POPPE ANDRÁS PUBLIKÁCIÓI 2003. SZEPT. 30-IG
SZUMMA: 102 TÉTEL, EBBŐL 21 CIKK, 73 KONF. KIAD., 7 KÖNYV, 1
DISSZERTÁCIÓ
96 FÜGGETLEN HIVATKOZÁS
Disszertáció:
[D1]
Poppe András: Félvezető eszközök modellezési kérdései. Kandidátusi értekezés BME
Elektronikus Eszközök Tanszéke /MTA TMB, Budapest, 1994 (in Hungarian)
Folyóirat cikkek:
[A1]
Olaszi G., Podoletz Gy., Fiser J., Poppe A.: LPC-elven működő text-to-speech
beszédszintetizáló rendszer fejlesztése. Információ-Elektronika 21(5): pp 247-255 (1986) (in
Hungarian)
[A2]
Székely V., Fábry G., Fiser J., Laczik Zs., Poppe A.: Nemlineáris áramkörszimuláció személyi
számítógépen. Híradástechnika 37(3): pp 101-107 (1987) (in Hungarian)
[A3]
Székely V., Poppe A., Fábry G., Oláh A., Laczik Zs.: A TRANZ-TRAN áramkörszimulációs
programrendszer mikroszámítógépeken. Magyar Elektronika 5(4): pp 33-39 (1988) (in
Hungarian)
[A4]
A. Poppe: The functional modeling feature of the TRANS-TRAN nonlinear circuit analysis
program. Journal of Semicustom IC's, 7(2): pp. 38-46 (1989)
[A5]
V. Székely, A. Poppe: Novel tools for thermal and electrical analysis of circuits. Electrosoft
1(4): pp. 234-252 (1990)
[A6]
V. Székely, M. Kerecsen-Rencz, A. Poppe: Upgraded Education of IC Design Methodology at
the Department of Electron Devices of TUB. Journal on Communication (Híradástechnika)
43(3): pp. 11-14 (1992)
[A7]
Székely V., Poppe A., Benedek Zs., Halász G., Szabó P.: Új eszközök a mikroelektronikai
számítógépes tervezés oktatásában. Elektronikai technológia - Mikrotechnika 30(7-8): pp.
245-253 (1992)
[A8]
A. Poppe: ESSDERC'96. Journal on Communication (Híradástechnika) 43(11): p. 31 (1992)
1
[A9]
Poppe A.: IC tervezési lehetõségek a BME Elektronikus Eszközök Tanszékén Híradástechnika
44(3): pp. 71-74 (1993) (in Hungarian)
[A10] K. Tarnay, A. Poppe, T. Kocsis, F. Masszi: Evaluation and interpretation of 3D Monte Carlo
simulation results of
submicron MOS Transistors. Journal on Communication
(Híradástechnika) 44(7): pp. 23-31. (1993)
[A11]
K. Tarnay, F. Masszi, T. Kocsis, A. Poppe, L. Kiss: The Ionisation Process of Particles in
Mesoscopic Structures: Simulation by Monte Carlo Method. Physics Scrypta T54: pp. 256262 (1994)
[A12]
V. Szekely, A. Poppe, M. Rencz, A. Csendes, A. Pahi: Electro-thermal simulation: A
realization by simultaneous iteration
MICROELECTRONICS JOURNAL
28 (3): 247-262 MAR 1997
[A13]
K. Tarnay, A. Gali, A. Poppe, T. Kocsis, F. Masszi: Examination of MOS Structures by a 3D
Particle Dynamics Monte-Carlo Simulator Including Electrothermal Effects. Physics Scrypta
T69: pp. 290-294 (1997)
[A14]
V. Székely, A. Poppe, A. Páhi, A. Csendes, G. Hajas, M. Rencz: Electro-thermal and logithermal simulation of VLSI designs. IEEE Transactions on Very Large Scale Integration
(VLSI) System (Special Issue selected from papers presented at the Therminic’96 Workshop).
Vol. 5, No. 3, pp 258-269 (1997)
[A15]
V. Székely, A. Páhi, A. Poppe, M. Rencz: Electro-Thermal Simulation with the SISSI
Package. Joiurnal of Analog Integrated Circuits and Signal Processing. Kluwer, Vol. 21, pp.
