IBM Power SystemsTM
IBM Systems & Technology Group
POWER7™ Technical Excellence
and Announcement Highlights
Dale Scott, CTS
dlscott@us.ibm.com
© 2013 IBM
Corporation
IBM Power Systems
Power your planet.
+
AIX - the future of UNIX
Total integration with i
Scalable Linux ready
for x86 consolidation
Workload-Optimizing Systems
Virtualization without Limits
 Drive over 90% utilization
 Dynamically scale per demand
Dynamic Energy Optimization
 70-90% energy cost reduction
 EnergyScale™ technologies
Resiliency without Downtime
 Roadmap to continuous
availability
 High availability systems &
scaling
Management with Automation
 VMControl to manage
virtualization
 Automation to reduce task time
Smarter Systems for a Smarter Planet.
2
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
IBM Designs and Manufactures POWER
Industry Leader Technology and Architecture
POWER is pervasive
#1 UNIX systems market share worldwide
60% of World’s Fastest Computers (Top500)
50% of Automobiles worldwide
100% of top three game consoles (PS3, xBox360, Wii)
100% of systems on Mars
Wii
Playstation3
3
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7 Portfolio
Power 795
POWER7+
5 Feb POWER7+
Announcement
780
POWER7+
770
POWER7+
750 / 760
POWER7+
710/730
POWER7+
720/740
Power
775
IBM PureFlex
System
PS Blades
PowerLinux
7R1 / 7R2
p460
Power
755
p260+
p24L
4
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power Processor Technology Roadmap
POWER9
POWER8
POWER5/5+
130/90 nm
Dual Core
Enhanced Scaling
SMT
Distributed Switch +
Core Parallelism +
FP Performance +
Memory Bandwidth +
Virtualization
2004
5
POWER6/6+
65/65 nm
Dual Core
High Frequencies
Virtualization +
Memory Subsystem +
Altivec
Instruction Retry
Dynamic Energy Mgmt
SMT +
Protection Keys
2007
Power is performance redefined
POWER7/7+
45/32 nm
Eight Cores
On-Chip eDRAM
Power-Optimized Cores
Memory Subsystem ++
SMT++
Reliability +
VSM & VSX
Protection Keys+
2010
More Cores
SMT+++
Reliability ++
FPGA Support
Transactional Memory
(2014 – 2015)
More Threads/core
Wider Pipes to cores
Running now
Future
© 2013 IBM Corporation
IBM Power Systems
POWER7+
POWER7
45 nm
6
Power is performance redefined
POWER7+
POWER7
32 nm
© 2013 IBM Corporation
IBM Power Systems
POWER7+
POWER7
45 nm
POWER7+
POWER7
32 nm
Add additional Cache
7
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+
POWER7
45 nm
POWER7+
POWER7
32 nm
Add additional Cache
Add on Chip Accelerators
8
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ Design
Physical Design:
SMP Fabric
• 8 cores with integrated Cache, Memory
Controllers, and Accelerators
• 3 / 4 / 6 / 8 Core options
• 32nm technology
Features:
• 2.5X increase in L3 Cache
•eDRAM technology
•Higher Frequencies
• Memory Compression Engine
• Active Memory Expansion with less
processor overhead
• Encryption / Cryptography Support
• Random Number Generator
• Enhanced Energy / Power Gating
• 1/20 LPAR Core Granularity
• 2X SPFP performance
9
Power is performance redefined
Core
Core
L2
L2
L3 Cache
M
C
A
c
c
E
n
g
Core
Core
L2
L2
L3 Cache
M
C
Power Bus
L3 Cache
L2
Core
L2
Core
G
X
B
u
s
L3 Cache
L2
L2
Core
Core
SMP Fabric
© 2013 IBM Corporation
IBM Power Systems
Processor Designs
POWER5 POWER5+ POWER6
Technology
Size
Transistors
Cores
Frequencies
L2 Cache
130nm
389 mm2
276 M
2
1.65
GHz
1.9MB
Shared
36MB
90nm
245 mm2
276 M
2
1.9
GHz
1.9MB
Shared
36MB
L3 Cache
Memory
1
1
Cntrl
Architecture Out of Order Out of Order
10
LPAR
10 / Core
Power is performance
redefined 10 / Core
65nm
341 mm2
790 M
2
4-5
GHz
4MB / Core
32MB
2/1
In of Order
10 / Core
POWER7 POWER7+
45nm
32nm
567 mm2
567 mm2
1.2 B
2.1 B
8
8
3–4
3.6 – 4.4+
GHz
GHz
256 KB
256 KB
per Core
per Core
4MB / Core 10MB / Core
2/1
2/1
Out of Order Out of Order
10 / Core
20 / Core
© 2013 IBM Corporation
IBM Power Systems
Benefits of eDRAM for POWER7+
With eDRAM
Without eDRAM
2.1B Transistors
567 mm2
5.4B Transistors
950 mm2
IBM’s eDRAM Benefits:
 Greater density: 1/3 the space of 6T SRAM implementation
 Less power requirements: 1/5 the standby power
 Fewer soft errors: Soft Error Rate 250x lower than SRAM
 Better Performance
11
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ Encryption Accelerator
Technology
Client Benefits
 Crypto Offload
Accelerators:
o Provide cryptographic
engines to relieve the
POWER7+ processor from
the performance intensive
cryptographic algorithms of
AES, SHA, and RSA.
 Can be applied to a broader set of data
creating a stronger security ecosystem
 POWER7+ core focused on application
performance.
 Two primary AIX security applications:
1) Encrypted File Systems protecting
your data in storage or on backup media
2) IPsec protecting your data over the
network.
 High quality random
numbers:
o Generated with high
performance with the RNG
offload feature of the
POWER7+ processor.
 Ensures that the high demand for
entropy on a heavily loaded systems
always yields high quality random
numbers.
 RNG offload provides entropy and
security is ensured
 Processor performance focused on your
applications.
12
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ RAS Specific Features
New Power On Reset Engine (PORE)
 Enables a processor core to be re-initialized while
system remains up and running
 Directly used to:
Allow for Concurrent Firmware Updates: In
cases where a processor initialization register
value needs to be changed
L3 Cache dynamic column repair
 New self-healing capability that complements
cache line delete
 Uses PORE feature to substitute a failing bit-line
for a spare during run-time.
New Fabric Bus Dynamic Lane Repair
 POWER7+ has spare bit lanes that can
dynamically be repaired (using PORE)
For Busses that connect CEC drawers
Avoids any repair action or outage related to a
single bit failure.
