Journal of Material Cycles and Waste Management
Resource-availability scenario analysis for formal and informal recycling of end-of-life
electrical and electronic equipment in China
Habuer a, *, Jun Nakatani b, *, and Yuichi Moriguchi b
Address correspondence to the following:
a,
* Department of Global Ecology, Graduate School of Global Environmental Studies, Kyoto University
C-1-3-462 Nishikyo-ku, Kyoto 615-8540, Japan
TEL: +81-75-383-3339 / FAX: +81-75-383-3338
E-mail: ha.buer.6w@kyoto-u.ac.jp
b,*
Department of Urban Engineering, Graduate School of Engineering, The University of Tokyo
7-3-1 Hongo, Bunkyo-ku, Tokyo 113-8656, Japan
TEL: +81-3-5841-6255 / FAX: +81-3-5841-6255
E-mail: nakatani@env.t.u-tokyo.ac.jp
b
Department of Urban Engineering, the University of Tokyo
Supporting Information
Fig. S1 Market-share ratio of desktop and laptop PCs a
a: obtained through fitting with historical data; the desktop PC market-share ratio is underestimated believing it may
retain its 10% share over the entire PC market, at least until 2030
Fig. S2 Obsolete amount of CRT, LCD monitors, and main units of desktop PCs in China
Fig.S3 Annually generated common metal contents from EoL PCs
Fig.S4 Annually generated contents of less common metals from EoL PCs
Fig.S5 Inflow and outflow per unit weight of EoL CRT TV sets in option I
With environmental contaminants
land
space
residue
(0.6)
metallic parts
(14.4)
Cables
(4.2)
waste CRT TV
(100)
Process
md
Process
M_shr
process
M_ecs
Iron
(12.4)
Aluminum
(0.2)
Copper
(1.2)
plastic
(2.5)
copper
(1.8)
Parts
(9.4)
Process
M_gs
CRT
(42.5)
Process
process
M_es
Process
Rc &
Ru
General glass
(27.6)
Leaded glass
(14.8)
phosphor
(0.02)
Electronic
component
(1.0)
IC chips
and substrate
(7.9)
process B
PCBoard
(8.9)
M_c
Size-reduced
plastic (20.6)
Process
Lf
residue
(4.3)
plastic
(2.4)
Aluminum
(0.5)
copper
(0.5)
Ferrous
(0.3)
silver
(0.001)
gold
(3.E-5)
platinum
(2.E-4)
Fig.S6 Inflow and outflow per unit weight of EoL CRT TV sets in option II-b
With electricity consumption
land
space
plastic
(20.6)
Recycled or reused :
(iron 12.7;
Aluminum 0.6;
Copper 3.5;
Plastic 25.5;
General glass 27.6;
Land filled:
Leaded glass 14.8;;
Electronic component 1.0; (residue 4.9)
Silver 0.001;
Gold 3E-5;
Palladium 2.E-4)
Parts 9.4
Process
Rc
Fig.S7 Inflow and outflow per unit weight of EoL LCD TV sets in option I
With environmental contaminants
land
space
residue
(0.2)
metallic parts
(49.6)
Process
M_shr
Recycled or reused :
Iron
(45.3)
Aluminum
(4.0)
(iron 45.8;
Aluminum 4.6;
Copper 0.5;
Plastic 27.8;
LCD panel 10.2;
Electronic component 0.9;
Organic gas 3.1;
Silver 0.0003;
Land filled:
Gold 0.001;
(residue 5.7)
Platinum 0.001;
Tin 0.3;
zinc 0.2; etc.
