REFERENCES
1.
S. Wolf and R.N. Tauber, Silicon Processing for the VLSI Era, Volume 1 – Process
Technology, Lattice Press, Sunset Beach, CA, 1986.
2.
R.B. Fair, “Rapid Thermal Processing – A Justification,” Rapid Thermal Processing,
Science and Technology, edited by R. B. Fair, Academic Press, Boston, pp. 1-11, 1993.
3.
T. Borca-Tascuic, D.A. Achimov, and G. Chen, “Difference Between Wafer Temperature
and Thermocouple Reading During Rapid Thermal Processing,” Mat. Res. Soc. Symp.
Proc. Vol. 525, pp. 103-108, 1998.
4.
J. Wagner and F.G. Boebel, “Temperature Measurement at RTP Facilities – An Overview,”
Mat. Res. Soc. Symp. Proc., Vol. 429, pp. 303-308, 1996.
5.
K.G. Kreider, D.P. DeWitt, B.K. Tsai, F.J. Lovas, and D.W. Allen, “RTP Calibration
Wafer Using Thin-Film Thermocouples,” Mat. Res. Soc. Symp. Proc., Vol. 525, pp. 87-94,
1998.
6.
J. Lai, T. Perazzo, Z. Shi, and A. Majumdar, “Optimization and Performance of HighResolution Micro-optomechanical Thermal Sensors,” Sensors and Actuators A, Vol. 58, pp.
113-119, 1997.
7.
P.M. Nieva, P.M. Zavracky, G.G. Adams, H. Tada, A.R. Abramson, I.N. Miaoulis, and
P.Y. Wong, “Temperature Measurement During Rapid Thermal Annealing Using MEMS,”
Proceedings of the 5th ASME/JSME Joing Thermal Engineering Conference, 1999.
8.
H. Tada, A.R. Abramson, P. Nieva, P. Zavracky, I.N. Miaoulis, and P.Y. Wong, “MEMS
as Temperature Sensors During High Temperature Processing,” Mat. Res. Soc. Symp.
Proc., Vol. 518, pp. 161-166, 1998.
69
9.
A.M. Madni and L.A. Wan, “Microelectromechanical Systems (MEMS): An Overview of
Current State-of-the-Art,” Proceedings of the IEEE Aerospace Applications Conference,
Vol. 1, pp. 421-427, 1998.
10.
J-Å. Schweitz, “Mechanical Characterization of Thin films By Micromechanical
Techniques,” MRS Bulletin, pp. 34-45, July 1992.
11.
D.A. Swyt. “Generic Technology, Measurement and Standards Issues in Micromaching
and Microfabrication,” Proceedings of SPIE, Microlithography and Metrology in
Micromachining, pp.16-21, 1995.
12.
W.N. Sharpe, Jr., S. Brown, G. C. Johnson, and W. Knauss, “Round-robin Tests of
Modulus and Strength of Polysilicon,” Mat. Res. Soc. Symp. Proc., Vol. 518, pp. 57-65,
1998.
13.
W.N. Sharpe, Jr., K. Turner, and R.L. Edwards, “Polysilicon Tensile Testing With
Electrostatic Gripping,” Mat. Res. Soc. Symp. Proc., Vol. 518, pp. 191-196, 1998.
14.
S. Greek and F. Ericson, “Young’s Modulus, Yield Strength and Fracture Strength of
Microelements Determined by Tensile Testing,” Mat. Res. Soc. Symp. Proc., Vol. 518, pp.
51-56, 1998.
15.
W.N. Sharpe, Jr., B.Yuan, and R.L. Edwards, “A New Technique for Measuring the
Mechanical Properties of thin Films,” J. Microelectromechanical Systems, Vol. 6, No. 3,
pp. 193-198, 1997.
16.
P.T. Jones, G.C. Johnson, and R.T. Howe, “Fracture Strength of Polycrystalline Silicon,
Mat. Res. Soc. Symp. Proc., Vol. 518, pp. 197-202, 1998.
17.
S. Johansson, J-Å. Schweitz, “Fracture Testing of Silicon Microelements in situ in a
Scanning Electron Microscope,” J. Appl. Phys., Vol. 63, No. 10, pp. 4799-5844, 1988.
70
18.
T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix, “Measuring the Strength and Stiffness
of thin film materials by Mechanically Deflecting Cantilever Microbeams,” Mat. Res. Soc.
Symp. Proc., Vol. 130, pp. 87-92, 1992.
19.
S. Jayaraman, R.L. Edwards, and K.J. Hemker, “Relating mechanical testing and
microstructural features of polysilicon thin films,” J. Mater. Res., Vol. 14, No. 3, pp. 688697, 1999.