13
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7 SMT4
Peak Characteristics
Requires POWER7 Mode
 POWER6 Mode supports SMT1 and SMT2
Operating System Support
 AIX 6.1 and AIX 7.1
 IBM i 6.1 and 7.1
 Linux
Dynamic Runtime SMT scheduling
 Spread work among cores to execute in
appropriate threaded mode
 Can dynamical shift between modes as
required: SMT1 / SMT2 / SMT4
LPAR-wide SMT controls
 ST, SMT2, SMT4 modes
 smtctl / mpstat commands”
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
SMT1
14
Power is performance redefined
SMT2
SMT4
© 2013 IBM Corporation
IBM Power Systems
Blades
15
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7 Single Wide Blades: PS700/PS701/PS703
PS700 4 Core
Architecture
Processor
DDR3
Memory
PS701 8 Core
PS703 16 Core
One 4 Core Socket
POWER7 @ 3.0 GHz
One 8 Core Socket
POWER7 3.0 GHz
Two 8 Core Sockets
POWER7 2.4 GHz
Up to 64 GB
Up to 128 GB
Up to 256 GB
DASD / Bays 0 - 1 SAS ( 300/600 GB ) 0 - 1 SAS ( 300/600 GB )
0 - 1 SAS (300/600 GB)
0 - 2 SSD ( 177 GB)
Daughter
CIOv & CFFh
Card Options PCIe Gen1 support
CIOv & CFFh
PCIe Gen1 support
CIOv & CFFh
PCIe Gen2 support
Integrated
Dual Port Gbt Ethernet
16
Options
IVE, SAS,redefined
USB
Power is performance
Dual Port Gbt Ethernet
IVE, SAS, USB
Dual Port Gbt Ethernet
© 2013 IBM
Corporation
No IVE, SAS,
USB
IBM Power Systems
POWER7 Double Wide Blades: PS702 & PS704
PS704
32 Core
PS702
16 Core
Architecture
Processor
DDR3
Memory
DASD / Bays
8 Cores/Socket Two
Sockets
POWER7 8-Core @ 3.0 GHz
Up to 256 GB
0 - 2 SAS ( 300/600 GB )
Daughter
CIOv & CFFh
Card Options PCIe Gen1 support
Integrated
Quad Port Gbt Ethernet
17Options
IVE, SAS,
USB
Power is performance
redefined
Architecture
Processor
DDR3
Memory
DASD / Bays
8 Cores/Socket Four
Sockets
POWER7 8-Core @ 2.4 GHz
Up to 512 GB
0 - 2 SAS ( 300/600 GB )
0 – 4 SSD ( 177 GB )
Daughter
CIOv & CFFh
Card Options PCIe Gen2 support
Integrated
Options
Quad Port Gbt Ethernet
No IVE, SAS, ©USB
2013 IBM Corporation
IBM Power Systems
710 to 740
18
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
More Performance –- Less Price
New POWER7+ Models Offer Significantly Improved
Price/Performance
Power 740
 21-42% Better
Power 720
 14-21% Better
Power 730
 49-60% Better
Power 710
 16-39% Better
Based on rPerf and USA prices.
Prices are subject to change without notice. Reseller prices can vary
19
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 4U 720/740 Advantages over Power 2U
710/730
Power model
Footprint
Add processor card
later if needed
SW tiers
Max Internal drives
12X I/O drawers
Disk only drawers
Max. GB memory
Internal tape
PCIe slots CEC max
PCIe slots max
PCI-X slots max 8
Same serial number
upgrades
CBU
IBM i Editions
Solution Editions
20
710 / 730
720 / 740
2U rack
+ no tower
4U rack
+ tower
no
No / Yes
same
6
No / Yes 1
Yes 3
256 / 512
Yes & No 5
6 6 LP 7
6 LP / 4 LP+20
FH
0
same
8
Yes 2
Yes 3
512 4 / 1024
Yes
6 6 FH +4LP
No
Yes / no
No
No
Yes 9
Yes
Yes / no
Yes
Power is performance redefined
24 2 / 44
26* / 48
24 / 48
Advantage
1. 730 has max of one 12X loop
2. 4-core supports zero 12X I/O drawer
3. 710 4-core and 720 4-core support
zero disk-only drawer
4. 4-core 720 has max of 64 GB
5. AIX/Linux can use HH bay for RDX
or DAT160, IBM i does not support
this bay
6. Five x8 PCIe slots and a 6th x4 PCIe
slot only for Ethernet adapter
7. LP (Low Profile) limits selection of
PCIe adapters, especially for PCIe
SAS adapters with write cache
8. PCI-X I/O drawer withdrawn from
marketing
9. AIX, but not IBM i
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 710 Express
✓1 Socket: Power 710
✓2U Form Factor
✓POWER7+
✓4, 6 or 8 cores
✓Up to 256 GB memory
✓5 PCIe x8 Gen2 Slots
✓6th PCIe x4 Gen2 slot for Ethernet
✓Single GX++ Slots
 Ultra SSD Drawer option
✓3 or 6 SFF Bays
 Optional add’l storage drawers
21
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 730 Express
✓2 Sockets: Power 730
✓2U Form Factor
✓POWER7+
✓4, 6 or 8 cores per socket
✓Up to 512 GB Memory
✓5 PCIe x8 Gen2 Slots
✓6th PCIe x4 Gen2 slot for Ethernet
✓Dual GX++ Slots
 12X PCIe Drawer option
 Ultra SSD I/O Drawer option
✓3 or 6 SFF Bays
 Optional add’l Storage drawers
22
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 710 and 730
Rperf 53.9 – 115.4
120.4 – 223.1
POWER7+
Architecture
Planar
DDR3 Memory
POWER7+ 710: 1S2U
POWER7+ 730: 2S2U
Power 730
Supports up to
320 LPARs
Power 710
Supports up to
160 LPARs
23
Power is performance redefined
SFF SAS Bays
PCIe Gen2 Expansion
Slots
Integrated
SAS/SATA Cntrl
GX++ Slots
Ethernet in 6th slot
FC # 2319 Support
Media Bays
12X PCIe Drawers *
HDD/SSD drawer *
Ultra SSD Drawer *
Virt Management
Redundant Power &
Cooling
EnergyScale
Warranty
Power 710
Power 730
8231-E1D
8231-E2D
4 Core @ 3.6 GHz
6 Core @ 4.2 GHz
8 Core @ 4.2 GHz
8 Core @ 4.3 GHz
12 Core @ 4.2 GHz
16 Core @ 3.6 GHz
16 Core @ 4.2 GHz
Single Socket
Dual Socket
4 / 8 / 16 / 32 GB DIMMs
4 / 8 / 16 / 32 GB DIMMs
8GB to 256GB
8GB to 512GB
Up to 6 HDD or SSD
Five x8 LP
One x4 LP (Ethernet Adapter)
Standard: RAID 0, 1, & 10
Optional: RAID 5 & 6
One
Two
Quad 10/100/1000
Yes
1 Slim-line & opptionally 1 Half Height
No
Yes / Max: 2
Max 4
Max 14
Max = 1/2
Max = 1
IVM or HMC
Optional
* 4-core 710 does not use these I/O drawers
Standard
TPMD
3 Years
© 2013 IBM Corporation
IBM Power Systems