process
Lf
Cables
(0.8)
waste LCD TV
(100)
Process
md
plastic
(0.5)
copper
(0.4)
process
M_ecs
Process
Rc &
Ru
&Er
LCD panel
(10.2)
plastic
(27.3)
residue (0.01)
Electronic
component
(0.9)
IC chips
and substrate
(10.2)
Organic
gas(3.1)
Process
Pyro
Copper alloy
(7.2)
Lead (0.01)
Bismuth (0.001)
Antimony (0.0001)
zinc (0.2)
Nickel (0.001)
Fig.S8 Inflow and outflow per unit weight of EoL LCD TV sets in option II-a
With electricity consumption
Process
process
M_es
Plastic (0.01)
Glass (0.9)
Aluminum (0.01)
Mercury (0.0003)
land
space
process
M_mr
residue
(5.5)
Aluminum
(0.6)
copper
(0.1)
Ferrous
(0.5)
silver
(0.003)
gold
(0.001)
palladium
(0.001)
Tin (0.3)
Rc
PCBoard
(11.2)
Size-reduced
plastic (27.3)
process Hydro
CCFL
(0.9)
Process
M_gs
land
space
residue
(0.2)
metallic parts
(49.6)
Cables
(0.84)
waste LCD TV
(100)
Process
md
Process
M_shr
Iron
(45.3)
Aluminum
(4.0)
plastic
(0.49)
copper
(0.35)
process
M_ecs
LCD panel
(10.2)
plastic
(27.3)
process
M_mr
process
M_es
process
Lf
Process
Rc &
Ru
Plastic (0.01)
Glass (0.9)
Aluminum (0.01)
Mercury (0.0003)
residue (0.01)
Electronic
component
(0.9)
IC chips and substrate
(10.2)
process B
PCBoard
(11.2)
Size-reduced
plastic (27.3)
(iron 45.8;
Aluminum 4.6;
Copper 0.5;
Plastic 30.9;
LCD panel 10.2;
Electronic component 0.9; Land filled:
(residue 6.2)
Silver 0.0003;
Gold 0.002;
Platinum 0.001)
residue
(6.0)
plastic
(3.1)
Aluminum
(0.6)
copper
(0.1)
Ferrous
(0.5)
silver
(0.0003)
gold
(0.002)
platinum
(0.001)
Fig.S9 Inflow and outflow per unit weight of EoL LCD TV sets in option II-b
With electricity consumption
land
space
CCFL
(0.9)
Process
M_gs
Recycled or reused :
Process
Rc
The abbreviations of processes are listed below:
md: Manual dismantling and separation
pM: Primitive (outdated) physical mechanical process
pM_hs: Hammer smashing
pM_hb: Heating board
M: Physical mechanical process (including shredding, packaging, axed cutting, eddy current separation, magnetic and
gravity separation)
M_shr: Shredding and packaging
M_gs: Shredding and gravity separation
M_es: Electronic component separation
M_c: Cutting and shredding
M_ecs: Shredding and eddy current separation
M_mr: Mechanical separation and mercury recovery
pC: Primitive chemical process
pPyro: Open burning
pHydro: Primitive hydrometallurgical process (such as acid leaching)
C: Chemical process
Pyro: Pyro metallurgical process
Hydro: Hydro metallurgical process
Od: Open dumping
Lf: Landfill disposal
Rd: Resale to downstream manufacture
Rc: Recycled
Ru: Reused
Er: Energy recovery
B: Physical process
Table.S1. Module composition and average PCs weight
Other non-ferrous metal
Total
Panel glass
Funnel glass
Outer panel
Inner panel
Drives (CPU, FDD,HDD)
Cold Cathode Fluorescent Lamps
(CCFLs)
Copper cable (wire)
Electronic component c
Weight (kg)
Copper metal
Printed circuit board (PCBoard)
Total (%)
Aluminum metal
Plastic material
Battery
Ferrous metal
Weight (%) of module b
63.0
_
0.2
_
63.2
2.8
19.0
_
_
_
_
13.7
_
_
0.9
0.4
100
10.1
LCD monitor
n.a
n.a
n.a
n.a
54.8
21.6
7.4
_
_
16.1
n.a
0.0
_
0.1
_
_
100
14.0
CRT monitor
4.0
_
_
0.0
4.0
18.0
12.0
40.3
21.7
_
_
_
_
_
4.0
_
100
24.3
16.0
2.4
_
_
18.4
27.7
14.7
_
_
13.3
_
10.0
13.9
0.05
1.0
0.9
100
2.9
Metallic material (metallic housing
etc.)
Type of PCs e
Desktop
PC
Main unit
Laptop PC
CRT glass d
LCD panel
b: The median values of collected data from published literature and technical reports [17, 19, 25–29]; c: capacitors, solder, resistance and diode etc. contained in PC Boards; d: by
assuming the percentages of panel and funnel glass 65% and 35% respectively according to [17, 18]; e: The numbers of individual data sets collected are 1 for Main unit, 7 for LCD
monitor, 10 for CRT monitor and 15 for Laptop PC. n.a: nonavailable; CRT: cathode ray tube, LCD: liquid crystal display.
