REV.8.0
Hitachi IE Systems Co.,Ltd.
Date ：
The head office, Inazawa factory
Non-Use Warranty / Chemical Substance Certification Sheet
Company name ：
Signature of person in charge：
Regarding the products written in the products list below
, We certify that the chemical substances which we checked ✔ below are not used intentionally and the
1.
amounts of chemical substances in Table-1 which we checked ✔ (including impurities) do not exceed the
thresholds in the Table.
Though
we do
notthe
certify
that the substances
amounts of chemical
contained
in the
(orof
thechemical
parts) with
1. We certify
that
chemical
are not substances
used intentionally
and
theproducts
amounts
RoHS exemptions in the product list below do not exceed the thresholds in Table-1, we certify that the conditions
substances
Table (including
impurities) do not exceed those thresholds specified by law (RoHS, etc.).
for thoseinexemptions
are applicable.
Though
we do not
certify that
the amounts
of chemical
substances
contained
in the products (or the parts)
□ Table-1.
(Prohibited
chemicals)
and Table-2
(Candidates
of prohibited
chemicals)
Table-1.
(Prohibited
chemicals)
with □
RoHS
exemptions
in the
product and
list below do not exceed the thresholds in Table-1, we certify that the
[Table-2 (Candidates
of prohibited chemicals) except chemicals input “Y” in the “Contain” cell.]
conditions for those exemptions
are applicable.
(In
the
caces
as
follows,
input
“Y”
in
the
“Contain”
cellwe
and
input that
the “Date
of countermeasure”
it in the cell.
2. By inserting a check in one of the two boxes
below
certify
the amount
of prohibited of
chemicals
in
(1) In the case of existence of the thresholds, when they are not satisfied with it,
our product
is
based
on
scientific
fact
and
that
the
registered
data
is
accurate.
(2) In the case of no-existence of the thresholds, when they include the chemicals. )
2. We certify that the amount of the checked chemicals above in our product is based on scientific fact and that
the registered data is accurate.
Products
*Attach a list if the space is insufficient
Supplier’s
Product (part)
number
No.
Hitachi’s
Product (part)
number
Hitachi’s
Product (part)
name
Exemption
Manufacturing plant
Existence
Yes /No
(*1)
Exemption code
Part
*1) In the case that the prohibited chemicals in the products have RoHS exemptions, fill in the “Exemption code” in the yes/no column and
the “part” used in the product. As for the “Exemption code” use either the “Exemption Code of Article4(1)” or “Exemption Code of ITS”
noted in ANNEX 3. (e.g., Lead in high melting temperature type solders=7(a) or Pb-R-2)
Table-1 Prohibited chemicals
No.
Prohibited material
Law thresholds
No.
Prohibited material
Law thresholds
Intentional use
prohibited
Intentional use
prohibited
Intentional use
prohibited
Intentional use
prohibited
Intentional use
prohibited
Intentional use
prohibited
1
Cadmium and Cadmium Compounds
100ppm
10
Polychloronapthalenes (Cl=>3)
2
Hexavalent Chromium Compounds
1000ppm
11
Short Chain Chlorinated Paraffins
Lead and Lead Compounds
1000ppm
12
Hexabromocyclododecane (HBCD) and all
major diastereoisomers
*1
300ppm
13
Asbestos
Mercury and Mercury Compounds
1000ppm
14
Ozone Depleting Substances
Lead, Cadmium, Mercury, Hexavalent
Chromium (package and wrapping only)*2
Total
100 ppm
15
Radioactive Substances
5
Tri-substituted Organostannic
Compounds*3
Intentional use
prohibited
and 1000ppm by
weight of tin
16
PFOS and its Analogous Compounds
6
Polybrominated Biphenyls (PBBs)
1000ppm
17
2-(2H-1,2,3-benzotriazole-2-yl)-4,6-di-tertbutylphenol
7
Polybrominated Diphenyl ethers (PBDEs)
1000ppm
18
Hexachlorobenzene
19
Dimethylfumarate (DMF)
0.1ppm
20
Benzenamine, N-phenyl-, reaction
products with styrene and
2,4,4-trimethylpentene (BNST)
Intentional use
prohibited
3
4
1~4
Lead and Lead Compounds (wire coating)
8
Polychlorinated Biphenyls (PCBs)
9
Polychlorinated Terphenyls (PCTs)
Intentional use
prohibited
Intentional use
prohibited
50ppm(equipments)
Intentional use
prohibited
Intentional use
prohibited
Intentional use
prohibited
*1: Apply to wire coating.