Power 730 Remote IO Drawer option
FC 5802 or 5877
Model E2C
Single IB 12x Loop
 Requires FC # EJOG
Support for Two Remote IO Drawers
 FC # 5802 or FC # 5877
Total IO Adapter Slots: 24
 Four internal LP PCIe Gen2 slots
 One internal LP PCIe Gen2 slot ( Ethernet Adapter )
 Up to Twenty external PCIe Gen1 slots
24
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 720 Express
✓Single Socket:
✓4U Form Factor
✓POWER7+
✓4, 6 or 8 cores per socket
✓Up to 512 GB Memory
✓5 + 4 PCIe x8 Gen2 Slots
✓6th PCIe x4 Gen2 slot for Ethernet
✓One GX++ Slots
 12X PCI Drawer
 Ultra SSD I/O Drawer option
✓6 or 8 SFF Bays
 Optional add’l Storage drawers
✓Optional Split Backplane support on planar
25
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
520 / 720 Upgrade Paths Details
(same serial number)
POWER7
8202-E4B
POWER7
8202-E4C
POWER7+
8202-E4D
720
6/8-core
“B” model
720
6/8-core
“C” model
720
6/8-core
“D” mdoel
520 4-core
8203-E4A
POWER6
520 2-core
8203-E4A
POWER6
Notes:
• Same-serial-number upgrades from Power 720 to a newer Power 720 (Bto-C, B-to-D, or C-to-D) are not offered
• POWER6 9408-M25 to POWER6 8203-E4A conversions remain available
26
Power is performance redefined
IBM Confidential Until Announced
© 2013 IBM Corporation
IBM Power Systems
HA/DR Offering: CBU for i Power 720
IBM i processor license entitlement
Primary for 6/8-core (P10) = Power
720, 740, 750, 760, p260, p240, 520*
550* or 560*, PS70x, or JS23/4S
----------------------------------------Primary for 4-core (P05) = Power 720,
740, 750, p240, p260, 520*, 550*, 560* ,
PS70x, or JS23/43
* POWER6 5xx, not POWER5
Temporary transfer of unused
IBM i processor license
entitlement from primary to
CBU server
Temporary transfer of unused
IBM i user license
entitlements
Temporary transfers
5250 Enterprise Enablements
CBU Power 720
FC #0444
Prerequisites
New server order or upgrade into new model
from POWER6 520
Primary server must be a POWER7 or POWER6
server with equal or higher IBM i software tier.
Must purchase minimum of one IBM i processor
license entitlement for new CBU server
Registration of primary system and CBU is
required prior to CBU order being
manufactured
Note: No lower-priced hardware or
lower priced IBM i licensing –
savings is in transferability.
27
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 740 Express
✓Single or Dual Sockets
✓4U Form Factor
✓POWER7+
✓6 or 8 cores per socket
✓Up to 1 TB Memory
✓5 + 4 PCIe x8 Gen2 Slots
✓6th PCIe x4 Gen2 slot for Ethernet
✓Dual GX++ Slots
 12X PCI Drawer option
 Ultra SSD I/O Drawer option
✓6 or 8 SFF Bays
 Optional add’l Storage drawers
✓Optional Split Backplane support on planar
28
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
HA/DR Offering: CBU for i Power 740
IBM i processor license entitlement
Temporary transfers
Primary = 740, 750, 760
770, 550*, 560* or 570*
* POWER6 5xx, not POWER5
Temporary transfer of unused
IBM i processor license
entitlement from primary to
CBU server
Temporary transfer of unused
IBM i 5250 Enablement from
primary to CBU server
Note: no priced hardware,
savings in licensing and
5250 transfers
29
Power is performance redefined
5250 Enterprise Enablements
CBU Power 720
FC #0444
Prerequisites
New server order
Primary server must be a POWER7 or
POWER6 server with equal or higher IBM i
software tier.
Must purchase minimum of one IBM i
processor license entitlement for new CBU
server
If transfer 5250, must have at least one 5250
Enterprise Enablement on CBU server
Registration of primary system and CBU is
required prior to CBU order being
manufactured
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 720 / 740
*
Planar
Rperf 53.9 – 102.4
90.6 – 223.1
DDR3 Memory DIMMs
SAS SFF Bays
PCIe Gen2
Expansion Slots
Integrated SAS Controller
Power 720: 1S4U
Tower
30
Integrated Ports
Ethernet in 6th PCIe slot
Media Bays
I2X PCIe IO Drawers
12X PCI-X I/O Drawers
HDD/SSD-only drawer
EXP30 Ultra SSD Drawer
Virt Management
Redundant Power and
Cooling
EnergyScale
Warranty
Power is performance redefined
Power 740
8202-E4D
8205-E6D
4-core 3.6 GHz
6-core 3.6 GHz
8 core 3.6 GHz
POWER7+
Architecture
Power 720: 1S4U
Power 740: 2S4U
Power 720
1 or 2 x 6-core 4.2 GHz
1 or 2 x 8-core 3.6 GHz
1 or 2 x 8-core 4.2 GHz
Dual Socket
Single Socket
Single Socket option
4 / 8 / 16* / 32* GB
4 / 8 / 16 / 32 GB
4GB to 512* GB
4GB to 1 TB
Up to 6 or 8 HDD or SSD
Five x8 Full High (FH) (Base)
One x4 FH (Base) / Ethernet Adapter
Four x8 LP ( Optional)
Standard: RAID 0, 1, & 10
Optional: RAID 5 & 6
3 USB, 2 Serial, 2 HMC
Quad 10/100/1000
1 Slim-line & 1 Half Height
Max 2 **
Max 2 / 4
Supported **
Supported
Max 14**
Max 14
Max 1 **
Max 1 or 2
IVM & HMC
Optional
Standard
TPMD
3 Years
* max of 64GB memory on 4-core Power 720
** max zero drawers on 4-core Power 720
© 2013 IBM Corporation
IBM Power Systems
750 and 760
31
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Merging Power 770 & Power 740 = Power
750/760
Enterprise System features
Express System pricing
Quad Sockets
IO Subsystem
Power
760
Power
750
Power 770
Memory Architecture
RAS Features
Power 740
32
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ Power 750 / 760
New generation of Express/Enterprise Class servers
 Evolution of Power 750
 Provides more Core, more Memory, more IO bandwidth, etc.
Wide range of uses..