21-31, 1999
[A16]
V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN: a thermal simulation
tool for IC chips, microstructures and PW boards
MICROELECTRONICS RELIABILITY
40 (3): 517-524 MAR 2000
[A17]
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek, K. Torki, B. Courtois, M.
Rencz: New approaches in the transient thermal measurements
MICROELECTRONICS JOURNAL
31 (9-10): 727-733 SEP-OCT 2000
[A18]
Zs. Benedek, B. Courtois, G. Farkas, E. Kollár, S. Mir, A. Poppe, M. Rencz, V. Székely, K.
Torki: A scalable multi-functional thermal test chip family: Design and evaluation
JOURNAL OF ELECTRONIC PACKAGING
123 (4): 323-330 DEC 2001
[A19] V. Székely, M. Rencz, A. Poppe, B. Courtois: THERMODEL: A tool for thermal model
generation, and application for MEMS
ANALOG INTEGRATED CIRCUITS AND SIGNAL PROCESSING
29 (1-2): 49-59 OCT 2001
[A20]
A. Poppe, V. Székely: Dynamic Temperature Measurements: Tools Providing a Look into
Package and Mount Structures, Electronics Cooling Magazin, Vol.8, No.2, May 2002. pp. 1018
[A21]
M. Rencz, V. Székely, A. Poppe, K. Torki, B. Courtois: A methodology for the co-simulation
of dynamic compact models of packages with the detailed models of boards. Submitted to CPT
Special Issue of SEMITHERM 2002
Konferencia kiadványokban megjelent publikációk:
2
[P1]
A. Poppe, V. Székely: The TRANS-TRAN 4 nonlinear circuit simulation program. In Proc. of
MICROSYSTEM'88, 30 August - 1 September 1988, Bratislava, Czechoslovakia, pp.34-35
[P2]
A. Poppe: The functional modeling feature of the TRANS-TRAN nonlinear circuit analysis
program. In Proc. of CCC'89 - 2nd Hungarian Custom Circuits Conference, 10-12 May 1989,
Szeged, Hungary, pp. 253-260
[P3]
A. Poppe, W. Schoenmaker, W. Magnus, C. Sala, R. Vankemmel, K. DeMeyer: An analytic
mobility model for two dimensional electron gas layers and the implementation in a device
simulator, In Proc. of VPAD'91 - 1991 International Workshop on VLSI Process and Device
Modeling, 26-27 May 1991, Oiso, Kanagawa, Japan, pp. 118-119,
[P4]
V. Székely, A. Poppe, M. Kerecsen-Rencz: Integration of network and thermal simulation
programs into electrical and electronics engineering education. In Proc.of The International
Workshop on Computer Aided Learning and Simulation Technologies, Czech Technical
University, Prague, 24-27 June 1991, pp. 72-95
[P5]
V. Székely, M. Kerecsen-Rencz, A. Poppe: Upgraded Education of IC Design Methodology at
the Department of Electron Devices of TUB In Proc.
- Symposium on
Microprocessor Applications, 22-24 April 1992, Budapest, Hungary, pp. 189-198
[P6]
A. Poppe, Zs. Benedek, G. Halász, P. Szabó: DIGITRAIN - a digital control system for model
- Symposium on Microprocessor Applications, 22-24 April 1992,
Budapest, Hungary, pp. 215-220
[P7]
K. Tarnay, F. Masszi, T. Kocsis, A. Poppe, P. Verhás: Quantum Mechanical Approach for the
Examination of the Properties of MOS Inversion Layers in p-type Silicon. In Proc. of the 15th
NORDIC Semiconductor Meeting, 8-11 June 1992, Hamenlinna, Finland, pp. 187-190
[P8]
A. Poppe, T. Horváth, T. Nagy, G. Érseki, G. Kasza, P. Bõsze: Impact of New CAD Systems
on Students' Projects. In Proc. of the TEMPUS Workshop: Computer Aided Methods and
Technical Management in Electrical Engineering Education. Techn. Univ. of Budapest,
Hungary, 16-18 June 1993.