*2: Apply to the sum of lead, cadmium, mercury and the hexavalent chromium included in the package and wrapping of the products.
*3: Tributyl Tin Oxide (TBTO), Tributyl Tins (TBTs), Triphenyl Tins (TPTs), and other Tri-substituted organostannic compounds
*4: Regarding the details of “Law thresholds”, please refer to the Annex１Table 1 Level A list of “Common Specification for the Management of
Chemical Substances Contained”.
Contact details:
depart.
phone
name
e-mail
Products list
No.
*Attach a list if the space is insufficient
Supplier’s
Hitachi’s
Hitachi’s
product (part)
product (part)
product (part)
number
number
name
Exemption (*1)
Manufacturing plant
Existence
Substance group No.-The use
Yes /No
which becomes exemption
Part
(*1)When application of the prohibited substance, you use correspond to the RoHS exclusion item, be sure to fill in the “existence”, “JGPSSI
substance group No. -The use which becomes exemption” in the ANNEX 3 and make it clear which “part” it is used in. (Example: Lead in the high
melting temp. type solder=7(a))
Table-2
N
o
Candidate of prohibited chemicals
Law thresholds e.t.c.
Chemical substance group
Thresholds
1 Bis(2-ethylhexyl)phthalate (DEHP) 1000ppm(0.1wt%)
Hitachi’s thresholds e.t.c.
1000ppm(0.1wt%)
Benzyl butyl phthalate (BBP)
1000ppm(0.1wt%)
Dibutyl phthalate (DBP)
1000ppm(0.1wt%)
Diisobutyl phthalate (DIBP)
Intentional use prohibited
30ppm
2 Azocolourants and azodyes which
Ban of attachment, mix, or production of the
form certain aromatic amines.
(0.003wt%)
substances in the manufacturing process.
Impurities
*Refer to the Annex4 Specific
Even if it contained as impurities, the concentrations
content rate
amine list
in material must not exceed 30ppm.
Concentration of tin in Product must not exceed
1000ppm
3 Dibutyltin compounds (DBT)
（0.1ｗｔ％） 1000 ppm （0.1ｗｔ％）
Tin content rate
ditto
Intentional use prohibited
Ban of attachment, mix, or production of the
substances in the manufacturing process.
Intentional use prohibited
75ppm
6 Formaldehyde
(0.0075wt%) Ban of attachment, mix, or production of the
Impurities content substances in the manufacturing process.
Even if it contained as impurities, the concentrations
rate
in material must not exceed 75ppm.
Intentional use prohibited
7 Tris(2,3-dibromopropyl)phosphate
Ban of attachment, mix, or production of the
substances in the manufacturing process
ditto
8 Tris（1-aziridinyl） phosphine oxide
ntentional use prohibited
1ppm
9 Polycyclic aromatic hydrocarbons
(PAHｓ）
(0.0001ｗｔ％） Ban of attachment, mix, or production of the substances in
4 Dioctyltin compounds (DOT)
5 Fluorinated greenhouse gases
(HFC, PFC, SF6)
10 Perfluorooctanoic acid (PFOA)
and individual salts and esters of
PFOA
ditto
-
the manufacturing process.
Impurities content
Concentration must not exceed 0.0001 % by weight of
rate
rubber or plastic component even contained as impurities.
1. Article: Concentration in product must not exceed
1000ppm
0.1 % by weight.
（0.1ｗｔ％）
2. Chemical products and specific cases: Intentional
Impurities content
use prohibited. Ban of attachment, mix, or production
rate
of the substances in the manufacturing process.
