RIT graduate academic plan and checklist for Master of Engineering degree in Microelectronic
Engineering
Name (printed): ___________________ (signed) _____________________ Date: ______
University ID #: ___________________ Is this an initial plan ______ or a new plan _____?
Academic Advisor (printed): ___________________ (signed) _____________________ Date: ______
(See section III for internship and capstone experience)
Section I - course work:
This form is to be updated each semester!
Degree requirements consist of a total of 30 semester credit hours:
1) Eight – three semester credit courses (24 SCH)
2) Two semester credits of Seminar Research (2 SCH)
3) Four semester credits of Internship (4 SCH)
Year 1 – Fall Semester
Required Courses are in bold
MCEE-601 Microelectronic Fabrication
MCEE-605 Lithographic Materials and Processes
MCEE – 603 Thin Films
MCEE – 795 Research Methods
MCEE – xxx Graduate Elective
Total
Credits
3
3
3
1
3
13
Actual Courses
Credits
Year 1 – Spring Semester
Required Courses are in bold
MCEE-732 CMOS Manufacturing
MCEE-602 VLSI Process Modeling
MCEE – 515 Nanolithography
MCEE – 795 Research Methods
MCEE – xxx Graduate Elective
Total
Credits
3
3
3
1
3
13
Actual Courses
Credits
Actual Courses
Credits
Actual Courses
Credits
Summer
Required Courses are in bold
MCEE-77 Internship
Total
Credits
4
4
Year 2 – Fall
Required Courses are in bold
Credits
Total
Version Date: 6-26-15
page 1 of 4
Section II - Approved Graduate Elective Courses (other courses may be considered for approval):
Listed by topic areas:
Lithography
MCEE-615 Nanolithographic Systems (spring)
Semiconductor and Device Physics:
MCEE-713 Quantum and Solid State Physics
EEEE-713 Solid State Physics
MCEE-706 SiGe and SOI (spring, alternate years)
Photovoltaics and energy:
MCEE-620 Photovoltaic Science and Engineering
MCEE-740 Solid State Lighting
EEEE-546 Power Electronics
Manufacturing and yield:
MCEE-730 Metrology for Failure Analysis
Micro-electro-mechanical Systems:
MCEE-770 MEMS Fabrication
EEEE-787 MEMS Evaluation
EEEE-689 Fundamentals of MEMS
Electrical Engineering (includes but is not limited to):
EEEE-531 Biomed Sensors & Transducers I
EEEE-546 Power Electronics
EEEE-602 Random Signals and Noise
EEEE-603 Matrix Methods in EE
EEEE-610 Analog Electronics
EEEE-712 Advanced Field Effect Devices
EEEE-730 Advanced Analog IC Design
EEEE-766 Multivariable Modeling
Computer Engineering:
Version Date: 6-26-15
page 2 of 4
Imaging Science:
IMGS-616 Fourier Methods for Imaging
Microsystems:
MCSE-713 Lasers
CQAS (includes but is not limited to):
CQAS-621 Statistical Quality Control
CQAS-670 DOE for Process Improvement
CQAS-682 Lean Six Sigma Fundamentals
Materials Science:
MTSE-601 Materials Science
MTSE-617 Material Degradation
MTSE-702 Polymer Science
MTSE-703 Solid State Science
MTSE-704 Theory Meth Mat Sci & Eng
MTSE-780 Theory Microsensors & Actuators
Packaging:
Version Date: 6-26-15
page 3 of 4
Section III - Internship
Name of company you are doing your internship with: ______________________
Contact Name (printed): _____________________
Email: ______________________________ Phone number
Start Date: ______
End Date: ________
Program Director Approval
Name (printed): __________________________ (signed) _____________________ Date: ______
Internship Student Report Submitted: (Date) _______________
Internship Student Survey Submitted: (Date) _______________
Internship Employer Survey Submitted: (Date) _______________
Version Date: 6-26-15
page 4 of 4