[P9]
K. Tarnay, F. Masszi, A. Poppe, P. Verhás, T. Kocsis, Zs. Kohári: A 3D Monte Carlo
semiconductor device simulator for submicron silicon MOS structures
(Electrosoft'93
Conference, Southampton, UK, June 1993) Published in: Software Applications in Electrical
Engineering (ed.: P.P. Sylvester), Computational Mechanics Publications, SouthamptonBoston, 1993, pp. 345-358
[P10]
K. Tarnay, F. Masszi, A. Poppe, P. Verhás, T. Kocsis, Zs. Kohári: The MiCroMOS 3D Monte
Carlo device simulator - a tool for verifying the MINIMOS mobility models (SISDEP'93
Conference, Vienna, Austria, 7-9 September 1993) Published in: Simulation of Semiconductor
Devices and Processes Vol. 5 (ed.: S. Selberherr, H. Stippel, E. Strasser), Springer Verlag,
Wien-New York, 1993. pp. 477-480 ISBN: 3 211 82504 5
[P11]
K. Tarnay, I. Habermajer, A. Poppe, T. Kocsis, F. Masszi: Modeling the Carrier-Lattice
Interactions and the Energy Transport in a 3D Particl Dynamics Monte Carlo Simulator for
MOS Structures. In Abstracts of Papers from the Tenth International Conference on the
Numerical Analysis of Semiconductor Devices and Integrated Circuits - NASCODE X,
Dublin, Ireland, 21-24 June 1994, pp. 28-29
3
[P12]
T. Kocsis, K. Tarnay, F. Masszi, A. Poppe: Modelling the 2D behaviour of electrons near the
Si-SiO2 interface by a 3D particle dynamics Monte Carlo simulator. In Procc. of PC'94 - the
6th Joint EPS-APS International Conferenece on Physics Computing, 22-26 August 1994,
Lugano, Switzerland, pp. 22-26. ISBN: 2 88270 011 3
[P13]
K. Tarnay, F. Masszi, T. Kocsis, A. Poppe: Modeling of Impacty Ionization in a Quasi
Deterministic 3D Particle Dynamics Semiconductor Device Simulation Program (SISDEP'95
Conference, Erlangen, 6-8 September 1995) Published in: Simulation of Semiconductor
Devices and Processes Vol. 6 (ed.: H. Ryssel, P. Pichler), Springer Verlag, Wien-New York,
1995, pp. 238-241 ISBN: 3 211 82736 6
[P14]
V. Székely, A. Poppe, M. Rencz, A. Csendes, A. Páhi: Self-Consistent Electro-Thermal
Simulation: Fundamentals and Practice. In Collection of Papers presented at the 1st
THERMINIC Workshop, September 25-26 1995, Grenoble, France pp. 188-194,
[P15]
A. Poppe, J.M. Karam, K. Hofmann, M. Rencz, B. Courtois, M. Glesner, V. Székely: A
general CAD concept and design framework architecture for integrated microsystems. In Proc.
of MicroSIM'95 - 1st International Conference on Simulation and Design ofMicrosystems
and Microstructures. 26-28 September 1995, Southampton, UK
[P16]
A. Poppe, J.M. Karam, K. Hofmann, M. Rencz, B. Courtois, M. Glesner, V. Székely: A CAD
framework concept for the design of integrated microsystems. In Proc, of SPIE'95 Symposium
on Micromachining & Microfabrication, 14-15 October 1995, Austin, Texas, USA, SPIE Proc.
Vol. 2642 (Micromachined Devices and Components, Eds: Ray Roop, Kevin Chau) paper 25.,
pp.215-224
[P17]
J.M. Karam, B. Courtois, K. Hofmann, A. Poppe, M. Rencz, M. Glesner, V. Székely:
Microsystems Modeling at System Level. In Proc. of the 3rd Asia Pacific Conference on
Hardware Description Languages, January 8-10 1996, Bangalore, India, pp 34-39
[P18]
J.M. Karam, B. Courtois, K. Hofmann, M. Glesner, A. Poppe, M. Rencz, V. Székely: Applied
design and analysis of microsystems. In Proc. of ED&TC'96, 11-14 March 1996, Paris, France,
pp. 528-532
[P19]
V. Székely, A. Poppe, M. Rencz, G. Farkas, A. Csendes, A. Páhi: An efficient method for the
self-consistent electro-thermal simulation and its integration into a CAD framework. In Proc.
