PSZ 19:16 (Pind. 1/07)
UNIVERSITI TEKNOLOGI MALAYSIA
DECLARATION OF THESIS / UNDERGRADUATE PROJECT REPORT AND COPYRIGHT
Author’s full name : LEONG KAH MENG
Date of Birth
: JUNE 21ST 1990
Title
: WIRELESS ENERGY TRANSFER VIA ANTENNA
Academic Session : 2012/2013
I declare that this thesis is classified as:

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(Contains confidential information under the Official Secret Act
1972)*
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(Contains restricted information as specified by the
organization where research was done)*
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Date:
NOTES:
*
19th JUNE 2013
EN. JOHARI BIN KASIM
NAME OF SUPERVISOR
Date:
19th JUNE 2013
If the thesis is CONFIDENTAL or RESTRICTED, please attach with the letter from
the organization with period and reasons for confidentiality or restriction.
ii
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opinion this thesis is sufficient in terms of scope and quality for the
award of the degree of Bachelor of Engineering (Electrical - Electronics)”
Signature
Name of Supervisor
Date
: ………………………….........
: EN. JOHARI BIN KASIM
: ………………………………..
Signature
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Date
: ………………………….........
: DR. TAN TIAN SWEE
: ………………………………..
iii
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Adalah disahkan bahawa projek penyelidikan tesis ini telah dilaksanakan melalui
kerjasama antara _______________________ dengan _______________________
Disahkan oleh:
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Nama : ……………………………………….
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* Jika penyediaan tesis/projek melibatkan kerjasama.
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Tesis ini telah diperiksa dan diakui oleh:
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Nama dan Alamat Pemeriksa Dalam :
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……………………………………………..
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Disahkan oleh Timbalan Pendaftar di SPS:
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iv
WIRELESS ENERGY TRANSFER VIA ANTENNA
LEONG KAH MENG
A thesis submitted in fulfilment of the
requirements for the award of the degree of
Bachelor of Engineering (Electrical - Electronics)
Faculty of Electrical
Universiti Teknologi Malaysia
JUNE 2013
v
I declare that this thesis entitled “Wireless Energy Transfer Via Antenna” is the
result of my own research except as cited in the references. The thesis has not been
accepted for any degree and is not concurrently submitted in candidature of any
other degree.
Signature
Name
Date
:
:
:
....................................................
LEONG KAH MENG
June 19th 2013
vi
To my family and friends
vii
ACKNOWLEDGEMENT
My special thank go to En. Johari Bin Kasim and Dr. Tan Tian Swee, who
acted as my research supervisor and co-supervisor. They always help me during the
development of this thesis. I found their expertise, suggestions and patience were
valuable. I also thank Lum Kin Yun, who acted as my mentor and provide most
valuable comments. I have truly learned many things from him. A special word of
thank is due to my friends, who always gave me spiritual support. I appreciate the
help that provided by them whenever I faced difficulties.
.
.
viii
ABSTRACT
This study mainly discussed about the wireless energy transfer using antenna. An
antenna is an electrical device which can converts electric power into radio waves and
vice versa. The antenna can transmit the energy through the air from the current in the
form of electromagnetic waves (radio waves) at several operating frequency. In this
project, microstrip antenna is chosen to be the transmetter antenna and receiver antenna
pair for the charging system. Microstrip antenna call also name as patch antenna, had
been well known to most of the researcher due to its characteristic of ease of analysis,
fabrication, feeding methods. It consists of a metallic conductor (patch) that is placed on
top of a grounded dielectric substrate which can be say as „printed‟ on the surface. A
charge pump is design by modifying voltage multiplier which consists of diodes and
capacitors. In theory, it can produce an output which is multiple from the input power
supply depend on the stages used. The project involves with tools learning which is
needed in this project for example: AWR Design Environment, Auto CAD 2009, Proteus
Professional and Eagle Layout Editor. This 2 software AWR Design Environment and
Auto CAD 2009 are needed during the early stage of antenna design and simulation
result. The other 2 software which is Proteus Professional and Eagle Layout Editor which
are used to design charge pump and the simulation result including fabrication of charge
pump. In the end of experiment, result show that different size of antenna consists of
different resonance frequency. The lower the resonance frequency of microstrip antenna
larger the size of microstrip antenna and vice versa. Lower resonance frequency,
1.94GHz can travel longer distance compare to higher resonance frequency, 2.5GHz.
ix
ABSTRAK
Kajian ini terutamanya membincangkan tentang pemindahan tenaga tanpa wayar
menggunakan antena. Antena adalah alat elektrik yang boleh menukarkan tenaga
elektrik kepada gelombang radio dan sebaliknya. Antena boleh menghantar tenaga
melalui udara dari semasa dalam bentuk gelombang elektromagnetik (gelombang
radio) di beberapa kekerapan operasi. Dalam projek ini, antena mikrostrip dipilih
untuk menjadi antena transmetter dan sepasang antena penerima untuk sistem caj
elektrik. Mikrostrip antena memanggil juga menamakan sebagai antena patch, telah
diketahui kebanyakan penyelidik kerana ciri-ciri yang memudahkan analisis,
fabrikasi, makan kaedah. Ia terdiri daripada konduktor logam (patch) yang
diletakkan di atas substrat dielektrik berasaskan yang boleh dikatakan sebagai
'dicetak' di permukaan. Sebuah pam caj adalah reka bentuk dengan mengubah
pengganda voltan yang terdiri daripada diod dan kapasitor. Secara teori, ia boleh
menghasilkan output yang pelbagai dari bekalan kuasa input bergantung kepada
peringkat yang digunakan. Projek ini melibatkan dengan alat pembelajaran yang
diperlukan dalam projek ini sebagai contoh: AWR Design Alam Sekitar, Auto CAD
2009, Proteus Profesional dan Eagle Layout Editor. 2 perisian AWR Design Alam
Sekitar dan Auto CAD 2009 diperlukan pada peringkat awal reka bentuk antena dan
hasil simulasi. Perisian 2 yang lain, Proteus Profesional dan Eagle Editor Layout
yang digunakan untuk reka bentuk pam caj elektrik dan hasil simulasi termasuk
fabrikasi pam cas elecktrik. Pada akhir eksperimen, mengakibatkan menunjukkan
bahawa saiz yang berbeza antena terdiri daripada frekuensi resonans yang berbeza.
Lebih rendah frekuensi resonans antena mikrostrip lebih besar saiz antena mikrostrip
dan sebaliknya. Rendah resonans kekerapan, 1.94GHz boleh pergi lagi jauh
berbanding dengan resonans kekerapan yang lebih tinggi, 2.5GHz.
x
TABLE OF CONTENTS
CHAPTER
TITLE
ACKNOWLEDGEMENT
1
2
PAGE
vii
ABSTRACT
v
ABSTRAK
ix
TABLE OF CONTENTS
x
LIST OF FIGURES
xii
LIST OF TABLES
xiii
LIST OF ABBREVIATION
xiv
LIST OF APPENDICES
xv
INTRODUCTION
1
1.1
Background Study
1
1.2
Problem Statement
2
1.3
Objective
2
1.4
Scope of Study
3
1.5
Work Contribution
3
LITERATURE REVIEW
4
2.1
Antenna
4
2.2
Microstrip Antenna
5
2.2.1
Advantages and Disadvantages Of Microstrip
Antenna
6
2.2.2
Application of Microstrip Antenna
7
2.3
Rectifier
8
2.3.1
Half-wave rectification
8
2.3.2
Full-wave rectification
9
2.4
Voltage Doubler
2.5
Diode
9
11
xi
2.6
3
4
Capacitor
METHODOLOGY
15
3.1
Work flow of project
15
3.2
System Overview
17
3.3
System Developing Process
18
3.3.1
Antenna Design
20
3.3.2
Charge Pump
26
3.3.3
Soldering Process
29
3.3.4
Measurement
32
RESULT AND DISCUSSION
35
4.1
Result Overview
35
4.2
Overall Result
36
4.2.1
Antenna
36
4.2.1.1 Size Of Antenna
36
4.2.1.2 Frequency Response Of Antenna
39
Power Receive
40
4.2.2
5
12
CONCLUSION AND FUTUTE WORK
44
5.1
Conclusion
44
5.2
Problems
45
5.2
Recommendation
46
REFERENCES
47
APPENDIX A
50
APPENDIX B
51
APPENDIX C
61
APPENDIX D
70
xii
LIST OF FIGURES
FIGURE NO.
TITLE
PAGE
2.1
Representative Shapes Of Microstrip Antenna
2.2
Parameters For A Typical Rectangular Microstrip Antenna 6
2.3
Half-wave Rectification
9
2.4
Full-wave Rectification
9
2.5
Voltage Doubler
10
2.6
Voltage Doubler Waveform
10
2.7
Top View For SOT 323 Package
12
2.8
Ceramic Capacitor
12
Dimension of MLCC
13
2.10
Q Factor Specification vs. Specific Frequency For 0402
14
2.11
Q Factor Specification vs. Specific Frequency For 0603
14
3.1
Workflow Of The Project
17
3.2
Overview of project
18
3.3
Summary Of Antenna Design
19
3.4
Main Window In AWR Design Environment
21
3.5
TXLINE calculator
22
3.6
Design Microstrip Antenna
23
3.7
Frequency response for microstrip antenna
23
3.8
UV exposure machine
24
3.9
Microstrip antenna resonance frequency 1.94GHz
2.9
5
and 2.5 GHz
25
3.10
Network Analyzer
26
3.11
Voltage multiplier design using Proteus 7 Professional
27
3.12
7 stages Voltage multiplier
28
3.13
PCB Drawing using Eagle Layout Editor
29
3.14
Hot Air Station
30
xiii
3.15
Pre-Heater
31
3.16
Charge pump
32
3.17
Measurement using Lab Bricks and Power Meter
33
3.18
USB Power Meter
34
4.1
Comparison between 2 Antennas
36
4.2
Comparison between actual and Software simulation for
1.94GHz
4.3
Comparison between actual and Software simulation for
2.5GHz
4.4
38
39
Comparison between 2 different frequencies (1.94GHz
and 2.5GHz)
43
xiv
LIST OF TABLES
TABLE NO.
