6, R7
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RGZ48B
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B.17 MSP-TS430RGZ48B
Figure B-34. MSP-TS430RGZ48B Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RGZ48B
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Figure B-35. MSP-TS430RGZ48B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
82
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Table B-18. MSP-TS430RGZ48B Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7, C12
3
10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14
4
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
478-1403-2-ND
7
D1
1
green LED, SMD0805
P516TR-ND
8
J1, J2, J3,
J4
0
12-pin header, TH
SAM1029-12-ND
(Header) SAM1213-12ND (Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
9
J5
1
3-pin header, male, TH
10
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
11
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
9
Jumper
15-38-1024-ND
See Pos. 10and Pos. 11
HRP14H-ND
12
Description
Digi-Key Part No.
Comment
311-1245-2-ND
13
JTAG
1
14-pin connector, male,
TH
14
BOOTST
0
10-pin connector, male,
TH
15
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
16
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
17
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
18
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
19
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
20
R5
1
47k Ω, SMD0805
541-47000ATR-ND
U1
1
Socket: QFN11T048008_A101121_RGZ48
Manuf.: Yamaichi
22
PCB
1
81 x 76 mm
2 layers
23
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
24
MSP430
2
MSP430F5342IRGZ
21
"DNP Keep vias free of solder"
SLAU278X – May 2009 – Revised February 2016
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DNP: R6, R8, R9, R10, R11,R12
DNP: enclosed with kit, supplied by TI
Hardware
83
Vcc
ext
int
J1
3
2
1
VCC
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
GND
TEST/SBWTCK1
TEST/SBWTCK
R7
0R
JP4
3
2
1
DNP
GND
EVQ11
JP5
3
2 PJ.0/TDO
1
DNP
DVSS 12
P4.6 11
P4.5 10
P4.4 9
P1.7 8
P1.6 7
P3.7 6
P3.6 5
P3.5 4
P3.4 3
P2.2 2
P2.1 1
DNP
C9
JP7
GND
9
7
5
3
1
JP8
GND
J2
Ext_PWR
3
2 PJ.3/TCK
1
100nF
C6
DVCC
C7
DNP
1uF/10V
GND
10
8
6
4
2
DNP
If external supply voltage:
remove R3 and add R2 (0 Ohm)
DNP
BOOTST
3
2 PJ.2/TMS
1
HFGND
RST/SBWTDIO
P2.0
TEST/SBWTCK1
P2.1
DNP
C8
DNP
JP6
SV2
3
2 PJ.1/TDI
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP4 to JP9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 1-2
SW1
C5
1.1nF
RST/SBWTDIO
R4
47k
HFXOUT
HFXIN
36
35
34
33
32
31
30
29
28
27
26
25
3
2
1
RST/NMI
JP3
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
JTAG ->
U1
36_DVSS
35_P4.6
34_P4.5
33_P4.4
32_P1.7
31_P1.6
30_P3.7
29_P3.6
28_P3.5
27_P3.4
26_P2.2
25_P2.1
Target Socket Board for MSP430FR58xx, FR59xx IRGZ
MSP-TS430RGZ48C
1.2
Copyright © 2009–2016, Texas Instruments Incorporated
SBW ->
C2
DNP
LFXIN
LFXOUT
SV1
1_P1.0
2_P1.1
3_P1.2
4_P3.0
5_P3.1
6_P3.2
7_P3.3
8_P4.7
9_P1.3
10_P1.4
11_P1.5
12_PJ.0_TDO
QUARZ5
Q2
2
1
C4
DNP
1
P1.0
2
P1.1
3
P1.2
4
P3.0
5
P3.1
6
P3.2
7
P3.3
8
P4.7
9
P1.3
10
P1.4
11
P1.5
PJ.0/TDO 12
12
11
10
9
8
7
6
5
4
3
2
1
JP1
C3
100nF
1
2
3
4
5
6
7
8
9
10
11
12
R8
0R
R9
0R
DVCC
AVCC
1uF/10V
SV4
Q1
LFGND QUARZ5
DNP
C1
DNP
P1.3
P1.2
P1.1
P1.0
0R
R6
0R
R5
2
1
JP2
GND
DVCC
connection by via
AVSS
JP11
JP10
JP9
R2
-
R3
0R
0R R12
DVSS
DNP
SW2
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
SV3
TP1TP2
48 AVCC
47 AVSS
46
45
44 AVSS
43
42
41 AVSS
40 P2.4
39 P2.3
38 P2.7
37 DVCC
48_AVCC
47_AVSS
46_LFXOUT
45_LFXIN
44_AVSS
43_HFXOUT
42_HFXIN
41_AVSS
40_P2.4
39_P2.3
38_P2.7
37_DVCC
13_PJ.1_TDI
14_PJ.2_TMS
15_PJ.3/TCK
16_P4.0
17_P4.1
18_P4.2
19_P4.3
20_P2.5
21_P2.6
22_TEST/SBWTCK
23_RST/SBWTDIO
24_P2.0
13
1 PJ.1/TDI
2 PJ.2/TMS
14
3 PJ.3/TCK
15
4 P4.0
16
5 P4.1
17
6 P4.2
18
7 P4.3
19
8 P2.5
20
9 P2.6
21
10 TEST/SBWTCK22
11 RST/SBWTDIO 23
12 P2.0
24
2
1
2
1
2
1
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MSP-TS430RGZ48C
B.18 MSP-TS430RGZ48C
Figure B-36. MSP-TS430RGZ48C Target Socket Module, Schematic
MSP-TS430RGZ48C
www.ti.com
Connector JTAG
For JTAG Tool
Jumper JP2
Analog/digital power
C5
JP8
JP4
RST/SBWTDIO
BOOTST
123
123
123
123
JP5
JP7 JP6
JP2 JP1
R4
DVCC
AVCC
123
2
1
SBW
int
Ext.
Pwr.
Vcc
123
3
Vcc
R2
TDO
R3
1
2
JTAG
ext
PWR
Jumper JP1
Open to measure current
10
1
2
TCK TMS TDI
J1
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
14
JTAG
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector BOOTST
For Bootloader Tool
JP3 R7
TEST/SBWTCK
20
25
GND
GND
J2
MSP-TS430RGZ48C
Rev. 1.2
RoHS
15
TP1
Clamshell
GND
QFN11T048-008 A101121
P1.3
45
R6
Q1
R9
R5
R8
C2
C1
C8
Q2
C7
C9
RESET
C6
SW1
R13
GND
R12
C4
C3
R14
40
TP2
Orient Pin 1 of MSP430 device
P1.1
P1.0
R1 D1
SW2
1
U1
JP10
35
LEDs connected to
P1.0, P1.1, P1.2 via
JP9, JP10, JP11
(only D1 assembled)
JP9
JP11
5
R10 D2
30
R11 D3
P1.2
10
Switch SW1
Device reset
Connector J2
External power connector
Jumper J1 to "ext"
Switch SW2
Connected to P1.3
HF ands LF oscillators with capacitors
and resistors to connect pinheads
Figure B-37. MSP-TS430RGZ48C Target Socket Module, PCB
NOTE: LFOSC and HFOSC pins are swapped at SV1.
42_HFXIN (pin 42) → SV1 (pin 7)
43_HFXOUT (pin 43) → SV1 (pin 6)
45_LFXIN (pin 45) → SV1 (pin 10)
46_LFXOUT (pin 46) → SV1 (pin 9)
SLAU278X – May 2009 – Revised February 2016
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Table B-19. MSP-TS430RGZ48C Bill of Materials
Pos
1
Ref Des
SV1, SV2, SV3,
SV4
Number
Per
Board
4
Description
Digi-Key Part Number
12-pin header, TH
Comment
DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
SAM1029-12-ND
: Header
: Receptacle
1.1
SV1, SV2, SV3,
SV4
4
12-pin receptable, TH
DNP: headers and receptacles enclosed with kit.
Keep vias free of solder.
: Header
86
SAM1213-12-ND
: Receptacle
2
JP1, JP2, JP9
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP
4
J1, JP3, JP4, JP5,
JP6, JP7, JP8
7
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
5
J2
1
3-pin header, male, TH
SAM1035-03-ND
6
JP1, JP2, JP9, J1,
JP3, JP4, JP5, JP6,
JP7, JP8
10
Jumper
15-38-1024-ND
7
R2, R3, R5, R6, R8,
R9, R10, R11, R14
9
DNP, 0805
8
R12, R13, R7
3
0R, 0805
541-000ATR-ND
9
C5
1
1.1nF, CSMD0805
490-1623-2-ND
10
C3, C7
2
1uF, 10V, CSMD0805
490-1702-2-ND
11
R4
1
47k, 0805
541-47000ATR-ND
12
C4, C6
2
100nF, CSMD0805
311-1245-2-ND
13
R1
1
330R, 0805
541-330ATR-ND
14
C1, C2, C8, C9
4
DNP, CSMD0805
15
SW1, SW2
2
EVQ-11L05R
P8079STB-ND
DNP
16
BOOTST
1
10-pin connector, male, TH
HRP10H-ND
DNP, keep vias free of solder
17
JTAG
1
14-pin connector, male, TH
HRP14H-ND
18
Q1
1
DNP: MS3V-TR1 (32768kHz,
20ppm, 12.5pF)
depends on application
Micro Crystal, DNP, enclosed in kit, keep vias free of
solder
19
Q2
1
DNP, Christal
depends on application
DNP, keep vias free of solder
20
U1
1
Socket: QFN11T048-008
A101121-001
Manuf.: Yamaichi
20.1
U1
1
MSP430FR5969IRGZ
DNP: enclosed with kit. Is supplied by TI.
21
D1
1
green LED, DIODE0805
22
D3
1
red (DNP), DIODE0805
DNP
23
D2
1
yellow (DNP), DIODE0805
DNP
24
TP1, TP2
2
Testpoint
25
Rubber stand off
4
26
PCB
1
Hardware
79.6 x 91.0 mm
Place on: JP1, JP2, JP9, J1, JP3, JP4, JP5, JP6,
JP7, JP8
DNP
DNP
P516TR-ND
DNP, keep pads free of solder
Buerklin: 20H1724
apply to corners at bottom side
MSP-TS430RGZ48C
Rev. 1.2
2 layers, black solder mask
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PM64
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B.19 MSP-TS430PM64
12pF
C2
not assembled
R9
12pF
C1
R3
R4
2
14
12
10
8
6
4
2
1
13
11
9
7
5
3
1
J1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
100nF
1
0R
R2
DVCC
2
3
4
5
6
7
XIN
XOUT
10
11
12
13
14
15
16
VCC
TCK
TMS
TDI
TDO
C8
R5
U2
MSP64PM
Socket:
Yamaichi
IC51-0644-807
RST/NMI
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
C3
12pF
not assembled
C4
12pF
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
J3
10
8
6
4
2
BOOTST
9
7
5
3
1
ML10
not assembled
J5
TITLE:
MSP-TS430PM64
Document Number:
PWR3
GND
1
2
3
For BSL usage add:
R11 0R
R6 R7 R13 R14
MSP430F14x : 0 0 open open
MSP430F41x : open open 0 0
If external supply voltage:
remove R11 and add R10 (0 Ohm)
R10 -
REV:
1.2
Sheet: 1/1
MSP-TS430PM64 Target Socket PM64
for F14x and F41x
FE16-1-3
GND
Date: 3/14/2006 10:46:30 AM
Copyright © 2009–2016, Texas Instruments Incorporated
10nF
47K
87
Hardware
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JTAG
ML14
J6
JP1Q
Open J6 if LCD
is connected
560R
2
remove R8 and add R9 (0 Ohm)
If external supply voltage:
GND
C5
FE16-1-1
0R
0R
0R
R14
0R
R7
R13
R6
FE16-1-4
XTCLK
J2
C7
+
R1 0R
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
AVCC
DVSS
AVSS
61
60
59
RST
TCK
TMS
TDI
TDO
53
52
51
50
49
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
10uF/10V
10uF/6,3V
+
C6
JP1Q
not assembled
J7
1
J4
FE16-1-2
-
LFXTCLK
0R
R12
Q1
-
R8
reserved for
future
enhancement
LED3
D1
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-38. MSP-TS430PM64 Target Socket Module, Schematic
MSP-TS430PM64
www.ti.com
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
D1
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Jumper J7
Open to measure current
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Figure B-39. MSP-TS430PM64 Target Socket Module, PCB
88
Hardware
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PM64
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Table B-20. MSP-TS430PM64 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1.1
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
0
Description
Digi-Key Part No.
Comment
DNP: C6
DNP: Headers and receptacles
enclosed with kit.Keep vias free
of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
Place on: J6, J7
11
2
Jumper
15-38-1024-ND
12
JTAG
1
14-pin connector, male, TH
HRP14H-ND
13
BOOTST
0
10-pin connector, male, TH
14
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
R3
1
330 Ω, SMD0805
541-330ATR-ND
16
R1, R2, R4,
R6, R7, R8,
R9, R10, R11,
R12, R13, R14
3
0 Ω, SMD0805
541-000ATR-ND
17
R5
1
47k Ω, SMD0805
541-47000ATR-ND
18
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
19
PCB
1
78 x 75 mm
2 layers
20
Rubber
standoff
4
21
MSP430
22
DNP: Keep vias free of solder
select appropriate
MSP430F2619IPM
MSP430F417IPM
SLAU278X – May 2009 – Revised February 2016
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DNP: Keep vias free of solder
DNP: R4, R6, R7, R9, R10,
R11, R12, R13, R14
Apply to corners at bottom side
DNP: Enclosed with kit supplied
by TI
Hardware
89
Vcc
3
2
ext
1
int
JP3
2
1
JP2
14
12
10
8
6
4
2
R2
0R
JTAG
C5
100nF
13
11
9
7
5
3
1
DNP
GND
J4
R6
330R
3
TEST/SBWTCK 2
A
1
JP5
RST/NMI
VCC
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
3
2
1
JP4
AVCC
AVSS
Socket:
Yamaichi
IC51-0644-807
DNP GND
R4
47k C3
2.2nF
VCC430
RST/SBWTDIO
B
P1.0
P1.1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
3
2 P7.0/TDO
1
C
JP6
J3
3
2
1
JP7
P7.1/TDI
D
DNP
R13
0R
TEST/SBWTCK
A
ADD LCD-CAP!
P5.1
3
2 P7.2/TMS
1 E
JP8
DNP
9
7
5
3
1
DNP
R11
0R
DNP
RST/SBWTDIO
B
DNP
R10
0R
PWR3
GND
1
2
3
3
2 P7.3/TCK
1 F
JP9
10
8
6
4
2
R14
0R BOOTST
GND
J5
Sheet: 1/1
REV:
1.1
If supplied by interface: populate R11 (0R), remove R10
If supplied locally: populate R10 (0R), remove R11
MSP-TS430PM64A
MSP-TS430PM64A Target Socket
for F4152
TITLE:
Document Number:
Date: 3/29/2011 3:07:02 PM
Copyright © 2009–2016, Texas Instruments Incorporated
JTAG ->
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
SBW ->
AVCC
J1
VCC430
AVSS
C4
100nF
0R
R7
XIN
Q1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
GND
J2
A
B
F
E
D
C
VCC430
C6
10uF/6.3V
R1 0R
DNP
12pF
C2
DNP
R5
0R
XOUT
DNP
R3
P5.1
330R
JP1
Open JP1 if LCD
is connected
DNP
12pF
C1
XTLGND
GND
D1
2
1
+
GND
1
2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
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MSP-TS430PM64A
B.20 MSP-TS430PM64A
Figure B-40. MSP-TS430PM64A Target Socket Module, Schematic
MSP-TS430PM64A
www.ti.com
Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector BOOTST
For Bootloader Tool
Jumpers JP4 to JP9
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP2
Open to measure current
Orient Pin 1 of MSP430 device
Jumper JP1
Open to disconnect LED
D1
LED connected to P5.1
Figure B-41. MSP-TS430PM64A Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PM64A
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Table B-21. MSP-TS430PM64A Bill of Materials
Pos.
Ref Des
No. per Board
1
C1, C2,
0
12pF, SMD0805
DNP
2
C3
0
2.2nF, SMD0805
DNP
3
C6,
1
10uF, 10V, Tantal Size B
511-1463-2-ND
4
C4, C5
2
100nF, SMD0805
478-3351-2-ND
5
D1
1
green LED, SMD0805
P516TR-ND
6
J1, J2, J3, J4
Digi-Key Part No.
Comment
DNP: Headers and receptacles
enclosed with kit. Keep vias
free of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
7
J5, JP3, JP4,
JP5, JP6, JP7,
JP8, JP9
8
3-pin header, male, TH
SAM1035-03-ND
8
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
2
Jumper
15-38-1024-ND
Place on: J6, J7
HRP14H-ND
9
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
13
R3, R6
2
330 Ω, SMD0805
541-330ATR-ND
14
R1, R2, R5,
R7, R9, R10,
R11, R13, R14
2
0 Ω, SMD0805
541-000ATR-ND
15
R4
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC51-0644-807
Manuf.: Yamaichi
17
PCB
1
78 x 75 mm
4 layers
18
Rubber stand
off
4
19
MSP430
2
12
92
0
Description
Hardware
DNP: Keep vias free of solder
DNP: R5, R7, R9, R10, R11,
R13, R14
select appropriate
Apply to corners at bottom side
DNP: Enclosed with kit
supplied by TI
MSP430F4152IPM
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PM64D
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B.21 MSP-TS430PM64D
6
A
Vcc
int
B
ext
3
2
1
JP1
2
1
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
to measure supply current
JP2
XIN
C
D
3
2
1
47K
JP9 R4
TEST/SBWTCK
VCC430
DNP
EVQ11
E
RST/SBWTDIO
SW1
3
2
1
JP8
P1.7/TDO
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
F
3
2
1
JP7
3
2
1
JP6
P1.6/TDI
P1.1
P1.0
9
J3
BSLRX 3
BSLTX 1
5
TEST/SBWTCK7
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
G
3
2
1
JP5
VCC
P1.5/TMS
Ext_PWR
J5
P1.4/TCK
BSL
DNP R10 0R
10
8
DNP R11 0R
6
4 RST/SBWTDIO
2
BSL Interface
4-wire JTAG: Set jumpers J4 to J9 to position 2-3
2-wire "SpyBiWire": Set jumpers JP4 to JP9 to position 2-1
JTAG-Mode selection:
P6.0/L16
P6.1/L17
P6.2/L18
P6.3/L19
P6.4/L20
P6.5/L21
P6.6/L22
P6.7/L23
P2.0/L24
P2.1/L25
P2.2/L26
P2.3/L27
P2.4/L28
P2.5/L29
P2.6/L30
P2.7/L31
File: MSP-TS430PM64D
Datum:9/3/2014 3:08:18 PM
G
H
H
Rev.: 1.0
Target Socket Board for MSP430FR413xIPM and MSP430FR203xIPM
Titel: MSP-TS430PM64D
MSP430FR413xIPM / MSP430FR203xIPM
Socket: Yamaichi IC51-0644-807
F
1
2
3
RST/NMI
3
2
1
TCK
TMS
TDI
TDO/SBWTDIO
P1.2
P1.1
P1.0
P1.3
SBW ->JP10
JTAG ->
JP3
JP4
U1
P4.7/R13
P4.6/R23
P4.5/R33
P4.4/LCDC2
P4.3/LCDC1
P4.2/XOUT
P4.1/XIN
DVSS
DVCC
RST/NMI/SBWTDIO
TEST/SBWTCK1
P4.0/TA1.1
P8.3/TA1.2
P8.2/TA1CLK
P8.1/A1CLK/A9
P8.0/SMCLK/A8
E
I
Seite 1/1
I
A3
6
5
4
3
2
1
Copyright © 2009–2016, Texas Instruments Incorporated
SW2
C4
EVQ11
100nF
DNP
R1
330R
D1
LED_Green
R5
R6
D2 DNP 330R DNP
LED_Green
P4.6
P4.7
1
1
P4.7
2
2
P4.6
3
3
P4.5
4
4
P4.4
5
5
P4.3
DNP
6
XOUT 6
R3 0R
DNP
7
7
XIN
R2
0R
8
8
GND
9 VCC430
9
10
10
RST/SBWTDIO
11
11
TEST/SBWTCK
12
12
13
13
14
14
15
15
16
16
D
J4
GND
D3 DNP 330R DNP
LED_Green
XOUT
C6
P4.5
C7
C9
C8
J1
Disconnect JP3 and
JP4 before BSL use.
93
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C3
DNP
100nF
P4.4
P4.3
2
1
2
1
10uF/10V
12pF C2
TP1 TP2
12pF C1
DNP
100nF
100nF
DNP
100nF
DNP
C
J2
5
4
B
25
26
27
28
29
30
31
32
Q1
QUARZ5
C5
1.1nF
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P7.0/L0
P7.1/L1
P7.2/L2
P7.3/L3
P7.4/L4
P7.5/L5
P7.6/L6
P7.7/L7
P3.0/L8
P3.1/L9
P3.2/L10
P3.3/L11
P3.4/L12
P3.5/L13
P3.6/L14
P3.7/L15
P1.7/TA0.1/TDO/A7
P1.6/TA0.2/TDI/TCLK/A6
P1.5/TA0CLK/TMS/A5
P1.4/MCLK/TCK/A4
P1.3/UCA0STE/A3
P1.2/UCA0CLK/A2
P1.1/UCA0RXD/UCA0SOMI/A1
P1.0/UCA0TXD/UCA0SIMO/A0
P5.7/L39
P5.6/L38
P5.5/L37
P5.4/L36
P5.3/UCB0SOMI/UCB0SCL/L35
P5.2/UCB0SIMO/UCB0SDA/L34
P5.1/UCB0CLK/L33
P5.0/UCB0STE/L32
P1.7/TDO 17
P1.6/TDI 18
P1.5/TMS 19
P1.4/TCK 20
21
P1.3
22
P1.2
23
P1.1
24
P1.0
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
3
2
1
A
GND
Figure B-42. MSP-TS430PM64D Target Socket Module, Schematic
MSP-TS430PM64D
www.ti.com
Connector JTAG
For JTAG Tool
32
30
1
1
R11
R1 D1
JP4
R5 D2
R6 D3
20
P1.0
P1.1
P1.2
17
Switch SW2
Connected to P1.3
J1
SW2
C4
C3
Clamshell
35
33
U1
P1.3
10
GND
GND
C2
R3
Switch SW1
Device reset
RESET
45
C8
C9
SW1
R2
C1
5
Connector J5
External power connector
Jumper JP1 to "ext"
R4 C5
Q1
VCC
40
J5
MSP-TS430PM64D
Rev. 1.0
RoHS
1
2
3
1
2
3
2
JP5
3
1
2
3
1
25
JP3
16
Curr. Meas.
JP2
GND
Disconnect JP3 and
JP4 before BSL use!
