Contents
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Capability-PCB
Capability-FPC and RFPC
Capability-Aluminum PCB
Capability-PCBA
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Capability –PCB General Capability
• Number of Layer:
2-28Layer
• Maximum processing area: 680 x 1000 mm
• Min board Thickness:
2 Layer 0.3mm(12mil)；
4 Layer
0.4mm(16mil)；
6 Layer 0.8mm(32mil)；
8 Layer
1.0mm(40mil)；
10 Layer 1.1mm(44mil)；
12 Layer
1.3mm(52mil)；
14 Layer 1.5mm(59mil)；
16 Layer
1.6mm(63mil)；
18 Layer 1.8mm(71mil)；
• Finished board thickness tolerance:
Thickness＜0.8mm，Tolerance:+/-0.08mm；
0.8mm≤Thickness≤6.5mm，Tolerance+/-10%
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Capability -- PCB General Capability
• Twisting and bending ：≤0.75%，Min0.5%。
• Range of TG：130-215℃
• Impedance tolerance+/-10%，Min+/-5%。
• Hi-Pot Test: Max4000V/10MA/60S
• Surface treatment:
HASL With Lead HASL Free Lead
Flash Gold
Immersion Gold
Immersion Silver Immersion Tin
Gold Finger
Osp
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Capability -- PCB Pattern limit
Min width
0.1mm (4 mil)
Min trace
0.1mm (4 mil)
Min width of ring (inner layer)
0.15mm (6 mil)
Min width of ring (out layer)
0.1mm (4 mil)
Min solder bridge
0.1mm (4 mil)
Min height of legend
0.7mm (28mil)
Min width of legend
0.15mm (6 mil)
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Capability -- PCB Holes processing
Final hole size
Min 0.2mm
Drilling hole size
0.20~6.5mm
Drilling tolerance
+/-0.05mm
Final hole size tolerance (PTH)
φ0.20~1.60mm+/-0.075mm
φ1.60~6.30mm: +/-0.10mm
φ0.20~1.60mm+/-0.05mm
Final hole size tolerance (NPTH) φ1.60~6.50mm: +/-0.05mm
Length /width 2:1
Drilling strip hole
Min strip hole width 0.65mm
Length & width
0.05mm
board thickness/hole size
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≤ 10:1
tolerance
+/-
Capability -- PCB Cu thickness +plating (1)
• Cu thickness
Out layer Cu thickness:1-6OZ
Inner layer Cu thickness:0.5-4OZ
Cu thickness of PTH: average>=20um,Min.>=18um
• HASL with lead: Tin 63% Lead37%
• HASL free lead:
surface thickness>=0075um
Thickness in the hole>=5um
• Flash Gold
Ni thickness:3-5um (120u"-160u")
Gold thickness:0.025-0.075um （1u"-3u"）
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Capability -- PCB Cu thickness +plating (2)
• Immersion Gold
Ni thickness:3-5um (120u"-160u")
Gold thickness:0.025-0.15um （1u"-6u"）
• Immersion Tin
Tin thickness:0.8-1.2um （32u"-48u"）
• Immersion silver
Ag thickness:0.15um-0.75um (6u"-30u")
• Gold Finger
Ni thickness:3-5um
（120u"-160u"）
Gold thickness:0.025-1.51um （1u"-60u"）
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Capability -- PCB Cover thickness (1)
• Solder mask
Color: green, matte green,yellow,blue,red,black,matte black
Solder mask thickness:
Surface line≥10um，
surface line corner≥6um
surface board 10-25um
Solder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm
• Legend
Color: White, yellow, black
Min height of legend 0.70mm (28mil)；
Min width of legend 0.15mm (6 mil)
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Capability -- PCB Cover thickness (2)
• Blue Gel
thickness:0.2-1.5mm
tolerance+/-0.15mm
• Carbon print:
Thickness:5-25um
Min space：0.25mm
impedance:200Ω
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Capability -FPC
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FPC Layers 1-8 layers
Board Thickness 0.05-0.5mm
Min.line width/space 0.04/0.04mm
in.Through Hole Size 0.2mm
PTH Hole Dia.Tolerance ∮≤0.1mm 0.05mm ∮≥0.1mm