of ED&TC'96, 11-14 March 1996, Paris, France, p. 604
[P20]
V. Székely, A. Páhi, A. Poppe, M. Rencz: Electro-Thermal Simulation of ICs Based on the
Electricaland Thermal Netlist Extracted from the Layout. In Proc. of the 3rd Advanced
Training Course: Mixed Design of Integrated Circuits and Systems (MIXDES’96), 30 May - 1
June 1996, Lodz, Poland, pp. 250-255
4
[P21]
V. Székely, A. Poppe, A. Páhi, A. Csendes, G. Hajas, M. Rencz: Electro-thermal and logithermal simulation of VLSI designs. In Collection of Papers presented at the 2nd Therminic
Workshop, 25-27 September 1996 Budapest, Hungary, pp. 79-88.
[P22]
J.M. Karam, B. Courtois, K. Hofmann, A. Poppe. M. Rencz, M. Glesner, V. Székely: CAD of
MEMS: from the idea to the reality. In Proc. of 3rd France-Japan Congress and 1st EuropeAsia Congress on Mechatronics, Vol. 1. October 1-3 1996, Besancon, France, pp. 70-75
[P23]
J.M. Karam, B. Courtois, M. Rencz, A. Poppe, V. Székely: Microsystem Design Framework
based on Tool Adaptations and Library Developments. In Proc. of SPIE'96 Symposium on
Micromachining and Microfabrication, 14-15 October 1996, Austin, Texas, USA, SPIE Proc.
Vol. 2880 (Microlithography and Metrology in Micromachining II, Eds: Michael T. Postek,
Craig Fridrich) pp. 236-245
[P24]
V. Székely, A. Páhi, A. Poppe, M. Rencz, A. Csendes: SISSSI - a tool for dynamic electrothermal simulation of analog VLSI cells. EDTC’97, 17-20 March 1997, Paris, France. p. 617.
[P25]
V. Székely, A. Páhi, A. Poppe, G. Hajas, M. Rencz, A. Csendes: SISSSI: an Electro-Thermal
Simulation Tool for IC Design. MIXDES’97 - 4th International Workshop Mixed Design of
Integrated Circuits and Systems, 12-14 June 1997, Poznan, Poland, pp. 283-293
[P26]
J.M. Karam, B. Courtois, H. Boutamine, P. Drake, A. Poppe, V. Szekely, M. Rencz, K.
Hofmann, M. Glesner: CAD and Foundries for Microsystems.
34th Design Automation Conference, 9-13 June 1997, Anaheim, Claifornia, USA.
pp.674-679
[P27]
V. Székely, A. Páhi, A. Poppe, M. Rencz: Electro-Thermal Simulation with the SISSI
Package. ECS’97 - 1st Electronic Circuits and Systems Conference, 4-5 September 1997,
Bratislava, Slovakia, pp. 141-146
[P28]
V. Székely, A. Poppe, M. Rencz, A. Páhi, G. Hajas: Electro-thermal and logi-thermal
simulation of ICs. Hungarian-Korean Seminar on Integrated Circuits and Devices, 24-26 June
1997, Budapest, Hungary, pp 157-166
[P29]
K. Tarnay, T. Kocsis, A. Poppe, Á. Gali: MicroMOS - a quasi deterministic 3D Monte Carlo
simulation method for sub-half-micron MOS transistors. Hungarian-Korean Seminar on
Integrated Circuits and Devices, 24-26 June 1997, Budapest, Hungary, pp 275-286
[P30]
H. Boutamine, J.M. Karam, B. Courtois, P. Drake, J. Oudinot, H. El Tahawi, A.D. Cao, M.
Rencz, A. Poppe, V. Székely: Engineering tool set for monolithic and hybrid microsystem
design. In Proc. of SPIE'97 Symposium on Micromachining & Microfabrication, 29-30
September 1997, Austin, Texas, USA, SPIE Proc. Vol. 3225 (Microlithography and Metrology
in Micromachining III, Eds: Craig Fridrich, Akira Umeda) pp. 236-245
5
[P31]
V. Székely, M. Rencz, A. Poppe, A. Páhi, G. Hajas, L. Lipták-Fegó: Uncovering thermally
induced circuit behaviour of integrated circuits with the SISSI simulation package. In
Collection of Papers presented at the 3rd Therminic Workshop, 21-23 September 1997
Cannes, France, pp. 149-152.