Refer to the right
Concentration must not exceed the following levels
note
even contained as impurities.
-Chemical products:0.001% by weight
-fiber, carpet, or other coated articles:1 μg/m2.
11 Polychlorinated Naphthalenes
(more than 3 chlorine atoms)
-
12
13
14
15
16
17
Aldrin
Dieldrin
Endrin
Chlorophenothane
Chlordanes
-
18
19
20
21
22
23
24
25
26
27
28
29
2,4,6-tri-tert-butylphenol
Toxaphene
Mirex
Kelthane
Hexachloro-1,3-butadiene
Pentachlorobenzene
α-Hexachlorocyclohexane
β-Hexachlorocyclohexane
γ-Hexachlorocyclohexane
Chlordecone
Endosulfan
Nickel and Nickel compounds
N,N'-ditolyl-p-phenyle nediamine,
N-tolyl-N'-xylyl-p-ph enylenediamine
and N,N'-dixylyl-p-phenylene diamine
-
Intentional use prohibited
Ban of attachment, mix, or production of the
substances in the manufacturing process
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
ditto
Ban of use as stainless steels or nickel plating.
This applies to the following articles.
1) The most outside surface of keyboards and mice
as final products.
2) The most outside surface of palm rests of laptops
and chassis of mobile phones.
3) Surface of liquid crystal touch panels.
Contain
Date of
Counter
measure
ANNEX3 Exemption list
Exemption
Code of
Article4(1)
1
Exemption
For general lighting purposes < 30 W: 5 mg
1(b)
For general lighting purposes ≥= 30 W and < 50 W: 5 mg
1(c)
For general lighting purposes ≥ 50 W and < 150 W: 5 mg
1(d)
For general lighting purposes ≥150 W: 15 mg
1(e)
For general lighting purposes with circular or square
structural shape and tube diameter ≤17 mm
1(g)
2(a)
2(a)(1)
2(a)(2)
2(a)(3)
2(a)(4)
2(a)(5)
2(b)
2(b)(1)
2(b)(2)
For special purposes: 5 mg
For general lighting purposes < 30 W with a lifetime equal or
above 20 000 h: 3,5 mg
Mercury in double-capped linear fluorescent lamps for
general lighting purposes not exceeding (per lamp):
Tri-band phosphor with normal lifetime and a tube diameter <
9 mm (e.g. T2): 5 mg
Tri-band phosphor with normal lifetime and a tube diameter
≥ 9 mm and ≤ 17 mm (e.g. T5): 5 mg
Tri-band phosphor with normal lifetime and a tube diameter >
17 mm and ≤ 28 mm (e.g. T8): 5 mg
Tri-band phosphor with normal lifetime and a tube diameter >
28 mm (e.g. T12): 5 mg
Expires on 31 December 2011; 3.5mg may be
used per burner after 31 December 2011 until
31 December 2012; 2.5mg mg shall be used
per burner after 31 December 2012
Hg-R-6
Expires on 31 December 2011; 3.5mg may be
used per burner after 31 December 2011
No limitation of use until 31 December 2011;
7 mg may be used per burner after 31
December 2011
－
Hg-R-7
Tri-band phosphor with long lifetime (≥ 25000h): 8 mg
Expires on 31 December 2011; 4 mg may be
used per lamp after 31 December 2011
Expires on 31 December 2011; 3 mg may be
used per lamp after 31 December 2011
Expires on 31 December 2011; 3.5 mg may be
used per lamp after 31 December 2011
Expires on 31 December 2012; 3.5 mg may be
used per lamp after 31 December 2012
Expires on 31 December 2011; 5 mg may be
used per lamp after 31 December 2011
Mercury in other fluorescent lamps not exceeding (per lamp):
Linear halophosphate lamps with tube >28 mm (e.g. T10 and
T12): 10 mg
Non-linear halophosphate lamps (all diameters): 15 mg
2(b)(3)
Non-linear tri-band phosphor lamps with tube diameter > 17
mm (e.g. T9)
2(b)(4)
Lamps for other general lighting and special purposes (e.g.