JP6
JP7
JP8
J2
TP1
Jumper JP2
Open to measure current
2
3
SBW->
JTAG->
3
ext
VCC
int
2
R10
1
2
BSL
10
1
2
JP10
JP9
3
2
1
JP1
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
14
JTAG
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector BOOTST
For Bootloader Tool
C7
C6
48
1
J3
IC51-0644-807
TP2
49
55
60
64
GND
Orient Pin 1 of
MSP430 device
J4
Figure B-43. MSP-TS430PM64D Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
94
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MSP-TS430PM64D
www.ti.com
Table B-22. MSP-TS430PM64D Bill of Materials
Pos.
No. per
Board
Ref Des
Description
Digi-Key Part No.
Comment
1
PCB
1
90x96 mm
MSP-TS430PM64D Rev. 1.0
2 layers, 90x96mm, white solder
mask
2
BSL
1
10-pin connector, male, TH
HRP10H-ND
DNP, keep vias free of solder
3
D1
1
Green LED, HSMG-C170,
DIODE0805
516-1434-1-ND
Avago, Farnell 5790852
4
D2, D3
2
LED, DIODE0805
5
JP2, JP3,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
6
JP1, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 (JTAG)
7
R1
1
330R, 0805
541-330ATR-ND
8
R5, R6
2
330R, 0805
541-330ATR-ND
DNP
9
R2, R3,
R10, R11
4
0R, 0805
541-0.0ATR-ND
DNP
10
R4
1
47K, 0805
311-47KARTR-ND
11
C1, C2
2
12pF, CSMD0805
709-1169-2-ND
12
C3
1
10uF/10V, CSMD0805
445-1371-2-ND
13
C4
1
100nF, CSMD0805
311-1245-2-ND
14
C6, C7,
C8, C9
4
100nF, CSMD0805
311-1245-2-ND
15
C5
1
1.1nF, CSMD0805
490-1623-2-ND
16
J1, J2, J3,
J4
1
16-pin header, TH
SAM1029-16-ND
DNP: headers and receptacles,
enclosed with kit. Keep vias free
of solder.
17
J1, J2, J3,
J4
1
16-pin receptable, TH
SAM1213-16-ND
DNP: headers and receptacles,
enclosed with kit. Keep vias free
of solder.
18
JTAG
1
14-pin connector, male, TH
HRP14H-ND
19
U1
1
Socket IC51-0644-807
Manuf.: Yamaichi
20
U1
2
MSP430FR4133IPM
DNP: enclosed with kit. Is
supplied by TI.
21
J5
1
3-pin header, male, TH
22
Q1
1
Microcrystal 32768Hz, MS3V-T1R
(32.768kHz, 20ppm, 12.5pF)
23
SW1, SW2 2
24
Rubber
stand off
Panasonic EVQ11
4
DNP
DNP
SAM1035-03-ND
P8079STB-ND
DNP, Lacon: 1251459
Buerklin: 20H1724
apply to corners at bottom side
SLAU278X – May 2009 – Revised February 2016
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Hardware
95
6
Vcc
ext
int
J1
A
3
2
1
2
1
JTAG
13
11
9
7
5
3
1
B
STE
RST/NMI
JP3
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
SBW ->
JTAG ->
GND
TEST/SBWTCK1
14
RXD/SIMO
TXD/SOMI/SDA12
SPICLK/SCL 10
8
6
4
2
VCC
DVCC
AVCC
C
TEST/SBWTCK
JP4
3
2
1
47k
R4
D
DNP
EVQ11
JP5
3
2 PJ.0/TDO
1
JP6
E
3
2 PJ.1/TDI
1
Jumpers JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode.
Close 2-3 to debug in 4-wire JTAG mode.
SW1
1.1nF
C5
RST/SBWTDIO
JP7
3
2 PJ.2/TMS
1
JP8
F
G
P2.0
C11
100nF
GND
2
1
I2C
2
1
H
SPICLK/SCL1
TEST/SBWTCK
9
7
5
3
RXD/SIMO1
1
TXD/SOMI/SDA1
P1.7
P2.1
GND
DVCC
UART
R15
10k
JP16
R7
10k
1
2
3
BSL Tool Select:
Open = BSL Connector
Closed = JTAG Connector
JP13
SPICLK/SCL
JP15
JP14
RXD/SIMO
J5
P1.6
TXD/SOMI/SDA
48
47
46
45
P1.0 44
P1.1 43
P1.2 42
P1.3 41
DVCC 40
DVSS 39
38
37
36
35
34
33
P2.0
LFGND
connection by via
3
2 PJ.3/TCK
1
DNP
C2
DNP
DNP
C1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
Socket:
Yamaichi C51-0644-807
BSL
Rev.: 1.0
I
GND
J2
DNP
Ext_PWR
STE
Page 1/1
I
A3
If external supply voltage:
remove R3 and add R2 (0 Ohm)
RST/SBWTDIO
10
8
6
4
2
3
2
1
Title: MSP-TS430PM64F
Target Socket Board for MSP430FR697x/687x devices
H
File: MSP-TS430PM64F
Date: 10/20/2014 4:38:53 PM
G
R2
0R
R3
0R
2
1
DNP
DNP
1
2
SAM1129-16-ND
JP1
GND
LFXIN
LFXOUT
QUARZ5
Q1
P9.7/A15/C15
P9.6/A14/C14
P9.5/A13/C13
P9.4/A12/C12
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREFP1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+
P1.2/TA1.1/TA0CLK/COUT/A2/C2
P1.3/TA1.2/A3/C3
DVCC2
DVSS2
P7.4/SMCLK/S11
P7.3/TA0.2/S12
P7.2/TA0.1/S13
P7.1/TA0.0/S14
P7.0/TA0CLK/S15
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK/S16
MSP430FR697XPM/RGC
F
6
5
4
3
2
1
Copyright © 2009–2016, Texas Instruments Incorporated
C4
SAM1129-16-ND
SAM1129-16-ND
E
JP18
1
2
1
2
JP17
C3
D
R6
0R
R5
0R
100nF
HFXIN
HFXOUT
AVSS
AVCC
1uF/10V
DNP
DNP
AVSS
C9
DNP
Q2
HFGND QUARZ5
DNP
C8
DNP
U1
J6
P4.3/UCA0SOMI/UCA0RXD/UCB1STE/S4
P1.4/UCB0CLK/UCA0STE/TA1.0/S3
P1.5/UCB0STE/UCA0CLK/TA0.0/S2
P1.6/UCB0SIMO/UCB0SDA/TA0.1/S1
P1.7/UCB0SOMI/UCB0SCL/TA0.2/S0
R33/LCDCAP
P6.0/R23
P6.1/R13/LCDREF
P6.2/COUT/R03
P6.3/COM0
P6.4/TB0.0/COM1/S30
P6.5/TB0.1/COM2/S29
P6.6/TB0.2/COM3/S28
P3.0/UCB1CLK/TA3.2/S27
P3.1/UCB1SIMO/UCB1SDA/TA3.3/S26
P3.2/UCB1SOMI/UCB1SCL/TA3.4/S25
C10
DVCC
1
1
2
2
3
3
4 P1.6
4
5 SPICLK/SCL15
6 LCDCAP
6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
LCDCAP
GND
100nF
C15
4u7
C
AVSS
C6
J3
100nF
GND
C7
P1.3
P1.2
P1.1
P1.0
DNP
GND
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
DVCC
DVSS
0R
R8
0R
R9
DVCC
1uF/10V
DVCC
JP2
GND
AVSS
DVSS
JP11
JP10
JP9
B
SAM1129-16-ND
5
0R R12
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
DNP
SW2
4
3
2
1
A
J4
TP1TP2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK/S5
DVSS1
DVCC3
DVCC1
DVSS3
TEST/SBWTCK
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S6
RST/NMI/SBWTDIO
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1P4.6/UCB1SIMO/UCB1SDA/TA1.1/S7
P4.5/UCB1CLK/TA1.0/S8
PJ.1/TDI/TCLK/MCLK/SRSCG0
P4.4/UCB1STE/TA1CLK/S9
PJ.2/TMS/ACLK/SROSCOFF
P5.7/UCA1STE/TB0CLK/S10
PJ.3/TCK/COUT/SRCPUOFF
AVSS3
P3.3/TA1.1/TB0CLK/S24
PJ.6/HFXIN
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S23
PJ.7/HFXOUT
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S22
AVSS2
P3.6/UCA1CLK/TB0.2/S21
PJ.5/LFXOUT
P3.7/UCA1STE/TB0.3/S20
PJ.4/LFXIN
P2.3/UCA0STE/TB0OUTH/S19
AVSS1
P2.2/UCA0CLK/TB0.4/RTCCLK/S18
AVCC1
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0/S17
17 DVSS
17
18 DVCC
18
19TEST/SBWTCK 19
20RST/SBWTDIO 20
21
21PJ.0/TDO
22PJ.1/TDI
22
23PJ.2/TMS
23
24PJ.3/TCK
24
25
25
26
26
27
27
28
28
29
29
30
30
31
31
32RXD/SIMO1
32
2
1
2
1
2
1
SLAU278X – May 2009 – Revised February 2016
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Hardware
96
www.ti.com
MSP-TS430PM64F
B.22 MSP-TS430PM64F
Figure B-44. MSP-TS430PM64F Target Socket Module, Schematic
MSP-TS430PM64F
www.ti.com
BSL Tool Select
Jumper JP13 to JP15
Open = BSL Connector
Close = JTAG Connector
Connector BSL
For Bootloader
BSL Interface Select
Jumper J16
2
Close 1-2 for I C
Close 2-3 for UART
10
Connector JTAG
For JTAG Tool
Close JP17 and JP18
to enable BSL pullups
14
1
2
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
1
2
R15
Connector J2
External power connector
Jumper J1 to “ext”
R7
30
20
Switch SW1
Device reset
J4
10 15
Clamshell
5
Orient Pin 1 of MSP430 device
1 J3
HF and LF oscillators with capacitors
and resistors to connect pinheads
IC51-0644-807
D1 R1
D2R10
D3 R11
45
40
C11
Switch SW2
Connected to P1.3
25
U1
35
J5
Jumper JP1, JP2
Open to measure
digital or analog current
LEDs connected to
P1.0, P1.1, P1.2 from
JP9, JP10, JP11
(only D1 assembled)
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
50
55
60
J6
This target board supports UART or I2C BSL configuration. To select the configuration to use, set the
jumpers as shown in the following table.
Jumper Configuration
UART BSL Configuration
2
I C BSL Configuration
JP17 and JP18
Open
Close
JP16
Close 2-3 (UART)
Close 1-2 (I2C)
Figure B-45. MSP-TS430PM64F Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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Hardware
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MSP-TS430PM64F
www.ti.com
Table B-23. MSP-TS430PM64F Bill of Materials (BOM)
Ref Des
Number
per
Board
1
PCB
1
90.0 x 92.5 mm
MSP-TS430PM64F Rev. 1.0
2 layers, purple solder mask
2
JP1, JP2, JP9,
JP13, JP14, JP15,
6
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP17, JP18
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header's pin1 only
4
JP10, JP11
2
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
5
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
6
JP3, JP4, JP5, JP6,
JP7, JP8, JP16
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
7
J2
1
3-pin header, male, TH
SAM1035-03-ND
8
R2, R5, R6, R8, R9
5
0R, 0805
541-0.0ATR-ND
Pos.
Description
DigiKey Part Number
Comment
DNP
9
R3, R12, R13
3
0R, 0805
541-0.0ATR-ND
10
C5
1
1.1nF, CSMD0805
490-1623-2-ND
11
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
12
C15
1
4u7, CSMD0805
445-1370-1-ND
13
R7, R15
1
10k, 0805
541-10KATR-ND
14
R4
1
47k, 0805
541-47KATR-ND
15
C4, C6, C10, C11
4
100nF, CSMD0805
490-1666-1-ND
16
R1
1
330R, 0805
541-330ATR-ND
17
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
18
R14
1
47k, 0805
541-47KATR-ND
DNP
19
C1, C2, C8, C9
4
DNP, CSMD0805
20
SW2
1
EVQ-11L05R
P8079STB-ND
DNP, Lacon: 1251459
21
SW1
1
EVQ-11L05R
P8079STB-ND
DNP, Lacon: 1251459
22
J3, J4, J5, J6
4
16-pin header, TH
SAM1029-16-ND
DNP: headers enclosed with kit.
Keep vias free of solder.
23
J3, J4, J5, J6
4
16-pin receptacle, TH
SAM1213-16-ND
DNP: receptacles enclosed with kit.
Keep vias free of solder.
24
TP1, TP2
2
Testpoint
25
BSL
1
10-pin connector, male, TH
HRP10H-ND
26
JTAG
1
14-pin connector, male, TH
HRP14H-ND
27
U1
1
Socket:IC51-0644-807
Manuf. Yamaichi
28
U1
2
MSP430FR6972IPMR
DNP: enclosed with kit.
Is supplied by TI.
29
Q1
1
DNP: MS3V-TR1
(32,768kHz/ 20ppm/12,5pF)
depends on application
Micro Crystal, DNP, enclosed in kit,
keep vias free of solder
30
Q2
1
DNP, Crystal
depends on application
DNP, keep vias free of solder
516-1434-1-ND
Avago, Farnell 5790852
31
D1
1
green LED, HSMG-C170
DIODE0805
32
D3
1
red (DNP), DIODE0805
33
D2
1
yellow (DNP), DIODE0805
34
Rubber stand off
4
98
Hardware
DNP
DNP
DNP, keep pads free of solder
DNP
DNP
Buerklin: 20H1724
apply to corners at bottom side
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430RGC64B
www.ti.com
B.23 MSP-TS430RGC64B
Figure B-46. MSP-TS430RGC64B Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
Submit Documentation Feedback
Copyright © 2009–2016, Texas Instruments Incorporated
Hardware
99
MSP-TS430RGC64B
www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
If the system should
be supplied from LDOI (J6),
close JP4 and set JP3 to "ext"
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-47. MSP-TS430RGC64B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R12 (0 Ω) must be assembled, and R11 must be removed.
100 Hardware
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Table B-24. MSP-TS430RGC64B Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7, C10
3
10uF, 6.3V, SMD0805
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3, J4
0
16-pin header, TH
SAM1029-16-ND (Header)
SAM1213-16-ND
(Receptacle)
DNP: Headers and receptacles enclosed
with kit. Keep vias free of solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
14
Description
Digi-Key Part No.
311-1245-2-ND
478-1403-2-ND
15
JTAG
1
14-pin connector, male, TH HRP14H-ND
16
BOOTST
0
10-pin connector, male, TH
"DNP Keep vias free of solder"
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
20
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
21
R1, R2, R4,
R6, R8,
R9,R10, R11,
R12
3
0 Ohm, SMD0805
541-000ATR-ND
22
R5
1
47k Ω, SMD0805
541-47000ATR-ND
U1
1
Socket: QFN11T064-006N-HSP
24
PCB
1
85 x 76 mm
25
Adhesive
plastic feet
4
Approximately 6mm width,
2mm height
26
D3,D4
27
MSP430
2
MSP430F5310 RGC
23
Comment
DNP: Q1 Keep vias free of solder
DNP: Q2 Keep vias free of solder
DNP: R6, R8, R9, R10, R11,R12
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons
Part No. SJ-5302
SLAU278X – May 2009 – Revised February 2016
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Apply to corners at bottom side
DNP: enclosed with kit, supplied by TI
Hardware
101
MSP-TS430RGC64C
www.ti.com
B.24 MSP-TS430RGC64C
The MSP-TS430RGC64C target board has been designed with the option to operate with the target
device DVIO input voltage supplied via header J6 (see Figure B-48). This development platform does not
supply the 1.8-V DVIO rail on board and it MUST be provided by external power supply for proper device
operation. For correct JTAG connection, programming, and debug operation, it is important to follow this
procedure:
1. Make sure that the VCC and DVIO voltage supplies are OFF and that the power rails are fully
discharged to 0 V.
2. Enable the 1.8-V external DVIO power supply.
3. Enable the 1.8-V to 3.6-V VCC power supply (alternatively, this supply can be provided from the MSPFET430UIF JTAG debugger interface).
4. Connect the MSP-FET430UIF JTAG connector to the target board.
5. Start the debug session using IAR or CCS IDE.
For more information on debugging the MSP4and MSP430F525x, see the device-specific data sheets
(MSP430F522x: SLAS718; MSP430F525x: SLAS903) and Designing with MSP430F522x and
MSP430F521x Devices (SLAA558).
For debugging of devices (MSP430F524x and MSP430F523x) without use of the DVIO power domain,
short JP4 with the jumper.
102
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13
11
9
7
5
3
1
RST/NMI
GND
TCK
TMS
TDI
TDO
TCK
2
3
1
2
3
JP8
4
tbd
C4
5
S.G.
9
7
5
3
1
J6
1
2
3
6
J5
0R
DVCC
1
2
Size:
0R
1.1
MSP430
Tools
TI Friesing
Revision:
Mentor Pads Logic V9
6
R11
PINHEAD_1X2
JP4
PINHEAD_1X3
GND
GND
BSL
CN-ML10
0 1
8
6
4
2
BOOTST
C16
GND
C15
4.7uF
1
MSP-TS430RGC64C
100nF
GND
Comment:
PINHEAD_1X3
3
2
1
DVIO Power Circle
P1.2/TA0.1
P1.1/TA0.0
TEST/SBWTCK
GND
Name:
SHORTCUT2
J3
12/14/10
Date:
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
tbd C3 XTLGND2
JP9
JP10
1
1
<-- SBW
2
2
I
O
3
3
<-- JTAG
TDI
TDO
PINHEAD_1X3 PINHEAD_1X3
GND
Design:
of
Title of Schematic
1
Appr.:
Page:
Drawing#:
5
MSP-TS430RGC64C.sch
Rev.:
File:
R12
PINHEAD_1X3
THERMAL_8
JP5
JP6
JP7
1
1
1
TDO
2
2
2
RSTDVCC_SBWTDIO
C
M
3
3
3
TCK
TMS
RST/NMI
PINHEAD_1X3
PINHEAD_1X3
PINHEAD_1X3
Q2
4
A
B
C
D
Copyright © 2009–2016, Texas Instruments Incorporated
DVCC
QUARZ_4PIN
THERMAL_7
R7
330R
TEST/SBWTCK
THERMAL_6
R9
0R
P3.3/UCA0TXD/UCA0SIMO
P3.2/UCB0CLK/UCA0STE
P3.1/UCB0SOMI/UCB0SCL
P3.0/UCB0SIMO/UCB0SDA
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
THERMAL_4
103
Hardware
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R10
0R
DVSS
DVIO
P4.0/PM_UCB1STE
P4.1/PM_UCB1SIMO
P4.2/PM_UCB1SOMI
P4.3/PM_UCB1CLK
P4.4/PM_UCA1TXD
P4.5/PM_UCA1RXD
P4.6/PM_NONE
P4.7/PM_NONE
J4
P2.7/UCB0STE/UCA0CLK
26MHz/ASX53
THERMAL_5
1
14
12
10
8
6
4
2
JTAG
C8
P7.3/TB0.3
3
ext
2
VCC
1
int
JP3
P2.3/TA2.0
47K
P7.4/TB0.4
P3.4/UCA0RXD/UCA0SOMI
P2.2/TA2CLK/SMCLK
2.2nF
U1
MSP430F5229
TEST/SBWTCK
R5
RSTDVCC_SBWTDIO
PJ.2/TMS
JP1
R2
0R
PJ.3/TCK
P1.1/TA0.0
1
2
PINHEAD_1X2
P1.0/TA0CLK/ACLK
A
B
10uF
P6.0/CB0/A0
P6.3/CB3/A3
P6.2/CB2/A2
P6.1/CB1/A1
P6.4/CB4/A4
P6.5/CB5/A5
P6.6/CB6/A6
P6.7/CB7/A7
AVCC
P5.4/XIN
P7.5/TB0.5
P2.1/TA1.2
P5.0/A8/VEREF+
P5.1/A9/VEREF-
AVSS
P5.5/XOUT
DVSS
DVCC
BSLEN
P2.0/TA1.1
C5
J1
AVSS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
DVCC 15
16
PJ.0/TDO
P1.3/TA0.2
C6
100nF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
RST/NMI
P1.7/TA1.0
10uF
C10
100nF
C14
C13
R8
0R
100nF
R6
0R
C7
P5.2/XT2IN
P1.6/TA1CLK/CBOUT
R1
0R
DVCC
10uF
GND
0R
R4
THERMAL_3
12pF
Q1
D1
PJ.1/TDI/TCLK
P1.2/TA0.1
P7.0/TB0.0
P2.6/RTCCLK/DMAE0
P5.3/XT2OUT
P1.5/TA0.4
P7.1/TB0.1
P2.5/TA2.2
C1
12pF
2
R3
330R
THERMAL_2
P7.2/TB0.2
P2.4/TA2.1
XTLGND
C2
1
???
470nF
C9
GND
3
THERMAL_1
65
66
67
68
69
70
71
72
C
M
I
O
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
P1.4/TA0.3
SHC1
GND
JP2
2
1
2
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
RSTDVCC/SBWTDIO
VCORE
VCORE 17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
P1.1/TA0.0
P1.2/TA0.1
1
2
3
4
5
6
7
DVCC 8
9
10
11
12
13
14
15
16
C
D
1
J2
D3
Figure B-48. MSP-TS430RGC64C Target Socket Module, Schematic
MSP-TS430RGC64C
www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
Connector J6
External power connector
to supply DVIO
Jumper JP4
Ÿ For F524x devices, close.
Ÿ For F522x, F523x, and F525x devices,
close only if one power supply is used
for VCC and DVIO, and if VCC is not
higher then 1.98 V. Otherwise, supply
DVIO over J6.
Do not close if VCC > 1.98 V, as it may
damage the chip.
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Connector J5
External power connector for DVCC
Set jumper JP3 to "ext"
IMPORTANT NOTE:
Rev1.0 of the board does not have
connection from pin 4 of BOOTST to
pin 64 of MCU. To use BSL, these pins
should be connected by a wire.
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-49. MSP-TS430RGC64C Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R11 or R12 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R12 (0 Ω) must be assembled, and R11 must be removed.
104 Hardware
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Table B-25. MSP-TS430RGC64C Bill of Materials
Item
Qty
Reference
1
0
C1, C2
Value
2
0
C3, C4
4
3
C5, C7, C10
10uF
CAP, SMD, Ceramic, 0805
5
5
C8 C6 C13-15
100nF
CAP, SMD, Ceramic, 0805
5
5
C8
2.2nF
CAP, SMD, Ceramic, 0805
6
1
C9
470nF
CAP, SMD, Ceramic, 0805
7
1
C16
4.7uF
CAP, SMD, Ceramic, 0805
8
1
D1
Green LED
LED, SMD, 0805
12pF
Description
Comment
CAP, SMD, Ceramic, 0805
DNP C1 C2
CAP, SMD, Ceramic, 0805
DNP C3 C4
Supplier No.
Digi-Key: 311-1245-2-ND
Digi-Key: 478-1403-2-ND
DNP: headers and
receptacles enclosed with
kit. Keep vias free of solder.