[P32]
B. Courtois, J.M. Karam, M. Lubaszewski, V. Szekely, M. Rencz, A. Poppe, K. Hofmann, M.
Glesner: CAD Tools and Foundries to Boost Microsystems Development, LDSD'97, The
Second International Conference on Low Dimensional Structures & Devices, Lisbon, Portugal
19-21, May 1997
[P33]
Székely, M. Rencz, A. Páhi, A. Poppe, Sz. Hajder: Thermal simulation tools for microsystem
elements. Proc. T366 of MSM'98, April 6-8, 1998, Santa Clara, California, USA
[P34]
G. Hajas, A. Páhi, Sz. Hajder, A. Poppe, M. Rencz, V. Székely: Thermal Investigation of
Digital Integrated Circuits.In Informal Proc. of the 5th NEXUSPAN Workshop. 6-8 May 1998,
Budapest, pp. 49-54
[P35]
A. Páhi, V. Székely, M. Rencz, A. Poppe, Sz. Hajder: New software tools for the thermal and
electrostatic simulation of microsystem elements.In Informal Proc. of the 5th NEXUSPAN
Workshop. 6-8 May 1998, Budapest, pp. 162-169
[P36]
G. Hajas, A. Páhi, Sz. Hajder, A. Poppe, M. Rencz, V. Székely: Logi-thermal simulation: a
new approach for considering thermal effects in digital designs. Proc. of WDTA’98 (1st
International Workshop on Design, Test and Applications), 8-10 June 1998, Dubrovnik,
Croatia, pp. 89-92. ISBN 953-184-009-1
[P37]
G. Hajas, A. Páhi, Sz. Hajder, A. Poppe, M. Rencz, V. Székely: Thermal investigation of large
digital integrated circuits. Proc. of MEXDES’98 (5th International Conference on Mixed
Design of Integrated Circuits and Systems), 18-20 June 1998, Lodz, Poland, pp. 223-227.
[P38]
V. Székely, A. Poppe, M. Rencz, A. Páhi, Sz. Hajder, G. Hajas: Structural and algorithmic
questions of a platform independent electro-thermal simulator. Proc. of the 4th THERMINIC
Workshop, 27-29 September 1998, Cannes, France, pp. 121-126.
[P39]
V. Székely, M. Rencz, A. Poppe, B. Courtois: New Way for Thermal Transient Testing.
Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium
(SEMI-THERM), Proceedings 1999, pp. 182-188
UGRÁS
[P41]
M. Oláh, S. Török, A. Poppe, P. Masa, A. Lőrincz: Mixed-Signal VLSI for Skeletonization by
Grassfire Transformation - Design and Evaluation. ECS'99 - 2nd Electronic Circuits and
Systems Conference, Bratislava, Slovakia, Sept. 1999
[P42]
M. Oláh, S. Török, A. Poppe, P. Masa, A. Lőrincz: Design and Evaluation of a Grassfire
Skeletonization Chip. Proc. of MIXDES'99 (6th International Conference on Mixed Design of
Integrated Circuits and Systems), Krakow, Poland, 17-19 June, 1999, pp. 477-481
UGRÁS
[P44]
V. Székely, S. Ress, A. Poppe, S. Török, D. Magyari, Zs. Benedek, B. Courtois, M. Rencz:
Transient thermal measurements for dynamic package modeling: new approaches. Proc. of the
5th Therminic Workshop, 3-6 October 1999, Rome, Italy, pp. 7-11
[P45]
M. Rencz, V. Székely, Zs. Kohári, S. Ress, A. Poppe: Thermal evaluation of the SIP9
package. Proc. of the 5th Therminic Workshop, 3-6 October 1999, Rome, Italy, pp. 111-116.