 Data Base
 ERP
 Server consolidation
Enterprise features
 40GB of Internal IO bandwidth
 Split Backplane support standard
 Six full size PCIe Gen2 slots with Blind swap support
 Blind swap PCIe adapter support
 Quad Socket processor design
 Memory Density options
CUoD support ( Power 760 )
Supports up to 640 / 960 LPARs
33
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Processor Offerings for Power 750 and Power
760
Cores
Sockets
1
2
3
4
Power 750
8
16
24
32
Power 760
12
24
36
48
Power 750
34
Power is performance redefined
Power 760
© 2013 IBM Corporation
IBM Power Systems
Power 750
✓POWER7+
✓ 8 Cores per Socket @ 3.5 & 4.0 GHz
✓Up to Four Sockets
✓Up to 32 Cores
✓Up to 1 TB of memory
✓6 PCIe Gen2 slots
✓6 SFF DASD/SSD Bays
✓Multifunction card w/ up to 4 10GbE ports
✓Enhanced RAS
✓Three year maintenance coverage
35
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 750
8408-E8D
POWER7+ Arch.
Up to 4 Sockets
DDR3 Memory
Capacity on Demand
SAS SFF Bays
Up to 32 Cores
4 Socket / 5U
Supports up to
640 LPARs
Rperf 104.5 – 397.7
3 Yr Maintenance
24 x 7
36
Power is performance redefined
IO Expansion Slots in
CEC
8-core DCM @ 4.0 GHz
8-core DCM @ 3.5 GHz
Up to 1 TB
N/A
Up to 6 HDD or SSD
Split Backplane support
PCIe x8: 6 Slots ( Hot Swap )
Dual GX++ Bus (with 2 or more DCM)
SAS ( Dual ) plus SATA
Integrated IO Cntrl
Standard RAID 0, 1, & 10
Optional RAID 5 & 6
IVM / HMC Support
Integrated Multifunction
Card (IMFC)
Integrated Ports
Media Bays
12X PCIe IO Drawers
EXP30 Ultra SSD Drawer
HDD/SSD-only drawer
Redundant Power
Redundant Cool
EnergyScale
Yes / Yes
(HMC optional)
4 Ethernet (Dual 10 Gb & Dual 1 Gb
or Quad 10Gb); 2 USB, 1 serial
1 USB, 2 HMC, 2 SPCN, plus IMFC
1 Slim-line for DVD
Max 4
(no PCI-X drawers)
Max 2
Max 51
Yes
Yes
Dynamic Energy Save & Capping
© 2013 IBM Corporation
IBM Power Systems
Power 760
✓POWER7+
✓12 Cores per Socket @ 3.1 & 3.4 GHz
✓Up to Four Sockets
✓Up to 48 Cores
✓Up to 2 TB of memory
✓6 PCIe Gen2 slots
✓6 SFF DASD/SSD Bays
✓Multifunction card w/ up to 4 10Gb E ports
✓Capacity on Demand for Processors
 Permanent activations
 Dynamic Processor Sparing
✓Enhanced RAS
✓Three year maintenance coverage
37
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 760
Up to 48 Cores
4 Socket / 5U
Supports up to
960 LPARs
Rperf 142.1 – 507.8
3 Yr Maintenance
24 x 7
38
9109-RMD
POWER7+ Arch.
Up to 4 Sockets
12-core DCM @ 3.4 GHz
12-core DCM @ 3.1 GHz
DDR3 Memory
Capacity on Demand
Up to 2 TB
Yes for Processors (Permanent only )
SAS SFF Bays
Up to 6 HDD or SSD
Split Backplane support
IO Expansion Slots in CEC
PCIe x8: 6 Slots ( Hot Swap )
Dual GX++ Bus (with 2 or more DCM)
SAS ( Dual ) plus SATA
Integrated IO Cntrl
Standard RAID 0, 1, & 10
Optional RAID 5 & 6
IVM / HMC Support
No / Yes
Integrated Multifunction
Card (IMFC)
4 Ethernet (Dual 10 Gb & Dual 1 Gb or
Quad 10Gb); 2 USB, 1 serial
Integrated Ports
Media Bays
12X PCIe IO Drawers
EXP30 Ultra SSD Drawer
HDD/SSD-only drawer
1 USB, 2 HMC, 2 SPCN, plus IMFC
1 Slim-line for DVD
Max 4
(no PCI-X drawers)
Max 2
Max 51
Redundant Power
Redundant Cooling
Yes
Yes
EnergyScale
Dynamic Energy Save & Capping
Power is performance redefined
(HMC required)
© 2013 IBM Corporation
IBM Power Systems
New Power 760 delivers Processor Upgrade On Demand
-Seamless capacity for non-disruptive growth
 Benefits from Processor Upgrade on Demand
CoD offers non-disruptive growth capability
CoD offers the ability to quickly add additional processing capability
CoD enhances system reliability by providing processor sparing
CoD provides system growth even after processors have been withdrawn
CoD offers more granular price points, to match your needs and your growth
Inactive cores are not subject to maintenance
Inactive cores are not subject to PowerVM licensing
 Power 760 Processor Upgrade on Demand
Offered for both processor frequencies
Starts with just 8 active cores per system
Grows in increments of one processor core
Minimum activations consistent for all configurations
39
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 750 / 760 I/O Differences to
Remember
 Unlike POWER7 750 or POWER7/POWER7+ 770, No PCI-X
slots
 Thus no SCSI I/O
 Can’t migrate older PCI-X drawers to 750/760
 Unlike POWER7 750, need two or more processor sockets
filled for any GX++ capability
 1 DCM = 0 GX++ slots usable
 2-4 DCM = 2 GX++ slots usable
40
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 750 / 760 Systems
Sockets
Cores
Frequencies
Maximum Memory
GX slots
PCI slots
MultiFunction
Ethernet ports *
SFF SAS bays
Integrated split
backplane
LPARs
Height
Installation
CoD
Software Tier
HMC
41
POWER7 750
POWER7+ 750
POWER7+ 760
4
32
3.2 – 3.6 GHz
512 GB
1 GX++ &
1 shared GX
2 PCIx &
3 PCIe Gen1
Four 1Gb
or two 10Gb
6/8
4
32
3.5 – 4.0 GHz
1 TB
4
48
3.1 – 3.4 GHz
2 TB
2 GX++
2 GX++
6 PCIe Gen2
6 PCIe Gen2
Two 10Gb CNA + Two
10/1 Gb
6
Two 10Gb CNA + Two 10/1
Gb
6
No
Yes
Yes
10 per core
4U
Customer Set-Up
N/A
Small
Optional
20 per core
5U
Customer Set-Up
N/A
Small
Optional
20 per core
5U
IBM installed
Processor on Demand
Medium
Required
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ Performance
1400
1200
1000
800
600
400
200
0
710 / 720
730 / 740
750
760
770
780
rPerf ratings charted. If CPW ratings charted, the bars show the same scaling.
