CF260 BGA
Rework Station
Operation Manual
CF260 工作参数：
型号 model
迅维 CF260
适合锡球类型 Solder Type
有铅/无铅 3 g" {%Normal Solder/Lead free
适用元件种类 SMD
Micro bga、BGA、CSP、QFP
PCB 高度
0.5～4mm
Thickness
PCB 尺寸 3 R-PCB Size
W50×D50～W440×D310mm
上部加热方式及功率
热风 Hot flow /700W
Heating/Consumption(Upper)
下部加热方式及功率
热风 Hot flow /700W
Heating/Consumption(Bottom)
预热方式及功率 Preheat mode
power
暗红外 IR 2400w
PCB 定位方式 Positioning PCB
外形或治具 Shape or Tongs
传动方式 Driver
齿轮、齿条 Gear、rack
控制方式 control
温控仪表控制
温度范围
室温 Room temperature ~400 摄氏度
Temperature range
总功率 Max Consumption
3.8KW
电源
110v~220v
Power
机身尺寸 Dimension
720mmL X 620mmW X 410mmH
机体重量 Weight
28KG(volume weight:42kg)
What is 3 independent heating area BGA rework station?
Upper heating
Area
bottom heating
Area
IR heating Area
CF-260 owns 3 independent heating area，incl. Upper, bottom, ir heating area,
controlled by 。when heating，Upper/Bottom Nozzle will heat the BGA chip and IR heat
the whole PCBA to avoid deform. The ideal IR heating temperature is 80to 110 degrees.
Feature：
1、Fine design Jig，which making hold laptop Motherboard easier.
2、Bottom Nozzle come with 4 adjustable screw that enable PCB held stable
For PCB with many components, the middle pole will take effect
2、Enlarge bottom heating pad. We have the largest one within similar
products.
4、Upper Nozzle was designed with small hole. The holes became larger when
spreading to edge. It makes heat dispersed uniformly on the BGA chip.
5、Air volume button can adjust the temperature. Air volume button come with
5 gear, Max. 5 and Min. 0 风量调节 5 档位最大，0 档位最小。
Air volume button
Menu
一、Install rework station
二、Control Panel introduction
三、Temperature setup
四、Dismantle chip set demo
五、Recommended temperature setup
六、BGA soldering Q&A
七、Miscellaneous
一、Install rework station
Horizontal bracket installation:
Upper heating gun holder installation：
Caution：
1、
2、
3、
4、
5、
Please make sure space is in calm wind conditon
Install on solid& stable surface. Table should be flat.
Maintain good ventilation in the room
Please ensure the electricity wire can support power of 3.6kw.
Otherwise, it may happen fire with potential risk.
Keep the room clean with less dust
二、Control Panel introduction
Power on：when power on，the rework station will heat using parameter shown in PTN
Power off：Hold power off button 0.5S，rework station shut down
Lighting：Front/back lighting
Fan：Put “0”, rework station will cool down itself for 60s. When put”1”, cooling down
permenant.
Temperature test line：Test the BGA temperature
Air Volume button：Adjust upper heating air volume
三、Temperature setup
Turn on switch, 2s later, ok to solder.
Button introduction：
PTN： Choose temperature profile. Save up to 10 profiles, 0 to 9. PTN shows
current temperature profile
DISP： Push twice, Time led light. SV shows the temperature of Temperature test
line
PC410 panel：
1、Current temp.
2、Target temp.
3、SET temperature。.
4、Choose temperature profile。
5、Turn up 。
6、Turn down。
7、Switch to next option。
Demo
Material
Lead Intel South Bridge
Segment
1
2
3
4
5
Upper
heating
L1
70
L2
165
L3
185
L4
220
L5
225
Upper
heating
slope
r1
3
r2
3
r3
3
r4
3
r5
3
Upper
heating
time
D1
40
D2
40
D3
40
D4
40
D5
40
Bottom
heating
L1
100
L2
175
L3
195
L4
235
L5
245
Bottom
heating
slope
r1
3
r2
3
r3
3
r4
3
r5
3
Bottom
heating
time
D1
40
D2
40
D3
40
D4
40
D5
40
IR Heating
Target temp. 100 degree(summer), 150 degree(winter)
1) Press PTN,PTN show 4, setting profile 4
2) Press SET to adjust profile 4。r1, heating slope。3.00， 3 degree/sec。Press
PAR，to the next parameter
3) L1，target temperature。Set 165。Then press PAR。
4) D1，keeping time when temperature reach 165 degree，here，set 40
seconds
5) set segment r2, set 3.00, same as r1
6) L2 set 195。Press PAR
7) Set D2 stay 40s at 195 degree then press PAR
8) Set segment r 3 , 3.00 as well then PAR。
9) L3 ,215 degree then press PAR。
10) Set d3 40 at 215 degree then press PAR。
11) Set r4 3.00。
12) Set L4 245 degree then press PAR
13) Set D4 40s then press PAR
14) Set r5 at 3.00 then press PAR。
15) Set L5 at 260。Press PAR
16) Set d5 as 50 at 260 degree Press PAR
16) Set r6 to end to close the heating process
17) Keep HB at 500，Don’t change
Bottom temperature please refer the same
IR heating setup：
PV shows actual temperature，SV show target temperature，
There are 6 pieces heating block in total
Switch off left button，the first one on the left didn’t heat
Switch off left button，the first one on the right didn’t heat
Switch off mid button，all heating block didn’t heat
Left
Mid
right
四、Dismantle process：
1、 Using Jig to fix PCB， making it stable
Adjust the bottom nozzle to touch the pcba。
To make sure PCBA is flat. No deform
2、 Here we show desolder IBM T60
3、Insert temperature test line to bottom of BGA
4、Power on
5、Press DISP twice，when TIME light，SV shows current temperature
6、
到最后一段的时候，如果发现温度无法达到熔点
Melting point：
Lead ball 200degree, lead free ball 230 degree
When temperature(using test line) reach melting point(through our practice), it
is the time to remove the chip with IC forceps
7、 Special highlight, in normal practice, we don’t use vacuum pen because
most chip now is glue on the bottom or dispensing
Notice:
When soldering chip, please put temperature test line to the corner of chip, while not the
bottom of chip to avoid ball adhesion.