[P46]
A. Poppe, Gy. Csaba, K. Tarnay, V. Székely: Considering electro-thermal interactions in submicron n-MOS transistors on microscopic scale within a 3D particle dynamics based Monte
6
Carlio simulator. Proc. of the 5th Therminic Workshop, 3-6 October 1999, Rome, Italy, pp.
134-137.
[P47]
V. Székely, A. Páhi, A. Poppe, M. Rosental, T. Teszéri, M. Rencz: Thermal time constant
analysis and implementation in the THERMAN and SUNRED thermal simulation tools. Proc.
of the 5th Therminic Workshop, 3-6 October 1999, Rome, Italy, pp. 343-348.
[P48]
M. Rencz, V. Székely, A. Páhi, A. Poppe: Algorythmic and practical questions of electrothermal circuit simulation. SPIE's International Symposium on Microelectronics and MicroElectromechanical Systems, 27-29 October, 1999, Royal Pines Resort, Queensland, Australia,
SPIE Proc.Vol 3893, pp.178-187
[P49]
V. Székely, A. Poppe, M. Rencz, M. Rosental, T. Teszéri: THERMAN: a thermal-simulation
tool for IC chips, microstructures and PW boards. MIXDES'99 (6th International Conference
on Mixed Design of Integrated Circuits and Systems), Krakow, Poland, 17-19 June, 1999, pp.
331-336
[P50]
M. Rencz, V. Székely, A. Páhi, A. Poppe: An alternative method for electro-thermal circuit
simulation., Proceedings of the 1999 Southwest Symposium on Mixed-Signal Design, April
11-13, 1999, Tucson, Arizona, USA, pp. 117-122
[P51]
Oláh Miklós, Poppe András, Lőrincz András: Szenzoros információ feldolgozása analóg VLSI
rendszerekkel. PKI Tudományos Napok, 1999. November 23-24
[P52]
V. Székely, A. Poppe, M. Rencz: Algorithmic extension of thermal field solvers: the time
constant analysis. Proc. of the SEMI-THERM Symposium, March 21-23, 2000, Double Tree
Hotel, San Jose, CA, USA, pp. 99-106
[P53]
V. Székely, A. Poppe, M. Rencz: User friendly thermal simulators for research and education.
ISSE 2000, Balatonfüred, May 6-10. 2000, Hungary. Proceedings, pp. 106-110
[P54]
V. Székely, M. Rencz, A. Poppe, B. Courtois: THERMODEL: A tool for thermal model
generation, and application for MEMS packages, SPIE DTIP Conference, May. 9-11.Paris,
France. Proceedings, pp. 39-49, 2000
[P55]
M. Rencz, V. Székely, A. Poppe, B. Courtois: Friendly tools for the thermal simulation of
power packages. IWIPP 2000 Int. Wshop on Integrated Power Packaging, July 14-15 2000,
Waltham, Ma, USA, Proceedings pp 51-54
[P56]
A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely, K. Torki, S. Mir, B.
Courtois: Design of a scalable multi-functional thermal test die with direct and boundary scan
access for programmed excitation and measurement data acquisition. 6 th Therminic Workshop,
September 24-27 2000, Budapest, Hungary, pp. 267-272
[P57]
M. Rencz, V. Székely, A. Poppe, B. Courtois: From MEMs to the global simulation of SoCs.
International Symposium on Microelectronics and Assembly (ISMA) 2000, Nov. 27-Dec. 1.
2000, pp. 9-22
[P58]
V. Székely, M. Rencz, A. Poppe, B. Courtois: New hardware tools for the thermal transient
testing of packages. 3rd Electronics Packaging Technology Conference, (EPTC) 2000, 5-7
December, 2000, Singapore, pp. 46-52
[P59]