: Header
SAM1029-16-ND
: Receptacle
SAM1213-16-ND
9
4
J1-J4
16-pin header
Pin header 1x16: Grid: 100mil
(2.54 mm)
10
2
J5, J6
3-pin header, male, TH
Pin header 1x3: Grid: 100mil (2.54
mm)
11
JP5, JP6, JP7,
JP8, JP9, JP10
3-pin header, male, TH
Pinheader 1x3: Grid: 100mil (2.54
mm)
12
JP3
3-pin header, male, TH
Pin header 1x3: Grid: 100mil (2.54
place jumper on pins 1-2
mm)
SAM1035-03-ND
13
JP1, JP2, JP4
2-pin header, male, TH
Pin header 1x2; Grid: 100mil (2.54
place jumper on header
mm)
SAM1035-02-ND
SAM1035-03-ND
place jumpers on pins 2-3
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
14
10
15
1
JTAG
2x7Pin,Wanne
Header, THD, Male 2x7 Pin,
Wanne, 100mil spacing
HRP14H-ND
16
0
BOOTST
2x5Pin,Wanne
Header, THD, Male 2x5 Pin,
Wanne, 100mil spacing
DNP
17
1
Q1
26MHz/ASX53
CRYSTAL, SMD, 5x3MM, 26MHz
Only Kit.
18
0
Q2
26MHz/ASX53
CRYSTAL, SMD, 5x3MM, 26MHz
300-8219-1-ND
19
1
D3
LL103A
DIODE, SMD, SOD123, Schottky
Buerklin: 24S3406
20
2
R3, R7
330 Ohm, SMD0805
21
1
R5
47k Ohm, SMD0805
RES, SMD, 0805, 1/8W, x%
0 Ohm, SMD0805
RES, SMD, 0805, 1/8W, x%
DNP: R6, R8, R9, R10,
R11,R12
Socket: QFN11T064-006-N-HSP
Manuf.: Yamaichi
R1, R2, R4, R6,
R8, R9, R10,
R11, R12
22
23
Jumper
SAM1035-03-ND
1
24
2
25
4
26
1
U1
MSP430
MSP430F5229IRGCR
541-330ATR-ND
84 x 76 mm
541-47000ATR-ND
541-000ATR-ND
IC, MCU, SMD, 9.15x9.15mm
Thermal Pad with Socket
apply to corners at bottom
side
Rubber stand off Rubber stand off
PCB
15-38-1024-ND
Buerklin: 20H1724
84 x 76 mm
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Hardware
105
MSP-TS430RGC64USB
www.ti.com
B.25 MSP-TS430RGC64USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-50. MSP-TS430RGC64USB Target Socket Module, Schematic
106
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MSP-TS430RGC64USB
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB1
USB connector
Vcc
ext
int
3 2 1
14
JTAG
1
2
JP3
2
2
3
3
3
IC7
C39
R10
C33
C35
R33
R11
R34
C38 R35
R9
C3
Q2
C4
R12
J4 49
D4
C36
48
C8
C6
R1
QFN11T064-006
C14 Q1
+
C5
C7 +
R4
R6
C2
C1
R8
C9
D1
LED connected to P1.0
U1
1
1 J1
Orient Pin 1 of MSP430 device
JP4
Connector J5
External power connector
Jumper JP3 to "ext"
S3
2
3
R36
1
3
C40
1
2
D2
1
2
D3
1
64
R7
1
3
JTAG ->
J5
JP1
JP5
JP10
JP9
JP8
JP7
JP6
2
R5
R2
1
SBW ->
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
VCC
GND
GND
USB1
Connector JTAG
For JTAG Tool
D1
R3
C12
C13
JP2
16
3 2 1
17 J2
32
S2
S1
LED1
R15
LED2
R16
LED3
R13
LED
C11
C10
Clamshell
J3 33
Jumper JP2
Open to disconnect LED
MSP-TS430RGC64USB
Rev.: 1.4
RoHS
Figure B-51. MSP-TS430RGC64USB Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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Hardware 107
MSP-TS430RGC64USB
www.ti.com
Table B-26. MSP-TS430RGC64USB Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11, C13,
C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
4
Description
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
16-pin header, TH
SAM1029-16-ND
: Header
SAM1213-16-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2, JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
12
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
Q2
1
Crystal
Q2: 4MHz Buerklin: 78D134
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
1
1M Ω, SMD0805
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket: QFN11T064-006
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber stand
off
4
22
MSP430
2
MSP430F5509 RGC
23
Insulating disk
to Q2
1
Insulating disk to Q2
http://www.ettinger.de/Art_Deta
il.cfm?ART_ARTNUM=70.08.1
21
27
C33
1
220n SMD0603
Buerklin: 53D2074
28
C35
1
10p SMD0603
Buerklin: 56D102
29
C36
1
10p SMD0603
Buerklin: 56D102
30
C38
1
220n SMD0603
Buerklin: 53D2074
31
C39
1
4u7 SMD0603
Buerklin: 53D2086
32
C40
1
0.1u SMD0603
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
36
LED
0
JP3QE
108
Hardware
DNP: Q1
Keep vias free of solder
DNP: R4, R6, R8, R9, R12
541-47000ATR-ND
Buerklin: 20H1724
Apply to corners at bottom side
DNP: enclosed with kit. Is
supplied by TI
Manu: TI
SAM1032-03-ND
DNP
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MSP-TS430RGC64USB
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Table B-26. MSP-TS430RGC64USB Bill of Materials (continued)
Pos.
Ref Des
No. Per
Board
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15, R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4 / 1k5
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
Description
Digi-Key Part No.
SLAU278X – May 2009 – Revised February 2016
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Comment
Hardware
109
MSP-TS430PN80
www.ti.com
B.26 MSP-TS430PN80
NOTE: For MSP430F47x and MSP430FG47x devices:
Connect pins 7 and 10 (GND) externally to DVSS (see data sheet).
Connect load capacitance on Vref pin 60 when SD16 is used (see data sheet).
For use of BSL: connect pin 1 of BOOST to pin 58 of U1 and pin 3 of BOOST to pin 57 of U1.
Figure B-52. MSP-TS430PN80 Target Socket Module, Schematic
110
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Jumper JP2
Open to measure current
Connector BOOTST
For Bootloader Tool
Connector JTAG
For JTAG Tool
Jumper JP1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
D1
LED connected to pin 12
Connector J5
External power connector
Jumper JP1 to "ext"
Jumper J6
Open to disconnect LED
Orient Pin 1 of
MSP430 device
Figure B-53. MSP-TS430PN80 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PN80
www.ti.com
Table B-27. MSP-TS430PN80 Bill of Materials
Pos.
Ref Des
No. per Board
1
C1, C2
0
12pF, SMD0805
DNP: C1, C2
1.1
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
D1
1
green LED, SMD0603
475-1056-2-ND
6
J1, J2, J3, J4
0
Description
Digi-Key Part No.
Comment
DNP: Headers and receptacles
enclosed with kit.Keep vias
free of solder.
25-pin header, TH
SAM1029-20-ND
: Header
SAM1213-20-ND
: Receptacle
7
J5, JP1
2
3-pin header, male, TH
SAM1035-03-ND
8
J6, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3
Jumper
15-38-1024-ND
Place on: J6, JP2, JP1/Pos1-2
HRP14H-ND
9
10
JTAG
1
14-pin connector, male, TH
11
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
13
R3
1
560 Ω, SMD0805
541-560ATR-ND
14
R1, R2, R4,
R6, R7, R10,
R11, R12
2
0 Ω, SMD0805
541-000ATR-ND
15
R5
1
47k Ω, SMD0805
541-47000ATR-ND
16
U1
1
Socket: IC201-0804-014
Manuf.: Yamaichi
17
PCB
1
77 x 77 mm
2 layers
18
Adhesive
Plastic feet
4
~6mm width, 2mm height
19
MSP430
2
MSP430FG439IPN
12
112
Hardware
DNP: Keep vias free of solder
DNP: R4, R6, R7, R10, R11,
R12
for example, 3M Bumpons Part
Apply to corners at bottom side
No. SJ-5302
DNP: Enclosed with kit
supplied by TI
SLAU278X – May 2009 – Revised February 2016
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B.27 MSP-TS430PN80A
Figure B-54. MSP-TS430PN80A Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PN80A
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector J6
If the system is supplied from LDOI,
close JP4 and set JP3 to external
Orient Pin 1 of
MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
Figure B-55. MSP-TS430PN80A Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
114 Hardware
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Table B-28. MSP-TS430PN80A Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
2
C3, C4
0
47pF, SMD0805
DNP
3
C6, C7,
C10, C12
3
10uF, 6.3V, SMD0805
DNP C10
4
C5, C11,
C13, C14,
C15
5
100nF, SMD0805
5
C8
1
2.2nF, SMD0805
6
C9
1
470nF, SMD0805
7
C16
1
4.7uF, SMD0805
8
C17
1
220nF, SMD0805
9
D1
1
green LED, SMD0805
P516TR-ND
10
J1, J2, J3,
J4
0
20-pin header, TH
SAM1029-20-ND
(Header) SAM1213-20ND (Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
11
J5 , J6
2
3-pin header, male, TH
12
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
13
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
10
Jumper
15-38-1024-ND
See Pos. 12 and Pos. 13
HRP14H-ND
14
Description
Digi-Key Part No.
Comment
311-1245-2-ND
478-1403-2-ND
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
17
Q1
0
Crystal
Micro Crystal MS3V-T1R
32.768kHz, C(Load) =
12.5pF
DNP: Q1 Keep vias free of solder
18
Q2
0
Crystal
Q2: 4MHz Buerklin:
78D134
DNP: Q2 Keep vias free of solder
19
Insulating
disk to Q2
0
Insulating disk to Q2
http://www.ettinger.de/Art_
Detail.cfm?ART_ARTNUM
=70.08.121
20
D3,D4
2
LL103A
Buerklin: 24S3406
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R9,R10,
R11, R12
3
0 Ohm, SMD0805
541-000ATR-ND
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
25
PCB
1
77 x 91 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
27
MSP430
2
MSP430F5329IPN
"DNP Keep vias free of solder"
SLAU278X – May 2009 – Revised February 2016
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DNP: R6, R8, R9, R10, R11,R12
DNP: enclosed with kit, supplied by TI
Hardware
115
MSP-TS430PN80USB
www.ti.com
B.28 MSP-TS430PN80USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
NOTE: R11 should be populated.
Figure B-56. MSP-TS430PN80USB Target Socket Module, Schematic
116
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Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG debug interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB Connector
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP4
Close for USB bus powered device
Button S3
BSL invoke
Orient Pin 1 of MSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-57. MSP-TS430PN80USB Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PN80USB
www.ti.com
Table B-29. MSP-TS430PN80USB Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11,
C13, C14
4
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12
0
10uF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
4
20-pin header, TH
SAM1029-20-ND
7.1
4
Description
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
DNP: headers and
receptacles enclosed with kit.
Keep vias free of solder.
20-pin header, TH
SAM1213-20-ND
: Header
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6,
JP7,
JP8,JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
JP4
1
SAM1035-02-ND
Place jumper only on one pin
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3,
JP4, JP5, JP6, JP7, JP8,
JP9, JP10
11
12
118
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
15
Q2
1
Crystal
"Q2: 4MHzBuerklin: 78D134"
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
0
1M Ω, SMD0805
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket:IC201-0804-014
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber
standoff
4
22
MSP430
2
MSP430F5529
23
Insulating
disk to Q2
1
Insulating disk to Q2
http://www.ettinger.de/Art_De
tail.cfm?ART_ARTNUM=70.0
8.121
27
C33
1
220n
Buerklin: 53D2074
28
C35
1
10p
Buerklin: 56D102
29
C36
1
10p
Buerklin: 56D102
30
C38
1
220n
Buerklin: 53D2074
Hardware
DNP: Q1 Keep vias free of
solder
DNP: R4, R6, R8, R9, R12
DNP
541-47000ATR-ND
Buerklin: 20H1724
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
SLAU278X – May 2009 – Revised February 2016
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Table B-29. MSP-TS430PN80USB Bill of Materials (continued)
Pos.
Ref Des
No. per
Board
31
C39
1
4u7
Buerklin: 53D2086
32
C40
1
0.1u
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
36
LED
0
JP3QE
SAM1032-03-ND
DNP
37
LED1
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
38
LED2
0
LEDCHIPLED_0603
FARNELL: 852-9868
DNP
39
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9841
DNP
40
R13, R15,
R16
0
470R
Buerklin: 07E564
DNP
41
R33
1
1k4
Buerklin: 07E612
42
R34
1
27R
Buerklin: 07E444
43
R35
1
27R
Buerklin: 07E444
44
R36
1
33k
Buerklin: 07E740
45
S1
0
PB
P12225STB-ND
DNP
46
S2
0
PB
P12225STB-ND
DNP
46
S3
1
PB
P12225STB-ND
47
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
Description
Digi-Key Part No.
Comment
Manu: TI
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PZ100
www.ti.com
B.29 MSP-TS430PZ100
NOTE: Connections between the JTAG header and pins XOUT and XIN are no longer required and should not be
made.
Figure B-58. MSP-TS430PZ100 Target Socket Module, Schematic
120
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Jumper J6
Open to disconnect LED
Connector JTAG
For JTAG Tool
Jumper J7
Open to measure current
Connector BOOTST
For Bootloader Tool
D1
LED connected to pin 12
Connector J5
External power connection
Remove R8 and jumper R9
Orient Pin 1 of MSP430 device
Figure B-59. MSP-TS430PZ100 Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PZ100
www.ti.com
Table B-30. MSP-TS430PZ100 Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1b
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C6, C7
1
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5
1
100nF, SMD0805
478-3351-2-ND
4
C8
1
10nF, SMD0805
478-1383-2-ND
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
yellow LED, TH, 3mm, T1
511-1251-ND
7
J1, J2, J3, J4
Digi-Key Part No.
Comment
DNP: C6
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
J6, J7
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
Place on: J6, J7
10
2
Jumper
15-38-1024-ND
11
JTAG
1
14-pin connector, male, TH
HRP14H-ND
12
BOOTST
0
10-pin connector, male, TH
13
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
14
R3
1
330 Ω, SMD0805
541-330ATR-ND
15
R1, R2, R4,
R8, R9, R10,
R11, R12
3
0 Ω, SMD0805
541-000ATR-ND
16
R5
1
47k Ω, SMD0805
541-47000ATR-ND
U1
1
Socket: IC201-1004-008 or
IC357-1004-53N
18
PCB
1
82 x 90 mm
19
Adhesive
Plastic feet
4
~6mm width, 2mm height
20
MSP430
2
MSP430FG4619IPZ
17
122
0
Description
Hardware
DNP: Keep vias free of
solder
DNP: Keep vias free of
solder
DNP: R4, R9, R10, R12
Manuf.: Yamaichi
2 layers
for example, 3M Bumpons
Part No. SJ-5302
Apply to corners at bottom
side
DNP: enclosed with kit
supplied by TI
SLAU278X – May 2009 – Revised February 2016
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B.30 MSP-TS430PZ100A
Figure B-60. MSP-TS430PZ100A Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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Hardware
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MSP-TS430PZ100A
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
Jumper JP2
Open to disconnect LED
Connector J5
External power connector
Jumper JP3 to "ext"
D1
LED connected to P5.1
Orient Pin 1 of
MSP430 Device
Figure B-61. MSP-TS430PZ100A Target Socket Module, PCB
124 Hardware
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Table B-31. MSP-TS430PZ100A Bill of Materials
Pos.
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
DNP
1b
C3, C4
0
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
2
C7, C9
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5, C11, C14
3
100nF, SMD0805
311-1245-2-ND
4
C8
1
10nF, SMD0805
478-1358-1-ND
5
C6
0
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
67-1553-1-ND
7
J1, J2, J3, J4
Description
0
Digi-Key Part No.
Comment
DNP
DNP: Headers and
receptacles enclosed with
kit.Keep vias free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
pPlace jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
3
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3
HRP14H-ND
12
13
JTAG
1
14-pin connector, male, TH
14
BOOTST
0
10-pin connector, male, TH
15
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) =
12.5pF
16
R3
1
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R7, R8,
R9, R10,
R11, R12
2
0 Ω, SMD0805
541-000ATR-ND
18
R5
1
47k Ω, SMD0805
541-47000ATR-ND
19
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
20
PCB
1
90 x 82 mm
4 layers
21
Rubber
standoff
4
22
MSP430
2
DNP: Keep vias free of
solder
Select appropriate
MSP430F47197IPZ
SLAU278X – May 2009 – Revised February 2016
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DNP: Keep vias free of
solder
DNP: R4, R6, R7, R8, R9,
R10, R11, R12
Apply to corners at bottom
side
DNP: Enclosed with kit
supplied by TI
Hardware
125
MSP-TS430PZ100B
www.ti.com
B.31 MSP-TS430PZ100B
Figure B-62. MSP-TS430PZ100B Target Socket Module, Schematic
126
Hardware
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Orient Pin 1 of MSP430 device
JP11, JP12, JP13
Connect 1-2 to connect
AUXVCCx with DVCC
or drive AUXVCCx externally
D1
LED connected to P1.0
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Jumper JP2
Open to disconnect LED
Figure B-63. MSP-TS430PZ100B Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
SLAU278X – May 2009 – Revised February 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
Hardware 127
MSP-TS430PZ100B
www.ti.com
Table B-32. MSP-TS430PZ100B Bill of Materials
Position
Ref Des
No. per
Board
1
C1, C2
0
12pF, SMD0805
2
C4, C5,
C6 , C7,
C8, C9
6
100nF, SMD0805
311-1245-2-ND
3
C10, C26
2
470 nF, SMD0805
478-1403-2-ND
4
C11, C12
1
10 uF / 6.3 V SMD0805
5
C13, C14,
C16, C18,
C19, C29
6
4.7 uF SMD0805
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3,
J4
0
25-pin header, TH
SAM1029-25-ND
(Header) SAM1213-25ND (Receptacle)
DNP: Headers and receptacles
enclosed with kit. Keep vias free of
solder:
8
J5
1
3-pin header, male, TH
9
JP3, JP5,
JP6, JP7,
JP8, JP9,
JP10
7
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3 on JP5, JP6,
JP7, JP8, JP9, JP10 place jumpers on
pins 1-2 on JP3,
10
JP1, JP2,
JP4
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
11
JP11, JP12,
JP13
3
4-pin header, male, TH
13
Jumper
15-38-1024-ND
HRP14H-ND
12
128
Description
Digi-Key Part No.
Comment
DNP
C12 DNP
place jumper on header 1-2
See Pos. 9 and Pos. 10 and Pos. 11
15
JTAG
1
14-pin connector, male,
TH
16
BOOTST
0
10-pin connector, male,
TH
17
Q1
0
Crystal
21
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
22
R1, R2, R4,
R6, R8,
R10, R11
2
0 Ohm, SMD0805
541-000ATR-ND
23
R5
1
47k Ω, SMD0805
541-47000ATR-ND
24
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
25
PCB
1
90 x 82 mm
2 layers
26
Adhesive
plastic feet
4
Approximately 6mm width, for example, 3M Bumpons
Apply to corners at bottom side
2mm height
Part No. SJ-5302
27
MSP430
2
MSP430F6733IPZ
Hardware
"DNP Keep vias free of solder"
DNP: Q1 Keep vias free of solder
DNP: R4, R6, R8, R10, R11
DNP: enclosed with kit, supplied by TI
SLAU278X – May 2009 – Revised February 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
MSP-TS430PZ100C
www.ti.com
B.32 MSP-TS430PZ100C
BOOTST
10
8
6
4
2
R10
R11
DNP
DNP
0R
0R
LDOO
C18
100nF
C19
100nF
GND
1 JP5
2
3
DNP
GND
JP6
R9
XT2IN
R12
XT2OUT
TDO 1
RST 2
RST/NMI 3
1 JP4
2
LDOI/LDOO Interface
GND
R7 330R
VCC
GND
TEST/SBWTCK
TCK
1 J6
2
3
Note: If the system should be
supplied via LDOI (J6) close JP4
and set JP3 to external
LDOI
GND
RST/NMI
TCK
TMS
TDI
TDO
TEST/SBWTCK
RST
R5
47K
0R
C
TCK
0R
D1
1 JP7
2
3
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
M
TMS
HCTC_XTL_4
DNP
Q2G$1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
P8.2 60
P8.1 59
P8.0 58
57
56
55
54
53
52
51
1 JP8
2
3
C3
DNP
I
TDI
47pF
47pF
DNP
C4
J3
DVCC1
1 JP9
2
3
GND
O
TDO
C11 100nF
C10 100nF
DNP
GND
4
3
2
1
VBAT
DVCC1
GND
1 JP10<- SBW
2
3
<- JTAG
JP11
1
2
3
GND
PWR3
MSP430: Ta rget-Socket MSP-TS430PZ100C
1.1
Copyright © 2009–2016, Texas Instruments Incorporated
129
Hardware
SLAU278X – May 2009 – Revised February 2016
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9
7
5
JTAG
13
11
9
7
5
3
1
2.2nF
C8
DVCC1
GND
U1
QFP100PZ
R3
330R
XTLGND2
VCC
D4
Socket:
Yamaichi
IC201-1004-008
P1.0
3
Q2G$2
TEST/SBWTCK
DNP
14
12
10
8
6
4
2
R1
0R
R6 0R
R8 0R
470nF
GND
P516TR-ND
HCTC_XTL_4
LL103A
220nF
C21
GND
4
BSL-Rx3
BSL-Tx 1
D3
C17
DNP
100nF
XIN
XOUT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
C16
P1.2
P1.1
2
1
LL103A
R2
0R
AVCC
DNP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15 AVSS
16
17
18
19
20
21
22
23
24
25
DNP
VBAT
C15
BSL Interface
GND
JP3
DNP
+
C7
4.7uF
C12
100nF
C9
1
2
ext 3
int
GND
C5
100nF
DVCC1
1 JP1
2
DNP
C2
12pF
12pF
C1
J1
C13
100nF
0R R4
J2
Vcc
VCC
+
C6
AVSS
10uF/6.3V
4.7n
2
1
4
J4
GND
JP2
LFXTCLK
C14
100nF
10uF/6.3V
HCTC_XTL_4
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
HCTC_XTL_4
100
99
98
97
96
C 95
M 94
93
I
O 92
91
GND 90
DVCC1 89
88
VBAT 87
VBAK 86
85
84
AVSS 83
82
LDOO 81
LDOI 80
79
PU.1
78
77
PU.0
GND 76
26
27
28
29
30
31
32
33
34
35 P1.1
36 P1.2
37
38
39
40 P1.6
41 P1.7
42
43
44
45
46
47
48
49
50
Q1G$2
3
2
Q1G$1
1
100nF
C20
DVCC1
RST
GND
XTLGND1
J5
Figure B-64. MSP-TS430PZ100C Target Socket Module, Schematic
MSP-TS430PZ100C
www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
Connector JTAG
For JTAG Tool
JP3
14
1
2
BOOTST
J5
R11
VCC
JP4
D4
J6
C15
C21
LDOI/LDOO
C20
1 2 3
75
1
95
90
85
80
76
Connector J5
External power connector
Jumper JP3 to "ext"
If the system should
be supplied from LDOI (J6),
close JP4 and set JP3 to external
R9
R12
C4
C3
100
Q2
5
0
70
C10
C11
C16
1
Orient Pin 1 of MSP430 device
GND
GND
R10
JP1
+
1 2 3
123
123
123
123
int
JP6
R5 C8
123
R2
SBW JTAG
4
ext
R7
1 2 3
GND
1
C5 C7
JP7
J4
2
VBAT
DVCC
3
D3 JP5
JP10
JP9
JP8
JTAG
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
10
Vcc
1
2
Connector BOOTST
For Bootloader Tool
JP11
11
C18
C19
Q1
5
J3
0
+
60
R1
C6
65
2
R8
C1
C2
R6
C12
C13
C17
C14
U1
55
C9
R4
26
30
3540 45
50
51
25
J1
J2
D1
LED connected to P1.0
D1 R3 JP2
Jumper JP2
Open to disconnect LED
Figure B-65. MSP-TS430PZ100C Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
130 Hardware
SLAU278X – May 2009 – Revised February 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
MSP-TS430PZ100C
www.ti.com
Table B-33. MSP-TS430PZ100C Bill of Materials
Pos.