induction lamps)
3
Mercury in cold cathode fluorescent lamps and external
electrode fluorescent lamps (CCFL and EEFL) for special
purposes not exceeding (per lamp):
3(a)
Scope and dates of applicability
Mercury in single capped (compact) fluorescent lamps not
exceeding (per burner):
1(a)
1(f)
JIG Code
Expires on 13 April 2012
Expires on 13 April 2016
Hg-R-8
No limitation of use until 31 December 2011;
15 mg may be used per lamp after 31
December 2011
No limitation of use until 31 December 2011;
15 mg may be used per lamp after 31
December 2011
Short length ( ≤500 mm)
Hg-R-9
No limitation of use until 31 December 2011;
3.5 mg may be used per lamp after 31
December 2011
3(b)
Medium length ( >500mm and ≤ 1500 mm)
No limitation of use until 31 December 2011;
5 mg may be used per lamp after 31 December
2011
3(c)
Long length ( > 1500 mm)
No limitation of use until 31 December 2011;
13 mg may be used per lamp after
31December 2011
4(a)
Mercury in other low pressure discharge lamps (per lamp)
4(b)
Mercury in High Pressure Sodium (vapour) lamps for general
lighting purposes not exceeding (per burner) in lamps with
improved colour rendering index Ra > 60:
4(b)-I
Hg-R-10
P≤ 155 W
Hg-R-11
No limitation of use until 31December 2011;
15 mg may be used per lamp after
31December 2011
No limitation of use until 31December 2011;
30 mg may be used per burner after
31December 2011
4(b)-Ⅱ
155W < P ≤ 405 W
No limitation of use until 31December 2011;
40 mg may be used per burner after
31December 2011
4(b)-Ⅲ
P > 405 W
No limitation of use until 31December 2011;
40 mg may be used per burner after
31December 2011
note
Exemption
Code of
Article4(1)
4(c)
4(c)-I
Exemption
JIG Code
Scope and dates of applicability
Mercury in other High Pressure Sodium (vapour) lamps for
general lighting purposes not exceeding (per burner):
P ≤ 155 W
4(c)-Ⅱ
155W < P ≤ 405W
4(c)-Ⅲ
P > 405 W
No limitation of use until 31December 2011;
25 mg may be used per burner after
31December 2011
Hg-R-12 No limitation of use until 31December 2011;
30 mg may be used per burner after
31December 2011
No limitation of use until 31December 2011;
40 mg may be used per burner after
31December 2011
4(d)
Mercury in High Pressure Mercury (vapour) lamps (HPMV)
Hg-R-13 Expires on 13 April 2015
4(e)
Mercury in metal halide lamps(MH)
Hg-R-14
4(f)
Mercury in other discharge lamps for special purposes not
specifically mentioned in this Annex
Hg-R-15
4(g)
5(a)
5(b)
6(a)
6(b)
6(c)
7(a)
7(b)
Mercury in hand crafted luminous discharge tubes used for
signs, decorative or architectural and specialist lighting and
light-artwork, where the mercury content shall be limited as
follows:
Lead in glass of cathode ray tubes
Lead in glass of fluorescent tubes not exceeding 0,2% by
weight
Lead as an alloying element in steel for machining purposes
and in galvanised steel containing up to 0,35% lead by weight
Lead as an alloying element in aluminium containing up to
0,4% lead by weight
Copper alloy containing up to 4% lead by weight
Lead in high melting temperature type solders (i.e. leadbased
alloys containing 85% by weight or more lead)
Lead in solders for servers, storage and storage array
systems, network infrastructure equipment for switching,
signalling, transmission, and network management for
telecommunications
－
Pb-RE-5
Pb-RE-6
Pb-RE-3
Pb-R-1
Pb-RE-4
Pb-R-2
Pb-R-3
7(c)-I
Electrical and electronic components containing lead in a
glass or ceramic other than dielectric ceramic in capacitors,
e.g. piezoelectronic devices, or in a glass or ceramic matrix
compound
Pb-RE-7
7(c)-II
Lead in dielectric ceramic in capacitors for a rated voltage of
125 V AC or 250 V DC or higher
Pb-RE-8
7(c)-(III)
Lead in dielectric ceramic in capacitors for a rated voltage of
less than 125 V AC or 250 V DC