TITLE
2.1
Application of mcrostrip antenna
2.2
Dimension of MLCC
4.1
Comparison Within Network Analyzer And AWR
Design Environment For 1.94GHz
4.2
PAGE
8
13
38
Comparison Within Network Analyzer And AWR
Design Environment For 2.5GHz
39
4.3
Resonance Frequency =2.5GHz
41
4.4
Resonance Frequency =1.94GHz
42
xv
LIST OF ABBREVIATION
AO
-
Analog Office
AWRDE
-
AWR Design Environment
DC
-
Direct Current
AC
-
Alternating Current
MLCC
-
Multilayer Ceramic Capacitor
MWO
-
Microwave Office
RF
-
Radio Frequency
RFID
-
Radio Frequency Identification
SMT
-
Surface Mounted
VSS
-
Visual System Simulator
xv
LIST OF APPENDICES
APPENDIX
TITLE
PAGE
A
GHANTT CHART
50
B
DATA SHEET OF MLCC
51
C
DATA SHEET OF DIODE
61
D
AWR DESIGN ENVIRONMENT GUIDE
70
1
CHAPTER 1
INTRODUCTION
1.1
Background of Study
Nowadays, the usage of electronic devices is gradually increases for every
mankind in this world.
For examples smart phones, laptop, Ipad and Ipod are
become important to everyone. No matter whom you are, students, business, or even
though you are just a house wife, those electronic devices are become a necessities
for everyone. Smart phone play an important role in communication field which can
easily connecting one to another. Of course you won‟t find a University students
study without laptop and the business man can done any investment without using a
laptop. I-pad and I-pod also are the most popular entertainment electronic devices
among the teenagers. All of these electronic devices do need a charger. Imagine this,
when go oversea to dealing with your business, all of a sudden you realize that you
forget to bring your charger. To make sure this situation does not happen to you,
every time you leave your house you must bring along your charger.
What a
troublesome thing. After several hours journey travel with your family and you
spend the time playing I-pad or I-pod in bus, and the batteries is low. The first thing
you have to do is find a hotel and charge up your devices.
2
1.2
Problem Statement
A charger is an important thing for every electronic device, without charger
non-of the electronic devices can last more than 1 week. However, not everyone will
bring along the charger side by side to every place they go. Although the charger is
not large in size and heavy but carry a charger to travel everywhere is very
inconvenience. And every time you want to leave your house for several days, you
have to bring along the charger. If you forget to bring the charger will make you
suffer which all the electronic devices will ran out of batteries and stop function.
One of the weaknesses of nowadays charger, which most concern by
everyone is the cable of the charger is too short. You cannot charge your electronic
devices in everywhere you like, but you have to charge the electronic device near to
the plug but not your bed or sofa. This make you have to wait until the devices fully
charge then only you can proceed your further job. To compensate this problem,
wireless charger is need for everyone who is using the electronic devices. Microstrip
antenna charger is needed to implement to solve all the problems. This type of
microstrip antenna contains its pros and cons. In this project, we will further discuss
the method and the design of the microstrip antenna charger.
1.3
Objective
The main objective of this project is to study the characteristic of microstrip
antenna. The sub-objective is to design an antenna pairs used for power transmission
and receiving purpose.
To study the characteristic of antenna and study the
parameter that will affect the wireless charging system. Design a wireless charging
device by using microstrip antenna. Last but not least, to determine the wireless
energy transfers frequency range which is safe to human body
3
1.4
Scope of the project
The scope of this project is to design and implement a receiver and
transmitter by using microstrip antenna which operates at frequency from 3MHz to
3GHz. The distance within the transmitter and the receiver will be 25 centimeter.
Firstly, the literature review about microstrip antenna had been done to understand
the concept of array microstrip antenna. Then, a microstrip antenna is designed to
check for the patch dimensions and their related variables. After the fine and tuning
process done, and the dimensions have been decided, microstrip antennas are
designed in the final stage of the project. The input power is set to 10mW.
1.5
Work Contribution
The microstrip array antenna is a antenna that can produce high gain with low
fabrication cost. It can only successfully designed and implemented by proper time
management, planning and the allocation of working period are done well. The main
contribution of this project is first, identifying the problem and objectives. Follow by
literature review for others work and papers. After that constructs a prototype of
transmitter and receiver for this project. When the prototype is done, we must go
through testing of the prototype whether this prototype can work according to theory
or not. If the prototype can work properly according the design, then we can move to
next stage which is fine and tuning process. This process can help to improve the
system performance and reduce error. When all the steps are done, then we can
record the result and further discuss about the result. From the result, we can analyze
and commend for the future works.
4
CHAPTER 2
LITERATURE REVIEW
2.1
Antenna
An antenna is an electrical device which can converts electric power into
radio waves and vice versa. The antenna can transmit the energy through the air
from the current in the form of electromagnetic waves (radio waves) at several
operating frequency. An antenna receives some of the energy from electromagnetic
wave to generate a tiny voltage at its terminal, and transfer to the receiver to amplify
the voltage to certain amount that we need. In Webster‟s Dictionary, an antenna
defined as a usually metallic device (as a rod or wire) use in radiating or receiving radio
wave. However, an antenna is defined as the part of transmitting or receiving system
that is designed to radiate or to receive electromagnetic wave based on IEEE Standard
Definitions of Terms for Antennas. An antenna can be classified into several types.
These are the antenna type which are most common can found in the market, wire
antennas, aperture antennas, reflector antennas, microstrip antennas, array antennas,
dielectric antennas, active integrated antennas, lens antennas and last but not least leaky
wave antennas.
However, nowadays from all these types of antenna, microstrip antennas is the
most popular and most applicable compared with other types of antenna due to its
characteristic which ease of analysis, fabrication, feeding methods and their attractive
radiation characteristics especially low cross-polarization radiation. Over the years,
many papers have been published on microstrip antenna for various applications, such as
mobile communications radio frequency identification (RFID), and medical telemetry.
5
Microstrip antenna is antenna that consists of a metallic conductor (patch)
that is placed on top of a grounded dielectric substrate which can be say as „printed‟
on the surface. There are several pattern of patch antenna such as square, rectangular,
thin strip (dipole), circular, elliptical, triangular, disc sector or any other configuration as
shown in Figure 2.1. Among all those patterns, the square, triangular, rectangular and
circular are the most commonly use due to the characteristic of ease of analysis and
fabrication.
a) Square
b) Rectangular
f) Circular
Figure 2.1
2.2
c) Dipole
d) Elliptical
e) Triangular
g) Circular Ring h) Ring Sector i) Disc Sector
Representative shapes of microstrip antenna (Sim, Z, 2010)
Microstrip Antenna
Microstrip antenna call also name as patch antenna, had been well known to
most of the researcher due to its characteristic of ease of analysis, fabrication, feeding
methods. It is also famous in point-to-point application. Most of the common microstrip
antennas design constructed by 4 part. First is a very this flat metallic region which call
as patch. Secondly is the dielectric substrate of the antenna. Thirdly is the ground plane
which is usually much larger then a patch. Last part is the feed network. This part is
important because this feed network is use to connect within the connector and the
6
circuit. If error occur, it may affect the performance of antenna. A simple configuration
of microstrip antenna is as shown in Figure 2.2
L
Patch
W
t
Dielectric
Substrate
h
Ground Plane
Figure 2.2: Parameters for a typical rectangular microstrip antenna (Sim, Z, 2010)
2.2.1
Advantages and Disadvantages Of Microstrip Antenna
These are some of the advantages of microstrip antenna which make
researcher to choose this microstrip antenna as one of the research material in
wireless energy transfer. For example, it is easy to fabricate. The fabrication process
will be further discusses in chapter 3 methodology. Low fabrication cost which can
also consider inexpensive also one of the reason which make this microstrip antenna
popular use in research. Other than that, microstrip antenna also is a efficient
radiator. It can act as transmitter and receiver pair for the system. It also supports not
only linear but circular polarization. It is easy to feed with the microwave integration
circuit and other connector. Most commonly connector use to feed the microstrip
antenna is call SMA connector. The microstrip antenna usually is small in size and
light in weight. So it is easy to keep and carry. It is also flexible to be design
according the shape and desire resonance frequency you want. In this project we will
used the AWR design environment to design the antenna according to the desire
frequency.
7
Of course everything has its pros and cons, microstrip antenna does had its
disadvantages. These are some of the disadvantages of microstrip antenna. For
example, the microstrip antenna had low impedance bandwidths which make the
transmission easy being affect by noise. It also had a lower gain compare to other
antenna. Low gain is one of the disadvantages that need more consideration. This is
because a low gain antenna will not provide a very efficient output that you desire.
Sometimes, extra radiation occurs from its feed and junctions. This will cause the
leakage of the signal or energy. If the precaution is not done, it might cause the
system fail to receive any signal or energy from the transmitter. The excitation of
surface wave is one of the disadvantages of microstrip antenna. The polarization
purity of the microstrip antenna is difficult to achieve. Microstrip antenna had lower
power handling capability compare to other antennas.
Sometimes the size of
microstrip antenna can be part of disadvantages of microstrip antenna. Certain
research the size of antenna will be fabricate in very big size in order to had better
achievement.
2.2.2
Application of Microstrip Antenna
Microstrip antennas are now gradually used in many applications. Nowadays,
many applications have chosen microstrip antennas for their main component during
implementation process. For example, microstrip antenna can function as transmitter
and receiver to transmit and receive energy using radio frequency. Some of the
applications of the microstrip antennas in military and civil are as mention in table
2.1. From the table is classify the application of the microstrip antenna and its field.
Platform
Application
Aircraft
Radar communication, navigation, altimeter, landing
system.