Ref Des
Number
Per
Board
Description
Digi-Key Part No.
Comment
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11,
C13, C14,
C19, C20
6
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12,
C18,17
0
100nF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
Buerklin 53 D 292
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
4
25-pin header, TH
SAM1029-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
4
25-pin header, TH
SAM1213-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
7.1
DNP: C1, C2
DNP: C3, C4
DNP: C10, C12,C18, C17
8
J5, J6
2
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6,
JP7,
JP8,JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
10.1
JP4
1
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4, JP5, JP6,
JP7, JP8, JP9, JP10
12
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
BOOTST
1
10-pin connector, male, TH
HRP10H-ND
15
Q1
0
Crystal
16
Q2
1
Crystal
17
R3, R7
2
330 Ohm, SMD0805
541-330ATR-ND
18
R1, R2, R4,
R6, R8, R9,
R10, R11,
R12
3
0 Ohm, SMD0805
541-000ATR-ND
19
R5
1
47k Ohm, SMD0805
541-47000ATR-ND
20
U1
1
Socket: IC357-1004-53N
21
PCB
1
79.5 x 99.5 mm
22
Rubber stand
off
4
23
MSP430
2
MSP430F643x
24
C16
1
4.7 nF SMD0603
Buerklin 53 D 2042
26
D3, D4
2
LL103A
Buerklin: 24S3406
27
JP11
1
4-pin header, male, TH
SAM1035-04-ND
28
C15
1
4.7 uF, SMD0805
Buerklin 53 D 2430
29
C21
1
220nF, SMD0805
Buerklin 53 D 2381
DNP, keep vias free of solder
DNP: Q1
Keep vias free of solder
DNP: Q2 Keep vias free of solder
DNP: R6, R8, R9, R10, R11, R12
Manuf.: Yamaichi
MSP-TS430PZ100C Rev 1.0 2 layers
Buerklin: 20H1724
apply to corners at bottom side
DNP: enclosed with kit. Is supplied by TI.
SLAU278X – May 2009 – Revised February 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
Place jumper on Pin 1 and Pin 2
Hardware
131
Vcc
A
3
2
1
VCC
14
12
10
8
6
4
2
JTAG
13
11
9
7
5
3
1
B
RST/NMI
JP3
3
2
1
TCK/SBWTCK
TMS
TDI
TDO/SBWTDIO
GND
TEST/SBWTCK1
JTAG ->
SBW ->
C
TEST/SBWTCK
JP4
3
2
1
D
EVQ11
GND
DNP
JP5
3
2 PJ.0/TDO
1
JP6
E
3
2 PJ.1/TDI
1
JP7
3
2 PJ.2/TMS
1
JTAG-Mode selection:
4-wire JTAG: Set jumpers JP3 to JP8 to position 2-3
2-wire "SpyBiWire": Set jumpers JP3 to JP8 to position 1-2
SW1
1.1nF
C5
RST/SBWTDIO
47k
R4
HFXIN
HFXOUT
JP8
F
3
2 PJ.3/TCK
1
DNP
DNP
DNP
C9
DNP
DNP
C8
HFGND
C7
100nF
C6
DVCC
1uF/10V
GND
G
J5
BSLTX
H
TEST/SBWTCK
BSLRX
RST/SBWTDIO
DVCC
ESIVCC
C12
GND
9
7
5
3
1
10
8
6
4
2
BSL
DNP
Rev.: 1.2
I
GND
J2
Ext_PWR
DNP
DNP
Seite 1/1
I
A3
6
5
1
2
3
4
If external supply voltage:
remove R3 and add R2 (0 Ohm)
1 JP12
2
DNP
100nF
C13
DNP
DNP
470nF
C14
3
2
1
Bearb.:Petersen
1099/1/001/01.1
GND
ESICOM
1uF/10V
DNP
GND
File: MSP-TS430PZ100D
Datum:7/9/2013 5:23:25 PM
G
H
Target Socket Board for MSP430FR698xPZ, FR688xPZ
Dok:
Titel: MSP-TS430PZ100D
FE25-1A3
75
75
ESIVCC
ESIVCC
74
P9.7/ESICI3/A15/C15 74
73
P9.6/ESICI2/A14/C14 73
72
P9.5/ESICI1/A13/C13 72
71
P9.4/ESICI0/A12/C12 71
70
P9.3/ESICH3/ESITEST3/A11/C11 70
69
P9.2/ESICH2/ESITEST2/A10/C10 69
68
P9.1/ESICH1/ESITEST1/A9/C9 68
67
P9.0/ESICH0/ESITEST0/A8/C8 67
P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VEREF66 P1.0 66
P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VEREF+65 P1.1 65
P1.2/TA1.1/TA0CLK/COUT/A2/C2 64 P1.2 64
P1.3/ESITEST4/TA1.2/A3/C3 63 P1.3 63
62
P8.7/A4/C4 62
61
P8.6/A5/C5 61
60
P8.5/A6/C6 60
59
P8.4/A7/C7 59
58 DVCC 58
DVCC2
57 DVSS 57
DVSS2
56
P7.4/SMCLK/S13 56
55
P7.3/TA0.2/S14 55
54
P7.2/TA0.1/S15 54
53
P7.1/TA0.0/S16 53
52
P7.0/TA0CLK/S17 52
P2.0/UCA0SIMO/UCA0TXD/TB0.6/TB0CLK51 BSLTX51
Socket:
Yamaichi IC201-1004-008
F
R2
-
R3
0R
J1
DVCC
ext
int
DVCC
AVCC
DNP
DNP
E
QUARZ5
Q2
2
1
2
1
JP1
100nF
C4
C2
DNP
C1
LFXIN
LFXOUT
P4.3/UCA0SOMI/UCA0RXD/UCB1STE
P1.4/UCB0CLK/UCA0STE/TA1.0/S1
P1.5/UCB0STE/UCA0CLK/TA0.0/S0
P1.6/UCB0SIMO/USB0SDA/TA0.1
P1.7/UCB0SOMI/UCB0SCL/TA0.2
R33/LCDCAP
P6.0/R23
P6.1/R13/LCDREF
P6.2/COUT/R03
P6.3/COM0
P6.4/TB0.0/COM1
P6.5/TB0.1/COM2
P6.6/TB0.2/COM3
P2.4/TB0.3/COM4/S43
P2.5/TB0.4/COM5/S42
P2.6/TB0.5/COM6/S41
P2.7/TB0.6/COM7/S40
P10.2/TA1.0/SMCLK/S39
P5.0/TA1.1/MCLK/S38
P5.1/TA1.2/S37
P5.2/TA1.0/TA1CLK/ACLK/S36
P5.3/UCB1STE/S35
P3.0/UCB1CLK/S34
P3.1/UCB1SIMO/UCB1SDA/S33
P3.2/UCB1SOMI/UCB1SCL/S32
IC1
Q1
LFGND QUARZ5
DNP
connection by via
100nF
C11
GND
DNP
1
1
2
2
3
3
4
4
5
5
6 LCDCAP 6
7
7
8
8
9
9
10
10
11
11
12
12
13
13
14
14
15
15
16
16
17
17
18
18
19
19
20
20
21
21
22
22
23
23
24
24
25
25
FE25-1A1
J3
C10
DVCC
MSP430FR698XPZ
LCDCAP
100nF
C15
4u7
DNP
D
Copyright © 2009–2016, Texas Instruments Incorporated
C3
DVCC
P1.3
P1.2
P1.1
P1.0
GND
ESIVSS
1uF/10V
AVSS
DVSS
JP11
JP10
JP9
GND
C
AVSS
AVCC
ESICOM
JP2
GND
0R R12
0R R13
R14DNP
R11 DNP
D3
red (DNP)
R10DNP
R1 330R
D2
yellow (DNP)
D1
green
GND
B
AVSS
6
5
4
3
2
1
A
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
AVSS
0R
R6
0R
R5
R8
0R
R9
0R
GND
FE25-1A4
R7
0R
J4
DNP
SW2
DVCC
DVSS
P4.2/UCA0SIMO/UCA0TXD/UCB1CLK 100
DVSS1
99
DVCC3
DVCC1
98
DVSS3
TEST/SBWTCK
P4.1/UCB1SOMI/UCB1SCL/ACLK/S2 97
XRST/NMI/SBWTDIO
P4.0/UCB1SIMO/UCB1SDA/MCLK/S3 96
PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1
P10.0/SMCLK/S4 95
PJ.1/TDI/TCLK/MCLK/SRSCG0
P4.7/UCB1SOMI/UCB1SCL/TA1.2/S5 94
PJ.2/TMS/ACLK/SROSCOFF
P4.6/UCB1SIMO/UCB1SDA/TA1.1/S6 93
PJ.3/TCK/COUT/SRCPUOFF
P4.5/UCB1CLK/TA1.0/S7 92
P6.7/TA0CLK/S31
P4.4/UCB1STE/TA1CLK/S8 91
P7.5/TA0.2/S30
P5.7/UCA1STE/TB0CLK/S9 90
P7.6/TA0.1/S29
P5.6/UCA1CLK/S10 89
P10.1/TA0.0/S28
P5.5/UCA1SOMI/UCA1RXD/S11 88
P7.7/TA1.2/TB0OUTH/S27
P5.4/UCA1SIMO/UCA1TXD/S12 87
P3.3/TA1.1/TB0CLK/S26
86
AVSS2
P3.4/UCA1SIMO/UCA1TXD/TB0.0/S25
PJ.5/LFXOUT 85
P3.5/UCA1SOMI/UCA1RXD/TB0.1/S24
PJ.4/LFXIN 84
P3.6/UCA1CLK/TB0.2/S23
83
AVSS1
P3.7/UCA1STE/TB0.3/S22
PJ.6/HFXIN 82
P8.0/RTCCLK/S21
PJ.7/HFXOUT 81
P8.1/DMAE0/S20
80
AVSS3
P8.2/S19
79
AVCC1
P8.3/MCLK/S18
78
ESICOM
P2.3/UCA0STE/TB0OUTH
77
ESICI
P2.2/UCA0CLK/TB0.4/RTCCLK
76
ESIVSS
P2.1/UCA0SOMI/UCA0RXD/TB0.5/DMAE0
26 DVSS
26
27 DVCC
27
28 TEST/SBWTCK28
29 RST/SBWTDIO29
30 PJ.0/TDO
30
31 PJ.1/TDI
31
32 PJ.2/TMS
32
33 PJ.3/TCK
33
34
34
35
35
36
36
37
37
38
38
39
39
40
40
41
41
42
42
43
43
44
44
45
45
46
46
47
47
48
48
49
49
50 BSLRX
50
TP1TP2
J6
FE25-1A2
2
1
2
1
2
1
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MSP-TS430PZ100D
B.33 MSP-TS430PZ100D
Figure B-66. MSP-TS430PZ100D Target Socket Module, Schematic
MSP-TS430PZ100D
www.ti.com
Jumper J1
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector JTAG
For JTAG Tool
45
40
Vcc
int
R13
TEST/SBWTCK
SBW
1
35
30
Jumper JP3 to JP8
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
C10
J4 26
R4
50
JTAG
GND
SW1
C5
25
J5 51
J2
TP2
Switch SW1
Device reset
RESET
JP1
10
C12
C13
C15
JP9
65
C11
Q1
Q2
5
C3
C4
70
80
85
90
J3
1
C2
R6
R5
C1
C8
R9
75
ESIVCC
JP12
R7
JP2
AVCC 76 J6
R8
C9
D2 R10
D1 R1
C14
Orient Pin 1 of MSP430 device
1
R12
P1.0
JP11
D3 R11
P1.2
JP10
R14
P1.1
IC1
15
SW2
60
P1.3
RoHS
C6
C7
Rev. 1.2
DVCC
Switch SW2
Connected to P1.3
MSP-TS430PZ100D
20
55
Jumper JP1
Open to measure current
LEDs connected to
P1.0, P1.1, P1.2 through
JP9, JP10, JP11
(only D1 assembled)
PWR J1
ext
R3
R2
Vcc
GND
GND
Connector J2
External power connector
Jumper J1 to “ext”
JTAG
BSL
Ext.
Pwr.
1
2
TDO
RST/SBWTDIO
14
1
2
TCK
TMS
TDI
10
JP8 1
JP7 1
JP6 1
JP5 1
JP4 1
JP3 1
Connector BSL
For Bootloader Tool
95
TP1
HF and LF oscillators with
capacitors and resistors
to connect pinheads
GND
100
Figure B-67. MSP-TS430PZ100D Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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Table B-34. MSP-TS430PZ100D Bill of Materials
Pos.
Ref Des
Number
Per
Board
Description
Digi-Key Part No.
Comment
1
PCB
1
90.0 x 100.0 mm
MSP-TS430PZ100D
Rev 1.2
2 layers, white solder mask
2
JP1, JP2,
JP9
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
3
JP10, JP11,
JP12
3
2-pin header, male, TH
SAM1035-02-ND
DNP, keep pads free of solder
4
J1
1
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 1-2
5
JP3, JP4,
JP5, JP6,
JP7, JP8
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
6
J2
1
3-pin header, male, TH
SAM1035-03-ND
7
R2, R3, R5,
R6, R8, R9
6
0R, 0805
541-0.0ATR-ND
8
R7, R12, R13 3
0R, 0805
541-0.0ATR-ND
9
C5
1
1.1nF, CSMD0805
490-1623-2-ND
10
C3, C7
2
1uF/10V, CSMD0805
490-1702-2-ND
11
C12
1
1uF/10V, CSMD0805
490-1702-2-ND
12
R4
1
47k, 0805
541-47KATR-ND
13
C4, C6, C10,
C11
4
100nF, CSMD0805
490-1666-1-ND
14
C13
1
100nF, CSMD0805
490-1666-1-ND
DNP
15
C15
1
4u7, CSMD0805
445-1370-1-ND
DNP
16
R1
1
330R, 0805
541-330ATR-ND
17
C14
1
470nF, CSMD0805
587-1290-2-ND
DNP
18
R10, R11
2
330R, 0805
541-330ATR-ND
DNP
19
R14
1
47k, 0805
541-47KATR-ND
DNP
20
C1, C2, C8,
C9
4
DNP, CSMD0805
21
SW2
1
EVQ-11L05R
P8079STB-ND
DNP
22
SW1
1
EVQ-11L05R
P8079STB-ND
DNP
23
J3, J4, J5, J6 4
25-pin header, TH
SAM1029-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
: Header
24
J3, J4, J5, J6 4
25-pin receptacle, TH
SAM1213-25-ND
DNP: headers and receptacles enclosed
with kit. Keep vias free of solder.
: Receptacle
25
TP1, TP2
2
Testpoint
26
BSL
1
10-pin connector, male, TH
HRP10H-ND
27
JTAG
1
14-pin connector, male, TH
HRP14H-ND
28
IC1
1
Socket: IC201-1004-008
29
IC1
1
MSP430FR6989
30
Q1
1
DNP: MS3V-TR1
(32768kHz/20ppm/12,5pF)
depends on application
Micro Crystal, DNP, enclosed in kit, keep
vias free of solder
31
Q2
1
DNP, Crystal
depends on application
DNP, keep vias free of solder
32
D1
1
green LED, DIODE0805
P516TR-ND
33
D3
1
red (DNP), DIODE0805
34
D2
1
yellow (DNP), DIODE0805
35
Rubber
stand off
4
134
Hardware
DNP
DNP
DNP
DNP, keep pads free of solder
DNP, keep vias free of solder
Manuf. Yamaichi
DNP: enclosed with kit. Is supplied by TI
DNP
DNP
Buerklin: 20H1724
apply to corners at bottom side
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PZ5x100
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B.34 MSP-TS430PZ5x100
Figure B-68. MSP-TS430PZ5x100 Target Socket Module, Schematic
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PZ5x100
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Connector JTAG
For JTAG Tool
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Connector BOOTST
For Bootloader Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumper JP1
Open to measure current
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 ofMSP430 device
D1
LED connected to P1.0
Jumper JP2
Open to disconnect LED
Figure B-69. MSP-TS430PZ5x100 Target Socket Module, PCB
136 Hardware
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MSP-TS430PZ5x100
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Table B-35. MSP-TS430PZ5x100 Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C2
0
1b
C3, C4
2
C6, C7
2
10uF, 10V, Tantal Size B
511-1463-2-ND
3
C5, C10, C11,
C12, C13, C14
4
100nF, SMD0805
311-1245-2-ND
4
C8
0
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
67-1553-1-ND
7
J1, J2, J3, J4
0
Description
Digi-Key Part No.
Comment
12pF, SMD0805
DNP
47pF, SMD0805
DNP: Only recommendation.
Check your crystal spec.
DNP: C12, C14
DNP
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
25-pin header, TH
SAM1029-25-ND
: Header
SAM1213-25-ND
: Receptacle
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 2-3
10
JP1, JP2
2
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
Place jumper on pins 1-2
9
Jumper
15-38-1024-ND
Place on JP1, JP2, JP3, JP5,
JP6, JP7, JP8, JP9, JP10
HRP14H-ND
12
13
JTAG
1
14-pin connector, male, TH
14
BOOTST
0
10-pin connector, male, TH
DNP: Keep vias free of solder
Q1, Q2
0
Crystal
Q1: Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R10, R11, R12
3
0 Ω, SMD0805
541-000ATR-ND
18
R5
1
47k Ω, SMD0805
541-47000ATR-ND
19
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
20
PCB
1
90 x 82 mm
2 layers
21
Rubber
standoff
4
22
MSP430
2
15
Select appropriate
MSP430F5438IPZ
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DNP: Keep vias free of solder
DNP: R6, R8, R9, R10, R11,
R12
Apply to corners at bottom side
DNP: Enclosed with kit
supplied by TI
Hardware
137
MSP-TS430PZ100USB
www.ti.com
B.35 MSP-TS430PZ100USB
Due to the use of diodes in the power chain, the voltage on the MSP430F5xx device is approximately
0.3 V lower than is set by the debugging tool. Set the voltage in the IDE to 0.3 V higher than desired; for
example, to run the MCU at 3.0 V, set it to 3.3 V.
Figure B-70. MSP-TS430PZ100USB Target Socket Module, Schematic
138
Hardware
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MSP-TS430PZ100USB
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Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB1
USB connector
Connector JTAG
For JTAG Tool
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Orient Pin 1 of MSP430 device
Jumper JP2
Open to disconnect LED
D1
LED connected to P1.0
LED1, LED2, LED3
LEDs connected to P8.0, P8.1, P8.2
Jumpers LED 1, 2, 3
Open to disconnect LED1, LED2, LED3
Figure B-71. MSP-TS430PZ100USB Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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MSP-TS430PZ100USB
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Table B-36. MSP-TS430PZ100USB Bill of Materials
Pos.
Ref Des
No. Per
Board
1
C1, C2
0
12pF, SMD0805
1.1
C3, C4
2
47pF, SMD0805
2
C6, C7
2
10uF, 6.3V, Tantal Size B
511-1463-2-ND
3
C5, C11, C13,
C14, C19
5
100nF, SMD0805
311-1245-2-ND
3.1
C10, C12,
C18, C17
0
100nF, SMD0805
311-1245-2-ND
4
C8
1
2.2nF, SMD0805
5
C9
1
470nF, SMD0805
478-1403-2-ND
6
D1
1
green LED, SMD0805
P516TR-ND
7
J1, J2, J3, J4
7.1
4
Description
25-pin header, TH
Digi-Key Part No.
Comment
DNP: C1, C2
DNP: C10, C12,C18, C17
SAM1029-25-ND
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
DNP: headers and receptacles
enclosed with kit. Keep vias
free of solder.
: Header
: Receptacle
4
25-pin header, TH
SAM1213-25-ND
8
J5
1
3-pin header, male, TH
SAM1035-03-ND
9
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
10
JP1, JP2, JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
11
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
10
Jumper
15-38-1024-ND
Place on: JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8, JP9, JP10
12
13
JTAG
1
14-pin connector, male, TH
HRP14H-ND
14
Q1
0
Crystal
Micro Crystal MS1V-T1K
32.768kHz, C(Load) = 12.5pF
15
Q2
1
Crystal
Q2: 4MHz, Buerklin: 78D134
16
R3, R7
2
330 Ω, SMD0805
541-330ATR-ND
17
R1, R2, R4,
R6, R8, R9,
R12
3
0 Ω, SMD0805
541-000ATR-ND
18
R10
1
100 Ω, SMD0805
Buerklin: 07E500
18
R11
1
1M Ω, SMD0603
18
R5
1
47k Ω, SMD0805
19
U1
1
Socket:IC201-1004-008
Manuf.: Yamaichi
20
PCB
1
79 x 77 mm
2 layers
21
Rubber stand
off
4
22
MSP430
2
MSP430F6638IPZ
23
Insulating disk
to Q2
1
Insulating disk to Q2
24
C16
1
4.7 nF SMD0603
27
C33
1
220n SMD0603
Buerklin: 53D2074
28
C35, C36
2
10p SMD0603
Buerklin: 56D102
30
C38
1
220n SMD0603
Buerklin: 53D2074
31
C39
1
4u7 SMD0603
Buerklin: 53D2086
140
Hardware
DNP: Q1. Keep vias free of
solder
DNP: R6, R8, R9, R12
not existing in Rev 1.0
541-47000ATR-ND
Buerklin: 20H1724
apply to corners at bottom side
DNP: enclosed with kit. Is
supplied by TI
http://www.ettinger.de/Art_Deta
il.cfm?ART_ARTNUM=70.08.1
21
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Table B-36. MSP-TS430PZ100USB Bill of Materials (continued)
Ref Des
No. Per
Board
32
C40
1
0.1u SMD0603
Buerklin: 53D2068
33
D2, D3, D4
3
LL103A
Buerklin: 24S3406
34
IC7
1
TPD4E004
35
LED
0
JP3QE
SAM1032-03-ND
DNP
36
LED1, LED2,
LED3
0
LEDCHIPLED_0603
FARNELL: 852-9833
DNP
37
R13, R15, R16
0
470R SMD0603
Buerklin: 07E564
DNP
38
R33
1
1k4 / 1k5 SMD0603
Buerklin: 07E612
39
R34
1
27R SMD0603
Buerklin: 07E444
40
R35
1
27R SMD0603
Buerklin: 07E444
41
R36
1
33k SMD0603
Buerklin: 07E740
42
S1, S2, S3
1
PB
P12225STB-ND
43
USB1
1
USB_RECEPTACLE
FARNELL: 117-7885
44
JP11
1
4-pin header, male, TH
SAM1035-04-ND
Pos.