42
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 750 / 760 Performance …
Power 595
POWER5+
64 Core
@ 2.3 GHz
Power 570
POWER6
16 Core
@ 5.0 GHz
Power 750
POWER7+
32 Core
@ 4.0 GHz
Power 760
POWER7+
48 Core
@ 3.4 GHz
rPerf ratings charted. If CPW ratings charted, the bars show the same scaling.
43
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
HMC V7 R7.7.0 (1H 2013) Highlights
 Server Management
– POWER7+ 710 / 720 / 730 / 740 / 750 / 760
 Virtualization Management
– Mobility
• Performance improvement for Live Partition Migration
– Usability
• GUI for VIOS install
 Console Management
– Browser currency
– Security currency
– Update of expired user password for Kerberos authenticated users
– Remove support for 7315-C04, 7315-CR2, 7310-CR2
– V7.8.0 4th Q 2013, significant enhancements
FYI: POWER7 Servers which currently are not planned to be provided
7.6 or later Firmware levels. (Fixes continued to be provided.)
• Power 710/720/730/740 “B” or “C” models
• Power 750 “B” model
• Power 755 “C” model
• Power 770/780 “B” models
• Power Blades
44
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
AIX Operating System Support
AIX V7.1 TL00: Statement of Direction
May 31, 2013
AIX V7.1 TL01: Statement of Direction
May 31, 2013
AIX V7.1 TL02: Service Pack 2, or later
AIX V6.1 TL08: Service Pack 2, or later
AIX V6.1 TL07: Service Pack 7, or later
Planned availability March 29, 2013
AIX V6.1 TL06: Service Pack 11, or later
Planned availability March 29, 2013
AIX V5.3 TL12: Statement of Direction
May 31, SP8
Announced as being available now or soon
45
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
IBM i Operating System Support
IBM i 7.1, or later
IBM i 6.1.1 with machine code 6.1.1, or later
NOTE: on POWER7+ servers 6.1 is supported as a CLIENT partition
accessing all I/O through either IBM i 7.1 or through VIOS without
additional charge
For a modest additional charge, FC # EB34: IBM i 6.1.1 Native IO
Enablement on the Power 710/720/730/740 adds native 6.1 I/O access
Without #EB34, IBM i 6.1 can not be ordered as the primary OS with
FC #2145 & #0566
SAN Load Source Specify
Boot from SAN (FC #0837)
Optional Load Source Specify
System Console - Internal LAN (FC #5553)
46
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Linux
SUSE Linux Enterprise Server 11 Service Pack 2, or later
With current maintenance updates available from SUSE to enable all planned
functionality.
SOD for Red Hat Executive Linux:
Red Hat intends to continue to work with Red Hat to provide support for the new Power 710 (8231-E1D), PowerLinux 7R1 (8246-L1D, 8246-L1T),
Power 720 (8202-E4D), Power 730 (8231-E2D), PowerLinux 7R2 (8246-L2D, 8246-L2T), Power 740 (8205-E6D), Power 750 (8408-E8D), and
Power 760 (9109-RMD) with an upcoming Red Hat Enterprise Linux 6 release. For additional questions about the availability of this release and
supported hardware servers, consult the Red Hat Hardware Catalog at
https://hardware.redhat.com
RHEL 6 PRE-INSTALL FEATURE FOR POWER 710, 720, 730, 740, 750, 760, AND POWERLINUX 7R1, 7R2
IBM intends to provide support for pre-install of an upcoming Red Hat Enterprise Linux 6 release on the new Power 710 (8231-E1D), PowerLinux
7R1 (8246-L1D, 8246-L1T), Power 720 (8202-E4D), Power 730 (8231-E2D), PowerLinux 7R2 (8246-L2D, 8246-L2T), Power 740 (8205-E6D),
Power 750 (8408-E8D) and Power 760 (9109-RMD) systems.
Information concerning Red Hat Enterprise Linux was obtained from Red Hat. Questions concerning Red Hat Enterprise Linux should be directed
to Red Hat, as Red Hat Enterprise Linux is not an IBM product. Red Hat Enterprise Linux is sold or licensed, as the case may be, to users under
Red Hat's terms and conditions. Availability and support is the responsibility of Red Hat. IBM IS NOT LIABLE AND MAKES NO WARRANTIES,
EXPRESSOR IMPLIED, REGARDING RED HAT ENTERPRISE LINUX, INCLUDING BUT NOT LIM3 ITED TO ANY IMPLIED WARRANTIES
OR CONDITION OF MERCHANTABILITY AND FIT- 3 NESS FOR A PARTICULAR PURPOSE. Moreover, all statements regarding IBM's or
Red Hat's future direction and intent are subject to change or withdrawal without notice, and represents goals and objectives only. Information
regarding potential future third-party products that may work 3 with an IBM product should not be relied on in making a purchase decsion. The
information mentioned regarding potential future third-party products is not a commitment, promise, or legal obligation to deliver 3 any material,
code or functionality. Information about potential future third-party products may not be incorporated into any contract. The development,
release, and timing of any future features or functionality 3 described for IBM or Red Hat products remains at IBM's or Red Hat's sole discretion,
as applicable.
47
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
VIOS Support
VIOS 2.2.2.2
VIOS 2.2.1
SOD
SOD:
VIOS 2.2.1 SUPPORT FOR POWER 710, 720, 730, 740, 750, 760, POWERLINUX 7R1, AND POWERLINUX 7R2
IBM intends to provide to those customers with VIOS 2.2.1 the ability to run that environment on the new Power 710 (8231E1D), PowerLinux 7R1 (8246-L1D, 8246-L1T), Power 720 (8202-E4D), Power 730 (8231-E2D), PowerLinux 7R2 (8246-L2D,
8246-L2T), Power 740 (8205-E6D), Power 750 8408-E8D) and Power 760 (9109-RMD).
IBM's statements regarding its plans, directions, and intent are subject to change or withdrawal without notice at IBM's sole
discretion. Information regarding potential future products is intended to outline our general product direction and it should not
be relied on in making a purchasing decision. The information mentioned regarding potential future products is not a
commitment, promise, or legal obligation to deliver any material, code, or functionality. Information about potential future
products may not be incorporated into any contract. The develop ment, release, and timing of any future features or functionality
described for our products remains at our sole discretion.