20.
O. Tabata, K. Kawahata, S. Sugiyama, and I. Igarashi, “Mechanical Property
Measurements of Thin Films Using Load-Deflection of Composite Rectangular
Membrane,” Proceedings of the IEEE Workshop on Micro-electro-mechanical Systems, pp.
152-156, 1989.
21.
H. Kahn, S. Stemmer, R.L. Mullen, M.A. Huff, and A.H. Heuer, “Polycrystalline Silicon
Films for Microelectromechanical Devices,” Mat.Res. Soc. Symp. Proc., Vol. 403, pp. 321326, 1996.
22.
H. Kahn, S. Stemmer, K.Nandakumar, A.H. Heuer, R.L. Mullen, R. Ballarini, and M.A.
Huff, “Mechanical Properties of Thick, Surface Micromachined Polysilicon Films,”
Proceedings of IEEE International Workshop on Micro-electro-mechanical Systems, pp.
343-348, 1996.
23.
S. Lee, C. Cho, J. Kim, S. Park, S. Yi, J. Kim, and D. Dan Cho, “The Effects of Texture
and Doping on the Young’s Modulus of Polysilicon,” Mat.Res. Soc. Symp. Proc., Vol. 518,
pp. 21-26, 1998.
24.
H. Kahn, M.A. Huff, and A.H. Heuer, “Heating Effects on the young’s Modulus of Films
Sputtered onto Micromachined Resonators,” Mat.Res. Soc. Symp. Proc., Vol. 518, pp. 3338, 1998.
71
25.
P.H. Townsend and D.M. Barnett, “Elastic Relationships in Layered Composite Media
With Approximation for the Case of Thin Films on a Thick Substrate,” J. Appl. Phys., Vol.
62, No. 11, pp. 4438-4444, 1987.
26.
F.P. Beer and E.R. Johnson, Jr., Mechanics of Materials, Second Edition, McGraw-Hill,
Inc., New York, pp. 204-207, 1992.
27.
T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix, “Measuring the Strength and Stiffness
of Thin Film Materials by Mechanically Deflecting Cantilever Microbeams,” Mat. Res.
Soc. Symp. Proc., Vol. 130, pp. 87-92, 1989.
28.
S. Wolf and R.N. Tauber, Silicon Processing for the VLSI Era: Volume 1 – Process
Technology, Lattice Press, Sunset Beach, CA, pp. 175-181 and 198-199, 1986.
29.
G.W. McLellan and E.B. Shand, Glass Engineering Handbook, Third Edition, McGrawHill, New York, pp. 2-14 – 2-15, 1984.
30.
N.W. Ashcroft and N.D. Mermin, Solid State Physics, Saunders College Publishing, Fort
Worth, TX, pp.492-494, 1976.
31.
T. Soma and H.M. Kagaya, in Properties of Silicon, The Institution of Electrical Engineers
(Inspec), London, pp. 33-36, 1988.
32.
A.R. Abramson, “Effect of Doping Level During Rapid Thermal Processing of Multilayer
Structures,” J. Mater. Res., Vol.14, No. 6, pp. 2402-2410, 1999.
33.
P.Y. Wong, Processing Uniformity in Thin-Film Manufacturing by Thermal Radiative
Heating, Doctoral Dissertation, Tufts University, 1995.
34.
F.P. Incropera and D.P. DeWitt, Introduction to Heat Transfer, Second Edition, John Wiley
& Sons, New York, pp. 654-706, 1990.
72
35.
O.S. Heavens, Optical Properties of Thin Solid Films, Butterworth, Washington, D.C., pp.
46-95, 1955.
36.
H. Tada, A. R. Abramson, I. N. Miaoulis, and P. Y. Wong, “Effect of Surface Patterning in
Thin Film Structures on the Thermal Radiative Properties During Rapid Thermal
Processing,” Proceedings of the ASME International Mechanical Engineering Congress
and Exposition, HTD-Vol.361-2, pp. 93-98, 1998.
37.
H. Tada, I. N. Miaoulis, and P. Y. Wong, “Numerical Simulation of Radiant Thermal
Processing of Bilayer Microcantilevers,” Proceedings of the ASME International
Mechanical Engineering Congress and Exposition, DSC-Vol.66, pp. 37-44, 1998.
38.
S.V. Patankar, Numerical Heat Transfer and Fluid Flow, Hemisphere Publishing
Corporation, Washington, pp. 67-68, 1980.
39.
M. Ohring, The Materials Science of Thin Films, Academic Press, San Diego, CA, pp. 432435, 1992.
73