Description
Digi-Key Part No.
Comment
Manu: TI
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DNP S1 and S2. (Only S3)
place jumper only on Pin 1
Hardware
141
14
12
10
8
6
4
2
C40
0.1u
1
USB1
VBUS
I
TDI
C38
220n
GND
1 JP9
2
3
C33
220n
1
2
3
JP10
GND
O
TDO
1 JP4
2
D4
LL103A
<- SBW
<- JTAG
1
2
3
GND
P8.0
P8.1
6
P8.2
GND
4
GND
2
LED-1 1 LED-2 3 LED-3 5
GND
470R
D-
1 JP8
2
3
C16
4.7n
VBAK
VBAT
DVCC1
GND
LED3
D+
C3
47pF
VCC
4
3
2
1
470R
D- 2
GND
SHIELD
M
TMS
C4
GND
JP11
C11 100nF
C10 100nF
DNP
R13
LED2
D+ 3
4
5
SHIELD1
1 JP7
2
3
USB Interface
C
TCK
0R
0R
GND
J3
DVCC1
GND
R16
470R
LL103A
D2
GND
6
JP6
R12
R9
XT2OUT
XT2IN
47pF
P8.2
P8.1
P8.0
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
DNP
P1.6
GND
1.1
Miscellaneous
P1.7
S2
C39
4u7
GND GND
TDO 1
RST 2
RST/NMI 3
DVCC1
1 JP5
2
3 DNP
C18
33k
R35 27R
10p
C36
GND
VCC
TCK
100nF
C19
DNP
100nF
GND
TEST/SBWTCK1
U1
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
R15
LED1
Target socket board MSP-TS430PZ100AUSB
for MSP430FG6626IPZ device
S1
R34 27R
10p
RST/NMI
TCK
TMS
TDI
TDO
RST
R5
47K
DVCC1
TEST/SBWTCK
DNP
0R
NR
2.2nF C8
R1
0R
R14
10uF/6,3V
+
C6
C14
P9.7/S0
P9.6/S1
P9.5/S2
P9.4/S3
P9.3/S4
P9.2/S5
P9.1/S6
P9.0/S7
P8.7/S8
P8.6/UCB1SOMI/UCB1SCL/S9
P8.5/UCB1SIMO/UCB1SDA/S10
DVCC2
DVSS2
P8.4/UCB1CLK/UCA1STE/S11
P8.3/UCA1RXD/UCA1SOMI/S12
P8.2/UCA1TXD/UCA1SIMO/S13
P8.1/UCB1STE/UCA1CLK/S14
P8.0/TB0CLK/S15
P4.7/TB0OUTH/SVMOUT/S16
P4.6/TB0.6/S17
P4.5/TB0.5/S18
P4.4/TB0.4/S19
P4.3/TB0.3/S20
P4.2/TB0.2/S21
P4.1/TB0.1/S22
D1
2
1
2
1
C35
13
11
9
7
5
3
1
GND GND
JTAG
C7
R2
0R
C17
100nF
0R
0R
P6.4/CB4/AD0+/OA0O
P6.5/CB5/AD0-/OA0N
P6.6/CB6/AD1+/GSW0A
P6.7/CB7/AD1-/GSW0B
MSP430FG6626IPZ
P7.4/CB8/AD2+/OA1O
P7.5/CB9/AD2-/OA1N
P7.6/CB10/AD3+/GSW1A
P7.7/CB11/AD3-/GSW1B
P5.0/VREF+/VEREF+
P5.1//A4/DAC0
P5.6/A5/DAC1
NR
AVSS1
XOUT
XIN
AVCC
CPCAP
P2.0/P2MAP0/DAC0
P2.1/P2MAP1/DAC1
P2.2/P2MAP2
P2.3/P2MAP3
P2.4/P2MAP4/R03
P2.5/P2MAP5
P2.6/P2MAP6/LCDREF/R13
P2.7/P2MAP7/R23
R3
330R
Socket:
Yamaichi
IC357-1004-053N
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
GND
GND
Copyright © 2009–2016, Texas Instruments Incorporated
R36
VBUS
VUSB
3
2
1
JP3
100nF
C5
R11
1M
AVCC
R6
R8
100nF
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
10
10
11
11
12
12
NR
13
AVSS 13
14
XOUT 14
15
15
XIN
16
16
AVCC
17 CPCAP 17
18
18
19
19
20
20
21
21
22
22
23
23
24
24
25
25
P1.0
Q2G$2
IO3
4
GND
5
IO4
6
VCC
IO2
2
IO1
1
R33
1k4
PUR
PU.0/DP
PU.1/DM
int
GND
1 JP1
2
DVCC1
DNP
Q3
QUARZ5
12pF
C2
DNP
XOUT
XIN
J1
C15
HCTC_XTL_4
Q2G$1
4
3
IC7
AVSS 22nF
TPD4E004
DVCC1
C12
100nF
DNP
2
1
HCTC_XTL_4
2
1
DNP
12pF
C1
+
ext
Vcc
GND
GND
10uF/6,3V
3
C13
100nF
GND
2
1
J4
GND
C9
470nF
XTLGND2
JP2
TP2
TP1
100
100
99
99
98
98
97
97
96
96
95 C
95
94 M
94
93 I
93
92 O
92
91
91
90 GND
90
89 DVCC1 89
88
88
87 VBAT 87
86 VBAK 86
85
85
84
84
83 AVSS 83
82 V18
82
81 VUSB 81
80 VBUS 80
79 PU.1/DM 79
78 PUR
78
77 PU.0/DP 77
76 GND
76
0R R4
J2
AVSS
R10
100R
S3
XTLGND1
P6.3/CB3/A3/OA1IP0
P6.2/CB2/A2/OA0IP0
P6.1/CB1/A1
P6.0/CB0/A0
RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
DVSS3
DVCC3
P5.7/DMAE0/RTCCLK
VBAT
VBAK
P7.3/XT2OUT
P7.2/XT2IN
AVSS2
V18
VUSB
VBUS
PU.1/DM
PUR
PU.0/DP
VSSU
DVCC1
DVSS1
VCORE
LCDCAP/R33
COM0
P5.3/COM1/S42
P5.4/COM2/S41
P5.5/COM3/S40
P1.0/TA0CLK/ACLK/S39
P1.1/TA0.0/S38
P1.2/TA0.1/S37
P1.3/TA0.2/S36
P1.4/TA0.3/S35
P1.5/TA0.4/S34
P1.6/TA0.1/S33
P1.7/TA0.2/S32
P3.0/TA1CLK/CBOUT/S31
P3.1/TA1.0/S30
P3.2/TA1.1/S29
P3.3/TA1.2/S28
P3.4/TA2CLK/SMCLK/S27
P3.5/TA2.0/S26
P3.6/TA2.1/S25
P3.7/TA2.2/S24
P4.0/TB0.0/S23
26
26
27
27
28
28
29
29
30
30
31
31
32
32
33
33
34 P1.0 34
35
35
36
36
37
37
38
38
39
39
40 P1.6 40
41 P1.7 41
42
42
43
43
44
44
45
45
46
46
47
47
48
48
49
49
50
50
SLAU278X – May 2009 – Revised February 2016
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142
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MSP-TS430PZ100AUSB
B.36 MSP-TS430PZ100AUSB
The development board MSP-TS430PZ100AUSB supports the MSP430FG662x and MSP430FG642x
flash devices in the 100-pin QFP package. MSP430FG6626IPZ devices are not included in the MSPTS430PZ100AUSB kit. Free samples can be ordered from
www.ti.com/product/MSP430FG6626/samplebuy.
J5
PWR3
Figure B-72. MSP-TS430PZ100AUSB Target Socket Module, Schematic
MSP-TS430PZ100AUSB
www.ti.com
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
Jumper JP1
Open to measure current
USB1
USB connector
Connector JTAG
For JTAG Tool
14
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
3
2
1
1
2
3
4
VCC
GND
GND
1
2
Connector J5
External power connector
Jumper JP3 to "ext"
+
1
1
1
1
2
2
2
2
3
3
3
3
3
3
2
2
1
1
95
90
85
80
76
75
1
100
5
70
Orient Pin 1 of MSP430 device
+
10
65
U1
15
60
20
Jumper JP2
Open to disconnect LED
55
26
30
35
40
45
50
51
25
D1
LED connected to P1.0
J2
J1
1 2 3
LED1, LED2, LED3
LEDs connected to P8.0, P8.1, P8.2
Jumpers LED 1, 2, 3
Open to disconnect LED1, LED2, LED3
Figure B-73. MSP-TS430PZ100AUSB Target Socket Module, PCB
SLAU278X – May 2009 – Revised February 2016
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Hardware 143
MSP-TS430PZ100AUSB
www.ti.com
Table B-37. MSP-TS430PZ100AUSB Bill of Materials
Pos.
Ref Des
No. Per
Board
1
PCB Rev. 1.1
1
99.65mm x 79.54mm
2 layers, red solder mask
2
C1, C2
2
12pF, SMD0805
DNP: C1, C2
3
C10, C12,
C17, C18
9
100nF, SMD0805
311-1245-2-ND
4
C15
1
22nF, CSMD0805
311-1242-1-ND
5
C16
1
4.7 nF SMD0603
311-1250-1-ND
6
C3, C4
2
47pF, CSMD0805
709-1337-1-ND
7
C33, C38
2
220n SMD0603
Buerklin: 53D2074
8
C35, C36
2
10p SMD0603
Buerklin: 56D102
9
C39
1
4u7 SMD0603
Buerklin: 53D2086
10
C40
1
0.1u SMD0603
Buerklin: 53D2068
11
C5, C11, C13,
C14, C19
5
100nF, SMD0805
311-1245-2-ND
12
C6, C7
2
10uF/6.3V, Tantal Size B
511-1463-2-ND
13
C8
1
2.2nF, CSMD0805
709-1339-1-ND
14
C9
1
470nF, SMD0805
478-1403-2-ND
516-1434-1-ND
Description
Digi-Key Part No.
Comment
DNP: C10, C12,C18, C17
15
D1
1
green LED, HSMG-C170
DIODE0805
16
D2, D4
2
LL103A, SOD-80
17
IC7
1
TPD4E004DRYR
296-23618-1-ND
Manu: TI
18
J1, J2, J3, J4
4
25-pin header, TH
SAM1029-25-ND
DNP: Headers enclosed in kit.
Keep vias free of solder.
19
J1, J2, J3, J4
4
25-pin receptacle, TH
SAM1213-25-ND
DNP: Receptacles enclosed in
kit. Keep vias free of solder.
20
J5
1
3-pin header, male, TH
SAM1035-03-ND
21
JP1, JP2, JP4
3
2-pin header, male, TH
SAM1035-02-ND
place jumper on header
22
JP11
1
4-pin header, male, TH
SAM1035-04-ND
Place jumper on Pin 1 and 2
23
JP3
1
3-pin header, male, TH
SAM1035-03-ND
place jumper on pins 1-2
24
JP5, JP6, JP7,
JP8, JP9,
JP10
6
3-pin header, male, TH
SAM1035-03-ND
place jumpers on pins 2-3
25
Jumpers for
JP1, JP2, JP3,
JP4, JP5, JP6,
JP7, JP8, JP9,
JP10, JP11
11
Jumper
15-38-1024-ND
26
JTAG
1
14-pin connector, male, TH
HRP14H-ND
27
LED
1
JP3QE
SAM1032-03-ND
28
LED1, LED2,
LED3
3
FARNELL: 852-9833
DNP
29
MSP430
2
MSP430FG6626IPZ
DNP: Free samples can be
ordered in the TI Store
30
Q2
1
Crystal
31
Q3
1
MS3V-T1R (32.768kHz/
20ppm/12.5pF)
32
R1, R2, R4
3
0 Ohm, SMD0805
541-0.0ATR-ND
33
R10
1
100R, R0603
541-100GCT-ND
34
R11
1
1M, R0603
541-1.0MGCT-ND
35
R13, R15, R16
3
470R SMD0603
Buerklin: 07E564
36
R14
1
0 Ohm, SMD0805
541-0.0ATR-ND
37
R3
1
330 Ohm, SMD0805
541-330ATR-ND
144
Hardware
Avago, Farnell 5790852
Buerklin: 24S3406
DNP
Q2: 4MHz
Buerklin: 78D134
DNP
SLAU278X – May 2009 – Revised February 2016
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Copyright © 2009–2016, Texas Instruments Incorporated
MSP-TS430PZ100AUSB
www.ti.com
Table B-37. MSP-TS430PZ100AUSB Bill of Materials (continued)
Ref Des
No. Per
Board
38
R33
1
1k4 / 1k5 SMD0603
Buerklin: 07E612
39
R34, R35
2
27R SMD0603
Buerklin: 07E444
40
R36
1
33k SMD0603
41
R5
1
47k Ohm, SMD0805
541-47000ATR-ND
42
R6, R8, R9,
R12
4
0 Ohm, SMD0805
541-000ATR-ND
DNP
43
S1, S2
1
PB
P12225STB-ND
DNP
44
S3
1
PB
P12225STB-ND
45
TP1, TP2
2
Test point
DNP, Keep vias free of solder
46
U1
1
Socket: IC357-1004-53N
Manuf.: Yamaichi
47
USB1
1
USB Receptacle
FARNELL: 117-7885
48
Insulating disk
for Q2
1
Insulating disk for Q2
ettinger.de 70.08.121
49
Rubber stand
off
4
Pos.
Description
Digi-Key Part No.
Comment
Buerklin: 07E740
Buerklin: 20H1724
SLAU278X – May 2009 – Revised February 2016
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Apply to corners at bottom side
Hardware
145
VCC
C
D
1 JP5
2
3
TDO 1
RST 2
RST/NMI 3
JP6
PJ.3
TCK
E
1 JP7
2
3
VASYS1/2
GND
E
PJ.2
TMS
IC1
1 JP8
2
3
PJ.1
TDI
VASYS1/2
GND
MSP430F677XIPEU#
F
1 JP9
2
3
PJ.0
TDO
JP10
1
2
3
~RST/NMI/SBWTDIO
PJ.3/TCK
PJ.2/TMS
PJ.1/TDI/TCLK
PJ.0/TDO
TEST/SBWTCK
P2.3/PM_TA1.0
P2.2/PM_TA0.2
P2.1/PM_TA0.1
P2.0/PM_TA0.0
P11.5/TACLK/RTCCLK
P11.4/CBOUT
P11.3/TA2.1
P11.2/TA1.1
P11.1/TA3.1/CB3
P11.0/S0
P10.7/S1
P10.6/S2
P10.5/S3
P10.4/S4
P10.3/S5
P10.2/S6
P10.1/S7
P10.0/S8
P9.7/S9
P9.6/S10
P9.5/S11
P9.4/S12
P9.3/S13
P9.2/S14
P9.1/S15
P9.0/S16
DVSS2
DVSYS
P8.7/S17
P8.6/S18
P8.5/S19
P8.4/S20
F
<- SBW
GND
DVDSYS
P2.1
P2.0
G
RST
PJ.3
PJ.2
PJ.1
PJ.0
TEST/SBWTCK
<- JTAG
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
J3
H
GND
DNP
BOOTST
TP1 TP2
C14
RST
R10
0R
DNP
10
8
6
4
2
Rev.:
DNP
R11
0R
VCC
1.1
I
GND
PWR3
I
Seite 1/1
Bearb.: Petersen
Dok:
1080/1/001/01.1
DNP
C9
100nF 4.7uF 100nF
GND
9
TEST/SBWTCK 7
5
3
1
P2.1
P2.0
DVDSYS
C6
GND
H
Titel: MSP430: Target-Socket
MSP-TS430PEU128 for F6779
MSP-TS430PEU128
File:
Datum: 22.05.2012 09:37:33
G
1
2
3
B
JTAG
R7 330R
VREF
GND
470nF
C10
C16
TCK
TEST/SBWTCK
AUXVCC1
4.7uF
C19
GND
XIN
XOUT
AUXVCC3
RTCCAP1
RTCCAP0
P1.5/SMCLK/CB0/A5
P1.4/MCLK/SDCLK/CB1/A4
P1.3/ADC10CLK/TACLK/RTCCLK/A3
P1.2/ACLK/TA3.1/A2
P1.1/TA2.1/VEREF+/A1
P1.0/TA1.1/TA0.0/VEREF-/A0
P2.4/PM_TA2.0
P2.5/PM_UCB0SOMI/PM_UCB0SCL
P2.6/PM_USB0SIMO/PM_UCB0SDA
P2.7/PM_UCB0CLK
P3.0/PM_UCA0RXD/PM_UCA0SOMI
P3.1/PM_UCA0TXD/PM_UCA0SIMO
P3.2/PM_UCA0CLK
P3.3/PM_UCA1CLK
P3.4/PM_UCA1RXD/PM_UCA1SOMI
P3.5/PM_UCA1TXD/PM_UCA1SIMO
COM0
COM1
P1.6/COM2
P1.7/COM3
P5.0/COM4
P5.1/COM5
P5.2/COM6
P5.3/COM7
LCDCAP/R33
P5.4/SDCLK/R23
P5.5/SD0DIO/LCDREF/R13
P5.6/SD1DIO/R03
P5.7/SD2DIO/CB2
P6.0/SD3DIO
P3.6/PM_UCA2RXD/PM_UCA2SOMI
P3.7/PM_UCA2TXD/PM_UCA2SIMO
P4.0/PM_UCA2CLK
GND
C4
4.7uF
RST/NMI
VCC1
GND
VCC1
4.7uF
C18
AUXVCC2
GND
100nF
TCK
TMS
TDI
TDO
TEST/SBWTCK
JP11 1
2
3
4
JP12 1
2
3
4
GND
C17
Vcc
JP3
13
11
9
7
5
3
1
XIN
XOUT
VEREF+
1
0R
R6
2
0R
R8
AUXVCC33
4
5
6
7
8
9
10
VEREF+
11
P1.0
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
LCDCAP
31
32
33
34
35
36
37
38
C15
4.7uF
14
12
10
8
6
4
2
DVDSYS
DNP
DNP
12pF
C2
LFXTCLK
12pFDNP
C1
AUXVCC3
10uF/6,3V
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
J4
4
3
2
1
FE04-1
1 JP1
2
RST
R5
47K
GND
VCC1
GND
DNP
J1
D
A3
6
5
4
3
2
1
Copyright © 2009–2016, Texas Instruments Incorporated
J5
VCC
DNP
GND
C3 2.2nF
C13
AVCC
C8
4.7uF
P1.0
JP13 1
2
3
4
AVSS
100nF
0R
0R
2
1
GND
C12
AVSS
LCDCAP
C29
4.7uF
GND
C
J2
100nF
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
0R
R4
100nF
C7
A
int
R2
R1
10uF/6,3V
C11
DVCC
VCC1
DVDSYS
ext
VCC1 JP4
C5
100nF
GND
JP2
GND
B
DNP
6
5
4
3
2
1
A
SLAU278X – May 2009 – Revised February 2016
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146
Q1
QUARZ5
1
2
GND
470nF
C26
VCORE
GND
DVCC
DVDSYS
AUXVCC1
AUXVCC2
VASYS1/2
AVCC
AVSS
SD6N0
SD6P0
SD5N0
SD5P0
SD4N0
SD4P0
VREF
AVSS
VASYS1/2
SD3N0
SD3P0
SD2N0
SD2P0
SD1N0
SD1P0
SD0N0
SD0P0
P4.1/PM_UCA3RXD/PM_UCA3SOMI
P4.2/PM_UCA3TXD/PM_UCA3SIMO
P4.3/PM_UCA3CLK
P4.4/PM_UCB1SOMI/PM_UCB1SCL
P4.5/PM_UCB1SIMO/PM_UCB1SDA
P4.6/PM_UCB1CLK
P4.7/PM_TA3.0
P6.1/SD4DIO/S39
P6.2/SD5DIO/S38
P6.3/SD6DIO/S37
P6.4/S36
P6.5/S35
P6.6/S34
P6.7/S33
P7.0/S32
P7.1/S31
P7.2/S30
P7.3/S29
P7.4/S28
P7.5/S27
P7.6/S26
P7.7/S25
P8.0/S24
P8.1/S23
P8.2/S22
P8.3/S21
R3
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
330R
D1
VCORE
DVSS1
DVCC
VDSYS
AUXVCC1
AUXVCC2
VASYS1
AVCC
AVSS1
SD6N0
SD6P0
SD5N0
SD5P0
SD4N0
SD4P0
VREF
AVSS2
VASYS2
SD3N0
SD3P0
SD2N0
SD2P0
SD1N0
SD1P0
SD0N0
SD0P0
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
www.ti.com
MSP-TS430PEU128
B.37 MSP-TS430PEU128
Figure B-74. MSP-TS430PEU128 Target Socket Module, Schematic
MSP-TS430PEU128
www.ti.com
JP11, JP12, JP13
Connect 1-2 to connect AUXVCCx with DVCC or
drive AUXVCCx externally
GND
GND
1
3
2
1
3
2
1
3
2
1
JP6
JP7
JP8
JP9
95
14
90
IC1
1
2
Connector J5
External power connector
Jumper JP3 to "ext"
Jumpers JP5 to JP10
Close 1-2 to debug in Spy-Bi-Wire mode
Close 2-3 to debug in 4-wire JTAG mode
Connector JTAG
For JTAG Tool
10
80
C14
25
R11 R10
20
2
1
JTAG
C2
R6
85
15
1
2
3
JP5
C7
C4
C16
1
2
3
SBW
3
2
1234
1
C19
DVCC
C13
C8
1234
C6
C9
C26
C10
C15
C17
C5
C11
C18
AUXVCC
3
JTAG
AUXVCC1
JP11
4
GND
R8
C1
Orient Pin 1 of
MSP430 device
R5
C3
105
RST/NMI
TCK
TMS
TDI
TDO
TEST/SBWTCK
100
110
J5
JP10 R7
115
5
10
Jumper JP2
Open to disconnect LED
120
P1.0
JP2 R3 D1
D1
LED connected to P1.0
125
AUXVCC3
JP13
C12
AUXVCC2
JP12
1
R4
128
VCC
JP4
J4
GND
J1
JP1
R1
R2
TP1
Jumper JP1
Open to measure current
Connector BOOTST
For Bootloader Tool
75
2
1
C29
1
30
BOOTST
int
70
MSP-TS430PEU128
RoHS
Rev. 1.1
ext
Jumper JP3
1-2 (int): Power supply from JTAG interface
2-3 (ext): External power supply
DVDSYS
65
35
JP3
40
45
50
55
J2
60
64
J3
TP2
GND
Figure B-75. MSP-TS430PEU128 Target Socket Module, PCB
NOTE: For bootloader use, the BSL connector and only one of the resistors R10 or R11 must be
populated. If the board is supplied internally, R11 (0 Ω) must be assembled. If the board is
supplied externally, R10 (0 Ω) must be assembled, and R11 must be removed.