Missiles
Radar, fuzing, telemetry.
Satellites
Communication, Direct TV broadcast, remote sensing
8
radars and radiometers.
Ships
Communication, navigations and radar.
Land Vehicles
Mobile telephone, mobile radio.
Others
Biomedical systems, intruder alarm.
Table 2.1
2.3
Application of mcrostrip antenna
Rectifier
A rectifier is an electrical device that converts alternating current (AC) into
direct current (DC). It makes sure current only flows in one direction. The process
is can be said as rectification. Physically, rectifiers have several features, including
vacuum tube diodes, mercury-arc valves, solid-state diodes, silicon-controlled
rectifiers and other silicon-based semiconductor switches.
Historically, even
synchronous electromechanical switches and motors have been used.
2.3.1
Half-wave rectification
During half wave rectification, a single-phase was supply to the input, either
the positive or negative half of the AC wave is passed, in the other way the other half
is blocked. Due to the only one half of the input waveform that can reach the output,
so the voltage is lower. A single diode is enough for half-wave rectification in a
single-phase supply. However a half-wave rectifier will produce more ripple than
full-wave rectifiers, and some process for example filtering process need to be done
to eliminate harmonics of the AC frequency from the output. Figure 2.4 show the
input and output waveform of a half-wave rectifier.
9
Figure 2.3
2.3.2
Half-wave rectification (Mohd Suzaini , May 2008)
Full-wave rectification
Full-wave rectification converts both polarities of the input waveform to DC
(direct current), and produce higher mean output voltage compare to half-wave
rectifier. Two diodes and a center tapped transformer, or four diodes by using bridge
configuration and input AC source are needed to set up a complete full wave rectifier.
Figure 2.5 show the input and output waveform for a full-wave rectifier.
Figure 2.4
2.4
Full-wave rectification (Mohd Suzaini , May 2008)
Voltage Doubler
A voltage doubler consists of 2 diodes and 2 capacitors. In theory, it can
produce an out double which is double from the input power supply. The radio
frequency wave is rectified by D2 and C2 in the positive half of the cycle, and then
by D1 and C1 in the negative cycle. During the positive half-cycle, the voltage
stored on C1 from the negative half-cycle is transferred to C2. The voltage on C2 is
approximately two times the peak voltage of the RF source minus the turn-on voltage
of the diode, therefore it is name as voltage doubler. Figure 2.6 and 2.7 show a
voltage doubler schematic and its waveform.
10
AC
+
Figure 2.5
DC
-
Voltage Doubler
Voltage
Input
Output
Figure 2.6
Voltage Doubler Waveform (Mohd Suzaini , May 2008)
The radio frequency wave is rectified by D2 and C2 in the positive half of the
cycle, and then by D1 and C1 in the negative cycle. During the positive half-cycle,
11
the voltage stored on C1 from the negative half-cycle is transferred to C2. The
voltage on C2 is roughly two times the peak voltage of the RF source minus the turnon voltage of the diode, hence the name voltage doubler.
2.5
Diode
There are many types of diode in the world but not every diode is suitable to
be use in this project. This project mainly about wireless energy transfer using
frequency up to Giga Hz. Therefore the diode must be a high frequency diode with
low turn on voltage. Surface mount microwave schottky detector diodes is suitable
to use in this project. This is some of the feature of this HSMS-286X family of this
diode surface mount SOT-23/SOT-143 pakages and miniature SOT-323 and
SOT‑363 packages. Usually it consists of high detection sensitivity which makes it
popular in RF application. It can detect up to 50 mV/μW at 915 MHz, and also
detect up to 35 mV/μW at 2.45 GHz and last but not least detect up to 25 mV/μW at
5.80 GHz. Surface mount microwave schottky detector diodes are low FIT (Failure
in Time) rate. It is also available to provide tape and reel options. Surface mount
microwave schottky detector diodes is also a Unique Configurations in Surface
Mount SOT-363 Package. This is because it can increase flexibility, save board
space and reduce cost. All this advantages is needed when soldering process in PCB.
The HSMS-286K grounded center leads provide up to 10 dB higher isolation. It is
also matched diodes for consistent performance and better thermal conductivity for
higer power dissipation.
Due to its high sensitivity, it is chosen to be use in this project as rectifying
purpose. Figure 2.8 show its top view in SOT 323 package lead code identity (top
view).
12
Figure 2.7
2.6
Top view for SOT 323 package (Appendix C)
Capacitor
There was many capacitors‟ data sheet also being study in order to get the
suitable capacitor which can use in this project.
Multilayer ceramic capacitor
(MLCC) with high capacitance and low ESR series were chosen to be further
research to be use in this project. MLCC consists of a conducting material and
electrodes. To manufacture a chip-type SMT and achieve miniaturization, high
density and high efficiency, ceramic condensers are used.
Figure 2.8
Ceramic Capacitor (Appendix B)
13
Figure 2.9
Size inch
(mm)
0402 (1005)
0603 (1608)
Dimension of MLCC (Appendix B)
L (mm)
W(mm)
T(mm)
1±0.05
0.5±0.05
0.5±0.05
1.6±0.1
0.8±0.1
0.8±0.07
1.6+0.15/-0.1
0.8+0.15/-0.1
0.8+0.15/-0.1
Table 2.2
MB (mm)
0.25+0.05/0.1
0.4±0.15
Dimension of MLCC
This MLCC consists of high capacitance and low ESR performance at high
frequency. Its quality improvement of telephone calls for low power loss and better
performance. In application of MLCC, it can use in mobile telecommunication for
examples mobile phone and WLAN. Other than that is also use as RF module and
power amplifier. It also can act as a tuner. Figure 2.11 and 2.12 show the electrical
characteristic of MLCC capacitor.
14
Minimum
Typical
Figure 2.10
Q factor specification vs. Specific frequency for 0402
Minimum
Typical
Figure 2.11: Q factor specification vs. Specific frequency for 0603
15
CHAPTER 3
METHODOLOGY
3.1
Work flow of project
Before this project being started, the problem statement had been carefully
studied and identify. We found that there is a need in helping the human being by
developing a charging system which can transmit and receive energy wirelessly by
using pairs of microstrip antenna as transmitter and receiver purpose. This is the
summarize for the project. First, we design a wireless charging device for certain
range using microstrip antenna as transmitter and receiver. Second, we have to built
up a wireless transfer system via microstrip antenna by receive frequency resonance.
Third step is to study several parameters that use to contribute the system
performance of wireless energy transfer system. After that we have to improve the
system in order to charge the electronic device. Last but not least we try to improve
the system in order to charge the electronic device.
Basically this project started by planning on the project development flow
and do the literature review on the previous works which have done by the other
researchers from this related field. The planning of the project is to make sure that
the project can be completed or finished on time and it also can act as a guideline in
the working schedule for the project. Other reason is that having a good planning
can help us increase our work to a maximum level in shortest time. By studying the
16
literature reviews, we can gather the information from the previous works which
done by several researchers so that the mistake can be minimize, and the same
mistake will not repeat again. It also helps in reduce the time works on getting the
certain standards as well as makes me more understand about the overall of my
ongoing project.
Then, the next project phase involves the tools learning which is needed in
this project for example: AWR Design Environment, Auto CAD 2009, Proteus
Professional and Eagle Layout Editor. Basically in this stage, the project has to
divide into 2 parts which is the antenna and charge pump. This 2 software AWR
Design Environment and Auto CAD 2009 are needed during the early stage of
antenna design and simulation result.
The other 2 software which is Proteus
Professional and Eagle Layout Editor which are used to design charge pump and the
simulation result including fabrication of charge pump.
The next steps would be prototype building and system testing.
After
undergoes the software simulation, then we can go to the prototype building in order
to justify the software simulation is correct. In this stage, the data sheet reading is
very important, because the component using in this project is tiny size and special
for RF use specification. Misuse of different specification component might make
the error occur.
After finish prototype building and system testing, then we have go to another
stage which is fine and tuning. This process helps to improve the prototype of the
project and make it more applicable and accurate.
Finally, the system was performed by using the set of data collected to create
the database which can be use in discussion and conclusion. After that, another set of
data was used to test the system performance. The result was verified so that can get
the percentage of gain of the system. The summary of the project workflow was
shown in Figure 3.1.
17
Figure 3.1
3.2
Workflow of the project.
System Overview
This is a wireless charging system using microstrip antenna as transmitter and
receiver. Generally, is consist of pairs of microstrip antenna as transmitter and
receiver, signal generator , power amplifier, DC converting circuit and output which
are going to charge the electronic device.
In this project, the system is divides into two major parts, which transmitter
and the receiver. The transmitter consists of signal generator which can generate
resonance frequency energy then pass through a power amplifier to maximize the
energy to transmitter before it transmits. This energy is then receive by the another
part of the system which is the receiver to be rectify in order to charge the electronic
device. The receiver consist of microstrip antenna receiver and a DC converting
circuit which the antenna have the same resonance frequency with transmitter
antenna and the dc converting circuit is use to rectify the energy receive. Figure 3.2
shows the overview of the project.
18
Figure 3.2
3.3
Overview of project
System Developing Process
The system development process consists of two parts, which are the antenna
part as well as the DC converting circuit or voltage multiplier. During the antenna
part, it will provide the software system simulation and fabrication process of
microstrip antenna. Then the fabricated antenna will have to calibrate so that the
comparison within the actual result and the simulation result using software can be
versify. Figure 3.3 show the summary of antenna design.
19
Figure 3.3
Summary of antenna design
The second part is the DC converting circuit which also can name as voltage
multiplier.
In this stage, Proteus 7 Professional is used to undergo software
simulation. After the simulation, then the model of the specific component for
example diode and capacitor have to be study and purchase. The Eagle Layout
Editor then is used to fabricate the DC converting circuit is printed circuit board.
