ADDITIONAL TERMS AND CONDITIONS FOR
PROHIBITED PARTS,MATERIALS, AND PROCESS
REQUIREMENTS
THIS SUPPLEMENT IS TO BE USED ONLY IN ADDITION TO ATK PROCUREMENT
TERMS AND CONDITIONS. THIS SUPPLEMENT SHOULD NEVER BE USED IN A STANDALONE CAPACITY.
Seller shall certify that the articles delivered under this Contract conform to the
requirements set forth in the Procurement Order Specification and applicable Detail
Specification. The Seller shall submit with each shipment, a certification as to the
compliance to this document. The certification shall be dated and bear the signature
and title of an authorized representative of the Seller supplying the article(s).
1.0

Notification: In the event Seller becomes aware or suspects that it has prohibited
materials, parts, or processes the Seller shall immediately notify ATK Goleta.

Remedies: In the event that products delivered under this contract are, or include,
prohibited materials, parts, or processes that are listed below Seller shall promptly
investigate, analyze and report in writing to ATK Goleta whether such prohibited parts,
materials should be replaced conforming to the requirements of this contract, or whether
an alternative solution is recommended to meet the contract requirements at Seller’s
expense. The parties shall then agree upon the appropriate course of action.

Flowdown: Seller shall include this clause or reasonably equivalent provisions in all
subcontracts for the delivery of items that will be furnished to or included in products
furnished to ATK Goleta.
GENERAL
The following lists in general are prohibited for all parts and materials:
a. Pure Cadmium, Zinc or Selenium (high vapor pressure materials). The actual
acceptable percentages of zinc and cadmium in alloys or brazes and the extent of
over-plating, when required, shall be technically substantiated with data for the
intended applications and shall require ATK approval prior to use.
b. Constructions and finishes containing pure tin unless alloyed with a minimum of 3
weight percent lead (Note – Sn96Ag4, Sn95Sb5, Au80Sn20, are examples of alloys
containing tin that are not alloyed with lead, but are considered acceptable when
applied in certain applications). Tin plated wire is exempt from this prohibition if the
tin coating is applied prior to the extrusion or drawing process. Usage of tin plated
wire requires ATK approval. Solder coating over pure tin plated surfaces is not
acceptable without ATK approval.
c. Zinc chromate as a finish coat (acceptable if sealed or not on an exposed surface).
d. Mercury and compounds of mercury.
e. Materials that exhibit or are known to exhibit natural radioactivity (such as uranium,
potassium, radium, thorium, and/or any alloys thereof).
f. Corrosive silicone sealants, adhesives, or coatings (acetic acid evolving silicone).
ATK-FORM-346
Functional Mgr.:
Mike Eskenazi
Date:
02-01-2012
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ADDITIONAL TERMS AND CONDITIONS FOR
PROHIBITED PARTS,MATERIALS, AND PROCESS
REQUIREMENTS
g. Alloys with stress corrosion threshold in any grain direction less than 25 ksi.
h. Aluminum alloys 5083-H32, -H38; 5086-H34, -H38; or 5456-H32, -H38 where the
temperature will exceed 150°F.
i. Asbestos-containing adhesives, sealants, coatings, and encapsulants.
j. Any non-vented honeycomb core structures.
k. Non-hermetically sealed crystals.
l. Crimping solder coated wire of any type, and crimping solid conductors.
m. Alloy steel fasteners (as defined in FF-S-86; typically require an applied finish for
corrosion protection).
2.0
SEMICONDUCTORS
a. Die protection via organic materials without underlying passivation.
2.0
CAPACITORS
a. Aluminum electrolytic capacitors. Solid electrolytic capacitors should be used
instead.
b. Paper capacitors.
c. Metallized paper in molded case capacitors.
d. Glass capacitors with lead-to-foil weld, or radial leads, or CYR41, 42, 43, 51, 52 and
53 styles.
e. Mica capacitors with lead-to-foil weld, or radial leads, or CYR41, 42, 43, 51, 52, 53
styles.
f. Mica capacitors except MIL-C-87164 types.
g. Tantalum clad capacitors.
h. Metallized film with less than 2.0 microns of polycarbonate or 4.0 microns of
polypropylene film or with aluminum metal less than 99.9 percent pure.