NOTE: The MSP-TS430PEU128 Rev 1.1 ships with the following modifications:
•
R7 value is changed to 0 Ω instead of 330 Ω.
•
JTAG pin 8 is connected only to JP5 pin 3, and not to pin 2.
•
JP5 pin 2 is connected to IC1 pin 97.
•
BOOTST pin 7 is connected to IC1 pin 97.
SLAU278X – May 2009 – Revised February 2016
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Table B-38. MSP-TS430PEU128 Bill of Materials
Pos.
Ref Des
No. Per
Board
1
PCB
1
2
D1
3
JP1, JP2, JP4
4
JP5, JP6, JP7, JP8,
JP9, JP10
6
5
JP11, JP12, JP13
6
JP3
7
JP1, JP2, JP3, JP4,
JP5, JP6, JP7, JP8,
JP9, JP10, JP11,
JP12, JP13
13
8
R1, R2, R4, R6, R8
9
R10, R11
10
C3
11
C13, C14, C16, C17,
C18, C19, C29
7
12
C11
13
C12
14
148
Description
Digi-Key Part No.
Comment
94x119.4mm, 4 layers
MSP-TS430PEU128
Rev. 1.1
1
green LED, DIODE0805
516-1434-1-ND
3
2-pin header, male, TH
SAM1035-02-ND
Place jumper on header
3-pin header, male, TH
SAM1035-03-ND
Place jumpers on pins 1-2 (SBW)
3
4-pin header, male, TH
SAM1035-04-ND
Place jumpers on pins 1-2 (AVCC=VCC)
1
4-pin header, male, TH
SAM1035-04-ND
Place jumpers on pins 1-2
Jumper
WM4592-ND
5
0R, 0805
541-0.0ATR-ND
2
0R, 0805
541-0.0ATR-ND
DNP
1
2.2nF, CSMD0805
490-1628-2-ND
DNP
4.7uF, 6.3V, CSMD0805
587-1302-2-ND
1
10uF, 6.3V, CSMD0805
445-1372-2-ND
1
10uF, 6.3V, CSMD0805
445-1372-2-ND
DNP
C1, C2
2
12pF, CSMD0805
490-5531-2-ND
DNP
15
R5
1
47K, 0805
311-47KARTR-ND
16
C4, C5, C6, C7, C8,
C15
6
100nF, CSMD0805
311-1245-2-ND
17
C9
1
100nF, CSMD0805
311-1245-2-ND
18
R3, R7
2
330R, 0805
541-330ATR-ND
19
C10, C26
2
470nF, CSMD0805
587-1282-2-ND
20
BOOTST
1
10-pin connector, male, TH
HRP10H-ND
21
JTAG
1
14-pin connector, male, TH
HRP14H-ND
22
IC1 Socket
1
Socket: IC500-1284-009P
23
IC1
2
MSP430F67791IPEU
24
J5
1
3-pin header, male, TH
25
Q1
1
Crystal: MS3V-T1R 32.768kHz
12.5pF ±20ppm
DNP: Crystal enclosed with kit. Keep vias free
of solder
26
TP1, TP2
2
Test point
DNP, keep vias free of solder
27
J2,J4
2
28
J2,J4
2
29
J1, J3
2
30
J1, J3
2
31
Rubber feet
4
Hardware
4 layers, green solder mask
DNP
DNP, keep vias free of solder
Manuf. Yamaichi
DNP: enclosed with kit. Is supplied by TI
SAM1035-03-ND
26-pin header, TH
SAM1029-26-ND
DNP: Headers enclosed with kit. Keep vias free
of solder.
26-pin receptable, TH
SAM1213-26-ND
DNP: Receptacles enclosed with kit. Keep vias
free of solder.
38-pin header, TH
SAM1029-38-ND
DNP: Headers enclosed with kit. Keep vias free
of solder.
38-pin receptable, TH
SAM1213-38-ND
DNP: Receptacles enclosed with kit. Keep vias
free of solder.
Rubber feet
Buerklin: 20H1724
apply to bottom side corners
SLAU278X – May 2009 – Revised February 2016
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EM430F5137RF900
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B.38 EM430F5137RF900
Figure B-76. EM430F5137RF900 Target Board, Schematic
SLAU278X – May 2009 – Revised February 2016
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EM430F5137RF900
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Connector JTAG
For JTAG Tool
Jumper JP2
Close INT for power supply from JTAG interface
Close EXT to external power supply (CON12)
Jumper JP3
Open to measure current
CON12
External power connector
Jumper JP2 to "EXT"
Connector BOOTST
For Bootloader Tool
VCC
GND
GND
Jumper JP1
Close JTAG position to debug in 4-wire JTAG mode
Close SBW position to debug in Spy-Bi-Wire mode
Jumper JP1 in Spy-Bi-Wire mode
Jumpers JP5, JP10
Open to disconnect LEDs
D2
LED (red) connected
to P3.6 through JP10
D1
LED (green) connected
to P1.0 through JP5
Push-button S2
Connected to P1.7
Q3
Footprint for 32-kHz crystal
Crystal Q1
RF - 26 MHz
R431 and R441
Use 0-W resistor to make XIN and XOUT
available on connector Port 5
Button S1
Reset
X1
RF - Signal SMA
Figure B-77. EM430F5137RF900 Target board, PCB
The battery pack that is included with the EM430F5137RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
150 Hardware
SLAU278X – May 2009 – Revised February 2016
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EM430F5137RF900
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Table B-39. EM430F5137RF900 Bill of Materials
Item
Reference
No. per
Board
1
Q1
1
( CUSTOMER SUPPLY )
CRYSTAL, SMT, 4P, 26MHz
2
C1-C5, C082,
C222, C271,
C281, C311,
C321, C341,
C412, C452
14
CAPACITOR, SMT, 0402, CER,
16V, 10%, 0.1uF
3
C071
1
CAPACITOR, SMT, 0603,
CERAMIC, 0.47uF, 16V, 10%,
X5R
4
R401
1
RES0402, 47.0K
Description
Value
Manufacturer's Part
Number
Manufacturer
ASX-531(CS)
AKER
ELECTRONIC
0.1uF
0402YC104KAT2A
AVX
0.47uF
0603YD474KAT2A
AVX
CRCW04024702F100
DALE
09 18 514 6323
HARTING
09 18 510 6323
HARTING
26M
47kΩ
5
CON11
1
HEADER, THU, MALE, 14P,
2X7, 25.4x9.2x9.45mm
6
CON10
0
HEADER, THU, MALE, 10P,
2X5, 20.32x9.2x9.45mm
7
D1
1
LED, SMT, 0603, GREEN, 2.1V
active
APT1608MGC
KINGBRIGHT
8
D2
1
LED, SMT, 0603, RED, 2.0V
active
APT1608EC
KINGBRIGHT
MS1V-T1K (UN)
MICRO
CRYSTAL
22-03-5035
MOLEX
9
Q3
0
UNINSTALLED CRYSTAL, SMT,
3P, MS1V (Customer Supply)
10
CON12
1
HEADER, THU, MALE, 3P, 1x3,
9.9x4.9x5.9mm
11
C251, C261
2
50V, 5%, 27pF
27pF
GRM36COG270J50
MURATA
1kΩ
BLM15HG102SN1D
MURATA
GRM1555C1H101JZ01
MURATA
32.768k
12
L341
1
FERRITE, SMT, 0402, 1.0kΩ,
250mA
13
C293
1
CAPACITOR, SMT, 0402,
CERAMIC, 100pF, 50V, 0.25pF,
C0G(NP0)
100pF
14
L304
1
INDUCTOR, SMT, 0402, 2.2nH,
0.1nH, 220mA, 500MHz
0.0022u
H
LQP15MN2N2B02
MURATA
15
L303, L305
2
INDUCTOR, SMT, 0402, 15nH,
2%, 450mA, 250MHz
0.015uH
LQW15AN15NG00
MURATA
16
L292, L302
2
INDUCTOR, SMT, 0402, 18nH,
2%, 370mA, 250MHz
0.018uH
LQW15AN18NG00
MURATA
17
C291
1
CAPACITOR, SMT, 0402,
CERAMIC, 1pF, 50V, 0.05pF,
C0G(NP0)
18
C303
1
19
C292, C301C302, C304
20
1pF
GRM1555C1H1R0WZ01 MURATA
CAPACITOR, SMT, 0402,
CERAMIC, 8.2pF, 50V, 0.05pF,
C0G(NP0)
8.2pF
GRM1555C1H8R2WZ01 MURATA
4
CAPACITOR, SMT, 0402,
CERAMIC, 1.5pF, 50V, 0.05pF,
C0G(NP0)
1.5pF
GRM1555C1H1R5WZ01 MURATA
L291, L301
2
INDUCTOR, SMT, 0402, 12nH,
2%, 500mA, 250MHz
0.012uH
21
C282, C312,
C351, C361,
C371
5
CAPACITOR, SMT, 0402,
CERAMIC, 2pF, 50V, 0.1pF,
C0G
22
L1
1
INDUCTOR, SMT, 0402, 6.2nH,
0.1nH, 130mA, 500MHz
23
S1-S2
2
ULTRA-SMALL TACTILE
SWITCH, SMT, 2P, SPST-NO,
1.2x3x2.5mm, 0.05A, 12V
24
R4-R5, R051,
R061, R431,
R441
0
UNINSTALLED
RESISTOR/JUMPER, SMT,
0402, 0 Ω, 5%, 1/16W
24a
R7
1
RESISTOR/JUMPER, SMT,
0402, 0 Ω, 5%, 1/16W
LQW15AN12NG00
MURATA
2.0pF
GRM1555C1H2R0BZ01
Murata
6.2nH
LQP15MN6N2B02
Murata
B3U-1000P
OMRON
0Ω
ERJ-2GE0R00X
PANASONIC
0Ω
ERJ-2GE0R00X
PANASONIC
SLAU278X – May 2009 – Revised February 2016
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Comment
DNP
DNP
DNP
Hardware
151
EM430F5137RF900
www.ti.com
Table B-39. EM430F5137RF900 Bill of Materials (continued)
Item
Reference
No. per
Board
25
R2-R3, R6
3
RESISTOR, SMT, 0402, THICK
FILM, 5%, 1/16W, 330
330Ω
ERJ-2GEJ331
PANASONIC
26
C431, C441
0
CAPACITOR, SMT, 0402, CER,
12pF, 50V, 5%, NPO
12pF
ECJ-0EC1H120J
PANASONIC
27
C401
1
CAPACITOR, SMT, 0402, CER,
2200pF, 50V, 10%, X7R
0.0022uF ECJ-0EB1H222K
PANASONIC
28
R331
1
RESISTOR, SMT, THICK FILM,
56K, 1/16W, 5%
56kΩ
ERJ-2GEJ563
PANASONIC
29
C081, C221,
C411, C451
4
CAPACITOR, SMT, 0603,
CERAMIC, 10uF, 6.3V, 20%,
X5R
10uF
ECJ-1VB0J106M
PANASONIC
30
R1
1
RESISTOR/JUMPER, SMT,
0402, 0 Ω, 5%, 1/16W
0Ω
ERJ-2GE0R00X
PANASONIC
31
C041
0
UNINSTALLED CAP CERAMIC
4.7UF 6.3V X5R 0603
4.7uF
ECJ-1VB0J475K
Panasonic
32
X1
1
SMA STRIGHT JACK, SMT
32K10A-40ML5
ROSENBERGER
33
Q2
0
Crystal, SMT, 32.768 kHz
MS3V-T1R
Micro Crystal
U1
1
DUT, SMT, PQFP, RGZ-48,
0.5mmLS, 7.15x7.15x1mm,
THRM.PAD
CC430F5137
TI
35
JP1
1
Pin Connector 2x4pin
61300821121
WUERTH
36
CON1-CON9
0
Pin Connector 2x4pin
61300821121
WUERTH
37
JP2
1
Pin Connector 1x3pin
61300311121
WUERTH
38
JP3, JP5,
JP10
3
Pin Connector 1x2pin
61300211121
WUERTH
38a
JP7, CON13
0
Pin Connector 1x2pin
61300211121
WUERTH
DNP
39
JP4
1
Pin Connector 2x2pin
61300421121
WUERTH
DNP
40
JP1a
1
Pin Connector 2x3pin
61300621121
WUERTH
34
152
Hardware
Description
Value
32.768k
Manufacturer's Part
Number
Manufacturer
Comment
DNP
DNP
DNP
SLAU278X – May 2009 – Revised February 2016
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B.39 EM430F6137RF900
Figure B-78. EM430F6137RF900 Target Board, Schematic
SLAU278X – May 2009 – Revised February 2016
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Connector JTAG
For JTAG Tool
Connector BOOTST
For Bootloader Tool
Jumper JP2
Close INT for power supply from JTAG interface
Close EXT to external power supply (CON12)
Jumper JP3
Open to measure current
CON12
External power connector
Jumper JP2 to "EXT"
Jumper JP1
Close JTAG position to debug in 4-wire JTAG mode
Close SBW position to debug in Spy-Bi-Wire mode
VCC
GND
GND
Jumper JP1 in Spy-Bi-Wire mode
Jumpers JP5, JP10
Open to disconnect LEDs
D2
LED (red) connected
to P3.6 through JP10
D1
LED (green) connected
to P1.0 through JP5
Push-button S2
Connected to P1.7
Q2/Q3
Footprint for 32-kHz crystal
R541 and R551
Use 0-W resistor to make P5.0 and P5.1
available on connector Port 5
Crystal Q1
RF - 26 MHz
Button S1
Reset
C392
C422
L451
X1
RF - Signal SMA
Figure B-79. EM430F6137RF900 Target Board, PCB
The battery pack that is included with the EM430F6137RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
154 Hardware
SLAU278X – May 2009 – Revised February 2016
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EM430F6137RF900
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Table B-40. EM430F6137RF900 Bill of Materials
Pos.
Ref Des
No. per
Board
1
Q1
1
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,
26MHz
ASX-531(CS)
AKER
ELECTRONIC
2
C1-C5, C112,
C252, C381,
C391, C421,
C431, C451,
C522, C562
14
CAPACITOR, SMT, 0402, CER, 16V, 10%,
0.1uF
0402YC104KAT2A
AVX
3
C101
1
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
16V, 10%, X5R
0603YD474KAT2A
AVX
4
R511
1
RES0402, 47.0K
CRCW04024702F100
DALE
09 18 514 6323
HARTING
Description
Part No.
Manufacturer
5
CON11
1
HEADER, THU, MALE, 14P, 2X7,
25.4x9.2x9.45mm, 90deg
7
D1
1
LED, SMT, 0603, GREEN, 2.1V
APT1608MGC
KINGBRIGHT
8
D2
1
LED, SMT, 0603, RED, 2.0V
APT1608EC
KINGBRIGHT
10
CON12
1
HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm
22-03-5035
MOLEX
11
C361, C371
2
50V, ±5%, 27pF
GRM36COG270J50
MURATA
12
L451
1
FERRITE, SMT, 0402, 1.0kΩ, 250mA
BLM15HG102SN1D
MURATA
GRM1555C1H101JZ01
MURATA
13
C403
1
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
50V, ±0.25pF, C0G(NP0)
14
L414
1
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
1000mA, 250MHz
LQW15AN2N2C10
MURATA
15
L413, L415
2
INDUCTOR, SMT, 0402, 15nH, ±5%, 460mA,
250MHz
LQW15AN15NJ00
MURATA
16
L402, L412
2
INDUCTOR, SMT, 0402, 18nH, ±5%, 370mA,
250MHz
LQW15AN18NJ00
MURATA
17
C401
1
CAPACITOR, SMT, 0402, CER, 1pF, 50V,
±0.25pF, NP0
GJM1555C1H1R0CB01D
MURATA
18
C413
1
CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H8R2CZ01
MURATA
19
C402, C411C412, C414
4
CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H1R5CZ01
MURATA
20
L401, L411
2
INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,
250MHz
LQW15AN12NJ00
MURATA
21
C46-C48, C392,
C422
5
CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H2R0CZ01
Murata
22
L1
1
INDUCTOR, SMT, 0402, 6.2nH, ±0.1nH, 700mA,
LQW15AN6N2D00
250MHz
Murata
23
S1-S2
2
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
B3U-1000P
OMRON
24
R7
1
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
1/16W
ERJ-2GE0R00X (UN)
PANASONIC
25
R2-R3, R6
3
RESISTOR, SMT, 0402, THICK FILM, 5%,
1/16W, 330
ERJ-2GEJ331
PANASONIC
27
C511
1
CAPACITOR, SMT, 0402, CER, 2200pF, 50V,
10%, X7R
ECJ-0EB1H222K
PANASONIC
28
C111, C251,
C521, C561
4
CAPACITOR, SMT, 0603, CERAMIC, 10uF,
6.3V, 20%, X5R
ECJ-1VB0J106M
PANASONIC
28a
C041
1
CAP CERAMIC 4.7UF 6.3V X5R 0603
ECJ-1VB0J475M
PANASONIC
29
R441
1
RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602
PANASONIC
ERJ-2GE0R00X
PANASONIC
30
R1
1
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
1/16W
31
X1
1
SMA STRIGHT JACK, SMT
32K10A-40ML5
ROSENBERGER
CC430F6137
TI
61300821121
WUERTH
33
U1
1
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
9.15x9.15x1mm, THRM.PAD
34
JP1
1
Pin Connector 2x4pin
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EM430F6137RF900
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Table B-40. EM430F6137RF900 Bill of Materials (continued)
Pos.
Ref Des
No. per
Board
Description
Part No.
Manufacturer
35
JP2
1
Pin Connector 1x3pin
61300311121
WUERTH
36a
JP3, JP5, JP10
3
Pin Connector 1x2pin
61300211121
WUERTH
38
JP1a
1
Pin Connector 2x3pin
61300621121
WUERTH
156
Hardware
SLAU278X – May 2009 – Revised February 2016
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EM430F6147RF900
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B.40 EM430F6147RF900
Figure B-80. EM430F6147RF900 Target Board, Schematic
SLAU278X – May 2009 – Revised February 2016
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EM430F6147RF900
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Connector JTAG
For JTAG Tool
Jumper JP9
TPS status
Jumper JP3
Open to measure current
Connector BOOTST
For Bootloader Tool
Jumpers JP6 and JP8
Close 1-2 for Bypass mode
Close 2-3 for TPS mode
TPS62730
CON12
External poser connector
Jumper JP2 to "EXT"
Jumper JP2
Close INT: Power supply from JTAG interface
Close EXT: External power supply
Jumpers JP5 and JP10
Open to disconnect LEDs
Jumper JP1
Close JTAG position to debug in JTAG mode
Close SBW position to debug in Spy-BI-Wire mode
D2
LED (red) connected
to P3.6 through JP10
D1
LED (green) connected
to P1.0 through JP5
Button S2
Connected to P1.7
Orient pin 1 of MSP430 device
32-kHz crystal
Crystal Q1
RF - 26 MHz
SMA1
RF - Signal SMA
R554 and R551
Use 0-W resistor to make P5.0 and P5.1
available on connector Port 5
Button S1
Reset
Figure B-81. EM430F6147RF900 Target Board, PCB
The battery pack which comes with the EM430F6147RF900 kit may be connected to CON12. Ensure
correct battery insertion regarding the polarity as indicated in battery holder.
158 Hardware
SLAU278X – May 2009 – Revised February 2016
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EM430F6147RF900
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Table B-41. EM430F6147RF900 Bill of Materials
Pos.
Ref Des
No. per
Board
1
Q1
1
( CUSTOMER SUPPLY ) CRYSTAL, SMT, 4P,
26MHz
ASX-531(CS)
AKER
ELECTRONIC
2
C1-5 C112
C252 C381
C391 C421
C431 C451
C522 C562
14
CAPACITOR, SMT, 0402, CER, 16V, 10%,
0.1uF
0402YC104KAT2A
AVX
3
C101
1
CAPACITOR, SMT, 0603, CERAMIC, 0.47uF,
16V, 10%, X5R
0603YD474KAT2A
AVX
4
R511
1
RES0402, 47.0K
CRCW04024702F100
DALE
09 18 514 6323
HARTING
Description
Part No.
Manufacturer
5
CON11
1
HEADER, THU, MALE, 14P, 2X7,
25.4x9.2x9.45mm, 90deg
7
D1
1
LED, SMT, 0603, GREEN, 2.1V
APT1608MGC
KINGBRIGHT
8
D2
1
LED, SMT, 0603, RED, 2.0V
APT1608EC
KINGBRIGHT
10
CON12
1
HEADER, THU, MALE, 3P, 1x3, 9.9x4.9x5.9mm
22-03-5035
MOLEX
11
C361, C371
2
50V, ±5%, 27pF
GRM36COG270J50
MURATA
12
L451
1
Inductor, SMD, 0402, 12nH, 5%, 370mA
LQW15AN12NJ00
MURATA
GRM1555C1H101JZ01
MURATA
13
C403
1
CAPACITOR, SMT, 0402, CERAMIC, 100pF,
50V, ±0.25pF, C0G(NP0)
14
L414
1
INDUCTOR, SMT, 0402, 2.2nH, ±0.2nH,
1000mA, 250MHz
LQW15AN2N2C10
MURATA
15
L413
1
Inductor, SMD, 0402, 15nH, 5%, 370mA,
250MHz
LQW15AN15NJ00
MURATA
15
L415
1
INDUCTOR,SMT,0402,15nH,±5%,460mA,250M
Hz
LQW15AN15NJ00
MURATA
16
L402, L412
2
Inductor, SMD, 0402, 18nH, 5%, 460mA,
250MHz
LQW15AN18NJ00
MURATA
17
C401
1
CAPACITOR, SMT, 0402, CER, 1pF, 50V,
±0.25pF, NP0
GJM1555C1H1R0CB01D
MURATA
18
C413
1
CAPACITOR, SMT, 0402, CERAMIC, 8.2pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H8R2CZ01
MURATA
19
C402, C411C412, C414
4
CAPACITOR, SMT, 0402, CERAMIC, 1.5pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H1R5CZ01
MURATA
20
L1, L401, L411
3
INDUCTOR, SMT, 0402, 12nH, ±5%, 500mA,
250MHz
LQW15AN12NJ00
MURATA
21
C46-C48, C392
4
CAPACITOR, SMT, 0402, CERAMIC, 2.0pF,
50V, ±0.25pF, C0G(NP0)
GRM1555C1H2R0CZ01
MURATA
22
L2
1
Inductor, SMD, 0805, 2.2uH, 20%, 600mA,
50MHz
LQM21PN2R2MC0
MURATA
23
S1-S2
2
ULTRA-SMALL TACTILE SWITCH, SMT, 2P,
SPST-NO, 1.2x3x2.5mm, 0.05A, 12V
B3U-1000P
OMRON
24
R1, R7, R551,
R554
4
RESISTOR/JUMPER, SMT, 0402, 0 Ω, 5%,
1/16W
ERJ-2GE0R00X (UN)
PANASONIC
25
R2-R3, R6
3
RESISTOR, SMT, 0402, THICK FILM, 5%,
1/16W, 330
ERJ-2GEJ331
PANASONIC
27
C511
1
CAPACITOR, SMT, 0402, CER, 2200pF, 50V,
10%, X7R
ECJ-0EB1H222K
PANASONIC
28
C111, C251,
C521, C561
4
CAPACITOR, SMT, 0603, CERAMIC, 1uF, 6.3V,
ECJ-1VB0J105K
20%, X5R
PANASONIC
28a
C041
1
CAP CERAMIC 4.7UF 6.3V X5R 0603
PANASONIC
29
R441
1
RESISTOR, SMT, THICK FILM, 56K, 1/16W, 1% ERJ-2RKF5602
PANASONIC
30
X1
1
SMA STRIGHT JACK, SMT
32K10A-40ML5
ROSENBERGER
1
DUT, SMT, PQFP, RGC-64, 0.5mmLS,
9.15x9.15x1mm, THRM.PAD
CC430F6147
TI
31
U1
ECJ-1VB0J475M
SLAU278X – May 2009 – Revised February 2016
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Hardware
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EM430F6147RF900
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Table B-41. EM430F6147RF900 Bill of Materials (continued)
Pos.
