Call for Papers
(Jan. 1, 2009)
Conference Chair:
About ICLS
Lee, Young Hae, Hanyang Univ., Korea
The International Congress on Logistics and SCM Systems is organized by The International Federation of
Logistics & SCM Systems (IFLS) and The Asian Pacific Federation of Logistics & SCM Systems(APFLS).
The 1st Congress was hosted by Waseda University in Tokyo, Japan, November 22-24, 2004, followed by the
2nd Congress hosted by The National Kaohsiung First University of Science and Technology in Kaohsiung,
Taiwan, May 1-4 2006. The 3rd Congress was hosted by Kanagawa University in Yokohama, Japan, August
29-31, 2007 and the 4th Congress was hosted by Asian Institute of Technology in Bangkok, Thailand,
November 26-28, 2008. The 5th International Congress on Logistics and SCM Systems, ICLS 2009 will
be hosted by The Korean Society of Supply Chain Management(KSCM) in COEX(Convention &
Exhibition Center), Seoul, Korea, June 2-5, 2009. The Congress aims to provide an international forum for
leading academics, researchers and practitioners to discuss and exchange ideas on the latest development and
to seek opportunities for collaboration among the participants as well as to promote excellence in the field.
The latest papers in academic thinking and successful case examples will be presented. The Congress
cordially invites papers from researchers, educators, modelers, software developers, users and practitioners in
universities, industries and research institutes.
Conference Co-Chairs:
Gen, Mitsuo, Waseda Univ., Japan
Min, Hokey, Bowling Green State Univ., USA
Organizing Committee: Chair:
Kwon, Oh-Kyong, Inha Univ., Korea
Program Committee: Chair:
Kim, Seung Chul, Hanyang Univ., Korea
Technical Committee: Chair:
Rim, Suk-Chul, Ajou Univ., Korea
International Advisory Committee:
Azadivar, Farhad, Univ. of Massachusetts, USA
Beaumont, Nicholas, Monash Univ., Australia
Chen, Jian, Tsinghua Univ., China
Cheng, T.C. Edwin, Hong Kong Polytech Univ., HK
Chin, Hyung-In, Univ. of Incheon, Korea
Chou,Yon-Chun, National Taiwan Univ., Taiwan
Disney, Stephen, Cardiff Univ., UK
Fujimoto, Takahiro, Univ. of Tokyo, Japan
Gunther, Hans-Otto, Technical Univ. of Berlin, Germany
Hiraki, Shusaku, Hiroshima Shudo Univ., Japan
Ho, Bruce Chien-Ta, National Chung Hsing Univ., Taiwan
Hochbaum, Dorit S., Univ. of California, Berkeley, USA
Hong, Paul, Univ. of Toledo, USA
Hwang, Hark, KAIST, Korea
Hwang, Heung-Suk, Tongmyong Univ., Korea
Jain, Pramod K., Indian Institute of Technology, India
Kachitvichyanukul, Voratas, AIT, Thailand
Karasawa, Yutaka, Kanagawa Univ., Japan
Katayama, Hiroshi, Waseda Univ., Japan
Kim, Kap-Hwan, Pusan National Univ., Korea
Kim, Tae-Hyun, Yonsei Univ., Korea
Kim, Woong Jin, Hyupsung Univ., Korea
Kitaoka, Masatoshi, Kanagawa Univ., Japan
Koh, Siau Ching Lenny, Univ. of Sheffield, UK
Kreowski, Hans-Jörg, Univ. of Bremen, Germany
Kwon, Ik-Whan G., Saint Louis Univ., USA
Lai, K. K., City Univ. of Hong Kong, HK
Lin, Lie-chien, Kaohsiung Univ. of Sci. & Tech., Taiwan
Liu, Baoding, Tsinghua Univ., China
Lukka, Anita, Lappeenranta Univ. of Technology, Finland
Mak, K.L., Univ. of Hong Kong, H K
Matsumaru, Masanobu, Tokai Univ., Japan
Mentzer, John T. , Univ. of Tennessee, USA
Muffatto, Moreno, Univ. of Padua, Italy
Nagel, Pieter J A, Victoria Univ., Australia
Oum, Tae H., Univ. of British Columbia, Canada
Park, Sang-Min, Univ. of Incheon, Korea
Park, Jin-Woo, Seoul National Univ., Korea
Park, Yang-Byung, Kyunghee Univ., Korea
Pawar, Kulwant S., Univ. of Nottingham, UK
Piplani, Rajesh, Nanyang Tech. Univ., Singapore
