Ultrafast Laser-Based Thermal Characterization of

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Ultrafast Laser-Based Thermal Characterization of

Nanoelectronic Materials

Ronggui Yang, Associate Professor

S.P. Chip and Lori Johnson Faculty Fellow

Department of Mechanical Engineering

Materials Science and Engineering Program

University of Colorado, Boulder, CO 80309

Tel: (303) 735-1003, Fax: (303) 492-3498

Email: Ronggui.Yang@Colorado.Edu

http://spot.colorado.edu/~yangr

Outline

1. Introduction to Nanoscale Heat Conduction

2. Transient Thermoreflectance Measurement of Thermal Properties in Thin Films

- Thermal Conductivity vs. Heat Capacity

- Anisotropic Thermal Conductivity: Cross-Plane vs. In-Plane

3. Measurement of Phonon Mean Free Path using Ultrafast EUV Probes

- Quasi-Ballistic Phonon Transport and Average Phonon Mean Free Path

- Collectively-Diffusive Phonon Transport and Mean Free Path Spectroscopy

Multiscale Problems in Electronic Thermal Management

Courtesy of Professor Kenneth Goodson’s interpretation of DARPA’s Thermal Management

Technologies and ICECool program led by Dr. Avi Bar-Cohen and Dr. Tom Kenny

Heat Transfer in Nano-enabled Devices

COLD SIDE

Gate

Source

Channel

Drain

HOT SIDE

MOSFET Laser Diode Energy Conversion

Characteristic Lengths of Energy Carriers

10

5

10

4

10

3

10

2

PHONON (Si)

ELECTRON (Au)

AIR MOLECULE k

=

1

3

Cv Λ carriers electrons phonons photons air molecules wavelength

10-100 nm

1 nm

0.1-10

µ m

0.01 nm

10

1

0 50 100 150 200 250 300

TEMPERATURE (K)

Λ

~ 300 nm, τ ~ 100 ps in silicon at room temperature

G. Chen, D. Borca-Tascuic and R.G. Yang, “Nanoscale Heat Transfer,” in “Encyclopedia of Nanoscience and Nanotechnology”, edited by H.S. Nalwa, Vol. 7, pp. 429-459, American Scientific Publishers, 2004

Reduced Thermal Conductivity of Nanomaterials

Silicon Thin Films

Silicon-Germanium Superlattices

K.L. Wang, UCLA

S. Pei, Houston in,BULK c,BULK

Marconnet, Asheghi, and Goodson, J. Heat Transfer, 2013 c,FILM

EXPERIMENTAL in,FILM BULK ALLOY (300K) p=0.6

p=0.5

Lines – Fitting with Chen’s Model p=0.6

120 160 200 240 280

G. Chen, Physical Review B, 1998

High Thermal Conductivity of Carbon Nano-Structures

Single Wall Carbon Nanotube (CNT)

Theory

Berber, et al, Physical Review Letters 84 4613 (2000)

Experiment

Kim, et al, Applied Physics Letters 87, 215502 (2001)

Pop et al, MRS Bulletin, 37(1273), 2012

Technological Advances: Enabling Nano-Materials

Thermal Interface Materials

Thermoelectric Materials

Courtesy of Dr.Avi Bar-Cohen from DARPA

Zhao, Dravid, and Kanatzidis, Energy and Environmental Science, Vol. 7, pp. 251-267, 2014

Theoretical and Experimental Tools

10 -10 10 -9 10 -8 10 -7 10 -6 10 -5

First

Principles Molecular

Dynamics

Boltzmann-Transport-Equationbased Simulations

10 -4 10 -3

Continuum Theory

10 -2

Transient Thermoreflectance (FDTR & TDTR) Micro-Device-Based Metrology Scanning Probe-Based Metrology

Outline

1. Introduction to Nanoscale Heat Conduction

2. Transient Thermoreflectance Measurement of Thermal Properties in Thin Films

- Thermal Conductivity vs. Heat Capacity

(K,C)=(1.35, 1.62)

