EML 4561- Electronic Packaging
Summer A 2002
Professor: W. Kinzy Jones, EAS 3442 (office) EAS 3450, ECS 163 (Laboratories)
Phone: 305-348-2345 (office), 305-393-0506 (mobile)
Course Description
This is an introductory course for mechanical and electrical engineers in the field of electronic packaging. The course introduces the major fabrication technologies, design methods and engineering analysis used in the production of electronic devices and assemblies. In addition to lectures, the course provides hands on experience for he student through design projects and lab exercises.
Text : “Fundamentals of Microsystem Packaging”, R. Tummala, McGraw Hill, 2001
Grading
Exams (50%) A midterm and a final will be given.
Design Project (25%) Layout and fabrication of a microcircuit assembly. Students shall fabricate an interconnect assembly and assemble a working prototype. The class will choose the design. Parts and materials will be provided.
Laboratory reports (15%) Laboratory sessions will be held during the semester. Short reports will be required for two laboratory experiment/ process development
Homework (10%) Short homework assignments will be given throughout the semester.
Homework is due one week after assignment
Assignments:
Weeks 1-2.
This will be an intensive introduction of electronic packaging, with 6 hours of lecture each week. All of the slides used will be available on the web. eic4.eng.fiu.edu/~jones
Week 3- Design issues, LTCC processing and design
Schematics, electrical parts, net-lists, pin equivalent drawings
Screen printing, ink rheology, photolithography
Homework: Design of test cell
Lab: Fabrication of thick film ink
Week 4- Interconnect Design and fabrication
Single and multilayer construction. Laminate and LTCC fabrication ground rules.,
Mid-term exam
Lab: Screen fabrication and screen printing of test cells, cofire tape processing
Week 5- Materials and Components
Active and passive devices, materials for conductors, insulators, semiconductors
Homework: Project Design due
Week 6 – Thermal analysis, Assembly methods

Thermal analysis and thermal management, environmental testing, soldering, wire bonding, pick and place
Homework: Thermal analysis project
Lab: Fabricate project in LTCC
Week 7- Assembly, Reliability
Mil HBK 217, Final Exam
Lab: Complete Assembly of project board
Course Objectives
Provide the student with an understanding of the field of electronic packaging
Provide the student with knowledge of the design process in electronic packaging
Provide the student with an understanding of the three major methods of interconnect substrates (laminate, ceramic, deposited) and the design trade-off required for selection
Provide the student with an understanding of the construction of active and passive components, their construction and design trade-offs in selection and reliability performance.
Provide the student with an understanding of first level assembly and the impact on reliability
Provide the student with an understanding of thermal management, using conduction as the demonstrator.
Provide a laboratory experience that will allow the design, fabrication and assembly of a complex, multilayer electronic package fabricated in low temperature cofire ceramic.