48
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
rPerf
GHz (#core/socket) : rPerf (# core)
POWER7+ 710
3.6 GHz (4): 53.9 (4)
4.2 GHz (6): 90.6 (6)
4.2 GHz (8): 115.5 (8)
POWER7+ 720
3.6 GHz (4): 53.9 (4)
3.6 GHz (6), 79.5 (6),
3.6 GHz (8): 102.4 (8)
POWER7+ 730
4.3 GHz (4): 120.4 (8),
4.2 GHz (6): 176.6 (12),
3.6 GHz (8): 197.7 (16)
4.2 GHz (8): 223.1 (16)
POWER7+ 740
4.2 GHz (6): 90.6 (6), 176.6 (12)
3.6 GHz (8): 102.4 (8), 197.7 (16)
4.2 GHz (8): 115.5 (8), 223.1 (16)
POWER7+ 750
3.5 GHz (8): 104.5 (8), 197.0 (16), 275.9 (24), 354.9 (32)
4.0 GHz (8): 117.1 (8), 220.7 (16), 309.2 (24), 397.7 (32)
POWER7+ 760
3.1 GHz (12): 142.1 (12), 264.8 (24), 370.7 (36), 476.7 (48)
3.4 GHz (12): 151.4 (12), 282.1 (24), 395.0 (36), 507.8 (48)
49
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
CPW
GHz (#core/socket) : CPW (# core)
POWER7+ 710
3.6 GHz (4): 28,400 (4)
4.2 GHz (6): 49,400 (6)
4.2 GHz (8): 64,500 (8)
POWER7+ 720
3.6 GHz (4): 28,400 (4)
3.6 GHz (6), 42,400 (6),
3.6 GHz (8): 56,300 (8)
POWER7+ 730
4.3 GHz (4): 59,700 (8)
4.2 GHz (6): 89,200 (12),
3.6 GHz (8): 104,700 (16)
4.2 GHz (8): 117,600 (16)
POWER7+ 740
4.2 GHz (6): 49,000 (6), 91,700 (12)
3.6 GHz (8): 56,300 (8), 106,500 (16)
4.2 GHz (8): 64,500 (8), 120,000 (16)
POWER7+ 750
3.5 GHz (8): 52,000(8), 96,000(16), 141,500(24), 185(32)
4.0 GHz (8): 59,000(8), 108,000(16), 158,000(24), 208,000(32)
POWER7+ 760
3.1 GHz (12): 69,800(12), 129,000(24), 194,700(36), 258,000(48)
3.4 GHz (12): 75,200(12), 137,000(24), 209,000(36), 274,000(48)
50
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+
770 / 780
51
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 770
✓POWER7+
✓Frequencies:
 4C SCM @ 3.8 GHz
Max Config:64 Cores
 3C SCM @ 4.2 GHz
Max Config: 48 Cores
✓Up to 64 Cores
✓Up to 4 TB of memory
✓6 PCIe Gen2 slots / CEC
✓MultiFunction Card with 10GbE and 1GbE
✓Capacity on Demand
✓Enhanced RAS
4Socket / 4U
16-core or 12-core / 4U
55
 Self-healing capability for L3 Cache functions
 Core re-initialization (Running system)
 Dynamic Processor Fabric Bus repair
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 780
✓POWER7+
✓Frequencies:
 8C SCM @ 3.7 GHz Max Cores: 128 Cores
 4C SCM @ 4.4 GHz Max Cores: 64 Cores
✓Up to 128 Cores
✓Up to 4 TB of memory
✓6 PCIe Gen2 slots / CEC
✓MultiFunction Card with 10GbE and 1GbE
✓Enhanced Capacity on Demand options
✓Enhanced RAS
4Socket / 4U
32-core or 16-core / 4U
56
 Self-healing capability for L3 Cache functions
 Core re-initialization (Running system)
 Dynamic Processor Fabric Bus repair
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 770(MMC) / 780(MHC) Diagram…..
Inter Node Buses
DRAM
DRAM
DRAM
DRAM
A/B Buses
8 SN
Dimms
DRAM
X Bus
Y Bus
Z Bus
DRAM
DRAM
DRAM
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
POWER7
DRAM
DRAM
DRAM
POWER7
8 SN
Dimms
DRAM
DRAM
DRAM
DRAM
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PSI
CPU CARD
P7IOC
Hub
FSP
Card
A/B Buses
DRAM
TPMD
GX++
Busses
GX++
Busses
GX++
GX++
12X IB
12X IB
I/O
Backplane
P7IOC
Hub
PCIe
PSI
Write Cache
SAS
EXP
SAS
EXP
PCIe
2 x HMC
Write Cache
SATA
Media
DASD Backplane
Serial
USB
Gen2
Slots
57
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
P
C
I
e
Anchor
Card
Power is performance redefined
Serial USB
Ext
SAS
RAID
RAID
Battery Battery
Ethernet
2x 1Gbt & 2x 10Gbt
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 770 / 780 Quad Socket Planar…..
TPMD
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
SN
SN
SN
SN
SN
SN
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
SN
SN
SN
SN
SN
SN
SN
SN
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
PWR7+
PWR7+
PWR7+
PWR7+
PS
PS
I
I
GX++
Busses
GX++
Busses
P7IOC
Hub
P7IOC
Hub
FSP
Card
USB
P
C
I
e
EXP
SAS
EXP
SATA
PCIe
Buses
P
C
I
e
SAS
Write Cache
PCIe Buses
P
C
I
e
12X IB
PCIe x8
12X IB
PCIe x8
Write Cache
PCIe
P
C
I
e
GX++
GX++
I/O
Backplane
PCIe
2 x HMC
CPU
CARD
P
C
I
e
P
C
I
e
Media
DASD Backplane
Serial
Anchor
Card
Ext
SAS
RAID
Battery
RAID
Battery
USB Serial
Ethernet
2 x 1Gbt & 2 x 10Gbt
58
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ 770 / 780 Top View
Memory
R
E
G
U
L
A
T
O
R
59
R
E
G
U
L
A
T
O
R
POWER7+
Socket 0
R
E
G
U
L
A
T
O
R
POWER7+
Socket 2
Power is performance redefined
Memory
R
E
G
U
L
A
T
O
R
R
E
G
U
L
A
T
O
R
R
E
G
U
L
A
T
O
R
POWER7+
Socket 3
R
E
G
U
L
A
T
O
R
Memory
POWER7+
Socket 1
R
E
G
U
L
A
T
O
R
© 2013 IBM Corporation
IBM Power Systems
POWER7+ System Upgrades….