After the printed and etching process is done then can move to the next step which is
soldering process. In this soldering process must be very careful, this is because the
component suitable use in the project is tiny size, so the instrument used to soldering
the component is hot air station. It is a special tool use in soldering surface-mount
device. When all the process is done then the final result can be recorded and
discussion can be done.
20
3.3.1
Antenna Design
In this project, antenna design is very important, because the antenna is use in
transmitting and receiving the energy. In order to design an antenna which can
resonance in the desire frequency, software simulation play an important role. AWR
Design Environment is chosen to be the design platform for the microstrip antenna
for this project. The AWR Design Environment (AWRDE) suite consists of three
powerful tools that can be group together to create an integrated system and RF or
analog design environment: Visual System SimulatorTM (VSS), Microwave Office®
(MWO), and Analog Office® (AO) software.
These powerful tools are fully
integrated in the AWR Design Environment suite and allow you to incorporate
circuit designs into system designs without leaving the AWR Design Environment.
Figure 3.4 show the main window display from AWR Design Environment.
Before we go into the software part, we have to design the resonance
frequency of the microstrip antenna which is going to be use in the project.
Frequency 1.9GHz and 2.45 GHz are chosen to be the suitable resonance frequency
which can be use in the project. 1.9 GHz and 2.45GHz is both the communication
use resonance frequency. After the frequency had been decide then now can ready to
design the antenna in the AWR Design Environment.
21
Title bar
Menu bar
Toolbar
Project
Browser
System diagrams
Circuit schematics
Workplace
Tabs
Status
Window
Figure 3.4
Main window in AWR Design Environment(Appendix D)
One of the advantages of AWR Design Environment is this software consist
of TXLINE calculator. This calculator can help you calculate the length and width
of the microstrip antenna transmission line (not the entire antenna size) according to
the resonance frequency. This calculator is just can use as reference so that you do
not need to try and error and waste time to start from zero. Just have to fill in the
detail of the design of antenna for example the desire frequency resonance and the
thickness of the antenna substrate. After you get the reference length and width then
just go to the tuning stage for your antenna. In this stage you have to adjust the
length and width until you get the best frequency response for the antenna in the
decided frequency resonance. Figure 3.5 show the TXLINE calculator.
22
Figure 3.5
TXLINE calculator
After using the calculator to calculate the reference microstrip antenna
transmission line then we can go to design the size of the antenna. Difference sizes
of microstrip antenna consist of different resonance frequency. When the sizes of the
antenna do not feed with the transmission line, leakage of the energy might be occurs.
This will affect the final value of the result. Once you finish your result you can
simulate and see the frequency response of the antenna. Repeat the steps until the
antenna get the desire resonance frequency in the maximize frequency response.
Figure 3.6 show the design of the microstrip antenna which design using AWR
Design Environment. Figure 3.7 show the correct frequency response graph for the
microstrip antenna.
23
Figure 3.6
Design Microstrip Antenna
2400mhx
Db
Frequency (GHz)
Figure 3.7
Frequency response for microstrip antenna
After checking all the waveform and the frequency and make sure the
antenna can use in its maximum performance, then can move to next stage which is
24
fabrication of micrstrip antenna. Before going to the fabrication laboratory, another
step is needed which is drawing the correct size of microstrip antenna using the Auto
CAD. This step is very important because the fabrication of microstrip antenna will
be base on the Auto CAD design exactly. The design in Auto CAD will then printed
in a transparency paper by using laser printer in order to matching with the UV
exposure machine. This UV exposure method usually use in fabrication of antenna
due to the sensitivity of the antenna so the normal ironing or laminated on PCB will
easily expand the copper in the PCB. The expanded part of the copper will cause the
difference between the simulation part which done before so it will gradually affect
the performance of the antenna. After the UV exposure process then can move to
etching process. Figure 3.8 show the UV exposure machine which using during the
fabrication of microstrip antenna.
Figure 3.8
UV exposure machine
When all the process is finish then the microstrip antenna can be said is
fabricated successfully. Figure 3.9 show the microstrip antenna which is fabricated
and being tested using network analyzer. Network analyzer is use to calibrate the
correct frequency resonance which at the maximize resonance frequency for the
25
antenna.
Every antenna which successfully fabricated must be tested using the
network analyzer in order to verify the performance of the antenna. Figure 3.10
show the network analyzer which can perform from 30kHz up to 20GHz.
Figure 3.9
Microstrip antenna resonance frequency 1.94GHz and 2.5 GHz
26
Figure 3.10
3.3.2
Network Analyzer
Charge Pump
A charge pump is a circuit that when an input in AC is applied, the receiver is
able to output a DC voltage which larger than a simple rectifier would generate. It
can be thought of as an AC to DC converter that can rectifies the AC signal and
magnify the DC level. The more complex of the design of the charge pump is, the
larger power does the charge pump consume. In that case, it is necessary to design a
simple charge pump circuit for this project.
In this project, the circuit design of the charge pump is decided to use Proteus
7 Professional. Its demonstration is intended for prospective customers who wish to
evaluate professional level products. It is much more differs from Proteus Lite in
that it does not allow you to save, print or design your own microcontroller based
designs but does include all features offered by the professional system including
netlist based PCB design with auto-placement, auto-routing and graph based
simulation. The Proteus Design Suite combines schematic capture, SPICE circuit
simulation, and PCB design to make a complete electronics design system. Figure
27
3.11 show the circuit which name voltage multiplier that use in this project was
designed using Proteus 7 Professional.
Figure 3.11
Voltage multiplier design using Proteus 7 Professional
This simple circuit consists of 2 stages also name as voltage doubler. By
increasing the stage number for the voltage multiplier, there will have the increment
for the output DC voltage. In order to make the circuit simple and small, surface
mount component is chosen. In that case, the printed circuit boards (PCB) design
need to be very small to fit with the SMD component use. Another reason for
choosing SMD component is due to most of component use for application in radio
frequency is SMD component. Due to the tiny size of the SMD components, the
components are rather difficult to handle and solder in the circuit. Also, the pads to
which the components attached are very small, and they do not have enough solder to
allow them to be removed and replaced again and again. Plus, when the components
are constantly being soldered, unsoldered and resoldered, the conductive solder
covering on the board loses its solder, it will became difficult to soldered in PCB. It
also might spoil the component by repeating solder and unsoldered the components.
Therefore, software simulation plays an important role to protect and save time for
28
doing the try and error during soldering process. This is why Proteus 7 Professional
is chosen in this project.
Another simulation was done using Multisim to verify the voltage multiplier
is applicable into this project. Multisim as a part of the Circuit Design Suite
combines the intuitive environment with NI Ultiboard layout. This integrated tool
can use in simulate and analyze circuits for homework and pre-lab assignments,
explore breadboard in 3D and last but not least to create PCB for design projects.
Figure 3.12 show the 7 stages of voltage multiplier which is design using Multisim.
Every stage of voltage multiplier consists of 2 diodes and 2 capacitors.
Figure 3.12
7 stages Voltage multiplier
When the design of the charge pump was decided, next step is to put the
design into PCB. Eagle Layout Editor is suitable use in this step before fabricate the
circuit into PCB. Figure 3.13 show the drawing used to print in the glossy paper in
order to print the circuit into the PCB. Total 6 stages of voltage multiplier is use in
this project. After some testing using the Proteus 7 Professional and Multisim, this
design of voltage multiplier is most effective to be used.
29
Figure 3.13
3.3.3
PCB Drawing using Eagle Layout Editor
Soldering Process
As mention before, most of the component used in this project is SMD
component which is very small in size. Therefore the soldering process is difficult.
In order to soldering the SMD correctly without failure, some tools and step we have
to follow. One of the advantages in doing this project is to soldering the SMD
component. This is because usually the component we solder in laboratory is the
normal size electronic component which using soldering iron. But in this case, the
soldering iron is not suitable due to the tiny size of the components. Several tools
such as tweezers, dental picks, liquid flux, flux pen and hot air station are needed in
this soldering process. Liquid flux is the key of soldering SMD component. Flux
removes oxides from metal that prevent solder from bonding to it, and also helps to
distribute heat. Flux also help in fixing the SMD component which you want to
solder due to the sticky property of flux. Sometime the magnifying glass is needed is
you cannot see the component clearly. By holding the component, we recommend
you to use dental picks. This is because the component is small in size and if use
bare hands to handle it may lose the component easily. That will cause a lot of waste.
Dental picks can help you hold the small component firmly.
Finally is the step to solder the component. Hot air station is use to solder the
SMD component. It can be adjust in its temperature for heating the component with
the suitable temperature. Sometimes, the pre-heater is needed to use in soldering
SMD component. Pre-heater is use to heat the component before it being solder
using hot air station for the pre-heating process, it help to speed up the soldering
30
process.
This is because some of the component might not sustain the high
temperature from hot air station and the soldering process must be fast enough or
else the component will be destroyed due to expose to a high temperature over long
period of time. Figure 3.14 and 3.15 shows the model of hot air station and preheater which use in the soldering process.
Figure 3.14
Hot Air Station
31
Figure 3.15
Pre-Heater
When all the process for example etching, drilling and soldering process were
done in the PCB, the prototype design of the charge pump can said is done. The
fabricated charge pump can be undergoes testing and tuning process. Figure 3.16
shows the charge pump which is fabricated successfully.
32
Figure 3.16
3.3.4
Charge pump
Measurement
Other then the fabrication process, another factor we have to concern is the
method of measurement. In this project, the scope is set the distance between the
microstrip antenna transmitter and receiver distance up to 25cm. So, a set of reading
was recorded start from 3cm up to 30cm. The reading is taken repeatedly up to few
times in order to get the average reading of the output. This is because the high
frequency transmission might being affected by noise and other outside frequency
disturbance.
In order to carry out the measurement Vaunix and Mini-Circuit USB Power
Meter were used in this project. Test signals at RF and microwave frequencies
usually need to measure for many times in order to get the more accurate reading.