Ref Des
No. per
Board
33
U2
1
IC, Step Down Converter with Bypass Mode for
Low Power Wireless
TPS62370
TI
34
JP1
1
Pin Connector 2x4pin
61300821121
WUERTH
35
JP2, JP6, JP8
3
Pin Connector 1x3pin
61300311121
WUERTH
36a
JP3, JP5, JP9,
JP10
4
Pin Connector 1x2pin
61300211121
WUERTH
38
JP1a
1
Pin Connector 2x3pin
61300621121
WUERTH
38
C7
1
Capacitor, Ceramic, 1206, 16V, X5R, 20%
GRM31CR61C226ME15L
MURATA
38
C8-9
2
CAP, SMD, Ceramic, 0402, 2.2uF, X5R
GRM155R60J225ME15D
MURATA
1
CAP, SMD, Ceramic, 0603, 4.7uF, 16V, 10%,
X5R
38
160
C041
Hardware
Description
Part No.
Manufacturer
MURATA
SLAU278X – May 2009 – Revised February 2016
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MSP-FET
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B.41 MSP-FET
The MSP-FET is a powerful flash emulation tool to quickly begin application development on MSP430
microcontrollers.
The MSP-FET provides a USB interface to program and debug the MSP430 devices in-system through
the JTAG interface or the pin-saving Spy-Bi-Wire (2-wire JTAG) protocol. Furthermore, the USB interface
can be used for UART backchannel and MSP target BSL communication. UART and I2C BSL
communication modes are supported.
The MSP-FET development tool supports development with all MSP430 devices and is designed for use
with PCBs that contain MSP430 devices; for example, the MSP430 target socket boards.
B.41.1 Features
•
•
•
•
•
USB debugging interface to connect a MSP430 MCU to a PC for real-time in-system programming and
debugging
Software configurable supply voltage between 1.8 V and 3.6 V at 100 mA
Supports JTAG Security Fuse blow to protect code
Supports all MSP430 boards with JTAG header
Supports both JTAG and Spy-Bi-Wire (2-wire JTAG) debug protocols
B.41.2 Release Notes
The MSP-FET is supported by MSP Debug Stack (MSPDS) revision 3.4.0.20 and higher. Observe the
following MSPDS-specific MSP-FET limitations.
B.41.2.1
•
•
•
MSPDS 3.4.0.20 Limitations
EEM access to F149 and L092 devices is possible only when JTAG speed is set to slow.
Poly Fuse Blow in Spy-Bi-Wire mode is in beta state and is not officially supported.
The UART backchannel function is not implemented (even though an additional COM port is shown on
the PC).
B.41.2.2 MSPDS UART Backchannel Implementation
In MSPDS v3.4.1.0 and later, the UART backchannel function is implemented and supported for the MSPFET. The baud rates that are supported depend on the target configuration and the debug settings.
Table B-42 shows which baud rates are supported with certain configuration combinations.
A green cell with ✓ means that the corresponding baud rate is supported without any data loss with the
specified combination of settings.
A red cell with ✗ means that the corresponding baud rate is not supported (data loss is expected) with the
specified combination of settings.
Table B-42. UART Backchannel Implementation
Target MCLK
Frequency:
1 MHz
1 MHz
8 MHz
8 MHz
1 MHz
1 MHz
8 MHz
8 MHz
Debugger:
Active
Active
Active
Active
Inactive
Inactive
Inactive
Inactive
Flow Control:
No
Yes
No
Yes
No
Yes
No
Yes
4800 baud
✓
✓
✓
✓
✓
✓
✓
✓
9600 baud
✓
✓
✓
✓
✓
✓
✓
✓
19200 baud
✓
✓
✓
✓
✓
✓
✓
✓
28800 baud
✗
✓
✓
✓
✓
✓
✓
✓
38400 baud
✗
✓
✗
✓
✗
✓
✓
✓
57200 baud
✗
✓
✗
✓
✗
✓
✗
✓
115200 baud
✗
✗
✗
✓
✗
✗
✗
✓
SLAU278X – May 2009 – Revised February 2016
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Figure B-82. MSP-FET Top View
Figure B-83. MSP-FET Bottom View
B.41.2.3 MSPDS UART Backchannel Activation Commands
The MSP-FET supports two different backchannel UART modes, one with flow control and one without.
The different modes can be selected by opening the corresponding COM port with a dedicated baud rate.
See Table B-43 for the specific baud rates for each command.
NOTE: The baud rates used by these commands cannot be used for communication.
If none of the specified commands are transferred before setting the communication baud rate,
communication starts with these default settings: 3.3-V target VCC, no flow control mechanism.
Table B-43. UART Backchannel Activation Commands
Baud Rate
162
Command
9620
Set all backchannel UART pins to high impedance – no current flow into target device
9621
Configure backchannel UART communication without handshake (default start behavior)
9622
Configure backchannel UART communication with handshake
9623
Voltage configuration command.
When this command is received, target VCC is set to 3300 mV. After target VCC is configured, it is switched
through to the target device.
Hardware
SLAU278X – May 2009 – Revised February 2016
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MSP-FET
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B.41.2.4 MSPDS MSP Target BSL Activation Commands
The MSP-FET can be used for communication with the target device BSL through the I2C and UART
protocols. The activation of the different protocols is equivalent to the MSP-FET backchannel UART. See
Table B-44 for command details. In MSP-FET BSL communication mode, flow control is not available,
because this is not supported by the MSP target device BSL.
UART BSL: The MSP-FET BSL UART mode supports the following baud rates: 9600, 14400, 19200,
28800, 38400, 56000, 57600, and 115200. For the BSL UART, 8 + 1 + even parity is used.
I2C BSL: The MSP-FET is always the I2C master, and the target device BSL is always the I2C slave. 7-bit
I2C addressing mode is used with a fixed I2C slave address of 0x48.
NOTE: If the MSP-FET is configured to support BSL communication, debugger functionality is
disabled. To switch to debugger mode, either perform a power cycle (unplug the USB cable)
or configure the baud rate to 8001.
Table B-44. MSP Target BSL Activation Commands
Baud Rate
Command
2
9620
Set all UART or I C pins to high impedance – no current flow into target device
9601
BSL entry sequence and power up 3.3 V (UART BSL)
100000 or 100001
BSL entry sequence and power up 3.3 V (I2C BSL)
400000 or 400001
BSL entry sequence and power up 3.3 V (I2C BSL)
9623
Power up 3.3 V
8001
Activate debugger
SLAU278X – May 2009 – Revised February 2016
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Hardware
163
1
A
J1
A
C
D7
B0530W-7-F
0R
R17
B
VBUS bypass
27R
27R
C31
10p
1
C33
10p
1
C70
4.7u, dnp
GND1
R62
100R
C
100n
C71
GND1
USB BSL activation
VBUS5
VBUS
PUR
PU.0/DP
PU.1/DM
1 P6.4/CB4/A4
VUSB
A_VCC_DT
2 P6.5/CB5/A5
J5
A_VCC_DT_BSR
1k4 R2
R61
1M
1
VCC_DT_SENSE
3 P6.6/CB6/A6/DAC0
4 P6.7/CB7/A7/DAC1
5 P7.4/CB8/A12
LED0
7 P7.6/CB10/A14/DAC0
DCDC_TEST
8 P7.7/CB11/A15/DAC1
6 P7.5/CB9/A13
VCC_DT_REF
DCDC_RST
VCC_DCDC_REF
9 P5.0/VREF+/VEREF+
MCU_P2.1
DCDC_PULSE
MCU_DMAE0
21
20 P2.3/P2MAP3
19 P2.2/P2MAP2
18 P2.1/P2MAP1
17 P2.0/P2MAP0
16 P5.6/ADC12CLK/DMAE0
P2.5/P2MAP5
P2.6/P2MAP6/R03
P2.7/P2MAP7/LCDREF/
DVCC1
D
1
Host MCU
HOST_TDO
USB interface
1
R3
100n
R45
1
100n
C6
VREF+
10 P5.1/VREF-/VEREF11 AVCC1
MCU_P2.2
22
AVCC_POD
FPGA_RESET
12 AVSS1
13 XIN
14 XOUT
MCU_P2.3
23
15 AVSS2
MCU_P2.4
24
U1
3
2
P1
MSP430F6638IPZR
1
1
220n
C8
1
1
E
P9.3/S4 71
P9.4/S3 72
P9.5/S2 73
P9.6/S1 74
P9.7/S0 75
FPGA_TCK
FPGA_TDI
FPGA_TMS
FPGA_TDO
FPGA_TRST
MCU_P9.5
VCC_DT2SUPPLY_CTRL
PWM_SETVF
F
HOST_RST
P9.2/S5 70
HOST_SDA
of
A
3/12/2014
4k7
R28
4k7
R30
Rev
1
5
F
HOST_SCL
VCC_POD33
Debug i/f
27k
R76
1n
C55
P9.1/S6 69
GND1
P9.0/S7 68
1
MSP-FET Rev 1.2
MCU_P4.1
MCU_P4.2
MCU_P4.3
MCU_P4.4
MCU_P4.5
MCU_P4.6
MCU_P4.7
VCC_DT2TRGT_CTRL
MCU_P8.1
MCU_P8.2
MCU_P8.3
DCDC_IO0
VCC_POD33
VCC_SUPPLY2TRGT_CTRL
P4.2/TB0.2/S21 52
P4.3/TB0.3/S20 53
P4.4/TB0.4/S19 54
P4.5/TB0.5/S18 55
P4.6/TB0.6/S17 56
P4.7/TB0OUTH/SVMOUT57
P8.0/TB0CLK/S15 58
P8.1/UCB1STE 59
P8.2/UCA1TXD 60
P8.3/UCA1RXD 61
P8.4/UCB1CLK/UCA1ST62
DVSS2 63
DVCC2 64
P8.5/UCB1SIMO 65
P8.6/UCB1SOMI 66
P8.7/S8 67
1
3/12/2014
Number
P4.1/TB0.1/S22 51
Title
C
Size
Date
Sheet
VCC_POD33
C23
1
C5
VCC_POD33
MCU_P2.5
25
P7.2/XT2IN 84
R85
2
4.7u, dnp
1
+
R1
10uF/6.3V
0R
R50
MCU_P2.6
E
1
2
3
4
Copyright © 2009–2016, Texas Instruments Incorporated
DCDC_IO1
P5.7/RTCCLK 88
C14
1
TPD4E004DRYR
3
33k R60
AVCC_POD
AVCC_POD
0R
MCU_P2.7
P2.4/P2MAP4
VCC_POD33
1
HOST_TMS
IO4 5
U5
2 IO2
4
5
VCC_POD33
C7
100n
1
C9
100n
1
AVCC1
General power supply
DVCC2
VCC_POD33
DVCC3
VCC_POD33
DVCC1 +
LED1
D2
PJ.2/TMS 94
IO3 4
3 GND
LED
D1
MCU_P4.0
100n
C18
1
P4.0/TB0.0/S23
VSSU 76
PU.0/DP
PU.0/DP 77
PU.1/DM
PU.1/DM 79
P3.5/TA2.0/S26
VBUS
VBUS 80
VUSB
V18
V18 82
P3.2/TA1.1/S29
PUR
PUR 78
P3.7/TA2.2/S24
50
P3.6/TA2.1/S25
49
MCU_P3.7
48
MCU_P3.6
47
MCU_P3.5
AVSS3 83
P3.1/TA1.0/S30
VCC_POD33
DVCC3 89
P1.3/TA0.2/S36
81
VUSB
P3.4/TA2CLK/SMCLK/S
46
P3.3/TA1.2/S28
MCU_P3.4
C12 C11
C17
1
D
MCU_P1.7
45
MCU_P3.3
P7.3/XT2OUT 85
P1.7/TA0.2/S32
41
P3.0/TA1CLK/CBOUT/S
VBAK
VBAK 86
P1.6/TA0.1/S33
40
MCU_P1.6
HOST_TCK
P5.4/COM2/S41
0R, dnp
R46 470R
1
C
MCU_P1.5
44
MCU_P3.2
VCC_POD33
87
VBAT
P1.5/TA0.4/S34
39
P1.4/TA0.3/S35
38
MCU_P1.4
37
MCU_P1.3
43
MCU_P3.1
DVSS3 90
MCU_P1.1
42
MCU_P3.0
P1.2/TA0.1/S37
MCU_P1.2
36
TEST/SBWTCK 91
A_VCC_SUPPLY_HOST
A_VBUS5
LCDCAP/R33
P6.0/CB0/A0 97
HOST_TDI
PJ.1/TDI/TCLK
P5.5/COM3/S40
A_VF
P6.1/CB1/A1 98
HOST_TEST
P1.1/TA0.0/S38
35
PJ.0/TDO 92
P1.0/TA0CLK/ACLK/S3
34
MCU_P1.0
93
TDIOFF_CTRL
PJ.3/TCK 95
VF2TDI_CTRL
33
P5.3/COM1/S42
LED1
32
HOST_RST
31
RST/NMI/SBWTDIO 96
COM0
30
A_VCC_SENSE0_TRGT
99
P6.2/CB2/A2
P5.2/R23
29
10uF/6.3V
1
1
B
R47 470R
100
P6.3/CB3/A3
VCORE(2)
26
DVSS1
27
VCORE
28
VF2TEST_CTRL
VCC 6
1 IO1
LED0
1
C16
VBAK
470n 220n 4.7n
V18
1
11
10
7
6
Additional supply
C15
VCORE
2
3
4
68p
A
VREF+
SLAU278X – May 2009 – Revised February 2016
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MSP-FET
B.41.3 Schematics
Figure B-84. MSP-FET USB Debugger, Schematic (1 of 5)
MSP-FET
www.ti.com
B
100n
C51
10n
C52
10n
C38
100n
C39
10n
C40
100n
C41
10n
C42
10n
C48
2
+
C19
1
C
1 GND
2 GAA2/IO51RSB1
3 IO52RSB1
4 GAB2/IO53RSB1
5 IO95RSB1
6 GAC2/IO94RSB1
1
U2
IO17RSB0 83
MCU_P1.5
GDC2/IO56RSB1
IO18RSB0 82
MCU_P1.6
E
MCU_P3.4
D
MCU_P1.1
A3PN125-VQG100
1
1
MCU_P3.3
VMV1
GBA1/IO24RSB0 76
R5
1k
Title
C
Size
Date
GNDQ 75
VMV0 74
GBA2/IO25RSB0 73
IO26RSB0 72
GBB2/IO27RSB0 71
GBC2/IO29RSB0 70
IO31RSB0 69
VCC 68
GND 67
VCCIB0 66
GCC1/IO35RSB0 65
GCC0/IO36RSB0 64
GCA1/IO39RSB0 63
GCA0/IO40RSB0 62
GCB2/IO42RSB0 61
GCC2/IO43RSB0 60
GDC1/IO45RSB0 59
GDC0/IO46RSB0 58
GND 51
VPUMP 52
NC 53
TDO 54
TRST 55
VJTAG 56
GDA1/IO49RSB0 57
Number
3/12/2014
VCC_POD33
MCU_P3.5
MCU_P3.6
MCU_P3.7
MCU_P4.0
MCU_P4.1
VCC_POD15
VCC_POD33
MCU_P4.2
MCU_P4.3
MCU_P4.4
MCU_P4.5
MCU_P4.6
MCU_P4.7
MCU_P8.1
MCU_P8.2
MCU_P8.3
VCC_POD33
27R
VCC_POD33
R44
R4
1k
1
MSP-FET Rev 1.2
1
Sheet
F
FPGA_TRST
of
A
3/12/2014
FPGA_TDO
Rev
2
5
F
1
2
3
4
Copyright © 2009–2016, Texas Instruments Incorporated
FPGA_IO_TCK
FPGA_IO_TDI
7 IO93RSB1
GEB0/IO74RSB1
GEA1/IO73RSB1
GEA0/IO72RSB1
VMV1
GNDQ
MCU_P2.6
165
Hardware
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FPGA_DIR_CTRL_TCK
FPGA_IO_TMS
FPGA_DIR_CTRL_TMS
FPGA_DIR_CTRL_TDI
8 IO92RSB1
25
24
23
22
21
20 GEB1/IO75RSB1
19 GEC1/IO77RSB1
18 VCCIB1
17 VCC
16 GFA2/IO83RSB1
15 GFA1/IO84RSB1
14 VCCPLF
13 GFA0/IO85RSB1
12 VCOMPLF
11 GFB0/IO86RSB1
10 GFB1/IO87RSB1
9 GND
FPGA_IO_TDO
FPGA_DIR_CTRL_TDO
MCU_P2.7
FPGA_DIR_CTRL_RST
FPGA_IO_TEST
VCC_POD33
VCC_POD15
FPGA_DIR_CTRL_TEST
FPGA_IO_UART_TXD
FPGA_IO_UART_RXD
FPGA_DIR_CTRL_UART_TXD
FPGA_DIR_CTRL_UART_RXD
VCC_POD33
FPGA_IO_UART_CTS
93
A
10n
C50
FPGA
100n
C49
100n
C37
100n
C47
GBA0/IO23RSB0 77
E
1
1
1
1
L3
33n
10n
C34
1
100n
C22
VCC_POD15
10n
C21
10uF/6.3V
100n
C20
10n
C36
1
100n
C35
VCC_POD33
VCC_JTAG
10n
C46
1
VCC_POD33
VCC_PUMP
100n
C45
MCU_P3.2
TMS
VCC_POD33
MCU_P2.5
GAC1/IO07RSB0
D
MCU_P3.1
TDI
GBB1/IO22RSB0 78
FPGA_TDI
1
C
GBB0/IO21RSB0 79
FPGA_TMS
VCC_POD15
VCC_POD33
VCC_PLF
10n
1
C44
1
100n
1
C43
B
MCU_P3.0
TCK
50
MCU_P1.7
GDA2/IO54RSB1
GBC1/IO20RSB0 80
49
81
48
GBC0/IO19RSB0
47
MCU_P1.4
IO57RSB1
IO60RSB1
40
GDB2/IO55RSB1
FPGA_TCK
VCC_POD33
87
VCCIB0
VCCIB1
39
VCC_POD33
46
GND 88
GND
38
2
3
4
A
VCC_POD15
45
IO15RSB0 84
44
MCU_P1.3
IO58RSB1
43
MCU_P1.2
IO13RSB0 85
42
IO11RSB0 86
IO59RSB1
41
MCU_P1.0
IO10RSB0 90
IO61RSB1
MCU_DMAE0
100
IO00RSB0
VCC_POD15
VCC 89
VCC
37
MCU_P2.4
GAC0/IO06RSB0 94
IO64RSB1
FPGA_TP2
IO09RSB0 91
36
GAB1/IO05RSB0 95
IO65RSB1
FPGA_TP1
IO62RSB1
FPGA_RESET
IO66RSB1
FPGA_TP0
IO08RSB0 92
35
MCU_P2.3
FPGA_IO_RST
IO63RSB1
34
GAB0/IO04RSB0 96
33
IO67RSB1
32
MCU_P2.2
31
MCU_P2.1
IO68RSB1
GAA1/IO03RSB0 97
30
GAA0/IO02RSB0 98
29
1
1
1
MCU_P9.5
99
IO01RSB0
FF/GEB2/IO70RSB1
27
FPGA_IO_UART_RTS
GEC2/IO69RSB1
28
FPGA_DIR_CTRL_UART_RTS
GEA2/IO71RSB1
26
FPGA_DIR_CTRL_UART_CTS
VCC_PLF
Figure B-85. MSP-FET USB Debugger, Schematic (2 of 5)
1
B
C57
+
4.7u
C56
100n
C63
DCDCGND
C
1
G
Q3
D8
1
L4
2
GND1
D
4.7u
C29
DCDCGND
100n
C53
R57 0.2
GND1
R25 150k
VCC_DT_SENSE
VCC_SUPPLY
GND1
GND1
2.2u
C26
DT current measurement shunt
DCDCGND DCDCGND
OUT 5
INA21XDCK
6
OUT
U10
INA214AIDCKT
NR 4
2
E
2.2u
2.2u
3 NO2
2 COM1
1 NO1
IN4 12
IN1 13
V+ 14
U20
TS3A4751PWR
DCDC calibration switch
C72
R56
R64
C69
COM4 10
NO4 11
5 IN2
NO3 8
COM3 9
4 COM2
DCDC_CAL1
6 IN3
TS3A4751PWR
7 GND
GND1
Number
3/12/2014
R63
C73
1
DCDC_CAL0
F
Rev
3/12/2014
of
A
3
5
F
GND1
VCC_SUPPLY
2.2u
Sheet
MSP-FET Rev 1.2
DCDC_CAL2
GND1
VCC_DT_BSR
VCC_DT
VCC_DT_REF
C
Size
Date
VCC_DT
A
VBUS5
2.2u
DCDC_CAL0
D4
C3
Q4
DCDCGND
3
U7
TPS73401DDCT
1 IN
2 GND
GND1
3 EN
GND1
1
VCC_SUPPLY
S/W controlled DCDC converter
DCDC MCU
U4
MSP430G2452PW
DVSS 14
XIN/P2.6 13
1 DVCC
2 P1.0/TA0CLK
DCDC_CAL2
DCDC_TEST
DCDC_RST
HOST_SDA
B1
E
2
DCDCGND
C62
10n
GND1
R20
0R
Energy measurement method protected under U.S. Patent Application 13/329,073
VCC_POD33
A_VCC_SUPPLY
XOUT/P2.7 12
NMI-RST 10
TEST/SBWTCK 11
P1.7/SDI 9
3 P1.1/TA0.0
5 P1.3/ADC10CLK
4 P1.2/TA0.1
6 P1.4/TA0.2
DCDC_CAL1
DCDC_IO0
HOST_SCL
VBUS
C10
1u
GND1
VCC_POD33
DT current sense
GND1
DT level shifter supply
3
and subsequent patent applications
DCDC_PULSE
DCDC_IO1
P1.6/TA0.1 8
MSP430G2452PW
33p
GND1
A_VCC_SUPPLY_HOST
7 P1.5/TA0.0
C66
R6
220k
R7
220k
C1
VCC_DCDC_REF
1n
GND1
A_VCC_SUPPLY
VCC_SUPPLY
DCDC MCU reference voltage
C28
33p
1
2
S
D
3
C1,C2 3
10R R49
5 IN4 IN+
E
1
2
3
4
Copyright © 2009–2016, Texas Instruments Incorporated
R53
R19
2
VCC_DT
GND1
C24 1n
1 A1
10R R54
D
C54 1n
1
R55
VCC_DT_BSR
C
R23 180k
R24 160k
VCC_SUPPLY
R65
220k
R15
220k
1
DCDC_RST
VCC_POD33
DCDC MCU debug i/f
27k, dnp
R26
C13
1n, dnp
GND1
B
C67 10p
2
3
4
A
GND
V+
REF
2 A2
C65 100n
C68 1n
SLAU278X – May 2009 – Revised February 2016
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MSP-FET
Figure B-86. MSP-FET USB Debugger, Schematic (3 of 5)
MSP-FET
www.ti.com
1
A
L2
33u
A
C
B
D10
B0530W-7-F
+
C74
VF
100u/10V
GND1
VF = +5V ... 6.5V
GND1
D3
Q1
BC817-16LT1
C30
C
GND1
E
330n
GND1
GND1
47k
R29
dnp
DDZ9692-7
B
Fuse blow step-up converter
VBUS
PWM_SETVF
C
TC_TEST_BSR
VF2TDI_CTRL
D6
DNP B0530W-7-F
A
VF
VCC_DT
VCC_DT_TRGT
47k
R58
VF_TEST
IN1
VDD
U6
ADG821BRMZ-REEL7
S1
S2
D2
D1
IN2
GND
U9
ADG821BRMZ-REEL7
IN1
VDD
S2
D2
S1
GND
IN2
D1
J6
C
VF2TEST_CTRL
47k
R59
47k
R22
GND1
GND1
TC_TDI_BSR
TC_TDI_FD
VF
VF_TDI
VF
Fuse voltage multiplexer / VCC_DT to level shifters
TC_TEST_FD
VCC_POD33
47k
R48
1
2
3
4
5
6
7
8
9
10
11
12
13
14
D
DIR 5
VCCB 6
B 4
1 VCCA
1 VCCA
DIR 5
VCCB 6
B 4
DIR 5
VCCB 6
B 4
1 VCCA
1 VCCA
DIR 5
VCCB 6
B 4
DIR 5
VCCB 6
U16
SN74LVC1T45DCKR
3 A
2 GND
U15
SN74LVC1T45DCKR
3 A
2 GND
U14
SN74LVC1T45DCKR
3 A
2 GND
U13
SN74LVC1T45DCKR
3 A
2 GND
U12
SN74LVC1T45DCKR
DT level shifters
VCC_POD33
FPGA_IO_TCK
VCC_POD33
FPGA_IO_TMS
VCC_POD33
FPGA_IO_TDI
VCC_POD33
FPGA_IO_TDO
VCC_POD33
1 VCCA
B 4
2 GND
3 A
47k
R97
47k
R92
47k