Expires on 1 January 2013 and　after that
Pb-RE-9 date may be used in spare parts for EEE placed
on the market before 1 January 2013
7(c)-(Ⅳ)
Lead in PZT based dielectric ceramic materials for capacitors
Pb-RE-12 Expires on 21 July 2016
being part of integrated circuits or discrete semiconductors
8(a)
Cadmium and its compounds in one shot pellet type thermal
cut-offs
Cd-R-7
8(b)
Cadmium and its compounds in electrical contacts
Cd-R-8
9
Hexavalent chromium as an anticorrosion agent of the
carbon steel cooling system in absorption refrigerators up to
0,75 % by weight in the cooling solution
Cr-R-2
9(b)
Lead in bearing shells and bushes for refrigerant-containing
compressors for heating, ventilation, air conditioning and
refrigeration (HVACR) applications
Pb-R-32
Expires on 1 January 2012 and　after that
date may be used in spare parts for EEE placed
on the market before 1 January 2012
May be used in spare parts for EEE placed on
the market before 24 September 2010
11(a)
Lead used in C-press compliant pin connector systems
Pb-RE-10
11(b)
Lead used in other than C-press compliant pin connector
systems
Expires on 1 January 2013 and after that date
Pb-RE-11 may be used in spare parts for EEE placed on
the market before 1 January 2013
12
13(a)
13(b)
Lead as a coating material for the thermal conduction module
C-ring
Lead in white glasses used for optical applications
Cadmium and lead in filter glasses and glasses used for
reflectance standards
Pb-R-5
Pb-R-30
Cd-R-9
May be used in spare parts for EEE placed on
the market before 24 September 2010
note
Exemption
Code of
Article4(1)
14
15
16
17
18(a)
Exemption
Lead in solders consisting of more than two elements for the
connection between the pins and the package of
microprocessors with a lead content of more than 80% and
less than 85% by weight
Lead in solders to complete a viable electrical connection
between semiconductor die and carrier within integrated
circuit flip chip packages
Lead in linear incandescent lamps with silicate coated tubes
Lead halide as radiant agent in high intensity discharge (HID)
lamps used for professional reprography applications
Lead as activator in the fluorescent powder (1 % lead by
weight or less) of discharge lamps when used as speciality
lamps for diazoprinting reprography, lithography, insect traps,
photochemical and curing processes containing phosphors
such as SMS ((Sr,Ba)2MgSi2O7:Pb)
JIG Code
Scope and dates of applicability
Pb-R-7
Expires on 1 January 2011 and after that date
may be used in spare parts for EEE placed on
the market before 1 January 2011
Pb-R-8
Pb-R-10
Pb-R-11
Pb-R-34
18(b)
Lead as activator in the fluorescent powder (1% lead by
weight or less) of discharge lamps when used as sun tanning
lamps containing phosphors such as BSP (BaSi2O5:Pb)
Pb-R-33
19
Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions
as main amalgam and with PbSn-Hg as auxiliary amalgam in
very compact energy saving lamps(ESL)
Pb-R-13
20
Lead oxide in glass used for bonding front and rear substrates
of flat fluorescent lamps used for Liquid Crystal Displays
(LCDs)
Pb-R-14
21
21
23
24
25
26
cadmium in printing inks for the application of enamels on
glasses, such as borosilicate and soda lime glasses
Lead in printing inks for the application of enamels on
glasses, such as borosilicate and soda lime glasses
Lead in finishes of fine pitch components other than
connectors with a pitch of 0,65 mm and less
Lead in solders for the soldering to machined through hole
discoidal and planar array ceramic multilayer capacitors
Lead oxide in surface conduction electron emitter displays
(SED) used in structural elements, notably in the seal frit and
frit ring
Lead oxide in the glass envelope of black light blue lamps