- Anisotropic Thermal Conductivity: Cross-Plane vs. In-Plane

3. Measurement of Phonon Mean Free Path using Ultrafast EUV Probes

- Quasi-Ballistic Phonon Transport and Average Phonon Mean Free Path

- Collectively-Diffusive Phonon Transport and Mean Free Path Spectroscopy

Transient Thermoreflectance Method For

Thermal Properties of Nanostructured Materials

Pump film substrate

Detector

T

( ) max

R

( ) max

Probe

Sub-ps Pulse laser

Mechanical stage

Sample

Pump

Detector

Modulator

Function generator

Lock-in

Amplifier

J. Zhu, et al, Journal of Applied Physics, Vol. 108, Art # 094315, 2010.

J. Liu, et al, Review of Scientific Instruments, Vol. 84 , Art # 034902, 2013.

Time-Domain Thermoreflectance (TDTR) Signal

Pump beam intensity

12.5ns

1000ns 150fs time

Sample surface temperature

Experiment data time

Delay time t

1

Probe beam intensity

Best fit curve

(K,C)

Delay time (ns)

Thermoreflectance time time

Challenges in Practice

Heat capacity C is usually the input for extracting thermal conductivity K.

Al metal film

Differential Scanning Calorimeter (DSC) can be used for materials in bulk forms

A new material

Si substrate

Bulk form of new material might not be available

Heat capacity input limits the accuracy of thermal conductivity measurement!

Typically only cross-plane thermal properties are measured.

K r

K z

Beam spot size: 10-20 µm

Thermal diffusion length: ~100 nm- 1 µm

One-dimensional heat transfer: K z

, G

Graphite

K z

K r

AlAs

GaAs

AlAs/GaAs Superlattice

Frequency-Dependent TDTR Method for Simultaneous

Measurement of Thermal Conductivity and Heat Capacity

Thermal Penetration Depth: L

=

2 D film

ω

Modulation Frequency

L

2

L

1 Semi-infinite

Low frequency modulation

Experiment data

High frequency modulation

Low frequency: Thermal diffusivity

K

C

K

Best fit curve with (K, C) pairs

(K,C)

Delay time (ns)

High Frequency: Thermal effusivity KC

C

J. Liu, et al, Review of Scientific Instruments, Vol. 84, Art # 034902, 2013.

Validation on Thermally-Oxidized SiO

2

Thin Film

(K,C)=(1.35, 1.62)

J. Liu, et al, Review of Scientific

Instruments, Vol. 84, Art # 034902, 2013.

Atomic/Molecular Layer-Deposited (ALD/MLD)

Hybrid Organic-Inorganic Materials

Inorganic Nanolaminate (ALD W/Al

2

O

3

)

S. M. George, Chem. Rev., 110(111),2010.

Interface Density (nm -1 )

R. M. Costescu, et al, Science, 303(989),2004.

Hybrid Organic-Inorganic Crystals, Interfaces and Nanocomposites

MO

3

(L) x

Perovskite-Like Structures ALD/MLD Hybrid Multi-layer Materials metallic organic

Organic-inorganic interfaces

Dependence on backbone stiffness

Thickness-dependence

George SM, Yoon B, Dameron AA. Accounts of Chemical Research. 2009.

Zhang et al, JACS 135, p. 17401-17407, 2013

Type-A

ALD/MLD-Enabled Zincone Thin Films

Porous films

Type-B Type-C

Zincone MLD film Zincone MLD film Zincone ALD: MLD film

ZnO crystalline-like

Amorphous-like

K (Al

2

O

3

) =1.23 W/mK

G=66.25 MW/m 2 K

Liu et al, Nano Letters, Vol. 13, p. 5594, 2013

Dependence on Thickness and Composition

Type-A

Type-B

Type-C

Liu et al, Nano Letters, Vol. 13, p. 5594, 2013 11/20

Temperature-Dependent Thermal Properties

amorphous-like crystalline-like

Liu et al, Nano Letters, Vol. 13, p. 5594, 2013

Outline

1. Introduction to Nanoscale Heat Conduction

2. Transient Thermoreflectance Measurement of Thermal Properties in Thin Films

- Thermal Conductivity vs. Heat Capacity

- Anisotropic Thermal Conductivity: Cross-Plane vs. In-Plane

K z

K r

AlAs

GaAs

Graphite AlAs/GaAs Superlattice

3. Measurement of Phonon Mean Free Path using Ultrafast EUV Probes

- Quasi-Ballistic Phonon Transport and Average Phonon Mean Free Path

- Collectively-Diffusive Phonon Transport and Mean Free Path Spectroscopy

Transient Thermoreflectance for

Anisotropic Thermal Conductivity

Frequency-domain measurement

Scan through a large range of modulation frequency f (0.025

- 20 MHz) using a small beam spot R (2 - 6 um)