R89
47k
R27
VCC_POD33
47k
R31
GND1
47k
R90
GND1
47k
R91
GND1
47k
R98
GND1
E
100n
C85
100n
C82
F
100n
C84
VCC_DT_TRGT
100n
C83
C80
1 VCCA
DIR 5
VCCB 6
B 4
2 GND
3 A
DIR 5
VCCB 6
U22
SN74LVC1T45DCKR
1 VCCA
B 4
2 GND
3 A
DIR 5
VCCB 6
U26
SN74LVC1T45DCKR
1 VCCA
B 4
2 GND
3 A
DIR 5
VCCB 6
U27
SN74LVC1T45DCKR
1 VCCA
B 4
2 GND
3 A
DIR 5
VCCB 6
U28
SN74LVC1T45DCKR
1 VCCA
GND1
47k
R88
GND1
47k
R93
GND1
47k
R96
GND1
IO6 6
IO7 7
IO8 8
TC_UART_TXD_FD
TC_RST_FD
TC_UART_RXD_FD
TC_UART_RTS_FD
B 4
2 GND
3 A
1 IO1
IO5 5
1
47k
R95
47k
R94
47k
R87
TC_UART_RTS_FD
3/12/2014
of
VCC_DT_TRGT
4
A
F
5
Rev
FPGA_DIR_CTRL_UART_RTS
VCC_DT_TRGT
VCC_DT_TRGT
TC_UART_CTS_FD
FPGA_DIR_CTRL_UART_CTS
VCC_DT_TRGT
VCC_DT_TRGT
TC_UART_RXD_FD
FPGA_DIR_CTRL_UART_RXD
VCC_DT_TRGT
VCC_DT_TRGT
TC_UART_TXD_FD
FPGA_DIR_CTRL_UART_TXD
VCC_DT_TRGT
VCC_DT_TRGT
47k, dnp
R84
TC_TEST_FD
FPGA_DIR_CTRL_TEST
VCC_DT_TRGT
100n 100n
FPGA_IO_TEST
VCC_POD33
FPGA_IO_UART_TXD
VCC_POD33
FPGA_IO_UART_RXD
VCC_POD33
FPGA_IO_UART_CTS
VCC_POD33
FPGA_IO_UART_RTS
47k
47k
R101 R102
2 IO2
GND1
3 IO3
U3
TPD8E003DQDR
4 IO4
TPD8E003DQD
TC_UART_CTS_FD
1
Number
3/12/2014
Sheet
MSP-FET Rev 1.2
VCC_JTAGLDO_TRGT
C
Size
Date
GND1
C79
TC_TCK_FD
GND1
100n
TC_TEST_BSR
U17
SN74LVC1T45DCKR
C78
IO8 8
TC_TMS_FD
VCC_POD33
100n
IO7 7
E
47k
R86
C77
VCC_DT_TRGT
FPGA_DIR_CTRL_TCK
TC_TCK_FD
VCC_DT_TRGT
VCC_DT_TRGT
FPGA_DIR_CTRL_TMS
TC_TMS_FD
VCC_DT_TRGT
VCC_DT_TRGT
FPGA_DIR_CTRL_TDI
TC_TDI_FD
VCC_DT_TRGT
VCC_DT_TRGT
FPGA_DIR_CTRL_TDO
TC_TDO_FD
VCC_DT_TRGT
VCC_DT_TRGT
FPGA_DIR_CTRL_RST
TC_RST_FD
1 IO1
IO6 6
VCC_DT_TRGT
2 IO2
47k
R100
3 IO3
FPGA_IO_RST
47k
R99
GND1
ESD protection
VCC_SUPPLY_TRGT
4 IO4
U21
TPD8E003DQDR
TC_TDO_FD
TPD8E003DQD
IO5 5
TC_TDI_BSR
1
VCC_SENSE0_TRGT
D
1
2
3
4
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1
1
167
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1
1
1
1
1
R13 100R
1
TDIOFF_CTRL
1
1
GND1
1
1
1
1
R14
D5
2k2
dnp
MMSZ5232B-7-F
1
TC_TDO_FD
R33 100R
R32 100R
R35 100R
Target MCU connector
VCC_SUPPLY_TRGT
VF_TDI
TC_TDI_BSR
TC_TMS_FD
VCC_SENSE0_TRGT
VCC_JTAGLDO_TRGT
R34 100R
R37 100R
R38 100R
R39 100R
R40 100R
R41 100R
C
9 GND
TC_TCK_FD
TC_TEST_BSR
VF_TEST
TC_RST_FD
TC_UART_CTS_FD
TC_UART_RTS_FD
TC_UART_TXD_FD
TC_UART_RXD_FD
R43 100R
B
9 GND
2
3
4
A
VCC_DT2TRGT_CTRL
R42
1k
Figure B-87. MSP-FET USB Debugger, Schematic (4 of 5)
1
2
3
4
VBUS
A
10n
C25
3 EN2
2 IN
1 EN1
GND 4
OUT2 5
OUT1 6
U19
TLV7111533D
MSP-FET power supply
1u
C3
33p
B
1u
C59
PWRGND
U18
1u
C61
PWRGND
1
GND1
47k
R16
VCC_POD15
R36
150k
R12
270k
VF
VCC_SUPPLY_TRGT
A_VBUS5
GND1
VCC_DT
VCC_POD33
GND 6
IN2 7
COM1 8
NO2 5
33p
C27
TS5A21366RSE
4 COM2
3 IN1
2 V+
1 NO1
TS5A21366RSER
PWRGND
VBUS5
R51
240k
A_VCC_SENSE0_TRGT
R52
150k
1
B
C4
1
A_VF
C
R79
150k
R78
150k
VCC_DT
VCC_DT2SUPPLY_CTRL
R80R
33p
C
1
C32
33p
R9
150k
VCC_DT_BSR
A_VCC_DT
R18
150k
1
C2
33p
D
D
TP9
TP3
TP2
TP1
TP0
DCDC_IO0
DCDC_PULSE
GND1
VBUS
VCC_SUPPLY
Test points
A_VCC_DT_BSR
E
E
TP4
TP5
TP6
TP7
TP8
C
Size
Date
FPGA_TP0
FPGA_TP1
FPGA_TP2
GND1
DCDC_IO1
J2
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
HEADER_1X8_50MIL_A
J3
J4
HEADER_1X8_50MIL_A
1
2
3
4
5
6
7
8
HEADER_1X8_50MIL_A
TP11
F
VBUS
HOST_TEST
HOST_TDO
HOST_TDI
HOST_TMS
HOST_TCK
HOST_RST
VCC_DT
GND1
A_VCC_SUPPLY_HOST
DCDC_RST
DCDC_TEST
VCC_POD33
VCC_POD15
of
GND1
3/12/2014
A
5
5
F
FPGA_TRST
FPGA_TCK
FPGA_TMS
FPGA_TDI
FPGA_TDO
HOST_SCL
HOST_SDA
VBUS5
MSP-FET Rev 1.2
1
Rev
Common debug and test i/f
Number
3/12/2014
Sheet
1
2
3
4
Copyright © 2009–2016, Texas Instruments Incorporated
C58
PWRGND PWRGND
VCC_SUPPLY_TRGT
VBUS
VCC_SUPPLY
Target power switch
VCC_SUPPLY2TRGT_CTRL
47k
R21
GND1
1
Analog inputs to Host MCU
R11
150k
R10
150k
VCC_SENSE0_TRGT
A
SLAU278X – May 2009 – Revised February 2016
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MSP-FET
Figure B-88. MSP-FET USB Debugger, Schematic (5 of 5)
MSP-FET
www.ti.com
B.41.4 Layout
Figure B-89. MSP-FET USB Debugger, PCB (Top)
Figure B-90. MSP-FET USB Debugger, PCB (Bottom)
B.41.5 LED Signals
The MSP-FET shows its operating states using two LEDs, one green and one red. Table B-45 lists all
available operation modes. An
or
icon indicates that the LED is off, an
or
icon indicates that
the LED is on, and an
or
icon indicates that the LED flashes.
Table B-45. MSP-FET LED Signals
Function
Power LED
Mode LED
MSP-FET not connected to PC, or MSP-FET not ready; for example, after a major firmware
update. Connect or reconnect MSP-FET to PC.
MSP-FET connected and ready
MSP-FET waiting for data transfer
Ongoing data transfer
An error has occurred; for example, target VCC overcurrent. Unplug MSP-FET from target,
and cycle the power off and on. Check target connection, and reconnect MSP-FET.
Firmware update in progress. Do not disconnect MSP-FET while both LEDs are blinking.
FPGA update in progress. Do not disconnect MSP-FET while both LEDs are blinking rapidly.
SLAU278X – May 2009 – Revised February 2016
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B.41.6 JTAG Target Connector
Figure B-91 shows the pinout of the JTAG connector.
Figure B-91. JTAG Connector Pinout
Table B-46. JTAG Connector Pin State by Operating Mode
Pin
170
Name
After Power-Up
When JTAG Protocol is
Selected
When Spy-Bi-Wire Protocol
is Selected
1
TDO/TDI
Hi-Z, pulled up to 3.3 V In, TDO
In and Out, SBWTDIO
2
VCC_TOOL
3.3 V
VCC
3
TDI/VPP
Hi-Z, pulled up to 3.3 V Out, TDI
Hi-Z, pulled up to VCC
4
VCC_TARGET
In, external VCC sense
In, external VCC sense
5
TMS
Hi-Z, pulled up to 3.3 V Out, TMS
Hi-Z, pulled up to VCC
6
N/C
N/C
N/C
7
TCK
Hi-Z, pulled up to 3.3 V Out, TCK
Out, SBWTCK
8
TEST/VPP
Out, Gnd
Out, TEST
Hi-Z, pulled up to VCC
9
GND
Ground
Ground
Ground
10
UART_CTS/SPI_CLK/I2C_SCL
Hi-Z, pulled up to 3.3 V
Out, Target UART Clear-ToSend Handshake input
Out, Target UART Clear-ToSend Handshake input
11
RST
Out, VCC
Out, RST
Out
12
UART_TXD/SPI_SOMI/I2C_SDA
Hi-Z, pulled up to 3.3 V In, Target UART TXD output
13
UART_RTS
Hi-Z, pulled up to 3.3 V
14
UART_RXD/SPI_SIMO
Hi-Z, pulled up to 3.3 V Out, Target UART RXD input
Hardware
VCC
In, external VCC sense
N/C
In, Target UART Ready-toSend Handshake output
In, Target UART TXD output
In, Target UART Ready-toSend Handshake output
Out, Target UART RXD input
SLAU278X – May 2009 – Revised February 2016
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Figure B-92 shows the state of each pin in the connector after power-up.
Pin
Signal
-
USB Power
2
VCC_TOOL
1
TDO/TDI
3
TDI
5
TMS
7
TCK
8
TEST
11
RST
12
UART_TXD
14
UART_RXD
10
UART_CTS
13
UART_RTS
Figure B-92. Pin States After Power-Up
SLAU278X – May 2009 – Revised February 2016
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B.41.7 Specifications
Table B-47 shows the physical and electrical specifications of the MSP-FET.
Table B-47. Specifications
Mechanical
Size (without cables)
80 mm x 50 mm x 20 mm
Interfaces
USB interface
USB 2.0, full speed
Target interface
JTAG 14-pin
JTAG cable length
20 cm (max)
Power supply
USB powered, 200 mA
(max)
Target output voltage
VCC_TOOL
1.8 V to 3.6 V
Selectable in 0.1-V steps. VCC_TOOL available from JTAG pin 2.
Target output current
100 mA (max)
Current supplied through JTAG pin 2
Target output overcurrent
detection level
160 mA (max)
JTAG signal overcurrent
detection level
30 mA (max)
Total current supplied through JTAG pins 1, 3, 5, 7, 8, 10, 11, 12, 13, 14
External target supply
Supported (1.8 V to 3.6 V)
Connect external target voltage VCC_TARGET to JTAG pin 4. JTAG
and SBW signals are regulated to external target voltage ±100 mV.
Fuse blow
Supported
For devices with poly-fuse
See Table B-46 for pinout
JTAG and Spy-Bi-Wire Interface, Electrical
JTAG and Spy-Bi-Wire Interface, Timing
JTAG clock speed
8 MHz (max)
Protocol speed selectable by software
Spy‑Bi‑Wire clock speed
8 MHz (max)
Protocol speed selectable by software. System limitations due to
external RC components on reset pin (SBWTDIO) might apply.
JTAG and Spy-Bi-Wire Interface, Speed
Flash write speed (JTAG)
Up to 20 kB/sec
Flash write speed
(Spy‑Bi‑Wire)
Up to 7 kB/sec
FRAM write speed (JTAG)
Up to 50 kB/sec
FRAM write speed
(Spy‑Bi‑Wire)
Up to 14 kB/sec
EnergyTrace™ Technology
Target output current
accuracy
For target output voltage = 1.8 V to 3.6 V, target output current <75 mA
and USB voltage = 5 V constant during and after calibration
± 2%, ± 500 nA
B.41.8 MSP-FET Revision History
Revision numbers are printed on the PCB and are stored in nonvolatile memory in firmware. Table B-48
shows the revision history of the MSP-FET.
Table B-48. MSP-FET Revision History
172
Revision
Date
Revision 1.2
March 2014
Hardware
Comments
Initial release
SLAU278X – May 2009 – Revised February 2016
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B.42 MSP-FET430UIF
Figure B-93. MSP-FET430UIF USB Interface, Schematic (1 of 4)
SLAU278X – May 2009 – Revised February 2016
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MSP-FET430UIF
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Figure B-94. MSP-FET430UIF USB Interface, Schematic (2 of 4)
174
Hardware
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MSP-FET430UIF
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Figure B-95. MSP-FET430UIF USB Interface, Schematic (3 of 4)
SLAU278X – May 2009 – Revised February 2016
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Figure B-96. MSP-FET430UIF USB Interface, Schematic (4 of 4)
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Figure B-97. MSP-FET430UIF USB Interface, PCB
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B.42.1 MSP-FET430UIF Revision History
Revision 1.3
• Initial released hardware version
Assembly change on 1.3 (May 2005)
• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R
Changes 1.3 to 1.4 (Aug 2005)
• J5: VBUS and RESET additionally connected
• R29, R51, R42, R21, R22, R74: value changed from 330R to 100R
• U1, U7: F1612 can reset TUSB3410; R44 = 0R added
• TARGET-CON.: pins 6, 10, 12, 13, 14 disconnected from GND
• Firmware-upgrade option through BSL: R49, R52, R53, R54 added; R49, R52 are currently DNP
• Pullups on TCK and TMS: R78, R79 added
• U2: Changed from SN74LVC1G125DBV to SN74LVC1G07DBV
NOTE:
Using a locally powered target board with hardware revision 1.4
Using an MSP-FET430UIF interface hardware revision 1.4 with populated R62 in conjunction
with a locally powered target board is not possible. In this case, the target device RESET
signal is pulled down by the FET tool. It is recommended to remove R62 to eliminate this
restriction. This component is located close to the 14-pin connector on the MSP-FET430UIF
PCB. See the schematic and PCB drawings in this document for the exact location of this
component.
Assembly change on 1.4a (January 2006)
• R62: not populated
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B.43 MSP-FET430PIF
Figure B-98. MSP-FET430PIF FET Interface Module, Schematic
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Figure B-99. MSP-FET430PIF FET Interface Module, PCB
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Appendix C
SLAU278X – May 2009 – Revised February 2016
Hardware Installation Guide
This section describes the hardware installation process of the following USB debug interfaces on a PC
running Windows XP:
• MSP-FET430UIF
• eZ430-F2013
• eZ430-RF2500
• eZ430-Chronos
• eZ430-RF2780
• eZ430-RF2560
• MSP-WDSxx "Metawatch"
• LaunchPad (MSP-EXP430G2)
• MSP-EXP430FR5739
• MSP-EXP430F5529
The installation procedure for other supported versions of Windows is very similar and, therefore, not
shown here.
Topic
C.1
...........................................................................................................................
Page
Hardware Installation ........................................................................................ 182
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C.1
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Hardware Installation
Table C-1 shows the USB VIDs and PIDs used in MSP430 tools.
Table C-1. USB VIDs and PIDs Used in MSP430 Tools
USB VID
USB PID
INF File Name
eZ430-F2013
Tool
0x0451
0xF430
usbuart3410.inf
eZ430-RF2500
0x0451
0xF432
430CDC.inf
eZ430-RF2780
0x0451
0xF432
430CDC.inf
eZ430-RF2560
0x0451
0xF432
430CDC.inf
MSP-WDSxx "Metawatch"
0x0451
0xF432
430CDC.inf
eZ430-Chronos
0x0451
0xF432
430CDC.inf
MSP-FET430UIF (1)
0x2047
0x0010
msp430tools.inf
MSP-FET
0x2047
0x0204
msp430tools.inf
eZ-FET
0x2047
0x0203
msp430tools.inf
LaunchPad (MSP-EXP430G2)
0x0451
0xF432
430CDC.inf
MSP-EXP430FR5739
0x0451
0xF432
430CDC.inf
MSP-EXP430F5529
0x0451
0xF432
430CDC.inf
(1)
The older MSP-FET430UIF used with IAR versions before v5.20.x and CCS versions before v5.1 has VID 0x0451 and PID
0xF430. With the firmware update, it is updated to the 0x2047 and 0x0010, respectively.
1. Before connecting of the USB Debug Interface with a USB cable to a USB port of the PC the one of
IDEs (CCS or IAR) should be installed. The IDE installation isntalls also drivers for USB Debug
Interfaces without user interaction. After IDE installation the USB Debug Interface can be connected
and will be ready to work within few seconds.
2. The driver can be also installed manually. After plug in the USB Debug Interface to USB port of the PC
the Hardware Wizard starts automatically and opens the "Found New Hardware Wizard" window.
3. Select "Install from a list or specific location (Advanced)" (see Figure C-1).
Figure C-1. Windows XP Hardware Wizard
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4. Browse to the folder where the driver information files are located (see Figure C-2).
For CCS, the default folder is: c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_CDC, or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_FET_XP_XX, or
c:\ti\ccsv5\ccs_base\emulation\drivers\msp430\USB_eZ-RF depending of firmware version of the tool.
For IAR Embedded Workbench, the default folder is: <Installation Root>\Embedded Workbench
x.x\430\drivers\TIUSBFET\eZ430-UART, or
<Installation Root>\Embedded Workbench x.x\430\drivers\<Win_OS>.
Figure C-2. Windows XP Driver Location Selection Folder
5. The Wizard generates a message that an appropriate driver has been found.
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6. The wizard installs the driver files.
7. The wizard shows a message that it has finished the installation of the software USB Debug Interface.
8. The USB debug interface is installed and ready to use. The Device Manager lists a new entry as
shown in Figure C-3, Figure C-4, or Figure C-5.
Figure C-3. Device Manager Using USB Debug Interface using VID/PID 0x2047/0x0010
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Figure C-4. Device Manager Using USB Debug Interface with VID/PID 0x0451/0xF430
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Figure C-5. Device Manager Using USB Debug Interface With VID/PID 0x0451/0xF432
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Revision History
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Revision History
Changes from October 14, 2015 to February 12, 2016 ................................................................................................... Page
•
Updated text, figures, and BOM for board revision 1.1 in Section B.5, MSP-TS430PW20 .................................... 44
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
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