Luckily, Vaunix Technology Corporation has an idea that rivals the traditionally
large and expensive RF/microwave electronic test equipment. These portable Lab
Bricks are convenience to be use at home in the field as they are in the laboratory or
production line. And all they need is just a laptop with USB interface to become and
controller for the lab bricks signal generator and the handy graphical-user-interface
(GUI) software supplied with each instrument. This Vaunix Lab Bricks can generate
from 1.6GHz up to 20GHz and the generate power in 10mW. The signal generator
33
consist of a SMA connector which can be feed with the connection of microstrip
antenna which using the same SMA connector. Figure 3.17 show the step which
how the measurement and the result are being recorded.
Figure 3.17
Measurement using Lab Bricks and Power Meter
From figure 3.17, the left hand side is the lab bricks signal generator and the
right hand side is the mini-circuit power meter which use to measure how much
energy the receiver antenna can receive from then transmitter antenna. Total or 2 set
of reading were taken which the resonance frequency is set to 1.94 GHz and 2.5GHz.
The power meter was increasing in distance in order to get the different results which
receive by the receiver antenna. Every resonance frequencies were taken 2 times in
order to get the average to increase the accuracy of the result. Figure 3.18 shows
how the readings were recorded in the mini-circuit USB power meter which connect
with the receiver antenna and the laptop.
34
Figure 3.18
USB Power Meter
35
CHAPTER 4
RESULT AND DISCUSSION
4.1
Result Overview
In this chapter, the result is divided into 2 parts which is the result simulation
from the microstrip antenna pairs and the energy being transfer and energy receive.
In chapter 3 we had mention about the fabrication of the microstrip antenna
transmitter and the receiver. In this chapter we are going to explain more detail by
comparison between the actual result and the simulation result both microstrip
transmitter and receiver antenna pairs. The size and the frequency response in
microstrip antenna will be further discusses in this chapter.
Another set of result which mention in chapter 3 measurement also include in
this chapter.
We will look into the result which follow the correct method
measurement and further to discuss about it. 2 set of reading is taken from different
resonance frequency which is 1.94GHz and 2.5GHz. Every set of reading were
taken 2 times in order to get the average reading for the result.
36
4.2 Overall Result
This topic will discuss about the overall result which get from the experiment.
Basically it divided in to 2 parts which is size of antenna and frequency of antennas.
We do comparison within the size and frequency of microstrip antennas.
4.2.1 Antenna
As mention before, the antenna used in the experiment is microstrip antenna.
So the size of antenna and the frequency of antenna already been investigate for
further discuss in this section.
4.2.1.1 Size Of Antenna
Different size of antenna consists of different resonance frequency. Figure
4.1 show the comparison between the antennas consists of lower resonance
frequency (1.94GHz) and the higher frequency (2.5GHz).
Figure 4.1: Comparison between 2 Antennas
37
From the figure 4.1 we can see that the comparison within the size from 2
different resonance frequency of microstrip antennas. The size for the microstrip
antenna which consists of resonance frequency equal to 1.95GHz is larger then
microstrip antenna which consists of resonance frequency equal to 2.5GHz. By
increasing the size of microstrip antenna can lower down the resonance frequency of
microstrip antenna. In order to get the best resonance frequency for the microstrip
antenna, we can do more simulation by using AWR Design Environment software.
4.2.1.2 Frequency Response Of Antenna
In this sub topic we more interested to understand the different between the
actual measurement and the software simulation. After the fabrication process of
microstrip antenna, we must calibrate the microstrip antenna in order to know that
the actual simulation is same with the software simulation. This is because the
fabrication is not 100 percent same with the software simulation result due to some
error and uncertainty occur. The actual measurement for the microstrip antenna was
calibrated using a network analyzer. The software simulation is base on the AWR
Design Environment.
Figure 4.2 shows the comparison between the actual
measurement of the performance of microstrip antenna and the software simulation.
38
Figure 4.2: Comparison between actual and Software simulation for 1.94GHz
From both of the graphs we can found out that both simulation and actual
frequency response of antenna is correct. This is because both frequency response
graphs had passed the -10dB. An antenna will get a better frequency response if it
passes through -10dB in its frequency response graph. The deeper it goes, the better
the performance of the antenna. From the figure 4.2 we can compare the range of
resonance frequency and the best resonance frequency in 1.95GHz microstrip
antenna. Table 4.1 shows the comparison of frequency within the network analyzer
and AWR design environment.
The range resonance frequency and the best
resonance frequency are selected to be compared.
Range of resonance
Network Analyzer
AWR Design Environment
1.92-1.96GHz
1.85-1.91GHz
frequency
Best resonance frequency
Table 4.1
1.95GHz
1.9GHz
Comparison Within Network Analyzer And AWR Design Environment
For 1.94GHz
39
Figure 4.3: Comparison between actual and Software simulation for 2.5GHz
From both of the graphs we can found out that both simulation and actual
frequency response of antenna is correct. This is because both frequency response
graphs have pass the -10dB. An antenna will get a better frequency response if it
passes through -10dB in its frequency response graph. The deeper it goes, the better
the performance of the antenna. From the figure 4.3 we can compare the range of
resonance frequency and the best resonance frequency in 2.5GHz microstrip antenna.
Range of resonance
Network Analyzer
AWR Design Environment
2.48-2.53GHz
2.40-2.45GHz
frequency
Best resonance frequency
Table 4.2
2.51GHz
2.44GHz
Comparison Within Network Analyzer And AWR Design Environment
for 2.5GHz
40
4.2.2
Power Receive
In this sub topic we will discuss about the power receive with the increment
of distance. The fix variable is the frequency resonance set at 1.94GHz and 2.5GHz
and the power source is set as 10mW. Table 4.1 and 4.2 shows the result which
measure using mini-cirsuit USB power meter. The measurement is repeated twice to
get average result. The measurement is carry out from 3 centimeter up to 30
centimeter. Total of 2 sets reading is being measure repeatedly in order to get the
average of the reading. This is to make sure the accuracy of the reading which is
being recorded.
41
Frequency =2.5GHz
Range (cm)
1st (mW)
2nd (mW)
Average(mW)
3
1.042
1.081
1.062
4
0.625
0.692
0.659
5
0.420
0.474
0.447
6
0.294
0.338
0.316
7
0.219
0.251
0.235
8
0.159
0.185
0.172
9
0.114
0.132
0.123
10
0.085
0.107
0.096
11
0.066
0.080
0.073
12
0.051
0.062
0.057
13
0.041
0.054
0.048
14
0.033
0.043
0.038
15
0.026
0.036
0.031
16
0.019
0.028
0.024
17
0.015
0.022
0.019
18
0.012
0.019
0.016
19
0.01
0.015
0.013
20
0.008
0.013
0.011
21
0.007
0.011
0.009
22
0.006
0.010
0.008
23
0.006
0.009
0.008
24
0.005
0.009
0.007
25
0.005
0.008
0.007
26
0.005
0.006
0.006
27
0.005
0.005
0.005
28
0.005
0.005
0.005
29
0.005
0.005
0.005
30
0.005
0.005
0.005
Table 4.3
Resonance Frequency =2.5GHz
42
Frequency =1.94GHz
Range (cm)
1st (mW)
2nd (mW)
Average(mW)
3
0.942
0.957
0.950
4
0.703
0.698
0.701
5
0.504
0.502
0.503
6
0.352
0.378
0.365
7
0.268
0.279
0.274
8
0.212
0.213
0.213
9
0.164
0.166
0.165
10
0.131
0.131
0.131
11
0.105
0.106
0.106
12
0.086
0.086
0.086
13
0.070
0.071
0.071
14
0.059
0.059
0.059
15
0.047
0.046
0.047
16
0.033
0.035
0.034
17
0.025
0.026
0.026
18
0.020
0.019
0.020
19
0.016
0.016
0.016
20
0.013
0.013
0.013
21
0.012
0.012
0.012
22
0.011
0.011
0.011
23
0.010
0.010
0.010
24
0.009
0.009
0.009
25
0.008
0.008
0.008
26
0.007
0.007
0.007
27
0.006
0.006
0.006
28
0.005
0.005
0.005
29
0.005
0.005
0.005
30
0.005
0.005
0.005
Table 4.4
Resonance Frequency =1.94GHz
43
From the result we get from both 2.5GHz and 1.94GHz, graph power versus
distance was plotted in order to show different between this 2 different frequencies
against distance. Figure 4.3 shows the power versus distance graph between 2
different frequencies (1.94GHz and 2.5GHz).
Power (mW)
Distance (cm)
Figure 4.4
Comparison between 2 different frequencies (1.94GHz and 2.5GHz)
From all table 4.1 and 4.2 and the figure 4.3, we can clearly seen that with the
increment in the distance, the power receive by the microstrip antenna is gradually
decrease. For the microstrip antenna receiver resonance frequency equal to 2.5GHz
will receive a constant value after 27cm and microstrip antenna receiver resonance
frequency equal to 1.94GHz will receive a constant value after 26cm which equal to
0.005mW. This is due to noise disturbance and other affection frequency such as
wifi frequency. From the figure 4.3 we can seen that the resonance frequency
1.94GHz can carry higher power compare with resonance frequency 2.5GHz over a
long distance.
From the distance start from 5cm to 15cm, 1.95GHz resonance
frequency carries higher power then 2.5GHz resonance frequency. In fact, the signal
will diffract. If the power meter moved with the path which the signal travel, then the
energy receiver will be higher.
44
CHAPTER 5
CONCLUSION, PROBLEMS AND RECOMMENDATION
5.1
Conclusion
The project did provide the fundamental idea on implementing the wireless
power transfer charging system by using microstrip antenna as transmitter and
receiver. The performance of this system was measured and being discuss in chapter
4.
As mentioned in the introduction, the purpose of doing this project is trying
to apply the science and technology that we learn in lecture to be use for the benefit
of mankind, which by applying the wireless energy transfer theory into daily life. As
discussed in the previous chapter on the obtained result, we can say that the
efficiency of microstrip antenna as transmitter and receiver does not performed very
well in wireless energy transfer. It is only able to achieve a low gain of power
receiving which lower than 1%. Some of the reasons that can affect this wireless
energy transfer for example noise and other frequency source might highly affect the
performance of this microstrip antenna pair.