Power 570 & 770 systems can upgrade to POWER7+
POWER7 780
9179-MHC
POWER7 780
POWER7+ 780
9179-MHB
9179-MHD
POWER6 570
9117-MMA
POWER7 770
9117-MMC
POWER7 770
POWER7+ 770
9117-MMB
9117-MMD
POWER6 570
9117-MMA
9406-MMA converted to 9117-MMA
62
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
795
64
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
795 Hardware Oct Announcements
2X Max Memory
Now up to 16 TB
PCIe Gen2
Two new GX++ Adapters
16Gb Fibre Channel
10Gb FCoE / CNA
RoCE support (RDMA over
Converged Ethernet)
65
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
Power 795
Power 795
MTM 9119-FHB
Rperf
2732978
Architecture
L2 & L3 Cache
DDR3 Memory
DASD / Bays
Book Interconnect
GX++ Bus
Media Bays
Remote IO Drawers
LPARs
Redundant
Power & Cooling
Hot Maintenance
Cooling
Redundant Clock
Power / Thermal
(TPMD)
67
Power is performance redefined
Up to 32 Sockets ( Max 256 Cores)
4 TurboCore / 8 Max Core & 6 Core
On Chip
Up to 16 TB
Remote I/O Drawer
( SAS / SSD )
Point to Point
4 per System Book
Max: 32 ( 8 Nodes )
Media drawer
1 – 32 drawers
Up to 254
Yes
Yes
Air
Yes
Advanced Energy Scale
Optional DC power
© 2013 IBM Corporation
IBM Power Systems
Availability / Reliability by Design for POWER7
Dual Clocks
770/780/795
Operating System
Hot patch Kernel
Storage Keys
Concurrent Add: 770/780
Eliminates Upgrade outages
Hot Plug / Removal
Fans & Power Supplies
Concurrent Service 770/780
Eliminates Repair Outages
Hot Plug / Removal
PCI-X & PCIe Adapters
IO Drawers
Passive backplane
No active components
Hot Plug / Removal
Disks
First Failure Data Capture
Help eliminates intermittent failures
Hot Add
I/O racks
Memory
Chip Kill technology
with Bit-steering
68
Processors
Dynamic De-Allocation
Packaging
Instruction Retry
Alternate Processor Recovery
Power is performance redefined
Hypervisor
Mainframe technology
Mobility
Partition Mobility
WPAR Mobility
© 2013 IBM Corporation
IBM Power Systems
POWER7+ Deliver more Performance per Watt
>5X increase in performance per watt over POWER6+
>10X increase in performance per watt since POWER5+
rPerf per KWatt *
>10 years of changing the server landscape
POWER4 POWER4+ POWER5 POWER5+ POWER6 POWER6+ POWER7 POWER7+
p670
570
p670
570
Power 570 Power 570 Power 780 Power 780
1.5 GHz 1.65 GHz 1.9 GHz
1.1 GHz
4.7 GHz
4.2 GHz
3.8 GHz
3.7 GHz
KWatts: KWatts: 6.7 KWatts: 5.2 KWatts: 5.2 KWatts: 5.6 KWatts: 5.6 KWatts: 6.9 KWatts: 7.7
6.7
* rPerf values used, CPW would be similar
69
Power is performance redefined
© 2013 IBM Corporation
IBM Power Systems
POWER7+ RAS Feature Overview
RAS Item
Redundant / Hot Swap Fans & Blowers
Hot Swap DASD & Media
/
PCI Adapters
● Standard
◙ Optional
▬ Not Available
Power
Blades
Power
710 / 730
Power
720 / 740
Power
750
● ( BC )
●
●
●
▬
●
●
▬
●
▬
●
● ( BC )
●
●
▬
▬
PowerVM™/Live Part. Mobility/Live App Mobility
●
●
●
◙
●
●
●
◙
●
●
◙
●
●
●
◙
Redundant Service Processors
▬
▬
▬
▬
Redundant System Clocks
▬
▬
▬
▬
Redundant / Hot Swap Power Regulators
▬
▬
▬
▬
Dynamic Processor Sparing
▬
▬
▬
▬
Memory Sparing
▬
▬
▬
▬
Hot GX Adapter Add and Cold Repair
▬
▬
▬
▬
Hot-node Add / Cold-node Repair
▬
▬
▬
▬
Hot-node Repair / Hot-memory Add
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
▬
Concurrent Firmware Update
Redundant / Hot Swap Power Supplies
Dual disk controllers (split backplane)
Processor Instruction Retry
Alternate Processor Recovery
Storage Keys
Dynamic Service Processor &System Clock Failover
Hot-node Repair / Hot-memory Add for all
nodes**
Enterprise Memory
Hot GX Adapter Repair
70
Midplane Power
connection
inter-nodal communication
isforperformance
redefined
●
◙
◙
●
●
●
◙
●
▬
▬
© 2013 IBM Corporation
▬
IBM Power Systems
● Standard
◙ Optional
▬ Not Available
POWER7+ RAS Feature Overview
Power
750+
Power
760+
Power
770+
Power
780+
Power
795
Hot-node Repair / Hot-memory Add
●
●
●
●
●
●
●
●
◙
▬
▬
▬
▬
▬
▬
▬
●
●
●
●
●
●
●
●
◙
◙
▬
▬
▬
▬
▬
▬
●
●
●
●
●
●
●
●
◙
◙
◙
●*
●*
●
●*
●*
●
●
●
●
●
●
●
●
◙
◙
◙
●*
●*
●
●*
●*
●
●
●
●
●
●
●
●
◙
◙
◙
●
●
●
●*
●*
Dynamic Service Processor &System Clock Failover
▬
▬
●*
●*
●
Hot-node Repair / Hot-memory Add for all nodes**
Enterprise Memory
Hot GX Adapter Repair
▬
▬
▬
▬
▬
▬
●*
●
●
●*
●
●
●*
●
●
Active Memory Mirroring for Hypervisor
▬
▬
◙
●
●
Power Pools
▬
▬
▬
●
●
RAS Item
Redundant / Hot Swap Fans & Blowers
Hot Swap DASD / Media / PCI Adapters
Concurrent Firmware Update
Redundant / Hot Swap Power Supplies
Dual disk controllers (split backplane)
Processor Instruction Retry
Alternate Processor Recovery
Redundant / Hot Swap Power Regulators
PowerVM™/Live Part. Mobility/Live App Mobility
Dynamic Processor Sparing
Memory Sparing
Redundant Service Processors
Redundant System Clocks
Hot GX Adapter Add and Cold Repair
Hot-node Add / Cold-node Repair
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IBM Power Systems
IBM AIX
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IBM AIX
AIX Advantages
IBM develops hardware, AIX is first to support it.