Table S2. Substances’ contents in a desktop PC f
Major fraction
PC Board
(mg/kg)
Substance concentration in a desktop PC
Common metals
Less common metals
Al: aluminum
Cu: copper
Fe: iron
Sn: tin
Zn: zinc
Ni: nickel
Pb: lead
Ba: barium
18000
200000
13000
23000
2600
2563
19000
1900
178342
34630
281492
2344
20725
21396
1561
n.a
50
48
n.a
n.a
15861
n.a
380
570
5
n.a
n.a
134
Au: gold
220
18
Pd: palladium
145
29
Bi: bismuth
Co: cobalt
Sb: antinomy
Hg: mercury
Sr: strontium
Ag: silver
Precious metals
f:data from [17–19].
Drives
(mg/kg)
n.a: nonavailable
Table S3. Substances’ contents in laptop PC g
Substance concentration in a laptop PC
Common metal
Less common
metal
Precious metal
Major modules
LCD panel
Battery
(mg/Kg)
(mg/Kg)
PC Board
(mg/Kg)
CCFL
(mg/Kg)
Al: aluminum
17700
n.a
53000
n.a
Cu: copper
Fe: iron
Sn: tin
50825
37000
16500
175
n.a
n.a
87500
207500
n.a
n.a
n.a
n.a
Zn: zinc
15500
3
n.a
n.a
991
1848
773
115
2
13
60
n.a
n.a
n.a
n.a
n.a
n.a
n.a
n.a
n.a
Co: cobalt
Sb: antinomy
Hg: mercury
Sr: strontium
80
210
380
n.d
n.d
n.a
n.a
167000
n.a
n.a
n.a
n.a
n.a
300
n.a
Ag: silver
Au: gold
Pd: palladium
99
625
204
12
n.a
n.a
n.a
n.a
n.a
n.a
n.a
n.a
Ni: nickel
Pb: lead
Ba: barium
Bi: bismuth
g: data from [18, 25, 30–33]
n.a: nonavailable, n.d: nondetected.
Table S4.Characteristics of each group by cumulative metal contents and damage factors
Group
(G)
1
2
3
4
5
Cumulative metal
content (C)
large
middle
large
small
large
middle
middle
small
small
Damage factor
(D)
high
high
middle
high
low
middle
low
middle
low
Potential negative maximum impact
(C×D)
high
Middle-high
Middle-high
middle
middle
middle
middle-low
middle-low
low
Table S5. Summary of categorization of metals in EoL TV sets and PCs discarded in 2010-2030
Group
G1
G2
G3
G4
G5
Metals included in
Co in EoL TV sets
Ba in EoL TV sets
Zn, Sb, Co in EoL TV sets; Zn, Sb in EoL PCs
Cu in EoL PCs
Sb, Pb in EoL TV sets; Ba, Sb, Pb in EoL PCs
Fe, Zn, Ni, Ag, Sn, Pd, Au in in EoL TV sets;
Fe, Co, Zn, Ni, Ag, Sn in EoL PCs
Fe, Cu, Pb, Al, Sn, Ni, Ag, Bi, Pd, Au in EoL TV sets;
Fe, Cu, Pb, Al, Sn, Co, Ni, Ag, Bi in EoL PCs
Pb, Ba, Ni, Zn, Ag in EoL TV sets;
Pb, Co, Ni, Zn, Ag in EoL PCs
Cu, Ni, Zn, Hg in EoL TV sets;
Cu, Ni, Zn, Ag, Co in EoL PCs
Pb, Cu in EoL TV sets; Pb, Cu, Pd, Au in EoL PCs
Pd, Au in EoL PCs
Sn, Sb, Hg, Co in EoL TV sets; Ba, Sn, Sb in EoL PCs
Sn in EoL TV sets; Sn in EoL PCs
Co in EoL TV sets
Description
low positive incentive for resource availability (RA)
low positive incentive for resource recovery (MV)
high negative potential environmental impact (ED)
high negative potential environmental impact (HH)
middle-low positive incentive for resource availability (RA)
middle-low positive incentive for resource recovery (MV)
middle- high negative potential environmental impact (ED)
middle- high negative potential environmental impact (HH)
middle positive incentive for resource availability (RA)
middle positive incentive for resource recovery (MV)
middle negative potential environmental impact (ED)
middle negative potential environmental impact (HH)
middle-high positive incentive for resource availability (RA)
middle-high positive incentive for resource recovery (MV)
middle-low negative potential environmental impact (ED)
middle-low negative potential environmental impact (HH)
high positive incentive for resource availability (RA)
high positive incentive for resource recovery (MV)
low negative potential environmental impacts (ED)
low negative potential environmental impact (HH)