Pujawan, N., Sepuluh Nopember Institute of Tech, Indonesia
Rahman, Shams, RMIT University, Australia
Ratliff, Don, GIT, USA
So, Rick, UC Irvine, USA
Sohal, Amrik, Monash Univ., Australia
Tabucanon, Mario T., AIT, Thailand
Tanchoco, Joe M.A., Purdue Univ., USA
Teo, Chung Piaw, National Univ. of Singapore, Singapore
Tian, Peng, Shanghai Jiaotong Univ., China
Wakabayashi, keizo, Nihon Univ., Japan
Wang, Fan, Sun Yat-sen Univ., China
Whiteing, Tony, Univ. of Leeds, UK
Wu,Yen-Chun Jim, National Sun Yat-Sen Univ., Taiwan
Submission
Submissions should be made electronically through e-mail icls2009@kscm.org. A submission should
include abstract or full paper with the key words, and a cover page including title, topic areas, name(s) of
author(s), affiliation(s), and e-mail address, and the contact information of the corresponding author,
including mailing address, telephone and fax number. A submission of abstract or paper should be in file
format of MS Word or PDF. The final manuscript for the proceedings would be fine in the format of MS
Word or Power Point slides. At least one of authors should register by Pre-registration.
Proceedings and Publication
All accepted papers will be published in the conference proceedings. In addition, the refereed selected papers
will be invited for publication in the International Journal of Logistics and SCM Systems (The official
journal of IFLS) and the other special issue of SCI class international journal after the conference. The
best paper award will be presented during the conference.
Topic areas:
International Supply Chain Networks
Procurement and Delivery Strategies
Strategies for Logistics & SCM
Distribution and Third Party Logistics
Logistics Planning and Control
Supply Chain Performance Assessment
Plant and Warehouse Management
Vehicle Routing & Transportation
Optimization of Logistics & SCM Systems
Lean Logistics
Decision Support Systems for Logistics & SCM
Communication Technologies for Logistics
e-Logistics, c-Logistics, u-Logistics
Supplier Relationship Management
Product Development for Logistics & SCM
Sustainable Logistics & SCM Systems
Simulation of Logistics & SCM
Material Handling System
Green Logistics
Inventory Management
Harbor and Port Management
Logistics Outsourcing
SCM in Healthcare industry
Logistics Engineering
Global Logistics & SCM
Customer-Supplier Relationship
RFID for Logistics & SCM
IT & Solutions for Logistics & SCM
Case Studies for Logistics & SCM
Collaboration in SCM
Integration of Production and Logistics
Advanced Planning and Scheduling
Reverse Manufacturing and Logistics
Service Supply Chain Management
Important dates
Abstract or full paper submission
Notification of acceptance
Submission of final manuscript(MS Word or Power Point)
Pre-registration
Conference dates
February 15, 2009
March 1, 2009
March 30, 2009
March 30, 2009
June 2-5, 2009
Registration
Pre-Registration
Normal Registration
Regular(including presenting author, co-author)
$300
$350
Full time Student
$150
$175
spouse
$100
Tour Fee
$10
The regular and student registration fee will cover attending all sessions of the conference, a hard copy and a
CD-ROM of the Proceedings, souvenir, refreshments, lunches, Banquet and dinner, welcome reception party
on June 2, 2009.
Tour covers visiting a manufacturing company like Samsung Electronics and a leading logistics company
near to Seoul.
ICLS 2009 OFFICE/ The Korean Society of Supply Chain Management(KSCM)
Conference Secretary: Ms. Shin (icls2009@kscm.org / kscm@kscm.org)
Tel.+82-31-438-5269, 400-4506, Fax.+82-31-406-1089 http://ICLS2009.hanyang.ac.kr (KSCM, http://www.kscm.org)