Expires on 1 September 2013
Expires on 1 January 2011
Expires on 1 June 2011
Expires on 1 June 2011
Cd-R-3
Pb-R-15
Pb-R-17
May be used in spare parts for EEE placed on
the market before 24 September 2010
Pb-R-18
Pb-R-35
Pb-R-20
Expires on 1 June 2011
27
Lead alloys as solder for transducers used in high-powered
(designated to operate for several hours at acoustic power
levels of 125 dB SPL and above) loudspeakers
Pb-R-21
Expired on 24 September 2010
29
Lead bound in crystal glass as defined in Annex I (Categories
1, 2, 3 and 4) of Council Directive 69/493/EEC
Pb-R-22
Cadmium alloys as electrical/mechanical solder joints to
electrical conductors located directly on the voice coil in
transducers used in high-powered loudspeakers with sound
pressure levels of 100 dB (A) and more
Lead in soldering materials in mercury free flat fluorescent
31
lamps (which,e.g. are used for liquid crystal displays, design or
industrial lighting)
Lead oxide in seal frit used for making window assemblies for
32
Argon and Krypton laser tubes
Lead in solders for the soldering of thin copper wires of 100
33
μm diameter and less in power transformers
34
Lead in cermet-based trimmer potentiometer elements
Lead in the plating layer of high voltage diodes on the basis of
37
a zinc borate glass body
Cadmium and cadmium oxide in thick film pastes used on
38
aluminium bonded beryllium oxide
Cadmium in colour converting II-VI LEDs (< 10 μg Cd per
39
mm2 of light-emitting area) for use in solid state illumination
or display systems
Cadmium in photoresistors for analogue optocouplers applied
40
in professional audio equipment
Lead in solders and termination finishes of electrical and
electronic components and finishes of printed circuit boards
used in ignition modules and other electrical and electronic
engine control systems, which for technical reasons must be
41
mounted directly on or in the crankcase or cylinder of handANNEX4 held
Exemption
list (classes SH:1, SH:2, SH:3 of
combustion engines
Directive 97/68/EC of the European Parliament and of the
Council (1)
30
Cd-R-4
Pb-R-23
Pb-R-24
Pb-R-25
Pb-R-26
Pb-R-27
Cd-R-6
Cd-R-10
Expires on 1 July 2014
Cd-R-11
Expires on 31 December 2013
－
note
N o.
Exem ption
Equipm ent utilising or detecting ionising radiation
1
Lead、cadm ium and m ercury in detectors for ionising radiation.
2
Lead bearings in X-ray tubes.
3
Lead in electrom agnetic radiation am plification devices:m icro-channelplate and capillary plate.
4
Lead in glass frit of X-ray tubes and im age intensifiers and lead in glass frit binder for assem bly of gas lasers and
for vacuum tubes that convert electrom agnetic radiation into electrons.
5
Lead in shielding for ionising radiation.
6
Lead in X-ray test objects.
7
Lead stearate X-ray diffraction crystals.
8
R adioactive cadm ium isotope source for portable X-ray fluorescence spectrom eters.
Sensors,detectors and electrodes
1a
Lead and cadm ium in ion selective electrodes including glass of pH electrodes.
1b
Lead anodes in electrochem icaloxygen sensors.
1c
Lead、cadm ium and m ercury in infra-red light detectors.
1d
M ercury in reference electrodes:low chloride m ercury chloride,m ercury sulphate and m ercury oxide.
O thers
9
C adm ium in helium -cadm ium lasers.
10
Lead and cadm ium in atom ic absorption spectroscopy lam ps.
11
Lead in alloys as a superconductor and therm alconductor in M R I.
12
Lead and cadm ium in m etallic bonds creating superconducting m agnetic circuits in M R I, SQ U ID , N M R (N uclear
M agnetic R esonance) or FTM S (Fourier Transform M ass Spectrom eter) detectors.Expires on 30 June 2021.
13
Lead in counterw eights.
14
Lead in single crystalpiezoelectric m aterials for ultrasonic transducers.
15
Lead in solders for bonding to ultrasonic transducers.