A. Poppe, G. Farkas, M. Rencz, Zs. Benedek, L. Pohl, V. Székely, K. Torki, S. Mir, B.
Courtois: Design issues of a multi functional intelligent thermal test die. SEMI-THERM XVII,
San Jose, CA, USA, March 20-22, 2001
[P60]
M. Rencz, V. Székely, A. Poppe, G. Farkas, B. Courtois: New tools and methods for the
thermal transient testing of packages. HD International 2001. Santa Clara, CA, USA, April
18-20. 2001, Proceedings pp 268-273
7
[P61]
A.Poppe, M.Rencz, V.Székely, G.Mezei: Development of a platform independent electrothermal simulator, THERMINIC Workshop, Sept.24-27, Paris, France, 2001, Proceedings pp
275-280
[P62]
M.Rencz, V.szekely, A.Poppe, G.Farkas, B.Courtois: New methods and supporting tools for
the thermal transient testing of packages, APACK 2001, Singapore, 5-7 dec. 2001
[P63]
M. Rencz, V. Székely, A. Poppe, B. Courtois: An algorithm for the direct co-simulation of
dynamic compact models of packages with the detailed thermal models of boards. 4 th
Electronics Packaging Technology Conference (EPTC 2002) 10-12. December, Singapore,
Proceedings pp 293-298.
[P64]
M. Rencz, V. Székely, A. Poppe, B.Courtois: Co-simulation of Dynamic compact models of
packages with the detailed models of printed circuit boards, SEMICON West 2002, July 16-18
2002, San Jose, CA, USA, Proceedings pp 285-290
[P65]
M. Rencz, V. Székely, A. Poppe: Integration of a network solver and a field solver for the
mixed level thermal simulation of MEMS problems, DTIP Design, Test, Integration and
Packaging of MEMS/MOEMS (DTIP) 2002, 6-8 May 2002 Cannes, France, Proceedings of
SPIE, Vol. 4755, pp 36-43 (2002)
[P66]
M. Rencz, A. Poppe, V. Székely, B. Courtois: Inclusion of RC compact models of packages into
board level thermal simulation tools, SEMITHERM, March 1-14 2002,San Jose, CA, USA,
Proceedings pp 71-76
[P67]
V. Székely, M. Rencz, A. Poppe, G. Farkas: User friendly tools for the thermal simulation and
modeling of electronic subsystems EurosimE 2002, 15-16 April 2002, Paris, France,
Proceedings pp 254-261
[P68]
M. Rencz, V. Székely, A. Poppe, K. Torki, B. Courtois: Electro-thermal simulation for the
prediction of chip operation within the package. SEMI-THERM XIX, March 11-13, 2003, San
Jose, CA, USA Proceedings pp. 168-175
[P69]
M. Rencz, V. Székely, A. Poppe: A fast algorithm for the layout based electro-thermal cosimulation. DATE 03, March 3-7, 2003, Munich, Germany, Proceedings pp 1032-1037
[P70]
M. Rencz, V. Székely, A. Poppe, B. Courtois: Algorithmic and modeling aspects in the electrothermal simulation of thermally operated microsystems. Nanotech2003, February 23-27, 2003,
San Francisco, USA, pp 476-481
[P71]
G. Farkas, A. Poppe, E. Kollár, P. Stehouwer: Dynamic compact models of cooling mounts for
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N.J. Pilgrim, W. Batty, R.W. Kelsall, C. Snowsen: Nanascale electrothermal co-simulation:
compact dynamic models of hyperbolic heat transport and self-consistent device Monte Carlo,
9th THERMINIC Workshop, 24-26 September 2002, Aix-en-Provance, France, pp. 239-244
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C.J.M. Lasance: Final report on the EC-funded thermal project PROFIT, 9th THERMINIC
Workshop, 24-26 September 2002, Aix-en-Provance, France, pp. 283-289
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[C109] M.R. Stan, K. Skadron, M. Barcella, W. Huang, K. Sankaranarayanan, S. Velusamy: HotSpot:
a dynamic compact thermal model at the processor-architecture level, Microelectronics
Journal 34: pp. 1153-1165 (2003)
Hivatkozza [A18]
[C110] M.R. Stan, K. Skadron, M. Barcella, W. Huang, K. Sankaranarayanan, S. Velusamy: HotSpot:
a dynamic compact thermal model at the processor-architecture level, Microelectronics
Journal 34: pp. 1153-1165 (2003)
Hivatkozza [A14]
pohl therminic 9 197-200 – eurosime
szekely – torok therminic 9 233-238 – date2003
19