Electrochemical Gas Sensors Graduate Research Project Mike Weimer ECEN 5004 – Digital Packaging Introduction Gas sensors used in several applications Detection of toxic vapors HCl Cl2 H2S O3 Explosives/narcotics detection Airport sensors (GE EntryScan3) Police/Government narcotics detection Nuclear detection at U.S. ports Radon / Natural Gas detection (Methyl Mercaptan) O2 sensors on automobiles ECEN 5004 – Digital Packaging Introduction – Automotive O2 Sensors Most widely used application Detects O2 concentration in exhaust stream Promotes cleaner burning fuel/air mixture Reduces overall pollution • Invented by Bosch (1976) • First used by Volvo (1976) • Introduced to U.S. (1980) • Required in Europe (1993) ECEN 5004 – Digital Packaging Introduction – Airport/Toxin Detection GE EntryScan3 Toxic Gas Sensors ECEN 5004 – Digital Packaging Introduction – Natural Gas Detection MythBusters ‘Flatus Catcher’ ECEN 5004 – Digital Packaging Introduction – Natural Gas Detection MythBusters captured and analyzed ‘flatus’ Employed a bathtub-based flatus catcher Flatus contained in a Flatulence Containment Unit (FCU) Methyl Mercaptan (CH4S) – Highly Toxic, Highly Smelly Methane (CH4) – Highly Flammable Hydrogen Sulfide (H2S) – Flammable and Toxic Proved though ‘toxic,’ flatus inhalation won’t kill you Proved flatus is flammable Proved ‘pretty girls’ do produce flatus ECEN 5004 – Digital Packaging Introduction – Natural Gas Detection Useful for Natural Gas furnaces and fireplaces Leak detection Particularly useful during sleep (not able to smell) Radon detection (carcinogen) No odor Responsible for 21,000 lung cancer deaths/yr (U.S.) Usual prevention is plastic sheeting ECEN 5004 – Digital Packaging Operation Incoming vapor reacts with surface or electrolyte Causes changes in current or resistance Current: FET-type devices (‘micro fuel cells’) Resistance: Film-based devices Anomalies in current/resistance concentration Multi-layered design for high sensitivity 1st Layer: Hydrophobic Membrane 2nd Layer: Electrodes 3rd Layer: Electrolyte ECEN 5004 – Digital Packaging Operation Typical Electrochemical Gas Sensor Structure ECEN 5004 – Digital Packaging Operation – Anodic Reactions CO + H2O CO2 + [CO]: 2H+ + 2e[H2S]: H2S + 4H2O H2SO4 + 8H+ +8e- [NO]: NO + 2H2O HNO3 + 3H+ + 3e- [H2]: H2 2H+ + 2e- [HCN]: 2HCN + Au HAu(CN)2 + H+ + eECEN 5004 – Digital Packaging Operation – Cathodic Reactions [O2]: [NO2]: O2 + 4H+ + 4e- 2H2O NO2 + 2H+ + 2e- NO + H2O [Cl2]: Cl2 + 2H+ + 2e- 2HCl [O3]: O3 + 2H+ + 2e- O2 + H2O ECEN 5004 – Digital Packaging Fabrication Thin films are becoming more prevalent Resistance measurement on film surface SnO2 films are widely used - high surface reactivity Chemical Vapor Deposition (CVD) Gas-phase technique Precursors introduced simultaneously Deposition is controlled by exposure time Films are granular and non-uniform ECEN 5004 – Digital Packaging Fabrication – CVD Films CVD Deposited SnO2 Film ECEN 5004 – Digital Packaging Fabrication – PVD Films Physical Vapor Deposition (PVD) Solid/Gas-phase technique Block of SnO2 heated to vaporization (thermal evap.) Films are irregular and non-uniform PVD Deposited SnO2 Film (Actual Journal image) ECEN 5004 – Digital Packaging Fabrication – Wet Chemistry Films Wet Chemical Deposition (WCD) a.k.a. ‘Sol-gel’ Substrate submersed in solution to form SnO2 WCD Deposited SnO2 Film (speaks for itself) ECEN 5004 – Digital Packaging Fabrication – ALD Films Atomic Layer Deposition (ALD) Conformal, uniformly-deposited SnO2 thin films Deposition rate precisely controlled ALD Deposited SnO2 Film (on Al nanoparticles) ECEN 5004 – Digital Packaging Fabrication – ALD Films ALD Deposited Al2O3 Film (on Ni particle) ECEN 5004 – Digital Packaging Fabrication – ALD Films Fluidized Bed ALD Reactor ECEN 5004 – Digital Packaging Fabrication – ALD Films Precursors introduced individually Prevent gas-phase reactions Usually deposited using SnCl4 + H2O2 SnOSnCl3* + HCl SnOH* + SnCL4 [A] SnCl* + H2O2 SnOH* + HCl + ½ O2 [B] Resulting SnO2 film deposits at ~0.1 nm/AB cycle Operates from 250 – 400 °C ECEN 5004 – Digital Packaging Fabrication – ALD Films Electrochemical gas sensors fabricated via ALD have superior electrical properties Uniform film deposition Uniform electrochemical properties Free of pinholes ECEN 5004 – Digital Packaging Packaging Considerations Sensor selectivity/sensitivity Environmental concerns Corrosive environment (metals) Oxidizing environment Humidity Temperature Electrolyte housing Chemical inertness of housing Sensor lifetime ECEN 5004 – Digital Packaging Packaging Considerations Surface Area Higher sensitivity = larger surface area Higher sensitivity = shorter lifetime Package Material Plastics (polyethylene, polypropylene) Chemically inert, inexpensive Metals (aluminum, tin) Lightweight, inexpensive, less porous Apparently several metals grow whiskers (even Al) Whisker growth inside package can alter sensitivity and cause false concentration reports ECEN 5004 – Digital Packaging Sn-plated Cu surface in need of a shave ECEN 5004 – Digital Packaging Packaging Considerations Typical gas sensor packages ECEN 5004 – Digital Packaging Typical Sensitivities * More corrosive/reactive gases tend to have higher sensitivity sensors ECEN 5004 – Digital Packaging Summary Electrochemical gas sensors widely available Toxic gas sensing, automotive applications Explosives sensing Flatus testing Thin film sensors are the next generation Atomic Layer Deposition (ALD) High sensitivities achievable with correct packaging Chemical inertness of housing Temperature/humidity variations Sensor lifetime ECEN 5004 – Digital Packaging Alliance, Nebraska