However, by studying from this project some conclusion can we come out
base on the objective which is lower the resonance frequency of microstrip antenna
larger the size of microstrip antenna and vice versa. Therefore, we can always
design an microstrip antenna with desired resonance frequency base on the size of
microstrip antenna. The characteristic of microstrip antenna has been study, antenna
45
resonance frequency 1.94GHz and 2.5GHz were chosen. In order to achieve a longer
distance for this wireless energy transfer system, a lower resonance frequency
1.94GHz had been chosen duo to its longer wave length and make it penetrate to
longer distance. If further study about the path it travels, we can get more efficiency
power gain from the system. Lower resonance frequency, 1.94GHz can travel longer
distance compare to higher resonance frequency, 2.5GHz.
In fact this is the technology that can highly recommend to human being. By
applying this wireless energy transfer theory in future, there will be no troublesome
of limit with the length of wire anymore.
.
5.2
Problems
From this project, I had learnt that energy transfer without any wire can be
easily affected by noise. Wires usually act as a medium to transfer signal or energy.
In this project, I using the microstrip antenna pair as the transmitted medium and
does not using any wires.
In chapter 4, I had discussed in the result that I get from the experiment.
When the distance was increased the power receive decreased and up to certain
distance will get a constant value. This is due to the effect of noise. In fact there will
be no constant value and will keep decrease in the power receive with the increase in
distance between transmitter and receiver. Other then noises, the power gain from
the microstrip antenna is low. The power receive by the microstrip antenna is very
low which is less than 1% of efficiency. The power input from the Lab Bricks singal
generator is also low.
Another serious problem which affected this wireless energy transfer
charging system is charge pump design without considered the impedance matching.
This charge pump is design using Proteus 7 Professional and Eagle Layout Editor to
implement in PCB. Due to difference impedance between charge pump and the
microstrip antenna, the energy loss easily into the environment and make the
46
measurement cannot be carry on. Therefore no voltage that can stored in the store
capacitor due to the losses of energy to the environment.
5.3
Recommendation
In order to get a more accurate reading or output from this experiment, we
should carry out the measurement process in a special room which is free from noise
and other source frequency that will affect the whole system. Special chamber can
help in deflecting the disturbance sources are recommended during measurement of
the wireless energy transfer. And last but not least, before fabricate any charge pump
or DC converting circuit in this project, can calculate and design the impedance of
the charge pump so that it is same or less impedance then the antenna pair. This will
reduce the energy loss during the wireless energy transfer. Other suggestion is about
the charge pump design. We can design a smaller charge pump which can be
implant inside the electronic devices such as handphone, iPod and laptop so that this
charge pump will not become another problem that make the user forget to bring this
charge pump to anywhere.
47
References
A.Rosen, M. A. Stuchly, and A. V. Vorst, “Applications of RF/microwaves in
medicine,” IEEE Trans. Microwave Theory Tech., vol. 50, pp. 963−974 , Mar. 2002.
Chang, S. H., W. J. Liao, et al. (2010). "A Franklin Array Antenna for Wireless
Charging Applications." Piers 2010 Xi'an: Progress in Electromagnetics Research
Symposium Proceedings, Vols 1 and 2: 279-283.
Chean Khan Goh, Xianming Qing, Zhi Ning Chen, and Terence Shie Ping See.
“Effect of Wireless Charging Antennas on Transmission of an Antenna Pair through
Human Body.” 2012 IEEE Asia-Pacific Conference on Antennas and Propagation,
August 27-29, 2012, Singapore
David Castelvecchi. Wireless energy may power electronics. MIT Tech Talk, 51(9),
November 2006. (Dec. 08).
Daniel W. Harrist , BS, University of Pittsburgh, 2001. “WIRELESS BATTERY
CHARGING SYSTEM USING RADIO FREQUENCY ENERGY HARVESTING.“
D. V. Gretskih, A. V. Gomozov, V. M. Shokalo, and Sh. F. A. Al-Sammarraie et al.
(2011). “ANTENNA-RECTIFIER FOR POWER SUPPLY SUBSYSTEM OF
LOW-SMALL SPACECRAFT D.” 2011 VIII International Conference on Antenna
Theory and Techniques, September 20-23, Kyiv, Ukraine pp. 315-317
Heikkinen, J. and M. Kivikoski (2001). "Performance and efficiency of planar
rectennas for short-range wireless power transfer at 2.45 GHz." Microwave and
Optical Technology Letters 31(2): 86-91.
48
J. J. Casanova, Z. N. Low, J. Lin, and R. Tseng, “Transmitting coil achieving
uniform magnetic field distribution for planar wireless power transfer system,”
Proceedings of the 4th international conference on Radio and wireless symposium,
2009, San Diego, CA, USA.
Li, X. H., H. R. Zhang, et al. (2012). "A Wireless Magnetic Resonance Energy
Transfer System for Micro Implantable Medical Sensors." Sensors 12(8): 1029210308.
Lin, J. S. (2011). "Wireless Energy Transfer and Conversion." IEEE Microwave
Magazine 12(5): 126-139.
M. F. Salbani, and M. A. Abdul Halim, et al. (2011). “Development of Helical
Antenna Prototype for Wireless Power Transmission.” 2011 IEEE International
Conference on Control System.
Mohd Suzaini Bin Mohd Hamdan. “Design, Simulate and Construct 15kv Cockcroftwallton Volatge Multiplier” University Technical Malaysia, Melaka. (May 2008)
M. Z. Azad and M. Ali, “A miniature implanted inverted-F antenna for GPS
application,” IEEE Trans. Antennas Propag., vol. 57, pp. 1854−1858, June 2009.
Peng, L., O. Breinbjerg, et al. (2010). "Wireless Energy Transfer through NonResonant Magnetic Coupling." Journal of Electromagnetic Waves and Applications
24(11-12): 1587-1598.
Peng, L., J. Y. Wang, et al. (2011). "Performance Analysis and Experimental
Verification of Mid-Range Wireless Energy Transfer through Non-Resonant
Magnetic Coupling." Journal of Electromagnetic Waves and Applications 25(5-6):
845-855.
49
P. Li and R. Bashirullah, "A wireless power interface for rechargeable battery
operated medical implants," IEEE Trans. Circuits Syst. II, Exp. Briefs, vol. 54, no.
10, pp. 912−916, Oct. 2007.
Prof. Dr.-Ing. Albert Heuberger. (2013) “WIRELESS ENERGY TRANSMISSION
SYSTEM” RAUNHOFER institute for integrated circuits iis
Sim, Z. W., R. Shuttleworth, et al. (2010). "Compact Patch Antenna Design for
Outdoor Rf Energy Harvesting in Wireless Sensor Networks." Progress in
Electromagnetics Research-Pier 105: 273-294.
S. Suzuki, T. Katane, H. Saotome, and O. Saito, “Electric powergenerating system
using magnetic coupling for deeply implanted medical electronic devices,” IEEE
Trans. Magn., vol. 38, no. 5, pp. 3006−3008, 2002.
Vazifehdan, J., R. V. Prasad, et al. (2012). "An Analytical Energy Consumption
Model for Packet Transfer over Wireless Links." IEEE Communications Letters
16(1): 30-33.
Wang, J. H., S. L. Ho, et al. (2011). "Finite-Element Analysis and Corresponding
Experiments of Resonant Energy Transfer for Wireless Transmission Devices." IEEE
Transactions on Magnetics 47(5): 1074-1077.
Watfa, M. K., H. AlHassanieh, et al. (2011). "Multi-Hop Wireless Energy Transfer in
WSNs." IEEE Communications Letters 15(12): 1275-1277.
Yu, X. F., S. Sandhu, et al. (2011). "Wireless energy transfer with the presence of
metallic planes." Applied Physics Letters 99(21).
50
Appendix A
Gantt chart of the project schedule for Semester 1
Gantt chart of the project schedule for Semester 2
51
Appendix B
Multilayer Ceramic Capacitors
MLCC
consists
of
a
conducting
material
and
electrodes.
To
manufacture a chip-type SMT and achieve miniaturization, high density and high
efficiency, ceramic condensers are used. WTC HH series MLCC is used at high
frequencies generally have a small temperature coefficient of capacitance, typical
within the ±30ppm/°C required for NP0 (C0G) classification and have excellent
conductivity internal electrode. Thus, WTC HH series MLCC will be with the
feature of low ESR and high Q characteristics.
