Note : This background statement is not part of the balloted item. It is provided solely to assist the recipient in reaching an informed decision based on the rationale of the activity that preceded the creation of this document.
Note : Recipients of this document are invited to submit, with their comments, notification of any relevant patented technology or copyrighted items of which they are aware and to provide supporting documentation. In this context, “patented technology” is defined as technology for which a patent has issued or has been applied for. In the latter case, only publicly available information on the contents of the patent application is to be provided.
Ballot History
This is the second submission of Document 4584. It was submitted for yellow balloting in cycle 1, 2009. The voting process resulted in 16 accepts, 24 abstains and 1 reject. This document incorporates all submitted comments and resolves the rejected vote.
Background
SEMI standard P40-1103 is up for review and in need of many revisions. A lot more is now known about the implementation of EUV Lithography and specifications governing missing items need to be considered, and several companies have requested changes in some existing specifications.
Document 4584 was approved for yellow balloting in cycle 1, 2009 at the February 29 th , 2008 NA Microlithography
Committee meeting and was completely rewritten by the EUV Mask Task Force under the North American
Microlithography Committee.
Ballot results will be reviewed at the July 14 th , 2009 meeting of the EUV Mask Task Force and the NA
Microlithography Committee meeting.
If you need technical assistance, or have questions, please contact Kevin Orvek (at Kevin.Orvek@SEMATECH.org
) or John Zimmerman (at John.Zimmerman@ASML.com). For procedural issues, please contact Susan Turner at
408-943-7019 or e-mail: sturner@semi.org.

Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900 Fax: 408.943.7943
DRAFT
Document Number: 4584A
Date: 13.04.2020
1 Purpose
1.1 This specification covers the mounting requirements for Extreme Ultraviolet Lithography (EUVL) masks in select tools.
2 Scope
2.1 This standard details the requirements for EUVL mask mounting. The mask mount is a flat reference surface against which the mask is clamped. The specific design and material of the mask mount are not specified.
2.1.1 The mounting requirements in this standard apply to the EUV exposure tools. These mounting requirements may be used in other tools used to fabricate or measure EUV masks.
NOTICE: This standard does not purport to address safety issues, if any, associated with its use. It is the responsibility of the users of this standard to establish appropriate safety and health practices and determine the applicability of regulatory or other limitations prior to use.
3 Referenced Standards
3.1 SEMI Standards
SEMI P37 — Specification for Extreme Ultraviolet Lithography Masks Substrates
NOTICE: Unless otherwise indicated, all documents cited shall be the latest published versions.
4 Terminology
4.1 Abbreviations and Acronyms
4.1.1 EUV — extreme ultraviolet
4.1.2 EUVL — extreme ultraviolet lithography
4.2 Definitions
4.2.1 chuck — the chuck is the physical apparatus in the tools listed in ¶ 2.1.1 upon which the mask is mounted.
4.2.2 mounting surface — the mounting surface is the surface of the chuck in direct contact with the mask. The backside of the mask, which is the non-patterned side, shall be in direct contact with the mounting surface while the mask is being used in the tools listed in ¶ 2.1.1.
4.2.3 pin or pedestal
— if the surface of the chuck consists of an array of pins or pedestals, pins are protrusions from the chuck surface that come to a point at the location on their surface farthest from the chuck. Pedestals have a nominally flat surface at their surface farthest from the chuck.
4.2.4 user — this term may refer to the user of fabrication equipment for EUV masks that contains a chuck, or this term may refer to the purchaser of an EUV mask from a mask supplier.
5 Mounting Requirements
5.1
The mask mounting quality area (backside) is indicated in Figure 1. The dimensions of the mask mounting
quality area, D and W , are agreed upon between the user and supplier. The edge length of the mask substrate, L , is defined in SEMI P37.
5.2
The mounting surface shall meet the flatness requirements and local slope requirements defined in Table 1 and
Table 2 over the mounting quality area shown in Figure 1.
5.2.1 The flatness error is defined as the maximum deviation of the surface from the best fit plane determined by least squares fitting. This definition is illustrated in Figure 2. Note that the mounting surface is defined in ¶ 4.2.2.
5.2.2 If the mounting surface is discontinuous, the plane that defines the maximum deviation will include points near or at the tops of the pins or pedestals. This plane is illustrated in Figure 3.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900 Fax: 408.943.7943
DRAFT
Document Number: 4584A
Date: 13.04.2020
5.3
The mask will be mounted with a clamping pressure as specified in Table 3. The clamping pressure is the force
per unit area in the plane of the mounting surface. The minimum effective bending stiffness of the chuck cross
section is specified in Table 4.
6 Test Methods
6.1 General

test methods do not preclude empirically meeting the requirements. Nor do they preclude the use of a reference blank.
6.2 Flatness

to be agreed upon between user and supplier.
6.3 Local Slope

to be agreed upon between user and supplier.
6.4 Clamping Pressure

to be agreed upon between user and supplier.
7 Certification
7.1 Upon request of the user, a supplier's certification that the chuck was manufactured and tested in accordance with this specification, together with a report of the test results, shall be furnished at the time of shipment.
L
L
D
W
Figure 1
Dimensions of Mask Backside Mounting Quality Area
Table 1 Flatness of the Mounting Surface
Mounting Quality Area (millimeters 2 )
W x D
Table 2 Local Slope of the Mounting Surface
Area over which local slope is measured (millimeters²)
20 x 20
Maximum Peak-to-Valley Flatness (nanometers)
30
Local Slope Error (microradians)

1.0
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900 Fax: 408.943.7943
Table 3 Clamping Pressure
DRAFT
Document Number: 4584A
Date: 13.04.2020
Max Clamping Pressure on contacted area (kPa) Maximum Range of Clamping Pressure within Flatness Quality
Area (%)

2000
Table 4 Minimum Effective Bending Stiffness of the Chuck Cross Section
20
Bending Stiffness (Newton-meter) #1
300,000
#1 The effective bending stiffness ( D ) of a chuck with a solid cross section is given by:
D 
E h 3

  2
 where E is the elastic modulus in N/m 3 , h is the thickness in meters and ν is Poisson’s ratio.
Chuck
1
Figure 2
Definition of Flatness Error
Note: P1 is the best fit plane determined through least squares fitting.
Chuck
1
Figure 3
Definition of Flatness Error for a Pin or Pedestal Chuck
Note: P1 is the best fit plane determined through least squares fitting
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
Page 3 Doc. 4584
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SEMI
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Semiconductor Equipment and Materials International
3081 Zanker Road
San Jose, CA 95134-2127
Phone:408.943.6900 Fax: 408.943.7943
DRAFT
Document Number: 4584A
Date: 13.04.2020
NOTICE: SEMI makes no warranties or representations as to the suitability of the standards set forth herein for any particular application. The determination of the suitability of the standard is solely the responsibility of the user.
Users are cautioned to refer to manufacturer's instructions, product labels, product data sheets, and other relevant literature, respecting any materials or equipment mentioned herein. These standards are subject to change without notice.
By publication of this standard, Semiconductor Equipment and Materials International (SEMI) takes no position respecting the validity of any patent rights or copyrights asserted in connection with any items mentioned in this standard. Users of this standard are expressly advised that determination of any such patent rights or copyrights, and the risk of infringement of such rights are entirely their own responsibility.
This is a draft document of the SEMI International Standards program. No material on this page is to be construed as an offi cial or adopted standard. Permission is granted to reproduce and/or distribute this document, in whole or in part, only within the scope of SEMI International Standards committee (document development) activity. All other reproduction and/or distribution without the prior written consent of SEMI is prohibited.
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