±0.075mm
Solder Mask Registration Tolerance ±0.05mm
Min.Routing Dimension Tolerance ±0.05mm
Hole to edge（Hard tool/Die Cut) ±0.1/±0.2mm
Eege to Edge（Hard tool/Die Cut) ±0.05/±0.2mm
Circuit to edge（Hard tool/Die Cut) ±0.07/±0.2mm
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Capability-Flex Rigid PCB
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4L1R+2F+1R
6L2R+2F+2R
1+HDI 6L1+1R+2F+1R+1
2+HDI 6L1+1F+2F+1F+1
2+HDI 8L
Thin 4L R-F（1+HDI ）
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Capability—FPC and RFPC Material-1
1. Base Material
1.1 FCCL ( Flexible Copper Clad laminate)
Polyimide: Kapton (12.5 m/20 m/25 m/50 m/75 m
High flex life, good thermal management, high moisture absorption
and good tear resistant
Polyester (25 m/50 m/75 m)
Most cost effective, good flex life, low thermal resistivity, low
moisture absorption and tear resistant
1.2 Dielectric Substrates：PI, PET.
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Capability—FPC and RFPC Material
2. Coverlay
2.1 Cover Layer from ½ mil to 5 mils (12.7 to 127µm)
Polyimide: (12.5 m/15 m/25 m/50 m/75 m/125 m)
High flex life, high thermal resistivity.
2.2 Flexible Solder Mask
Most cost effective, lower flex life, better for registration
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2.3 PIC—photo imaging covercoat
Lower flex life, better for registration
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Capability—FPC and RFPC Material
3. Adhesive Sheet
4. Conductive Layer
4.1 Rolled Annealed Copper (9 m/12 m/17.5 m/35 m/70 m)
High flex life, good forming characteristics.
4.2 Electrodeposited Copper (17.5 m/35 m/70 m)
More cost effective
4.3 Silver Ink
Most cost effective, poor electrical characteristics. Most often used
as shielding or to make connections between copper layers
5.SF-PC5000 and SF-PC1000 protection film
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Capability—FPC and RFPC Material
6.Additional Material & Stiffeners
FR4——Epoxy
Pressure Sensitive Adhesive (PSA)
Steel, Aluminum stiffeners
7. No / Low Flow PP
Applied in Lamination
106(2mil)
1080(3.0mil / 3.5mil)
2116(5.6mil) w/o micro-via
Brand: TUC, Panasonic, Arlon, Hitachi, Doosan
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Capability –Aluminum PCB
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Capability- PCB Assembly
1. PCBA, PCB assembly: SMT & PTH & BGA
1.1.SMD :160K points/hour. operation rate :70%( 8 working hours per
day, 20 set equipments)
1.2.DIP: 75K points/hour. operation rate :80% ( 8 working hours per
day, 250 persons for DIP)
2. PCBA and enclosure design
3. Components sourcing and purchasing
4. Quick prototyping
5. Final assembly
6. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
7. Custom clearance for material importing and product exporting
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Capability –Profiling for all
• cnc :
tolerance+/-0.1mm
line to cnc ≥0.20mm
hole to cnc ≥0.30mm
gold finger to cnc ≥0.20mm
• Punching: Hole size diameter +/-0.10mm
Punching diameter +/-0.15mm
• v-cut:
corner：30℃、45℃、60℃
corner tolerance：+/-5°
v-cut deepness：0.6-1.6mm
deepness tolerance：+/-0.10mm
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Capability –Test for all
• Equipment:
Universal Tester
Flying Probe Open/Short Tester
High power Microscope
Solderability Testing Kit
Peel Strength tester
High Volt Open & Short tester
Cross Section Molding Kit With Polisher
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