Linux support comes later
AIX has fewer end user complaints
Windows has 70% more
Linux has 50% more
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IBM Power Systems
IBM AIX
AIX has no reported security breaches (0)
AIX requires fewer support staff
Windows 57% higher
Linux 49% higher
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IBM Power Systems
IBM AIX
TCO for AIX is lower
Windows more than 200% higher
Linux more than 90% higher
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IBM Power Systems
IBM AIX
AIX has higher availability
as high as 99% available
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© 2013 IBM Corporation
IBM Power Systems
IBM AIX
IBM owns AIX, Systems and Virtualization
one place for support
IBM has owned virtualization since 1967
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IBM Power Systems
IBM Virtualization
PowerVM
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IBM Power Systems
AIX 5.3 WPARs for POWER7 Environments
AIX 7.1 Native
Run-Time Environment
AIX 5.2
WPARs
/usr
& /opt
/usr & /opt
/usr
& /opt
AIX 5.3
WPARs
/usr
& /opt
/usr
& /opt
WPAR
1
WPAR
2
WPAR
3
WPAR
4
WPAR
5
WPAR
6
/
/var
/tmp
/home
/
/var
/tmp
/home
/
/var
/tmp
/home
/
/var
/tmp
/home
/
/var
/tmp
/home
/
/var
/tmp
/home
Native syscalls
AIX 5.2 syscall
Compatibility Layer
AIX 5.3 syscall
Compatibility Layer
AIX 7.1 Kernel
Clients must be utilizing AIX 5.3 at Technology Level 12 Service Pack 04.
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IBM Power Systems
Power Systems Virtualization – Proven and Pervasive
Dynamically Resizable
Virtual I/O paths
11Core
Cores
Virtual
I/O
CUoD
Server
Partition
Int Virt
Linux
Manager
Oracle 11g
Oracle10g
Oracle 9i
Oracle 10g
Oracle11g
AIX
V5.3
Linux
Oracle RAC
Storage
Sharing
Ethernet
Sharing
8
Cores
PowerVM’s
Linux
WebSphere
WebSphere
WebSphere
WebSphere
WebSphere
Manager
PowerVM’s
Oracle 10g
Int Virt
Linux
3
24 3
Cores
Cores Cores
3
14
Cores
Cores
Oracle RAC
Server
Partition
16
Cores
PowerVM’s
Oracle RAC
1 Core
Cores
Virtual
I/O
Storage
Sharing
Ethernet
Sharing
Virtual LAN
Tier Consolidation
Multi-Tier Consolidation
POWER Hypervisor
Oracle Pricing on Power7 64 core system
Network
Oracle EE: 38 cores
Oracle RAC: 14 cores
WebSphere: 1920 PVUs
Do not pay for VIO server cores
Network
Virtual Network to WebSphere works at memory speeds
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IBM Power Systems
Active Memory Expansion & Active Memory Sharing
Active Memory Expansion
Effectively gives more memory
capacity to the partition using
compression / decompression of
the contents in true memory
AIX partitions only
Active Memory Sharing
Moves memory from one partition
to another
Best fit when one partition is not
busy when another partition is
busy
AXI, IBM i, and Linux partitions
15
10
5
0
#10
#9
#8
#7
#6
#5
#4
#3
#2
#1
Active Memory Expansion together with Active Memory Sharing
Supported
Considerations
 Only AIX partitions using Active Memory Expansion
 Active Memory Expansion value is dependent upon compressibility of
data and available CPU resource
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IBM Power Systems
Active Memory Expansion
True
memory
True
memory
True
memory
True
memory
True
memory
True
memory
Expanded
memory
Expanded
memory
Expanded
memory
Expanded
memory
Expanded
memory
Expanded
memory
Effectively
up to 125%
more
memory
POWER7+ advantage
Expand memory beyond physical limits
More effective server consolidation
 Run more application workload / users per
partition
 Run more partitions and more workload
per server
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IBM Power Systems
Dynamically optimize memory utilization across virtual images
PowerVM Active Memory Sharing
Memory Usage (GB)
15
10
Asia
Americas
Europe
5
0
Time
15
Memory Usage (GB)
Dynamically adjusts memory available on a physical system
for multiple virtual images based on their workload activity
levels:
 Different workload peaks due to time zones
 Mixed workloads with different time of day peaks (e.g.
CRM by day, batch at night)
 Ideal for highly-consolidated workloads with low or
sporadic memory requirements
Available with PowerVM Enterprise Edition
 Supports AIX, IBM i and Linux workloads
Blends Power Systems hardware, firmware and software
enhancements to optimize resources
 Supports over-commitment of logical memory
 Overflow managed by VIOS paging device
 Two VIOS partitions can be used for redundancy
 Compatible with Live Partition Mobility
10
Night
Day
5
0
Time
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IBM Power Systems
PowerVM virtualization can also help manage risk
PowerVM Live Partition Mobility
Business and IT security and resiliency are as critical as ever, and must be
dynamic and intelligent in order to match the speed of business change
PowerVM Live Partition Mobility
 Move running AIX and Linux partitions between systems
Virtualized SAN and Network Infrastructure
“In 2008, UPMC migrated over 400 LPARs from POWER5- to POWER6-based
servers, each taking less than one hour of downtime. In 2011, UPMC will do it all
over again, only this time there won’t be downtime at all.”
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Special notices
This document was developed for IBM offerings in the United States as of the date of publication. IBM may not make these offerings available in other
countries, and the information is subject to change without notice. Consult your local IBM business contact for information on the IBM offerings
available in your area.
Information in this document concerning non-IBM products was obtained from the suppliers of these products or other public sources. Questions on
the capabilities of non-IBM products should be addressed to the suppliers of those products.
IBM may have patents or pending patent applications covering subject matter in this document. The furnishing of this document does not give you any
license to these patents. Send license inquires, in writing, to IBM Director of Licensing, IBM Corporation, New Castle Drive, Armonk, NY 10504-1785
USA.
All statements regarding IBM future direction and intent are subject to change or withdrawal without notice, and represent goals and objectives only.
The information contained in this document has not been submitted to any formal IBM test and is provided "AS IS" with no warranties or guarantees
either expressed or implied.
All examples cited or described in this document are presented as illustrations of the manner in which some IBM products can be used and the results
that may be achieved. Actual environmental costs and performance characteristics will vary depending on individual client configurations and
conditions.
IBM Global Financing offerings are provided through IBM Credit Corporation in the United States and other IBM subsidiaries and divisions worldwide to
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and may vary by country. Other restrictions may apply. Rates and offerings are subject to change, extension or withdrawal without notice.
IBM is not responsible for printing errors in this document that result in pricing or information inaccuracies.
All prices shown are IBM's United States suggested list prices and are subject to change without notice; reseller prices may vary.
IBM hardware products are manufactured from new parts, or new and serviceable used parts. Regardless, our warranty terms apply.
Any performance data contained in this document was determined in a controlled environment. Actual results may vary significantly and are dependent
on many factors including system hardware configuration and software design and configuration. Some measurements quoted in this document may
have been made on development-level systems. There is no guarantee these measurements will be the same on generally-available systems. Some
measurements quoted in this document may have been estimated through extrapolation. Users of this document should verify the applicable data for
their specific environment.
Current: 1Q 2010
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