Features:
•
High Q and low ESR performance at high frequency
•
Quality improvement of telephone calls for low power loss and better
performance
52
Applications:
•
Mobile telecommunication: Mobile phone, WLAN
•
RF module: Power amplifier, VCO
•
Tuners
Size
Inch (mm)
L
(mm)
W
(mm)
0402 (1005)
1±0.05
0.5±0.05
0.5±0.05
N
1.6±0.1
0.8±0.1
0.8±0.07
S
1.6
+0.15/-0.1
0.8
+0.15/-0.1
0.8
+0.15/-0.1
X
0603 (1608)
T
(mm)/Symbol
Remark
MB
(mm)
#
0.25
+0.05/-0.1
0.4±0.15
General Electrical Data:
Diel
Size
ectri
Capacitance*
c
N
0402, 0603
P
0402: 0.5pF to 470pF** & 0603: 0.5pF to 3300pF
Cap≤5pF: B (±0.1pF), C (±0.25pF)0
Capacitance tolerance 5pF<Cap<
Rated voltage
16V,
10pF:25V,
C 50V, 100V, 200V, 250V, 500V, 630V
Q*
Cap<30pF: Q≥400+20C; Cap≥30pF: Q≥1,000
(WVDC)
0.25pF),
Insulation resistance (±
≥10GΩ
or R×C≥100Ω-F whichever is smaller
Operating
-55°
C
to
+125°C
D (±0.5pF)
at Ur
Capacitance change ±30ppm/°C
temperature
Cap≥10pF:
Termination
Ni/Sn (lead-free termination)
F (±1%), G
(±2%), J
(±5%)
53
Capacitance Range
Capacitance
DIELECTRI
SIZ
C
Rated
E
0.5pF
Voltage
0.6pF
(0R5)
0.7pF
(0R6)
0.8pF
(0R7)
0.9pF
(0R8)
1.0pF
(0R9)
1.2pF
(1R0)
1.5pF
(1R2)
1.8pF
(1R5)
2.2pF
(1R8)
2.7pF
(2R2)
3.3pF
(2R7)
3.9pF
(3R3)
4.7pF
(3R9)
5.6pF
(4R7)
6.8pF
(5R6)
8.2pF
(6R8)
10pF (100)
(8R2)
12pF (120)
15pF (150)
18pF (180)
22pF (220)
27pF (270)
33pF (330)
39pF (390)
47pF (470)
56pF (560)
68pF (680)
82pF (820)
100pF
120pF
(101)
150pF
(121)
180pF
(151)
220pF
(181)
270pF
(221)
330pF
(271)
390pF
(331)
470pF
(391)
560pF
(471)
680pF
(561)
820pF
(681)
1,000pF
(821)
(102)
NP
16
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
040
25
2
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
50
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N^
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
0
16
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
060
25 50
3
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S^ S^
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
S S
100
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S^
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
54
1,200pF
1,500pF
(122)
1,800pF
(152)
2,200pF
(182)
2,700pF
(222)
3,300pF
(272)
(332)
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Packaging Dimension And Quantity:
Size
7" reel
Thickness
(mm)/Symbol
0402
0.5±0.05
0.8±
0.8+0.15/-0.1
0.07
0603
Pape
13" reel
r
Tape
N
10,000
20,000
S
X
4,000
15,000
Reliability Test Conditions and Requirements:
No
Ite
Test Condition
m
1
ments
No remarkable defect
Visual and
-
Mechanical
2
Capacitance
Q/ D.F.
3
(Dissipation
Factor)
Require
Dimensions to conform to
individual
specification
sheet
Shall
not exceed
the limits
Cap≤1,000pF, 1±0.2Vrms,
given in the detailed
1MHz±10%
spec
Cap>1,000pF, 1±0.2Vrms,
NP0: Cap≥30pF,
1kHz±10% At 25°C
To
applytemperature
voltage: ( ≤100V )
ambient
Q≥1,000;
250% of rated voltage
Q≥400+20C
Duration: 1 to 5 sec
Charge and discharge current
less than 50mA
Cap<30pF,
55
To apply voltage:
200V~300V
≥2 times V DC
500V~999V
≥1.5
times
DC Cut-off,
Rated V
voltage:<200V
set
at 10mA
To apply
rated voltage for
4
5
Dielectric
Insulation
Strength
Resistance
Rated
voltage:200~630V
TEST=
sec.
max. 12015sec.
To
apply rated voltage (500V
RAMP=0
max.)
With
for 60no
sec.electrical load.
6
Temperature
Coefficient
7
Adhesive
Strength of
Vibration
Termination
8
Resistance
flash over
test
≥10GΩ
or during
R×C≥100Ω-F
whichever is smaller
Operating temperature: -55°C Capacitance change: within
±30ppm/°C
Pressurizing
to +125°C at force:
25°C
5N (≤0603) and
Vibration
frequency:
10N (>0603)
Test
10~55
Hz/min.
time: 10±
1 sec. Total
amplitude: 1.5mm
Test
time: 6hrs. (Two hrs
Solder
9
≥10ΩG
No evidence of damage or
each in three mutually
Solderability temperature:
perpendicular
directions.)
235±
5°C Dipping
No remarkable damage or
removal of the
No
remarkable damage
terminations
Cap change and Q/D.F.: To
meet initial spec.
95% min. coverage of all
metalized area
time:middle
2±0.5 part
sec.of substrate
The
shall be pressurized by means
(This capacitance change
of the pressurizing rod at a rate means
10
11
the
change
of
Bending Test of about 1 mm per second until capacitance under specified
the deflection becomes 1 mm
flexure of substrate from
and then the pressure shall be
the capacitance measured
maintained for 5±1 sec.
before the test.)
Measurement to be made after
Resistance to Solder
No remarkable damage
keeping at room temp. for
Soldering Heat
temperature:
24±2 hrs.
260±5°C Dipping
Cap change: within ±2.5% or
time: 10±1 sec
is larger
Preheating: 120 to 150°C for
Q/D.F., I.R. and dielectric
1 minute before immerse the
strength: To meet initial
capacitor in a eutectic solder
requirements
±0.25pF whichever
Measurement to be made after 25% max. leaching on each
keeping at room temp. for
24±2 hrs. (Class I) or 48±4
hrs. (Class II)
edge
56
Reliability Test Conditions and Requirements:
No
Ite
m
Temperature
12 Cycle
Humidity
(Damp
13
Heat) Steady
State
Test Condition
Req
damage
Conduct the five cycles according No remarkableuire
to the
Cap change: within
men ±2.5% or
temperatures and time
±0.25pF whichever
ts
Test temp.: 40±2°C Humidity:
Measurement to be made after
90~95% RH Test time: 500+24/keeping at room temp. for 24±2
0hrs.
hrs.
Measurement to be made after
is larger
No remarkable damage
Q/D.F., I.R. and dielectric
Cap change: within ±5.0% or
strength: To meet initial
±0.5pF whichever
requirements
is larger
keeping at room temp. for 24±2
Q/D.F. value:
hrs.
NP0: Cap≥30pF, Q≥350;
10pF≤Cap<30pF,
Q≥275+2.5C Cap<10pF;
Test temp.: 40±2°C Humidity:
Humidity (Damp 90~95%RH Test time: 500+24/-0
14
Heat) Load
hrs.
15
Q≥200+10C
No remarkable damage.
I.R.:
≥1GΩorwithin
RxC≥50Ω-F
Cap change:
±7.5% or
whichever
is smalleris larger.
±0.75pF whichever
To apply voltage: rated voltage
Q/D.F. value:
(Max. 500V)
NP0: Cap≥30pF,
Measurement to be made after
Q≥200; Cap<30pF,
keeping at room temp. for 24±2
Q≥100+10/3C
hrs. temp.:
Test
I.R.: ≥500MΩ or RxC≥25Ω-F
NP0:
No
remarkable
damage.
whichever
is smaller.
High
125±3°C
Cap change: within ±3.0% or
Temperature
To apply voltage:
±0.3pF whichever is larger.
Load
(1) <500V: 200% of rated
Q/D.F. value:
(Endurance)
voltage. (2) 500V: 150%
NP0: Cap≥30pF, Q≥350
of rated voltage. (3)
10pF≤Cap<30pF,
≥630V: 120% of rated
Q≥275+2.5C
voltage. Test time:
Cap<10pF,
1000+24/-0 hrs.
Q≥200+10C
Measurement to be made after
I.R.: ≥1GΩ or RxC≥50Ω-F
keeping at room temp. for 24±2
whichever is smaller.
hrs.
57
Constructions:
The construction of MLCC
No.
Name
1
Ceramic material
2
Inner electrode
3
4
NP0*
Inner layer
Termination
5
NP0
CaZrO3 / BaTiO3 based
AgPd alloy
Ni
Ag
Cu
Middle layer
Ni
Outer layer
Sn
Storage and handling conditions
(1) To store products at 5 to 40°C ambient temperature and 20 to 70%. related
humidity conditions.
(2) The product is recommended to be used within one year after shipment.
Check solderability in case of shelf life extension is needed.
Cautions:
a. The corrosive gas reacts on the terminal electrodes of capacitors, and
results in the poor solderability. Do not store the capacitors in the
58
ambience of corrosive gas (e.g., hydrogen sulfide, sulfur dioxide,
chlorine, ammonia gas etc.)
b. In corrosive atmosphere, solderability might be degraded, and silver
migration might occur to cause low reliability. c. Due to the dewing by
rapid humidity change, or the photochemical change of the terminal
electrode by direct
sunlight,the solderability and electrical performance may deteriorate. Do not
store capacitors under direct sunlight
or dewing condition. To store products on the shelf and avoid exposure to
moisture.
Recommended soldering conditions:
The lead-free termination MLCCs are not only to be used on SMT
against lead-free solder paste, but also suitable against lead-containing
solder paste. If the optimized solder joint is requested, increasing
soldering time, temperature and concentration of N2 within oven are
recommended.
Recommended reflow soldering profile for SMT process with SnAgCu
series solder paste.
59
Recommended wave soldering profile for SMT process with SnAgCu series solder.