Photothermal method

R

R

L r L r1

L r2

L r3

L rn

Thermal diffusion length L r

= κ r

/

π

Cf

A. J. Schmidt, et al, Rev. Sci. Instru. 80(094901),2009.

Nonconcentric beams/offset spots

Scan through the sample surface

µ

)

Laser heating x

0 signal

Offset x

0

0

J. P. Feser, et al, Rev. Sci. Instru. 83(104901),2012.

Anisotropic Thermal Conductivity Measurment

- Varying the Beam Spot Sizes

R

Pump beam

Probe beam

Position of Sample Stage

Our approach

Choose one beam spot size R

1 and modulation frequency f

1

R

1

>>

=

L k r r

1

π

Cf

1

Cross-plane thermal properties K z and G

Choose many small beam spots R

2,

…, R n and modulation frequency f

2

( R n

< R

1

, f

2

< f

1

)

R n

~

=

L r 2 k r

π

Cf

2

In-plane thermal conductivity K r

Highly Ordered Pyrolytic Graphite (HOPG)

Kr

Al thin film

HOPG Kz

SPI grade II HOPG

Anisotropic Thermal Conductivity of HOPG

R = 13 - 21.3 µm

R =27.2 µm

The measured Kz and Kr (T>250K) agree well with the literature values.

The discrepancy between the measured Kr (T<250K ) and the literature values could be due to the size effect using small beam spots, similar to the observation by Gang Chen’s group for measuring phonon mean free path in silicon [

Phys. Rev. Lett., 107(095901), 2011

] .

Anisotropic Thermal Conductivity of Tungsten Thin Films

Sputtered W

Al

150 - 250 nm sputtered W

2 nm Ti

Glass substrate

Atomic layer deposited (ALD) W

Al

6 - 35 nm ALD W

2 nm alumina

Glass substrate

Outline

1. Introduction to Nanoscale Heat Conduction

2. Transient Thermoreflectance Measurement of Thermal Properties in Thin Films

- Thermal Conductivity vs. Heat Capacity

- Anisotropic Thermal Conductivity: Cross-Plane vs. In-Plane

3. Measurement of Phonon Mean Free Path using Ultrafast EUV Probes

- Quasi-Ballistic Phonon Transport and Average Phonon Mean Free Path

- Collectively-Diffusive Phonon Transport and Mean Free Path Spectroscopy

The Importance of Phonon Mean Free Paths

Kn=L/MFP = 1.0

Ge

Electrons

Mean Free Path Λ =1-50 nm

Wavelength λ =1-50 nm

1 0

5

1 0

4

Λ

λ

Phonons

=10-300 nm

=1 -5nm

P H O N O N ( S i)

E L E C T R O N ( A u )

A IR M O L E C U L E

1 0

3 k

=

1

3

Cv Λ

Si

Temperature

Kn=L/MFP= 25.0

1 0

2

1 0

1

0 5 0 1 0 0 1 5 0 2 0 0

T E M P E R A T U R E (K )

2 5 0 3 0 0

Temperature

But how to measure phonon mean free path?

Nano-Si in Ge matrix

R.G. Yang, and G. Chen, Physical Review B, Vol. 69, 195316, 2004

r

T

1

1 r

2

T

2

Quasi-Ballistic Heat Conduction

r

2

>> r

1

Diffusive Limit

Q

F

=

4k

π r

1

(

T

1

T

2

)

=

4

3

Cv

Λ π r

1

(

T

1

T

2

)

Ballistic Limit

Q

R

= π r

2

Cv ( T

1 , e

T

2

)

2

π r

2

Cv

(

T

1

T

2

)

Chen, Journal of Heat Transfer, Vol. 118, pp. 539-545, 1996

Siemens, et al, Nature Materials, Vol. 9, pp. 26-30, 2010

Probing Phonon Transport using EUV Light

p

Fused silica or

Sample:

L from 2 µm - 65 nm h=20 nm, η =L/p= 0.25

Siemens, et al, Nature Materials, Vol. 9, pp. 26-30, 2010

Observation of Quasi-Ballistic Phonon Transport

p

Signal components:

• Decay:

Heat flow from nanostructure

• Oscillation:

Surface acoustic wave propagation

Siemens, et al, Nature Materials, Vol. 9, pp. 26-30, 2010

31

Measurement of Average Phonon Mean Free Paths

Ni on Fused Silica substrate

Ni on Sapphire substrate

• Fused silica substrate:

Λ ~2 nm

• Sapphire substrate:

Λ ~120 nm

Siemens, et al, Nature Materials, Vol. 9, pp. 26-30, 2010

L

L

Λ ~

Λ ~ 2 nm

32

Outline

1. Introduction to Nanoscale Heat Conduction

2. Transient Thermoreflectance Measurement of Thermal Properties in Thin Films

- Thermal Conductivity vs. Heat Capacity

- Anisotropic Thermal Conductivity: Cross-Plane vs. In-Plane

3. Measurement of Phonon Mean Free Path using Ultrafast EUV Probes

- Quasi-Ballistic Phonon Transport and Average Phonon Mean Free Path

- Collectively-Diffusive Phonon Transport and Mean Free Path Spectroscopy

First-Principles Simulation of

Phonon Transport and Thermal Properties

Phonon Dispersion

20

Silicon example

DFT

Tersoff

Exp.

16

12

8

4

0

Γ

K X

Γ

Phonon Relaxation Time

10000

1000

TA1

TA2

LA

LO

TO1

TO2

100

10

1

0.5

1 2 4

Frequency (THz)

8 16

L

Lucas Lindsay, David Broido, Natalio Mingo, 2007-

K. Esfarjani, G. Chen, and H.T. Stokes, Phys. Rev. B, Vol. 84, # 085204, 2011.

Phonon Mean Free Path Spectroscopy inspired by our Nature Materials 2010

Gang Chen’s Group, Physical Review Letters, Vol. 107, #095901, 2011 Jonathan Malen’s Group, Nature Communications, 2013 doi:10.1038/ncomms2630

Collectively-Diffusive Phonon Transport

( /Λ) = tanh

( /Λ) = 1 − tanh

2Λ http://arxiv.org/abs/1407.0658

Ultrafast Characterization Meets Quantum Mechanics Simulations http://arxiv.org/abs/1407.0658

High Resolution Phonon Mean Free Path Spectroscopy

4000

2000

Bins used for fit of r eff

MFP most suppressed by given L and P=4L

800

600

400

200

Experimental

Configurations

0

0 200 400 600 800 1000 4000 http://arxiv.org/abs/1407.0658

Summary

1.

Nanoscale heat conduction plays an important role in modern information and energy systems.

Fundamental research, both theoretically and experimentally, are needed for better understanding of nanoscale thermal transport mechanisms.

2.

Pump-and-probe method using femto-second lasers is essential for nanoscale thermal transport measurement. We demonstrated simultaneous measurement of thermal conductivity and heat capacity in both bulk and thin film materials using frequency-dependent time-domain transient thermoreflectance (TDTR) signals and measurement of anisotropic thermal conductivity by varying beam spot sizes of transient thermoreflective measurement.

3.

Ultrafast shortwave length extreme ultraviolet (EUV) and soft x-ray lasers are extremely powerful in measuring surface deformation. By using metallic nano-grating, new regimes of nanoscale thermal transport (collectively-diffusive, quasi-ballistic, and diffusive) were identified. High resolution phonon mean free path spectroscopy was developed using EUV light.

Research Themes of Yang’s Group

Nano-enabled Energy Conversion, Storage, and Thermal Management Systems (NEXT)

• Energy Conversion: Thermoelectrics, Photovoltaics, & Light Emitting Diodes

• Thermal Management: Phase-Change Heat Transfer, Thermal Interface Materials, & Thermoelectrics

• Energy Storage: Lithium Ion Batteries, & Thermal Energy Storage

Advanced Characterization

• Solid-Solid and Solid-Liquid

Thermal Interfaces

• Ultrafast Laser-Based Thermal

Characterization

Nanostructured Materials and

Devices

• Physics-Based Design

• Cost-Effective Manufacturing

Multi-scale and Multi-physics Modeling and Simulations:

Quantum Mechanics/Molecular Dynamics, Nonequilibrium Green’s

Function, Boltzmann Transport Equation (Monte Carlo, Finite

Element/Difference Methods), Simplified Physical Models.

Characterization and Fabrication Facilities

Femtosecond Laser-based Pump-and-Probe System for

Nanoscale Heat Conduction

Some NanoManufacturing Facilities

Phase-Change Heat Transfer Characterization Facilities

Pool Boiling with High Speed

Visualization

Spray Loop (Boiling,

Evaporation and Jet), at NREL

Low-temperature CVD growth

Scalable manufacturing of porous alumina templates

Flow Boiling Loop

CU-Boulder for NGAS Innovation Day,

Condensation Loop 4/16/2014

CHI Electrochemical

Workstation

41

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