DEEPA MANNATH
8759, Southwestern Blvd., #1127
Email: deepamannath@yahoo.com
Dallas, TX 75206
Phone: (469) 877-6934
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Summary
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Experience with Integrated Circuit manufacturing, DOE methodologies and Thin Film and
Surface Analysis Techniques like AFM, Ellipsometry and SEM.
Work in a clean room environment.
Experience in using tools like the Mentor Graphics’ IC Station, Ansoft’s SiWave and related tools
and VHDL Modeling and Simulation using SystemVision.
Strong background in Theory of Semiconductor Materials and Device Physics.
Excellent written and verbal communication skills, involved with creation of extensive
documentation and technical presentations, good attention to detail.
Languages: English, Hindi, Malayalam, Marathi, familiar with German.
Education
Currently pursuing PhD. Microelectronics and Photonics, University of Arkansas. GPA 3.9/4.0 Expected
graduation date: May 2006.
Master of Science, Electrical Engineering 2000-2002, Texas Tech University. GPA: 3.65/4.0
Bachelor of Engineering (BE) in Instrumentation and Control 1996-2000, University of Pune, India. First
Class with Distinction.
Work Experience
Jan 2005- Current
RF Wireless Product Engineer, Texas Instruments Inc.
May 2004- Dec. 2004
KFAB Product Engineer, Texas Instruments Inc.
May 2003-May 2004
Senior Research Assistant, University of Arkansas.
 Working on developing Integrated Passives, particularly, integrated capacitors. Fabrication, Design,
Yield and Reliability studies of Tantalum Oxide Capacitors on various Flex substrates, their integration
into PWBs, and study of defect mechanisms.
 Developing designs in AUTOCAD for Integrated Capacitors.
 Simulations of capacitors in ANSOFT.
June 2001 – Present, Applied Materials Inc., Santa Clara
Co-operative Student, CPI (Copper PVD and Integrated Modules) group.
 Implemented Test Matrices on the PreClean II chamber with a newly installed Aluminum chamber
body. Qualified PreClean chambers with Pedestal Height Matrices and Power DOEs by characterizing
the Etch Rate and Uniformity. Processed Black Diamond wafers as low-k dielectric and determined
Capacitance, Uniformity and Thickness.
 Simulated a Control System loop using Simulink for the 2-zone heater in an LPCVD Chamber and
produced results for various Controller Algorithms.
 Designed and Assembled a Controller Box for 3-zone Heater in a TxZ Chamber on 300MM Endura
System. Supported design of Personality Cards for interlock boards by verifying schematics and
redesigning boards for optimal space utilization. Edited and assembled a Chamber User Manual for IMP
Vectra 300MM Chamber using Adobe Framemaker.
August 2000 – May 2001
Research Assistant, Texas Tech University.
Member of a team involved with a Micro Fluidics project. Responsibilities included:
Projects
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Coating Silicon wafers with low k dielectric materials.
Working on the E-beam evaporator.
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Design, Simulation and Layout of a bit-serial multiplier using Mentor Graphics’ IC Station.
Design and Fabrication of LED circuit using the Applied Materials P 5000 system.
Design and Simulation of CMOS Inverter Circuit using PSpice and LEdit.
Computerized Automatic Control Systems Trainer Kit.
Main features:
1. Built loops and systems and studied their transfer functions for stability analysis.
2. Plotted Bode and Nyquist plots using G programming in LabVIEW and inferred stability
from those plots.
Coursework
Introduction to IC design, IC Design Lab I, VHDL Modeling and Simulation, Organic Circuit Board
Technology, Advanced Electronic Packaging, Theory of Semiconductor Materials, Semiconductor
Processing, Solid State, Devices, Advanced Semiconductor processing, Process Equipment
Instrumentation & Design.
Computer Skills
Proficient in Mentor Graphics’ IC Station, LabVIEW, PSpice, LEdit, ANSOFT’s SiWave,
Windows XP/2000.
Skilled in VHDL Modeling and Simulation using SystemVision, Unix, Framemaker 6.0, MS Office, MS
Project, JUMP, Assembly Language for 8085, 8086.
Familiar with AUTOCAD, Maple, MATLAB, Simulink.
Technical Skills
Varian XM-8 Sputtering machine, AFM, Dektak Profilometer, Tantalum Anodization, Wet and Dry etch
(RIE), Endura 300MM System Operation- Running wafers, Resistivity and Thickness uniformity
metrology, Photolithography, E-beam evaporation, Ellipsometry, AMAT P-5000 System Operation.
Publications
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Achievements
Extra Curricular
“Decoupling with Anodized Ta” L Schaper, R. Ulrich, D. Mannath, J. Morgan, K. Maner, IPC
February 2004.
“Advanced Decoupling in High Performance IC Packaging” Deepa Mannath, Leonard W. Schaper,
Richard K. Ulrich. ECTC 2004.
Recipient of the Walton Doctoral Fellowship 2003-2004.
Passed the Fundamentals of Engineering (FE) Exam.
Topped the College during all four years in Undergraduate studies.
Recipient of “Best Graduating Student Award” in BE.
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Student member of IMAPS.
Assistant Editor for the IEEE magazine at Texas Tech University.
Worked with the Missionaries of Charity on Social work projects while in India.
Attended first level Mastery of Consciousness classes at the School of Metaphysics.