60
Part Number Table
Descriptio
Capacitor, RF, 0.5PF, 50V, NP0,
n
Capacitor, RF, 0.5PF, 50V, NP0,
0402
Capacitor, RF, 0.6PF, 50V, NP0,
0402
Capacitor, RF, 0.8PF, 50V, NP0,
0402
Capacitor, RF, 10PF, 50V, NP0,
0402
Capacitor, RF, 100PF, 50V, NP0,
0402
Capacitor, RF, 1PF, 50V, NP0,
0402
Capacitor, RF, 1PF, 50V, NP0,
0402
Capacitor, RF, 1.2PF, 50V, NP0,
0402
Capacitor, RF, 1.5PF, 50V, NP0,
0402
Capacitor, RF, 1.5PF, 50V, NP0,
0402
Capacitor, RF, 1.8PF, 50V, NP0,
0402
Capacitor, RF, 1.8PF, 50V, NP0,
0402
Capacitor, RF, 2.2PF, 50V, NP0,
0402
Capacitor, RF, 2.2PF, 50V, NP0,
0402
Capacitor, RF, 2.7PF, 50V, NP0,
0402
Capacitor, RF, 3PF, 50V, NP0,
0402
Capacitor, RF, 3.9PF, 50V, NP0,
0402
Capacitor, RF, 3.9PF, 50V, NP0,
0402
Capacitor, RF, 4.7PF, 50V, NP0,
0402
Capacitor, RF, 4.7PF, 50V, NP0,
0402
Capacitor, RF, 5.1PF, 50V, NP0,
0402
Capacitor, RF, 5.6PF, 50V, NP0,
0402
Capacitor, RF, 6.8PF, 50V, NP0,
0402
Capacitor, RF, 6.8PF, 50V, NP0,
0402
Capacitor, RF, 6.8PF, 50V, NP0,
0402
Capacitor, RF, 8.2PF, 50V, NP0,
0402
Capacitor, RF, 0.75PF, 50V, NP0,
0402
Capacitor, RF, 100PF, 50V, NP0,
0402
Capacitor, RF, 1PF, 50V, NP0,
0603
Capacitor, RF, 2.2PF, 50V, NP0,
0603
Capacitor, RF, 2.7PF, 50V, NP0,
0603
Capacitor, RF, 3.3PF, 50V, NP0,
0603
0603
Part
MC000269
Number
MC000270
MC000271
MC000272
MC000273
MC000274
MC000275
MC000276
MC000277
MC000278
MC000279
MC000280
MC000281
MC000282
MC000283
MC000284
MC000285
MC000286
MC000287
MC000288
MC000289
MC000290
MC000291
MC000292
MC000293
MC000294
MC000295
MC000296
MC000297
MC000298
MC000299
MC000300
MC000301
61
Appendix C
HSMS-286x Series
Surface Mount Microwave Schottky Detector Diodes
Data Sheet
Description
Avago‟s HSMS‑286x family of DC biased detector diodes have been designed
and optimized for use from 915 MHz to 5.8 GHz. They are ideal for RF/ID and RF Tag
applications as well as large signal detection, modulation, RF to DC conversion or
voltage doubling.
Available in various package configurations, this family of detector diodes
provides low cost solutions to a wide variety of design problems. Avago‟s
manufacturing techniques assure that when two or more diodes are mounted into
a single surface mount package, they are taken from adjacent sites on the wafer,
assuring the highest possible degree of match.
Features
• Surface Mount SOT‑23/SOT‑143 Packages
• Miniature SOT‑323 and SOT‑363 Packages
• High Detection Sensitivity:
up to 50 mV/µW at 915 MHz up to 35 mV/µW at 2.45 GHz
up to 25 mV/µW at 5.80 GHz
• Low FIT (Failure in Time) Rate*
• Tape and Reel Options Available
• Unique Configurations in Surface Mount SOT‑363
62
Package
– increase flexibility
– save board space
– reduce cost
• HSMS‑286K Grounded Center Leads Provide up to 10 dB Higher Isolation
Better Thermal Conductivity for Higher Power Dissipation
• Lead‑free
*
For more information see the Surface Mount Schottky Reliability Data Sheet.
SOT-23 / SOT-143 Package Lead Code Identification (top view)
SOT-323 Package Lead Code Identification (top view)
63
SOT-363 Package Lead Code Identification (top view)
SOT-23 / SOT-143 DC Electrical Specifications, TC = +25°C, Single Diode
Notes:
1. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA.
2. ∆CT for diodes in pairs is 0.05 pF maximum at –0.5V.
SOT-323 / SOT-363 DC Electrical Specifications, TC = +25°C, Single Diode
64
Notes:
1. ∆VF for diodes in pairs is 15.0 mV maximum at 1.0 mA.
2. ∆CT for diodes in pairs is 0.05 pF maximum at –0.5V.
RF Electrical Specifications, TC = +25°C, Single Diode
Absolute Maximum Ratings, TC = +25°C, Single Diode
Note:
1. Operation in excess of any one of these conditions may result in permanent
damage to the device.
2. TC = +25°C, where TC is defined to be the temperature at the package pins
where contact is made to the circuit board.
65
Equivalent Linear Circuit Model, Diode Chip
RS = series resistance (see Table of SPICE parameters)
C j = junction capacitance (see Table of SPICE parameters)
SPICE Parameters
66
SMT Assembly
Reliable assembly of surface mount components is a complex process that
involves many material, process, and equipment factors, including: method of
heating (e.g., IR or vapor phase reflow, wave soldering,
etc.) circuit board
material, conductor thickness and pattern, type of solder alloy, and the thermal
conductivity and thermal mass of components. Components with a low mass, such
as the SOT packages, will reach solder reflow temperatures faster than those with a
greater mass.
Avago‟s diodes have been qualified to the time‑tem‑ perature profile shown
in Figure 35. This profile is repre‑ sentative of an IR reflow type of surface mount
assembly process.
After ramping
up from room temperature, the circuit board with
components attached to it (held in place with solder paste) passes through one or
more preheat zones. The preheat zones increase the temperature of the board and
components to prevent thermal shock and begin evaporating solvents from the
solder paste. The reflow zone briefly elevates the temperature suffi‑ ciently to
produce a reflow of the solder.
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The rates of change of temperature for the ramp‑up and cool‑down zones are
chosen to be low enough to not cause deformation of the board or damage to
compo‑ nents due to thermal shock. The maximum temperature in the reflow zone
(TMAX) should not exceed 260°C.
These parameters are typical for a surface mount assembly process for Avago
diodes. As a general guideline, the circuit board and components
should be
exposed only to the minimum temperatures and times necessary to achieve a
uniform reflow of solder.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package
body surface
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SMT Assembly Package Dimensions Outline (SOT-23)
Outline SOT-323 (SC-70 3 Lead)
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Outline SOT-363 (SC-60 6 Lead)
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Appendix D
AWR DESIGN ENVIRONMENT 9.04 GUIDE
The AWR®
Design Environment (AWRDE) suite comprises three
powerful tools that can be used together to create an integrated system and RF
or analog design environment: Visual System SimulatorTM (VSS), Microwave
Office® (MWO), and Analog Office® (AO) software. These powerful tools are
fully integrated in the AWR Design Environment suite and allow you to
incorporate circuit designs into system designs without leaving the AWR
Design Environment. In this course, the focus will be on Microwave Office
simulator.
Here are some guidelines to start with
the software.
1. To start the AWRDE
suite choose
Start > Programs > AWR 2010 > AWR Design Environment
The following main window displays. You can see the general appearance and
tabs of the software in this picture
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2. To create a project or open a project, choose respectively
File > New Project
File > Open Project
3. To set units, Environmental options and Simulation options
double-click “Project Options” in the “Project Browser”
in the “Frequencies” tab, determine simulation
frequency range
This frequency sweep is global, but you can specify different
sweep for each schematic, simply right-click on the specified
schematic and select options.
in the “Global Units” tab, determine the units for parameters
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in your design
This setting is applied for all of the schematics in the project.
4. To create a schematic for your circuit
right-click “Circuit Schematics” in the “Project Browser” and choose “New
Schematic”.
5. To add or edit circuit elements for use in your schematics
click the “Elements” tab in the lower left window
choose the desired element in the “Circuits Elements” and click and
drag it into the schematic window
to edit model parameters, double-click the element graphic in the
schematic window
or press Ctrl+L in schematic window and type the name of element which you want.
6. To add ports to a schematic diagram
expand the “Ports” category in the “Element Browser” and choose a suitable
one.
7. To connect element block nodes with a wire
position the cursor over a node, click at this position to mark the beginning
of the wire and slide the mouse to a location where a bend is needed. Click
again to mark the bend point.
8. To view the results of your circuit and system simulations before you perform
a simulation, you create a graph and specify the data or measurements that
you want to plot
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
right-click “Graphs” in the “Project Browser”

choose “New Graph” to display a dialog box in which to specify
a graph name and graph type

right click on the created graph and select “Add Measurement” then
choose the desired results that you want to plot.
9. To run a simulation on the active project, choose
Simulate > Analyze (or press F8)
Sometimes you need to use previously defined schematic as a subcircuit in another
schematic. In this case, the previously defined circuit appears as an N-port
device in the new schematic. In order to do this, follow these steps:
open a new schematic
right click on “Circuit Schematics” and choose “New Schematic”
click “Elements” tab in the lower left window
choose “Subcircuit” in the “Elements” browser
choose the desired schematic and drag and drop it in the schematic window
In addition to use a previously defined schematic in the new circuit, there is a
capability to define a 2-port block with desired S-parameters and use that block
in your circuit. This is particularly useful when you want to represent a particular
device in your circuit but you only want to use its port information, not to design
the whole device.
For this purpose there
are two options:
first, you can enter the S-parameters in the circuit [note that these values
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are assumed constant in the whole frequency range]
second, you can import S-parameters from a text file [this gives you the
ability to define the S-parameters for each frequency].
Here are the steps which you need to define N-port blocks:
click “Elements” tab in the lower left window
choose “Network blocks” in the “Elements” browser
to choose a 2-port network, select “S2P_BLK”, and then enter the
S-parameter information in the block
to choose an N-port S-parameter block, select NPORT_F and then import
the S-parameter information from a touchstone format text file.
More information can be found in the Help. There are also number of examples
which can be accessed using File > Open Example, which can be used to become
more familiar with the software and its capabilities.
10.
Time Domain Reflectometery
Generally, a Time Domain Reflectometer (TDR) transmits a short-rise time
pulse along the conductor. If the conductor is of a uniform impedance and
properly terminated, the entire transmitted pulse will be absorbed in the far-end
termination and no signal will be reflected toward the TDR. Any impedance
discontinuities will cause some of the incident signal to be sent back towards the
source.
AWR has the capability to emulate a TDR. You can find this application
in Graph > Measurements > Linear.
It has four options. LP options are for low-pass and BP options are for bandpass frequency ranges. I and S are impulse and step responses, respectively.
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The time duration of the TDR is inversely proportional to the frequency step of
the simulation.