16
M ercury in very high accuracy capacitance and loss m easurem ent bridges and in high frequency R F sw itches and
relays in m onitoring and controlinstrum ents not exceeding 20 m g of m ercury per sw itch or relay.
17
Lead in solders in portable em ergency defibrillators.
18
Lead in solders of high perform ance infrared im aging m odules to detect in the range 8-14 μm .
19
Lead in Liquid crystalon silicon (LC oS) displays.
20
C adm ium in X-ray m easurem ent filters.
21
C adm ium in phosphor coatings in im age intensifiers for X-ray im ages until31 D ecem ber 2019 and in spare parts
for X-ray system s placed on the EU m arket before 1 January 2020.
22
Lead acetate m arker for use in stereotactic head fram es for use w ith C T and M R Iand in positioning system s for
gam m a beam and particle therapy equipm ent.Expires on 30 June 2021.
23
24
Lead as an alloying elem ent for bearings and w ear surfaces in m edical equipm ent exposed to ionising radiation.
Expires on 30 June 2021.
Lead enabling vacuum tight connections betw een alum inium and steelin X-ray im age intensifiers.Expires on 31
D ecem ber 2019.
25
Lead in the surface coatings of pin connector system s requiring nonm agnetic connectors w hich are used durably
at a tem perature below ? 20 °C under norm aloperating and storage conditions.Expires on 30 June 2021.
26
Lead in
- solders on printed circuit boards,
- term ination coatings of electricaland electronic com ponents and coatings of printed circuit boards,
- solders for connecting w ires and cables,
- solders connecting transducers and sensors,
that are used durably at a tem perature below .20 °C under norm aloperating and storage conditions.
Expires on 30 June 2021.
note
N o.
27
28
29
30
31
32
33
34
35
36
37
Exem ption
Lead in
- solders,
- term ination coatings of electricaland electronic com ponents and printed circuit boards,
- connections of electricalw ires,shields and enclosed connectors,
w hich are used in
(a) m agnetic fields w ithin the sphere of 1 m radius around the isocentre of the m agnet in m edical m agnetic
resonance im aging equipm ent,including patient m onitors designed to be used w ithin this sphere,or
(b) m agnetic fields w ithin 1 m distance from the external surfaces of cyclotron m agnets, m agnets for beam
transport and beam direction controlapplied for particle therapy.
Expires on 30 June 2020.
Lead in solders for m ounting cadm ium telluride and cadm ium zinc telluride digitalarray detectors to printed circuit
boards.Expires on 31 D ecem ber 2017.
Lead in alloys,as a superconductor or therm alconductor,used in cryo-cooler cold heads and/or in cryo-cooled
cold probes and/or in cryo-cooled equipotential bonding system s, in m edical devices (category 8) and/or in
industrialm onitoring and controlinstrum ents.Expires on 30 June 2021.
exavalent chrom ium in alkali dispensers used to create photocathodes in X-ray im age intensifiers until 31
D ecem ber 2019 and in spare parts for X-ray system s placed on the EU m arket before 1 January 2020.’
Lead, cadm ium and hexavalent chrom ium in reused spare parts, recovered from m edical devices placed on the
m arket before 22 July 2014 and used in category 8 equipm ent placed on the m arket before 22 July 2021,provided
that reuse takes place in auditable closed-loop business-to-business return system s,and that the reuse of parts
is notified to the consum er.Expires on 21 July 2021.
Lead in solders on printed circuit boards ofdetectors and data acquisition units for P ositron Em ission Tom ographs
w hich are integrated into M agnetic R esonance Im aging equipm ent.Expires on 31 D ecem ber 2019.
Lead in solders on populated printed circuit boards used in D irective 93/42/EEC class IIa and IIb m obile m edical
devices other than portable em ergency defibrillators.Expires on 30 June 2016 for class IIa and on 31 D ecem ber
2020 for class IIb.
Lead as an activator in the fluorescent pow der of discharge lam ps w hen used for extracorporeal photopheresis
lam ps containing B SP (B aSi2 O 5 :P b) phosphors.Expires on 22 July 2021.