五、CF 260 Useful profiles
slope=3.00
home temperature 18～20 degree
Material
Lead ball profile（Intel south bridge）
Segment
1
2
3
4
5
Upper
heating
L1
70
L2
165
L3
185
L4
220
L5
225
slope
r1
3
r2
3
r3
3
r4
3
r5
3
Time
D1
40
D2
40
D3
40
D4
40
D5
40
Bottom
heating
L1
100
L2
175
L3
195
L4
235
L5
245
Slope
r1
3
r2
3
r3
3
r4
3
r5
3
Time
D1
40
D2
40
D3
40
D4
40
D5
40
IR heating
100 in summer, 150 in winter
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
适用物料
Lead free ball profile（Intel south bridge）
阶段
1
2
3
4
5
上加热温区
L1
165
L2
185
L3
215
L4
235
L5
245
上温区斜率
r1
3
r2
3
r3
3
r4
3
r5
3
上温区时间
D1
40
D2
40
D3
40
D4
40
D5
40
下加热温区
L1
165
L2
195
L3
225
L4
245
L5
260
下温区斜率
r1
3
r2
3
r3
3
r4
3
r5
3
下温区时间
D1
40
D2
40
D3
40
D4
40
D5
40
预热温区
设定目标值为 100 度即可
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
下面使用简化的曲线表(simplified table)：
适用物料
Lead free ball profile（Intel south bridge）
阶段
1
2
3
4
5
上加热温区
165
185
215
235
245
下加热温区
165
195
225
245
260
时间
40
40
40
45
45
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
适用物料
Lead free ball profile（775 CPU socket）
阶段
1
2
3
4
5
上加热温区
165
195
215
245
260
下加热温区
165
195
235
245
270
时间
40
40
40
50
50
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
适用物料
Lead ball profile（775 CPU socket, 478 socket）
阶段
1
2
3
4
5
上加热温区
100
165
215
235
245
下加热温区
100
195
225
235
260
时间
40
40
50
50
50
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
适用物料
Lead free ball profile（AMD, ATI chipset）
Lead free ball profile（Nvidia chipset）
阶段
1
2
3
4
5
上加热温区
70
110
165
205
225
下加热温区
110
165
215
260
270
时间
40
70
70
50
50
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
For ATI\NV chipset，PCB is thin/slim，Please using upper heating temperature low and
bottom temperature high. Upper heating temperature don’t higher than 260 degree
适用物料
Lead free ball profile（Nvidia VGA chipset on laptop）
阶段
1
2
3
4
5
上加热温区
165
195
215
235
245
下加热温区
165
195
215
260
270
时间
40
70
70
50
50
预热温区
建议值 100（夏季） 150（冬季） 室温对曲线有极大影响，需灵活调节
六、BGA soldering Q&A
1、How to find suitable profiles for BGA
BGA soldering/desoldering is impacted by temperature, humidity, wind, PCB thickness,
PCB design. There is no perfect profile works in all situation.
Suggest to use laptop/desktop north bridge to fine turn profiles. Check the temperature of
segment 4 finished. The ideal melting point for lead free ball is 217 degree and 183 for lead
ball. But, in practice, the ball don’t melt in the temperature. The temperature need to reach
235 for lead free and 200 for lead.
2、If the 4 screw can’t touch motherboard in the same time, how to do?
a. adjust the screw hight to fit with mother board.
b. Use mid pole to hold PCB
c. fine turn the position of pcb
3、How to use air volume button?
We offer 28mm to 46mm 5 pieces nozzle to address different size of chipset. When using
small nozzle, we use less air volume to control the temperature.
1、 Caution on 775 CPU socket solder/desoldering
Desoldering 775 socket，Put temperature test line between PCB and 775 socket，from direction of 必
power supply.
775scoket，Use flux with direct soldering, but remove 775 socket cover
Soldering 775 socket，Make sure the pcb is flat
2、 Flux
Please choose BGA flux and keep good condition. Don’t put under sunlight
3、 Cleaning job in BGA soldering
Stencils are suggested to be cleaned by ultrosonic cleaner. Solder ball was not suggested
to be recycle.
4、 Why chipset explode?
a. Air volume is too high and not uniform.
b. Chipset is wet
We suggest to dry chipset under 165 degree for 10 mins. If can using dry box to dry it at 100
degree for 10hrs, it would be better.
5、How to remove chip with glue？
Under temperature of 230 degree, solder ball melt. Pull the chip with forceps heavily. Don’t
worry!
七、Attantion：
1、Make sure wind blow less than 2M/s
3 、 When use large nozzle, choose large air volume with more distance. Eg.
Using34mmx34mm Nozzle. Keep nozzle 2to 3mm distance to chip
4、Soler 775and 478 CPU socket，suggest to use same size of nozzle as 775 and 478
CPU.
八、 Warranty
One year warranty.