Smooth Cu Signal Integrity
Minutes of April 23, 2015
(11:00 AM Central)
Project Lead: Stephanie Moran, Oracle
Project Facilitator:
John Davignon, HDP User Group Facilitator
Next Meeting May 7, 2015 at 11:00 AM Central time
Meeting Agenda:
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Continue with task list and get resources and dates committed to them.
Finalize the Adhesion Promoter Candidate List
Meeting Attendees:
Stephanie Moran, Project Lead Oracle
Joe Smetana, Alcatel-Lucent
Trent Uehling, Freescale
John Davignon, HDP
Thomas Winkel, IBM
Bruce Chamberlin, IBM
Brian Butler, Introbotix
John Marshall. MacDermid
Karl Sauter, Oracle
Geoffrey Hazelett, Polar
Jim Fuller, Sanmina
Action Items:
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Brian will send his SPP coupon Design to Jim Fuller by the next meeting
Johnd will speak with Chris Katzko, TTM to see if he also wants to measure all the cores using
his Laser system. Completed
Each team member will send their choice of adhesion promoter/finish to Stephanie and Johnd so
we can make a list. The final decision will be closed at the May 7th meeting.
John will contact Jim Hartzell about Alpha chemistry support. Email sent 4/23/15
Johnd will send out an email to our PCB Fab members to ask which adhesion promoters have in
their shops and which could be candidates for our list.
Discussion Details:
Next meeting we need to finalize agreement on the following Implementation Phase needs: (Once
we have these agreed upon with names/dates we can move into the Implementation Phase and start the
pilot run.) Green denotes action has been fully or partially resourced.
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Smooth Cu Signal Integrity
1. Who will build all the cores we need for the testing? (Dana to contact WUS on this) NOTE:
Need to make sure that the cores are compatible with the various lamination shops who will finish
the cores. Post Etch Punch maybe the best tooling for us to use.
2. Who will be the single site to measure the roughness for all the cores? John Marshall,
MacDermid has volunteered to measure all cores using his Non-contact White Light Zygo.
Chris Katzko, TTM has volunteered to also measure using a Keyence LCSM (Laser light
microscope)
3. What metrology will be used for the single site roughness measurement? Non-contact White
Light Zygo – John Marshall, Mac Dermid / Non-Contact Keyence Laser Light LCSM –Chris
Katzko
4. Who will be the PCB shops and Chemistries we will evaluate?
5. Who will be the external Chemistry Suppliers and who will contact them for participation?
6. Who will be finishing the cores from the external Chemistry Suppliers?
7. Who will be the collections site for the finish routed panels/coupons? (One possibility is to have
the coupons directly shipped to each test site by the fabricator/supplier)
8. What naming/numbering system will we use?
9. Who will do the Thermal Shock Testing (Dan Korf has volunteered Huawei / Jim Fuller,
Sanmina to be back-up?)
10. Who will do the S3 Testing ( Scott Hinaga has volunteered Cisco, need a back-up)
11. Who will do the SPP Testing (Brian Butler has volunteered Introbotix / Polar is possible
back-up)
12. Who will do the Resistivity Testing (Karl has volunteered Oracle, need a back-up)
13. Who will collect and analyze the data?
14. Who will write the final Report/Presentation
Adhesion Promotion Candidates as of April 23, 2015
1. MEC Flatbond GT/GC (this is available from their R&D center in Japan in full 18x24" panel sizes)
2. Atotech Secure HFz (available from their Berlin, Germany R&D center, also in full 18x24" panel
size)
3. MacDermid Multibond MP, newer oxide alternatives specifically for Signal Integrity - M Speed HF
and M Speed NE.
4. Glicap, OMG
5. Bondfilm (Jim Fuller, Owego NY)
6. Alpha Prep (Jim Fuller, Owego NY)
Jim Fuller has the coupon data from both Stephanie and Scott and is waiting for Brian’s SPP coupon
design so he can layout the TV panel.
Brian confirmed the SPP design is Ok and that the stack ups match Scott's S3 design. Brian will have the
coupon sent to Jim by the next meeting.
Geoffrey asked if we were interested in adding a Set2DIL coupon to the board. The team said no at this
time.
Johnd will send out an email to our PCB Fab members to ask which adhesion promoters have in their
shops and which could be candidates for our list.
One option for skipping the collections site requirement is to have the fabricator/chemistry supplier ship
directly to the testers. We will keep this option open until we see how many adhesion promoters and
suppliers are involved.
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Next Meeting: May 7, 2015 at 11:00 AM Central Time
EOM
2/9/2016
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