M ercury in cold cathode fluorescent lam ps for back-lighting liquid crystaldisplays,not exceeding 5 m g per lam p,
used in industrialm onitoring and controlinstrum ents placed on the m arket before 22 July 2017.Expires on 21 July
2024.
Lead used in other than C -press com pliant pin connector system s for industrial m onitoring and control
instrum ents.
Expires on 31 D ecem ber 2020. M ay be used after that date in spare parts for industrial m onitoring and control
instrum ents placed on the m arket before 1 January 2021.
Lead in platinized platinum electrodes used for conductivity m easurem ents w here at least one of the follow ing
conditions applies:
(a)w ide-range m easurem ents w ith a conductivity range covering m ore than 1 order of m agnitude (e.g. range
betw een 0,1 m S/m and 5 m S/m ) in laboratory applications for unknow n concentrations;
(b)m easurem ents of solutions w here an accuracy of +/? 1 % of the sam ple range and w here high corrosion
resistance of the electrode are required for any of the follow ing:
(i) solutions w ith an acidity < pH 1;
(ii) solutions w ith an alkalinity > pH 13;
(iii) corrosive solutions containing halogen gas;
(c)m easurem ents of conductivities above 100 m S/m that m ust be perform ed w ith portable instrum ents.
Expires on 31 D ecem ber 2018.
38
Lead in solder in one interface of large area stacked die elem ents w ith m ore than 500 interconnects per interface
w hich are used in X-ray detectors of com puted tom ography and X-ray system s.
Expires on 31 D ecem ber 2019.M ay be used after that date in spare parts for C T and X-ray system s placed on the
m arket before 1 January 2020.
39
Lead in m icro-channelplates (M C P s) used in equipm ent w here at least one of the follow ing properties is present:
(a) a com pact size of the detector for electrons or ions,w here the space for the detector is lim ited to a m axim um
of 3 m m /M C P (detector thickness + space for installation of the M C P ), a m axim um of 6 m m in total, and an
alternative design yielding m ore space for the detector is scientifically and technically im practicable;
(b) a tw o-dim ensionalspatialresolution for detecting electrons or ions,w here at least one of the follow ing applies:
(i) a response tim e shorter than 25 ns;
(ii) a sam ple detection area larger than 149 m m 2;
(iii) a m ultiplication factor larger than 1,3 × 103.
(c) a response tim e shorter than 5 ns for detecting electrons or ions;
(d) a sam ple detection area larger than 314 m m 2 for detecting electrons or ions;
(e) a m ultiplication factor larger than 4,0 × 107.
The exem ption expires on the follow ing dates:
(a) 21 July 2021 for m edicaldevices and m onitoring and controlinstrum ents;
(b) 21 July 2023 for in-vitro diagnostic m edicaldevices;
(c) 21 July 2024 for industrialm onitoring and controlinstrum ents.
40
Lead in dielectric ceram ic in capacitors for a rated voltage of less than 125 V A C or 250 V D C for industrial
m onitoring and controlinstrum ents.
Expires on 31 D ecem ber 2020. M ay be used after that date in spare parts for industrial m onitoring and control
instrum ents placed on the m arket before 1 January 2021.
note
N o.
Exem ption
40
Lead in dielectric ceram ic in capacitors for a rated voltage of less than 125 V A C or 250 V D C for industrial
m onitoring and controlinstrum ents.
Expires on 31 D ecem ber 2020. M ay be used after that date in spare parts for industrial m onitoring and
controlinstrum ents placed on the m arket before 1 January 2021.
41
Lead as a therm al stabiliser in polyvinyl chloride (P V C ) used as base m aterial in am perom etric,
potentiom etric and conductom etric electrochem ical sensors w hich are used in in-vitro diagnostic m edical
devices for the analysis of blood and other body fluids and body gases.
Expires on 31 D ecem ber 2018.
42
M ercury in electric rotating connectors used in intravascular ultrasound im aging system s capable of high
operating frequency (> 50 M H z) m odes of operation.
Expires on 30 June 2019.
note