i. Silver-cased electrolytic (wet slug) tantalum capacitors. Solid tantalum electrolytic
capacitors should be used instead.
j. Capacitors using base-metal electrodes (BME; oxygen vacancy issue)
k. Metallized Film Capacitors with no insulator between babbit terminations and end
seals (electrical shorting prevention).
l. Single-sealed CLR-style capacitors as identified by their compression seal dash
numbers.
3.0
CONNECTORS
a. Silver or silver-plating, as finish or as an underplate, on contacts or terminals.
b. Wire-wrap contacts.
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ADDITIONAL TERMS AND CONDITIONS FOR
PROHIBITED PARTS,MATERIALS, AND PROCESS
REQUIREMENTS
c. Use of center conductor of RF cable assemblies as pin contacts.
d. Non-captivated RF connector contacts.
e. RF cable assemblies using the cable center conductor as the mating-interface pincontact in the connector.
f. Plastic composite connectors exposed to atomic oxygen environment
g. Insulation Displacement Connection (IDC) wire terminations.
h. Lockwashers (split, internal tooth, external tooth, etc.). Lockwashers are normally
supplied with jackpost hardware kits and should be discarded.
i. Lubricants used on electrical contacts.
j. Open barrel crimp-contact terminations
k. Card edge connectors which use PWB pads (lands) as contacts
l. E-clips, C-clips, or snap rings for jackscrew hardware, on space-flight connectors
m. Crimping solder-dipped or tinned stranded or solid conductor wiring
n. Polyvinylchloride (PVC)
o. Polyamide (nylon) connector insert material and cable ties
p. Fuzz buttons
5.0
RELAYS
a. Relays containing coil wire sizes smaller than 44 AWG that do not require the
performance of a continuous coil continuity test during thermal shock.
6.0
RESISTORS AND THERMISTORS
a. All variable types.
b. Non-hermetic hollow core (glass or ceramic) or internal metallized film types.
c. Carbon film types (i.e., pyrolitic carbon film deposited on glass or ceramic core;
RCR, MILR39008)
d. Devices constructed with a deposited thin metal film (<350 angstroms) over a solid
core that do not have a protective undercoating between the metal film and the outer
jacket shall not be used (i.e., RLR, MIL-PRF-39017)
e. Aspect ratio (Length-to-Width) for chip resistors shall not be greater than 2:1
7.0
FILMS OVER SOLID CORES WITHOUT INITIAL UNDERCOATING
a. Silver or silver-palladium terminations without a barrier metallization.
b. Aluminum end-cap terminations without protective undercoating.
c. Film chips with film < 350 angstroms thick or with copper or nickel conductor films.
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ADDITIONAL TERMS AND CONDITIONS FOR
PROHIBITED PARTS,MATERIALS, AND PROCESS
REQUIREMENTS
d. Film networks with thick films, tantalum nitride films < 350 angstroms thick, nichrome
films or non-hermetic.
e. Thin film types without a corrosion-resistant protective coating over the metal film.
8.0
WIRE AND CABLE
a. MIL-W-16878 types.
b. All PTFE insulated wire or cable used in applications which have a high probability of
producing cold flow of the insulation.
c. All PVC insulated types.
d. Aluminum cable and insulated wire.
e. MIL-W-76, MIL-W-81044 types.
f. Tin and nickel-plated wire in crimped wire terminations.
g. Harness applications using wire smaller than 30 AWG (excluding magnetic and
microelectronic applications).
h. Wire smaller than 28 AWG used in external harnesses that is NOT beryllium copper
alloy CS95, 170, or 172 (does not apply to microelectronic and magnetic
assemblies).
9.0
RF AND EMI FILTERS
a. EMI or RFI filters with tubular ceramic elements.
b. Filters using capacitors with base metal electrodes (BME; oxygen vacancy issue)
10.0
SWITCHES
a. Slide types.
b. Thermoplastic materials.
11.0
PRINTED WIRING BOARDS
a. Hot Air Solder Leveling (HASL) finishes unless confirmed by Parts, Materials, and
Processes, Control Board (PMPCB) that solderability issues are a very low risk.
b. Immersion gold finishes on printed wiring board surfaces.
c. Weld repair of internal and external circuit traces on bare boards.
d. Eyelets or “Z-wire” type PWB structures.
e. Non-conformally coated populated PWBs unless conformal coating adversely affects
performance.
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